Datasheet ADP222, ADP223, ADP224, ADP225 Datasheet (ANALOG DEVICES)

High PSRR Voltage Regulators

ADP222/ADP223/ADP224/ADP225

Rev. B

Trademarks and registered trademarks are the property of their respective owners.

Fax: [phone] ©2011 Analog Devices, Inc. All rights reserved.

EN1

VOUT1

VIN

EN2

GND

6

4

3

2

ADJ2 VOUT2

1

8

5

7

ADJ1

ADP223/

ADP225

R1

R4

R2

ON

OFF

ON

OFF

V

IN

= 4.2V

+

C1
1µF

+

C3
1µF

+

C2
1µF

VOUT1 = 2. 8V

VOUT2 = 2. 0V

09376-001

R3

EN1

VOUT1

VIN

EN2

GND

6

4

3

2

SENSE2 VOUT2

1 8

5

7

SENSE1

ADP222/

ADP224

ON

OFF

ON

OFF

V

IN

= 4.2V

+

C1
1µF

+

C3
1µF

+

C2
1µF

VOUT2 = 3.3V

VOUT1 = 1.5V

09376-101

Data Sheet

FEATURES

Input voltage range: 2.5 V to 5.5 V
Small, 8-lead, 2 mm × 2 mm LFCSP package
Initial accuracy: ±1%
High PSRR: 70 dB at 10 kHz, 60 dB at 100 kHz, 40 dB at 1 MHz
Low noise: 27 µV rms at V
Excellent transient response
Low dropout voltage: 170 mV at 300 mA load
65 µA typical ground current at no load, both LDOs enabled
Fixed output voltage from 0.8 V to 3.3 V (ADP222/ADP224)
Adjustable output voltage range from 0.5 V to 5.0 V

(ADP223/ADP225)
Quick output discharge (QOD)—ADP224/ADP225
Overcurrent and thermal protection

APPLICATIONS

Portable and battery-powered equipment
Portable medical devices
Post dc-to-dc regulation
Point of sale terminals
Credit card readers
Automatic meter readers
Wireless network equipment

= 1.2 V, 50 µV rms at V

OUT

= 2.8 V

OUT

Dual, 300 mA Output, Low Noise,

TYPICAL APPLICATION CIRCUITS

Figure 1. ADP223/ADP225

GENERAL DESCRIPTION

The 300 mA, adjustable dual output ADP223/ADP225 and
fixed dual output ADP222/ADP224 combine high PSRR, low
noise, low quiescent current, and low dropout voltage in a
voltage regulator that is ideally suited for wireless applications
with demanding performance and board space requirements.

The ADP222/ADP224 are available with fixed outputs voltages
from 0.8V to 3.3V. The adjustable output ADP223/ADP225 may
be set to output voltages from 0.5 V to 5.0 V. The low quiescent
current, low dropout voltage, and wide input voltage range of
the ADP222/ADP223/ADP224/ADP225 extend the battery life
of portable devices.

The ADP222/ADP223/ADP224/ADP225 maintain power
supply rejection greater than 60 dB for frequencies as high as

Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

Figure 2. ADP222/ADP224

100 kHz while operating with a low headroom voltage. The

ADP222/ADP223/ADP224/ADP225 offer much lower noise

performance than competing LDOs without the need for a
noise bypass capacitor. Overcurrent and thermal protection
circuitry prevent damage in adverse conditions.

The ADP224 and ADP225 are identical to the ADP222 and

ADP223, respectively, but with the addition of a quick output

discharge (QOD) feature.

The ADP222/ADP223/ADP224/ADP225 are available in a
small 8-lead, 2 mm × 2 mm LFCSP package and are stable with
tiny 1 µF, ±30% ceramic output capacitors, resulting in the smallest
possible board area for a wide variety of portable power needs.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: [phone]

www.analog.com

ADP222/ADP223/ADP224/ADP225 Data Sheet

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications ....................................................................................... 1

Typical Application Circuits ............................................................ 1

General Description ......................................................................... 1

Revision History ............................................................................... 2

Specifications ..................................................................................... 3

Input and Output Capacitor, Recommended Specifications .. 4

Absolute Maximum Ratings ............................................................ 5

Thermal Data ................................................................................ 5

Thermal Resistance ...................................................................... 5

ESD Caution .................................................................................. 5

Pin Configuration and Function Descriptions ............................. 6

REVISION HISTORY

8/11—Rev. A to Rev. B

Changes to Features and General Descriptions Sections ............ 1

Added Figure 64; Renumbered Sequentially .............................. 17

Changes to Theory of Operation Section .................................... 17

Changes to Output Capacitor Section ......................................... 18

Changes to Paralleling Outputs to Increase Output

Current Section ............................................................................... 19

Updated Outline Dimensions ....................................................... 23

Typical Performance Characteristics ..............................................7

Theory of Operation ...................................................................... 17

Applications Information .............................................................. 18

Capacitor Selection .................................................................... 18

Enable Feature ............................................................................ 19

Paralleling Outputs to Increase Output Current .................... 19

Quick Output Discharge (QOD) Function ............................ 19

Current Limit and Thermal Overload Protection ................. 20

Thermal Considerations ............................................................ 20

Printed Circuit Board Layout Considerations........................ 22

Outline Dimensions ....................................................................... 23

Ordering Guide .......................................................................... 23

7/11—Rev. 0 to Rev. A

Added ADP222, ADP224, and ADP225 ......................... Universal

Changes to Features Section, Applications Section,

General Description Section, and Figure 2 .................................... 1

Changes to Table 1 ............................................................................. 3

Added Figure 4; Renumbered Sequentially ................................... 6

Changes t o Table 5 ............................................................................. 6

Changes to Typical Performance Characteristics Section ........... 7

Changes to Theory of Operation Section and Figure 62 .......... 17

Added Figure 63 ............................................................................. 17

Added Quick Output Discharge (QOD) Function Section

Added Figure 70 ............................................................................. 20

2/11—Revision 0: Initial Version

Rev. B | Page 2 of 24

Data Sheet ADP222/ADP223/ADP224/ADP225

INPUT VOLTAGE RANGE

VIN

TJ = −40°C to +125°C

2.5 5.5

V

V

= 0.8 V

100 µs

EN Input Leakage Current

V

EN1 = EN2 = VIN or GND

0.1 µA

UNDERVOLTAGE LOCKOUT

UVLO

Input Voltage Rising

UVLO

2.45

V

SPECIFICATIONS

VIN = (V
unless otherwise noted.

Table 1.

