Datasheet ADG658 Datasheet (Analog Devices)

Page 1
+3 V/+5 V/±5 V CMOS 4- and 8-Channel
S

FEATURES

±2 V to ±6 V dual supply 2 V to 12 V single supply Automotive temperature range −40°C to +125°C <0.1 nA leakage currents 45 Ω on resistance over full signal range Rail-to-rail switching operation Single 8-to-1 multiplexer ADG658 Differential 4-to-1 multiplexer ADG659 16-lead LFCSP/TSSOP/QSOP packages Typical power consumption <0.1 µW TTL/CMOS compatible inputs Package upgrades to 74HC4051/74HC4052 and
MAX4051/MAX4052/MAX4581/MAX4582

APPLICATIONS

Automotive applications Automatic test equipment Data acquisition systems Battery-powered systems Communication systems Audio and video signal routing Relay replacement Sample-and-hold systems Industrial control systems

GENERAL DESCRIPTION

The ADG658 and ADG659 are low voltage, CMOS analog multiplexers comprised of eight single channels and four differential channels, respectively. The ADG658 switches one of eight inputs (S1–S8) to a common output, D, as determined by the 3-bit binary address lines A0, A1, and A2. The ADG659 switches one of four differential inputs to a common differential output, as determined by the 2-bit binary address lines A0 and
EN
A1. An the device. When disabled, all channels are switched off.
These parts are designed on an enhanced process that provides lower power dissipation yet gives high switching speeds. These parts can operate equally well as either multiplexers or
input on both devices is used to enable or disable
Analog Multiplexers
ADG658/ADG659
demultiplexers and have an input range that extends to the supplies. All channels exhibit break-before-make switching action, preventing momentary shorting when switching channels. All digital inputs have 0.8 V to 2.4 V logic thresholds, ensuring TTL/CMOS logic compatibility when using single +5 V or dual ±5 V supplies.
The ADG658 and ADG659 are available in 16-lead TSSOP/ QSOP packages and 16-lead 4 mm × 4 mm LFCSP packages.

PRODUCT HIGHLIGHTS

1. Single- and dual-supply operation. The ADG658 and ADG659 offer high performance and are fully specified and guaranteed with ±5 V, +5 V, and +3 V supply rails.
2. Automotive temperature range −40°C to +125°C.
3. Low power consumption, typically <0.1 µW.
4. 16-lead 4 mm × 4 mm LFCSP packages, 16-lead TSSOP package and 16-lead QSOP package.
FUNCTIONAL BLOCK DIAGRAM
A0 A1 ENA0 A1 A2
Figure 1.
ADG659
1 OF 4
DECODER
DA
DB
03273-0-001
ADG658
S1
8
1 OF 8
DECODER
EN
SWITCHES SHOWN FOR A LOGIC 1 INPUT
S1A
S4A
D
S1B
S4B
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 Fax: 781.326.8703 © 2004 Analog Devices, Inc. All rights reserved.
www.analog.com
Page 2
ADG658/ADG659
TABLE OF CONTENTS
Specifications: Dual Supply............................................................. 3
Pin Configuration and Function Descriptions........................... 11
Specifications: Single Supply 5V..................................................... 5
Specifications: Single Supply 2.7 to 3.6 V...................................... 7
Absolute Maximum Ratings............................................................ 9
ESD Caution.................................................................................. 9
REVISION HISTORY
7/04—Data Sheet Changed from Rev. 0 to Rev. A
Updated Format.............................................................. Universal
Added QSOP Package Outline ..................................................20
Changes to Ordering Guide....................................................... 20
3/03—Rev. 0: Initial Version
Typical Perfor m a n c e C ha r a c te r is t i c s ........................................... 13
Test C ir c uits ................................................................................ 16
Outline Dimensions ....................................................................... 19
Ordering Guide .......................................................................... 20
Rev. A | Page 2 of 20
Page 3
ADG658/ADG659

