Datasheet ADP3309 Datasheet (Analog Devices)

Page 1
anyCAP™ 100 mA
a
FEATURES 1.2% Accuracy Over Line and Load Regulations @ +25C Ultralow Dropout Voltage: 120 mV Typical @ 100 mA Requires Only C anyCAP = Stable with All Types of Capacitors
(Including MLCC) Current and Thermal Limiting Low Noise Low Shutdown Current: 1 ␮A
3.0 V to 12 V Supply Range –20C to +85C Ambient Temperature Range Several Fixed Voltage Options Ultrasmall SOT-23-5 Package Excellent Line and Load Regulations
APPLICATIONS Cellular Telephones Notebook, Palmtop Computers Battery Powered Systems PCMCIA Regulator Bar Code Scanners Camcorders, Cameras
= 0.47 F for Stability
O
Low Dropout Linear Regulator
ADP3309
FUNCTIONAL BLOCK DIAGRAM
ADP3309
CC
M
BANDGAP
R1
R2
REF
ERR/NC
SD
IN
THERMAL
PROTECTION
Q2
Q1
DRIVER G
GND
OUT
GENERAL DESCRIPTION
The ADP3309 is a member of the ADP330x family of precision low dropout anyCAP voltage regulators. It is pin-for-pin and functionally compatible with National’s LP2981, but offers performance advantages. The ADP3309 stands out from con­ventional LDOs with a novel architecture and an enhanced
process. Its patented design requires only a 0.47 µF output
capacitor for stability. This device is stable with any type of capacitor regardless of its ESR (Equivalent Series Resistance) value, including ceramic types for space restricted applications.
The ADP3309 achieves ±1.2% accuracy at room temperature and ±2.2% overall accuracy over temperature, line and load
regulations. The dropout voltage of the ADP3309 is only
anyCAP is a trademark of Analog Devices, Inc.
120 mV (typical) at 100 mA. This device also includes a current limit and a shutdown feature. In shutdown mode, the ground
current is reduced to ~1 µA.
The ADP3309 operates with a wide input voltage range from
3.0 V to 12 V and delivers a load current in excess of 100 mA. The ADP3309 anyCAP LDO offers a wide range of output voltages. For a 50 mA version, refer to the ADP3308 data sheet.
V
IN
0.47mF
ERR/NC
C1
+ –
ADP3309-3.3
IN
SD
OFF
OUT
ON
GND
V
= +3.3V
C2
0.47mF
OUT
+ –
Figure 1. Typical Application Circuit
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Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 1998
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ADP3309-xx–SPECIFICATIONS
(@TA = –20C to +85C, VIN = 7 V, CIN = 0.47 F, C otherwise noted.)1 The following specifications apply to all voltage options.
= 0.47 F, unless
OUT
Parameter Symbol Conditions Min Typ Max Units
OUTPUT VOLTAGE ACCURACY V
OUT
VIN = V I T V
OUTNOM
= 0.1 mA to 100 mA
L
= +25°C –1.2 +1.2 %
A
= V
IN
OUTNOM
+ 0.3 V to 12 V
+ 0.3 V to 12 V
IL = 0.1 mA to 100 mA –2.2 +2.2 %
VV
V
I
GND
O
IN
O
L
LINE REGULATION V
LOAD REGULATION I
GROUND CURRENT I
= V
IN
T
T
OUTNOM
= +25°C 0.02 mV/V
A
= 0.1 mA to 100 mA
L
= +25°C 0.06 mV/mA
A
+ 0.3 V to 12 V
IL = 100 mA 0.8 2.0 mA IL = 0.1 mA 0.19 0.3 mA
GROUND CURRENT IN DROPOUT I
GND
VIN = 2.4 V IL = 0.1 mA 0.9 1.7 mA
V
DROPOUT VOLTAGE V
DROP
= 98% of V
OUT
OUTNOM
IL = 100 mA 0.12 0.25 V
= 10 mA 0.025 0.07 V
I
L
IL = 1 mA 0.004 0.015 V
SHUTDOWN THRESHOLD V
THSD
ON 2.0 0.75 V OFF 0.75 0.3 V
SHUTDOWN PIN INPUT CURRENT I
GROUND CURRENT IN SHUTDOWN I
SDIN
Q
MODE T
OUTPUT CURRENT IN SHUTDOWN I
OSD
MODE T
ERROR PIN OUTPUT LEAKAGE I
EL
0 < V 5 < V
VSD = 0 V, VIN = 12 V
V T
T
V
5 V 1 µA
SD
12 V @ VIN = 12 V 9 µA
SD
= +25°C 0.005 1 µA
A
= 0 V, VIN = 12 V
SD
= +85°C 0.01 3 µA
A
= +25°C @ VIN = 12 V 2 µA
A
= +85°C @ VIN = 12 V 4 µA
A
= 5 V 13 µA
EO
ERROR PIN OUTPUT
“LOW” VOLTAGE V
PEAK LOAD CURRENT I
OUTPUT NOISE @ 5 V OUTPUT V
NOTES
1
Ambient temperature of +85°C corresponds to a junction temperature of 125°C under typical full load test conditions.
