Input voltage range: 3.3 V to 20 V
Maximum output current: 300 mA
Low noise: 15 µV rms for fixed output versions
PSRR performance of 60 dB at 10 kHz, V
Reverse current protection
Low dropout voltage: 200 mV at 300 mA load
Initial accuracy: ±0.8%
Accuracy over line, load, and temperature: −2%, +1%
Low quiescent current (V
= 5 V), I
IN
GND
load
Low shutdown current: 40 µA at V
IN
Stable with small 1 µF ceramic output capacitor
7 fixed output voltage options: 1.5 V, 1.8 V, 2.5 V, 3 V, 3.3 V,
5 V, and 9 V
Adjustable output from 1.22 V to V
Foldback current limit and thermal overload protection
User programmable precision UVLO/enable
Power good indicator
8-lead LFCSP and 8-lead SOIC packages
= 3.3 V
OUT
= 750 μA with 300 mA
= 12 V
– VDO
IN
TYPICAL APPLICATION CIRCUITS
Figure 1. ADP7102 with Fixed Output Voltage, 5 V
Figure 2. ADP7102 with Adjustable Output Voltage, 5 V
APPLICATIONS
Regulation to noise sensitive applications: ADC, DAC
circuits, precision amplifiers, high frequency oscillators,
clocks, and PLLs
Communications and infrastructure
Medical and healthcare
Industrial and instrumentation
GENERAL DESCRIPTION
The ADP7102 is a CMOS, low dropout linear regulator that
operates from 3.3 V to 20 V and provides up to 300 mA of
output current. This high input voltage LDO is ideal for
regulation of high performance analog and mixed signal
circuits operating from 19 V to 1.22 V rails. Using an
advanced proprietary architecture, it provides high power
supply rejection, low noise, and achieves excellent line and
load transient response with just a small 1 µF ceramic
output capacitor.
The ADP7102 is available in 7 fixed output voltage options and
an adjustable version, which allows output voltages that range
from 1.22 V to V
− VDO via an external feedback divider.
IN
The ADP7102 output noise voltage is 15 μV rms and is independent of the output voltage. A digital power good output
allows power system monitors to check the health of the output
voltage. A user programmable precision undervoltage lockout
function facilitates sequencing of multiple power supplies.
The ADP7102 is available in 8-lead, 3 mm × 3 mm LFCSP
and 8-lead SOIC packages. The LFCSP offers a very compact
solution and also provides excellent thermal performance for
applications requiring up to 300 mA of output current in a
small, low-profile footprint.
Information furnishe d by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Page 2
ADP7102 Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
UVLO Hysteresis Current UVLO
Enable Pulldown Current I
INPUT VOLTAGE
Shutdown Threshold V
Hysteresis 250 mV
OUTPUT NOISE OUT
10 Hz to 100 kHz, VIN = 6.3 V, V
10 Hz to 100 kHz, VIN = 8 V, V
10 Hz to 100 kHz, VIN = 12 V, V
10 Hz to 100 kHz, VIN = 5.5 V, V
10 Hz to 100 kHz, VIN = 12 V, V
10 Hz to 100 kHz, VIN = 18 V, V
POWER SUPPLY REJECTION RATIO PSRR 100 kHz, VIN = 4.3 V, V
100 kHz, VIN = 6 V, V
10 kHz, VIN = 4.3 V, V
10 kHz, VIN = 6 V, V
100 kHz, VIN = 3.3 V, V
100 kHz, VIN = 6 V, V
100 kHz, VIN = 16 V, V
10 kHz, VIN = 3.3 V, V
10 kHz, VIN = 6 V, V
10 kHz, VIN = 16 V, V
1
Based on an end-point calculation using 1 mA and 300 mA loads. See Figure 6 for typical load re gulation performance for loads less than 1 mA.
2
Dropout voltage is defined as the input-to-output voltage differential when the input voltage is set to the nominal output voltage. This applies only for output
voltages above 3.0 V.
3
Start-up time is defined as the time between the rising edge of EN to VOUT being at 90% of its nominal value.
4
Current-limit threshold is defined as the current at which the output voltage drops to 90% of the specified typical value. For example, the current limit for a 5.0 V
output voltage is defined as the current that causes the output voltage to drop to 90% of 5.0 V, or 4.5 V.
3.3 V ≤ VIN ≤ 20 V, TJ = −40°C to +125°C 1.18 1.23 1.28 V
RISE
3.3 V ≤ VIN ≤ 20 V, TJ = −40°C to +125°C, 10 kΩ
FAL L
1.13 V
in series with enable pin
VEN > 1.25 V, TJ = −40°C to +125°C 7.5 9.8 12 µA
HYS
EN = VIN 500 nA
EN-IN
STA RT
TJ = −40°C to +125°C 2.45 V
SHUTDOWN
10 Hz to 100 kHz, VIN = 5.5 V, V
NOISE
= 1.8 V 15 µV rms
OUT
= 3.3 V 15 µV rms
OUT
= 5 V 15 µV rms
OUT
= 9 V 15 µV rms
OUT
= 1.5 V,
OUT
18 µV rms
adjustable mode
OUT
= 5 V,
30 µV rms
adjustable mode
= 15 V,
OUT
65 µV rms
adjustable mode
= 3.3 V 50 dB
OUT
= 5 V 50 dB
OUT
= 3.3 V 60 dB
OUT
= 5 V 60 dB
OUT
= 1.8 V, adjustable mode 50 dB
OUT
= 5 V, adjustable mode 60 dB
OUT
= 15 V, adjustable mode 60 dB
OUT
= 1.8 V, adjustable mode 60 dB
OUT
= 5 V, adjustable mode 80 dB
OUT
= 15 V, adjustable mode 80 dB
OUT
INPUT AND OUTPUT CAPACITOR, RECOMMENDED SPECIFICATIONS
Table 2.
