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PRODUCENT: AG Termopasty Grzegorz Gąsowski
Product data sheet
18-100 Łapy, ul. Harcerska 8, tel./fax (085) 715 79 80
No Clean Soldering Paste
easy printeasy printeasy print
/Sn96,5Ag3Cu0,5//Sn96,5Ag3Cu0,5/
Description:
<
Paste for soldering of surface-mounted (SMD) components
Advantages:
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Resistant to solderballing ( mid chip solderballing )
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Good adhesion to components for over 24hrs after application
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Exhibits long stencil life even for 8hrs of continuous printing, prolonged usability ( stencil life )
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Low level of colourless, non-corrosive soldering residues ( no clean ), that are flexible enough to allow
penetration of tester needles
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Fine pitch
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Printing with squeegee speed up to 150mm/s
Technical details
Properties Results Procedures
Chemical
type of solder Sn96,5Ag3Cu0,5
classification of flux REL - 0
paper chromatography test on Clfiz satisfy (REL - 0) IPC TM 650
J-STD - 004
Physical
density ≈ 4,6 g/cm
particle size 25-45 µm IPC-TM 650T
tackiness 1,0 G/mm2 24hafter
printability more than 8h
3
IPC-TM 650T
IPC J-STD - 005
Electrical
SIR-IPC
Symbols:
SIR - Surface Insulation Resistance
IPC - J STD 004/ 005, IPC - TM650 - American standards defining technical requirements for pastes and fluxes
> 2,6*109Ώ, after 7 days
IPC J-STD 004
(85˚C, in 85%)
easy print
is a set of fluxes and activators that should be considered as non-toxic.
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Application requirements
Storage Printing
store in temp. 3-7˚C
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for no longer than 6
months in tightly
closed containers.
<
the best (optimal)
temperature of paste
application: 23-26˚C
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max. temperature of
paste application:
28˚C
in order to avoid
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changes in rheology
of the paste do not
mix used with unused
paste.
<
in order to prevent
condensation of
moisture and to
achieve required
properties of the
paste warm the
container up to room
temperature for
several hours before
opening
<laser-cut stencils or
electro-formed
stencils:
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100µm for pitch =
0.4mm
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150µm for pitch
> 0.5 mm
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metal stencils are
recommended
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squeegee travel
speed in a printer:
25- 150 mm/sec
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squeegee pressure:
1.5- 3N at a cm of
length
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amount of paste on a
stencil: size of a roll
rolling ahead of
squeegee is 15-20mm
Reflow
<any soldering
methods are allowed
(air or nitrogen
atmospheres)
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preheating: ramp-up
temperature 12,0˚C/s to 145-160˚C
or max. 210- 220˚C
for versions without
plateau
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plateau phase (only
for packages with
high density
assemblies having
different mass)
145-160˚C
for 60- 90s
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soldering - reflow
phase: 30-90s above
180˚C
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cooling: gradient:
1-2˚C/s
Cleaning
<as a rule a no-clean
paste does not
require cleanin
<
however if cleaning
is necessary it is
recommended to use
alcohol PCB cleaner.
No Clean Soldering Paste
easy printeasy printeasy print
/Sn96,5Ag3Cu0,5//Sn96,5Ag3Cu0,5/
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Soldering procedure for profile No. 1
Zone
Setpoint °C
Actual °C
Blower Power
Setpoint %
Zone
Setpoint °C
Actual °C
Start Run
Heat
On
On
1T
150
150
80
VIP70A
1B
150
150
Edge Conveyor
Setpoint
2T
200
200
2B
200
200
cm
29.00
Soldering profile No. 1 used in research
3T
250
249
80
3B
250
247
Center Support
Setpoint
cm
14.00
4T
275
273
4B
275
273
Conveyor
Setpoint
5T
255
254
80
5B
255
254
cmpm
45.00
No Clean Soldering Paste
easy printeasy printeasy print
/Sn96,5Ag3Cu0,5//Sn96,5Ag3Cu0,5/
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