Datasheet ADL5358 Datasheet (ANALOG DEVICES)

Page 1
500 MHz to 1700 MHz, Dual-Balanced
Mixer, LO Buffer, IF Amplifier, and RF Balun

FEATURES

RF frequency range of 500 MHz to 1700 MHz IF frequency range of 30 MHz to 450 MHz Power conversion gain: 8.3 dB SSB noise figure of 9.9 dB SSB noise figure with 5 dBm blocker of 23 dB Input IP3 of 25.2 dBm Input P1dB of 10.6 dBm Typical LO drive of 0 dBm Single-ended, 50 Ω RF and LO input ports High isolation SPDT LO input switch Single-supply operation: 3.3 V to 5 V Exposed paddle, 6 mm × 6 mm, 36-lead LFCSP

APPLICATIONS

Cellular base station receivers Transmit observation receivers Radio link downconverters

GENERAL DESCRIPTION

The ADL5358 uses a highly linear, doubly balanced, passive mixer core along with integrated RF and local oscillator (LO) balancing circuitry to allow single-ended operation. The ADL5358 incorporates the RF baluns, allowing for optimal performance over a 500 MHz to 1700 MHz RF input frequency range. Performance is optimized for RF frequencies from 500 MHz to 1200 MHz using a high-side LO and RF frequencies from 1200 MHz to 1700 MHz using a low-side LO. The balanced passive mixer arrangement provides good LO-to-RF leakage, typically better than −20 dBm, and excellent intermodulation performance. The balanced mixer core also provides extremely high input linearity, allowing the device to be used in demanding cellular applications where in-band blocking signals may otherwise result in the degradation of dynamic performance. A high linearity IF buffer amplifier follows the passive mixer core to yield a typical power conversion gain of 8.3 dB and can be used with a wide range of output impedances.
The ADL5358 provides two switched LO paths that can be used in TDD applications where it is desirable to ping-pong between two local oscillators. LO current can be externally set using a resistor to minimize dc current commensurate with the desired level of performance. For low voltage applications, the ADL5358 is capable of operation at voltages down to 3.3 V with substantially reduced current. Under low voltage operation, an additional logic pin is provided to power down (<300 µA) the circuit when desired.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
ADL5358

FUNCTIONAL BLOCK DIAGRAM

N
M
M
S
G
M
N
O C
M
M
M
G
M
V
O
D
C
MNIN
MNCT
COMM
VPOS
COMM
VPOS
COMM
DVCT
DVIN
O P V
S O P V
The ADL5358 is fabricated using a BiCMOS high performance IC process. The device is available in a 6 mm × 6 mm, 36-lead LFCSP and operates over a −40°C to +85°C temperature range. An evaluation board is also available.
Table 1. Passive Mixers
RF Frequency (MHz)
Single Mixer
500 to 1700 ADL5367 ADL5357 ADL5358 1200 to 2500 ADL5365 ADL5355 ADL5356
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2009 Analog Devices, Inc. All rights reserved.
O N M
P O V D
Figure 1.
P O N M
N O V D
E
S
L
O
N
P
M
V
ADL5358
S
E L
O
V
P
D
V
Single Mixer and IF Amp
G L N
C
M
N
C
G L
N V D
Dual Mixer and IF Amp
LOI2
VGS2
VGS1
VGS0
LOSW
PWDN
VPOS
COMM
LOI1
07885-001
Page 2
ADL5358

TABLE OF CONTENTS

Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
5 V Performance ........................................................................... 4
3.3 V Performance ........................................................................ 4
Absolute Maximum Ratings ............................................................ 5
ESD Caution .................................................................................. 5
Pin Configuration and Function Descriptions ............................. 6
Typical Performance Characteristics ............................................. 7
5 V Performance ........................................................................... 7

REVISION HISTORY

11/09—Revision 0: Initial Version
3.3 V Performance ...................................................................... 15
Spurious Performance ............................................................... 16
Circuit Description......................................................................... 17
RF Subsystem .............................................................................. 17
LO Subsystem ............................................................................. 18
Applications Information .............................................................. 19
Basic Connections ...................................................................... 19
IF Port .......................................................................................... 19
Bias Resistor Selection ............................................................... 19
Mixer VGS Control DAC .......................................................... 19
Evaluation Board ............................................................................ 21
Outline Dimensions ....................................................................... 23
Ordering Guide .......................................................................... 23
Rev. 0 | Page 2 of 24
Page 3
ADL5358

SPECIFICATIONS

VS = 5 V, IS = 350 mA, TA = 25°C, fRF = 900 MHz, fLO = 1103 MHz, LO power = 0 dBm, RF power = −10 dBm, R1 = R4 = 1.3 k, R2 = R5 = 1 k, Z
= 50 Ω, VGS0 = VGS1 = VGS2 = 0 V, unless otherwise noted.
O
Table 2.
Parameter Conditions Min Typ Max Unit
RF INPUT INTERFACE
Return Loss Tunable to >20 dB over a limited bandwidth 20 dB Input Impedance 50 Ω RF Frequency Range 500 1700 MHz
OUTPUT INTERFACE
Output Impedance Differential impedance, f = 200 MHz 230||0.75 Ω||pF IF Frequency Range 30 450 MHz DC Bias Voltage1 Externally generated 3.3 5.0 5.5 V
LO INTERFACE
LO Power −6 0 +10 dBm Return Loss 13 dB Input Impedance 50 Ω LO Frequency Range 530 1670 MHz
POWER-DOWN (PWDN) INTERFACE2
PWDN Threshold 1.0 V Logic 0 Level 0.4 V Logic 1 Level 1.4 V PWDN Response Time Device enabled, IF output to 90% of its final level 160 ns Device disabled, supply current < 5 mA 230 ns PWDN Input Bias Current Device enabled 0 μA
Device disabled 70 μA
1
Apply supply voltage from external circuit through choke inductors.
2
PWDN function is intended for use with VS ≤ 3.6 V only.
Rev. 0 | Page 3 of 24
Page 4
ADL5358

