Datasheet ADUM3200 Datasheet (ANALOG DEVICES)

Dual-Channel, Digital Isolators,

G

Enhanced System-Level ESD Reliability

Data Sheet

FEATURES

Enhanced system-level ESD performance per IEC 61000-4-x High temperature operation: 125°C Narrow body, RoHS-compliant, 8-lead SOIC Low power operation

5 V operation

1.7 mA per channel maximum @ 0 Mbps to 2 Mbps

3.7 mA per channel maximum @ 10 Mbps

7.0 mA per channel maximum @ 25 Mbps

3 V operation

1.5 mA per channel maximum @ 0 Mbps to 2 Mbps

2.5 mA per channel maximum @ 10 Mbps

4.7 mA per channel maximum @ 25 Mbps Bidirectional communication 3 V/5 V level translation High data rate: dc to 25 Mbps (NRZ) Precise timing characteristics

3 ns maximum pulse width distortion

3 ns maximum channel-to-channel matching High common-mode transient immunity: >25 kV/μs

Safety and regulatory approvals

UL recognition: 2500 V rms for 1 minute per UL 1577

CSA Component Acceptance Notice #5A

VDE Certificate of Conformity

DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12 V

= 560 V peak

IORM

Qualified for automotive applications

APPLICATIONS

Size-critical multichannel isolation SPI interface/data converter isolation RS-232/RS-422/RS-485 transceiver isolation Digital field bus isolation Hybrid electric vehicles, battery monitor

ADuM3200/ADuM3201

GENERAL DESCRIPTION

The ADuM3200/ADuM32011 are dual-channel, digital isolators based on the Analog Devices, Inc., iCoupler® technology. Combining high speed CMOS and monolithic transformer technology, these isolation components provide outstanding performance characteristics superior to alternatives such as optocoupler devices.

By avoiding the use of LEDs and photodiodes, iCoupler devices remove the design difficulties commonly associated with optocouplers. The typical optocoupler concerns regarding uncertain current transfer ratios, nonlinear transfer functions, and temperature and lifetime effects are eliminated with the simple iCoupler digital interfaces and stable performance char- acteristics. The need for external drivers and other discrete components is eliminated with these iCoupler products. Furthermore, iCoupler devices consume one-tenth to one-sixth the power of optocouplers at comparable signal data rates.

The ADuM3200/ADuM3201 isolators provide two independent isolation channels in a variety of channel configurations and data rates (see the Ordering Guide). They operate with 3.3 V or 5 V supply voltages on either side, providing compatibility with lower voltage systems as well as enabling voltage translation functionality across the isolation barrier. The ADuM3200W and ADuM3201W are automotive grade versions qualified for 125°C operation.

In comparison to the ADuM120x isolators, the ADuM3200/

ADuM3201 isolators contain various circuit and layout changes

to provide increased capability relative to system-level IEC 61000-4-x testing (ESD, burst, and surge). The precise capability in these tests for either the ADuM120x or ADuM3200/

ADuM3201 products is strongly determined by the design and

layout of the user’s board or module. For more information, see the AN-793 Application Note, ESD/Latch-Up Considerations with

iCoupler Isolation Products.

1

Protected by U.S. Patents 5,952,849; 6,873,065; 7,075,329.

FUNCTIONAL BLOCK DIAGRAMS

1

V

DD1

ENCODE DECODE

2

V

IA

3

ENCODE DECODE

4

ND

V

IB

1

Figure 1. ADuM3200 Functional Block Diagram

Rev. C

Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.

8

V

DD2

7

V

OA

6

V

OB

5

GND

2

5927-001

1

V

DD1

DECODE ENCODE

2

V

OA

3

ENCODE DECODE

4

ND

V

IB

1

8

V

DD2

7

V

IA

6

V

OB

5

GND

2

5927-002

Figure 2. ADuM3201 Functional Block Diagram

ADuM3200/ADuM3201 Data Sheet

REVISION HISTORY

2/12—Rev. B to Rev. C

Created Hyperlink for Safety and Regulatory Approvals

Entry in Features Section ................................................................. 1

Change to PC Board Layout Section ............................................ 16

11/11—Rev. A to Rev. B

Changes to Features Section, Applications Section, and

General Descriptions Section ......................................................... 1

Changes to Specifications Section .................................................. 3

Changes to Table 2 9 ........................................................................ 12

Changes to Ambient Operating Temperature Maximum

Value, Table 30 ................................................................................ 13

Changes to V

Changes to Figure 9, Figure 10, Figure 11 Captions ................. 15

Changes to Ordering Guide ......................................................... 20

Added Automotive Products Section........................................... 20

Pin Descriptions ............................................... 14

DD1

DIN V VDE V 0884-10 (VDE V 0884-10) Insulation

Characteristics ............................................................................ 12

Recommended Operating Conditions .................................... 12

Absolute Maximum Ratings ......................................................... 13

ESD Caution................................................................................ 13

Pin Configurations and Function Descriptions ......................... 14

Typical Performance Characteristics ........................................... 15

Application Information ................................................................ 16

PC Board Layout ........................................................................ 16

System-Level ESD Considerations and Enhancements ........ 16

Propagation Delay-Related Parameters ................................... 16

DC Correctness and Magnetic Field Immunity........................... 16

Power Consumption .................................................................. 18

Insulation Lifetime ..................................................................... 18

Outline Dimensions ....................................................................... 19

Ordering Guide .......................................................................... 20

Automotive Products ................................................................. 20

6/07—Rev. 0 to Rev. A

Updated VDE Certification Throughout ....................................... 1

Changes to Features, General Description, and Note 1 ............... 1

Changes to Regulatory Information Section .............................. 10

Changes to DIN V VDE V 0884-10 (VDE V 0884-10)

Insulation Characteristics Section ................................................ 11

Added Table 10 ............................................................................... 12

Added Insulation Lifetime Section .............................................. 17

7/06—Revision 0: Initial Version

Rev. C | Page 2 of 20

Data Sheet ADuM3200/ADuM3201

A Grade

B Grade

C Grade

PHL

PLH

PHL

PSK

PSKCD

PSKOD

DD1

DD2

DD1

DDx

IxH

DDx

IxH

IxL

Input Current per Channel

II

−10

+0.01

+10

µA

0 V ≤ VIx ≤ V

DDX

Supply Current per Channel

DDI(Q)

DDO(Q)

DDI(D)

DDO(D)

Refresh Rate

fr 1.2 Mbps

SPECIFICATIONS

ELECTRICAL CHARACTERISTICS—5 V, 105°C OPERATION

All typical specifications are at TA = 25°C, V operation range: 4.5 V ≤ V are tested with C

= 15 pF and CMOS signal levels, unless otherwise noted.

L

≤ 5.5 V, 4.5 V ≤ V

DD1

Table 1.

Parameter Symbol Min Typ Max Min Typ Max Min Typ Max Unit Test Conditions

SWITCHING SPECIFICATIONS

Data Rate 1 10 25 Mbps Within PWD limit

Propagation Delay t

, t

20 150 20 50 20 45 ns 50% input to 50% output

Pulse Width Distortion PWD 40 3 3 ns |t

Change vs. Temperature 6 5 5 ps/°C Pulse Width PW 1000 100 40 ns Within PWD limit Propagation Delay Skew t

100 15 15 ns Between any two units

Channel Matching

Codirectional t

Opposing-Direction t Output Rise/Fall Time tR/tF 10 2.5 2.5 ns 10% to 90%

50 3 3 ns 50 15 15 ns

= V

DD1

= 5 V. Minimum/maximum specifications apply over the entire recommended

DD2

≤ 5.5 V, and −40°C ≤ TA ≤ +105°C, unless otherwise noted. Switching specifications

DD2

− t

|

Table 2.

