Datasheet ADG721 Datasheet (Analog Devices)

Page 1
CMOS
a

FEATURES

1.8 V to 5.5 V Single Supply 4 (Max) On Resistance Low On Resistance Flatness –3 dB Bandwidth >200 MHz Rail-to-Rail Operation 8-Lead MSOP Package Fast Switching Times
20 ns
t
ON
10 ns
t
OFF
Low Power Consumption (<0.1 W) TTL/CMOS Compatible
APPLICATIONS USB 1.1 Signal Switching Circuits Cell Phones PDAs Battery-Powered Systems Communication Systems Sample Hold Systems Audio Signal Routing Video Switching Mechanical Reed Relay Replacement
Low Voltage 4  Dual SPST Switches
ADG721/ADG722/ADG723

FUNCTIONAL BLOCK DIAGRAMS

IN2
ADG721
S1
D1
S1
D1
IN2
SWITCHES SHOWN FOR A LOGIC "0" INPUT
IN1
D2
S2
ADG723
IN2
ADG722
S1
D1
IN1
D2
S2
IN1
D2
S2

GENERAL DESCRIPTION

The ADG721, ADG722, and ADG723 are monolithic CMOS SPST switches. These switches are designed on an advanced submicron process that provides low power dissipation yet gives high switching speed, low on resistance, and low leakage currents.
The ADG721, ADG722, and ADG723 are designed to operate from a single 1.8 V to 5.5 V supply, making them ideal for use in battery-powered instruments and with the new generation of DACs and ADCs from Analog Devices.
The ADG721, ADG722, and ADG723 contain two independent single-pole/single-throw (SPST) switches. The ADG721 and ADG722 differ only in that both switches are normally open and normally closed, respectively. While in the ADG723, Switch 1 is normally open and Switch 2 is normally closed.
Each switch of the ADG721, ADG722, and ADG723 conducts equally well in both directions when on. The ADG723 exhibits break-before-make switching action.
REV. A

