A
PLUS MAKE YOUR PRODUCTION A-PLUS
APExx08 Series
DATA SHEET
A
PLUS INTEGRATED CIRCUITS INC.
Address:
3 F-10, No. 32, Sec. 1, Chenggung Rd., Taipei,
Taiwan 115, R.O.C.
(115)台北市南港區成功路㆒段 32 號 3 樓之 10.
TEL: 886-2-2782-9266
FAX: 886-2-2782-9255
WEBSITE : http: //www.aplusinc.com.tw
Sales E-mail:
sales@aplusinc.com.tw
Technology E-mail:
service@aplusinc.com.tw
APExx08 Series
Rev 1.3 2003/8/18
1
1.0 General Description
The APExx08 series are very low cost voice and melody synthesizer with 4-bits CPU. They have various
features including 4-bits ALU, ROM, RAM, I/O ports, timers, clock generator, voice and melody
synthesizer, and PWM (Direct drive) or D/A current outputs, etc. The audio synthesizer contains one
voice-channel and two melody-channels. Furthermore, they consist of 27 instructions in these devices.
With CMOS technology and halt function can minimize power dissipation. Their architectures are similar
to RISC, with two stages of instruction pipeline. They allow all instructions to be executed in a single
cycle, except for program branches and data table read instructions (which need two instruction cycles).
2.0 Features
(1) Single power supply can operate from 2.4V to 5.5V at 4MHz or 8MHz.
(2) Program ROM: 16k x 10 bits
(3) 1 set of 16-bits DPR can access up to 64k x 10 bits melody data memory space, and 1 set of 18-bits
VPR can access up to 256k x 10 bits voice data memory space.
Product Voice Duration (sec) Voice Pointer (VPR) ROM Size (10-bit )
APE0508 5 14-bits 16k
APE1008 10 15-bits 32k
APE1508 15 16-bits 48k
APE2008 20 16-bits 64k
APE3108 31 17-bits 96k
APE4108 41 17-bits 128k
APE5208 52 18-bits 160k
APE6308 63 18-bits 192k
(4) Data Registers:
a). 128 x 4-bit s data RAM (00-7Fh)
(APE0508 /1008 is 96 x 4-bits data RAM 00-5Fh)
b). Unbanked special function registers (SFR) range: 00h-2Fh
(5) I/O Ports:
a). PRA: 4-bits I/O Port A (10h) can be programmed to input/output individually. (Regist er control)
b). PRB: 4-bits I/O Port B (13h) can be configured to input/output individually. (Mask option)
(6) On-chip clock generator: Resistive Clock Drive (RM)
(7) Timer: 1-set Voice Interrupt (Timer0: a 9-bits auto-reload timer/counter).
(8) Stack: 2-level subroutine nesting.
(9) B uilt-in 4 Level Volume Control can be pr o gr amm ed .
(10) Built-in 8 Level DAC current output can be configured. (Mask option)
(11) Built-in IR Carry Output: Port B[1] can be configured as IR pin by 38k / 56kHz. (Mask option)
APExx08 Series
Rev 1.3 2003/8/18
2
(12) External Reset: Port B[3] can be configured as reset pin. (Mask opt on)
(13) HALT and Release from HALT function to reduce power consumpt ion
(14) Watch Dog Timer (WDT)
(15) Instruction: 1-cycle instruction except for table read and program branches which are 2-cycles
(16) Number of instruction: 27
(17) DAC: 1 channel voice and dual tone melody synthesizer (One 9-bits Cout or 8-bits PWM output).
FIGURE 1 : ROM Map of APExx08 Series
14-bit x 2 STACK
Reset Vector
00000h-03FFFh
16-bit Data Pointer
PC[13:0]
Reserved for Testing
000FFh-00400h
00401h
00000h
000FEh
Program ROM
00000h-0FFFFh
Data ROM for Melody
18-bit Voice Pointer
00000h-2FFFFh
Voic e ROM fo r Voice
APExx08 Series
Rev 1.3 2003/8/18
3
3.0 Pin Description
Pad Name Pin Attr. Description
PWM2/Cout
O
PWM2 output, or Current Output of Audio.
PWM1
O PWM1 output.
Vdd1~2
Power
Power supply during operation.
PRA0~3
I/O
I/O port can be programmed to input/output individually.
Input type with weak pull-low or fix-input-floating capability.
Buffer Output type.
PRB0, PRB2
I/O
I/O port can be configured to input/output individually.
Input type with weak pull-low or fix-input-floating capability.