SPECIFICATIONS: DUAL SUPPLY

VDD = +5 V ± 10%, VSS = −5 V ± 10%, GND = 0 V, unless otherwise noted. Table 1.
B Version
−40°C
Parameter +25°C
to +85°C
ANALOG SWITCH
Analog Signal Range VSS to V On Resistance (RON) 45 typ VS = ±4.5 V, IS = 1 mA; 75 90 100 Ω max Test Circuit 1 On Resistance Match between 1.3 Ω typ Channels (∆RON) 3 3.2 3.5 max VS = 3.5 V, IS = 1 mA On Resistance Flatness (R
) 10 typ VDD = +5 V, VSS = −5 V;
FLAT(ON)
16 17 18 max VS = ±3 V, IS = 1 mA LEAKAGE CURRENTS VDD = +5.5 V, VSS = −5.5 V
Source OFF Leakage IS (OFF) ±0.005 nA typ ±0.2 ±5 nA max Test Circuit 2
Drain OFF Leakage ID (OFF) ±0.005 nA typ
ADG658 ±0.2 ±5 nA max Test Circuit 3 ADG659 ±0.1 ±2.5 nA max
Channel ON Leakage ID, IS (ON) ±0.005 nA typ VD = VS = ±4.5 V; Test Circuit 4
ADG658 ±0.2 ±5 nA max ADG659 ±0.1 ±2.5 nA max
DIGITAL INPUTS
Input High Voltage, V Input Low Voltage, V
INH
INL
2.4 V min
0.8 V max
Input Current
I
or I
INL
INH
0.005 µA typ VIN = V ±1 µA max CIN, Digital Input Capacitance 2 pF typ
DYNAMIC CHARACTERISTICS
t
TRANS
2
80 ns typ RL = 300 Ω, CL = 35 pF 115 140 165 ns max VS = 3 V; Test Circuit 5 tON (EN)
80 ns typ R 115 140 165 ns max VS = 3 V; Test Circuit 7 t
(EN)
OFF
30 ns typ R 45 50 55 ns max VS = 3 V; Test Circuit 7 Break-Before-Make Time Delay, t
BBM
50 ns typ RL = 300 Ω, CL = 35 pF 10 ns min VS1 = VS2 = 3 V; Test Circuit 6 Charge Injection 2 pC typ VS = 0 V, RS = 0 Ω, 4 pC max CL = 1 nF; Test Circuit 8 Off Isolation −90 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; Test Circuit 9 Total Harmonic Distortion, THD + N 0.025 % typ RL = 600 Ω, 2 V p-p, f = 20 Hz to 20 kHz
Channel-to-Channel Crosstalk (ADG659) −90 dB typ R
−3 dB Bandwidth
ADG658 210 MHz typ RL = 50 Ω, CL = 5 pF;
ADG659 400 MHz typ Test Circuit 10 CS (OFF) 4 pF typ f = 1 MHz CD (OFF)
ADG658 23 pF typ f = 1 MHz
ADG659 12 pF typ f = 1 MHz
1
Y Version
−40°C to+125°C Unit Test Conditions/Comments
V VDD = +4.5 V, VSS = −4.5 V
DD
= ±4.5 V, VS = 4.5 V;
V
D
= ±4.5 V, VS = 4.5 V;
V
D
or V
INL
= 300 Ω, CL = 35 pF
L
= 300 Ω, CL = 35 pF
L
= 50 Ω, CL = 5 pF, f = 1 MHz; Test Circuit 11
L
m
m
INH
Rev. A | Page 3 of 20
Page 4
ADG658/ADG659
B Version
−40°C
Parameter +25°C
to +85°C
CD, CS (ON)
ADG658 28 pF typ f = 1 MHz ADG659 16 pF typ f = 1 MHz
POWER REQUIREMENTS VDD = +5.5 V, VSS = −5.5 V
I
DD
0.01 µA typ Digital Inputs = 0 V or 5.5 V
1 µA max
I
SS
0.01 µA typ Digital Inputs = 0 V or 5.5 V
1 µA max
1
Temperature range is as follows: B Version: −40°C to +85°C. Y Version: −40°C to +125°C.
2
Guaranteed by design; not subject to production test.
Y Version
−40°C to+125°C Unit Test Conditions/Comments
Rev. A | Page 4 of 20
Page 5
ADG658/ADG659