PRODUCT HIGHLIGHTS

1. 1.8 V to 5.5 V Single-Supply Operation.
The ADG721, ADG722, and ADG723 offer high perfor­mance, including low on resistance and fast switching times, and are fully specified and guaranteed with 3 V and 5 V supply rails.
2. Very Low R
At 1.8 V operation, R
(4 W max at 5 V, 10 W max at 3 V).
ON
is typically 40 W over the tempera-
ON
ture range.
3. Low On Resistance Flatness.
4. –3 dB Bandwidth > 200 MHz.
5. Low Power Dissipation.
CMOS construction ensures low power dissipation.
6. Fast t
ON/tOFF
.
7. 8-Lead MSOP.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 © 2004 Analog Devices, Inc. All rights reserved.
Page 2
ADG721/ADG722/ADG723–SPECIFICATIONS
1
(VDD = 5 V 10%, GND = 0 V. All specifications –40C to +85C, unless otherwise noted.)
B Version
–40C to
Parameter +25C +85C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 V to V On Resistance (R
)45 W max VS = 0 V to VDD, IS = –10 mA,
ON
DD
On Resistance Match between
Channels (DR
) 0.3 W typ VS = 0 V to VDD, IS = –10 mA
ON
1.0 W max
On Resistance Flatness (R
FLAT(ON)
)0.85 W typ VS = 0 V to VDD, IS = –10 mA
1.5 W max
LEAKAGE CURRENTS V
Source OFF Leakage I
(OFF) ±0.01 nA typ VS = 4.5 V/1 V, VD = 1 V/4.5 V
S
±0.25 ±0.35 nA max Test Circuit 2
Drain OFF Leakage I
(OFF) ±0.01 nA typ VS = 4.5 V/1 V, VD = 1 V/4.5 V
D
±0.25 ±0.35 nA max Test Circuit 2
Channel ON Leakage I
, IS (ON) ±0.01 nA typ VS = VD = 1 V, or VS = VD = 4.5 V
D
±0.25 ±0.35 nA max Test Circuit 3
DIGITAL INPUTS
Input High Voltage, V Input Low Voltage, V
INL
INH
2.4 V min
0.8 V max
Input Current
I
INL
or I
INH
0.005 mA typ VIN = V ±0.1 mA max
DYNAMIC CHARACTERISTICS
t
ON
2
14 ns typ RL = 300 W, CL = 35 pF
20 ns max V
t
OFF
6 ns typ RL = 300 W, CL = 35 pF
10 ns max V
Break-Before-Make Time Delay, t
7 ns typ RL = 300 W, CL = 35 pF,
D
(ADG723 Only) 1 ns min V
Charge Injection 2 pC typ V
Off Isolation –60 dB typ R
–80 dB typ R
Channel-to-Channel Crosstalk –77 dB typ R
–97 dB typ R
Bandwidth –3 dB 200 MHz typ R C
(OFF) 7 pF typ
S
(OFF) 7 pF typ
C
D
CD, CS (ON) 18 pF typ
POWER REQUIREMENTS V
I
DD
0.001 mA typ
1.0 mA max
NOTES
1
Temperature range: B Version, –40C to +85C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
V
Test Circuit 1
= 5.5 V
DD
or V
INL
= 3 V, Test Circuit 4
S
= 3 V, Test Circuit 4
S
= VS2 = 3 V, Test Circuit 5
S1
= 2 V; RS = 0 W, CL = 1 nF,
S
INH
Test Circuit 6
= 50 W, CL = 5 pF, f = 10 MHz
L
= 50 W, CL = 5 pF, f = 1 MHz,
L
Test Circuit 7
= 50 W, CL = 5 pF, f = 10 MHz
L
= 50 W, CL = 5 pF, f = 1 MHz,
L
Test Circuit 8
= 50 W, CL = 5 pF, Test Circuit 9
L
= 5.5 V
DD
Digital Inputs = 0 V or 5 V
–2–
REV. A
Page 3
ADG721/ADG722/ADG723
1
SPECIFICATIONS
Parameter +25C +85C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 V to V On Resistance (R
On Resistance Match between
Channels (DR
On Resistance Flatness (R
LEAKAGE CURRENTS V
Source OFF Leakage I
Drain OFF Leakage I
Channel ON Leakage I
DIGITAL INPUTS
Input High Voltage, V Input Low Voltage, V Input Current
or I
I
INL
INH
DYNAMIC CHARACTERISTICS
t
ON
t
OFF
Break-Before-Make Time Delay, t
(ADG723 Only) 1 ns min V
Charge Injection 2 pC typ V
Off Isolation –60 dB typ R
Channel-to-Channel Crosstalk –77 dB typ R
Bandwidth –3 dB 200 MHz typ R
(OFF) 7 pF typ
C
S
(OFF) 7 pF typ
C
D
CD, CS (ON) 18 pF typ
POWER REQUIREMENTS V
I
DD
NOTES
1
Temperature range: B Version, –40C to +85C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
) 6.5 W typ VS = 0 V to VDD, IS = –10 mA
ON
) 0.3 W typ VS = 0 V to VDD, IS = –10 mA
ON
(OFF) ±0.01 nA typ VS = 3 V/1 V, VD = 1 V/3 V
S
(OFF) ±0.01 nA typ VS = 3 V/1 V, VD = 1 V/3 V
D
, IS (ON) ±0.01 nA typ VS = VD = 1 V, or 3 V
D
INH
INL
(VDD = 3 V 10%, GND = 0 V. All specifications –40C to +85C, unless otherwise noted.)
B Version
–40C to
DD
V
10 W max Test Circuit 1
1.0 W max
FLAT(ON)
) 3.5 W typ VS = 0 V to VDD, IS = –10 mA
= 3.3 V
DD
±0.25 ±0.35 nA max Test Circuit 2
±0.25 ±0.35 nA max Test Circuit 2
±0.25 ±0.35 nA max Test Circuit 3
2.0 V min
0.4 V max
0.005 mA typ VIN = V
INL
±0.1 mA max
2
16 ns typ RL = 300 W, CL = 35 pF
24 ns max V
= 2 V, Test Circuit 4
S
7 ns typ RL = 300 W, CL = 35 pF
11 ns max V
7 ns typ RL = 300 W, CL = 35 pF,
D
= 2 V, Test Circuit 4
S
= VS2 = 2 V, Test Circuit 5
S1
= 1.5 V; RS = 0 W, CL = 1 nF,
S
Test Circuit 6
= 50 W, CL = 5 pF, f = 10 MHz
L
–80 dB typ R
= 50 W, CL = 5 pF, f = 1 MHz,
L
Test Circuit 7
= 50 W, CL = 5 pF, f = 10 MHz
L
–97 dB typ R
= 50 W, CL = 5 pF, f = 1 MHz,
L
Test Circuit 8
= 50 W, CL = 5 pF,
L
Test Circuit 9
= 3.3 V
DD
Digital Inputs = 0 V or 3 V
0.001 mA typ
1.0 mA max
or V
INH
REV. A
–3–
Page 4
ADG721/ADG722/ADG723

