Datasheet ADG801, ADG802 Datasheet (ANALOG DEVICES)

<0.4 Ω CMOS 1.8 V to 5.5 V

www.BDTIC.com/ADI

FEATURES

0.4 Ω maximum on resistance @ 125°C

0.08 Ω maximum on resistance flatness @ 125°C

1.8 V to 5.5 V single supply Automotive temperature range from −40°C to +125°C 400 mA current-carrying capability Tiny 6-lead SOT-23, 8-lead MSOP, and 6-ball WLCSP packages 35 ns switching times Low power consumption TTL-/CMOS-compatible inputs Pin compatible with ADG701/ADG702

APPLICATIONS

Power routing Cellular phones Modems PCMCIA cards Hard drives Data acquisition systems Communications systems Relay replacement Battery-powered systems

SPST Switches

ADG801/ADG802

FUNCTIONAL BLOCK DIAGRAM

ADG801

S

ADG802

S

SWITCHES SHOWN FOR

A LOGIC 1 INPUT

Figure 1.

D

IN

D

IN

02800-001

GENERAL DESCRIPTION

The ADG801 and ADG802 are monolithic CMOS, single-pole, single throw (SPST) switches with on resistance of less than

0.4 Ω. These switches are designed using an advanced submicron process that provides extremely low on resistance, high switching speed, and low leakage currents.

The low on resistance of <0.4 Ω makes these parts ideal for a

pplications where low on resistance switching is critical.

The ADG801 switch is normally open (NO), while the ADG802 is n

ormally closed (NC). Each switch conducts equally well in

both directions when on.

PRODUCT HIGHLIGHTS

1. Low on resistance (0.25 Ω typical).

2. 1.8 V t

3. T

4. 400 mA c

5. A

6. P

o 5.5 V single-supply operation.

iny 6-lead SOT-23, 8-lead MSOP, and 6-ball WLCSP

packages.

urrent-carrying capability.

utomotive temperature range from −40°C to +125°C.

in compatible with ADG701 (ADG801) and ADG702

(ADG802).

Rev. A

Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.

ADG801/ADG802

www.BDTIC.com/ADI

REVISION HISTORY

3/07—Rev. 0 to Rev. A

Updated Format..................................................................Universal

Added 6-Ball WLCSP Package (Text and Figures) ........Universal

Replaced Typical Performance Characteristics Section .............. 8

Updated Outline Dimensions....................................................... 12

Changes to Ordering Guide.......................................................... 14

5/02—Revision 0: Initial Version

ESD Caution...................................................................................5

Pin Configuration and Function Descriptions..............................6

Terminology.......................................................................................7

Typical Performance Characteristics..............................................8

Test Circuits..................................................................................... 10

Outline Dimensions....................................................................... 12

Ordering Guide .......................................................................... 14

Rev. A | Page 2 of 16

ADG801/ADG802

www.BDTIC.com/ADI

SPECIFICATIONS

VDD = 5 V ± 10%, GND = 0 V, unless otherwise noted. The automotive temperature range is −40°C to +125°C.

Table 1.

Parameter 25°C −40°C to +85°C −40°C to +125°C1Unit Test Conditions/Comments

ANALOG SWITCH

Analog Signal Range 0 V to VDD V On Resistance (RON) 0.25 Ω typ VS = 0 V to VDD, IS = 100 mA; Test Circuit 1

0.3 0.35 0.4 Ω max VS = 0 V to VDD, IS = 100 mA; Test Circuit 1 On Resistance Flatness (R

0.07 0.08 Ω max LEAKAGE CURRENTS VDD = 5.5 V

Source Off Leakage, IS (Off) ±0.01 nA typ

±0.25 ±3 ±30 nA max

Drain Off Leakage, ID (Off) ±0.01 nA typ

±0.25 ±3 ±30 nA max

Channel On Leakage, ID, IS (On) ±0.01 nA typ VS = VD = 1 V, or 4.5 V; Test Circuit 3 ±0.25 ±3 ±30 nA max VS = VD = 1 V, or 4.5 V; Test Circuit 3 DIGITAL INPUTS

