Datasheet ADL5606 Datasheet (ANALOG DEVICES)

Page 1
1800 MHz to 2700 MHz,

FEATURES

Operation from 1800 MHz to 2700 MHz Gain of 24.3 dB at 2140 MHz OIP3 of 45.5 dBm at 2140 MHz P1dB of 30.8 dBm at 2140 MHz Noise figure of 4.7 dB at 2140 MHz Power supply: 5 V Power supply current: 362 mA typical Internal active biasing Fast power-up/power-down function Compact 4 mm × 4 mm, 16-lead LFCSP ESD rating of ±1 kV (Class 1C) Pin-compatible with the ADL5605 (700 MHz to 1000 MHz)

APPLICATIONS

Wireless infrastructure Automated test equipment ISM/AMR applications

GENERAL DESCRIPTION

The ADL5606 is a broadband, two-stage, 1 W RF driver amplifier that operates over a frequency range of 1800 MHz to 2700 MHz. The device can be used in a wide variety of wired and wireless applications, including ISM, MC-GSM, W-CDMA, TD-SCDMA, and LTE.
The ADL5606 operates on a 5 V supply voltage and a supply current of 362 mA. The driver also incorporates a fast power­up/power-down function for TDD applications, applications that require a power saving mode, and applications that intermittently transmit data.
The ADL5606 is fabricated on a GaAs HBT process and is packaged in a compact 4 mm × 4 mm, 16-lead LFCSP that uses an exposed paddle for excellent thermal impedance. The
ADL5606 operates from −40°C to +85°C. A fully populated
evaluation board tuned to 2140 MHz is also available.
1 W RF Driver Amplifier

FUNCTIONAL BLOCK DIAGRAM

NC
NC
NC
NC
14
13
15
16
1RFIN
PWDN
2DISABLE
3VCC
4VBIAS
0
–10
–20
–30
–40
ACPR (dBc)
–50
–60
–70
–80
0 2 4 6 8 10121416182022
Figure 2. ACPR vs. Output Power, 3GPP, TM1-64, at 2140 MHz
VBIAS
ADL5606
5
6
NC
NC
Figure 1.
2140 MHz
P
OUT
7
NC
(dBm)
8
NC
ADL5606
12 RFOUT
11 RFOUT
10 RFOUT
9RFOUT
09968-001
09968-002
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2011 Analog Devices, Inc. All rights reserved.
Page 2
ADL5606

TABLE OF CONTENTS

Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Typical Scattering Parameters ..................................................... 4
Absolute Maximum Ratings ............................................................ 6
Thermal Resistance ...................................................................... 6
ESD Caution .................................................................................. 6
Pin Configuration and Function Descriptions ............................. 7
Typical Performance Characteristics ............................................. 8
1960 MHz Frequency Tuning Band ........................................... 8

REVISION HISTORY

7/11—Revision 0: Initial Version
2140 MHz Frequency Tuning Band ............................................9
2630 MHz Frequency Tuning Band ......................................... 10
General......................................................................................... 11
Applications Information .............................................................. 13
Basic Layout Connections ......................................................... 13
ADL5606 Matching .................................................................... 14
ACPR and EVM ......................................................................... 15
Thermal Considerations ............................................................ 15
Soldering Information and Recommended PCB Land
Pattern .......................................................................................... 15
Evaluation Board ............................................................................ 16
Outline Dimensions ....................................................................... 18
Ordering Guide .......................................................................... 18
Rev. 0 | Page 2 of 20
Page 3
ADL5606

