Datasheet ADT516 Datasheet (Analog Devices)

Page 1
SPI/I2C Compatible, Temperature Sensor,
4-Channel ADC and Quad Voltage Output DAC

FEATURES

ADT7516—four 12-bit DACs ADT7517—four 10-bit DACs ADT7519—four 8-bit DACs Buffered voltage output Guaranteed monotonic by design over all codes 10-bit temperature-to-digital converter 10-bit 4-channel ADC DC input bandwidth Input range: 0 V to 2.28 V Temperature range: –40°C to +120°C Temperature sensor accuracy of typ: ±0.5°C Supply range: 2.7 V to 5.5 V DAC output range: 0 V to 2 V Power-down current: 1 µA Internal 2.28 V
option
REF
Double-buffered input logic Buffered reference input Power-on reset to 0 V DAC output Simultaneous update of outputs (
On-chip rail-to-rail output buffer amplifier
®
, I2C®, QSPI™, MICROWIRE™, and DSP compatible
SPI 4-wire serial interface SMBus packet error checking (PEC) compatible 16-lead QSOP package

GENERAL DESCRIPTION

The ADT7516/ADT7517/ADT75191 combine a 10-bit temp­erature-to-digital converter, a 10-bit 4-channel ADC, and a quad 12-/10-/8-bit DAC, respectively, in a 16-lead QSOP package. The parts also include a band gap temperature sensor and a 10-bit ADC to monitor and digitize the temperature reading to a resolution of 0.25°C.
The ADT7516/ADT7517/ ADT7519 operate from a single 2.7 V to 5.5 V supply. The input voltage range on the ADC channels is 0 V to 2.28 V, and the input bandwidth is dc. The reference for the ADC channels is derived internally. The output voltage of the DAC ranges from 0 V to V time of 7 ms typical.
The ADT7516/ADT7517/ADT7519 provide two serial interface options: a 4-wire serial interface that is compatible with SPI, QSPI, MICROWIRE, and DSP interface standards, and a 2-wire
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
REF
function)
LDAC
, with an output voltage settling
DD
ADT7516/ADT7517/ADT7519

APPLICATIONS

Portable battery-powered instruments Personal computers Smart battery chargers Telecommunications systems Electronic text equipment Domestic appliances Process control

PIN CONFIGURATION

V
-B
1
OUT
V
-A
2
OUT
V
REF
D+/AIN1 D–/AIN2
GND
V
-IN CS
DD
ADT7516/
3
ADT7517/
ADT7519
4
TOP VIEW
5
(Not to Scale)
6 7 8
Figure 1.
2
SMBus/I
C interface. They feature a standby mode that is
controlled through the serial interface.
The reference for the four DACs is derived either internally or from a reference pin. The outputs of all DACs may be updated simultaneously using the software LDAC function or the
LDAC
external
pin. The ADT7516/ADT7517/ADT7519 incorporate a power-on reset circuit, which ensures that the DAC output powers up to 0 V and remains there until a valid write takes place.
The ADT7516/ADT7517/ADT7519’s wide supply voltage range, low supply current, and SPI/I
2
them ideal for a variety of applications, including personal computers, office equipment, and domestic appliances.
1
Protected by the following U.S. Patent Numbers: 6,169,442; 5,867,012;
5,764174. Other patents pending.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 Fax: 781.326.8703 © 2004 Analog Devices, Inc. All rights reserved.
www.analog.com
V
-C
16
OUT
V
-D
15
OUT
14
AIN4
13
SCL/SCLK
12
SDA/DIN
11
DOUT/ADD
10
INT/INT
9
LDAC/AIN3
C compatible interface make
02883-A-006
Page 2
ADT7516/ADT7517/ADT7519
TABLE OF CONTENTS
Specifications..................................................................................... 3
Conversion Speed....................................................................... 19
DAC AC Characteristics .............................................................. 6
Functional Block Diagram .............................................................. 8
Absolute Maximum Ratings............................................................ 9
ESD Caution.................................................................................. 9
Pin Configuration and Functional Descriptions........................ 10
Te r m in o l o g y .................................................................................... 11
Typical Performance Characteristics ........................................... 13
Theory of Operation ...................................................................... 19
Power-Up Calibration ................................................................ 19
REVISION HISTORY
8/04—Data Sheet Changed from Rev. 0 to Rev. A
Updated Format...................................................................... Universal
Deleted ADT7518
Added ADT7519..................................................................... Universal
Change to Internal V
Change to Equation.............................................................................26
Value ..............................................................5
REF
Function Description—Voltage Output.................................. 20
Functional Description—Analog Inputs................................. 23
ADC Transfer Function............................................................. 23
Functional Description—Measurement.................................. 25
ADT7516/ADT7517/ADT7519 Registers............................... 28
Serial Interface............................................................................ 37
SMBus Alert Response............................................................... 43
Outline Dimensions....................................................................... 44
Ordering Guide .......................................................................... 44
7/03—Initial Version: Rev. 0
Rev. A | Page 2 of 44
Page 3
ADT7516/ADT7517/ADT7519

SPECIFICATIONS

Table 1. Temperature range is as follows: A version: –40°C to +120°C. VDD = 2.7 V to 5.5 V, GND = 0 V, REFIN = 2.25 V, unless otherwise noted.
Parameter
DAC DC PERFORMANCE
ADT7519
ADT7517
ADT7516
ADC DC ACCURACY Max VDD = 5 V.
Resolution 10 Bits Total Unadjusted Error (TUE) 2 3 % of FSR Offset Error ±0.5 % of FSR
Gain Error ±2 % of FSR ADC BANDWIDTH DC Hz ANALOG INPUTS
Input Voltage Range 0 2.28 V AIN1 to AIN4. C4 = 0 in Control Configuration 3. 0 V
DC Leakage Current ±1 µA
Input Capacitance 5 20 pF
Input Resistance 10 MΩ THERMAL CHARACTERISTICS
INTERNAL TEMPERATURE SENSOR
Accuracy @ VDD = 3.3 V ±10% ±1.5 °C TA = 85°C. ±0.5 ±3 °C TA = 0°C to +85°C. ±2 ±5 °C TA = –40°C to +120°C.
Accuracy @ VDD = 5 V ±5% ±2 ±3 °C TA = 0°C to +85°C. ±3 ±5 °C TA = –40°C to +120°C.
Resolution 10 Bits Equivalent to 0.25°C.
Long-Term Drift 0.25 °C Drift over 10 years if part is operated at 55°C.
1
2, 3
Min Typ Max Unit Conditions/Comments
Resolution 8 Bits Relative Accuracy ±0.15 ±1 LSB Differential Nonlinearity ±0.02 ±0.25 LSB Guaranteed monotonic over all codes.
Resolution 10 Bits Relative Accuracy ±0.5 ±4 LSB Differential Nonlinearity ±0.05 ±0.5 LSB Guaranteed monotonic over all codes.
Resolution 12 Bits Relative Accuracy ±2 ±16 LSB Differential Nonlinearity ±0.02 ±0.9 LSB Guaranteed monotonic over all codes. Offset Error ±0.4 ±2 % of FSR Gain Error ±0.3 ±2 % of FSR Lower Deadband 20 65 mV
Lower deadband exists only if offset error is negative. See Figure 8.
Upper Deadband 60 100 mV
Upper deadband exists if V
= VDD and off-set
REF
plus gain error is positive. See Figure 9.
Offset Error Drift
4
–12 ppm of FSR/°C Gain Error Drift4 –5 ppm of FSR/°C DC Power Supply Rejection
4
Ratio
–60 dB ∆V
= ±10%.
DD
DC Crosstalk4 200 µV See Figure 5.
DD
V AIN1 to AIN4. C4 = 0 in Control Configuration 3.
Internal reference used. Averaging on.
Rev. A | Page 3 of 44
Page 4
ADT7516/ADT7517/ADT7519
Parameter
THERMAL CHARACTERISTICS
1
Min Typ Max Unit Conditions/Comments
External transistor = 2N3906.
EXTERNAL TEMPERATURE SENSOR
Accuracy @ VDD = 3.3 V ±10% ±1.5 °C TA = 85°C. ±3 °C T ±5 °C T
= 0°C +85°C.
A
= –40°C to +120°C.
A
Accuracy @ VDD = 5 V ±5% ±2 ±3 °C TA = 0°C +85°C. ±3 ±5 °C TA = –40°C to +120°C.
Resolution 10 Bits Equivalent to 0.25°C.
Output Source Current 180 µA High Level. 11 µA Low Level.
Thermal Voltage Output
8-Bit DAC Output
Resolution 1 °C
Scale Factor 8.97 mV/°C 0 V to V
17.58 mV/°C 0 V to 2 V
output. TA = –40°C to +120°C.
REF
output. TA = –40°C to +120°C.
REF
10-Bit DAC Output
Resolution 0.25 °C Scale Factor 2.2 mV/°C 0 V to V
4.39 mV/°C 0 V to 2 V
output. TA = –40°C to +120°C.
REF
output. TA = –40°C to +120°C.
REF
CONVERSION TIMES Single channel mode.
Slow ADC
VDD/AIN 11.4 ms Averaging (16 samples) on.
712 µs Averaging off.
Internal Temperature 11.4 ms Averaging (16 samples) on.
712 µs Averaging off.
External Temperature 24.22 ms Averaging (16 samples) on.
1.51 ms Averaging off.
Fast ADC
VDD/AIN 712 µs Averaging (16 samples) on.
44.5 µs Averaging off.
Internal Temperature 2.14 ms Averaging (16 samples) on.
134 µs Averaging off.
External Temperature 14.25 ms Averaging (16 samples) on. 890 µs Averaging off. ROUND ROBIN UPDATE RATE
Slow ADC @ 25°C
5
Time to complete one measurement cycle through all channels.
Averaging On 79.8 ms AIN1 and AIN2 are selected on Pins 7 and 8.
Averaging Off 4.99 ms AIN1 and AIN2 are selected on Pins 7 and 8.
Averaging On 94.76 ms D+ and D– are selected on Pins 7 and 8.
Averaging Off 9.26 ms D+ and D-– are selected on Pins 7 and 8.
Fast ADC @ 25°C
Averaging On 6.41 ms AIN1 and AIN2 are selected on Pins 7 and 8.
Averaging Off 400.84 µs AIN1 and AIN2 are selected on Pins 7 and 8.
Averaging On 21.77 ms D+ and D– are selected on Pins 7 and 8.
Averaging Off 3.07 ms D+ and D– are selected on Pins 7 and 8. DAC EXTERNAL REFERENCE INPUT4
V
Input Range 1 V
REF
V
Input Impedance >10 MΩ Buffered reference and power-down mode.
REF
DD
V Buffered reference.
Reference Feedthrough –90 dB Frequency = 10 kHz. Channel-to-Channel Isolation –75 dB Frequency = 10 kHz.
Rev. A | Page 4 of 44
Page 5
ADT7516/ADT7517/ADT7519
Parameter
1
Min Typ Max Unit Conditions/Comments
ON-CHIP REFERENCE
Reference Voltage4 2.28 V Temperature Coefficient4 80 ppm/°C
OUTPUT CHARACTERISTICS4
Output Voltage
6
0.001 VDD − 0.1 V
This is a measure of the minimum and maximum
drive capability of the output amplifier. DC Output Impedance 0.5 Short Circuit Current 25 mA VDD = 5 V.
16 mA VDD = 3 V.
Power-Up Time 2.5 µs Coming out of power-down mode. VDD = 5 V.
5 µs Coming out of power-down mode. VDD = 3.3 V. DIGITAL INPUTS4
Input Current ±1 µA VIN = 0 V to V
DD.
VIL, Input Low Voltage 0.8 V VIH, Input High Voltage 1.89 V Pin Capacitance 3 10 pF All digital inputs. SCL, SDA Glitch Rejection 50 ns
Input filtering suppresses noise spikes of less
than 50 ns. LDAC Pulse Width
20 ns Edge triggered input.
DIGITAL OUTPUT
Digital High Voltage, V Output Low Voltage, V Output High Current, I Output Capacitance, C
OH
OL
OH
OUT
INT/INT Output Saturation Voltage
I2C TIMING CHARACTERISTICS 7,
Serial Clock Period, t
1
8
2.4 V I
SOURCE
= I
= 200 µA.
SINK
0.4 V IOL = 3 mA. 1 mA V
= 5 V.
OH
50 pF
0.8 V I
= 4 mA.
OUT
2.5 µs Fast Mode I2C. See Figure 2. Data In Setup Time to SCL High, t250 ns Data Out Stable after SCL Low, t SDA Low Setup Time to SCL
Low (Start Condition), t
4
SDA High Hold Time after SCL High (Stop Condition), t
SDA and SCL Fall Time, t
5
6
SPI TIMING CHARACTERISTICS
CS to SCLK Setup Time, t SCLK High Pulse Width, t SCLK Low Pulse Width, t Data Access Time after SCLK
Falling Edge, t
10
,
4
1
2
3
Data Setup Time Prior to SCLK Rising Edge, t
5
Data Hold Time after SCLK Rising Edge, t
6
CS to SCLK Hold Time, t
7
CS to DOUT High Impedance, t
, 9
4
0 ns See Figure 2.
3
50 ns See Figure 2.
50 ns See Figure 2.
90 ns See Figure 2.
0 ns See Figure 3. 50 ns See Figure 3.
50 ns See Figure 3. 35 ns
20 ns See Figure 3.
0 ns See Figure 3.
0 µs See Figure 3. 40 ns See Figure 3.
8
Rev. A | Page 5 of 44
Page 6
ADT7516/ADT7517/ADT7519
T
Parameter
1
Min Typ Max Unit Conditions/Comments
POWER REQUIREMENTS
V
DD
2.7 5.5 V VDD Settling Time 50 ms VDD settles to within 10% of its final voltage level. IDD (Normal Mode)
11
3 mA V
= 3.3 V, VIH = VDD, and VIL = GND.
DD
2.2 3 mA VDD = 5 V, VIH = VDD, and VIL = GND. IDD (Power-Down Mode) 10 µA VDD = 3.3 V, VIH = VDD, and VIL = GND.
10 µA VDD = 5 V, VIH = VDD, and VIL = GND.
Power Dissipation 10 mW VDD = 3.3 V. Normal mode.
33 µW VDD = 3.3 V. Shutdown mode.
1
See the section. Terminology
2
DC specifications are tested with the outputs unloaded.
3
Linearity is tested using a reduced code range: ADT7516 (Code 115 to 4095); ADT7517 (Code 28 to 1023); ADT7519 (Code 8 to 255).
4
Guaranteed by design and characterization, not production tested.
5
Round robin is the continuous sequential measurement of the following channels: VDD, internal temperature, external temperature (AIN1, AIN2), AIN3, and AIN4.
6
For the amplifier output to reach its minimum voltage, the offset error must be negative. For the amplifier output to reach its maximum voltage (V
plus gain error must be positive.
7
The SDA and SCL timing is measured with the input filters turned on to meet the fast-mode I2C specification. Switching off the input filters improves the transfer rate
but has a negative effect on the EMC behavior of the part.
8
Guaranteed by design, not production tested.
9
All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD), and timed from a voltage level of 1.6 V.
10
Measured with the load circuit shown in Figure 4.
11
The IDD specification is valid for all DAC codes and full-scale analog input voltages. Interface inactive. All DACs and ADCs active. Load currents excluded.
= VDD), the offset
REF

DAC AC CHARACTERISTICS

Table 2. VDD = 2.7 V to 5.5 V, RL = 4.7 kΩ to GND; CL = 200 pF to GND; 4.7 kΩ to VDD; all specifications T otherwise noted.
Parameter
1, 2
Min Typ
Output Voltage Settling Time V
3
Max Unit Conditions/Comments
= VDD = 5 V.
REF
ADT7519 6 8 µs 1/4 scale to 3/4 scale change (40h to C0h). ADT7517 7 9 µs 1/4 scale to 3/4 scale change (100h to 300h). ADT7516 8 10 µs 1/4 scale to 3/4 scale change (400h to C00h).
Slew Rate 0.7 V/µs Major-Code Change Glitch Energy 12 nV-s 1 LSB change around major carry. Digital Feedthrough 0.5 nV-s Digital Crosstalk 1 nV-s Analog Crosstalk 0.5 nV-s DAC-to-DAC Crosstalk 3 nV-s Multiplying Bandwidth 200 kHz V Total Harmonic Distortion –70 dB V
= 2 V ±0.1 V p-p.
REF
= 2.5 V ±0.1 V p-p. Frequency = 10 kHz.
REF
1
See section. Terminology
2
Guaranteed by design and characterization, not production tested.
3
@ 25°C.
SCL
SDA
DATA IN
SDA
DATA OU
t
4
t
Figure 2. I
1
t
2
t
3
2
C Bus Timing Diagram
t
5
t
6
02883-A-002
MIN
to T
MAX
, unless
Rev. A | Page 6 of 44
Page 7
ADT7516/ADT7517/ADT7519
O
CS
t
1
SCLK
DIN
DOUT
D7
XXXXXXXXD7D6D5D4D3D2D1 D0
t
2
t
t
3
D6 D5 D4 D3 D2 D1 D0 X X X X X X X X
t
6
5
t
4
Figure 3. SPI Bus Timing Diagram
t
7
t
8
02883-A-003
200µAI
TO OUTPUT
PIN
C
L
50pF
200µAI
Figure 4. Load Circuit for Access Time and Bus Relinquish Time
OL
1.6V
OH
02883-A-004
V
DD
TO DAC
UTPUT
Figure 5. Load Circuit for DAC Outputs
4.7k
4.7k
200pF
02883-A-005
Rev. A | Page 7 of 44
Page 8
ADT7516/ADT7517/ADT7519

