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AP2552FDC
Datasheet (Diodes) [ru]
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Datasheet AP2552AFDC, AP2552AW6, AP2552FDC, AP2552W6, AP2553AFDC Datasheet (Diodes) [ru]

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P2552/ AP2553/ AP2552A/ AP2553A
PRECISION ADJUSTABLE CURRENT-LIMITED POWER SWITCHES
Description
The AP2552/53 and AP2552A/53A are single channel precision
adjustable current-limited switches optimized for applications that
require precision current limiting, or to provide up to 2.1A of
continuous load current during heavy loads/short circuits. These
devices offer a programmable current-limit threshold between 75mA
and 2.36A (typ) via an external resistor. Current limit accuracy ±6%
can be achieved at high current-limit settings. The rise and fall times
are controlled to minimize current surges during turn on/off.
The devices have fast short-circuit response time for improved overall
system robustness. They provide a complete protection solution for
applications subject to heavy capacitive loads and the prospect of
short circuit, offering reverse current blocking and limiting, over-
current, over-temperature and short-circuit protection, as well as
controlled rise time and under-voltage lockout functionality. A
7ms deglitch capability on the open-drain Flag output prevents false
over-current reporting and does not require any external components.
AP2552/53 limits the output current to a safe level when the output
current exceeds current-limit threshold.
AP2552A/53A provides latch-off function during over-current or
reverse-voltage conditions.
All devices are available in SOT26 and U-DFN2020-6 packages.
Applications
Set-Top Boxes
LCD TVs & Monitors
Residential Gateways
Laptops, Desktops, Servers, e-Readers, Printers, Docking
Stations, HUBs
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
AP2552/AP2553/AP2552A/AP2553A
Document number: DS35404 Rev. 10 - 2
Pin Assignments
Features
Up to 2.1A Maximum Load Current
Accurate Adjustable Current Limit, 75mA - 2360mA
±6% Accurate Adjustable Current Limit, 1.63A with R
Constant-Current (AP2552/53) During Over-Current
Output Latch-Off (AP2552A/53A) at Over-Current
Fast Short-Circuit Response Time: 2µs (typ)
Reverse Current Blocking During Shutdown and Reverse Current
Limiting During Enable
Operating Range: 2.7V - 5.5V
Built-in Soft-Start with 3ms Typical Rise Time
Over-Current , Output Over-Voltage and Thermal Protection
Fault Report (FAULT) with Blanking Time
ESD Protection: 2kV HBM, 500V CDM
Active Low (AP2552/52A) or Active High (AP2553/53A) Enable
Ambient Temperature Range: -40ºC to +85°C
SOT26 and U-DFN2020-6 Package: Available in “Green” Molding
Compound (No Br, Sb)
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
15kV ESD Protection per IEC 61000-4-2 (with external
capacitance)
UL Recognized, File Number E322375, Vol. 1
1IEC60950-1 CB Scheme Certified
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OUT
ILIM
FAULT
GND
EN
Top View
1
PAD
2
3
6
5
4
U-DFN2020-6
Top View
1
2
3
SOT26
6
5
4
IN
GND
EN
OUTIN
ILIM
FAU LT
LIM
October 2014
© Diodes Incorporated
= 15k
Page 2
P2552/ AP2553/ AP2552A/ AP2553A
Typical Applications Circuit
Available Options
Part Number Channel Enable Pin (EN)
AP2552 1 Active Low
AP2553 1 Active High
AP2552A 1 Active Low
AP2553A 1 Active High
120µF Output Capacitance is a Requirement of USB
Recommended Maximum
Continuous Load Current (A)
2.1 Constant-Current
2.1 Latch-Off
Current-Limit
Protection
Package
U-DFN2020-6
SOT26
U-DFN2020-6
SOT26
Pin Descriptions
Pin
Name
GND 2 2 5 5 — Ground, connect to external exposed pad.
