Datasheet AP2281-1FMG, AP2281-1WG, AP2281-3FMG, AP2281-3WG Datasheet (Diodes)

A

V



Green

SINGLE SLEW RATE CONTROLLED LOAD SWITCH

Description

The AP2281 slew rate controlled load switch is a single P-channel

MOSFET power switch designed for high-side load-switching

applications. The MOSFET has a typical R

allowing increased load current handling capacity with a low forward

voltage drop. The turn-on slew rate of the device is controlled

internally.

The AP2281 load switch is designed to operate from 1.5V to 6V,

making it ideal for 1.8V, 2.5V, 3.3V, and 5V systems. The typical

quiescent supply current is only 0.01µA.

of 80m at 5V,

DS(ON)

Features

 Wide input voltage range: 1.5V – 6V

 Low R

 Turn-on slew rate controlled

 AP2281-1: 1ms turn-on rise time

 AP2281-3: 100µs turn-on rise time with internal discharge

 Very low turn-on quiescent current: << 1µA

 Fast load discharge option

 Temperature range -40°C to +85°C  Lead-Free Finish; RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (Note 3)

: 80mΩ typical @ 5V

DS(ON)

Applications

 Smart Phones  PDA  Cell Phones  GPS Navigators  PMP/MP4  Notebook and Pocket PC

Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.

2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

Pin Assignments

OUT

GND

EN IN

( Top View )

1

IN

2

IN

3

EN

U-DFN2018-6

1

2

7

(Top View)

SOT26

6

OUT

5

OUT

4

GND

IN

6

GND

5

43

P2281

Typical Applications Circuit

AP2281

Document number: DS31359 Rev. 7 - 2

IN

1uF

IN

Enable

EN

OUT

GND

OUT

V

0.1uF

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Pin Descriptions

P2281

Pin Name

OUT

GND 2, 5 4 Ground.

EN 3 3 Enable input, active high

IN

PAD 7 Thermal pad. Suggest connecting to ground plane to get better heat dissipation.

Pin Number

SOT26 U-DFN2018-6

1 5, 6

4, 6 1, 2

Voltage output pin. This is the pin to the P-channel MOSFET drain connection. Bypass to ground through a 0.1uF capacitor.

Voltage input pin. This is the pin to the P-channel MOSFET source. Bypass to ground through a 1µF capacitor.

Function

Options

Part Number Slew Rate (typ) Active Pull Down Enable

AP2281-1 1ms No Active High

AP2281-3 100µs Yes Active High

Functional Block Diagram

AP2281

Document number: DS31359 Rev. 7 - 2

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P2281

Absolute Maximum Ratings (@T

= +25°C, unless otherwise specified.)

A

Symbol Parameter Ratings Unit

ESD HBM Human Body Model ESD Protection 5 KV

ESD MM Machine Model ESD Protection

V

IN

V

OUT

V

EN

I

load

T

J

T

ST

P

D

Notes: 4. TJ, max = +125°C.

5. Ratings apply to ambient temperature at +25°C.

Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time.

Input Voltage 6.5 V

Output Voltage VIN +0.3 V

Enable Voltage 6.5 V

Maximum Continuous Load Current 2 A

Operating Junction Temperature Range -40 to +125 °C

Storage Temperature Range -65 to +150 °C

Power Dissipation

SOT26 (Note 4, 5, 6) 720 mW

U-DFN2018-6 (Note 4, 5, 7) 1410 mW

SOT26 500 V

U-DFN2018-6 450 V

Recommended Operating Conditions (@T

= +25°C, unless otherwise specified.)

A

Symbol Parameter Min Max Unit

V

I

OUT

T

IN

A

Input voltage 1.5 6.0 V

Output Current 0 2.0 A

Operating Ambient Temperature -40 +85 °C

Electrical Characteristics (@T

= +25°C, unless otherwise specified.)

A

Symbol Parameters Test Conditions Min Typ Max Unit

I

SHDN

I

LEAK

R

DS(ON)

V

I

SINK

T

D(ON)

T

D(OFF)

R

DISCH

θJA

θJC

I

ON

Q

Input Quiescent Current

Input Shutdown Current

Input Leakage Current

Switch on-resistance

V

= VIN, I

EN

V

= 0V, OUT open

EN

V

= 0V, OUT grounded

EN

= 5.0V

V

IN

OUT

= 0

VIN = 3.3V

VIN = 1.8V

VIN = 1.5V

IL

IH

EN Input Logic Low Voltage

EN Input Logic High Voltage

EN Input leakage

Output turn-on delay time

Output turn-on rise time

Output turn-off delay time

Discharge FET on-resistance

V

= 1.5V to 6V

IN

1.5V ≤ V

≤ 2.7V

IN

2.7V < VIN < 5.25V

V

≥ 5.25V

IN

V

= 5V

EN

R

= 10Ω

LOAD

AP2281-1, R

AP2281-3, R

R

= 10Ω

LOAD

= 10Ω

For AP2281-3 only, V

= GND

EN

SOT26 (Note 6)

Thermal Resistance Junction-to-Ambient

U-DFN2018-6 (Note 7)

SOT26 (Note 6)

Thermal Resistance Junction-to-case

U-DFN2018-6 (Note 7)

— 0.01 1 μA

—

— —

1.4

1.6

1.7

— —

—

0.01 1 μA

80 100 mΩ

95 120

160 210

mΩ

210 280 mΩ

0.4 V

— —

1 μA

1 — μS

1000 1500 μS

100 150 μS

0.5 1 μS

65 100 Ω

153

78

29

19

—

°C/W

V

Notes: 6. Test condition for SOT26: Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.

