Wideband switch: −3 dB @ 4 GHz
ADG936 absorptive dual SPDT
ADG936-R reflective dual SPDT
High off isolation (36 dB @ 1 GHz)
Low insertion loss (0.9 dB dc to 1 GHz)
Single 1.65 to 2.75 V power supply
CMOS/LVTTL control logic
20-lead TSSOP and 4 mm × 4 mm LFCSP package
Low power consumption (1 µA max)
APPLICATIONS
Wireless communications
General-purpose RF switching
Dual-band applications
High speed filter selection
Digital transceiver front end switch
IF switching
Tuner modules
Antenna diversity switching
GENERAL DESCRIPTION
The ADG936/ADG936-R are wideband analog switches that
comprise two independently selectable SPDT switches using a
CMOS process to provide high isolation and low insertion loss
to 1 GHz. The ADG936 is an absorptive/matched dual SPDT
with 50 Ω terminated shunt legs; the ADG936-R is a reflective
dual SPDT. These devices are designed such that the isolation is
high over the dc to 1 GHz frequency range. They have on-board
CMOS control logic, eliminating the need for external
controlling circuitry. The control inputs are both CMOS and
–10
VDD = 2.5V
= 25°C
T
A
–20
–30
–40
–50
–60
OFF ISOLATION (dB)
–70
–80
Figure 3. Off Is olation v s. Frequency Figure 4. Inser tion Loss vs. Fre quency
S21
S12
FREQUENCY (Hz)
10G10k100k1M10M100M1G
04503-0-019
CMOS 1.65 V to 2.75 V, Dual SPDT
ADG936/ADG936-R
FUNCTIONAL BLOCK DIAGRAMS
RF1A
04503-0-001
RFCA
INA
ADG936-R
RFCB
INB
VDD= 2.5V
RFCA
INA
ADG936
RFCB
INB
50Ω
RF2A
50Ω
RF1B
50Ω
RF2B
50Ω
Figure 1. Figure 2.
LVTTL compatible. The low power consumption of these
CMOS devices makes them ideally suited for wireless
applications and general-purpose high frequency switching.
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
VDD = 2.25 V to 2.75 V 1.7 V
VDD = 1.65 V to 1.95 V 0.65 V
CC
VDD = 2.25 V to 2.75 V 0.7 V
VDD = 1.65 V to 1.95 V 0.35 V
0 ≤ VIN ≤ 2.75 V ± 0.1 ± 1 µA
CAPACITANCE4
RF Port On Capacitance CRF ON f = 1 MHz 2.5 pF
Digital Input Capacitance C
DIG
f = 1 MHz 2 pF
POWER REQUIREMENTS
V
DD
Quiescent Power Supply Current I
1.65 2.75 V
DD
Digital inputs = 0 V or V
DD
0.1 1 µA
1
Temperature range B Version: −40°C to +85°C.
2
Typical values are at VDD = 2.5 V and 25°C, unless otherwise noted.
3
Operating frequency is the point at which insertion loss degrades by 1 dB.
4
Guaranteed by design, not subject to production test.
5
Video feedthrough is the dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 Ω test
setup, measured with 1 ns rise time pulses and 500 MHz bandwidth.
1
V
V
CC
Rev. 0 | Page 3 of 16
Page 4
ADG936/ADG936-R
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 2.
Parameter Rating
VDD to GND –0.5 V to +4 V
Inputs to GND –0.5 V to VDD + 0.3 V
Continuous Current 30 mA
Input Power 18 dBm
Operating Temperature Range
Industrial (B Version) –40°C to +85°C
Storage Temperature Range –65°C to +150°C
Junction Temperature 150°C
TSSOP Package
θJA Thermal Impedance 143°C/W
LFCSP Package
θJA Thermal Impedance (4-layer board) 30.4°C/W
Lead Temperature, Soldering (10 s) 300°C
IR Reflow, Peak Temperature (<20 s) 235°C
ESD 1 kV
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may
affect device reliability. Only one absolute maximum rating may
be applied at any one time.
