1.8 V to 5.5 V single supply
2 Ω (typ) on resistance
Low on-resistance flatness
–3 dB bandwidth > 200 MHz
Rail-to-rail operation
Fast switching times:
18 ns
t
ON
t
12 ns
OFF
Typical power consumption < 0.01 µW
TTL/CMOS compatible
APPLICATIONS
Battery powered systems
Communication systems
Sample hold systems
Audio signal routing
Video switching
Mechanical reed relay replacement
GENERAL DESCRIPTION
The ADG701/ADG702 are monolithic CMOS SPST switches.
These switches are designed on an advanced submicron process
that provides low power dissipation yet high switching speed,
low on resistance, and low leakage currents. In addition, −3 dB
bandwidths of greater than 200 MHz can be achieved.
The ADG701/ADG702 can operate from a single 1.8 V to 5.5 V
supply, making it ideal for use in battery-powered instruments
and with the new generation of DACs and ADCs from Analog
Devices.
Figure 1 shows that with a logic input of 1, the switch of the
ADG701 is closed, while that of the ADG702 is open. Each
switch conducts equally well in both directions when on.
The ADG701/ADG702 are available in 5-lead SOT-23, 6-lead
SOT-23, and 8-lead MSOP packages.
2 Ω SPST Switches
ADG701/ADG702
FUNCTIONAL BLOCK DIAGRAM
ADG701
D
IN
SWITCHES SHOWN FOR A LOGIC 1 INPUT
Figure 1.
PRODUCT HIGHLIGHTS
1. 1.8 V to 5.5 V single-supply operation. The ADG701/
ADG702 offer high performance, including low on
resistance and fast switching times, and are fully specified
and guaranteed with 3 V and 5 V supply rails.
2. Ver y lo w R
operation, R
3. On resistance flatness R
4. −3 dB bandwidth > 200 MHz.
5. Low power dissipation. CMOS construction ensures low
power dissipation.
6. Fast t
7. Tiny 5-lead SOT-23, 6-lead SOT-23, and 8-lead MSOP
packages.
(3 Ω max at 5 V, 5 Ω max at 3 V). At 1.8 V
ON
is typically 40 Ω over the temperature range.
ON
FLAT(ON)
ON/tOFF.
ADG702
(1 Ω max).
DS
IN
00039-001
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
VDD = 5 V ± 10%, GND = 0 V. Temperature range for B version is −40°C to +85°C, unless otherwise noted.
Table 1.
B Version
Parameter +25°C –40°C to +85°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 V to V
DD
On Resistance (RON) 2 Ω typ VS = 0 V to VDD, IS = –10 mA; Figure 11
3 4 Ω max
On-Resistance Flatness (R
) 0.5 Ω typ VS = 0 V to VDD, IS = –10 mA
FLAT(ON)
1.0 Ω max
LEAKAGE CURRENTS VDD = 5.5 V
Source OFF Leakage, IS (OFF) ±0.01 nA typ VS = 4.5 V/1 V, VD = 1 V/4.5 V; Figure 12
±0.25 ±0.35 nA max
Drain OFF Leakage, ID (OFF) ±0.01 nA typ VS = 4.5 V/1 V, VD = 1 V/4.5 V; Figure 12
±0.25 ±0.35 nA max
Channel ON Leakage, ID, IS (ON) ±0.01 nA typ VS = VD = 1 V, or 4.5 V; Figure 13
±0.25 ±0.35 nA max
DIGITAL INPUTS
Input High Voltage, V
Input Low Voltage, V
INH
INL
2.4 V min
0.8 V max
Input Current
I
or I
INL
INH
0.005 µA typ VIN = V
±0.1 µA max
DYNAMIC CHARACTERISTICS
t
ON
1
12 ns typ RL = 300 Ω , CL = 35 pF
18 ns max VS = 3 V; Figure 14
t
OFF
8 ns typ RL = 300 Ω , CL = 35 pF
12 ns max VS = 3 V; Figure 14
Charge Injection 5 pC typ VS = 2 V, RS = 0 Ω , CL = 1 nF; Figure 15
Off Isolation –55 dB typ RL = 50 Ω , CL = 5 pF, f = 10 MHz
–75 dB typ RL = 50 Ω , CL = 5 pF, f = 1 MHz; Figure 16
Bandwidth –3 dB 200 MHz typ RL = 50 Ω , CL = 5 pF; Figure 17
CS (OFF) 17 pF typ
CD (OFF) 17 pF typ
CD, CS (ON) 38 pF typ
POWER REQUIREMENTS VDD = 5.5 V
Digital inputs = 0 V or 5 V
I
DD
0.001 µA typ
1.0 µA max
V
or V
INL
INH
1
Guaranteed by design, not subject to production test.
