Datasheet AP2301FGEG, AP2301SN, AP2311FGEG, AP2311SN, AP2301M8G Datasheet (Diodes)

AP2301/AP2311

2.0A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH

Description

The AP2301 and AP2311 are single channel current-limited

integrated high-side power switches optimized for Universal Serial

Bus (USB) and other hot-swap applications. The family of devices

complies with USB standards and is available with both polarities of

Enable input.

The devices have fast short-circuit response time for improved overall

system robustness, and have integrated output discharge function to

ensure completely controlled discharging of the output voltage

capacitor. They provide a complete protection solution for applications

subject to heavy capacitive loads and the prospect of short circuit,

and offer reverse current blocking, over-current, over-temperature

and short-circuit protection, as well as controlled rise time and under-

voltage lockout functionality. A 7ms deglitch capability on the open-

drain Flag output prevents false over-current reporting and does not

require any external components.

All devices are available in SO-8, MSOP-8, MSOP-8EP, U-DFN3030-

8 and U-DFN2020-6 packages.

Features

• Single channel current-limited power switch

• Output discharge function

• Fast short-circuit response time: 2µs

• 2.5A accurate current limiting

• Reverse current blocking

• 70mΩ on-resistance

• Input voltage range: 2.7V - 5.5V

• Built-in soft-start with 0.6ms typical rise time

• Over-current and thermal protection

• Fault report (FLG) with blanking time (7ms typ)

• ESD protection: 2kV HBM, 200V MM

• Ambient temperature range: -40°C to +85°C

• SO-8, MSOP-8, MSOP-8EP, U-DFN3030-8 and U-DFN2020-6:

Available in “Green” Molding Compound (No Br, Sb)

 Totally Lead-free & Fully RoHS Compliant (Notes 1 & 2)

 Halogen and Antimony Free. “Green” Device (Note 3)

• UL Recognized, File Number E322375

• IEC60950-1 CB Scheme Certified

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

Pin Assignments

Applications

• LCD TVs & Monitors

• Set-Top-Boxes, Residential Gateways

• Laptops, Desktops, Servers, e-Readers, Printers, Docking

Stations, HUBs

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( Top View )

1

GND

2

IN

3

IN

EN

4

SO-8

( Top View )

1

GND

2

IN

3

IN

4

EN

MSOP-8 /MSOP-8EP

Note: latter with exposed pad

(dotted line)

(Top View)

1

GND

2

IN

3

IN

4

EN

U-DFN3030-8 Type E

U-DFN2020-6

8

NC

7

OUT

6

OUT

5

FLG

8

NC

7

OUT

6

OUT

5

FLG

8

NC

7

OUT

6

FLG

5

February 2014

Typical Applications Circuit

Enable Active High

Power Supply

2.7V to 5.5V

10k

ON

0.1uF

IN

FLG

EN

GND

OUT

0.1uF

AP2301/AP2311

Load

120uF

OFF

Available Options

Part Number Channel Enable Pin (EN)

AP2301 1 Active Low

AP2311 1 Active High

Recommended Maximum

Continuous Load Current (A)

Typical Current

Limit (A)

2A 2.5A

Pin Descriptions

Name

GND 1 1 2 Ground

IN

EN 4 4 3 Enable input, active low (AP2301) or active high (AP2311)

FLG 5 5

OUT

NC

Exposed

Pad

SO-8,

MSOP-8

2, 3 2, 3

6, 7 6, 7 5 Voltage Output Pin All OUT pins must be tied together externally.

8 8

—

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

Pin Number

MSOP-8EP,

U-DFN3030-8

Exposed

Pad

U-DFN2020-6

1 Voltage Input Pin; Connect a 0.1µF or larger ceramic capacitor from IN to GND as

4 Over-temperature and over-current fault reporting with 7ms deglitch; active low open-

6 NC:

Exposed

Pad

close as possible. (all IN pins must be tied together externally)

drain output. FLG is disabled for 7ms after turn-on.

No Internal Connection; recommend tie to OUT pins

Exposed pad. It should be externally connected to GND and thermal mass for enhanced thermal

impedance. It should not be used as electrical ground conduction path.