Specifications subject to change without notice.
EOL
LDPK
NOISE
I
= 400 µA 0.12 0.3 V
SINK
VIN = V
OUTNOM
+ 1 V, T
= +25°C 150 mA
A
f = 10 Hz–100 kHz 100 µV
rms
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Page 3
ADP3309
GND
TOP VIEW
(Not to Scale)
SD
OUT
ADP3309
IN
ERR/NC
NC = NO CONNECT
ABSOLUTE MAXIMUM RATINGS*
Input Supply Voltage . . . . . . . . . . . . . . . . . . . –0.3 V to +16 V
Shutdown Input Voltage . . . . . . . . . . . . . . . . –0.3 V to +16 V
Power Dissipation . . . . . . . . . . . . . . . . . . . . Internally Limited
Operating Ambient Temperature Range . . . –55°C to +125°C Operating Junction Temperature Range . . . –55°C to +125°C
␣ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190°C/W
θ
JA
θ
␣ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W
JC
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . .+300°C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . .+220°C
*This is a stress rating only; operation beyond these limits can cause the device to
be permanently damaged.
ORDERING GUIDE
Voltage Package Marking
Model Output Option* Code
ADP3309ART-2.7 2.7 V SOT-23 DNC ADP3309ART-2.85 2.85 V SOT-23 DVC ADP3309ART-2.9 2.9 V SOT-23 DWC ADP3309ART-3 3.0 V SOT-23 DPC ADP3309ART-3.3 3.3 V SOT-23 DRC ADP3309ART-3.6 3.6 V SOT-23 DSC
*SOT = Surface Mount. Contact the factory for the availability of other output voltage options.
PIN FUNCTION DESCRIPTIONS
Pin Name Function
1 IN Regulator Input. 2 GND Ground Pin. 3 SD Active Low Shutdown Pin. Connect to
ground to disable the regulator output. When shutdown is not used, this pin should be connected to the input pin.
4 ERR/NC Open Collector. Output that goes low
to indicate the output is about to go out of regulation. This pin can be left open. (NC = No Connect).
5 OUT Output of the Regulator, fixed 2.7, 2.85,
2.9, 3.0, 3.3 or 3.6 volts output voltage.
Bypass to ground with a 0.47 µF or larger
capacitor.
PIN CONFIGURATION
Other Member of anyCAP Family
Model Output Current Package Option
1
2
ADP3308 50 mA SOT-23-5 Lead
NOTES
1
See individual data sheet for detailed ordering information.