Rev. B | Page 3 of 12
Page 4
ADG701/ADG702
VDD = 3 V ±10%, GND = 0 V. Temperature range for B version is −40°C to +85°C, unless otherwise noted.
Table 2.
B Version
Parameter +25°C −40°C to +85°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 V to V
DD
On Resistance (RON) 3.5 Ω typ VS = 0 V to VDD, IS = −10 mA; Figure 11
5 6 Ω max
On-Resistance Flatness (R
) 1.5 Ω typ VS = 0 V to VDD, IS = −10 mA
FLAT(ON)
LEAKAGE CURRENTS VDD = 3.3 V
Source OFF Leakage IS(OFF) ±0.01 nA typ VS = 3 V/1 V, VD = 1 V/3 V; Figure 12
±0.25 ±0.35 nA max
Drain OFF Leakage ID(OFF) ±0.01 nA typ VS = 3 V/1 V, VD = 1 V/3 V; Figure 12
±0.25 ±0.35 nA max
Channel ON Leakage ID, IS(ON) ±0.01 nA typ V = VD = 1 V, or 3 V; Figure 13
±0.25 ±0.35 nA max
DIGITAL INPUTS
Input High Voltage, V
Input Low Voltage, V
INH
INL
2.0 V min
0.4 V max
Input Current
I
or I
INL
INH
0.005 µA typ VIN = V
±0.1 µA max
DYNAMIC CHARACTERISTICS
t
ON
1
14 ns typ RL = 300 Ω , CL = 35 pF
20 ns max VS = 2 V, Figure 14
t
OFF
8 ns typ RL = 300 Ω , CL = 35 pF
13 ns max VS = 2 V, Figure 14
Charge Injection 4 pC typ VS = 1.5 V, RS = 0 Ω , CL = 1 nF; Figure 15
Off Isolation −55 dB typ RL = 50 Ω , CL = 5 pF, f = 10 MHz
−75 dB typ RL = 50 Ω , CL = 5 pF, f = 1 MHz; Figure 16
Bandwidth −3 dB 200 MHz typ RL = 50 Ω , CL = 5 pF; Figure 17
CS (OFF) 17 pF typ
CD (OFF) 17 pF typ
CD, CS (ON) 38 pF typ
POWER REQUIREMENTS VDD = 3.3 V
Digital Inputs = 0 V or 3 V
I
DD
0.001 µA typ
1.0 µA max
1
Guaranteed by design, not subject to production test.
V
or V
INL
INH
Rev. B | Page 4 of 12
Page 5
ADG701/ADG702
ABSOLUTE MAXIMUM RATINGS
TA = +25°C, unless otherwise noted.
Table 3.
Parameter Rating
VDD to GND −0.3 V to +7 V
Analog, Digital Inputs1
Continuous Current, S or D 30 mA
Peak Current, S or D
Operating Temperature Range
Industrial (B Version) −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
MSOP Package, Power Dissipation 315 mW
θJA Thermal Impedance 206°C/W
θJC Thermal Impedance 44°C/W
SOT-23 Package, Power Dissipation 282 mW
θJA Thermal Impedance 229.6°C/W
θJC Thermal Impedance 91.99°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
ESD 2 kV
−0.3 V to V
or 30 mA, whichever
occurs first
100 mA, pulsed at 1 ms,
10% duty cycle max
+0.3 V
DD
1
Overvoltages at IN, S, or D are clamped by internal diodes. Current should be
limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability. Only one absolute maximum rating may be
applied at any one time.
Table 4. Truth Table
ADG701 In ADG702 In Switch Condition
0 1 OFF
1 0 ON
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Most positive power supply potential.
GND Ground (0 V) Reference.
S Source Terminal. May be an input or output.
D Drain Terminal. May be an input or output.
IN Logic Control Input.
R
ON
R
FLAT(ON)
Ohmic resistance between D and S.
Flatness is defined as the difference between the maximum and minimum value of on resistance as measured
over the specified analog signal range.
IS (OFF) Source Leakage Current with the Switch OFF.
ID (OFF) Drain Leakage Current with the Switch OFF.
ID, IS (ON) Channel Leakage Current with the Switch ON.
VD (VS) Analog Voltage on Terminals D and S.
CS (OFF) OFF Switch Source Capacitance.
CD (OFF) OFF Switch Drain Capacitance.
CD, CS (ON) ON Switch Capacitance.
t
ON
t
OFF
Delay between applying the digital control input and the output switching on. See Figure 14.