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Function

Package

SO-8

MSOP-8

MSOP-8EP U-DFN3030-8 U-DFN2020-6

February 2014

Functional Block Diagram

AP2301/AP2311

IN

UVLO

EN

Absolute Maximum Ratings (@T

Current

Sense

Discharge

Driver

Thermal

Sense

= +25°C, unless otherwise specified.)

A

Current

Limit

Deglitch

Control

OUT

FLG

GND

Symbol Parameter Ratings Unit

ESD HBM Human Body Model ESD Protection 2 kV

ESD MM Machine Model ESD Protection 200 V

VIN

V

OUT

V

EN , VFLG

I

LOAD

T

J(MAX)

TST

Notes: 4. All voltages referred to GND pin. Maximums are the lower of (VIN +0.3) and 6.5V

5. UL Recognized Rating from -30°C to +70°C (Diodes qualified T

Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time.

Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices.

Input Voltage (Note 4) -0.3 to 6.5 V

Output Voltage (Note 4)

Enable Voltage (Note 4)

Maximum Continuous Load Current Internal Limited A

Maximum Junction Temperature 150 °C

-0.3 to (VIN +0.3) or 6.5

Storage Temperature Range (Note 5) -65 to +150 °C

from -65°C to +150°C)

ST

V

Recommended Operating Conditions (@T

= +25°C, unless otherwise specified.)

A

Symbol Parameter Min Max Unit

V

I

OUT

V

T

Input voltage 2.7 5.5 V

IN

Output Current 0 2 A

EN Input Logic Low Voltage 0 0.8 V

IL

EN Input Logic High Voltage 2

IH

Operating Ambient Temperature -40 +85

A

V

IN

V

°C

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

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February 2014

AP2301/AP2311

Electrical Characteristics (@T

Symbol Parameter Test Conditions Min Typ Max Unit

V

∆V

I

SHDN

I

R

DS(ON)

I

SHORT

T

SHORT

I

LEAK-EN

I

LEAK-O

T

D(OFF)

R

I

T

R

T

Notes: 6. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.

7. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down when V The discharge function offers a resistive discharge path for the external storage capacitor for limited time.

8. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.

9. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane.

10. Device mounted on 1"x1" FR-4 substrate PCB, 2oz copper, with minimum recommended padon top layer and thermal vias to bottom layer ground.

Input UVLO

UVLO

Input UVLO Hysteresis

UVLO

Input Shutdown Current Disabled, OUT = open 0.1 1 µA

Input Quiescent Current Enabled, OUT = open 60 100 µA

I

Q

Input Leakage Current Disabled, OUT grounded 0.1 1 µA

LEAK

Reverse Leakage Current

REV

Switch on-resistance

Over-Load Current Limit (Note 6)

LIMIT

Current limiting trigger threshold Output Current Slew rate (<100A/s) 2.5 A

I

Trig

Short-Circuit Current Limit Enabled into short circuit 2.75 A

Short-circuit Response Time

EN Input Logic Low Voltage

V

IL

EN Input Logic High Voltage

V

IH

EN Input leakage

Output leakage current

Output turn-on delay time

D(ON)

Output turn-on rise time

TR

Output turn-off delay time

Output turn-off fall time

TF

FLG output FET on-resistance

FLG

FLG Off Current

FOH

FLG blanking time

Blank

Discharge time

DIS

Discharge resistance (Note 7)

DIS

Thermal Shutdown Threshold Enabled 140

SHDN

Thermal Shutdown Hysteresis 20

HYS

Thermal Resistance Junction-to-

θJA

Ambient

= +25°C, VIN = +5V, CIN = 0.1µF, CL = 1µF, unless otherwise specified.)

A

VIN rising

VIN decreasing

Disabled, V

V

= 5V, I

IN

VIN = 3.3V, I

V

= 5V, V

IN

V

= 0V to I

OUT

V

= 2.7V to 5.5V

IN

V

= 2.7V to 5.5V

IN

V

= 5V, V

IN

Disabled, V

CL= 1µF, R

I

= 10mA

FLG

V

= 5V

FLG

= 0V, V

IN

= 2.0A

OUT

= 2.0A

OUT

= 4.5V -40°C ≤ TA ≤ +85°C

OUT

= 0V and 5.5V

EN

= 0V

OUT

= 5Ω

LOAD

= 5Ω

LOAD

= 5Ω

LOAD

= 5Ω

LOAD

= 5V, I

OUT

REV

T

-40°C ≤ TA ≤ +85°C

T

-40°C ≤ TA ≤ +85°C

= I

(OUT shorted to ground)

