1.8 V to 5.5 V Single Supply
4 (Max) On Resistance
Low On Resistance Flatness
–3 dB Bandwidth >200 MHz
Rail-to-Rail Operation
8-Lead MSOP Package
Fast Switching Times
20 ns
t
ON
10 ns
t
OFF
Low Power Consumption (<0.1 W)
TTL/CMOS Compatible
APPLICATIONS
USB 1.1 Signal Switching Circuits
Cell Phones
PDAs
Battery-Powered Systems
Communication Systems
Sample Hold Systems
Audio Signal Routing
Video Switching
Mechanical Reed Relay Replacement
Low Voltage 4 Dual SPST Switches
ADG721/ADG722/ADG723
FUNCTIONAL BLOCK DIAGRAMS
IN2
ADG721
S1
D1
S1
D1
IN2
SWITCHES SHOWN FOR A LOGIC "0" INPUT
IN1
D2
S2
ADG723
IN2
ADG722
S1
D1
IN1
D2
S2
IN1
D2
S2
GENERAL DESCRIPTION
The ADG721, ADG722, and ADG723 are monolithic CMOS
SPST switches. These switches are designed on an advanced
submicron process that provides low power dissipation yet gives
high switching speed, low on resistance, and low leakage currents.
The ADG721, ADG722, and ADG723 are designed to operate
from a single 1.8 V to 5.5 V supply, making them ideal for use
in battery-powered instruments and with the new generation of
DACs and ADCs from Analog Devices.
The ADG721, ADG722, and ADG723 contain two independent
single-pole/single-throw (SPST) switches. The ADG721 and
ADG722 differ only in that both switches are normally open and
normally closed, respectively. While in the ADG723, Switch 1 is
normally open and Switch 2 is normally closed.
Each switch of the ADG721, ADG722, and ADG723 conducts
equally well in both directions when on. The ADG723 exhibits
break-before-make switching action.
REV. A
PRODUCT HIGHLIGHTS
1. 1.8 V to 5.5 V Single-Supply Operation.
The ADG721, ADG722, and ADG723 offer high performance, including low on resistance and fast switching times,
and are fully specified and guaranteed with 3 V and 5 V
supply rails.
2. Very Low R
At 1.8 V operation, R
(4 W max at 5 V, 10 W max at 3 V).
ON
is typically 40 W over the tempera-
ON
ture range.
3. Low On Resistance Flatness.
4. –3 dB Bandwidth > 200 MHz.
5. Low Power Dissipation.
CMOS construction ensures low power dissipation.
6. Fast t
ON/tOFF
.
7. 8-Lead MSOP.
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2
Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be
ADG721BRM–40°C to +85°CS6BMSOPRM-8
ADG721BRM-REEL–40°C to +85°CS6BMSOPRM-8
ADG721BRM-REEL7–40°C to +85°CS6BMSOPRM-8
ADG721BRMZ
ADG721BRMZ-REEL
ADG721BRMZ-REEL7
2
–40°C to +85°CS6BMSOPRM-8
2
–40°C to +85°CS6BMSOPRM-8
2
–40°C to +85°CS6BMSOPRM-8
ADG722BRM–40°C to +85°CS7BMSOPRM-8
ADG722BRM-REEL–40°C to +85°CS7BMSOPRM-8
ADG722BRM-REEL7–40°C to +85°CS7BMSOPRM-8
ADG722BRMZ
ADG722BRMZ-REEL
ADG722BRMZ-REEL7
2
–40°C to +85°CS7BMSOPRM-8
2
–40°C to +85°CS7BMSOPRM-8
2
–40°C to +85°CS7BMSOPRM-8
ADG723BRM–40°C to +85°CS8BMSOPRM-8
ADG723BRM-REEL–40°C to +85°CS8BMSOPRM-8
ADG723BRM-REEL7–40°C to +85°CS8BMSOPRM-8
NOTES
1
Branding = Due to package size limitations, these three characters represent the part number.
2
Z = Pb-free part.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADG721/ADG722/ADG723 feature proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–4–
REV. A
Page 5
PIN CONFIGURATION
8-Lead MSOP (RM-8)
ADG721/ADG722/ADG723
8
V
DD
7
IN1
6
D2
5
S2
IN2
GND
S1
D1
1
ADG721/
2
ADG722/
ADG723
3
TOP VIEW
4
(Not to Scale)
TERMINOLOGY
V
DD
Most Positive Power Supply Potential.