Input High Voltage, V

Input Low Voltage, V

INH

0.8 V max

INL

Input Current

I

or I

0.005 μA typ VIN = V

INL

INH

±0.1 μA max

CIN, Digital Input Capacitance 5 pF typ DYNAMIC CHARACTERISTICS2

tON 35 ns typ RL = 50 Ω, CL = 35 pF

45 50 55 ns max VS = 3 V; Test Circuit 4

t

9 ns typ RL = 50 Ω, CL = 35 pF

OFF

15 18 21 ns max VS = 3 V; Test Circuit 4

Charge Injection 50 pC typ VS = 2.5 V, RS = 0 Ω; CL = 1 nF;

Test Circuit 5

Off Isolation −61 dB typ RL = 50 Ω, CL = 5 pF; f = 100 kHz;

Test Circuit 6

Bandwidth −3 dB 12 MHz typ RL = 50 Ω, CL = 5 pF; Test Circuit 7

CS (Off) 180 pF typ f = 1 MHz

CD (Off) 180 pF typ f = 1 MHz

CD, CS (On) 420 pF typ f = 1 MHz POWER REQUIREMENTS VDD = 5.5 V

IDD 0.001 μA typ Digital inputs = 0 V or 5.5 V

1.0 2.0 μA max

1

On resistance parameters tested with IS = 10 mA.

2

Guaranteed by design, not subject to production test.

) 0.05 Ω typ VS = 0 V to VDD, IS = 100 mA

FLAT(ON)

= 4.5 V/1 V, VD = 1 V/4.5 V; Test

V

S

Circuit 2

= 4.5 V/1 V, VD = 1 V/4.5 V; Test

V

S

Circuit 2

= 4.5 V/1 V, VD = 1 V/4.5 V; Test

V

S

Circuit 2

= 4.5 V/1 V, VD = 1 V/4.5 V; Test

V

S

Circuit 2

2.0 V min

or V

INL

INH

Rev. A | Page 3 of 16

ADG801/ADG802

www.BDTIC.com/ADI

VDD = 2.7 V to 3.6 V, GND = 0 V, unless otherwise noted. The automotive temperature range is −40°C to +125°C.

Table 2.

Parameter 25°C −40°C to +85°C −40°C to +125°C1 Unit Test Conditions/Comments

ANALOG SWITCH

Analog Signal Range 0 V to VDD V On Resistance (RON) 0.4 Ω typ VS = 0 V to VDD, IS = 100 mA; Test Circuit 1

0.6 0.65 0.7 Ω max VS = 0 V to VDD, IS = 100 mA; Test Circuit 1 On Resistance Flatness (R

LEAKAGE CURRENTS VDD = 3.6 V

Source Off Leakage, IS (Off) ±0.01 nA typ VS = 3.3 V/1 V, VD = 1 V/3.3 V; Test Circuit 2 ±0.25 ±3 ±30 nA max VS = 3.3 V/1 V, VD = 1 V/3.3 V; Test Circuit 2 Drain Off Leakage, ID (Off) ±0.01 nA typ VS = 3.3 V/1 V, VD = 1 V/3.3 V; Test Circuit 2 ±0.25 ±3 ±30 nA max VS = 3.3 V/1 V, VD = 1 V/3.3 V; Test Circuit 2

Channel On Leakage, ID, IS (On) ±0.01 nA typ VS = VD = 1 V, or 3.3 V; Test Circuit 3 ±0.25 ±3 ±30 nA max VS = VD = 1 V, or 3.3 V; Test Circuit 3 DIGITAL INPUTS

