Datasheet ADP190 Datasheet (ANALOG DEVICES)

Logic Controlled,

FEATURES

Low RDSON of 105 mΩ at 1.8 V Internal output discharge resistor (ADP191) Turn-on slew rate limiting (ADP191) Low input voltage range: 1.1 V to 3.6 V 500 mA continuous operating current Built-in level shift for control logic that can be operated

by 1.2 V logic Low 2 μA (maximum) ground current Ultralow shutdown current: <1 μA Ultrasmall 0.8 mm × 0.8 mm, 4-ball, 0.4 mm pitch WLCSP

APPLICATIONS

Mobile phones Digital cameras and audio devices Portable and battery-powered equipment

High-Side Power Switches

ADP190/ADP191

TYPICAL APPLICATIONS CIRCUIT

ADP190

VIN VOUT

+

GND

–

ON

EN

OFF

ADP191

VIN VOUT

+

GND

–

ON

EN

OFF

LEVEL SHIFT

AND SLEW

RATE CONTROL

Figure 1.

LEVEL SHIFT

AND SLEW

RATE CONTROL

AND LOAD

DISCHARGE

Figure 2.

LOAD

07874-001

07874-102

GENERAL DESCRIPTION

The ADP190/ADP191 are high-side load switches designed for operation from 1.1 V to 3.6 V. These load switchs provide power domain isolation for extended power battery life. The devices contain a low on-resistance P-channel MOSFET that supports more than 500 mA of continuous current and minimizes power loss. The low 2 A (maximum) of ground current and ultralow shutdown current make the ADP190/ADP191 ideal for batteryoperated portable equipment. The built-in level shifter for enable logic makes the ADP190/ADP191 compatible with modern processors and GPIO controllers.

The ADP191 controls the turn-on slew rate of the switch to reduce the input inrush current. The ADP191 also incorporates an internal output discharge resistor to discharge the output capacitance when the ADP191 output is disabled.

Beyond operating performance, the ADP190/ADP191 occupy minimal printed circuit board (PCB) space with an area less than

0.64 mm

2

and a height of 0.60 mm. It is available in an ultrasmall

0.8 mm × 0.8 mm, 4-ball, 0.4 mm pitch WLCSP.

Rev. D

Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.

ADP190/ADP191

REVISION HISTORY

11/10—Rev. C to Rev. D

Changed 4 m to 4 M in Theory of Operation Section .......... 9

3/10—Rev. B to Rev. C

Change to Low Input Voltage Range Value................ Throughout

1/10—Rev. A to Rev. B

Added ADP191.............................................................. Throughout

Changes to Table 1............................................................................ 3

Changes to Table 3............................................................................ 5

Changes to Ordering Guide.......................................................... 15

9/09—Rev. 0 to Rev. A

Changes to Ordering Guide.......................................................... 13

1/09—Revision 0: Initial Version

Pin Configuration and Function Descriptions..............................6

Typical Performance Characteristics..............................................7

Theory of Operation .........................................................................9

Applications Information.............................................................. 10

Ground Current.......................................................................... 10

Enable Feature ............................................................................ 10

Timing ......................................................................................... 10

Thermal Considerations............................................................ 12

PCB Layout Considerations...................................................... 14

Outline Dimensions....................................................................... 15

Ordering Guide .......................................................................... 15

Rev. D | Page 2 of 16

ADP190/ADP191

SPECIFICATIONS

VIN = 1.8 V, VEN = VIN, I

Table 1. ADP190

Parameter Symbol Test Conditions Min Typ Max Unit

INPUT VOLTAGE RANGE VIN T EN INPUT

EN Input Threshold V

1.3 V < VIN < 1.8 V, TJ = −40°C to +85°C 0.4 1.2 V

1.8 V ≤ VIN ≤ 3.6 V, TJ = −40°C to +85°C 0.45 1.2 V

Logic High Voltage VIH 1.1 V ≤ VIN ≤ 3.6 V 1.1 V

Logic Low Voltage VIL 1.1 V ≤ VIN ≤ 3.6 V 0.3 V

EN Input Pull-Down Resistance REN 4 MΩ

CURRENT

Ground Current1 I

Shutdown Current I

EN = GND, TJ = −40°C to +85°C 2 µA VIN to VOUT RESISTANCE RDSON V V V V V VOUT TIME

Turn-On Delay Time t

1

Ground current includes EN pull-down current.