1 Mbps—A Grade,

B Grade, and C Grade

Parameter Symbol

10 Mbps—B Grade and

C Grade

25 Mbps—C Grade

Unit Test Conditions Min Typ Max Min Typ Max Min Ty p Max

SUPPLY CURRENT

ADuM3200 I

I

ADuM3201 I

I

1.3 1.7 3.5 4.6 7.7 10.0 mA No load

1.0 1.6 1.7 2.8 3.1 3.9 mA No load

1.1 1.5 2.6 3.4 5.3 6.8 mA No load

1.3 1.8 3.1 4.0 6.4 8.3 mA No load

DD2

Table 3. For All Models

Parameter Symbol Min Typ Max Unit Test Conditions

DC SPECIFICATIONS

Logic High Input Threshold VIH 0.7 V Logic Low Input Threshold VIL 0.3 V Logic High Output Voltages VOH V V

V

− 0.1 5.0 V IOx = −20 µA, VIx = V

− 0.5 4.8 V IOx = −4 mA, VIx = V

Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 µA, VIx = V

0.2 0.4 V IOx = 4 mA, VIx = V

Quiescent Input Supply Current I

Quiescent Output Supply Current I

Dynamic Input Supply Current I

Dynamic Output Supply Current I

0.4 0.8 mA VIA = VIB = 0 V

0.5 0.6 mA VIA = VIB = 0 V

0.19 mA/Mbps

0.05 mA/Mbps

AC SPECIFICATIONS

Common-Mode Transient Immunity1 |CM| 25 35 kV/µs VIx = V

, VCM = 1000 V,

DDX

transient magnitude = 800 V

1

|CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both

rising and falling common-mode voltage edges.

Rev. C | Page 3 of 20

ADuM3200/ADuM3201 Data Sheet

PHL

PLH

PHL

PLH

PHL

PSK

PSKCD

PSKOD

DD1

DD2

DD1

DC SPECIFICATIONS

DDx

IxH

DDx

IxH

Logic Low Output Voltages

VOL 0.0

0.1 V IOx = 20 µA, VIx = V

IxL

DDX

DDI(Q)

DDO(Q)

DDI(D)

DDO(D)

Common-Mode Transient Immunity1

|CM|

25

35 kV/µs

VIx = V

, VCM = 1000 V,

ELECTRICAL CHARACTERISTICS—3 V, 105°C OPERATION

All typical specifications are at TA = 25°C, V operation range: 2.7 V ≤ V are tested with C

= 15 pF and CMOS signal levels, unless otherwise noted.

L

≤ 3.6 V, 2.7 V ≤ V

DD1

Table 4.

A Grade B Grade C Grade Parameter Symbol Min Typ Max Min Typ Max Min Typ Max Unit Test Conditions

SWITCHING SPECIFICATIONS

Data Rate 1 10 25 Mbps Within PWD limit Propagation Delay t

, t

20 150 20 60 20 55 ns 50% input to 50% output

Pulse Width Distortion PWD

ADuM3200 40 3 3 ns |t ADuM3201 40 4 4 ns |t

Change vs. Temperature 6 5 5 ps/°C Pulse Width PW 1000 100 40 ns Within PWD limit Propagation Delay Skew t

100 22 16 ns Between any two units

Channel Matching

Codirectional t

Opposing-Direction t Output Rise/Fall Time tR/tF 3.0 3.0 3.0 ns 10% to 90%

50 3 3 ns 50 22 16 ns

= V

DD1

= 3.0 V. Minimum/maximum specifications apply over the entire recommended

DD2

≤ 3.6 V, and −40°C ≤ TA ≤ +105°C, unless otherwise noted. Switching specifications

DD2

− t

| |

Table 5.

1 Mbps—A Grade,

B Grade, and C Grade

Parameter Symbol

10 Mbps—B Grade and

C Grade 25 Mbps—C Grade

Unit Test Conditions Min Typ Max Min Typ Max Min Ty p Max

SUPPLY CURRENT

ADuM3200 I

I

ADuM3201 I

I

0.8 1.3 2.0 3.2 4.3 6.4 mA No load

0.7 1.0 1.1 1.7 1.8 2.4 mA No load

0.7 1.3 1.5 2.1 3.0 4.2 mA No load

0.8 1.6 1.9 2.4 3.6 5.1 mA No load

DD2

Table 6. For All Models

Parameter Symbol Min Typ Max Unit Test Conditions

Logic High Input Threshold VIH 0.7 V Logic Low Input Threshold VIL 0.3 V Logic High Output Voltages VOH V V

0.2 0.4 V IOx = 4 mA, VIx = V Input Current per Channel II −10 +0.01 +10 µA 0 V ≤ VIx ≤ V

V

− 0.1 3.0 V IOx = −20 µA, VIx = V

− 0.5 2.8 V IOx = −4 mA, VIx = V

Supply Current per Channel

Quiescent Input Supply Current I

Quiescent Output Supply Current I

Dynamic Input Supply Current I

Dynamic Output Supply Current I

0.3 0.5 mA VIA = VIB = 0 V

0.10 mA/Mbps

0.03 mA/Mbps

AC SPECIFICATIONS

DDX

transient magnitude = 800 V

Refresh Rate fr 1.1 Mbps

1

|CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both

rising and falling common-mode voltage edges.

Rev. C | Page 4 of 20

Data Sheet ADuM3200/ADuM3201

PHL

PLH

PHL

PSK

Channel Matching

PSKCD

PSKOD

1 Mbps—A Grade,

10 Mbps—B Grade and

DD1

DD2

ADuM3201

I

DD1

1.1

1.5 2.6

3.4 5.3

6.8

mA

No load

DDx

IxH

DDx

IxH

IxL

DDX

DDI(Q)

Quiescent Output Supply Current

I

DDO(Q)

0.3

0.5

mA

VIA = VIB = 0 V

Dynamic Input Supply Current

I

DDI(D)

0.19 mA/Mbps

DDO(D)

ELECTRICAL CHARACTERISTICS—MIXED 5 V/3 V, 105°C OPERATION

All typical specifications are at TA = 25°C, V

operation range: 4.5 V ≤ V

are tested with C

= 15 pF, and CMOS signal levels, unless otherwise noted.

L

≤ 5.5 V, 2.7 V ≤ V

DD1

Table 7.

A Grade B Grade C Grade

Parameter Symbol Min Typ Max Min Typ Max Min Typ Max Unit Test Conditions

SWITCHING SPECIFICATIONS

Data Rate 1 10 25 Mbps Within PWD limit Propagation Delay t

, t

15 150 15 55 15 50 ns 50% input to 50% output

Pulse Width Distortion PWD 40 3 3 ns |t

Change vs. Temperature 6 5 5 ps/°C Pulse Width PW 1000 100 40 ns Within PWD limit Propagation Delay Skew t

50 22 15 ns Between any two units

= 5 V, V

DD1

DD2

= 3 .0 V. Minimum/maximum specifications apply over the entire recommended

DD2

≤ 3.6 V, and −40°C ≤ TA ≤ +105°C, unless otherwise noted. Switching specifications

− t

|

Codirectional t

Opposing-Direction t

50 3 3 ns 50 22 15 ns

Output Rise/Fall Time tR/tF 3.0 3.0 3.0 ns 10% to 90%

Table 8.