FAULT
ILIM 5 5 2 2 O
OUT 6 6 1 1 O Output
Exposed
Pad
AP2552/AP2553/AP2552A/AP2553A
Document number: DS35404 Rev. 10 - 2
AP2552W6-7 AP2553W6-7 AP2552FDC-7 AP2553FDC-7
IN 1 1 6 6 I
EN
EN — 3 — 4 I Enable input, logic high turns on power switch.
— — Pad Pad —
Pin Number
3 — 4 — I Enable input, logic low turns on power switch.
4 4 3 3 O
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I/O Function
Input, connect a 0.1µF or greater ceramic capacitor from IN to GND as close to IC as possible.
Active-low open-drain output, asserted during over­current, over-temperature, or reverse-voltage conditions.
Use external resistor to set current-limit threshold; recommended 10k≦RLIM≦232k.
No internal connection; recommend to connect to GND externally for improved power dissipation. It should not be used as electrical ground conduction path.
October 2014
© Diodes Incorporated
Page 3
Functional Block Diagram
P2552/ AP2553/ AP2552A/ AP2553A
AP2552/AP2553/AP2552A/AP2553A
Document number: DS35404 Rev. 10 - 2
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October 2014
© Diodes Incorporated
Page 4
P2552/ AP2553/ AP2552A/ AP2553A
Absolute Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Symbol Parameter Ratings Unit
ESD
VIN, V
VILIM,
HBM Human Body Model ESD Protection 2 kV
CDM Charged Device Model ESD Protection 500 V
IEC system
level
, V
OUT
FAULT
VENV
,EN
—
Surges per EN61000-4-2. 1999 Applied to Output
Terminals of EVM Note (5)
,
Voltage on IN, OUT,
Continuous
FAULT
Sink Current
FAULT
, ILIM, EN, EN
15 kV
-0.3 to +6.5 V
25 mA
— ILIM Source Current 1 mA
I
LOAD
T
J(MAX)
TST
Notes: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C).
5. External capacitors need to be connected to the output, EVM board was tested with capacitor 2.2uF 50V 0805. This level is a pass test only and not a limit.
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices.
Maximum Continuous Load Current Internal Limited A
Maximum Junction Temperature -40 to +150 °C
Storage Temperature Range (Note 4) -65 to +150 °C
Dissipation Rating Table
Thermal
Board Package
Resistance
Thermal
Resistance
θ
JA
θJC
T
≤ +25°C
A
Power
Rating
Derating Factor
Above
= +25°C
T
A
= +70°C
T
A
Power Rating
= +85°C
T
A
Power Rating
High-K (Note 6) W6 160°C/W 55°C/W 625mW 6.25mW/°C 340mW 250mW
High-K (Note 6) FDC 120°C/W 34°C/W 833mW 8.33mW/°C 450mW 330mW
Note: 6. The JEDEC high-K (2s2p) board used to derive this data was a 3in x 3in, multilayer board with 1oz internal power and ground planes with 2oz copper traces on top and bottom of the board.
Recommended Operating Conditions (@T
= +25°C, unless otherwise specified.)
A
Symbol Parameter Min Max Unit
V
IN
I
OUT
VENV
,EN
VIH
VIL
R
LIM
IO

TA
TJ
Input Voltage 2.7 5.5 V
Continuous Output Current (-40°C  TA +85°C)
Enable Voltage 0 5.5 V
High-Level Input Voltage on EN or
Low-Level Input Voltage on EN or
EN
EN
Current-Limit Threshold Resistor Range (1% initial tolerance)
Continuous
FAULT
Sink Current
Input De-Coupling Capacitance, IN to GND 0.1
0 2.1 A
2.0
V
IN
0 0.8 V
10 210 k
0 10 mA
Operating Ambient Temperature -40 +85
Operating Junction Temperature -40 +125
V
µF
C
C
AP2552/AP2553/AP2552A/AP2553A
Document number: DS35404 Rev. 10 - 2
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October 2014
© Diodes Incorporated
Page 5
P2552/ AP2553/ AP2552A/ AP2553A
Electrical Characteristics (@T
= +25°C, VIN = 2.7V to 5.5V, VEN = 0V or VEN = VIN, R
A
= 10k, unless otherwise specified.)