= 200 mA, TA = 25°C, unless otherwise noted.

LOAD

= −40°C to +85°C 1.1 3.6 V

J

1.1 V ≤ VIN ≤ 1.3 V, TJ = −40°C to +85°C 0.3 1.0 V

EN_TH

V

GND

EN = GND 0.1 µA

OFF

ON_DLY

= 3.6 V, VOUT open, TJ = −40°C to +85°C 2 µA

IN

= 3.6 V, I

IN

= 2.5 V, I

IN

= 1.8 V, I

IN

= 1.5 V, I

IN

= 1.2 V, I

IN

I

= 200 mA, EN = 1.5 V, C

LOAD

VIN = 3.6 V, I

= 200 mA, EN = 1.5 V 80 mΩ

LOAD

= 200 mA, EN = 1.5 V 90 mΩ

LOAD

= 200 mA, EN = 1.5 V 105 130 mΩ

LOAD

= 200 mA, EN = 1.5 V 125 mΩ

LOAD

= 200 mA, EN = 1 V 160 mΩ

LOAD

= 200 mA, EN = 1.5 V, C

LOAD

= 1 F 5 s

LOAD

= 1 F 1.5 s

LOAD

Table 2. ADP191

Parameter Symbol Test Conditions Min Typ Max Unit

INPUT VOLTAGE RANGE VIN T

= −40°C to +85°C 1.1 3.6 V

J

EN INPUT

EN Input Threshold V

1.1 V ≤ VIN ≤ 1.3 V, TJ = −40°C to +85°C 0.3 1.0 V

EN_TH

1.3 V < VIN < 1.8 V, TJ = −40°C to +85°C 0.4 1.2 V

1.8 V ≤ VIN ≤ 3.6 V, TJ = −40°C to +85°C 0.45 1.2 V

Logic High Voltage VIH 1.1 V ≤ VIN ≤ 3.6 V 1.1 V

Logic Low Voltage VIL 1.1 V ≤ VIN ≤ 3.6 V 0.3 V

EN Input Pull-Down Resistance REN 4 MΩ

CURRENT

Ground Current1 I

Shutdown Current I

V

GND

EN = GND 0.1 µA

OFF

= 3.6 V, VOUT open, TJ = −40°C to +85°C 2 µA

IN

EN = GND, TJ = −40°C to +85°C 2 µA VIN to VOUT RESISTANCE RDSON V V V V V VOUT DISCHARGE RESISTANCE R

215 Ω

DIS

= 3.6 V, I

IN

= 2.5 V, I

IN

= 1.8 V, I

IN

= 1.5 V, I

IN

= 1.2 V, I

IN

= 200 mA, EN = 1.5 V 80 mΩ

LOAD

= 200 mA, EN = 1.5 V 90 mΩ

LOAD

= 200 mA, EN = 1.5 V 105 130 mΩ

LOAD

= 200 mA, EN = 1.5 V 125 mΩ

LOAD

= 200 mA, EN = 1 V 160 mΩ

LOAD

VOUT TIME

Turn-On Delay Time t

1

Ground current includes EN pull-down current.

I

ON_DLY

VIN = 3.6 V, I

ON_DLY

= 200 mA, EN = 1.5 V, C

LOAD

= 200 mA, EN = 1.5 V, C

LOAD

= 1 F 80 s

LOAD

= 1 F 50 s

LOAD

Rev. D | Page 3 of 16

ADP190/ADP191

V

TIMING DIAGRAM

TURN-ON

DELAY

90%

10%

EN

TURN-OFF

DELAY

V

OUT

TURN-ON

RISE

TURN-OFF

Figure 3. Timing Diagram

FALL

07874-003

Rev. D | Page 4 of 16

ADP190/ADP191

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter Rating

VIN to GND Pins −0.3 V to +4.0 V VOUT to GND Pins −0.3 V to VIN EN to GND Pins −0.3 V to +4.0 V Continuous Drain Current

