Datasheet ADG901 Datasheet (Analog Devices)

Wideband, 40 dB Isolation at 1 GHz, CMOS

RF2

CTRL

ADG901

RF1

50

50

RF2

CTRL

ADG902

RF1

1.65 V to 2.75 V, SPST Switches
ADG901/ADG902

FEATURES
Wideband Switch: –3 dB @ 4.5 GHz
Absorptive/Reflective Switches
High Off Isolation (40 dB @ 1 GHz)
Low Insertion Loss (0.8 dB @1 GHz)
Single 1.65 V to 2.75 V Power Supply
CMOS/LVTTL Control Logic
8-Lead MSOP and Tiny 3 mm  3 mm LFCSP Packages
Low Power Consumption (<1 A)

APPLICATIONS
Wireless Communications
General-Purpose RF Switching
Dual-Band Applications
High Speed Filter Selection
Digital Transceiver Front End Switch
IF Switching
Tuner Modules
Antenna Diversity Switching

GENERAL DESCRIPTION

The ADG901/ADG902 are wideband switches that use a
CMOS process to provide high isolation and low insertion loss to
1 GHz. The ADG901 is an absorptive (matched) switch with
50 Ω terminated shunt legs, while the ADG902 is a reflective
switch. These devices are designed such that the isolation is
high over the dc to 1 GHz frequency range. They have on-board
CMOS control logic, thus eliminating the need for external
controlling circuitry. The control inputs are both CMOS and

FUNCTIONAL BLOCK DIAGRAMS

LVTTL compatible. The low power consumption of these
CMOS devices makes them ideally suited to wireless applica­tions and general-purpose high frequency switching.

PRODUCT HIGHLIGHTS

1. –40 dB Off Isolation @ 1 GHz

2. 0.8 dB Insertion Loss @ 1 GHz

3. Tiny 8-Lead MSOP/LFCSP Packages

0

TA = 25C

–10

20

–

–30

–40

–50

VDD = 2.5 V

FREQUENCY (Hz)

V

DD

= 1.8 V

–60

ISOLATION (dB)

–70

–80

–90

–100

10k 100k 1M 10M 100M 1G 10G

Figure 1. Off Isolation vs. Frequency

REV. A

Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.

–0.4

–0.6

0.8

–

–1.0

–1.2

–1.4

–1.6

–1.8

–2.0

–2.2

INSERTION LOSS (dB)

–2.4

–2.6

VDD = 2.5V

= 25C

T

–2.8

A

–3.0

10k 100k 1M 10M 100M 1G 10G

FREQUENCY (Hz)

Figure 2. Insertion Loss vs. Frequency

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: [phone] www.analog.com
Fax: [phone] © 2004 Analog Devices, Inc. All rights reserved.

(VDD = 1.65 V to 2.75 V, GND = 0 V, input power = 0 dBm,

1

ADG901/ADG902–SPECIFICATIONS

all specifications T

MIN

to T

, unless otherwise noted.)

MAX

B Version

Parameter Symbol Conditions Min Typ2Max Unit

AC ELECTRICAL CHARACTERISTICS

Operating Frequency
–3 dB Frequency
Input Power

4

3

4

DC 2.5 GHz

4.5 GHz
0 V dc Bias 7 dBm
+0.5 V dc Bias 16 dBm

Insertion Loss S

, S

21

Isolation—RF1 to RF2 S21, S

DC to 100 MHz; VDD = 2.5 V ± 10% 0.4 0.7 dB

12

500 MHz; V
1000 MHz; V
100 MHz 60 61 dB

12

= 2.5 V ± 10% 0.5 0.8 dB

DD

= 2.5 V ± 10% 0.8 1.25 dB

DD

(CP Package) 500 MHz 43 45 dB

1000 MHz 34 40 dB

Isolation—RF1 to RF2 S

, S

21

100 MHz 51 60 dB

12

(RM Package) 500 MHz 37.5 47 dB

1000 MHz 31 37 dB
DC to 100 MHz 20 28 dB

22

Return Loss (On Channel)

4

S11, S

500 MHz 23 29 dB

Return Loss (Off Channel)