Parameter Symbol

B Grade, and C Grade

Min Typ Max Min Typ Max Min Ty p Max

C Grade 25 Mbps—C Grade

Unit Test Conditions

SUPPLY CURRENT

ADuM3200 I

I

1.3 1.7 3.5 4.6 7.7 10.0 mA No load

0.7 1.0 1.1 1.7 1.8 2.4 mA No load

0.8 1.6 1.9 2.4 3.6 5.1 mA No load

DD2

Table 9. For All Models

Parameter Symbol Min Typ Max Unit Test Conditions

DC SPECIFICATIONS

Logic High Input Threshold VIH 0.7 V Logic Low Input Threshold VIL 0.8 0.3 V Logic High Output Voltages VOH V V

V

− 0.1 V

− 0.5 V

V IOx = −20 µA, VIx = V

− 0.2 V IOx = −4 mA, VIx = V

Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 µA, VIx = V

0.2 0.4 V IOx = 4 mA, VIx = V Input Current per Channel II −10 +0.01 +10 µA 0 V ≤ VIx ≤ V Supply Current per Channel

Quiescent Input Supply Current I

0.4 0.8 mA VIA = VIB = 0 V

Dynamic Output Supply Current I

AC SPECIFICATIONS

Common-Mode Transient Immunity1 |CM| 25 35 kV/µs VIx = V

Refresh Rate fr 1.2 Mbps

1

|CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both

rising and falling common-mode voltage edges.

0.03 mA/Mbps

Rev. C | Page 5 of 20

, VCM = 1000 V,

DDX

transient magnitude = 800 V

ADuM3200/ADuM3201 Data Sheet

PHL

PLH

PHL

PLH

PHL

PSK

PSKCD

PSKOD

DD1

DD2

DD1

DC SPECIFICATIONS

DDx

IxH

DDx

IxH

Logic Low Output Voltages

VOL 0.0

0.1 V IOx = 20 µA, VIx = V

IxL

DDX

DDI(Q)

DDO(Q)

DDI(D)

DDO(D)

Common-Mode Transient Immunity1

|CM|

25

35 kV/µs

VIx = V

, VCM = 1000 V,

ELECTRICAL CHARACTERISTICS—MIXED 3 V/5 V, 105°C OPERATION

All typical specifications are at TA = 25°C, V operation range: 2.7 V ≤ V are tested with C

= 15 pF and CMOS signal levels, unless otherwise noted.

L

≤ 3.6 V, 4.5 V ≤ V

DD1

Table 10.

A Grade B Grade C Grade Parameter Symbol Min Typ Max Min Typ Max Min Typ Max Unit Test Conditions

SWITCHING SPECIFICATIONS

Data Rate 1 10 25 Mbps Within PWD limit Propagation Delay t

, t

Pulse Width Distortion PWD

ADuM3200 40 3 3 ns |t ADuM3201 40 4 4 ns |t

Change vs. Temperature 6 5 5 ps/°C Pulse Width PW 1000 100 40 ns Within PWD limit Propagation Delay Skew t

50 22 15 ns Between any two units

Channel Matching

Codirectional t

Opposing-Direction t Output Rise/Fall Time tR/tF 2.5 2.5 2.5 ns 10% to 90%

50 3 3 ns

50 22 15 ns

= 3 V, V

DD1

DD2

= 5 .0 V. Minimum/maximum specifications apply over the entire recommended

DD2

≤ 5.5 V, and −40°C ≤ TA ≤ +105°C, unless otherwise noted. Switching specifications

15 150 15 55 15 50 ns 50% input to 50% output

− t

|

− t

|

Table 11.

1 Mbps—A Grade,

B Grade, and C Grade

Parameter Symbol

10 Mbps—B Grade and

C Grade 25 Mbps—C Grade

Unit Test Conditions Min Typ Max Min Typ Max Min Ty p Max

SUPPLY CURRENT

ADuM3200 I

I

ADuM3201 I

I

0.8 1.3 2.0 3.2 4.3 6.4 mA No load

1.0 1.6 1.7 2.8 3.1 3.9 mA No load

0.7 1.3 1.5 2.1 3.0 4.2 mA No load

1.3 1.8 3.1 4.0 6.4 8.3 mA No load

DD2

Table 12. For All Models

Parameter Symbol Min Typ Max Unit Test Conditions

Logic High Input Threshold VIH 0.7 V Logic Low Input Threshold VIL 0.4 0.3 V Logic High Output Voltages VOH V V

0.2 0.4 V IOx = 4 mA, VIx = V Input Current per Channel II −10 +0.01 +10 µA 0 V ≤ VIx ≤ V

V

− 0. 1 V

− 0.5 V

V IOx = −20 µA, VIx = V

− 0.2 V IOx = −4 mA, VIx = V

Supply Current per Channel

Quiescent Input Supply Current I

Quiescent Output Supply Current I

Dynamic Input Supply Current I

Dynamic Output Supply Current I

0.3 0.5 mA VIA = VIB = 0 V

0.5 0.6 mA VIA = VIB = 0 V

0.10 mA/Mbps

0.05 mA/Mbps

AC SPECIFICATIONS

DDX

transient magnitude = 800 V

Refresh Rate fr 1.1 Mbps

1

|CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both

rising and falling common-mode voltage edges.

Rev. C | Page 6 of 20

Data Sheet ADuM3200/ADuM3201

PHL

PLH

PHL

PSK

Channel Matching

PSKCD

PSKOD

1 Mbps—A Grade,

10 Mbps—B Grade and

DD1

DD2

ADuM3201

I

DD1

1.1

1.5 2.6

3.4 5.3

6.8

mA

No load

DD2

DDx

IxH

DDx

IxH

IxL

DDX

DDI(Q)

DDO(Q)

DDI(D)

DDO(D)

AC SPECIFICATIONS

ELECTRICAL CHARACTERISTICS—5 V, 125°C OPERATION

All typical specifications are at TA = 25°C, V

operation range: 4.5 V ≤ V

are tested with C

= 15 pF and CMOS signal levels, unless otherwise noted.

L

≤ 5.5 V, 4.5 V ≤ V

DD1

Table 13.

A Grade B Grade C Grade

Parameter Symbol Min Typ Max Min Typ Max Min Typ Max Unit Test Conditions

SWITCHING SPECIFICATIONS

Data Rate 1 10 25 Mbps Within PWD limit Propagation Delay t

, t

20 150 20 50 20 45 ns 50% input to 50% output

Pulse Width Distortion PWD 40 3 3 ns |t

Change vs. Temperature 6 5 5 ps/°C Pulse Width PW 1000 100 40 ns Within PWD limit Propagation Delay Skew t

100 15 15 ns Between any two units

= V

DD1

= 5 V. Minimum/maximum specifications apply over the entire recommended

DD2

≤ 5.5 V, and −40°C ≤ TA ≤ +125°C, unless otherwise noted. Switching specifications

DD2

− t

|

Codirectional t

Opposing-Direction t Output Rise/Fall Time tR/tF

50 3 3 ns 50 15 15 ns

2.5 2.5 2.5

ns 10% to 90%

Table 14.

Parameter Symbol

B Grade, and C Grade

Min Typ Max Min Typ Max Min Ty p Max

C Grade 25 Mbps—C Grade

Unit Test Conditions

SUPPLY CURRENT

ADuM3200 I

I

1.3 2.0 3.5 4.6 7.7 10.0 mA No load

1.0 1.6 1.7 2.8 3.1 3.9 mA No load

1.3 1.8 3.1 4.0 6.4 8.3 mA No load

Table 15. For All Models

Parameter Symbol Min Typ Max Unit Test Conditions

DC SPECIFICATIONS

Logic High Input Threshold VIH 0.7 V Logic Low Input Threshold VIL 0.3 V Logic High Output Voltages VOH V V

V

− 0.1 5.0 V IOx = −20 µA, VIx = V

− 0.5 4.8 V IOx = −4 mA, VIx = V

Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 µA, VIx = V

0.2 0.4 V IOx = 4 mA, VIx = V Input Current per Channel II −10 +0.01 +10 µA 0 V ≤ VIx ≤ V Supply Current per Channel

Quiescent Input Supply Current I

Quiescent Output Supply Current I

Dynamic Input Supply Current I

Dynamic Output Supply Current I

0.4 0.8 mA VIA = VIB = 0 V

0.5 0.6 mA VIA = VIB = 0 V

0.19 mA/Mbps

0.05 mA/Mbps

Common-Mode Transient Immunity1 |CM| 25 35 kV/µs VIx = V

Refresh Rate fr 1.2 Mbps

1

|CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both

rising and falling common-mode voltage edges.