FAULT
Symbol Parameter Test Conditions (Note 7) Min Typ Max Unit
Supply
V
V
I
UVLO
UVLO
SHDN
I
Q
I
REV
Input UVLO
Input UVLO Hysteresis
Input Shutdown Current
Input Quiescent Current
Reverse Leakage Current
VIN Rising
VIN Decreasing
V
= 5.5V, Disabled, OUT = Open
IN
= 5.5V, Enabled, OUT = Open, R
V
IN
V
= 5.5V, Enabled, OUT = Open, R
IN
Disabled, V
= 0V, V
IN
OUT
= 5.5V, I
= 20k
LIM
= 210k
LIM
at VIN
REV
2.4 2.65 V
25
0.1 1 µA
100 140 µA
80 120 µA
0.01 1 µA
Power Switch
70 95
135
80 105
150
1.1 1.5 ms
0.7 1 ms
0.5 ms
0.5 ms
R
DS(ON)
Switch On-Resistance
Output Turn-On Rise Time
tR
Output Turn-Off Fall Time
tF
SOT26 Package,
U-DFN2020-6 Package
= 5.5V, CL = 1µF, R
V
IN
VIN = 2.7V, CL = 1µF, R
= 5.5V, CL = 1µF, R
V
IN
VIN = 2.7V, CL = 1µF, R
= +25°C, V
T
J
-40°C TA  +85°C
= +25°C, V
T
J
-40°C TA  +85°C
= 100. See Figure 1
LOAD
= 100.
LOAD
= 100. See Figure 1
LOAD
= 100.
LOAD
= 5.0V
IN
= 5.0V
IN
0.1
0.1
Current Limit
2200 2365 2542
1540 1632 1730
1180 1251 1326
1160 1251 1340
500 530 562
485 529 573
121 142 162
50 75 100
2620
1820
1380
570
150
75
2
mA
I
LIMIT
I
SHORT
t
SHORT
Current-Limit Threshold (maximum DC output current),
= V
V
OUT
IN
-0.5V
Short-Circuit Current Limit, OUT Connected to GND
Short-Circuit Response Time
= 10k -40°C  TA  +85°C
R
LIM
R
= 15k -40°C  TA  +85°C
LIM
= +25°C
T
R
= 20k
LIM
R
= 49.9k
LIM
R
= 210k
LIM
I
Shorted to IN or GND
LIM
R
= 10k
LIM
R
= 15k
LIM
R
= 20k
LIM
R
= 49.9k
LIM
R
= 210k
LIM
I
Shorted to IN or GND
LIM
V
OUT
= 0V to I
OUT
= I
(OUT shorted to ground)
LIMIT
J
-40°C TA  +85°C
= +25°C
T
J
-40°C TA  +85°C
See Figure 2
Enable Pin
I
LEAK-EN
tON
t
OFF
EN Input Leakage Current
Turn-On Time
Turn-Off Time
V
= 5V, V
IN
= 0V and 6V
EN
CL = 1µF, RL = 100. See Figure 1
CL = 1µF, RL = 100. See Figure 1
-0.5
0.5 µA
3 ms
1 ms
Output Discharge
R
R
DIS_LATCH
Notes: 7. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
8. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down when V The discharge function offers a resistive discharge path for the external storage capacitor for limited time.
Discharge Resistance (Note 8)
DIS
Discharge Resistance During Latch-Off
VIN = 5V, Disabled, I
=1mA
OUT
VIN = 5V, Latch-Off, AP2552A/53A Only
600
1000
< V
).
IN
UVLO
AP2552/AP2553/AP2552A/AP2553A
Document number: DS35404 Rev. 10 - 2
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October 2014
© Diodes Incorporated
mV
m
mA
µs
Page 6
P2552/ AP2553/ AP2552A/ AP2553A
Electrical Characteristics (cont.)