TA = 25°C ±1 A

TA = 85°C ±500 mA

Continuous Diode Current −50 mA Storage Temperature Range −65°C to +150°C Operating Junction Temperature Range −40°C to +125°C Soldering Conditions JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in combination. The ADP190/ADP191can be damaged when the junction temperature limits are exceeded. Monitoring ambient temperature does not guarantee that T temperature limits. In applications with high power dissipation and poor PCB thermal resistance, the maximum ambient

is within the specified

J

Junction-to-ambient thermal resistance (θ based on modeling and calculation using a 4-layer board. The junction-to-ambient thermal resistance is highly dependent on the application and board layout. In applications where high maximum power dissipation exists, close attention to thermal board design is required. The value of θ PCB material, layout, and environmental conditions. The specified values of θ See JESD51-7 and JESD51-9 for detailed information regarding board construction. For additional information, see the AN-617 application note, MicroCSP

Ψ

is the junction-to-board thermal characterization parameter

JB

with units of °C/W. Ψ calculation using a 4-layer board. The JESD51-12 document,

Guidelines for Reporting and Using Electronic Package Thermal Information, states that thermal characterization parameters are

not the same as thermal resistances. Ψ power flowing through multiple thermal paths rather than through a single path, as in thermal resistance (θ paths include convection from the top of the package as well as radiation from the package, factors that make Ψ in real-world applications. Maximum junction temperature (T is calculated from the board temperature (T dissipation (P

T

= TB + (PD × ΨJB)

J

See JESD51-8, JESD51-9, and JESD51-12 for more detailed information about Ψ

temperature may need to be derated.

In applications with moderate power dissipation and low PCB thermal resistance, the maximum ambient temperature can exceed the maximum limit as long as the junction temperature is within specification limits. The junction temperature (T the device is dependent on the ambient temperature (T power dissipation of the device (P thermal resistance of the package (θ

Maximum junction temperature (T ambient temperature (T

) and power dissipation (PD) using the

A

), and the junction-to-ambient

D

).

JA

) is calculated from the

J

), the

A

) of

J

THERMAL RESISTANCE

and ΨJB are specified for the worst-case conditions, that is, a

θ

JA

device soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type θJA ΨJB Unit

4-Ball, 0.4 mm Pitch WLCSP 260 58.4 °C/W

ESD CAUTION

formula

= TA + (PD × θJA)

T

J

are based on a 4-layer, 4 inch × 3 inch PCB.

JA

TM

Waf er L e vel Ch i p Scal e Pa ckage.

of the package is based on modeling and

JB

) using the formula

D

.

JB

) of the package is

JA

may vary, depending on

JA

measures the component

JB

). Therefore, ΨJB thermal

JB

more useful

JB

) and the power

B

)

J

Rev. D | Page 5 of 16

ADP190/ADP191

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

12

VIN VOUT

A

TOP VIEW

(Not to Scale)

EN

B GND

07874-002

Figure 4. Pin Configuration

Table 5. Pin Function Descriptions

Pin No. Mnemonic Description

A1 VIN Input Voltage. B1 EN Enable Input. Drive EN high to turn on the switch; drive EN low to turn off the switch. A2 VOUT Output Voltage. B2 GND Ground.

Rev. D | Page 6 of 16

ADP190/ADP191

TYPICAL PERFORMANCE CHARACTERISTICS

VIN = 1.8 V, VEN = VIN > VIH, I

200

180

160

140

(mΩ)

ON

120

RDS

100

80

= 100 mA, TA = 25°C, unless otherwise noted.