5 V PERFORMANCE

VS = 5 V, IS = 350 mA, TA = 25°C, fRF = 900 MHz, fLO = 1103 MHz, LO power = 0 dBm, RF power = −10 dBm, R1 = R4 = 1.3 k, R2 = R5 = 1 k, VGS0 = VGS1 = VGS2 = 0 V, and Z
Table 3.
Parameter Conditions Min Typ Max Unit
DYNAMIC PERFORMANCE
Power Conversion Gain Including 4:1 IF port transformer and PCB loss 7.6 8.3 8.6 dB Voltage Conversion Gain Z SSB Noise Figure 9.9 dB SSB Noise Figure Under Blocking
Input Third-Order Intercept (IIP3)
Input Second-Order Intercept (IIP2)
Input 1 dB Compression Point (IP1dB) 10.6 dBm LO-to-IF Leakage Unfiltered IF output −33 dBm LO-to-RF Leakage −31 dBm RF-to-IF Isolation −43 dBc IF/2 Spurious −10 dBm input power −72 dBc IF/3 Spurious −10 dBm input power −79 dBc IF Channel-to-Channel Isolation 54 dB
POWER SUPPLY
Positive Supply Voltage 4.75 5 5.25 V Quiescent Current LO supply 170 mA IF supply 180 mA Total Quiescent Current 350 mA
= 50 Ω, unless otherwise noted.
O
= 50 Ω, differential Z
SOURCE
5 dBm blocker present ±10 MHz from wanted RF input, LO source filtered
= 899.5 MHz, f
f
RF1
= 900.5 MHz, fLO = 1103 MHz,
RF2
each RF tone at −10 dBm
= 900 MHz, f
f
RF1
= 950 MHz, fLO = 1103 MHz,
RF2
each RF tone at −10 dBm
= 200 Ω differential 14.6 dB
LOAD
23 dB
22 25.2 dBm
57 dBm

3.3 V PERFORMANCE

VS = 3.3 V, IS = 200 mA, TA = 25°C, fRF = 900 MHz, fLO = 1103 MHz, LO power = 0 dBm, RF power = −10 dBm, R1 = R4 = 1.2 k, R2 = R5 = 400 , VGS0 = VGS1 = VGS2 = 0 V, and Z
Table 4.
Parameter Conditions Min Typ Max Unit
DYNAMIC PERFORMANCE
Power Conversion Gain Including 4:1 IF port transformer and PCB loss 8.3 dB Voltage Conversion Gain Z SSB Noise Figure 8.9 dB Input Third-Order Intercept (IIP3)
f each RF tone at −10 dBm
Input Second-Order Intercept (IIP2)
f each RF tone at −10 dBm
Input 1 dB Compression Point (IP1dB) 6.75 dBm
POWER INTERFACE
Supply Voltage 3.0 3.3 3.6 V Quiescent Current Resistor programmable 200 mA Total Quiescent Current Device disabled 300 μA
= 50 , unless otherwise noted.
O
= 50 Ω, differential Z
SOURCE
= 899.5 MHz, f
RF1
= 950 MHz, f
RF1
= 900.5 MHz, fLO = 1103 MHz,
RF2
= 900 MHz, fLO = 1103 MHz,
RF2
= 200 Ω differential 14.6 dB
LOAD
19.3 dBm
47.2 dBm
Rev. 0 | Page 4 of 24
Page 5
ADL5358

ABSOLUTE MAXIMUM RATINGS

Table 5.
Parameter Rating
Supply Voltage, VS 5.5 V RF Input Level 20 dBm LO Input Level 13 dBm MNOP, MNON, DVOP, DVON Bias 6.0 V VGS2, VGS1, VGS0, LOSW, PWDN 5.5 V Internal Power Dissipation 2.2 W θJA 22°C/W Maximum Junction Temperature 150°C Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering, 60 sec) 260°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

Rev. 0 | Page 5 of 24
Page 6
ADL5358

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

N
M
M
P
E
S
O
G
M
O
N
N
O
P
M
C
M
V
6
5
4
3
3
3
3
3
1
MNIN
2
MNCT
3
COMM
4
VPOS
5
COMM
6
VPOS
7
COMM
DVCT
8 9
DVIN
NOTES
1. NC = NO CONNECT .
2. EXPOSED PAD MUST BE CONNECT E D TO GROUND.
ADL5358
TOP VIEW
(Not to S cal e)
0
1
2
1
1
1
S
M
M
O
G
M
P
V
O
V
D
C
3
1
P O V D
Figure 2. Pin Configuration
G
S
O
L
L
O
N
N
N
C
P
M
M
V
M
2
3
4
1
N O V D
N
1
0
9
8
3
3
2
2
27
LOI2 VGS2
26
VGS1
25
VGS0
24
LOSW
23 22
PWDN
21
VPOS
20
COMM LOI1
19
5
6
7
8
1
1
1
1
S
E
C
G
L
L
N
O
V
V
P
D
V
D
07885-002
Table 6. Pin Function Descriptions
Pin No. Mnemonic Description
1 MNIN RF Input for Main Channel. Internally matched to 50 Ω. This pin must be ac-coupled. 2 MNCT Center Tap for Main Channel Input Balun. Bypass this pin to ground using low inductance capacitor. 3, 5, 7, 12, 20, 34 COMM Device Common (DC Ground). 4, 6, 10, 16,
VPOS Positive Supply Voltage.
21, 30, 36 8 DVCT Center Tap for Diversity Channel Input Balun. Bypass to ground using low inductance capacitor. 9 DVIN RF Input for Diversity Channel. Internally matched to 50 Ω. This pin must be ac-coupled. 11 DVGM Diverstiy Amplifier Bias Setting. Connect a 1.3 kΩ resistor to ground for typical operation. 13, 14 DVOP, DVON
Diversity Channel Differential Open-Collector Outputs. DVOP and DVON should be pulled-up to
VCC using external inductors. 15 DVLE Diversity Channel IF Return. This pin must be grounded. 17 DVLG Diverstiy Channel LO Buffer Bias Setting. Connect a 1 kΩ resistor to ground for typical operation. 18, 28 NC No Connect. 19 LOI1 Local Oscillator Input 1. Internally matched to 50 Ω. This pin must be ac-coupled. 22 PWDN
Connect to Ground for Normal Operation. Connect this pin to 3 V for disable mode when using
VPOS < 3.6 V. PWDN pin must be grounded when VPOS > 3.6 V. 23 LOSW Local Oscillator Input Selection Switch. Set LOSW high to select LOI1 or set LOSW low to select LOI2. 24, 25, 26 VGS0, VGS1, VGS2 Gate to Source Control Voltages. For typical operation, set VGS0, VGS1, and VGS2 to low logic level. 27 LOI2 Local Oscillator Input 2. Internally matched to 50 Ω. This pin must be ac-coupled. 29 MNLG Main Channel LO Buffer Bias Setting. Connect a 1 kΩ resistor to ground for typical operation. 31 MNLE Main Channel IF Return. This pin must be grounded. 32, 33 MNOP, MNON
Main Channel Differential Open-Collector Outputs. MNOP and MNON should be pulled-up to
VCC using external inductors. 35 MNGM Main Amplifier Bias Setting. Connect a 1.3 kΩ resistor to ground for typical operation. Paddle EPAD Exposed pad must be connected to ground.
Rev. 0 | Page 6 of 24
Page 7
ADL5358

