Datasheet ADG708 Datasheet (ANALOG DEVICES)

CMOS, 1.8 V to 5.5 V/±2.5 V, 3 Ω

S1S

www.BDTIC.com/ADI

FEATURES

1.8 V to 5.5 V single supply ±2.5 V dual supply 3 Ω on resistance

0.75 Ω on resistance flatness 100 pA leakage currents 14 ns switching times Single 8-to-1 multiplexer ADG708 Differential 4-to-1 multiplexer ADG709 16-lead TSSOP package Low power consumption TTL-/CMOS-compatible inputs

APPLICATIONS

Data acquisition systems Communication systems Relay replacement Audio and video switching Battery-powered systems

Low Voltage 4-/8-Channel Multiplexers

ADG708/ADG709

FUNCTIONAL BLOCK DIAGRAMS

ADG708

S1A

S4A

S1B

8

1 OF 8

DECODER

A0DA1 A2

Figure 1. Figure 2.

EN

S4B

00041-001

ADG709

1 OF 4

DECODER

A0

A1

EN

DA

DB

00041-002

GENERAL DESCRIPTION

The ADG708 and ADG709 are low voltage, CMOS analog multiplexers comprising eight single channels and four differential channels, respectively. The ADG708 switches one of eight inputs (S1 to S8) to a common output, D, as determined by the 3-bit binary address lines A0, A1, and A2. The ADG709 switches one of four differential inputs to a common differential output as determined by the 2-bit binary address lines A0 and A1. An EN input on both devices is used to enable or disable the device. When disabled, all channels are switched off.

Low power consumption and an operating supply range of

1.8 V to 5.5 V make the ADG708 and ADG709 ideal for battery-powered, portable instruments. All channels exhibit break-before-make switching action preventing momentary shorting when switching channels.

These switches are designed on an enhanced submicron process that provides low power dissipation yet gives high switching speed, very low on resistance, and leakage currents.

On resistance is in the region of a few ohms and is closely matched between switches and very flat over the full signal range. These parts can operate equally well as either multiplexers or demultiplexers and have an input signal range that extends to the supplies.

The ADG708 and ADG709 are available in 16-lead TSSOP packages.

PRODUCT HIGHLIGHTS

1. Single-/dual-supply operation. The ADG708 and ADG709

are fully specified and guaranteed with 3 V and 5 V single supply and ±2.5 V dual-supply rails.

2. Low R

3. Low power consumption (<0.01 μW).

4. Guaranteed break-before-make switching action.

5. Small 16-lead TSSOP package.

(3 Ω typical).

ON

Rev. B

Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.

ADG708/ADG709

www.BDTIC.com/ADI

REVISION HISTORY

8/06−Rev. A to Rev. B

Updated Format.................................................................. Universal

Changes to Absolute Maximum Ratings Section..........................9

Added Table 7 and Table 8 .............................................................10

Updated Outline Dimensions........................................................18

Changes to Ordering Guide...........................................................18

4/02—Rev. 0 to Rev. A

E

dits to FEATURES and PRODUCT HIGHLIGHTS..................1

Change to SPECIFICATIONS.................................................... 2–4

Edits to ABSOLUTE MAXIMUM RATINGS Notes ....................5

Edits to TPCs 2, 5, 6–9, 11, and 15............................................. 7–9

Edits to Test Circuits 9 and 10 .......................................................11

Addition of Test Circuit 11.............................................................11

Pin Configuration and Function Descriptions........................... 10

Terminology.................................................................................... 11

Typical Performance Characteristics........................................... 12

Test Circuits..................................................................................... 15

Power-Supply Sequencing......................................................... 17

Outline Dimensions....................................................................... 18

Ordering Guide............................................................................... 18

10/00—Revision 0: Initial Version

Rev. B | Page 2 of 20

ADG708/ADG709

www.BDTIC.com/ADI

SPECIFICATIONS

VDD = 5 V ± 10%, VSS = 0 V, GND = 0 V, unless otherwise noted.

Table 1.

