
Absolute Maximum Ratings T
=25°C unless otherwise noted
AO4425
38V P-Channel MOSFET
General Description
The AO4425 uses advanced trench technology to
provide excellent R
charge with a 25V gate rating. This device is suitable
for use as a load switch or in PWM applications. It is
ESD protected.
Top View Bottom View
, and ultra-low low gate
DS(ON)
SOIC-8
Product Summary
(V) = -38V
DS
ID = -14A (VGS = -20V)
R
R
ESD Rating: 4000V HBM
100% UIS Tested
100% Rg Tested
< 10mΩ (VGS = -20V)
DS(ON)
< 11mΩ (VGS = -10V)
DS(ON)
G
D
S
A
Maximum UnitsParameter
Drain-Source Voltage -38
Continuous Drain
Current
A
TA=25°C
TA=70°C
B
TA=25°C
A
Power Dissipation
TA=70°C
Junction and Storage Temperature Range
V
DS
V
GS
I
D
I
DM
P
D
TJ, T
STG
±25Gate-Source Voltage
-14
-11
-50Pulsed Drain Current
3.1
2
-55 to 150
V
V
A
W
°C
Thermal Characteristics
Parameter Units
Maximum Junction-to-Ambient
Maximum Junction-to-Ambient
Maximum Junction-to-Lead
C
t ≤ 10s
Steady-State
Steady-State
R
θJA
R
θJL
26 40
50 75
14 24
°C/W
°C/W
°C/W
Alpha & Omega Semiconductor, Ltd. www.aosmd.com

AO4425
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol Min Typ Max Units
Parameter Conditions
STATIC PARAMETERS
BV
I
DSS
I
GSS
V
GS(th)
I
D(ON)
R
DS(ON)
g
FS
V
SD
I
S
DSS
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body leakage current
Gate Threshold Voltage
On state drain current
Static Drain-Source On-Resistance
Forward Transconductance
Diode Forward Voltage
Maximum Body-Diode Continuous Current
ID=-250µA, VGS=0V
VDS=-30V, VGS=0V
VDS=0V, VGS=±20V
VDS=0V, VGS=±25V
VDS=V
GS ID
=-250µA
VGS=-10V, VDS=-5V
VGS=-20V, ID=-14A
VGS=-10V, ID=-14A
VDS=-5V, ID=-14A
IS=-1A,VGS=0V
-38 V
-100
TJ=55°C -500
±1 µA
±10 µA
-2 -2.5 -3.5 V
-50 A
7.7 10
TJ=125°C 11 13.5
8.8 11 mΩ
43 S
0.71 1 V
4.2 A
nA
mΩ
DYNAMIC PARAMETERS
C
iss
C
oss
C
rss
R
g
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
VGS=0V, VDS=-20V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
3800 pF
560 pF
350 pF
7.5 Ω
SWITCHING PARAMETERS
Q
Q
Q
t
D(on)
t
r
t
D(off)
t
f
t
rr
Q
g
gs
gd
Total Gate Charge
Gate Source Charge
Gate Drain Charge
VGS=-10V, VDS=-20V, ID=-14A
Turn-On DelayTime
Turn-On Rise Time
Turn-Off DelayTime
VGS=-10V, VDS=-20V, RL=1.35Ω,
R
=3Ω
GEN
Turn-Off Fall Time
Body Diode Reverse Recovery Time
rr
Body Diode Reverse Recovery Charge
IF=-14A, dI/dt=100A/µs
IF=-14A, dI/dt=100A/µs
63 nC
14.1 nC
16.1 nC
12.4 ns
9.2 ns
97.5 ns
45.5 ns
35
ns
33 nC
A: The value of R
The value in any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal
resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R
θJA
D. The static characteristics in Figures 1 to 6,12,14 are obtained using <300 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in
SOA curve provides a single pulse rating.
Rev 3 : Nov. 2010
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T
θJA
-15
is the sum of the thermal impedence from junction to lead R
2
FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The
and lead to ambient.
θJL
-12.8
=25°C.
A
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AO4425
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
30
25
20
-5V
-4.5V
(A)
15
D
-I
10
-4V
-3.5V
5
VGS=-3V
0
0 1 2 3 4 5
-VDS (Volts)
Fig 1: On-Region Characteristics
10
9
)
Ω
Ω
Ω
Ω
(m
8
DS(ON)
R
7
30
VDS=-5V
25
20
(A)
15
D
-I
10
125°C
25°C
5
0
2 2.5 3 3.5 4 4.5 5
-VGS(Volts)
Figure 2: Transfer Characteristics
1.6
VGS=-10V
1.4
ID = -14A
VGS=-20V
1.2
ID = -14A
1
Normalized On-Resistance
6
0 5 10 15 20 25 30
-ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
20
ID=-14A
15
)
Ω
Ω
Ω
Ω
(m
DS(ON)
R
10
125°C
5
4 8 12 16 20
-VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
-12.8
(A)
S
-I
0.8
0 25 50 75 100 125 150 175
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
-15
1.0E+01
1.0E+00
1.0E-01
1.0E-02
1.0E-03
1.0E-04
25°C
1.0E-05
1.0E-06
0.0 0.2 0.4 0.6 0.8 1.0
-VSD (Volts)
Figure 6: Body-Diode Characteristics
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AO4425
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
10
VDS=-15V
ID=-14A
8
6
(Volts)
GS
4
-V
2
0
0 10 20 30 40 50 60 70
-Qg (nC)
Figure 7: Gate-Charge Characteristics
100.0
R
DS(ON)
limited
10µs
100µs
1ms
10.0
10ms
(Amps)
D
-I
1.0
T
J(Max)
=150°C
1s
10s
TA=25°C
0.1
0.1 1 10 100
-VDS (Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
10
D=Ton/T
T
J,PK=TA+PDM.ZθJA.RθJA
R
=40°C/W
θJA
1
5000
4000
3000
2000
Capacitance (pF)
1000
C
0
0 10 20 30 40
Figure 8: Capacitance Characteristics
40
30
20
Power (W)
10
0
0.001 0.01 0.1 1 10 100 1000
Figure 10: Single Pulse Power Rating Junction-to-
-15
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
-12.8
oss
-VDS (Volts)
Pulse Width (s)
Ambient (Note E)
C
iss
T
J(Max)
TA=25°C
=150°C
0.1
Normalized Transient
Thermal Resistance
JA
θ
θ
θ
θ
Z
Single Pulse
0.01
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
Figure 11: Normalized Maximum Transient Thermal Impedance
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Pulse Width (s)