RoHS-compliant, 16-lead, QSOP package
Low power operation: 5 V
1.2 mA per channel maximum @ 0 Mbps to 2 Mbps
2.8 mA per channel maximum @ 10 Mbps
High temperature operation: 105°C
Up to 10 Mbps data rate (NRZ)
Low default output state
1000 V rms isolation rating
The ADuM75101 is a unidirectional 5-channel isolator based on
the Analog Devices, Inc., iCoupler® technology. In contrast to
the ADuM1510, the ADuM7510 has a lower isolation rating,
offering a reduced cost option for applications that can accept
a 1 kV ac isolation. Combining high speed CMOS and monolithic
air core transformer technology, these isolation components
provide outstanding performance characteristics superior to
alternatives such as optocoupler devices.
By avoiding the use of LEDs and photodiodes, iCoupler devices
eliminate the design difficulties commonly associated with optocouplers. The typical optocoupler concerns regarding uncertain
current transfer ratios, nonlinear transfer functions, and temperature
and lifetime effects are eliminated with the simple iCoupler digital
Unidirectional Digital Isolator
ADuM7510
FUNCTIONAL BLOCK DIAGRAM
1
V
DD1
ADuM7510
2
GND
1
3
V
V
V
V
V
GND
ENCODEDECODE
IA
4
ENCODEDECODE
IB
5
ENCODEDECODE
IC
6
ENCODEDECODE
ID
7
ENCODEDECODE
IE
8
1
Figure 1.
interfaces and stable performance characteristics. The need for
external drivers and other discrete components is eliminated with
these iCoupler products. Furthermore, iCoupler devices run at
one-tenth to one-sixth the power consumption of optocouplers
at comparable signal data rates.
The ADuM7510 isolator provides five independent isolation
channels supporting data rates up to 10 Mbps. Each side operates
with the supply voltage of 4.5 V to 5.5 V. Unlike other optocoupler
alternatives, the ADuM7510 isolator has a patented refresh
feature that ensures dc correctness in the absence of input logic
transitions and during power-up/power-down conditions.
16
V
DD2
15
GND
2
14
V
OA
13
V
OB
12
V
OC
11
V
OD
10
V
OE
9
GND
2
07632-001
1
Protected by U.S. Patents 5,952,849; 6,873,065; and 7,075,329.
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
All voltages are relative to their respective ground. 4.5 V ≤ V
over the entire recommended operation range, unless otherwise noted; all typical specifications are at T
Table 1.
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
DC SPECIFICATIONS
≤ 5.5 V, 4.5 V ≤ V
DD1
≤ 5.5 V; all minimum/maximum specifications apply
DD2
= 25°C, V
A
DD1
= V
DD2
= 5 V.
Output Quiescent Supply Current per Channel I
0.3 0.5 mA
Total Supply Current, Five Channels1
V
Supply Current, Quiescent I
V
Supply Current, Quiescent I
V
Supply Current, 10 Mbps Data Rate I
V
Supply Current, 10 Mbps Data Rate I
Input Currents IIA, IIB, IIC, IID, I
Logic High Input Threshold
Logic Low Input Threshold
Logic High Output Voltages V
Logic Low Output Voltages V
2.0 3.5 mA VIA = VIB = VIC = VID = VIE = 0 V
1.5 2.5 mA VIA = VIB = VIC = VID = VIE = 0 V
7.7 10 mA 5 MHz logic signal frequency
3.3 4.0 mA 5 MHz logic signal frequency
−10 +1 +10 µA VIA, VIB, VIC, VID, VIE ≥ 0 V
V
V
, V
OAH
OBH
V
, V
OCH
ODH
V
, V
OAL
OBL
V
, V
2.0 V
0.8 V
,
V
− 0.4 4.8 V IOx = −4 mA, VIx = VIH
DD2
,
,
0.2 0.4 V IOx = +4 mA, VIx = VIL
, V
Minimum Pulse Width2 PW 100 ns CL = 15 pF, CMOS signal levels
Maximum Data Rate3 10 Mbps CL = 15 pF, CMOS signal levels
Propagation Delay4 t