Parameter Symbol Conditions Min Typ Max Unit
Minimum Input and Output Capacitance1 C
Capacitor ESR R
1
The minimum input and output capacitance should be greater than 0.7 μF over the full range of operating conditions. The full range of operating conditions in the
application must be considered during device selection to ensure that the minimum capacitance specification is met. X7R and X5R type capacitors are recommended;
Y5V and Z5U capacitors are not recommended for use with any LDO.
TA = −40°C to +125°C 0.7 µF
MIN
TA = −40°C to +125°C 0.001 0.2 Ω
ESR
Rev. A | Page 4 of 28
Page 5
Data Sheet ADP7102
Operating Ambient Temperature Range
–40°C to +85°C
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
VIN to GND –0.3 V to +22 V
VOUT to GND –0.3 V to +20 V
EN/UVLO to GND –0.3 V to VIN
PG to GND –0.3 V to VIN
SENSE/ADJ to GND –0.3 V to VOUT
Storage Temperature Range –65°C to +150°C
Operating Junction Temperature Range –40°C to +125°C
Soldering Conditions JEDEC J-STD-020
Stresses above those listed under absolute maximum ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL DATA
Absolute maximum ratings apply individually only, not in
combination. The ADP7102 can be damaged when the junction
temperature limit is exceeded. Monitoring ambient temperature
does not guarantee that T
limits. In applications with high power dissipation and poor
thermal resistance, the maximum ambient temperature may
have to be derated.
In applications with moderate power dissipation and low PCB
thermal resistance, the maximum ambient temperature can
exceed the maximum limit as long as the junction temperature
is within specification limits. The junction temperature (T
the device is dependent on the ambient temperature (T
power dissipation of the device (P
ambient thermal resistance of the package (θ
Maximum junction temperature (T
ambient temperature (T
formula
T
= TA + (PD × θJA)
J
Junction-to-ambient thermal resistance (θ
based on modeling and calculation using a 4-layer board. The
junction-to-ambient thermal resistance is highly dependent on
the application and board layout. In applications where high
maximum power dissipation exists, close attention to thermal
is within the specified temperature
J
) of
J
), the
A
), and the junction-to-
D
).
JA
) is calculated from the
J
) and power dissipation (PD) using the
A
) of the package is
JA
board design is required. The value of θ
on PCB material, layout, and environmental conditions. The
specified values of θ
are based on a 4-laye r, 4 in. × 3 in. circuit
JA
board. See JESD51-7 and JESD51-9 for detailed information on
the board construction. For additional information, see the
AN-617 Application Note, MicroCSP™ Wafer Level Chip Scale
Package, available at www.analog.com.
Ψ
is the junction-to-board thermal characterization parameter
JB
with units of °C/W. The package’s Ψ
calculation using a 4-layer board. The JESD51-12, Guidelines
for Reporting and Using Electronic Package Thermal
Information, states that thermal characterization parameters are
not the same as thermal resistances. Ψ
component power flowing through multiple thermal paths
rather than a single path as in thermal resistance, θ
Ψ
thermal paths include convection from the top of the
JB
package as well as radiation from the package, factors that make
Ψ
more useful in real-world applications. Maximum junction
JB
temperature (T
and power dissipation (P
T
= TB + (PD × ΨJB)
J
) is calculated from the board temperature (TB)
J
) using the formula
D
See JESD51-8 and JESD51-12 for more detailed information
about Ψ
.
JB
Thermal Resistance
θJA and ΨJB are specified for the worst-case conditions, that is, a
device soldered in a circuit board for surface-mount packages.
θ
is a parameter for surface-mount packages with top
2. IT IS HI GHLY RECOM M E NDE D THAT THE
EXPOSED PAD ON THE BOTTOM OF THE
PACKAGE BE CONNE CTED TO THE GROUND
PLANE ON T HE BOARD.
3GND
4NC
1VOUT
2SENSE/ADJ
6 GND
5 EN/UVLO
8 VIN
7 PG
ADP7102
TOP VIEW
(Not to S cale)
09506-003
NOTES
1. NC = NO CONNECT. DO NOT CONNECT TO
THIS PIN.
2. IT IS HI GHLY RECOM M E NDE D THAT THE
EXPOSED PAD ON THE BOTTOM OF THE
PACKAGE BE CONNE CTED TO THE GROUND
PLANE ON T HE BOARD.
VOUT
1
SENSE/ADJ
2
GND
3
NC
4
VIN
8
PG
7
GND
6
EN/UVLO
5
ADP7102
TOP VIEW
(Not to S cale)
09506-104
Sense (SENSE). Measures the actual output voltage at the load and feeds it to the error amplifier.
performance and is electrically connected to GND inside the package. It is highly recommended
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 3. LFCSP Package
Figure 4. Narrow Body SOIC Package
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
1 VOUT Regulated Output Voltage. Bypass VOUT to GND with a 1 µF or greater capacitor.
2 SENSE/ADJ
Connect SENSE as close as possible to the load to minimize the effect of IR drop between the
regulator output and the load. This function applies to fixed voltages only.
Adjust Input (ADJ). An external resistor divider sets the output voltage. This function applies to
adjustable voltages only.