Parameter Symbol Test Conditions/Comments Min Typ Max Unit

+ 0.5 V) or 2.5 V (whichever is greater), EN1 = EN2 = VIN, I

OUT

OUT1

= I

= 10 mA, CIN = C

OUT2

OUT1

= C

= 1 µF, TA = 25°C,

OUT2

OPERATING SUPPLY CURRENT

I

I

GND

= 0 µA 65 µA

OUT

WITH BOTH REGULATORS ON

I
I
I
I
I
SHUTDOWN CURRENT I
OUTPUT VOLTAGE ACCURACY1 V

EN1 = EN2 = GND 0.2 2 µA

GND-SD

TJ = −40°C to +125°C

OUT

I
0 µA < I
ADJUSTABLE-OUTPUT VOLTAGE

ACCURACY

1

TJ = −40°C to +125°C

V

ADJ

I
0 µA < I
LINE REGULATION ΔV

/ΔVIN VIN = (V

OUT

VIN = (V
LOAD REGULATION2 ΔV

OUT

/ΔI

OUT

I
DROPOUT VOLTAGE3 V

DROPOUT

I
I
I
SENSE INPUT BIAS CURRENT SENSE
ADJx INPUT BIAS CURRENT ADJ
START-UP TIME4 t

CURRENT-LIMIT THRESHOLD5 I

I-BIAS

2.5 V ≤ VIN ≤ 5.5 V, ADJx connected to VOUTx 10 nA

I-BIAS

V

STA RT-UP

340 400 mA

LIMIT

= 0 µA, TJ = −40°C to +125°C 150 µA

OUT

= 10 mA 100 µA

OUT

= 10 mA, TJ = −40°C to +125°C 200 µA

OUT

= 300 mA 300 µA

OUT

= 300 mA, TJ = −40°C to +125°C 450 µA

OUT

= 10 mA −1 +1 %

OUT

< 300 mA, VIN = (V

OUT

= 10 mA 0.495 0.500 0.505 V

OUT

< 300 mA, VIN = (V

OUT

+ 0.5 V) to 5.5 V 0.01 %/V

OUT

+ 0.5 V ) to 5.5 V, TJ = −40°C to +125°C −0.05 +0.05 %/V

OUT

I

= 1 mA to 300 mA 0.001 %/mA

OUT

= 1 mA to 300 mA, TJ = −40°C to +125°C 0.002 %/mA

OUT

V

= 3.3 V

OUT

I

= 10 mA 6 mV

OUT

= 10 mA, TJ = −40°C to +125°C 9 mV

OUT

= 300 mA 170 mV

OUT

= 300 mA, TJ = −40°C to +125°C A 260 mV

OUT

+ 0.5 V) to 5.5 V −2 +2 %

OUT

+ 0.5 V) to 5.5 V 0.490 0.510 V

OUT

2.5 V ≤ VIN ≤ 5.5 V, SENSEx connected to VOUTx 10 nA

= 3.3 V 240 µs

OUT

OUT

THERMAL SHUTDOWN

Thermal Shutdown Threshold TSSD TJ rising 155 °C

Thermal Shutdown Hysteresis TS

15 °C

SD-HYS

EN INPUT

EN Input Logic High VIH 2.5 V ≤ VIN ≤ 5.5 V 1.2 V

EN Input Logic Low VIL 2.5 V ≤ VIN ≤ 5.5 V 0.4 V

I-LEAKAGE

EN1 = EN2 = VIN or GND, TJ = −40°C to +125°C 1 µA

Input Voltage Falling UVLO

Hysteresis UVLO

OUTPUT DISCHARGE TIME t
OUTPUT DISCHARGE RESISTANCE R

RISE

2.2 V

FAL L

HYS

V

DIS

140 Ω

QOD

= 2.8 V 1000 µs

OUT

Rev. B | Page 3 of 24

120

mV

ADP222/ADP223/ADP224/ADP225 Data Sheet

10 kHz

68 dB

Parameter Symbol Test Conditions/Comments Min Typ Max Unit

OUTPUT NOISE OUT
10 Hz to 100 kHz, VIN = 5 V, V
10 Hz to 100 kHz, VIN = 3.6 V, V

10 Hz to 100 kHz, VIN = 3.6 V, V
POWER SUPPLY REJECTION RATIO PSRR VIN = 2.5 V, V
100 Hz 76 dB

1 kHz 76 dB

10 kHz 70 dB

100 kHz 60 dB

1 MHz 40 dB

VIN = 3.8 V, V

100 Hz 68 dB

1 kHz 68 dB

100 kHz 60 dB

1 MHz 40 dB

1

Accuracy when VOUTx is connected directly to ADJx or SENSEx. When the VOUTx voltage is set by external feedback resistors, the absolute accuracy in adjust mode

depends on the tolerances of resistors used.

2

Based on an end-point calculation using 1 mA and 300 mA loads.

3

Dropout voltage is defined as the input-to-output voltage differential when the input voltage is set to the nominal output voltage. This applies only for output

voltages above 2.5 V.

4

Start-up time is defined as the time between the rising edge of EN to V

5

Current-limit threshold is defined as the current at which the output voltage drops to 90% of the specified typical value. For example, the current limit for a 3.0 V

output voltage is defined as the current that causes the output voltage to drop to 90% of 3.0 V or 2.7 V.

10 Hz to 100 kHz, VIN = 5 V, V

NOISE

= 0.8 V, I

OUT

= 2.8 V, I

OUT

being at 90% of its nominal value.

OUT

= 3.3 V 56 µV rms

OUT

= 2.8 V 50 µV rms

OUT

= 2.5 V 45 µV rms

OUT

= 1.2 V 27 µV rms

OUT

= 100 mA

OUT

= 100 mA

OUT

INPUT AND OUTPUT CAPACITOR, RECOMMENDED SPECIFICATIONS

The minimum input and output capacitance should be greater than 0.70 µF over the full range of the operating conditions. The full range of the
operating conditions in the application must be considered during device selection to ensure that the minimum capacitance specification
is met. X7R and X5R type capacitors are recommended for use with the LDOs, but Y5V and Z5U capacitors are not recommended for use
with the LDOs.

Table 2.

Parameter Symbol Conditions Min Typ Max Unit

MINIMUM INPUT AND OUTPUT CAPACITANCE C
CAPACITOR ESR R

TA = −40°C to +125°C 0.70 µF

MIN

TA = −40°C to +125°C 0.001 1 Ω

ESR

Rev. B | Page 4 of 24

Data Sheet ADP222/ADP223/ADP224/ADP225

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter Rating

VIN to GND −0.3 V to +6 V
ADJ1, ADJ2, VOUT1, VOUT2 to GND −0.3 V to VIN
EN1, EN2 to GND −0.3 V to +6 V
Storage Temperature Range −65°C to +150°C
Operating Junction Temperature Range −40°C to +125°C
Soldering Conditions JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in
combination.

The ADP222/ADP223/ADP224/ADP225 can be damaged when
the junction temperature limits are exceeded. Monitoring
ambient temperature does not guarantee that T
specified temperature limits. In applications with high power
dissipation and poor thermal resistance, the maximum ambient
temperature may have to be derated. In applications with
moderate power dissipation and low PCB thermal resistance, the
maximum ambient temperature can exceed the maximum limit as
long as the junction temperature is within specification limits.
The junction temperature (T
ambient temperature (T
(P

), and the junction-to-ambient thermal resistance of the

D

package (θ

). Maximum junction temperature (TJ) is calculated

JA

from the ambient temperature (T

) of the device is dependent on the

J

), the power dissipation of the device

A

) and power dissipation (PD)

A

using the formula

T

= TA + (PD × θJA)

J

is within the

J

Junction-to-ambient thermal resistance (θ
based on modeling and calculation using a 4-layer board. θ
is highly dependent on the application and board layout. In
applications where high maximum power dissipation exists,
close attention to thermal board design is required. The value
of θ

may vary, depending on PCB material, layout, and

JA

environmental conditions. The specified value of θ
on a 4-layer, 4 in × 3 in, 2½ oz copper board, as per JEDEC
standards. For more information, see the AN-772 Application
Note, A Design and Manufacturing Guide for the Lead Frame
Chip Scale Package (LFCSP).

Ψ

is the junction-to-board thermal characterization parameter

JB

with units of °C /W. Ψ

of the package is based on modeling and

JB

calculation using a 4-layer board. The JESD51-12, Guidelines for
Reporting and Using Package Thermal Information, states that
thermal characterization parameters are not the same as thermal
resistances. Ψ

measures the component power flowing

JB

through multiple thermal paths rather than a single path as in
thermal resistance, θ

. Therefore, ΨJB thermal paths include

JB

convection from the top of the package as well as radiation from
the package, factors that make Ψ

more useful in real-world

JB

applications. Maximum junction temperature (T
from the board temperature (T

) and power dissipation (PD)

B

using the formula

T

= TB + (PD × ΨJB)

J

Refer to JESD51-8 and JESD51-12 for more detailed
information about Ψ

.