Pulse-Width Distortion, |t
− t
4
|
, t
20 27 40 ns CL = 15 pF, CMOS signal levels
PWD 5 ns CL = 15 pF, CMOS signal levels
Change vs. Temperature 5 ps/°C CL = 15 pF, CMOS signal levels
Propagation Delay Skew5 t
Channel-to-Channel Matching6 t
30 ns CL = 15 pF, CMOS signal levels
5 ns CL = 15 pF, CMOS signal levels
Output Rise/Fall Time (10% to 90%) tR/tF 2.5 ns CL = 15 pF, CMOS signal levels
Common-Mode Transient Immunity at
|CMH| 10 15 kV/µs VIx = V
DD1/VDD2
, VCM = 1000 V,
Common-Mode Transient Immunity at
Logic Low Output
7
Refresh Rate fr 1.2 Mbps
Input Dynamic Supply Current per Channel8 I
Output Dynamic Supply Current per Channel8 I
1
Supply current values are for all five channels combined, running at identical data rates. Output supply current values are specified with no output load present. The
supply current associated with an individual channel, operating at a given data rate, can be calculated as described in the Power Consumption section. See Figure 4
through Figure 6 for information on the per-channel supply current as a function of the data rate for unloaded and loaded conditions. See Figure 7 and Figure 8 for
total I
and I
DD1
2
The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed. Operation below the minimum pulse width is not
recommended.
3
The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed.
4
t
propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. t
PHL
measured from the 50% level of the rising edge of the V
5
t
is the magnitude of the worst-case difference in t
PSK
load within the recommended operating conditions.
6
Channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels within the same component.
7
CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 V × V
rate that can be sustained while maintaining V
transient magnitude is the range over which the common mode is slewed.
8
Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in the signal data rate. See Figure 4 through Figure 6 for infor-
mation on the per-channel supply current as a function of the data rate for unloaded and loaded conditions. See the Power Consumption section for guidance on
calculating the per-channel supply current for a given data rate.
supply currents as a function of the data rate for the ADuM7510.
DD2
|CML| 10 15 kV/µs VIx = 0 V, VCM = 1000 V,
transient magnitude = 800 V
0.14 mA/Mbps
0.045 mA/Mbps
propagation delay is
signal to the 50% level of the rising edge of the VOx signal.
Ix
and/or t
PHL
< 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The
O
that is measured between units at the same operating temperature, supply voltages, and output
PLH
. CML is the maximum common-mode voltage slew
DD2
Rev. B | Page 3 of 12
PLH
ADuM7510 Data Sheet
Resistance (Input-to-Output)1
R
I-O
1012 Ω
2
I-O
Rated Dielectric Insulation Voltage
1000
V rms
1 minute duration
DD1
DD2
PACKAGE CHARACTERISTICS
Table 2.
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
Capacitance (Input-to-Output)
C
2.2 pF f = 1 MHz
Input Capacitance2 CI 4.0 pF
IC Junction-to-Ambient Thermal Resistance, QSOP θJA 76 °C/W Thermocouple located at center of
package underside
1
The device is considered a 2-terminal device. Pin 1 through Pin 8 are shorted together, and Pin 9 through Pin 16 are shorted together.
2
Input capacitance is from any input data pin to ground.
INSULATION AND SAFETY-RELATED SPECIFICATIONS
Table 3.