3 GND Ground.
4 NC Do Not Connect to this Pin.
5 EN/UVLO Enable Input (EN). Drive EN high to turn on the regulator; drive EN low to turn off the regulator.
For automatic startup, connect EN to VIN.
Programmable Undervoltage Lockout (UVLO). When the programmable UVLO function is used,
the upper and lower thresholds are determined by the programming resistors.
6 GND Ground.
7 PG Power Good. This open-drain output requires an external pull-up resistor to VIN or VOUT. If the
part is in shutdown, current limit, thermal shutdown, or falls below 90% of the nominal output
voltage, PG immediately transitions low. If the power good function is not used, the pin may be
left open or connected to ground.
8 VIN Regulator Input Supply. Bypass VIN to GND with a 1 µF or greater capacitor.
EPAD Exposed Pad. Exposed paddle on the bottom of the package. The EPAD enhances thermal
that the EPAD be connected to the ground plane on the board.
Figure 30. Output Voltage vs. Junction Temperature, V
= 1.8 V
OUT
= 5 V, Adjustable
OUT
Figure 32. Output Voltage vs. Input Voltage, V
= 5 V, Adjustable
OUT
Figure 33. Reverse Input Current vs. Temperature, VIN = 0 V, Different
Voltages on V
OUT
Figure 31. Output Voltage vs. Load Current, V
= 5 V, Adjustable
OUT
Rev. A | Page 11 of 28
Figure 34. Power Supply Rejection Ratio vs. Frequency, V
V
= 3.3 V
IN
= 1.8 V,
OUT
Page 12
ADP7102 Data Sheet
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
0
101001k10k100k1M10M
PSRR (dB)
FREQUENCY (Hz)
LOAD = 300mA
LOAD = 100mA
LOAD = 10mA
LOAD = 1mA
09506-028
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
0
101001k10k100k1M10M
PSRR (dB)
FREQUENCY (Hz)
LOAD = 300mA
LOAD = 100mA
LOAD = 10mA
LOAD = 1mA
09506-029
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
0
101001k10k100k1M10M
PSRR (dB)
FREQUENCY (Hz)
LOAD = 300mA
LOAD = 100mA
LOAD = 10mA
LOAD = 1mA
09506-030
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
0
101001k10k100k1M10M
PSRR (dB)
FREQUENCY (Hz)
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
09506-031
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
0
101001k10k100k1M10M
PSRR (dB)
FREQUENCY (Hz)
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
09506-032
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
0
101001k10k100k1M10M
PSRR (dB)
FREQUENCY (Hz)
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
09506-033
Figure 35. Power Supply Rejection Ratio vs. Frequency, V
V
= 4.8 V
IN
= 3.3 V,
OUT
Figure 38. Power Supply Rejection Ratio vs. Frequency, V
= 5 V, VIN = 6.5 V
OUT
Figure 36. Power Supply Rejection Ratio vs. Frequency, V
V
= 4.3 V
IN
Figure 37. Power Supply Rejection Ratio vs. Frequency, V
V
= 3.8 V
IN
= 3.3 V,
OUT
= 3.3 V,
OUT
Figure 39. Power Supply Rejection Ratio vs. Frequency, V
Figure 40. Power Supply Rejection Ratio vs. Frequency, V
Rev. A | Page 12 of 28
= 5 V, VIN = 6 V
OUT
= 5 V, VIN = 5.5 V
OUT
Page 13
Data Sheet ADP7102
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
0
101001k10k100k1M10M
PSRR (dB)
FREQUENCY (Hz)
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
09506-034
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
0
101001k10k100k1M10M
PSRR (dB)
FREQUENCY (Hz)
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
09506-035
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
0
101001k10k100k1M10M
PSRR (dB)
FREQUENCY (Hz)
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
09506-036
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
0
101001k10k100k1M10M
PSRR (dB)
FREQUENCY (Hz)
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
09506-037
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
0
00.250.500.751.001.251.50
PSRR (dB)
HEADROOM VOLTAGE (V)
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
09506-038
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
0
00.250.500.751.001.251.50
PSRR (dB)
HEADROOM VOLTAGE
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
09506-039
Figure 41. Power Supply Rejection Ratio vs. Frequency, V
Figure 42. Power Supply Rejection Ratio vs. Frequency, V
= 5 V, VIN = 5.3 V
OUT
= 5 V, VIN = 5.2 V
OUT
