Fixed gain of 20 dB
Operation up to 500 MHz
Input/output internally matched to 50 Ω
Integrated bias control circuit
OIP3 of 40 dBm at 70 MHz
P1dB of 20.4 dBm at 70 MHz
Noise figure of 2.5 dB at 70 MHz
Temperature and power supply stable
Single 5 V power supply
GENERAL DESCRIPTION
The ADL5534 contains two broadband, fixed-gain, linear
amplifiers and operates at frequencies up to 500 MHz. The
device can be used in a wide variety of equipment, including
cellular, satellite, broadband, and instrumentation equipment.
The ADL5534 has a fixed gain of 20 dB, which is stable over
frequency, temperature, power supply, and from device-todevice. The amplifiers are single-ended and internally matched
to 50 Ω. Only input/output ac-coupling capacitors, power supply
decoupling capacitors, and an external bias inductor are
required for operation of each amplifier.
Dual IF Amplifier
ADL5534
FUNCTIONAL BLOCK DIAGRAM
15 NC
14 NC
BIAS
BIAS
NC 6
CLIN2 7
Figure 1.
13 RFOUT1
12 CLIN1
11 NC
10 NC
9 NC
RFOUT2 8
06836-001
16 RFI N1
NC 1
NC 2
NC 3
NC
NC = NO CONNECT
ADL5534
4
RFIN2 5
The ADL5534 is fabricated on a GaAs HBT process. The
device is packaged in a 16-lead 5 mm × 5 mm LFCSP that
uses an exposed paddle for excellent thermal impedance.
The ADL5534 consumes 98 mA of current per amplifier on
a single 5 V supply, and is fully specified for operation from
−40°C to +85°C.
A similar amplifier, ADL5531 (available from Analog Devices,
Inc.) is the 20 dB gain single-channel version. Fully populated
evaluation boards for both the ADL5531 and ADL5534 are
available.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Frequency Range 20 500 MHz
Gain (S21) 190 MHz 20.4 dB
Input Return Loss (S11) 190 MHz −18.0 dB
Output Return Loss (S22) 190 MHz −29.0 dB
Reverse Isolation (S12) 190 MHz −23.0 dB
FREQUENCY = 70 MHz
Gain 21.0 dB
vs. Frequency ±5 MHz ±0.04 dB
vs. Temperature −40°C ≤ TA ≤ +85°C ±0.20 dB
vs. Supply 4.75 V to 5.25 V ±0.20 dB
Output 1 dB Compression Point 20.4 dBm
Output Third-Order Intercept f = 1 MHz, output power (P
Noise Figure 2.5 dB
Device-to-Device Isolation Measured at output with input applied to alternate device −46.0 dB
FREQUENCY = 190 MHz
Gain 19.520.4 21 dB
vs. Frequency ±50 MHz ±0.15 dB
vs. Temperature −40°C ≤ TA ≤ +85°C ±0.20 dB
vs. Supply 4.75 V to 5.25 V ±0.17 dB
Output 1 dB Compression Point 20.6 dBm
Output Third-Order Intercept f = 1 MHz, output power (P
Noise Figure 2.7 dB
Device-to-Device Isolation Measured at output with input applied to an alternate device −38.0 dB
FREQUENCY = 380 MHz
Gain 19.019.8 20.5 dB
vs. Frequency ±50 MHz ±0.18 dB
vs. Temperature −40°C ≤ TA ≤ +85°C ±0.22 dB
vs. Supply 4.75 V to 5.25 V ±0.16 dB
Output 1 dB Compression Point 20.4 dBm
Output Third-Order Intercept f = 1 MHz, output power (P
Noise Figure 3.0 dB
Device-to-Device Isolation Measured at output with input applied to an alternate device −34.0 dB
POWER INTERFACE RFOUT1, RFOUT2 pins
Supply Voltage 4.75 5 5.25 V
Supply Current Per amplifier 98 110 mA
vs. Temperature −40°C ≤ TA ≤ +85°C ±15 mA
Power Dissipation 0.5 W
) = 0 dBm per tone 40.0 dBm
OUT
) = 0 dBm per tone 39.0 dBm
OUT
) = 0 dBm per tone 36.0 dBm
OUT
Rev. 0 | Page 3 of 16
Page 4
ADL5534
TYPICAL SCATTERING PARAMETERS
VPOS = 5 V and TA = 25°C; the effects of the test fixture have been de-embedded up to the pins of the device.