Buffer Output type.
PRB1 / IR
I/O
I/O port can be configured to input/output individually.
Input type with weak pull-low or fix-input-floating capability.
Buffer Output type.
Mask option selected as an IR Carrier Output with 38k / 56kHz
PRB3 / Reset
I/O
I/O port can be configured to input/output individually.
Input type with weak pull-low or fix-input-floating capability.
Buffer Output type.
Mask option selected as an external RESET pin with weak pull-low
capability.
OSC
I
RM mode Oscillator input
GND1~2
Power
Ground Potential
4.0 DC Characteristics
Symbol Parameter Vdd Min. Typ. Max. Unit Condition
Vdd Operating voltage 2.4 3 5.5 V depending on Freq.
3 1
Isb Standby
4.5 1
uA
4MHz, RM,
in HALT Mode
3 2
Iop
Supply
current
Operating
4.5 7
mA
4MHz, RM,
IO Floating
3 4
Iih
Input current
(Inter n al pu l l lo w)
4.5 10
uA
Input ports with weak
pull-low
3 -4
Ioh Output-high current
4.5 -10
3 8.5
Iol Output-low current
4.5 17.5
mA
4MHz, RM
(IO ports)
3 0.8 ~ 4.8
Cout
DAC output current
(8-level option)
4.5 0.9 ~ 6.5
mA
4MHz, RM
(Full s cale)
dF/F Frequency stability -5 5 %
Fosc(3v- 2.4v)
Fosc (3v)
dF/F Fosc lot variation -10 10 %
Vdd=3V, Rosc=430k,
4MHz
APExx08 Series
Rev 1.3 2003/8/18
4
FIGURE 2 : Frequency vs. Rosc (at 3V)
Resistor (Rosc ohms) 110k 200k 300k 430k
Frequency (MHz)
14.84 8.25 5.54 3.92
5.0 Application Circuit
Rosc vs Freq.
5.54
3.92
8.25
14.84
0
5
10
15
20
0 100 200 300 400 500
Rosc (k ohm)
Freq. (MHz)
APExx08 Series
Rev 1.3 2003/8/18
5
6.0 Bonding Diagram of APE0508 / APE1008
Pad # Pad Name X Y Pad # Pad Name X Y
1
PWM2/Cout -518 -195
9
PRB0 267 -574
2
Vdd1 -518 -479
10
PRB1 377 -574
3
PWM1 -431 -603
11
Vdd2 487 -574
4
GND1 -283 -603
12
GND2 489 -414
5
PRA0 -173 -574
13
OSC 489 -304
6
PRA1 -63 -574
14
PRB2 489 -194
7
PRA2 47 -574
15
PRB3 489 -84
8
PRA3 157 -574
Chip Size :
APE0508 : 1234 um x 1404 um
APE1008 : 1234 um x 1404 um
ROM
PRB3
2
3
4
5
6
7
8
9
10
11
12
13
14
15
PRB2
OSC
Vdd2
GND2
PRB1
PRB0
PRA3
PRA2
PRA1
PRA0
GND1
PWM1
PWM2/Cout
Vdd1
1
(0, 0)
Pad Size : 80 um x 80 um
* The IC substrate must be connected to GND.
APExx08 Series
Rev 1.3 2003/8/18
6
6.1 Bonding Diagram of other APExx08 series
Pad # Pad Name X Y Pad # Pad Name X Y
1
PWM2/Cout 58 466
9
PRB0 843 87
2
Vdd1 58 182
10
PRB1 953 87
3
PWM1 145 58
11
Vdd2 1063 87
4
GND1 293 58
12
GND2 1059 247
5
PRA0 403 87
13
OSC 1059 357
6
PRA1 513 87
14
PRB2 1059 467
7
PRA2 623 87
15
PRB3 1059 577
8
PRA3 733 87
Chip Size :
APE1
508 : 1230 um x 1848 um, APE2008 : 1230 um x 1848 um
APE3108 : 1230 um x 1848 um, APE4108 : 1230 um x 2528 um
APE5208 : 1230 um x 2528 um, APE6308 : 1230 um x 2528 um
ROM
PRB3
2
3
4
5 6
7
8
9
10
11
12
13
14
15
PRB2
OSC
Vdd2
GND2
PRB1
PRB0
PRA3
PRA2
PRA1 PRA0
GND1
PWM1
PWM2/Cout
Vdd1
1
(0, 0)
Pad Size: 80 um x 80 um
* The IC substrate must be connected to GND.
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