SPECIFICATIONS

VCC1 = 5 V and TA = 25°C, unless otherwise noted.1
Table 1.
Parameter Test Conditions/Comments Min Typ Max Unit
OVERALL FUNCTION
Frequency Range 1800 2700 MHz
FREQUENCY = 1960 MHz ± 30 MHz
Gain 24.7 dB
vs. Frequency ±30 MHz ±0.5 dB vs. Temperature −40°C ≤ TA ≤ +85°C ±0.9 dB vs. Supply 4.75 V to 5.25 V ±0.05 dB
Output 1 dB Compression Point (P1dB) 30.2 dBm
vs. Frequency ±30 MHz +0.2/−0.6 dB vs. Temperature −40°C ≤ TA ≤ +85°C ±0.5 dB
vs. Supply 4.75 V to 5.25 V ±0.5 dB Adjacent Channel Power Ratio (ACPR) P Output Third-Order Intercept (OIP3) ∆f = 1 MHz, P
vs. Frequency ±30 MHz +0.8/−0.2 dB
vs. Temperature −40°C ≤ TA ≤ +85°C +0.0/−2.2 dB
vs. Supply 4.75 V to 5.25 V ±0.5 dB Noise Figure 5.1 dB
FREQUENCY = 2140 MHz ± 30 MHz
Gain 24.3 dB
vs. Frequency ±30 MHz +0.4/−0.1 dB
vs. Temperature −40°C ≤ TA ≤ +85°C ±0.9 dB
vs. Supply 4.75 V to 5.25 V ±0.06 dB Output 1 dB Compression Point (P1dB) 30.8 dBm
vs. Frequency ±30 MHz ±0.5 dB
vs. Temperature −40°C ≤ TA ≤ +85°C ±0.8 dB
vs. Supply 4.75 V to 5.25 V ±0.4 dB Adjacent Channel Power Ratio (ACPR) P Output Third-Order Intercept (OIP3) ∆f = 1 MHz, P
vs. Frequency ±30 MHz +2.3/−0.8 dB
vs. Temperature −40°C ≤ TA ≤ +85°C +0.0/−2.5 dB
vs. Supply 4.75 V to 5.25 V +0.6/−0.3 dB Noise Figure 4.7 dB
FREQUENCY = 2630 MHz ± 60 MHz
Gain 20.6 dB
vs. Frequency ±60 MHz +0.7/−1.8 dB
vs. Temperature −40°C ≤ TA ≤ +85°C ±1.0 dB
vs. Supply 4.75 V to 5.25 V ±0.09 dB Output 1 dB Compression Point (P1dB) 28.9 dBm
vs. Frequency ±60 MHz +0.5/−1.7 dB
vs. Temperature −40°C ≤ TA ≤ +85°C +1.2/−2.0 dB
vs. Supply 4.75 V to 5.25 V ±0.2 dB Output Third-Order Intercept (OIP3) ∆f = 1 MHz, P
vs. Frequency ±60 MHz ±3.0 dB
vs. Temperature −40°C ≤ TA ≤ +85°C +0.3/−4.0 dB
vs. Supply 4.75 V to 5.25 V ±1.9 dB Noise Figure 5.1 dB
= 18 dBm, one-carrier W-CDMA, 64 DPCH 52 dBc
OUT
= 14 dBm per tone 45.6 dBm
OUT
= 18 dBm, one-carrier W-CDMA, 64 DPCH 51 dBc
OUT
= 14 dBm per tone 45.5 dBm
OUT
= 14 dBm per tone 43.2 dBm
OUT
Rev. 0 | Page 3 of 20
Page 4
ADL5606
Parameter Test Conditions/Comments Min Typ Max Unit
POWER-DOWN INTERFACE DISABLE pin
Logic Level to Enable V Logic Level to Disable V DISABLE Pin Current V VCC1 Pin Current
1
Enable Time 10% of control pulse to 90% of RFOUT 75 ns Disable Time 10% of control pulse to 90% of RFOUT 20 ns
POWER INTERFACE RFOUT pin
Supply Voltage 4.75 5 5.25 V Supply Current 362 390 mA
vs. Temperature −40°C ≤ TA ≤ +85°C +0/−25 mA
1
VCC1 is the supply to the DUT through the RFOUT pins.