Supply Voltage on RFOUT1, RFOUT2 5.5 V
Input Power on RFIN1, RFIN2 10 dBm
Internal Power Dissipation (Paddle Soldered) 900 mW
θJA (Junction-to-Air) 54°C/W
Maximum Junction Temperature 150°C
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. 0 | Page 5 of 16
Page 6
ADL5534
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
15 NC
14 NC
16 RFI N1
PIN 1
NC 1
NC 2
NC 3
NC 4
INDICATOR
ADL5534
TOP VIEW
(Not to Scale)
RFIN2 5
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 2, 3, 4, 6, 9,
NC No Connect.
10, 11, 14, 15
5, 16 RFIN2, RFIN1 RF Input. Requires a dc blocking capacitor. Use a 10 nF capacitor for normal operation.
7, 12 CLIN2, CLIN1
A 1 nF capacitor connected from Pin 7 to ground and Pin12 to ground provides decoupling
for the on-board linearizer.
8, 13 RFOUT2, RFOUT1
RF Output and Bias. DC bias is provided to this pin through an inductor. A 470 nH inductor is
recommended for normal operation. The RF path requires a dc blocking capacitor. Use a 10 nF
capacitor for normal operation.
Exposed Paddle GND. Solder this paddle to a low impedance ground plane.
13 RFOUT1
12 CLIN1
11 NC
10 NC
9 NC
NC 6
CLIN2 7
RFOUT2 8
06836-002
Rev. 0 | Page 6 of 16
Page 7
ADL5534
–
TYPICAL PERFORMANCE CHARACTERISTICS
22
20
18
16
14
12
10
8
6
NOISE FI GURE AND GAIN (d B)
4
2
0
050 100 150 200 250 300 350 400 450 500
FREQUENCY (MHz)
GAIN
OIP3
P1dB
NOISE FIGURE
Figure 3. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency
21.4
21.2
21.0
20.8
20.6
20.4
20.2
20.0
GAIN (dB)
19.8
19.6
19.4
19.2
19.0
050 100 150 200 250 300 350 400 450 500
+25°C
FREQUENCY (MHz)
–40°C
+85°C
Figure 4. Gain vs. Frequency and Temperature
45
42
39
36
33
30
27
24
P1dB AND OIP3 (d Bm)
21
18
15
12
06836-003
23.0
22.5
22.0
21.5
21.0
P1dB (dBm)
20.5
20.0
19.5
19.0
+85°C
+85°C
050 100 150 200 250 300 350 400 450 500
–40°C
+25°C
–40°C
FREQUENCY (MHz)
+25°C
42
40
38
36
34
OIP3 (dBm)
32
30
28
26
06836-006
Figure 6. P1dB and OIP3 vs. Frequency and Temperature
42
190MHz
40
38
36
500MHz
34
32
OIP3 (dBm)
30
28
26
24
6836-004
380MHz
–4–2024681012141618–620
P
(dBm)
OUT
70MHz
20MHz
06836-007
Figure 7. OIP3 vs. Output Power and Frequency
5
–10
–15
–20
–25
S–PARAMETERS (d B)
–30
–35
60 100 140 180 220 260 300 340 380 420 460
20500
FREQUENCY (MHz)
S11
S12
S22
Figure 5. Input Return Loss (S11), Output Return Loss (S22), and Reverse
06836-005
5.0
4.5
4.0
3.5
3.0
2.5
NOISE FIGURE (dB)
2.0
1.5
1.0
050 100 150 200 250 300 350 400 450 500
+85°C
+25°C
–40°C
FREQUENCY (MHz)
Figure 8. Noise Figure vs. Frequency and Temperature
06836-008
Isolation (S12) vs. Frequency
Rev. 0 | Page 7 of 16
Page 8
ADL5534
–
60
25
50
40
30
20
PERCENTAGE (%)
10
0
36.6
37.4
38.2
39.0
39.8
37.0
37.8
38.6