(@TA = +25°C, VIN = 2.7V to 5.5V, VEN = 0V or VEN = VIN, R
Symbol Parameter Test Conditions (Note 6) Min Typ Max Unit
Reverse Voltage Protection
V
Reverse-Voltage Comparator Trip Point
RVP
IROCP Reverse Current Limit
Time from Reverse-Voltage Condition to
t
TRIG
MOSFET Turn Off (AP2552A/AP2553A)
Fault Flag
VOL
I
FOH
t
Blank_OC
t
Blank_RV
FAULT Output Low Voltage
FAULT Off Current
FAULT Blanking and Latch Off Time (Over-Current)
FAULT Blanking Time (Reverse-Voltage)
Thermal Shutdown
T
T
SHDN_OCP
T
SHDN
Thermal Shutdown Threshold
Thermal Shutdown Threshold under Current Limit
Thermal Shutdown Hysteresis
HYS
= 10k, unless otherwise specified.)
FAULT
V
– VIN
OUT
V
– V
OUT
VIN = 5V
I
= 1mA
FAULT
V
FAULT
IN
= 6V
= 200mV
95 135 190 mV
0.72
3 4.75 7 ms
180 mV
1 µA
Assertion or deassertion due to overcurrent 5 7.5 10 ms
Assertion or deassertion due to reverse-voltage
Enabled, R
Enabled, R
= 1k
LOAD
= 1k
LOAD
2 3.75 6 ms
160
140
20
Typical Performance Characteristics
A
°C
°C
°C
V
EN
V
OUT
50%
T
D(ON)
T
10%
50%
R
90%
Figure 1 Voltage Waveforms: AP2552/52A (left), AP2553/53A (right)
AP2552/AP2553/AP2552A/AP2553A
Document number: DS35404 Rev. 10 - 2
V
T
D(OFF)
90%
10%
EN
T
F
V
OUT
50%
T
D(ON)
Figure 2 Response Time to Short Circuit Waveform
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T
10%
50%
T
R
90%
D(OFF)
90%
10%
T
F
October 2014
© Diodes Incorporated
Page 7
Typical Performance Characteristics (cont.)
V
= 5V
IN
R
= 20k
LIM
= 5
R
OUT
P2552/ AP2553/ AP2552A/ AP2553A
V
= 5V
IN
R
= 20k
LIM
= 5
R
OUT
Figure 3 Turn-On Delay and Rise Time
Figure 5 Device Enabled into Short-circuit
2ms/div
500µs/div
V R R
IN
LIM
OUT
= 5V
= 20k
= 0
Figure 4 Turn-Off Delay and Fall Time
Figure 6 No Load to 1Ω Transient Response
2ms/div
2ms/div
2ms/div
Figure 7 Short-Circuit Current Limit Response
AP2552/AP2553/AP2552A/AP2553A
Document number: DS35404 Rev. 10 - 2
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Figure 8 Extended Short-Circuit into Thermal Cycles
20ms/div
October 2014
© Diodes Incorporated
Page 8
Typical Performance Characteristics (cont.)
P2552/ AP2553/ AP2552A/ AP2553A
1ms/div
Figure 9 Reverse Current Limit Response(AP2552A/AP2553A)
Figure 11 Quiescent Current vs. Ambient Temperature
Figure 10 Reverse Current Limit vs. Ambient Temperature
Figure 12 Quiescent Current vs. Ambient Temperature
Figure 13 Switch On-Resistance vs. Ambient Temperature
AP2552/AP2553/AP2552A/AP2553A
Document number: DS35404 Rev. 10 - 2
Figure 14 Under-Voltage Lock Out vs. Ambient Temperature
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October 2014
© Diodes Incorporated
Page 9
P2552/ AP2553/ AP2552A/ AP2553A
Application Information
The AP2552/53 AND AP2552A/53A are integrated high-side power switches optimized for Universal Serial Bus (USB) that require protection
functions. The power switches are equipped with a driver that controls the gate voltage and incorporates slew-rate limitation. This, along with the
various protection features and special functions, makes these power switches ideal for hot-swap or hot-plug applications.