B Version C Version

−40°C to

Parameter +25°C

ANALOG SWITCH

Analog Signal Range 0 V to VDD 0 V to VDD V On Resistance (RON) 3 3 Ω typ VS = 0 V to VDD, IDS = 10 mA;

4.5 5 4.5 5 Ω max see Figure 20 On Resistance Match Between 0.4 0.4 Ω typ Channels (ΔRON) 0.8 0.8 Ω max VS = 0 V to VDD, IDS = 10 mA On Resistance Flatness (R

1.2 1.2 Ω max

LEAKAGE CURRENTS VDD = 5.5 V

Source Off Leakage IS (OFF) ±0.01 ±0.01 nA typ VD = 4.5 V/1 V, VS = 1 V/4.5 V; ±20 ±0.1 ±0.3 nA max see Figure 21 Drain Off Leakage ID (OFF) ±0.01 ±0.01 nA typ VD = 4.5 V/1 V, VS = 1 V/4.5 V; ±20 ±0.1 ±0.75 nA max see Figure 22 Channel On Leakage ID, IS (ON) ±0.01 ±0.01 nA typ VD = VS = 1 V or 4.5 V; see Figure 23 ±20 ±0.1 ±0.75 nA max

DIGITAL INPUTS

Input High Voltage, V Input Low Voltage, V Input Current

I

or I

0.005 0.005 μA typ VIN = V

INL

INH

±0.1 ±0.1 μA max Digital Input Capacitance, CIN 2 2 pF typ

DYNAMIC CHARACTERISTICS2

t 25 25 ns max VS1 = 3 V/0 V, VS8 = 0 V/3 V Break-Before-Make Time Delay, t 1 1 ns min VS = 3 V; see Figure 25 tON (EN) 14 14 ns typ RL = 300 Ω, CL = 35 pF 25 25 ns max VS = 3 V; see Figure 26 t 12 12 ns max VS = 3 V; see Figure 26 Charge Injection ±3 ±3 pC typ VS = 2.5 V, RS = 0 Ω, CL = 1 nF; see Figure 27 Off Isolation −60 −60 dB typ RL = 50 Ω, CL = 5 pF, f = 10 MHz

−80 −80 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 28 Channel-to-Channel Crosstalk −60 −60 dB typ RL = 50 Ω, CL = 5 pF, f = 10 MHz

−80 −80 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 29

−3 dB Bandwidth 55 55 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 30 CS (OFF) 13 13 pF typ f = 1 MHz CD (OFF)

14 14 ns typ RL = 300 Ω, CL = 35 pF; see Figure 24

TRANSITION

(EN) 7 7 ns typ RL = 300 Ω, CL = 35 pF

OFF

ADG708 85 85 pF typ f = 1 MHz ADG709 42 42 pF typ f = 1 MHz

INH

0.8 0.8 V max

INL

) 0.75 0.75 Ω typ VS = 0 V to VDD, IDS = 10 mA

FLAT(ON)

2.4 2.4 V min

8 8 ns typ RL = 300 Ω, CL = 35 pF

OPEN

+85°

1

−40°C to

C

+25°C

+85°C

Unit Test Conditions/Comments

or V

INH

INL

Rev. B | Page 3 of 20

ADG708/ADG709

www.BDTIC.com/ADI

B Version C Version

−40°C to

Parameter +25°C

CD, CS (ON)

ADG708 96 96 pF typ f = 1 MHz ADG709 48 48 pF typ f = 1 MHz

POWER REQUIREMENTS VDD = 5.5 V

IDD 0.001 0.001 μA typ Digital inputs = 0 V or 5.5 V

1.0 1.0 μA max

1

Temperature range is as follows: B Version and C Version: −40°C to +85°C.

2

Guaranteed by design, not subject to production test.

+85°C

+25°C

−40°C to +85°C

Unit Test Conditions/Comments

Rev. B | Page 4 of 20

ADG708/ADG709

www.BDTIC.com/ADI

VDD = 3 V ± 10%, VSS = 0 V, GND = 0 V, unless otherwise noted.

Table 2.

B Version C Version

−40°C to +85°

Parameter +25°C

C

ANALOG SWITCH

Analog Signal Range 0 V to VDD 0 V to VDD V On Resistance (RON) 8 8 Ω typ VS = 0 V to VDD, IDS = 10 mA; 11 12 11 12 Ω max see Figure 20 On Resistance Match Between 0.4 0.4 Ω typ VS = 0 V to VDD , IDS = 10 mA Channels (ΔRON) 1.2 1.2 Ω max

LEAKAGE CURRENTS VDD = 3.3 V

Source Off Leakage IS (OFF) ±0.01 ±0.01 nA typ VS = 3 V/1 V, VD = 1 V/3 V; ±20 ±0.1 ±0.3 nA max see Figure 21 Drain Off Leakage ID (OFF) ±0.01 ±0.01 nA typ VS = 3 V/1 V, VD = 1 V/3 V; ±20 ±0.1 ±0.75 nA max see Figure 22 Channel On Leakage ID, IS (ON) ±0.01 ±0.01 nA typ VS = VD = 1 V or 3 V; see Figure 23 ±20 ±0.1 ±0.75 nA max