LIMIT

at VIN

= +25°C

A

= +25°C

A

Assertion or deassertion due to overcurrent and overtemperature condition

CL= 1µF, VIN = 5V, disabled to V

VIN = 5V, disabled, I

OUT

= 1mA

OUT

< 0.5V

SO-8 (Note 8) 96

MSOP-8 (Note 8) 130

MSOP-8-EP (Note 9) 92

U-DFN3030-8 (Note 9) 84

1.6 2.0 2.4 V

50 mV

0.01 1 µA

70 84

105

90 108

135

2.05 2.50 2.85 A

2 µs

0.8 V

2 V

0.01 1 µA

0.5 1 µA

0.1 ms

0.6 1.5 ms

0.1 ms

0.05 0.1 ms

20 40 Ω

0.01 1 µA

4 7 15 ms

0.6 ms

100 Ω

°C/W

U-DFN2020-6 (Note 10) 90 °C/W

< V

UVLO

).

IN

mΩ

°C

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

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February 2014

Typical Performance Characteristics

AP2301/AP2311

V

EN

V

OUT

50%

T

D(ON)

T

10%

R

90%

Turn-On Delay and Rise Time

V

OUT

2V/div

V

EN

5V/div

I

IN

1A/div

Device enabled

V

50%

T

D(OFF)

90%

10%

T

F

EN

V

OUT

50%

T

D(ON)

T

10%

R

Figure 1. Voltage Waveforms: AP2301 (left), AP2311 (right)

All Enable Plots are for Enable Active Low

Turn-Off Delay and Fall Time

TA=25°C V

=5V

IN

=1uF

C

L

R

=2.5Ω

OUT

V

OUT

2V/div

V

EN

5V/div

I

IN

1A/div

Device disabled

90%

50%

T

D(OFF)

90%

T

F

10%

TA=25°C V

=5V

IN

C

=1uF

L

=2.5Ω

R

OUT

Turn-On Delay and Rise Time

V

OUT

2V/div

Device enabled

V

EN

5V/div

I

IN

1A/div

Inrush current limit

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

Turn-Off Delay and Fall Time

TA=25°C

=5V

V

TA=25°C

=5V

V

IN

C

=120uF

L

=2.5Ω

R

OUT

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V

OUT

2V/div

V

EN

5V/div

I

IN

1A/div

Device disabled

IN

C

=120uF

L

R

OUT

=2.5Ω

February 2014

r

Typical Performance Characteristics (cont.)

Device Enabled Into Short-Circuit

AP2301/AP2311

Inrush Current

V

EN

5V/div

I

OUT

1A/div

V

OUT

2V/div

I

IN

2A/div

FLG 5V/div

Full-Load to Short-Circuit

Transient Response

Output short circuited

Device turns off and re-enables into current limit

TA=25°C V

=5V

IN

C

=120uF

L

R

=1Ω

OUT

TA=25°C V

=5V

IN

R

OUT

=2.5Ω

V

EN

5V/div

TA=25°C V

=5V

IN

R

=2.5Ω

OUT

CL=120uF CL=220uF

I

OUT

1A/div

CL=470uF

Short-Circuit to Full-Load

Recovery Response

V

OUT

2V/div

IIN 2A/div

FLG 5V/div

Output short circuit

emoved

Short circuit present and device thermal cycles

TA=25°C V

=5V

IN

=2.5Ω

R

OUT

No-Load to Short-Circuit

Transient Response

V

OUT

2V/div

I

IN

2A/div

Output short circuited

Device enters current limit

TA=25°C V

=5V

IN

=0Ω

R

OUT

Short-Circuit to No-Load

Recovery Response

Output short

emoved

V

OUT

2V/div

IIN 2A/div

circuit

Short circuit present and device thermal cycles

T

A

V

IN

R

OUT

=25°C

=5V

=0Ω

FLG 5V/div

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

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February 2014

Typical Performance Characteristics (cont.)