Protection Features:
Under-Voltage Lockout (UVLO)
Whenever the input voltage falls below UVLO threshold (~2.5V), the power switch is turned off. This facilitates the design of hot-insertion
systems where it is not possible to turn off the power switch before input power is removed.
Over-Current and Short-Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, AP2552/53 maintains a constant output current and reduces the
output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
For AP2552A/53A, when an overcurrent condition is detected, the devices will limit the current until the overload condition is removed or the
internal deglitch time (7-ms typical) is reached, and AP2552A/53A will be turned off. AP2552A/53A will remain latched off until power is cycled
or the device enable is toggled.
The different overload conditions and the corresponding response of the AP2552/53 and AP2552A/53A are outlined below:
NO Conditions Explanation Behavior of the AP2552/53
Short-circuit condition at
1
start-up
Short-circuit or overcurrent
2
condition
Gradual increase from nominal operating current to
3
I
LIMIT
Output is shorted before input voltage is applied or before the part is enabled
Short-Circuit or Overload condition that occurs when the part is enabled.
Load increases gradually until the current-limit threshold.(I
NO Conditions Explanation Behavior of the AP2552A/53A
Short-circuit condition at
1
start-up
Short-circuit or overcurrent
2
condition
Gradual increase from nominal operating current to
3
I
LIMIT
Output is shorted before input voltage is applied or before the part is enabled
Short-Circuit or Overload condition that occurs when the part is enabled.
Load increases gradually until the current-limit threshold.(I
Over-Current FAULT Signal
The FAULT signal will be asserted in response to OCP before the device reaches its current limit. The output current upon FAULT signal triggered will be lower than the I_limit value. To implement FAULT signal for precision system protection control, it is recommended to leave enough margin from maximum continuous operating current for each RLIM value condition.
AP2552/AP2553/AP2552A/AP2553A
Document number: DS35404 Rev. 10 - 2
9 of 17
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The IC senses the short circuit and immediately clamps output current to a certain safe level namely I
SHORT.
At the instance the overload occurs, higher current may flow
for a very short period of time before the current limit function can react.
After the current limit function has tripped (reached the over-
current trip threshold), the device switches into current limiting mode and the current is clamped at I
The current rises until I has been reached, the device switches into its current limiting
)
TRIG
mode and is set at I
LIMIT
or thermal limit. Once the threshold
LIMIT
.
The IC senses the short circuit and immediately clamps output current to a certain safe level namely I
When the internal
SHORT.
deglitch time (7-ms typical) is reached and the devices will be turned off.
At the instance the overload occurs, higher current may flow
for a very short period of time before the current limit function can react.
After the current limit function has tripped (reached the over-
current trip threshold), the device switches into current limiting mode and the current is clamped at I
the internal deglitch time (7-ms typical) is reached and
When the devices will be turned off.
The current rises until I
or thermal limit. Once the threshold
LIMIT
has been reached, the device switches into its current limiting
)
mode and is set at I
TRIG
. When the internal deglitch time (7-ms
LIMIT
typical) is reached and the devices will be turned off.
/I
SHORT
© Diodes Incorporated
.
LIMIT
/I
SHORT
LIMIT
October 2014
.
Page 10
P2552/ AP2553/ AP2552A/ AP2553A
Application Information
Current-Limit Threshold Programming
The current-limit threshold can be programmed using an external resistor. The current-limit threshold is proportional to the current sourced out of
I
.
LIM
The recommended 1% resistor range for R
temperature and process. This graph does not include the external resistor tolerance. The traces routing the RLIM resistor to the AP2552/53 and
AP2552A/53A should be as short as possible to reduce parasitic effects on the current-limit accuracy.
To design below a maximum current-limit threshold, find the intersection of R
curve and choose a value of R
limiting upstream power supplies causing the input voltage bus to droop. The resulting minimum current-limit threshold is the intersection of the
selected value of R
Best Fit Current-Limit Threshold Equations (I
MAXLIM
and the I
LIM
)(
mAI
)(
R
LIM
(cont.)
is 10k R
LIM
above this value. Programming the current limit below a maximum threshold is important to avoid current
LIM
(I
k
) curve.