DIGITAL INPUTS

Input High Voltage, V Input Low Voltage, V

2.0 2.0 V min

INH

0.8 0.8 V max

INL

Input Current

I

or I

0.005 0.005 μA typ VIN = V

INL

INH

±0.1 ±0.1 μA max Digital Input Capacitance, CIN 2 2 pF typ

DYNAMIC CHARACTERISTICS2

t

18 18 ns typ RL = 300 Ω, CL = 35 pF; see Figure 24

TRANSITION

30 30 ns max VS1 = 2 V/0 V, VS2 = 0 V/2 V Break-Before-Make Time Delay, t

8 8 ns typ RL = 300 Ω, CL = 35 pF

OPEN

1 1 ns min VS = 2 V; see Figure 25 tON (EN) 18 18 ns typ RL = 300 Ω, CL = 35 pF 30 30 ns max VS = 2 V; see Figure 26 t

(EN) 8 8 ns typ RL = 300 Ω, CL = 35 pF

OFF

15 15 ns max VS = 2 V; see Figure 26 Charge Injection ±3 ±3 pC typ VS = 1.5 V, RS = 0 Ω, CL = 1 nF; see Figure 27 Off Isolation −60 −60 dB typ RL = 50 Ω, CL = 5 pF, f = 10 MHz

−80 −80 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 28 Channel-to-Channel Crosstalk −60 −60 dB typ RL = 50 Ω, CL = 5 pF, f = 10 MHz

−80 −80 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 29

−3 dB Bandwidth 55 55 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 30 CS (OFF) 13 13 pF typ f = 1 MHz CD (OFF)

ADG708 85 85 pF typ f = 1 MHz ADG709 42 42 pF typ f = 1 MHz

CD, CS (ON)

ADG708 96 96 pF typ f = 1 MHz ADG709 48 48 pF typ f = 1 MHz

1

−40°C to

+25°C

Rev. B | Page 5 of 20

+85°C

Unit Test Conditions/Comments

or V

INH

INL

ADG708/ADG709

www.BDTIC.com/ADI

B Version C Version

−40°C to

Parameter +25°C

POWER REQUIREMENTS VDD = 3.3 V

IDD 0.001 0.001 μA typ Digital inputs = 0 V or 3.3 V

1.0 1.0 μA max

1

Temperature ranges are as follows: B Version and C Version: −40°C to +85°C.

2

Guaranteed by design, not subject to production test.

+85°C

+25°C

−40°C to +85°C

Unit Test Conditions/Comments

Rev. B | Page 6 of 20

ADG708/ADG709

www.BDTIC.com/ADI

DUAL SUPPLY

VDD = +2.5 V ± 10%, V

Table 3.

B Version C Version

Parameter +25°C

ANALOG SWITCH

Analog Signal Range VSS to VDD VSS to VDD V On Resistance (RON) 2.5 2.5 Ω typ VS = VSS to VDD, IDS = 10 mA;

4.5 5 4.5 5 Ω max see Figure 20 On Resistance Match Between 0.4 0.4 Ω typ Channels (ΔRON) 0.8 0.8 Ω max VS = VSS to VDD, IDS = 10 mA On Resistance Flatness (R

1.0 1.0 Ω max

LEAKAGE CURRENTS VDD = +2.75 V, VSS = −2.75 V

Source Off Leakage IS (OFF) ±0.01 ±0.01 nA typ VS = +2.25 V/−1.25 V, VD = −1.25 V/+2.25 V; ±20 ±0.1 ±0.3 nA max see Figure 21 Drain Off Leakage ID (OFF) ±0.01 ±0.01 nA typ VS = +2.25 V/−1.25 V, VD = −1.25 V/+2.25 V; ±20 ±0.1 ±0.75 nA max see Figure 22 Channel On Leakage ID, IS (ON) ±0.01 ±0.01 nA typ VS = VD = +2.25 V/−1.25 V; see Figure 23 ±20 ±0.1 ±0.75 nA max