TYPICAL SCATTERING PARAMETERS

VCC1 = 5 V and TA = 25°C; the effects of the test fixture have been de-embedded up to the pins of the device.1
Table 2.
Frequency (MHz)
Magnitude (dB) Angle (°) Magnitude (dB) Angle (°) Magnitude (dB) Angle (°) Magnitude (dB) Angle (°)
1000 −5.94 1.63 25.77 42.78 −64.90 91.56 −1.68 179.86 1050 −7.09 −24.39 25.28 25.40 −63.13 114.08 −1.63 179.29 1100 −7.74 −48.66 24.68 10.90 −58.63 108.53 −1.54 178.87 1150 −7.94 −69.86 23.97 −1.40 −58.57 98.35 −1.53 178.32 1200 −7.82 −87.28 23.32 −12.01 −59.58 114.37 −1.53 177.95 1250 −7.46 −100.72 22.71 −21.44 −55.02 106.02 −1.46 177.27 1300 −7.06 −111.67 22.14 −29.87 −52.50 102.74 −1.45 176.60 1350 −6.70 −120.51 21.64 −37.10 −54.05 91.45 −1.43 176.34 1400 −6.38 −126.95 21.16 −44.03 −53.01 111.40 −1.39 175.90 1450 −6.08 −133.47 20.75 −50.61 −51.79 83.98 −1.35 175.36 1500 −5.76 −138.12 20.33 −56.84 −53.89 111.28 −1.38 174.93 1550 −5.47 −142.70 19.98 −62.62 −53.41 117.99 −1.35 174.51 1600 −5.24 −146.61 19.67 −68.33 −53.37 76.10 −1.34 174.16 1650 −5.02 −150.10 19.36 −73.72 −51.35 87.47 −1.30 173.84 1700 −4.76 −153.11 19.07 −79.01 −50.65 92.39 −1.26 173.35 1750 −4.58 −155.89 18.79 −83.92 −50.70 83.18 −1.24 173.01 1800 −4.42 −158.41 18.52 −88.97 −51.02 92.52 −1.23 172.59 1850 −4.25 −160.75 18.28 −93.94 −50.59 93.13 −1.23 172.28 1900 −4.11 −162.84 18.01 −98.66 −50.81 82.49 −1.21 171.75 1950 −3.97 −164.79 17.78 −103.29 −50.52 90.57 −1.18 171.61 2000 −3.82 −166.56 17.56 −107.86 −52.43 75.32 −1.19 171.19 2050 −3.72 −168.58 17.34 −112.42 −49.77 80.61 −1.17 170.99 2100 −3.61 −170.35 17.13 −116.91 −50.35 81.31 −1.16 170.70 2150 −3.50 −172.01 16.90 −121.14 −49.72 83.35 −1.16 170.44 2200 −3.42 −173.71 16.68 −125.59 −50.21 87.74 −1.16 170.09 2250 −3.36 −175.63 16.47 −129.80 −47.59 82.95 −1.17 169.84 2300 −3.28 −177.44 16.27 −134.15 −47.62 88.25 −1.14 169.46 2350 −3.23 −179.05 16.02 −138.14 −48.93 79.29 −1.16 169.27 2400 −3.23 179.33 15.79 −142.35 −49.37 83.50 −1.18 169.01 2450 −3.19 177.86 15.58 −146.40 −48.09 75.23 −1.18 168.72 2500 −3.15 176.27 15.37 −150.40 −47.72 78.72 −1.16 168.34 2550 −3.17 174.60 15.15 −154.46 −47.40 76.72 −1.18 168.15
S11 S21 S12 S22
decreasing 0 1.1 V
DISABLE
increasing 1.4 5 V
DISABLE
= 5 V 1.4 mA
DISABLE
V
= 5 V 4.2 mA
DISABLE
Rev. 0 | Page 4 of 20
Page 5
ADL5606
Frequency (MHz)
Magnitude (dB) Angle (°) Magnitude (dB) Angle (°) Magnitude (dB) Angle (°) Magnitude (dB) Angle (°)
2600 −3.14 172.86 14.92 −158.40 −46.51 77.12 −1.20 167.77 2650 −3.14 171.24 14.70 −162.27 −47.66 73.90 −1.20 167.47 2700 −3.12 169.74 14.48 −166.06 −47.77 71.80 −1.22 167.16 2750 −3.14 167.93 14.24 −169.97 −45.35 73.70 −1.22 166.68 2800 −3.16 166.21 13.98 −173.76 −45.43 76.05 −1.24 166.34 2850 −3.15 164.65 13.78 −177.32 −46.35 71.78 −1.25 166.25 2900 −3.15 162.67 13.53 178.93 −46.92 73.31 −1.26 165.90 2950 −3.15 160.86 13.27 175.30 −45.88 70.64 −1.30 165.58 3000 −3.14 159.03 13.04 171.76 −45.94 66.79 −1.29 165.35 3050 −3.13 157.22 12.79 168.32 −45.60 73.37 −1.33 165.06 3100 −3.08 155.39 12.57 165.01 −44.06 61.32 −1.35 164.76 3150 −3.01 152.90 12.32 161.32 −45.54 58.34 −1.36 164.32 3200 −3.08 150.72 12.04 157.39 −46.51 60.72 −1.36 163.65 3250 −3.06 149.25 11.78 153.80 −43.87 61.02 −1.35 163.38 3300 −3.05 147.28 11.53 150.59 −44.31 68.64 −1.36 162.94 3350 −3.03 145.53 11.20 147.57 −44.17 62.82 −1.39 162.61 3400 −2.94 143.76 10.95 144.00 −43.67 64.76 −1.39 162.08 3450 −2.95 141.94 10.65 141.12 −44.65 72.58 −1.39 161.92 3500 −2.85 140.04 10.39 137.78 −44.52 53.43 −1.38 161.39 3550 −2.83 138.58 10.10 134.68 −44.22 63.44 −1.35 161.11 3600 −2.79 136.47 9.83 131.38 −43.79 46.56 −1.36 160.74 3650 −2.74 134.67 9.55 128.32 −42.04 50.76 −1.31 160.48 3700 −2.78 132.80 9.25 125.07 −43.97 57.92 −1.33 160.24 3750 −2.80 130.85 8.94 121.74 −42.96 49.24 −1.30 159.79 3800 −2.87 128.85 8.63 119.06 −43.01 51.05 −1.30 159.68 3850 −3.03 126.98 8.30 115.71 −41.84 45.82 −1.24 159.28 3900 −3.24 125.26 7.90 113.11 −41.50 36.66 −1.26 159.17 3950 −3.63 123.34 7.59 110.08 −42.15 39.82 −1.20 159.15 4000 −4.24 122.71 7.15 108.11 −41.81 41.17 −1.21 159.19
1
VCC1 is the supply to the DUT through the RFOUT pins.
S11 S21 S12 S22
Rev. 0 | Page 5 of 20
Page 6
ADL5606

ABSOLUTE MAXIMUM RATINGS

Table 3.
Parameter Rating
Supply Voltage, VCC11 6.5 V Input Power (50 Ω Impedance) 18 dBm Internal Power Dissipation (Paddle Soldered) 3.5 W Maximum Junction Temperature 150°C Lead Temperature (Soldering 60 sec) 240°C Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +150°C
1
VCC1 is the supply to the DUT through the RFOUT pins.
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