JB

THERMAL RESISTANCE

θJA and ΨJB are specified for the worst-case conditions, that is, a
device soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type θJA θJC ΨJB Unit

8-Lead 2 mm × 2 mm LFCSP 50.2 31.7 18.2 °C/W

ESD CAUTION

) of the package is

JA

is based

JA

) is calculated

J

JA

Rev. B | Page 5 of 24

ADP222/ADP223/ADP224/ADP225 Data Sheet

EN1

VOUT1

VIN

EN2

GND

6

4

3

2

SENSE2 VOUT2

1

8

5

7

SENSE1

NOTES

1. CONNECT EXPOSED PAD TO GND.

09376-102

ADP222/

ADP224

EN1

VOUT1

VIN

EN2

ADP223/

ADP225

GND

6

4

3

2

ADJ2 VOUT2

1 8

5

7

ADJ1

NOTES

1. CONNECT EXPOSED PAD TO GND.

09376-002

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

Figure 3. ADP222/ADP224 Pin Configuration

Figure 4. ADP223/ADP225 Pin Configuration

Table 5. Pin Function Descriptions

Pin No.

ADP222/ADP224 ADP223/ADP225 Mnemonic Description

1 1 EN1 Enable Input for the Second Regulator. Drive EN1 high to turn on Regulator 1 and

drive EN1 low to turn off Regulator 1. For automatic startup, connect EN1 to VIN.

2 2 EN2 Enable Input for the First Regulator. Drive EN2 high to turn on Regulator 2 and drive

EN2 low to turn off Regulator 2. For automatic startup, connect EN2 to VIN.
3 3 GND Ground Pin.
N/A1 4 ADJ2 Adjust Pin for VOUT2. A resistor divider from VOUT2 to ADJ2 sets the output

voltage.
4 N/A1 SENSE2 Sense Pin for VOUT2.
5 5 VOUT2 Regulated Output Voltage. Connect an 1 µF or greater output capacitor between

VOUT2 and GND.
6 6 VIN Regulator Input Supply. Bypass VIN to GND with a 1 µF or greater capacitor.
7 7 VOUT1 Regulated Output Voltage. Connect 1 µF or greater output capacitor between

VOUT1 and GND.
N/A1 8 ADJ1 Adjust Pin for VOUT1. A resistor divider from VOUT1 to ADJ1 sets the output

voltage.
8 N/A1 SENSE1 Sense Pin for VOUT1.
EPAD The exposed paddle must be connected to ground.

1

N/A means not applicable.

Rev. B | Page 6 of 24

Data Sheet ADP222/ADP223/ADP224/ADP225

3.20

3.22

3.24

3.26

3.28

3.30

3.32

3.34

3.36

3.38

3.40

–40 –5 25 85 125

V

OUT

(V)

JUNCTION T E M P E R ATURE (° C)

LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA

09376-105

2.75

2.76

2.77

2.78

2.79

2.80

2.81

2.82

2.83

2.84

2.85

–40 –5 25 85 125

V

OUT

(V)

JUNCTION T E M P E R ATURE (° C)

09376-106

LOAD = 10µA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA

1.780

1.785

1.790

1.795

1.800

1.805

1.810

1.815

1.820

–40 –5 25 85 125

V

OUT

(V)

JUNCTION T E M P E R ATURE (°C)

LOAD = 10µA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA

09376-107

1.180

1.185

1.190

1.195

1.200

1.205

1.210

1.215

1.220

–40 –5 25 85 125

JUNCTION T E M P E R ATURE (°C)

LOAD = 10µA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA

09376-108

V

OUT

(V)

3.20

3.22

3.24

3.26

3.28

3.30

3.32

3.34

3.36

3.38

3.40

0.01 0.1 1 10 100 1000

V

OUT

(V)

I

LOAD

(mA)

09376-109

2.75

2.76

2.77

2.78

2.79

2.80

2.81

2.82

2.83

2.84

2.85

0.01 0.1 1 10 100 1000

I

LOAD

(mA)

09376-110

V

OUT

(V)

TYPICAL PERFORMANCE CHARACTERISTICS

VIN = 5 V, V

= 3.3 V, V

OUT1

= 2.8 V, I

OUT2

OUT1

= I

= 1 mA, CIN = C

OUT2

= 1 µF, TA = 25°C, unless otherwise noted.

OUT

Figure 5. Output Voltage vs. Junction Temperature, V

ADP222/ADP224

Figure 6. Output Voltage vs. Junction Temperature, V

ADP222/ADP224

OUTx

OUTx

= 3.3 V,

= 2.8 V,

Figure 8. Output Voltage vs. Junction Temperature, V

ADP222/ADP224

Figure 9. Output Voltage vs. Load Current, V

OUTx

= 1.2 V,

OUTx

= 3.3 V, ADP222/ADP224

Figure 7. Output Voltage vs. Junction Temperature, V

ADP222/ADP224

= 1.8 V,

OUTx

Figure 10. Output Voltage vs. Load Current, V

= 2.8 V, ADP222/ADP224

OUTx

Rev. B | Page 7 of 24

ADP222/ADP223/ADP224/ADP225 Data Sheet

1.780

1.785

1.790

1.795

1.800

1.805

1.810

1.815

1.820

0.01 0.1 1 10 100 1000

I

LOAD

(mA)

09376-111

V

OUT

(V)

1.180

1.185

1.190

1.195

1.200

1.205

1.210

1.215

1.220

0.01 0.1 1 10 100 1000

I

LOAD

(mA)

09376-112

V

OUT

(V)

3.20

3.22

3.24

3.26

3.28

3.30

3.32

3.34

3.36

3.38

3.40

3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5

V

OUT

(V)

VIN (V)

LOAD = 10µA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA

09376-113

2.75

2.76

2.77

2.78

2.79

2.80

2.81

2.82

2.83

2.84

2.85

3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5

V

OUT

(V)

V

IN

(V)

LOAD = 10µA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA

09376-114

1.780

1.785

1.790

1.795

1.800

1.805

1.810

1.815

1.820

2.30 2.70 3.10 3.50 3.90 4.30 4.70 5.10 5.50

V

OUT

(V)

VIN (V)

LOAD = 10µA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA

09376-115

1.180

1.185

1.190

1.195

1.200

1.205

1.210

1.215

1.220

2.30 2.70 3.10 3.50 3.90 4.30 4.70 5.10 5.50

V

OUT

(V)

V

IN

(V)

LOAD = 10µA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA

09376-116

Figure 11. Output Voltage vs. Load Current, V

Figure 12. Output Voltage vs. Load Current, V

= 1.8 V, ADP222/ADP224

OUTx

= 1.2 V, ADP222/ADP224

OUTx

Figure 14. Output Voltage vs. Input Voltage, V

Figure 15. Output Voltage vs. Input Voltage, V

= 2.8 V, ADP222/ADP224

OUTx

= 1.8 V, ADP222/ADP224

OUTx

Figure 13. Output Voltage vs. Input Voltage, V

= 3.3 V, ADP222/ADP224

OUTx

Figure 16. Output Voltage vs. Input Voltage, V

Rev. B | Page 8 of 24

= 1.2 V, ADP222/ADP224

OUTx

Data Sheet ADP222/ADP223/ADP224/ADP225

0

20

40

60

80

100

120

140

–40 –5 25 85 125

GROUND CURRENT ( µ A)

JUNCTION T E M P E R ATURE (°C)

LOAD = 10µA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA

09376-117

0

50

100

150

200

250

300

GROUND CURRENT ( µ A)

–40 –5 25 85 125

JUNCTION T E M P E R ATURE (°C)

LOAD = 100µA
LOAD = 1m

A

LOAD = 10mA

LOAD = 50mA
LOAD = 100mA
LOAD = 300mA

09376-118

0

20

40

60

80

100

120

140

0.01 0.1 1 10 100 1000

GROUND CURRENT ( µ A)

I

LOAD

(mA)

09376-119

0

50

100

150

200

250

0.01 0.1 1 10 100 1000

GROUND CURRENT ( µ A)

I

LOAD

(mA)

09376-120

0

20

40

60

80

100

120

140

2.30 2.70 3.10 3.50 3.90 4.30 4.70 5.10 5.50

GROUND CURRENT ( µ A)

VIN (V)