2
SOT = Surface Mount.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADP3309 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
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ADP3309
–Typical Performance Characteristics
3.302
3.301
3.300
3.299
3.298
3.297
OUTPUT VOLTAGE – Volts
3.296
3.295
3.3 4 145 6 7 8 9 10 11 12 13
IL = 0mA
IL = 10mA
IL = 50mA
IL = 100mA
INPUT VOLTAGE – Volts
V
OUT
= +3.3V
Figure 2. Line Regulation: Output Voltage vs. Supply Voltage
900
750
600
450
GROUND CURRENT – mA
300
IL = 0 TO 100mA
3.302 V
= +3.3V
3.301
3.300
3.299
3.298
3.297
OUTPUT VOLTAGE – Volts
3.296
3.295
20 30 40 50 60 70 80 90
0 10 100
OUTPUT LOAD – mA
OUT
= +7V
V
IN
Figure 3. Output Voltage vs. Load Current
0.2
0.1 IL = 0mA
0.0
–0.1
–0.2
OUTPUT VOLTAGE – %
–0.3
IL = 50mA
IL = 100mA
1150
900
650
400
GROUND CURRENT – mA
160
0
0 1.2 12.02.4 3.6 4.8 6.0 7.2 8.4 9.6 10.8
INPUT VOLTAGE – Volts
V
OUT
= 0mA
I
L
= +3.3V
Figure 4. Quiescent Current vs. Supply Voltage
1250
1000
GROUND CURRENT – mA
IL = 100mA
750
500
250
VIN = +7V
IL = 0mA
150
0 25 100
50 75
OUTPUT LOAD – mA
Figure 5. Quiescent Current vs. Load Current
120
96
72
48
24
INPUT-OUTPUT VOLTAGE – mV
0
0 25 10050 75
OUTPUT LOAD – mA
Figure 8. Dropout Voltage vs. Output Current
–0.4
–45 –25 135–5 15 35 75 95 11555
TEMPERATURE – 8C
Figure 6. Output Voltage Variation % vs. Temperature
5
4
3
2
1
INPUT/OUTPUT VOLTAGE – Volts
0
01 0
234321
INPUT VOLTAGE – Volts
V R
OUT
= 33V
L
= +3.3V
Figure 9. Power-Up/Power-Down
0 –25 –5 135
15 35 55 75 95 115
TEMPERATURE – 8C
Figure 7. Quiescent Current vs. Temperature
8.0
7.0
6.0
5.0
4.0
3.0
2.0
INPUT/OUTPUT VOLTAGE – Volts
1.0
0
0 20 200
40 60 80 100 120 140 160 180
V
TIME – ms
V
IN
OUT
VSD = V CL = 0.47mF R
L
V
OUT
= 33V
= +3.3V
IN
Figure 10. Power-Up Overshoot
–4–
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ADP3309
3.320
3.310
3.300
3.290
3.280
Volts
7.5
7.0
V
= +3.3V
OUT
RL = 33V
= 0.47mF
C
L
V
IN
0 40 400
80 120 160 200 240 280 320 360
TIME – ms
Figure 11. Line Transient Response
3.320 V
= +3.3V
OUT
= 4.7mF
C
3.310
L
3.300
VoltsmA
3.290
3.280
I
100
10
OUT
3.320
3.310
3.300
3.290
3.280
Volts
7.5
7.0
V
= +3.3V
OUT
V
IN
40 60 80 100 120 140 160 180
0 20 200
TIME – ms
Figure 12. Line Transient Response
300
200
mA
100
0
4
µ
Volts
2
0
V
= +3.3V
OUT
RL = 3.3kV C
= 0.47mF
L
I
OUT
V
OUT
3.320 V
= +3.3V
OUT
= 0.47mF
C
3.310
L
3.300
VoltsmA
3.290
3.280
I
100
10
0 100 500
OUT
200 300 400
TIME – ms
Figure 13. Load Transient
4
CL = 0.47mF
3
2
1
Volts
0 3
0
CL = 4.7mF
V R
OUT
= 33V
L
+3V
V
+3.3V
= +3.3V
V
OUT
SD
0 100 500
200 300 400
TIME – ms
Figure 14. Load Transient
4
+3.3V
3
2
1
Volts
0
3
0
010 50
20 30 40
TIME – ms
V
OUT
R
= 33V
L
C
= 0.47mF
L
V
SD
= +3.3V
Figure 17. Turn Off
01 5234
0.5 4.51.5 2.5 3.5 TIME – sec
Figure 15. Short Circuit Current
0
a. 0.47mF, RL = 33k
–10
b. 0.47mF, R c. 10mF, R
–20
d. 10mF, R
–30 –40 –50 –60
db
–70
RIPPLE REJECTION – dB
–80 –90
a
c
–100
10 100 10M1k 10k 1M
V
= 33
L
V
= 33k
L
V
= 33
L
FREQUENCY – Hz
V
a
100k
OUT
c
= +3.3V
b
d
V
Figure 18. Power Supply Ripple Rejection
0 20 10040 60 80
TIME – ms
Figure 16. Turn On
10
1
V
= +3.3V, CL = 0.47mF
OUT
= 1mA
I
L
0.1
0.01 100 1k 100k10k
VOLTAGE NOISE SPECTRAL DENSITY – mV Hz
FREQUENCY – Hz
Figure 19. Output Noise Density
–5–REV. 0
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ADP3309
THEORY OF OPERATION
The ADP3309 anyCAP LDO uses a single control loop for regulation and reference functions. The output voltage is sensed by a resistive voltage divider consisting of R1 and R2, which is varied to provide the available output voltage option. Feedback is taken from this network by way of a series diode (D1) and a second resistor divider (R3 and R4) to the input of an amplifier.