LOAD

VIN = 1.2V

V

= 1.8V

IN

VIN = 3.6V

V

T

V

EN

1

2

V

OUT

I

LOAD

C

LOAD

V

EN

= 3.6V

= 200mA

= 1µF

= 1.5V

60

JUNCTION TEMPERATURE, T

Figure 5. RDS

200

180

160

(mΩ)

140

ON

RDS

120

100

80

1.2 2.01.6 2.4 2.8 3.2 3.6

Figure 6. RDS

100

80

60

vs. Temperature (Includes ~15 mΩ Trace Resistance)

ON

V

(V)

IN

vs. Input Voltage, VIN (Includes ~15 mΩ Trace Resistance)

ON

J

(°C)

I I I I I

LOAD LOAD LOAD LOAD LOAD

1258525–5–40

= 10mA = 100mA = 250mA = 350mA = 500mA

VIN = 1.2V VIN = 1.8V VIN = 2.5V VIN = 3.6V

CH1 500mV CH2 2V M1. 0 0µ s A CH1 990mV

07874-004

T 3.0µs

07874-007

Figure 8. ADP190 Turn-On Delay, Input Voltage = 3.6 V

V

T

V

EN

V

1

2

CH1 500mV CH2 1V M4µ s A CH1 990mV

07874-005

OUT

T 12µs

OUT

I

LOAD

C

LOAD

V

EN

= 1.8V

= 200mA

= 1µF

= 1.5V

07874-008

Figure 9. ADP190 Turn-On Delay, Input Voltage = 1.8 V

T

1

V

EN

I

IN

40

20

DIFFERENCE ( mV )

0

–20

0 10050 150 200 250 300 350

LOAD (mA)

07874-006

Figure 7. Voltage Drop vs. Load Current (Includes ~15 mΩ Trace Resistance)

Rev. D | Page 7 of 16

2

3

CH1 2.00V CH2 100mA CH3 2.00V

V

OUT

M20.0µs A CH1 1.24V

T 10.20%

Figure 10. ADP191 Turn-On Delay and Inrush Current

vs. Input Voltage = 3.6 V

07874-110

ADP190/ADP191

T

1

2

3

V

EN

I

IN

V

OUT

1.3

I

= 10mA

LOAD

I

= 100mA

LOAD

I

= 250mA

LOAD

1.2

I

= 350mA

LOAD

I

= 500mA

LOAD

1.1

1.0

0.9

GROUND CURRENT (µA)

0.8

CH1 2.00V CH2 50.0mA CH3 1.00V

M40.0µs A CH1 1.24V

T 10.20%

Figure 11. ADP191 Turn-On Delay and Inrush Current

vs. Input Voltage = 1.8 V

T

1

3

CH1 2.00V CH2 50.0mA CH3 1.00V

V

EN

V

OUT

M200µs A CH1 600mV

T 10.20%

Figure 12. ADP191 Turn-Off Delay, Input Voltage = 3.6 V

T

1

V

EN

0.7

07874-111

JUNCTION TEMPERATURE, T

J

(°C)

1258525–5–40

07874-009

Figure 14. Ground Current vs. Temperature

2.0

I

= 10mA

LOAD

I

= 100mA

LOAD

1.8

I

= 250mA

LOAD

I

= 350mA

LOAD

I

= 500mA

LOAD

1.6

1.4

1.2

1.0

GROUND CURRENT (µA)

0.8

0.6

07874-112

V

(V)

IN

Figure 15. Ground Current vs. Input Voltage, V

0.7

0.6

0.5

VIN = 1.2V VIN = 1.8V VIN = 2.5V VIN = 3.6V

3.2 3.61.2 1.7 2.2 2.7

07874-010

IN

0.4

0.3

0.2

V

3

CH1 2.00V CH2 50.0mA CH3 500mV

OUT

M200µs A CH1 600mV

T 10.20%

Figure 13. ADP191 Turn-Off Delay, Input Voltage = 1.8 V

07874-113

SHUTDOWN CURRENT (µ A)

0.1

0

JUNCTION TEMPERATURE, T

Figure 16. Shutdown Current vs. Temperature

J

(°C)

1251007550250–25–50

07874-011

Rev. D | Page 8 of 16

ADP190/ADP191

THEORY OF OPERATION

The ADP190/ADP191are high-side PMOS load switches. They are designed for supply operation from 1.1 V to 3.6 V. The PMOS load switch is designed for low on resistance, 105 mΩ at V

=

IN

1.8 V, and supports 500 mA of continuous current. It is a low ground current device with a nominal 4 MΩ pull-down resistor on its enable pin. The package is a space-saving 0.8 mm ×

0.8 mm, 4-ball WLCSP.