LIM
LIMIT
):
OS(min)
08.20
904.0
210k. Figure 15 includes current-limit tolerance due to variations caused by
LIM
and the maximum desired load current on the I
LIM
94.19
)mA(I
)TYP(LIM
R
LIM
925.0
k
)mA(I
)MIN(LIM
R
LIM
OS(max)
26.20
956.0
k
(I
LIM
)
Figure 15 Current-Limit Threshold vs. R
LIM
Thermal Protection
Thermal protection prevents the IC from damage when the die temperature exceeds safe margins. This mainly occurs when heavy-overload or
short-circuit faults are present for extended periods of time. The AP2552/53 AND AP2552A/53A implements a thermal sensing to monitor the
operating junction temperature of the power distribution switch. Once the die temperature rises to approximately +160°C (+140°C in case the
part is under current limit), the thermal protection feature activates as follows: The internal thermal sense circuitry turns the power switch off and
the FAULT output is asserted, thus preventing the power switch from damage. Hysteresis in the thermal sense circuit allows the device to cool
down by approximately +20°C before the output is turned back on. This built-in thermal hysteresis feature is an excellent feature, as it avoids
undesirable oscillations of the thermal protection circuit. The switch continues to cycle in this manner until the load fault is removed, resulting in
a pulsed output.
AP2552/AP2553/AP2552A/AP2553A
Document number: DS35404 Rev. 10 - 2
10 of 17
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October 2014
© Diodes Incorporated
Page 11
P2552/ AP2553/ AP2552A/ AP2553A
Application Information (cont.)
Reverse-Current and Reverse-Voltage Protection
The USB specification does not allow an output device to source current back into the USB port. In a normal MOSFET switch, current will flow in
reverse direction (from the output side to the input side) when the output side voltage is higher than the input side. A reverse-current limit
(ROCP) feature is implemented in the AP2552/53 AND AP2552A/53A to limit such back currents. The ROCP circuit is activated when the output
voltage is higher than the input voltage. After the reverse current circuit has tripped (reached the reverse current trip threshold), the current is
clamped at this IROCP level.
In addition to ROCP, reverse over-voltage protection (ROVP) is also implemented. The ROVP circuit is activated by the reverse voltage
comparator trip point; i.e., the difference between the output voltage and the input voltage.
For AP2552/53, once ROVP is activated, FAULT assertion occurs at a de-glitch time of 4ms. Recovery from ROVP is automatic when the fault is
removed. FAULT de-assertion de-glitch time is same as the de-assertion time.
For AP2552A/53A, once ROVP is activated and when the condition exists for more than 5ms (TYP), output device is disabled and shut down.
This is called the "Time from Reverse-Voltage Condition to MOSFET Turn Off”. FAULT assertion occurs at a de-glitch time of 4ms after ROVP is
reached. Recovery from this fault is achieved by recycling power or toggling EN. FAULT de-assertion de-glitch time is same as the de-assertion
time.
Special Functions:
Discharge Function
When enable is de-asserted, or when the input voltage is under UVLO level, the discharge function is active. The output capacitor is discharged
through an internal NMOS that has a discharge resistance of 100. Hence, the output voltage drops down to zero. The time taken for discharge
is dependent on the RC time constant of the resistance and the output capacitor.
FAULT Response
The FAULT open-drain output goes active low for any of following faults: Current limit threshold, short- circuit current limit, reverse-voltage
condition or thermal shutdown. The time from when a fault condition is encountered to when the FAULT output goes low is 7ms (TYP). The
FAULT output remains low until over-current, short-circuit current limit and over-temperature conditions are removed. Connecting a heavy
capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the FAULT due to the 7ms
deglitch timeout. This 7-ms timeout is also applicable for over-current recovery and over-temperature recovery. The AP2552/53 and
AP2552-2/53A are designed to eliminate erroneous over-current reporting without the need for external components, such as an RC delay
network.
