Datasheet ADSP-TS202S Datasheet (ANALOG DEVICES)

Page 1

TigerSHARC

Embedded Processor

ADSP-TS202S

KEY FEATURES

500 MHz, 2.0 ns instruction cycle rate 12M bits of internal—on-chip—DRAM memory 25 mm × 25 mm (576-ball) thermally enhanced ball grid array

package

Dual-computation blocks—each containing an ALU, a multi-

plier, a shifter, and a register file

Dual-integer ALUs, providing data addressing and pointer

manipulation

Single-precision IEEE 32-bit and extended-precision 40-bit

floating-point data formats and 8-, 16-, 32-, and 64-bit fixed-point data formats

Integrated I/O includes 14-channel DMA controller, external

port, four link ports, SDRAM controller, programmable flag pins, two timers, and timer expired pin for system integration

DATA ADDRESS GENERATION

INTEGER

KALU

32-BIT × 32-BIT

128

DAB

PROGRAM

SEQUEN CER

ADDR

FETCH

BTB

IAB

INTEGER

JALU

32-BIT × 32-BIT

J-BUS ADDR

J-BUS DATA

K-BUS ADDR

K-BUS DATA

I-BUS ADDR

I-BUS DATA

MULALUSHIFT

FILE

32-B IT × 32-BI T

1149.1 IEEE-compliant JTAG test access port for on-chip emulation

On-chip arbitration for glueless multiprocessing

KEY BENEFITS

Provides high performance static superscalar DSP

operations, optimized for large, demanding multiprocessor DSP applications

Performs exceptionally well on DSP algorithm and I/O

benchmarks (see benchmarks in Table 1)

Supports low overhead DMA transfers between internal

memory, external memory, memory-mapped peripherals, link ports, host processors, and other (multiprocessor) DSPs

Eases programming through extremely flexible instruction

set and high-level-language-friendly DSP architecture

Enables scalable multiprocessing systems with low

communications overhead

12M BITS INTERNAL MEMORY

MEMORY BLOCKS

(PAGE CACHE)

4 × CROSSBAR CONNECT

ADADA

128

S-BUS ADDR

S-BUS DATA

128

FILE

32-BIT × 32-BIT

SOC

I/F

128

MUL ALU SHIFT

SOC BUS

JTAG

HOST

MULTI-

PROC

SDRAM

CTRL

C-BUS

ARB

DMA

OUT

JTAG PORT

EXTERNAL

PORT

EXT DMA

REQ

LINK PORTS

4 8

4 8 4 8

4 8

ADDR

DATA

CTRL

TigerSHARC and the TigerSHARC logo are registered trademarks of Analog Devices, Inc.

Rev. C

Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.

COMPUTATIONAL BLOCKS

Figure 1. Functional Block Diagram

Page 2

ADSP-TS202S

General Description ................................................. 3

Dual Compute Blocks ............................................ 4

Data Alignment Buffer (DAB) .................................. 4

Dual Integer ALU (IALU) ....................................... 4

Program Sequencer ............................................... 5

Interrupt Controller ........................................... 5

Flexible Instruction Set ........................................ 5

DSP Memory ....................................................... 5

External Port (Off-Chip Memory/Peripherals Interface) . 6

Host Interface ................................................... 6

Multiprocessor Interface ...................................... 7

SDRAM Controller ............................................ 7

EPROM Interface .............................................. 7

DMA Controller ................................................... 7

Link Ports (LVDS) ................................................ 9

Timer and General-Purpose I/O ............................... 9

Reset and Booting ................................................. 9

Clock Domains .................................................... 9

Power Domains .................................................. 10

Filtering Reference Voltage and Clocks .................... 10

Development Tools ............................................. 10

Evaluation Kit .................................................... 11

Designing an Emulator-Compatible

DSP Board(Target) .......................................... 11

Additional Information ........................................ 11

Pin Function Descriptions ....................................... 12

Strap Pin Function Descriptions ................................ 20

ADSP-TS202S—Specifications .................................. 21

Operating Conditions .......................................... 21

Electrical Characteristics ....................................... 22

Absolute Maximum Ratings .................................. 23

Package Information ........................................... 23

ESD Sensitivity ................................................... 23

Timing Specifications .......................................... 24

General AC Timing .......................................... 24

Link Port Low Voltage, Differential-Signal (LVDS)

Electrical Characteristics, and Timing ................ 30

Link Port—Data Out Timing ........................... 31

Link Port—Data In Timing ............................. 34

Output Drive Currents ......................................... 36

Test Conditions .................................................. 37

Output Disable Time ........................................ 37

Output Enable Time ......................................... 38

Capacitive Loading ........................................... 38

Environmental Conditions .................................... 40

Thermal Characteristics ..................................... 40

576-Ball BGA_ED Pin Configurations ......................... 41

Outline Dimensions ................................................ 45

Surface Mount Design .......................................... 45

Ordering Guide ..................................................... 46

REVISION HISTORY

12/06—Rev. B to Rev. C

Applied Corrections and Additional Information to:

Figure 7, SCLK_VREF Filtering Scheme .................... 10

Operating Conditions ........................................... 21

Added On-Chip DRAM Refresh ............................. 27

Ordering Guide .................................................. 46

Rev. C | Page 2 of 48 | December 2006

Page 3

GENERAL DESCRIPTION

ADSP-TS202S

The ADSP-TS202S TigerSHARC processor is an ultrahigh performance, static superscalar processor optimized for large signal processing tasks and communications infrastructure. The DSP combines very wide memory widths with dual computation blocks—supporting floating-point (IEEE 32-bit and extended precision 40-bit) and fixed-point (8-, 16-, 32-, and 64-bit) processing—to set a new standard of performance for digital signal processors. The TigerSHARC static superscalar architecture lets the DSP execute up to four instructions each cycle, performing 24 fixed-point (16-bit) operations or six floating-point operations.

Four independent 128-bit wide internal data buses, each connecting to the six 2M bit memory banks, enable quad-word data, instruction, and I/O accesses and provide 28G bytes per second of internal memory bandwidth. Operating at 500 MHz, the ADSP-TS202S processor’s core has a 2.0 ns instruction cycle time. Using its single-instruction, multiple-data (SIMD) features, the ADSP-TS202S processor can perform four billion 40-bit MACS or one billion 80-bit MACS per second. Table 1 shows the DSP’s performance benchmarks.

Table 1. General-Purpose Algorithm Benchmarks at 500 MHz

Clock

Benchmark Speed

Cycles

32-bit algorithm, 1 billion MACS/s peak performance 1K point complex FFT 64K point complex FFT

(Radix 2)

(Radix 2) 2.8 ms 1397544

18.8 μs 9419

FIR filter (per real tap) 1 ns 0.5 [8 × 8][8 × 8] matrix multiply (complex,

floating-point) 2.8 μs 1399 16-bit algorithm, 4 billion MACS/s peak performance

256 point complex FFT

(Radix 2) 1.9 μs 928 I/O DMA transfer rate External port 1G bytes/s n/a Link ports (each) 1G bytes/s n/a

Cache preloaded.

The ADSP-TS202S processor is code-compatible with the other TigerSHARC processors.

The Functional Block Diagram on Page 1 shows the ADSPTS202S processor’s architectural blocks. These blocks include

• Dual compute blocks, each consisting of an ALU, multiplier, 64-bit shifter, and 32-word register file and associated data alignment buffers (DABs)

• Dual integer ALUs (IALUs), each with its own 31-word register file for data addressing and a status register

• A program sequencer with instruction alignment buffer (IAB) and branch target buffer (BTB)

• An interrupt controller that supports hardware and software interrupts, supports level- or edge-triggers, and supports prioritized, nested interrupts

• Four 128-bit internal data buses, each connecting to the six 2M-bit memory banks

• On-chip DRAM (12M-bit)

• An external port that provides the interface to host processors, multiprocessing space (DSPs), off-chip memorymapped peripherals, and external SRAM and SDRAM

• A 14-channel DMA controller

• Four full-duplex LVDS link ports

• Two 64-bit interval timers and timer expired pin

• An 1149.1 IEEE compliant JTAG test access port for onchip emulation

Figure 2 shows a typical single-processor system with external

SRAM and SDRAM. Figure 4 on Page 8 shows a typical multiprocessor system.

ADSP-TS202S

RST_IN RST_OUT

CLOCK

REFERENCE

SDRAM

MEMORY

(OPTIONAL)

CLK ADDR

RAS CAS

DATA

DQM

CKE

A10

LINK

DEVICES

(4 MAX)

(OPTIONAL)

POR_ IN

SCLK

SCLKRAT2–0

SCLK_V

REF

IRQ3–0

FLAG3–0

ID2–0

MSSD3–0 RAS CAS

LDQM

HDQM

SDWE

SDCKE

SDA10

IORD IOWR IOEN

LxDATO3–0P/N

LxCLKOUTP/N

LxACKI

LxBCMPO

LxDATI3–0P/N

LxCLKINP/N

LxACKO

LxBCMPI

CONTROLIMP1–0 TMR0E DS2–0

BMS

BRST

ADDR31–0

DATA63–0

WRH/W RL

ACK

MS1–0

MSH HBR HBG

BOFF

BR7–0

CPA DPA

DMAR3–0

BUSLOCK

JTAG

S S

R T

D D

Figure 2. ADSP-TS202S Single-Processor System with External SDRAM

A T A D

BOOT

EPROM

(OPTIONAL)

ADDR

DATA

MEMORY

(OPTIONAL)

ADDR

DATA

OE WE

ACK

HOST

PROCESSOR

INTERFACE (OPTIONAL)

ADDR

DATA

DMA DEVICE

(OPTIONAL)

DATA

Rev. C | Page 3 of 48 | December 2006

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ADSP-TS202S

The TigerSHARC DSP uses a Static Superscalar This architecture is superscalar in that the ADSP-TS202S processor’s core can execute simultaneously from one to four 32-bit instructions encoded in a very large instruction word (VLIW) instruction line using the DSP’s dual compute blocks. Because the DSP does not perform instruction reordering at runtime— the programmer selects which operations will execute in parallel prior to runtime—the order of instructions is static.

With few exceptions, an instruction line, whether it contains one, two, three, or four 32-bit instructions, executes with a throughput of one cycle in a 10-deep processor pipeline.

For optimal DSP program execution, programmers must follow the DSP’s set of instruction parallelism rules when encoding an instruction line. In general, the selection of parallel instructions that the DSP can execute in each cycle depends on both the instruction line resources each instruction requires and on the source and destination registers used in the instructions. The programmer has direct control of three core components—the IALUs, the compute blocks, and the program sequencer.

The ADSP-TS202S processor, in most cases, has a two-cycle execution pipeline that is fully interlocked, so—whenever a computation result is unavailable for another operation dependent on it—the DSP automatically inserts one or more stall cycles as needed. Efficient programming with dependency-free instructions can eliminate most computational and memory transfer data dependencies.

In addition, the ADSP-TS202S processor supports SIMD operations two ways—SIMD compute blocks and SIMD computations. The programmer can load both compute blocks with the same data (broadcast distribution) or different data (merged distribution).

DUAL COMPUTE BLOCKS

The ADSP-TS202S processor has compute blocks that can execute computations either independently or together as a single-instruction, multiple-data (SIMD) engine. The DSP can issue up to two compute instructions per compute block each cycle, instructing the ALU, multiplier, or shifter to perform independent, simultaneous operations. Each compute block can execute eight 8-bit, four 16-bit, two 32-bit, or one 64-bit SIMD computations in parallel with the operation in the other block. These computation units support IEEE 32-bit single-precision floating-point, extended-precision 40-bit floating point, and 8-, 16-, 32-, and 64-bit fixed-point processing.

The compute blocks are referred to as X and Y in assembly syntax, and each block contains three computational units—an ALU, a multiplier, and a 64-bit shifter—and a 32-word register file.

• Register File—each compute block has a multiported, 32-word, fully orthogonal register file used for transferring data between the computation units and data buses and for

†

Static Superscalar is a trademark of Analog Devices, Inc.

†

architecture.

storing intermediate results. Instructions can access the registers in the register file individually (word-aligned), in sets of two (dual-aligned), or in sets of four (quad-aligned).

• ALU—the ALU performs a standard set of arithmetic operations in both fixed- and floating-point formats. It also performs logic and permute operations.

• Multiplier—the multiplier performs both fixed- and floating-point multiplication and fixed-point multiply and accumulate.

• Shifter—the 64-bit shifter performs logical and arithmetic shifts, bit and bit stream manipulation, and field deposit and extraction operations.

Using these features, the compute blocks can

• Provide 8 MACS per cycle peak and 7.1 MACS per cycle sustained 16-bit performance and provide 2 MACS per cycle peak and 1.8 MACS per cycle sustained 32-bit performance (based on FIR)

• Execute six single-precision floating-point or execute 24 fixed-point (16-bit) operations per cycle, providing 3G FLOPS or 12.0G/s regular operations performance at 500 MHz

• Perform two complex 16-bit MACS per cycle

DATA ALIGNMENT BUFFER (DAB)

The DAB is a quad-word FIFO that enables loading of quadword data from nonaligned addresses. Normally, load instructions must be aligned to their data size so that quad words are loaded from a quad-aligned address. Using the DAB significantly improves the efficiency of some applications, such as FIR filters.

DUAL INTEGER ALU (IALU)

The ADSP-TS202S processor has two IALUs that provide powerful address generation capabilities and perform many generalpurpose integer operations. The IALUs are referred to as J and K in assembly syntax and have the following features:

• Provide memory addresses for data and update pointers

• Support circular buffering and bit-reverse addressing

• Perform general-purpose integer operations, increasing programming flexibility

• Include a 31-word register file for each IALU

As address generators, the IALUs perform immediate or indirect (pre- and post-modify) addressing. They perform modulus and bit-reverse operations with no constraints placed on memory addresses for the modulus data buffer placement. Each IALU can specify either a single-, dual-, or quad-word access from memory.

The IALUs have hardware support for circular buffers, bit reverse, and zero-overhead looping. Circular buffers facilitate efficient programming of delay lines and other data structures required in digital signal processing, and they are commonly used in digital filters and Fourier transforms. Each IALU provides registers for four circular buffers, so applications can set

Rev. C | Page 4 of 48 | December 2006

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ADSP-TS202S

up a total of eight circular buffers. The IALUs handle address pointer wraparound automatically, reducing overhead, increasing performance, and simplifying implementation. Circular buffers can start and end at any memory location.

Because the IALU’s computational pipeline is one cycle deep, in most cases integer results are available in the next cycle. Hardware (register dependency check) causes a stall if a result is unavailable in a given cycle.

PROGRAM SEQUENCER

The ADSP-TS202S processor’s program sequencer supports the following:

• A fully interruptible programming model with flexible programming in assembly and C/C++ languages; handles hardware interrupts with high throughput and no aborted instruction cycles

• A 10-cycle instruction pipeline—four-cycle fetch pipe and six-cycle execution pipe—computation results available two cycles after operands are available

• Supply of instruction fetch memory addresses; the sequencer’s instruction alignment buffer (IAB) caches up to five fetched instruction lines waiting to execute; the program sequencer extracts an instruction line from the IAB and distributes it to the appropriate core component for execution

• Management of program structures and program flow determined according to JUMP, CALL, RTI, RTS instructions, loop structures, conditions, interrupts, and software exceptions

• Branch prediction and a 128-entry branch target buffer (BTB) to reduce branch delays for efficient execution of conditional and unconditional branch instructions and zero-overhead looping; correctly predicted branches that are taken occur with zero overhead cycles, overcoming the five-to-nine stage branch penalty

• Compact code without the requirement to align code in memory; the IAB handles alignment

Interrupt Controller

The DSP supports nested and nonnested interrupts. Each interrupt type has a register in the interrupt vector table. Also, each has a bit in both the interrupt latch register and the interrupt mask register. All interrupts are fixed as either level-sensitive or edge-sensitive, except the IRQ3–0 are programmable.

The DSP distinguishes between hardware interrupts and software exceptions, handling them differently. When a software exception occurs, the DSP aborts all other instructions in the instruction pipe. When a hardware interrupt occurs, the DSP continues to execute instructions already in the instruction pipe.

hardware interrupts, which

direct the DSP to conditionally execute a multiply, an add, and a subtract in both computation blocks while it also branches to another location in the program. Some key features of the instruction set include

• Algebraic assembly language syntax

• Direct support for all DSP, imaging, and video arithmetic types

• Eliminates toggling DSP hardware modes because modes are supported as options (for example, rounding, saturation, and others) within instructions

• Branch prediction encoded in instruction; enables zerooverhead loops

• Parallelism encoded in instruction line

• Conditional execution optional for all instructions

• User-defined partitioning between program and data memory

DSP MEMORY

The DSP’s internal and external memory is organized into a unified memory map, which defines the location (address) of all elements in the system, as shown in Figure 3.

The memory map is divided into four memory areas—host space, external memory, multiprocessor space, and internal memory—and each memory space, except host memory, is subdivided into smaller memory spaces.