TYPICAL PERFORMANCE CHARACTERISTICS

5 V PERFORMANCE

VS = 5 V, IS = 350 mA, TA = 25°C, fRF = 900 MHz, fLO = 1103 MHz, LO power = 0 dBm, RF power = −10 dBm, R1 = R4 = 1.3 kΩ, R2 = R5 = 1 kΩ, VGS0 = VGS1 = VGS2 = 0 V, Z
400
= 50 Ω, unless otherwise noted.
O
70
380
360
340
SUPPLY CURRENT (mA)
320
300
700 750 800 850 900 950 1000 1050 1100 1150 1200
TA =–40°C
TA = +25°C
TA = +85°C
RF FREQUENCY (M Hz )
Figure 3. Supply Current vs. RF Frequency
12
11
10
9
8
7
CONVERSION GAIN (dB)
6
TA = +25°C
TA = –40°C
TA = +85°C
65
60
55
TA = +25°C
INPUT IP2 (dBm)
50
45
40
700 750 800 850 900 950 1000 1050 1100 1150 1200
07885-003
RF FREQUENCY ( M Hz )
TA =–40°C
TA = +85°C
07885-006
Figure 6. Input IP2 vs. RF Frequency
14
13
12
11
10
INPUT P1dB (dBm)
9
TA = +85°C
TA = –40°C
TA = +25°C
5
700 750 800 850 900 950 1000 1050 1100 1150 1200
RF FREQUENCY (MHz )
Figure 4. Power Conversion Gain vs. RF Frequency
31
29
27
TA = –40°C
25
INPUT IP3 (dBm)
23
21
19
700 750 800 850 900 950 1000 1050 1100 1150 1200
TA = +85°C
RF FREQUENCY ( M Hz )
TA = +25°C
Figure 5. Input IP3 vs. RF Frequency
07885-004
07885-005
Rev. 0 | Page 7 of 24
8
700 750 800 850 900 950 1000 1050 1100 1150 1200
RF FREQUENCY ( M Hz )
Figure 7. Input P1dB vs. RF Frequency
14
13
12
11
10
9
SSB NOISE F IGURE (dB)
8
7
6
700 750 800 850 900 950 1000 1050 1100 1150 1200
TA = +25°C
TA = –40°C
RF FREQUENCY (M Hz )
TA = +85°C
Figure 8. SSB Noise Figure vs. RF Frequency
07885-007
07885-008
Page 8
ADL5358
VS = 5 V, IS = 350 mA, TA = 25°C, fRF = 900 MHz, fLO = 1103 MHz, LO power = 0 dBm, RF power = −10 dBm, R1 = R4 = 1.3 kΩ, R2 = R5 = 1 kΩ, VGS0 = VGS1 = VGS2 = 0 V, Z
400
380
360
340
SUPPLY CURRENT (mA)
320
300
–40 –20 –10–30 0 10 20 30 40 50 60 70 80
Figure 9. Supply Current vs. Temperature
10.0
9.5
9.0
8.5
8.0
CONVERSION GAIN (dB)
7.5
4.75V
5.0V
5.25V
= 50 Ω, unless otherwise noted.
O
V
= 5.25V
POS
V
= 5.0V
POS
V
= 4.75V
POS
TEMPERATURE ( °C)
62
61
60
59
V
V
58
57
56
INPUT IP2 (dBm)
55
54
53
52
–40 –30 –20 –10 0 2010 30 40 50 60 70 80
07885-009
= 5.0V
POS
TEMPERATURE (°C)
POS
= 5.25V
V
POS
= 4.75V
07885-012
Figure 12. Input IP2 vs. Temperature
13
12
11
10
INPUT P1dB (dBm)
9
V
POS
= 5.25V
V
= 5.0V
POS
V
= 4.75V
POS
7.0 –40 –30 –20 –10 0 2010 30 40 50 60 70 80
TEMPERATURE ( °C)
Figure 10. Power Conversion Gain vs. Temperature
29
28
27
26
25
24
INPUT IP3 (dBm)
23
22
21
–40 –30 –20 –10 0 2010 30 40 50 60 70 80
V
= 5.0V
POS
V
= 5.25V
POS
V
= 4.75V
POS
TEMPERATURE (°C)
Figure 11. Input IP3 vs. Temperature
07885-010
07885-011
8
–40 –30 –20 –10 0 2010 30 40 50 60 70 80
TEMPERATURE ( °C)
Figure 13. Input P1dB vs. Temperature
12.0
11.5
11.0
= 5.25V
10.5
10.0
9.5
SSB NOISE FIGURE (dB)
9.0
8.5
8.0 –40 –20 0
V
POS
V
V
POS
TEMPERATURE (°C)
POS
= 5.0V
20
= 4.75V
30
40 60–30 –10 10
50 70 80
Figure 14. SSB Noise Figure vs. Temperature
07885-013
07885-014
Rev. 0 | Page 8 of 24
Page 9
ADL5358
VS = 5 V, IS = 350 mA, TA = 25°C, fRF = 900 MHz, fLO = 1103 MHz, LO power = 0 dBm, RF power = −10 dBm, R1 = R4 = 1.3 kΩ, R2 = R5 = 1 kΩ, VGS0 = VGS1 = VGS2 = 0 V, Z
400
= 50 Ω, unless otherwise noted.
O
70
380
360
340
SUPPLY CURRENT ( mA)
320
300
30 80 130 180 230 280 330 430380
TA = –40°C
TA = +85°C
IF FREQ UENCY (MHz)
Figure 15. Supply Current vs. IF Frequency
11
10
9
8
7
6
CONVERSION G AI N (d B)
5
TA = +25°C
TA = –40°C
TA = +85°C
TA = +25°C
65
60
55
INPUT IP2 (dBm)
50
45
40
30
80
07885-015
TA = +85°C
130 180 230 280 330 380 430
IF FREQ UENCY (MHz)
TA = +25°C
TA = –40°C
07885-018
Figure 18. Input IP2 vs. IF Frequency
13
12
11
10
9
INPUT P1dB (dBm)
8
TA = +25°C
TA = +85°C
TA = –40°C
4
30
130 180 230 280 330 380 430
80
IF FREQUENCY (MHz )
Figure 16. Power Conversion Gain vs. IF Frequency
30
29
28
27
26
25
24
INPUT IP3 (dBm)
23
22
21
20
30
80
TA = +25°C
TA = +85°C
130 180 230 280 330 380 430
IF FREQ UE NCY (MHz)
Figure 17. Input IP3 vs. IF Frequency
07885-016
TA = –40°C
07885-017
7
30
130 180 230 280 330 380 430
80
IF FREQUE NCY (MHz)
07885-019
Figure 19. Input P1dB vs. IF Frequency
14
13
12
11
10
9
SSB NOISE F IGURE (dB)
8
7
6
30
130 180 230 280 330 380 430
80
IF FREQUE NCY ( M Hz )
07885-020
Figure 20. SSB Noise Figure vs. IF Frequency
Rev. 0 | Page 9 of 24
Page 10
ADL5358
VS = 5 V, IS = 350 mA, TA = 25°C, fRF = 900 MHz, fLO = 1103 MHz, LO power = 0 dBm, RF power = −10 dBm, R1 = R4 = 1.3 kΩ, R2 = R5 = 1 kΩ, VGS0 = VGS1 = VGS2 = 0 V, Z
11.0
10.5
10.0
9.5
9.0
8.5
8.0
7.5
CONVERSION G AI N (d B)
7.0
6.5
6.0 –6 –4 –2 0 2 4 6 8 10
Figure 21. Power Conversion Gain vs. LO Power
30
29
28
27
26
25
24
INPUT IP3 (dBm)
23
22
21
20
–6 –4 –2 0 2 4 6 8 10
TA =–40°C
TA = +25°C
Figure 22. Input IP3 vs. LO Power
64
62
60
58
56
INPUT IP2 (dBm)
54
52
50
–6 –4 –2 0 2 4 6 8 10
TA = –40°C
TA = +25°C
TA = +85°C
Figure 23. Input IP2 vs. LO Power
= 50 Ω, unless otherwise noted.
O
TA =–40°C
TA = +25°C
TA = +85°C
LO POW E R (dBm)
TA = +85°C
LO POW E R (dBm)
LO POWER (dBm)
12.0
11.5
11.0
10.5
10.0
INPUT P1dB (dBm)
9.5
9.0 –6 –4 –2 0 2 4 6 8 10
07885-021
TA = –40°C
TA = +85°C
TA = +25°C
LO POWE R (dBm)
07885-024
Figure 24. Input P1dB vs. LO Power
–60
–65
–70
–75
TA = +25°C
–80
IF/2 SPURIOUS (dBc)
–85
–90
700 750 800 850 900 950 1000 1050 1100 1150 1200
07885-022
TA = +85°C
TA = –40°C
RF FREQUENCY (M Hz )
07885-025
Figure 25. IF/2 Spurious vs. RF Frequency
–65
–67 –69
–71
–73
–75
–77
IF/3 SPURIOUS (dBc)
–79
–81
–83 –85
