FEATURES
Two Independent Controllers on One Chip
Two 2.525 V Outputs
Shutdown Inputs to Control Each Channel
2.5% Accuracy Over Line, Load, and Temperature
Low Quiescent Current
Low Shutdown Current
Works with External N-Channel MOSFETs for Low Cost
“Hiccup Mode” Fault Protection
No External Voltage or Current Setting Resistors
Small, 8-Lead SO Package
The ADM1052 is a dual, precision, voltage regulator controller
intended for power rail generation and active bus termination
on personal computer motherboards. It contains a precision
1.2 V bandgap reference and two channels consisting of control amplifiers driving external power devices. Each channel has a
shutdown input to turn off amplifier output and “Hiccup Mode”
protection circuitry for the external power device.
The ADM1052 operates from a 12 V supply. This gives sufficient headroom for the amplifiers to drive external N-channel
MOSFETs, operating as source-followers, as the external series
pass devices. This has the advantage that N-channel devices are
cheaper than P-channel devices of similar performance, and the
circuit is easier to stabilize than one using P-channel devices in
a common-source configuration.
3.3V
CC
CONTROL
AMPLIFIER
FORCE 1
SENSE 1
100F
V
OUT1
2 100F
SHDN1
SHDN2
V
CC
50A
V
CC
POWER-ON
RESET
SHUTDOWN
CONTROL
SHUTDOWN
CONTROL
CLK/DELAY
GENERATOR
GND
COMPARATOR
COMPARATOR
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
(VCC = 12 V 6%, VIN = 3.3 V, TA = 0C to 70C, both channels, unless otherwise
ADM1052–SPECIFICATIONS
ParameterMinTypMaxUnitTest Conditions/Comments
OUTPUT VOLTAGE
Channel 1, Channel 22.525VSHDN1, SHDN2 Floating
OUTPUT VOLTAGE ACCURACY–2.5+2.5%V
Load Regulation–5+5mVV
Line Regulation–5+5mVV
CONTROL AMPLIFIER
Control Amplifier Open-Loop Gain100dB
Control Amplifier Slew Rate3V/µs
Closed-Loop Settling Time5µsI
Turn-On Time5µsTo 90% of Force High Output Level (C
Sense Input Impedance
Force Output Voltage Swing, V
Force Output Voltage Swing, VF (Low)2VRL = 10 kΩ to V
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . 300°C
*This is a stress rating only and functional operation of the device at these or any
other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended
periods of time may affect reliability.
THERMAL CHARACTERISTICS
8-Lead Small Outline Package: JA = 150°C/W
ORDERING GUIDE
TemperaturePackagePackage
ModelRangeDescriptionOption
ADM1052JR0°C to 70°C8-Lead SOICSO-8
PIN FUNCTION DESCRIPTIONS
Pin
No.MnemonicFunction
1FORCE 2Output of Channel 2 control amplifier to
gate of external N-channel MOSFET.
2SENSE 2Input from source of external MOSFET to
inverting input of Channel 2 control
amplifier, via output voltage-setting feedback resistor network.
3SHDN2Digital Input. Active-low shutdown control
with 50 µA internal pull-up. The output
of Channel 2 control amplifier goes to
ground when SHDN2 is taken low.
4GNDDevice Ground Pin.
5SHDN1Digital Input. Active-low shutdown control
with 50 µA internal pull-up. The output
of Channel 1 control amplifier goes to
ground when SHDN1 is taken low.
6SENSE 1Input from source of external MOSFET
to inverting input of Channel 1 control
amplifier, via output voltage-setting
feedback resistor network.
7FORCE 1Output of Channel 2 control amplifier to
gate of external N-channel MOSFET.