The ADSP-TS202S processor internal memory has 12M bits of on-chip DRAM memory, divided into six blocks of 2M bits (64K words × 32 bits). Each block—M0, M2, M4, M6, M8, and M10—can store program instructions, data, or both, so applications can configure memory to suit specific needs. Placing program instructions and data in different memory blocks, however, enables the DSP to access data while performing an instruction fetch. Each memory segment contains a 128K bit cache to enable single-cycle accesses to internal DRAM.

The six internal memory blocks connect to the four 128-bit wide internal buses through a crossbar connection, enabling the DSP to perform four memory transfers in the same cycle. The DSP’s internal bus architecture provides a total memory bandwidth of 28G bytes per second, enabling the core and I/O to access eight 32-bit data-words and four 32-bit instructions each cycle. The DSP’s flexible memory structure enables

• DSP core and I/O accesses to different memory blocks in the same cycle

• DSP core access to three memory blocks in parallel—one instruction and two data accesses

• Programmable partitioning of program and data memory

• Program access of all memory as 32-, 64-, or 128-bit words—16-bit words with the DAB

Flexible Instruction Set

The 128-bit instruction line, which can contain up to four 32-bit instructions, accommodates a variety of parallel operations for concise programming. For example, one instruction line can

Rev. C | Page 5 of 48 | December 2006

Page 6

ADSP-TS202S

INTERNAL S PACE

RESERVED

SOC R E GISTE RS (UREGS)

RESERVED

INTE RNAL REGISTERS (UREGS)

RESERVED

INTERNAL MEMORY BLOCK 1 0

RESERVED

INTERNAL MEMORY BLOCK 8

RESERVED

INTERNAL ME MORY BLOCK 6

RESERVED

INTERNAL ME MORY BLOCK 4

RESERVED

INTERNAL MEMORY BLOCK 2

RESERVED

INTERNAL MEMORY BLOCK 0

0x 03 FF FFFF

0x 00 1F0 3F F

0x001F0000

0x 001 E0 3FF

0x001E0000

0x0014FFFF

0x0 01 40 00 0

0x0010FFFF

0x0 01 00 00 0

0x000CFFFF

0x 00 0C0 000

0x0008FFFF

0x0 00 80 00 0

0x0004FFFF

0x0 00 40 00 0

0x0000FFFF

0x0 00 00 00 0

GLOBAL SPACE

HO S T ( MSH)

RESERV ED

MSSD BANK 3 (MSSD3)

E C A P S

Y R O M E M L A N R E T X E

E C A P S

Y R O M E M

R O S S E C O R P

I T L U

RESERV ED

MSSD B ANK 2 ( MSSD2)

RESERV ED

MSSD BANK 1 (MSSD1)

RESERV ED

MSSD BANK 0 (MSSD0)

BANK 1 (MS 1)

BANK 0 (MS 0)

PROC ES SOR I D 7

PROC ES SOR I D 6

PROC ES SOR I D 5

PROC ES SOR I D 4

PROC ES SOR I D 3

PROC ES SOR I D 2

PROC ES SOR I D 1

PROC ES SOR I D 0

BROADCAST

RE SE RV E D

INTERNAL ME MORY

0xFFFFFFFF

0x 80 00 00 00

0x 74 00 00 00

0x 70 00 00 00

0x 64 00 00 00

0x 60 00 00 00

0x 54 00 00 00

0x 50 00 00 00

0x4 40 00 00 0

0x4 00 00 00 0

0x 38 00 00 00

0x 300 00 00 0

0x 2C00 00 00

0x 280 00 00 0

0x 240 00 00 0

0x 200 00 00 0

0x 1C00 00 00

0x 180 00 00 0

0x 140 00 00 0

0x 100 00 00 0

0x 0C00 00 00

0x 03 FFFF FF

0x 000 00 00 0

EACH IS A C OPY

OF INTERNAL S PACE

Figure 3. ADSP-TS202S Memory Map

EXTERNAL PORT (OFF-CHIP MEMORY/PERIPHERALS INTERFACE)

The ADSP-TS202S processor’s external port provides the DSP’s interface to off-chip memory and peripherals. The 4G word address space is included in the DSP’s unified address space. The separate on-chip buses—four 128-bit data buses and four 32-bit address buses—are multiplexed at the SOC interface and transferred to the external port over the SOC bus to create an external system bus transaction. The external system bus provides a single 64-bit data bus and a single 32-bit address bus. The external port supports data transfer rates of 1G bytes per second over the external bus.

The external bus can be configured for 32-bit or 64-bit, littleendian operations. When the system bus is configured for 64-bit operations, the lower 32 bits of the external data bus connect to even addresses, and the upper 32 bits connect to odd addresses.

Rev. C | Page 6 of 48 | December 2006

The external port supports pipelined, slow, and SDRAM protocols. Addressing of external memory devices and memorymapped peripherals is facilitated by on-chip decoding of high order address lines to generate memory bank select signals.

The ADSP-TS202S processor provides programmable memory, pipeline depth, and idle cycle for synchronous accesses, and external acknowledge controls to support interfacing to pipelined or slow devices, host processors, and other memorymapped peripherals with variable access, hold, and disable time requirements.

Host Interface

The ADSP-TS202S processor provides an easy and configurable interface between its external bus and host processors through the external port. To accommodate a variety of host processors, the host interface supports pipelined or slow protocols for

Page 7

ADSP-TS202S

ADSP-TS202S processor accesses of the host as slave or pipelined for host accesses of the ADSP-TS202S processor as slave. Each protocol has programmable transmission parameters, such as idle cycles, pipe depth, and internal wait cycles.

The host interface supports burst transactions initiated by a host processor. After the host issues the starting address of the burst and asserts the BRST internally while the host continues to assert BRST

The host interface provides a deadlock recovery mechanism that enables a host to recover from deadlock situations involving the DSP. The BOFF nism. When the host asserts BOFF current transaction and asserts HBG external bus.

The host can directly read or write the internal memory of the ADSP-TS202S processor, and it can access most of the DSP registers, including DMA control (TCB) registers. Vector interrupts support efficient execution of host commands.

signal, the DSP increments the address

signal provides the deadlock recovery mecha-

, the DSP backs off the

and relinquishes the

Multiprocessor Interface

The ADSP-TS202S processor offers powerful features tailored to multiprocessing DSP systems through the external port and link ports. This multiprocessing capability provides highest bandwidth for interprocessor communication, including

• Up to eight DSPs on a common bus

• On-chip arbitration for glueless multiprocessing

• Link ports for point-to-point communication

The external port and link ports provide integrated, glueless multiprocessing support.

The external port supports a unified address space (see Figure 3) that enables direct interprocessor accesses of each ADSP-TS202S processor’s internal memory and registers. The DSP’s on-chip distributed bus arbitration logic provides simple, glueless connection for systems containing up to eight ADSP-TS202S processors and a host processor. Bus arbitration has a rotating priority. Bus lock supports indivisible readmodify-write sequences for semaphores. A bus fairness feature prevents one DSP from holding the external bus too long.

The DSP’s four link ports provide a second path for interprocessor communications with throughput of 4G bytes per second. The cluster bus provides 1G bytes per second throughput—with a total of 4G bytes per second interprocessor bandwidth (limited by SOC bandwidth).

SDRAM Controller

The SDRAM controller controls the ADSP-TS202S processor’s transfers of data to and from external synchronous DRAM (SDRAM) at a throughput of 32 bits or 64 bits per SCLK cycle using the external port and SDRAM control pins.

The SDRAM interface provides a glueless interface with standard SDRAMs—16M bits, 64M bits, 128M bits, 256M bits, and 512M bits. The DSP supports directly a maximum of four banks of 64M words × 32 bits of SDRAM. The SDRAM interface is mapped in external memory in each DSP’s unified memory map.

EPROM Interface

The ADSP-TS202S processor can be configured to boot from an external 8-bit EPROM at reset through the external port. An automatic process (which follows reset) loads a program from the EPROM into internal memory. This process uses 16 wait cycles for each read access. During booting, the BMS tions as the EPROM chip select signal. The EPROM boot procedure uses DMA Channel 0, which packs the bytes into 32-bit instructions. Applications can also access the EPROM (write flash memories) during normal operation through DMA.

The EPROM or flash memory interface is not mapped in the DSP’s unified memory map. It is a byte address space limited to a maximum of 16M bytes (24 address bits). The EPROM or flash memory interface can be used after boot via a DMA.

pin func-

DMA CONTROLLER

The ADSP-TS202S processor’s on-chip DMA controller, with 14 DMA channels, provides zero-overhead data transfers without processor intervention. The DMA controller operates independently and invisibly to the DSP’s core, enabling DMA operations to occur while the DSP’s core continues to execute program instructions.

The DMA controller performs DMA transfers between internal memory and external memory and memory-mapped peripherals, the internal memory of other DSPs on a common bus, a host processor, or link port I/O; between external memory and external peripherals or link port I/O; and between an external bus master and internal memory or link port I/O. The DMA controller performs the following DMA operations:

• External port block transfers. Four dedicated bidirectional DMA channels transfer blocks of data between the DSP’s internal memory and any external memory or memorymapped peripheral on the external bus. These transfers support master mode and handshake mode protocols.

• Link port transfers. Eight dedicated DMA channels (four transmit and four receive) transfer quad-word data only between link ports and between a link port and internal or external memory. These transfers only use handshake mode protocol. DMA priority rotates between the four receive channels.

• AutoDMA transfers. Two dedicated unidirectional DMA channels transfer data received from an external bus master to internal memory or link port I/O. These transfers only use slave mode protocol, and an external bus master must initiate the transfer.

The DMA controller provides these additional features:

• Flyby transfers. Flyby operations only occur through the external port (DMA channel 0) and do not involve the DSP’s core. The DMA controller acts as a conduit to transfer data from an external I/O device and external SDRAM memory. During a transaction, the DSP relinquishes the

Rev. C | Page 7 of 48 | December 2006

Page 8

ADSP-TS202S

001

LINK

DEVICES

000

RESET

CLOCK

REFERENCE

LINK

DEVICES

(2 MAX)

(OPTIONAL)

ID2–0

RST_IN

CLKS/REFS

ID2–0

RST_IN

CLKS/REFS

RST_OUT POR_IN

SCLK

SCLK_V

REF

SCLKRAT2–0

IRQ3–0

FLAG3–0

LINK

LxDATO3–0P/N

LxCLKOUTP/N

LxACKI

LxBCMPO

LxDATI3–0P/N

LxCLKINP/N

LxACKO

LxBCMPI

TMR0E

CONTROLIMP1–0

DS2–0

ADSP-TS202S #7 ADSP-TS202S #6 ADSP-TS202S #5 ADSP-TS202S #4 ADSP-TS202S #3 ADSP-TS202S #2

ADSP-TS202S #1

ADDR31–0

DATA31–0

CONTROL

LINK

ADSP-TS202S #0

ADDR31–0

DATA31–0

BUSLOCK

REF

DMAR3–0

MSSD3–0

JTAG

CONTROL

BR7–2,0

BR1

BR7–1

BR0

WRL

ACK

MS1–0

BMS

CPA

DPA

BRST

BOFF

HBR HBG

MSH

IORD

IOWR

IOEN

RAS CAS

LDQM

SDWE

SDCKE

SDA10

S S

O R T N O C

L O R T N O C

D A

S S

D A

ADDR

DATA

OE WE

ACK

ADDR

DATA

ADDR

DATA

CS RAS CAS

DQM

CKE

A10

ADDR

DATA

GLOBAL

MEMORY

AND

PERIPHERALS

(OPTIONAL)

BOOT

EPROM

(OPTIONAL)

CLOCK

HOST

PROCESSOR

INTERFACE (OPTIONAL)

SDRAM

MEMORY

(OPTIONAL)

CLK

Figure 4. ADSP-TS202S Shared Memory Multiprocessing System

external data bus; outputs addresses and memory selects (MSSD3–0 RD

); outputs the IORD, IOWR, IOEN, and

/WR strobes; and responds to ACK.

• DMA chaining. DMA chaining operations enable applications to automatically link one DMA transfer sequence to another for continuous transmission. The sequences can occur over different DMA channels and have different transmission attributes.

• Two-dimensional transfers. The DMA controller can access and transfer two-dimensional memory arrays on any DMA transmit or receive channel. These transfers are implemented with index, count, and modify registers for both the X and Y dimensions.

Rev. C | Page 8 of 48 | December 2006

Page 9

LINK PORTS (LVDS)

The DSP’s four full-duplex link ports each provide additional four-bit receive and four-bit transmit I/O capability, using low voltage, differential-signal (LVDS) technology. With the ability to operate at a double data rate—latching data on both the rising and falling edges of the clock—running at 500 MHz, each link port can support up to 500M bytes per second per direction, for a combined maximum throughput of 4G bytes per second.

The link ports provide an optional communications channel that is useful in multiprocessor systems for implementing pointto-point interprocessor communications. Applications can also use the link ports for booting.

Each link port has its own triple-buffered quad-word input and double-buffered quad-word output registers. The DSP’s core can write directly to a link port’s transmit register and read from a receive register, or the DMA controller can perform DMA transfers through eight (four transmit and four receive) dedicated link port DMA channels.

Each link port direction has three signals that control its operation. For the transmitter, LxCLKOUT is the output transmit clock, LxACKI is the handshake input to control the data flow, and the LxBCMPO

output indicates that the block transfer is complete. For the receiver, LxCLKIN is the input receive clock, LxACKO is the handshake output to control the data flow, and the LxBCMPI

input indicates that the block transfer is complete. The LxDATO3–0 pins are the data output bus for the transmitter and the LxDATI3–0 pins are the input data bus for the receiver.

Applications can program separate error detection mechanisms for transmit and receive operations (applications can use the checksum mechanism to implement consecutive link port transfers), the size of data packets, and the speed at which bytes are transmitted.

TIMER AND GENERAL-PURPOSE I/O

The ADSP-TS202S processor has a timer pin (TMR0E) that generates output when a programmed timer counter has expired and four programmable general-purpose I/O pins (FLAG3–0) that can function as either single-bit input or output. As outputs, these pins can signal peripheral devices; as inputs, they can provide the test for conditional branching.

RESET AND BOOTING

The ADSP-TS202S processor has three levels of reset:

• Power-up reset—after power-up of the system (SCLK, all static inputs, and strap pins are stable), the RST_IN must be asserted (low).

• Normal reset—for any chip reset following the power-up reset, the RST_IN

pin must be asserted (low).

• DSP-core reset—when setting the SWRST bit in EMUCTL, the DSP core is reset, but not the external port or I/O.

For normal operations, tie the RST_OUT POR_IN

pin.

pin to the

ADSP-TS202S

After reset, the ADSP-TS202S processor has four boot options for beginning operation:

• Boot from EPROM.

• Boot by an external master (host or another ADSP-TS202S processor).

•Boot by link port.

• No boot—start running from memory address selected with one of the IRQ3–0

Using the “no boot” option, the ADSP-TS202S processor must start running from memory when one of the interrupts is asserted.

Table 2. No Boot, Run from Memory Addresses

Interrupt Address

IRQ0 IRQ1 IRQ2 IRQ3

0x3000 0000 (External Memory) 0x3800 0000 (External Memory) 0x8000 0000 (External Memory) 0x0000 0000 (Internal Memory)

The ADSP-TS202S processor core always exits from reset in the idle state and waits for an interrupt. Some of the interrupts in the interrupt vector table are initialized and enabled after reset.

For more information on boot options, see the EE-200:

ADSP-TS20x TigerSHARC Processor Boot Loader Kernels Operation on the Analog Devices website (www.analog.com).

CLOCK DOMAINS

The DSP uses calculated ratios of the SCLK clock to operate as shown in Figure 5. The instruction execution rate is equal to CCLK. A PLL from SCLK generates CCLK, which is phaselocked. The SCLKRATx pins define the clock multiplication of SCLK to CCLK (see Table 4 on Page 12). The link port clock is generated from CCLK via a software programmable divisor, and the SOC bus operates at 1/2 CCLK. Memory transfers to external, and link port buffers operate at the SOCCLK rate. SCLK also provides clock input for the external bus interface and defines the ac specification reference for the external bus signals. The external bus interface runs at the SCLK frequency. The maximum SCLK frequency is one quarter the internal DSP clock (CCLK) frequency.

SCLK

SCLKRATx

LCTLx REGISTER

PLL

SPD B ITS,

interrupt signals. See Table 2.

EXTERNAL INTERFACE

CCLK (INSTRUCTION RATE)

/CR

Figure 5. Clock Domains

SOCCLK (PERIPHERAL BUS RATE)

LxCLKOUT (LINK OUTPUT RATE)

Rev. C | Page 9 of 48 | December 2006

Page 10

ADSP-TS202S

POWER DOMAINS

The ADSP-TS202S processor has separate power supply connections for internal logic (V buffer (V

), and internal DRAM (V

DD_IO

Note that the analog (V

), analog circuits (V

DD_DRAM

) supply powers the clock generator

DD_A

) power supply.

), I/O

PLLs. To produce a stable clock, systems must provide a clean power supply to power input V attention to bypassing the V

. Designs must pay critical

DD_A

supply.