DIGITAL INPUTS

Input High Voltage, V Input Low Voltage, V Input Current

I

or I

0.005 0.005 μA typ VIN = V

INL

INH

±0.1 ±0.1 μA max Digital Input Capacitance, CIN 2 2 pF typ

DYNAMIC CHARACTERISTICS2

t

14 14 ns typ RL = 300 Ω, CL = 35 pF; see Figure 24

TRANSITION

25 25 ns max VS = 1.5 V/0 V; see Figure 24 Break-Before-Make Time Delay, t 1 1 ns min VS = 1.5 V; see Figure 25 tON (EN) 14 14 ns typ RL = 300 Ω, CL = 35 pF 25 25 ns max VS = 1.5 V; see Figure 26 t

(EN) 8 8 ns typ RL = 300 Ω, CL = 35 pF

OFF

15 15 ns max VS = 1.5 V; see Figure 26 Charge Injection ±3 ±3 pC typ VS = 0 V, RS = 0 Ω, CL = 1 nF; see Figure 27 Off Isolation –60 –60 dB typ RL = 50 Ω, CL = 5 pF, f = 10 MHz –80 –80 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 28 Channel-to-Channel Crosstalk –60 –60 dB typ RL = 50 Ω, CL = 5 pF, f = 10 MHz –80 –80 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 29

−3 dB Bandwidth 55 55 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 30 CS (OFF) 13 13 pF typ f = 1 MHz CD (OFF)

ADG708 85 85 pF typ f = 1 MHz ADG709 42 42 pF typ f = 1 MHz

CD, CS (ON)

ADG708 96 96 pF typ f = 1 MHz ADG709 48 48 pF typ f = 1 MHz

= –2.5 V ± 10%, GND = 0 V, unless otherwise noted.1

SS

−40°C to +85°C +25°C

0.6 0.6 Ω typ VS = VSS to VDD, IDS = 10 mA

FLAT(ON))

1.7 1.7 V min

INH

0.7 0.7 V max

INL

8 8 ns typ RL = 300 Ω, CL = 35 pF

OPEN

−40°C to +85°C Unit Test Conditions/Comments

INL

or V

INH

Rev. B | Page 7 of 20

ADG708/ADG709

www.BDTIC.com/ADI

B Version C Version

−40°C

Parameter +25°C

POWER REQUIREMENTS VDD = 2.75 V

IDD 0.001 0.001 μA typ Digital inputs = 0 V or 2.75 V

1.0 1.0 μA max ISS 0.001 0.001 μA typ VSS = −2.75 V

1.0 1.0 μA max Digital inputs = 0 V or 2.75 V

1

Temperature range is as follows: B Version and C Version: −40°C to +85°C.

2

Guaranteed by design not subject to production test.

to +85°C

+25°C

−40°C to +85°C

Unit Test Conditions/Comments

Rev. B | Page 8 of 20

ADG708/ADG709

www.BDTIC.com/ADI

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 4.

Parameter Rating

VDD to VSS 7 V VDD to GND −0.3 V to +7 V VSS to GND +0.3 V to −3.5 V Analog Inputs1

Digital Inputs1

Peak Current, S or D (Pulsed at 1 ms, 10% Duty Cycle Maximum)

Continuous Current, S or D 30 mA Operating Temperature Range Industrial (B and C Versions) −40°C to +85°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C TSSOP Package, Power Dissipation 432 mW

θJA Thermal Impedance 150.4°C/W θJC Thermal Impedance 27.6°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C

1

Overvoltages at A, EN, S, or D are clamped by internal codes. Current should

be limited to the maximum ratings given.

− 0.3 V to VDD + 0.3 V

V

SS

or 30 mA, whichever occurs first

−0.3 V to V 30 mA, whichever occurs first

100 mA

+ 0.3 V or

DD

Table 5. ADG708 Truth Table

A2 A1 A0 EN Switch Condition

x1 x1 x1 0 NONE 0 0 0 1 1 0 0 1 1 2 0 1 0 1 3 0 1 1 1 4 1 0 0 1 5 1 0 1 1 6 1 1 0 1 7 1 1 1 1 8

1

x = don’t care.

Table 6. ADG709 Truth Table

A1 A0 EN ON Switch Pair

1

x 0 0 1 1 0 1 1 2 1 0 1 3 1 1 1 4

1

x = don’t care.

1

x

0 NONE

ESD CAUTION

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Only one absolute maximum rating can be applied at any one time.

