±2 V to ±6 V dual supply
2 V to 12 V single supply
Automotive temperature range −40°C to +125°C
<0.1 nA leakage currents
45 Ω on resistance over full signal range
Rail-to-rail switching operation
Single 8-to-1 multiplexer ADG658
Differential 4-to-1 multiplexer ADG659
16-lead LFCSP/TSSOP/QSOP packages
Typical power consumption <0.1 μW
TTL/CMOS compatible inputs
Package upgrades to 74HC4051/74HC4052 and
MAX4051/MAX4052/MAX4581/MAX4582
APPLICATIONS
Automotive applications
Automatic test equipment
Data acquisition systems
Battery-powered systems
Communication systems
Audio and video signal routing
Relay replacement
Sample-and-hold systems
Industrial control systems
Analog Multiplexers
ADG658/ADG659
FUNCTIONAL BLOCK DIAGRAM
ADG658
S1
8
1 OF 8
DECODER
EN
SWITCHES SHOWN FOR A LOGIC 1 INPUT
S1A
S4A
D
S1B
S4B
Figure 1.
ADG659
1 OF 4
DECODER
A0A1ENA0 A1 A2
DA
DB
03273-0-001
GENERAL DESCRIPTION
The ADG658 and ADG659 are low voltage, CMOS analog
multiplexers comprised of eight single channels and four
differential channels, respectively. The ADG658 switches one of
eight inputs (S1–S8) to a common output, D, as determined by
the 3-bit binary address lines A0, A1, and A2. The ADG659
switches one of four differential inputs to a common differential
output, as determined by the 2-bit binary address lines A0 and
EN
A1. An
the device. When disabled, all channels are switched off.
These parts are designed on an enhanced process that provides
lower power dissipation yet gives high switching speeds. These parts
can operate equally well as either multiplexers or demultiplexers
and have an input range that extends to the supplies. All
channels exhibit break-before-make switching action, preventing
momentary shorting when switching channels. All digital inputs
have 0.8 V to 2.4 V logic thresholds, ensuring TTL/CMOS logic
compatibility when using single +5 V or dual ±5 V supplies.
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
input on both devices is used to enable or disable
The ADG658 and ADG659 are available in 16-lead TSSOP/
QSOP packages and 16-lead 4 mm × 4 mm LFCSP packages.
PRODUCT HIGHLIGHTS
1. Single- and dual-supply operation. The ADG658 and
ADG659 offer high performance and are fully specified
and guaranteed with ±5 V, +5 V, and +3 V supply rails.
2. Automotive temperature range −40°C to +125°C.
3. Low power consumption, typically <0.1 μW.
4. 16-lead 4 mm × 4 mm LFCSP packages, 16-lead TSSOP
VDD = +5 V ± 10%, VSS = −5 V ± 10%, GND = 0 V, unless otherwise noted.
Table 1.
B Version Y Version
−40°C
Parameter +25°C
to +85°C
ANALOG SWITCH
Analog Signal Range VSS to VDD V VDD = +4.5 V, VSS = −4.5 V
On Resistance (RON) 45 Ω typ VS = ±4.5 V, IS = 1 mA; see Figure 21
75 90 100 Ω max
On Resistance Match between 1.3 Ω typ
Channels (∆RON) 3 3.2 3.5 Ω max VS = 3.5 V, IS = 1 mA
On Resistance Flatness (R
) 10 Ω typ VDD = +5 V, VSS = −5 V;
FLAT(ON)
16 17 18 Ω max VS = ±3 V, IS = 1 mA
LEAKAGE CURRENTS VDD = +5.5 V, VSS = −5.5 V
Source OFF Leakage IS (OFF) ±0.005 nA typ VD = ±4.5 V, VS = 4.5 V; see mFigure 22