ABSOLUTE MAXIMUM RATINGS

(TA = 25°C unless otherwise noted)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog, Digital Inputs
2
. . . . . . . . . . –0.3 V to VDD + 0.3 V or
1
30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
MSOP Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206°C/W
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 44°C/W
θ
JC
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time.
2
Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
Table I. Truth Table (ADG721/ADG722)
ADG721 In ADG722 In Switch Condition
01OFF 10ON
Table II. Truth Table (ADG723)
Logic Switch 1 Switch 2
0 OFF ON 1ONOFF

ORDERING GUIDE

Model Temperature Range Branding1Package Description Package Option
ADG721BRM –40°C to +85°C S6B MSOP RM-8 ADG721BRM-REEL –40°C to +85°C S6B MSOP RM-8 ADG721BRM-REEL7 –40°C to +85°C S6B MSOP RM-8 ADG721BRMZ ADG721BRMZ-REEL ADG721BRMZ-REEL7
2
–40°C to +85°C S6B MSOP RM-8
2
–40°C to +85°C S6B MSOP RM-8
2
–40°C to +85°C S6B MSOP RM-8 ADG722BRM –40°C to +85°C S7B MSOP RM-8 ADG722BRM-REEL –40°C to +85°C S7B MSOP RM-8 ADG722BRM-REEL7 –40°C to +85°C S7B MSOP RM-8 ADG722BRMZ ADG722BRMZ-REEL ADG722BRMZ-REEL7
2
–40°C to +85°C S7B MSOP RM-8
2
–40°C to +85°C S7B MSOP RM-8
2
–40°C to +85°C S7B MSOP RM-8 ADG723BRM –40°C to +85°C S8B MSOP RM-8 ADG723BRM-REEL –40°C to +85°C S8B MSOP RM-8 ADG723BRM-REEL7 –40°C to +85°C S8B MSOP RM-8
NOTES
1
Branding = Due to package size limitations, these three characters represent the part number.
2
Z = Pb-free part.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG721/ADG722/ADG723 feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–4–
REV. A
Page 5

PIN CONFIGURATION

8-Lead MSOP (RM-8)
ADG721/ADG722/ADG723
8
V
DD
7
IN1
6
D2
5
S2
IN2
GND
S1
D1
1
ADG721/
2
ADG722/
ADG723
3
TOP VIEW
4
(Not to Scale)