GNDGround (0 V) Reference.
SSource Terminal. May be an input or output.
DDrain Terminal. May be an input or output.
INLogic Control Input.
R
ON
DR
ON
R
FLAT(ON)
Ohmic resistance between D and S.
On resistance match between any two channels i.e., R
max – R
ON
ON
min.
Flatness is defined as the difference between the maximum and minimum value of on
resitance as measured over the specified analog signal range.
(OFF)Source leakage current with the switch OFF.
I
S
(OFF)Drain leakage current with the switch OFF.
I
D
, IS (ON)Channel leakage current with the switch ON.
I
D
)Analog voltage on terminals D, S.
V
D (VS
(OFF)OFF Switch Source Capacitance.
C
S
(OFF)OFF Switch Drain Capacitance.
C
D
, CS (ON)ON Switch Capacitance.
C
D
t
t
t
ON
OFF
D
Delay between applying the digital control input and the output switching on.
Delay between applying the digital control input and the output switching off.
OFF time or ON time measured between the 90% points of both switches, when
switching from one address state to another (ADG723 Only).
CrosstalkA measure of unwanted signal that is coupled through from one channel to another as a
result of parasitic capacitance.
Off IsolationA measure of unwanted signal coupling through an OFF switch.
Charge Injection A measure of the glitch impulse transferred during switching.
REV. A
–5–
Page 6
ADG721/ADG722/ADG723
–Typical Performance Characteristics
–
R
ON
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
VDD = +2.7V
VDD = +4.5V
VDD = +3.0V
00.5
1.0 1.52.0 2.53.0 3.54.0 4.55.0
VD OR VS – DRAIN OR SOURCE VOLTAGE – V
VDD = +5.0V
TA = +25C
Figure 1. On Resistance as a Function of VD (VS) Single
Supplies
6.0
5.0
4.0
–
3.0
ON
R
2.0
–40C
+85C
VDD = +3V
+25C
1m
VDD = +5V
100
10
– A
1
SUPPLY
I
100n
10n
1n
1001k10k100k
101M
FREQUENCY – Hz
10M
Figure 4. Supply Current vs. Input Switching Frequency
–30
VDD = +3V, +5V
–40
–50
–60
–70
OFF ISOLATION – dB
–80
1.0
0
00.5
VD OR VS – DRAIN OR SOURCE VOLTAGE – V
1.01.52.02.53.0
Figure 2. On Resistance as a Function of VD (VS) for
Different Temperatures, VDD = 3 V
–
R
6.0
5.5
5.0
4.5
4.0
3.5
3.0
ON
2.5
2.0
1.5
1.0
0.5
0
00.5
+25C
1.0 1.52.0 2.53.0 3.54.0 4.55.0
VD OR VS – DRAIN OR SOURCE VOLTAGE – V
+85C
–40C
VDD = +5V
Figure 3. On Resistance as a Function of VD (VS) for
Different Temperatures, VDD = 5 V
–90
–100
10k100k
1M
FREQUENCY – Hz
Figure 5. Off Isolation vs. Frequency
–30
VDD = +3V, +5V
–40
–50
–60
–70
–80
CROSSTALK – dB
–90
–100
–110
10k100k
1M
FREQUENCY – Hz
Figure 6. Crosstalk vs. Frequency
10M100M
10M100M
–6–
REV. A
Page 7
–6
VDD = +5V
–7
–8
–9
–10
ON RESPONSE – dB
–11
ADG721/ADG722/ADG723
–12
Figure 7. On Response vs. Frequency
Test Circuits
I
DS
V1
SD
V
S
Test Circuit 1. On Resistance
RON = V1/I
V
FREQUENCY – Hz
DS
S
IN
1M1001k10k100k10M
100M
V
S
Test Circuit 2. Off Leakage
V
DD
0.1F
V
DD
SD
R
300
GND
IS (OFF)ID (OFF)
SD
AA
V
D
ADG721
V
IN
V
OUT
C
L
L
35pF
V
IN
ADG722
V
OUT
V
S
Test Circuit 3. On Leakage
50%50%
50%50%
90%90%
t
ON
SD
t
OFF
ID (ON)
A
V
D
REV. A
Test Circuit 4. Switching Times
V
DD
0.1F
V
V
V
OUT1
OUT2
IN
0V
0V
0V
V
V
S1
V
S2
S1D1
S2
IN1, IN2
V
IN
DD
GND
V
C
L1
35pF
OUT1
R
OUT2
L1
300
D2
R
300
V
C
L2
L2
35pF
50%50%
90%
90%
t
D
t
90%
90%
D
Test Circuit 5. Break-Before-Make Time Delay, tD (ADG723 Only)
–7–
Page 8
ADG721/ADG722/ADG723
R
S
V
S
V
DD
0.1F
V
DD
SD
V
S
IN
V
IN
GND
SD
IN
V
DD
V
DD
V
IN
V
OUT
GND
C
1nF
V
OUT
L
Test Circuit 6. Charge Injection
V
OUT
R
L
50
SW ON
V
SW OFF
V
V
DD
V
DD
GND
OUT
R
50
V
OUT
L
Q
= CL V
INJ
V
S
IN
OUT
0.1F
SD
IN
Test Circuit 7. Off Isolation