4

S11, S

1000 MHz 25 28 dB
DC to 100 MHz 18 23 dB

22

500 MHz 17 21 dB

On Switching Time
Off Switching Time
Rise Time
Fall Time

4

4

1 dB Compression
Third Order Intermodulation Intercept IP
Video Feedthrough

4

4

4

5

t
t
t
t
P

ON

OFF

RISE

FALL

–1 dB

3

1000 MHz 15 19 dB
50% CTRL to 90% RF 3.6 6 ns
50% CTRL to 10% RF 5.8 9.5 ns
10% to 90% RF 3.1 5.5 ns
90% to 10% RF 6.0 8.5 ns
1000 MHz 17 dBm
900 MHz/901 MHz, 4 dBm 30 36 dBm

2.5 mV p-p

DC ELECTRICAL CHARACTERISTICS

Input High Voltage V

Input Low Voltage V

Input Leakage Current I

CAPACITANCE

4

INH

V

INH

INL

V

INL

I

VDD = 2.25 V to 2.75 V 1.7 V
VDD = 1.65 V to 1.95 V 0.65 V

CC

V
VDD = 2.25 V to 2.75 V 0.7 V
VDD = 1.65 V to 1.95 V 0.35 VCCV
0 ≤ VIN ≤ 2.75 V ± 0.1 ±1 µA

RF1/RF2, RF Port On Capacitance CRF ON f = 1 MHz 1.2 pF
CTRL Input Capacitance C

CTRL

f = 1 MHz 2.1 pF

POWER REQUIREMENTS

V

DD

Quiescent Power Supply Current I

NOTES

1

Temperature range B Version: –40°C to +85°C.

2

Typical values are at VDD = 2.5 V and 25°C, unless otherwise stated.

3

Point at which insertion loss degrades by 1 dB.

4

Guaranteed by design, not subject to production test.

5

The dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 Ω test setup, measured with
1 ns rise time pulses and 500 MHz bandwidth.

Specifications subject to change without notice.

DD

Digital inputs = 0 V or V

DD

1.65 2.75 V

0.1 1 µA

REV. A–2–

ADG901/ADG902

ABSOLUTE MAXIMUM RATINGS

(TA = 25°C, unless otherwise noted.)

VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4 V

Inputs to GND . . . . . . . . . . . . . . . . . . –0.5 V to V

Continuous Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA

Input Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 dBm

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C

MSOP Package

Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206°C/W

␪

JA

1

+ 0.3 V

DD

LFCSP Package

Thermal Impedance (2-layer board) . . . . . . . . . . 84°C/W

␪

JA

Thermal Impedance (4-layer board) . . . . . . . . . . 48°C/W

␪

2

JA

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300°C

IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . . 235°C

ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 kV

NOTES

1

Stresses above those listed under Absolute Maximum Ratings may cause perma­nent damage to the device. This is a stress rating only and functional operation of
the device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.

2

RF1/2 Off Port Inputs to Ground ................................... –0.5 V to VDD – 0.5 V

ORDERING GUIDE

Model Temperature Range Package Description Package Option Branding

ADG901BRM –40°C to +85°CMini Small Outline Package (MSOP) RM-8 W6B
ADG901BRM-500RL7 –40°C to +85°CMini Small Outline Package (MSOP) RM-8 W6B
ADG901BRM-REEL7 –40°C to +85°CMini Small Outline Package (MSOP) RM-8 W6B
ADG901BCP-500RL7 –40°C to +85°CLead Frame Chip Scale Package (LFCSP) CP-8 W6B
ADG901BCP-REEL7 –40°C to +85°CLead Frame Chip Scale Package (LFCSP) CP-8 W6B
ADG902BRM –40°C to +85°CMini Small Outline Package (MSOP) RM-8 W7B
ADG902BRM-500RL7 –40°C to +85°CMini Small Outline Package (MSOP) RM-8 W7B
ADG902BRM-REEL7 –40°C to +85°CLead Frame Chip Scale Package (LFCSP) RM-8 W7B
ADG902BCP-500RL7 –40°C to +85°CLead Frame Chip Scale Package (LFCSP) CP-8 W7B
ADG902BCP-REEL7 –40°C to +85°CLead Frame Chip Scale Package (LFCSP) CP-8 W7B
EVAL-ADG901EB Evaluation Board
EVAL-ADG902EB Evaluation Board

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADG901/ADG902 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.

