The AN8480NSB is a 3-phase full-wave motor
driver IC with a reverse rotation brake/short brake
changeover function, incorporating a thermal protection circuit with its protection monitor pin.
FG output high-levelFG
FG output low-levelFG
In-phase input voltage rangeV
FG hysteresis widthH
Brake cirrcuit
Short brake model levelV
Reverse rotation brake mode levelV
Short brake start levelV
Short brake currentI
VCC = 5 V in power save mode00.1mA
CC1
VCC = 5 V, IO = 0 mA1816mA
CC2
Voltage with which a circuit operates2.7 V
at VCC = 5 V and L → H
Voltage with which a circuit becomes0.7V
STOP
off at VCC = 5 V and H → L
Voltage with which V
MED
becomes1.551.75V
PC1
low at VCC = 5 V and EC = 0 V
VCC = 5 V, IHB = 20 mA0.71.21.6V
HB
VCC = 5 V15µA
BH
VCC = 5 V1.54.0V
HBR
VCC = 5 V60mV[p-p]
INH
VCC = 5 V−1000100mV
OF
VCC = 5 V2575125mV
DZ
VCC = 5 V, EC = ECR = 1.65 V−5−1µA
IN
VCC = 5 V, RCS = 0.5 Ω0.751.01.25A/V
CS
VCC = 5 V, IO =−300 mA0.91.6V
OH
VCC = 5 V, IO = 300 mA0.20.6V
OL
VCC = 5 V, RCS = 0.5 Ω400500600mA
TL
VCC = 5 V, IFG =− 0.01 mA3.0V
H
VCC = 5 V, IFG = 0.01 mA0.5V
L
VCC = 5 V,1.53.0V
FGR
Input D-range at H2+, H2−
VCC = 5 V11020mV
FG
V
SBR
RBR
SBRLVCC
SBR
= 5 V1.0V
CC
V
= 5 V3 .5 V
CC
= 5 V, ECR = 1.65 V1.651.74V
V
= 5 V1235mA
CC
CC
V
3
Page 4
AN8480NSBICs for Compact Disc/CD-ROM Player
■ Electrical Characteristics at Ta = 25°C (continued)
• Design reference data
Note) The characteristics listed below are theoretical values based on the IC design and are not guaranteed.
ParameterSymbolConditionsMinTypMaxUnit
Thermal protection
Thermal protection operatingT
SDONVCC
temperature
Thermal protection hysteresis width ∆T
SD
Thermal protection flag
Level at thermal protection = onV
Level at thermal protection = offV
TSDONVCC
TSDOFFVCC
■ Usage Notes
Prevent this IC from being line-to-ground fault. (To be concrete, do not short-circuit any of A1 (pin 28), A2 (pin 27)
and A3 (pin 26) with VM pin (pin 21).)
■ Application Notes
• PD Ta curves of HSOP042-P-0400
2.500
2.240
= 5 V, ∆EC = 100 mV160°C
VCC = 5 V, ∆EC = 100 mV45°C
= 5 V0.5V= 5 V3.0 V
P
T
D
a
2.000
(W)
D
1.500
1.042
1.000
Power dissipation P
0.500
0.000
Independent IC
without a heat sink
= 119.9°C/W
R
th(j-a)
025
5012575100150
Ambient temperature Ta (°C)
Mounted on standard board
(glass epoxy: 75 × 75 × t1.6 mm
R
= 55.8°C/W
th(j-a)
3
)
4
Page 5
ICs for Compact Disc/CD-ROM PlayerAN8480NSB
■ Application Notes (continued)
• Phase conditions between Hall input and output current
Phase of Hall pin
H1+H3+H2+
A
HML
B
HML
C
MLH
D
LMH
E
LMH
F
MLH
H1
H3
H2
H2H1
H3
ECR
EC
0
A3A3A2A1A2A1
Emit
Output current
Sink
ABCDE
F
• Power consumption calculation method
You can find a rough value of electric power to be consumed in the IC in the following method and the use of EXCEL
(computer soft ware) will enable you to put it on a graph.
Calculating formula:
1. Let an induced voltage generated in each phase as below:
(Reference to a motor center point)
E
= EO × sin (X) · · · (1)EA2 = EO × sin (X+120) · · · (2)
A1
E
= EO × sin (X+240) · · · (3)X: Phase angle
A3
2. Let a current flowing in each phase as below:
IA1 = IO × sin (X) · · · (4)IA2 = IO × sin (X+120) · · · (5)
I
= IO × sin (X+240) · · · (6)
A3
3. The voltages generated by a wire-wound resistance of a motor are:
= IA1 × R · · · (7)VR2 = IA2 × R · · · (8)VR3 = IA3 × R · · · (9)
V
R1
4. In each phase, add the voltage generated by an induced voltage and that by a wire-wound resistance.
' = (1) + (4)VA2' = (2) + (5)VA3' = (3) + (6)
V
A1
5. As the lowest voltage in each phase angle must be 0 V, you can get the voltage to be generated in each phase by
means of subtracting the lowest voltage from the voltage of the remaining two phases.
V
= VA1' − MIN (VA1', VA2', VA3') · · · (10)
A1
V
= VA2' − MIN (VA1', VA2', VA3') · · · (11)
A2
V
= VA3' − MIN (VA1', VA2', VA3') · · · (12)
A3
6. Subtract the supply voltage from each phase's voltage found in item 5 and then multiply it by each phase's current,
so that you can get the power consumption.
3
P = Σ (12 − VAn ) × I
n=1
An
0
0
5
Page 6
AN8480NSBICs for Compact Disc/CD-ROM Player
■ Application Notes (continued)
• Theory of thermal resistance
A chip temperature or the fin temperature can be understood in the same way as Ohm's Law.
T
j
R
j-c
R
f
R
c-a
T
a
Make sure that T
P
= Ta + P × (R
T
j
does not exceed 150°C.
j
: Chip temperature
T
j
T
: Ambient temperature
a
P : Electric power generated by IC
R
: Thermal resistance between a chip and a package
j-c
R
: Thermal resistance between a package and a surface of a heat sink or free air
c-a
R
: Thermal resistance between a package and surface of a heat sink
f
+ R
// Rf)
j-c
c-a
If it exceeds 150°C, you can suppress the rise of a chip temperature by adding a heat sink which is equivalent to
R
in the above figure.
f
Tj = Ta + P × (R
j-c
+ R
c-a
// Rf)
A package surface and the fin are available for a temperature measurement. But the fin part is recommendable for
measurement because a package surface measurement does not always promise you a consistent measuring result.
■ Application Circuit Example
FG
Low: TSD on
TSDF
High: TSD off
VM = 12 V
VM
21
CS1
22
A1
28
27
A2
A3
26
PG
1
FG
12
RCS = 0.5 Ω
H1+
H1−
H2+
H2−
H3+
H3−
VH
Servo
EC
torque
command
ECR
High: Start
Medium: FG is on.
Low: Stop
SG
15
2
3
5
Hall
amp.
6
matrix
8
9
7
18
17
Detection
Hall
bias
EA
10
S/S
Start/stop
16
CC
V
Direction
detection
ER
Logic
EP = ER × EA
Absolute
value
Direction
changeover
20
PCI
0.1 µF
Upper side
distribution
Lower side
distribution
VTL
protection
Thermal
circuit
Amp.
Amp.
Brake
circuit
13
BRK
Low: Short brake
High: Reverce rotation brake
comparator
11
FG signal
= 5 V
V
CC
6
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