D1
R3
PTAT
CURRENT
OUTPUT
)
R1
R
LOAD
(a)
R2
C
LOAD
INPUT
Q1
NONINVERTING
WIDEBAND
DRIVER
COMPENSATION CAPACITOR
ADP3309
ATTENUATION (V
BANDGAP/VOUT
PTAT
V
G
OS
M
R4
GND
Figure 20.␣ Functional Block Diagram
A very high gain error amplifier is used to control this loop. The amplifier is constructed in such a way that at equilibrium it produces a large, temperature proportional input “offset volt­age” that is repeatable and very well controlled. The tem­perature proportional offset voltage is combined with the complementary diode voltage to form a “virtual bandgap” volt­age, implicit in the network, although it never appears explicitly in the circuit. Ultimately, this patented design makes it possible to control the loop with only one amplifier. This technique also improves the noise characteristics of the amplifier by providing more flexibility on the trade-off of noise sources that leads to a low noise design.
The R1, R2 divider is chosen in the same ratio as the bandgap voltage to the output voltage. Although the R1, R2 resistor divider is loaded by the diode D1, and a second divider consist­ing of R3 and R4, the values can be chosen to produce a tem­perature stable output.
The patented amplifier controls a new and unique noninverting driver that drives the pass transistor, Q1. The use of this special noninverting driver enables the frequency compensation to include the load capacitor in a pole splitting arrangement to achieve reduced sensitivity to the value, type and ESR of the load capacitance.
Most LDOs place very strict requirements on the range of ESR values for the output capacitor because they are difficult to stabilize due to the uncertainty of load capacitance and resis­tance. Moreover, the ESR value, required to keep conventional LDOs stable, changes depending on load and temperature. These ESR limitations make designing with LDOs more diffi­cult because of their unclear specifications and extreme varia­tions over temperature.
This is no longer true with the ADP3309 anyCAP LDO. It can be used with virtually any capacitor, with no constraint on the minimum ESR. This innovative design allows the circuit to be
stable with just a small 0.47 µF capacitor on the output. Addi-
tional advantages of the design scheme include superior line noise rejection and very high regulator gain which leads to ex-
cellent line and load regulation. An impressive ±2.2% accuracy
is guaranteed over line, load and temperature.
Additional features of the circuit include current limit and ther­mal shutdown. Compared to the standard solutions that give warning after the output has lost regulation, the ADP3309 provides improved system performance by enabling the ERR pin to give warning before the device loses regulation.
As the chip’s temperature rises above 165°C, the circuit acti-
vates a soft thermal shutdown, indicated by a signal low on the ERR pin, to reduce the current to a safe level.
APPLICATION INFORMATION Capacitor Selection: anyCAP
Output Capacitors: As with any micropower device, output transient response is a function of the output capacitance. The ADP3309 is stable with a wide range of capacitor values, types
and ESR (anyCAP). A capacitor as low as 0.47 µF is all that is
needed for stability. However, larger capacitors can be used if high output current surges are anticipated. The ADP3309 is
stable with extremely low ESR capacitors (ESR 0), such as
multilayer ceramic capacitors (MLCC) or OSCON.
Input Bypass Capacitor: An input bypass capacitor is not re­quired. However, for applications where the input source is high impedance or far from the input pin, a bypass capacitor is rec-
ommended. Connecting a 0.47 µF capacitor from the input pin
(Pin 1) to ground reduces the circuit’s sensitivity to PC board layout. If a bigger output capacitor is used, the input capacitor
must be 1 µF minimum.
Thermal Overload Protection
The ADP3309 is protected against damage due to excessive power dissipation by its thermal overload protection circuit,
which limits the die temperature to a maximum of 165°C.
Under extreme conditions (i.e., high ambient temperature and power dissipation) where die temperature starts to rise above
165°C, the output current is reduced until the die temperature
has dropped to a safe level. The output current is restored when the die temperature is reduced.
Current and thermal limit protections are intended to protect the device against accidental overload conditions. For normal operation, device power dissipation should be externally limited
so that junction temperatures will not exceed 125°C.
Calculating Junction Temperature
Device power dissipation is calculated as follows:
P
= (VIN – V
D
Where I and V
Assuming I
V
OUT
and I
LOAD
are input and output voltages respectively.