THERMAL RESISTANCE

Tabl e 4 lists the junction-to-air thermal resistance (θJA) and the junction-to-paddle thermal resistance (θ
) for the ADL5606.
JC
For more information, see the Thermal Considerations section.
Table 4. Thermal Resistance
Package Type θJA θ
Unit
JC
16-Lead LFCSP (CP-16-10) 52.9 12.9 °C/W

ESD CAUTION

Rev. 0 | Page 6 of 20
Page 7
ADL5606

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

NC
NC
NC
NC
14
13
15
16
PIN 1 INDICATOR
1RF IN
2DISABLE
ADL5606
3VCC
TOP VIEW
(Not to Scale)
4VBIAS
5
6
NC
NC
NOTES
1. THE EXPOSED PADDLE SHOULD BE SOLDERED TO A LOW IMPEDANCE EL ECTRICAL AND T HERMAL GROUND PLANE.
2. NC = NO CONNEC T. DO NOT CONNECT TO THIS PIN.
Figure 3. Pin Configuration
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
1 RFIN RF Input. Requires a dc blocking capacitor. 2 DISABLE
Connect this pin to 5 V to disable the part. In the disabled state, the part draws approximately 4 mA of current from the power supply and 1.4 mA from the DISABLE pin.
3 VCC
Under normal operation, this pin is connected to the power supply and draws a combined 362 mA of current. When this pin is grounded along with the VBIAS pin, the device is disabled and draws
approximately 1.4 mA from the DISABLE pin. 4 VBIAS Applying 5 V to this pin enables the bias circuit. When this pin is grounded, the device is disabled. 5, 6, 7, 8, 13,
NC No Connect. Do not connect to this pin.
14, 15, 16 9, 10, 11, 12 RFOUT
RF Output. DC bias is provided to this pin through an inductor that is connected to the 5 V power
supply. The RF path requires a dc blocking capacitor. EP The exposed paddle should be soldered to a low impedance electrical and thermal ground plane.
7
NC
8
NC
12 RFOUT
11 R FOUT
10 RFOUT
9RFOUT
09968-003
Rev. 0 | Page 7 of 20
Page 8
ADL5606

TYPICAL PERFORMANCE CHARACTERISTICS

1960 MHZ FREQUENCY TUNING BAND

50
45
40
35
30
25
20
15
10
5
NOISE FIGURE, GAIN, P1dB, OIP3 (dB, dBm)
0 1930 1990
1940 1950 1960 1970 1980
OIP3 (dBm)
P1dB (dBm)
GAIN (dB)
NF (dB)
FREQUENCY (MHz)
Figure 4. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency
(OIP3 at P
= 14 dBm per Tone)
OUT
46
44
42
40
38
36
34
P1dB (dBm)
32
30
28
26
1930 1940 1950 1960 1970 1980 1990
09968-004
+25°C
+85°C
–40°C
+25°C
–40°C
+85°C
FREQUENCY (MHz )
Figure 7. P1dB and OIP3 vs. Frequency and Temperature
(OIP3 at P
= 14 dBm per Tone)
OUT
50
48
46
44
42
40
38
OIP3 (dBm)
36
34
32
30
09968-007
26.5
26.0
25.5
25.0
24.5
GAIN (dB)
24.0
23.5
23.0
22.5 1930 1940 1950 1960 1970 1980 1990
–40°C
+25°C
+85°C
FREQUENCY (MHz )
Figure 5. Gain vs. Frequency and Temperature
0
S22
–10
–20
–30
–40
S-PARAMETERS ( dB)
–50
S11
S12
48
1930MHz 1960MHz
47
1990MHz
46
45
44
OIP3 (dBm)
43
42
41
40
–5 0 5 10 15 20
09968-005
Figure 8. OIP3 vs. P
7
6
5
NOISE FIGURE (dB)
4
P
PER TONE (d Bm)
OUT
OUT
+85°C
+25°C
–40°C
09968-008
and Frequency
–60
1930 1990
1940 1950 1960 1970 1980
FREQUENCY (MHz )
Figure 6. Input Return Loss (S11), Output Return Loss (S22),
and Reverse Isolation (S12) vs. Frequency
09968-006
Rev. 0 | Page 8 of 20
3
1940 1950 1960 1970 1980
1930 1990
FREQUENCY (MHz )
Figure 9. Noise Figure vs. Frequency and Temperature
09968-009
Page 9
ADL5606