±0.2 ±5 nA max
Drain OFF Leakage ID (OFF) ±0.005 nA typ VD = ±4.5 V, VS = 4.5 V; see mFigure 23
ADG658 ±0.2 ±5 nA max
ADG659 ±0.1 ±2.5 nA max
Channel ON Leakage ID, IS (ON) ±0.005 nA typ VD = VS = ±4.5 V; see Figure 24
ADG658 ±0.2 ±5 nA max
ADG659 ±0.1 ±2.5 nA max
DIGITAL INPUTS
Input High Voltage, V
Input Low Voltage, V
2.4 V min
INH
0.8 V max
INL
Input Current
I
or I
0.005 μA typ VIN = V
INL
INH
±1 μA max
CIN, Digital Input Capacitance 2 pF typ
DYNAMIC CHARACTERISTICS1
t
80 ns typ RL = 300 Ω, CL = 35 pF
TRANSITION
115 140 165 ns max VS = 3 V; see Figure 25
tON (EN)
80 ns typ R
115 140 165 ns max VS = 3 V; see Figure 27
t
(EN)
OFF
30 ns typ R
45 50 55 ns max VS = 3 V; see Figure 27
Break-Before-Make Time Delay, t
50 ns typ RL = 300 Ω, CL = 35 pF
BBM
10 ns min VS1 = VS2 = 3 V; see Figure 26
Charge Injection 2 pC typ VS = 0 V, RS = 0 Ω,
4 pC max CL = 1 nF; see Figure 28
Off Isolation −90 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 29
Total Harmonic Distortion, THD + N 0.025 % typ RL = 600 Ω, 2 V p-p, f = 20 Hz to 20 kHz
Channel-to-Channel Crosstalk
(ADG659)
−90 dB typ R
−3 dB Bandwidth
ADG658 210 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 30
ADG659 400 MHz typ
−40°C
to+125°C Unit Test Conditions/Comments
or V
INH
INL
= 300 Ω, CL = 35 pF
L
= 300 Ω, CL = 35 pF
L
= 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 31
L
Rev. B | Page 3 of 20
Page 4
ADG658/ADG659
B Version Y Version
−40°C
Parameter +25°C
to +85°C
CS (OFF) 4 pF typ f = 1 MHz
CD (OFF)
ADG658 23 pF typ f = 1 MHz
ADG659 12 pF typ f = 1 MHz
CD, CS (ON)
ADG658 28 pF typ f = 1 MHz
ADG659 16 pF typ f = 1 MHz
POWER REQUIREMENTS VDD = +5.5 V, VSS = −5.5 V
IDD 0.01 μA typ Digital Inputs = 0 V or 5.5 V
1 μA max
ISS 0.01 μA typ Digital Inputs = 0 V or 5.5 V
1 μA max
1
Guaranteed by design; not subject to production test.
Analog Signal Range 0 to VDD V VDD = 4.5 V, VSS = 0 V
On Resistance (RON) 85 Ω typ VS = 0 V to 4.5 V, IS = 1 mA; see Figure 21
150 160 200 Ω max
On Resistance Match between 4.5 Ω typ VS = 3.5 V, IS = 1 mA
Channels (∆RON) 8 9 10 Ω max
On Resistance Flatness (R
) 13 14 16 Ω typ VDD = 5 V, VSS = 0 V, VS = 1.5 V to 4 V, IS = 1 mA
FLAT(ON)
LEAKAGE CURRENTS VDD = 5.5 V
Source OFF Leakage IS (OFF) ±0.005 nA typ VS = 1 V/4.5 V, VD = 4.5 V/1 V; see Figure 22
±0.2 ±5 nA max
Drain OFF Leakage ID (OFF) ±0.005 nA typ VS = 1 V/4.5 V, VD = 4.5 V/1 V; see Figure 23
ADG658 ±0.2 ±5 nA max
ADG659 ±0.1 ±2.5 nA max
Channel ON Leakage ID, IS (ON) ±0.005 nA typ VS = VD = 1 V or 4.5 V, see Figure 24
ADG658 ±0.2 ±5 nA max
ADG659 ±0.1 ±2.5 nA max
DIGITAL INPUTS
Input High Voltage, V
Input Low Voltage, V
2.4 V min
INH
0.8 V max
INL
Input Current
I
or I
0.005 μA typ VIN = V
INL
INH
±1 μA max
CIN, Digital Input Capacitance 2 pF typ
DYNAMIC CHARACTERISTICS1
t
120 ns typ RL = 300 Ω, CL = 35 pF
TRANSITION
200 270 300 ns max VS = 3 V; see Figure 25
tON (EN)
120 ns typ R
190 245 280 ns max VS = 3 V; see Figure 27
t
(EN)
OFF
35 ns typ R
50 60 70 ns max VS = 3 V; see Figure 27