Parameter Symbol Value Unit Test Conditions/Comments
Minimum External Air Gap QSOP Package (Clearance) L(I01) 3.8 min mm Measured from input terminals to output terminals,
shortest distance through air
Minimum External Tracking QSOP Package (Creepage) L(I02) 3.8 min mm Measured from input terminals to output terminals,
shortest distance path along body
Tracking Resistance (Comparative Tracking Index) CTI >400 V DIN IEC 112/VDE 0303 Part 1
Isolation Group II Material Group (DIN VDE 0110, 1/89, Table 1)
Maximum Working Voltage Compatible with 50 Years
V
354 V peak Continuous peak voltage across the isolation barrier
IORM
Service Life
RECOMMENDED OPERATING CONDITIONS
All voltages are relative to their respective ground. See the DC Correctness and Magnetic Field Immunity section for information on
immunity to external magnetic fields.
Table 4.
Parameter Symbol Min Max Unit
Operating Temperature TA −40 +105 °C
Supply Voltages V
, V
4.5 5.5 V
Input Signal Rise and Fall Times 1.0 ms
REGULATORY INFORMATION
The ADuM7510 is approved by the organization listed in Table 5.
Table 5.
UL (Pending)
Recognized under UL 1577 component recognition program1
Single/basic insulation, 1000 V rms isolation voltage
File E214100
1
In accordance with UL 1577, each ADuM7510 is proof tested by applying an insulation test voltage of 1200 V rms for 1 sec (current leakage detection limit = 5 µA).
Rev. B | Page 4 of 12
Data Sheet ADuM7510
DD1
DD2
IA
OA
ABSOLUTE MAXIMUM RATINGS
Ambient temperature TA = 25°C, unless otherwise noted.
Table 6.
Parameter Rating
Storage Temperature (TST) Range −65°C to +150°C
Ambient Operating Temperature (TA)
−40°C to +105°C
Range
Supply Voltages1 (V
Input Voltages1
(V
, VIB, VIC, VID, VIE)
Output Voltages1
, VOB, VOC, VOD, VOE)
(V
, V
) −0.5 V to +7.0 V
−0.5 V to V
−0.5 V to V
+ 0.5 V
DDI
+ 0.5 V
DDO
Average Output Current per Pin2
Side 1 (IO1) −10 mA to +10 mA
Side 2 (IO2) −10 mA to +10 mA
Common-Mode Transients3 −100 kV/μs to +100 kV/μs
1
All voltages are relative to their respective ground.
2
See Figure 3 for maximum rated current values for various temperatures.
3
Refers to common-mode transients across the insulation barrier. Common-
mode transients exceeding the absolute maximum ratings may cause latchup or permanent damage.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. B | Page 5 of 12
ADuM7510 Data Sheet
V
DD1
1
GND
1
*
2
V
IA
3
V
IB
4
V
DD2
16
GND
2
*
15
V
OA
14
V
OB
13
V
IC
5
V
OC
12
V
ID
6
V
OD
11
V
IE
7
V
OE
10
GND
1
*
8
GND
2
*
9
ADuM7510
TOP VIEW
(Not to S cale)
*PIN 2 AND PIN 8 ARE INTERNALLY CO NNE CTED. CONNECTING BOTH
TO GND
1
IS RECOMM E NDE D. PIN 9 AND PIN 15 ARE INTERNALL Y
CONNECTED. CONNECTING BOTH TO GND
2
IS RECOMMENDED.
07632-002
DD1
to GND1 is recommended.
3
V
IA
Logic Input A.
ID
IE
1
2
OE
OD
2
16
V
DD2
Supply Voltage for Isolator Side 2 (4.5 V to 5.5 V).
DD2
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 2. Pin Configuration
Table 7. Pin Function Descriptions
Pin No. Mnemonic Description
1 V
2 GND
1
Supply Voltage for Isolator Side 1 (4.5 V to 5.5 V).
Ground 1. Ground reference for Isolator Side 1. Pin 2 and Pin 8 are internally connected, and connecting both
4 VIB Logic Input B.
5 VIC Logic Input C.
6 V
7 V
Logic Input D.
Logic Input E.
8 GND1 Ground 1. Ground reference for Isolator Side 1. Pin 2 and Pin 8 are internally connected, and connecting both
to GND
is recommended.