8V
CC
12 V Supply.
LEAVE OPEN OR
CONNECT TO
LOGIC SIGNALS
IF SHUTDOWN
REQUIRED
SHDN1
SHDN2
12V
V
CC
ADM1052
GND
1F
FORCE 2
SENSE 2
PHD55N03LT
FORCE 1
SENSE 1
MTD3055VL
3.3V
3.3V
100F
V
OUT1
2 100F
100F
V
OUT2
2 100F
PIN CONFIGURATION
Figure 1. Test Circuit
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADM1052 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
REV. A
–3–
ADM1052
Tek Stop: 25.0MS/s 56Acqs
Stop:
–Typical Performance Characteristics
[]
T
T
2.55
2.54
2.53
T
2
v
T
3
v
1
t
Ch1 500mV Ch2 20.0mV M 2.00s Ch1 3.53V
Ch1
Ch3 20.0mV
B
W
B
W
B
W
TPC 1. Line Transient Response, Channel 1 and Channel 2
2.536
2.535
2.534
2.533
– V
OUT
V
2.532
2.531
2.530
2.529
2.9
3.03.13.23.33.43.53.63.7
VIN – V
TPC 2. Line Regulation, Channel 1
2.52
OUTPUT – V
2.51
2.50
0.20.40.60.81.01.21.41.61.8
0
CURRENT – A
TPC 4. Load Regulation, Channel 1
2.55
2.54
2.53
2.52
OUTPUT – V
2.51
2.50
0.20.40.60.81.01.21.41.61.8
0
CURRENT – A
TPC 5. Load Regulation, Channel 2
2.542
2.541
2.540
2.539
– V
OUT
V
2.538
2.537
2.536
2.535
2.9
3.03.13.23.33.43.53.63.7
VIN – V
TPC 3. Line Regulation, Channel 2
–4–
0
–10
–20
–30
–40
–50
RIPPLE REJECTION – dB
–60
–70
1001k10k100k1M10M
10
FREQUENCY – Hz
TPC 6. VCC Supply Ripple Rejection
REV. A
OUTPUT – V
2.544
2.542
2.540
2.538
2.536
2.534
Tek Stop: Single Seq 50.0MS/s
Stop:
1
t
[]
T
T
ADM1052
2.532
2.530
2.528
102030405060708090
0
TEMPERATURE – C
TPC 7. Regulator Output Voltage vs. Temperature
Tek Stop: Single Seq 50.0MS/s
Stop:
1
t
[]
T
T
t
Ch1 20.0mV M 1.00s Ch1 –45.0mV
Ch1
B
W
t
Ch1 20.0mV M 1.00s Ch1 –40mV
Ch1
B
W
TPC 10. Transient Response Channel 2, 10 mA to 2 A
Output Load Step
Tek Stop: Single Seq 50.0MS/s
Stop:
[]
T
t
1
T
t
Ch1 20.0mV M 1.00s Ch1 37.6mV
Ch1
B
W
TPC 8. Transient Response Channel 1, 10 mA to 2 A
Output Load Step
Tek Stop: Single Seq 50.0MS/s
Stop:
1
t
Ch1 20.0mV M 1.00s Ch1 5.2mV
Ch1
[]
T
T
B
W
TPC 9. Transient Response Channel 1, 2 A to 10 mA
Output Load Step
REV. A
TPC 11. Transient Response Channel 2, 2 A to 10 mA
Output Load Step
Tek Stop: 10.0kS/s 0Acqs
Stop:
t
1
t
Ch1 10.0mV M 5.00s Ch1 800mV
Ch1
[]
T
T
B
W
t
TPC 12. Force Output In Hiccup Mode, Channel 1
–5–
ADM1052
GENERAL DESCRIPTION
The ADM1052 is a dual, precision, voltage regulator controller
intended for power rail generation and active bus termination on
personal computer motherboards. It contains a precision 1.2 V
bandgap reference and two channels consisting of control amplifiers driving external power devices. Both channels have an
output of nominally 2.525 V. Each channel has a shutdown
input to turn off amplifier output and protection circuitry for
the external power device.
The ADM1052 operates from a 12 V V
disabled until V
climbs above the reset threshold (6 V–9 V). The
CC
supply. The output is
CC
output from the ADM1052 is used to drive external N-channel
MOSFETs, operating as source-followers. This has the advantage that N-channel devices are cheaper than P-channel devices
of similar performance, and the circuit is easier to stabilize than
one using P-channel devices in a common-source configuration.
The external power devices are protected by a “Hiccup Mode”
circuit that operates if the circuit goes out of regulation due to
an output short-circuit. In this case the power device is pulsed
on/off with a 1:40 duty cycle to limit the power dissipation until
the fault condition is removed.
CIRCUIT DESCRIPTION
CONTROL AMPLIFIERS
The reference voltage is amplified and buffered by the control
amplifiers and external MOSFETs, the output voltage of each
channel being determined by the feedback resistor network
between the sense input and the inverting input of the control amplifier.