Break-Before-Make Time Delay, t
100 ns typ RL = 300 Ω, CL = 35 pF
BBM
10 ns min VS1 = VS2 = 3 V; see Figure 26
Charge Injection 0.5 pC typ VS = 2.5 V, RS = 0 Ω, CL = 1 nF; see Figure 28
1 pC max
Off Isolation −90 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 29
Channel-to-Channel Crosstalk −90 dB typ RL = 50 Ω, CL = 5 pF; f = 1 MHz; see Figure 31
(ADG659)
−3 dB Bandwidth
ADG658 180 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 30
ADG659 330 MHz typ
CS (OFF) 5 pF typ f = 1 MHz
CD (OFF)
ADG658 29 pF typ f = 1 MHz
ADG659 15 pF typ f = 1 MHz
−40°C
to +125°C Unit Test Conditions/Comments
or V
INH
INL
= 300 Ω, CL = 35 pF
L
= 300 Ω, CL = 35 pF
L
Rev. B | Page 5 of 20
Page 6
ADG658/ADG659
B Version Y Version
−40°C
Parameter +25°C
to +85°C
CD, CS (ON)
ADG658 30 pF typ f = 1 MHz
ADG659 16 pF typ f = 1 MHz
POWER REQUIREMENTS VDD = 5.5 V
IDD 0.01 μA typ Digital Inputs = 0 V or 5.5 V
1 μA max
1
Guaranteed by design; not subject to production test.
Analog Signal Range 0 to VDD V VDD = 2.7 V, VSS = 0 V
On Resistance (RON) 185 Ω typ VS = 0 V to 2.7 V, IS = 0.1 mA; see Figure 21
300 350 400 Ω max
On Resistance Match between 2 Ω typ VS = 1.5 V, IS = 0.1 mA
Channels (∆RON) 4.5 6 7 Ω max
LEAKAGE CURRENTS VDD = 3.3 V
Source OFF Leakage IS (OFF) ±0.005 nA typ VS = 1 V/3 V, VD = 3 V/1 V; see Figure 22
±0.2 ±5 nA max
Drain OFF Leakage ID (OFF) ±0.005 nA typ VS = 1 V/3 V, VD = 3 V/1 V; see Figure 23
ADG658 ±0.2 ±5 nA max
ADG659 ±0.1 ±2.5 nA max
Channel ON Leakage ID, IS (ON) ±0.005 nA typ VS = VD = 1 V or 3 V, see Figure 24
ADG658 ±0.2 ±5 nA max
ADG659 ±0.1 ±2.5 nA max
DIGITAL INPUTS
Input High Voltage, V
Input Low Voltage, V
2.0 V min
INH
0.5 V max
INL
Input Current
I
or I
0.005 μA typ VIN = V
INL
INH
±1 μA max
CIN, Digital Input Capacitance 2 pF typ
DYNAMIC CHARACTERISTICS1
t
200 ns typ RL = 300 Ω, CL = 35 pF
TRANSITION
370 440 490 ns max VS = 1.5 V; see Figure 25
tON (EN)
230 ns typ R
370 440 490 ns max VS = 1.5 V; see Figure 27
t
(EN)
OFF
50 ns typ R
80 90 110 ns max VS = 1.5 V; see Figure 27
Break-Before-Make Time Delay, t
200 ns typ RL = 300 Ω, CL = 35 pF
BBM
10 ns min VS1 = VS2 = 1.5 V; see Figure 26
Charge Injection 1 pC typ VS = 1.5 V, RS = 0 Ω, CL = 1 nF; see Figure 28
2 pC max
Off Isolation −90 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 29
Channel-to-Channel Crosstalk −90 dB typ RL = 50 Ω, CL = 5 pF; f = 1 MHz; see Figure 31
(ADG659)
−3 dB Bandwidth
ADG658 160 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 30
ADG659 300 MHz typ
CS (OFF) 5 pF typ f = 1 MHz
CD (OFF)
ADG658 29 pF typ f = 1 MHz
ADG659 15 pF typ f = 1 MHz
−40°C
to +125°C Unit Test Conditions/Comments
or V
INH
INL
= 300 Ω, CL = 35 pF
L
= 300 Ω, CL = 35 pF
L
Rev. B | Page 7 of 20
Page 8
ADG658/ADG659
B Version Y Version
−40°C
Parameter +25°C
to +85°C
CD, CS (ON)
ADG658 30 pF typ f = 1 MHz
ADG659 16 pF typ f = 1 MHz
POWER REQUIREMENTS VDD = 3.6 V
IDD 0.01 μA typ Digital Inputs = 0 V or 3.6 V
1 μA max
1
Guaranteed by design; not subject to production test.