FUNCTIONAL BLOCK DIAGRAM

INTERNAL
TEMPERATURE
VALUE REGISTER
EXTERNAL
TEMPERATURE
VALUE REGISTER
A-TO-D
CONVERTER
V
DD
VALUE REGISTER
AIN1
VALUE REGISTER
AIN2
VALUE REGISTER
AIN3
VALUE REGISTER
AIN4
VALUE REGISTER
D+/AIN1 D–/AIN2
LDAC/AIN3
AIN4
7 8 9
14
ON-CHIP
TEMPERATURE
SENSOR
ANALOG
MUX
V
DD
SENSOR
COMPARATOR
DIGITAL MUX
LIMIT
STATUS
REGISTERS
ADDRESS POINTER
REGISTER
T
HIGH
REGISTERS
T
LOW
REGISTERS
VCCLIMIT
REGISTERS
AIN
DIGITAL MUX
SPI/SMBus INTERFACE
HIGH
REGISTERS
AIN
LOW
REGISTERS
CONTROL CONFIG. 1
REGISTER
CONTROL CONFIG. 2
REGISTER
CONTROL CONFIG. 3
REGISTER
DAC CONFIGURATION
REGISTERS
LDAC CONFIGURATION
REGISTERS
INTERRUPT MASK
REGISTERS
LIMIT
LIMIT
LIMIT
LIMIT
ADT7516/ADT7517/ADT7519
DAC A
REGISTERS
DAC B
REGISTERS
DAC C
REGISTERS
DAC D
REGISTERS
STRING
DAC A
STRING
DAC B
STRING
DAC C
STRING
DAC D
GAIN
SELECT
LOGIC
INTERNAL
REFERENCE
POWER-
DOWN LOGIC
16
15
10
2
1
V
OUT
V
OUT
V
OUT
V
OUT
INT/INT
-A
-B
-C
-D
12
5
6
GND
V
DD
13
4
SCL
CS
SDA
11
ADD
9
LDAC/AIN33V
REF
-IN
Figure 6.
02883-A-001
Rev. A | Page 8 of 44
Page 9
ADT7516/ADT7517/ADT7519

ABSOLUTE MAXIMUM RATINGS

Table 3.
Parameter Rating
VDD to GND –0.3 V to +7 V Analog Input Voltage to GND –0.3 V to VDD + 0.3 V Digital Input Voltage to GND –0.3 V to VDD + 0.3 V Digital Output Voltage to GND –0.3 V to VDD + 0.3 V Reference Input Voltage to GND –0.3 V to VDD + 0.3 V Operating Temperature Range –40°C to +120°C Storage Temperature Range –65°C to +150°C Junction Temperature 150°C 16-Lead QSOP Package
Power Dissipation Thermal Impedance θ
Junction-to-Ambient 105.44°C/W
JA
θ
Junction-to-Case 38.8°C/W
JC
IR Reflow Soldering Peak Temperature 220°C (0°C/5°C) Time at Peak Temperature 10 sec to 20 sec Ramp-Up Rate 2°C/sec to 3°C/sec Ramp-Down Rate –6°C/sec
1
2
(TJ max – TA)/θ
JA
Table 4. I
2
C Address Selection
ADD Pin I2C Address
Low 1001 000 Float 1001 010 High 1001 011
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
1
Values relate to package being used on a 4-layer board.
2
Junction-to-case resistance is applicable to components featuring a
preferential flow direction, e.g., components mounted on a heat sink. Junction-to-ambient resistance is more useful for air cooled PCB-mounted components.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. A | Page 9 of 44
Page 10
ADT7516/ADT7517/ADT7519

PIN CONFIGURATION AND FUNCTIONAL DESCRIPTIONS

-B
1
V
OUT
V
-A
2
OUT
V
REF
D+/AIN1 D–/AIN2
-IN CS
GND
V
DD
ADT7516/
3
ADT7517/ ADT7519
4
TOP VIEW
5
(Not to Scale)
6 7 8
Figure 7. Pin Configuration (QSOP Package)
Table 5. Pin Function Descriptions
Pin No.
Mnemonic Description
1 V 2 V 3 V 4
-B Buffered Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation.
OUT
-A Buffered Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation.
OUT
-IN Reference Input Pin for All Four DACs. This input is buffered and has an input range from 1 V to VDD.
REF
CS SPI Active Low Control Input. This is the frame synchronization signal for the input data. When CS goes low, it enables
the input register, and data is transferred in on the rising edges and out on the falling edges of the subsequent serial
clocks. It is recommended that this pin be tied high to V 5 GND Ground Reference Point for All Circuitry on the Part. Analog and digital ground. 6 VDD Positive Supply Voltage, 2.7 V to 5.5 V. The supply should be decoupled to ground. 7 D+/AIN1 D+. Positive Connection to External Temperature Sensor.
AIN1. Analog Input. Single-ended analog input channel. Input range is 0 V to 2.28 V or 0 V to V 8 D–/AIN2 D–. Negative Connection to External Temperature Sensor.
AIN2. Analog Input. Single-ended analog input channel. Input range is 0 V to 2.28 V or 0 V to V 9
LDAC/AIN3 LDAC. Active Low Control Input. Transfers the contents of the input registers to their respective DAC registers. A
falling edge on this pin forces any or all DAC registers to be updated if the input registers have new data. A minimum
pulse width of 20 ns must be applied to the
LDAC pin to ensure proper loading of a DAC register. This allows simul-
taneous update of all DAC outputs. Bit C3 of the Control Configuration 3 register enables the
LDAC pin controlling the loading of the DAC registers.
the
AIN3. Analog Input. Single-ended analog input channel. Input range is 0 V to 2.28 V or 0 V to V 10
11 DOUT/ADD
INT Over Limit Interrupt. The output polarity of this pin can be set to give an active low or active high interrupt when
INT/
temperature,V
, or AIN limits are exceeded. The default is active low. Open-drain output—needs a pull-up resistor.
DD
SPI Serial Data Output. Logic output. Data is clocked out of any register at this pin. Data is clocked out on the falling
edge of SCLK. Open-drain output—needs a pull-up resistor.
2
ADD. I
C Serial Bus Address Selection Pin. Logic input. A low on this pin gives the address 1001 000; leaving it floating gives the address 1001 010; and setting it high gives the address 1001 011. The I not latched by the device until after this address has been sent twice. On the eighth SCL cycle of the second valid communication, the serial bus address is latched in. Any subsequent changes on this pin will have no effect on the I serial bus address.
12 SDA/DIN
2
C Serial Data Input/Output. I2C serial data to be loaded into the part’s registers and read from these registers is
SDA. I provided on this pin. Open-drain configuration—needs a pull-up resistor.
DIN. SPI Serial Data Input. Serial data to be loaded into the part’s registers is provided on this pin. Data is clocked into a register on the rising edge of SCLK. Open-drain configuration—needs a pull-up resistor.
13 SCL/SCLK
Serial Clock Input. This is the clock input for the serial port. The serial clock is used to clock data out of any register of the ADT7516/ADT7517/ADT7519 and also to clock data into any register that can be written to. Open-drain configuration—needs a pull-up resistor.
14 AIN4 Analog Input. Single-ended analog input channel. Input range is 0 V to 2.28 V or 0 V to VDD. 15 V 16 V
-D Buffered Analog Output Voltage from DAC D. The output amplifier has rail-to-rail operation.
OUT
-C Buffered Analog Output Voltage from DAC C. The output amplifier has rail-to-rail operation.
OUT
V
-C
16
OUT
V
-D
15
OUT
14
AIN4
13
SCL/SCLK
12
SDA/DIN
11
DOUT/ADD
10
INT/INT
9
LDAC/AIN3
when operating the serial interface in I2C mode. -
DD
02883-A-006
2
C address set up by the ADD pin is
.
DD
.
DD
LDAC pin. Default is with
.
DD
2
C
Rev. A | Page 10 of 44
Page 11
ADT7516/ADT7517/ADT7519

TERMINOLOGY

Relative Accuracy

Relative accuracy or integral nonlinearity (INL) is a measure of the maximum deviation, in LSBs, from a straight line passing through the endpoints of the transfer function. Typical INL versus code plots can be seen in Figure 10, Figure 11, and Figure 12.

Differential Nonlinearity

Differential nonlinearity (DNL) is the difference between the measured change and the ideal 1 LSB change between any two adjacent codes. A specified differential nonlinearity of ±0.9 LSB maximum ensures monotonicity. Typical DAC DNL versus code plots can be seen in Figure 13, Figure 14, and Figure 15.

Total Unadjusted Error (TUE)

Total unadjusted error is a comprehensive specification that includes the sum of the relative accuracy error, gain error, and offset error under a specified set of conditions.

Offset Error

This is a measure of the offset error of the DAC and the output amplifier (See Figure 8 and Figure 9). It can be negative or positive, and it is expressed in mV.

Offset Error Match

This is the difference in offset error between any two channels.

Gain Error

This is a measure of the span error of the DAC. It is the deviation in slope of the actual DAC transfer characteristic from the ideal expressed as a percentage of the full-scale range.

Gain Error Match

This is the difference in gain error between any two channels.

Offset Error Drift

This is a measure of the change in offset error with changes in temperature. It is expressed in (ppm of full-scale range)/°C.

Gain Error Drift

This is a measure of the change in gain error with changes in temperature. It is expressed in (ppm of full-scale range)/°C.

Long Term Temperature Drift

This is a measure of the change in temperature error with the passage of time. It is expressed in °C. The concept of long-term stability has been used for many years to describe the amount an IC’s parameter would shift during its lifetime. This is a concept that has typically been applied to both voltage references and monolithic temperature sensors. Unfortunately, integrated circuits cannot be evaluated at room temperature (25°C) for 10 years or so to determine this shift. Manufacturers perform accelerated lifetime testing of integrated circuits by operating ICs at elevated temperatures (between 125°C and 150°C) over a shorter period (typically between 500 and 1000
hours). As a result, the lifetime of an integrated circuit is significantly accelerated due to the increase in rates of reaction within the semiconductor material.

DC Power Supply Rejection Ratio (PSRR)

This indicates how the output of the DAC is affected by changes in the supply voltage. PSRR is the ratio of the change in V a change in V in dB. V
for full-scale output of the DAC. It is measured
DD
is held at 2 V and VDD is varied ±10%.
REF
OUT
to

DC Crosstalk

This is the dc change in the output level of one DAC in response to a change in the output of another DAC. It is measured with a full-scale output change on one DAC while monitoring another DAC. It is expressed in µV.

Reference Feedthrough

This is the ratio of the amplitude of the signal at the DAC output to the reference input when the DAC output is not being updated (i.e., LDAC is high). It is expressed in dB.

Channel-to-Channel Isolation

This is the ratio of the amplitude of the signal at the output of one DAC to a sine wave on the reference input of another DAC. It is measured in dB.

Major-Code Transition Glitch Energy

Major-code transition glitch energy is the energy of the impulse injected into the analog output when the code in the DAC register changes state. It is normally specified as the area of the glitch in nV-s and is measured when the digital code is changed by 1 LSB at the major carry transition (011 . . . 11 to 100 . . . 00 or 100 . . . 00 to 011 . . . 11).

Digital Feedthrough

Digital feedthrough is a measure of the impulse injected into the analog output of a DAC from the digital input pins of the device but is measured when the DAC is not being written to. It is specified in nV-s and is measured with a full-scale change on the digital input pins, i.e., from all 0s to all 1s or vice versa.

Digital Crosstalk

This is the glitch impulse transferred to the output of one DAC at midscale in response to a full-scale code change (all 0s to all 1s and vice versa) in the input register of another DAC. It is measured in standalone mode and is expressed in nV-s.

Analog Crosstalk

This is the glitch impulse transferred to the output of one DAC due to a change in the output of another DAC. It is measured by loading one of the input registers with a full-scale code change (all 0s to all 1s and vice versa) while keeping
LDAC
pulse digital code was not changed. The area of the glitch is expressed in nV-s.
low and monitor the output of the DAC whose
LDAC
high. Then
Rev. A | Page 11 of 44
Page 12
ADT7516/ADT7517/ADT7519

DAC-to-DAC Crosstalk

This is the glitch impulse transferred to the output of one DAC due to a digital code change and subsequent output change of another DAC. This includes both digital and analog crosstalk. It is measured by loading one of the DACs with a full-scale code
LDAC
change (all 0s to all 1s and vice versa) with monitoring the output of another DAC. The energy of the glitch is expressed in nV-s.

Multiplying Bandwidth

The amplifiers within the DAC have a finite bandwidth. The multiplying bandwidth is a measure of this. A sine wave on the reference (with full-scale code loaded to the DAC) appears on the output. The multiplying bandwidth is the frequency at which the output amplitude falls to 3 dB below the input.

Total Harmonic Distortion

This is the difference between an ideal sine wave and its attenuated version using the DAC. The sine wave is used as the reference for the DAC, and the THD is a measure of the harmonics present on the DAC output, expressed in dB.

Round Robin

This term is used to describe the ADT7516/ADT7517/ ADT7519 cycling through the available measurement channels in sequence, taking a measurement on each channel.

DAC Output Settling Time

This is the time required, following a prescribed data change, for the output of a DAC to reach and remain within ±0.5 LSB of the final value. A typical prescribed change is from 1/4 scale to 3/4 scale.
low and
OUTPUT
VOLTAGE
NEGATIVE
OFFSET
ERROR
AMPLIFIER
FOOTROOM
NEGATIVE
OFFSET
ERROR
LOWER
DEADBAND
CODES
DAC CODE
Figure 8. DAC Transfer Function with Negative Offset
OUTPUT
VOLTAGE
POSITIVE
OFFSET
ERROR
DAC CODE FULL SCALE
Figure 9. DAC Transfer Function with Positive Offset (V
GAIN ERROR
OFFSET ERROR
ACTUAL IDEAL
GAIN ERROR
OFFSET ERROR
UPPER DEADBAND CODES
ACTUAL IDEAL
+
02883-A-007
+
02883-A-008
= VDD)
REF
Rev. A | Page 12 of 44
Page 13
ADT7516/ADT7517/ADT7519