2140 MHZ FREQUENCY TUNING BAND

60
50
40
30
20
10
NOISE FIGURE, GAIN, P1dB, OIP3 (dB, dBm)
0
2120 2130 2140 2150 2160
2110 2170
OIP3 (dBm)
P1dB (dBm)
GAIN (dB)
NF (dB)
FREQUENCY (MHz)
Figure 10. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency
(OIP3 at P
= 14 dBm per Tone)
OUT
46
44
42
40
38
36
34
P1dB (dBm)
32
30
28
26
2110 2120 2130 2140 2150 2160 2170
09968-010
FREQUENCY (MHz)
+25°C
+25°C
–40°C
+85°C
–40°C
+85°C
Figure 13. P1dB and OIP3 vs. Frequency and Temperature
(OIP3 at P
= 14 dBm per Tone)
OUT
50
48
46
44
42
40
38
OIP3 (dBm)
36
34
32
30
09968-013
28
27
26
25
24
GAIN (dB)
23
22
21
20
2110 2120 2130 2140 2150 2160 2170
–40°C
+25°C
+85°C
FREQUENCY (MHz )
Figure 11. Gain vs. Frequency and Temperature
0
–10
–20
–30
S22
S11
50
48
46
44
42
40
38
OIP3 (dBm)
36
34
32
30
09968-011
2110MHz 2140MHz 2170MHz
–5 0 5 10 15 20
Figure 14. OIP3 vs. P
7
6
5
P
PER TONE (d Bm)
OUT
and Frequency
OUT
+85°C
+25°C
09968-014
–40
S-PARAMETERS (d B)
–50
–60
2110 2170
2120 2130 2140 2150 2160
FREQUENCY (MHz )
Figure 12. Input Return Loss (S11), Output Return Loss (S22),
and Reverse Isolation (S12) vs. Frequency
S12
09968-012
Rev. 0 | Page 9 of 20
NOISE FIGURE (dB)
4
3
2120 2130 2140 2150 2160
2110 2170
FREQUENCY (MHz )
–40°C
Figure 15. Noise Figure vs. Frequency and Temperature
09968-015
Page 10
ADL5606

2630 MHZ FREQUENCY TUNING BAND

60
50
40
30
20
10
NOISE FIGURE, GAIN, P1dB, OIP3 (dB, dBm)
0 2570 2690
2590 2610 2630 2650
OIP3 (dBm)
P1dB (dBm)
GAIN (dB)
NF (dB)
2670
FREQUENCY ( MHz)
Figure 16. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency
(OIP3 at P
= 14 dBm per Tone)
OUT
09968-016
52
49
46
43
40
37
34
P1dB (dBm)
31
28
25
22
2570 2590 2610 2630 2650 2670 2690
+25°C
+25°C
–40°C
+85°C
–40°C
+85°C
FREQUENCY ( MHz)
Figure 19. P1dB and OIP3 vs. Frequency and Temperature
(OIP3 at P
= 14 dBm per Tone)
OUT
54
51
48
45
42
39
36
OIP3 (dBm)
33
30
27
24
09968-019
23.0
22.5
22.0
21.5
21.0
20.5
20.0
19.5
GAIN (dB)
19.0
18.5
18.0
17.5
17.0 2570 2690
2590 2610 2630 2650
FREQUENCY ( MHz)
–40°C
+25°C
+85°C
2670
Figure 17. Gain vs. Frequency and Temperature
0
–10
–20
–30
–40
S-PARAMETERS (dB)
–50
S22
S11
S12
49
47
45
43
41
OIP3 (dBm)
39
37
2570MHz 2630MHz 2690MHz
35
09968-017
–5 20
7
6
5
NOISE FIGURE (dB)
4
051015
P
PER TONE (dBm)
OUT
Figure 20. OIP3 vs. P
and Frequency
OUT
+85°C
+25°C
–40°C
09968-020
–60
2570 2690
2590 2610 2630 2650
FREQUENCY ( MHz)
Figure 18. Input Return Loss (S11), Output Return Loss (S22),
and Reverse Isolation (S12) vs. Frequency
2670
09968-018
Rev. 0 | Page 10 of 20
3
2590 2610 2630 2650
2570 2690
FREQUENCY ( MHz)
2670
Figure 21. Noise Figure vs. Frequency and Temperature
09968-021
Page 11
ADL5606