−40°C
to +125°C
Unit Test Conditions/Comments
Rev. B | Page 8 of 20
Page 9
ADG658/ADG659
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter Rating
VDD to VSS 13 V
VDD to GND −0.3 V to +13 V
VSS to GND +0.3 V to −6.5 V
Analog Inputs1 V
Digital Inputs1
Peak Current, S or D 40 mA
(Pulsed at 1 ms, 10% duty cycle max)
Continuous Current, S or D 20 mA
Operating Temperature Range
Automotive (Y Version) −40°C to +125°C
Industrial (B Version) −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
θJA Thermal Impedance
Over voltages at AX, EN, S, or D are clamped by internal diodes. Current
should be limited to the maximum ratings.
− 0.3 V to VDD + 0.3 V
SS
GND − 0.3 V to V
or 10 mA, whichever
occurs first
+ 0.3 V
DD
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 3. 16-Lead, 4 mm × 4 mm LFCSP Pin Configuration
DD
V
S3B
S1B
16 15 14 13
ADG659
TOP VIEW
(Not to Scale)
5 6 7 8
SS
A1
V
GND
S3A
A0
12
S2A
11
DA
10
S1A
S4A
9
03273-A-003
Table 7. Pin Function Descriptions
Parameter Description
VDD Most Positive Power Supply Potential.
VSS Most Negative Power Supply Potential.
IDD Positive Supply Current.
ISS Negative Supply Current.
GND Ground (0 V) Reference.
S Source Terminal. May be an input or output.
D Drain Terminal. May be an input or output.
AX Logic Control Input.
EN Active Low Digital Input. When high, device is disabled and all switches are OFF. When low, AX logic inputs determine ON
switch.
VD (VS) Analog Voltage on Terminals D, S.
RON Ohmic Resistance between D and S.
∆RON On Resistance Match between Any Two Channels, i.e., RONmax − RONmin.
R
FLAT(ON)
Flatness is defined as the difference between the maximum and minimum value of ON Resistance as measured over the
specified analog signal range.
IS (OFF) Source Leakage Current with the Switch OFF.
ID (OFF) Drain Leakage Current with the Switch OFF.
ID, IS (ON) Channel Leakage Current with the Switch ON.
V
Maximum Input Voltage for Logic 0.
INL
V
Minimum Input Voltage for Logic 1.
INH
I
) Input Current of the Digital Input.
INL (IINH
CS (OFF) OFF Switch Source Capacitance. Measured with reference to ground.
CD (OFF) OFF Switch Drain Capacitance. Measured with reference to ground.
CD, CS (ON) ON Switch Capacitance. Measured with reference to ground.
CIN Digital Input Capacitance.
Rev. B | Page 11 of 20
Page 12
ADG658/ADG659
Parameter Description
tON Delay between Applying the Digital Control Input and the Output Switching ON. See Test Circuit 7.
t
Delay between Applying the Digital Control Input and the Output Switching OFF.
OFF
t
ON Time. Measured between 80% points of both switches when switching from one address state to another.
BBM
Charge
Injection
Off Isolation Measure of Unwanted Signal Coupling through an OFF Switch.
Crosstalk Measure of Unwanted Signal Coupled through from One Channel to Another as a Result of Parasitic Capacitance.
Bandwidth The Frequency at which the Output is Attenuated by 3 dB.
On Response The Frequency Response of the ON Switch.
Insertion Loss The Loss Due to the ON Resistance of the Switch.
Measure of the Glitch Impulse Transferred from the Digital Input to the Analog Output during Switching.