Input High Voltage, V

Input Low Voltage, V

INL

Input Current

I

or I

0.005 μA typ VIN = V

INL

INH

±0.1 μA max

CIN, Digital Input Capacitance 5 pF typ DYNAMIC CHARACTERISTICS2

tON 40 ns typ RL = 50 Ω, CL = 35 pF

55 60 65 ns max VS = 1.5 V; Test Circuit 4

t

9 ns typ RL = 50 Ω, CL = 35 pF

OFF

15 18 21 ns max VS = 1.5 V; Test Circuit 4

Charge Injection 10 pC typ VS = 1.5 V, RS = 0 Ω, CL = 1 nF; Test Circuit 5

Off Isolation −61 dB typ RL = 50 Ω, CL = 5 pF, f = 100 kHz;

Test Circuit 6

Bandwidth −3 dB 12 MHz typ RL = 50 Ω, CL = 5 pF; Test Circuit 7

CS (Off) 180 pF typ f = 1 MHz

CD (Off) 180 pF typ f = 1 MHz

CD, CS (On) 420 pF typ f = 1 MHz POWER REQUIREMENTS VDD = 3.6 V

IDD 0.001 μA typ Digital inputs = 0 V or 3.6 V

1.0 2.0 μA max

1

On resistance parameters tested with IS = 10 mA.

2

Guaranteed by design, not subject to production test.

) 0.1 0.1 0.1 Ω typ VS = 0 V to VDD, IS = 100 mA

FLAT(ON)

2.0 V min

INH

0.8 V max

or V

INL

INH

Rev. A | Page 4 of 16

ADG801/ADG802

www.BDTIC.com/ADI

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Parameter Rating

VDD to GND −0.3 V to +7 V Analog Inputs1

Digital Inputs1

Continuous Current, Pin S or Pin D 400 mA Peak Current, Pin S or Pin D

Operating Temperature Range

tomotive

Au Storage Temperature Range −65°C to +150°C Junction Temperature (T Package Power Dissipation ( T MSOP

θJA Thermal Impedance 206°C/W

θJC Thermal Impedance 44°C/W SOT-23 (4-Layer Board)

θJA Thermal Impedance 119°C/W

θJC Thermal Impedance 91.99°C/W WLCSP (4-Layer Board)

θJA Thermal Impedance 120°C/W Lead Temperature, Soldering

(10 sec) IR Reflow, Peak Temperature

(<20 sec) Reflow Soldering (Pb-Free)

Peak Temperature 260(+0/−5)°C

Time at Peak Temperature 10 sec to 40 sec

1

Overvoltages at Pin IN, Pin S, or Pin D are clamped by internal diodes. Current should be limited to the maximum ratings provided.

) 150°C

JMAX

−0.3 V to VDD + 0.3 V or mA, whichever occurs first

30

−0.3 V to VDD + 0.3 V or mA, whichever occurs first

30

800 mA, pulsed at 1 ms, 10% duty c

−40°C to +125°C

JMAX

300°C

235°C

ycle max

– TA)/θJA

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Table 3. Truth Table

ADG801 (Pin IN) ADG802 (Pin IN) Switch Condition

0 1 Off 1 0 On

ESD CAUTION

Rev. A | Page 5 of 16

ADG801/ADG802

V

www.BDTIC.com/ADI

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

1

D

2

S

(Not to Scale)

3

GND

NC = NO CONNECT

AD801/

ADG802

TOP VIEW

6

V

DD

5

NC

4

IN

02800-002

Figure 2. 6-Lead SOT-23

(RJ-6)

D

1

ADG801/

2

NC

ADG802

3

NC

TOP VIEW

(Not to Scale)

4

DD

NC = NO CONNECT

S

8

7

GND

6

IN

NC

5

02800-003

Figure 3. 8-Lead MSOP

(RM-8)

BALLA1 INDICATOR

B

A

VDD

1

2

3

(BALL SIDE DO WN)

NC = NO CONNECT

D

NC

S

IN GND

ADG801/

ADG802

TOP VIEW

Not to Scal e

02800-020

Figure 4. 6-Ball 2 ×3 WLCSP

(CB-6-1)

Table 4. Pin Function Descriptions

Pin Number

SOT-23 MSOP WLCSP

Mnemonic

Description

1 1 B1 D Drain Terminal. Can be an input or an output. 2 8 B2 S Source Terminal. Can be an input or an output. 3 7 B3 GND 4 6 A3 IN 5 2, 3, 5 A2 NC 6 4 A1 V

DD

Most Positive Power Supply Potential.