DD_A

FILTERING REFERENCE VOLTAGE AND CLOCKS

Figure 6 and Figure 7 show possible circuits for filtering V

and SCLK_V

. These circuits provide the reference voltages

REF

for the switching voltage reference and system clock reference.

DD_IO

R2 C1 C2

R1: 2k⍀ SERIES RESISTOR (±1%) R2: 2.55k⍀ SERIES RES ISTOR (±1%) C1: 1␮F CAPACITOR (SMD) C2: 1nF CAP ACITOR (HF SMD) PLACED CLOSE TO DSP’S PINS

Figure 6. V

CLOCK DRIVER

VOLTAGE OR

DD_IO

R2 C1 C2

R1: 2k⍀ SERIES RESISTOR (±1%) R2: 2.55k⍀ SERIES RESISTOR (±1%) C1: 1␮F CAPACI TOR (SMD) C2: 1nF CAPACITOR (HF SMD) PLACED CLOSE TO DSP’S PINS

IF CLOCK DRIVER VOLTAGE > V

Figure 7. SCLK_V

Filtering Scheme

REF

DD_IO

Filtering Scheme

REF

SCLK_V

REF

DEVELOPMENT TOOLS

The ADSP-TS202S processor is supported with a complete set of CROSSCORE including Analog Devices emulators and VisualDSP++ opment environment. The same emulator hardware that supports other TigerSHARC processors also fully emulates the ADSP-TS202S processor.

†

CROSSCORE is a registered trademark of Analog Devices, Inc.

‡

VisualDSP++ is a registered trademark of Analog Devices, Inc.

†

software and hardware development tools,

‡

devel-

The VisualDSP++ project management environment lets programmers develop and debug an application. This environment includes an easy to use assembler (which is based on an algebraic syntax), an archiver (librarian/library builder), a linker, a loader, a cycle-accurate instruction-level simulator, a C/C++ compiler, and a C/C++ run-time library that includes DSP and mathematical functions. A key point for theses tools is C/C++ code efficiency. The compiler has been developed for efficient translation of C/C++ code to DSP assembly. The DSP has architectural features that improve the efficiency of compiled C/C++ code.

The VisualDSP++ debugger has a number of important features. Data visualization is enhanced by a plotting package that offers a significant level of flexibility. This graphical representation of user data enables the programmer to quickly determine the performance of an algorithm. As algorithms grow in complexity, this capability can have increasing significance on the designer’s development schedule, increasing productivity. Statistical profiling enables the programmer to nonintrusively poll the processor as it is running the program. This feature, unique to VisualDSP++, enables the software developer to passively gather important code execution metrics without interrupting the real-time characteristics of the program. Essentially, the developer can identify bottlenecks in software quickly and efficiently. By using the profiler, the programmer can focus on those areas in the program that impact performance and take corrective action.

Debugging both C/C++ and assembly programs with the VisualDSP++ debugger, programmers can

• View mixed C/C++ and assembly code (interleaved source and object information)

• Insert breakpoints

• Set conditional breakpoints on registers, memory, and stacks

• Trace instruction execution

• Perform linear or statistical profiling of program execution

• Fill, dump, and graphically plot the contents of memory

• Perform source level debugging

• Create custom debugger windows

The VisualDSP++ IDE lets programmers define and manage DSP software development. Its dialog boxes and property pages let programmers configure and manage all of the TigerSHARC processor development tools, including the color syntax highlighting in the VisualDSP++ editor. This capability permits programmers to

• Control how the development tools process inputs and generate outputs

• Maintain a one-to-one correspondence with the tool’s command line switches

The VisualDSP++ Kernel (VDK) incorporates scheduling and resource management tailored specifically to address the memory and timing constraints of DSP programming. These capabilities enable engineers to develop code more effectively,

Rev. C | Page 10 of 48 | December 2006

Page 11

ADSP-TS202S

eliminating the need to start from the very beginning, when developing new application code. The VDK features include threads, critical and unscheduled regions, semaphores, events, and device flags. The VDK also supports priority-based, preemptive, cooperative, and time-sliced scheduling approaches. In addition, the VDK was designed to be scalable. If the application does not use a specific feature, the support code for that feature is excluded from the target system.

Because the VDK is a library, a developer can decide whether to use it or not. The VDK is integrated into the VisualDSP++ development environment, but can also be used via standard command line tools. When the VDK is used, the development environment assists the developer with many error-prone tasks and assists in managing system resources, automating the generation of various VDK-based objects, and visualizing the system state, when debugging an application that uses the VDK.

VCSE is Analog Devices technology for creating, using, and reusing software components (independent modules of substantial functionality) to quickly and reliably assemble software applications. It also can be used for downloading components from the Web, dropping them into the application, and publishing component archives from within VisualDSP++. VCSE supports component implementation in C/C++ or assembly language.

Use the expert linker to visually manipulate the placement of code and data on the embedded system, view memory use in a color-coded graphical form, easily move code and data to different areas of the DSP or external memory with a drag of the mouse, and examine runtime stack and heap usage. The expert linker is fully compatible with existing linker definition file (LDF), allowing the developer to move between the graphical and textual environments.

Analog Devices DSP emulators use the IEEE 1149.1 JTAG test access port of the ADSP-TS202S processor to monitor and control the target board processor during emulation. The emulator provides full speed emulation, allowing inspection and modification of memory, registers, and processor stacks. Nonintrusive in-circuit emulation is assured by the use of the processor’s JTAG interface—the emulator does not affect target system loading or timing.

In addition to the software and hardware development tools available from Analog Devices, third parties provide a wide range of tools supporting the TigerSHARC processor family. Hardware tools include TigerSHARC processor PC plug-in cards. Third party software tools include DSP libraries, realtime operating systems, and block diagram design tools.

EVALUATION KIT

Analog Devices offers a range of EZ-KIT Lite forms to use as a cost-effective method to learn more about developing or prototyping applications with Analog Devices processors, platforms, and software tools. Each EZ-KIT Lite includes an evaluation board along with an evaluation suite of the VisualDSP++ development and debugging environment

†

evaluation plat-

with the C/C++ compiler, assembler, and linker. Also included are sample application programs, power supply, and a USB cable. All evaluation versions of the software tools are limited for use only with the EZ-KIT Lite product.

The USB controller on the EZ-KIT Lite board connects the board to the USB port of the user’s PC, enabling the VisualDSP++ evaluation suite to emulate the on-board processor in-circuit. This permits the customer to download, execute, and debug programs for the EZ-KIT Lite system. It also allows in-circuit programming of the on-board flash device to store user-specific boot code, enabling the board to run as a standalone unit, without being connected to the PC.

With a full version of VisualDSP++ installed (sold separately), engineers can develop software for the EZ-KIT Lite or any custom-defined system. Connecting one of Analog Devices JTAG emulators to the EZ-KIT Lite board enables high speed, nonintrusive emulation.

DESIGNING AN EMULATOR-COMPATIBLE DSP BOARD (TARGET)

The Analog Devices family of emulators are tools that every DSP developer needs to test and debug hardware and software systems. Analog Devices has supplied an IEEE 1149.1 JTAG test access port (TAP) on each JTAG DSP. The emulator uses the TAP to access the internal features of the DSP, allowing the developer to load code, set breakpoints, observe variables, observe memory, and examine registers. The DSP must be halted to send data and commands, but once an operation has been completed by the emulator, the DSP system is set running at full speed with no impact on system timing.

To use these emulators, the target board must include a header that connects the DSP’s JTAG port to the emulator.

For details on target board design issues including mechanical layout, single processor connections, multiprocessor scan chains, signal buffering, signal termination, and emulator pod logic, see the EE-68: Analog Devices JTAG Emulation Technical Reference on the Analog Devices website (www.analog.com)— use the string “EE-68” in site search. This document is updated regularly to keep pace with improvements to emulator support.

ADDITIONAL INFORMATION

This data sheet provides a general overview of the ADSP-TS202S processor’s architecture and functionality. For detailed information on the ADSP-TS202S processor’s core architecture and instruction set, see the ADSP-TS201 Tiger-

SHARC Processor Hardware Reference and the ADSP-TS201 TigerSHARC Processor Programming Reference. For detailed

information on the development tools for this processor, see the VisualDSP++ User’s Guide for TigerSHARC Processors.

†

EZ-Kit Lite is a registered trademark of Analog Devices, Inc.

Rev. C | Page 11 of 48 | December 2006

Page 12

ADSP-TS202S

PIN FUNCTION DESCRIPTIONS

While most of the ADSP-TS202S processor’s input pins are normally synchronous—tied to a specific clock—a few are asynchronous. For these asynchronous signals, an on-chip synchronization circuit prevents metastability problems. Use the ac specification for asynchronous signals when the system design requires predictable, cycle-by-cycle behavior for these signals.

The output pins can be three-stated during normal operation. The DSP three-states all outputs during reset, allowing these pins to get to their internal pull-up or pull-down state. Some pins have an internal pull-up or pull-down resistor (±30% tolerance) that maintains a known value during transitions between different drivers.

Table 3. Pin Definitions—Clocks and Reset

Signal Type Term Description

SCLKRAT2–0 I (pd) na Core Clock Ratio. The DSP’s core clock (CCLK) rate = n × SCLK, where n is user-program-

mable using the SCLKRATx pins to the values shown in Tab le 4 . These pins may change only during reset; connect these pins to V

or VSS. All reset specifications in

DD_IO

Tab le 25 , Tab le 2 6, and Ta ble 2 7 must be satisfied. The core clock rate (CCLK) is the

instruction cycle rate.

SCLK I na System Clock Input. The DSP’s system input clock for cluster bus.The core clock rate

is user-programmable using the SCLKRATx pins. For more information, see Clock

Domains on Page 9.

RST_IN

I/A na Reset. Sets the DSP to a known state and causes program to be in idle state. RST_IN

must be asserted a specified time according to the type of reset operation. For details,

see Reset and Booting on Page 9, Table 21 on Page 24, and Figure 14 on Page 27. RST_OUT POR_IN

O na Reset Output. Indicates that the DSP reset is complete. Connect to POR_IN. I/A na Power-On Reset for internal DRAM. Connect to RST_OUT.

I = input; A = asynchronous; O = output; OD = open-drain output; T = three-state; P = power supply; G = ground; pd = internal pull-down 5 k

Ω; pu = internal pull-up 5 kΩ; pd_0 = internal pull-down 5 kΩ on DSP ID = 0; pu_0 = internal pull-up 5 kΩ on DSP

ID = 0; pu_od_0 = internal pull-up 500 Ω on DSP ID = 0; pd_m = internal pull-down 5 kΩ on DSP bus master; pu_m = internal pull-up 5 kΩ on DSP bus master; pu_ad = internal pull-up 40 k

Term (termination of unused pins) column symbols: epd = external pull-down approximately 5 k imately 5 kΩ to V

, nc = not connected; na = not applicable (always used); V

DD_IO

Ω. For more pull-down and pull-up information, see Electrical Characteristics on Page 22.

Ω to V

; epu = external pull-up approx-

= connect directly to V

DD_IO

; VSS = connect directly to V

DD_IO

Table 4. SCLK Ratio

SCLKRAT2–0 Ratio

000 (default) 4 001 5 010 6 011 7 100 8 101 10 110 12 111 Reserved

Rev. C | Page 12 of 48 | December 2006

Page 13

ADSP-TS202S

Table 5. Pin Definitions—External Port Bus Controls

Signal Type Term Description

ADDR31–0 I/O/T

(pu_ad)

DATA63–0 I/O/T

(pu_ad)

I/O/T (pu_0)

WRL

I/O/T (pu_0)

WRH

I/O/T (pu_0)

ACK I/O/T/OD

(pu_od_0)

BMS

O/T (pu_0)

MS1–0

O/T (pu_0)

MSH

O/T (pu_0)

BRST

I/O/T (pu_0)

I = input; A = asynchronous; O = output; OD = open-drain output; T = three-state; P = power supply; G = ground; pd = internal pull-down 5k

Ω; pu = internal pull-up 5 kΩ; pd_0 = internal pull-down 5 kΩ on DSP ID = 0; pu_0 = internal pull-up 5 kΩ on DSP ID = 0; pu_od_0 = internal

pull-up 500 = internal pull-up 40 k

Ω on DSP ID = 0; pd_m = internal pull-down 5 kΩ on DSP bus master; pu_m = internal pull-up 5 kΩ on DSP bus master; pu_ad

Ω. For more pull-down and pull-up information, see Electrical Characteristics on Page 22.

Term (termination of unused pins) column symbols: epd = external pull-down approximately 5 k imately 5 k

This external pull-up may be omitted for the ID = 000 TigerSHARC processor.

Ω to V

, nc = not connected; na = not applicable (always used); V

DD_IO

nc Address Bus. The DSP issues addresses for accessing memory and peripherals on

these pins. In a multiprocessor system, the bus master drives addresses for accessing internal memory or I/O processor registers of other ADSP-TS202S processors. The DSP inputs addresses when a host or another DSP accesses its internal memory or I/O processor registers.

nc External Data Bus. The DSP drives and receives data and instructions on these pins.

Pull-up or pull-down resistors on unused DATA pins are unnecessary.

epu

Memory Read. RD is asserted whenever the DSP reads from any slave in the system, excluding SDRAM. When the DSP is a slave, RD

is an input and indicates read transactions that access its internal memory or universal registers. In a multiprocessor system, the bus master drives RD. RD changes concurrently with ADDR pins.

epu

Write Low. WRL is asserted in two cases: when the ADSP-TS202S processor writes to an even address word of external memory or to another external bus agent; and when the ADSP-TS202S processor writes to a 32-bit zone (host, memory, or DSP programmed to 32-bit bus). An external master (host or DSP) asserts WRL

for writing to a DSP’s low word of internal memory. In a multiprocessor system, the bus master drives WRL

. WRL changes concurrently with ADDR pins. When the DSP is a slave, WRL is an input and indicates write transactions that access its internal memory or universal registers.

epu

Write High. WRH is asserted when the ADSP-TS202S processor writes a long word (64 bits) or writes to an odd address word of external memory or to another external bus agent on a 64-bit data bus. An external master (host or another DSP) must assert

for writing to a DSP’s high word of 64-bit data bus. In a multiprocessing system,

WRH the bus master drives WRH

. WRH changes concurrently with ADDR pins. When the DSP is a slave, WRH is an input and indicates write transactions that access its internal memory or universal registers.

epu

Acknowledge. External slave devices can deassert ACK to add wait states to external memory accesses. ACK is used by I/O devices, memory controllers, and other peripherals on the data phase. The DSP can deassert ACK to add wait states to read and write accesses of its internal memory. The pull-up is 50 Ω on low-to-high transactions and is 500 Ω on all other transactions.

na Boot Memory Select. BMS is the chip select for boot EPROM or flash memory. During

reset, the DSP uses BMS cessor system, the DSP bus master drives BMS

as a strap pin (EBOOT) for EPROM boot mode. In a multipro-

. For details, see Reset and Booting on

Page 9 and the EBOOT signal description in Table 16 on Page 20.

nc Memory Select. MS0 or MS1 is asserted whenever the DSP accesses memory banks 0

or 1, respectively. MS1–0 with ADDR pins. When ADDR31:27 = 0b00110, MS0

are decoded memory address pins that change concurrently

is asserted. When ADDR31:27 =

0b00111, MS1 is asserted. In multiprocessor systems, the master DSP drives MS1–0.

nc Memory Select Host. MSH is asserted whenever the DSP accesses the host address

space (ADDR31 = 0b1). MSH

is a decoded memory address pin that changes concur-

rently with ADDR pins. In a multiprocessor system, the bus master DSP drives MSH

epu

Burst. The current bus master (DSP or host) asserts this pin to indicate that it is reading or writing data associated with consecutive addresses. A slave device can ignore addresses after the first one and increment an internal address counter after each transfer. For host-to-DSP burst accesses, the DSP increments the address automatically while BRST

is asserted.

DD_IO

Ω to V

= connect directly to V

; epu = external pull-up approx-

; VSS = connect directly to V

DD_IO

Rev. C | Page 13 of 48 | December 2006

Page 14

ADSP-TS202S

Table 6. Pin Definitions—External Port Arbitration

Signal Type Term Description

BR7–0

I/O V

DD_IO

Multiprocessing Bus Request Pins. Used by the DSPs in a multiprocessor system to arbitrate for bus mastership. Each DSP drives its own BRx line (corresponding to the value of its ID2–0 inputs) and monitors all others. In systems with fewer than eight DSPs, set the unused BRx

pins high (V

DD_IO

ID2–0 I (pd) na Multiprocessor ID. Indicates the DSP’s ID, from which the DSP determines its order in

a multiprocessor system. These pins also indicate to the DSP which bus request (BR0

–BR7) to assert when requesting the bus: 000 = BR0, 001 = BR1, 010 = BR2,

011 = BR3

, 100 = BR4, 101 = BR5, 110 = BR6, or 111 = BR7. ID2–0 must have a

constant value during system operation and can change during reset only.

O na Bus Master. The current bus master DSP asserts BM. For debugging only. At reset this

is a strap pin. For more information, see Table 16 on Page 20.