Table 3. Truth Table
INx RF1x RF2x
0 Off On
1 On Off
1
RF1x/RF2x Off Port Inputs to Ground = –0.5 V to VDD – 0.5 V.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. 0 | Page 4 of 16
Page 5
ADG936/ADG936-R
A
A
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
RFC
V
GND
RF1A
GND
GND
RF1B
GND
GND
RFCB
DD
1
2
3
ADG936
ADG936-R
4
5
TOP VIEW
(Not to Scale)
6
7
8
9
10
20
GND
19
INA
18
GND
17
RF2A
16
GND
15
GND
14
RF2B
13
GND
12
INB
GND
11
04503-0-002
Figure 5. 20-Lead TSSOP (RU-20) Figure 6. 20-Lead 4 mm × 4 mm LFCSP (CP-20)
Table 4. Pin Function Descriptions
Pin No.
20-Lead
TSSOP
20-Lead
LFCSP Mnemonic Function
1 18 RFCA Common RF Port for Switch A.
2 19 V
DD
Power Supply Input. These parts can be operated from 1.65 V to 2.75 V. VDD should be
decoupled to GND.
3, 5, 6, 8, 9,
11,13, 15,
16, 18, 20
1, 3, 4, 6, 7,
9, 12,13, 15,
17, 20
GND Ground Reference Point for All Circuitry on the Part.
4 2 RF1A RF1A Port.
7 5 RF1B RF1B Port.
10 8 RFCB Common RF Port for Switch B.
12 10 INB Logic Control Input.
14 11 RF2B RF2B Port.
17 14 RF2A RF2A Port.
19 16 INA Logic Control Input.
GND
RF1A
GND
GND
RF1B
1
2
3
4
5
DD
GND18 RFC
GND
V
20
17
19
ADG936
ADG936-R
TOP VIEW
(Not to Scale)
7
8
9
GND6GND
GND
RFCB
INA
16
10
INB
15
14
13
12
11
GND
RF2A
GND
GND
RF2B
04503-0-003
Rev. 0 | Page 5 of 16
Page 6
ADG936/ADG936-R
TERMINOLOGY
Table 5.
Parameter Description
V
DD
I
DD
GND Ground (0 V) Reference.
INx Logic Control Input.
V
INL
V
INH
I
(I
) Input Current of the Digital Input.
INL
INH
C
IN
t
ON
t
OFF
t
RISE
t
FALL
Off Isolation The Attenuation between Input and Output Ports of the Switch when the Switch Control Voltage Is in the Off Condition.
Insertion Loss The Attenuation between Input and Output Ports of the Switch when the Switch Control Voltage Is in the On Condition.
Crosstalk Measure of Unwanted Signal Coupled through from One Channel to Another as a Result of Parasitic Capacitance.
P
–1 dB
IP
3
Return Loss
Video
Feedthrough
Most Positive Power Supply Potential.
Positive Supply Current.
Maximum Input Voltage for Logic 0.
Minimum Input Voltage for Logic 1.
Digital Input Capacitance.
Delay between Applying the Digital Control Input and the Output Switching On.
Delay between Applying the Digital Control Input and the Output Switching Off.
Rise Time. Time for the RF signal to rise from 10% of the On level to 90% of the On level.
Fall Time. Time for the RF signal to fall from 90% of the On level to 10% of the On level.
1 dB Compression Point. The RF input power level at which the switch insertion loss increases by 1 dB over its low level
value. P
is a measure of how much power the On switch can handle before the insertion loss increases by 1 dB.
–1 dB
Third-Order Intermodulation Intercept. This is a measure of the power in false tones that occurs when closely spaced
tones are passed through a switch, whereby the nonlinearity of the switch causes these false tones to be generated.
The Amount of Reflected Power Relative to the Incident Power at a Port. Large return loss indicates good matching. By
measuring return loss, the VSWR can be calculated from conversion charts. VSWR (voltage standing wave ratio) indicates
the degree of matching present at a switch RF port.
