FEATURES
ⴞ1.2% Accuracy Over Line and Load Regulations @ +25ⴗC
Ultralow Dropout Voltage: 120 mV Typical @ 100 mA
Requires Only C
anyCAP = Stable with All Types of Capacitors
(Including MLCC)
Current and Thermal Limiting
Low Noise
Low Shutdown Current: 1 A
3.0 V to 12 V Supply Range
–20ⴗC to +85ⴗC Ambient Temperature Range
Several Fixed Voltage Options
Ultrasmall SOT-23-5 Package
Excellent Line and Load Regulations
APPLICATIONS
Cellular Telephones
Notebook, Palmtop Computers
Battery Powered Systems
PCMCIA Regulator
Bar Code Scanners
Camcorders, Cameras
= 0.47 F for Stability
O
Low Dropout Linear Regulator
ADP3309
FUNCTIONAL BLOCK DIAGRAM
ADP3309
CC
M
BANDGAP
R1
R2
REF
ERR/NC
SD
IN
THERMAL
PROTECTION
Q2
Q1
DRIVERG
GND
OUT
GENERAL DESCRIPTION
The ADP3309 is a member of the ADP330x family of precision
low dropout anyCAP voltage regulators. It is pin-for-pin and
functionally compatible with National’s LP2981, but offers
performance advantages. The ADP3309 stands out from conventional LDOs with a novel architecture and an enhanced
process. Its patented design requires only a 0.47 µF output
capacitor for stability. This device is stable with any type of
capacitor regardless of its ESR (Equivalent Series Resistance)
value, including ceramic types for space restricted applications.
The ADP3309 achieves ±1.2% accuracy at room temperature
and ±2.2% overall accuracy over temperature, line and load
regulations. The dropout voltage of the ADP3309 is only
anyCAP is a trademark of Analog Devices, Inc.
120 mV (typical) at 100 mA. This device also includes a current
limit and a shutdown feature. In shutdown mode, the ground
current is reduced to ~1 µA.
The ADP3309 operates with a wide input voltage range from
3.0 V to 12 V and delivers a load current in excess of 100 mA.
The ADP3309 anyCAP LDO offers a wide range of output
voltages. For a 50 mA version, refer to the ADP3308 data sheet.
V
IN
0.47mF
ERR/NC
C1
+
–
ADP3309-3.3
IN
SD
OFF
OUT
ON
GND
V
= +3.3V
C2
0.47mF
OUT
+
–
Figure 1. Typical Application Circuit
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
*SOT = Surface Mount.
Contact the factory for the availability of other output voltage options.
PIN FUNCTION DESCRIPTIONS
Pin NameFunction
1INRegulator Input.
2GNDGround Pin.
3SDActive Low Shutdown Pin. Connect to
ground to disable the regulator output.
When shutdown is not used, this pin
should be connected to the input pin.
4ERR/NCOpen Collector. Output that goes low
to indicate the output is about to go
out of regulation. This pin can be left open.
(NC = No Connect).
5OUTOutput of the Regulator, fixed 2.7, 2.85,
2.9, 3.0, 3.3 or 3.6 volts output voltage.
Bypass to ground with a 0.47 µF or larger
capacitor.
PIN CONFIGURATION
Other Member of anyCAP Family
ModelOutput CurrentPackage Option
1
2
ADP330850 mASOT-23-5 Lead
NOTES
1
See individual data sheet for detailed ordering information.
2
SOT = Surface Mount.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADP3309 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–3–REV. 0
Page 4
ADP3309
–Typical Performance Characteristics
3.302
3.301
3.300
3.299
3.298
3.297
OUTPUT VOLTAGE – Volts
3.296
3.295
3.3 4145 6 7 8 9 10 11 12 13
IL = 0mA
IL = 10mA
IL = 50mA
IL = 100mA
INPUT VOLTAGE – Volts
V
OUT
= +3.3V
Figure 2. Line Regulation: Output
Voltage vs. Supply Voltage
900
750
600
450
GROUND CURRENT – mA
300
IL = 0 TO 100mA
3.302
V
= +3.3V
3.301
3.300
3.299
3.298
3.297
OUTPUT VOLTAGE – Volts
3.296
3.295
20 30 40 50 60 70 80 90
0 10100
OUTPUT LOAD – mA
OUT
= +7V
V
IN
Figure 3. Output Voltage vs. Load
Current
0.2
0.1
IL = 0mA
0.0
–0.1
–0.2
OUTPUT VOLTAGE – %
–0.3
IL = 50mA
IL = 100mA
1150
900
650
400
GROUND CURRENT – mA
160
0
0 1.212.02.4 3.6 4.8 6.0 7.2 8.4 9.6 10.8
INPUT VOLTAGE – Volts
V
OUT
= 0mA
I
L
= +3.3V
Figure 4. Quiescent Current vs.