Ground (0 V) Reference. Logic Control Input. Most Positive Power Supply Potential.

Rev. A | Page 6 of 16

ADG801/ADG802

www.BDTIC.com/ADI

TERMINOLOGY

I

(I

)

INL

VDD

The most positive power supply potential.

I

DD

Positive supply current.

GND

Ground (0 V) reference.

S

The source terminal can be an input or an output.

D

The drain terminal can be an input or an output.

IN

Logic control input.

V

(VS)

D

Analog voltage on Terminal D and Terminal S.

R

ON

Ohmic resistance between Terminal D and Terminal S.

R

FLAT(ON)

The difference between the maximum and minimum value of on resistance as measured over the specified analog signal range.

I

(Off)

S

Source leakage current with the switch off.

I

(Off)

D

Drain leakage current with the switch off.

I

, IS (On)

D

Channel leakage current with the switch on.

V

INL

Maximum input voltage for Logic 0.

V

INH

Minimum input voltage for Logic 1.

INH

Input current of the digital input.

C

(Off)

S

The off switch source capacitance is measured with reference to

ground.

C

(Off)

D

The off switch drain capacitance is measured with reference to

ground.

, CS (On)

C

D

The on switch capacitance is measured with reference

ground.

to

C

IN

Digital input capacitance.

t

ON

The delay between applying the digital control input and when t

he output switches on. See Figure 17.

t

OFF

The delay between applying the digital control input and when t

he output switches off.

Charge Injection

A measure of the glitch impulse transferred from the digital in

put to the analog output during switching.

Off Isolation

A measure of unwanted signal coupling through an off switch.

Bandwidth

The frequency at which the output is attenuated by 3 dB.

On Response

The frequency response of the on switch.

Insertion Loss

The loss due to the on resistance of the switch.

Rev. A | Page 7 of 16

ADG801/ADG802

www.BDTIC.com/ADI

TYPICAL PERFORMANCE CHARACTERISTICS

0.50

0.45

0.40

0.35

0.30

0.25

0.20

ON RESISTANCE (Ω)

0.15

0.10

0.05

VDD = 2.7V

VDD = 3.0V

VDD = 3.3V

VDD = 4.5V

VDD = 5.0V

0

0 1.0 2.0 3.0 4.0 5.0 5.5

V

D

(VS) (V)

TA = 25°C

VDD = 5.5V

02800-004

3.5

3.0

2.5

2.0

1.5

1.0

CURRENT (nA)

0.5

–0.5

0

VDD = 5V, 3V

4020

60

TEMPERATURE (°C)

ID (OFF)

80

IS, ID(ON)

100 120

IS (OFF)

02800-007

ON RESISTANCE (Ω)

0.50

0.45

0.40

0.35

0.30

0.25

0.20

0.15

0.10

0.05

0.50

0.45

0.40

0.35

0.30

0.25

0.20

0.15

0.10

0.05

VDD = 5V

0

01.51.00.5

VDD = 3V

0

01.51.00.5

(VS)

D

+125°C

–40°C

2.0 2.5 3.0 3. 5 4.0 4.5 5. 0

–40°C

+85°C

+25°C

VD (VS) (V)

(VS) for Different Temperatures

D

+125°C

+25°C

VD (VS) (V)

2.0 2.5 3.0

+85°C

Figure 8. Leakage Current vs. Temperature Figure 5. On Resistance vs. V

400

TA = 25°C

300

200

100

0

CHARGE INJECTI ON (pC)