OIP3 (dBm)
39.4
40.2
40.6
Figure 9. OIP3 Distribution at 190 MHz
100
90
80
70
60
50
40
PERCENTAGE (%)
30
20
10
0
19.019. 419. 820. 220.621.021.421 .8
P1dB (dBm)
Figure 10. P1dB Distribution at 190 MHz
41.0
41.4
41.8
–30
–35
–40
–45
–50
INPUT TO ALTERNATE O UTPUT ISO LATIO N (dB)
–55
60 100 140 180 220 260 3 00 340 380 420 46020500
06836-009
FREQUENCY (MHz)
06836-011
Figure 12. Device-to-Device Isolation vs. Frequency
4.0
3.8
3.6
3.4
3.2
3.0
2.8
NOISE FI GURE (dB)
2.6
2.4
2.2
2.0
050 100 150 200 250 300 350 400 450 500
6836-010
FREQUENCY (MHz)
06836-013
Figure 13. Noise Figure vs. Frequency at 25°C, Multiple Devices Shown
70
60
50
40
30
PERCENTAGE (%)
20
10
0
19.7
19.9
20.1
20.3
20.5
20.7
19.8
20.0
20.2
20.4
GAIN (dB)
20.6
20.8
20.9
21.0
06836-012
Figure 11. Gain Distribution at 190 MHz
150
140
130
120
110
100
90
80
SUPPLY CURRENT (mA)
70
60
50
–40–30–20–100 102030405060708090
5.25V
5V
4.75V
TEMPERATURE ( °C)
Figure 14. Supply Current vs. Temperature and Supply Voltage
06836-014
Rev. 0 | Page 8 of 16
Page 9
ADL5534
V
BASIC CONNECTIONS
470nH
L1
C7
10nF
C9
1µF
POS
GND
RFIN1
RFIN2
C1
10nF
C3
10nF
15
14
1nF
13
NC
NC
RFOUT1
CLIN1
Z1
NC
C6
NC
NC
NC
RFOUT2
CLIN2
867
L2
470nH
C5
12
1nF
11
10
9
C8
10nF
16
1
RFIN1
NC
2
NC
3
ADL5534
NC
4
NC
RFIN2
5
C2
10nF
C4
10nF
C10
1µF
RFOUT1
RFOUT2
VPOS1
GND1
06836-015
Figure 15. Basic Connections
Table 5. Recommended Components for Basic Connections
The basic connections for operating the ADL5534 are shown in
Figure 15. Recommended components are listed in Tabl e 5. The
inputs and outputs should be ac-coupled with appropriately
sized capacitors (device characterization was performed with
10 nF capacitors). DC bias is provided to the amplifier via the
L1 and L2 inductors connected to the RFOUT1 and RFOUT2
pins. The recommended inductors for L1 and L2 are Coilcraft,
1008CS-471XJLC or equivalent. The bias voltage should be
decoupled using 10 nF and 1 μF capacitors. A bias voltage
of 5 V is required.
Rev. 0 | Page 9 of 16
Page 10
ADL5534
V
1
NC
2
NC
3
NC
4
NC
RFIN
ADT2-1T-1P+
1
T1
C15
10nF
Figure 16. Connections for Operating as a Balanced Amplifier
USING BALUNS TO COMBINE BOTH AMPLIFIERS
INTO A SINGLE AMPLIFIER
The ADL5534 is ideal for use in a balanced amplifier configuration. To accomplish this, flux-coupled RF transformers
with a 2:1 impedance ratio can be used for wide band
operation. Alternatively, a balun can be constructed using
lumped element components for operation over a narrow
frequency range. Figure 16 shows the necessary connections
for configuring the ADL5534 for operation as a balanced
amplifier. Figure 17 shows the performance of the ADL5534
operating in a balanced configuration.