TYPICAL PERFORMANCE CHARACTERISTICS

0.20
0.15
0.10
0.05
0
–0.05
INL ERROR (LSB)
–0.10
–0.15
–0.20
0 50 100 150 200 250
DAC CODE
02883-A-009
0.10
0.08
0.06
0.04
0.02
0
–0.02
DNL ERROR (LSB)
–0.04
–0.06
–0.08
–0.10
0 50 100 150 200 250
DAC CODE
02883-A-012
Figure 10. ADT7519 Typical DAC INL Plot
0.6
0.4
0.2
0
INL ERROR (LSB)
–0.2
–0.4
–0.6
0 200 400 600
Figure 11. ADT7517 Typical DAC INL Plot
2.5
2.0
1.5
1.0
0.5
0
–0.5
INL ERROR (LSB)
–1.0
–1.5
–2.0
–2.5
Figure 12. ADT7516 Typical DAC INL Plot
DAC CODE
800 1000
20001500500 10000 2500 3000 3500 4000
DAC CODE
Figure 13. ADT7519 Typical DAC DNL Plot
0.3
0.2
0.1
0
–0.1
DNL ERROR (LSB)
–0.2
02883-A-010
–0.3
0 200 400 600 800 1000
DAC CODE
02883-A-013
Figure 14. ADT7517 Typical DAC DNL Plot
1.0
0.8
0.6
0.4
0.2
0
–0.2
DNL ERROR (LSB)
–0.4
–0.6
–0.8
02883-A-011
–1.0
20001500500 10000 2500 3000 3500 4000
DAC CODE
02883-A-014
Figure 15. ADT7516 Typical DAC DNL Plot
Rev. A | Page 13 of 44
Page 14
ADT7516/ADT7517/ADT7519
0.30
10
0.25
0.20
0.15
0.10
0.05
ERROR (LSB)
0
–0.05
–0.10
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 16. ADT7519 DAC INL and DNL Error vs. V
0.14
0.12
0.10
0.08
0.06
0.04
0.02
ERROR (LSB)
0
–0.02
–0.04
–0.06
–40 110805020–10
INL WCP
INL WCN
DNL WCP
DNL WCN
TEMPERATURE (°C)
INL WCP
DNL WCP
DNL WCN
INL WCN
V
(V)
REF
REF
Figure 17. ADT7519 DAC INL Error and DNL Error vs. Temperature
5
0
–5
ERROR (LSB)
–10
–15
02883-A-015
–20
2.7 3.3 3.6 4.0
GAIN ERROR
Figure 19. DAC Offset Error and Gain Error vs. V
2.505
2.500
2.495
2.490
2.485
2.480
DAC OUTPUT (V)
2.475
VDD=5V
=5V
V
REF
DAC OUTPUT
2.470
02883-A-016
LOADED TO MIDSCALE
2.465 0123
Figure 20. DAC V
Source and Sink Current Capability
OUT
OFFSET ERROR
V
(V)
DD
SOURCE CURRENT
CURRENT (mA)
V
= 2.25V
REF
4.5 5.0
SINK CURRENT
45
02883-A-018
5.5
DD
02883-A-019
6
0
–0.2
–0.4
–0.6
–0.8
–1.0
ERROR (LSB)
–1.2
–1.4
–1.6
–1.8
–40 120100806040200–20
OFFSET ERROR
GAIN ERROR
TEMPERATURE (°C)
Figure 18. DAC Offset Error and Gain Error vs. Temperature
02883-A-017
Rev. A | Page 14 of 44
ERROR (LSB)
–0.2
–0.4
–0.6
–0.8
–1.0
–1.2
–1.4
–1.6
–1.8
0
–40 120100806040200–20
TEMPERATURE (
Figure 21. Supply Current vs. DAC Code
OFFSET ERROR
GAIN ERROR
°
C)
02883-A-017
Page 15
ADT7516/ADT7517/ADT7519
2.00 ADC OFF
DAC OUTPUTS AT 0V
1.95
1.90
(mA)
CC
I
1.85
1.80
1.75
2.7 3.1 3.5 3.9 4.3 4.7 5.12.9 3.3 3.7 4.1 4.5 4.9 5.3 5.5 (V)
V
CC
02883-A-021
1.8
1.6
1.4
1.2
1.0
0.8
DAC OUTPUT (V)
0.6
0.4
0.2 0
024
68
TIME (µs)
02883-A-024
10
Figure 22. Supply Current vs. Supply Voltage @ 25°C
7
6
5
4
(mA)
CC
I
3
2
1
0
2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5 (V)
V
CC
Figure 23. Power-Down Current vs. Supply Voltage @ 25°C
4.0
3.5
3.0
2.5
2.0
1.5
DAC OUTPUT (V)
1.0
0.5
0
02 4681
TIME (µs)
02883-A-022
02883-A-023
0
Figure 25. Exiting Power-Down to Midscale
0.4700
0.4695
0.4690
0.4685
0.4680
0.4675
0.4670
DAC OUTPUT (V)
0.4665
0.4660
0.4655
0.4650 02 46810
TIME (µs)
Figure 26. ADT7516 DAC Major Code Transition Glitch Energy;
011…11 to 100...00
0.4730
0.4725
0.4720
0.4715
0.4710
0.4705
DAC OUTPUT (V)
0.4700
0.4695
0.4690
0.4685 02 46810
TIME (µs)
02883-A-025
02883-A-026
Figure 24. DAC Half-Scale Settling (1/4 to 3/4 Scale Code Change)
Figure 27. ADT7516 DAC Major Code Transition Glitch Energy;
100…00 to 011…11
Rev. A | Page 15 of 44
Page 16
ADT7516/ADT7517/ADT7519
0
–2
–4
VDD=5V T
A
=25°C
0
±100mV RIPPLE ON V V
= 2.25V
REF
–10
= 3.3V
V
DD
TEMPERATURE = 25°C
–20
CC
–6
–8
FULL-SCALE ERROR (mV)
–10
–12
12 3
V
(V)
REF
Figure 28. DAC Full-Scale Error vs. V
2.329 VDD= 5V
V
= 5V
REF
2.328
DAC OUTPUT LOADED TO MIDSCALE
2.327
2.326
2.325
DAC OUTPUT (V)
2.324
2.323
2.322
012 34
TIME (µs)
45
02883-A-027
REF
02883-A-028
5
–30
AC PSRR (dB)
–40
–50
–60
1 10 100
FREQUENCY (kHz)
02883-A-030
Figure 31. PSRR vs. Supply Ripple Frequency
1.5 EXTERNAL TEMPERATURE @ 5V
1.0
C)
°
0.5
0
TEMPERATURE ERROR (
–0.5
–1.0
INTERNAL TEMPERATURE @ 3.3V
INTERNAL TEMPERATURE @ 5V
–30 0 40 85 120
EXTERNAL TEMPERATURE @ 3.3V
TEMPERATURE (°C)
02883-A-031
Figure 29. DAC-to-DAC Crosstalk
1.0
0.8
0.6
0.4
0.2
0
–0.2
INL ERROR (LSB)
–0.4
–0.6
–0.8
–1.0
0 200 400 600 800 1000
Figure 30. ADC INL with Ref = V
ADC CODE
(3.3 V)
DD
02883-A-029
Rev. A | Page 16 of 44
Figure 32. Internal Temperature Error @ 3.3 V and 5 V
3
=3.3V
V
DD
2
1
0
–1
ERROR (LSB)
–2
–3
–4
–40 –20 0
OFFSET ERROR
GAIN ERROR
20 40 60 80 100 120
TEMPERATURE (°C)
Figure 33. ADC Offset Error and Gain Error vs. Temperature
02883-A-032
Page 17
ADT7516/ADT7517/ADT7519
3
2
1
0
ERROR (LSB)
–1
–2
–3
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
OFFSET ERROR
GAIN ERROR
VDD (V)
02883-A-033
10
VDD = 3.3V COMMON-MODE
8
VOLTAGE = 100mV
6
4
2
0
–2
TEMPERATURE ERROR (°C)
–4
–6
1 100 200 300 400 500 600
NOISE FREQUENCY (Hz)
02883-A-036
Figure 34. ADC Offset Error and Gain Error vs. V
15
10
5
D+ TO GND
0
–5
D+ TO V
CC
–10
–15
TEMPERATURE ERROR (°C)
–20
–25
01020
30 40 50 60 70 80 90 100
PCB LEAKAGE RESISTANCE (M)
VDD=3.3V TEMPERATURE = 25°C
DD
Figure 35. External Temperature Error vs. PCB Leakage Resistance
0
–10
–20
VDD=3.3V
Figure 37. External Temperature Error vs. Common-Mode Noise Frequency
70
60
50
40
30
20
10
TEMPERATURE ERROR (°C)
0
02883-A-034
–10
1 100 200
NOISE FREQUENCY (MHz)
VDD = 3.3V DIFFERENTIAL-MODE VOLTAGE = 100mV
300 400 500 600
02883-A-037
Figure 38. External Temperature Error vs. Differential-Mode Noise Frequency
0.6 VDD = 3.3V
0.4
0.2
–30
–40
TEMPERATURE ERROR (°C)
–50
–60
0 5 10 15 20 25
CAPACITANCE (nF)
30 35 40 45 50
02883-A-035
Figure 36. External Temperature Error vs. Capacitance between D+ and D–
Rev. A | Page 17 of 44
0
–0.2
TEMPERATURE ERROR (°C)
–0.4
–0.6
1 100 200 300 400 500 600
±250mV
02883-A-038
NOISE FREQUENCY (Hz)
Figure 39. Internal Temperature Error vs. Power Supply Noise Frequency
Page 18
ADT7516/ADT7517/ADT7519
140
120
C)
100
°
EXTERNAL TEMPERATURE
80
INTERNAL TEMPERATURE
0
–5
–10
60
TEMPERATURE (
40
E
R
O
F
U
T
P
A
E
R
E
M
20
0
0
T E C
10 20
O
R
NME
V
I
N
G
ED
H
N
A
H
30 40 50
TIME (s)
T
N
E
R
E
02883-A-039
60
Figure 40. Temperature Sensor Response to Thermal Shock
–15
ATTENUATION (dB)
–20
–25
10 100 1k 10k 100k 1M 10M
1
FREQUENCY (Hz)
02883-A-040
Figure 41. DAC Multiplying Bandwidth (Small Signal Frequency Response)
Rev. A | Page 18 of 44
Page 19
ADT7516/ADT7517/ADT7519

THEORY OF OPERATION

Directly after the power-up calibration routine, the ADT7516/ ADT7517/ADT7519 go into idle mode. In this mode, the devices are not performing any measurements and are fully powered up. All four DAC outputs are at 0 V.
To begin monitoring, write to the Control Configuration 1 register (Address 18h) and set Bit C0 = 1. The ADT7516/ ADT7517/ADT7519 go into their power-up default measure­ment mode, which is round robin. The devices proceed to take measurements on the V
channel, internal temperature sensor
DD
channel, external temperature sensor channel, or AIN1 and AIN2, AIN3, and finally AIN4. Once they finish taking measurements on the AIN4 channel, the devices immediately loop back to start taking measurements on the V
channel and
DD
repeats the same cycle as before. This loop continues until the monitoring is stopped by resetting Bit C0 of the Control Configuration 1 register to 0.
It is also possible to continue monitoring as well as switching to single-channel mode by writing to the Control Configuration 2 register (Address 19h) and setting Bit C4 = 1. Further explana­tion of the single-channel and round robin measurement modes is given in later sections. All measurement channels have averaging enabled on them on power-up. Averaging forces the devices to take an average of 16 readings before giving a final measured result. To disable averaging and consequently decrease the conversion time by a factor of 16, set Bit C5 = 1 in the Control Configuration 2 register.
There are four single-ended analog input channels on the ADT7516/ADT7517/ADT7519: AIN1 to AIN4. AIN1 and AIN2 are multiplexed with the external temperature sensor terminals D+ and D–. Bits C1 and C2 of the Control Configuration 1 register (Address 18h) are used to select between AIN1/AIN2 and the external temperature sensor. The input range on the analog input channels is dependent on whether the ADC reference used is the internal V specifications, it is recommended that the maximum V
or VDD. To meet line arity
REF
DD
value is 5 V. Bit C4 of the Control Configuration 3 register is used to select between the internal reference or V
as the analog inputs’
DD
ADC reference.
Controlling the DAC outputs can be done by writing to the DACs’ MSB and LSB registers (Addresses 10h to 17h). The power-up default setting is to have a low going pulse on the
pin (Pin 9) controlling the updating of the DAC outputs
LDAC from the DAC registers. Alternatively, one can configure the updating of the DAC outputs to be controlled by means other
than the
pin by setting Bit C3 = 1 of the Control
LDAC Configuration 3 register (Address 1Ah). The DAC Configur­ation register (Address 1Bh) and the LDAC Configuration register (Address 1Ch) can now be used to control the DAC updating. These two registers also control the output range of
the DACs and selecting between the internal or external refer­ence. DAC A and DAC B outputs can be configured to give a voltage output proportional to the temperature of the internal and external temperature sensors, respectively.
2
The dual serial interface defaults to the I
C protocol on power­up. To select and lock in the SPI protocol, follow the selection process as described in the Serial Interface Selection section.
2
C protocol cannot be locked in, while the SPI protocol
The I is automatically locked in on selection. The interface can be
2
switched back to be I off and on. When using I
or GND.
V
DD
C on selection when the device is powered
2
C, the CS pin should be tied to either
There are a number of different operating modes on the ADT7516/ADT7517/ADT7519 devices and all of them can be controlled by the configuration registers. These features consist of enabling and disabling interrupts, polarity of the INT/
INT
pin, enabling and disabling the averaging on the measurement channels SMBus timeout and software reset.

POWER-UP CALIBRATION

It is recommended that no communication to the part be ini­tiated until approximately 5 ms after V
has settled to within
DD
10% of its final value. It is generally accepted that most systems take a maximum of 50 ms to power up. Power-up time is directly related to the amount of decoupling on the voltage supply line.
During the 5 ms after V
has settled, the part is performing a
DD
calibration routine. Any communication to the device during calibration will interrupt this routine, and could cause erro­neous temperature measurements. If it is not possible to have
at its nominal value by the time 50 ms has elapsed or if
V
DD
communication to the device has started prior to V is recommended that a measurement be taken on the V nel before a temperature measurement is taken. The V
settling, it
DD
chan-
DD
DD
measurement is used to calibrate out any temperature measure­ment error due to different supply voltage values.

CONVERSION SPEED

The internal oscillator circuit used by the ADC has the capa­bility to output two different clock frequencies. This means that the ADC is capable of running at two different speeds when doing a conversion on a measurement channel. Thus, the time taken to perform a conversion on a channel can be reduced by setting Bit C0 of the Control Configuration 3 register (Address 1Ah). This increases the ADC clock speed from 1.4 kHz to 22 kHz. At the higher clock speed, the analog filters on the D+ and D– input pins (external temperature sensor) are switched off. This is why the power-up default setting is to have the ADC working at the slow speed. The typical times for fast and slow ADC speeds are given in the specifications.
Rev. A | Page 19 of 44
Page 20
ADT7516/ADT7517/ADT7519
V
The ADT7516/ADT7517/ADT7519 power up with averaging on. This means every channel is measured 16 times and internally averaged to reduce noise. The conversion time can also be sped up by turning off the averaging. This is done by setting Bit C5 of the Control Configuration 2 register (Address 19h) to 1.

FUNCTION DESCRIPTION—VOLTAGE OUTPUT

Digital-to-Analog Converters

The ADT7516/ADT7517/ADT7519 have four resistor string DACs fabricated on a CMOS process with resolutions of 12, 10, and 8 bits, respectively. They contain four output buffer ampli­fiers and are written to via I face. See the Serial Interface section for more information.
The ADT7516/ADT7517/ADT7519 operate from a single sup­ply of 2.7 V to 5.5 V, and the output buffer amplifiers provide rail-to-rail output swing with a slew rate of 0.7 V/µs. All four DACs share a common reference input, V input is buffered to draw virtually no current from the reference source because it offers the source a high impedance input. The devices have a power-down mode in which all DACs may be turned off completely with a high impedance output.
Each DAC output will not be updated until it receives the LDAC command. Therefore, while the DAC registers would have been written to with a new value, this value will not be represented by a voltage output until the DACs have received the LDAC command. Reading back from any DAC register prior to issuing an LDAC command will result in the digital value that corresponds to the DAC output voltage. Thus, the digital value written to the DAC register cannot be read back until after the LDAC command has been initiated. This LDAC command can be given by either pulling the
(falling edge loads DACs), setting up Bits D4 and D5 of the DAC configuration register (Address 1Bh), or using the LDAC register (Address 1Ch).
When using the
LDAC
the low going pulse width should be 20 ns minimum. The
pin has to go high and low again before the DAC
LDAC registers can be reloaded.

Digital-to-Analog Section

The architecture of one DAC channel consists of a resistor string DAC followed by an output buffer amplifier. The voltage at the V
-IN pin or the on-chip reference of 2.28 V provides
REF
the reference voltage for the corresponding DAC. Figure 42 shows a block diagram of the DAC architecture. Since the input coding to the DAC is straight binary, the ideal output voltage is given by
DV
×
V
OUT
REF
=
N
2
2
C serial interface or SPI serial inter-
-IN. The reference
REF
pin low
LDAC
pin to control the DAC register loading,
where: D = decimal equivalent of the binary code that is loaded to the DAC register:
0 to 255 for ADT7519 (8 bits) 0 to 1023 for ADT7517 (10 bits) 0 to 4095 for ADT7516 (12 bits) N = DAC resolution

Resistor String

The resistor string section is shown in Figure 43. It is simply a string of resistors, each of approximately 603 Ω. The digital code loaded to the DAC register determines at which node on the string the voltage is tapped off to be fed into the output amplifier. The voltage is tapped off by closing one of the switches connecting the string to the amplifier. Because it is a string of resistors, it is guaranteed monotonic.
V
-IN
REF
REFERENCE BUFFER
INT V
INPUT
REGISTER
REF
DAC
REGISTER
Figure 42. Single DAC Channel Architecture
R
R
R
R
R
Figure 43. Resistor String
2.28V
INTERNAL
Figure 44. DAC Reference Buffer Circuit
REF
RESISTOR
STRING
(GAIN = 1 OR 2)
OUTPUT BUFFER
TO OUTPUT AMPLIFIER
V
REF
STRING
DAC A
STRING
DAC B
STRING
DAC C
STRING
DAC D
GAIN MODE
AMPLIFIER
02883-A-042
-IN
02883-A-043
V
-A
OUT
02883-A-041
Rev. A | Page 20 of 44
Page 21
ADT7516/ADT7517/ADT7519
V

DAC Reference Inputs

There is an input reference pin for the DACs. This reference input is buffered (see Figure 44).
The advantage with the buffered input is the high impedance it presents to the voltage source driving it. The user can have an external reference voltage as low as 1 V and as high as V
DD
. The
restriction of 1 V is due to the footroom of the reference buffer.
LDAC
The
configuration register controls the option to select between internal and external voltage references. The default setting is for external reference selected.