OUT
LOAD
are load current and ground current, V
GND
= 100 mA, I
= 3.3 V, device power dissipation is:
P
= (5.0 – 3.3) 100 mA + 5.0 × 2 mA = 180 mW
D
T = T
TA = P
J
) I
OUT
GND
× θJA = 0.18 × 190 = 34.2°C
D
+ (VIN) I
LOAD
GND
= 2 mA, VIN = 5.0 V and
IN
With a maximum junction temperature of 125°C, this yields a maximum ambient temperature of ~90°C.
Printed Circuit Board Layout Consideration
Surface mount components rely on the conductive traces or pads to transfer heat away from the device. Appropriate PC board layout techniques should be used to remove heat from the immediate vicinity of the package.
–6–
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Page 7
The following general guidelines will be helpful when designing
V
OUT
= 2.7V/3.3VVIN = 4V TO 12V
OUTPUT SELECT
4V 0V
ADP3309-2.7
OUTIN
SD
GND
ADP3309-3.3
+
+
IN
OUT
C1
1.0mF
C2
0.47mF
SD
GND
ADP3309-3.3
OUT
IN
SD
GND
+
V
IN
= 4V TO 8V
MJE253*
V
OUT
= 3.3V@1A
C1
47mF
C2 10mF
*AAVID531002 HEATSINK IS USED
ERR
R1
50V
a board layout:
1. PC board traces with larger cross section areas will remove more heat. For optimum results, use PC boards with thicker copper and or wider traces.
2. Increase the surface area exposed to open air so heat can be removed by convection or forced air flow.
3. Do not use solder mask or silk screen on the heat dissipating traces because it will increase the junction to ambient thermal resistance of the package.
Shutdown Mode
Applying a TTL high signal to the shutdown pin or tying it to the input pin will turn the output ON. Pulling the shutdown pin down to a TTL low signal or tying it to ground will turn the output OFF. In shutdown mode, quiescent current is reduced
to less than 1 µA.
Error Flag Dropout Detector
The ADP3309 will maintain its output voltage over a wide range of load, input voltage and temperature conditions. If the output is about to lose regulation, for example, by reducing the supply voltage below the combined regulated output and drop­out voltages, the ERR pin will be activated. The ERR output is an open collector that will be driven low.
Once set, the ERRor flag’s hysteresis will keep the output low until a small margin of operating range is restored either by raising the supply voltage or reducing the load.
ADP3309
Figure 21. Crossover Switch
Higher Output Current
The ADP3309 can source up to 100 mA without any heatsink or pass transistor. If higher current is needed, an appropriate pass transistor can be used, as in Figure 22, to increase the output current to 1 A.
APPLICATION CIRCUITS Crossover Switch
The circuit in Figure 21 shows that two ADP3309s can be used to form a mixed supply voltage system. The output switches between two different levels selected by an external digital input. Output voltages can be any combination of voltages from the Ordering Guide of the data sheet.
V
= 2.5V TO 3.5V
IN
C1 100mF 10V
R1 120V
V
I
IN
LIM
ADP3000-ADJ
SW2GND
L1
6.8mH
SW1
FB
D1
1N5817
Figure 23. Constant Dropout Post Regulator
Figure 22. Higher Output Current Linear Regulator␣
Constant Dropout Post Regulator
The circuit in Figure 23 provides high precision with low drop­out for any regulated output voltage. It significantly reduces the ripple from a switching regulator while providing a constant dropout voltage, which limits the power dissipation of the LDO to 30 mW. The ADP3000 used in this circuit is a switching regulator in the step-up configuration.
ADP3309-3.3
C2 100mF 10V
2N3906
Q1
R2
30.1kV 1%
R3 124kV 1%
IN OUT
SD
GND
Q2 2N3906
R4 274kV
+
3.3V@100mA
C3
2.2mF
–7–REV. 0
Page 8
ADP3309
0.0669 (1.70)
0.0590 (1.50)
0.0512 (1.30)
0.0354 (0.90)
0.0059 (0.15)
0.0019 (0.05)
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
5-Lead Surface Mount Package
(SOT-23)
0.1181 (3.00)
0.1102 (2.80)
4 5
0.1181 (3.00)
0.1024 (2.60)
0.0374 (0.95) BSC
0.0571 (1.45)
0.0374 (0.95)
SEATING PLANE
PIN 1
1 3
2
0.0748 (1.90) BSC
0.0197 (0.50)
0.0138 (0.35)
10°
C3250–2.5–7/98
0.0079 (0.20)
0.0031 (0.08)
0.0217 (0.55)
0.0138 (0.35)
–8–
PRINTED IN U.S.A.
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