Spurious Signals Present at the RF Ports of the Switch when the Control Voltage Is Switched from High to Low or Low to
High without an RF Signal Present.
Figure 9. Insertion Loss vs. Frequency over Supplies
(S12 and S21)
–30
–40
–50
–60
OFF ISOLATION (dB)
–70
10G10k100k1M10M100M1G
04503-0-016
–80
S21
S12
FREQUENCY (Hz)
10G10k100k1M10M100M1G
04503-0-019
Figure 11. Isolation vs. Frequency over Supplies
–10
V
= 2.5V
DD
–20
–30
–40
–50
–60
–70
–80
OFF ISOLATION (dB)
–90
–100
10G10k100k1M10M100M1G
04503-0-017
–110
T
= +25°C
A
T
= +85°C
A
TA = –40°C
FREQUENCY (Hz)
10G1G10k100k1M10M100M
04503-0-020
Figure 12. Isolation vs. Frequency over Temperature
Rev. 0 | Page 7 of 16
Page 8
ADG936/ADG936-R
0
VDD = 2.5V
= 25°C
T
A
–5
–10
TEK RUN
INx
[]
T
T
TRIG'D
∆ : 2.20mV
–15
–20
RETURN LOSS (dB)
–25
–30
–10
–20
–30
–40
–50
–60
CROSSTALK (dB)
–70
–80
–90
OFF SWITCH
ON SWITCH
FREQUENCY (Hz)
Figure 13. Return Loss vs. Frequency ( S11)
VDD = 2.5V
= 25°C
T
A
FREQUENCY (Hz)
Figure 14. Crosstalk vs. Frequency (S12 and S21)
1
3
RFCx
10G10k100k1M10M100M1G
04503-0-021
CH1 1.00VΩ20.0ns
CH3 1.00mVΩ
04503-0-024
Figure 16. Video Feedt hrough
35
30
25
20
(dB)
3
15
IP
10
5
VDD = 2.5V
TA = 25°C
10G10k100k1M10M100M1G
04503-0-022
0
FREQUENCY (MHz)
900100200300400500600700800
04504-0-019
Figure 17. IP
vs. Frequency
3
TEK RUN: 5.00GS/s ET ENVELOPE
1
3
CH1CH25.00ns
CH3
[]
INx
RFx
1.00V
100mV
T
100mV
Figure 15. Switch Timing
04503-0-023
Rev. 0 | Page 8 of 16
(dBm)
–1dB
P
18
16
14
12
10
8
6
4
2
0
VDD = 2.5V
TA = 25°C
FREQUENCY (MHz)
Figure 18. P
vs. Frequency
–1 dB
1500025050075010001250
04503-0-025
Page 9
ADG936/ADG936-R
V
V
TEST CIRCUITS
Similar setup for the ADG936. Additional pins omitted for clarity.