Output Amplifier

The output buffer amplifier can generate output voltages to within 1 mV of either rail. Its actual range depends on the value
, gain, and offset error.
of V
REF
If a gain of 1 is selected (Bits 0 to 3 of the DAC configuration register = 0), the output range is 0.001 V to V
REF
.
If a gain of 2 is selected (Bits 0 to 3 of the DAC configuration register = 1), the output range is 0.001 V to 2 V
. Be cause
REF
of clamping, however, the maximum output is limited to
– 0.001 V.
V
DD
The output amplifier can drive a load of 4.7 kΩ to GND or V in parallel with 200 pF to GND or V
(see Figure 5). The
DD
DD
source and sink capabilities of the output amplifier can be seen in the plot of Figure 20.
The slew rate is 0.7 V/µs with a half-scale settling time to ±0.5 LSB (at 8 bits) of 6 µs.

Thermal Voltage Output

The ADT7516/ADT7517/ADT7519 can output voltages that are proportional to temperature. DAC A output can be configured to represent the temperature of the internal sensor while DAC B output can be configured to represent the external temperature sensor. Bits C5 and C6 of the Control Configuration 3 register select the temperature proportional output voltage. Each time a temperature measurement is taken, the DAC output is updated. The output resolution for the ADT7519 is 8 bits with 1°C change corresponding to 1 LSB change. The output resolution for the ADT7516 and ADT7517 are capable of 10 bits with
OPTIONAL CAPACITOR, UP TO 3nF MAX. CAN BE ADDED TO IMPROVE HIGH FREQUENCY NOISE REJECTION IN NOISY ENVIRONMENTS
REMOTE
SENSING
TRANSISTOR
(2N3906)
Figure 45. Signal Conditioning for External Diode Temperature Sensor
D+ C1
D–
LOW-PASS
FILTER
f
= 65kHz
C
,
I N × I I
0.25°C change corresponding to 1 LSB change. The default output resolution for the ADT7516 and ADT7517 is 8 bits. To increase this to 10 bits, set C1 = 1 in the Control Configuration 3 register. The default output range is 0 V to V increased to 0 V to 2 V
can be done by setting D0 = 1 for DAC A (internal temp-
2 V
REF
. Increasing the output voltage span to
REF
REF
erature sensor) and D1 = 1 for DAC B (external temperature sensor) in the DAC configuration register (Address 1Bh).
The output voltage is capable of tracking a maximum temp­erature range of –128°C to +127°C, but the default setting is –40°C to +127°C. If the output voltage range is 0 V to V
-IN = 2.25 V), then this corresponds to 0 V representing
(V
REF
–40°C, and 1.48 V representing +127°C. This, of course, will give an upper deadband between 1.48 V and V
REF
The internal and external analog temperature offset registers can be used to vary this upper deadband and, consequently, the temperature that 0 V corresponds to. Table 6 and Table 7 give examples of how this is done using a DAC output voltage span of V
and 2 V
REF
, respectively. Simply write in the temperature
REF
value, in twos complement format, at which 0 V is to start. For example, if using the DAC A output and 0 V to start at –40°C, program D8h into the internal analog temperature offset reg­ister (Address 21h). This is an 8-bit register and has a temp­erature offset resolution of only 1°C for all device models. Use the formulas following the tables to determine the value to program into the offset registers.
Table 6. Thermal Voltage Output (0 V to V
REF
)
O/P Voltage (V) Default °C Max °C Sample °C
0 –40 –128 0
0.5 +17 –71 +56 1 +73 –15 +113
1.12 +87 –1 +127
1.47 +127 +39
1.5 2
2.25
UDB UDB UDB
+42 +99
+127
Upper deadband has been reached. DAC output is not capable of
increasing. See Fig . ure 9
DD
BIAS
V
OUT+
TO ADC
BIAS
DIODE
V
OUT–
02883-A-044
and this can be
-IN
REF
.
UDB UDB UDB UDB
Rev. A | Page 21 of 44
Page 22
ADT7516/ADT7517/ADT7519
(
)
()(
)
÷=−
(
I N × I I
INTERNAL
SENSE
TRANSISTOR
Figure 46. Top Level Structure of Internal Temperature Sensor
BIAS
DIODE
Table 7. Thermal Voltage Output (0 V to 2V
REF
)
O/P Voltage (V) Default °C Max °C Sample °C
0 –40 –128 0
0.25 –26 –114 +14
0.5 +12 –100 +28
0.75 +3 –85 +43 1 +17 –71 +57
1.12 +23 –65 +63
1.47 +43 –45 +83
1.5 +45 –43 +85 2 +73 –15 +113
2.25 +88 0 +127
2.5 +102 +14
2.75 +116 +28 3
3.25
3.5
3.75 4
4.25
4.5
UDB UDB UDB UDB UDB UDB UDB
+42 +56 +70 +85 +99 +113 +127
UDB UDB UDB UDB UDB UDB UDB UDB UDB
Negative temperatures:
()
1280 += TempVdCodeRegisterOffset
where: D7 of Offset Register Code is set to 1 for negative temperatures.
Example:
()
()
58hd dCodeRegisterOffset ==+= 8812840
Since a negative temperature has been inserted into the equation, DB7 (MSB) of the offset register code is set to 1. Therefore 58h becomes D8h.
58h + DB7(1) = D8h
Positive temperatures: Offset Register Code (d) = 0 V Temp
Example: Offset Register Code (d) = 10d = 0Ah
BIAS
V
DD
V
OUT+
TO ADC
V
OUT–
02883-A-045
The following equation is used to work out the various temperatures for the corresponding 8-bit DAC output:
TempVLSBPODACTempBit 01/8 +
For example, if the output is 1.5 V, V has an LSB size = 2.25 V/256 = 8.79 × 10
-IN = 2.25 V, 8-bit DAC
REF
–3
, and 0 V temp is at
–128°C, then the resultant temperature is
3
)
()
C°+=+×÷
431281079.85.1
The following equation is used to work out the various temperatures for the corresponding 10-bit DAC output:
10-Bit Temp = ((DAC O/P ÷ 1 LSB) × 0.25) + (0 V Temp)
For example, if the output is 0.4991 V, V DAC has an LSB size = 2.25 V/1024 = 2.197 × 10
-IN = 2.25 V, 10-bit
REF
–3
, and 0 V
temp is at –40°C, then the resulting temperature is
–3
(((0.4991 ÷ 2.197 × 10
) × 0.25) + (–40) = +16.75°C
Figure 47 shows a graph of the DAC output versus temperature for a V
-IN = 2.25 V.
REF
2.25
2.10
1.95
1.80
1.65
1.50
1.35
1.20
1.05
0.90
DAC OUTPUT (V)
0.75
0.60
0.45
0.30
0.15 0
–128–110 –90 –70 –50 –30 –10 10 30 50 70 90 110 127
Figure 47. DAC Output vs. Temperature V
TEMPERATURE (°C)
0V = –128°C
0V = –40°C
REF
0V = 0°C
-IN = 2.25 V
02883-A-046
Rev. A | Page 22 of 44
Page 23
ADT7516/ADT7517/ADT7519
A
A
=

FUNCTIONAL DESCRIPTION—ANALOG INPUTS

Single-Ended Inputs

The ADT7516/ADT7517/ADT7519 offer four single-ended analog input channels. The analog input range is from 0 V to
2.28 V, or 0 V to V recommended that the maximum V Selection between the two input ranges is done by Bit C4 of the Control Configuration 3 register (Address 1Ah). Setting this bit to 0 sets up the analog input ADC reference to be sourced from the internal voltage reference of 2.28 V. Setting the bit to 1 sets up the ADC reference to be sourced from V
The ADC resolution is 10 bits and is mostly suitable for dc input signals. Bits C1:2 of the Control Configuration 1 register (Address 18h) are used to set up Pins 7 and 8 as AIN1 and AIN2. Figure 48 shows the overall view of the 4-channel analog input path.
AIN1
AIN2
AIN3
AIN4

Converter Operation

The analog input channels use a successive approximation ADC based on a capacitor DAC. Figure 49 and Figure 50 show sim­plified schematics of the ADC. Figure 49 shows the ADC during acquisition phase. SW2 is closed and SW1 is in Position A. The comparator is held in a balanced condition and the sampling capacitor acquires the signal on AIN.
IN
REF/2
IN
REF/2
. To maintain the linearity specification, it is
DD
value be set at 5 V.
DD
.
DD
M
U L T
I P L E X E R
10-BIT
ADC
TO ADC VALUE REGISTER
Figure 48. Quad Analog Input Path
INT V
REF
A
SW1
SAMPLING
CAPACITOR
B
SW2
ACQUISITION
PHASE
COMPARATOR
CAP DAC
CONTROL
LOGIC
REF
Figure 49. ADC Acquisition Phase
INT V
REF
A
SW1
SAMPLING
CAPACITOR
B
SW2
CONVERSION
PHASE
COMPARATOR
CAP DAC
CONTROL
LOGIC
REF
Figure 50. ADC Conversion Phase
02883-A-047
V
DD
02883-A-048
V
DD
02883-A-049
When the ADC eventually goes into conversion phase (see Figure 50), SW2 opens and SW1 moves to position B, causing the comparator to become unbalanced. The control logic and the DAC are used to add and subtract fixed amounts of charge from the sampling capacitor to bring the comparator back into a balanced condition. When the comparator is rebalanced, the conversion is complete. The control logic generates the ADC output code. Figure 51 shows the ADC transfer function for the analog inputs.

ADC TRANSFER FUNCTION

The output coding of the ADT7516/ADT7517/ADT7519 analog inputs is straight binary. The designed code transitions occur midway between successive integer LSB values (i.e., 1/2 LSB, 3/2 LSB). The LSB is V
= 2.28 V. The ideal transfer characteristic is shown in
V
REF
/1024 or internal V
DD
Figure 51.
111...111
111...110
111...000
011...111
ADC CODE
000...010
000...001
000...000
1LSB = INT V 1LSB = V
+V
REF
ANALOG INPUT
Figure 51. Single-Ended Transfer Function
To work out the voltage on any analog input channel, the following method can be used:
1 LSB = reference (v)/1024
Convert value read back from AIN value register into decimal.
()
sizeLSBdvalueAINvoltageAIN ×
d = decimal
Example:
Internal reference used. Therefore V
REF
AIN value = 512d
10226.21024/28.21
×== VsizeLSB
3
=××=
/1024, internal
REF
/1024
REF
/1024
DD
– 1LSB0V 1/2LSB
= 2.28 V.
3
VvoltageAIN 14.110226.2512
02883-A-050
Rev. A | Page 23 of 44
Page 24
ADT7516/ADT7517/ADT7519
A

Analog Input ESD Protection

Figure 52 shows the input structure on any of the analog input pins that provides ESD protection. The diode provides the main ESD protection for the analog inputs. Care must be taken that the analog input signal never drops below the GND rail by more than 200 mV. If this happens, the diode will become forward-biased and start conducting current into the substrate. The 4 pF capacitor is the typical pin capacitance and the resistor is a lumped component made up of the on resistance of the multiplexer switch.
IN
4pF
Figure 52. Equivalent Analog Input ESD Circuit
S/W RESET
100
02883-A-051

AIN Interrupts

The measured results from the AIN inputs are compared with the AIN V
(greater than comparison) and V
HIGH
(less than or
LOW
equal to comparison) limits. An interrupt occurs if the AIN inputs exceed or equal the limit registers. These voltage limits are stored in on-chip registers. Note that the limit registers are 8 bits long while the AIN conversion result is 10 bits long. If the voltage limits are not masked out, then any out-of-limit com­parisons generate flags that are stored in the Interrupt Status 1 register (Address = 00h) and one or more out-of-limit results will cause the INT/
output to pull either high or low
INT
depending on the output polarity setting. It is good design practice to mask out interrupts for channels that are of no concern to the application. Figure 53 shows the interrupt structure for the ADT7516/ ADT7517/ADT7519. It gives a block diagram representation of how the various measurement channels affect the INT/
INT
pin.
Upper deadband has been reached. DAC output is not capable of increasing.
See . Figure 9
INTERRUPT
STATUS
REGISTER
(TEMP AND
AIN1 TO AIN4)
STATUS BITSSTATUS BIT
WATCHDOG
LIMIT
COMPARISONS
READ RESET
INTERRUPT
STATUS
REGISTER 2
)
(V
DD
Figure 53. ADT7516/ADT7517/ADT7519 Interrupt Structure
INTERRUPT
MASK
REGISTERS
CONTROL
CONFIGURATION
REGISTER 1
INTERNAL TEMP
EXTERNAL TEMP
V
DD
DIODE FAULT
AIN1–AIN4
ENABLE BIT
INT/INT
INT/INT (LATCHED OUTPUT)
02883-A-052
Rev. A | Page 24 of 44
Page 25
ADT7516/ADT7517/ADT7519

FUNCTIONAL DESCRIPTION—MEASUREMENT

Temperature Sensor

The ADT7516/ADT7517/ADT7519 contain an ADC with special input signal conditioning to enable operation with external and on-chip diode temperature sensors. When the ADT7516/ADT7517/ADT7519 is operating in single-channel mode, the ADC continually processes the measurement taken on one channel only. This channel is preselected by Bits C0:C2 in the Control Configuration 2 register (Address 19h). When in round robin mode, the analog input multiplexer sequentially selects the V measure its internal temperature, either the external temper­ature sensor or AIN1 and AIN2, AIN3, and then AIN4. These signals are digitized by the ADC and the results are stored in the various value registers.
The measured results from the temperature sensors are com­pared with the internal and external T temperature limits are stored in on-chip registers. If the temp­erature limits are not masked, any out-of-limit comparisons generate flags that are stored in the Interrupt Status 1 register. One or more out-of-limit results will cause the INT/
to pull either high or low depending on the output polarity setting.
Theoretically, the temperature measuring circuit can measure temperatures from –128°C to +127°C with a resolution of
0.25°C. However, temperatures outside T guaranteed operating temperature range of the device. Temp­erature measurement from –128°C to +127°C is possible using an external sensor.
Temperature measurement is initiated by three methods. The first method is applicable when the part is in single-channel measurement mode. The temperature is measured 16 times and internally averaged to reduce noise. In single-channel mode, the part is continuously monitoring the selected channel, i.e., as soon as one measurement is taken another one is started on the same channel. The total time to measure a temperature channel with the ADC operating at slow speed is typically 11.4 ms (712 µs × 16) for the internal temperature sensor and 24.22 ms (1.51 ms × 16) for the external temperature sensor. The new temperature value is stored in two 8-bit registers and is ready for reading by the I of disabling the averaging by setting Bit 5 in the Control Configuration 2 register (Address 19h). The ADT7516/ ADT7517/ADT7519 default on power-up with averaging enabled.
The second method is applicable when the part is in round robin measurement mode. The part measures both the internal and external temperature sensors as it cycles through all pos­sible measurement channels. The two temperature channels are measured each time the part runs a round robin sequence. In round robin mode, the part is continuously measuring all channels.
input channel, the on-chip temperature sensor to
DD
, T
HIGH
2
C or SPI interface. The user has the option
limits. These
LOW
INT
are outside the
A
output
Temperature measurement is also initiated after every read or write to the part when the part is in either single-channel measurement mode or round robin measurement mode.
Once serial communication has started, any conversion in pro­gress stops and the ADC resets. Conversion restarts immedi­ately after the serial communication has finished. The temp­erature measurement proceeds normally as described above.
V
Monitoring
DD
The ADT7516/ADT7517/ADT7519 also have the ability to monitor its own power supply. The part measures the voltage on
pin to a resolution of 10 bits. The resulting value is
its V
DD
stored in two 8-bit registers; the two LSBs are stored in register address 03h and the eight MSBs are stored in register address 06h. This allows the option of doing just a 1-byte read if 10-bit resolution is not important. The measured result is compared with the V
HIGH
and V
limits. If the VDD interrupt is not
LOW
masked, any out-of-limit comparison generates a flag in the Interrupt Status 2 register and one or more out-of-limit results will cause the INT/
output to pull either high or low,
INT
depending on the output polarity setting.
Measuring the voltage on the V
pin is regarded as monitoring
DD
a channel along with the inter nal, external, and AIN channels. The user can select the V
channel for single-channel
DD
measurement by setting Bit C4 = 1 and setting Bits C0:C2 to all 0s in the Control Configuration 2 register.
When measuring the V
value, the reference for the ADC is
DD
sourced from the internal reference. Table 8 shows the data format. As the maximum V scaling is performed on the V
voltage measurable is 7 V, internal
DD
voltage to match the 2.28 V
DD
internal reference value. Below is an example of how the transfer function works.
= 5 V
V
DD
ADC Reference = 2.28 V
10
1 LSB = ADC Reference/2 = 2.28/1024 = 2.226 mV Scale Factor = Full-scale V
/ADC Reference
CC
= 7/2.28 = 3.07 Conversion Result = V
/(Scale Factor × LSB size)
DD
= 5/(3.07 × 2.226 mV) = 2 DCh
Rev. A | Page 25 of 44
Page 26
ADT7516/ADT7517/ADT7519
(
×=∆
Table 8. VDD Data Format (V
Digital Output V
Value (V) Binary Hex
DD
2.7 01 1000 1011 18B 3 01 1011 0111 1B7
3.5 10 0000 0000 200 4 10 0100 1001 249
4.5 10 1001 0010 292 5 10 1101 1100 2DC
5.5 11 0010 0101 325 6 11 0110 1110 36E
6.5 11 1011 0111 3B7 7 11 1111 1111 3FF

On-Chip Reference

The ADT7516/ADT7517/ADT7519 have an on-chip 1.2 V band gap reference, which is gained up by a switched capacitor ampli­fier to give an output of 2.28 V. The amplifier is powered up for the duration of the device monitoring phase and is powered down once monitoring is disabled. This saves on current con­sumption. The internal reference is used as the reference for the ADC. The ADC is used for measuring V sensor, external temperature sensor, and AIN inputs. The internal reference is always used when measuring V internal and external temperature sensors. The external reference is the default power-up reference for the DACs.