Delay between applying the digital control input and the output switching off.
Off Isolation A measure of unwanted signal coupling through an OFF switch.
Charge Injection A measure of the glitch impulse transferred from the digital input to the analog output during switching.
Bandwidth The frequency at which the output is attenuated by −3 dBs.
On Response The frequency response of the ON switch.
On Loss
The voltage drop across the ON switch seen in Figure 10 as the number of dBs the signal is from 0 dB at very low
frequencies.
V
DD
IN
00039-004
Rev. B | Page 6 of 12
Page 7
ADG701/ADG702
TYPICAL PERFORMANCE CHARACTERISTICS
3.5
3.0
VDD = 2.7V
T
A
= 25°C
10m
1m
VDD = 5V
2.5
VDD = 3.0V
2.0
(Ω)
ON
1.5
R
1.0
0.5
0
V
= 5.0V
DD
00.5 1.0 1.5 2.02.5 3.0 3.54.0 4.5 5.0
VD OR VS– DRAIN OR SOURCE VOLTAGE (V)
Figure 5. On Resistance as a Function of V
3.5
3.0
2.5
2.0
(Ω)
ON
1.5
R
1.0
0.5
0
00.51.01.52.02.53.0
VD OR VS– DRAIN OR SOURCE VOLTAGE (V)
+85°C
+25°C
–40°C
Figure 6. On Resistance as a Function of V
V
= 3 V
DD
3.5
3.0
V
= 4.5V
DD
(VS) Single Supplies
D
V
= 3V
DD
(VS) for Different Temperatures
D
VDD = 5V
00039-005
00039-006
100µ
10µ
(A)
1µ
SUPPLY
I
100n
10n
1n
101001k10k100k1M10M
FREQUENCY (Hz)
Figure 8. Supply Current vs. Input Switching Frequency
–10
VDD = 5V, 3V
–20
–30
–40
–50
–60
–70
–80
OFF ISOLATION (dB)
–90
–100
–110
10k100k1M10M100M
FREQUENCY (Hz)
Figure 9. Off Is olation vs. Fre quency
0
VDD = 3V
00039-008
00039-009
2.5
2.0
(Ω)
ON
1.5
R
1.0
0.5
0
00.5 1.0 1.5 2.02.5 3.0 3.54.0 4.5 5.0
VD OR VS– DRAIN OR SOURCE VOLTAGE (V)
+85°C
+25°C
–40°C
Figure 7. On Resistance as a Function of V
V
= 5 V
DD
(VS) for Different Temperatures
D
00039-007
Rev. B | Page 7 of 12
–2
–4
ON RESPONSE (dB)
–6
10k100k1M10M100M
FREQUENCY (Hz)
Figure 10. On Response vs. Frequency
00039-010
Page 8
ADG701/ADG702
V
V
V
V
TEST CIRCUITS
I
DS
V1
SD
IS(OFF)ID(OFF)
SD
AA
SD
ID (ON)
A
V
S
RON = V1/I
DS
00039-011
S
V
D
00039-012
S
Figure 11. On Resistance Figure 12. Off Leakage Figure 13. On Leakage
V
DD
0.1µF
V
IN
V
ADG701
DD
V
C
L
35pF
OUT
V
IN
ADG702
V
OUT
SD
R
V
S
IN
GND
L
300Ω
50%50%
50%50%
90%90%
t
ON
t
OFF
00039-014
Figure 14. Switching Times
V
DD
V
DD
R
S
V
S
S
IN
GND
D
C
L
1nF
V
ADG701
IN
V
OUT
V
ADG702
IN
V
OUT
ONOFF
Q
= CL×∆V
INJ
OUT
∆V
OUT
Figure 15. Charge Injection
0.1µF
DD
0.1µF
V
DD
00039-015
V
D
00039-013
V
DD
V
R
50Ω
OUT
L
V
IN
00039-016
S
SD
IN
V
V
S
IN
GND
Figure 16. Off Isolation
V
DD
SD
IN
GND
Figure 17. Bandwidth
R
50Ω
V
OUT
L
00039-017
Rev. B | Page 8 of 12
Page 9
ADG701/ADG702
APPLICATIONS INFORMATION
The ADG701/ADG702 belong to Analog Devices’ new family
of CMOS switches. This series of general-purpose switches
have improved switching times, lower on resistance, higher
bandwidth, low power consumption, and low leakage currents.
ADG701/ADG702 SUPPLY VOLTAGES
Functionality of the ADG701/ADG702 extends from 1.8 V to
5.5 V single supply, making the parts ideal for battery-powered
instruments, where power efficiency and performance are
important design parameters.