9 GND2 Ground 2. Ground reference for Isolator Side 2. Pin 9 and Pin 15 are internally connected, and connecting both
10 V
11 V
to GND
Logic Output E.
Logic Output D.
is recommended.
12 VOC Logic Output C.
13 VOB Logic Output B.
14 VOA Logic Output A.
15 GND2 Ground 2. Ground reference for Isolator Side 2. Pin 9 and Pin 15 are internally connected, and connecting both
to GND
is recommended.
Table 8. Truth Table (Positive Logic)
1, 2
V
DD1
State
V
DD2
State
VOx
Output
V
Ix
Input
High Powered Powered High Normal operation, data is high.
Low Powered Powered Low Normal operation, data is low.
X Unpowered Powered Low Input unpowered. Outputs return to input state within 1 µs of V
X Powered Unpowered High-Z Output unpowered. Output pins are in high impedance state. Outputs return to input
1
VIX and VOX refer to the input and output signals of a given channel (A, B, C, D, or E).
2
X = don’t care.
1
Description
See the Power-Up/Power-Down Considerations section for more details.
state within 1 µs of V
Rev. B | Page 6 of 12
power restoration.
power restoration.
DD1
Data Sheet ADuM7510
07632-003
0
50
100
150
200
250
300
350
0255075100125150175
MAXIMUM CURRENT (mA)
AMBIENT TEMPERATURE (°C)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0246810
DATA RATE (Mbps)
I
DD1
CURRENT/CHANNEL ( mA)
07632-004
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0246810
DATA RATE (Mbps)
I
DD2
CURRENT/CHANNEL ( mA)
07632-005
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0246810
DATA RATE (Mbps)
I
DD2
CURRENT/CHANNEL 15pF LOAD (mA)
07632-006
8
7
6
5
4
3
2
1
0
0246810
DATA RATE (Mbps)
I
DD1
CURRENT (mA)
07632-007
8
7
6
5
4
3
2
1
0
0246810
DATA RATE (Mbps)
I
DD2
CURRENT 15pF LOAD (mA)
07632-008
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 3. Thermal Derating Curve, Dependence of Safety-Limiting Values
with Case Temperature per DIN V VDE V 0884-10
Figure 4. Typical I
Supply Current per Channel vs. Data Rate
DD1
Figure 6. Typical I
Figure 7. Typical Total I
Supply Current per Channel vs. Data Rate
DD2
(15 pF Output Load)
Supply Current vs. Data Rate
DD1
Figure 5. Typical I
Supply Current per Channel vs. Data Rate
DD2
(No Output Load)
Figure 8. Typical Total I
Supply Current vs. Data Rate
DD2
(15 pF Output Load)
Rev. B | Page 7 of 12
ADuM7510 Data Sheet
V
APPLICATIONS INFORMATION
PRINTED CIRCUIT BOARD (PCB) LAYOUT
The ADuM7510 digital isolator requires no external interface
circuitry for the logic interfaces. Power supply bypassing is strongly
recommended at the input and output supply pins (see Figure 9).
Bypass capacitors are most conveniently connected between Pin 1
and Pin 2 for V
and between Pin 15 and Pin 16 for V
DD1
DD2
. The
capacitor value should be between 0.01 μF and 0.1 μF. The total
lead length between both ends of the capacitor and the input
power supply pin should not exceed 10 mm. Bypassing between
Pin 1 and Pin 8 and between Pin 9 and Pin 16 should also be
considered unless the ground pair on each package side is
connected close to the package.
V
GND
GND
DD1
1
V
IA
V
IB
V
IC
V
ID
V
IE
1
ADuM7510
Figure 9. Recommended PCB Layout
V
DD2
GND
V
OA
V
OB
V
OC
V
OD
V
OE
GND
2
2
7632-009
See the AN-1109 Application Note for board layout guidelines.
