Datasheet APM4410KC-TU, APM4410KC-TR Datasheet (ANPEC)

Page 1
APM4410
N-Channel Enhancement Mode MOSFET
Features
30V/11.5A, R
R
••
High Density Cell Design
••
••
Reliable and Rugged
••
••
SO-8 Package
••
= 9m(typ.) @ VGS = 10V
DS(ON)
=14.5m(typ.) @ VGS = 4.5V
DS(ON)
Pin Description
Applications
Power Management in Notebook Computer,
Portable Equipment and Battery Powered
Systems
APM4410
Handling Code
Temp. Range
Package Code
Package Code K : S O -8 Operating Junction Temp. Range C : -55 to 125°C Handling Code TU : Tube TR : Tape & R ee l
1
S
S
GD
2
3
45
8S
7
6
D
D
D
SO 8
D
G
S
N-Channel MOSFET
APM 4410 K :
Absolute Maximum Ratings (T
Symbol
V
DSS
V
GSS
I
D
I
DM
P
D
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright ANPEC Electronics Corp. Rev. A.5 - July., 2002
Drain-Source Voltage 30
Gate-Source Voltage ±20
Maximum Drain Current – Continuous 11.5
Maximum Drain Current – Pulsed 50
Maximum Power Dissipation
APM 4410 XXXXX
XXXXX - Date Code
= 25°C unless otherwise noted)
A
Parameter Rating Unit
V
A
TA=25°C
=100°C
T
A
2.5
1.0
W
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Page 2
APM4410
Thermal Characteristics
Symbol
T
J
T
STG
R
θJA
Maximum Junction Temperature 150
Storage Temperature Range -55 to 150
Thermal Resistance - Junction to Ambient 50 °C/W
Parameter Rating Unit
Electrical Characteristics (TA=25°C unless otherwise noted)
Symbol Parameter Test Condition
Static
BV
I
DSS
V
GS(th)
I
GSS
R
DS(ON)
V
Dynamic
Q
Q
Q
t
d(ON)
t
d(OFF)
C
C
C
Drain-Source Breakdown Voltage
DSS
V
=0V, ID=250µA
GS
Zero Gate Voltage Drain Current VDS=24V, VGS=0V 1 uA
Gate Threshold Voltage
Gate Leakage Current VGS=±20V, V
Drain-Source On-state Resistance
V
DS=VGS
VGS=10V, ID=11.5A 9 11
b
, ID=250µA
=0V ±100 nA
DS
VGS=4.5V, ID=5A
Diode Forward Voltage
SD
a
Total Gate Charge 45 60
g
Gate-Source Charge 10
gs
Gate-Drain Charge
gd
b
ISD=2.3A, VGS=0V 0.6 1.2 V
V
=15V, VGS=10V,
DS
=10A
I
D
Turn-on Delay Time 16 25
=15V, RL=15Ω,
V
t
Turn-on Rise Time 24 35
r
Turn-off Delay Time 78 110
t
Turn-off Fall Time
f
Input Capacitance 2000
iss
Output Capacitance 400
oss
Reverse Transfer Capacitance
rss
DD
=1A , V
I
D
=6Ω,
R
G
V
=0V, VDS=25V
GS
GEN
=10V,
Frequency = 1.0MHZ
Min. Typ
30 V
°C
APM4410
a
.
Max.
Unit
13V
m
14.5 16
nC
8
ns
42 80
pF
220
Notes
a
: Guaranteed by design, not subject to production testing
b
: Pulse test ; pulse width ≤300µs, duty cycle ≤ 2%
Copyright ANPEC Electronics Corp. Rev. A.5 - July., 2002
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Page 3
APM4410
Typical Characteristics
Output Characteristics
50
VGS=5,6,7,8,9,10V
40
30
20
-Drain Current (A)
DS
I
10
0
0246810
VGS=4V
VGS=3V
VDS-Drain-to-Source Voltage (V)
Threshold Voltage vs. Junction Temperature
1.4
IDS=250µA
1.2
Transfer Characteristics
50
40
30
20
-Drain Current (A)
DS
I
10
0
012345
VGS-Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.020
0.016
TJ=25°C
TJ=-55°C
TJ=125°C
1.0
0.8
(Normalized)
0.6
0.4
VGS(th)-Threshold Voltage (V)
0.2
-50 -25 0 25 50 75 100 125 150
Tj-Junction Temperature (°C)
Copyright ANPEC Electronics Corp. Rev. A.5 - July., 2002
VGS=4.5V
0.012
0.008
VGS=10V
-On-Resistance (Ω)
DS(ON)
0.004
R
0.000 0 5 10 15 20 25 30 35
IDS-Drain Current (A)
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Page 4
APM4410
Typical Characteristics Cont.