LOAD = 10µA
LOAD = 100µA
LOAD = 1mA

LOAD = 10mA
LOAD = 100mA
LOAD = 300mA

09376-121

2.30 2.70 3.10 3.50 3.90 4.30 4.70 5.10 5.50

GROUND CURRENT ( µ A)

VIN (V)

LOAD = 10µA
LOAD = 100µA
LOAD = 1mA

LOAD = 10mA
LOAD = 100mA
LOAD = 300mA

09376-122

0

50

100

150

200

250

Figure 17. Ground Current vs. Junction Temperature, Single Output,

ADP222/ADP224

Figure 18. Ground Current vs. Junction Temperature, Dual Output,

ADP222/ADP224

Figure 20. Ground Current vs. Load Current, Dual Output, ADP222/ADP224

Figure 21. Ground Current vs. Input Voltage, V

= 1.2 V, ADP222/ADP224

OUTx

Figure 19. Ground Current vs. Load Current, Single Output, ADP222/ADP224

Figure 22. Ground Current vs. Input Voltage, V

= 1.2 V and 1.8 V,

OUTx

ADP222/ADP224

Rev. B | Page 9 of 24

ADP222/ADP223/ADP224/ADP225 Data Sheet

3.20

3.22

3.24

3.26

3.28

3.30

3.32

3.34

3.36

3.38

3.40

–40 –5 25 85 125

V

OUT

(V)

JUNCTION T E M P E RATURE (°C)

LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA

09376-003

2.75

2.76

2.77

2.78

2.79

2.80

2.81

2.82

2.83

2.84

2.85

–40 –5 25 85 125

V

OUT

(V)

JUNCTION T E M P E RATURE (°C)

LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA

09376-004

–40 –5 25 85 125

1.780

1.785

1.790

1.795

1.800

1.805

1.810

1.815

1.820

V

OUT

(V)

JUNCTION T E M P E RATURE (°C)

LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA

09376-005

–40 –5 25 85 125

JUNCTION T E M P E RATURE (°C)

1.180

1.185

1.190

1.195

1.200

1.205

1.210

1.215

1.220

V

OUT

(V)

LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA

09376-006

3.20

3.22

3.24

3.26

3.28

3.30

3.32

3.34

3.36

3.38

3.40

0.1 1 10 100 1000

V

OUT

(V)

I

LOAD

(mA)

09376-007

2.75

2.76

2.77

2.78

2.79

2.80

2.81

2.82

2.83

2.84

2.85

0.01 0.1 1 10 100 1000

V

OUT

(V)

I

LOAD

(mA)

09376-008

Figure 23. Output Voltage vs. Junction Temperature, V

ADP223/ADP225

Figure 24. Output Voltage vs. Junction Temperature, V

ADP223/ADP225

OUTx

OUTx

= 3.3 V,

= 2.8 V,

Figure 26. Output Voltage vs. Junction Temperature, V

ADP223/ADP225

Figure 27. Output Voltage vs. Load Current, V

OUTx

= 1.2 V,

OUTx

= 3.3 V, ADP223/ADP225

Figure 25. Output Voltage vs. Junction Temperature, V

ADP223/ADP225

OUTx

= 1.8 V,

Figure 28. Output Voltage vs. Load Current, V

= 2.8 V, ADP223/ADP225

OUTx

Rev. B | Page 10 of 24

Data Sheet ADP222/ADP223/ADP224/ADP225

1.780

1.785

1.790

1.795

1.800

1.805

1.810

1.815

1.820

0.1 1 10 100 1000

V

OUT

(V)

I

LOAD

(mA)

09376-009

1.180

1.185

1.190

1.195

1.200

1.205

1.210

1.215

1.220

0.1 1 10 100 1000

V

OUT

(V)

I

LOAD

(mA)

09376-010

3.70 3.90 4.10 4.30 4.70 4.90 5.10 5.30 5.50

VIN (V)

3.20

3.26

3.24

3.22

3.28

3.30

3.32

3.34

3.36

3.38

3.40

V

OUT

(V)

LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA

09376-011

3.50 3.70 3.90 4.10 4.30 4.70 4.90 5.10 5.30 5.50

VIN (V)

2.75

2.78

2.77

2.76

2.79

2.80

2.81

2.82

2.83

2.84

2.85

V

OUT

(V)

LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 200mA
LOAD = 300mA

09376-012

1.780

1.785

1.790

1.795

1.800

1.805

1.810

1.815

1.820

2.30 2.70 3.10 3.50 3.90 4.30 4.70 5.10 5.50

V

OUT

(V)

VIN (V)

09376-013

LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA

2.30 2.70 3.10 3.50 3.90 4.30 4.70 5.10 5.50

VIN (V)

1.180

1.185

1.190

1.195

1.200

1.205

1.210

1.215

1.220

V

OUT

(V)

LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA

09376-014

Figure 29. Output Voltage vs. Load Current, V

Figure 30. Output Voltage vs. Load Current, V

= 1.8 V, ADP223/ADP225

OUTx

= 1.2 V, ADP223/ADP225

OUTx

Figure 32. Output Voltage vs. Input Voltage, V

Figure 33. Output Voltage vs. Input Voltage, V

= 2.8 V, ADP223/ADP225

OUTx

= 1.8 V, ADP223/ADP225

OUTx

Figure 31. Output Voltage vs. Input Voltage, V

= 3.3 V, ADP223/ADP225

OUTx

Figure 34. Output Voltage vs. Input Voltage, V

Rev. B | Page 11 of 24

= 1.2 V, ADP223/ADP225

OUTx

ADP222/ADP223/ADP224/ADP225 Data Sheet

–40 –5 25 85 125

JUNCTION T E M P E RATURE (°C)

0

50

100

150

200

250

300

GROUND CURRENT ( uA)

LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA

09376-015

0

50

100

150

200

250

300

350

400

450

500

GROUND CURRENT (µA)

LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA

–40 –5 25 85 125

JUNCTION T E M P E RATURE (°C)

09376-016

0

50

100

150

200

250

0.01 0.1 1 10 100 1000

GROUND CURRENT (µA)

I

LOAD

(mA)

09376-017

0

100

200

300

400

500

50

150

250

350

450

0.01 0.1 1 10 100 1000

GROUND CURRENT (µA)

I

LOAD

(mA)

09376-018

0

50

100

150

200

250

2.3 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

GROUND CURRENT (µA)

VIN (V)

LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA

09376-019

0

50

100

150

200

250

300

350

400

450

2.3 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5

GROUND CURRENT (µA)

VIN (V)

LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 200mA
LOAD = 300mA

09376-020

Figure 35. Ground Current vs. Junction Temperature, Single Output,

Includes 100 µA for Output Divider, ADP223/ADP225

Figure 36. Ground Current vs. Junction Temperature, Dual Output, Includes

200 µA for Output Dividers, ADP223/ADP225

Figure 38. Ground Current vs. Load Current, Dual Output, Includes 200 µA for

Output Dividers, ADP223/ADP225

Figure 39. Ground Current vs. Input Voltage, V

= 1.2 V, Single Output,

OUTx

Includes 100 µA for Output Divider, ADP223/ADP225

Figure 37. Ground Current vs. Load Current, Single Output,

Includes 100 µA for Output Divider, ADP223/ADP225

Figure 40. Ground Current vs. Input Voltage, V

= 1.2 V and 1.8 V,

OUTx

Dual Output, Includes 200 µA for Output Dividers, ADP223/ADP225

Rev. B | Page 12 of 24

Data Sheet ADP222/ADP223/ADP224/ADP225

0

20

40

60

80

100

120

140

1 10 100 1000

DROPOUT V OLTAGE (mV)

I

LOAD

(mA)

09376-021

0

20

40

60

80

100

120

140

160

1 10 100 1000

DROPOUT V OLTAGE (mV)

I

LOAD

(mA)

09376-022

2.90

2.95

3.00

3.05

3.10

3.15

3.20

3.25

3.30

3.35

3.40

3.1 3.2 3.3 3.4 3.5 3.6

V

OUT

(V)