Rev. C | Page 7 of 20

, VCM = 1000 V,

DDX

transient magnitude = 800 V

ADuM3200/ADuM3201 Data Sheet

PHL

PLH

PHL

PLH

PHL

PSK

PSKCD

PSKOD

DD1

DD2

DD1

DDx

Logic Low Input Threshold

VIL

0.3 V

DDx

V

DDx

IxH

DDx

IxH

IxL

DDX

DDI(Q)

DDO(Q)

DDI(D)

DDO(D)

ELECTRICAL CHARACTERISTICS—3 V, 125°C OPERATION

All typical specifications are at TA = 25°C, V operation range: 3.0 V ≤ V are tested with C

= 15 pF and CMOS signal levels, unless otherwise noted.

L

≤ 3.6 V, 3.0 V ≤ V

DD1

Table 16.

A Grade B Grade C Grade Parameter Symbol Min Typ Max Min Typ Max Min Typ Max Unit Test Conditions

SWITCHING SPECIFICATIONS

Data Rate 1 10 25 Mbps Within PWD limit Propagation Delay t

, t

20 150 20 60 20 55 ns 50% input to 50% output

Pulse Width Distortion PWD

ADuM3200 40 3 3 ns |t ADuM3201 40 4 4 ns |t

Change vs. Temperature 6 5 5 ps/°C Pulse Width PW 1000 100 40 ns Within PWD limit Propagation Delay Skew t

100 22 16 ns Between any two units

Channel Matching

Codirectional t

Opposing-Direction t Output Rise/Fall Time tR/tF

50 3 3 ns

50 22 16 ns

= V

DD1

= 3.0 V. Minimum/maximum specifications apply over the entire recommended

DD2

≤ 3.6 V, and −40°C ≤ TA ≤ +125°C, unless otherwise noted. Switching specifications

DD2

3.0 3.0 3.0

− t

|

− t

|

ns 10% to 90%

Table 17.

1 Mbps—A Grade,

B Grade, and C Grade

Parameter Symbol

10 Mbps—B Grade and

C Grade 25 Mbps—C Grade

Unit Test Conditions Min Typ Max Min Typ Max Min Ty p Max

SUPPLY CURRENT

ADuM3200 I

I

ADuM3201 I

I

0.8 1.3 2.0 3.2 4.3 6.4 mA No load

0.7 1.0 1.1 1.7 1.8 2.4 mA No load

0.7 1.3 1.5 2.1 3.0 4.2 mA No load

0.8 1.6 1.9 2.4 3.6 5.1 mA No load

DD2

Table 18. For All Models

Parameter Symbol Min Typ Max Unit Test Conditions

DC SPECIFICATIONS

Logic High Input Threshold VIH 0.7 V

Logic High Output Voltages VOH V V Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 µA, VIx = V

0.2 0.4 V IOx = 4 mA, VIx = V Input Current per Channel II −10 +0.01 +10 µA 0 V ≤ VIx ≤ V

V

− 0.1 3.0 V IOx = −20 µA, VIx = V

− 0.5 2.8 V IOx = −4 mA, VIx = V

Supply Current per Channel

Quiescent Input Supply Current I

Quiescent Output Supply Current I

Dynamic Input Supply Current I

Dynamic Output Supply Current I

0.3 0.5 mA VIA = VIB = 0 V

0.10 mA/Mbps

0.03 mA/Mbps

AC SPECIFICATIONS

Common-Mode Transient Immunity1 |CM| 25 35 kV/µs VIx = V

, VCM = 1000 V,

DDX

transient magnitude = 800 V

Refresh Rate fr 1.1 Mbps

1

|CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both

rising and falling common-mode voltage edges.

Rev. C | Page 8 of 20

Data Sheet ADuM3200/ADuM3201

PHL

PLH

PHL

PSK

Channel Matching

PSKCD

PSKOD

1 Mbps—A Grade,

10 Mbps—B Grade and

DD1

DD2

ADuM3201

I

DD1

1.1

1.5 2.6

3.4 5.3

6.8

mA

No load

DC SPECIFICATIONS

DDx

IxH

DDx

IxH

IxL

DDX

DDI(Q)

DDO(Q)

DDI(D)

DDO(D)

Common-Mode Transient Immunity1

|CM|

25

35 kV/µs

VIx = V

, VCM = 1000 V,

ELECTRICAL CHARACTERISTICS—MIXED 5 V/3 V, 125°C OPERATION

All typical specifications are at TA = 25°C, V

operation range: 4.5 V ≤ V

are tested with C

= 15 pF and CMOS signal levels, unless otherwise noted.

L

≤ 5.5 V, 3.0 V ≤ V

DD1

Table 19.

A Grade B Grade C Grade

Parameter Symbol Min Typ Max Min Typ Max Min Typ Max Unit Test Conditions

SWITCHING SPECIFICATIONS

Data Rate 1 10 25 Mbps Within PWD limit Propagation Delay t

, t

Pulse Width Distortion PWD 40 3 3 ns |t

Change vs. Temperature 6 5 5 ps/°C Pulse Width PW 1000 100 40 ns Within PWD limit Propagation Delay Skew t

50 22 15 ns Between any two units

= 5 V, V

DD1

= 3.0 V. Minimum/maximum specifications apply over the entire recommended

DD2

≤ 3.6 V, and −40°C ≤ TA ≤ +125°C, unless otherwise noted. Switching specifications

DD2

15 150 15 55 15 50 ns 50% input to 50% output

− t

|

Codirectional t

Opposing-Direction t Output Rise/Fall Time tR/tF

50 3 3 ns 50 22 15 ns

3.0 3.0 3.0

ns 10% to 90%

Table 20.

Parameter Symbol

B Grade, and C Grade

Min Typ Max Min Typ Max Min Ty p Max

C Grade 25 Mbps—C Grade

Unit Test Conditions

SUPPLY CURRENT

ADuM3200 I

I

1.3 2.0 3.5 4.6 7.7 10.0 mA No load

0.7 1.0 1.1 1.7 1.8 2.4 mA No load

0.8 1.6 1.9 2.4 3.6 5.1 mA No load

DD2

Table 21. For All Models

Parameter Symbol Min Typ Max Unit Test Conditions

Logic High Input Threshold VIH 0.7 V Logic Low Input Threshold VIL 0.8 0.3 V Logic High Output Voltages VOH V V Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 µA, VIx = V

0.2 0.4 V IOx = 4 mA, VIx = V Input Current per Channel II −10 +0.01 +10 µA 0 V ≤ VIx ≤ V

V

− 0.1 V

− 0.5 V

V IOx = −20 µA, VIx = V

− 0.2 V IOx = −4 mA, VIx = V

Supply Current per Channel

Quiescent Input Supply Current I

Quiescent Output Supply Current I

Dynamic Input Supply Current I

Dynamic Output Supply Current I

0.4 0.8 mA VIA = VIB = 0 V

0.3 0.5 mA VIA = VIB = 0 V

0.19 mA/Mbps

0.03 mA/Mbps

AC SPECIFICATIONS

DDX

transient magnitude = 800 V

Refresh Rate fr 1.2 Mbps

1

|CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both

rising and falling common-mode voltage edges.