The ADP191 incorporates an internal output discharge resistor to discharge the output capacitance when the ADP191 output is disabled. The ADP191 also contains circuitry to limit the switch turn-on slew rate to limit the inrush current.

VIN VOUT

GND

EN

ADP190

VIN VOUT

GND

LEVEL SHIFT

EN

Figure 17. ADP190 Functional Block Diagram

AND SLEW

RATE CONTROL

ADP191

LEVEL SHIFT

AND SLEW

RATE CONTRO L

AND LOAD

DISCHARGE

Figure 18. ADP191 Functional Block Diagram

07874-030

07874-118

Rev. D | Page 9 of 16

ADP190/ADP191

APPLICATIONS INFORMATION

GROUND CURRENT

The major source for ground current in the ADP190/ADP191 is the 4 MΩ pull-down on the enable (EN) pin. Figure 19 shows typical ground current when V to 3.6 V.

2.0

1.8

1.6

1.4

1.2

1.0

GROUND CURRENT (µA)

0.8

0.6

Figure 19. Ground Current vs. Load Current

As shown in Figure 20, an increase in ground current can occur when V

≠ VIN. This is caused by the CMOS logic nature of the

EN

level shift circuitry as it translates an EN signal ≥ 1.1 V to a logic high. This increase is a function of the V

14

12

10

8

(µA)

GND

6

I

4

2

0

V

OUT

Figure 20. Typical Ground Current when V

ENABLE FEATURE

The ADP190/ADP191 use the EN pin to enable and disable the VOUT pin under normal operating conditions. As shown in Figure 21, when a rising voltage on EN crosses the active threshold, VOUT turns on. When a falling voltage on EN crosses the inactive threshold, VOUT turns off.

= VIN and VIN varies from 1.1 V

EN

V

= 3.6V

IN

V

= 2.5V

IN

= 1.8V

V

IN

VIN = 1.2V

LOAD (mA)

IN

V

= 3.6V

OUT

= 1.8V

(V)

V

EN

≠ VIN

EN

350300250200150100500

07874-013

− VEN delta.

3.50.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 3.33.12.9

07874-014

2.0

1.8

1.6

1.4

1.2

(V)

1.0

OUT

V

0.8

0.6

0.4

0.2

0

V

(V)

EN

1.200.40.50.60.70.1 0.2 0.3 0.8 0.9 1.0 1.1

07874-015

Figure 21. Typical EN Operation

As shown in Figure 21, the EN pin has built-in hysteresis. This prevents on/off oscillations that can occur due to noise on the EN pin as it passes through the threshold points.

The EN pin active/inactive thresholds derive from the VIN voltage; therefore, these thresholds vary with changing input voltage. Figure 22 shows typical EN active/inactive thresholds when the input voltage varies from 1.1 V to 3.6 V.

1.15

1.05

0.95

0.85

0.75

0.65

0.55

TYPICAL EN THRESHOLDS ( V )

0.45

0.35

1.20

1.35

1.50

1.65

Figure 22. Typical EN Pin Thresholds vs. Input Voltage, V

EN ACTIVE

EN INACTIVE

1.80

1.95

2.10

2.25

2.55

2.70

2.85

3.00

2.40

VIN (V)

3.15

3.60

3.30

3.45

07874-016

IN

TIMING

Turn-on delay is defined as the delta between the time that EN reaches >1.1 V until VOUT rises to ~10% of its final value. The ADP190/ADP191 include circuitry to set the typical 1.5 s turnon delay at 3.6 V V Figure 23, the turn-on delay is dependent on the input voltage.

