Datasheet ADMP401 Datasheet (ANALOG DEVICES)

Omnidirectional Microphone with

OUTPUT

AMPLIFIER

ADMP401

POWER

07712-001

VDD GND

OUTPUT

Data Sheet

FEATURES

4.72 mm × 3.76 mm × 1.0 mm surface-mount package
High SNR of 62 dBA
Sensitivity of −42 dBV
Flat frequency response from 100 Hz to 15 kHz
Low current consumption of <250 μA
Single-ended analog output
High PSRR of 70 dB
Compatible with Sn/Pb and Pb-free solder processes
RoHS/WEEE compliant

APPLICATIONS

Smartphones and feature phones
Teleconferencing systems
Digital video cameras
Bluetooth headsets
Video phones
Tablets

Bottom Port and Analog Output

ADMP401

GENERAL DESCRIPTION

The ADMP401 is a high quality, high performance, low power,
analog output, bottom-ported omnidirectional MEMS
microphone. The ADMP401 consists of a MEMS microphone
element, an impedance converter, and an output amplifier. The
ADMP401 sensitivity specification makes it an excellent choice
for both near field and far field applications. The ADMP401 has
a high SNR and flat wideband frequency response, resulting in
natural sound with high intelligibility. Low current consumption
enables long battery life for portable applications. A built-in
particle filter provides for high reliability. The ADMP401
complies with the TIA-920 standard, Telecommunications

Telephone Terminal Equipment Transmission Requirements for
Wideband Digital Wireline Telephones.

The ADMP401 is available in a thin, 4.72 mm × 3.76 mm ×

1.0 mm surface-mount package. It is reflow solder compatible
with no sensitivity degradation. The ADMP401 is halide free.

FUNCTIONAL BLOCK DIAGRAM

Figure 1.

Rev. D

Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of th eir respective owners.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: [phone] www.analog.com
Fax: [phone] ©2010–2012 Analog Devices, Inc. All rights reserved.

ADMP401 Data Sheet

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications ....................................................................................... 1

General Description ......................................................................... 1

Functional Block Diagram .............................................................. 1

Revision History ............................................................................... 2

Specifications ..................................................................................... 3

Absolute Maximum Ratings ............................................................ 4

ESD Caution .................................................................................. 4

Pin Configuration and Function Descriptions ............................. 5

Printed Circuit Board (PCB) Land Pattern Layout ...................... 6

Typical Performance Characteristics ............................................. 7

REVISION HISTORY

1/12—Rev. C to Rev. D

Updated Outline Dimensions ....................................................... 11

Changes to Figure 12 ...................................................................... 11

Added Figure 13 .............................................................................. 11

Change to Ordering Guide ............................................................ 11

8/11—Rev. B to R e v. C

Changes to Figure 1 .......................................................................... 1

Changes to Ta ble 3 ............................................................................ 4

Removed Terminal Side Down from Figure 3 .............................. 5

Changes to Bullet 2 in Pick-and-Place Equipment Section ........ 9

Changes to Ordering Guide .......................................................... 11

12/10—Rev. A t o R e v. B

Changes to Applications and General Description Sections ...... 1

Changes to Ta ble 1 ............................................................................ 3

10—Rev. 0 to Re v. A

8/

Changes to Frequency Response Parameter, Table 1 ................... 3

Changes to Supply Voltage Parameter, Table 2 ............................. 4

Changes to Applications Information Section, Figure 9, and

Figure 10 ............................................................................................ 8

Updated Outline Dimensions ....................................................... 11

4/10—Revision 0: Initial Ve rs i on

Applications Information .................................................................8

Connecting the ADMP401 to a Codec ......................................8

Connecting the ADMP401 to an Op Amp Gain Stage ............8

Handling Instructions .......................................................................9

Pick-and-Place Equipment ..........................................................9

Reflow Solder .................................................................................9

B o ar d Was h ....................................................................................9

Reliability Specifications ................................................................ 10

Outline Dimensions ....................................................................... 11

Ordering Guide .......................................................................... 11

Rev. D | Page 2 of 12

Data Sheet ADMP401

SPECIFICATIONS

TA = 25°C, VDD = 1.8 V, unless otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications are not
guaranteed.

Table 1.

Parameter Symbol Test Conditions/Comments Min Typ Max Unit

PERFORMANCE

Directionality Omni
Sensitivity 1 kHz, 94 dB SPL −45 −42 −39 dBV
Signal-to-Noise Ratio SNR 62 dBA
Equivalent Input Noise EIN 32 dBA SPL
Dynamic Range Derived from EIN and maximum acoustic input 88 dB
Frequency Response1 Low frequency, −3 dB point 100 Hz
High frequency, −3 dB point 15 kHz
Deviation limits from flat response within pass band −3/+2 dB
Total Harmonic Distortion THD 105 dB SPL 3 %
Power Supply Rejection Ratio PSRR 217 Hz, 100 mV p-p square wave superimposed on VDD = 1.8 V 70 dB
Maximum Acoustic Input Peak 120 dB SPL

POWER SUPPLY

Supply Voltage VDD 1.5 3.3 V
Supply Current IS 250 µA

OUTPUT CHARACTERISTICS

Output Impedance Z
Output DC Offset 0.8 V
Output Current Limit 90 µA

1

See Figure 6 and Figure 7.

