Datasheet ADG663, ADG662, ADG661 Datasheet (Analog Devices)

LC2MOS
a
FEATURES +5 V, 65 V Power Supplies Ultralow Power Dissipation (<0.5 mW) Low Leakage (<100 pA) Low On Resistance (<50 V) Fast Switching Times Low Charge Injection TTL/CMOS Compatible TSSOP Package
APPLICATIONS Battery Powered Instruments Single Supply Systems Remote Powered Equipment +5 V Supply Systems Computer Peripherals such as Disk Drives Precision Instrumentation Audio and Video Switching Automatic Test Equipment Precision Data Acquisition Sample Hold Systems Communication Systems
Precision 5 V Quad SPST Switches
ADG661/ADG662/ADG663
FUNCTIONAL BLOCK DIAGRAM
IN1
IN2
ADG661
IN3
IN4
SWITCHES SHOWN FOR A LOGIC "1" INPUT
S1
D1 S2
D2 S3
D3 S4
D4
IN1
IN2
ADG663
IN3
IN4
IN1
IN2
ADG662
IN3
IN4
S1
D1 S2
D2 S3
D3 S4
D4
S1
D1 S2
D2 S3
D3 S4
D4
GENERAL DESCRIPTION
The ADG661, ADG662 and ADG663 are monolithic CMOS devices comprising four independently selectable switches. These switches feature low, well-controlled on resistance and wide analog signal range, making them ideal for precision analog signal switching.
They are fabricated using Analog Devices' advanced linear compatible CMOS (LC
2
MOS) process, which offers benefits of low leakage currents, ultralow power dissipation and low capaci­tance for fast switching speeds with minimum charge injection.
The on resistance profile is very flat over the full analog input range ensuring excellent linearity and low distortion when switching audio signals. Fast switching speed coupled with high signal bandwidth also make the parts suitable for video signal switching. CMOS construction ensures ultralow power dissipa­tion making the parts ideally suited for portable and battery powered instruments.
The ADG661, ADG662 and ADG663 contain four indepen­dent SPST switches. The ADG661 and ADG662 differ only in that the digital control logic is inverted. The ADG661 switches are turned on with a logic low on the appropriate control input, while a logic high is required for the ADG662. The ADG663 has two switches with digital control logic similar to that of the ADG661, while the logic is inverted on the other two switches.
Each switch conducts equally well in both directions when ON and has an input signal range that extends to the supplies. In the OFF condition, signal levels up to the supplies are blocked. All switches exhibit break-before-make switching action for use in multiplexer applications. Inherent in the design is low charge injection for minimum transients when switching the digital inputs.
PRODUCT HIGHLIGHTS
1. +5 V Single Supply Operation The ADG661, ADG662 and ADG663 offer high perfor­mance, including low on resistance and wide signal range, fully specified and guaranteed with ± 5 V and +5 V supply rails.
2. Ultralow Power Dissipation CMOS construction ensures ultralow power dissipation.
3. Low R
ON
4. Break-Before-Make Switching This prevents channel shorting when the switches are config­ured as a multiplexer.
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Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
ADG661/ADG662/ADG663–SPECIFICA TIONS
1
Dual Supply
(VDD = +5 V 6 10%, VSS = –5 V 6 10%, GND = 0 V, unless otherwise noted)
B Versions
Parameter +258C–408C to +858C Units Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range VDD to V R
ON
30 typ VD = –3.5 V to +3.5 V, IS = –10 mA;
SS
38 50 max VDD = +4.5 V, V
LEAKAGE CURRENTS V
Source OFF Leakage I
(OFF) ±0.025 nA typ VD = ±4.5 V, VS = ±4.5 V;
S
V
= –4.5 V
SS
= +5.5 V, VSS = –5.5 V
DD
±0.1 ±2.5 nA max Test Circuit 2
Drain OFF Leakage I
(OFF) ±0.025 nA typ VD = ±4.5 V, VS = ±4.5 V;
D
±0.1 ±2.5 nA max Test Circuit 2
Channel ON Leakage I
, IS (ON) ±0.05 nA typ VD = VS = ±4.5 V;
D
±0.2 ±5 nA max Test Circuit 3
DIGITAL INPUTS
Input High Voltage, V Input Low Voltage, V
INL
INH