Rev. C | Page 9 of 20

ADuM3200/ADuM3201 Data Sheet

PHL

PLH

PHL

PLH

PHL

PSK

PSKCD

PSKOD

DD1

DD2

DD1

DC SPECIFICATIONS

DDx

IxH

DDx

IxH

Logic Low Output Voltages

VOL 0.0

0.1 V IOx = 20 µA, VIx = V

IxL

DDX

DDI(Q)

DDO(Q)

DDI(D)

DDO(D)

Common-Mode Transient Immunity1

|CM|

25

35 kV/µs

ELECTRICAL CHARACTERISTICS—MIXED 3 V/5 V, 125°C OPERATION

All typical specifications are at TA = 25°C, V operation range: 3.0 V ≤ V are tested with C

= 15 pF and CMOS signal levels, unless otherwise noted.

L

≤ 3.6 V, 4.5 V ≤ V

DD1

Table 22.

A Grade B Grade C Grade Parameter Symbol Min Typ Max Min Typ Max Min Typ Max Unit Test Conditions

SWITCHING SPECIFICATIONS

Data Rate 1 10 25 Mbps Within PWD limit Propagation Delay t

, t

Pulse Width Distortion PWD

ADuM3200 40 3 3 ns |t ADuM3201 40 4 4 ns |t

Change vs. Temperature 6 5 5 ps/°C Pulse Width PW 1000 100 40 ns Within PWD limit Propagation Delay Skew t

50 22 15 ns Between any two units

Channel Matching

Codirectional t

Opposing-Direction t Output Rise/Fall Time tR/tF

50 3 3 ns

50 22 15 ns

= 3 V, V

DD1

DD2

= 5.0 V. Minimum/maximum specifications apply over the entire recommended

DD2

≤ 5.5 V, and −40°C ≤ TA ≤ +125°C, unless otherwise noted. Switching specifications

15 150 15 55 15 50 ns 50% input to 50% output

− t

|

− t

|

2.5 2.5 2.5

ns 10% to 90%

Table 23.

1 Mbps—A Grade,

B Grade, and C Grade

Parameter Symbol

10 Mbps—B Grade and

C Grade 25 Mbps—C Grade

Unit Test Conditions Min Typ Max Min Typ Max Min Ty p Max

SUPPLY CURRENT

ADuM3200 I

I

ADuM3201 I

I

0.8 1.3 2.0 3.2 4.3 6.4 mA No load

1.0 1.6 1.7 2.8 3.1 3.9 mA No load

0.7 1.3 1.5 2.1 3.0 4.2 mA No load

1.3 1.8 3.1 4.0 6.4 8.3 mA No load

DD2

Table 24. For All Models

Parameter Symbol Min Typ Max Unit Test Conditions

Logic High Input Threshold VIH 0.7 V Logic Low Input Threshold VIL 0.4 0.3 V Logic High Output Voltages VOH V V

0.2 0.4 V IOx = 4 mA, VIx = V Input Current per Channel II −10 +0.01 +10 µA 0 V ≤ VIx ≤ V

V

− 0.1 V

− 0.5 V

V IOx = −20 µA, VIx = V

− 0.2 V IOx = −4 mA, VIx = V

Supply Current per Channel

Quiescent Input Supply Current I

Quiescent Output Supply Current I

Dynamic Input Supply Current I

Dynamic Output Supply Current I

0.3 0.5 mA VIA = VIB = 0 V

0.5 0.6 mA VIA = VIB = 0 V

0.10 mA/Mbps

0.05 mA/Mbps

AC SPECIFICATIONS

VIx = V

DDX

, V

CM

= 1000 V,

transient magnitude = 800 V

Refresh Rate fr 1.1 Mbps

1

|CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both

rising and falling common-mode voltage edges.

Rev. C | Page 10 of 20

Data Sheet ADuM3200/ADuM3201

Resistance (Input to Output)1

R

I-O

1012 Ω

I-O

JCO

Isolation Group

IIIa Material Group (DIN VDE 0110, 1/89, Table 1)

PACKAGE CHARACTERISTICS

Table 25.

Parameter Symbol Min Typ Max Unit Test Conditions

Capacitance (Input to Output)1 C

1.0 pF f = 1 MHz Input Capacitance CI 4.0 pF IC Junction-to-Case Thermal Resistance, Side 1 θ

46 °C/W Thermocouple located at center

JCI

of package underside

IC Junction-to-Case Thermal Resistance, Side 2 θ

1

The device is considered a 2-terminal device; Pin 1, Pin 2, Pin 3, and Pin 4 are shorted together, and Pin 5, Pin 6, Pin 7, and Pin 8 are shorted together.

41 °C/W

REGULATORY INFORMATION

The ADuM3200/ADuM3201 devices are approved by the organizations listed in Table 26. Refer to Table 31 and the Insulation Lifetime section for details regarding recommended maximum working voltages for specific cross-isolation waveforms and insulation levels.

Table 26.

UL CSA VDE

Recognized under UL 1577 Component Recognition Program

1

Single/basic 2500 V rms isolation voltage

Approved under CSA Component Acceptance Notice #5A

Basic insulation per CSA 60950-1-03 and IEC 60950-1, 400 V rms (566 V peak) maximum working voltage Functional insulation per CSA 60950-1-03 and IEC 60950-1, 800 V rms (1131 V peak) maximum working voltage

File E214100 File 205078 File 2471900-4880-0001

1

In accordance with UL 1577, each ADuM320x is proof-tested by applying an insulation test voltage ≥3000 V rms for 1 second (current leakage detection limit = 5 µA).

2

In accordance with DIN V VDE V 0884-10, each ADuM320x is prooftested by applying an insulation test voltage ≥1050 V peak for 1 second (partial discharge detection

limit = 5 pC). An asterisk (*) marking branded on the component designates DIN V VDE V 0884-10

approval.

Certified according to DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12

2

Reinforced insulation, 560 V peak

INSULATION AND SAFETY-RELATED SPECIFICATIONS

Table 27.

Parameter Symbol Value Unit Conditions

Rated Dielectric Insulation Voltage 2500 V rms 1-minute duration Minimum External Air Gap (Clearance) L(I01) 4.90 min mm Measured from input terminals to output terminals,

shortest distance through air

Minimum External Tracking (Creepage) L(I02) 4.01 min mm Measured from input terminals to output terminals,

shortest distance path along body Minimum Internal Gap (Internal Clearance) 0.017 min mm Insulation distance through insulation Tracking Resistance (Comparative Tracking Index) CTI >175 V DIN IEC 112/VDE 0303 Part 1

Rev. C | Page 11 of 20

ADuM3200/ADuM3201 Data Sheet

Climatic Classification

40/105/21

IORM

After Environmental Tests Subgroup 1

896

V peak

CASE TEMPERATURE (°C)

SAFETY- LIMITING CURRENT (mA)

0

200

180

100

80

60

40

20

50 100 150 200

SIDE #1

SIDE #2

120

140

160

05927-003

ADuM3200C/ADuM3201C

−40

+105

°C

Fall Times

DIN V VDE V 0884-10 (VDE V 0884-10) INSULATION CHARACTERISTICS

These isolators are suitable for reinforced isolation only within the safety limit data. Maintenance of the safety data is ensured by protective circuits. The asterisk (*) marking on the package denotes DIN V VDE V 0884-10 approval for a 560 V peak working voltage.

Table 28.