VIN (V)

LOAD = 1mA
LOAD = 5mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA

09376-023

2.40

2.45

2.50

2.55

2.60

2.65

2.70

2.75

2.80

2.85

2.90

2.6 2.7 2.8 2.9 3.0 3.1

V

OUT

(V)

VIN (V)

09376-024

LOAD = 1mA
LOAD = 5mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA

0

50

100

150

200

250

300

350

400

450

3.1 3.2 3.3 3.4 3.5 3.6

GROUND CURRENT (µA)

V

IN

(V)

LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA

09376-025

VIN (V)

0

50

100

150

200

250

300

350

400

2.6 2.7 2.8 2.9 3.0 3.1

GROUND CURRENT ( uA)

LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA

09376-026

Figure 41. Dropout Voltage vs. Load Current, V

Figure 42. Dropout Voltage vs. Load Current, V

OUT

OUT

= 3.3 V

= 2.8 V

Figure 44. Output Voltage vs. Input Voltage in Dropout, V

Figure 45. Ground Current vs. Input Voltage in Dropout, V

OUTx

OUTx

= 2.8 V

= 3.3 V

Figure 43. Output Voltage vs. Input Voltage in Dropout, V

OUTx

= 3.3 V

Figure 46. Ground Current vs. Input Voltage in Dropout, V

OUTx

= 2.8 V

Rev. B | Page 13 of 24

ADP222/ADP223/ADP224/ADP225 Data Sheet

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

0

10 100 1k 10k 100k 1M 10M

PSRR (dB)

FREQUENCY (Hz)

V

RIPPLE

= 50mV

V

IN

= 4.3V

V

OUT

= 3.3V

C

OUT

= 1µF

LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA

09376-027

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

0

10 100 1k 10k 100k 1M 10M

PSRR (dB)

FREQUENCY (Hz)

LOAD = 100

µ

A
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA

V

RIPPLE

= 50mV

V

IN

= 3.8V

V

OUT

= 2.8V

C

OUT

= 1µF

09376-028

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

0

10 100 1k 10k 100k 1M 10M

PSRR (dB)

FREQUENCY (Hz)

LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA

V

RIPPLE

= 50mV

V

IN

= 2.8V

V

OUT

= 1.8V

C

OUT

= 1µF

09376-029

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

0

10 100 1k 10k 100k 1M 10M

PSRR (dB)

FREQUENCY (Hz)

LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA

V

RIPPLE

= 50mV

V

IN

= 2.5V

V

OUT

= 1.2V

C

OUT

= 1µF

09376-030

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

0

10 100 1k 10k 100k 1M 10M

PSRR (dB)

FREQUENCY (Hz)

LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA

V

RIPPLE

= 50mV

V

IN

= 3.8V

V

OUT

= 3.3V

C

OUT

= 1µF

09376-031

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

0

10 100 1k 10k 100k 1M 10M

PSRR (dB)

FREQUENCY (Hz)

LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA

V

RIPPLE

= 50mV

V

IN

= 3.3V

V

OUT

= 2.8V

C

OUT

= 1µF

09376-032

Figure 47. Power Supply Rejection Ratio vs. Frequency,

V

= 4.3, V V

IN

OUTx

= 3.3 V

Figure 48. Power Supply Rejection Ratio vs. Frequency,

V

= 3.8 V, V

IN

OUTx

= 2.8 V

Figure 50. Power Supply Rejection Ratio vs. Frequency,

V

= 2.5 V, V

IN

OUTx

= 1.2 V

Figure 51. Power Supply Rejection Ratio vs. Frequency,

V

= 3.8 V, V

IN

OUTx

= 3.3 V

Figure 49. Power Supply Rejection Ratio vs. Frequency,

V

IN

= 2.8 V, V

= 1.8 V

OUTx

Figure 52. Power Supply Rejection Ratio vs. Frequency,

V

= 3.3 V, V

IN

OUTx

= 2.8 V

Rev. B | Page 14 of 24

Data Sheet ADP222/ADP223/ADP224/ADP225

10 100 1k 10k 100k 1M 10M

PSRR (dB)

FREQUENCY (Hz)

V

RIPPLE

= 50mV

V

IN

= 2.5V

V

OUT

= 1.8V

C

OUT

= 1µF

09376-033

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

0

LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA

CH2 10mVCH1 1V

CH3 10mV

B

W

B

W

M1µs A CH4 200mV

1

3

2

T 10.40%

B

W

V

IN

V

OUT2

V

OUT1

09376-034

CH2 10mVCH1 1V

CH3 10mV

B

W

B

W

M4µs A CH4 200mV

1

3

2

T 9.8%

B

W

09376-035

V

IN

V

OUT2

V

OUT1

CH2 10mVCH1 1V

CH3 10mV

B

W

B

W

M1µs A CH4 200mV

1

3

2

T 9.8%

B

W

09376-036

V

IN

V

OUT2

V

OUT1

CH2 10mVCH1 1V

CH3 10mV

B

W

B

W

M1µs A CH4 200mV

1

3

2

T 10.00%

B

W

09376-037

V

IN

V

OUT2

V

OUT1

CH2 50mVCH1 200mA Ω

CH3 10mV

B

W

B

W

M10µs A CH1 200mA

1

3

2

T 10.20%

B

W

09376-038

V

OUT2

V

OUT1

LOAD CURRENT

ON V

OUT1

Figure 53. Power Supply Rejection Ratio vs. Frequency,

V

= 2.5 V, V

IN

OUTx

= 1.8 V

Figure 56. Transient Line Response, V

I

LOAD

= 3.3 V and 2.8 V, VIN = 4 V to 5 V,

OUTx

= 300 mA

Figure 54. Transient Line Response, V

I

LOAD

Figure 55. Transient Line Response, V

I

LOAD

= 3.3 V and 2.8 V, VIN = 4 V to 5 V,

OUTx

= 10 mA

= 1.2 V and 1.8 V, VIN = 4 V to 5 V,

OUTx

= 10 mA

Figure 57. Transient Line Response, V

Figure 58. Transient Load Response, V

Rev. B | Page 15 of 24

V

OUTx

I

= 300 mA

LOAD

= 2.8 V, I

= 1.2 V and 1.8 V, VIN = 4 V to 5 V,

OUTx

OUTx

LOAD

= 3.3 V, I
= 1 mA

= 1 mA to 300 mA;

LOAD

ADP222/ADP223/ADP224/ADP225 Data Sheet

CH2 50mVCH1 200mA Ω

CH3 10.0mV

B

W

B

W

M10µs A CH1 200mA

1

3

2

T 10.20%

B

W

09376-039

LOAD CURRENT

ON V

OUT1

V

OUT2

V

OUT1

0

10

20

30

40

50

60

70

0.001 0.01 0.1 1 10 100 1000

NOISE (µ V rms)

I

LOAD

(mA)

1.2V

1.8V

2.8V

3.3V

09376-040

0.01

0.1

1

10

10 100 1k 10k 100k

NOISE SPECTRAL DENSITY (µV/√Hz)

FREQUENCY (Hz)

1.2V

1.8V

2.8V

3.3V

09376-041

Figure 59. Transient Load Response, V

V

= 1.8 V, I

OUTx

OUTx

LOAD

= 1.2 V, I
= 1 mA

= 1 mA to 300 mA;

LOAD

Figure 60. RMS Output Noise vs. Load Current and Output Voltage,

V

= 5 V, C

IN

OUT

= 1 µF

Figure 61. Output Noise Spectral Density, VIN = 5 V, I

= 10 mA, C

LOAD

OUT

= 1 μF

Rev. B | Page 16 of 24

Data Sheet ADP222/ADP223/ADP224/ADP225

G

V

THEORY OF OPERATION

The ADP222/ADP223/ADP224/ADP225 are low quiescent
current, fixed and adjustable dual output, low dropout linear
regulators that operate from 2.5 V to 5.5 V and provide up to
300 mA of current from each output. Drawing a low 300 μA
quiescent current (typical) at full load make the ADP222/

ADP223/ADP224/ADP225 ideal for battery-operated portable

equipment. Shutdown current consumption is typically 200 nA.