BOFF

I epu Back Off. A deadlock situation can occur when the host and a DSP try to read from

each other’s bus at the same time. When deadlock occurs, the host can assert BOFF to force the DSP to relinquish the bus before completing its outstanding transaction.

BUSLOCK O/T

(pu_0)

HBR

I epu Host Bus Request. A host must assert HBR to request con trol of the DSP’s extern al bus.

na Bus Lock Indication. Provides an indication that the current bus master has locked the

bus. At reset, this is a strap pin. For more information, see Table 16 on Page 20.

When HBR

is asserted in a multiprocessing system, the bus master relinquishes the

bus and asserts HBG once the outstanding transaction is finished.

HBG

I/O/T (pu_0)

epu

Host Bus Grant. Acknowledges HBR and indicates that the host can take control of the external bus. When relinquishing the bus, the master DSP three-states the ADDR31–0, DATA63–0, MSH

, MSSD3–0, MS1–0, RD, WRL, WRH, BMS, BRST, IORD, IOWR, IOEN, RAS, CAS, SDWE, SDA10, SDCKE, LDQM, and HDQM pins, and the DSP puts the SDRAM in self-refresh mode. The DSP asserts HBG

until the host deasserts HBR. In multiprocessor systems, the current bus master DSP drives HBG, and all slave DSPs monitor it.

CPA

I/O/OD (pu_od_0)

epu

Core Priority Access. Asserted while the DSP’s core accesses external memory. This pin enables a slave DSP to interrupt a master DSP’s background DMA transfers and gain control of the external bus for core-initiated transactions. CPA

is an open-drain output, connected to all DSPs in the system. If not required in the system, leave CPA unconnected (external pull-ups will be required for DSP ID = 1 through ID = 7).

DPA

I/O/OD (pu_od_0)

epu

DMA Priority Access. Asserted while a high priority DSP DMA channel accesses external memory. This pin enables a high priority DMA channel on a slave DSP to interrupt transfers of a normal priority DMA channel on a master DSP and gain control of the external bus for DMA-initiated transactions. DPA connected to all DSPs in the system. If not required in the system, leave DPA

is an open-drain output,

uncon-

nected (external pull-ups will be required for DSP ID = 1 through ID = 7).

I = input; A = asynchronous; O = output; OD = open-drain output; T = three-state; P = power supply; G = ground; pd = internal pull-down 5k

Ω; pu = internal pull-up 5 kΩ; pd_0 = internal pull-down 5 kΩ on DSP ID = 0; pu_0 = internal pull-up 5 kΩ on DSP ID = 0; pu_od_0 = internal

pull-up 500 = internal pull-up 40 k

Term (termination of unused pins) column symbols: epd = external pull-down approximately 5 k imately 5 k

The BRx pin matching the ID2–0 input selection for the processor should be left nc if unused. For example, the processor with ID = 000 has BR0 = nc and BR7–1 = V

This external pull-up resistor may be omitted for the ID = 000 TigerSHARC processor.

Ω on DSP ID = 0; pd_m = internal pull-down 5 kΩ on DSP bus master; pu_m = internal pull-up 5 kΩ on DSP bus master; pu_ad

Ω. For more pull-down and pull-up information, see Electrical Characteristics on Page 22.

Ω to V

; epu = external pull-up approx-

Ω to V

, nc = not connected; na = not applicable (always used); V

DD_IO

= connect directly to V

DD_IO

; VSS = connect directly to V

DD_IO

Rev. C | Page 14 of 48 | December 2006

Page 15

ADSP-TS202S

Table 7. Pin Definitions—External Port DMA/Flyby

Signal Type Term Description

DMAR3–0

IOWR

IORD

IOEN

I = input; A = asynchronous; O = output; OD = open-drain output; T = three-state; P = power supply; G = ground; pd = internal pull-down 5kΩ; pu = internal pull-up 5 kΩ; pd_0 = internal pull-down 5 kΩ on DSP ID = 0; pu_0 = internal pull-up 5 kΩ on DSP ID = 0; pu_od_0 = internal pull-up 500

Ω on DSP ID = 0; pd_m = internal pull-down 5 kΩ on DSP bus master; pu_m = internal pull-up 5 kΩ on DSP bus master; pu_ad

= internal pull-up 40 kΩ. For more pull-down and pull-up information, see Electrical Characteristics on Page 22. Term (termination of unused pins) column symbols: epd = external pull-down approximately 5 k

imately 5 k

Ω to V

Table 8. Pin Definitions—External Port SDRAM Controller

I/A epu DMA Request Pins. Enable external I/O devices to request DMA services from the DSP.

In response to DMARx, the DSP performs DMA transfers according to the DMA channel’s initialization. The DSP ignores DMA requests from uninitialized channels.

O/T (pu_0)

nc I/O Write. When a DSP DMA channel initiates a flyby mode read transaction, the DSP

asserts the IOWR

signal during the data cycles. This assertion makes the I/O device

sample the data instead of the TigerSHARC.

O/T (pu_0)

nc I/O Read. When a DSP DMA channel initiates a flyby mode write transaction, the DSP

asserts the IORD signal during the data cycle. This assertion with the IOEN makes the I/O device drive the data instead of the TigerSHARC.

O/T (pu_0)

nc I/O Device Output Enable. Enables the output buffers of an external I/O device for fly-

by transactions between the device and external memory. Active on flyby transactions.

Ω to V

; epu = external pull-up approx-

, nc = not connected; na = not applicable (always used); V

DD_IO

= connect directly to V

DD_IO

; VSS = connect directly to V

DD_IO

Signal Type Term Description

MSSD3–0

I/O/T (pu_0)

nc Memory Select SDRAM. MSSD0, MSSD1, MSSD2, or MSSD3 is asserted whenever the

DSP accesses SDRAM memory space. MSSD3–0 are decoded memory address pins that are asserted whenever the DSP issues an SDRAM command cycle (access to ADDR31:30 = 0b01—except reserved spaces shown in Figure 3 on Page 6). In a multi-

RAS

I/O/T (pu_0)

processor system, the master DSP drives MSSD3–0

nc Row Address Select. When sampled low, RAS indicates that a row address is valid in

a read or write of SDRAM. In other SDRAM accesses, it defines the type of operation to execute according to SDRAM specification.

CAS I/O/T

(pu_0)

nc Column Address Select. When sampled low, CAS indicates that a column address is

valid in a read or write of SDRAM. In other SDRAM accesses, it defines the type of operation to execute according to the SDRAM specification.

LDQM O/T

(pu_0)

nc Low Word SDRAM Data Mask. When sampled high, three-states the SDRAM DQ

buffers. LDQM is valid on SDRAM transactions when CAS

is asserted, and inactive on read transactions. On write transactions, LDQM is active when accessing an odd address word on a 64-bit memory bus to disable the write of the low word.

HDQM O/T

(pu_0)

nc High Word SDRAM Data Mask. When sampled high, three-states the SDRAM DQ

buffers. HDQM is valid on SDRAM transactions when CAS is asserted, and inactive on read transactions. On write transactions, HDQM is active when accessing an even address in word accesses or when memory is configured for a 32-bit bus to disable the write of the high word.

I = input; A = asynchronous; O = output; OD = open-drain output; T = three-state; P = power supply; G = ground; pd = internal pull-down

Ω; pu = internal pull-up 5 kΩ; pd_0 = internal pull-down 5 kΩ on DSP ID = 0; pu_0 = internal pull-up 5 kΩ on DSP ID = 0; pu_od_0 = internal

5k pull-up 500 = internal pull-up 40 k

Term (termination of unused pins) column symbols: epd = external pull-down approximately 5 k imately 5 k

Ω on DSP ID = 0; pd_m = internal pull-down 5 kΩ on DSP bus master; pu_m = internal pull-up 5 kΩ on DSP bus master; pu_ad

Ω. For more pull-down and pull-up information, see Electrical Characteristics on Page 22.

Ω to V

; epu = external pull-up approx-

Ω to V

, nc = not connected; na = not applicable (always used); V

DD_IO

= connect directly to V

DD_IO

; VSS = connect directly to V

DD_IO

Rev. C | Page 15 of 48 | December 2006

Page 16

ADSP-TS202S

Table 8. Pin Definitions—External Port SDRAM Controller (Continued)

Signal Type Term Description

SDA10 O/T

(pu_0)

SDCKE I/O/T

(pu_m/ pd_m)

SDWE

I/O/T (pu_0)

I = input; A = asynchronous; O = output; OD = open-drain output; T = three-state; P = power supply; G = ground; pd = internal pull-down

Ω; pu = internal pull-up 5 kΩ; pd_0 = internal pull-down 5 kΩ on DSP ID = 0; pu_0 = internal pull-up 5 kΩ on DSP ID = 0; pu_od_0 = internal

5k pull-up 500 = internal pull-up 40 k

Ω on DSP ID = 0; pd_m = internal pull-down 5 kΩ on DSP bus master; pu_m = internal pull-up 5 kΩ on DSP bus master; pu_ad

Ω. For more pull-down and pull-up information, see Electrical Characteristics on Page 22.

Term (termination of unused pins) column symbols: epd = external pull-down approximately 5 k imately 5 kΩ to V

, nc = not connected; na = not applicable (always used); V

DD_IO

Table 9. Pin Definitions—JTAG Port

nc SDRAM Address Bit 10. Separate A10 signals enable SDRAM refresh operation while

the DSP executes non-SDRAM transactions.

nc SDRAM Clock Enable. Activates the SDRAM clock for SDRAM self-refresh or suspend

modes. A slave DSP in a multiprocessor system does not have the pull-up or pulldown. A master DSP (or ID = 0 in a single processor system) has a pull-up before granting the bus to the host, except when the SDRAM is put in self refresh mode. In self refresh mode, the master has a pull-down before granting the bus to the host.

nc SDRAM Write Enable. When sampled low while CAS is active, SDWE indicates an

SDRAM write access. When sampled high while CAS

is active, SDWE indicates an SDRAM read access. In other SDRAM accesses, SDWE defines the type of operation to execute according to SDRAM specification.

Ω to V

; epu = external pull-up approx-

= connect directly to V

DD_IO

; VSS = connect directly to V

DD_IO

Signal Type Term Description

EMU

O/OD nc TCK I epd or epu TDI I (pu_ad) nc TDO O/T nc TMS I (pu_ad) nc TRST

I/A (pu_ad) na Test Reset (JTAG). Resets the test state machine. TRST must be asserted or pulsed low

Emulation. Connected to the DSP’s JTAG emulator target board connector only.

Test Clock (JTAG). Provides an asynchronous clock for JTAG scan. Test Data Input (JTAG). A serial data input of the scan path. Test Data Output (JTAG). A serial data output of the scan path. Test Mode Select (JTAG). Used to control the test state machine.

after power-up for proper device operation. For more information, see Reset and

Booting on Page 9.

I = input; A = asynchronous; O = output; OD = open-drain output; T = three-state; P = power supply; G = ground; pd = internal pull-down 5k

Ω; pu = internal pull-up 5 kΩ; pd_0 = internal pull-down 5 kΩ on DSP ID = 0; pu_0 = internal pull-up 5 kΩ on DSP ID = 0; pu_od_0 = internal

pull-up 500 = internal pull-up 40 k

Term (termination of unused pins) column symbols: epd = external pull-down approximately 5 k imately 5 kΩ to V

See the reference on Page 11 to the JTAG emulation technical reference EE-68.

Ω on DSP ID = 0; pd_m = internal pull-down 5 kΩ on DSP bus master; pu_m = internal pull-up 5 kΩ on DSP bus master; pu_ad

Ω. For more pull-down and pull-up information, see Electrical Characteristics on Page 22.

Ω to V

; epu = external pull-up approx-

, nc = not connected; na = not applicable (always used); V

DD_IO

= connect directly to V

DD_IO

; VSS = connect directly to V

DD_IO

Rev. C | Page 16 of 48 | December 2006

Page 17

ADSP-TS202S

Table 10. Pin Definitions—Flags, Interrupts, and Timer

Signal Type Term Description

FLAG3–0 I/O/A

(pu)

IRQ3–0

I/A (pu)

TMR0E O na Timer 0 expires. This output pulses whenever timer 0 expires. At reset, this is a strap pin.

I = input; A = asynchronous; O = output; OD = open-drain output; T = three-state; P = power supply; G = ground; pd = internal pull-down

Ω; pu = internal pull-up 5 kΩ; pd_0 = internal pull-down 5 kΩ on DSP ID = 0; pu_0 = internal pull-up 5 kΩ on DSP ID = 0; pu_od_0 = internal

5k pull-up 500 Ω on DSP ID = 0; pd_m = internal pull-down 5 kΩ on DSP bus master; pu_m = internal pull-up 5 kΩ on DSP bus master; pu_ad = internal pull-up 40 kΩ. For more pull-down and pull-up information, see Electrical Characteristics on Page 22.

Term (termination of unused pins) column symbols: epd = external pull-down approximately 5 k imately 5 k

Ω to V

, nc = not connected; na = not applicable (always used); V

DD_IO

Table 11. Pin Definitions—Link Ports

Signal Type Term Description

LxDATO3–0P O nc Link Ports 3–0 Data 3–0 Transmit LVDS P LxDATO3–0N O nc Link Ports 3–0 Data 3–0 Transmit LVDS N LxCLKOUTP O nc Link Ports 3–0 Transmit Clock LVDS P LxCLKOUTN O nc Link Ports 3–0 Transmit Clock LVDS N LxACKI I (pd) nc Link Ports 3–0 Receive Acknowledge. Using this signal, the receiver indicates to the

LxBCMPO

O (pu) nc Link Ports 3–0 Block Completion. When the transmission is executed using DMA, this

LxDATI3–0P I V LxDATI3–0N I V LxCLKINP I/A V LxCLKINN I/A V LxACKO O nc Link Ports 3–0 Transmit Acknowledge. Using this signal, the receiver indicates to the

LxBCMPI

I (pd_l) V

I = input; A = asynchronous; O = output; OD = open-drain output; T = three-state; P = power supply; G = ground; pd = internal pull-down 5k

Ω; pu = internal pull-up 5 kΩ; pd_0 = internal pull-down 5 kΩ on DSP ID = 0; pu_0 = internal pull-up 5 kΩ on DSP ID = 0; pu_od_0 = internal

pull-up 500 = internal pull-up 40 k

Ω on DSP ID = 0; pd_m = internal pull-down 5 kΩ on DSP bus master; pu_m = internal pull-up 5 kΩ on DSP bus master; pu_ad

Ω; pd_l = internal pull-down 50 kΩ. For more pull-down and pull-up information, see Electrical Characteristics on

Page 22.

Term (termination of unused pins) column symbols: epd = external pull-down approximately 5 k imately 5 kΩ to V

, nc = not connected; na = not applicable (always used); V

DD_IO

nc FLAG pins. Bidirectional input/output pins can be used as program conditions. Each pin

can be configured individually for input or for output. FLAG3–0 are inputs after power-up and reset.

nc Interrupt Request. When asser ted, the DSP generates an interrupt. Each of the IRQ3–0 pins

can be independently set for edge-triggered or level-sensitive operation. After reset, these pins are disabled unless the IRQ3–0

strap option and interrupt vectors are initialized for

booting.

For more information, see Table 16 on Page 20.

Ω to V

; epu = external pull-up approx-

= connect directly to V

DD_IO

; VSS = connect directly to V

DD_IO

transmitter that it may continue the transmission.

signal indicates to the receiver that the transmitted block is completed. The pull-up resistor is present on L0BCMPO

only. At reset, the L1BCMPO, L2BCMPO, and L3BCMPO

pins are strap pins. For more information, see Table 16 on Page 20.

DD_IO

Link Ports 3–0 Data 3–0 Receive LVDS P Link Ports 3–0 Data 3–0 Receive LVDS N Link Ports 3–0 Receive Clock LVDS P Link Ports 3–0 Receive Clock LVDS N

transmitter that it may continue the transmission.

Link Ports 3–0 Block Completion. When the reception is executed using DMA, this signal indicates to the receiver that the transmitted block is completed.

Ω to V

; epu = external pull-up approx-

= connect directly to V

DD_IO

; VSS = connect directly to V

DD_IO

Rev. C | Page 17 of 48 | December 2006

Page 18

ADSP-TS202S

Table 12. Pin Definitions—Impedance Control, Drive Strength Control, and Regulator Enable

Signal Type Term Description

CONTROLIMP0 CONTROLIMP1

DS2, DS1

ENEDREG I (pu) V

I = input; A = asynchronous; O = output; OD = open-drain output; T = three-state; P = power supply; G = ground; pd = internal pull-down 5k

Ω; pu = internal pull-up 5 kΩ; pd_0 = internal pull-down 5 kΩ on DSP ID = 0; pu_0 = internal pull-up 5 kΩ on DSP ID = 0; pu_od_0 = internal

pull-up 500 Ω on DSP ID = 0; pd_m = internal pull-down 5 kΩ on DSP bus master; pu_m = internal pull-up 5 kΩ on DSP bus master; pu_ad = internal pull-up 40 k

Term (termination of unused pins) column symbols: epd = external pull-down approximately 5 k imately 5 kΩ to V

DD_IO

Table 13. Impedance Control Selection

I (pd) I (pu)

na na

Impedance Control. As shown in Tab le 1 3, the CONTROLIMP1–0 pins select between normal driver mode and A/D driver mode. When using normal mode (recommended), the output drive strength is set relative to maximum drive strength according to

Tab le 1 4. When using A/D mode, the resistance control operates in the analog mode,

where drive strength is continuously controlled to match a specific line impedance as shown in Tab le 1 4.