Round Robin Measurement

On power-up, the ADT7516/ADT7517/ADT7519 go into round robin mode but monitoring is disabled. Setting Bit C0 of the Configuration Register 1 to 1 enables conversions. It sequences through all the available channels, taking a measurement from each in the following order: V external temperature sensor/(AIN1 and AIN2), AIN3, and AIN4. Pin 7 and Pin 8 can be configured to be either external temperature sensor pins or standalone analog input pins. Once conversion is completed on the AIN4 channel, the device loops around for another measurement cycle. This method of taking a measurement on all the channels in one cycle is called round robin. Setting Bit C4 of Control Configuration 2 (Address 19h) disables the round robin mode and in turn sets up the single­channel mode. The single-channel mode is where only one channel, e.g., internal temperature sensor, is measured in each conversion cycle.
The time taken to monitor all channels will normally not be of interest, since the most recently measured value can be read at any time. For applications where the round robin time is impor­tant, typical times at 25°C are given in the specifications.

Single-Channel Measurement

Setting C4 of the Control Configuration 2 register enables the single-channel mode and allows the ADT7516/ADT7517/ ADT7519 to focus on one channel only. A channel is selected by writing to Bits C0:C2 in the Control Configuration 2 register.
= 2.28 V)
REF
, internal temperature
DD
, and the
DD
, internal temperature sensor,
DD
For example, to select the V
channel for monitoring, write to
DD
the Control Configuration 2 register and set C4 to 1 (if not done so already), then write all 0s to Bits C0:C2. All subsequent conversions will be done on the V
channel only. To change the
DD
channel selection to the internal temperature channel, write to the Control Configuration 2 register and set C0 = 1. When measuring in single-channel mode, conversions on the channel selected occur directly after each other. Any communication to the ADT7516/ADT7517/ADT7519 stops the conversions, but they are restarted once the read or write operation is completed.

Temperature Measurement Method

Internal Temperature Measurement
The ADT7516/ADT7517/ADT7519 contain an on-chip band gap temperature sensor whose output is digitized by the on-chip ADC. The temperature data is stored in the Internal Temper­ature Value register. Because both positive and negative temper­atures can be measured, the temperature data is stored in twos complement format, as shown in Table 9. The thermal charac­teristics of the measurement sensor could change and, therefore, an offset is added to the measured value to enable the transfer function to match the thermal characteristics. This offset is added before the temperature data is stored. The offset value used is stored in the internal temperature offset register.
External Temperature Measurement
The ADT7516/ADT7517/ADT7519 can measure the temper­ature of one external diode sensor or diode-connected transistor.
The forward voltage of a diode or diode-connected transistor, operated at a constant current, exhibits a negative temperature coefficient of about –2 mV/°C. Unfortunately, because the absolute value of V
varies from device to device, and indivi-
BE
dual calibration is required to null this out, the technique is unsuitable for mass production.
The technique used in the ADT7516/ADT7517/ADT7519 is to measure the change in V
when the device is operated at two
BE
different currents. This is given by
)
NnqKTV
1/
BE
where:
K is Boltzmann’s constant. q is the charge on the carrier. T is the absolute temperature in kelvins. N is the ratio of the two currents.
Figure 45 shows the input signal conditioning used to measure the output of an external temperature sensor. This figure shows the external sensor as a substrate transistor, provided for temp­erature monitoring on some microprocessors, but it could equally well be a discrete transistor.
Rev. A | Page 26 of 44
Page 27
ADT7516/ADT7517/ADT7519
If a discrete transistor is used, the collector will not be grounded, and should be linked to the base. If a PNP transistor is used, the base is connected to the D– input and the emitter to the D+ input. If an NPN transistor is used, the emitter is connected to the D– input and the base to the D+ input.
A 2N3906 is recommended as the external transistor.
To prevent ground noise interfering with the measurement, the more negative terminal of the sensor is not referenced to ground, but is biased above ground by an internal diode at the D– input. As the sensor is operating in a noisy environment, C1 is provided as a noise filter. See the Layout Considerations section for more information on C1.
4.
Try to minimize the number of copper/solder joints, which
can cause thermocouple effects. Where copper/solder joints are used, make sure that they are in both the D+ and D– path and at the same temperature.
Thermocouple effects should not be a major problem because 1°C corresponds to about 240 µV, and thermocouple voltages are about 3 µV/°C of temperature difference. Unless there are two thermocouples with a big temperature differential between them, thermocouple voltages should be much less than 200 mV.
Place 0.1 µF bypass and 2200 pF input filter capacitors
5. close to the ADT7516/ADT7517/ADT7519.
To m e as u re ∆ V
, the sensor is switched between operating
BE
currents of I and N × I. The resulting waveform is passed through a low-pass filter to remove noise, then to a chopper­stabilized amplifier that performs the functions of amplification and rectification of the waveform to produce a dc voltage proportional to ∆V
. This voltage is measured by the ADC to
BE
give a temperature output in 10-bit twos complement format. To further reduce the effects of noise, digital filtering is performed by averaging the results of 16 measurement cycles.

Layout Considerations

Digital boards can be electrically noisy environments, and care must be taken to protect the analog inputs from noise, particu­larly when measuring the very small voltages from a remote diode sensor. The following precautions should be taken:
1.
Place the ADT7516/ADT7517/ADT7519 as close as
possible to the remote sensing diode. Provided that the worst noise sources such as clock generators, data/address buses, and CRTs are avoided, this distance can be 4 inches to 8 inches.
Route the D+ and D– tracks close together, in parallel, with
2. grounded guard tracks on each side. Provide a ground plane under the tracks, if possible.
3.
Use wide tracks to minimize inductance and reduce noise
pickup. A 10 mil track minimum width and spacing is recommended.
GND
D+
D–
GND
Figure 54. Arrangement of Signal Tracks
10 MIL 10 MIL
10 MIL 10 MIL 10 MIL 10 MIL
10 MIL
02883-A-053
6.
If the distance to the remote sensor is more than 8 inches,
the use of twisted-pair cable is recommended. This will work up to about 6 feet to 12 feet.
For long distances (up to 100 feet), use shielded twisted-
7. pair cable, such as Belden #8451 microphone cable. Con­nect the twisted pair to D+ and D–. and the shield to GND close to the ADT7516/ADT7517/ADT7519. Leave the remote end of the shield unconnected to avoid ground loops.
Because the measurement technique uses switched current sources, excessive cable and/or filter capacitance can affect the measurement. When using long cables, the filter capacitor may be reduced or removed.
Cable resistance can also introduce errors. Series resistance of 1 Ω introduces about 0.5°C error.
Temperature Value Format
One LSB of the ADC corresponds to 0.25°C. The ADC can theoretically measure a temperature span of 255°C. The internal temperature sensor is guaranteed to a low value limit of –40°C. It is possible to measure the full temperature span using the external temperature sensor. The temperature data format is shown in Table 9.
The result of the internal or external temperature measure­ments is stored in the temperature value registers, and is com­pared with limits programmed into the internal or external high and low registers.
Rev. A | Page 27 of 44
Page 28
ADT7516/ADT7517/ADT7519
Table 9. Temperature Data Format (Internal and External Temperature)
Temperature Digital Output
–40°C 11 0110 0000 –25°C 11 1001 1100 –10°C 11 1101 1000 –0.25°C 11 1111 1111 0°C 00 0000 0000 +0.25°C 00 0000 0001 +10°C 00 0010 1000 +25°C 00 0110 0100 +50°C 00 1100 1000 +75°C 01 0010 1100 +100°C 01 1001 0000 +105°C 01 1010 0100 +125°C 01 1111 0100
Temperature conversion formula:
Positive Temperature = ADC Code/4 Negative Temperature = (ADC Code* – 512)/4
*where DB9 is removed from the ADC code.

Interrupts

The measured results from the internal temperature sensor, external temperature sensor, V compared with the T T
LOW/VLOW
(less than or equal to comparison) limits. An inter-
HIGH/VHIGH
rupt occurs if the measurement exceeds or equals the limit registers. These limits are stored in on-chip registers. Note that the limit registers are 8 bits long while the conversion results are 10 bits long. If the limits are not masked, any out-of-limit com­parisons generate flags that are stored in the Interrupt Status 1 register (Address 00h) and Interrupt Status 2 register (Address 01h). One or more out-of-limit results will cause the INT/
output to pull either high or low depending on the
INT
output polarity setting. It is good design practice to mask out interrupts for channels that are of no concern to the application.
Figure 53 shows the interrupt structure for the ADT7516/ ADT7517/ADT7519. It gives a block diagram representation of how the various measurement channels affect the INT/

ADT7516/ADT7517/ADT7519 REGISTERS

The ADT7516/ADT7517/ADT7519 contain registers that are used to store the results of external and internal temperature measurements, V ments, high and low temperature limits, supply voltage and analog input limits, set output DAC voltage levels, configure multipurpose pins, and generally to control the device. A description of these registers follows.
The register map is divided into registers of 8 bits. Each register has its own individual address, but some consist of data that is linked with other registers. These registers hold the 10-bit conversion results of measurements taken on the temperature,
value measurements, analog input measure-
DD
pin, and AIN inputs are
DD
(greater than comparison) and
pin.
INT
V
, and AIN channels. For example, the eight MSBs of the VDD
DD
measurement are stored in register Address 06h while the two LSBs are stored in register Address 03h. The link involved between these types of registers is that when the LSB register is read first, the MSB registers associated with that LSB register are locked to prevent any updates. To unlock these MSB registers, the user has only to read any one of them, which will have the effect of unlocking all previously locked MSB registers. So for the preceding example, if Register 03h was read first, MSB Registers 06h and 07h would be locked to prevent any updates to them. If Register 06h was read, this register and Register 07h would be subsequently unlocked.
FIRST READ
COMMAND
SECOND READ
COMMAND
Figure 55. Phase 1 of 10-Bit Read
Figure 56. Phase 2 of 10-Bit Read
LSB
REGISTER
LOCK ASSOCIATED
MSB REGISTERS
MSB
REGISTER
UNLOCK ASSOCI AT ED
MSB REGISTERS
OUTPUT
DATA
OUTPUT
DATA
02883-A-054
02883-A-055
If an MSB register is read first, its corresponding LSB register is not locked, leaving the user with the option of just reading back 8 bits (MSB) of a 10-bit conversion result. Reading an MSB register first does not lock other MSB registers, and likewise reading an LSB register first does not lock other LSB registers.
Table 10. ADT7516/ADT7517/ADT7519 Registers
RD/WR Address
Name Power-On
Default
00h Interrupt Status 1 00h 01h Interrupt Status 2 00h 02h Reserved 03h Internal Temp and VDD LSBs 00h 04h
External Temp and AIN1 to
00h
AIN4 LSBs 05h Reserved 00h 06h VDD MSBs xxh 07h Internal Temp MSBs 00h 08h
External Temp MSBs/AIN1
00h
MSBs 09h AIN2 MSBs 00h 0Ah AIN3 MSBs 00h 0Bh AIN4 MSBs 00h 0Ch–0Fh Reserved 00h 10h
DAC A LSBs
00h
(ADT7516/ADT7517 only) 11h DAC A MSBs 00h 12h
DAC B LSBs
00h
(ADT7516/ADT7517 only) 13h DAC B MSBs 00h 14h
DAC C LSBs
00h
(ADT7516/ADT7517 only)
Rev. A | Page 28 of 44
Page 29
ADT7516/ADT7517/ADT7519
RD/WR Address
Name Power-On
Default
15h 00h DAC C MSBs 16h
DAC D LSBs
00h
(ADT7516/ADT7517 only) 17h 00h DAC D MSBs 18h Control CONFIGURATION 1 00h 19h Control CONFIGURATION 2 00h 1Ah Control CONFIGURATION 3 00h 1Bh DAC CONFIGURATION 00h 1Ch LDAC CONFIGURATION 00h 1Dh Interrupt Mask 1 00h 1Eh Interrupt Mask 2 00h 1Fh Internal Temp Offset 00h 20h External Temp Offset 00h 21h Internal Analog Temp Offset D8h 22h External Analog Temp Offset D8h 23h V 24h V 25h Internal T 26h Internal T 27h
External T
Limit C7h
DD VHIGH
Limit 62h
DD VLOW
Limit 64h
HIGH
Limit C9h
LOW
/AIN1 V
HIGH
HIGH
FFh
Limits 28h l T
LOW
/AIN1 V
LOW
Limits 00h Externa 29h–2Ah Reserved 2Bh AIN2 V 2Bh AIN2 V 2Ch AIN2 V 2Dh AIN3 V 2Eh AIN3 V 2Fh AIN4 V 30h AIN4 V
Limit FFh
HIGH
Limit FFh
HIGH
Limit 00h
LOW
Limit FFh
HIGH
Limit 00h
LOW
Limit FFh
HIGH
Limit 00h
LOW
31h–4Ch Reserved 4Dh Device ID 03h/0Bh/07h 4Eh Manufacturer’s ID 41h 4Fh Silicon Revision 04h 50h–7Eh Reserved 00h 7Fh SPI Lock Status 00h 80h–FFh Reserved 00h

Interrupt Status 1 Register (Read-Only) [Add. = 00h]

e This 8-bit read-only register reflects the status of some of th
interrupts that can cause the INT/
pin to go active. This
INT
register is reset by a read operation, provided that any out-of­limit event has been corrected. It is also reset by a software res
et.
Table 11. Interrupt Status 1 Register
D2 D1 D0 D7 D6 D5 D4 D3
0* 0* 0* 0* 0* 0* 0* 0*
*Default gs at er-upsettin pow .
Table 12.
Bit Function
D0
1 when the internal temperature value exceeds T
HIGH
limit. Any internal temperature reading greater than the set limit will cause an out-of-limit event.
D1
1 when internal temperature value exceeds T
limit. Any
LOW
internal temperature reading less than or equal to the set limit will cause an out-of-limit event.
D2
This status bit is linked to the configuration of Pins 7 and 8. If configured for external temperature sensor, this bit is 1 when external temperature value exceeds T
limit. The
HIGH
default value for this limit register is –1°C, so any external temperature reading greater than the set limit will cause an out-of-limit event. If configured for AIN1 and AIN2, this bit is 1 when AIN1 input voltage exceeds V
HIGH
or V
LOW
limits.
D3
1 when external temperature value exceeds T
limit. The
LOW
default value for this limit register is 0°C, so any external temperature reading less than or equal to the set limit will cause an out-of-limit event.
D4
1 Indicates a fault (open or short) for the external temperature sensor.
D5
1 when AIN2 voltage is greater than its corresponding V
HIGH
limit. 1 when AIN2 voltage is less than or equal to its corresponding V
D6
1 when AIN3 voltage is greater than its corresponding V
LOW
limit.
HIGH
limit. 1 when AIN3 voltage is less than or equal to its corresponding V
D7
1 when AIN4 voltage is greater than its corresponding V
LOW
limit.
HIGH
limit. 1 when AIN4 voltage is less than or equal to its corresponding V
LOW
limit.