Supply Voltage
1250
1000
GROUND CURRENT – mA
IL = 100mA
750
500
250
VIN = +7V
IL = 0mA
150
025100
5075
OUTPUT LOAD – mA
Figure 5. Quiescent Current vs. Load
Current
120
96
72
48
24
INPUT-OUTPUT VOLTAGE – mV
0
0251005075
OUTPUT LOAD – mA
Figure 8. Dropout Voltage vs. Output
Current
–0.4
–45 –25135–5 15 3575 95 11555
TEMPERATURE – 8C
Figure 6. Output Voltage Variation %
vs. Temperature
5
4
3
2
1
INPUT/OUTPUT VOLTAGE – Volts
0
010
234321
INPUT VOLTAGE – Volts
V
R
OUT
= 33V
L
= +3.3V
Figure 9. Power-Up/Power-Down
0
–25 –5135
15 35 55 75 95 115
TEMPERATURE – 8C
Figure 7. Quiescent Current vs.
Temperature
8.0
7.0
6.0
5.0
4.0
3.0
2.0
INPUT/OUTPUT VOLTAGE – Volts
1.0
0
0 20200
40 60 80 100 120 140 160 180
V
TIME – ms
V
IN
OUT
VSD = V
CL = 0.47mF
R
L
V
OUT
= 33V
= +3.3V
IN
Figure 10. Power-Up Overshoot
–4–
REV. 0
Page 5
ADP3309
3.320
3.310
3.300
3.290
3.280
Volts
7.5
7.0
V
= +3.3V
OUT
RL = 33V
= 0.47mF
C
L
V
IN
0 40400
80 120 160 200 240 280 320 360
TIME – ms
Figure 11. Line Transient Response
3.320
V
= +3.3V
OUT
= 4.7mF
C
3.310
L
3.300
VoltsmA
3.290
3.280
I
100
10
OUT
3.320
3.310
3.300
3.290
3.280
Volts
7.5
7.0
V
= +3.3V
OUT
V
IN
40 60 80 100 120 140 160 180
0 20200
TIME – ms
Figure 12. Line Transient Response
300
200
mA
100
0
4
µ
Volts
2
0
V
= +3.3V
OUT
RL = 3.3kV
C
= 0.47mF
L
I
OUT
V
OUT
3.320
V
= +3.3V
OUT
= 0.47mF
C
3.310
L
3.300
VoltsmA
3.290
3.280
I
100
10
0100500
OUT
200300400
TIME – ms
Figure 13. Load Transient
4
CL = 0.47mF
3
2
1
Volts
0
3
0
CL = 4.7mF
V
R
OUT
= 33V
L
+3V
V
+3.3V
= +3.3V
V
OUT
SD
0100500
200300400
TIME – ms
Figure 14. Load Transient
4
+3.3V
3
2
1
Volts
0
3
0
01050
203040
TIME – ms
V
OUT
R
= 33V
L
C
= 0.47mF
L
V
SD
= +3.3V
Figure 17. Turn Off
015234
0.54.51.52.53.5
TIME – sec
Figure 15. Short Circuit Current
0
a. 0.47mF, RL = 33k
–10
b. 0.47mF, R
c. 10mF, R
–20
d. 10mF, R
–30
–40
–50
–60
db
–70
RIPPLE REJECTION – dB
–80
–90
a
c
–100
1010010M1k10k1M
V
= 33
L
V
= 33k
L
V
= 33
L
FREQUENCY – Hz
V
a
100k
OUT
c
= +3.3V
b
d
V
Figure 18. Power Supply Ripple
Rejection
020100406080
TIME – ms
Figure 16. Turn On
10
1
V
= +3.3V, CL = 0.47mF
OUT
= 1mA
I
L
0.1
0.01
1001k100k10k
VOLTAGE NOISE SPECTRAL DENSITY – mV Hz
FREQUENCY – Hz
Figure 19. Output Noise Density
–5–REV. 0
Page 6
ADP3309
THEORY OF OPERATION
The ADP3309 anyCAP LDO uses a single control loop for
regulation and reference functions. The output voltage is sensed
by a resistive voltage divider consisting of R1 and R2, which is
varied to provide the available output voltage option. Feedback
is taken from this network by way of a series diode (D1) and a
second resistor divider (R3 and R4) to the input of an amplifier.