GENERAL

35
30
30
25
20
15
PERCENTAGE (%)
10
5
0
43.0 43.5 44.0 44.5 45.0 45.5 46.0 46.5 47.0 47.5 OIP3 (dBm)
Figure 22. OIP3 Distribution at 2140 MHz, 14 dBm per Tone
35
30
25
20
15
PERCENTAGE (%)
10
5
25
20
15
10
PERCENTAGE (%)
5
0
09968-022
4.66 4.68 4.70 4.72 4.74 4.76 4.78 4.80 4.82 NOISE FI GURE (dB)
09968-025
Figure 25. Noise Figure Distribution at 2140 MHz
0
–10
–20
–30
–40
ACPR (dBc)
–50
–60
–70
1960MHz
2140MHz
0
29.8 30.0 30.2 30.4 30.6 30.8 31.0 31.2 31.4 31.6 P1dB (dBm)
Figure 23. P1dB Distribution at 2140 MHz
35
30
25
20
15
PERCENTAGE (%)
10
5
0
23.4 23.6 23.8 24.0 24.2 24.4 24.6 24.8 25.0
GAIN (dB)
Figure 24. Gain Distribution at 2140 MHz
09968-023
09968-024
Rev. 0 | Page 11 of 20
–80
0 2 4 6 8 10121416182022
Figure 26. ACPR vs. P
3.5
3.0
2.5
2.0
EVM (%)
1.5
1.0
0.5
0
10–5 0 5 10152025
Figure 27. EVM vs. P
OUT
OUT
P
(dBm)
OUT
, 3GPP, TM1-64, at 1960 MHz and 2140 MHz
1960MHz
2140MHz
P
(dBm)
OUT
, 3GPP, TM1-64, at 1960 MHz and 2140 MHz
09968-026
9968-027
Page 12
ADL5606
375
370
365
360
355
350
SUPPLY CURRENT (mA)
345
340
–40 –20 0 20 40 60 80
5.25V
TEMPERATURE (°C)
4.75V
5V
09968-028
Figure 28. Supply Current vs. Temperature and Supply Voltage at 2140 MHz
3
3
2
CH3 1V
CH2 1V
M20ns 10GS/ s IT 4ps/p t A CH2 2.5V
Figure 30. Turn-On Time, 10% of Control Pulse to 90% of RFOUT
9968-030
2
CH3 1V
CH2 1V
M20ns 10GS/ s IT 4ps/p t A CH2 2.5V
Figure 29. Turn-Off Time, 10% of Control Pulse to 90% of RFOUT
9968-029
Rev. 0 | Page 12 of 20
Page 13
ADL5606

APPLICATIONS INFORMATION

BASIC LAYOUT CONNECTIONS

The basic connections for operating the ADL5606 are shown in Figure 31. The RF matching components correspond to the 2140 MHz frequency tuning band.

Power Supply

The voltage supply for the ADL5606, which ranges from 4.75 V to 5.25 V, should be connected to the VCC1 test pin. The dc bias to the output stage is supplied through L1 and is connected to the RFOUT pin. Three decoupling capacitors (C7, C8, and C9) are used to prevent RF signals from propagating on the dc lines. The VBIAS and VCC pins can be directly connected to the main supply voltage. Additional decoupling capacitors (C5, C6, and C11) are required on the VCC pin.

RF Input Interface

Pin 1 is the RF input pin for the ADL5606. The RF input is easily matched with one capacitor, in a series or shunt configuration, and a microstrip line used as an inductor. For the 1960 MHz and 2140 MHz frequency tuning bands, a shunt capacitor is used to match the input to 50 Ω; for the 2630 MHz frequency tuning band, a series capacitor is used.
For complete information about component values and spacing for the different frequency tuning bands, see the ADL5606 Matching section.

RF Output Interface

Pin 9 to Pin 12 are the RF output pins. The RF output requires only one shunt capacitor and a microstrip line used as an inductor to match to 50 Ω. For complete information about component values and spacing for the different frequency tuning bands, see the ADL5606 Matching section.

Power-Down

The ADL5606 can be disabled by connecting the DISABLE pin to 5 V. When disabled, the ADL5606 draws approximately 4 mA of current from the power supply and 1.4 mA from the DISABLE pin. Decoupling Capacitor C3 is recommended to prevent the propagation of RF signals. To completely shut down the device, connect the VCC pin, the VBIAS pin, and the VCC1 test pin to ground. In this state, the part draws approximately 1.4 mA from the DISABLE pin.
RFIN
DISABLE
VCC
C11 10µF
C1
20pF
C6
0.01µF
C3 10pF
C
IN
1.3pF
C5 100pF
NC NC NC NC
1
RFIN
DISABLE
2
ADL5606
VCC
3
VBIAS
4
NC NC NC NC
13
RFOUT
RFOUT
RFOUT
RFOUT
8147156165
12
11
10
9
VCC1
L1 18nH
C7
100pF
C8
0.01µF
C9
10µF
C
OUT
3.9pF
C2
20pF
RFOUT
09968-031
Figure 31. Basic Connections
Rev. 0 | Page 13 of 20
Page 14
ADL5606