Optimized for use with small 1 μF ceramic capacitors, the

ADP222/ADP223/ADP224/ADP225 provide excellent

transient performance.

ADJ1

ADP223/ADP225

VIN VOUT1

140Ω

ADP225 ONLY

140Ω

VOUT2

ADJ2

EN1

EN2

ND

THERMAL

SHUTDOW N

CONTROL

LOGIC

AND

ENABLE

CURRENT

LIMIT

REFERENCE

CURRENT

LIMIT

Figure 62. Internal Block Diagram, ADP223/ADP225

SENSE1

ADP222/ADP224

VIN VOUT1

140Ω

140Ω

VOUT2

SENSE2

EN1

EN2

GND

THERMAL

SHUTDOWN

CONTRO L

LOGIC

AND

ENABLE

CURRENT

LIMIT

REFERENCE

CURRENT

LIMIT

ADP224

ONLY

Figure 63. Internal Block Diagram, ADP222/ADP224

Internally, the ADP222/ADP223/ADP224/ADP225 consist of a
reference, two error amplifiers, and two PMOS pass transistors.
Output current is delivered via the PMOS pass device, which is

09376-062

09376-063

Rev. B | Page 17 of 24

controlled by the error amplifier. The error amplifier compares
the reference voltage with the feedback voltage from the output
and amplifies the difference. If the feedback voltage is lower
than the reference voltage, the gate of the PMOS device is
pulled lower, allowing more current to flow and increasing the
output voltage. If the feedback voltage is higher than the
reference voltage, the gate of the PMOS device is pulled higher,
allowing less current to flow and decreasing the output voltage.

= 4.2V

IN

+

C1

OFF

OFF

1µF

ON

1 8

ON

EN1

2

EN2

3

GND

4

ADJ2 VOUT2

ADP223/

ADP225

VOUT1

ADJ1

VIN

7

6

5

R2

R1

VOUT2 = 2.0V

+

C2
1µF

VOUT1 = 2.8V

+

R3

R4

C3
1µF

09376-064

Figure 64. Typical Application Circuit for Setting Output Voltages,

ADP223/ADP225

The ADP223/ADP225 are exactly the same as the ADP222/

ADP224 except that the output voltage dividers are internally

disconnected and the feedback input of the error amplifiers is
brought out for each output. The output voltages can be set
according to the following equations:

V

= 0.50 V(1 + R1/R2)

OUT1

V

= 0.50 V(1 + R3/R4)

OUT2

The value of R1 and R3 should be less than 200 kΩ to minimize
errors in the output voltage caused by the ADJx pin input current.
For example, when R1 and R2 each equal 200 kΩ, the output
voltage is 1.0 V. The output voltage error introduced by the ADJx
pin input current is 2 mV or 0.20%, assuming a typical ADJx pin
input current of 10 nA at 25°C.

The output voltage of the ADP223/ADP225

may be set from

0.5 V to 5.0 V.

The ADP222/ADP224 are available in multiple output voltage
options ranging from 0.8 V to 3.3 V.

The ADP224/ADP225 are identical to the ADP222/ADP223
with the addition of a quick output discharge (QOD) feature.
This allows the output voltage to start up from a known state.

The ADP222/ADP223/ADP224/ADP225 use the EN1/EN2 pins
to enable and disable the VOUT1/VOUT2 pins under normal
operating conditions. When EN1/EN2 are high, VOUT1/VOUT2
turn on; when EN1/EN2 are low, VOUT1/VOUT2 turn off. For
automatic startup, EN1/EN2 can be tied to VIN.

ADP222/ADP223/ADP224/ADP225 Data Sheet

A CH1 200mA

1

M10µs

T 10.20%

3

2

CH1 200mA
CH3 10mV

CH2 50mV

B

W

B

W

Ω

B

W

09376-043

V

OUT2

V

OUT1

LOAD CURRENT

ON V

OUT1

1.2

1.0

0.8

0.6

0.4

0.2

0

0 2 4 6 8 10

CAPACITANCE (µ F)

VOLTAGE (V)

09376-044

APPLICATIONS INFORMATION

CAPACITOR SELECTION

Output Capacitor

The ADP222/ADP223/ADP224/ADP225 are designed for
operation with small, space-saving ceramic capacitors but
function with most commonly used capacitors as long as care is
taken with regard to the effective series resistance (ESR) value.
The ESR of the output capacitor affects the stability of the LDO
control loop. A minimum of 0.7 µF capacitance with an ESR of
1 Ω or less is recommended to ensure the stability of the ADP222/

ADP223/ADP224/ADP225. Transient response to changes in

load current is also affected by output capacitance. Using a
larger value of output capacitance improves the transient response
of the ADP222/ADP223/ADP224/ADP225 to large changes in
load current. Figure 65 shows the transient responses for an
output capacitance value of 1 µF.

Figure 66 depicts the capacitance vs. voltage bias characteristic
of an 0402, 1 µF, 10 V, X5R capacitor. The voltage stability of a
capacitor is strongly influenced by the capacitor size and voltage
rating. In general, a capacitor in a larger package or higher voltage
rating exhibits better stability. The temperature variation of the
X5R dielectric is ~±15% over the −40°C to +85°C temperature
range and is not a function of package or voltage rating.

Figure 65. Output Transient Response, C

Input Bypass Capacitor

Connecting a 1 µF capacitor from VIN to GND reduces the
circuit sensitivity to the printed circuit board (PCB) layout,
especially when long input traces or high source impedance
are encountered. If greater than 1 µF of output capacitance is
required, the input capacitor should be increased to match it.

Input and Output Capacitor Properties

Any good quality ceramic capacitors can be used with the

ADP222/ADP223/ADP224/ADP225, as long as they meet the

minimum capacitance and maximum ESR requirements.
Ceramic capacitors are manufactured with a variety of
dielectrics, each with different behavior over temperature and
applied voltage. Capacitors must have a dielectric adequate to
ensure the minimum capacitance over the necessary temperature
range and dc bias conditions. X5R or X7R dielectrics with a
voltage rating of 6.3 V or 10 V are recommended, but Y5V and
Z5U dielectrics are not recommended, due to their poor
temperature and dc bias characteristics.

OUT

= 1 µF

Rev. B | Page 18 of 24

Figure 66. Capacitance vs. Voltage Bias Characteristic

Use Equation 1 to determine the worst-case capacitance accounting
for capacitor variation over temperature, component tolerance,
and voltage.

C

= C

EFF

× (1 − TEMPCO) × (1 − TOL) (1)

BIAS

where:
C

is the effective capacitance at the operating voltage.

BIAS

TEMPCO is the worst-case capacitor temperature coefficient.
TOL is the worst-case component tolerance.

In this example, the worst-case temperature coefficient (TEMPCO)
over −40°C to +85°C is assumed to be 15% for an X5R dielectric.
The tolerance of the capacitor (TOL) is assumed to be 10%, and
C

is 0.94 µF at 1.8 V, as shown in Figure 66.

BIAS

Substituting these values in Equation 1 yields

C

= 0.94 µF × (1 − 0.15) × (1 − 0.1) = 0.719 µF

EFF

Therefore, the capacitor chosen in this example meets the
minimum capacitance requirement of the LDO over temperature
and tolerance at the chosen output voltage.

To guarantee the performance of the ADP222/ADP223/

ADP224/ADP225, it is imperative that the effects of dc bias,

temperature, and tolerances on the behavior of the capacitors
be evaluated for each application.