Rev. B | Page 9 of 20

ADG708/ADG709

V

AS3AS4A

A

www.BDTIC.com/ADI

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

V

S1

S2

A0

EN

SS

DA

1

2

3

ADG709

4

TOP VIEW

5

(Not to Scale)

6

7

8

16

A1

15

GND

14

V

DD

13

S1B

12

S2B

11

S3B

S4B

10

9

DB

00041-004

A0

EN

SS

S1

S2

S3

S4

D

1

2

3

ADG708

4

TOP VIEW

5

(Not to Scale)

6

7

8

16

A1

15

A2

14

GND

V

13

DD

12

S5

11

S6

10

S7

9

S8

00041-003

Figure 3. ADG708 TSSOP Figure 4. ADG709 TSSOP

Table 7. ADG708 Pin Function Descriptions

Pin No. Mnemonic Description

1 A0 Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 5 ). 2 EN Digital Input. Controls the configuration of the switch, as shown in the truth table (see Tabl e 5). 3 V

SS

Most Negative Power Supply Pin in Dual Supply Applications. For single supply applications, it should be tied

to GND. 4 S1 5 S2 6 S3 7 S4 8 D 9 S8 10 S7 11 S6 12 S5 13 V

Most Positive Power Supply Pin.

DD

14 GND 15 A2 16 A1 Digital Input. Controls the configuration of the swit

Source Terminal. Can be an input or output.

Drain Terminal. Can be an input or output.

Source Terminal. Can be an input or output.

Ground (0 V) Reference.

Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 5).

ch, as shown in the truth table (see Table 5).

Table 8. ADG709 Pin Function Descriptions

Pin No. Mnemonic Description

1 A0 Digital Input. Controls the configuration of the switch, as shown in the truth table (see Tabl e 6). 2 EN Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 6). 3 V

SS

Most negative power supply pin in dual supply applications. For single supply applications, it should be tied

to GND. 4 S1A 5 S2A 6 S3A 7 S4A 8 DA 9 DB 10 S4B 11 S3B 12 S2B 13 S1B 14 V

Most Positive Power Supply Pin.

DD

15 GND 16 A1 Digital Input. Controls the configuration of the swit

Source Terminal. Can be an input or output.

Drain Terminal. Can be an input or output.

Source Terminal. Can be an input or output.

Ground (0 V) Reference.

ch, as shown in the truth table (see Table 6).

Rev. B | Page 10 of 20

ADG708/ADG709

www.BDTIC.com/ADI

TERMINOLOGY

VDD

Most positive power supply potential.

C

IN

Digital input capacitance.

VSS

Most negative power supply in a dual-supply application. In sin

gle-supply applications, this should be tied to ground at the

device.

GND

Ground (0 V) reference.

S

Source terminal. Can be an input or output.

D

Drain terminal. Can be an input or output.

Ax

Logic control input.

EN

Active high enable.

R

ON

Ohmic resistance between D and S.

R

FLAT(ON)

Flatness is defined as the difference between the maximum and minimum value of on resistance as measured over the specified analog signal range.

I

(OFF)

S

Source leakage current with the switch off.

I

(OFF)

D

Drain leakage current with the switch off.

I

, IS (ON)

D

Channel leakage current with the switch on.

V

(VS)

D

Analog voltage on Terminal D and Terminal S.

C

(OFF)

S

Off switch source capacitance. Measured with reference to

round.

g

(OFF)

C

D

Off switch drain capacitance. Measured with reference to

round.

g

, CS (ON)

C

D

On switch capacitance. Measured with reference to ground.

t

TRANSITION

Delay time measured between the 50% and 90% points of the dig

ital inputs and the switch on condition when switching from

one address state to another.

(EN)

t

ON

Delay time between the 50% and 90% points of the EN digital input and the switch on condition.

t

(EN)

OFF

Delay time between the 50% and 90% points of the EN digital input and the switch off condition.

t

OPEN

Off time measured between the 80% points of both switches

hen switching from one address state to another.

w

Off Isolation

A measure of unwanted signal coupling through an off switch.

Crosstalk

A measure of unwanted signal that is coupled through from one

nnel to another as a result of parasitic capacitance.

cha

Charge

A measure of the glitch impulse transferred from injection of

e digital input to the analog output during switching.

th

Bandwidth

The frequency at which the output is attenuated by 3 dB.

On Response

The frequency response of the on switch.

On Loss

The loss due to the on resistance of the switch.

V

INL

Maximum input voltage for Logic 0.

V

INH

Minimum input voltage for Logic 1.

I

(I

)

INL

INH

Input current of the digital input.

I

DD

Positive supply current.

I

SS

Negative supply current.