For the AP2552/53 and AP2552A/53A when the reverse voltage condition is triggered, FAULT output goes low after 4ms (TYP). This 4ms (TYP)
timeout is also applicable for the recovery from reverse voltage fault.
When the ILIM pin is shorted to IN or GND, current-limit threshold and short-circuit current limit will be clamped at typically 75mA. When the ILIM
pin is shorted to IN or GND, the AP2552/53 and AP2552A/53A FAULT pin will not assert during current limiting conditions; The FAULT pin will
assert during short circuit conditions.
Power Supply Considerations
A 0.01-F to 0.1-F X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. This limits the input
voltage drop during line transients. Placing a high-value electrolytic capacitor on the input (10F minimum) and output pin (120µF) is
recommended when the output load is heavy. This precaution also reduces power-supply transients that may cause ringing on the input.
Additionally, bypassing the device output with a 0.1F to 4.7F ceramic capacitor improves the immunity of the device to short-circuit transients.
This capacitor also prevents output from going negative during turn-off due to parasitic inductance.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (T P
Finally, calculate the junction temperature: T Where: T P
= R
D
= PD x ΘJA + TA
J
= Ambient temperature °C
A
= Thermal resistance
JA
= Total power dissipation
D
AP2552/AP2553/AP2552A/AP2553A
Document number: DS35404 Rev. 10 - 2
DS(ON)
) and R
A
× I2
, the power dissipation can be calculated by:
DS(ON)
www.diodes.com
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October 2014
© Diodes Incorporated
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P2552/ AP2553/ AP2552A/ AP2553A
Application Information (cont.)
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or PC boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise and fall times of the AP2552/53 AND AP2552A/53A, these devices can be used to
provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2552/53 AND AP2552A/53A also
ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion.
Generic Hot-Plug Applications
By placing the AP2552/53 AND AP2552A/53A between the VCC input and the rest of the circuitry, the input power reaches these devices first
after insertion. The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This
implementation controls system surge current and provides a hot-plugging mechanism for any device.
Ordering Information
Part Number
AP2552W6-7
AP2552W6-7R W6 SOT26 3000/Tape & Reel -7R
AP2552FDC-7 FDC U-DFN2020-6 3000/Tape & Reel -7
AP2552FDC-7R FDC U-DFN2020-6 3000/Tape & Reel -7R
AP2553W6-7
AP2553W6-7R W6 SOT26 3000/Tape & Reel -7R
AP2553FDC-7 FDC U-DFN2020-6 3000/Tape & Reel -7
AP2553FDC-7R FDC U-DFN2020-6 3000/Tape & Reel -7R
AP2552AW6-7
AP2552AW6-7R W6 SOT26 3000/Tape & Reel -7R
AP2552AFDC-7 FDC U-DFN2020-6 3000/Tape & Reel -7
AP2552AFDC-7R FDC U-DFN2020-6 3000/Tape & Reel -7R
AP2553AW6-7
AP2553AW6-7R W6 SOT26 3000/Tape & Reel -7R
AP2553AFDC-7 FDC U-DFN2020-6 3000/Tape & Reel -7
AP2553AFDC-7R FDC U-DFN2020-6 3000/Tape & Reel -7R
Enable
Active
Low
High
Low
High
AP2552/AP2553/AP2552A/AP2553A
Document number: DS35404 Rev. 10 - 2
Output Fault
Condition
Output Current
Limits
Output Latches
Off
Package