I (pu) I (pd)

na Digital Drive Strength Selection. Selected as shown in Tab le 1 4. For drive strength calcu-

lation, see Output Drive Currents on Page 36. The drive strength for some pins is preset, not controlled by the DS2–0 pins. The pins that are always at drive strength 7 (100%) include: CPA

, DPA, TDO, EMU, and RST_OUT. The drive strength for the ACK pin is always

x2 drive strength 7 (100%).

Connect the ENEDREG pin to VSS. Connect the V

DD_DRAM

DRAM power supply.

Ω. For more pull-down and pull-up information, see Electrical Characteristics on Page 22.

Ω to V

, nc = not connected; na = not applicable (always used); V

= connect directly to V

DD_IO

pins to a properly decoupled

; epu = external pull-up approx-

; VSS = connect directly to V

CONTROLIMP1-0 Driver Mode

00 (recommended) Normal 01 Reserved 10 (default) A/D Mode 11 Reserved

Table 14. Drive Strength/Output Impedance Selection

DS2–0 Pins

Drive Strength

Output Impedance

000 Strength 0 (11.1%) 26 Ω 001 Strength 1 (23.8%) 32 Ω 010 Strength 2 (36.5%) 40 Ω 011 Strength 3 (49.2%) 50 Ω 100 Strength 4 (61.9%) 62 Ω 101 (default) Strength 5 (74.6%) 70 Ω 110 Strength 6 (87.3%) 96 Ω 111 Strength 7 (100%) 120 Ω

CONTROLIMP1 = 0, A/D mode disabled.

CONTROLIMP1 = 1, A/D mode enabled.

Rev. C | Page 18 of 48 | December 2006

Page 19

ADSP-TS202S

Table 15. Pin Definitions—Power, Ground, and Reference

Signal Type Term Description

DD_A

DD_IO

DD_DRAM

REF

SCLK_V

REF

NC — nc No Connect. Do not connect these pins to anything (not to any supply, signal, or each

I = input; A = asynchronous; O = output; OD = open-drain output; T = three-state; P = power supply; G = ground; pd = internal pull-down

Ω; pu = internal pull-up 5 kΩ; pd_0 = internal pull-down 5 kΩ on DSP ID = 0; pu_0 = internal pull-up 5 kΩ on DSP ID = 0; pu_od_0 = internal

5k pull-up 500 Ω on DSP ID = 0; pd_m = internal pull-down 5 kΩ on DSP bus master; pu_m = internal pull-up 5 kΩ on DSP bus master; pu_ad = internal pull-up 40 k

Term (termination of unused pins) column symbols: epd = external pull-down approximately 5 k imately 5 k

Ω to V

PnaV PnaV PnaV PnaV

Pins for Internal Logic

Pins for Analog Circuits. Pay critical attention to bypassing this supply.

Pins for I/O Buffers

Pins for Internal DRAM

I na Reference voltage defines the trip point for all input buffers, except SCLK, RST_IN,

, IRQ3–0, FLAG3–0, DMAR3–0, ID2–0, CONTROLIMP1–0, LxDATO3–0P/N,

POR_IN LxCLKOUTP/N, LxDATI3–0P/N, LxCLKINP/N, TCK, TDI, TMS, and TRST. V connected to a power supply or set by a voltage divider circuit as shown in Figure 6.

For more information, see Filtering Reference Voltage and Clocks on Page 10.

I na System Clock Reference. Connect this pin to a reference voltage as shown in Figure 7.

For more information, see Filtering Reference Voltage and Clocks on Page 10.

GnaGround Pins

other). These pins are reserved and must be left unconnected.

Ω. For more pull-down and pull-up information, see Electrical Characteristics on Page 22.

Ω to V

; epu = external pull-up approx-

, nc = not connected; na = not applicable (always used); V

DD_IO

= connect directly to V

DD_IO

; VSS = connect directly to V

DD_IO

can be

REF

Rev. C | Page 19 of 48 | December 2006

Page 20

ADSP-TS202S

STRAP PIN FUNCTION DESCRIPTIONS

Some pins have alternate functions at reset. Strap options set DSP operating modes. During reset, the DSP samples the strap option pins. Strap pins have an internal pull-up or pull-down for the default value. If a strap pin is not connected to an overdriving external pull-up, pull-down, or logic load, the DSP samples the default value during reset. If strap pins are

connected to logic inputs, a stronger external pull-up or pulldown may be required to ensure default value depending on leakage and/or low level input current of the logic load. To set a mode other than the default mode, connect the strap pin to a sufficiently stronger external pull-up or pull-down. Table 16 lists and describes each of the DSP’s strap pins.

Table 16. Pin Definitions—I/O Strap Pins

Type (at Signal

EBOOT I

IRQEN I

LINK_DWIDTH I

SYS_REG_WE I

TM1 I (pu) L1BCMPO Test Mode 1. Do not overdrive default value during reset. TM2 I (pu) L2BCMPO TM3 I (pu) L3BCMPO I = input; A = asynchronous; O = output; OD = open-drain output; T = three-state; P = power supply; G = ground; pd = internal pull-down

5kΩ; pu = internal pull-up 5 kΩ; pd_0 = internal pull-down 5 kΩ on DSP ID = 0; pu_0 = internal pull-up 5 kΩ on DSP ID = 0; pu_od_0 = internal pull-up 500 Ω on DSP ID = 0; pd_m = internal pull-down 5 kΩ on DSP bus master; pu_m = internal pull-up 5 kΩ on DSP bus master; pu_ad = internal pull-up 40 kΩ. For more pull-down and pull-up information, see Electrical Characteristics on Page 22.

Reset) On Pin … Description

BMS

(pd_0)

BM Interrupt Enable

(pd)

TMR0E Link Port Input Default Data Width

(pd)

BUSLOCK

(pd_0)

EPROM Boot

0 = boot from EPROM immediately after reset (default) 1 = idle after reset and wait for an external device to boot DSP through the

external port or a link port

0 = disable and set IRQ3–0 interrupts to edge-sensitive after reset (default) 1 = enable and set IRQ3–0

0 = 1-bit (default) 1 = 4-bit

SYSCON and SDRCON Write Enable

0 = one-time writable after reset (default) 1 = always writable

Test Mode 2. Do not overdrive default value during reset. Test Mode 3. Do not overdrive default value during reset.

interrupts to level-sensitive immediately after reset

When default configuration is used, no external resistor is needed on the strap pins. To apply other configurations, a 500 Ω resistor connected to V external pull-downs, do not strap these pins directly to V

is required. If providing

DD_IO

; the

strap pins require 500 Ω resistor straps.

All strap pins are sampled on the rising edge of RST_IN

(deassertion edge). Each pin latches the strapped pin state (state of the strap pin at the rising edge of RST_IN sertion of RST_IN

, these pins are reconfigured to their normal

). Shortly after deas-

functionality.

These strap pins have an internal pull-down resistor, pull-up resistor, or no-resistor (three-state) on each pin. The resistor type, which is connected to the I/O pad, depends on whether RST_IN

is active (low) or if RST_IN is deasserted (high).

Table 17 shows the resistors that are enabled during active reset

and during normal operation.

Rev. C | Page 20 of 48 | December 2006

Table 17. Strap Pin Internal Resistors—Active Reset (RST_IN

Pin RST_IN = 0 RST_IN = 1

BMS BM TMR0E (pd) Driven BUSLOCK L1BCMPO L2BCMPO L3BCMPO

pd = internal pull-down 5 k pd_0 = internal pull-down 5 k pu_0 = internal pull-up 5 kΩ on DSP ID = 0

= 0) vs. Normal Operation (RST_IN = 1)

(pd_0) (pu_0) (pd) Driven

(pd_0) (pu_0) (pu) Driven (pu) Driven (pu) Driven

Ω; pu = internal pull-up 5 kΩ;

Ω on DSP ID = 0;

Page 21

ADSP-TS202S—SPECIFICATIONS

Note that component specifications are subject to change without notice. For information on link port electrical characteristics, see Link Port Low Voltage, Differential-Signal

(LVDS) Electrical Characteristics, and Timing on Page 30.

OPERATING CONDITIONS

Parameter Description Test Conditions Grade

ADSP-TS202S

Min Typ Max Unit

DD_A

DD_IO

DD_DRAM

CASE

IH1

IH2

DD_A

DD_IO

DD_DRAM

REF

SCLK_V

Specifications vary for different grades (for example, SABP-060, SABP-050, SWBP-050). For more information on part grades, see Ordering Guide on Page 46.

specification applies to input and bidirectional pins: SCLKRAT2–0, SCLK, ADDR31–0, DATA63–0, RD, WRL, WRH, ACK, BRST, BR7–0, BOFF, HBR, HBG, MSSD3–0, RAS,

IH1

CAS, SDCKE, SDWE, TCK, FLAG3–0, DS2–0, ENEDREG.

Values represent dc case. During transitions, the inputs may overshoot or undershoot to the voltage shown in Table 18, based on the transient duty cycle. The dc case is equivalent

to 100% duty cycle.

specification applies to input and bidirectional pins: TDI, TMS, TRST, CIMP1–0, ID2–0, LxBCMPI, LxACKI, POR_IN, RST_IN, IRQ3–0, CPA, DPA, DMAR3–0.

IH2

Applies to input and bidirectional pins.

For details on internal and external power calculation issues, including other operating conditions, see the EE-170, Estimating Power for the ADSP-TS202S on the Analog Devices

website.

Internal Supply Voltage @ CCLK = 500 MHz 050 1.00 1.05 1.10 V

Analog Supply Voltage @ CCLK = 500 MHz 050 1.00 1.05 1.10 V

I/O Supply Voltage (all) 2.38 2.50 2.63 V

Internal DRAM Supply Voltage @ CCLK = 500 MHz 050 1.425 1.500 1.575 V

Case Operating Temperature A –40 +85 °C

High Level Input Voltage2,

High Level Input Voltage3,

Low Level Input Voltage3,

VDD Supply Current, Typical Activity

Supply Current, Typical Activity @ CCLK = 500 MHz, VDD = 1.05 V, T

DD_A

Supply Current, Typical Activity6@ SCLK = 62.5 MHz, V

DD_IO

Supply Current, Typical

DD_DRAM

Activity

Voltage Reference (all) (V

REF

@ VDD, V

@ CCLK = 500 MHz, VDD = 1.05 V, T

= Max (all) 1.7 3.63 V

DD_IO

= Max (all) 1.9 3.63 V

DD_IO

= Min (all) –0.33 +0.8 V

DD_IO

@ CCLK = 500 MHz, V

= 2.5 V, T

DD_IO

DD_DRAM

CASE

= 1.5 V, T

= 25°C 050 2.06 A

= 25°C 050 20 50 mA

= 25°C (all) 0.15 A

= 25°C 050 0.25 0.40 A

CASE

× 0.56)±5% V

DD_IO

× 0.56) ±5% V

CLOCK_DRIVE

Rev. C | Page 21 of 48 | December 2006

Page 22

ADSP-TS202S

Table 18. Maximum Duty Cycle for Input Transient Voltage

Maximum Duty

Cycle

VIN Max (V)

VIN Min (V)

+3.63 –0.33 100% +3.64 –0.34 90% +3.70 –0.40 50% +3.78 –0.48 30% +3.86 –0.56 17% +3.93 –0.63 10%

The individual values cannot be combined for analysis of a single instance of

overshoot or undershoot. The worst case observed value must fall within one of the voltages specified and the total duration of the overshoot or undershoot (exceeding the 100% case) must be less than or equal to the corresponding duty cycle.

Duty cycle refers to the percentage of time the signal exceeds the value for the

100% case. This is equivalent to the measured duration of a single instance of overshoot or undershoot as a percentage of the period of occurrence. The practical worst case for period of occurrence for either overshoot or undershoot is 2 × t

SCLK

ELECTRICAL CHARACTERISTICS

Parameter Description Test Conditions Min Max Unit

High Level Input Current @ V

IH_PU

IH_PD

IH_PD_L

Low Level Input Current @ V

IL_PU

IL_PU_AD

OZH

OZH_PD

Three-State Leakage Current Low @ V

OZL

OZL_PU

OZL_PU_AD

OZL_OD

High Level Output Voltage

Low Level Output Voltage

High Level Input Current @ V

Low Level Input Current @ V

Three-State Leakage Current High @ V

Three-State Leakage Current Low @ V

Input Capacitance

2, 3

Parameter name suffix conventions: no suffix = applies to pins without pull-up or pull-down resistors; _PD = applies to pin types (pd) or (pd_0); _PU = applies to pin types (pu) or (pu_0); _PU_AD = applies to pin types (pu_ad); _OD = applies to pin types OD; _PD_L = applies to pin types (pd_l).

Applies to output and bidirectional pins.

Applies to all signals.

Guaranteed but not tested.

@ V

=Min, IOH = –2 mA 2.18 V

DD_IO

=Min, IOL=4 mA 0.4 V

DD_IO

=Max, VIN=VIH Max 20 μA

DD_IO

=Max, VIN=VIH Max 20 μA

DD_IO

=Max, VIN=V

DD_IO

=Max, VIN=VIH Max 3076μA

DD_IO

=Max, VIN=0 V 20 μA

DD_IO

=Max, VIN=0 V 0.3 0.76 mA

DD_IO

=Max, VIN= 0 V 30 100 μA

DD_IO

=Max, VIN=VIH Max 50 μA

DD_IO

=Max, VIN=V

DD_IO

=Max, VIN=0 V 20 μA

DD_IO

=Max, VIN=0 V 0.3 0.76 mA

DD_IO

=Max, VIN= 0 V 30 100 μA

DD_IO

=Max, VIN =0 V 4 7.6 mA

DD_IO

@ fIN=1 MHz, T

Max 0.3 0.76 mA

DD_IO

Max 0.3 0.76 mA

DD_IO

=25°C, VIN=2.5 V 3 pF

CASE

Rev. C | Page 22 of 48 | December 2006

Page 23

ADSP-TS202S

PACKAGE INFORMATION

The information presented in Figure 8 provide details about the package branding for the ADSP-TS202S processors. For a complete listing of product availability, see Ordering Guide on

Page 46.

ADSP-TS20xS

tppZ-ccc

LLLLLLLLL-L 2.0

yyww count ry_of_origin

Figure 8. Typical Package Brand

Table 19. Package Brand Information

Brand Key Field Description

t Temperature Range pp Package Type Z Lead Free Option (optional) ccc See Ordering Guide LLLLLLLLL-L Silicon Lot Number R.R Silicon Revision yyww Date Code vvvvvv Assembly Lot Code

vvvvv

ABSOLUTE MAXIMUM RATINGS

Stresses greater than those listed below may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Table 20. Absolute Maximum Ratings

Parameter Rating

Internal (Core) Supply Voltage (V Analog (PLL) Supply Voltage (V External (I/O) Supply Voltage (V External (DRAM) Supply Voltage (V Input Voltage

Output Voltage Swing –0.5 V to V Storage Temperature Range –65°C to +150°C

Applies to 10% transient duty cycle. For other duty cycles see Table 18.

)–0.3 V to +1.4 V

DD_A

)–0.3 V to +3.5 V

DD_IO

)–0.3 V to +2.1 V

DD_DRAM

–0.63 V to +3.93 V

+0.5 V

DD_IO

ESD SENSITIVITY

ESD (electrostatic discharge) sensitive device.

Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be take to avoid performance degradation or loss of functionality.

Rev. C | Page 23 of 48 | December 2006

Page 24

ADSP-TS202S

TIMING SPECIFICATIONS

With the exception of DMAR3–0, IRQ3–0, TMR0E, and FLAG3–0 (input only) pins, all ac timing for the ADSP-TS202S processor is relative to a reference clock edge. Because input setup/hold, output valid/hold, and output enable/disable times are relative to a clock edge, the timing data for the ADSP-TS202S processor has few calculated (formula-based) values. For information on ac timing, see General AC Timing. For information on link port transfer timing, see Link Port Low

Voltage, Differential-Signal (LVDS) Electrical Characteristics, and Timing on Page 30.

General AC Timing

Timing is measured on signals when they cross the 1.25 V level as described in Figure 15 on Page 29. All delays (in nanoseconds) are measured between the point that the first signal reaches 1.25 V and the point that the second signal reaches

1.25 V.

Table 21. AC Asynchronous Signal Specifications

Name Description Pulse Width Low (Min) Pulse Width High (Min)

IRQ3–0 DMAR3–0 FLAG3–0 TMR0E

These input pins have Schmitt triggers and therefore do not need to be synchronized to a clock reference.

For output specifications on FLAG3–0 pins, see Table 29.