–100

–200

01.51.00.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

02800-005

VDD = 3V

VS (V)

VDD = 5V

02800-008

Figure 9. Charge Injection vs. Source Voltage Figure 6. On Resistance vs. V

50

45

t

ON

40

35

30

25

TIME (ns)

20

15

t

OFF

10

5

0

–20 0 20 40 60 80 100 120

–40

02800-006

VDD = 3V

VDD = 5V

VDD = 3V, 5V

TEMPERATURE (°C)

02800-009

Figure 7. On Resistance vs. V

(VS) for Different Temperatures

D

Rev. A | Page 8 of 16

Figure 10. t

Times vs. Temperature

ON/tOFF

ADG801/ADG802

A

–

A

www.BDTIC.com/ADI

10

TA = 25°C V

= 3V, 5V

DD

–20

–30

TION (dB)

–40

–50

ATTENU

–60

–70

0.1 1 10

Figure 11. Off Isolation vs. Fr

0

–1

–2

–3

–4

TION (dB)

–5

–6

ATTENU

–7

TA = 25°C

–8

V

= 3V, 5V

DD

–9

FREQUENCY (MHz)

02800-010

equency

110.2 020

FREQUENCY (MHz)

02800-011

Figure 12. On Response vs. Frequency

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

LOGIC THRESHOLD VOLTAGE (V)

0.2

0

21

VIN RISING

VINFALL ING

345 6

VDD (V)

Figure 13. Logic Threshold Voltage vs. Supply Voltage

02800-012

Rev. A | Page 9 of 16

ADG801/ADG802

V

www.BDTIC.com/ADI

TEST CIRCUITS

I

DS

V1

SD

I

(OFF)

S

SD

A

I

D

(OFF)

A

V

D

SD

NC

02800-014

NC = NO CONNECT

ID(ON)

A

V

D

2800-015

V

S

RON= V1/I

DS

2800-013

Figure 15. Off Leakage Figure 14. On Resistance

Figure 16. On Leakage

0.1µF

V

S

V

S

IN

R

S

DD

V

DD

SD

GND

DD

V

DD

SD

IN

GND

V

OUT

R

C

50Ω

L

35pF

Figure 17. Switching Times

V

OUT

C 1nF

L

V

OUT

Figure 18. Charge Injection

V

IN

V

IN

V

OUT

IN

ADG801

IN

ADG802

ADG801

ADG802

50% 50%

90%

t

ON

Q

= CL × ΔV

INJ

OUT

90%

ΔV

t

OFF

OUT

OFF

02800-016

02800-017

Rev. A | Page 10 of 16

ADG801/ADG802

V

www.BDTIC.com/ADI

0.1µF

DD

NETWORK

V

DD

ANALYZER

IN

V

IN

S

D

GND

50Ω

OFF ISOLATION = 20 log

R 50Ω

L

50Ω

V

S

V

OUT

V

OUT

V

S

02800-018

Figure 19. Off Isolation

0.1µF

IN

V

IN

DD

V

DD

S

D

GND

INSERTION LOSS = 20 log

NETWORK ANALYZER

50Ω

V

OUT

R

L

50Ω

V

WITH SWITCH

OUT

V

WITHOUT SWITCH

OUT

S

02800-019

Figure 20. Bandwidth

Rev. A | Page 11 of 16

ADG801/ADG802

www.BDTIC.com/ADI

OUTLINE DIMENSIONS

1.60 BSC

PIN 1

INDICATOR

1.30

1.15

0.90

0.15 MAX

2.90 BSC

1 3

1.90 BSC

0.50

0.30

4526

0.95 BSC

2.80 BSC

1.45 MAX

SEATING PLANE

0.22

0.08 10°

0.60

4°

0.45

0°

0.30

COMPLIANT TO JEDEC STANDARDS MO-178-AB

Figure 21. 6-Lead Small Outline Transistor Package [SOT-23]

(RJ-6)