to limit the VIN inrush current. As shown in

IN

Rev. D | Page 10 of 16

ADP190/ADP191

I

T

V

EN

1

2

CH1 1V CH2 1V M4µs A CH1 2.34V

T 15.96µs

Figure 23. ADP190 Typical Turn-On Delay Time with Varying Input Voltage

4.0

3.5

= 100mA

LOAD

= 1µF

C

LOAD

= 3.6V

V

EN

V

= 2.5V

OUT

V

= 1.8V

OUT

V

= 1.2V

OUT

07874-017

Figure 25. ADP190 Typical Rise Time and Inrush Current with C

= 3.6V

V

OUT

T

1

2

3

CH1 2V

CH3 2.00mA Ω

T

1

V

EN

V

OUT

I

IN

V

= 1.8V

OUT

= 200mA

I

LOAD

= 1µF

C

LOAD

= 3.6V

V

EN

CH2 2V M10µs A CH1 2.32V

T 40.16µs

V

EN

LOAD

07874-029

= 1 F

3.0

2.5

2.0

1.5

INPUT VOLTAGE (V)

1.0

0.5

0

TIME (µs)

= 1.8V

V

OUT

VEN = 1.8V

= 1.2V

V

OUT

5000 100 200 300 400

07874-124

Figure 24. ADP191 Typical Turn-On Delay Time with Varying Input Voltage

The rise time is defined as the delta between the time from 10% to 90% of VOUT reaching its final value. It is dependent on the RC time constant where C = load capacitance (C RDS

||R

ON

adequate approximation for RC is RDS

. Because RDSON is usually smaller than R

LOAD

× C

ON

) and R =

LOAD

. The ADP190/

LOAD

, an

ADP191 do not need any input or load capacitor, but capacitors can be used to suppress noise on the board. If significant load capacitance is connected, inrush current is a concern.

The ADP191 contains circuitry to limit the slew rate of the switch turn to reduce the turn on inrush current. See Figure 25 and Figure 26 for a comparison of rise time and inrush current.

I

IN

2

3

CH1 2.00V CH2 100mA CH3 2.00V

V

OUT

M20.0µs A CH1 1.24V

T 10.20%

Figure 26. ADP191 Typical Rise Time and Inrush Current with C

T

1

2

3

CH1 2V

CH3 2.00mA Ω

CH2 2V M10µs A CH1 1.00V

V

EN

V

OUT

I

IN

T 39.8µs

V

OUT

I

LOAD

C V

EN

LOAD

= 3.6V

= 1.8V

= 200mA

= 4.7µF

Figure 27. ADP190 Typical Rise Time and Inrush Current with C

LOAD

07874-126

= 1 F

07874-019

= 4.7 µF

Rev. D | Page 11 of 16

ADP190/ADP191

The turn-off time is defined as the delta between the time from 90% to 10% of VOUT reaching its final value. It is also dependent on the RC time constant.

The ADP191 incorporates an internal output discharge resistor to discharge the output capacitance when the ADP191 output is disabled. See Figure 28 and Figure 29 for a comparison of turnoff times.

V

= 1.8V

I

LOAD

C

LOAD

= 100mA,

EN

= 1µF

OUT

= 3.6V

V

EN

= 100mA,

= 4.7µF

07874-020

T

I

= 200mA,

LOAD

= 1µF

C

LOAD

I

LOAD

C

LOAD

1

2

V

EN

CH1 1V CH2 500mV M10µs A CH1 1V

T 30.36µs

Figure 28. ADP190 Typical Turn-Off Time, Various Load Currents

T

1

V

To guarantee reliable operation, the junction temperature of the ADP190/ADP191must not exceed 125°C. To ensure that the junction temperature stays below this maximum value, the user must be aware of the parameters that contribute to junction temperature changes. These parameters include ambient temperature, power dissipation in the power device, and thermal resistances between the junction and ambient air (θ

). The θJA

JA

value is dependent on the package assembly compounds that are used and the amount of copper used to solder the package GND pin to the PCB. Tabl e 6 shows typical θ

values of the 4-ball

JA

WLCSP for various PCB copper sizes. Tab l e 7 shows the typical Ψ

value of the 4-ball WLCSP.

JB

Table 6. Typical θ

Values for WLCSP

JA

Copper Size (mm2) θJA (°C/W)

01 260 50 159 100 157 300 153 500 151

1

Device soldered to minimum size pin traces.