Rev. B | Page 11 of 20

ADG708/ADG709

www.BDTIC.com/ADI

TYPICAL PERFORMANCE CHARACTERISTICS

8

7

6

5

4

3

ON RESISTANCE (Ω)

2

1

0

012345

VD OR VS – DRAIN OR SOURCE VOLTAGE (V)

Figure 5. On Resistance as a Function of V

8

7

6

5

4

3

ON RESISTANCE (Ω)

2

1

0

–2.5 –2.0 –1.5 –1.0 –0.5 1.0 1.5 2.0 2.5 3.00.50

–3.0

VD OR VS – DRAIN OR SOURCE VO LTAGE (V)

VDD = 2.7V

VDD = 3.3V

VDD = +2.25V V

= –2.25V

SS

VDD = 4.5V

= +2.75V

V

DD

V

= –2.75V

SS

D

Figure 6. On Resistance as a Function of V

TA = 25°C V

= 0V

SS

VDD= 5.5V

(VS) for Single Supply

= 25°C

T

A

(VS) for Dual Supply

D

8

7

6

5

4

3

ON RESISTANCE (Ω)

2

1

0

0 0.5 1.0 1.5 2.0 3.02.5

OR VS – DRAIN OR SOURCE VOLTAG E (V)

V

00041-005

D

Figure 8. On Resistance as a Function of V

–40°C

(VS) for Different Temperatures,

D

+85°C

+25°C

V

= 3V

DD

V

= 0V

SS

00041-008

Single Supply

8

7

6

5

4

3

ON RESISTANCE (Ω)

2

1

0

–3.0 –2.5 –2.0 –1.5 –1.0 0 0.5 1.0 1.5 2.0 2.5–0.5 3.0

OR VS – DRAIN OR SOURCE VO LTAGE (V)

V

00041-006

D

Figure 9. On Resistance as a Function of V

+85°C

–40°C

(VS) for Different Temperatures,

D

VDD = +2.5V V

= –2.5V

SS

+25°C

0041-009

Dual Supply

8

7

6

5

4

3

ON RESISTANCE (Ω)

2

1

0

0123 4

VD OR VS – DRAIN OR SOURCE VOLTAGE (V)

Figure 7. On Resistance as a Function of V

+85°C

–40°C

(VS) for Different Temperatures,

D

+25°C

V

= 5V

DD

V

= 0V

SS

5

0041-007

Single Supply

Rev. B | Page 12 of 20

0.12

0.08

0.04

0

CURRENT (nA)

–0.04

–0.08

–0.12

012345

VS, (VD = VDD – VS) (V)

ID (ON)

IS (OFF)

Figure 10. Leakage Currents as a Function of V

VDD = 5V V

SS

T

A

ID (OFF)

(VS)

D

= 0V

= 25°C

00041-010

ADG708/ADG709

www.BDTIC.com/ADI

0.12

0.08

0.04

VDD = 3V V

= 0V

SS

T

= 25°C

A

I

(ON)

D

0.35

0.30

0.25

0.20

VDD = 3V V

= 0V

SS

0

CURRENT (nA)

–0.04

–0.08

–0.12

00.5

1.0 1.5 2.0 3.0

VD, (VS = VDD – VD) (V)

I

S

(OFF)

Figure 11. Leakage Currents as a Function of V

0.12

0.08

I

D

IS (OFF)

(ON), VS = V

ID (OFF)

CURRENT (nA)

–0.04

–0.08

–0.12

0.04

0

–3.0

–2.5 –2.0 –1.5 –1.0 0 0.5 1.0 1.5 2.0 2.5

–0.5 3.0

, (VD = VDD – VS) (V)

V

S

Figure 12. Leakage Currents as a Function of V

0.35 VDD = +5V

V

= 0V

SS

AND

0.30 V

= +2.5V

DD

V

= –2.5V

SS

0.25

0.20

0.15

CURRENT (nA)

–0.05

0.10

0.05

0

25 35 45 55 65 75 85

15

TEMPERATURE ( °C)

ID (OFF)

IS (OFF)

Figure 13. Leakage Currents as a Function of Temperature

(OFF)

I

D

2.5

(VS)

D

VDD = +2.5V V

= –2.5V

SS

= 25°C

T

A

D

(VS)

D

ID (ON)

0.15

0.10

CURRENT (nA)

I

S

ID (OFF)

(OFF)

ID (ON)

00041-014

0.05

0

–0.05

0041-011

25 35 45 55 65 75 85

15

TEMPERATURE (°C)