Figure 44. Power Supply Rejection Ratio vs. Frequency, V
= 5 V, VIN = 6 V,
OUT
Adjustable with Noise Reduction Circuit
Figure 45. Power Supply Rejection Ratio vs. Headroom Voltage, 100 Hz,
V
= 5 V
OUT
Figure 43. Power Supply Rejection Ratio vs. Frequency, V
Adjustable
OUT
= 5 V, VIN = 6 V,
Rev. A | Page 13 of 28
Figure 46. Power Supply Rejection Ratio vs. Headroom Voltage, 1 kHz,
V
= 5 V
OUT
Page 14
ADP7102 Data Sheet
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
0
00.250.500.751.001.251.50
PSRR (dB)
HEADROOM VOLTAGE (V)
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
09506-040
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
0
00.250.500.751.001.251.50
PSRR (dB)
HEADROOM VOLTAGE (V)
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
09506-041
0
5
10
15
20
25
30
0.000010.00010.0010.010.11
NOISE (µV rms)
LOAD CURRENT (A)
3.3V
1.8V
5V
5V
ADJ
5V
ADJ
NR
09506-042
0.01
0.1
1
10
101001k10k100k
FREQUENCY (Hz)
3.3V
5V
5V ADJ
5V ADJ NR
µV/√Hz
09506-043
CH2 50mVCH1 200mAM 20µsA CH1 76mA
1
2
T 10.4%
Ω
B
W
B
W
09506-044
LOAD CURRENT
OUTPUT VOLTAGE
CH1 200mACH2 50mVM 20µsA CH1 168mA
1
2
T 10.2%
B
W
B
W
Ω
09506-045
LOAD CURRENT
OUTPUT VOLTAGE
Figure 47. Power Supply Rejection Ratio vs. Headroom Voltage, 10 kHz,
V
= 5 V
OUT
Figure 48. Power Supply Rejection Ratio vs. Headroom Voltage, 100 k Hz,
V
= 5 V
OUT
Figure 50. Output Noise Spectral Density, I
= 10 mA, C
LOAD
OUT
Figure 51. Load Transient Response, C
V
OUT
, C
= 1 μF, I
IN
OUT
= 1.8 V, VIN = 5 V
= 1 mA to 300 mA,
LOAD
= 1 μF
Figure 49. Output Noise vs. Load Current and Output Voltage,
C
= 1 μF
OUT
, C
Figure 52. Load Transient Response, C
V
= 3.3 V, VIN = 5 V
OUT
= 1 μF, I
IN
OUT
= 1 mA to 300 mA,
LOAD
Rev. A | Page 14 of 28
Page 15
Data Sheet ADP7102
CH1 200mACH2 50mVM 20µsA CH1 216mA
1
2
T 10.2%
B
W
B
W
Ω
09506-046
LOAD CURRENT
OUTPUT VOLTAGE
CH2 10mVCH1 1VM 4µsA CH4 1.56V
1
2
T 9.8%
B
W
B
W
09506-047
OUTPUT VOLTAGE
INPUT VOLTAGE
CH2 10mVCH1 1VM 4µsA CH4 1.56V
1
2
T 9.8%
B
W
B
W
09506-048
OUTPUT VOLTAGE
INPUT VOLTAGE
CH1 1VCH2 10mVM 4µsA CH4 1.56V
1
2
T 9.8%
B
W
B
W
09506-049
OUTPUT VOLTAGE
INPUT VOLTAGE
Figure 53. Load Transient Response, C
V
= 5 V, VIN = 7 V
OUT
Figure 54. Line Transient Response, CIN, C
V
OUT
, C
IN
= 1.8 V
OUT
= 1 μF, I
= 1 μF, I
OUT
= 1 mA to 300 mA,
LOAD
= 300 mA,
LOAD
Figure 55. Line Transient Response, CIN, C
V
= 3.3 V
OUT
Figure 56. Line Transient Response, CIN, C
= 1 μF, I
OUT
OUT
= 1 μF, I
LOAD
= 300 mA,
LOAD
= 300 mA, V
OUT
= 5 V
Rev. A | Page 15 of 28
Page 16
ADP7102 Data Sheet
CH2 10mVCH1 1VM 4µsA CH4 1.56V
1
2
T 9.8%
B
W
B
W
09506-050
OUTPUT VOLTAGE
INPUT VOLTAGE
CH2 10mVCH1 1VM 4µsA CH4 1.56V
1
2
T 9.8%
B
W
B
W
09506-051
OUTPUT VOLTAGE
INPUT VOLTAGE
CH2 10mVM 4µsA CH4 1.56V
1
2
T 9.8%
B
W
B
W
CH1 1V
09506-052
OUTPUT VOLTAGE
INPUT VOLTAGE
Figure 57. Line Transient Response, CIN, C
Figure 58. Line Transient Response, C
OUT
= 1 μF, I
= 1 mA, V
LOAD
OUT
= 1.8 V
Figure 59. Line Transient Response, CIN, C
= 1 μF, I
OUT
= 1 mA, V
LOAD
OUT
= 5 V
, C
= 1 μF, I
IN
OUT
= 1 mA, V
LOAD
OUT
= 3.3 V
Rev. A | Page 16 of 28
Page 17
Data Sheet ADP7102
SHUTDOWN
VIN
GND
EN/
UVLO
VOUT
R1
R2
1.22V
REFERENCE
VREG
PGOOD
PG
SENSE
SHORT-CIRCUIT,
THERMAL
PROTECT
10µA
09506-055
SHUTDOWN
VIN
GND
EN/
UVLO
VOUT
1.22V
REFERENCE
VREG
PGOOD
PG
SENSE
SHORT-CIRCUIT,
THERMAL
PROTECT
10µA
09506-056
VOUT = 5V
VIN = 8V
PG
VOUTVIN
PG
GND
ADJ
EN/
UVLO
RPG
100kΩ
R4
100kΩ
R3
100kΩ
COUT
1µF
CIN
1µF
ON
OFF
R2
13kΩ
+
+
R1
40.2kΩ
09506-057
THEORY OF OPERATION
The ADP7102 is a low quiescent current, low-dropout linear
regulator that operates from 3.3 V to 20 V and provides up to
300 mA of output current. Drawing a low 750 μA of quiescent
current (typical) at full load makes the ADP7102 ideal for
battery-operated portable equipment. Ty pical shutdown
current consumption is 40 μA at room temperature.
Optimized for use with small 1 µF ceramic capacitors, the
ADP7102 provides excellent transient performance.
is higher than the reference voltage, the gate of the PMOS
device is pulled higher, allowing less current to pass and
decreasing the output voltage.