PROPAGATION DELAY-RELATED PARAMETERS
Propagation delay is a parameter that describes the length of
time it takes for a logic signal to propagate through a component.
The propagation delay to a logic low output can differ from the
propagation delay to a logic high output.
INPUT (
OUTPUT (V
)
Ix
t
PLH
)
Ox
t
PHL
50%
50%
Figure 10. Propagation Delay Parameters
Pulse width distortion is the maximum difference between
these two propagation delay values and is an indication of how
accurately the input signal timing is preserved.
Channel-to-channel matching refers to the maximum amount
the propagation delay differs between channels within a single
ADuM7510 component.
Propagation delay skew refers to the maximum amount the
propagation delay differs among multiple ADuM7510 components operated under the same conditions.
DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY
Positive and negative logic transitions at the isolator input
cause narrow (~1 ns) pulses to be sent via the transformer to
the decoder. The decoder is bistable and is, therefore, either set
or reset by the pulses indicating input logic transitions. In the
absence of logic transitions at the input for more than ~1 μs,
a periodic set of refresh pulses indicative of the correct input
state are sent to ensure dc correctness at the output.
07632-010
If the decoder receives no pulses for more than about 5 μs, the
input side is assumed to be unpowered or nonfunctional, in which
case, the isolator output is forced to a default low state by the
watchdog timer circuit (see Table 8).
The limitation on the magnetic field immunity of the device is
set by the condition in which induced voltage in the transformer
receiving coil is sufficiently large to either falsely set or reset the
decoder. The following analysis defines such conditions. The
ADuM7510 is examined in a 4.5 V operating condition because it
represents the most susceptible mode of operation of this product.
The pulses at the transformer output have an amplitude greater
than 1.5 V. The decoder has a sensing threshold of about 1.0 V,
thereby establishing a 0.5 V margin in which induced voltages
can be tolerated. The voltage induced across the receiving coil is
given by
V = (−dβ/dt)∑∏r
2
; n = 1, 2, …, N
n
where:
β is the magnetic flux density.
r
is the radius of the nth turn in the receiving coil.
n
N is the number of turns in the receiving coil.
Given the geometry of the receiving coil in the ADuM7510 and
an imposed requirement that the induced voltage be, at most,
50% of the 0.5 V margin at the decoder, a maximum allowable
magnetic field is calculated, as shown in Figure 11.
1000
100
10
1
(kgauss)
0.1
0.01
MAXIMUM ALL OWABLE MAG NE TIC FLUX
0.001
1k10k100k1M10M100M
MAGNETIC FIELD FREQUENCY (Hz)
07632-011
Figure 11. Maximum Allowable External Magnetic Flux Density
For example, at a magnetic field frequency of 1 MHz, the
maximum allowable magnetic field of 0.5 kgauss induces
a voltage of 0.25 V at the receiving coil. This is about 50% of the
sensing threshold and does not cause a faulty output transition.
If such an event occurs with the worst-case polarity during a
transmitted pulse, it reduces the received pulse from >1.0 V to
0.75 V, still well above the 0.5 V sensing threshold of the
decoder.
Rev. B | Page 8 of 12
Data Sheet ADuM7510
The preceding magnetic flux density values correspond to specific
current magnitudes at given distances away from the ADuM7510
transformers. Figure 12 expresses these allowable current magnitudes as a function of frequency for selected distances. The
ADuM7510 is very insensitive to external fields. Only extremely
large, high frequency currents, very close to the component can
potentially be a concern. For the 1 MHz example noted, a 1.2 kA
current must be placed 5 mm away from the ADuM7510 to affect
component operation.
