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Application Note 119B
April 2008
Powering Complex FPGA-Based Systems Using Highly
Integrated DC/DC µModule Regulator Systems
Part 2 of 2 Thermal Performance and Layout
Alan Chern and Afshin Odabaee
60W by Paralleling Four DC/DC μModule Regulators
In part one of this article, we discussed the circuit and
electrical performance of a compact and low profi le 48A,
1.5V DC/DC regulator solution for a four-FPGA design. The
new approach uses four DC/DC μModule
parallel (Figure 1) to increase output current while sharing the current equally among each device. This solution
relies on the accurate current sharing of these μModule
regulators to prevent hot-spots by dissipating the heat
evenly over a compact surface area. Each DC/DC μModule
regulator is a complete power supply with on-board inductor,
DC/DC controller, MOSFETs, compensation circuitry and
input/output bypass capacitors. It occupies only 15mm ×
15mm of board area and has a low profi le (height) of only
2.8mm. This low profi le allows air to fl ow smoothly over
the entire circuit. Moreover, this solution casts no thermal
shadow on its surrounding components, further assisting
in optimizing thermal performance of the entire system.
®
regulators in
Thermal Performance
Figure 2 is a thermal image of the board shown in Figure 1
with readings of the temperatures at specifi c locations.
Cursors 1 to 4 show an estimation of the surface temperature on each module. Cursors 5 to 7 indicate the
surface temperature of the PCB. Notice the difference in
temperature between the inner two regulators, cursors 1
and 2, and the outside, cursors 3 and 4. The LTM4601
μModule regulators placed on the outside have large planes
to the left and right promoting heat sinking to cool the
part down a few degrees. The inner two only have small
top and bottom planes to draw heat away, thus becoming
slightly warmer than the outside two.
Airfl ow also has a substantial effect on the thermal balance
of the system. Note the difference in temperature between
Figures 2 and 3. In Figure 3, a 200LFM airfl ow travels
evenly from the bottom to the top of the demo board,
causing a 20°C drop across the board compared to the
no airfl ow case in Figure 2.
L, LT, LTC, LTM, μModule, Linear Technology and the Linear logo are registered trademarks of
Linear Technology Corporation. All other trademarks are the property of their respective owners.
Figure 1. Four DC/DC μModule Regulator Systems Current Share to Regulate 1.5V at 48A With Only 2.8mm Profi le and 15mm × 15mm
of Board Area for Each Device. Each μModule Regulator Weighs Only 1.7g and Has an IC Form-Factor that Can Easily be Used With
Any Pick-and-Place Machine During Board Assembly
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Application Note 119B
The direction of airfl ow is also important. In Figure 4 the
system is placed inside a 50°C ambient chamber with
airfl ow traveling from right to left, pushing the heat from
one μModule regulator to the next, creating a stacking
effect. The μModule device on the right, the closest to
the airfl ow source, is the coolest. The leftmost μModule
regulator has a slightly higher temperature because of
spillover heat from the other μModule regulators.
Heat transfer to the PCB also changes with airfl ow. In
Figure 2, heat transfers evenly to both left and right sides
of the PCB. In Figure 4, most of the heat moves to the
left side. Figure 5 shows an extreme case of heat stacking
from one μModule device to the next. Each of the four
μModule regulators is fi tted with a BGA heat sink and the
entire board is operated in a chamber with an ambient
temperature of 75°C.
Figure 2. Thermograph of 48A, 1.5V Circuit of Figure 1 Shows
Balanced Current Sharing Among Each DC/DC μModule
Regulator and Low Temperature Rise Even Without Airfl ow
(VIN = 20V to 1.5V
Figure 4. Thermograph of Four Parallel LTM4601 with 400LFM
Right-to-Left Airfl ow in 50°C Ambient Chamber (12VIN to 1V
at 40A)
OUT
at 40A)
OUT
Figure 3. Thermograph of Four Parallel LTM4601 with 200LFM
Bottom-to-Top Airfl ow (20VIN to 1.5V
Figure 5. Thermograph of Four Parallel LTM4601 With
BGA Heatsinks and 400LFM Right-to-Left Airfl ow in a 75°C
Ambient Chamber (12VIN to 1V
OUT
at 40A)
OUT
at 40A)
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Simple Copy and Paste Layout
Application Note 119B
Layout of parallel μModule regulators is relatively simple,
in that there are few electrical design considerations.
Nevertheless, if the intent of a design is to minimize the
required PCB area, thermal considerations become paramount, so the important parameters are spacing, vias,
airfl ow and planes.
The LTM4601 μModule regulator has a unique LGA package footprint, which allows solid attachment to the PCB
while enhancing thermal heat sinking. The footprint itself
simplifi es layout of the power and ground planes, as shown
in Figure 6. Laying out four parallel μModule regulators is
just as easy, as shown in Figures 7 and 8.
If laid out properly, the LGA packaging and the power
planes alone can provide enough heat sinking to keep
the LTM4601 cool.
V
IN
•••••••••••
••••••••
••••••••
••••••••
•••••••••
••••••••••
••••••••••
••••••••••
SIGNAL
GND
GND
V
OUT
C
IN
C
OUTCOUT
C
IN
•••••
•••••
•••••
••••••
Figure 6. The LTM4601’s Pin Layout Provides Simple Power
Plane Placement and Easy Paralleling Capability (Copy and
Paste Approach)
Figure 7. Top Layer Planes for Figure 1 Circuit
Figure 8. Bottom Layer Planes for Figure 1 Circuit
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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Application Note 119B
Conclusion
Delivering 60W of power in a compact space without
effi cient means to remove the heat from the power supply exacerbates the already diffi cult task of system heat
management and cooling. The DC/DC μModule regulator
family is designed with careful attention to the layout of
its internal components, package type, and electrical operation, which ease thermal management of a very dense
power supply circuit. The LGA package and simple layout
allow 100% surface mountable and low profi le design
for maximum effi ciency in air fl ow. This new approach in
power supply design takes advantage of paralleling multiple
DC/DC μModule regulators and following a copy and paste
approach in layout design, to provide a 60W power supply
with minimum components while operating effi ciently in
a compact and low profi le space.
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Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com
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LT 1210 REV B • PRINTED IN USA
© LINEAR TECHNOLOGY CORPORATION 2008
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