700 750 800 850 900 950 1000 1050 1100 1150 1200
07885-023
TA = –40°C
RF FREQUENCY (M Hz )
Figure 26. IF/3 Spurious vs. RF Frequency
TA = +25°C
TA = +85°C
07885-026
Rev. 0 | Page 10 of 24
Page 11
ADL5358
VS = 5 V, IS = 350 mA, TA = 25°C, fRF = 900 MHz, fLO = 1103 MHz, LO power = 0 dBm, RF power = −10 dBm, R1 = R4 = 1.3 kΩ, R2 = R5 = 1 kΩ, Z
= 50 Ω, VGS0 = VGS1 = VGS2 = 0 V, unless otherwise noted.
O
100
MEAN = 8.47 STANDARD DEVIATION = 0.66%
80
500
400
12
9
60
40
PERCENTAGE (%)
20
0
7.0 7.5 8.0 8.5 9.0 9.5 10.0 CONVERSION G AI N (d B)
Figure 27. Conversion Gain Distribution
100
MEAN = 25.2 STANDARD DEVIATION = 0.71
80
60
40
PERCENTAGE (%)
20
0
1815 21 24 27 3330
INPUT IP3 LO (dBm)
Figure 28. Input IP3 Distribution
100
MEAN = 10.66 STANDARD DEVIATION = 0.96
80
60
40
PERCENTAGE (%)
20
0
7 8 9 10111213
INPUT P1dB (dBm)
Figure 29. Input P1dB Distribution
300
200
RESISTANCE (Ω)
100
0
30 43038033028023018013080
07885-027
IF FREQ UE NCY (MHz)
Figure 30. IF Output Impedance (R Parallel, C Equivalent)
10
12
14
16
18
20
22
24
RF RETURN LO S S (dB)
26
28
30
700 750 800 850 900 950 1000 1050 1100 1150 1200
07885-028
RF FREQUENCY ( M Hz )
Figure 31. RF Return Loss, Fixed IF
8
9
10
11
12
13
14
LO RETURN L OSS (dB)
15
16
17
900 950 1000 1050 1100 1150 1200 1250 1300 1350 1400
07885-029
SELECTED
UNSELECTED
LO FREQ UENCY ( GHz)
Figure 32. LO Return Loss, Selected and Unselected
6
3
CAPACIT A N CE (pF )
0
–3
07885-030
07885-031
07885-032
Rev. 0 | Page 11 of 24
Page 12
ADL5358
VS = 5 V, IS = 350 mA, TA = 25°C, fRF = 900 MHz, fLO = 1103 MHz, LO power = 0 dBm, RF power = −10 dBm, R1 = R4 = 1.3 kΩ, R2 = R5 = 1 kΩ, Z
= 50 Ω, VGS0 = VGS1 = VGS2 = 0 V, unless otherwise noted.
O
65
–24
TA = +25°C
60
55
TA = –40°C
50
LO SWITCH ISOLATION (dB)
45
40
700 750 800 850 900 950 1000 1050 1100 1150 1200
TA = +85°C
RF FREQUENCY (M Hz )
Figure 33. LO Switch Isolation vs. RF Frequency
–20
–25
–30
5
–3
–40
–45
RF-TO-IF ISOLATION (dB)
–50
–55
–60
700 750 800 850 900 950 1000 1050 1100 1150 1200
TA = +85°C
TA = +25°C
TA = –40°C
RF FREQUENCY ( M Hz )
Figure 34. RF-to-IF Isolation vs. RF Frequency
–20
–26
–28
–30
–32
–34
LO-TO - RF LEAKAGE (dBm)
–36
–38
900 95
07885-033
TA = –40°C
TA = +25°C
TA = +85°C
0 1000 1050 1100 1150 1200 1250 1300 1350 1400
LO FREQUE NCY (MHz)
07885-036
Figure 36. LO-to-RF Leakage vs. LO Frequency
0
–5
–10
–15
–20
2XLO LEAKAGE (dBm)
–25
–30
900 950 1000 1050 1100 1150 1200 1250 1300 1350 1400
07885-034
LO FREQUE NCY (MHz)
2XLO-TO-RF
2XLO-TO-IF
07885-037
Figure 37. 2XLO Leakage vs. LO Frequency
0
–25
–30
–35
–40
LO-TO- IF LEAKAGE ( dBm)
–45
–50
0 1000 1050 1100 1150 1200 1250 1300 1350 1400
90095
TA = +85°C
LO FREQ UE NCY (MHz )
TA = –40°C
TA = +25°C
07885-035
Figure 35. LO-to-IF Leakage vs. LO Frequency
–10
–20
–30
3XLO-TO-RF
–40
–50
3XLO LEAKAGE (dBm)
–60
3XLO-TO-IF
–70
900 950 1000 1050 1100 1150 1200 1250 1300 1350 1400
LO FREQ UENCY ( MHz)
Figure 38. 3XLO Leakage vs. LO Frequency
07885-038
Rev. 0 | Page 12 of 24
Page 13
ADL5358
VS = 5 V, IS = 350 mA, TA = 25°C, fRF = 900 MHz, fLO = 1103 MHz, LO power = 0 dBm, RF power = −10 dBm, R1 = R4 = 1.3 kΩ, R2 = R5 = 1 kΩ, VGS0 = VGS1 = VGS2 = 0 V, Z
9
= 50 Ω, unless otherwise noted.
O
14
30
8
7
6
5
CONVERSION GAIN (dB)
VGS = 000
4
VGS = 011 VGS = 100 VGS = 110
3
700 120011001000900800750 11501050950850
RF FREQUENCY ( MHz)
13
12
11
10
SSB NOISE F IGURE (dB)
9
8
Figure 39. Power Conversion Gain and SSB Noise Figure vs. RF Frequency
for Various VGS Settings
13
12
11
10
9
INPUT P1dB (dB)
8
VGS = 000
7
VGS = 011 VGS = 100 VGS = 110
6
700 120011001000900800750 11501050950850
RF FREQUENCY ( M Hz )
45
40
35
30
25
INPUT IP3 (dB)
20
15
10
Figure 40. Input P1dB and Input IP3 vs. RF Frequency for Various VGS Settings
CONVERSION GAIN AND SSB NOISE FIGURE ( dB)
16
14
12
10
8
6
4
2
600 1600150014001300120011001000900800700
INPUT IP3
NOISE FI G URE
CONVERSION GAIN
LO BIAS RES ISTOR VALUE ( Ω)
32
28
24
20
16
INPUT IP3 (dBm)
12
8
4
Figure 41. Power Conversion Gain, SSB Noise Figure, and Input IP3 vs.
LO Bias Resistor Value
25
20
15
10
SSB NOISE F IGURE (dB)
5
0
–30 –25 –20 –15 –5–10 501
07885-039
BLOCKER POW E R ( dBm)
0
07885-042
Figure 42. SSB Noise Figure vs. 10 MHz Offset Blocker Level
300
280
260
240
220
200
180
160
SUPPLY CURRENT (mA)
140
120
100
600 1600150014001300120011001000900800700
07885-040
IF RESIS T OR SUPPLY CURRENT
LO RESIS T OR SUPPLY CURRENT
BIAS RESISTOR VALUE (Ω)
07885-043
Figure 43. LO and IF Supply Current vs. IF and LO Bias Resistor Value
18
16
14
12
10
8
6
CONVERSION GAIN AND SSB NOIS E FIGURE (d B)
4
07885-041
600 1600150014001300120011001000900800700
INPUT IP3
NOISE FI GURE
CONVERSION GAIN
IF BIAS RESIS TOR VAL UE ( Ω)
28
24
20
16
12
INPUT IP3 (dBm)
8
4
0
07885-044
Figure 44. Power Conversion Gain, SSB Noise Figure, and Input IP3 vs.
IF Bias Resistor Value
Rev. 0 | Page 13 of 24
Page 14
ADL5358
VS = 5 V, IS = 350 mA, TA = 25°C, fRF = 900 MHz, fLO = 1103 MHz, LO power = 0 dBm, RF power = −10 dBm, R1 = R4 = 1.3 kΩ, R2 = R5 = 1 kΩ, VGS0 = VGS1 = VGS2 = 0 V, Z
60
59
= 50 Ω, unless otherwise noted.
O
TA = –40°C
58
57
56
55
54
IF CHANNEL-T O-CHANNEL ISOLATIO N (dB)
53
700 750 800 850 900 950 1000 1050 1100 1150 1200
Figure 45. IF Channel-to-Channel Isolation vs. RF Frequency
TA = +85°C
RF FREQUENCY (M Hz )
TA = +25°C
07885-045
Rev. 0 | Page 14 of 24
Page 15
ADL5358