Description Conditions Symbol Characteristic Unit

Installation Classification per DIN VDE 0110

For Rated Mains Voltage ≤ 150 V rms I to IV For Rated Mains Voltage ≤ 300 V rms I to III For Rated Mains Voltage ≤ 400 V rms I to II

Pollution Degree per DIN VDE 0110, Table 1 Maximum Working Insulation Voltage V Input-to-Output Test Voltage, Method B1 V

× 1.875 = VPR, 100% production test, tm = 1 sec,

IORM

2

560 V peak

VPR 1050 V peak

partial discharge < 5 pC

Input-to-Output Test Voltage, Method A V

After Input and/or Safety Test Subgroup 2

× 1.6 = VPR, tm = 60 sec, partial discharge < 5 pC VPR

V

× 1.2 = VPR, tm = 60 sec, partial discharge < 5 pC 672 V peak

IORM

and Subgroup 3 Highest Allowable Overvoltage Transient overvoltage, tTR = 10 seconds VTR 4000 V peak Safety-Limiting Values Maximum value allowed in the event of a failure

(see Figure 3) Case Temperature TS 150 °C Side 1 Current IS1 160 mA Side 2 Current IS2 170 mA

Insulation Resistance at TS VIO = 500 V RS >109 Ω

RECOMMENDED OPERATING CONDITIONS

Table 29.

Parameter Symbol Min Max Unit

Operating Temperature TA

ADuM3200A/ADuM3201A −40 +105 °C ADuM3200B/ADuM3201B −40 +105 °C

Figure 3. Thermal Derating Curve, Dependence of Safety-Limiting Values

on Case Temperature, per DIN V VDE V 0884-10

ADuM3200WA/ADuM3201WA −40 +125 °C ADuM3200WB/ADuM3201WB −40 +125 °C ADuM3200WC/ADuM3201WC −40 +125 °C

Supply Voltages1 V

DD1

, V

DD2

ADuM3200A/ADuM3201A 2.7 5.5 V ADuM3200B/ADuM3201B 2.7 5.5 V ADuM3200C/ADuM3201C 2.7 5.5 V ADuM3200WA/ADuM3201WA 3.0 5.5 V ADuM3200WB/ADuM3201WB 3.0 5.5 V ADuM3200WC/ADuM3201WC 3.0 5.5 V

Maximum Input Signal Rise and

1

All voltages are relative to their respective ground. See the DC Correctness

and Magnetic Field Immunity section for information on immunity to external magnetic fields.

Rev. C | Page 12 of 20

1.0 ms

Data Sheet ADuM3200/ADuM3201

ABSOLUTE MAXIMUM RATINGS

Ambient temperature = 25°C, unless otherwise noted.

Table 30.

Parameter Rating

Storage Temperature (TST) −55°C to +150°C Ambient Operating Temperature (TA) −40°C to +125°C Supply Voltages (V Input Voltage (VIA, VIB) Output Voltage (VOA, VOB)

, V

)1 −0.5 V to +7.0 V

DD1

DD2

1, 2

−0.5 V to V

1, 2

−0.5 V to V

+ 0.5 V

DDI

DDO

+ 0.5 V Average Output Current, per Pin (IO)3 −22 mA to +22 mA Common-Mode Transients

, CMH)4

(CM

L

1

All voltages are relative to their respective ground.

2

V

and V

DDI

given channel, respectively.

3

See Figure 3 for maximum rated current values for various temperatures.

4

Refers to common-mode transients across the insulation barrier. Common-

mode transients exceeding the Absolute Maximum Ratings can cause latch-up or permanent damage.

refer to the supply voltages on the input and output sides of a

DDO

Table 31. Maximum Continuous Working Voltage

−100 kV/μs to +100 kV/μs

1

Parameter Max Unit Constraint

AC Voltage, Bipolar Waveform 565 V peak AC Voltage, Unipolar Waveform

Functional Insulation 1131 V peak

50-year minimum lifetime

Maximum approved working voltage per IEC 60950-1

Basic Insulation 560 V peak Maximum approved working voltage per IEC 60950-1 and VDE V 0884-10

DC Voltage

Functional Insulation 1131 V peak

Maximum approved working voltage per IEC 60950-1

Basic Insulation 560 V peak Maximum approved working voltage per IEC 60950-1 and VDE V 0884-10

1

Refers to continuous voltage magnitude imposed across the isolation barrier. See the Insulation Lifetime section for more details.

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

Table 32. ADuM3200 Truth Table (Positive Logic)

VIA Input VIB Input V

State V

DD1

State VOA Output VOB Output Notes

DD2

H H Powered Powered H H L L Powered Powered L L H L Powered Powered H L L H Powered Powered L H X X Unpowered Powered H H

Outputs return to the input state within 1 μs of V

X X Powered Unpowered Indeterminate Indeterminate

Outputs return to the input state within 1 μs of V

Table 33. ADuM3201 Truth Table (Positive Logic)

VIA Input VIB Input V

State V

DD1

State VOA Output VOB Output Notes

DD2

H H Powered Powered H H L L Powered Powered L L H L Powered Powered H L L H Powered Powered L H X X Unpowered Powered Indeterminate H

Outputs return to the input state within 1 μs of V

X X Powered Unpowered H Indeterminate

Outputs return to the input state within 1 μs of V

power restoration.

DDI

power restoration.

DDO

power restoration.

DDI

power restoration.

DDO

Rev. C | Page 13 of 20

ADuM3200/ADuM3201 Data Sheet

05927-004

V

DD1

1

V

IA

2

V

IB

3

GND

1

4

V

DD2

8

V

OA

7

V

OB

6

GND

2

5

ADuM3200

TOP VIEW

(Not to Scale)

DD1

2

VIA

Logic Input A.

DD2

05927-005

V

DD1

1

V

OA

2

V

IB

3

GND

1

4

V

DD2

8

V

IA

7

V

OB

6

GND

2

5

ADuM3201

TOP VIEW

(Not to Scale)

DD1

6

VOB

Logic Output B.

DD2

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

Figure 4. ADuM3200 Pin Configuration

Table 34. ADuM3200 Pin Function Descriptions

Pin No. Mnemonic Description

1 V

S upply Voltage for Isolator Side 1.

3 VIB Logic Input B. 4 GND1 Ground 1. Ground reference for Isolator Side 1. 5 GND2 Ground 2. Ground reference for Isolator Side 2. 6 VOB Logic Output B. 7 VOA Logic Output A. 8 V

S upply Voltage for Isolator Side 2.

Figure 5. ADuM3201 Pin Configuration

Table 35. ADuM3201 Pin Function Descriptions

Pin No. Mnemonic Description

1 V

S upply Voltage for Isolator Side 1. 2 VOA Logic Output A. 3 VIB Logic Input B. 4 GND1 Ground 1. Ground reference for Isolator Side 1. 5 GND2 Ground 2. Ground reference for Isolator Side 2.

7 VIA Logic Input A. 8 V

S upply Voltage for Isolator Side 2.

Rev. C | Page 14 of 20

Data Sheet ADuM3200/ADuM3201

DATA RATE (Mbps)

CURRENT/CHANNEL ( mA)

0

6

2

8

10

10 20 30

5V

3V

4

05927-006

DATA RATE (Mbps)

CURRENT/CHANNEL ( mA)

0

3

2

1

4

10 20 30

5V

3V

05927-007

DATA RATE (Mbps)

CURRENT/CHANNEL ( mA)

0

3

2

1

4

10 20 30

5V

3V

05927-008

DATA RATE (Mbps)

CURRENT (mA)

0

15

10

5

20

10 20 30

5V

3V

05927-009

DATA RATE (Mbps)

CURRENT (mA)

0

3

2

1

4

10 20 30

5V

3V

05927-010

DATA RATE (Mbps)

CURRENT (mA)

0

6

2

8

10

10 20 30

5V

3V

4

05927-011

TYPICAL PERFORMANCE CHARACTERISTICS

Figure 6. Typical Input Supply Current per Channel vs. Data Rate

for 5 V and 3 V Operation

Figure 7. Typical Output Supply Current per Channel vs. Data Rate

for 5 V and 3 V Operation (No Output Load)

Figure 9. Typical ADuM3200 I

for 5 V and 3 V Operation

Figure 10. Typical ADuM3200 I

for 5 V and 3 V Operation

Supply Current vs. Data Rate

DD1

Supply Current vs. Data Rate

DD2

Figure 8. Typical Output Supply Current per Channel vs. Data Rate

for 5 V and 3 V Operation (15 pF Output Load)

Figure 11. Typical ADuM3201 I

for 5 V and 3 V Operation

or I

Supply Current vs. Data Rate

DD1

DD2

Rev. C | Page 15 of 20

ADuM3200/ADuM3201 Data Sheet

APPLICATION INFORMATION

PC BOARD LAYOUT

The ADuM3200/ADuM3201 digital isolators require no external interface circuitry for the logic interfaces. Power supply bypassing is strongly recommended at the input and output supply pins. The capacitor value should be between

0.01 μF and 0.1 μF. The total lead length between both ends of the capacitor and the input power supply pin should not exceed 20 mm. See the AN-1109 Application Note for board layout guidelines.