A power-on reset circuit disables the amplifier output until V
CC
has risen above the reset threshold (6 V–9 V).
Each amplifier output drives the gate of an N-channel power
MOSFET, whose drain is connected to the unregulated supply
input and whose source is the regulated output voltage, which is
also fed back to the appropriate sense input of the ADM1052.
The control amplifiers have high current-drive capability so that
they can quickly charge and discharge the gate capacitance of
the external MOSFET, thus giving good transient response to
changes in load or input voltage.
SHUTDOWN INPUTS
Each channel has a separate shutdown input, which may be
controlled by a logic signal and allows the output of the regulator to be turned on or off. If the shutdown input is held high or
not connected, the regulator operates normally. If the shutdown
input is held low, the enable input of the control amplifier is turned
off and the amplifier output goes low, turning off the regulator.
“HICCUP MODE” FAULT PROTECTION
Hiccup mode fault protection is a simple method of protecting
the external power device without the added cost of external
sense resistors or a current sense pin on the ADM1052. In the
event of a short-circuit condition at the output, the output
voltage will fall. When the output voltage of a channel falls 20%
below the nominal voltage, this is sensed by the hiccup comparator and the channel will go into hiccup mode, where the
enable signal to the control amplifier is pulsed on and off with a
1:40 duty cycle.
To prevent the device inadvertently going into hiccup mode
during power-up or during channel enabling, the hiccup mode is
held off for approximately 60 ms on both channels. By this time
the output voltage should have reached its correct value. In the
case of power-up, the hold-off period starts when V
reaches the
CC
power-on reset threshold of 6 V–9 V. In the case of channel
enabling, the hold-off period starts when SHDN is taken high.
Note that the hold-off timeout applies to both channels even if
only one channel is disabled/enabled.
As the 3.3 V input to the drain of the MOSFET is not monitored, it should ideally rise at the same or a faster rate than V
At the very least it must be available in time for V
to reach its
OUT
CC
.
final value before the end of the power-on delay. If the output
voltage is still less than 80% of the correct value after the poweron delay, the device will go into hiccup mode until the output
voltage exceeds 80% of the correct value during a hiccup mode
on-period. Of course, if there is a fault condition at the output
during power-up, the device will go into hiccup mode after
the power-up delay and remain there until the fault condition
is removed.
The effect of power-on delay is illustrated in Figure 2, which
shows an ADM1052 being powered up with a fault condition.
The output current rises to a very high value during the poweron delay, the device goes into hiccup mode, and the output is
pulsed on and off at 1:40 duty cycle. When the fault condition is
removed, the output voltage recovers to its normal value at the
end of the hiccup mode off period.
The load current at which the ADM1052 will go into hiccup
mode is determined by three factors:
• The input voltage to the drain of the MOSFET, V
• The output voltage V
• The on-resistance of the MOSFET, R
I
HICCUP
(–20%)
OUT
= (VIN – (0.8 × V
ON
OUT
))/R
IN
ON
It should be emphasized that the hiccup mode is not intended as
a precise current limit but as a simple method of protecting the
external MOSFET against catastrophic fault conditions such as
output short circuits.
–6–
REV. A
12V SUPPLY
3.3V SUPPLY
TO EXTERNAL
MOSFET DRAIN
GATE DRIVE TO
EXTERNAL MOSFET
CHANNEL 1
OR CHANNEL 2
OUTPUT VOLTAGE
POR THRESHOLD
6V – 9V
V
TURN-ON
REF
THRESHOLD
MOSFET GATE
THRESHOLD
NORMAL OUTPUT VOLTAGE
HICCUP MODE
HOLD-OFF TIME
OUTPUT < 0.8 V
DEVICE
ENTERS
HICCUP MODE
REG
FAULT
CURRENT
ADM1052
FAULT
REMOVED
CHANNEL 1
OR CHANNEL 2
OUTPUT CURRENT
2 AMPS
Figure 2. Power-On Reset and Hiccup Mode
APPLICATIONS INFORMATION
PCB LAYOUT
For optimum voltage regulation, the loads should be placed as
close as possible to the source of the output MOSFETs and
feedback to the sense inputs should be taken from a point as
close to the loads as possible. The PCB tracks from the loads
back to the sense inputs should be separate from the output
tracks and not carry any load current.