This pin is a strap option. During reset, an internal resistor pulls the pin low.

Interrupt Request 2 ×t DMA Request 2 × t FLAG3–0 Input 2× t Timer 0 Expired 4×t

The general ac timing data appears in Table 22 and Table 29. All ac specifications are measured with the load specified in

Figure 36 on Page 38, and with the output drive strength set to

strength 4. In order to calculate the output valid and hold times for different load conditions and/or output drive strengths, refer to Figure 37 on Page 38 through Figure 44 on Page 39 (Rise and Fall Time vs. Load Capacitance) and Figure 45 on Page 39 (Output Valid vs. Load Capacitance and Drive Strength).

The ac asynchronous timing data for the IRQ3–0

, DMAR3–0,

FLAG3–0, and TMR0E pins appears in Table 21.

ns 2× t

SCLK

ns 2× t

SCLK

ns 2× t

SCLK

ns ns

Table 22. Reference Clocks—Core Clock (CCLK) Cycle Time

Grade = 050 (500 MHz)

Parameter Description

CCLK

CCLK is the internal processor clock or instruction cycle time. The period of this clock is equal to the system clock period (t

(SCLKRAT2–0). For information on available part numbers for different internal processor clock rates, see the Ordering Guide on Page 46.

Core Clock Cycle Time 2.0 12.5 ns

) divided by the system clock ratio

SCLK

CCLK

Figure 9. Reference Clocks—Core Clock (CCLK) Cycle Time

UnitMin Max

Rev. C | Page 24 of 48 | December 2006

Page 25

Table 23. Reference Clocks—System Clock (SCLK) Cycle Time

SCLKRAT = 4×, 6×, 8×, 10×, 12× SCLKRAT = 5×, 7×

Parameter Description

1, 2, 3

SCLK

SCLKH

SCLKL

SCLKF

SCLKR

5, 6

SCLKJ

For more information, see Table 3 on Page 12.

For more information, see Clock Domains on Page 9.

The value of (t

System clock transition times apply to minimum SCLK cycle time (t

Actual input jitter should be combined with ac specifications for accurate timing analysis.

Jitter specification is maximum peak-to-peak time interval error (TIE) jitter.

System Clock Cycle Time 8 50 8 50 ns System Clock Cycle High Time 0.40 × t System Clock Cycle Low Time 0.40 × t System Clock Transition Time—Falling Edge

System Clock Transition Time—Rising Edge 1.5 1.5 ns System Clock Jitter Tolerance 500 500 ps

/ SCLKRAT2-0) must not violate the specification for t

SCLK

SCLKH

SCLK

CCLK

) only.

SCLKL

SCLK

ADSP-TS202S

UnitMin Max Min Max

0.60 × t

SCLK

0.60 × t

SCLK

1.5 1.5 ns

SCLKJ

0.45 × t

SCLKF

SCLK

SCLKR

0.55 × t

SCLK

ns ns

Figure 10. Reference Clocks—System Clock (SCLK) Cycle Time

Table 24. Reference Clocks—JTAG Test Clock (TCK) Cycle Time

Parameter Description Min Max Unit

t t t

TCK

TCKH

TCKL

Test Clock (JTAG) Cycle Time Greater of 30 or t

× 4ns

CCLK

Test Clock (JTAG) Cycle High Time 12 ns Test Clock (JTAG) Cycle Low Time 12 ns

TCK

TCKH

Figure 11. Reference Clocks—JTAG Test Clock (TCK) Cycle Time

TCKL

Rev. C | Page 25 of 48 | December 2006

Page 26

ADSP-TS202S

Table 25. Power-Up Timing

Parameter Min Max Unit

Timing Requirement

VDD_DRAM

For information about power supply sequencing and monitoring solutions, please visit www.analog.com/sequencing.

DD_A

DD_IO

DD_DRAM

Stable After VDD, V

DD_A

VDD_DRAM

, V

Stable >0 ms

DD_IO

Figure 12. Power-Up Timing

Table 26. Power-Up Reset Timing

Parameter Min Max Unit

Timing Requirements

RST_IN_PWR

RST_IN Deasserted After VDD, V

DD_A

, V

DD_IO

, V

, SCLK, and Static/

DD_DRAM

2ms

Strap Pins Stable

TRST_IN_PWR

TRST Asserted During Power-Up Reset 100 × t

SCLK

Switching Characteristic

RST_OUT_PWR

Applies after VDD, V

RST_OUT Deasserted After RST_IN Deasserted 1.5 ms

, V

DD_A

DD_IO

, V

, and SCLK are stable and before RST_IN deasserted.

DD_DRAM

RST_IN

RST_OUT

TRST

SCLK, V

DD,VDD_A,

DD_IO,VDD_DRAM

STATIC/STRAP PINS

RST_IN_PWR

TRST_IN_PWR

RST_OUT_PWR

Figure 13. Power-Up Reset Timing

Rev. C | Page 26 of 48 | December 2006

Page 27

ADSP-TS202S

Table 27. Normal Reset Timing

Parameter Min Max Unit

Timing Requirements

RST_IN

STRAP

Switching Characteristic

RST_OUT

RST_IN Asserted 2 ms RST_IN Deasserted After Strap Pins Stable 1.5 ms

RST_OUT Deasserted After RST_IN Deasserted 1.5 ms

RST_IN

RST_OUT

STRAP

STRAP PINS

Figure 14. Normal Reset Timing

Table 28. On-Chip DRAM Refresh

Parameter Min Max Unit

Timing Requirement

REF

For more information on setting the refresh rate for the on-chip DRAM, refer to the ADSP-TS201 TigerSHARC Processor Programming Reference.

On-chip DRAM Refresh Period 1.56 μs

Rev. C | Page 27 of 48 | December 2006

Page 28

ADSP-TS202S

Table 29. AC Signal Specifications

(All values in this table are in nanoseconds.)

Output Disable

(Max)

Reference

Clock

Name Description

Input Setup

(Min)

Input Hold

(Min)

Output Valid

(Max)

Output Hold

(Min)

Output Enable

(Min)

ADDR31–0 External Address Bus 1.5 0.5 4.0 1.0 1.15 2.0 SCLK DATA63–0 External Data Bus 1.5 0.5 4.0 1.0 1.15 2.0 SCLK MSH MSSD3–0 MS1–0 RD WRL WRH

Memory Select HOST Line — — 4.0 1.0 1.15 2.0 SCLK Memory Select SDRAM Lines 1.5 0.5 4.0 1.0 1.0 2.0 SCLK Memory Select for Static Blocks — — 4.0 1.0 1.15 2.0 SCLK Memory Read 1.5 0.5 4.0 1.0 1.15 2.0 SCLK Write Low Word 1.5 0.5 4.0 1.0 1.15 2.0 SCLK Write High Word 1.5 0.5 4.0 1.0 1.15 2.0 SCLK

ACK Acknowledge for Data High to Low 1.5 0.5 3.6 1.0 1.15 2.0 SCLK

Acknowledge for Data Low to High 1.5 0.5 4.2 0.9 1.15 2.0 SCLK SDCKE SDRAM Clock Enable 1.5 0.5 4.0 1.0 1.15 2.0 SCLK RAS CAS SDWE

Row Address Select 1.5 0.5 4.0 1.0 1.15 2.0 SCLK

Column Address Select 1.5 0.5 4.0 1.0 1.15 2.0 SCLK

SDRAM Write Enable 1.5 0.5 4.0 1.0 1.15 2.0 SCLK LDQM Low Word SDRAM Data Mask — — 4.0 1.0 1.15 2.0 SCLK HDQM High Word SDRAM Data Mask — — 4.0 1.0 1.15 2.0 SCLK SDA10 SDRAM ADDR10 — — 4.0 1.0 1.15 2.0 SCLK HBR HBG BOFF BUSLOCK BRST BR7–0 BM IORD IOWR IOEN CPA

Host Bus Request 1.5 0.5 — — — — SCLK

Host Bus Grant 1.5 0.5 4.0 1.0 1.15 2.0 SCLK

Back Off Request 1.5 0.5 — — — — SCLK

Bus Lock — — 4.0 1.0 1.15 2.0 SCLK

Burst Pin 1.5 0.5 4.0 1.0 1.15 2.0 SCLK

Multiprocessing Bus Request Pins 1.5 0.5 4.0 1.0 — — SCLK

Bus Master Debug Aid Only — — 4.0 1.0 — — SCLK

I/O Read Pin — — 4.0 1.0 1.0 2.0 SCLK

I/O Write Pin — — 4.0 1.0 1.15 2.0 SCLK

I/O Enable Pin — — 4.0 1.0 1.15 2.0 SCLK

Core Priority Access High to Low 1.5 0.5 4.0 1.0 0.75 2.0 SCLK

Core Priority Access Low to High 1.5 0.5 29.5 2.0 0.75 2.0 SCLK DPA

DMA Priority Access High to Low 1.5 0.5 4.0 1.0 0.75 2.0 SCLK

DMA Priority Access Low to High 1.5 0.5 29.5 2.0 0.75 2.0 SCLK BMS FLAG3–0 RST_IN

3, 4

Boot Memory Select — — 4.0 1.0 1.15 2.0 SCLK

FLAG Pins — — 4.0 1.0 1.15 2.0 SCLK

Global Reset Pin 1.5 2.5 — — — — SCLK

TMS Test Mode Select (JTAG) 1.50.5————TCK TDI Test Data Input (JTAG) 1.50.5————TCK TDO Test Data Output (JTAG) — — 4.0 1.0 0.75 2.0 TCK

TRST3,

EMU

ID2–0 CONTROLIMP1–0

Test Reset (JTAG) 1.50.5————TCK

Emulation High to Low — — 5.5 2.0 1.15 4.0 TCK or SCLK

Static Pins—Must Be Constant ———————

Rev. C | Page 28 of 48 | December 2006

Page 29

Table 29. AC Signal Specifications (Continued)

(All values in this table are in nanoseconds.)

ADSP-TS202S

Name Description

DS2–0 SCLKRAT2–0

Static Pins—Must Be Constant — — — — — — —

Static Pins—Must Be Constant — — — — — — — ENEDREG Static Pins—Must Be Connected to V STRAP SYS JTAG SYS

The external port protocols employ bus IDLE cycles for bus mastership transitions as well as slave address boundary crossings to avoid any potential bus contention. The

apparent driver overlap, due to output disables being larger than output enables, is not actual.

For input specifications on FLAG3–0 pins, see Table 21.

These input pins are asynchronous and therefore do not need to be synchronized to a clock reference.

For additional requirement details, see Reset and Booting on Page 9.

RST_IN clock reference is the falling edge of SCLK.

TDO output clock reference is the falling edge of TCK.

Reference clock depends on function.

These pins may change only during reset; recommend connecting it to V

STRAP pins include: BMS, BM, BUSLOCK, TMR0E, L1BCMPO, L2BCMPO, and L3BCMPO.

Specifications applicable during reset only.

JTAG system pins include: RST_IN, RST_OUT, POR_IN, IRQ3–0, DMAR3–0, HBR, BOFF, MS1–0, MSH, SDCKE, LDQM, HDQM, BMS, IOWR, IORD, BM, EMU, SDA10,

9, 10

11, 12

Strap Pins 1.50.5————SCLK

JTAG System Pins +2.5 +10.0 +12.0 –1.0 — — TCK

DD_IO/VSS

Input Setup

(Min)

Input Hold

(Min)

Output Valid

(Max)

Output Hold

(Min)

Output Enable

(Min)

Output Disable

(Max)1Reference

———————

Clock

IOEN, BUSLOCK, TMR0E, DATA63–0, ADDR31–0, RD, WRL, WRH, BRST, MSSD3–0, RAS, CAS, SDWE, HBG, BR7–0, FLAG3–0, L0DATOP3–0, L0DATON3–0, L1DATOP3–0, L1DATON3–0, L2DATOP3–0, L2DATON3–0, L3DATOP3–0, L3DATON3–0, L0CLKOUTP, L0CLKOUTN, L1CLKOUTP, L1CLKOUTN, L2CLKOUTP, L2CLKOUTN, L3CLKOUTP, L3CLKOUTN, L0ACKI, L1ACKI, L2ACKI, L3ACKI, L0DATIP3–0, L0DATIN3–0, L1DATIP3–0, L1DATIN3–0, L2DATIP3–0, L2DATIN3–0, L3DATIP3–0, L3DATIN3–0, L0CLKINP, L0CLKINN, L1CLKINP, L1CLKINN, L2CLKINP, L2CLKINN, L3CLKINP, L3CLKINN, L0ACKO, L1ACKO, L2ACKO, L3ACKO, ACK, CPA, DPA, L0BCMPO, L1BCMPO, L2BCMPO, L3BCMPO, L0BCMPI, L1BCMPI, L2BCMPI, L3BCMPI, ID2–0, CTRL_IMPD1–0, SCLKRAT2–0, DS2–0, ENEDREG.

JTAG system output timing clock reference is the falling edge of TCK.

REFERENCE

CLOCK

1.25V

SCLK

OR t

TCK

INPUT

SIGNAL

OUTPUT

SIGNAL

THREE-

STATE

INPUT

SETUP

OUTPUT

VALID

OUTPUT

DISABLE

1.25V

Figure 15. General AC Parameters Timing

Rev. C | Page 29 of 48 | December 2006

INPUT HOLD

OUTPUT

HOLD

OUTPUT ENABLE

Page 30

ADSP-TS202S

Link Port Low Voltage, Differential-Signal (LVDS) Electrical Characteristics, and Timing

Table 30 and Table 31 with Figure 16 provide the electrical

characteristics for the LVDS link ports. The LVDS link port signal definitions represent all differential signals with a V level and use signal naming without N (negative) and P (positive) suffixes (see Figure 16).

Table 30. Link Port LVDS Transmit Electrical Characteristics

Parameter Description Test Conditions Min Max Unit

| Output Differential Voltage RL = 100 Ω 300 650 mV

OCM

Output Voltage High, V Output Voltage Low, V

O_P

or V

O_N

Short-Circuit Output Current V

Common-Mode Output Voltage 1.20 1.50 V

Table 31. Link Port LVDS Receive Electrical Characteristics

Parameter Description Test Conditions Min Max Unit

| Differential Input Voltage t

ICM

Common-Mode Input Voltage 0.6 1.57 V

=0V

RL = 100 Ω 1.85 V RL = 100 Ω 0.92 V

or V

O_P

LDIS/tLDIH

= 0 V +5/–55 mA

O_N

= 0 V ±10 mA

≥ 0.20 ns ≥ 0.25 ns ≥ 0.30 ns ≥ 0.35 ns

250 217 206 195

850 850 850 850

mV mV mV mV

O_P

O_N

Figure 16. Link Ports—Transmit Electrical Characteristics

DIF FER ENT IA L PAI R W AV EFO R M S

Lx<PIN>P

Lx <P I N >N

DIFFERENTIAL V OLTA GE WAVEFO RM

Lx<PIN>

=0V

VOD=V

Figure 17. Link Ports—Signals Definition

VOD=(V

OCM

O_N

O_P

O_P–VO_N

O_P+VO_N

)

Rev. C | Page 30 of 48 | December 2006

Page 31

ADSP-TS202S

Link Port—Data Out Timing

Table 32 with Figure 19, Figure 18, Figure 20, Figure 21, Figure 22, and Figure 23 provide the data out timing for the

LVDS link ports.

Table 32. Link Port—Data Out Timing

Parameter Description Min Max Unit

Outputs

REO

FEO

LCLK OP

LCLK OH

LCLK OL

COJT

LDOS

LDOH

LACKID

BCMPOV

BCMPOH

Inputs

LACKIS

LACKIH

Timing is relative to the 0 differential voltage (VOD = 0).

LCR (link port clock ratio) = 1, 1.5, 2, or 4. t

For the cases of t

LCR= 1.

LCR= 1.5.

LCR= 2.

LCR= 4.

The t

and t

LDOS

TSW is a short-word transmission period. For a 4-bit link, it is 2 × LCR × t

Rising Edge (Figure 19)350ps Falling Edge (Figure 19)350ps LxCLKOUT Period (Figure 18) Greater of 2.0 or

0.9 × LCR × t LxCLKOUT High (Figure 18)0.4× t LxCLKOUT Low (Figure 18)0.4× t

LCLK OP

1, 2, 3

CCLK

LxCLKOUT Jitter (Figure 18) ±1504, 5,

LxDATO Output Setup (Figure 20) 0.25 × LCR × t

0.25 × LCR × t

0.25 × LCR × t LxDATO Output Hold (Figure 20) 0.25 × LCR × t

0.25 × LCR × t

CCLK

–0.10 × t –0.15 × t –0.30 × t

CCLK

1, 4, 8

5, 6,

1, 7,

1, 4, 8

1, 5, 6, 8

1, 7, 8

Delay from LxACKI Rising Edge to First Transmission

Smaller of 12.5 or

1.1 × LCR × t

0.6 × t

±250

16 × LCR × t

LCLK OP

1, 2, 3

CCLK

ns ns ps

ps ns

ns ns

ns ns ns

1, 2

CCLK

Clock Edge (Figure 21) LxBCMPO Valid (Figure 21)2× LCR × t LxBCMPO Hold (Figure 22)3× TSW – 0.5

1, 9

CCLK

1, 2

ns ns

LxACKI Low Setup to Guarantee that the Transmitter Stops Transmitting (Figure 22) LxACKI High Setup to Guarantee that the Transmitter Continues its Transmission Without Any Interruption (Figure 23)16× LCR × t

CCLK

1, 2

LxACKI High Hold Time (Figure 23)0.51 ns

is the core period.