7. Test condition for U-DFN2018-6: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom layer 1.0"x1.4" ground plane.

AP2281

Document number: DS31359 Rev. 7 - 2

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Typical Performance Characteristics

P2281

Quiescent Current vs. Input Voltage

0.01

A)



0.008

0.006

0.004

0.002

Quiescent Current (

0

1.02.0 3.04.0 5.06.0

Inpu t Voltage (V)

R

vs. Input Voltage

DS( ON)

I=100mA

I=500mA

I=1A

I=2A

)



300.00

250.00

200.00

(m

150.00

DS(ON)

R

100.00

50.00

1.522.533.544.555.56

Input Voltage (V)

Quiescent Current vs. Temperature

0.010

A)

0.008



0.006

0.004

0.002

VIN=1.8V

VIN=3.3V

VIN=5.0V

Quiescent Current (

0.000

-50 -25 0 25 50 75 100 125

Temperature (°C)

R

vs. Temperature

DS( ON)

200.00

180.00

160.00

140.00

)



120.00

(m

100.00

80.00

DS(ON)

R

60.00

40.00

20.00

0.00

-50 -25 0 25 50 75 100

Temperature (°C)

VIN =1.8V

VIN =3.3V

VIN =5V

ENABLE Threshold vs. Input Voltage

1.8

1.6

1.4

1.2

1.0

0.8

ON/OFF Threshold (V)

0.6

0.4

1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

AP2281

Document number: DS31359 Rev. 7 - 2

Input Voltage (V )

VIL (V)

VIH (V)

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Input Shutdown Current vs. Temperature

0.010

0.008

A)

0.006



(

0.004

SHDN

I

0.002

0.000

-50 -25 0 25 50 75 100 125

Temperature (°C)

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Typical Performance Characteristics (cont.)

AP2281-1 Turn-On

= 3.3V, RL = 7Ω)

(V

IN

AP2281-1 Turn-Off

(V

= 3.3V, RL = 7Ω)

IN

P2281

V

(5V/div)

EN

V

(2V/div)

OUT

I

(500mA/div)

IN

Time (500μs/div)

VEN (5V/div)

V

OUT

IIN (500mA/div)

(2V/div)

Time (50μs/div)

V

EN

OUT

(5V/div)

(2V/div)

AP2281-1 Turn-On

(V

= 5V, RL = 10Ω)

IN

VEN (5V/div)

V

(2V/div)

OUT

AP2281-1 Turn-Off (V

= 5V, RL = 10Ω)

IN

I

(500mA/div)

IN

Time (500μs/div)

AP2281-3 Turn-On

= 3.3V, RL = 7Ω)

(V

IN

VEN (5V/div)

V

OUT

I

IN

(2V/div)

(500mA/div)

Time (50μs/div)

AP2281

Document number: DS31359 Rev. 7 - 2

IIN (500mA/div)

Time (50μs/div)

AP2281-3 Turn-Off

= 3.3V, RL= 7Ω)

(V

IN

VEN (5V/div)

V

(2V/div)

OUT

IIN (500mA/div)

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Time (50μs/div)

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Typical Performance Characteristics (cont.)

P2281

AP2281-3 Turn-Off

(V

= 5V, RL=10Ω)

IN

Time (50μs/div)

V

(5V/div)

EN

V

(2V/div)

OUT

I

(500mA/div)

IN

AP2281-3 Turn-On

= 5V, RL = 10Ω)

(V

IN

Time (50μs/div)

VEN (5V/div)

V

OUT

IIN (500mA/div)

(2V/div)

Application Notes

Input Capacitor

A 1μF capacitor is recommended to connect between IN and GND pins to decouple input power supply glitch and noise. The input capacitor has

no specific type or ESR (Equivalent Series Resistance) requirement. However, for higher current application, ceramic capacitors are

recommended due to their capability to withstand input current surges from low impedance sources, such as batteries in portable applications.

This input capacitor must be located as close as possible to the device to assure input stability and less noise. For PCB layout, a wide copper

trace is required for both IN and GND

.

Output Capacitor

A 0.1μF capacitor is recommended to connect between OUT and GND pins to stabilize and accommodate load transient condition. The output

capacitor has no specific type or ESR requirement. The amount of the capacitance may be increased without limit. For PCB layout, the output

capacitor must be placed as close as possible to OUT and GND pins, and keep the traces as short as possible.

ENABLE/SHUTDOWN Operation

The AP2281 is turned on by setting the EN pin high, and is turned off by pulling it low. To ensure proper operation, the signal source used to

drive the EN pin must be able to swing above and below the specified turn-on/off voltage thresholds listed in the Electrical Characteristics section

under V

and VIH.