Figure 14. Leakage Currents as a Function of Temperature

10m

TA = 25°C

1m

100µ

10µ

1µ

CURRENT (A)

100n

10n

1n

10

0041-012

00041-013

Figure 15. Supply Current vs. Input Switching Frequency

0

–20

–40

–60

–80

ATTENUATIO N (dB)

–100

–120

30k 100M10M100k 1M

Figure 16. Off Isolation vs. Fr

VDD= +2.5V V

= –2.5V

SS

VDD = +3V

FREQUENCY (Hz)

VDD = +5V

equency

V

DD

T

A

= 5V

= 25°C

10M1M10k 100k1k100

0041-015

00041-016

Rev. B | Page 13 of 20

ADG708/ADG709

www.BDTIC.com/ADI

ATTENUATIO N (dB)

–100

–20

–40

–60

–80

0

VDD = 5V T

= 25°C

A

20

10

0

= +3V

V

= +2.5V

= –2.5V

DD

V

= 0V

SS

(pC)

–10

INJ

Q

–20

–30

V

DD

V

SS

V V

DD SS

TA = 25°C

= +5V

= 0V

–120

ATTENUATION (dB)

–10

–15

–20

0

–5

30k

VDD = 5V T

30k

FREQUENCY (Hz)

Figure 17. Crosstalk vs. Frequency

= 25°C

A

FREQUENCY (Hz)

100M10M100k 1M

0041-017

100M10M100k 1M

00041-018

–40

–3

–1 1 2 5

–2

VOLTAGE (V)

40

3

00041-019

Figure 19. Charge Injection vs. Source Voltage

Figure 18. On Response vs. Frequency

Rev. B | Page 14 of 20

ADG708/ADG709

VSSV

*

V

www.BDTIC.com/ADI

TEST CIRCUITS

I

DS

V1

S

V

S

RON = V1/I

Figure 20. On Resistance

V

DD

V

I

V

(OFF)

S

A

V

D

DD

S1

S2

S8

Figure 21. I

DD

V

DD

A2

IN

50Ω

A1

A0

ADG708*

2.4V

SIMILAR CO NNECTION F OR ADG709.

V

IN

50Ω

EN

DD

V

DD

A2

A1

S2 TO S7

A0

ADG708*

2.4V

*SIMILAR CONNECTIO N FOR ADG709.

EN

GND

(OFF)

S

GND

V

DS

V

SS

V

SS

EN

V

SS

S2 TO S7

SS

S1

S8

D

0041-020

D

0.8V

00041-021

V

S1

S8

S1

V

S8

D

R

L

300Ω

C

L

35pF

V

OUT

Figure 24. Switching Time of Multiplexer, t

V

S

V

OUT

R 300Ω

C

L

35pF

Figure 25. Break-Before-Make Delay, t

ADDRESS DRIVE (V

ADDRESS

DRIVE (V

DD

GND

Figure 22. I

DD

Figure 23. I

90%

GND

t

V

OPEN

SS

I

(OFF)

D

A

V

90%

D

00041-022

V

D

00041-023

0041-024

00041-025

0.8V

EN

(OFF)

D

V

SS

I

(ON)

D

A

2.4V

EN

(ON)

D

50%

t

TRANSITI ON

80%

V

DD

S1

S2

S8

V

S

V

S1

S8

V

S

3V

t

TRANSITION

50%

80%

)

IN

0V

V

S1

V

OUT

V

S8

TRANSITION

3

)

IN

0V

V

OUT

OPEN

Rev. B | Page 15 of 20

ADG708/ADG709

VDDV

V

2.4V

V

VDDV

www.BDTIC.com/ADI

ENABLE

DRIVE (V

OUTPUT

3

(V

IN

0V

V

OUT

)

3V

IN

0V

V

0V

ON

)

O

(EN), t

OFF

(EN)

50%

Q

INJ

0.9V

t

ON

= CL× ΔV

O

(EN)

OUT

50%

ΔV

OUT

0.9V

t

OFF

(EN)

O

0041-026

00041-027

SS

V

DDVSS

A2

A1

S2 TO S8

A0

ADG708*

EN

V

IN

50Ω

*SIMILAR CO NNECTION F OR ADG709.

R

S

V

S

V

IN

*SIMILAR CO NNECTION F OR ADG709.