The ADP7102 is available in 7 fixed output voltage options,
ranging from 1.8 V to 9 V and in an adjustable version with
an output voltage that can be set to between 1.22 V and 19 V
by an external voltage divider. The output voltage can be set
according to the following equation:
V
= 1.22 V(1 + R1/R2)
OUT
Figure 60. Fixed Output Voltage Internal Block Diagram
Figure 61. Adjustable Output Voltage Internal Block Diagram
Internally, the ADP7102 consists of a reference, an error
amplifier, a feedback voltage divider, and a PMOS pass
transistor. Output current is delivered via the PMOS pass
device, which is controlled by the error amplifier. The error
amplifier compares the reference voltage with the feedback
voltage from the output and amplifies the difference. If the
feedback voltage is lower than the reference voltage, the gate
of the PMOS device is pulled lower, allowing more current to
pass and increasing the output voltage. If the feedback voltage
Figure 62. Typical Adjustable Output Voltage Application Schematic
The value of R2 should be less than 200 kΩ to minimize
errors in the output voltage caused by the ADJ pin input
current. For example, when R1 and R2 each equal 200 kΩ,
the output voltage is 2.44 V. The output voltage error
introduced by the ADJ pin input current is 2 mV or 0.08%,
assuming a typical ADJ pin input current of 10 nA at 25°C.
The ADP7102 uses the EN/UVLO pin to enable and disable
the VOUT pin under normal operating conditions. When
EN/UVLO is high, VOUT turns on, when EN is low, VOUT
turns off. For automatic startup, EN/UVLO can be tied to VIN.
The ADP7102 incorporates reverse current protections
circuitry that prevents current flow backwards through the
pass element when the output voltage is greater than the input
voltage. A comparator senses the difference between the input
and output voltages. When the difference between the input
voltage and output voltage exceeds 55 mV, the body of the PFET
is switched to V
and turned off or opened. In other words,
OUT
the gate is connected to VOUT.
Rev. A | Page 17 of 28
Page 18
ADP7102 Data Sheet
CH2 50mVCH1 200mAM 20µsA CH1 76mA
1
2
T 10.4%
Ω
B
W
B
W
09506-058
LOAD CURRENT
OUTPUT VOLTAGE
1.2
1.0
0.8
0.6
0.4
0.2
0
0246810
CAPACITANCE (µF)
VOLTAGE (V)
09506-059
APPLICATIONS INFORMATION
CAPACITOR SELECTION
Output Capacitor
The ADP7102 is designed for operation with small, spacesaving ceramic capacitors but functions with most commonly
used capacitors as long as care is taken with regard to the
effective series resistance (ESR) value. The ESR of the output capacitor affects the stability of the LDO control loop. A
minimum of 1 µF capacitance with an ESR of 0.2 Ω or less is
recommended to ensure the stability of the ADP7102. Transient
response to changes in load current is also affected by output
capacitance. Using a larger value of output capacitance improves
the transient response of the ADP7102 to large changes in load
current. Figure 63 shows the transient responses for an output
capacitance value of 1 µF.
Figure 64 depicts the capacitance vs. voltage bias characteristic
of an 0402, 1 µF, 10 V, X5R capacitor. The voltage stability of a
capacitor is strongly influenced by the capacitor size and voltage
rating. In general, a capacitor in a larger package or higher voltage
rating exhibits better stability. The temperature variation of the
X5R dielectric is ~ ±15% over the −40°C to +85°C temperature
range and is not a function of package or voltage rating.
Figure 64. Capacitance vs. Voltage Characteristic
Use Equation 1 to determine the worst-case capacitance
accounting for capacitor variation over temperature,
component tolerance, and voltage.
C
= C
EFF
× (1 − TEMPCO) × (1 − TOL) (1)
BIAS
where:
Figure 63. Output Transient Response, V
= 1.8 V, C
OUT
Input Bypass Capacitor
Connecting a 1 µF capacitor from VIN to GND reduces
the circuit sensitivity to printed circuit board (PCB) layout,
especially when long input traces or high source impedance
are encountered. If greater than 1 µF of output capacitance is
required, the input capacitor should be increased to match it.
Input and Output Capacitor Properties
Any good quality ceramic capacitors can be used with the
ADP7102, as long as they meet the minimum capacitance and
maximum ESR requirements. Ceramic capacitors are manufactured with a variety of dielectrics, each with different behavior
over temperature and applied voltage. Capacitors must have a
dielectric adequate to ensure the minimum capacitance over
the necessary temperature range and dc bias conditions. X5R
or X7R dielectrics with a voltage rating of 6.3 V to 50 V are
OUT
= 1 µF
C
is the effective capacitance at the operating voltage.
BIAS
TEMPCO is the worst-case capacitor temperature coefficient.
TOL is the worst-case component tolerance.
In this example, the worst-case temperature coefficient
(TEMPCO) over −40°C to +85°C is assumed to be 15% for
an X5R dielectric. The tolerance of the capacitor (TOL) is
assumed to be 10%, and C
is 0.94 μF at 1.8 V, as shown
BIAS
in Figure 64.
Substituting these values in Equation 1 yields
C
= 0.94 μF × (1 − 0.15) × (1 − 0.1) = 0.719 μF
EFF
Therefore, the capacitor chosen in this example meets the
minimum capacitance requirement of the LDO over temperature and tolerance at the chosen output voltage.
To guarantee the performance of the ADP7102, it is imperative
that the effects of dc bias, temperature, and tolerances on the
behavior of the capacitors be evaluated for each application.
recommended. Y5V and Z5U dielectrics are not recommended,
due to their poor temperature and dc bias characteristics.