2.4 V min
0.8 V max
Input Current
I
INL
or I
INH
0.005 µA typ VIN = V
INL
or V
INH
±0.1 µA max
DYNAMIC CHARACTERISTICS
t
ON
t
OFF
Break-Before-Make Time Delay, t
(ADG663 Only) V
Charge Injection 6 pC typ V
2
150 ns typ RL = 300 , CL = 35 pF;
275 ns max V
= ±3 V; Test Circuit 4
S
55 ns typ RL = 300 , CL = 35 pF;
120 ns max V
D
80 ns typ RL = 300 , CL = 35 pF;
= ±3 V; Test Circuit 4
S
= VS2 = +3 V; Test Circuit 5
S1
= 0 V, RS = 0 , CL = 10 nF;
S
Test Circuit 6
OFF Isolation 70 dB typ R
= 50 , CL = 5 pF, f = 1 MHz;
L
Test Circuit 7
Channel-to-Channel Crosstalk 90 dB typ R
= 50 Ω, CL = 5 pF, f = 1 MHz;
L
Test Circuit 8
C
(OFF) 9 pF typ f = 1 MHz
S
C
(OFF) 9 pF typ f = 1 MHz
D
CD, CS (ON) 28 pF typ f = 1 MHz
POWER REQUIREMENTS
+4.5/5.5 V min/max
V
DD
I
DD
0.0001 µA typ VDD = +5.5 V, VSS = –5.5 V
–4.5/5.5 V min/max 1 µA max Digital Inputs = 0 V or 5 V
I
SS
0.0001 µA typ 1 µA max
NOTES
1
Temperature ranges are as follows: B Versions, –40°C to +85°C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
–2–
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ADG661/ADG662/ADG663
Single Supply
(VDD = +5 V 6 10%, VSS = 0 V, GND = 0 V, unless otherwise noted)
B Versions
Parameter +258C–408C to +858C Units Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 V to V R
ON
45 typ VD = 0 V to +3.5 V, IS = –10 mA;
DD
V
68 75 max VDD = +4.5 V
LEAKAGE CURRENTS V
Source OFF Leakage I
(OFF) ±0.025 nA typ VD = 4.5 V/1 V, VS = 1 V/4.5 V;
S
= +5.5 V
DD
±0.1 ±2.5 nA max Test Circuit 2
Drain OFF Leakage I
(OFF) ±0.025 nA typ VD = 4.5 V/1 V, VS = 1 V/4.5 V;
D
±0.1 ±2.5 nA max Test Circuit 2
Channel ON Leakage I
, IS (ON) ±0.05 nA typ VD = VS = +4.5 V/+1 V;
D
±0.2 ±5 nA max Test Circuit 3
DIGITAL INPUTS
Input High Voltage, V Input Low Voltage, V
INL
INH
2.4 V min
0.8 V max
Input Current
I
INL
or I
INH
0.005 µA typ VIN = V
INL
or V
INH
±0.1 µA max
DYNAMIC CHARACTERISTICS
t
ON
t
OFF
Break-Before-Make Time Delay, t
(ADG663 Only) V
Charge Injection 12 pC typ V
2
250 ns typ RL = 300 , CL = 35 pF;
400 ns max V
= +2 V; Test Circuit 4
S
45 ns typ RL = 300 , CL = 35 pF;
100 ns max V
D
140 ns typ RL = 300 , CL = 35 pF;
= +2 V; Test Circuit 4
S
= VS2 = +2 V; Test Circuit 5
S1
= 0 V, RS = 0 , CL = 10 nF;
S
Test Circuit 6
OFF Isolation 70 dB typ R
= 50 , CL = 5 pF, f = 1 MHz;
L
Test Circuit 7
Channel-to-Channel Crosstalk 90 dB typ R
= 50 , CL = 5 pF, f = 1 MHz;
L
Test Circuit 8
C
(OFF) 9 pF typ f = 1 MHz
S
C
(OFF) 9 pF typ f = 1 MHz
D
CD, CS (ON) 28 pF typ f = 1 MHz
POWER REQUIREMENTS
V
DD
I
DD
0.0001 µA typ VDD = +5.5 V
+4.5/5.5 V min/max 1 µA max Digital Inputs = 0 V or 5 V
NOTES
1
Temperature ranges are as follows: B Versions, –40°C to +85°C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
–3–REV. 0
ADG661/ADG662/ADG663
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
(TA = +25°C unless otherwise noted)
1
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+44 V
V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +25 V
DD
V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –25 V
SS
Analog, Digital Inputs
2
. . . . . . . . . . . VSS –2 V to VDD +2 V or
30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . .–40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . .–65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
TSSOP Package, Power Dissipation . . . . . . . . . . . . . .450 mW
θ
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . 115°C/W
JA
θ
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . . 35°C/W
JC
ORDERING GUIDE
Temperature Package Package
Model Range Description Option
ADG661BRU –40°C to +85°C 16-Lead TSSOP RU-16 ADG662BRU –40°C to +85°C 16-Lead TSSOP RU-16 ADG663BRU –40°C to +85°C 16-Lead TSSOP RU-16
Lead Temperature, Soldering
Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 secs) . . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time.