GND

A2

A1

A0

S

EN

DD

V

DD

ADG708*

GND

V

S1

S

D

R

L

300Ω

C

L

35pF

V

OUT

Figure 26. Enable Delay, t

SS

V

LOGIC INPUT

OUT

V

SS

D

C

L

1nF

Figure 27. Charge Injection

0.1µF

OFF ISOLATION = 20 log

NETWORK ANALYZER

50Ω

V

S

A2

A1

A0

EN

DD

SS

0.1µF

V

DD

SS

S

D

GND

50Ω

V

OUT

V

S

NETWORK ANALYZER

50Ω

V

OUT

R

L

50Ω

S

00041-028

Figure 28. Off Isolation

V

DD

ADG708*

GND

SS

EN

2.4V NETWO RK ANALYZER

D

R 50Ω

V

OUT

L

0.1µF 0.1µ F

V

A2

A1

A0

50Ω

S1

S2

S8

*SIMILAR CONNECTION FOR ADG709.

CHANNEL-TO-CHANNEL CROSSTALK = 20 log

Figure 29. Channel-to-Channel Crosstalk

Rev. B | Page 16 of 20

V

OUT

V

S

00041-029

ADG708/ADG709

V

www.BDTIC.com/ADI

DD

V

DDVSS

S

GND

SS

D

0.1µF 0.1µF

A2

A1

A0

2.4V

INSERTION LOSS = 20 log

EN

Figure 30. Bandwidth

POWER-SUPPLY SEQUENCING

When using CMOS devices, care must be taken to ensure correct power supply sequencing. Incorrect power supply sequencing can result in the device being subjected to stresses beyond the maximum ratings listed in the data sheet.

V

WITH SWITCH

OUT

V

WITHOUT SWITCH

OUT

NETWO RK

ANALYZER

50Ω

V

S

V

OUT

R

L

50Ω

0041-030

Digital and analog inputs should always be applied after power su

pplies and ground. For single-supply operation, V

should be

SS

tied to GND as close to the device as possible.

Rev. B | Page 17 of 20

ADG708/ADG709

www.BDTIC.com/ADI

OUTLINE DIMENSIONS

5.10

5.00

4.90

16

4.50

4.40

4.30

PIN 1

0.15

0.05

0.65 BSC

COPLANARITY

COMPLIANT TO JEDEC STANDARDS MO-153-AB

Figure 31. 16-Lead Thin Shrink S

0.10

0.30

0.19

9

81

1.20 MAX

SEATING PLANE

6.40

BSC

0.20

0.09 8°

0°

mall Outline Package [TSSOP]

0.75

0.60

0.45

(RU-16)

Dimensions shown in millimeters

ORDERING GUIDE

Model Temperature Range Package Description Package Option

ADG708BRU −40°C to +85°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16 ADG708BRU-REEL −40°C to +85°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16 ADG708BRU-REEL7 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16 ADG708BRUZ ADG708BRUZ-REEL ADG708BRUZ-REEL7 ADG708CRU −40°C to +85°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16 ADG708CRU-REEL −40°C to +85°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16 ADG708CRU-REEL7 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16 ADG708CRUZ ADG708CRUZ-REEL ADG708CRUZ-REEL7 ADG709BRU −40°C to +85°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16 ADG709BRU-REEL −40°C to +85°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16 ADG709BRU-REEL7 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16 ADG709BRUZ ADG709BRUZ-REEL ADG709BRUZ-REEL7 ADG709CRU −40°C to +85°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16 ADG709CRU-REEL −40°C to +85°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16 ADG709CRU-REEL7 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16 ADG709CRUZ ADG709CRUZ-REEL ADG709CRUZ-REEL7

1

Z = Pb-free part.

1

−40°C to +85°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16

Rev. B | Page 18 of 20

ADG708/ADG709

www.BDTIC.com/ADI

NOTES

Rev. B | Page 19 of 20

ADG708/ADG709

www.BDTIC.com/ADI

NOTES

Rev. B | Page 20 of 20

Datasheet ADG708 Datasheet (ANALOG DEVICES)

Specifications and Main Features

Frequently Asked Questions

User Manual

FEATURES

APPLICATIONS

FUNCTIONAL BLOCK DIAGRAMS

GENERAL DESCRIPTION

PRODUCT HIGHLIGHTS

TABLE OF CONTENTS

REVISION HISTORY

SPECIFICATIONS

DUAL SUPPLY

ABSOLUTE MAXIMUM RATINGS

ESD CAUTION

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

TERMINOLOGY

TYPICAL PERFORMANCE CHARACTERISTICS

TEST CIRCUITS

POWER-SUPPLY SEQUENCING

OUTLINE DIMENSIONS

ORDERING GUIDE