Rev. A | Page 18 of 28
Page 19
Data Sheet ADP7102
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
1.251.501.752.002.252.502.753.001.00
0
V
OUT
, EN RISE
V
OUT
, EN FALL
09506-060
VOUT = 5V
VIN = 8V
PG
VOUTVIN
PG
GND
SENSE
EN/
UVLO
RPG
100kΩ
R2
100kΩ
R1
100kΩ
COUT
1µF
CIN
1µF
ON
OFF
+
+
09506-061
TIME (µs)
0500100015002000
6
4
5
3
2
1
0
V
OUT
(V)
5V
3.3V
ENABLE
09506-062
PROGRAMABLE UNDERVOLTAGE LOCKOUT (UVLO)
The ADP7102 uses the EN/UVLO pin to enable and disable
the VOUT pin under normal operating conditions. As shown
in Figure 65, when a rising voltage on EN crosses the upper
threshold, VOUT turns on. When a falling voltage on EN/
UVLO crosses the lower threshold, VOUT turns off. The
hysteresis of the EN/UVLO threshold is determined by
the Thevenin equivalent resistance in series with the EN/
UVLO pin.
Figure 66. Typical EN Pin Voltage Divid er
Figure 65 shows the typical hysteresis of the EN/UVLO pin.
This prevents on/off oscillations that can occur due to noise
on the EN pin as it passes through the threshold points.
The ADP7102 uses an internal soft-start to limit the inrush
current when the output is enabled. The start-up time for the
3.3 V option is approximately 580 μs from the time the EN
active threshold is crossed to when the output reaches 90%
of its final value. As shown in Figure 67, the start-up time is
dependent on the output voltage setting.
Figure 65. Typical V
OUT
The upper and lower thresholds are user programmable and
can be set using two resistors. When the EN/UVLO pin voltage
is below 1.22 V, the LDO is disabled. When the EN/UVLO pin
voltage transitions above 1.22 V, the LDO is enabled and 10 µA
hysteresis current is sourced out of the pin raising the voltage,
thus providing threshold hysteresis. Typically, two external
resistors program the minimum operational voltage for the LDO.
The resistance values, R1 and R2 can be determined from:
R1 = V
R2 = 1.22 V × R1/(V
/10 μA
HYS
− 1.22 V)
IN
where:
V
is the desired turn-on voltage.
IN
V
is the desired EN/UVLO hysteresis level.
HYS
Hysteresis can also be achieved by connecting a resistor in series
with EN/UVLO pin. For the example shown in Figure 66, the
enable threshold is 2.44 V with a hysteresis of 1 V.
Response to EN Pin Operation
Figure 67. Typical Start-Up Behavior
Rev. A | Page 19 of 28
Page 20
ADP7102 Data Sheet
0
1
2
3
4
5
6
4.24.34.44.54.64.74.84.95.0
PG (V)
V
OUT
(V)
PG –40°C
PG –5°C
PG +25°C
PG +85°C
PG +125°C
09506-063
0
1
2
3
4
5
6
4.24.34.44.54.64.74.84.95.0
PG (V)
V
OUT
(V)
PG –40°C
PG –5°C
PG +25°C
PG +85°C
PG +125°C
09506-064
VOUT = 5V
VIN = 8V
PG
VOUTVIN
PG
GND
ADJ
EN/
UVLO
100kΩ
100kΩ
100kΩ
COUT
1µF
CIN
1µF
ON
OFF
R
NR
13kΩ
R
FB2
13kΩ
++
R
FB1
40.2kΩ
C
NR
100nF
+
09506-065
POWER GOOD FEATURE
The ADP7102 provides a power good pin (PG) to indicate
the status of the output. This open-drain output requires an
external pull-up resistor to VIN. If the part is in shutdown
mode, current-limit mode, or thermal shutdown, or if it falls
below 90% of the nominal output voltage, the power-good pin
(PG) immediately transitions low. During soft-start, the rising
threshold of the power-good signal is 93.5% of the nominal
output voltage.
The open-drain output is held low when the ADP7102 has
sufficient input voltage to turn on the internal PG transistor.
The PG transistor is terminated via a pull-up resistor to VOUT
or VIN.
Power-good accuracy is 93.5% of the nominal regulator output
voltage when this voltage is rising, with a 90% trip point when
this voltage is falling. Regulator input voltage brownouts or
glitches trigger power no good signals if V
A normal power-down causes the power good signal to go low
when V
drops below 90%.
OUT
Figure 68 and Figure 69 show the typical power good rising and
falling threshold over temperature.
falls below 90%.
OUT
NOISE REDUCTION OF THE ADJUSTABLE
ADP7102
The ultralow output noise of the fixed output ADP7102 is
achieved by keeping the LDO error amplifier in unity gain
and setting the reference voltage equal to the output voltage.
This architecture does not work for an adjustable output
voltage LDO. The adjustable output ADP7102 uses the more
conventional architecture where the reference voltage is fixed
and the error amplifier gain is a function of the output voltage.
The disadvantage of the conventional LDO architecture is that
the output voltage noise is proportional to the output voltage.
The adjustable LDO circuit may be modified slightly to
reduce the output voltage noise to levels close to that of the
fixed output ADP7102. The circuit shown in Figure 70 adds
two additional components to the output voltage setting resistor
divider. C
the ac gain of the error amplifier. R
R
FB2
mately 6 dB. The actual gain is the parallel combination of R
and R
always operates at greater than unity gain.
