
AM1011-500
RF & MICROWAVE TRANSISTORS
AVIONICS APPLICAT ION S
.P
OUT =
GAIN
500 W MIN. WITH 8.5 dB MIN.
.10:1 LOAD VSWR CAPABILITY @ 10µS.,
1% DUTY
.SIXPAC HERMETIC METAL/CERAMIC
PACKAGE
.EMITTER SITE BALLASTED OVERLAY
GEOMETRY
.REFRACTORY/GOLD METALLIZATION
.LOW THERMAL RESISTANCE
.INTERNAL INPUT/OUTPUT MATCHING
.CHARACTERIZED UNDER 32µS.,2%
DUTY CYCLE PULSE CONDITIONS
DESCRIP T IO N
The AM1011-500 device is a high power Class C
transistor specifically designed for L-Band Avionic applications involving high pulse burst duty
cycles.
This device is capable of operation over a wide
range of pulse widths, duty cycles, and temperatures. Low RF thermal resistance and computerized automatic wire bonding techniques ensure
high reliability and product consistency.
The AM1011-500 is supplied in the SIXPAC
Hermetic metal/ceramic package with internal input/output matching structures.
.400 x .600 2LFL (M198)
ORDER CODE
AM1011-500
PIN CONNECTI O N
1. Collector 3. Emitter
2. Base 4. Base
hermetically sealed
BRAN DI NG
1011-500
ABSOLUTE MAXIM UM RATINGS (T
Symbol Parameter Value Unit
P
DISS
I
C
V
CC
T
J
T
STG
THERMAL DATA
R
TH(j-c)
*Appliesonly torated RF amplifieroperation
Power Dissipation* (TC≤ 100°C)
Device Current* 27 A
Collector-Supply Voltage* 55 V
Junction Temperature (Pulsed RF Operation) 250
Storage Temperature
Junction-CaseThermal Resistance* 0.11
case
= 25°C)
1,360 W
− 65 to +200
°
°
°
C/W
C
C

AM1 011-500
ELECTRICAL SPECIFICATIONS (T
case
= 25°C)
STATIC
Symbol Test Conditions
BV
CBO
BV
EBO
BV
CES I
I
CES V
h
FE V
IC= 50 mA IE= 0mA
IE= 30 mA IC= 0mA
= 50 mA VBE= 0V
C
= 0V VCE= 50 V
BE
= 5V IC=1.0 A
CE
DYNAMIC
Symbol Test Conditions
P
OUT f = 1090 MHz P
hc
G
Load
Mismatch
Note: Pulse Width
f = 1090 MHz P
P f = 1090 MHz P
= 500 W Peak VSWR = 10:1, 10µS, 1% Duty
P
OUT
F=1090MHz VSWR=5:1, 32µS, 2% Duty
= 50 V
V
CC
32µSec, Duty Cycle
=
70 W V
IN =
OUT =
OUT =
2%
=
500 W V
500 W V
CC =
CC =
CC =
50 V
50 V
50 V
Value
Min. Typ . Max.
Uni t
70 — — V
3.0 — — V
70 — — V
— — 40 mA
10 — 200 —
Value
Min. Typ. Max.
Uni t
500——W
40 — — %
8.5 — — dB
No Degradation in Output
Power
TYPICAL PERFO R MANCE
POWER OUTPUT & COLLECTOR
EFFICIENCY vs POWER INPUT
P
OUT
POWER OUTPUT & COLLECTOR
EFFICIENCY vs POWER INPUT
P
OUT
η
C
η
C
* Pulse Burst conditions:
128 µSec train, 0.5 µSec on,
0.5 µSec off; with a period of 6.4 msec.

IMPEDANCE DATA
AM1 011-500
TEST CIRCUI T
FREQ.
Z
IN
1030 MHz 4.35 + j 6.97
1090 MHz 4.38 + j 2.75
1120 MHz 4.69 + j 2.95
P
= 70W
IN
V
= 50V
CC
(Ω)Z
CL
(Ω)
1.38 − j 4.08
.874 − j 3.55
1.3 − j 4.97

PACKAGE MECHANICAL DATA
Ref.: Dwg. No. 12-0198 rev. A
AM1 011-500
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility
for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life
support devices or systems without express written approval of SGS-THOMSON Microelectronics.
1995 SGS-THOMSON Microelectronics - All Rights Reserved
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