V
DD
10µF
V
DD
10µF
V
DD
V
RFx
RFCx
V
S
INx
GND
Figure 19. Switch Timing: t
V
DD
10µF
V
DD
RFx
RFCx
S
INx
GND
Figure 20. Switch Timing: t
OUT
V
INx
V
OUT
10%
50%50%
90%
t
ON
, t
ON
OFF
50%
90% 90%
t
RISE
, t
RISE
FALL
10%
t
OFF
t
FALL
50%
10%
04503-0-004
04503-0-005
R
L
50Ω
V
OUT
V
INx
R
L
50Ω
V
OUT
RFCx
INx
V
INx
RFCx
50Ω
INx
V
INx
10µF
ADG936-R
V
DD
GND
V
DD
V
DD
GND
RF1x
RF2x
INSERTION LOSS = 20log
Figure 22. Insertion Loss
ADG936-R
RF1x
RF2x
CROSSTALK = 20log
Figure 23. Crosstalk
50Ω
V
V
OUT
V
OUT
V
S
S
V
R
L
50Ω
NETWORK
ANALYZER
50Ω
NETWORK
ANALYZER
50Ω
V
R
L
50Ω
OUT
OUT
V
S
04503-0-007
V
S
04503-0-008
V
DD
10µF
50Ω
V
OUT
R
L
50Ω
NETWORK
ANALYZER
V
S
RFCx
INx
V
INx
04503-0-006
OSCILLOSCOPE
Figure 24. Video Feedt hrough
ADG936-R
V
DD
RF1x
RFC
RF2x
INx
INx
GND
OFF ISOLATION = 20log
50Ω
V
OUT
V
S
Figure 21. Off Isolation
10µF
V
V
GND
DD
DD
ADG936-R
RF1x
RF2x
NC
NC
04503-0-009
Rev. 0 | Page 9 of 16
Page 10
ADG936/ADG936-R
V
DD
10µF
V
ADG936-R
DD
10µF
V
DD
ADG936-R
V
DD
SPECTRUM
ANALYZER
RF1x
RF2x
50Ω
COMBINER
3
RFCx
INx
V
INx
GND
Figure 25. IP
RF
SOURCE
RF
SOURCE
04503-0-010
SPECTRUM
ANALYZER
RFCx
INx
V
INx
GND
Figure 26. P
–1 dB
RF1x
RF2x
50Ω
RF
SOURCE
V
S
04503-0-011
Rev. 0 | Page 10 of 16
Page 11
ADG936/ADG936-R
A
A
APPLICATIONS
The ADG936/ADG936-R are ideal solutions for low power,
high frequency applications. The low insertion loss, high
isolation between ports, low distortion, and low current
consumption of these parts make them excellent solutions for
many high frequency switching applications. They can be used
in applications such as switchable filters, transmitters and
receivers for radar systems, and communication systems from
base stations to cell phones.
The ADG9xx family of wideband switches is designed to meet
the demands of devices transmitting at ISM band frequencies to
1 GHz and higher. The low insertion loss, high isolation
between ports, single pin control interface, no requirement for
dc blocking capacitors, and TTL interface compatibility make
them cost-effective and easy-to-integrate switching solutions for
many high frequency switching and low power applications,
because the parts can handle up to 16 dBm of power.
ABSORPTIVE VS. REFLECTIVE
The ADG936 is an absorptive (matched) switch with 50 Ω
terminated shunt legs; the ADG936-R is a reflective switch with
0 Ω terminated shunts to ground. The ADG936 absorptive
switch has a good VSWR on each port, regardless of the switch
mode. An absorptive switch should be used when there is a
need for a good VSWR that is looking into the port but not
passing the through-signal to the common port. The ADG936
is, therefore, ideal for applications that require minimum
reflections back to the RF source. It also ensures that the
maximum power is transferred to the load.
The ADG936-R reflective switch is suitable for applications in
which high off-port VSWR does not matter, and the switch has
some other desired performance features. It can be used in
many applications, including high speed filter selection. In most
cases, an absorptive switch can be used instead of a reflective
switch, but not vice versa.
FILTER SELECTION
The ADG936 and ADG936-R can be used to switch high
frequency signals between different filters, and to multiplex the
signal to the output. These dual SPDT switches are also ideal for
high speed signal routing and for switching high speed
differential signals.
RF
RF
IN
IN
RFCA
RFCB
RF1A
RF2A
RF1B
RF2B
Figure 27. Filter Selection
RF1A
RF2A
RF1B
RF2B
RF
OUT
ADG936ADG936
RFCA
RFCB
RF
OUT
04504-0-013
Tx/Rx SWITCHING
The low insertion loss and high isolation between ports ensure
that the ADG936/ADG936-R are suitable transmit/receive
switches for all ISM band and Wireless LAN applications,
providing the required isolation between the transmit and
receive signals.