TERMINOLOGY

V
DD
Most Positive Power Supply Potential.
GND Ground (0 V) Reference.
S Source Terminal. May be an input or output.
DDrain Terminal. May be an input or output.
IN Logic Control Input.
R
ON
DR
ON
R
FLAT(ON)
Ohmic resistance between D and S.
On resistance match between any two channels i.e., R
max – R
ON
ON
min.
Flatness is defined as the difference between the maximum and minimum value of on resitance as measured over the specified analog signal range.
(OFF) Source leakage current with the switch OFF.
I
S
(OFF) Drain leakage current with the switch OFF.
I
D
, IS (ON) Channel leakage current with the switch ON.
I
D
)Analog voltage on terminals D, S.
V
D (VS
(OFF) OFF Switch Source Capacitance.
C
S
(OFF) OFF Switch Drain Capacitance.
C
D
, CS (ON) ON Switch Capacitance.
C
D
t
t t
ON
OFF
D
Delay between applying the digital control input and the output switching on.
Delay between applying the digital control input and the output switching off. OFF time or ON time measured between the 90% points of both switches, when
switching from one address state to another (ADG723 Only).
Crosstalk A measure of unwanted signal that is coupled through from one channel to another as a
result of parasitic capacitance.
Off Isolation A measure of unwanted signal coupling through an OFF switch.
Charge Injection A measure of the glitch impulse transferred during switching.
REV. A
–5–
Page 6
ADG721/ADG722/ADG723
–Typical Performance Characteristics
R
ON
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
VDD = +2.7V
VDD = +4.5V
VDD = +3.0V
0 0.5
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VD OR VS – DRAIN OR SOURCE VOLTAGE – V
VDD = +5.0V
TA = +25C
Figure 1. On Resistance as a Function of VD (VS) Single Supplies
6.0
5.0
4.0
3.0
ON
R
2.0
–40C
+85C
VDD = +3V
+25C
1m
VDD = +5V
100
10
– A
1
SUPPLY
I
100n
10n
1n
100 1k 10k 100k
10 1M
FREQUENCY – Hz
10M
Figure 4. Supply Current vs. Input Switching Frequency
–30
VDD = +3V, +5V
–40
–50
–60
–70
OFF ISOLATION – dB
–80
1.0
0
0 0.5
VD OR VS – DRAIN OR SOURCE VOLTAGE – V
1.0 1.5 2.0 2.5 3.0
Figure 2. On Resistance as a Function of VD (VS) for Different Temperatures, VDD = 3 V
R
6.0
5.5
5.0
4.5
4.0
3.5
3.0
ON
2.5
2.0
1.5
1.0
0.5
0
0 0.5
+25C
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VD OR VS – DRAIN OR SOURCE VOLTAGE – V
+85C
–40C
VDD = +5V
Figure 3. On Resistance as a Function of VD (VS) for Different Temperatures, VDD = 5 V
–90
–100
10k 100k
1M
FREQUENCY – Hz
Figure 5. Off Isolation vs. Frequency
–30
VDD = +3V, +5V
–40
–50
–60
–70
–80
CROSSTALK – dB
–90
–100
–110
10k 100k
1M
FREQUENCY – Hz
Figure 6. Crosstalk vs. Frequency
10M 100M
10M 100M
–6–
REV. A
Page 7
–6
VDD = +5V
–7
–8
–9
–10
ON RESPONSE – dB
–11
ADG721/ADG722/ADG723
–12
Figure 7. On Response vs. Frequency

Test Circuits

I
DS
V1
SD
V
S
Test Circuit 1. On Resistance
RON = V1/I
V
FREQUENCY – Hz
DS
S
IN
1M100 1k 10k 100k 10M
100M
V
S
Test Circuit 2. Off Leakage
V
DD
0.1F
V
DD
SD
R 300
GND
IS (OFF) ID (OFF)
SD
A A
V
D
ADG721
V
IN
V
OUT
C
L
L
35pF
V
IN
ADG722
V
OUT
V
S
Test Circuit 3. On Leakage
50% 50%
50% 50%
90% 90%
t
ON
SD
t
OFF
ID (ON)
A
V
D
REV. A
Test Circuit 4. Switching Times
V
DD
0.1F
V
V
V
OUT1
OUT2
IN
0V
0V
0V
V
V
S1
V
S2
S1 D1
S2
IN1, IN2
V
IN
DD
GND
V
C
L1
35pF
OUT1
R
OUT2
L1
300
D2
R 300
V
C
L2
L2
35pF
50% 50%
90%
90%
t
D
t
90%
90%
D
Test Circuit 5. Break-Before-Make Time Delay, tD (ADG723 Only)
–7–
Page 8
ADG721/ADG722/ADG723
R
S
V
S
V
DD
0.1F
V
DD
SD
V
S
IN
V
IN
GND
SD
IN
V
DD
V
DD
V
IN
V
OUT
GND
C 1nF
V
OUT
L
Test Circuit 6. Charge Injection
V
OUT
R
L
50
SW ON
V
SW OFF
V
V
DD
V
DD
GND
OUT
R 50
V
OUT
L
Q
= CL  V
INJ
V
S
IN
OUT
0.1F
SD
IN
Test Circuit 7. Off Isolation
V
DD
0.1F
V
NC
DD
SD
V
V
S
IN1
SD
GND
CHANNEL-TO-CHANNEL
CROSSTALK
= 20 LOG V
S/VOUT
50
V
IN2
Test Circuit 8. Channel-to-Channel Crosstalk
R 50
Test Circuit 9. Bandwidth
V
OUT
L
–8–
REV. A
Page 9
ADG721/ADG722/ADG723

APPLICATIONS INFORMATION

The ADG721/ADG722/ADG723 belong to Analog Devices’ new family of CMOS switches. This series of general-purpose switches has improved switching times, lower on resistance, higher bandwidths, low power consumption, and low leakage currents.