ADL5606 MATCHING

The RF input and output of the ADL5606 can be easily matched to 50 Ω with at most one external component and the micro­strip line used as an inductor. Tab le 6 lists the required matching component values. Capacitors C series (0402 size).
For all frequency tuning bands, the placement of C is critical. Table 7 lists the recommended component spacing for the various frequency tuning bands. The component spacing is referenced from the center of the component to the edge of the package.
Figure 32 to Figure 34 show the matching networks.
RFIN
20pF
and C
IN
C1
C
IN
2pF
are Murata GRM155
OUT
and C
IN
16
NC NC NC NC
1
2
RFIN
DISABLE
λ
1
OUT
ADL5606
Table 6. Recommended Components for Basic Connections
Frequency (MHz) CIN (pF) C
OUT
(pF)
1930 to 1990 2.0 3.6 2110 to 2170 1.3 3.9 2570 to 2690 2.0 3.3
Table 7. Matching Component Spacing
Frequency (MHz) λ1 (mils) λ2 (mils)
1930 to 1990 394 197 2110 to 2170 268 138 2570 to 2690 382 83
131415
12
RFOUT
L1 18nH
C
OUT
3.6pF
C2
20pF
RFOUT
RFOUT
RFOUT
RFOUT
11
10
9
λ
2
09968-032
Figure 32. ADL5606 Match Parameters, 1960 MHz Frequency Tuning Band
RFIN
C1
20pF
C
1.3pF
16
NC NC NC NC
1
2
RFIN
DISABLE
λ
1
IN
ADL5606
Figure 33. ADL5606 Match Parameters, 2140 MHz Frequency Tuning Band
131415
RFOUT
RFOUT
RFOUT
RFOUT
12
L1 18nH
C
OUT
3.9pF
C2
20pF
RFOUT
09968-033
11
10
9
λ
2
RFIN
C1
20pF
C
2pF
16
NC NC NC NC
1
2
RFIN
DISABLE
λ
1
IN
ADL5606
131415
RFOUT
RFOUT
RFOUT
RFOUT
12
L1 18nH
C
OUT
3.3pF
C2
20pF
RFOUT
11
10
9
λ
2
09968-034
Figure 34. ADL5606 Match Parameters, 2630 MHz Frequency Tuning Band
Rev. 0 | Page 14 of 20
Page 15
ADL5606

ACPR AND EVM

All adjacent channel power ratio (ACPR) and error vector magnitude (EVM) measurements were made using a single W-CDMA carrier and Test Model 1-64.
The signal is generated by a very low ACPR source and is meas­ured at the output by a high dynamic range spectrum analyzer. For ACPR measurements, the filter setting was chosen for low ACPR; for EVM measurements, the low EVM setting was selected. The spectrum analyzer incorporates an instrument noise correc­tion function, and highly linear amplifiers were used to boost the power levels for ACPR measurements.
Figure 26 shows ACPR vs. P For power levels up to 18 dBm, an ACPR of 50 dBc or better can be achieved at 1960 MHz and 2140 MHz.
Figure 27 shows EVM vs. P The EVM measured is 0.5% for power levels up to 18 dBm at 1960 MHz and 2140 MHz. The baseline composite EVM for the signal source was approximately 0.5%. When operated in the linear region, there is little or no contribution to EVM by the amplifier.
at 1960 MHz and 2140 MHz.
OUT
at 1960 MHz and 2140 MHz.
OUT
For optimal performance, it is recommended that the thermal vias be filled with a conductive paste of the equivalent thermal conductivity specified earlier in this section; alternatively, an external heat sink can be used to dissipate heat quickly without affecting the die junction temperature. It is also recommended that the ground pattern be extended above and below the device to improve thermal efficiency (see Figure 35).

SOLDERING INFORMATION AND RECOMMENDED PCB LAND PATTERN

Figure 35 shows the recommended land pattern for the ADL5606. To minimize thermal impedance, the exposed paddle on the 4 mm × 4 mm LFCSP is soldered to a ground plane along with Pin 5 to Pin 8 and Pin 13 to Pin 16. To improve thermal dissi­pation, 25 thermal vias are arranged in a 5 × 5 array under the exposed paddle. Areas above and below the paddle are tied with regular vias. If multiple ground layers exist, they should be tied together using vias. For more information about land pattern design and layout, see the AN-772 Application Note, A Design
and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP).

THERMAL CONSIDERATIONS

The ADL5606 is packaged in a thermally efficient 4 mm × 4 mm, 16-lead LFCSP. The thermal resistance from junction to air (θ was extracted assuming a standard 4-layer JEDEC board with 25 copper plated thermal vias. The thermal vias are filled with conductive copper paste (AE3030 with thermal conductivity of
7.8 W/mK and thermal expansion α1 of 4 × 10
8.6 × 10 is 12.9°C/W, where the case is the exposed pad of the lead frame package.
For the best thermal performance, it is recommended that as many thermal vias as possible be added under the exposed pad of the LFCSP. The thermal resistance values assume a minimum of 25 thermal vias arranged in a 5 × 5 array with a via diameter of 8 mils, via pad of 16 mils, and a pitch of 20 mils. The vias are plated with copper, and the drill hole is filled with a conductive copper paste.
) is 52.9°C/W. The thermal resistance for the product
JA
−5
−5
/°C). The thermal resistance from junction to case (θJC)
/°C and α2 of
RFIN
16 MIL VIA PAD WITH 8 MIL VIA
Figure 35. Recommended Land Pattern
16 13
RFOUT
58
09968-035
Rev. 0 | Page 15 of 20
Page 16
ADL5606