12V
V
CC
FORCE 1
SENSE 1
V
3.3V
IN
FORCE 2
SENSE 2
GND
I
1
V
OUT1
LOAD 1LOAD 2
I
2
V
OUT2
V
3.3V
IN
OFFON
1:40 DUTY CYCLE
Similarly, the ground connection to the ADM1052 should be
made as close as possible to the ground of the loads, and the
ground track from the loads to the ADM1052 should not carry
load current. Correct and incorrect layout practice is illustrated
in Figure 3.
12V
V
CC
FORCE 1
SENSE 1
FORCE 2
SENSE 2
GND
I1 + I
LOAD 1
2
V
OUT1
V
OUT2
I
1
I
2
LOAD 2
VOLTAGE DROP
BETWEEN OUTPUT
AND LOAD
REV. A
CORRECT
VOLTAGE DROP
IN GROUND LEAD
INCORRECT
Figure 3. Correct and Incorrect Layout Practice
–7–
ADM1052
LEAVE OPEN OR
CONNECT TO
LOGIC SIGNALS
IF SHUTDOWN
REQUIRED
SHDN1
SHDN2
12V
V
CC
ADM1052
GND
1F
FORCE 1
SENSE 1
FORCE 2
SENSE 2
3.3V
3.3V
100F
V
OUT1
2 100F
100F
V
OUT2
2 100F
Figure 4. Typical Application Circuit
SUPPLY DECOUPLING
The supply to the drain of an external MOSFET should be decoupled
as close as possible to the drain pin of the device, with a 100 µF
capacitor to ground. The output from the source of the MOSFET
should be decoupled as close as possible to the source pin of the
device. Decoupling capacitors should be chosen to have a low
Equivalent Series Resistance (ESR). With the MOSFETs specified
and two 100 µF capacitors in parallel, the circuit will be stable for
load currents up to 2 A. The V
pin of the ADM1052 should be
CC
decoupled with a 1 µF capacitor to ground, connected as close as
possible to the V
and GND pins.
CC
In practice, the amount of decoupling required will depend on
the application. PC motherboards are notoriously noisy environments, and it may be necessary to employ distributed decoupling
to achieve acceptable noise levels on the supply rails.
CHOICE OF MOSFET
As previously discussed, the load current at which an output
goes into hiccup mode depends on the on-resistance of the
external MOSFET. If the on-resistance is too low this current
may be very high. While the Test Circuit (Figure 1) shows the
use of the lower resistance PHD55N03LT from Philips on
Channel 1 and the use of the higher resistance MTD3055VL
from Motorola on Channel 2, the MTD3055VL is, in fact,
suitable for both channels. Similarly, the PHB11N06LT from
Philips is also suitable for both channels.
THERMAL CONSIDERATIONS
Heat generated in the external MOSFET must be dissipated
and the junction temperature of the device kept within acceptable limits. The power dissipated in the device is, of course, the
drain-source voltage multiplied by the load current. The required
thermal resistance to ambient is given by
JA
= T
J(MAX)
– T
AMB(MAX)
/(V
DS(MAX)
× I
OUT(MAX)
)
Surface-mount MOSFETs such as those specified must rely on
heat conduction through the device leads and the PCB. One
square inch of copper (645 sq. mm) gives a thermal resistance of
around 60°C/W for a SOT-223 surface-mount package and
80°C/W for a SO-8 surface-mount package.
For higher power dissipation than can be accommodated by a
surface-mount package D
2
PAK or TO-220 devices are recommended. These should be mounted on a heatsink with a thermal
resistance low enough to maintain the required maximum junction temperature.
C02127–0–1/01 (rev. A)
0.1574 (4.00)
0.1497 (3.80)
PIN 1
0.0098 (0.25)
0.0040 (0.10)
SEATING
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
8-Lead Small Outline Package
(Narrow Body, SO-8)
0.1968 (5.00)
0.1890 (4.80)
85
0.0500 (1.27)
PLANE
0.2440 (6.20)
0.2284 (5.80)
41
BSC
0.0192 (0.49)
0.0138 (0.35)
0.0688 (1.75)
0.0532 (1.35)
0.0098 (0.25)
0.0075 (0.19)
–8–
0.0196 (0.50)
0.0099 (0.25)
8
0.0500 (1.27)
0
0.0160 (0.41)
PRINTED IN U.S.A.
45
REV. A
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.