Dim

ensions shown in inches and (millimetes)

3.20

3.00

2.80

8

5

4

SEATING PLANE

5.15

4.90

4.65

1.10 MAX

0.23

0.08

8° 0°

0.80

0.60

0.40

3.20

3.00

1

2.80

PIN 1

0.65 BSC

0.95

0.85

0.75

0.15

0.38

0.00

0.22

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-187-AA

Figure 22. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dim

ensions shown in millimeters

Rev. A | Page 12 of 16

ADG801/ADG802

www.BDTIC.com/ADI

0.67

0.57

0.47

SEATING PLANE

0.50 BALL PITCH

0.24 MAX COPLANARITY

0.32 NOM

0.50

BOTTOM VIEW

(BALL SI DE UP)

0.32

0.59

62206-A

BALL 1

IDENTIFIER

1.34

1.14

0.94

TOP VIEW

(BALL SI DE DOWN)

2.38

2.18

1.98

0.44

0.36

0.28

Figure 23. 6-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-6-1)

Dimensions shown in millimeters

Rev. A | Page 13 of 16

ADG801/ADG802

www.BDTIC.com/ADI

ORDERING GUIDE

Model Temperature Range Package Description Package Option Branding

ADG801BCB-REEL7 −40°C to +125°C 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-1 SLB ADG801BCBZ-REEL7 ADG801BRM −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SLB ADG801BRM-REEL −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SLB ADG801BRM-REEL7 −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SLB ADG801BRMZ ADG801BRMZ-REEL ADG801BRMZ-REEL7 ADG801BRT-R2 −40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 SLB ADG801BRT-500RL7 −40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 SLB ADG801BRT-REEL −40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 SLB ADG801BRT-REEL7 −40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 SLB ADG801BRTZ-500RL72−40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 S06 ADG801BRTZ-REEL ADG801BRTZ-REEL7 ADG802BCB-REEL7 −40°C to +125°C 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-1 SMB ADG802BCBZ-REEL7 ADG802BRM-R2 −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SMB ADG802BRM −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SMB ADG802BRM-REEL −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SMB ADG802BRM-REEL7 −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SMB ADG802BRMZ ADG802BRMZ-REEL ADG802BRMZ-REEL7 ADG802BRT-500RL7 −40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 SMB ADG802BRT-REEL −40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 SMB ADG802BRT-REEL7 −40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 SMB ADG802BRTZ-500RL72−40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 S0F ADG802BRTZ-REEL ADG802BRTZ-REEL7

1

Branding on SOT-23 and MSOP packages is limited to three characters due to space constraints.

2

Z = RoHS Compliant Part.

3

2

−40°C to +125°C 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-1 S06

2

−40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 S06

2

−40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 S06

2

−40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 S06

2

−40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 S06

2

−40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 S06

2

−40°C to +125°C 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-1 S0F

−40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 S0F

2

−40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 S0F

2

−40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 S0F

2

−40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 S0F

2

−40°C to +125°C 6-Lead Small Outline Transistor Package [SOT-23] RJ-6 S0F

1

Rev. A | Page 14 of 16

ADG801/ADG802

www.BDTIC.com/ADI

NOTES

Rev. A | Page 15 of 16

ADG801/ADG802

www.BDTIC.com/ADI

NOTES

Rev. A | Page 16 of 16

Datasheet ADG801, ADG802 Datasheet (ANALOG DEVICES)

FEATURES

APPLICATIONS

FUNCTIONAL BLOCK DIAGRAM

GENERAL DESCRIPTION

PRODUCT HIGHLIGHTS

TABLE OF CONTENTS

REVISION HISTORY

SPECIFICATIONS

ABSOLUTE MAXIMUM RATINGS

ESD CAUTION

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

TERMINOLOGY

TYPICAL PERFORMANCE CHARACTERISTICS

TEST CIRCUITS

OUTLINE DIMENSIONS

ORDERING GUIDE