D1
R3
PTAT
CURRENT
OUTPUT
)
R1
R
LOAD
(a)
R2
C
LOAD
INPUT
Q1
NONINVERTING
WIDEBAND
DRIVER
COMPENSATION
CAPACITOR
ADP3309
ATTENUATION
(V
BANDGAP/VOUT
PTAT
V
G
OS
M
R4
GND
Figure 20.␣ Functional Block Diagram
A very high gain error amplifier is used to control this loop. The
amplifier is constructed in such a way that at equilibrium it
produces a large, temperature proportional input “offset voltage” that is repeatable and very well controlled. The temperature proportional offset voltage is combined with the
complementary diode voltage to form a “virtual bandgap” voltage, implicit in the network, although it never appears explicitly
in the circuit. Ultimately, this patented design makes it possible
to control the loop with only one amplifier. This technique also
improves the noise characteristics of the amplifier by providing
more flexibility on the trade-off of noise sources that leads to a
low noise design.
The R1, R2 divider is chosen in the same ratio as the bandgap
voltage to the output voltage. Although the R1, R2 resistor
divider is loaded by the diode D1, and a second divider consisting of R3 and R4, the values can be chosen to produce a temperature stable output.
The patented amplifier controls a new and unique noninverting
driver that drives the pass transistor, Q1. The use of this special
noninverting driver enables the frequency compensation to
include the load capacitor in a pole splitting arrangement to
achieve reduced sensitivity to the value, type and ESR of the
load capacitance.
Most LDOs place very strict requirements on the range of ESR
values for the output capacitor because they are difficult to
stabilize due to the uncertainty of load capacitance and resistance. Moreover, the ESR value, required to keep conventional
LDOs stable, changes depending on load and temperature.
These ESR limitations make designing with LDOs more difficult because of their unclear specifications and extreme variations over temperature.
This is no longer true with the ADP3309 anyCAP LDO. It can
be used with virtually any capacitor, with no constraint on the
minimum ESR. This innovative design allows the circuit to be
stable with just a small 0.47 µF capacitor on the output. Addi-
tional advantages of the design scheme include superior line
noise rejection and very high regulator gain which leads to ex-
cellent line and load regulation. An impressive ±2.2% accuracy
is guaranteed over line, load and temperature.
Additional features of the circuit include current limit and thermal shutdown. Compared to the standard solutions that give
warning after the output has lost regulation, the ADP3309
provides improved system performance by enabling the ERR
pin to give warning before the device loses regulation.
As the chip’s temperature rises above 165°C, the circuit acti-
vates a soft thermal shutdown, indicated by a signal low on the
ERR pin, to reduce the current to a safe level.
APPLICATION INFORMATION
Capacitor Selection: anyCAP
Output Capacitors: As with any micropower device, output
transient response is a function of the output capacitance. The
ADP3309 is stable with a wide range of capacitor values, types
and ESR (anyCAP). A capacitor as low as 0.47 µF is all that is
needed for stability. However, larger capacitors can be used if
high output current surges are anticipated. The ADP3309 is
stable with extremely low ESR capacitors (ESR ≈ 0), such as
multilayer ceramic capacitors (MLCC) or OSCON.
Input Bypass Capacitor: An input bypass capacitor is not required. However, for applications where the input source is high
impedance or far from the input pin, a bypass capacitor is rec-
ommended. Connecting a 0.47 µF capacitor from the input pin
(Pin 1) to ground reduces the circuit’s sensitivity to PC board
layout. If a bigger output capacitor is used, the input capacitor
must be 1 µF minimum.
Thermal Overload Protection
The ADP3309 is protected against damage due to excessive
power dissipation by its thermal overload protection circuit,
which limits the die temperature to a maximum of 165°C.
Under extreme conditions (i.e., high ambient temperature and
power dissipation) where die temperature starts to rise above
165°C, the output current is reduced until the die temperature
has dropped to a safe level. The output current is restored when
the die temperature is reduced.
Current and thermal limit protections are intended to protect
the device against accidental overload conditions. For normal
operation, device power dissipation should be externally limited
so that junction temperatures will not exceed 125°C.
Calculating Junction Temperature
Device power dissipation is calculated as follows:
P
= (VIN – V
D
Where I
and V
Assuming I
V
OUT
and I
LOAD
are input and output voltages respectively.