SPECIFICATIONS: SINGLE SUPPLY 5V

VDD = 5 V ± 10%, VSS = 0 V, GND = 0 V, unless otherwise noted. Table 2.
B Version
−40°C
Parameter +25°C
to +85°C
ANALOG SWITCH
Analog Signal Range 0 to V On Resistance (RON) 85 typ VS = 0 V to 4.5 V, IS = 1 mA; 150 160 200 Ω max Test Circuit 1 On Resistance Match between 4.5 Ω typ VS = 3.5 V, IS = 1 mA Channels (∆RON) 8 9 10 max On Resistance Flatness (R
) 13 14 16 typ
FLAT(ON)
LEAKAGE CURRENTS VDD = 5.5 V
Source OFF Leakage IS (OFF) ±0.005 nA typ VS = 1 V/4.5 V, VD = 4.5 V/1 V; ±0.2 ±5 nA max Test Circuit 2 Drain OFF Leakage ID (OFF) ±0.005 nA typ VS = 1 V/4.5 V, VD = 4.5 V/1 V;
ADG658 ±0.2 ±5 nA max Test Circuit 3 ADG659 ±0.1 ±2.5 nA max
Channel ON Leakage ID, IS (ON) ±0.005 nA typ VS = VD = 1 V or 4.5 V, Test Circuit 4
ADG658 ±0.2 ±5 nA max ADG659 ±0.1 ±2.5 nA max
DIGITAL INPUTS
Input High Voltage, V Input Low Voltage, V
INH
INL
2.4 V min
0.8 V max
Input Current
I
or I
INL
INH
0.005 µA typ VIN = V ±1 µA max CIN, Digital Input Capacitance 2 pF typ
DYNAMIC CHARACTERISTICS
t
TRANS
2
120 ns typ RL = 300 Ω, CL = 35 pF 200 270 300 ns max VS = 3 V; Test Circuit 5 tON (EN)
120 ns typ R 190 245 280 ns max VS = 3 V; Test Circuit 7 t
(EN)
OFF
35 ns typ R 50 60 70 ns max VS = 3 V; Test Circuit 7 Break-Before-Make Time Delay, t
100 ns typ RL = 300 Ω, CL = 35 pF
BBM
10 ns min VS1 = VS2 = 3 V; Test Circuit 6 Charge Injection 0.5 pC typ VS = 2.5 V, RS = 0 Ω, CL = 1 nF; 1 pC max Test Circuit 8 Off Isolation −90 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; Test Circuit 9 Channel-to-Channel Crosstalk −90 dB typ RL = 50 Ω, CL = 5 pF; f = 1 MHz;
(ADG659) Test Circuit 11
−3 dB Bandwidth
ADG658 180 MHz typ RL = 50 Ω, CL = 5 pF;
ADG659 330 MHz typ Test Circuit 10 CS (OFF) 5 pF typ f = 1 MHz CD (OFF)
ADG658 29 pF typ f = 1 MHz
ADG659 15 pF typ f = 1 MHz
1
Y Version
−40°C to +125°C Unit Test Conditions/Comments
DD
V VDD = 4.5 V, VSS = 0 V
= 5 V, VSS = 0 V
V
DD
= 1.5 V to 4 V, IS = 1 mA
V
S
or V
INL
INH
= 300 Ω, CL = 35 pF
L
= 300 Ω, CL = 35 pF
L
Rev. A | Page 5 of 20
Page 6
ADG658/ADG659
C
, CS (ON)
D
ADG658 30 pF typ f = 1 MHz ADG659 16 pF typ f = 1 MHz
POWER REQUIREMENTS VDD = 5.5 V
I
DD
1 µA max
1
Temperature range is as follows: B Version: −40°C to +85°C. Y Version: −40°C to +125°C.
2
Guaranteed by design; not subject to production test.
0.01 µA typ Digital Inputs = 0 V or 5.5 V
Rev. A | Page 6 of 20
Page 7
ADG658/ADG659