Power ON

AP2301/AP2311

Short-Circuit with Blanking Time and

Recovery

FLG 5V/div

I

OUT

1A/div

V

OUT

5V/div

V

IN

5V/div

VIN 2V/div

FLG 5V/div

TA=25°C V

=5V

IN

R

=2.5Ω

OUT

=120uF

C

L

V

OUT

5V/div

T

A

V

IN

=25°C

=5V

I

OUT

2A/div

UVLO Increasing

TA=25°C

=5V

V

IN

R

=2.5Ω

OUT

=120uF

C

L

VIN 2V/div

I

OUT

2A/div

UVLO Decreasing

TA=25°C V

=5V

IN

=2.5Ω

R

OUT

C

=120uF

L

I

OUT

2A/div

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

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February 2014

Typical Performance Characteristics (cont.)

AP2301/AP2311

Turn-on Time vs. Input voltage

100

90

80

70

60

50

40

30

Turn-on Time (us)

20

10

0

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

CL=1uF R

L

T

A

=5Ω =25°C

260 240 220 200 180 160 140 120 100

80 60

Turn-off Time (us)

40 20

Input Voltage (V)

Rise Time vs. Input voltage

1000

900 800

700

600

500 400

300

Rise Time (us)

200 100

0

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

CL=1uF

=5Ω

R

L

=25°C

T

A

100

Fall Time (us)

Input Voltage (V)

Turn-off Time vs. Input v oltage

0

2.0 2. 5 3.0 3.5 4.0 4.5 5. 0 5.5 6.0

Input Voltage (V)

Fall Time vs. Input voltage

90

80

70

60

50

40

30

20

10

0

2.02.53.03.5 4.04.55.05.56.0

Input Voltage (V)

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

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February 2014

Typical Performance Characteristics (cont.)

AP2301/AP2311

Supply Current,Output Enabled vs. Temperature

100

90

80

70

60

50

(uA)

40

30

20

10

Supply Current Output Enabled

0

VIN=5V

-50 -25 0 25 50 75 100 125

VIN=5.5V

VIN=2.7V

VIN=3.3V

Temperature (°C)

R

vs. Temperature

DS( ON)

180 170 160 150 140 130 120 110 100

(mΩ)

DS(ON)

R

VIN=5V

90 80 70 60 50 40 30 20 10

0

-50-25 0 255075100125

VIN=3.3V

VIN=2.7V

VIN=5.5V

Temperature (°C)

Supply Current,Output Disabled vs. Te mperature

0.30

0.25

0.20

0.15

0.10

0.05

0.00

(uA)

-0.05

-0.10

-0.15

-0.20

-0.25

Supply Current Output Disabled

-0.30

-50 -25 0 25 50 75 100 125

VIN=5.5V

VIN=5V

VIN=3.3V

VIN=2.7V

Temperature (°C)

Short-Circuit Output Current vs. Te mperature

3.0

2.9

2.8

2.7

2.6

2.5

2.4

2.3

2.2

2.1

Short-Circuit Output Current (A)

2.0

-50-250 255075100125

VIN=2.7V

VIN=5V

Temperature (°C)

VIN=3.3V

VIN=5.5V

Undervoltage Lockout vs. Temperature

2.2

2.1

2.0

1.9

1.8

1.7

Undervoltage Lockout (V)

1.6

UVLO Falling

-50 -25 0 25 50 75 100 125

Temperature (°C)

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

UVLO Rising

3.5

3.4

3.3

3.2

3.1

3.0

2.9

2.8

2.7

Threshold Trip Current (A)

2.6

2.5

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Threshold Trip Current vs. Input Voltage

CL=120uF

=

°

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Input Voltage (V)

February 2014

AP2301/AP2311

Application Information

Power Supply Considerations

A 0.1μF to 2.2μF X7R or X5R ceramic bypass capacitor placed between IN and GND, close to the device, is recommended. When an external

power supply is used, or an additional ferrite bead is added to the input, high inrush current may cause voltage spikes higher than the device

maximum input rating during short circuit condition. In this case a 2.2μF or bigger capacitor is recommended. Placing a high-value electrolytic

capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that may

cause ringing on the input. Additionally, bypassing the output with a 0.1μF to 1.0μF ceramic capacitor improves the immunity of the device to short

circuit transients.

Over-Current and Short Circuit Protection

An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series

resistance of the current path. When an over-current condition is detected, the device maintains a constant output current and reduces the output

voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.

Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before V

has been applied. The AP2301/AP2311 senses the short circuit and immediately clamps output current to a certain safe level namely I

LIMIT

In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher inrush

current may flow for a very short period of time before the current limit function can react. The input capacitor(s) rapidly discharge through the

device, activating current limit circuitry. Protection is achieved by momentarily opening the P-MOS high-side power switch and then gradually

turning it on. After the current limit function has tripped (reached the over-current trip threshold), the device switches into current limiting mode and

the current is clamped at I

LIMIT

.

In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the

current-limit threshold (I

) is reached or until the thermal limit of the device is exceeded. The AP2301/AP2311 is capable of delivering current up

TRIG

to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode

and is set at I

LIMIT

.

FLG Response

When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms

deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive

load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout.

The AP2301/AP2311 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.

Power Dissipation and Junction Temperature

The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating

ambient temperature (T

= R

P

D

DS(ON)

× I

A

2

) and R

, the power dissipation can be calculated by:

DS(ON)

Finally, calculate the junction temperature:

T

= PD x R

J

θJA

+ TA

Where:

T

= Ambient temperature °C

A

= Thermal resistance

R

θJA

P

= Total power dissipation

D

Thermal Protection

Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The

AP2301/AP2311 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die

temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense

circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the

device to cool down approximately 20°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input

power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch.

Under-Voltage Lockout (UVLO)

Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 2V, even if

the switch is enabled. Whenever the input voltage falls below approximately 2V, the power switch is quickly turned off. This facilitates the design of

hot-insertion systems where it is not possible to turn off the power switch before input power is removed.

IN

.

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

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February 2014

AP2301/AP2311

Application Information

(cont.)

Discharge Function

The discharge function of the device is active when enable is disabled or de-asserted. The discharge function with the N-MOS power switch

implementation is activated and offers a resistive discharge path for the external storage capacitor. This is designed for discharging any residue of

the output voltage when either no external output resistance or load resistance is present at the output.

Ordering Information

AP 23 X 1 X X -X

Enable

0 : Active Low 1 : Active High

Part Number

AP23X1SG-13 S SO-8 2500/Tape & Reel -13

AP23X1M8G-13 M8 MSOP-8 2500/Tape & Reel -13

AP23X1MPG-13 MP MSOP-8EP 2500/Tape & Reel -13

AP23X1FGEG-7 FGE U-DFN3030-8 Type E 3000/Tape & Reel -7

AP23X1SN-7 SN U-DFN2020-6 3000/Tape & Reel -7

Package

Code

Channel

1 : 1 Channel

Packaging

Package

S : SO-8 M8 : MSOP-8 MP : MSOP-8EP FGE : U-DFN3030-8 SN : U-DFN2020-6 (Green)

Lead Free

G:Green

7”/13” Tape and Reel

Quantity Part Number Suffix

Packing

7 : 7" Tape & Reel 13 : 13" Tape & Reel

Marking Information

(1) SO-8

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

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February 2014

Marking Information

(2) MSOP-8

(cont.)

AP2301/AP2311

(3) MSOP-8EP

(4) U-DFN3030-8 Type E

(5) U-DFN2020-6

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

( Top View )

XX : Identification Code

Y

X X

W

XY

: Year : 0~9 : Week : A~Z : 1~26 week;

W

a~z : 27~52 week; z represents

52 and 53 week

X

: A~Z : Green

Part Number Package Identification Code

AP2301FGEG-7 U-DFN3030-8 BB

AP2311FGEG-7 U-DFN3030-8 BC

( Top View )

XX : Identification Code

Y

XX

W

XY

: Year : 0~9 : Week : A~Z : 1~26 week;

W

a~z : 27~52 week; z represents

52 and 53 week

: A~Z : Internal Code

X

Part Number Package Identification Code

AP2301SN-7 U-DFN2020-6 DB

AP2311SN-7 U-DFN2020-6 DC

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February 2014

Package Outline Dimensions (All dimensions in mm.)

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.