PIN CONFIGURATION

8-Lead MSOP (RM-8)

8-Lead 3 mm  3 mm LFCSP (CP-8)

V

CTRL

GND

RF1

DD

1

ADG901/

2

ADG902

3

TOP VIEW

(Not to Scale)

4

8

RF2

7

GND

6

GND

5

GND

Pin No. Mnemonic Function

1V

2 CTRL CMOS or TTL Logic Level.

PIN FUNCTION DESCRIPTIONS

DD

Power Supply Input. These parts can
be operated from 1.65 V to 2.75 V;

should be decoupled to GND.

V

DD

0

➞

RF1 Isolated from RF2

➞

RF1 to RF2

1

3, 5, 6, 7 GND Ground Reference Point for All

Circuitry on the Part.

Table I. Truth Table

4 RF1 RF1 Port.
8 RF2 RF2 Port.

CTRL Signal Path

0 RF1 isolated from RF2
1 RF1 to RF2

REV. A

–3–

ADG901/ADG902

TERMINOLOGY

Parameter Description

V

DD

I

DD

GND Ground (0 V) reference.

CTRL Logic control input.

V

INL

V

INH

I

INL (IINH

C

t

ON

t

OFF

t

RISE

t

FALL

) Input current of the digital input.

IN

Off Isolation The attenuation between input and output ports of the switch when the switch control voltage is in the

Insertion Loss The attenuation between input and output ports of the switch when the switch control voltage is in the

P

–1 dB

IP

3

Return Loss The amount of reflected power relative to the incident power at a port. Large return loss indicates good matching.

Video Feedthrough Spurious signals present at the RF ports of the switch when the control voltage is switched from high to low

Most positive power supply potential.

Positive supply current.

Maximum input voltage for Logic 0.

Minimum input voltage for Logic 1.

Digital input capacitance.

Delay between applying the digital control input and the output switching on.

Delay between applying the digital control input and the output switching off.

Rise time. Time for the RF signal to rise from 10% to 90% of the ON level.

Fall time. Time for the RF signal to fall from 90% to 10% of the ON level.

OFF condition.

ON condition.

1 dB compression point. The RF input power level at which the switch insertion loss increases by 1 dB over its
low level value. It is a measure of how much power the ON switch can handle before the insertion loss increases
by 1 dB.

Third order intermodulation intercept. This is a measure of the power in false tones that occur when closely spaced
tones are passed through a switch, whereby the nonlinearity of the switch causes these false tones to be generated.

By measuring Return Loss the VSWR can be calculated from conversion charts. VSWR (voltage standing wave ratio)
indicates degree of matching present at a switch RF port.

or low to high without an RF signal present.

REV. A–4–

Typical Performance Characteristics–ADG901/ADG902

–0.4

–0.6

0.8

–

VDD = 2.5V

–1.0

–1.2

–1.4

–1.6

–1.8

–2.0

INSERTION LOSS (dB)

–2.2

–2.4

–2.6

TA = 25C

–2.8

–3.0

10k 100k 1M 10M 100M 1G 10G

VDD = 2.25V

VDD = 2.75V

FREQUENCY (Hz)

TPC 1. Insertion Loss vs. Frequency
over Supplies (S12 and S21)

–0.4

–0.6

+25C

0.8

–

–1.0

–1.2

–1.4

–1.6

–1.8

–2.0

–2.2

INSERTION LOSS (dB)

–2.4

–2.6

VDD = 2.5V

–2.8

–3.0

10k 100k 1M 10M 100M 1G 10G

+85C

FREQUENCY (Hz)

–40C

TPC 4. Insertion Loss vs. Frequency
over Temperature (S12 and S21)

–0.40

–0.45

0.50

–

–0.55

VDD = 2.5V

–0.60

–0.65

–0.70

–0.75

–0.80

INSERTION LOSS (dB)

–0.85

–0.90

TA = 25C

–0.95

–1.00

10k 100k 1M 10M 100M 1G 10G

VDD = 2.25V

VDD = 2.75V

FREQUENCY (Hz)