SYSTEM-LEVEL ESD CONSIDERATIONS AND ENHANCEMENTS

System-level ESD reliability (for example, per IEC 61000-4-x) is highly dependent on system design which varies widely by application. The ADuM3200/ADuM3201 incorporate many enhancements to make ESD reliability less dependent on system design. The enhancements include:

 ESD protection cells added to all input/output interfaces.  Key metal trace resistances reduced using wider geometry

and paralleling of lines with vias.

 The SCR effect inherent in CMOS devices minimized by

use of guarding and isolation technique between PMOS and NMOS devices.

 Areas of high electric field concentration eliminated using

45° corners on metal traces.

 Supply pin overvoltage prevented with larger ESD clamps

between each supply pin and its respective ground.

While the ADuM3200/ADuM3201 improve system-level ESD reliability, they are no substitute for a robust system-level design. See the AN-793 Application Note, ESD/Latch-Up

Considerations with iCoupler Isolation Products for detailed

recommendations on board layout and system-level design.

PROPAGATION DELAY-RELATED PARAMETERS

Propagation delay is a parameter that describes the time it takes a logic signal to propagate through a component. The propagation delay to a logic low output can differ from the propagation delay to a logic high.

Channel-to-channel matching refers to the maximum amount that the propagation delay differs between channels within a single ADuM3200/ADuM3201 component.

Propagation delay skew refers to the maximum amount that the propagation delay differs between multiple ADuM3200/

ADuM3201 components operating under the same conditions.

DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY

Positive and negative logic transitions at the isolator input cause narrow (~1 ns) pulses to be sent to the decoder via the transformer. The decoder is bistable and is therefore either set or reset by the pulses, indicating input logic transitions. In the absence of logic transitions of more than ~1 μs at the input, a periodic set of refresh pulses indicative of the correct input state are sent to ensure dc correctness at the output. If the decoder receives no internal pulses for more than about 5 μs, the input side is assumed to be unpowered or nonfunctional, in which case, the isolator output is forced to a default state (see Table 32 and Table 33) by the watchdog timer circuit.

The ADuM3200/ADuM3201 are extremely immune to external magnetic fields. The limitation on the ADuM3200/ADuM3201’s magnetic field immunity is set by the condition in which induced voltage in the transformer’s receiving coil is sufficiently large to either falsely set or reset the decoder. The following analysis defines the conditions under which this can occur. The 3 V operating condition of the ADuM3200/ADuM3201 is examined because it represents the most susceptible mode of operation.

The pulses at the transformer output have an amplitude greater than 1.0 V. The decoder has a sensing threshold at about 0.5 V, therefore establishing a 0.5 V margin in which induced voltages can be tolerated. The voltage induced across the receiving coil is given by

V = (−dβ/dt) ∑π r

where:

β is the magnetic flux density (gauss). N is the number of turns in the receiving coil. r

is the radius of the nth turn in the receiving coil (cm).

n

2

, n = 1, 2,…, N

n

INPUT (VIx)

OUTPUT (V

t

PLH

)

Ox

Figure 12. Propagation Delay Parameters

t

PHL

50%

Pulse width distortion is the maximum difference between these two propagation delay values and is an indication of how accurately the input signal’s timing is preserved.

05927-012

Rev. C | Page 16 of 20

Data Sheet ADuM3200/ADuM3201

MAGNETI C FIELD FRE QUENCY (Hz)

100

MAXIMUM ALLOWABLE MAGNETIC FLUX

DENSITY ( kgauss)

0.001 1M

10

0.01

1k 10k 10M

0.1

1

100M100k

05927-013

MAGNETI C FIELD FRE QUENCY (Hz)

MAXIMUM AL LOWABLE CURRE NT (kA)

1000

100

10

1

0.1

0.01 1k 10k 100M100k 1M 10M

DISTANCE = 5mm

DISTANCE = 1m

DISTANCE = 100mm

05927-014

Given the geometry of the receiving coil in the ADuM3200/

ADuM3201 and an imposed requirement that the induced

voltage is at most 50% of the 0.5 V margin at the decoder, a maximum allowable magnetic field is calculated, as shown in Figure 13.

The preceding magnetic flux density values correspond to specific current magnitudes at given distances away from the

ADuM3200/ADuM3201 transformers. Figure 14 expresses

these allowable current magnitudes as a function of frequency for selected distances. As seen, the ADuM3200/ADuM3201 are extremely immune and can be affected only by extremely large currents operated at high frequency and very close to the component. For the 1 MHz example, one would have to place a 0.5 kA current 5 mm away from the ADuM3200/ADuM3201 to affect the component’s operation.

Figure 13. Maximum Allowable External Magnetic Flux Density

For example, at a magnetic field frequency of 1 MHz, the maximum allowable magnetic field of 0.2 kgauss induces a voltage of 0.25 V at the receiving coil. This is about 50% of the sensing threshold and does not cause a faulty output transition. Similarly, if such an event were to occur during a transmitted pulse (and had the worst-case polarity), it would reduce the received pulse from >1.0 V to 0.75 V—still well above the

0.5 V sensing threshold of the decoder.

Figure 14. Maximum Allowable Current for Various

Current-to-ADuM3200/ADuM3201 Spacings

Note that at combinations of strong magnetic fields and high frequencies, any loops formed by printed circuit board traces could induce sufficiently large error voltages to trigger the threshold of succeeding circuitry. Care should be taken in the layout of such traces to avoid this possibility.

Rev. C | Page 17 of 20

ADuM3200/ADuM3201 Data Sheet

0V

RATED PEAK VOLTAGE

05927-015

0V

RATED PEAK VOLTAGE

05927-016

0V

RATED PEAK VOLTAGE

05927-017

POWER CONSUMPTION

The supply current at a given channel of the ADuM3200/

ADuM3201 isolator is a function of the supply voltage, the

channel’s data rate, and the channel’s output load.

For each input channel, the supply current is given by

I

= I

DDI

DDI (Q)

= I

I

DDI

× (2f − fr) + I

DDI (D)

DDI (Q)

For each output channel, the supply current is given by

I

DDO

= I

= (I

f ≤ 0.5fr

DDO (Q)

+ (0.5 × 10−3) × CLV

DDO (D)

) × (2f − fr) + I

DDO

where:

I

, I

DDI (D)

are the input and output dynamic supply currents

DDO (D)

per channel (mA/Mbps).

C

is the output load capacitance (pF).

L

V

is the output supply voltage (V).

DDO

f is the input logic signal frequency (MHz, half of the input data

rate, NRZ signaling).

f

is the input stage refresh rate (Mbps).

r

I

, I

DDI (Q)

are the specified input and output quiescent

DDO (Q)

supply currents (mA).