Rev. B | Page 12 of 20
Page 13
ADG658/ADG659
TYPICAL PERFORMANCE CHARACTERISTICS
100
TA = 25°C
90
80
70
60
50
40
ON RESISTANCE (Ω)
30
20
10
0
–5.5–3.5–1.50.52.54.5
VDD,VSS = ±5.5V
VDD,VSS = ±3V
VDD,VSS = ±5V
VD, VS (V)
Figure 4. On Resistance vs. V
VDD,VSS = ±2.7V
VDD,VSS = ±4.5V
(VS) for Dual Supply
D
03273-0-006
140
120
100
80
60
ON RESISTANCE (Ω)
40
20
= 5V
V
DD
= 0V
V
SS
0
01.02.0
0.51.52.5 3.04.54.05.0
V
+125°C
, VS (V)
D
+85°C
–40°C
3.5
+25°C
03273-0-009
Figure 7. On Resistance vs. VD (VS) for Different Temperatures (Single Supply)
250
200
150
100
ON RESISTANCE (Ω)
50
0
024681012
VDD = 2.7V
VDD = 5.5V
VDD = 12V
VDD = 3V
VDD = 3.3V
VDD = 4.5V
VDD = 5V
VDD = 10V
VD, VS(V)
Figure 5. On Resistance vs. VD (VS) for Single Supply
100
90
80
70
60
50
40
ON RESISTANCE (Ω)
30
20
VDD = +5V
10
V
SS
0
–5–20
Figure 6. On Resistance vs. V
+125°C
+85°C
+25°C
–40°C
= –5V
–4–11235
V
, VS(V)
D
(VS) for Different Temperatures (Dual Supply)
D
TA = 25°C
4–3
03273-0-007
03273-0-008
300
250
200
150
100
ON RESISTANCE (Ω)
50
VDD = 3V
V
= 0V
SS
0
00.51.01.52.02.53.0
Figure 8. On Resistance vs. V
1.5
VDD = 5V
V
= –5V
SS
1.0
V
= ±4V
D
V
= ±4V
S
0.5
0
–0.5
–1.0
CURRENT (nA)
–1.5
–2.0
–2.5
020406080100120
Figure 9. Leakage Current vs. Temperature (Dual Supply)
+85°C
+25°C
–40°C
V
, VS (V)
D
(VS) for Different Temperatures (Single Supply)
D
+125°C
IS (OFF)
ID (OFF)
IS,ID (ON)
TEMPERATURE (°C)
03273-0-011
03273-0-010
Rev. B | Page 13 of 20
Page 14
ADG658/ADG659
1.5
VDD = +5V
V
= 0V
SS
1.0
V
= ±4V
D
±
V
=1V
S
0.5
0
–0.5
–1.0
CURRENT (nA)
–1.5
VDD = +3V
V
= 0V
SS
–2.0
V
= ±2.4V
D
±
V
=1V
S
–2.5
020406080100120
TEMPERATURE (°C)
IS,ID (ON)
IS (OFF)
ID (OFF)
Figure 10. Leakage Current vs. Temperature (Single Supply)
14
TA = 25°C
12
10
8
C)
P
(
6
INJ
Q
4
VDD = +5V
2
V
= –5V
SS
0
–2
–4
–5–3–1135
–4–2024
(V)
V
S
VDD = +5V
V
SS
Figure 11. Charge Injection vs. Source Voltage
140
VDD = +5V
= –5V
V
SS
120
100
80
TIME (ns)
60
40
20
0
–40–20020406080100120
Figure 12. t
t
ON
TEMPERATURE (°C)
Times vs. Temperature (Dual Supply)
ON/tOFF
t
OFF
= 0V
03273-0-012
03273-0-013
03273-0-014
350
VSS = 0V
300
250
200
150
t
TIME (ns)
ON
100
50
0
–40–200100120
Figure 13. tON/t
VDD = 3V
VDD = 5V
VDD = 3V
t
OFF
20406080
TEMPERATURE (°C)
Times vs. Temperature (Single Supply)
OFF
VDD = 5V
0
–1
–2
–3
–4
–5
–6
–7
dB
–8
–9
–10
–11
–12
VDD = +5V
–13
–14
–15
= –5V
V
SS
= 25°C
T
A
100k1M10M100M
FREQUENCY (Hz)
Figure 14. ON Response vs. Frequency (ADG658)
0
–2
–4
–6
–8
–10
–12
dB
–14
–16
–18
–20
VDD = +5V
V
= –5V
SS
–22
T
= 25°C
A
–24
100k1M10M100M
FREQUENCY (Hz)
Figure 15. ON Response vs. Frequency (ADG659)
03273-0-015
03273-0-016
03273-0-017
Rev. B | Page 14 of 20
Page 15
ADG658/ADG659
–20
–40
0
VDD = +5V
V
= –5V
SS
T
= 25°C
A
10000
1000
100
VSS = 0V
VDD = 12V
–60
dB
–80
–100
–120
–10
–20