Table 7. Typical ΨJB Values

Package ΨJB Unit

4-Ball WLCSP 58.4 °C/W

V

3

CH1 2.00V CH3 500mV

OUT

M200µs A CH1 600mV

T 10.20%

07874-129

Figure 29. ADP191 Typical Turn-Off Time, Load Current = 0 mA

THERMAL CONSIDERATIONS

In most applications, the ADP190/ADP191 do not dissipate much heat due to their low on-channel resistance. However, in applications with high ambient temperature and load current, the heat dissipated in the package can be large enough to cause the junction temperature of the die to exceed the maximum junction temperature of 125°C.

The junction temperature of the die is the sum of the ambient temperature of the environment and the temperature rise of the package due to the power dissipation, as shown in Equation 1.

The junction temperature of the ADP190/ADP191can be calculated from the following equation:

T

= TA + (PD × θJA) (1)

J

where:

T

is the ambient temperature.

A

P

is the power dissipation in the die, given by

D

= [(VIN − V

P

D

OUT

) × I

] + (VIN × I

LOAD

) (2)

GND

where:

I

is the load current.

LOAD

is the ground current.

I

GND

V

and V

IN

are the input and output voltages, respectively.

OUT

Power dissipation due to ground current is quite small and can be ignored. Therefore, the junction temperature equation simplifies to the following:

T

= TA + {[(VIN − V

J

OUT

) × I

] × θJA} (3)

LOAD

As shown in Equation 3, for a given ambient temperature, inputto-output voltage differential, and continuous load current, there exists a minimum copper size requirement for the PCB to ensure that the junction temperature does not rise above 125°C. Figure 30 to Figure 35 show junction temperature calculations for different ambient temperatures, load currents, V

IN

to V

differentials,

OUT

and areas of PCB copper.

Rev. D | Page 12 of 16

ADP190/ADP191

T

140

MAX JUNCTION TEMPERATURE

120

LOAD CURRENT = 1mA

(°C)

LOAD CURRENT = 10mA

J

LOAD CURRENT = 25mA

100

LOAD CURRENT = 50mA LOAD CURRENT = 75mA

80

140

MAX JUNCTION TEMPERATURE

120

(°C)

J

100

80

60

40

JUNCTION TEMPERATURE,

20

LOAD CURRENT = 100mA LOAD CURRENT = 150mA

0

0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5

Figure 30. 500 mm

140

MAX JUNCTION TEMPERATURE

120

LOAD CURRENT = 1mA

(°C)

JUNCTION TEM P E RATURE,

LOAD CURRENT = 10mA

J

LOAD CURRENT = 25mA

100

LOAD CURRENT = 50mA LOAD CURRENT = 75mA

80

60

40

20

LOAD CURRENT = 100mA LOAD CURRENT = 150mA

0

0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5

Figure 31. 100 mm

140

MAX JUNCTION TEMPERATURE

LOAD CURRENT = 1mA

120

J

100

LOAD CURRENT = 10mA

(°C)

V

– V

(V)

IN

OUT

2

of PCB Copper, TA = 25°C

V

– V

(V)

IN

OUT

2

of PCB Copper, TA = 25°C

60

40

LOAD CURRENT = 1mA LOAD CURRENT = 10mA

JUNCTION TE M P E RATURE, T

20

LOAD CURRENT = 25mA LOAD CURRENT = 50mA

0

0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5

07874-021

V

Figure 33. 500 mm

140

MAX JUNCTION TEMPERATURE

120

(°C)

J

100

80

60

40

LOAD CURRENT = 1mA LOAD CURRENT = 10mA

JUNCTION TE M P E RATURE, T

20

LOAD CURRENT = 25mA LOAD CURRENT = 50mA

0

0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5

07874-022

V

Figure 34. 100 mm

140

MAX JUNCTION TEMPERATURE

120

(°C)

J

100

LOAD CURRENT = 75mA LOAD CURRENT = 100mA LOAD CURRENT = 150mA

– V

(V)

IN

OUT

2

of PCB Copper, TA = 50°C

LOAD CURRENT = 75mA LOAD CURRENT = 100mA LOAD CURRENT = 150mA

– V

(V)

IN

OUT

2

of PCB Copper, TA = 50°C

07874-024

07874-025

80

60

40

JUNCTION TEMPERATURE,

20

LOAD CURRENT = 25mA LOAD CURRENT = 50mA LOAD CURRENT = 75mA

0

0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5

Figure 32. 0 mm

V

2

LOAD CURRENT = 100mA LOAD CURRENT = 150mA

– V

(V)