To calculate the total I

DD1

and I

supply current, the supply

DD2

currents for each input and output channel corresponding to I

DD1

and I

are calculated and totaled. Figure 6 provides per-

DD2

channel input supply currents as a function of data rate.

Figure 7 and Figure 8 provide per-channel output supply currents as a function of data rate for an unloaded output condition and for a 15 pF output condition, respectively. Figure 9 through Figure 11 provide total I

DD1

and I supply current as a function of data rate for ADuM3200 and ADuM3201 channel configurations.

DD2

f ≤ 0.5fr

f > 0.5fr

DDO (Q)

f > 0.5fr

The values shown in Table 31 summarize the peak voltage for 50 years of service life for a bipolar ac operating condition, and the maximum CSA/VDE approved working voltages. In many cases, the approved working voltage is higher than the 50-year service life voltage. Operation at these high working voltages can lead to shortened insulation life.

The insulation lifetime of the ADuM3200/ADuM3201

he voltage waveform type imposed across the isolation

on t

depends

barrier. The iCoupler insulation structure degrades at different rates depending on whether the waveform is bipolar ac, unipolar ac, or dc. Figure 15, Figure 16, and Figure 17 illustrate these different isolation voltage waveforms.

A bipolar ac voltage environment is the most stringent. The goal of a 50-year operating lifetime under the ac bipolar condition determines the Analog Devices recommended maximum working voltage.

In the case of unipolar ac or dc voltage, the stress on the insulation is significantly lower. This allows operation at higher working voltages while still achieving a 50-year service life. The working voltages listed in Table 31 can be applied while maintaining the 50-year minimum lifetime, provided that the voltage conforms to either the unipolar ac or dc voltage cases. Any cross-insulation voltage waveform that does not conform to Figure 16 or Figure 17 should be treated as a bipolar ac waveform and its peak voltage should be limited to the 50-year lifetime voltage value listed in Tabl e 31.

Note that the voltage presented in Figure 16 is shown as sinusoidal for illustration purposes only. It is meant to represent any voltage waveform varying between 0 V and some limiting value. The limiting value can be positive or negative, but the voltage cannot cross 0 V.

INSULATION LIFETIME

All insulation structures eventually break down when subjected to voltage stress over a sufficiently long period. The rate of insulation degradation depends upon the characteristics of the voltage waveform applied across the insulation. In addition to the testing performed by the regulatory agencies, Analog Devices carries out an extensive set of evaluations to determine the lifetime of the insulation structure within the ADuM3200/

ADuM3201.

Analog Devices performs accelerated life testing using voltage levels higher than the rated continuous working voltage. Acceleration factors for several operating conditions are determined. These factors allow calculation of the time to failure at the actual working voltage.

Figure 15. Bipolar AC Waveform

Figure 16. Unipolar AC Waveform

Figure 17. DC Waveform

Rev. C | Page 18 of 20

Data Sheet ADuM3200/ADuM3201

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES)ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLYAND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-012-AA

012407-A

0.25 (0.0098)

0.17 (0.0067)

1.27 (0.0500)

0.40 (0.0157)

0.50 (0.0196)

0.25 (0.0099)

45°

8° 0°

1.75 (0.0688)

1.35 (0.0532)

SEATING

PLANE

0.25 (0.0098)

0.10 (0.0040)

4

1

8 5

5.00(0.1968)

4.80(0.1890)

4.00 (0.1574)

3.80 (0.1497)

1.27 (0.0500) BSC

6.20 (0.2441)

5.80 (0.2284)

0.51 (0.0201)

0.31 (0.0122)

COPLANARITY

0.10

OUTLINE DIMENSIONS

Figure 18. 8-Lead Standard Small Outline Package [SOIC_N]

Narrow Body (R-8)

Dimensions shown in millimeters (inches)

Rev. C | Page 19 of 20

ADuM3200/ADuM3201 Data Sheet

Number

DD1

Number

DD2

Maximum

ORDERING GUIDE

Model

1, 2

of Inputs,

Side

V

of Inputs,

Side

V

Data Rate (Mbps)

Propagation Delay, 5 V (ns)

Pulse Width Distortion (ns)

Temperature Range (°C)

Package Option3

ADuM3200ARZ 2 0 1 150 40 −40 to +105 R-8 ADuM3200ARZ-RL7 2 0 1 150 40 −40 to +105 R-8 ADuM3200BRZ 2 0 10 50 3 −40 to +105 R-8 ADuM3200BRZ-RL7 2 0 10 50 3 −40 to +105 R-8 ADuM3200CRZ 2 0 25 45 3 −40 to +105 R-8 ADuM3200CRZ-RL7 2 0 25 45 3 −40 to +105 R-8 ADuM3200WARZ 2 0 1 150 40 −40 to +125 R-8 ADuM3200WARZ-RL7 2 0 1 150 40 −40 to +125 R-8 ADuM3200WBRZ 2 0 10 50 3 −40 to +125 R-8 ADuM3200WBRZ-RL7 2 0 10 50 3 −40 to +125 R-8 ADuM3200WCRZ 2 0 25 45 3 −40 to +125 R-8 ADuM3200WCRZ-RL7 2 0 25 45 3 −40 to +125 R-8 ADuM3201ARZ 1 1 1 150 40 −40 to +105 R-8 ADuM3201ARZ-RL7 1 1 1 150 40 −40 to +105 R-8 ADuM3201BRZ 1 1 10 50 3 −40 to +105 R-8 ADuM3201BRZ-RL7 1 1 10 50 3 −40 to +105 R-8 ADuM3201CRZ 1 1 25 45 3 −40 to +105 R-8 ADuM3201CRZ-RL7 1 1 25 45 3 −40 to +105 R-8 ADuM3201WARZ 1 1 1 150 40 −40 to +125 R-8 ADuM3201WARZ-RL7 1 1 1 150 40 −40 to +125 R-8 ADuM3201WBRZ 1 1 10 50 3 −40 to +125 R-8 ADuM3201WBRZ-RL7 1 1 10 50 3 −40 to +125 R-8 ADuM3201WCRZ 1 1 25 45 3 −40 to +125 R-8 ADuM3201WCRZ-RL7 1 1 25 45 3 −40 to +125 R-8

1

Z = RoHS Compliant Part.

2

W = Qualified for Automotive Applications.

3

R-8 = 8-lead narrow body SOIC_N.

AUTOMOTIVE PRODUCTS

The ADuM3200W/ADuM3201W models are available with controlled manufacturing to support the quality and reliability requirements of automotive applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to obtain the specific Automotive Reliability reports for these models.

registered trademarks are the property of their respective owners. D05927-2/12(C)

Rev. C | Page 20 of 20

Datasheet ADUM3200 Datasheet (ANALOG DEVICES)

Specifications and Main Features

Frequently Asked Questions

User Manual

FEATURES

APPLICATIONS

GENERAL DESCRIPTION

FUNCTIONAL BLOCK DIAGRAMS

TABLE OF CONTENTS

REVISION HISTORY

SPECIFICATIONS

PACKAGE CHARACTERISTICS

REGULATORY INFORMATION

INSULATION AND SAFETY-RELATED SPECIFICATIONS

DIN V VDE V 0884-10 (VDE V 0884-10) INSULATION CHARACTERISTICS

RECOMMENDED OPERATING CONDITIONS

ABSOLUTE MAXIMUM RATINGS

ESD CAUTION

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

TYPICAL PERFORMANCE CHARACTERISTICS

APPLICATION INFORMATION

PC BOARD LAYOUT

SYSTEM-LEVEL ESD CONSIDERATIONS AND ENHANCEMENTS

PROPAGATION DELAY-RELATED PARAMETERS

DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY

POWER CONSUMPTION

INSULATION LIFETIME

OUTLINE DIMENSIONS

ORDERING GUIDE

AUTOMOTIVE PRODUCTS