SPECIFICATIONS: SINGLE SUPPLY 2.7 TO 3.6 V

VDD = 2.7 to 3.6 V, VSS = 0 V, GND = 0 V, unless otherwise noted. Table 3.
B Version
−40°C
Parameter +25°C
to +85°C
ANALOG SWITCH
Analog Signal Range 0 to V On Resistance (RON) 185 typ VS = 0 V to 2.7 V, IS = 0.1 mA; 300 350 400 Ω max Test Circuit 1 On Resistance Match between 2 Ω typ VS = 1.5 V, IS = 0.1 mA
Channels (∆RON)
4.5 6 7 max
LEAKAGE CURRENTS VDD = 3.3 V
Source OFF Leakage IS (OFF) ±0.005 nA typ VS = 1 V/3 V, VD = 3 V/1 V; ±0.2 ±5 nA max Test Circuit 2 Drain OFF Leakage ID (OFF) ±0.005 nA typ VS = 1 V/3 V, VD = 3 V/1 V;
ADG658 ±0.2 ±5 nA max Test Circuit 3
ADG659 ±0.1 ±2.5 nA max Channel ON Leakage ID, IS (ON) ±0.005 nA typ VS = VD = 1 V or 3 V, Test Circuit 4
ADG658 ±0.2 ±5 nA max
ADG659 ±0.1 ±2.5 nA max
DIGITAL INPUTS Input High Voltage, V Input Low Voltage, V
INH
INL
2.0 V min
0.5 V max
Input Current
I
or I
INL
INH
0.005 µA typ VIN = V ±1 µA max CIN, Digital Input Capacitance 2 pF typ DYNAMIC CHARACTERISTICS
t
TRANS
2
200 ns typ RL = 300 Ω, CL = 35 pF 370 440 490 ns max VS = 1.5 V; Test Circuit 7 tON (EN)
230 ns typ R 370 440 490 ns max VS = 1.5 V; Test Circuit 7 t
(EN)
OFF
50 ns typ R
80 90 110 ns max VS = 1.5 V; Test Circuit 7
Break-Before-Make Time Delay, t
200 ns typ RL = 300 Ω, CL = 35 pF
BBM
10 ns min VS1 = VS2 = 1.5 V; Test Circuit 6 Charge Injection 1 pC typ VS = 1.5 V, RS = 0 Ω, CL = 1 nF; 2 pC max Test Circuit 8 Off Isolation −90 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; Test Circuit 9 Channel-to-Channel Crosstalk −90 dB typ RL = 50 Ω, CL = 5 pF; f = 1 MHz;
(ADG659) Test Circuit 11
−3 dB Bandwidth
ADG658 160 MHz typ RL = 50 Ω, CL = 5 pF;
ADG659 300 MHz typ Test Circuit 10 CS (OFF) 5 pF typ f = 1 MHz CD (OFF)
ADG658 29 pF typ f = 1 MHz
ADG659 15 pF typ f = 1 MHz CD, CS (ON)
ADG658 30 pF typ f = 1 MHz
ADG659 16 pF typ f = 1 MHz
1
Y Version
−40°C to +125°C Unit Test Conditions/Comments
DD
V VDD = 2.7 V, VSS = 0 V
or V
INL
INH
= 300 Ω, CL = 35 pF
L
= 300 Ω, CL = 35 pF
L
Rev. A | Page 7 of 20
Page 8
ADG658/ADG659
B Version
−40°C
Parameter +25°C
to +85°C
POWER REQUIREMENTS VDD = 3.6 V
I
DD
0.01 µA typ Digital Inputs = 0 V or 3.6 V
1 µA max
1
Temperature range is as follows: B Version: −40°C to +85°C. Y Version: −40°C to +125°C.
2
Guaranteed by design; not subject to production test.
Y Version
−40°C to +125°C Unit Test Conditions/Comments
Rev. A | Page 8 of 20
Page 9
ADG658/ADG659

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.
Table 4.
Parameters Ratings
VDD to V
SS
13 V VDD to GND −0.3 V to +13 V VSS to GND +0.3 V to −6.5 V Analog Inputs Digital Inputs
1
1
V
−0.3 V to VDD +0.3 V
SS
GND −0.3 V to VDD +0.3
V or 10 mA, whichever
occurs first Peak Current, S or D 40 mA (Pulsed at 1 ms, 10% duty cycle max) Continuous Current, S or D 20 mA Operating Temperature Range
Automotive (Y Version) −40°C to +125°C
Industrial (B Version) −40°C to +85°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C θJA Thermal Impedance, 16-Lead
104°C/W
QSOP θJA Thermal Impedance, 16-Lead
150.4°C/W
TSSOP θJA Thermal Impedance (4-Layer
Board),
16-Lead LFCSP 70°C/W Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C ESD 5.5 kV
1
Over voltages at AX, EN, S, or D are clamped by internal diodes. Current
should be limited to the maximum ratings.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Rev. A | Page 9 of 20
Page 10
ADG658/ADG659
Table 5. ADG658 Truth Table
A2 A1 A0
1
X
X X 1 NONE
EN
0 0 0 0 1 0 0 1 0 2 0 1 0 0 3 0 1 1 0 4 1 0 0 0 5 1 0 1 0 6 1 1 0 0 7 1 1 1 0 8
1
X = Don’t Care
Table 6. ADG659 Truth Table
A1 A0
1
X
X 1 NONE
EN
0 0 0 1 0 1 0 2 1 0 0 3 1 1 0 4
1
X = Don’t Care
Switch Condition
On Switch Pair
Rev. A | Page 10 of 20
Page 11
ADG658/ADG659