LNA
NTENN
RFCA
ADG936
RFCB
Figure 28. Tx/Rx Switching
RF1B
RF2B
RF1B
RF2B
PA
04504-0-014
ANTENNA DIVERSITY SWITCH
The ADG936/ADG936-R are ideal for use as antenna diversity
switches, switching in different antennas to the tuner. The low
insertion loss, which ensures minimum signal loss and high
isolation between channels, makes these dual SPDT switches
suitable for switching applications in tuner modules and set-top
boxes.
Rev. 0 | Page 11 of 16
Page 12
ADG936/ADG936-R
EVALUATION BOARD
The ADG936 and ADG936-R evaluation board allows
designers to evaluate these high performance wideband
switches with minimal effort.
To prove that these devices meet the user’s requirements, only a
power supply and a network analyzer, along with the evaluation
board, are required. An application note available with the
evaluation board gives complete information on operating the
evaluation board.
The RFCA port is connected through a 50 Ω transmission line
to SMA connector J3. The RFCB port is connected through a
50 Ω transmission line to SMA connector J4. RF1A, RF2A,
RF1B, and RF2B are connected through 50 Ω transmission lines
to SMA connectors J5, J6, J7, and J8, respectively. A through
transmission line connects J9 and J10; this transmission line is
used to estimate the loss of the PCB over the environmental
conditions being evaluated.
The board is constructed of a four-layer, FR4 material with a
dielectric constant of 4.3 and an overall thickness of 0.062 in.
Two ground layers with grounded planes provide ground for
the RF transmission lines. The transmission lines were designed
using a coplanar waveguide with ground plane model using a
trace width of 0.024 in, clearance to ground plane of 0.008 in,
dielectric thickness of 0.02 in, and a metal thickness of
0.0021 in.
Figure 29. ADG936 and ADG936-R Evaluation Board Top View
Rev. 0 | Page 12 of 16
Page 13
ADG936/ADG936-R
OUTLINE DIMENSIONS
6.60
6.50
6.40
COPLANARITY
PIN 1
INDICATOR
1.00
0.85
0.80
SEATING
PLANE
0.15
0.05
PIN 1
0.10
20
1
0.65
BSC
0.30
0.19
COMPLIANT TO JEDEC STANDARDS MO-153AC
1.20 MAX
11
10
SEATING
PLANE
4.50
4.40
4.30
6.40 BSC
0.20
0.09
8°
0°
Figure 30. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
0.60
MAX
0.60
MAX
0.75
0.55
0.35
COPLANARITY
0.08
16
15
EXPOSED
(BOTTOM VIEW)
11
10
12° MAX
BSC SQ
0.50
BSC
4.00
TOP
VIEW
0.80 MAX
0.65 TYP
0.20
REF
3.75
BCS SQ
0.05 MAX
0.02 NOM
PAD
0.30
0.23
0.18
0.75
0.60
0.45
20
1
2.25
2.10 SQ
1.95
5
6
0.25 MIN
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
Figure 31. 20-Lead Lead Frame Chip Scale Package [LFCSP] 4 mm × 4 mm Body
(CP-20-1)
Dimensions shown in millimeters
Rev. 0 | Page 13 of 16
Page 14
ADG936/ADG936-R
ORDERING GUIDE
Model Temperature Range Package Description Package Option
ADG936BRU –40°C to +85°C Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BRU-500RL7 –40°C to +85°C Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BRU-REEL –40°C to +85°C Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BRU-REEL7 –40°C to +85°C Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BCP –40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP-20-1
ADG936BCP-500RL7 –40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP-20-1
ADG936BCP-REEL –40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP-20-1
ADG936BCP-REEL7 –40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP-20-1
ADG936BRU-R –40°C to +85°C Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BRU-R-500RL7 –40°C to +85°C Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BRU-R-REEL –40°C to +85°C Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BRU-R-REEL7 –40°C to +85°C Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BCP-R –40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP-20-1
ADG936BCP-R-500RL7 –40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP-20-1
ADG936BCP-R-REEL –40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP-20-1
ADG936BCP-R-REEL7 –40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP-20-1
EVAL-ADG936EB Evaluation Board RU-20
EVAL-ADG936-REB Evaluation Board RU-20