IN

OUT

of PCB Copper, TA = 25°C

07874-023

80

60

40

LOAD CURRENT = 1mA LOAD CURRENT = 10mA

JUNCTION TE M P E RATURE, T

20

LOAD CURRENT = 25mA LOAD CURRENT = 50mA

0

0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5

Figure 35. 0 mm

V

2

LOAD CURRENT = 75mA LOAD CURRENT = 100mA LOAD CURRENT = 150mA

– V

(V)

IN

OUT

of PCB Copper, TA = 50°C

07874-026

Rev. D | Page 13 of 16

ADP190/ADP191

In cases where the board temperature is known, use the thermal characterization parameter, Ψ ature rise. Maximum junction temperature (T from the board temperature (T using the formula

T

= TB + (PD × ΨJB) (4)

J

140

120

(°C)

J

100

80

LOAD CURRENT = 1mA

60

LOAD CURRENT = 10mA LOAD CURRENT = 25mA LOAD CURRENT = 50mA

40

LOAD CURRENT = 75mA

JUNCTION TE M P E RATURE, T

LOAD CURRENT = 100mA LOAD CURRENT = 150mA

20

MAX JUNCTION TEMPERATURE

0

0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5

, to estimate the junction temper-

JB

) is calculated

J

) and power dissipation (PD)

B

V

– V

(V)

IN

OUT

Figure 36. T

= 85°C

B

07874-027

Figure 37. ADP190 PCB Layout

07874-028

PCB LAYOUT CONSIDERATIONS

Improve heat dissipation from the package by increasing the amount of copper attached to the pins of the ADP190/ADP191. However, as listed in Tab l e 6 , a point of diminishing returns is eventually reached, beyond which an increase in the copper size does not yield significant heat dissipation benefits.

It is critical to keep the input and output traces as wide and as short as possible to minimize the circuit board trace resistance.

07874-200

Figure 38. ADP191 PCB Layout

Rev. D | Page 14 of 16

ADP190/ADP191

R

OUTLINE DIMENSIONS

0.660

0.800

0.760 SQ

0.720

0.430

0.400

0.370

0.600

0.540 SEATING

PLANE

12

BALL A1

IDENTIFIE

TOP VIEW

(BALL SI DE DO W N)

0.230

0.200

0.170

0.40 BALL PITCH

0.050 NOM COPLANARITY

0.280

0.260

0.240

BOTTOM VIEW

(BALL SIDE UP)

A

B

11509-A

Figure 39. 4-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-4-3)

Dimensions shown in millimeters

ORDERING GUIDE

Model1 Temperature Range Package Description Package Option Branding

ADP190ACBZ-R7 −40°C to +85°C 4-Ball Wafer Level Chip Scale Package [WLCSP] CB-4-3 4D ADP191ACBZ-R7 −40°C to +85°C 4-Ball Wafer Level Chip Scale Package [WLCSP] CB-4-3 4G ADP190CB-EVALZ Evaluation Board ADP191CB-EVALZ Evaluation Board

1

Z = RoHS Compliant Part.

Rev. D | Page 15 of 16

ADP190/ADP191

NOTES

Rev. D | Page 16 of 16

Datasheet ADP190 Datasheet (ANALOG DEVICES)

FEATURES

APPLICATIONS

TYPICAL APPLICATIONS CIRCUIT

GENERAL DESCRIPTION

TABLE OF CONTENTS

REVISION HISTORY

SPECIFICATIONS

TIMING DIAGRAM

ABSOLUTE MAXIMUM RATINGS

THERMAL DATA

THERMAL RESISTANCE

ESD CAUTION

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

TYPICAL PERFORMANCE CHARACTERISTICS

THEORY OF OPERATION

APPLICATIONS INFORMATION

GROUND CURRENT

ENABLE FEATURE

TIMING

THERMAL CONSIDERATIONS

PCB LAYOUT CONSIDERATIONS

OUTLINE DIMENSIONS

ORDERING GUIDE