Interrupt Status 2 Register (Read-Only) [Add. = 01h]

This 8-bit read-only register reflects the status of the VDD inter­rupt that can cause the INT/
pin to go active. This register is
INT reset by a read operation, provided that any out-of-limit event has been corrected. It is also reset by a software reset.
Table 13. Interrupt Status 2 Register
D7 D6 D5 D4 D3 D2 D1 D0
N/A N/A N/A 0* N/A N/A N/A N/A
*Default settings at power-up.
Table 14.
Bit Function
D4
1 when V limit. 1 when V V
LOW
value is greater than its corresponding V
DD
is less than or equal to its corresponding
DD
limit.
HIGH
Rev. A | Page 29 of 44
Page 30
ADT7516/ADT7517/ADT7519
Internal Temperature Value/VDD Value Register LSBs (Read-Only) [Add. = 03h]
This 8-bit read-only register stores the two LSBs of the 10-bit temperature reading from the internal temperature sensor and the two LSBs of the 10-bit supply voltage reading.
Table 15. Internal Temperature/VDD LSBs
D7 D6 D5 D4 D3 D2 D1 D0
N/A N/A N/A N/A V1 LSB T1 LSB N/A N/A N/A N/A 0* 0* 0* 0*
*Default settings at power-up.
Table 16.
Bit Function
D0 LSB of Internal Temperature Value. D1 B1 of Internal Temperature Value. D2 LSB of VDD Value. D3 B1 of VDD Value.
External Temperature Value and Analog Inputs 1 to 4 Register LSBs (Read-Only) [Add. = 04h]
This is an 8-bit read-only register. Bits D2:D7 store the two LSBs of the analog inputs AIN2–AIN4. Bits D0:D1 store the two LSBs of either the external temperature value or AIN1 input value. The type of input for D0 and D1 is selected by Bits C1:C2 of the Control Configuration Register 1.
Table 17. External Temperature and AIN1 to AIN4 LSBs
D7 D6 D5 D4 D3 D2 D1 D0
A4 A4 0* 0* 0* 0* 0* 0* 0* 0*
*Default settings at power-up.
Table 18.
Bit Function
D0 LSB of External Temperature Value or AIN1 Value. D1 Bit 1 of External Temperature Value or AIN1 Value. D2 LSB of AIN2 Value. D3 Bit 1 of AIN2 Value. D4 LSB of AIN3 Value. D5 Bit 1 of AIN3 Value. D6 LSB of AIN4 Value. D7 Bit 1 of AIN4 Value.

VDD Value Register MSBs (Read-Only) [Add. = 6h]

This 8-bit read-only register stores the supply voltage value. The eight MSBs of the 10-bit value are stored in this register.
Table 19. VDD Value MSBs
D7 D6 D5 D4 D3 D2 D1 D0
V9 V8 V7 V6 V5 V4 V3 V2 x* x* x* x* x* x* x* x*
*Loaded with VDD value after power-up.
A3 A3
LSB
A2 A2
LSB
T/A T/A
LSB
LSB
Internal Temperature Value Register MSBs (Read-Only) [Add. = 07h]
This 8-bit read-only register stores the internal temperature value from the internal temperature sensor in twos complement format. The eight MSBs of the 10-bit value are stored in this register.
Table 20. Internal Temperature Value MSBs
D7 D6 D5 D4 D3 D2 D1 D0
T9 T8 T7 T6 T5 T4 T3 T2 0* 0* 0* 0* 0* 0* 0* 0*
*Default settings at power-up.
External Temperature Value or Analog Input AIN1 Register MSBs (Read-Only) [Add. = 08h]
This 8-bit read-only register stores, if selected, the external temperature value or the analog input AIN1 value. Selection is done in the Control Configuration 1 register. The external temperature value is stored in twos complement format. The eight MSBs of the 10-bit value are stored in this register.
Table 21. External Temperature Value/Analog Inputs MSBs
D7 D6 D5 D4 D3 D2 D1 D0
T/A9 T/A8 T/A7 T/A6 T/A5 T/A4 T/A3 T/A2 0* 0* 0* 0* 0* 0* 0* 0*
*Default settings at power-up.

AIN2 Register MSBs (Read) [Add. = 09h]

This 8-bit read register contains the eight MSBs of the AIN2 analog input voltage word. The value in this register is com­bined with Bits D2:3 of the external temperature value and Analog Inputs 1 to 4 register LSBs, Address 04h, to give the full 10-bit conversion result of the analog value on the AIN2 pin.
Table 22. AIN2 MSBs
D7 D6 D5 D4 D3 D2 D1 D0
MSB A8 A7 A6 A5 A4 A3 A2 0* 0* 0* 0* 0* 0* 0* 0*
*Default settings at power-up.

AIN3 Register MSBs (Read) [Add. = 0Ah]

This 8-bit read register contains the eight MSBs of the AIN3 analog input voltage word. The value in this register is com­bined with Bits D4:5 of the external temperature value and Analog Inputs 1 to 4 register LSBs, Address 04h, to give the full 10-bit conversion result of the analog value on the AIN3 pin.
Table 23. AIN3 MSBs
D7 D6 D5 D4 D3 D2 D1 D0
MSB A8 A7 A6 A5 A4 A3 A2 0* 0* 0* 0* 0* 0* 0* 0*
*Default settings at power-up.
Rev. A | Page 30 of 44
Page 31
ADT7516/ADT7517/ADT7519

AIN4 Register MSBs (Read) [Add. = 0Bh]

This 8-bit read register contains the eight MSBs of the AIN4 analog input voltage word. The value in this register is com­bined with Bits D6:7 of the external temperature value and Analog Inputs 1 to 4 register LSBs, Address 04h, to give the full 10-bit conversion result of the analog value on the AIN4 pin.
Table 24. AIN4 MSBs
D7 D6 D5 D4 D3 D2 D1 D0
MSB A8 A7 A6 A5 A4 A3 A2 0* 0* 0* 0* 0* 0* 0* 0*
*Default settings at power-up.

DAC A Register LSBs (Read/Write) [Add. = 10h]

This 8-bit read/write register contains the 4/2 LSBs of the ADT7516/ADT7517 DAC A word, respectively. The value in this register is combined with the value in the DAC A register MSBs and converted to an analog voltage on the V power-up, the voltage output on the V
-A pin is 0 V.
OUT
-A pin. On
OUT
Table 25. DAC A (ADT7516) LSBs
D7 D6 D5 D4 D3 D2 D1 D0
B3 B2 B1 LSB N/A N/A N/A N/A 0* 0* 0* 0* N/A N/A N/A N/A
*Default settings at power-up.
Table 26. DAC A (ADT7517) LSBs
D7 D6 D5 D4 D3 D2 D1 D0
B1 LSB N/A N/A N/A N/A N/A N/A 0* 0* N/A N/A N/A N/A N/A N/A
*Default settings at power-up.

DAC A Register MSBs (Read/Write) [Add. = 11h]

This 8-bit read/write register contains the eight MSBs of the DAC A word. The value in this register is combined with the value in the DAC A register LSBs and converted to an analog voltage on the V the V
-A pin is 0 V.
OUT
-A pin. On power-up, the voltage output on
OUT
Table 27. DAC A MSBs
D7 D6 D5 D4 D3 D2 D1 D0
MSB B8 B7 B6 B5 B4 B3 B2 0* 0* 0* 0* 0* 0* 0* 0*
*Default settings at power-up.

DAC B Register LSBs (Read/Write) [Add. = 12h]

This 8-bit read/write register contains the 4/2 LSBs of the ADT7516/ADT7517 DAC B word, respectively. The value in this register is combined with the value in the DAC B register MSBs and converted to an analog voltage on the V power-up, the voltage output on the V
-B pin is 0 V.
OUT
-B pin. On
OUT
Table 28. DAC B (ADT7516) LSBs
D7 D6 D5 D4 D3 D2 D1 D0
B3 B2 B1 LSB N/A N/A N/A N/A 0* 0* 0* 0* N/A N/A N/A N/A
*Default settings at power-up.
Table 29. DAC B (ADT7517) LSBs
D7 D6 D5 D4 D3 D2 D1 D0
B1 LSB N/A N/A N/A N/A N/A N/A 0* 0* N/A N/A N/A N/A N/A N/A
*Default settings at power-up.

DAC B Register MSBs (Read/Write) [Add. = 13h]

This 8-bit read/write register contains the eight MSBs of the DAC B word. The value combines with the value in the DAC B register LSBs and converts to an analog voltage on the V pin. On power-up, the voltage output on the V
-B pin is 0 V.
OUT
OUT
-B
Table 30. DAC B MSBs
D7 D6 D5 D4 D3 D2 D1 D0
MSB B8 B7 B6 B5 B4 B3 B2 0* 0* 0* 0* 0* 0* 0* 0*
*Default settings at power-up.

DAC C Register LSBs (Read/Write) [Add. = 14h]

This 8-bit read/write register contains the 4/2 LSBs of the ADT7516/ADT7517 DAC C word, respectively. The value in this register is combined with the value in the DAC C register MSBs and converted to an analog voltage on the V power-up, the voltage output on the V
-C pin is 0 V.
OUT
-C pin. On
OUT
Table 31. DAC C (ADT7516) LSBs
D7 D6 D5 D4 D3 D2 D1 D0
B3 B2 B1 LSB N/A N/A N/A N/A 0* 0* 0* 0* N/A N/A N/A N/A
*Default settings at power-up.
Table 32. DAC C (ADT7517) LSBs
D7 D6 D5 D4 D3 D2 D1 D0
B1 LSB N/A N/A N/A N/A N/A N/A 0* 0* N/A N/A N/A N/A N/A N/A
*Default settings at power-up.

DAC C Register MSBs (Read/Write) [Add. = 15h]

This 8-bit read/write register contains the eight MSBs of the DAC C word. The value in this register is combined with the value in the DAC C register LSBs and converted to an analog voltage on the V the V
-C pin is 0 V.
OUT
-C pin. On power-up, the voltage output on
OUT
Table 33. DAC C MSBs
D7 D6 D5 D4 D3 D2 D1 D0
MSB B8 B7 B6 B5 B4 B3 B2 0* 0* 0* 0* 0* 0* 0* 0*
*Default settings at power-up.
Rev. A | Page 31 of 44
Page 32
ADT7516/ADT7517/ADT7519

DAC D Register LSBs (Read/Write) [Add. = 16h]

This 8-bit read/write register contains the 4/2 LSBs of the ADT7516/ADT7517 DAC D word, respectively. The value in this register is combined with the value in the DAC D register MSBs and converted to an analog voltage on the V On power-up, the voltage output on the V
-D pin is 0 V.
OUT
Table 34. DAC D (ADT7516) LSBs
D7 D6 D5 D4 D3 D2 D1 D0
B3 B2 B1 LSB N/A N/A N/A N/A 0* 0* 0* 0* N/A N/A N/A N/A
*Default settings at power-up.
Table 35. DAC D (ADT7517) LSBs
D7 D6 D5 D4 D3 D2 D1 D0
B1 LSB N/A N/A N/A N/A N/A N/A 0* 0* N/A N/A N/A N/A N/A N/A
*Default settings at power-up.

DAC D Register MSBs (Read/Write) [Add. = 17h]

This 8-bit read/write register contains the eight MSBs of the DAC D word. The register value combines with the value in the DAC D register LSBs and converts to an analog voltage on the V
-D pin. On power-up, the voltage output on the V
OUT
is 0 V.
Table 36. DAC D MSBs
D7 D6 D5 D4 D3 D2 D1 D0
MSB B8 B7 B6 B5 B4 B3 B2 0* 0* 0* 0* 0* 0* 0* 0*
*Default settings at power-up.

Control Configuration 1 Register (Read/Write) [Add. = 18h]

This configuration register is an 8-bit read/write register that is used to set up some of the operating modes of the ADT7516/ ADT7517/ADT7519.
Table 37. Control Configuration 1
D7 D6 D5 D4 D3 D2 D1 D0
PD C6 C5 C4 C3 C2 C1 C0 0* 0* 0* 0* 0* 0* 0* 0*
*Default settings at power-up.
OUT
-D pin.
-D pin
OUT
Table 38.
Bit Function
C0
C2:C1
C3
C4 Reserved. Write 0 only. C5
C6
PD
This bit enables/disables conversions in round robin and single-channel mode. ADT7516/ADT7517/ADT7519 powers up in round robin mode but monitoring is not initiated until this bit is set. The default = 0.
0 = Stop monitoring. 1 = Start monitoring. Selects between the two different analog inputs on Pins
7 and 8. ADT7516/ADT7517/ADT7519 powers up with AIN1 and AIN2 selected.
00 = AIN1 and AIN2 selected. 01 = Undefined. 10 = External TDM selected. 11 = Undefined. Selects between digital (LDAC) and analog inputs (AIN3)
on Pin 9. When AIN3 is selected, Bit C3 of the Control Configuration 3 register is masked and has no effect until LDAC is selected as the input on Pin 9.
0 = LDAC selected. 1 = AIN3 selected.
0 = Enable INT/ 1 = Disable INT/
Configures INT/ 0 = Active low. 1 = Active high. Power-Down Bit. Setting this bit to 1 puts the
ADT7516/ADT7517/ADT7519 into standby mode. In this mode, both ADC and DACs are fully powered down, but the serial interface is still operational. To power up the part again, just write 0 to this bit.
INT output.
INT output.
INT output polarity.

Control Configuration 2 Register (Read/Write) [Add. = 19h]

This configuration register is an 8-bit read/write register that is used to set up some of the operating modes of the ADT7516/ ADT7517/ADT7519.
Table 39. Control Configuration 2
D7 D6 D5 D4 D3 D2 D1 D0
C7 C6 C5 C4 C3 C2 C1 C0 0* 0* 0* 0* 0* 0* 0* 0*
*Default settings at power-up.
Rev. A | Page 32 of 44
Page 33
ADT7516/ADT7517/ADT7519
Table 40.
Bit Function
C2:0
In single-channel mode, these bits select between V
,
DD
the internal temperature sensor, external temperature sensor/AIN1, AIN2, AIN3, and AIN4 for conversion. The default is V
000 = V
.
DD
.
DD
001 = Internal temperature sensor. 010 = External temperature sensor/AIN1. (Bits C1:C2 of
the Control Configuration 1 register affect this selection). 011 = AIN2. 100 = AIN3. 101 = AIN4.
110–111 = Reserved. C3 Reserved. C4
Selects between single-channel and round robin conver-
sion cycle. The default is round robin.
0 = Round robin.
1 = Single channel. C5
Default condition is to average every measurement on all
channels 16 times. This bit disables this averaging.
Channels affected are temperature, analog inputs, and
.
V
DD
0 = Enable averaging.
1 = Disable averaging. C6
SMBus timeout on the serial clock puts a 25 ms limit on
the pulse width of the clock, ensuring that a fault on the
master SCL does not lock up the SDA line.
0 = Disable SMBus timeout.
1 = Enable SMBus timeout. C7
Software Reset. Setting this bit to 1 causes a software
reset. All registers and DAC outputs will reset to their
default settings.

Control Configuration 3 Register (Read/Write) [Add. = 1Ah]

This configuration register is an 8-bit read/write register that is used to set up some of the operating modes of the ADT7516/ ADT7517/ADT7519.
Table 41. Control Configuration 3
D7 D6 D5 D4 D3 D2 D1 D0
C7 C6 C5 C4 C3 C2 C1 C0 0* 0* 0* 0* 0* 0* 0* 0*
*Default settings at power-up.
Table 42.
Bit Function
C0 Selects between fast and slow ADC conversion speeds.
0 = ADC clock at 1.4 kHz. 1 = ADC clock at 22.5 kHz. D+ and D– analog filters are
disabled.
C1
On the ADT7516 and ADT7517, this bit selects between 8­bit and 10-bit DAC output resolution on the thermal voltage output feature. The default is 8 bits. This bit has no effect on the ADT7519 output because this part has only an 8-bit DAC. For the ADT7519, write 0 to this bit.
Bit Function
0 = 8-bit resolution.
1 = 10-bit resolution. C2 Reserved. Write 0 only. C3
LDAC pin controls updating of DAC outputs.
0 =
1 = DAC configuration register and LDAC configu ration
register control updating of DAC outputs. C4
Selects the ADC reference to be either internal V
or VDD
REF
for analog inputs.
0 = Internal V
REF.
1 = VDD. C5
Setting this bit selects DAC A voltage output to be
proportional to the internal temperature measurement. C6
Setting this bit selects DAC B voltage output to be
proportional to the external temperature measurement. C7 Reserved. Write 0 only.

DAC Configuration Register (Read/Write) [Add. = 1Bh]

This configuration register is an 8-bit read/write register that is used to control the output ranges of all four DACs and also to control the loading of the DAC registers if the
LDAC
pin is
disabled (Bit C3 = 1, Control Configuration 3 register).
Table 43. DAC Configuration
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0 0* 0* 0* 0* 0* 0* 0* 0*
*Default settings at power-up.
Table 44.
Bit Function
D0 Selects the output range of DAC A.
0 = 0 V to V 1 = 0 V to 2V
REF
REF
.
.
D1 Selects the output range of DAC B.
0 = 0 V to V 1 = 0 V to 2V
REF
REF
.
.
D2 Selects the output range of DAC C.
0 = 0 V to V 1 = 0 V to 2V
REF
REF
.
.
D3 Selects the output range of DAC D.
D5:D 4
0 = 0 V to V 1 = 0 V to 2V 00 = MSB write to any DAC register generates LDAC
command that updates that DAC only.
REF
REF
.
.
01 = MSB write to DAC B or DAC D register generates LDAC command that updates DACs A, B or DACs C, D, respectively.
10 = MSB write to DAC D register generates LDAC command that updates all four DACs.
11 = LDAC command generated from LDAC register.
D6:D7 Reserved. Write 0s only.
Rev. A | Page 33 of 44
Page 34
ADT7516/ADT7517/ADT7519

LDAC Configuration Register (Write-Only) [Add. = 1Ch]

This configuration register is an 8-bit write register that is used to control the updating of the quad DAC outputs if the
pin is disabled and Bits D4:D5 of the DAC configuration reg­ister are both set to 1. Also selects either the internal or external V
for all four DACs. Bits D0:D3 in this register are self-clear-
REF
ing, i.e., reading back from this register will always give 0s for these bits.
Table 45. LDAC Configuration
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0 0* 0* 0* 0* 0* 0* 0* 0*
*Default settings at power-up.
Table 46.
Bit Function
D0
Writing a 1 to this bit will generate the LDAC command to update DAC A output only.
D1
Writing a 1 to this bit will generate the LDAC command to update DAC B output only.
D2
Writing a 1 to this bit will generate the LDAC command to update DAC C output only.
D3
Writing a 1 to this bit will generate the LDAC command to update DAC D output only.
D4
Selects either internal V
or external V
REF
for DACs A
REF
and B.
D5
0 = External V 1 = Internal V Selects either internal V
REF
REF
.
or external V
REF
for DACs C
REF
and D. 0 = External V 1 = Internal V
REF
REF
D6:D7 Reserved. Write 0s only.