Data Sheet ADP222/ADP223/ADP224/ADP225

0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2

OUTPUT VOLTAGE (V)

ENABLE VOLTAGE (V)

VIN = 5.5V

09376-045

0

0.2

0.4

0.6

0.8

1.0

1.2

2.3 2.7 3.1 3.5

3.9 4.3 4.7 5.1 5.5

ENABLE THRES HOLDS (V)

VIN (V)

ENx FALL
ENx RISE

09376-046

0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

0 100 200 300 400 500 600 700 800 900 1000

OUTPUT VOLTAGE (V)

TIME (µs)

ENx

3.3V

2.8V

1.8V

1.2V

09376-047

EN1

VOUT1

VIN

EN2

GND

6

4

3

2

ADJ2 VOUT2

1 8

5

7

ADJ1

R1

R2

ON

OFF

V

IN

= 3.3V

+

C1
1µF

+

C2
1µF

VOUT2 = 2.8V

09376-053

ENABLE FEATURE

The ADP222/ADP223/ADP224/ADP225 use the ENx pins to
enable and disable the VOUTx pins under normal operating
conditions. Figure 67 shows a rising voltage on ENx crossing
the active threshold, where V
voltage on ENx crosses the inactive threshold, V

turns on. When a falling

OUTx

OUTx

turns off.

Figure 67. Typical ENx Pin Operation, V

= 5.5 V

IN

As shown in Figure 67, the ENx pins have built-in hysteresis.
This prevents on/off oscillations that can occur due to noise on
the ENx pins as it passes through the threshold points.

The active/inactive thresholds of the ENx pins are derived from
the VIN voltage. Therefore, these thresholds vary with changing
input voltage. Figure 68 shows typical ENx active/inactive thresholds
when the input voltage varies from 2.5 V to 5.5 V.

Figure 69. Typical Start-Up Time

PARALLELING OUTPUTS TO INCREASE OUTPUT CURRENT

The ADP223/ADP225 use a single band gap to generate the

reference voltage for each LDO. The reference voltages are
trimmed to plus or minus a couple of millivolts of each other.
This allows paralleling of the LDOs to increase the output
current to 600 mA. The adjust pins of each LDO are tied
together and a single output voltage divider sets the output
voltage. Even though the output voltage of each LDO is slightly
different, at high load currents, the resistance of the package
and the board layout absorbs the difference. Figure 70 shows
the schematic of a typical application where the LDO outputs
are paralleled.

Figure 68. Typical Enable Thresholds vs. Input Voltage

The ADP222/ADP223/ADP224/ADP225 use an internal soft
start to limit the inrush current when the output is enabled. The
start-up time for the 2.8 V option is approximately 240 µs from
the time the ENx active threshold is crossed to when the output
reaches 90% of its final value. The start-up time is somewhat
dependent on the output voltage setting and increases slightly as
the output voltage increases.

Figure 70. Paralleling Outputs for Higher Output Current

QUICK OUTPUT DISCHARGE (QOD) FUNCTION

The ADP224/ADP225 include an output discharge resistor to
force the voltage on each output to zero when the respective
LDO is disabled. This ensures that the outputs of the LDOs are
always in a well-defined state, regardless if it is enabled or not.
The ADP222/ADP223 do not include the output discharge
function. Figure 71 compares the turn-off time of a 3.3 V output
LDO with and without the QOD function. Both LDOs have a
1 kΩ resistor connected to each output. The LDO with the
QOD function discharges the output to 0 V in less than 1 ms,

Rev. B | Page 19 of 24

whereas the 1 kΩ load takes over 5 ms to do the same.

0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

0 2000 4000 6000 8000 10000

VOLTS (V)

TIME (µs)

ENABLE
V

OUT

, NO QOD

V

OUT

, WITH QOD

09376-169

6400

51

ADP222/ADP223/ADP224/ADP225 Data Sheet

THERMAL CONSIDERATIONS

In most applications, the ADP222/ADP223/ADP224/ADP225
do not dissipate much heat due to its high efficiency. However,
in applications with high ambient temperature, and high supply
voltage to output voltage differential, the heat dissipated in
the package is large enough that it can cause the junction
temperature of the die to exceed the maximum junction
temperature of 125°C.

When the junction temperature exceeds 155°C, the converter
enters thermal shutdown. It recovers only after the junction
temperature has decreased below 140°C to prevent any permanent
damage. Therefore, thermal analysis for the chosen application
is very important to guarantee reliable performance over all
conditions. The junction temperature of the die is the sum of
the ambient temperature of the environment and the temperature
rise of the package due to the power dissipation, as shown in
Equation 2.

To guarantee reliable operation, the junction temperature of
the ADP222/ADP223/ADP224/ADP225 must not exceed
125°C. To ensure that the junction temperature stays below this
maximum value, the user must be aware of the parameters that
contribute to junction temperature changes. These parameters
include ambient temperature, power dissipation in the power
device, and thermal resistances between the junction and ambient
air (θ

). The θJA number is dependent on the package assembly

JA

compounds that are used and the amount of copper used to
solder the package GND pin to the PCB.

Table 6 shows typical θ

values of the 8-lead LFCSP package for

JA

various PCB copper sizes, and Ta b l e 7 shows the typical Ψ
of the 8-lead LFCSP.

Table 6. Typical θJA Values

Copper Size (mm2) θJA (°C/W)

251 175.1
100 135.6
500 77.3
1000 65.2

1

Device soldered to minimum size pin traces.

Table 7. Typical ΨJB Value

Model ΨJB (°C/W)
8-Lead LFCSP 18.2

Figure 71. Typical Turn-Off Time with and Without QOD Function

CURRENT LIMIT AND THERMAL OVERLOAD PROTECTION

The ADP222/ADP223/ADP224/ADP225 are protected against
damage due to excessive power dissipation by current and
thermal overload protection circuits. The ADP222/ADP223/

ADP224/ADP225 are designed to current limit when the output

load reaches 300 mA (typical). When the output load exceeds
300 mA, the output voltage is reduced to maintain a constant
current limit.

Thermal overload protection is included, which limits the
junction temperature to a maximum of 155°C (typical). Under
extreme conditions (that is, high ambient temperature and
power dissipation) when the junction temperature starts to rise
above 155°C, the output is turned off, reducing the output current
to 0. When the junction temperature drops below 140°C, the
output is turned on again, and output current is restored to its
nominal value.

Consider the case where a hard short from VOUTx to ground
occurs. At first, the ADP222/ADP223/ADP224/ADP225 cur­rent limits, so that only 300 mA is conducted into the short. If
self-heating of the junction is great enough to cause its tempera­ture to rise above 155°C, thermal shutdown activates, turning
off the output and reducing the output current to 0 mA. As the
junction temperature cools and drops below 135°C, the output
turns on and conducts 300 mA into the short, again causing the
junction temperature to rise above 155°C. This thermal oscilla­tion between 140°C and 155°C causes a current oscillation
between 300 mA and 0 mA that continues as long as the short
remains at the output.

Current and thermal limit protections are intended to protect
the device against accidental overload conditions. For reliable
operation, device power dissipation must be externally limited
so that junction temperatures do not exceed 125°C.

value

JB

Rev. B | Page 20 of 24

Data Sheet ADP222/ADP223/ADP224/ADP225

140

120

100

80

60

40

20

0

JUNCTION T E M P E R ATURE T

J

(°C)

TOTAL POWER DISSIPATION (W)

0 0.2 0.4 0.6 0.8 1.0 1.2

6400mm

2

1000mm

2

500mm

2

100mm

2

25mm

2

JEDEC
T

J

MAX

09376-048

140

120

100

80

60

40

20

0

JUNCTION T E M P E R ATURE T

J

(°C)

TOT

AL POWER DISSIPATION (W)

0 0.2 0.4 0.6 0.8 1.0 1.2

6400mm

2

1000mm

2

500mm

2

100mm

2

25mm

2

JEDEC
T

J

MAX

09376-049

140

120

100

80

60

40

20

0

JUNCTION T E M P E R ATURE T

J

(°C)

TOTAL POWER DISSIPATION (W)

0 0.2 0.4 0.6 0.8 1.0 1.2

6400mm

2

1000mm

2

500mm

2

100mm

2

25mm

2

JEDEC
T

J

MAX

09376-050

140

120

100

80

60

40

20

0

JUNCTION T E M P E R ATURE T

J

(°C)

TOTAL POWER DISSIPATION (W)

0 21 3 4 5 6 7

TB = 25°C
T

B

= 50°C

T

B

= 85°C

T

J

MAX

09376-051

The junction temperature of the ADP222/ADP223/ADP224/

ADP225 can be calculated by

T

= TA + (PD × θJA) (2)

J

where:

T

is the ambient temperature.