IL

DISCHARGE Operation

The AP2281-3 offers discharge option that helps to discharge the output charge when disabled.

Power Dissipation

The device power dissipation and proper sizing of the thermal plane is critical to avoid thermal shutdown and ensure reliable operation. Power

dissipation of the device depends on input voltage and load conditions and can be calculated by:

2

xRIP 

OUTD

(1)

DSON

However, the maximum power dissipation that can be handled by the device depends on the maximum junction to ambient thermal resistance,

maximum ambient temperature, and maximum device junction temperature, which can be approximated by the equation below:

)TC125(



)T(max@P

 (2)

AD

For example at V

Based on SOT26 θ

= 5V, the typical R

IN

= 153°C/W and equation (2), the calculated junction temperature rise from ambient is approximately 49°C. Since the

JA

= 80mΩ. For I

DSON

= 2A, the maximum power dissipation calculated using equation (1) is PD = 0.32W.

OUT

maximum junction temperature is 125°C, the operating ambient temperature must be kept below 76°C to safely operate the device.

AP2281

Document number: DS31359 Rev. 7 - 2

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

JA

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Application Notes (cont.)

P2281

On the other hand, at T

Hence the safe operating maximum continuous current is 1.81A. For other application conditions, the users should recalculate the device

maximum power dissipation based on the operating conditions.

= +85°C and V

A

= 5V, the calculated maximum power dissipation from equation (2) is approximately P

IN

D(MAX)

= 0.26W.

Ordering Information

AP2281 - X XX G -7

Turn-on rise time

1 : 1ms 3 : 100us

Package

W : SOT26

FM : U-DFN2018-6

Green

G : Green

Packing

7 : Tape & Reel

Part Number Package Code Packaging

AP2281-1WG-7 W SOT26 3000/Tape & Reel -7

AP2281-3WG-7 W SOT26 3000/Tape & Reel -7

AP2281-1FMG-7 FM U-DFN2018-6 3000/Tape & Reel -7

AP2281-3FMG-7 FM U-DFN2018-6 3000/Tape & Reel -7

Quantity Part Number Suffix

7” Tape and Reel

Marking Information

(1) SOT26

( Top View )

(2) U-DFN2018-6

6

XX Y

1 2 3

Device Package Type Identification Code

AP2281-1W SOT26 U2

AP2281-3W SOT26 U3

WX

4

XX : Identification code

: Year 0~9

Y

: Week : A~Z : 1~26 week;

W

a~z : 27~52 week; z represents 52 and 53 week

: A~Z : Green

X

7

5

( Top View )

XX : Identification code

Y

XX

Y

W X

.

: Year 0~9 : Week : A~Z : 1~26 week;

W

a~z : 27~52 week; z represents 52 and 53 week

: A~Z : Green

X

Device Package Type Identification Code

AP2281-1FM U-DFN2018-6 UE

AP2281-3FM U-DFN2018-6 UF

AP2281

Document number: DS31359 Rev. 7 - 2

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Package Outline Dimensions (All dimensions in mm.)

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.

(1) SOT26

(2) U-DFN2018-6

K

J

A

Dim Min Max Typ

A 0.35 0.50 0.38

B C

H

M

D

L

B 1.50 1.70 1.60 C 2.70 3.00 2.80 D H 2.90 3.10 3.00 J 0.013 0.10 0.05 K 1.00 1.30 1.10 L 0.35 0.55 0.40

M 0.10 0.20 0.15



All Dimensions in mm

Dim Min Max Typ

A 0.545 0.605 0.575

A1 0 0.05 0.02 A3

b 0.15 0.25 0.20 D 1.750 1.875 1.80

D2 1.30 1.50 1.40

e E 1.95 2.075 2.00

E2 0.90 1.10 1.00

L 0.20 0.30 0.25

z

All Dimensions in mm

SOT26

 

0° 8°

U-DFN2018-6

 

 

P2281

0.95



0.13

0.50

0.30

AP2281

Document number: DS31359 Rev. 7 - 2

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Suggested Pad Layout

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.

(1) SOT26

(2) U-DFN2018-6

Y

Y1

AP2281

Document number: DS31359 Rev. 7 - 2

G

Z

Y

X

XC

X1

C2

G

www.diodes.com

C1

Dimensions Value (in mm)

Z

G

X Y

C1 2.40

C2

Dimensions Value (in mm)

C 0.50 G 0.20 X 0.25

X1 1.60

Y 0.35

Y1 1.20

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3.20

1.60

0.55

0.80

0.95

P2281

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Taping Orientation

P2281

Note: 8. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf

AP2281

Document number: DS31359 Rev. 7 - 2

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P2281

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Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

www.diodes.com

IMPORTANT NOTICE

LIFE SUPPORT

AP2281

Document number: DS31359 Rev. 7 - 2

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Datasheet AP2281-1FMG, AP2281-1WG, AP2281-3FMG, AP2281-3WG Datasheet (Diodes) [ru]