3.3 V PERFORMANCE

VS = 3.3 V, IS = 200 mA, TA = 25°C, fRF = 900 MHz, fLO = 1103 MHz, LO power = 0 dBm, RF power = −10 dBm, R1 = R4 = 1.2 kΩ, R2 = R5 = 400 Ω, VGS0 = VGS1 = VGS2 = 0 V, Z
220
= 50 Ω, unless otherwise noted.
O
60
215
210
205
200
SUPPLY CURRENT ( mA)
195
190
700 750 800 850 900 950 1000 1050 1100 1150 1200
TA = –40°C
TA = +25°C
TA = +85°C
RF FREQUENCY (M Hz )
Figure 46. Supply Current vs. RF Frequency at 3.3 V
11
10
9
TA = +25°C
8
7
CONVERSION GAIN (dB)
6
TA = +85°C
TA = –40°C
55
TA = –40°C
50
45
INPUT IP2 (dBm)
40
35
30
700 750 800 850 900 950 1000 1050 1100 1150 1200
07885-046
TA = +85°C
TA = +25°C
RF FREQUENCY (M Hz )
07885-049
Figure 49. Input IP2 vs. RF Frequency at 3.3 V
10
9
8
7
6
INPUT P1dB (dBm)
5
TA = +25°C
TA = +85°C
TA = –40°C
5
700 750 800 850 900 950 1000 1050 1100 1150 1200
RF FREQUENCY (M Hz )
Figure 47. Power Conversion Gain vs. RF Frequency at 3.3 V
26
24
22
20
18
INPUT IP3 (dBm)
TA = +85°C
16
14
12
700 750 800 850 900 950 1000 1050 1100 1150 1200
TA =–40°C
TA = +25°C
RF FREQUENCY (M Hz )
Figure 48. Input IP3 vs. RF Frequency at 3.3 V
07885-047
07885-048
Rev. 0 | Page 15 of 24
4
700 750 800 850 900 950 1000 1050 1100 1150 1200
RF FREQUENCY (MHz )
Figure 50. Input P1dB vs. RF Frequency at 3.3 V
14
13
12
11
TA = +25°C
10
9
8
7
SSB NOISE F IGURE (dB)
6
5
4
700 750 800 850 900 950 1000 1050 1100 1150 1200
TA = +85°C
TA = –40°C
RF FREQUENCY ( M Hz )
Figure 51. SSB Noise Figure vs. RF Frequency at 3.3 V
07885-050
07885-051
Page 16
ADL5358