2
Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG661/ADG662/ADG663 features proprietary ESD protection circuitry, per­manent damage may occur on devices subjected to high energy electrostatic discharges. There­fore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
–4–
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ADG661/ADG662/ADG663
PIN CONFIGURATION
IN1
1
2
D1
3
S1
4
V
SS
5
GND
6
S4
(Not to Scale)
7
D4
8
IN4
NC = NO CONNECT
ADG661 ADG662 ADG663
TOP VIEW
16
IN2
15
D2
14
S2 V
13
DD
12
NC
11
S3
10
D3
9
IN3
Table I. Truth Table (ADG661/ADG662)
ADG661 In ADG662 In Switch Condition
01ON 1 0 OFF
Table II. Truth Table (ADG663)
Logic Switch 1, 4 Switch 2, 3
0 OFF ON 1 ON OFF
TERMINOLOGY
V
DD
V
SS
Most positive power supply potential.
Most negative power supply potential in dual supplies. In single supply applications, it may be connected to GND.
GND Ground (0 V) Reference. S Source Terminal. May be an input or output. D Drain Terminal. May be an input or output. IN Logic Control Input. R
ON
I
(OFF) Source leakage current with the switch “OFF.”
S
(OFF) Drain leakage current with the switch “OFF.”
I
D
I
, IS (ON) Channel leakage current with the switch “ON.”
D
V
) Analog voltage on terminals D, S.
D (VS
(OFF) “OFF” Switch Source Capacitance.
C
S
C
(OFF) “OFF” Switch Drain Capacitance.
D
C
, CS (ON) “ON” Switch Capacitance.
D
t
ON
Ohmic resistance between D and S.
Delay between applying the digital control input and the output switching on.
t
OFF
Delay between applying the digital control input and the output switching off.
t
D
“OFF” time or “ON” time measured between the 90% points of both switches, when switching from one address state to another.
Crosstalk A measure of unwanted signal which is
coupled through from one channel to another as a result of parasitic capacitance.
Off Isolation A measure of unwanted signal coupling
through an “OFF” switch.
Charge A measure of the glitch impulse transferred Injection from the digital input to analog output during
switching.
–5–REV. 0
ADG661/ADG662/ADG663
Typical Performance Characteristics
50
TA = +258C
40
50
40
VDD = +5V V
= –5V
SS
50
TA = +25°C
40
30
V
ON
R
20
VDD = +5V V
= –5V
10
0
–55–4 34210–1–2–3
OR VS – DRAIN OR SOURCE VOLTAGE – V
V
D
SS
Figure 1. On Resistance as a Function of V
10mA
1mA
100mA
10mA
SUPPLY
I
1mA
100nA
10nA
10
(VS) Dual Supplies
D
VDD = +5V V
= –5V
SS
4 SW
1 SW
I–, I+
100
10k 1M
1k
FREQUENCY – Hz
100k
10M
Figure 4. Supply Current vs. Input Switching Frequency
30
V
ON
R
20
10
0
–5 V
OR VS – DRAIN OR SOURCE VOLTAGE – V
D
+858C
+258C
Figure 2. On Resistance as a Function of V
(VS) for
D
Different Temperatures
10
VDD = +5V V
= –5V
SS
1
VS = 65V V
= 65V
D
0.1
0.01
LEAKAGE CURRENT – nA
IS (OFF)
0.001 25
35
TEMPERATURE – 8C
ID (OFF)
ID (ON)
Figure 5. Leakage Currents as a Function of Temperature
30
V
ON
R
20
10
5–4 3 4210–1–2–3
0
01 5
VD OR VS – DRAIN OR SOURCE VOLTAGE – V
234
VDD = +5V
= 0V
V
SS
Figure 3. On Resistance as a Function of V
120
100
80
OFF ISOLATION – dB
60
40
105958575655545
100 10M1k 10k 100k 1M
(VS) Single Supply
D
V
= +5V
DD
= –5V
V
SS
FREQUENCY – Hz
Figure 6. Off Isolation vs. Frequency
0.006
0.004
0.002
0.000
–0.002