C
is chosen by setting the reactance of CNR equal to R
NR
R
at a frequency between 50 Hz and 100 Hz. This sets the
NR
frequency where the ac gain of the error amplifier is 3 dB
down from its dc gain.
and RNR are added in parallel with R
NR
is chosen to be equal to
NR
to reduce
FB1
; this limits the ac gain of the error amplifier to approxi-
, divided by R
FB1
. This ensures that the error amplifier
FB2
FB1
−
NR
Figure 68. Typical Power Good Threshold vs. Temperature, V
Figure 69. Typical Power Good Threshold vs. Temperature, V
Figure 70. Noise Reduction Modification to Adjustable LDO
The noise of the LDO is approximately the noise of the fixed
output LDO (typically 15 µV rms) times the square root of the
parallel combination of R
and R
NR
divided by R
FB1
. Based on
FB2
OUT
Rising
the component values shown in Figure 70, the ADP7102 has the
following characteristics:
• DC gain of 4.09 (12.2 dB)
• 3 dB roll off frequency of 59 Hz
• High frequency ac gain of 1.82 (5.19 dB)
• Noise reduction factor of 1.35 (2.59 dB)
• RMS noise of the adjustable LDO without noise reduction
of 27.8 µV rms
•RMS noise of the adjustable LDO with noise reduc-
tion (assuming 15 µV rms for fixed voltage option) of
20.25 µV rms
Falling
OUT
Rev. A | Page 20 of 28
Page 21
Data Sheet ADP7102
CURRENT LIMIT AND THERMAL OVERLOAD
PROTECTION
The ADP7102 is protected against damage due to excessive
power dissipation by current and thermal overload protection
circuits. The ADP7102 is designed to current limit when the
output load reaches 400 mA (typical). When the output load
exceeds 400 mA, the output voltage is reduced to maintain a
constant current limit.
Thermal overload protection is included, which limits the
junction temperature to a maximum of 150°C (typical). Under
extreme conditions (that is, high ambient temperature and/or
high power dissipation) when the junction temperature starts to
rise above 150°C, the output is turned off, reducing the output
current to zero. When the junction temperature drops below
135°C, the output is turned on again, and output current is
restored to its operating value.
Consider the case where a hard short from VOUT to ground
occurs. At first, the ADP7102 current limits, so that only 400 mA is
conducted into the short. If self heating of the junction is great
enough to cause its temperature to rise above 150°C, thermal
shutdown activates, turning off the output and reducing the
output current to zero. As the junction temperature cools and
drops below 135°C, the output turns on and conducts 400 mA
into the short, again causing the junction temperature to rise
above 150°C. This thermal oscillation between 135°C and
150°C causes a current oscillation between 400 mA and 0 mA
that continues as long as the short remains at the output.
Current and thermal limit protections are intended to protect
the device against accidental overload conditions. For reliable
operation, device power dissipation must be externally limited
so the junction temperature does not exceed 125°C.
THERMAL CONSIDERATIONS
In applications with low input-to-output voltage differential,
the ADP7102 does not dissipate much heat. However, in
applications with high ambient temperature and/or high
input voltage, the heat dissipated in the package may become
large enough that it causes the junction temperature of the
die to exceed the maximum junction temperature of 125°C.
When the junction temperature exceeds 150°C, the converter
enters thermal shutdown. It recovers only after the junction
temperature has decreased below 135°C to prevent any permanent
damage. Therefore, thermal analysis for the chosen application
is very important to guarantee reliable performance over all
conditions. The junction temperature of the die is the sum of
the ambient temperature of the environment and the temperature rise of the package due to the power dissipation, as shown
in Equation 2.
To guarantee reliable operation, the junction temperature
of the ADP7102 must not exceed 125°C. To ensure that the
junction temperature stays below this maximum value, the
user must be aware of the parameters that contribute to
junction temperature changes. These parameters include
ambient temperature, power dissipation in the power device,
and thermal resistances between the junction and ambient air
(θ
). The θJA number is dependent on the package assembly
JA
compounds that are used and the amount of copper used to
solder the package GND pins to the PCB.
Tabl e 6 shows typical θ
values of the 8-lead SOIC and 8-lead
JA
LFCSP packages for various PCB copper sizes. Tab l e 7 shows
the typical Ψ
The junction temperature of the ADP7102 is calculated from
the following equation:
T
= TA + (PD × θJA) (2)
J
where:
T
is the ambient temperature.
A
P
is the power dissipation in the die, given by
D
= [(VIN − V
P
D
OUT
) × I
] + (VIN × I
LOAD
) (3)
GND
where:
I
is the load current.
LOAD
I
is the ground current.
GND
V
and V
IN
are input and output voltages, respectively.
OUT
Power dissipation due to ground current is quite small and
can be ignored. Therefore, the junction temperature equation
simplifies to the following:
T
= TA + {[(VIN − V
J
OUT
) × I
] × θJA} (4)
LOAD
As shown in Equation 4, for a given ambient temperature,
input-to-output voltage differential, and continuous load
current, there exists a minimum copper size requirement for
the PCB to ensure that the junction temperature does not rise
above 125°C. Figure 71 to Figure 78 show junction temperature
calculations for different ambient temperatures, power dissipation, and areas of PCB copper.
In the case where the board temperature is known, use the
thermal characterization parameter, Ψ
junction temperature rise (see Figure 77 and Figure 78).