200 Ω

OUT

Rev. D | Page 3 of 12

ADMP401 Data Sheet

07712-002

t

P

t

L

t

25°C TO PEAK

t

S

PREHEAT

CRITICAL ZONE

T

L

TO T

P

TEMPERATURE

TIME

RAMP-DOWN

RAMP-UP

T

SMIN

T

SMAX

T

P

T

L

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter Rating

Supply Voltage −0.3 V to +3.6 V
Sound Pressure Level (SPL) 160 dB
Mechanical Shock 10,000 g
Vibration

Per MIL-STD-883 Method 2007,
Tes t Condition B

Temperature Range −40°C to +70°C

Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.

ESD CAUTION

Figure 2. Recommended Soldering Profile Limits

Table 3. Recommended Soldering Profile Limits

Profile Feature Sn-Pb Pb Free

Average Ramp Rate (TL to TP) 1.25°C/sec max 1.25°C/sec max
Preheat

Minimum Temperature (T
Maximum Temperature (T
Time (T

Ramp-Up Rate (T

SMIN

to T

), tS 60 to 75 sec 60 to 75 sec

SMAX

to TL) 1.25°C/sec 1.25°C/sec

SMAX

) 100°C 100°C

SMIN

) 150°C 200°C

SMAX

Time Maintained Above Liquidous (tL) 45 to 75 sec ~50 sec

Liquidous Temperature (TL) 183°C 217°C
Peak Temperature (TP) 215°C +3°C/−3°C 245°C +0°C/−5°C
Time Within 5°C of Actual Peak Temperature (tP) 20 to 30 sec 20 to 30 sec
Ramp-Down Rate 3°C/sec max 3°C/sec max
Time 25°C (t

) to Peak Temperature 5 min max 5 min max

25°C

Rev. D | Page 4 of 12

Data Sheet ADMP401

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

OUTPUT

1

GND

6

V

DD

5

Figure 3. Pin Configuration (Bottom View)

Table 4. Pin Function Descriptions

Pin No. Mnemonic Description

1 OUTPUT Analog Output Signal
2 GND Ground
3 GND Ground
4 GND Ground
5 VDD Power Supply
6 GND Ground

BOTTOM VIEW

Not to Scale

GND

GND

2

3

4

GND

07712-003

Rev. D | Page 5 of 12

ADMP401 Data Sheet

2.62

ø1.10

ø1.68

ø0.70 (2×)

ø0.90 (3×)

2.40

1.20

2.54

0.79

1.27

07712-004

1.27mm

1.2mm

2.54mm

2.62mm

3.41mm

2.4mm

0.85mm DIA. (3×)

1.8mm/1.3mm DI A. 0.2032 CUT WI DTH (4×) 0.649mm DIA. (2×)

07712-005

PRINTED CIRCUIT BOARD (PCB) LAND PATTERN LAYOUT

The recommended PCB land pattern for the ADMP401 should
have a 1:1 ratio to the solder pads on the microphone package,
as shown in Figure 4. Care should be taken to avoid applying
solder paste to the sound hole in the PCB.

A suggested solder paste stencil pattern layout is shown in
Figure 5. The diameter of the sound hole in the PCB should be
larger than the diameter of the sound port of the microphone.
A minimum diameter of 0.5 mm is recommended.

Figure 4. PCB Land Pattern Layout (Dimensions Shown in mm)

Figure 5. Suggested Solder Paste Stencil Pattern Layout

Rev. D | Page 6 of 12

Data Sheet ADMP401

–10

–8

–6

–4

–2

0

2

4

6

8

10

100

10k1k

07712-006

FREQUENCY ( Hz )

SENSITIVITY (dB)

10

0

–10

–20

100 1k 10k

FREQUENCY ( Hz )

(dB)

07712-007

0

–80

100 10k

FREQUENCY ( Hz )

PSRR (dB)

1k

–10

–20

–30

–40

–50

–60

–70

07712-008

TYPICAL PERFORMANCE CHARACTERISTICS

Figure 6. Frequency Response Mask

Figure 8. Typical Power Supply Rejection Ratio vs. Frequency

Figure 7. Typical Frequency Response (Measured)

Rev. D | Page 7 of 12

ADMP401 Data Sheet

07712-009

LINN

LINP

MICBIAS

ADAU1761

OR

ADAU1361

2.2µF

MINIMUM

V

DD

GND

ADMP401

OUTPUT

CM

0.1µF

1µF

MINIMUM

10kΩ

R

2

R

1

V

REF

OP177

07712-010

V

DD

GAIN = (R

1

+ R2)/R

1

GND

ADMP401

OUTPUT

0.1µF

V

O

V

REF

APPLICATIONS INFORMATION

The ADMP401 output can be connected to a dedicated codec
microphone input (see Figure 9) or to a high input impedance
gain stage (see Figure 10). A 0.1 µF ceramic capacitor placed
close to the ADMP401 supply pin is used for testing and is
recommended to adequately decouple the microphone from
noise on the power supply. A dc-blocking capacitor is required
at the output of the microphone.