SPURIOUS PERFORMANCE

All spur tables are (N × fRF) − (M × fLO) and were measured using the standard evaluation board. Mixer spurious products are measured in dBc from the IF output power level. Data was measured only for frequencies less than 6 GHz. Typical noise floor of the measurement system = −100 dBm.

5 V Performance

VS = 5 V, IS = 350 mA, TA = 25°C, fRF = 900 MHz, fLO = 1103 MHz, LO power = 0 dBm, RF power = −10 dBm, R1 = R4 = 1.3 kΩ, R2 = R5 = 1 kΩ, VGS0 = VGS1 = VGS2 = 0 V, and Z
N
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14
0 −28.0 −21.5 −59.0 −44.2 −71.2
−52.4 0.0 −70.8 −42.4 −67.8 −65.5 −86.2
1
−74.8 −73.1 −78.2 −90.2 −77.6 <−100 −91.0 <−100
2 3 <−100 <−100 <−100 −91.1 <−100 <−100 <−100 <−100 4 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100
<−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100
5
<−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100
6 7 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100
<−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100
8
<−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100
9 10 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 11 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100
<−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100
12
<−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100
13 14 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100

3.3 V Performance

VS = 3.3 V, IS = 200 mA, TA = 25°C, fRF = 900 MHz, fLO = 1103 MHz, LO power = 0 dBm, RF power = −10 dBm, R1 = R4 = 1.2 kΩ, R2 = R5 = 400 Ω, VGS0 = VGS1 = VG2 = 0 V, and Z
N
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14
−33.3 −23.7 −49.1 −41.3 −82.9
0
−46.3 0.0 −64.4 −39.4 −71.2 −73.1 −86.1
1 2 −68.2 −61.5 −78.4 −81.2 −71.8 −94.6 −88.8 <−100
−99.9 −90.6 −95.2 −75.7 <−100 <−100 <−100 <−100
3
<−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100
4 5 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 6 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100
<−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100
7
<−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100
8 9 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100
<−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100
10
<−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100
11 12 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 13 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100
<−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100 <−100
14
= 50 Ω, unless otherwise noted.
O
M
= 50 Ω, unless otherwise noted.
O
M
Rev. 0 | Page 16 of 24
Page 17
ADL5358

CIRCUIT DESCRIPTION

The ADL5358 consists of two primary components: the radio frequency (RF) subsystem and the local oscillator (LO) subsystem. The combination of design, process, and packaging technology allows the functions of these subsystems to be integrated into a single die, using mature packaging and interconnection technologies to provide a high performance, low cost design with excellent electrical, mechanical, and thermal properties. In addition, the need for external components is minimized, optimizing cost and size.
The RF subsystem consists of integrated, low loss RF baluns, passive MOSFET mixers, sum termination networks, and IF amplifiers. The LO subsystem consists of an SPDT-terminated FET switch and two multistage limiting LO amplifiers. The purpose of the LO subsystem is to provide a large, fixed amplitude balanced signal to drive the mixer independent of the level of the LO input.
A simplified schematic of the device is shown in Figure 52.
N
M
MNIN
MNCT
COMM
VPOS
COMM
VPOS
COMM
DVCT
DVIN
M
S
G
O P V
S O P V
M
N
O C
M
M
M
G
M
V
O
D
C
P O N M
P O V D
E
O
L
N
N
M
M
E
N
L
O
V
V
D
D
S O P V
ADL5358
S O P V
G L N
C
M
N
LOI2
VGS2
VGS1
VGS0
LOSW
PWDN
VPOS
COMM
LOI1
C
G L
N V D
Figure 52. Simplified Schematic

RF SUBSYSTEM

The single-ended, 50  RF input is internally transformed to a balanced signal using a low loss (<1 dB) unbalanced-to-balanced (balun) transformer. This transformer is made possible by an extremely low loss metal stack, which provides both excellent balance and dc isolation for the RF port. Although the port can be dc connected, it is recommended that a blocking capacitor be used to avoid running excessive dc current through the part. The RF balun can easily support an RF input frequency range of 500 MHz to 1700 MHz.
Rev. 0 | Page 17 of 24
07885-001
The resulting balanced RF signal is applied to a passive mixer that commutates the RF input with the output of the LO subsystem. The passive mixer is essentially a balanced, low loss switch that adds minimum noise to the frequency translation. The only noise contribution from the mixer is due to the resistive loss of the switches, which is in the order of a few ohms.
Because the mixer is inherently broadband and bidirectional, it is necessary to properly terminate all the idler (M × N product) frequencies generated by the mixing process. Terminating the mixer avoids the generation of unwanted intermodulation products and reduces the level of unwanted signals at the input of the IF amplifier, where high peak signal levels can compromise the compression and intermodulation performance of the system. This termination is accomplished by the addition of a sum network between the IF amplifier and the mixer and in the feedback elements in the IF amplifier.
The IF amplifier is a balanced feedback design that simultaneously provides the desired gain, noise figure, and input impedance that is required to achieve the overall performance. The balanced open­collector output of the IF amplifier, with impedance modified by the feedback within the amplifier, permits the output to be connected directly to a high impedance filter, differential amplifier, or an analog-to-digital input while providing optimum second­order intermodulation suppression. The differential output impedance of the IF amplifier is approximately 200 . If operation in a 50  system is desired, the output can be transformed to 50  by using a 4:1 transformer.
The intermodulation performance of the design is generally limited by the IF amplifier. The IP3 performance can be optimized by adjusting the IF current with an external resistor.
Figure 41, Figure 43, and Figure 44 illustrate how various IF and LO bias resistors affect the performance with a 5 V supply. Additionally, dc current can be saved by increasing either or both resistors. It is permissible to reduce the dc supply voltage to as low as 3.3 V, further reducing the dissipated power of the part. No performance enhancement is obtained by reducing the value of these resistors, and excessive dc power dissipation may result.
Page 18
ADL5358