–30
–40
–50
–60
dB
–70
–80
–90
–100
–110
–120
–130
100
10
100k1M10M100M
FREQUENCY (Hz)
Figure 16. OFF Isolation vs. Frequency
0
VDD = –5V
V
= +5V
SS
T
= 25°C
A
100k1M10M100M
FREQUENCY (Hz)
Figure 17. Crosstalk vs. Frequency
600Ω
IN AND OUT
VDD = +5V
V
= –5V
SS
= 25°C
T
A
03273-0-018
03273-0-019
(μA)
10
DD
I
1
0.1
0.01
01012
2468
VDD = 5V
VDD = 3V
V(EN) (V)
03273-0-021
Figure 19. VDD Current vs. Logic Level
3.0
2.5
2.0
1.5
1.0
0.5
LOGIC THRESHOLD VOLTAGE (V)
0
0
(V)
V
DD
12246810
03273-0-022
Figure 20. Logic Threshold Voltage vs. Supply Voltage
1
THD + N (%)
0.1
0.01
2050100
200 5001k5k10k 20k
FREQUENCY (Hz)
2k
Figure 18. THD + Noise
03273-0-020
Rev. B | Page 15 of 20
Page 16
ADG658/ADG659
V
V
TEST CIRCUITS
I
DS
V
V
DD
V1
V
S
V
S
RON =V1/I
D
DS
03273-0-023
S1
S2
S8
V
S
Figure 21. ON Resistance
V
V
DD
SS
V
V
DD
GND
(OFF)
S
SS
D
EN
LOGIC 1
03273-0-024
V
S
(OFF)
I
S
S
S1
A
S2
S8
V
D
Figure 22. I
V
V
S1
S8
V
DDVSS
V
DDVSS
A2
IN
50Ω
A1
A0
S2–S7
ADG658*
EN
GND
*SIMILAR CONNECTION FOR ADG659
V
S1
S8
S1
V
S8
D
R
300Ω
C
L
L
35pF
ADDRESS
DRIVE (V
V
OUT
Figure 25. Switching Time of Multiplexer, t
3V
)
IN
0V
V
S1
V
OUT
V
S8
TRANSITION
50%50%
t
TRANSITION
SS
V
DD
SS
EN
GND
Figure 23. ID (OFF)
V
DD
SS
V
DD
SS
EN
GND
Figure 24. ID (ON)
90%
I
D
D
LOGIC 1
I
D
t
TRANSITION
(OFF)
A
(ON)
D
A
90%
V
O
03273-0-025
V
D
03273-0-026
03273-0-027
Rev. B | Page 16 of 20
Page 17
ADG658/ADG659
V
*
IN
50Ω
*SIMILAR CONNECTION FOR ADG659
V
DD
V
DD
A2
A1
A0
ADG658*
EN
GND
V
SS
V
SS
S2–S7
3V
ADDRESS
DRIVE (V
V
OUT
R
L
300Ω
V
S
C
L
35pF
S1
S8
D
Figure 26. Break-Before-Make Delay, t
)
IN
0V
BBM
80%
03273-0-028
V
OUT
80%
t
BBM
V
V
V
A2
A1
A0
V
IN
EN
50Ω
*SIMILAR CONNECTION FOR ADG659
DD
DD
ADG658*
GND
SS
V
SS
S2–S8
3V
ENABLE
V
S1
S
D
R
300Ω
C
L
L
35pF
DRIVE (V
V
OUT
Figure 27. Enable Delay, t
OUTPUT
)
IN
0V
V
O
0V
(EN), t
OFF
(EN)
ON
50%50%
0.9V
O
t
(EN)
ON
0.9V
t
(EN)
OFF
O
03273-0-029
V
DDVSS
V
A2
DDVSS
A1
ADG658*
R
S
V
S
V
IN
SIMILAR CONNECTION FOR ADG659
A0
SD
EN
GND
C
1nF
LOGIC INPUT
V
OUT
L
3V
(V
)
IN
0V
V
OUT
Q
INJ
= CL×ΔV
OUT
ΔV
OUT
03273-0-030
Figure 28. Charge Injection
Rev. B | Page 17 of 20
Page 18
ADG658/ADG659
V
LOGIC 1
0.1μ F
DD
V
DDVSS
A2
A1
A0
EN
V
SS
0.1μ F
S
D
GND
50Ω
Figure 29. Off Isolation
NETWORK
ANALYZER
50Ω
R
L
50Ω
OFF ISOLATION = 20 LOG
NETWORK
ANALYZER
50Ω
V
S
V
S
V
OUT
V
OUT
V
03273-0-031
S
VDDV
SS
50Ω
0.1μ F
A1
A0
S1A
S1B
DB
DA
VDDV
ADG659
0.1μ F
SS
EN
DA
DB
GND
V
DDVSS
0.1μF0.1μF
V
DDVSS
A2
A1
S
A0
D
EN
GND
INSERTION LOSS = 20 LOG
Figure 30. Bandwidth
NETWORK
ANALYZER
V
OUT
R
L
50Ω
50Ω
V
S
V
OUT
R
L
50Ω
WITH SWITCH
V
OUT
WITHOUT SWITCH
V
OUT
03273-0-032
V
CHANNEL-TO-CHANNEL CROSSTALK = 20 LOG
OUT
V
S
03273-0-033
Figure 31. Channel-to-Channel Crosstalk
Rev. B | Page 18 of 20
Page 19
ADG658/ADG659
R
R
OUTLINE DIMENSIONS
5.10
5.00
4.90