CONNECTING THE ADMP401 TO A CODEC

CONNECTING THE ADMP401 TO AN OP AMP GAIN STAGE

Figure 10. ADMP401 Connected to the OP177 Op Amp

Figure 9. ADMP401 Connected to the Analog Devices ADAU1761 or

ADAU1361 Codec

Rev. D | Page 8 of 12

Data Sheet ADMP401

HANDLING INSTRUCTIONS

PICK-AND-PLACE EQUIPMENT

The MEMS microphone can be handled using standard pick­and-place and chip shooting equipment. Care should be taken
to avoid damage to the MEMS microphone structure as follows:

• Use a standard pickup tool to handle the microphone.

Because the microphone hole is on the bottom of the
package, the pickup tool can make contact with any part
of the lid surface.

• Use care during pick-and-place to ensure that no high

shock events above 10 kg are experienced because such
events may cause damage to the microphone.

• Do not pick up the microphone with a vacuum tool that

makes contact with the bottom side of the microphone.

• Do not pull air out or blow air into the microphone port.

• Do not use excessive force to place the microphone on

the PCB.

REFLOW SOLDER

For best results, the soldering profile should be in accordance
with the recommendations of the manufacturer of the solder
paste that is used to attach the MEMS microphone to the PCB.
It is recommended that the solder reflow profile not exceed the
limit conditions specified in Figure 2 and Ta b le 3.

BOARD WASH

When washing the PCB, ensure that water does not make
contact with the microphone port. Blow-off procedures and
ultrasonic cleaning must not be used.

Rev. D | Page 9 of 12

ADMP401 Data Sheet

RELIABILITY SPECIFICATIONS

The microphone sensitivity after stress must deviate by no more than ±3 dB from the initial value.

Table 5.

Stress Test Description

Low Temperature Operating Life −40°C, 500 hours, powered
High Temperature Operating Life +125°C, 500 hours, powered
THB +65°C/85% relative humidity, 500 hours, powered
Temperature Cycle −40°C/+125°C, one cycle per hour, 100 cycles
High Temperature Storage +150°C, 500 hours
Low Temperature Storage −40°C, 500 hours
Component CDM ESD All pins, 0.5 kV
Component HBM ESD All pins, 1.5 kV
Component MM ESD All pins, 0.2 kV

Rev. D | Page 10 of 12

Data Sheet ADMP401

3.86

3.76

3.66

4.82

4.72

4.62

BOTTOM VIEW

TOP VIEW

SIDE VIEW

0.90 DIA.

(PINS 1, 5, 6)

1

3

2

4

5

6

2.62 BSC

3.30 REF

1.10 DIA.

1.68 DIA.

0.25 DIA.
(THRU HOLE )

0.79 BSC

2.54
BSC

1.27 BSC

1.10

1.00

0.90

0.24 REF

0.73 REF

1.20 BSC

2.40 BSC

0.68 REF

0.61 REF

0.70 DIA.
(PINS 2, 4)

12-12-2011-C

3.14
REF

4.10 REF

REFERENCE
CORNER

PIN 1

PIN 1

DIRECTION OF FEED

07712-011

07712-012

PIN 1

DIRECTION OF FEED

OUTLINE DIMENSIONS

Figure 11. 6-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV]

4.72 mm × 3.76 mm Body
(CE-6-1)

Dimensions shown in millimeters

Figure 12. Microphone Orientation in Tape Until Date Code 1213

ORDERING GUIDE

Model1 Temperature Range Package Description Package Option2 Ordering Quantity

ADMP401ACEZ-RL −40°C to +70°C 6-Terminal LGA_CAV, 13” Tape and Reel CE-6-1 4,500
ADMP401ACEZ-RL7 −40°C to +70°C 6-Terminal LGA_CAV, 7” Tape and Reel CE-6-1 1,000
EVA L-ADMP401Z Evaluation Board
EVA L-ADMP401Z-FLEX Evaluation Board

1

Z = RoHS Compliant Part.

2

The CE-6-1 package option is halide free.

Figure 13. Microphone Orientation in Tape Starting with Date Code 1213

Rev. D | Page 11 of 12

ADMP401 Data Sheet

NOTES

©2010–2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07712-0-1/12(D)

Rev. D | Page 12 of 12