Code
W6 SOT26 3000/Tape & Reel -7
W6 SOT26 3000/Tape & Reel -7
W6 SOT26 3000/Tape & Reel -7
W6 SOT26 3000/Tape & Reel -7
www.diodes.com
Packaging
12 of 17
7” Tape and Reel
Quantity Part Number Suffix
October 2014
© Diodes Incorporated
Page 13
Marking Information
(1) SOT26
Device Package Identification Code
AP2552W6-7 SOT26 BJ
AP2552W6-7R SOT26 BJ
AP2553W6-7 SOT26 BK
AP2553W6-7R SOT26 BK
AP2552AW6-7 SOT26 BM
AP2552AW6-7R SOT26 BM
AP2553AW6-7 SOT26 BN
AP2553AW6-7R SOT26 BN
(2) U-DFN2020-6
Device Package Identification Code
AP2552FDC-7 U-DFN2020-6 BJ
AP2552FDC-7R U-DFN2020-6 BJ
AP2553FDC-7 U-DFN2020-6 BK
AP2553FDC-7R U-DFN2020-6 BK
AP2552AFDC-7 U-DFN2020-6 BM
AP2552AFDC-7R U-DFN2020-6 BM
AP2553AFDC-7 U-DFN2020-6 BN
AP2553AFDC-7R U-DFN2020-6 BN
AP2552/AP2553/AP2552A/AP2553A
Document number: DS35404 Rev. 10 - 2
( Top View )
6
5
W X
XX
Y
1 2 3
( Top View )
XX
Y W X
www.diodes.com
P2552/ AP2553/ AP2552A/ AP2553A
7
4
XX : Identification Code
Y
: Year 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
X
: Internal Code
XX
: Identification Code
Y : Year : 0~9
: Week : A~Z : 1~26 week;
W
a~z : 27~52 week; z represents
52 and 53 week
X
: Internal Code
13 of 17
October 2014
© Diodes Incorporated
Page 14
P2552/ AP2553/ AP2552A/ AP2553A
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
(1) Package Type: SOT26
A
(2) Package Type: U-DFN2020-6
K
J
H
A1
A
Pin #1 ID
E
E2
Z (4x)
AP2552/AP2553/AP2552A/AP2553A
Document number: DS35404 Rev. 10 - 2
D
D2
e
B C
M
D
b
L
A3
Seating Plane
L
14 of 17
www.diodes.com
Dim Min Max Typ
Dim Min Max Typ
A 0.57 0.63 0.60 A1 0.00 0.05 0.02 A3 –– –– 0.15
b 0.25 0.35 0.30
D 1.95 2.075 2.00 D2 1.55 1.75 1.65
E 1.95 2.075 2.00 E2 0.86 1.06 0.96
e –– –– 0.65 L 0.25 0.35 0.30 Z –– –– 0.20 All Dimensions in mm
SOT26
A 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D
 
H 2.90 3.10 3.00
J 0.013 0.10 0.05
K 1.00 1.30 1.10
L 0.35 0.55 0.40
M 0.10 0.20 0.15
0° 8°

All Dimensions in mm
U-DFN2020-6
Type C
0.95

October 2014
© Diodes Incorporated
Page 15
P2552/ AP2553/ AP2552A/ AP2553A
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) Package Type: SOT26
C2
(2) Package Type: U-DFN2020-6
G
Z
Y
C2
Dimensions Value (in mm)
Z 3.20
G 1.60
C1
X
X2
X1
X 0.55
Y 0.80 C1 2.40 C2 0.95
Y2
X
C
Y1
Y
Dimensions
C 0.650
X 0.350 X1 1.650 X2 1.700
Y 0.525 Y1 1.010 Y2 2.400
Value
(in mm)
AP2552/AP2553/AP2552A/AP2553A
Document number: DS35404 Rev. 10 - 2
15 of 17
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October 2014
© Diodes Incorporated
Page 16
P2552/ AP2553/ AP2552A/ AP2553A
Taping Orientation
(1)
Package Type: SOT26
(Note 11)
(2) Package Type (-7) : U-DFN2020-6
(3)
Package Type (-7R) : U-DFN2020-6
Note: 11. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf.
AP2552/AP2553/AP2552A/AP2553A
Document number: DS35404 Rev. 10 - 2
16 of 17
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© Diodes Incorporated
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P2552/ AP2553/ AP2552A/ AP2553A
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
IMPORTANT NOTICE
LIFE SUPPORT
AP2552/AP2553/AP2552A/AP2553A
Document number: DS35404 Rev. 10 - 2
17 of 17
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October 2014
© Diodes Incorporated
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