It is important to note that the supply voltage affects the input
signal range, the on resistance, and the switching times of the
part. The effects of the power supplies can be clearly seen in the
Typical Performance Characteristics and the Specifications
sections.
= 1.8 V operation, RON is typically 40 Ω over the
For V
DD
temperature range.
ON RESPONSE VS. FREQUENCY
Figure 18 illustrates the parasitic components that affect the ac
performance of CMOS switches (a box surrounds the switch).
Additional external capacitances further degrade some performance. These capacitances affect feedthrough, crosstalk,
and system bandwidth.
C
DS
SD
R
ON
C
V
IN
Figure 18. Switch Represented by Equivalent Parasitic Components
D
C
LOADRLOAD
The transfer function that describes the equivalent diagram of
the switch (Figure 18) is of the form (A)s shown below.
⎤
1)(
+
DSON
RCRs
⎥
1)(
+
TT
⎦
Where C
)(
T
=
= C
⎡
RsA
⎢
T
⎣
LOAD
CRs
ON
+ CD + CDS.
V
OUT
00039-018
The signal transfer characteristic is dependent on the switch
channel capacitance, C
. This capacitance creates a frequency
DS
zero in the numerator of the transfer function A(s). Because the
switch on resistance is small, this zero usually occurs at high
frequencies. The bandwidth is a function of the switch output
capacitance combined with C
and the load capacitance. The
DS
frequency pole corresponding to these capacitances appears in
the denominator of A(s).
The dominant effect of the output capacitance, C
, causes the
D
pole breakpoint frequency to occur first. In order to maximize
bandwidth, a switch must have a low input and output capacitance and low on resistance. The on response versus frequency
for the ADG701/ADG702 can be seen in Figure 10.
OFF ISOLATION
Off isolation is a measure of the input signal coupled through
an off switch to the switch output. The capacitance, C
the input signal to the output load, when the switch is off, as
shown in Figure 19.
C
DS
SD
V
IN
Figure 19. Off Isolation Is Affected by External Load Resistance and
C
Capacitance
C
D
LOADRLOAD
The larger the value of CDS, the larger the values of feedthrough
produced. Figure 9 illustrates the drop in off isolation as a
function of frequency. From dc to roughly 1 MHz, the switch
shows better than −75 dB isolation. Up to frequencies of 10
MHz, the off isolation remains better than −55 dB. As the
frequency increases, more and more of the input signal is
coupled through to the output. Off isolation can be maximized
by choosing a switch with the smallest C
possible. The values
DS
of load resistance and capacitance also affect off isolation, as
they contribute to the coefficients of the poles and zeros in the
transfer function of the switch when open.
⎡
RsA
=
)(
⎢
T
⎣
CRs
LOAD
⎤
+
1)(
DSLOAD
CRs
⎥
+
1))((
T
⎦
, couples
DS
V
OUT
00039-019
Rev. B | Page 9 of 12
Page 10
ADG701/ADG702
OUTLINE DIMENSIONS
3.00
BSC
85
3.00
BSC
PIN 1
0.65 BSC
0.15
0.00
0.38
0.22
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187AA
4
SEATING
PLANE
4.90
BSC
1.10 MAX
0.23
0.08
8°
0°
0.80
0.60
0.40
Figure 20. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
2.90 BSC
1.90
BSC
0.50
0.30
45
2.80 BSC
2
0.95 BSC
1.45 MAX
SEATING
PLANE
0.22
0.08
10°
0.60
4°
0.45
0°
0.30
1.60 BSC
PIN 1
INDICATOR
1.30
1.15
0.90
0.15MAX
6
13
COMPLIANT TO JEDEC STANDARDS MO-178AB
Figure 21. 6-Lead Plastic Surface Mount Package [SOT-23]
(RT-6)
Dimensions shown in inches and (millimeters)
Rev. B | Page 10 of 12
Page 11
ADG701/ADG702
2.90 BSC
4 5
0.50
0.30
3
2.80 BSC
0.95 BSC
1.45 MAX
SEATING
PLANE
(RJ-5)
0.22
0.08
10°
5°
0°
0.60
0.45
0.30
1.60 BSC
1
2
PIN 1
1.30
1.15
0.90
0.15MAX
Figure 22. 5-Lead Plastic Surface Mount Package [SOT-23]
1.90
BSC
COMPLIANT TO JEDEC STANDARDS MO-178AA
Dimensions shown in inches and (millimeters)
ORDERING GUIDE
Model Temperature Range Package Descriptions Package Options Brand