TPC 2. Insertion Loss vs. Frequency
over Supplies (S12 and S21)
(Zoomed TPC 1 Plot)

0

–5

TA = 25C
–10
–15

20

–

–25
–30
–35
–40
–45
–50
–55
–60
–65
–70

ISOLATION (dB)

–75
–80

–85
–90
–95

–100

10k 100k 1M 10M 100M 1G 10G

VDD = 2.5V

FREQUENCY (Hz)

V

DD

= 1.8V

TPC 5. OFF Isolation vs. Frequency
over Supplies (S12 and S21)

–0.4

–0.6

0.8

–

VDD = 1.8V

–1.0

–1.2

–1.4

–1.6

–1.8

–2.0

–2.2

–2.4

INSERTION LOSS (dB)

–2.6

TA = 25C

–2.8

–3.0

10k 100k 1M 10M 100M 1G 10G

VDD = 1.95V

VDD = 1.65V

FREQUENCY (Hz)

TPC 3. Insertion Loss vs. Frequency
over Supplies (S12 and S21)

0

VDD = 2.5V

–5
–10
–15

20

–

–25
–30
–35
–40
–45
–50
–55
–60

ISOLATION (dB)

–65
–70
–75
–80
–85
–90

10k 100k 1M 10M 100M 1G 10G

+85C

+25C

–40C

FREQUENCY (Hz)

TPC 6. OFF Isolation vs. Frequency
over Temperature (S12 and S21)

0

TA = 25C

2.5V

V

–5

DD =

10

–

–15

–20

–25

RETURN LOSS (dB)

–30

–35

10k 100k 1M 10M 100M 1G

OFF SWITCH

ON SWITCH

FREQUENCY (Hz)

TPC 7. Return Loss vs. Frequency
(S11)

REV. A

10G

CH1

CH2

CH1 = CTRL = 1V/DIV t
CH2 = RFx = 100mV/DIV t

TPC 8. Switch Timing

–5–

RISE

FALL

= 2.8ns

= 5.1ns

CTRL

RFx

CH2 pk-pk

2.016mV

CH1 500mV CH2 1mV 10.0ns

TPC 9. Video Feedthrough

ADG901/ADG902

40

35

30

25

20

(dBm)

3

IP

15

10

5

0

250 350 450 550

FREQUENCY (MHz)

650 750 850

TPC 10. IP3 vs. Frequency

VDD = 2.5V

= 25C

T

A

20

18

16

14

12

(dBm)

10

–1dB

8

P

6

4

2

0

0 250 500 750 1000 1250

TPC 11. P

FREQUENCY (MHz)

vs. Frequency

–1dB

VDD = 2.5V

= 25C

T

A

1500

REV. A–6–

ADG901/ADG902

Test Circuits*

V

DD

0.1F

V

DD

RF1

V

S

CTRL

GND

Test Circuit 1. Switching Timing: tON, t

V

DD

0.1F

V

DD

RF1

V

S

CTRL

GND

RF2

RF2

R

50

V

R

50

V

DD

0.1F

V

OUT

R

50

L

50

50

NETWORK

ANALYZER

RF2

V

S

NC

V

ADG901

V

OUT

V

CTRL

L

V

OUT

50% 50%

90%

t

ON

t

10%

OFF

OFF

OUT

V

CTRL

L

V

OUT

10%

t

RISE

50%

90%

90%

t

FALL

50%

10%

RF1

CTRL

V

CTRL

OSCILLOSCOPE

50

DD

RF2

50

GND

INSERTION LOSS

= 20

LOG

V

OUT

V

Test Circuit 4. Insertion Loss

V

DD

0.1F

V

DD

GND

V

ADG901

RF1

50

CTRL

CTRL

S

V

RF1

CTRL

CTRL

Test Circuit 2. Switch Timing: t

V

DD

0.1F

V

50

DD

50

GND

OFF ISOLATION =20 LOG

RF2

ADG901

Test Circuit 3. Off Isolation

, t

RISE

FALL

V

OUT

R

L

50

50

V

S

NETWORK
ANALYZER

V

OUT

V

S

Test Circuit 5. Video Feedthrough

*Similiar setups for ADG902.