Maximum junction temperature (T
the board temperature (T
) and power dissipation (PD)
B
using the following formula:
T
= TB + (PD × ΨJB) (5)
J
The typical value of Ψ
is 15.1°C/W for the 8-lead LFCSP
JB
package and 31.3°C/W for the 8-lead SOIC package.
, to estimate the
JB
) is calculated from
J
Figure 78. SOIC
Figure 77. LFCSP
Rev. A | Page 23 of 28
Page 24
ADP7102 Data Sheet
09506-074
09506-075
PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS
Heat dissipation from the package can be improved by
increasing the amount of copper attached to the pins of the
ADP7102. However, as listed in Ta b l e 6, a point of diminishing
returns is eventually reached, beyond which an increase in the
copper size does not yield significant heat dissipation benefits.
Place the input capacitor as close as possible to the VIN and
GND pins. Place the output capacitor as close as possible to the
VOUT and GND pins. Use of 0805 or 0603 size capacitors and
resistors achieves the smallest possible footprint solution on
boards where area is limited.
Figure 80. Example SOIC PCB Layout
Figure 79. Example LFCSP PCB L ayout
Rev. A | Page 24 of 28
Page 25
Data Sheet ADP7102
112008-A
PIN 1
INDICATOR
(R 0.2)
EXPOSED
PAD
BOTTOM VIEW
TOP VIEW
1
4
8
5
INDEX
AREA
3.00
BSC SQ
SEATING
PLANE
0.80
0.75
0.70
0.30
0.25
0.18
0.05 MAX
0.02 NOM
0.80 MAX
0.55 NOM
0.20 REF
0.50 BSC
COPLANARITY
0.08
2.48
2.38
2.23
1.74
1.64
1.49
0.50
0.40
0.30
COMPLIANT
TO
JEDEC STANDARDS MO - 229- WEED-4
FOR PROPE R CONNECTIO N OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DE S CRIPTIO NS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MS-012-AA
06-03-2011-B
1.27
0.40
1.75
1.35
2.41
0.356
0.457
4.00
3.90
3.80
6.20
6.00
5.80
5.00
4.90
4.80
0.10 MAX
0.05 NOM
3.81 REF
0.25
0.17
8°
0°
0.50
0.25
45°
COPLANARITY
0.10
1.04 REF
8
1
4
5
1.27 BSC
SEATING
PLANE
FOR PROP E R CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CO NFIGURATI ON AND
FUNCTIO N DE S CRIPTIONS
SECTION OF THIS DATA SHEET.
BOTTOM VIEW
TOP VIEW
0.51
0.31
1.65
1.25
3.098
OUTLINE DIMENSIONS
Figure 81. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
Figure 82. 8-Lead Standard Small Outline Package, with Exposed Pad [SOIC_N_EP]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-8-5)
Dimensions shown in millimeters
Narrow Body
(RD-8-2)
Dimensions shown in millimeters
Rev. A | Page 25 of 28
Page 26
ADP7102 Data Sheet
Temperature
Output
Package
Package
ADP7102ARDZ-1.5-R7
−40°C to +125°C
1.5
SOIC_N_EP
RD-8-2
ORDERING GUIDE
Model1
Range
Voltage (V)
2, 3
Description
Option
Branding
ADP7102ACPZ-R7 −40°C to +125°C Adjustable LFCSP_WD CP-8-5 LHO
ADP7102ACPZ-1.5-R7 −40°C to +125°C 1.5 LFCSP_WD CP-8-5 LJV
ADP7102ACPZ-1.8-R7 −40°C to +125°C 1.8 LFCSP_WD CP-8-5 LJW
ADP7102ACPZ-2.5-R7 −40°C to +125°C 2.5 LFCSP_WD CP-8-5 LJZ
ADP7102ACPZ-3.0-R7 −40°C to +125°C 3.0 LFCSP_WD CP-8-5 LKO
ADP7102ACPZ-3.3-R7 −40°C to +125°C 3.3 LFCSP_WD CP-8-5 LK1
ADP7102ACPZ-5.0-R7 −40°C to +125°C 5 LFCSP_WD CP-8-5 LK2
ADP7102ACPZ-9.0-R7 −40°C to +125°C 9 LFCSP_WD CP-8-5 LLC
ADP7102ARDZ-R7 −40°C to +125°C Adjustable SOIC_N_EP RD-8-2
ADP7102ARDZ-1.8-R7 −40°C to +125°C 1.8 SOIC_N_EP RD-8-2
ADP7102ARDZ-2.5-R7 −40°C to +125°C 2.5 SOIC_N_EP RD-8-2
ADP7102ARDZ-3.0-R7 −40°C to +125°C 3.0 SOIC_N_EP RD-8-2
ADP7102ARDZ-3.3-R7 −40°C to +125°C 3.3 SOIC_N_EP RD-8-2
ADP7102ARDZ-5.0-R7 −40°C to +125°C 5 SOIC_N_EP RD-8-2
ADP7102ARDZ-9.0-R7 −40°C to +125°C 9 SOIC_N_EP RD-8-2
ADP7102CP-EVALZ 3.3 LFCSP Evaluation Board
ADP7102RD-EVALZ 3.3 SOIC Evaluation Board
ADP7102CPZ-REDYKIT LFCSP REDYKIT
ADP7102RDZ-REDYKIT SOIC REDYKIT
1
Z = RoHS Compliant Part.
2
For additional voltage options, contact a local Analog Devices, Inc., sales or distribution representative.
3
The ADP7102CP-EVALZ and ADP7102RD-EVALZ evaluation boards are preconfigured with a 3.3 V ADP7102.