EVALUATION BOARD

The schematic of the ADL5606 evaluation board is shown in Figure 36. The evaluation board uses 25 mils wide, 50  traces and is made from IS410 material with a 20 mils gap to ground. The evaluation board is tuned for operation at 2140 MHz. The inputs and outputs should be ac-coupled with appropriately sized capacitors; therefore, for low frequency applications, the value of C1 and C2 may need to be increased. DC bias is provided to the output stage via an inductor (L1) connected to the RFOUT pin. A bias voltage of 5 V is recommended.
The evaluation board has a short, non-50  line on its output to accommodate the four output pins and to allow for easier low inductance output matching. The pads for Pin 9 to Pin 12 are included on this microstrip line and are included in all matches. The evaluation board uses numbers as identifiers to aid in the placement of matching components at both the RF input and RF output of the device. Figure 37 and Figure 38 show images of the board layout.
13
RFOUT
RFOUT
RFOUT
RFOUT
8147156165
12
11
10
9
VCC1
L1 18nH
C7
100pF
C8
0.01µF
C9
10µF
C
OUT
3.9pF
C2
20pF
RFOUT
09968-036
VCC3
R4
OPEN
DISABLE
R1 0
VCC2
RFIN
OPEN
R5
C10 OPEN
C11 10µF
C1
20pF
C4 OPEN
C6
0.01µF
C14 OPEN
C3 10pF
C
IN
1.3pF
C5 100pF
C13 OPEN
C12 OPEN
R2 0
1
2
3
4
NC NC NC NC
RFIN
DISABLE
ADL5606
VCC
VBIAS
NC NC NC NC
Figure 36. Evaluation Board, 2140 MHz Frequency Tuning Band
Table 8. Evaluation Board Configuration Options, 2140 MHz Frequency Tuning Band
Component Function/Notes Default Value
C1, C2 Input/output dc blocking capacitors. C1, C2 = 20 pF C3, C4, C5, C6, C7,
C8, C9, C10, C11, C12, C13, C14
Power supply decoupling capacitors. Power supply decoupling capacitors are required to filter out the high frequency noise on the power supply. The smallest capacitor should be the closest to the ADL5606. The main bias that goes through RFOUT is the most sensitive to noise because the bias is connected directly to the RF output. For the 1960 MHz and 2140 MHz frequency tuning bands, Capacitors C12, C13, and C14 are open; for the 2630 MHz frequency tuning band, it is recommended that the bypassing capacitors be added as follows:
C3 = 10 pF C5, C7 = 100 pF C6, C8 = 0.01 μF C9, C11 = 10 μF C4, C10, C12, C13, C14 = open
C12 = 100 pF, C13 = 0.01 μF, and C14 = 10 μF.
CIN
Input matching capacitor. To match the ADL5606 at the 2140 MHz frequency tuning band, Shunt Capacitor C
is required at a distance of 268 mils. If space is at a premium, an inductor
IN
C
= 1.3 pF HQ
IN
can take the place of the microstrip line.
C
OUT
Output matching capacitor. C
is set at a specific distance from the device so that the micro-
OUT
= 3.9 pF HQ
C
OUT
strip line can act as inductance for the matching network (see Ta ble 7 ). If space is at a premium, an inductor can take the place of the microstrip line. A short length of low impedance line on the output is embedded in the match.
L1
The main bias for the ADL5606 comes through L1 to the output stage. L1 should be high
L1 = 18 nH impedance for the frequency of operation while providing low resistance for the dc current. The evaluation board uses a Coilcraft® 0603HP-18NX_LU inductor; this 18 nH inductor provides some of the match at 2140 MHz.
R1, R2, R4, R5
To provide bias to all stages through just one supply, set R1 and R2 to 0 Ω, and leave R4 and R5 open. To provide separate bias to stages, set R1 and R2 to open and R4 and R5 to 0 Ω.
R1, R2 = 0 Ω
R4, R5 = open
Exposed Paddle The paddle should be connected to both thermal and electrical ground.
Rev. 0 | Page 16 of 20
Page 17
ADL5606
Figure 37. Evaluation Board Layout, Top
09968-037
Figure 38. Evaluation Board Layout, Bottom
09968-038
Rev. 0 | Page 17 of 20
Page 18
ADL5606

OUTLINE DIMENSIONS

PIN 1
INDICATOR
1.00
0.85
0.80
12° MAX
SEATING PLANE
4.00
BSC SQ
TOP
VIEW
0.80 MAX
0.65 TYP
0.35
0.30
0.25
3.75
BSC SQ
0.20 REF
0.60 MAX
0.65 BSC
0.05 MAX
0.02 NOM
COPLANARITY
0.50
0.40
0.30
0.08
0.60 MAX
13
12
EXPOSED
(BOTTOM VIEW)
9
8
1.95 BSC
PIN 1
16
1
PA D
4
5
FOR PROPER CONNECT ION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET.
INDICATOR
2.50
2.35 SQ
2.20
0.25 MIN
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
082008-A
Figure 39. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-16-10)
Dimensions shown in millimeters

ORDERING GUIDE

1
Model
ADL5606ACPZ-R7 −40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-10 ADL5606-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.
Temperature Range Package Description Package Option
Rev. 0 | Page 18 of 20
Page 19
ADL5606
NOTES
Rev. 0 | Page 19 of 20
Page 20
ADL5606
NOTES
©2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D09968-0-7/11(0)
Rev. 0 | Page 20 of 20
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