LEAKAGE CURRENT – nA
–0.004
–0.006
VDD = +5V
= –5V
V
SS
= +258C
T
A
–5 5–4 –3 –2 –1 0 1 2 3 4
VD OR VS – DRAIN OR SOURCE VOLTAGE
ID(ON)
ID(OFF)
IS(OFF)
Figure 7. Leakage Currents as a Function of V
(VS)
D
110
100
90
80
CROSSTALK – dB
70
60
100 10M1k 10k 100k 1M
FREQUENCY – Hz
VDD = +5V
= –5V
V
SS
Figure 8. Crosstalk vs. Frequency
–6–
REV. 0
Test Circuits
V
S
RON = V1/I
I
DS
V1
SD
DS
V
S
I
(OFF)
S
A
SD
I
D
(OFF)
A
ADG661/ADG662/ADG663
SD
V
D
V
S
I
(ON)
D
A
V
D
1. On Resistance 2. Off Leakage
V
DD
0.1mF
V
DD
SD
R
V
S
IN
V
GND
SS
L
300V
C
L
35pF
V
OUT
V
V
V
OUT
0.1mF V
SS
4. Switching Times
V
DD
0.1mF
V
GND
DD
0.1mF
V
C
L1
35pF
OUT1
R
OUT2
L1
300V
D2
R 300V
V
SS
V
SS
V
C
L2
L2
35pF
V
S1
V
S1 D1
S2
S2
IN1, IN2
V
IN
IN
IN
3V
ADG661
ADG662
V
IN
V
OUT1
V
OUT2
50% 50%
3V
50% 50%
90% 90%
t
ON
3V
0V
50% 50%
0V
90%
0V
t
3. On Leakage
t
OFF
t
90%
90%
D
90%
D
5. Break-Before-Make Time Delay
V
DD
V
DD
R
S
V
S
SD
IN
GND
V
OUT
C
L
10nF
V
SS
V
SS
3V
V
IN
V
OUT
Q
INJ
= CL 3 DV
OUT
DV
OUT
6. Charge Injection
–7–REV. 0
ADG661/ADG662/ADG663
+5V
–5V
2200pF
R
C
75V
C
C
1000pF
C
H
2200pF
V
OUT
ADG661 ADG662 ADG663
SW2
SW1
S
S
D
D
+5V
–5V
AD845
+5V
–5V
V
IN
OP07
Test Circuits (Continued)
V
DD
0.1mF
V
DD
SD
V
S
V
S
V
OUT
R
L
50V
IN
V
IN
V
GND
0.1mF
SS
V
SS
7. Off Isolation
V
DD
0.1mF
V
DD
SD
V
IN1
SD V
GND
0.1mF
SS
CHANNEL TO CHANNEL CROSSTALK = 20 3 LOG V
V
SS
APPLICATION
Figure 9 illustrates a precise, sample-and-hold circuit. An AD845 is used as the input buffer while the output operational amplifier is an OP07. During the track mode, SW1 is closed and the output V SW1 is opened and the signal is held by the hold capacitor C
follows the input signal VIN. In the hold mode,
OUT
.
H
Due to switch and capacitor leakage, the voltage on the hold
R
L
50V
V
OUT
capacitor will decrease with time. The ADG661/ADG662/ ADG663 minimizes this droop due to its low leakage specifica­tions. The droop rate is further minimized by the use of a poly­styrene hold capacitor. The droop rate for the circuit shown is
C3257–8–1/98
typically 15 µV/µs. A second switch SW2, which operates in parallel with SW1, is
included in this circuit to reduce pedestal error. Since both switches will be at the same potential, they will have a differen­tial effect on the op amp OP07 which will minimize charge injection effects. Pedestal error is also reduced by the compensa­tion network R
and CC. This compensation network also re-
C
duces the hold time glitch while optimizing the acquisition time. Using the illustrated op amps and component values, the pedes­tal error has a maximum value of 5 mV over the ±3 V input range. The acquisition time is 2.5 ms while the settling time is
50V
V
IN2
NC
S/VOUT
1.85 µs.
8. Channel-to-Channel Crosstalk
Figure 9. Accurate Sample-and-Hold
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
16-Lead TSSOP
(RU-16)
0.201 (5.10)
0.193 (4.90)
16
0.177 (4.50)
0.169 (4.30)
1
0.006 (0.15)
0.002 (0.05)
SEATING
PLANE
PIN 1
0.0256 (0.65)
BSC
0.0118 (0.30)
0.0075 (0.19)
9
8
0.256 (6.50)
0.246 (6.25)
0.0433 (1.10) MAX
0.0079 (0.20)
0.0035 (0.090)
–8–
8° 0°
PRINTED IN U.S.A.
0.028 (0.70)
0.020 (0.50)
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