= 2.0 ns and t

LCLKOP

values include LCLKOUT jitter.

LDOH

CCLK

= 12.5 ns, the effect of t

LCLKOP

specification on output period must be considered.

COJT

. For a 1-bit link, it is 8 × LCR × t

CCLK

ns.

Rev. C | Page 31 of 48 | December 2006

Page 32

ADSP-TS202S

LCLKOP

VOD=0V

LxCLKOUT

COJT

LCLKOH

LCLKOL

Figure 18. Link Ports—Output Clock

+|V

O_P

REO

L_P

L_N

FEO

MIN

OD|

=0V

MIN

OD|

O_N

RL=100⍀

=0.1pF

=5pF

L_P

=5pF

L_N

Figure 19. Link Ports—Differential Output Signals Transition Time

LxCLKOUT

=0V

LDOStLDOHtLDOStLDOH

LxDATO

VOD=0V

Figure 20. Link Ports—Data Output Setup and Hold

These parameters are valid for both clock edges.

LxCLKOUT

=0V

LxDATO

VOD=0V

LxACKI

LxBCMPO

LACK ID

BCMPOV

Figure 21. Link Ports—Transmission Start

Rev. C | Page 32 of 48 | December 2006

Page 33

LxCLKOUT

=0V

LxDATO

VOD=0V

ADSP-TS202S

FIRST EDGE OF FIFTH SHORT WORD I N A QUAD WORD

LAST EDGE IN A QUAD WORD

LxACKI

LxBCMPO

LxCLKOUT

=0V

LACKIS

BCMPOH

Figure 22. Link Ports—Transmission End and Stops

LAST EDGE IN A QUAD WORD

LACKIH

LxDATO

VOD=0V

LxACKI

LACKIS

Figure 23. Link Ports—Back to Back Transmission

Rev. C | Page 33 of 48 | December 2006

LACKIH

Page 34

ADSP-TS202S

Link Port—Data In Timing

Table 33 with Figure 24 and Figure 25 provide the data in

timing for the LVDS link ports.

Table 33. Link Port—Data In Timing

Parameter Description Min Max Unit

Inputs

LCLKI P

LDIS

LDIH

BCMPIS

BCMPIH

Timing is relative to the 0 differential voltage (VOD = 0).

|VID| = 250 mV

|VID| = 217 mV

|VID| = 206 mV

|VID| = 195 mV

LxCLKIN Period (Figure 25) Greater of 1.8

or 0.9 × t

LxDATI Input Setup (Figure 25)0.20

0.251,

0.301,

0.351,

LxDATI Input Hold (Figure 25)0.20

0.25

0.30

0.35 LxBCMPI Setup (Figure 24)2×t LxBCMPI Hold (Figure 24)2×t

1, 2

1, 3

1, 4

1, 5

LCLKI P

CCLK

12.5 ns ns

ns ns ns

ns ns ns ns

ns ns

LxCLKIN

=0V

LxDATI

VOD=0V

LxBCMPI

FIRST EDGE IN FIFTH SHORT WORD IN A QUAD WORD

BCMPIS

Figure 24. Link Ports—Last Received Quad Word

BCMPIH

Rev. C | Page 34 of 48 | December 2006

Page 35

LxCLKIN

=0V

LxDATI

VOD=0V

LCLKIP

LDIStLDIHtLDIStLDIH

ADSP-TS202S

Figure 25. Link Ports—Data Input Setup and Hold

These parameters are valid for both clock edges.

Rev. C | Page 35 of 48 | December 2006

Page 36

ADSP-TS202S

OUTPUT DRIVE CURRENTS

Figure 26 through Figure 33 show typical I–V characteristics for

the output drivers of the ADSP-TS202S processor. The curves in these diagrams represent the current drive capability of the output drivers as a function of output voltage over the range of drive strengths. For complete output driver characteristics, refer to the DSP’s IBIS models, available on the Analog Devices website (www.analog.com).

15.0

) A m

( T

N E R R U C

I P

T U P T

–10.0

U O

–12.5

–15.0

12.5

10.0

7.5

5.0

2.5

–2.5

–5.0

–7.5

= 2.38V, +105°C

DD_IO

=2.38V,+105°C

DD_IO

02.80.4 0.8 1.2 1.6 2.0 2.4

Figure 26. Typical Drive Currents at Strength 0

DD_IO

02.80.4

= 2.38V, +105°C

DD_IO

= 2.38V, +105°C

)

A m

(

T N E R R U C

–5

I P

–10

T U P

–15

T U O

–20

–25

–30

Figure 27. Typical Drive Currents at Strength 1

STRENGTH 0

=2.5V,+25°C

DD_IO

=2.5V, +25°C

DD_IO

OUTPUT PIN VOLTAGE (V)

STRENGTH 1

=2.5V,+25°C

DD_IO

=2.5V,+25°C

DD_IO

1.2 1.6 2.0 2.4

0.8 OUTPUT PIN VOLTAGE (V)

DD_IO

= 2.63V, –40°C

=2.63V,–40°C

= 2.63V, –40°C

STRENGTH 2

= 2.5V, +25°C

DD_IO

= 2.38V, +105°C

= 2.5V, +25°C

DD_IO

1.2 1.6 2.0 2.4

0.8 OUTPUT PIN VOLTAGE (V)

DD_IO

) A m

( T N

E R R U C

I P

T U P T U O

–9

–18

–27

–36

–45

02.80.4

DD_IO

= 2.38V, +105°C

Figure 28. Typical Drive Currents at Strength 2

) A m

( T

N E

R R U C

I P

–11

T U P T

–22

U O

–33

–44

–55

DD_IO

= 2.38V, +105°C

02.80.4 0.8 1.2 1.6 2.0 2.4

STRENGTH 3

=2.5V,+25°C

DD_IO

=2.5V,+25°C

DD_IO

OUTPUT PIN VOLTAGE (V)

Figure 29. Typical Drive Currents at Strength 3

) A

(

T N E

R R U C

–10

I P

–20

T U

–30

P T U

–40

–50

–60

–70

DD_IO

= 2.38V, +105°C

=2.38V,+105°C

02.80.4 0.8 1.2 1.6 2.0 2.4

STRENGTH 4

=2.5V,+25°C

DD_IO

=2.5V,+25°C

DD_IO

OUTPUT PIN VOLTAGE (V)

DD_IO

= 2.63V, –40°C

DD_IO

=2.63V,–40°C

= 2.63V, –40°C

=2.63V,–40°C

Rev. C | Page 36 of 48 | December 2006

Figure 30. Typical Drive Currents at Strength 4

Page 37

ADSP-TS202S

88 77

)

A m

( T

N E

R R U C

–11

I P

–22

T U

–33

P T

–44

U O

–55

–66

–77

–88

DD_IO

= 2.38V, +105°C

02.80.4 0.8 1.2 1.6 2.0 2.4

STRENGTH 5

=2.5V,+25°C

DD_IO

=2.5V, +25°C

DD_IO

OUTPUT PIN VOLTAGE (V)

Figure 31. Typical Drive Currents at Strength 5

100

) A m

( T

N E R R U C

I P

T U P T U O

–10 –20 –30 –40 –50 –60 –70 –80 –90

–100

90 80 70 60 50 40 30 20 10

DD_IO

=2.38V,+105°C

02.80.4 0.8 1.2 1.6 2.0 2.4

STRENGTH 6

=2.5V,+25°C

DD_IO

= 2.38V, +105°C

=2.5V,+25°C

DD_IO

OUTPUT PIN VOLTAGE (V)

Figure 32. Typical Drive Currents at Strength 6

110

) A m

( T

N E R R U C

I P

T U P T U O

100

–10 –20 –30 –40 –50 –60 –70 –80

–90 –100 –110

90 80 70 60 50 40 30 20 10

DD_IO

= 2.38V, +105°C

02.80.4 0.8 1.2 1.6 2.0 2.4

STRENGTH 7

=2.5V,+25°C

DD_IO

=2.5V,+25°C

DD_IO

OUTPUT PIN VOLTAGE (V)

Figure 33. Typical Drive Currents at Strength 7

DD_IO

=2.63V,–40°C

= 2.63V, –40°C

=2.63V,–40°C

= 2.63V, –40°C

=2.63V,–40°C

TEST CONDITIONS

The ac signal specifications (timing parameters) appear in

Table 29 on Page 28. These include output disable time, output

enable time, and capacitive loading. The timing specifications for the DSP apply for the voltage reference levels in Figure 34.

INPUT

OUTPUT

Figure 34. Voltage Reference Levels for AC Measurements (Except Output Enable/Disable)

Output Disable Time

Output pins are considered to be disabled when they stop driving, go into a high impedance state, and start to decay from their output high or low voltage. The time for the voltage on the bus to decay by ΔV is dependent on the capacitive load, C load current, I lowing equation:

The output disable time t t

MEASURED_DIS

switches to when the output voltage decays ΔV from the measured output high or output low voltage. t with test loads C

REFERENCE

OH (MEASURED)

OL (MEASURED)

1.25V 1.25V

. This decay time can be approximated by the fol-

and t

DECAY

as shown in Figure 35. The time

DECAY

CLVΔ()I

⁄=

is the difference between

DIS

is the interval from when the reference signal

is calculated

DECAY

MEASURED_ENA

ENA

– ⌬V

+ ⌬V

RAMP

OUTPUT STARTS

1.65V

0.85V

SIGNAL

and IL, and with ΔV equal to 0.4 V.

MEASURED_DIS

DIS

OH (MEASURED)

OL (MEASURED)

DECAY

OUTPUT STOPS

DRIVING

HIGH IMPEDANCE STATE.

TEST CONDITIONS CAUSE THIS

VOLTAGE TO BE APPROXIMATELY 1.25V.

Figure 35. Output Enable/Disable

DRIVING

and the

Rev. C | Page 37 of 48 | December 2006

Page 38

ADSP-TS202S

Output Enable Time

Output pins are considered to be enabled when they have made a transition from a high impedance state to when they start driving. The time for the voltage on the bus to ramp by ΔV is dependent on the capacitive load, C

, and the drive current, ID.

This ramp time can be approximated by the following equation:

RAMP

The output enable time t t

MEASURED_ENA

and t

RAMP

is the interval from when the reference signal

as shown in Figure 35. The time

CLVΔ()I

⁄=

is the difference between

ENA

switches to when the output voltage ramps ΔV from the measured three-stated output level. t

, drive current ID, and with ΔV equal to 0.4 V.

is calculated with test load

RAMP

Capacitive Loading

Output valid and hold are based on standard capacitive loads: 30 pF on all pins (see Figure 36). The delay and hold specifications given should be derated by a drive strength related factor for loads other than the nominal value of 30 pF. Figure 37 through Figure 44 show how output rise time varies with capacitance. Figure 45 graphically shows how output valid varies with load capacitance. (Note that this graph or derating does not apply to output disable delays; see Output Disable Time on

Page 37.) The graphs of Figure 37 through Figure 45 may not be

linear outside the ranges shown.

30pF

STRENGTH 0

=2.5V)

DD_IO

RISE TIM E

50⍀

1.25V

DD_IO

=2.5V)

OUTPUT

Figure 36. Equivalent Device Loading for AC Measurements (Includes All Fixtures)

) s n

(

S E M

I T

L L A F

D N A

E S

I R

FALL TIME

Y = 0.251x + 4.2245

10 20 30 40 50 60 70 80 90 100

Y = 0.259x + 3.0842

LOAD CAPACITANCE (pF)

Figure 37. Typical Output Rise and Fall Time (10% to 90%, V vs. Load Capacitance at Strength 0

STRENGTH 1

=2.5V)

) s n

( S

I T

L L A

F D

N A

I R

0 10203040506070 8090100

Y = 0.1527x + 0.7485

DD_IO

FALL TIME

RISE TIME

Y = 0.1501

LOAD CAPACITANCE (pF)

+0.05

Figure 38. Typical Output Rise and Fall Time (10% to 90%, V vs. Load Capacitance at Strength 1

STREN GTH 2

=2.5V)

) s n

( S

E M

I T

L L A

F D

N A

I R

0102030405060708090100

DD_IO

FALL TIME

Y = 0.0949x + 0.8112

RISE TIME

Y = 0.0861

LOAD CAPACITAN CE (pF)

+ 0.4712

Figure 39. Typical Output Rise and Fall Time (10% to 90%, V vs. Load Capacitance at Strength 2

STRENGTH 3

=2.5V)

) s n

( S

E M

I T

L L A

F D

N A

I R

0 102030405060708090100

DD_IO

FALL TIME

Y = 0.0691x + 1.1158

Y=0.06

LOAD CAPACITANCE (pF)

RISE TIME

+1.1362

Figure 40. Typical Output Rise and Fall Time (10% to 90%, V vs. Load Capacitance at Strength 3

DD_IO

=2.5V)

Rev. C | Page 38 of 48 | December 2006

Page 39

ADSP-TS202S

STRENG TH 4

=2.5V

) s n

( S

E M

I T

L L

A F

D N A

I R

10 20 30 40 50 60 70 80 90 100

DD_IO

FALL TIME

Y = 0.0592x + 1.0629

LOAD CAPACITANCE (pF)

)

RISE TIME

Y = 0.0573x + 0.9789

Figure 41. Typical Output Rise and Fall Time (10% to 90%, V vs. Load Capacitance at Strength 4

STRENGTH 5

=2.5V)

) s n

(

S E M

I T

L L

A F

D N A

E S

I R

10 20 30 40 50 60 70 80 90 100

DD_IO

FALL TIME

Y = 0.0493x + 0.8389

LOAD CAPACITANCE (pF)

RISE TIM E

Y = 0.0481

Figure 42. Typical Output Rise and Fall Time (10% to 90%, V vs. Load Capacitance at Strength 5

STREN GTH 6

=2.5V)

) s n

( S

E M

I T

L L

A F

D N A

I R

FALL TIME

Y = 0.0374x + 0.851

DD_IO

RISE TIME

Y = 0.0377

DD_IO

+0.7889

DD_IO

+0.7449

=2.5V)

STRENGTH 7

=2.5V)

) s n

( S

E M

I T

L L

A F

D N A

E S

I R

FALL TIME

Y = 0.0313x + 0.818

10 20 30 40 50 60 70 80 90 100

DD_IO

RISE TIME

Y = 0.0321

LOAD CAPACITANCE (pF)

Figure 44. Typical Output Rise and Fall Time (10% to 90%, V vs. Load Capacitance at Strength 7

) s n

(

I L A V

T U P T U O

0 102030405060708090100

Figure 45. Typical Output Valid (V Case Temperature and Strength 0 to 7

The line equations for the output valid vs. load capacitance are:

STRENGTH 0–7

=2.5V)

DD_IO

LOAD CAPACITANCE ( pF)

= 2.5 V) vs. Load Capacitance at Max

DD_IO

Strength 0: y = 0.0956x + 3.5662 Strength 1: y = 0.0523x + 3.2144 Strength 2: y = 0.0433x + 3.1319 Strength 3: y = 0.0391x + 2.9675 Strength 4: y = 0.0393x + 2.7653 Strength 5: y = 0.0373x + 2.6515 Strength 6: y = 0.0379x + 2.1206 Strength 7: y = 0.0399x + 1.9080

+0.6512

DD_IO

=2.5V)

10 20 30 40 50 60 70 80 90 100

LOAD CAPACITANCE (pF)

Figure 43. Typical Output Rise and Fall Time (10% to 90%, V vs. Load Capacitance at Strength 6

Rev. C | Page 39 of 48 | December 2006

DD_IO

=2.5V)

Page 40

ADSP-TS202S

ENVIRONMENTAL CONDITIONS

The ADSP-TS202S processor is rated for performance under T

environmental conditions specified in the Operating Con-

CASE

ditions on Page 21.

Thermal Characteristics

The ADSP-TS202S processor is packaged in a 25 mm × 25 mm, thermally enhanced ball grid array (BGA_ED). The ADSP-TS202S processor is specified for a case temperature (T

). To ensure that the T

CASE

exceeded, a heat sink and/or an air flow source may be required.

Table 34 shows the thermal characteristics of the

25 mm × 25 mm BGA_ED package. All parameters are based on a JESD51-9 four-layer 2s2p board. All data are based on 3 W power dissipation.

Table 34. Thermal Characteristics for 25 mm × 25 mm Package

Parameter Condition Typical Unit

Airflow = 0 m/s 12.9 Airflow = 1 m/s 10.2 °C/W Airflow = 2 m/s 9.0 °C/W Airflow = 3 m/s 8.0 °C/W

θJA measured per JEDEC standard JESD51-6.