Interrupt Mask 1 Register (Read/Write) [Add. = 1Dh]

This mask register is an 8-bit read/write register that can be used to mask any interrupts that can cause the INT/
INT
go active.
Table 47. Interrupt Mask 1
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0 0* 0* 0* 0* 0* 0* 0* 0*
*Default settings at power-up.
LDAC
pin to
Table 48.
Bit Function
D0 0 = Enable internal T
1 = Disable internal T
D1 0 = Enable internal T
1 = Disable internal T
D2 0 = Enable external T
1 = Disable external T
D3 0 = Enable external T
1 = Disable external T
interrupt.
HIGH
interrupt.
HIGH
interrupt.
LOW
interrupt.
LOW
interrupt or AIN1 interrupt.
HIGH
interrupt or AIN1 interrupt.
HIGH
interrupt.
LOW
interrupt.
LOW
D4 0 = Enable external temperature fault interrupt.
1 = Disable external temperature fault interrupt.
D5 0 = Enable AIN2 interrupt.
1 = Disable AIN2 interrupt.
D6 0 = Enable AIN3 interrupt.
1 = Disable AIN3 interrupt.
D7 0 = Enable AIN4 interrupt.
1 = Disable AIN4 interrupt.

Interrupt Mask 2 Register (Read/Write) [Add. = 1Eh]

This mask register is an 8-bit read/write register that can be used to mask any interrupts that can cause the INT/
INT
pin to
go active.
Table 49. Interrupt Mask 2
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0 0* 0* 0* 0* 0* 0* 0* 0*
*Default settings at power-up.
Table 50.
Bit Function
D0:D3 Reserved. Write 0s only. D4
0 = Enable V 1 = Disable V
interrupts.
DD
interrupts.
DD
D5:D7 Reserved. Write 0s only.
Internal Temperature Offset Register (Read/Write) [Add. = 1Fh]
This register contains the offset value for the internal temp­erature channel. A twos complement number can be written to this register which is then added to the measured result before it is stored or compared to limits. In this way, a one-point cali­bration can be done whereby the whole transfer function of the channel can be moved up or down. From a software point of view, this may be a very simple method to vary the charac­teristics of the measurement channel if the thermal charac­teristics change. Because it is an 8-bit register, the temperature resolution is 1°C.
Table 51. Internal Temperature Offset
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0 0* 0* 0* 0* 0* 0* 0* 0*
Rev. A | Page 34 of 44
Page 35
ADT7516/ADT7517/ADT7519
External Temperature Offset Register (Read/Write) [Add. = 20h]
This register contains the offset value for the external temp­erature channel. A twos complement number can be written to this register, which is then added to the measured result before it is stored or compared to limits. In this way, a one-point cali­bration can be done whereby the whole transfer function of the channel can be moved up or down. From a software point of view, this may be a very simple method to vary the charac­teristics of the measurement channel if the thermal charac­teristics change. Because it is an 8-bit register, the temperature resolution is 1°C.
Table 52. External Temperature Offset
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0 0* 0* 0* 0* 0* 0* 0* 0*
*Default settings at power-up.
Internal Analog Temperature Offset Register (Read/Write) [Add. = 21h]
This register contains the offset value for the internal thermal voltage output. A twos complement number can be written to this register, which is then added to the measured result before it is converted by DAC A. Varying the value in this register has the effect of varying the temperature span. For example, the output voltage can represent a temperature span of –128°C to +127°C or even 0°C to +127°C. In essence, this register changes the position of 0 V on the temperature scale. Temperatures other than –128°C to +127°C will produce an upper deadband on the DAC A output. Because it is an 8-bit register, the temperature resolution is 1°C. The default value is –40°C.
Table 53. Internal Analog Temperature Offset
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0 1* 1* 0* 1* 1* 0* 0* 0*
*Default settings at power-up.
External Analog Temperature Offset Register (Read/Write) [Add. = 22h]
This register contains the offset value for the external thermal voltage output. A twos complement number can be written to this register which is then added to the measured result before it is converted by DAC B. Varying the value in this register has the effect of varying the temperature span. For example, the output voltage can represent a temperature span of –128°C to +127°C or even 0°C to +127°C. In essence, this register changes the position of 0 V on the temperature scale. Temperatures other than –128°C to +127°C will produce an upper deadband on the DAC B output. Because it is an 8-bit register, the temperature resolution is 1°C. The default value is –40°C.
Table 54. External Analog Temperature Offset
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0 1* 1* 0* 1* 1* 0* 0* 0*
*Default settings at power-up.
VDD V
Limit Register (Read/Write) [Add. = 23h]
HIGH
This limit register is an 8-bit read/write register that stores the
upper limit, which will cause an interrupt and activate the
V
DD
INT/
V
output (if enabled). For this to happen, the measured
INT
value has to be greater than the value in this register. The
DD
default value is 5.46 V.
Table 55. VDD V
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0 1* 1* 0* 0* 0* 1* 1* 1*
*Default settings at power-up.
VDD V
Limit Register (Read/Write) [Add. = 24h]
LOW
HIGH
Limit
This limit register is an 8-bit read/write register that stores the
lower limit, which will cause an interrupt and activate the
V
DD
INT/
V
output (if enabled). For this to happen, the measured
INT
value has to be less than or equal to the value in this
DD
register. The default value is 2.7 V.
Table 56. VDD V
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0 0* 1* 1* 0* 0* 0* 1* 0*
*Default settings at power-up.
Internal T
HIGH
Limit
LOW
Limit Register (Read/Write) [Add. = 25h]
This limit register is an 8-bit read/write register that stores the twos complement of the internal temperature upper limit, which will cause an interrupt and activate the INT/
INT
output
(if enabled). For this to happen, the measured internal temp­erature value has to be greater than the value in this register. Because it is an 8-bit register, the temperature resolution is 1°C. The default value is +100°C.
Table 57. Internal T
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0 0* 1* 1* 0* 0* 1* 0* 0*
*Default settings at power-up.
HIGH
Limit
Rev. A | Page 35 of 44
Page 36
ADT7516/ADT7517/ADT7519
Internal T
This limit register is an 8-bit read/write register that stores the twos complement of the internal temperature lower limit, which will cause an interrupt and activate the INT/
enabled). For this to happen, the measured internal temperature value has to be more negative than or equal to the value in this register. Because it is an 8-bit register, the temperature reso­lution is 1°C. The default value is –55°C.
Table 58. Internal T
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0 1* 1* 0* 0* 1* 0* 0* 1*
External T [Add. = 27h]
If Pins 7 and 8 are configured for the external temperature sensor, this limit register is an 8-bit read/write register that stores the twos complement of the external temperature upper limit, which will cause an interrupt and activate the INT/
output (if enabled). For this to happen, the measured external temperature value has to be greater than the value in this reg­ister. Because it is an 8-bit register, the temperature resolution is 1°C. The default value is –1°C.
If Pins 7 and 8 are configured for AIN1 and AIN2 inputs, this limit register is an 8-bit read/write register that stores the AIN1 input upper limit, which will cause an interrupt and activate the INT/
INT
AIN1 value has to be greater than the value in this register. Because it is an 8-bit register, the resolution is four times less than the resolution of the 10-bit ADC. Because the power-up default settings for Pins 7 and 8 are AIN1 and AIN2 inputs, the default value for this limit register is full-scale voltage.
Table 59. AIN1 V
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0 1* 1* 1* 1* 1* 1* 1* 1*
*Default settings at power-up.
External T [Add. = 28h]
If Pins 7 and 8 are configured for the external temperature sensor, this limit register is an 8-bit read/write register that stores the twos complement of the external temperature lower limit, which will cause an interrupt and activate the INT/
output (if enabled). For this to happen, the measured external temperature value has to be more negative than or equal to the value in this register. Because it is an 8-bit register, the temp­erature resolution is 1°C. The default value is 0°C.
If Pins 7 and 8 are configured for AIN1 and AIN2 inputs, this limit register is an 8-bit read/write register that stores the AIN1 input lower limit, which will cause an interrupt and activate the
Limit Register (Read/Write) [Add. = 26h]
LOW
output (if
INT
Limit
LOW
HIGH
/AIN1 V
Limit Register (Read/Write)
HIGH
INT
output (if enabled). For this to happen, the measured
Limit
HIGH
LOW
/AIN1 V
Limit Register (Read/Write)
LOW
INT
INT/
output (if enabled). For this to happen, the measured
INT
AIN1 value has to be less than or equal to the value in this reg­ister. As it is an 8-bit register, the resolution is four times less than the resolution of the 10-bit ADC. Because the power-up default settings for Pins 7 and 8 are AIN1 and AIN2 inputs, the default value for this limit register is 0 V.
Table 60. AIN1 V
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0 0* 0* 0* 0* 0* 0* 0* 0*
*Default settings at power-up.
AIN2 V
Limit Register (Read/Write) [Add. = 2Bh]
HIGH
LOW
Limit
This limit register is an 8-bit read/write register that stores the AIN2 input upper limit, which will cause an interrupt and acti­vate the INT/
output (if enabled). For this to happen, the
INT measured AIN2 value has to be greater than the value in this register. Because it is an 8-bit register, the resolution is four times less than the resolution of the 10-bit ADC. The default
value is full-scale voltage.
Table 61. AIN2 V
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0 1* 1* 1* 1* 1* 1* 1* 1*
*Default settings at power-up.
AIN2 V
Limit Register (Read/Write) [Add. = 2Ch]
LOW
HIGH
Limit
This limit register is an 8-bit read/write register that stores the AIN2 input lower limit, which will cause an interrupt and acti­vate the INT/
output (if enabled). For this to happen, the
INT measured AIN2 value has to be less than or equal to the value in
this register. Because it is an 8-bit register, the resolution is four times less than the resolution of the 10-bit ADC. The default value is 0 V.
Table 62. AIN2 V
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0 0* 0* 0* 0* 0* 0* 0* 0*
AIN3 V
Limit Register (Read/Write) [Add. = 2Dh]
HIGH
LOW
Limit
This limit register is an 8-bit read/write register that stores the AIN3 input upper limit, which will cause an interrupt and acti­vate the INT/
output (if enabled). For this to happen, the
INT measured AIN3 value has to be greater than the value in this
register. Because it is an 8-bit register, the resolution is four times less than the resolution of the 10-bit ADC. The default value is full-scale voltage.
Table 63. AIN3 V
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0 1* 1* 1* 1* 1* 1* 1* 1*
*Default settings at power-up.
HIGH
Limit
Rev. A | Page 36 of 44
Page 37
ADT7516/ADT7517/ADT7519
AIN3 V
This limit register is an 8-bit read/write register that stores the AIN3 input lower limit, which will cause an interrupt and activate the INT/
the measured AIN3 value has to be less than or equal to the value in this register. Because it is an 8-bit register, the reso­lution is four times less than the resolution of the 10-bit ADC. The default value is 0 V.
Table 64. AIN3 V
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0 0* 0* 0* 0* 0* 0* 0* 0*
*Default settings at power-up.
AIN4 V
This limit register is an 8-bit read/write register that stores the AIN4 input upper limit, which will cause an interrupt and acti­vate the INT/
measured AIN4 value has to be greater than the value in this register. Because it is an 8-bit register, the resolution is four times less than the resolution of the 10-bit ADC. The default value is full-scale voltage.
Table 65. AIN4 V
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0 1* 1* 1* 1* 1* 1* 1* 1*
*Default settings at power-up.
AIN4 V
This limit register is an 8-bit read/write register that stores the AIN4 input lower limit, which will cause an interrupt and activate the INT/
the measured AIN4 value has to be less than or equal to the value in this register. Because it is an 8-bit register, the reso­lution is four times less than the resolution of the 10-bit ADC. The default value is 0 V.
Table 66. AIN4 V
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0 0* 0* 0* 0* 0* 0* 0* 0*
*Default settings at power-up.

Device ID Register (Read-Only) [Add. = 4Dh]

This 8-bit read-only register indicates which part the device is in the model range. ADT7516 = 03h, ADT7517 = 07h, and ADT7519 = 0Bh.

Manufacturer’s ID Register (Read-Only) [Add. = 4Eh]

This register contains the manufacturer’s identification number. ADI’s ID number is 41h.
Limit Register (Read/Write) [Add. = 2Eh]
LOW
output (if enabled). For this to happen,
INT
Limit
LOW
Limit Register (Read/Write) [Add. = 2Fh]
HIGH
output (if enabled). For this to happen, the
INT
Limit
HIGH
Limit Register (Read/Write) [Add. = 30h]
LOW
output (if enabled). For this to happen,
INT
Limit
LOW

Silicon Revision Register (Read-Only) [Add. = 4Fh]

This register is divided into the four LSBs representing the stepping and the four MSBs representing the version. The stepping contains the manufacturer’s code for minor revisions or steppings to the silicon. The version is the ADT7516/ ADT7517/ADT7519 version number.

SPI Lock Status Register (Read-Only) [Add. = 7Fh]

Bit D0 (LSB) of this read-only register indicates whether or not the SPI interface is locked. Writing to this register will cause the device to malfunction. The default value is 00h.
2
C interface.
0 = I 1 = SPI interface selected and locked.

SERIAL INTERFACE

There are two serial interfaces that can be used on this part: I2C and SPI. The device will power up with the serial interface in
2
I
C mode, but it is not locked into this mode. To stay in I2C
mode, it is recommended that the user tie the V
or GND. It is not possible to lock the I2C mode, but it is
CC
possible to select and lock the SPI mode.
To select and lock the interface into the SPI mode, a number of pulses must be sent down the
line (Pin 4). The following
CS
section describes how this is done.
Once the SPI communication protocol has been locked in, it cannot be unlocked while the device is still powered up. Bit D0 of the SPI lock status register (Address 7Fh) is set to 1 when a successful SPI interface lock has been accomplished. To reset the serial interface, the user must power down the part and power it up again. A software reset does not reset the serial interface.