LO SUBSYSTEM

The LO amplifier is designed to provide a large signal level to the mixer to obtain optimum intermodulation performance. The resulting amplifier provides extremely high performance centered on an operating frequency of 1100 MHz. The best operation is achieved with either high-side LO injection for RF signals in the 500 MHz to 1200 MHz range or low-side injection for RF signals in the 1200 MHz to 1700 MHz range. Operation outside these ranges is permissible, and conversion gain is extremely wideband, easily spanning 500 MHz to 1700 MHz, but intermodulation is optimal over the aforementioned ranges.
The ADL5358 has two LO inputs permitting multiple synthesizers to be rapidly switched with extremely short switching times (<40 ns) for frequency agile applications. The two inputs are applied to a high isolation SPDT switch that provides a constant input impedance, regardless of whether the port is selected, to avoid pulling the LO sources. This multiple section switch also ensures high isolation to the off input, minimizing any leakage from the unwanted LO input that may result in undesired IF responses.
The single-ended LO input is converted to a fixed amplitude differential signal using a multistage, limiting LO amplifier. This results in consistent performance over a range of LO input power. Optimum performance is achieved from −6 dBm to +10 dBm, but the circuit continues to function at considerably lower levels of LO input power.
The performance of this amplifier is critical in achieving a high intercept passive mixer without degrading the noise floor of the system. This is a critical requirement in an interferer rich environment, such as cellular infrastructure, where blocking interferers can limit mixer performance. The bandwidth of the intermodulation performance is somewhat influenced by the current in the LO amplifier chain. For dc current sensitive applications, it is permissible to reduce the current in the LO amplifier by raising the value of the external bias control resistor. For dc current critical applications, the LO chain can operate with a supply voltage as low as 3.3 V, resulting in substantial dc power savings.
In addition, when operating with supply voltages below 3.6 V, the ADL5358 has a power-down mode that permits the dc current to drop to <300 µA.
The logic inputs are designed to work with any logic family that provides a Logic 0 input level of less than 0.4 V and a Logic 1 input level that exceeds 1.4 V. All logic inputs are high impedance up to Logic 1 levels of 3.3 V. At levels exceeding 3.3 V, protection circuitry permits operation up to 5.5 V, although a small bias current is drawn.
Rev. 0 | Page 18 of 24
Page 19
ADL5358

APPLICATIONS INFORMATION

BASIC CONNECTIONS

The ADL5358 mixer is designed to downconvert radio frequencies (RF) primarily between 500 MHz and 1700 MHz to lower intermediate frequencies (IF) between 30 MHz and 450 MHz. Figure 53 depicts the basic connections of the mixer. It is recommended to ac-couple the RF and LO input ports to prevent non-zero dc voltages from damaging the RF balun or LO input circuit. The RFIN matching network consists of a series 8 pF capacitor to provide the optimized RF input return loss for the desired frequency band.

IF PORT

The mixer differential IF interface requires pull-up choke inductors to bias the open-collector outputs and to set the output match. The shunting impedance of the choke inductors used to couple dc current into the IF amplifier should be selected to provide the desired output return loss.
The real part of the output impedance is approximately 200 Ω, as seen in Figure 30, which matches many commonly used SAW filters without the need for a transformer. This results in a voltage conversion gain that is approximately 6 dB higher than the power conversion gain, as shown in Ta ble 3 . When a 50 Ω output impedance is needed, use a 4:1 impedance transformer, as shown in Figure 53.

BIAS RESISTOR SELECTION

The IF bias resistors (R1 and R4) and LO bias resistors (R2 and R5) are used to adjust the bias current of the integrated amplifiers at the IF and LO terminals. It is necessary to have a sufficient amount of current to bias both the internal IF and LO amplifiers to optimize dc current vs. optimum IIP3 performance. Figure 41, Figure 43, and Figure 44 provide the reference for the bias resistor selection when lower power consumption is preferred at the expense of conversion gain and IP3 performance.

MIXER VGS CONTROL DAC

The ADL5358 features three logic control pins, VGS0 (Pin 24), VGS1 (Pin 25), and VGS2 (Pin 26), that allow programmability for internal gate-to-source voltages for optimizing mixer performance over desired frequency bands. The evaluation board defaults VGS0, VGS1, and VGS2 to ground. Power conversion gain, NF, IIP3, and input P1dB can be optimized, as shown in Figure 39 and Figure 40.
Rev. 0 | Page 19 of 24
Page 20
ADL5358
MAIN_IN
C9
Z1 Z2
C3
C2
VCC
1
2
3
4
5
MAIN_OUTN
C19 C17
C22
R1
36 35 34 33 32 31 30 29 28
C33
C8 C21
L1
C27
R10
VCC
C32
T1
L2
R3
MAIN_OUTP
C25 C18
VCC
R2
R12
R7
R14 R11
C16
R16
C34
R17
LO2
VCC
27
26
R13
25
R8
24
R15
23
DIV_IN
VCC
C6 C7
C11
Z3 Z4
GND
VCC
+
C10
6
7
8
9
10 11 12 13 14 15 16 17 18
VCC
C23
R4
C20
DIV_OUTP DIV_OUTN
C30 C31
VCC
R6
L5
C1 C12
C28
R9
L4
C29
T2
ADL5358
VCC
C24 C13
22
21
C26
20
19
C14
R5
C15
LO1
VCC
R19
07885-153
Figure 53. Typical Application Circuit
Rev. 0 | Page 20 of 24
Page 21
ADL5358