θJA = 12.9°C/W for 0 m/s is for vertically mounted boards. For horizontally

mounted boards, use 17.0°C/W for 0 m/s.

θJB measured per JEDEC standard JESD51-9.

θJC measured by cold plate test method (no approved JEDEC standard).

—7.7°C/W —0.7°C/W

data sheet specification is not

CASE

°C/W

Rev. C | Page 40 of 48 | December 2006

Page 41

576-BALL BGA_ED PIN CONFIGURATIONS

Figure 46 shows a summary of pin configurations for the

576-ball BGA_ED package, and Table 35 lists the signal-to-ball assignments.

ADSP-TS202S

8624 22 24

1210

1614

191721 2 315

KEY:

SIGNAL

DD_IO

DD_DRAM

DD_A

REF

NO CONNECT

TOP VI EW

Figure 46. 576-Ball BGA_ED Pin Configurations1 (Top View, Summary)

For a more detailed pin summary diagram, see the EE-179: ADSP-TS201S System Design Guidelines on the Analog Devices website (www.analog.com).

Rev. C | Page 41 of 48 | December 2006

Page 42

ADSP-TS202S

Table 35. 576-Ball (25 mm × 25 mm) BGA_ED Ball Assignments

Ball No. Signal Name Ball No. Signal Name Ball No. Signal Name Ball No. Signal Name

A1 V

A2 DATA51 B2 V A3 V

A4 DATA49 B4 DATA50 C4 DATA52 D4 V A5 DATA43 B5 DATA44 C5 DATA47 D5 DATA48 A6 DATA41 B6 DATA42 C6 DATA45 D6 DATA46 A7 DATA37 B7 DATA38 C7 DATA39 D7 DATA40 A8 DATA33 B8 DATA34 C8 DATA35 D8 DATA36 A9 DATA29 B9 DATA30 C9 DATA31 D9 DATA32 A10 DATA25 B10 DATA26 C10 DATA27 D10 DATA28 A11 DATA23 B11 DATA24 C11 DATA21 D11 DATA22 A12 DATA19 B12 DATA20 C12 DATA17 D12 DATA18 A13 DATA15 B13 DATA16 C13 V A14 DATA11 B14 DATA12 C14 DATA13 D14 DATA14 A15 DATA9 B15 DATA10 C15 DATA7 D15 DATA8 A16 DATA5 B16 DATA6 C16 DATA3 D16 DATA4 A17 DATA1 B17 DATA2 C17 ACK D17 DATA0 A18 WRL A19 ADDR30 B19 ADDR31 C19 ADDR26 D19 ADDR27 A20 ADDR28 B20 ADDR29 C20 ADDR24 D20 ADDR25 A21 ADDR22 B21 ADDR23 C21 ADDR20 D21 V A22 V

A23 ADDR21 B23 V A24 V

E1 DATA61 F1 DATA63 G1 MSSD1 E2 DATA62 F2 MS1 G2 V E3 DATA57 F3 DATA59 G3 MS0 H3 MSSD3 E4 DATA58 F4 DATA60 G4 BMS H4 SCLKRAT0 E5 V E6 V E7 V E8 V E9 V E10 V E11 V E12 V E13 V E14 V E15 V E16 V E17 V E18 V E19 V E20 V

DD_IO

E21 ADDR15 F21 ADDR13 G21 ADDR7 H21 ADDR3 E22 ADDR14 F22 ADDR12 G22 ADDR6 H22 ADDR2 E23 ADDR11 F23 ADDR9 G23 ADDR5 H23 ADDR1 E24 ADDR10 F24 ADDR8 G24 ADDR4 H24 ADDR0

B1 DATA53 C1 V

C2 V C3 V

B3 V

D1 DATA55 D2 DATA56 D3 DATA54

D13 V

B18 WRH C18 RD D18 BRST

B22 V

B24 ADDR18 C24 V

F5 V F6 V F7 V F8 V F9 V F10 V F11 V F12 V F13 V F14 V F15 V F16 V F17 V F18 V F19 V F20 V

DD_IO

DD_DRAM

DD_IO

C22 V C23 V

G5 V G6 V G7 V G8 V G9 V G10 V G11 V G12 V G13 V G14 V G15 V G16 V G17 V G18 V G19 V G20 V

DD_IO

DD_DRAM

DD_IO

D22 ADDR19 D23 ADDR17 D24 ADDR16 H1 V

H2 MSH

H5 V H6 V H7 V H8 V H9 V H10 V H11 V H12 V H13 V H14 V H15 V H16 V H17 V H18 V H19 V H20 V

DD_IO

Rev. C | Page 42 of 48 | December 2006

Page 43

ADSP-TS202S

Table 35. 576-Ball (25 mm × 25 mm) BGA_ED Ball Assignments (Continued)

Ball No. Signal Name Ball No. Signal Name Ball No. Signal Name Ball No. Signal Name

J1 RAS K1 SDA10 L1 SDWE M1 BR3 J2 CAS K2 SDCKE L2 BR0 M2 SCLKRAT1 J3 V J4 V J5 V J6 V J7 V J8 V J9 V J10 V J11 V J12 V J13 V J14 V J15 V J16 V J17 V J18 V J19 V J20 V

REF

J21 L0ACKO K21 L0DATI1_N L21 L0DATI3_N M21 V J22 L0BCMPI K22 L0DATI1_P L22 L0DATI3_P M22 V J23 L0DATI0_N K23 L0CLKINN L23 L0DATI2_N M23 L0DATO3_N J24 L0DATI0_P K24 L0CLKINP L24 L0DATI2_P M24 L0DATO3_P N1 ID0 P1 SCLK R1 V N2 V N3 V N4 V N5 V N6 V N7 V N8 V N9 V N10 V N11 V N12 V N13 V N14 V N15 V N16 V N17 V N18 V N19 V N20 V

DD_A

DD_IO

N21 L0DATO2_N P21 L0DATO1_N R21 NC T21 L1DATI0_N N22 L0DATO2_P P22 L0DATO1_P R22 V N23 L0CLKON P23 L0DATO0_N R23 L0BCMPO N24 L0CLKOP P24 L0DATO0_P R24 L0ACKI T24 L1BCMPI

K3 LDQM L3 BR1 M3 BR5 K4 HDQM L4 BR2 M4 BR6 K5 V K6 V K7 V K8 V K9 V K10 V K11 V K12 V K13 V K14 V K15 V K16 V K17 V K18 V K19 V K20 V

DD_IO

DD_DRAM

DD_IO

P2 SCLK_VREF R2 NC (SCLK) P3 V

L5 V L6 V L7 V L8 V L9 V L10 V L11 V L12 V L13 V L14 V L15 V L16 V L17 V L18 V L19 V L20 V

DD_IO

DD_DRAM

DD_IO

R3 NC (SCLK_VREF)

M5 V M6 V M7 V M8 V M9 V M10 V M11 V M12 V M13 V M14 V M15 V M16 V M17 V M18 V M19 V M20 V

DD_IO

T1 RST_IN T2 SCLKRAT2

T3 BR4 P4 BM R4 BR7 T4 DS0 P5 V P6 V P7 V P8 V P9 V P10 V P11 V P12 V P13 V P14 V P15 V P16 V P17 V P18 V P19 V P20 V

DD_IO

DD_DRAM

DD_IO

R5 V R6 V R7 V R8 V R9 V R10 V R11 V R12 V R13 V R14 V R15 V R16 V R17 V R18 V R19 V R20 V

DD_IO

DD_DRAM

DD_IO

T5 V

T6 V

T7 V

T8 V

T9 V

T10 V

T11 V

T12 V

T13 V

T14 V

T15 V

T16 V

T17 V

T18 V

T19 V

T20 V

T22 L1DATI0_P

T23 L1ACKO

Rev. C | Page 43 of 48 | December 2006

Page 44

ADSP-TS202S

Table 35. 576-Ball (25 mm × 25 mm) BGA_ED Ball Assignments (Continued)

Ball No. Signal Name Ball No. Signal Name Ball No. Signal Name Ball No. Signal Name

U1 MSSD0 V1 MSSD2 W1 CONTROLIMP0 Y1 EMU U2 RST_OUT V2 DS2 W2 ENEDREG Y2 TCK U3 ID2 V3 POR_IN W3 TDI Y3 TMR0E U4 DS1 V4 CONTROLIMP1 W4 TDO Y4 FLAG3 U5 V U6 V U7 V U8 V U9 V U10 V U11 V U12 V U13 V U14 V U15 V U16 V U17 V U18 V U19 V U20 V

DD_IO

DD_DRAM

DD_IO

U21 L1CLKINN V21 L1DATI3_N W21 L1CLKON Y21 L1DATO1_N U22 L1CLKINP V22 L1DATI3_P W22 L1CLKOP Y22 L1DATO1_P U2 3 L 1D ATI 1_ N V2 3 L 1D ATI 2_ N W2 3 L1 DAT O3 _N Y 23 L 1D ATO 2_ N U2 4 L 1D ATI 1_ P V2 4 L1 DAT I2 _ P W 24 L 1 DATO 3_ P Y2 4 L 1D ATO 2_ P AA1 FLAG2 AB1 V AA2 FLAG1 AB2 V AA3 IRQ3 AA4 V

AA5 IRQ0 AB5 IRQ2 AC5 IOWR AD5 IORD AA6 IOEN AB6 IRQ1 AC6 DMAR2 AD6 DMAR3 AA7 DMAR0 AB7 DMAR1 AC7 CPA AD7 DPA AA8 HBR AB8 HBG AC8 BOFF AD8 BUSLOCK AA9 L3BCMPO AB9 L3ACKI AC9 L3DATO0_N AD9 L3DATO0_P AA10 L3DATO1_N AB10 L3DATO1_P AC10 L3CLKON AD10 L3CLKOP AA11 L3DATO3_N AB11 L3DATO3_P AC11 L3DATO2_N AD11 L3DATO2_P AA12 V

AA13 L3DATI2_N AB13 L3DATI2_P AC13 L3CLKINN AD13 L3CLKINP AA14 L3DATI1_N AB14 L3DATI1_P AC14 L3DATI0_N AD14 L3DATI0_P AA15 NC AB15 V AA16 L2DATO0_N AB16 L2DATO0_P AC16 L2BCMPO AD16 L2ACKI AA17 L2CLKON AB17 L2CLKOP AC17 L2DATO1_N AD17 L2DATO1_P AA18 L2DATO3_N AB18 L2DATO3_P AC18 L2DATO2_N AD18 L2DATO2_P AA19 L2CLKINN AB19 L2CLKINP AC19 L2DATI3_N AD19 L2DATI3_P AA20 L2DATI1_N AB20 L2DATI1_P AC20 L2DATI2_N AD20 L2DATI2_P AA21 V

AA22 L1BCMPO AA23 L1DATO0_N AB23 V AA24 L1DATO0_P AB24 V

On revision 1.x silicon, the R2 and R3 balls are NC. On revision 0.x silicon, the R2 ball is SCLK, and the R3 ball is SCLK_V

on revision 0.x silicon, see the EE-179: ADSP-TS20x TigerSHARC System Design Guidelines on the Analog Devices website (www.analog.com).

V5 V V6 V V7 V V8 V V9 V V10 V V11 V V12 V V13 V V14 V V15 V V16 V V17 V V18 V V19 V V20 V

AB3 V

DD_DRAM

DD_IO

W5 V W6 V W7 V W8 V W9 V W10 V W11 V W12 V W13 V W14 V W15 V W16 V W17 V W18 V W19 V W20 V

DD_IO

DD_DRAM

DD_IO

Y5 V Y6 V Y7 V Y8 V Y9 V Y10 V Y11 V Y12 V Y13 V Y14 V Y15 V Y16 V Y17 V Y18 V Y19 V Y20 V

AC1 FLAG0 AD1 V AC2 V AC3 V

DD_IO

AD2 ID1 AD3 V

DD_IO

AB4 NC AC4 TMS AD4 TRST

AB12 V

AC12 L3DATI3_N AD12 L3DATI3_P

AC15 L3ACKO AD15 L3BCMPI

AB21 L2ACKO AC21 L2DATI0_N AD21 L2DATI0_P AB22 V

DD_IO

AC22 V AC23 V

DD_IO

AD22 V AD23 L2BCMPI

AC24 L1ACKI AD24 V

. For more information on SCLK and SCLK_V

REF

DD_IO

REF

Rev. C | Page 44 of 48 | December 2006

Page 45

OUTLINE DIMENSIONS

The ADSP-TS202S processor is available in a 25 mm × 25 mm, 576-ball metric thermally enhanced ball grid array (BGA_ED) package with 24 rows of balls (BP-576).

25.2 0

25.0 0

24.8 0

1.25

1.00

0.75

3.10

2.94

2.78

NOTES:

1. ALL DIMENS ION S ARE IN M ILLIM ETERS .

2. THE ACTUAL POSITION OF THE BALL GRID IS WITHIN 0.25 mm OF ITS IDEAL POSITION RELATIVE TO THE PACKAGE EDGES.

3. CENTER DIMENSIONS ARE NOMINAL.

4. THIS PACKAGE C ONFORMS TO JEDEC MS-034 SP ECIFICATION.

1.25

1.00

0.75

A1 BALL INDICATOR

TOP VIEW

25.20

25.00

24.80

DETAIL A

1.00 BSC

23.00 BSC

1.00 BSC

(BALL

PITCH)

1.00 BSC

0.97 BSC

SEATING PLANE

10121416182024 22

1721 1923

1113

BOTTOM VIEW

0.75

0.65

0.55

(BALL

DIAMETER)

ADSP-TS202S

79531

1.60 MAX

0.20 M AX

0.60

0.50

0.40

DETAIL A

Figure 47. 576-Ball BGA_ED (BP-576)

SURFACE MOUNT DESIGN

Table 36 is provided as an aid to PCB design. For industry-

standard design recommendations, refer to IPC-7351, Generic

Requirements for Surface Mount Design and Land Pattern Standard.

Table 36. BGA Data for Use with Surface Mount Design

Package Ball Attach Type Solder Mask Opening Ball Pad Size

576-Ball BGA_ED (BP-576)

Nonsolder Mask Defined (NSMD) 0.69 mm diameter 0.56 mm diameter

Rev. C | Page 45 of 48 | December 2006

Page 46

ADSP-TS202S

ORDERING GUIDE

Model

Temperature

Range

Instruction

Rate

On-Chip DRAM Operating Voltage Package Option

ADSP-TS202SABP-050 –40°C to +85°C 500 MHz 12M bit 1.05 V

1.5 V

ADSP-TS202SABPZ050

–40°C to +85°C 500 MHz 12M bit 1.05 VDD, 2.5 V

1.5 V

Represents case temperature.

The instruction rate is the same as the internal processor core clock (CCLK) rate.

Z = Pb-free part.

, 2.5 V

DD_DRAM

DD_IO

Package Description

BP-576 576-Ball BGA_ED

Rev. C | Page 46 of 48 | December 2006

Page 47

ADSP-TS202S

Rev. C | Page 47 of 48 | December 2006

Page 48

ADSP-TS202S

C04325-0-12/06(C)

Rev. C | Page 48 of 48 | December 2006

Datasheet ADSP-TS202S Datasheet (ANALOG DEVICES)

Specifications and Main Features

Frequently Asked Questions

User Manual

KEY FEATURES

KEY BENEFITS

TABLE OF CONTENTS

REVISION HISTORY

GENERAL DESCRIPTION

DUAL COMPUTE BLOCKS

DATA ALIGNMENT BUFFER (DAB)

DUAL INTEGER ALU (IALU)

PROGRAM SEQUENCER

Interrupt Controller

DSP MEMORY

Flexible Instruction Set

EXTERNAL PORT (OFF-CHIP MEMORY/PERIPHERALS INTERFACE)

Host Interface

Multiprocessor Interface

SDRAM Controller

EPROM Interface

DMA CONTROLLER

LINK PORTS (LVDS)

TIMER AND GENERAL-PURPOSE I/O

RESET AND BOOTING

CLOCK DOMAINS

POWER DOMAINS

FILTERING REFERENCE VOLTAGE AND CLOCKS

DEVELOPMENT TOOLS

EVALUATION KIT

DESIGNING AN EMULATOR-COMPATIBLE DSP BOARD (TARGET)

ADDITIONAL INFORMATION

PIN FUNCTION DESCRIPTIONS

STRAP PIN FUNCTION DESCRIPTIONS

OPERATING CONDITIONS

ELECTRICAL CHARACTERISTICS

PACKAGE INFORMATION

ABSOLUTE MAXIMUM RATINGS

ESD SENSITIVITY

TIMING SPECIFICATIONS

General AC Timing

Link Port Low Voltage, Differential-Signal (LVDS) Electrical Characteristics, and Timing

OUTPUT DRIVE CURRENTS

TEST CONDITIONS

Output Disable Time

Output Enable Time

Capacitive Loading

ENVIRONMENTAL CONDITIONS

Thermal Characteristics

576-BALL BGA_ED PIN CONFIGURATIONS

OUTLINE DIMENSIONS

SURFACE MOUNT DESIGN

ORDERING GUIDE