0.15
0.05
4.50
4.40
4.30
PIN 1
16
0.65
BSC
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153AB
0.10
0.30
0.19
9
81
1.20
MAX
SEATING
PLANE
6.40
BSC
0.20
0.09
8°
0°
0.75
0.60
0.45
Figure 32. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
PIN 1
INDICATO
1.00
0.85
0.80
4.0
12° MAX
SEATING
PLANE
BSC SQ
TOP
VIEW
0.80 MAX
0.65 TYP
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
0.35
0.28
0.25
3.75
BSC SQ
0.20 REF
0.60 MAX
0.65 BSC
0.05 MAX
0.02 NOM
0.75
0.60
0.50
COPLANARITY
0.08
Figure 33. 16-Lead Lead Frame Chip Scale Package [LFCSP]
(CP-16-4)
Dimensions shown in millimeters
0.60 MAX
13
12
EXPOSED
PAD
(BOTTOM VIEW)
9
8
16
1
4
5
1.95 BSC
PIN 1
INDICATO
2.25
2.10 SQ
1.95
0.25 MIN
Rev. B | Page 19 of 20
Page 20
ADG658/ADG659
0.065
0.049
0.010
0.004
COPLANARITY
0.004
0.193
BSC
0.012
0.008
9
8
0.154
BSC
0.069
0.053
SEATING
PLANE
0.236
BSC
0.010
0.006
16
1
PIN 1
0.025
BSC
COMPLIANT TO JEDEC STANDARDS MO-137AB
8°
0°
0.050
0.016
Figure 34. 16-Lead Shrink Small Outline Package [QSOP]
(RQ-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
ADG658YRU −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG658YRU-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG658YRUZ1 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG658YRUZ-REEL71 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG658YCP −40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16
ADG658YCP-REEL7 −40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16
ADG658YCPZ1 −40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16
ADG658YRQ −40°C to +125°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG658YRQ-REEL −40°C to +125°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG658YRQZ1 −40°C to +125°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG658YRQZ-REEL71 −40°C to +125°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG659YRU −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG659YRU-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG659YRUZ1 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG659YRUZ-REEL71 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG659WYRUZ-REEL7
ADG659YCP −40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16
ADG659YCPZ
1
ADG659YCPZ-REEL7
ADG659YRQ −40°C to +125°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG659YRQ-REEL −40°C to +125°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG659YRQ-REEL7 −40°C to +125°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
ADG659YRQZ1 −40°C to +125°C 16-Lead Shrink Small Outline Package [QSOP] RQ-16
1
Z = RoHS Compliant Part.
2
Qualified for automotive.
1, 2
−40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
−40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16
1
−40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16