15
16
NC
RFIN1
Z1
ADL5534
NC
RFIN2
5
C6
1nF
POS
C10
1µF
C9
1µF
W2
GAIN
W1
GND
RFOUT
T2
ADT2-1T-1P+
1
VPOS1
GND1
OIP2
P1dB
NOISE FI GURE
FREQUENCY (MHz)
06836-016
OIP3
90
80
70
60
50
40
OIP2 (dBm)
30
20
10
0
06836-017
L1
470nH
14
13
NC
RFOUT1
NC
NC
NC
RFOUT2
CLIN2
867
L2
470nH
GAIN, NOISE FIGURE, P1dB, OIP3 (dB, dBm)
C7
10nF
C5
12
CLIN1
1nF
11
10
C16
9
10nF
C8
10nF
45
40
35
30
25
20
15
10
5
0
050 100 150 200 250 300 350 400 450 500
Figure 17. Performance of the ADL5534 Operating in Balanced
Configuration
Rev. 0 | Page 10 of 16
Page 11
ADL5534
V
470nH
15
14
1nF
NC
Z1
NC
NC
CLIN2
13
867
RFOUT1
NC
NC
NC
RFOUT2
470nH
CLIN1
RFIN
10nF
16
1
RFIN1
NC
2
NC
3
ADL5534
NC
4
NC
RFIN2
5
Figure 18. Narrow-Band IF Sampling Solution for Unbuffered ADC
ADC DRIVING APPLICATION
The ADL5534 is a high linearity, fixed gain IF amplifier suitable
for use as an ADC driver. The ADL5534 has a differential input
and output impedance of 100 Ω. A flux-coupled RF transformer
with a 2:1 impedance ratio was used to perform the single-endedto-differential conversion at the input of the ADL5534. The
interface between the ADL5534 and the AD9640 is a thirdorder low pass filter presenting a 100 Ω differential impedance
to the source and load. The ADL5534 must be ac-coupled to
prevent dc bias from entering the inputs of the ADC. Capacitors
of 100 pF were chosen to reduce any low frequency noise coming
from the ADL5534 and provide dc blocking. The measured
results for this interface shows 0.5 dB insertion loss for a 20 MHz
bandwidth centered around 92 MHz. The wideband response for
the interface is shown in Figure 19. The single-tone results in
Figure 20 show an SNR of 69.3 dB and an SFDR of 82 dBc. The
two-tone results in Figure 21 show an IMD3 of −80.5 dBc and
an SFDR of 78 dBc.
5
0
–5
–10
–15
–20
–25
–30
NORMALIZ ED LOSS (d B)
–35
–40
–45
50100150200250300350400
FREQUENCY (MHz)
Figure 19. Measured Frequency Response of ADC interface
Figure 20. Measured Single-Tone Performance of the Circuit in Figure 18
SFDR = 78.267dBc
0
NOISE FLOOR = –110.131dB
FUND 1= –7.181dBFs
–15
FUND 2= –7.191dBFsIMD (2F1 –F2)= –80.538dBc
–30
IMD (2F2 –F1)= –82.086dBc
–45
–60
–75
(dBFS)
–90
–105
–120
–135
60121824303642485460
FREQUENCY (MHz )
Figure 21. Measured Two-Tone Performance of the Circuit in Figure 18
06836-020
06836-021
Rev. 0 | Page 11 of 16
Page 12
ADL5534
SOLDERING INFORMATION AND RECOMMENDED
PCB LAND PATTERN
Figure 22 shows the recommended land pattern for ADL5534.
To minimize thermal impedance, the exposed paddle on the
package underside should be soldered down to a ground plane.
If multiple ground layers exist, they should be stitched together
using vias. Pin 1 to Pin 4, Pin 6, Pin 9 to Pin 11, and Pin 14 to
Pin 15 can be left unconnected, or can be connected to ground.
Connecting these pins to ground improves device-to-device
isolation and slightly enhances thermal impedance. For more
information on land pattern design and layout, refer to the
AN-772 Application Note , A Desig
for the Lead Frame Chip Scale Package (LFCSP).
n and Manufacturing Guide
3.1mm
4.8mm
0.2mm
0.8mm
2.4mm
Figure 22. Recommended Land Pattern
06836-022
Rev. 0 | Page 12 of 16
Page 13
ADL5534
V
EVALUATION BOARD
Figure 23 shows the schematic for the ADL5534 evaluation
board. The board is powered by a single 5 V supply. The
components used on the board are listed in Tabl e 6.