REV. A

–7–

ADG901/ADG902

SPECTRUM
ANALYZER

CTRL

V

CTRL

RF1

V

DD

0.1F

V

ADG901

50

DD

GND

Test Circuit 6. IP

50

RF2

3

COMBINER

RF

SOURCE

RF

SOURCE

SPECTRUM
ANALYZER

CTRL

V

CTRL

0.1F

ADG901

RF1

50

Test Circuit 7. P

GND

V

DD

V

DD

RF

SOURCE

RF2

50

–1dB

V

S

REV. A–8–

ADG901/ADG902

APPLICATIONS

The ADG901/ADG902 are ideal solutions for low power, high
frequency applications. The low insertion loss, high isolation
between ports, low distortion, and low current consumption of
these parts make them excellent solutions for many high frequency
switching applications.

Applications include switching between high frequency filters,
ASK generator, and FSK generator.

Absorptive vs. Reflective Switches

The ADG901 is an absorptive (matched) switch with 50 Ω termi-
nated shunt legs, and the ADG902 is a reflective switch with 0 Ω
terminated shunts to ground. The ADG901 absorptive switch
has a good VSWR on each port, regardless of the switch mode.
An absorptive switch should be used when there is a need for a
good VSWR that is looking into the port but not passing the
through signal to the common port. The ADG901 is therefore
ideal for applications that require minimum reflections back to
the RF source. It also ensures that the maximum power is trans­ferred to the load.

The ADG902 reflective switch is suitable for applications where
high off port VSWR does not matter and the switch has some
other desired performance feature. It can be used in many appli­cations, including high speed filter selection. In most cases, an
absorptive switch can be used instead of a reflective switch, but
not vice versa.

ADG9xx EVALUATION BOARD

The ADG9xx evaluation board allows designers to evaluate the
high performance wideband switches with a minimum of effort.

To prove that these devices meet user requirements, the user
requires only a power supply and a network analyzer along with
the evaluation board. An application note is available with the
evaluation board and provides complete information on operating
the evaluation board.

The RF1 port (see Figure 3) is connected through a 50 Ω trans-
mission line to the top left SMA connector J1. RF2 is connected
through a 50 Ω transmission line to the top SMA connector J2.
J3 is connected to GND. A through transmission line connects
J4 and J5 and this transmission line is used to estimate the loss
of the PCB over the environmental conditions being evaluated.

The board is constructed of a 4-layer, FR4 material with a dielec­tric constant of 4.3 and an overall thickness of 0.062 inches. Two
ground layers with grounded planes provide ground for the RF
transmission lines. The transmission lines were designed using a
coplanar waveguide with ground plane model using a trace width
of 0.052 inches, clearance to ground plane of 0.030 inches,
dielectric thickness of 0.029 inches, and a metal thickness of

0.014 inches.

REV. A

Figure 3. ADG9xx Evaluation Board Top View

–9–

ADG901/ADG902

OUTLINE DIMENSIONS

8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters

3.00
BSC

PIN 1

INDICATOR

85

3.00
BSC

1

PIN 1

0.65 BSC

0.15

0.00

0.38

0.22

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-187AA

4.90

BSC

4

SEATING
PLANE

1.10 MAX

0.23

0.08

8
0

0.80

0.60

0.40

8-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm  3 mm Body

(CP-8)

Dimensions shown in millimeters

0.50

0.40

BOTTOM

VIEW

0.30

4

PIN 1 INDICATOR

1

1.50
REF

3.00

BSC SQ

TOP

VIEW

2.75

BSC SQ

0.45

0.50
BSC

0.60 MAX

8

5

1.90

1.75

1.60

0.90

0.85

0.80

SEATING

PLANE

12 MAX

0.30

0.23

0.18

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

0.20 REF

0.25
MIN

1.60

1.45

1.30

REV. A–10–

ADG901/ADG902

Revision History

Location Page

10/04—Data Sheet changed from REV. 0 to REV. A.

Changes to FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Changes to PRODUCT HIGHLIGHTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Changes to SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Changes to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Change to ADG9xx EVALUATION BOARD section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Updated OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

REV. A

–11–

C03336–0–10/04(A)

–12–