A

P

is the power dissipation in the die, given by

D

= [(VIN − V

P

D

where:

I

is the load current.

LOAD

I

is the ground current.

GND

V

and V

IN

are input and output voltages, respectively.

OUT

Power dissipation due to ground current is quite small and can
be ignored. Therefore, the junction temperature equation
simplifies to the following:

T

= TA + {[(VIN − V

J

As shown in the simplified equation, for a given ambient
temperature, input- to-output voltage differential, and continuous
load current, there exists a minimum copper size requirement
for the PCB to ensure that the junction temperature does not rise
above 125°C. Figure 72 to Figure 75 show junction temperature
calculations for different ambient temperatures, power dissipation,
and areas of PCB copper.

OUT

) × I

OUT

LOAD

) × I

] + (VIN × I

] × θJA}

LOAD

GND

)

Figure 73. 8-Lead LFCSP, T

= 50°C

A

Figure 72. 8-Lead LFCSP, T

= 25°C

A

Figure 74. 8-Lead LFCSP, T

= 85°C

A

Figure 75. 8-Lead LFCSP, T

= 85°C

A

In the case where the board temperature is known, use the
thermal characterization parameter, Ψ

, to estimate the

JB

junction temperature rise (see Figure 75). Maximum junction
temperature (T
and power dissipation (P

T

= TB + (PD × ΨJB) (3)

J

The typical value of Ψ

) is calculated from the board temperature (TB)

J

) using the following formula:

D

is 18.2°C/W for the 8-lead LFCSP package.

JB

Rev. B | Page 21 of 24

ADP222/ADP223/ADP224/ADP225 Data Sheet

09376-052

U1

J1

TB2

TB5

EN1

C2
C1

C3

R3

R4

R1 R2

VOUT1

J2

TB6

ADP223 - ________- EVALZ

VOUT2

TB7

GND

ANALOG

DEVICES

TB1

GND

TB4

VIN

TB3

EN2

PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS

Heat dissipation from the package can be improved by
increasing the amount of copper attached to the pins of the

ADP222/ADP223/ADP224/ADP225. However, as listed in

Table 6, a point of diminishing returns is eventually reached
beyond which an increase in the copper size does not yield
significant heat dissipation benefits.

Place the input capacitor as close as possible to the VIN and
GND pins. Place the output capacitor as close as possible to the
VOUTx and GND pins. Use of 0402 or 0603 size capacitors and
resistors achieves the smallest possible footprint solution on
boards where area is limited.

Figure 76. Example 8-Lead LFCSP PCB La yout

Rev. B | Page 22 of 24

Data Sheet ADP222/ADP223/ADP224/ADP225

1.70

1.60

1.50

0.425

0.350

0.275

TOP VIEW

8

1

5

4

0.30

0.25

0.20

BOTTOM VIEW

PIN 1 INDEX

AREA

2.00

BSC SQ

SEATING

PLANE

0.60

0.55

0.50

1.10

1.00

0.90

0.20 REF

0.175 REF

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

PIN 1
INDICATOR
(R 0.15)

FOR PROP E R CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CO NFIGURATI ON AND
FUNCTIO N DE S CRIPTIONS
SECTION OF THIS DATA SHEET.

07-11-2011-B

ADP222ACPZ-1815-R7

−40°C to +125°C

1.8

1.5

8-Lead Lead Frame Chip Scale

CP-8-10

LL0

OUTLINE DIMENSIONS

ORDERING GUIDE

Output Voltage (V)
Model1 Temperature Range VOUT1 VOUT2 Package Description Package Option Branding

ADP222ACPZ-1218-R7 −40°C to +125°C 1.2 1.8 8-Lead Lead Frame Chip Scale

ADP222ACPZ-1228-R7 −40°C to +125°C 1.2 2.8 8-Lead Lead Frame Chip Scale

ADP222ACPZ-1233-R7 −40°C to +125°C 1.2 3.3 8-Lead Lead Frame Chip Scale

ADP222ACPZ-1528-R7 −40°C to +125°C 1.5 2.8 8-Lead Lead Frame Chip Scale

ADP222ACPZ-1533-R7 −40°C to +125°C 1.5 3.3 8-Lead Lead Frame Chip Scale

ADP222ACPZ-1825-R7 −40°C to +125°C 1.8 2.5 8-Lead Lead Frame Chip Scale

ADP222ACPZ-1827-R7 −40°C to +125°C 1.8 2.7 8-Lead Lead Frame Chip Scale

ADP222ACPZ-1833-R7 −40°C to +125°C 1.8 3.3 8-Lead Lead Frame Chip Scale

ADP222ACPZ-2818-R7 −40°C to +125°C 2.8 1.8 8-Lead Lead Frame Chip Scale

ADP222ACPZ-2827-R7 −40°C to +125°C 2.8 2.7 8-Lead Lead Frame Chip Scale

ADP222ACPZ-3325-R7 −40°C to +125°C 3.3 2.5 8-Lead Lead Frame Chip Scale

ADP222ACPZ-3328-R7 −40°C to +125°C 3.3 2.8 8-Lead Lead Frame Chip Scale

ADP222ACPZ-3330-R7 −40°C to +125°C 3.3 3.0 8-Lead Lead Frame Chip Scale

ADP224ACPZ-2818-R7 −40°C to +125°C 2.8 1.8 8-Lead Lead Frame Chip Scale

ADP225ACPZ-R7 −40°C to +125°C Adjustable Adjustable 8-Lead Lead Frame Chip Scale

Figure 77. 8-Lead Lead Frame Chip Scale Package [LFCSP_UD]

2.00 mm × 2.00 mm Body, Ultra Thin, Dual Lead

Dimensions shown in millimeters

(CP-8-10)

Package [LFCSP_UD]

Package [LFCSP_UD]

Package [LFCSP_UD]

Package [LFCSP_UD]

Package [LFCSP_UD]

Package [LFCSP_UD]

Package [LFCSP_UD]

Package [LFCSP_UD]

Package [LFCSP_UD]

Package [LFCSP_UD]

Package [LFCSP_UD]

Package [LFCSP_UD]

Package [LFCSP_UD]

Package [LFCSP_UD]

Package [LFCSP_UD]

Package [LFCSP_UD]

Rev. B | Page 23 of 24

CP-8-10 L16

CP-8-10 L17

CP-8-10 L18

CP-8-10 LKR

CP-8-10 LKS

CP-8-10 LL1

CP-8-10 L3A

CP-8-10 LL2

CP-8-10 LL3

CP-8-10 LJE

CP-8-10 LKV

CP-8-10 LKW

CP-8-10 LKX

CP-8-10 LKP

CP-8-10 LKQ

ADP222/ADP223/ADP224/ADP225 Data Sheet

©2011 Analog Devices, Inc. All rights reserved. Trademarks and

Output Voltage (V)
Model1 Temperature Range VOUT1 VOUT2 Package Description Package Option Branding

ADP223ACPZ-R7 −40°C to +125°C Adjustable Adjustable 8-Lead Lead Frame Chip Scale

Package [LFCSP_UD]
ADP223CP-EVALZ Adjustable Adjustable Evaluation Board
ADP225CP-EVALZ Adjustable Adjustable Evaluation Board

1

Z = RoHS Compliant Part.

CP-8-10 LJQ

registered trademarks are the property of their respective owners.
D09376-0-8/11(B)

Rev. B | Page 24 of 24