Transformers (T1 and T2) are provided so the ADL5534
can be configured as a balanced amplifier. Applying 5 V to
R1
ADT2-1T-1P+
R3
C1
10nF
C3
10nF
C11
OPEN
1
T1
C15
OPEN
C12
OPEN
V
POS
1
NC
2
NC
3
NC
4
NC
W3
Figure 23. Evaluation Board Schematic
RFIN1
RFIN2
R5
OPEN
R7
OPEN
OPEN
OPEN
15
16
NC
RFIN1
ADL5534
NC
RFIN2
5
C6
1nF
V
Z1
VPOS biases the amplifier corresponding to RFIN1 and
RFOUT1. Applying 5 V to VPOS1 biases the amplifier
corresponding to RFIN2 and RFOUT2. To bias both amplifiers
from a single supply, connect 5 V to VPOS or VPOS1 and
attach a jumper across W3.
POS
C10
1µF
C9
1µF
C13
OPEN
C14
OPEN
VPOS1
W2
GND1
W1
GND
C2
10nF
OPEN
T2
ADT2-1T-1P+
1
OPEN
C4
10nF
RFOUT1
R2
R6
OPEN
R8
OPEN
R4
RFOUT2
14
POS1
NC
CLIN2
470nH
13
867
470nH
L1
RFOUT1
NC
NC
NC
RFOUT2
L2
C7
10nF
C5
12
CLIN1
1nF
11
10
C16
OPEN
9
C8
10nF
06836-023
Table 6. Evaluation Board Configuration Options
Component Description Default Condition
C1, C2, C3, C4 AC coupling capacitors 10 nF, Size 0402
C5, C6 Provides decoupling for the on-board linearizer 1 nF, Size 0603
C11, C12, C13, C14,
C15, C16
Optional components used for configuring ADL5534 as a balanced amplifier
Optional components used for configuring ADL5534 as a balanced amplifier Open, Size 0603
R6, R7, R8
T1, T2
T1 and T2 are 50 Ω to100 Ω impedance transformers used to configure the ADL5534
as a balanced amplifier; T1 and T2 are used to present a 100 Ω differential impedance
Installed (Mini-Circuits®
ADT2-1T-1P+)
to the ADL5534
L1, L2 DC bias inductor 470 nH, Size 1008
VPOS, GND,
VPOS1, GND1
Clip-on terminals for power supply
VPOS, VPOS1; red
GND, GND1; black
W1, W2 2-pin jumper for connection of ground and supply via cable W1, W2
W3 2-pin jumper used to connect VPOS to VPOS1 W3
Rev. 0 | Page 13 of 16
Page 14
ADL5534
Figure 24. Evaluation Board Layout (Top)
06836-024
Figure 25. Evaluation Board Layout (Bottom)
06836-025
Rev. 0 | Page 14 of 16
Page 15
ADL5534
C
OUTLINE DIMENSIONS
5.00
INDI
PIN 1
ATO R
1.00
0.85
0.80
12° MAX
SEATING
PLANE
BSC SQ
TOP
VIEW
0.80 MAX
0.65 TYP
COMPLIANT TO JEDEC STANDARDS MO-220-VHHB
0.35
0.30
0.25
4.75
BSC SQ
0.20 REF
0.60 MAX
0.80 BSC
0.05 MAX
0.02 NOM
COPLANARITY
0.75
0.60
0.50
0.08
Figure 26. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
CP-16-6
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option Ordering Quantity
ADL5534ACPZ-R7
ADL5534ACPZ-R2
ADL5534-EVALZ
1
Z = RoHS Compliant Part.
1
−40°C to +85°C 16-Lead LFCSP_VQ, 7” Tape and Reel CP-16-6 1500
1
−40°C to +85°C 16-Lead LFCSP_VQ, 7” Tape and Reel CP-16-6 250