OUT
LOAD
are load current and ground current, V
GND
= 100 mA, I
= 3.3 V, device power dissipation is:
P
= (5.0 – 3.3) 100 mA + 5.0 × 2 mA = 180 mW
D
∆T = T
– TA = P
J
) I
OUT
GND
×θJA = 0.18 × 190 = 34.2°C
D
+ (VIN) I
LOAD
GND
= 2 mA, VIN = 5.0 V and
IN
With a maximum junction temperature of 125°C, this yields a
maximum ambient temperature of ~90°C.
Printed Circuit Board Layout Consideration
Surface mount components rely on the conductive traces or
pads to transfer heat away from the device. Appropriate PC
board layout techniques should be used to remove heat from the
immediate vicinity of the package.
–6–
REV. 0
Page 7
The following general guidelines will be helpful when designing
V
OUT
= 2.7V/3.3VVIN = 4V TO 12V
OUTPUT SELECT
4V
0V
ADP3309-2.7
OUTIN
SD
GND
ADP3309-3.3
+
+
IN
OUT
C1
1.0mF
C2
0.47mF
SD
GND
ADP3309-3.3
OUT
IN
SD
GND
+
V
IN
= 4V TO 8V
MJE253*
V
OUT
= 3.3V@1A
C1
47mF
C2
10mF
*AAVID531002 HEATSINK IS USED
ERR
R1
50V
a board layout:
1. PC board traces with larger cross section areas will remove
more heat. For optimum results, use PC boards with thicker
copper and or wider traces.
2. Increase the surface area exposed to open air so heat can be
removed by convection or forced air flow.
3. Do not use solder mask or silk screen on the heat dissipating
traces because it will increase the junction to ambient
thermal resistance of the package.
Shutdown Mode
Applying a TTL high signal to the shutdown pin or tying it to
the input pin will turn the output ON. Pulling the shutdown pin
down to a TTL low signal or tying it to ground will turn the
output OFF. In shutdown mode, quiescent current is reduced
to less than 1 µA.
Error Flag Dropout Detector
The ADP3309 will maintain its output voltage over a wide
range of load, input voltage and temperature conditions. If the
output is about to lose regulation, for example, by reducing the
supply voltage below the combined regulated output and dropout voltages, the ERR pin will be activated. The ERR output is
an open collector that will be driven low.
Once set, the ERRor flag’s hysteresis will keep the output low
until a small margin of operating range is restored either by
raising the supply voltage or reducing the load.
ADP3309
Figure 21. Crossover Switch
Higher Output Current
The ADP3309 can source up to 100 mA without any heatsink
or pass transistor. If higher current is needed, an appropriate
pass transistor can be used, as in Figure 22, to increase the
output current to 1 A.
APPLICATION CIRCUITS
Crossover Switch
The circuit in Figure 21 shows that two ADP3309s can be used
to form a mixed supply voltage system. The output switches
between two different levels selected by an external digital input.
Output voltages can be any combination of voltages from the
Ordering Guide of the data sheet.
V
= 2.5V TO 3.5V
IN
C1
100mF
10V
R1
120V
V
I
IN
LIM
ADP3000-ADJ
SW2GND
L1
6.8mH
SW1
FB
D1
1N5817
Figure 23. Constant Dropout Post Regulator
Figure 22. Higher Output Current Linear Regulator␣
Constant Dropout Post Regulator
The circuit in Figure 23 provides high precision with low dropout for any regulated output voltage. It significantly reduces the
ripple from a switching regulator while providing a constant
dropout voltage, which limits the power dissipation of the LDO
to 30 mW. The ADP3000 used in this circuit is a switching
regulator in the step-up configuration.
ADP3309-3.3
C2
100mF
10V
2N3906
Q1
R2
30.1kV
1%
R3
124kV
1%
INOUT
SD
GND
Q2
2N3906
R4
274kV
+
3.3V@100mA
C3
2.2mF
–7–REV. 0
Page 8
ADP3309
0.0669 (1.70)
0.0590 (1.50)
0.0512 (1.30)
0.0354 (0.90)
0.0059 (0.15)
0.0019 (0.05)
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
5-Lead Surface Mount Package
(SOT-23)
0.1181 (3.00)
0.1102 (2.80)
4 5
0.1181 (3.00)
0.1024 (2.60)
0.0374 (0.95) BSC
0.0571 (1.45)
0.0374 (0.95)
SEATING
PLANE
PIN 1
1 3
2
0.0748 (1.90)
BSC
0.0197 (0.50)
0.0138 (0.35)
10°
0°
C3250–2.5–7/98
0.0079 (0.20)
0.0031 (0.08)
0.0217 (0.55)
0.0138 (0.35)
–8–
PRINTED IN U.S.A.
REV. 0
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