ADG721/ADG722/ADG723 Supply Voltages

Functionality of the ADG721/ADG722/ADG723 extends from
1.8 V to 5.5 V single supply, which makes it ideal for battery­powered instruments, where important design parameters are power efficiency and performance.
It is important to note that the supply voltage affects the input signal range, the on resistance, and the switching times of the part. By taking a look at the typical performance characteristics and the specifications, the effects of the power supplies can be clearly seen.
For V
= 1.8 V, on resistance is typically 40 W over the tem-
DD
perature range.

On Response vs. Frequency

Figure 8 illustrates the parasitic components that affect the ac performance of CMOS switches (the switch is shown surrounded by a box). Additional external capacitances will further degrade some performance. These capacitances affect feedthrough, crosstalk, and system bandwidth.
C
DS
S
R
V
IN
ON
D
C
C
D
LOAD
R
LOAD
V
OUT
Figure 8. Switch Represented by Equivalent Parasitic Components
The transfer function that describes the equivalent diagram of the switch (Figure 8) is of the form (A)s shown below.
A(s) = R
È
s(RONCDS) +1
Í
T
Í
s(R
ONCTRT
Î
) +1
˘ ˙ ˙
˚
where:
= C
C
T
RT = R
LOAD
LOAD
+ CD + C /(R
LOAD
+ RON)
DS
The signal transfer characteristic is dependent on the switch channel capacitance, C
. This capacitance creates a frequency
DS
zero in the numerator of the transfer function A(s). Because the switch on resistance is small, this zero usually occurs at high frequencies. The bandwidth is a function of the switch output capacitance combined with CDS and the load capacitance. The frequency pole corresponding to these capacitances appears in the denominator of A(s).
The dominant effect of the output capacitance, C
, causes the
D
pole breakpoint frequency to occur first. Therefore, in order to maximize bandwidth, a switch must have a low input and output capacitance and low on resistance. See Figure 7.
Off Isolation
Off isolation is a measure of the input signal coupled through an off switch to the switch output. The capacitance, C
, couples
DS
the input signal to the output load, when the switch is off as shown in Figure 9.
C
DS
S
V
IN
D
C
C
D
LOAD
R
LOAD
V
OUT
Figure 9. Off Isolation Is Affected by External Load Resis­tance and Capacitance
The larger the value of CDS, the larger the values of feedthrough that are produced. The typical performance characteristic graph of Figure 5 illustrates the drop in off isolation as a function of frequency. From dc to roughly 1 MHz, the switch shows better than –80 dB isolation. Up to frequencies of 10 MHz, the off isolation remains better than –60 dB. As the frequency increases, more and more of the input signal is coupled through to the output. Off isolation can be maximized by choosing a switch with the smallest C
as possible. The values of load resistance
DS
and capacitance also affect off isolation, as they contribute to the coefficients of the poles and zeros in the transfer function of the switch when open.
A(s) =
È Í Í
Î
s(R
LOAD
s(R
)(C
LOADCDS
+ CD+ CDS) +1
LOAD
)
˘ ˙ ˙
˚
REV. A
–9–
Page 10
ADG721/ADG722/ADG723

OUTLINE DIMENSIONS

8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
3.00 BSC
85
3.00 BSC
1
PIN 1
0.65 BSC
0.15
0.00
0.38
0.22
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187AA
4
SEATING PLANE
4.90 BSC
1.10 MAX
0.23
0.08
8
0
0.80
0.60
0.40
–10–
REV. A
Page 11
ADG721/ADG722/ADG723

Revision History

Location Page
3/04—Data Sheet changed from REV. 0 to REV. A.
Additions to APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Changes to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Updated OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
REV. A
–11–
Page 12
C00045–0–3/04(A)
–12–
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