1000
100
10
1
DISTANCE = 5mm
0.1
MAXIMUM ALLOWABLE CURRENT (kA)
0.01
1k10k100k1M10M100M
DISTANCE = 100mm
DISTANCE = 1m
MAGNETIC FIELD FREQUENCY (Hz)
Figure 12. Maximum Allowable Current for
Various Current to ADuM7510 Spacings
07632-012
Note that at combinations of strong magnetic field and high
frequency, any loops formed by PCB traces can induce
sufficiently large error voltages to trigger the thresholds of
succeeding circuitry. Take care to avoid PCB structures that
form loops.
POWER CONSUMPTION
The supply current at a given channel of the ADuM7510
isolator is a function of the supply voltage, the channel
data rate, and the channel output load.
For each input channel, the supply current is given by
I
= I
DDI
DDI (Q)
I
DDI
= I
× (2f − fr) + I
DDI (D)
DDI (Q)
f ≤ 0.5fr
f > 0.5fr
For each output channel, the supply current is given by
I
I
DDO
DDO
= I
= (I
f ≤ 0.5fr
DDO (Q)
+ (0.5 × 10−3) × CL × V
DDO (D)
) × (2f − fr) + I
DDO
DDO (Q)
f ≤ 0.5fr
where:
I
, I
DDI (D)
are the input and output dynamic supply currents
DDO (D)
per channel (mA/Mbps).
C
is the output load capacitance (pF).
L
is the output supply voltage (V).
V
DDO
f is the input logic signal frequency (MHz, half of the input data
rate, NRZ signaling).
f
is the input stage refresh rate (Mbps).
r
I
, I
DDI (Q)
are the specified input and output quiescent
DDO (Q)
supply currents (mA).
To calculate the total I
DD1
and I
supply current, the supply
DD2
currents for each input and output channel corresponding to
I
DD1
and I
are calculated and totaled. Figure 4 and Figure 5
DD2
provide per-channel supply currents as a function of the data
rate for an unloaded output condition. Figure 6 provides perchannel supply current as a function of the data rate for a 15 pF
output condition. Figure 7 and Figure 8 provide total I
I
supply current as a function of the data rate for ADuM7510
DD2
DD1
and
products.
POWER-UP/POWER-DOWN CONSIDERATIONS
The ADuM7510 behaves as specified in Table 8 during powerup and power-down operations. However, the part can transfer
incorrect data when the power supplies are below the minimum
operating voltage but the internal circuits are not completely off.
Power-up/power-down errors can occur at V
the operating threshold of 1.9 V. The encoder generates data
pulses at low amplitude. The detector can miss data pulses that
are near the detection threshold. If the transferring state is a
logic high, the encoder generates a pair of pulses; the decoder
can reject one of the pulses for low amplitude. A single pulse is
interpreted as a logic low, and the output can be placed in the
wrong logic state for that refresh cycle.
Glitch-free operation is possible by following these
recommendations.
voltage near
DDx
Slew the power on or off as quickly as possible.
Use the default low operating mode by holding the inputs
low until power is stable.
Rev. B | Page 9 of 12
ADuM7510 Data Sheet
COMPLIANT TO JEDEC STANDARDS MO-137-AB
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLYAND ARE NOT APPROPRIATE FOR USE IN DESIGN.
16
9
8
1
SEATING
PLANE
0.010(0.25)
0.004(0.10)
0.012 (0.30)
0.008 (0.20)
0.025(0.64)
BSC
0.041(1.04)
REF
0.010 (0.25)
0.006 (0.15)
0.050 (1.27)
0.016 (0.41)
0.020 (0.51)
0.010 (0.25)
8°
0°
COPLANARITY
0.004 (0.10)
0.065(1.65)
0.049(1.25)
0.069(1.75)
0.053(1.35)
0.197 (5.00)
0.193 (4.90)
0.189 (4.80)
0.158 (4.01)
0.154 (3.91)
0.150 (3.81)
0.244 (6.20)
0.236 (5.99)
0.228 (5.79)
01-28-2008-A
DD1
DD2
OUTLINE DIMENSIONS
Figure 13. 16-Lead Shrink Small Outline Package [QSOP]