V
DD
0.1F
V
NC
DD
SD
V
V
S
IN1
SD
GND
CHANNEL-TO-CHANNEL
CROSSTALK
= 20 LOG V
S/VOUT
50
V
IN2
Test Circuit 8. Channel-to-Channel Crosstalk
R
50
Test Circuit 9. Bandwidth
V
OUT
L
–8–
REV. A
Page 9
ADG721/ADG722/ADG723
APPLICATIONS INFORMATION
The ADG721/ADG722/ADG723 belong to Analog Devices’
new family of CMOS switches. This series of general-purpose
switches has improved switching times, lower on resistance,
higher bandwidths, low power consumption, and low leakage
currents.
ADG721/ADG722/ADG723 Supply Voltages
Functionality of the ADG721/ADG722/ADG723 extends from
1.8 V to 5.5 V single supply, which makes it ideal for batterypowered instruments, where important design parameters are
power efficiency and performance.
It is important to note that the supply voltage affects the input
signal range, the on resistance, and the switching times of the
part. By taking a look at the typical performance characteristics
and the specifications, the effects of the power supplies can be
clearly seen.
For V
= 1.8 V, on resistance is typically 40 W over the tem-
DD
perature range.
On Response vs. Frequency
Figure 8 illustrates the parasitic components that affect the ac
performance of CMOS switches (the switch is shown surrounded
by a box). Additional external capacitances will further degrade
some performance. These capacitances affect feedthrough,
crosstalk, and system bandwidth.
C
DS
S
R
V
IN
ON
D
C
C
D
LOAD
R
LOAD
V
OUT
Figure 8. Switch Represented by Equivalent Parasitic
Components
The transfer function that describes the equivalent diagram of
the switch (Figure 8) is of the form (A)s shown below.
A(s) = R
È
s(RONCDS) +1
Í
T
Í
s(R
ONCTRT
Î
) +1
˘
˙
˙
˚
where:
= C
C
T
RT = R
LOAD
LOAD
+ CD + C
/(R
LOAD
+ RON)
DS
The signal transfer characteristic is dependent on the switch
channel capacitance, C
. This capacitance creates a frequency
DS
zero in the numerator of the transfer function A(s). Because the
switch on resistance is small, this zero usually occurs at high
frequencies. The bandwidth is a function of the switch output
capacitance combined with CDS and the load capacitance. The
frequency pole corresponding to these capacitances appears in
the denominator of A(s).
The dominant effect of the output capacitance, C
, causes the
D
pole breakpoint frequency to occur first. Therefore, in order to
maximize bandwidth, a switch must have a low input and
output capacitance and low on resistance. See Figure 7.
Off Isolation
Off isolation is a measure of the input signal coupled through an
off switch to the switch output. The capacitance, C
, couples
DS
the input signal to the output load, when the switch is off as
shown in Figure 9.
C
DS
S
V
IN
D
C
C
D
LOAD
R
LOAD
V
OUT
Figure 9. Off Isolation Is Affected by External Load Resistance and Capacitance
The larger the value of CDS, the larger the values of feedthrough
that are produced. The typical performance characteristic graph
of Figure 5 illustrates the drop in off isolation as a function of
frequency. From dc to roughly 1 MHz, the switch shows better
than –80 dB isolation. Up to frequencies of 10 MHz, the off
isolation remains better than –60 dB. As the frequency increases,
more and more of the input signal is coupled through to the
output. Off isolation can be maximized by choosing a switch
with the smallest C
as possible. The values of load resistance
DS
and capacitance also affect off isolation, as they contribute to
the coefficients of the poles and zeros in the transfer function of
the switch when open.