EVALUATION BOARD

An evaluation board is available for the family of double balanced mixers. The standard evaluation board schematic is shown in Figure 54. The evaluation board is fabricated using Rogers® RO3003 material.
Tabl e 7 describes the various configuration options of the evaluation board. Evaluation board layout is shown in Figure 55 and Figure 56.
MAIN_IN
DIV_IN
C9
Z1 Z2
VCC
C11
Z3 Z4
C3 C2
C6 C7
VCC
+
GND
C10
MAIN_OUTN
C22
VCC
MNIN
MNCT
COMM
VPOS
COMM
VPOS
COMM
DVCT
DVIN
VCC
C23
R10
C33
C19 C17
S O P V
C8 C21
L1
R1
M
M
G
M
N
O C
M
C27
VCC
N O N M
T1
L2
R3
P O N M
ADL5358
TOP VIEW
(Not to Scale)
S O P V
M
G
O
V
C
D
R4
L5
M
M
N
P
O
O
V
V
D
D
VCC
R6
L4
S O P V
S O P V
MAIN_OUTP
C18
G L N
M
G L V D
C32
C25
E L N
M
E L V D
C24 C13
VCC
C N
C N
VCC
R2
VGS2
VGS1
VGS0
LOSW
PWDN
VPOS
COMM
R5
LOI2
LOI1
C14
C26
R13
C16
R12
R16
R7
C34
R8
R17
R14 R11
R15
R19
VCC
C15
LO1
LO2
VCC
C1 C12
C28
C20
DIV_OUTP DIV_OUTN
C30 C31
R9
Figure 54. Evaluation Board Schematic
C29
T2
07885-154
Rev. 0 | Page 21 of 24
Page 22
ADL5358
Table 7. Evaluation Board Configuration
Components Description Default Conditions
C1, C8, C10, C12, C13, C15, C18, C21, C22, C23, C24, C25, C26
Z1 to Z4, C2, C3, C6, C7, C9, C11
T1, T2, C17, C19, C20, C27 to C33, L1, L2, L4, L5, R3, R6, R9, R10
C14, C16, R15, LOSW
R19, PWDN
R1, R2, R4, R5, R7, R8, R11 to R14, R16, R17, C34
Power Supply Decoupling. Nominal supply decoupling consists of a
0.01 μF capacitor to ground in parallel with 10 pF capacitors to ground positioned as close to the device as possible.
RF Main and Diversity Input Interface. Main and diversity input channels are ac-coupled through C9 and C11. Z1 to Z4 provide additional component placement for external matching/filter networks. C2, C3, C6, and C7 provide bypassing for the center taps of the main and diversity on-chip input baluns.
IF Main and Diversity Output Interface. The open collector IF output interfaces are biased through pull-up choke inductors L1, L2, L4, and L5, with R3 and R6 available for additional supply bypassing. T1 and T2 are 4:1 impedance transformers used to provide a single-ended IF output interface with C27 and C28 providing center-tap bypassing. C17, C19, C20, C29, C30, C31, C32, and C33 ensure an ac-coupled output interface. Remove R9 and R10 for balanced output operation.
LO Interface. C14 and C16 provide ac coupling for the LOI1 and LOI2 local oscillator inputs. LOSW selects the appropriate LO input for both mixer cores. R15 provides a pull-down to ensure LOI2 is enabled when the LOSW jumper is removed. Jumper can be removed to allow LOSW interface to be exercised using an external logic generator.
PWDN Interface. When the PWDN 2-pin shunt is inserted, the ADL5358 is powered down. When R19 is open, it pulls the PWDN logic low and enables the device. Jumper can be removed to allow PWDN interface to be exercised using an external logic generator. Grounding the PWDN pin is allowed during nominal operation but is not permitted when supply voltages exceed 3.3 V.
Bias Control. R16 and R17 form a voltage divider to provide a 3 V for logic control, bypassed to ground through C34. R7, R8, R11, R12, R13, and R14 provide resistor programmability of VGS0, VGS1, and VGS2. Typically, these nodes can be hardwired for nominal operation. Grounding these pins is allowed for nominal operation. R2 and R5 set the bias point for the internal LO buffers. R1 and R4 set the bias point for the internal IF amplifiers.
C1, C8, C12, C21 = 150 pF (Size 0402), C10 = 4.7 μF (Size 3216), C13, C15, C18 = 0.1 μF (Size 0402) C22, C23, C24, C25, C26 = 10 pF (Size 0402)
Z1, Z3 = open (Size 0402), Z2, Z4 = open (Size 0402), C2, C7 = 10 pF (Size 0402), C3, C6 = 0.01 μF (Size 0402), C9, C11 = 8 pF (Size 0402)
T1, T2 = TC4-1T+ (Mini-Circuits), C17, C19, C20, C29 to C33 = 0.001 μF (Size 0402), C27, C28 = 150 pF (Size 0402), L1, L2, L4, L5 = 330 nH (Size 0805), R3, R6, R9, R10 = 0 Ω (Size 0402)
C14, C16 = 10 pF (Size 0402), R15 = 10 kΩ (Size 0402), LOSW = 2-pin shunt
R19 = 10 kΩ (Size 0402), PWDN = 2-pin shunt
R1, R4 = 1.3 kΩ (Size 0402), R2, R5 = 1 kΩ (Size 0402), R7, R8, R11 = 0 Ω (Size 0402), R12, R13, R14 = open (Size 0402), R16 = 10 kΩ (Size 0402), R17 = 15 kΩ (Size 0402), C34 = 1 nF (Size 0402)
Figure 55. Evaluation Board Top Layer
07885-056
Figure 56. Evaluation Board Bottom Layer
07885-057
Rev. 0 | Page 22 of 24
Page 23
ADL5358

OUTLINE DIMENSIONS

6.00
INDICATOR
1.00
0.85
0.80
SEATING
PLANE
PIN 1
12° MAX
BSC SQ
TOP
VIEW
0.80 MAX
0.65 TYP
0.35
0.28
0.23
COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-1
5.75
BSC SQ
0.20 REF
0.05 MAX
0.02 NOM COPLANARITY
0.60 MAX
0.50 BSC
0.75
0.60
0.50
0.08
Figure 57. 36-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
6mm × 6 mm Body, Very Thin Quad (CP-36-1)
Dimensions shown in millimeters
0.60 MAX
28
27
EXPOSED
(BOTTOM VIEW)
19
18
36
1
PAD
9
10
4.00 REF
FORPROPERCONNECTIONOF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET.
PIN 1 INDICATOR
3.85
3.70 SQ
3.55
0.20 MIN
050808-D

ORDERING GUIDE

Model Temperature Range Package Description Package Option
ADL5358ACPZ-R21 −40°C to +85°C 36-Lead LFCSP_VQ CP-36-1 ADL5358ACPZ-R71 −40°C to +85°C 36-Lead LFCSP_VQ CP-36-1 ADL5358-EVALZ1 Evaluation Board
1
Z = RoHS Compliant Part.
Rev. 0 | Page 23 of 24
Page 24
ADL5358
NOTES
©2009 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D07885-0-11/09(0)
Rev. 0 | Page 24 of 24
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