(1) Package type: SO-8

(2) Package type: MSOP-8

E1

E

A1

Detail ‘A’

h

°

45

A2

A3

A

e

b

D

L

0.254 Gauge Plane

Seating Plane

7°~9

°

Detail ‘A’

x

y

1

b

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

A2

e

A1

E

Gauge Plane

Seating Plane

A3

A

0.25

4

x

1

Detail C

E3

E1

4

0

°

x

1

0

°

a

L

c

See Detail C

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AP2301/AP2311

SO-8

Dim Min Max

A - 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25

b 0.3 0.5

D 4.85 4.95

E 5.90 6.10 E1 3.85 3.95

e 1.27 Typ h - 0.35 L 0.62 0.82

0° 8°

θ

All Dimensions in mm

MSOP-8

Dim Min Max Typ

A - 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39

b 0.22 0.38 0.30

c 0.08 0.23 0.15

D 2.90 3.10 3.00

E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E3 2.85 3.05 2.95

e - - 0.65

L 0.40 0.80 0.60

a 0° 8° 4°

x - - 0.750

y - - 0.750

All Dimensions in mm

February 2014

Package Outline Dimensions (cont.) (All dimensions in mm.)

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.

(3) Package type: MSOP-8EP

D

x

y

E

E2

D1

(4) Package type: U-DFN3030-8 Type E

(5) Package type: U-DFN2020-6

1

e

A1

A

D

8Xb

A3

A2

A

A1

E

E2

Z (x4)

E3

E1

D

D2

e

Gauge Plane Seating Plane

See Detail C

b (x8)

A3

L (x8)

0.25

4

X

1

c

0

°

4

X

Detail C

1

0

°

a

L

Pin#1 ID

A

A1

E

E2

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

D

D2

D2/2

e

b

A3

SEATING PLANE

L

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AP2301/AP2311

MSOP-8EP

Dim Min Max Typ

A - 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39

b 0.22 0.38 0.30

c 0.08 0.23 0.15

D 2.90 3.10 3.00 D1 1.60 2.00 1.80

E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E2 1.30 1.70 1.50 E3 2.85 3.05 2.95

e - - 0.65

L 0.40 0.80 0.60

a 0° 8° 4°

x - - 0.750

y - - 0.750

All Dimensions in mm

U-DFN3030-8

Dim Min Max Typ

A1 0 0.05 0.02 A3

D2 2.15 2.35 2.25

Dim Min Max Typ

A1 0 0.05 0.03 A3

D2 1.45 1.65 1.55

E2 0.76 0.96 0.86

All Dimensions in mm

Type E

A 0.57 0.63 0.60

− −

b 0.20 0.30 0.25 D 2.95 3.05 3.00

E 2.95 3.05 3.00

e

− −

E2 1.40 1.60 1.50

L 0.30 0.60 0.45 Z

− −

All Dimensions in mm

U-DFN2020-6

A 0.57 0.63 0.60

⎯ ⎯

b 0.20 0.30 0.25

D 1.95 2.075 2.00

e

⎯ ⎯

E 1.95 2.075 2.00

L 0.30 0.40 0.35

0.15

0.65

0.40

0.15

0.65

February 2014

Suggested Pad Layout

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.

(1) Package type: SO-8

(2) Package type: MSOP-8

Y

X

C2

X C

C1

Dimensions Value (in mm)

X 0.60

Y 1.55 C1 5.4 C2 1.27

Y

(3) Package type: MSOP-8EP

Y1

X C

G

Y2

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

Y

Y1

X1

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Dimensions Value (in mm)

C 0.650 X 0.450 Y 1.350

Y1 5.300

Dimensions

C 0.650 G 0.450 X 0.450

X1 2.000

Y 1.350 Y1 1.700 Y2 5.300

Value

(in mm)

AP2301/AP2311

February 2014

Suggested Pad Layout (cont.)

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.

(4) Package type: U-DFN3030-8 Type E

(5) Package type: U-DFN2020-6

Y

(x8)

X (x8) C

YC

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

X2

C1

Y Z

X1

Y1

Y2

G

www.diodes.com

Dimensions Value (in mm)

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C 0.65

C1 2.35

X 0.30

Y 0.65 Y1 1.60 Y2 2.75

Z 1.67

G 0.15

X1 0.90 X2 0.45

Y 0.37

C 0.65

AP2301/AP2311

February 2014

Taping Orientation (Note 11)

For U-DFN2020-6 and U-DFN3030-8 Type E

AP2301/AP2311

Note: 11. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

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February 2014

AP2301/AP2311

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated.

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

www.diodes.com

IMPORTANT NOTICE

LIFE SUPPORT

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

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February 2014