Serial Interface Selection

The CS line controls the selection between I2C and SPI.
Figure 59 shows the selection process necessary to lock the SPI interface mode.
To communicate to the ADT7516/ADT7517/ADT7519 using the SPI protocol, send three pulses down the
in Figure 59. On the third rising edge (marked as C in Figure 59), the part selects and locks the SPI interface. The user is now limited to communicating to the device using the SPI protocol.
As per most SPI standards, the CS line must be low during every SPI communication to the ADT7516/ADT7517/ ADT7519 and high all other times. Typical examples of how to connect the dual interface as I
2
C or SPI is shown in Figure 57
and Figure 58. The following sections describe in detail how to
2
use the I
C and SPI protocols associated with the ADT7516/
ADT7517/ADT7519.
line to either
CS
line as shown
CS
Rev. A | Page 37 of 44
Page 38
ADT7516/ADT7517/ADT7519
ADT7516/ ADT7517/
ADT7519
Figure 57. Typical I
(START HIGH)
CS
V
CS
SDA
SCL
I2C ADDRESS = 1001 000
ADD
2
V
DD
C Interface Connection
DD
10k10k
A B
ADT7516/ ADT7517/
ADT7519
CS
V
DD
820820820
02883-A-057
C
DIN
SCLK
DOUT
Figure 58. Typical SPI Interface Connection
LOCK AND
SELECT SPI
SPI FRAMING
EDGE
02883-A-058
(START LOW)
CS
A B
Figure 59. Serial Interface—Selecting and Locking SPI Protocol

I2C Serial Interface

Like all I2C compatible devices, the ADT7516/ADT7517/ ADT7519 have a 7-bit serial address. The four MSBs of this address for the ADT7516/ADT7517/ADT7519 are set to 1001. The three LSBs are set by Pin 11, ADD. The ADD pin can be configured three ways to give three different address options: low, floating, and high. Setting the ADD pin low gives a serial bus address of 1001 000, leaving it floating gives the address 1001 010, and setting it high gives the address 1001 011. The recommended pull-up resistor value is 10 kΩ.
There is an enable/disable bit for the SMBus timeout. When this is enabled, the SMBus will time out after 25 ms of no activity. To enable it, set Bit 6 of the Control Configuration 2 register. The power-on default is with the SMBus timeout disabled.
The ADT7516/ADT7517/ADT7519 support SMBus packet error checking (PEC), but its use is optional. It is triggered by supplying the extra clocks for the PEC byte. The PEC is calculated using CRC-8. The frame clock sequence (FCS) conforms to CRC-8 by the polynominal
()
128
1
+++= xxxxC
Consult the SMBus specification (www.smbus.org) for more information.
The serial bus protocol operates as follows:
The master initiates a data transfer by establishing a start
1. condition, defined as a high to low transition on the serial data line SDA while the serial clock line SCL remains high. This indicates that an address/data stream will follow. All slave peripherals connected to the serial bus respond to the start condition and shift in the next eight bits, consisting of
SPI LOCKE D ON
THIRD RISI NG EDGE
C
SPI LOCKED ON
THIRD RISI NG EDGE
Data is sent over the serial bus in sequences of nine clock
2.
When all data bytes have been read or written, stop
3.
SPI FRAMING
EDGE
SPI FRAMING
EDGE
a 7-bit address (MSB first) plus a R/
bit, which
W
02883-A-056
determines the direction of the data transfer, i.e., whether data will be written to or read from the slave device.
The peripheral whose address corresponds to the transmitted address responds by pulling the data line low during the low period before the ninth clock pulse, known as the Acknowledge Bit. All other devices on the bus now remain idle while the selected device waits for data to be read from or written to it. If the R/
write to the slave device. If the R/
bit is 0 the master will
W
bit is 1, the master will
W
read from the slave device.
pulses: eight bits of data followed by an acknowledge bit from the receiver of data. Transitions on the data line must occur during the low period of the clock signal and remain stable during the high period, because a low to high tran­sition when the clock is high may be interpreted as a stop signal.
conditions are established. In write mode, the master will pull the data line high during the 10th clock pulse to assert a stop condition. In read mode, the master device will pull the data line high during the low period before the ninth clock pulse. This is known as No Acknowledge. The master will then take the data line low during the low period before the 10th clock pulse, and then high during the 10th clock pulse to assert a stop condition.
Rev. A | Page 38 of 44
Page 39
ADT7516/ADT7517/ADT7519
SDA
Any number of bytes of data can be transferred over the serial bus in one operation, but it is not possible to mix read and write in one operation because the type of operation is determined at the beginning and cannot subsequently be changed without starting a new operation.
2
C address set up by the ADD pin is not latched by the
The I device until after this address has been sent twice. On the eighth SCL cycle of the second valid communication, the serial bus address is latched in. This is the SCL cycle directly after the
2
device has seen its own I changes on this pin will have no effect on the I
C serial bus address. Any subsequent
2
C serial bus
address.

Writing to the ADT7516/ADT7517/ADT7519

Depending on the register being written to, there are two different writes for the ADT7516/ADT7517/ADT7519. It is not
2
possible to do a block write to this part, i.e., no I
C auto-
increment.
Writing to the Address Pointer Register for a Subsequent Read
To read data from a particular register, the address pointer register must contain the address of that register. If it does not, the correct address must be written to the address pointer register by performing a single-byte write operation, as shown in Figure 60. The write operation consists of the serial bus address followed by the address pointer byte. No data is written to any of the data registers. A read operation is then performed to read the register.

Writing Data to a Register

All registers are 8-bit registers, so only one byte of data can be written to each register. Writing a single byte of data to one of these read/write registers consists of the serial bus address, the data register address written to the address pointer register, followed by the data byte written to the selected data register. This is illustrated in Figure 61. To write to a different register, another start or repeated start is required. If more than one byte of data is sent in one communication operation, the addressed
SCL
register will be repeatedly loaded until the last data byte has been sent.

Reading Data from the ADT7516/ADT7517/ADT7519

Reading data from the ADT7516/ADT7517/ADT7519 is done in a 1-byte operation. Reading back the contents of a register is shown in Figure 62. The register address had previously been set up by a single-byte write operation to the address pointer register. To read from another register, write to the address pointer register again to set up the relevant register address. Thus, block reads are not possible, i.e., no I
2
C auto-increment.

SPI Serial Interface

The SPI serial interface of the ADT7516/ADT7517/ADT7519 consists of four wires:
, SCLK, DIN, and D OUT. The CS is
CS
used to select the device when more than one device is con­nected to the serial clock and data lines. The
is also used to
CS
distinguish between any two separate serial communications (see Figure 67 for a graphical explanation). The SCLK is used to clock data in and out of the part. The D
line is used to write to
IN
the registers, and the DOUT line is used to read data back from the registers. The recommended pull-up resistor value is between 500 Ω and 820 Ω.
The part operates in slave mode and requires an externally applied serial clock to the SCLK input. The serial interface is designed to allow the part to be interfaced to systems that provide a serial clock that is synchronized to the serial data.
There are two types of serial operations, read and write. Com­mand words are used to distinguish read operations from write operations. These command words are given in Table 67. Address auto-increment is possible in SPI mode.
Table 67. SPI Command Words
Write Read
90h (1001 0000) 91h (1001 0001)
191
9
START BY
MASTER
0 0 1 A2 A1 A P7 P6 P5 P4 P3 P2 P1 P0
FRAME 1
SERIAL BUS ADDRESS BYTE
Figure 60. I2C—Writing to the Address Pointer Register to Select a Register for a Subsequent Read Operation
01 R/W
ACK. BY
ADT7516/ADT7517/ADT7519
ADT7516/ADT7517/ADT7519
ADDRESS POINTER REGISTER BYTE
FRAME 2
ACK. BY
STOP BY MASTER
02883-A-059
Rev. A | Page 39 of 44
Page 40
ADT7516/ADT7517/ADT7519
A
SCL
SD
START BY
MASTER
1 0 0 1 A2 A1 A0 P7 P6 P5 P4 P3 P2 P1 P0
FRAME 1
SERIAL BUS ADDRESS BYTE
SCL (CONTINUED)
SDA (CONTINUED)
2
Figure 61. I
C—Writing to the Address Pointer Register Followed by a Single Byte of Data to the Selected Register
R/W
ACK. BY
ADT7516/ADT7517/ADT7519
SCL
1SDA
0 0 1 A2 A1 A0 R/W D7 D6 D5 D4 D3 D2 D1 D0
START BY
MASTER
SERIAL BUS ADDRESS BYTE
FRAME 1
Figure 62. I
2
C—Reading a Single Byte of Data from a Selected Register
ACK. BY
ADT7616/ADT7517/ADT7519

Write Operation

Figure 63 shows the timing diagram for a write operation to the ADT7516/ADT7517/ADT7519. Data is clocked into the reg­isters on the rising edge of SCLK. When the
line is high, the
CS
DIN and DOUT lines are in three-state mode. Only when the
goes from a high to a low does the part accept any data on
CS the DIN line. In SPI mode, the address pointer register is cap-
able of auto-incrementing to the next register in the register map without having to load the address pointer register each time. In Figure 63, the register address portion gives the first register that will be written to. Subsequent data bytes will be written into sequential writable registers. Thus, after each data byte has been written into a register, the address pointer register auto-increments its value to the next available register. The address pointer register will auto-increment from 00h to 3Fh and will loop back to start again at 00h when it reaches 3Fh.
191
ADDRESS POINTER REGISTER BYTE
D7 D6 D5 D4 D3 D2 D1 D0
191
SINGLE DATA BYTE FROM ADT7516/ADT7517/ADT7519
FRAME 2
FRAME 3
DATA BYTE
FRAME 2
ADT7516/ADT7517/ADT7519
ACK. BY
ADT7516/ADT7517/ADT7519

Read Operation

Figure 64 to Figure 66 show the timing diagrams necessary to accomplish correct read operations. To read back from a reg­ister, first write to the address pointer register with the address of the register to be read from. This operation is shown in Figure 64. Figure 65 shows the procedure for reading back a single byte of data. The read command is first sent to the part during the first eight clock cycles. During the following eight clock cycles, the data contained in the register selected by the address pointer register is output onto the D output onto the D
line on the falling edge of SCLK. Figure 66
OUT
shows the procedure when reading data from two sequential registers. Multiple data reads are possible in the SPI interface mode as the address pointer register is auto-incremental. The address pointer register will auto-increment from 00h to 3Fh and will loop back to start again at 00h when it reaches 3Fh
ACK. BY
91
9
NO ACK. BY
MASTER
9
STOP BY MASTER
STOP BY MASTER
line. Data is
OUT
02883-A-060
02883-A-061
Rev. A | Page 40 of 44
Page 41
ADT7516/ADT7517/ADT7519
S
CS
SCLK
DIN
181
D3
D3
D2
D2
START
D6
D7
D5
D3
D4
CS (CONTINUED)
SCLK (CONTINUED)
DIN (CONTINUED)
D1
D2
D7
D6
D6
D5
REGISTER ADDRESSWRITE COMMAND
D5
D4
D4
DATA BYTE
D0
1
D7
Figure 63. SPI—Writing to the Address Pointer Register Followed by a Single Byte of Data to the Selected Register
CS
181
CLK
DIN
START
D6
D7
D5
WRITE COMMAND
D3
D4
D1
D2
D7
D0
D6
D5
REGISTER ADDRESS
D4
D3
Figure 64. SPI—Writing to the Address Pointer Register to Select a Register for a Subsequent Read Operation
CS
D2
D1
D1
D1
8
D0
8
D0 STOP
D0
02883-A-062
8
STOP
02883-A-063
8
X
D1
X
D0
STOP
02883-A-064
SCLK
DIN
DOUT
18
D6
START
D7
X
D5
XXXX
READ COMMAND
D3
D4
D1
D2
X
X
1
X
D0
XD7
X
X
XX
D6
D5
D3
D4
DATA BYTE 1
Figure 65. SPI—Reading a Single Byte of Data From a Selected Register
X
D2
Rev. A | Page 41 of 44
Page 42
ADT7516/ADT7517/ADT7519
CS
D1
D1
X
8
X
X
D0
8
X
D0
STOP
02883-A-065
SCLK
DIN
DOUT
D7
START
X
D6
D5
XX
READ COMMAND
181
D3
X
X
D2
X
X
D2
D3
D4
X
X
CS (CONTINUED)
SCLK (CONTINUED)
DIN (CONTINUED)
DOUT (CONTINUED)
D1
D2
X
X
X
D0
XD7
1
X
D7
X
X
X
D6 D5
X
D6 D5 D4 D3
X
D4
DATA BYTE 1
X
DATA BYTE 2
Figure 66. SPI—Reading Two Bytes of Data from Two Sequential Registers
CS
SPI READ OPERATION WRITE OPERATION
Figure 67. SPI—Correct Use of
CS
during SPI Communication
02883-A-066
Rev. A | Page 42 of 44
Page 43
ADT7516/ADT7517/ADT7519
R
R
R

SMBus/SPI INT/

The ADT7516/ADT7517/ADT7519 INT/ interrupt line for devices that want to trade their ability to
master for an extra pin. The ADT7516/ADT7517/ADT7519 are slave devices and use the SMBus/SPI INT/
device that it wants to talk to. The SMBus/SPI INT/
ADT7516/ADT7517/ADT7519 is used as an over/under limit indicator.
The INT/
INT
the outputs of several devices to be wired-AND together when the INT/
pin is active low. Use C6 of the Control Config-
INT uration 1 register to set the active polarity of the INT/ put. The power-up default is active low. The INT/
can be disabled or enabled by setting C5 of the Control Config­uration 1 register to 1 or 0, respectively.
The INT/
INT
temperature value, the external temperature value, V any of the AIN input values exceed the values in their corres­ponding T
HIGH/VHIGH
put goes inactive again when a conversion result has the mea­sured value back within the trip limits and when the status reg­ister associated with the out-of-limit event is read. The two interrupt status registers show which event caused the INT/
pin to go active.
The INT/
INT can be connected to a voltage different from V maximum voltage rating of the INT/ exceeded. The value of the pull-up resistor depends on the application but should be large enough to avoid excessive sink
currents at the INT/ affect the temperature reading.

SMBUS ALERT RESPONSE

The INT/ when the SMBus/I
output and requires a pull-up to V
can be wire-AND together, so that the common line will go low if one or more of the INT/
the INT/ to be wired-AND together.
The INT/ Slave devices on the SMBus can not normally signal to the
master that they want to talk, but the allows them to do so. the SMBus general call address.
INT
pin must be set active low for a number of outputs
INT
INT
INT
outputs are an
INT
to signal the host
INT
on the
INT
pin has an open-drain configuration that allows
out-
INT
output
INT
output becomes active when either the internal
value, or
DD
or T
LOW/VLOW
registers. The INT/
INT
out-
INT
output requires an external pull-up resistor. This
, provided the
DD
output pin is not
INT
output, which can heat the chip and
INT
pin behaves the same way as an SMBus alert pin
2
C interface is selected. It is an open-drain
. Sever al INT/
DD
outputs goes low. The polarity of
INT
output can operate as an
SMBALERT
SMBALERT
is used in conjunction with
SMBALERT
outputs
INT
function.
function
One or more INT/
SMBALERT SMBALERT
line connected to the master. When the line is pulled low by one of the devices, the
outputs can be connected to a common
INT
following procedure occurs as shown in Figure 68.
1.
SMBALERT
2.
Master initiates a read operation and sends the alert res-
pulled low.
ponse address (ARA = 0001 100). This is a general call address that must not be used as a specific device address.
The devices whose INT/
3.
output is low responds to the
INT alert response address and the master reads its device address. As the device address is seven bits long, an LSB of 1 is added. The address of the device is now known and it
can be interrogated in the usual way.
If more than one device’s INT/
4.
output is low, the one
INT
with the lowest device address will have priority in accor­dance with normal SMBus specifications.
Once the ADT7516/ADT7517/ADT7519 have responded
5. to the alert response address, they will reset their INT/
INT
output, provided that the condition that caused the out-of­limit event no longer exists and that the status register associated with the out-of-limit event is read. If the SMBALERT
line remains low, the master will send the
ARA again. It will continue to do this until all devices whose
MASTE RECEIVES SMBALERT
START
SMBALERT
ALERT RESPONSE
ADDRESS
MASTER SENDS ARA AND READ
COMMAND
Figure 68. INT/
outputs were low have responded.
NO
ARA
ACK
STOP
RD ACK DEVICE ADDRESS
DEVICE SENDS
ITS ADDRESS
INT
Responds to
SMBALERT
02883-A-067
MASTER RECEIVES SMBALERT
START
ALERT RESPONSE
ADDRESS
MASTER SENDS
ARA AND READ
COMMAND
Figure 69. INT/
with Packet Error Checking (PEC)
DEVICE ACK
RD ACK
DEVICE SENDS
INT
Responds to
DEVICE
ADDRESS
ITS ADDRESS
SMBALERT
MASTE
ACK
ACK PEC
MASTE
NACK
ACK
DEVICE SENDS
ITS PEC DATA
ARA
NO
STOP
02883-A-068
Rev. A | Page 43 of 44
Page 44
ADT7516/ADT7517/ADT7519

OUTLINE DIMENSIONS

0.193 BSC
0.012
0.008
9
8
0.154 BSC
0.069
0.053
SEATING PLANE
0.236 BSC
0.010
0.006
8° 0°
0.050
0.016
0.065
0.049
0.010
0.004
COPLANARITY
0.004
Figure 70. 16-Lead Shrink Small Outline Package [QSOP]
16
1
PIN 1
0.025 BSC
COMPLIANT TO JEDEC STANDARDS MO-137AB
(RQ-16)
Dimensions in Inches

ORDERING GUIDE

Minimum
Model Temperature Range DAC Resolution Package Description
ADT7519ARQ –40°C to +120°C 8 Bits 16-Lead QSOP N/A ADT7519ARQ-REEL –40°C to +120°C 8 Bits 16-Lead QSOP 2500 ADT7519ARQ-REEL7 –40°C to +120°C 8 Bits 16-Lead QSOP 1000 ADT7519ARQZ
1
–40°C to +120°C 8 Bits 16-Lead QSOP N/A ADT7519ARQZ1-REEL –40°C to +120°C 8 Bits 16-Lead QSOP 2500 ADT7519ARQZ1-REEL7 –40°C to +120°C 8 Bits 16-Lead QSOP 1000 ADT7517ARQ –40°C to +120°C 10 Bits 16-Lead QSOP N/A ADT7517ARQ-REEL –40°C to +120°C 10 Bits 16-Lead QSOP 2500 ADT7517ARQ-REEL7 –40°C to +120°C 10 Bits 16-Lead QSOP 1000 ADT7516ARQ –40°C to +120°C 12 Bits 16-Lead QSOP N/A ADT7516ARQ-REEL –40°C to +120°C 12 Bits 16-Lead QSOP 2500 ADT7516ARQ-REEL7 –40°C to +120°C 12 Bits 16-Lead QSOP 1000
1
Z = Pb-free part.
Quantities/Reel
Purchase of licensed I2C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I2C Patent Rights to use these components in an I
2
C system, provided that the system conforms to the I2C Standard Specification as defined by Philips.
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners.
C02883-0-8/04(A)
Rev. A | Page 44 of 44
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