On-Resistance vs. Gate-to-Source Voltage
0.10
0.08
0.06
0.04
-On-Resistance (Ω)
DS (ON)
0.02
R
0.00 0246810
Gate Voltage (V)
Gate Charge
10
VDS=15V
IDS=11.5A
8
6
4
2
-Gate-to-Source Voltage (V)
GS
V
0
0 9 18 27 36 45
IDS=11.5A
On-Resistaence vs. Junction Temperature
2.00
VGS=10V IDS=11.5A
1.75
1.50
1.25
1.00
0.75
(Normalized)
-On-Resistance (Ω)
0.50
DS(ON)
R
0.25
0.00
-50 -25 0 25 50 75 100 125 150
Tj-Junction Temperature (°C)
Capacitance Characteristics
3000
2500
Ciss
2000
1500
1000
C-Capacitance (pF)
500
0
0 5 10 15 20 25 30
Coss
Crss
QG-Total Gate Charge (nC)
Copyright ANPEC Electronics Corp. Rev. A.5 - July., 2002
VDS-Drain-to-Source Voltage (V)
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Page 5
APM4410
Typical Characteristics Cont.
Source-Drain Diode Forward Voltage
50
10
-Source Current (A)
SD
I
TJ=150°C
1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
TJ=25°C
VSD-Source to Drain Voltage
Normalized Transient Thermal Transient Impedence, Junction to Ambient
Single Pulse Power
80
60
40
Power (W)
20
0
0.01 0.1 1 10
Time (sec)
1
Duty Cycle=0.5
D=0.2
D=0.1
0.1
D=0.05
Thermal Impedance
D=0.02
Normalized Effective Transient
SINGLE PULSE
0.01 1E-4 1E-3 0. 01 0.1 1 10
Copyright ANPEC Electronics Corp. Rev. A.5 - July., 2002
Square Wave Pulse Duration (sec)
1. Duty Cycle , D=t1/t2
2. Per Unit Base=R
3. TJM-TA=PDMZ
4. Surface Mounted
thJA
thJA
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=50°C/W
Page 6
APM4410
Packaging Information
SOP-8 pin ( Reference JEDEC Registration MS-012)
HE
0.015X45
e1 e2
D
A1
A
1
L
0.004max.
Dim
A 1.35 1.75 0.053 0.069
A1 0.10 0.25 0.004 0.010
D 4.80 5.00 0.189 0.197
E 3.80 4.00 0.150 0.157
H 5.80 6.20 0.228 0.244
L 0.40 1.27 0.016 0.050
e1 0.33 0.51 0.013 0.020
e2 1.27BSC 0.50BSC
18
φ
Millimeters Inches
Min. Max. Min. Max.
°
8
°
Copyright ANPEC Electronics Corp. Rev. A.5 - July., 2002
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Page 7
APM4410
Physical Specifications
Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb). Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition (IR/Convection or VPR Reflow)
Peak temperature
temperature
Pre-heat temperature
°
183 C
Time
Classification Reflow Profiles
Convection or IR/
Convection
Average ramp-up rate(183°C to Peak) 3°C/second max. 10 °C /second max. Preheat temperature 125 ± 25°C) Temperature maintained above 183°C Time within 5°C of actual peak temperature Peak temperature range Ramp-down rate Time 25°C to peak temperature
120 seconds max 60 – 150 seconds 10 –20 seconds 60 seconds 220 +5/-0°C or 235 +5/-0°C 215-219°C or 235 +5/-0°C 6 °C /second max. 10 °C /second max. 6 minutes max.
VPR
Package Reflow Conditions
pkg. thickness ≥≥≥ 2.5mm and all bgas
Convection 220 +5/-0 °C Convection 235 +5/-0 °C VPR 215-219 °C VPR 235 +5/-0 °C IR/Convection 220 +5/-0 °C IR/Convection 235 +5/-0 °C
Copyright ANPEC Electronics Corp. Rev. A.5 - July., 2002
pkg. thickness < 2.5mm and pkg. volume ≥≥≥ 350 mm³
pkg. thickness < 2.5mm and pkg. volume < 350mm³
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Page 8
APM4410
Reliability test program
Test item Method Description
SOLDERABILITY MIL-STD-883D-2003 245°C,5 SEC HOLT MIL-STD 883D-1005.7 1000 Hrs Bias @ 125°C PCT JESD-22-B, A102 168 Hrs, 100% RH, 121°C TST MIL-STD 883D-1011.9 -65°C ~ 150°C, 200 Cycles
Carrier Tape & Reel Dimensions
t
W
E
F
Po
A
P
P1
Ao
J
D
Bo
D1
C
Ko
T2
B
T1
Application
SOP-8
Application
SOP-8
Copyright ANPEC Electronics Corp. Rev. A.5 - July., 2002
A B C J T1 T2 W P E
330±1 62 ± 1.5
F D D1 Po P1 Ao Bo Ko t
5.5 ± 0.1 1.55±0.1
12.75 +
0.1 5
1.55+ 0.25
2 + 0.5 12.4 +0.2
4.0 ± 0.1 2.0 ± 0.1 6.4 ± 0.1 5.2± 0.1 2.1± 0.1 0.3±0.013
2± 0.2
12 + 0.3
- 0.1
8± 0.1 1.75± 0.1
(mm)
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Page 9
APM4410
Cover Tape Dimensions
Application Carrier Width Cover Tape Width Devices Per Reel
SOP- 8
Customer Service
Anpec Electronics Corp.
Head Office :
5F, No. 2 Li-Hsin Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
7F, No. 137, Lane 235, Pac Chiao Rd.,
Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.
Tel : 886-2-89191368
Fax : 886-2-89191369
12 9.3 2500
Copyright ANPEC Electronics Corp. Rev. A.5 - July., 2002
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