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

S1B S3B
DB S4B S2B
EN
V
GND
1
2
3 4
5
6
7
SS
8
ADG659
TOP VIEW
(Not to Scale)
16
V
DD
15
S3A
14
S2A
13
DA
12
S1A
11
S4A
10
A0
9
A1
03273-0-002
EN
V
GND
S5 S7
D S8 S6
SS
1
2
3
ADG658
4
TOP VIEW
(Not to Scale)
5
6
7
8
16
V
DD
15
S3
14
S2
13
S1
12
S4
11
A0
10
A1
9
A2
Figure 2. 16-Lead TSSOP/QSOP
S8 S6
EN
D
1 2 3
(Not to Scale)
4
DD
V
S7
S5
16 15 14 13
ADG658
TOPVIEW
5 6 7 8
SS
A2
V
GND
S3
12
S2
11
S1
10
S4 A0
9
A1
EXPOSED PAD FLOATING
DB S4B S2B
EN
1 2 3 4
DD
V
S3B
S1B
16 15 14 13
ADG659
TOPVIEW
(Not to Scale)
5 6 7 8
SS
A1
V
GND
S3A
A0
12
S2A
11
DA
10
S1A S4A
9
03273-A-003
Figure 3. 4 mm x 4 mm LFCSP
Table 7. Functional Descriptions
Parameter Description
V
DD
V
SS
I
DD
I
SS
Most Positive Power Supply Potential. Most Negative Power Supply Potential. Positive Supply Current.
Negative Supply Current. GND Ground (0 V) Reference. S Source Terminal. May be an input or output. D Drain Terminal. May be an input or output. A
X
Logic Control Input. EN Active Low Digital Input. When high, device is disabled and all switches are OFF. When low, AXlogic inputs determine ON
switch. VD (VS) Analog Voltage on Terminals D, S. R
ON
R R
FLAT(ON)
ON
Ohmic Resistance between D and S.
On Resistance Match between Any Two Channels, i.e., RONmax − RONmin.
Flatness is defined as the difference between the maximum and minimum value of ON Resistance as measured over the
specified analog signal range. IS (OFF) Source Leakage Current with the Switch OFF. ID (OFF) Drain Leakage Current with the Switch OFF. ID, IS (ON) Channel Leakage Current with the Switch ON. V
INL
V
INH
I
) Input Current of the Digital Input.
INL (IINH
Maximum Input Voltage for Logic 0.
Minimum Input Voltage for Logic 1.
CS (OFF) OFF Switch Source Capacitance. Measured with reference to ground. CD (OFF) OFF Switch Drain Capacitance. Measured with reference to ground.
Rev. A | Page 11 of 20
Page 12
ADG658/ADG659
Parameter Description
CD, CS (ON) ON Switch Capacitance. Measured with reference to ground. C
IN
t
ON
t
OFF
t
BBM
Charge Injection
Off Isolation Measure of Unwanted Signal Coupling through an OFF Switch. Crosstalk Measure of Unwanted Signal Coupled through from One Channel to Another as a Result of Parasitic Capacitance. Bandwidth The Frequency at which the Output is Attenuated by 3 dB. On Response The Frequency Response of the ON Switch. Insertion Loss The Loss Due to the ON Resistance of the Switch.
Digital Input Capacitance. Delay between Applying the Digital Control Input and the Output Switching ON. See Test Circuit 7. Delay between Applying the Digital Control Input and the Output Switching OFF. ON Time. Measured between 80% points of both switches when switching from one address state to another. Measure of the Glitch Impulse Transferred from the Digital Input to the Analog Output during Switching.
Rev. A | Page 12 of 20
Page 13
ADG658/ADG659

TYPICAL PERFORMANCE CHARACTERISTICS

100
TA = 25°C
90
80
70
60
50
40
ON RESISTANCE (Ω)
30
20
10
0
–5.5 –3.5 –1.5 0.5 2.5 4.5
VDD,VSS = ±5.5V
VDD,VSS = ±3V
VDD,VSS = ±5V
VD, VS (V)
Figure 4. On Resistance vs. V
250
200
VDD = 2.7V
VDD,VSS = ±2.7V
VDD,VSS = ±4.5V
(VS) for Dual Supply
D
TA = 25°C
03273-0-006
140
120
100
80
60
ON RESISTANCE (Ω)
40
20
= 5V
V
DD
= 0V
V
SS
0
0 1.0 2.0
0.5 1.5 2.5 3.0 4.54.0 5.0
Figure 7. On Resistance vs. V
300
250
+125°C
+85°C
+25°C
–40°C
, VS (V)
V
D
(VS) for Different Temperatures (Single Supply)
D
+85°C
3.5
03273-0-009
+125°C
150
100
ON RESISTANCE (Ω)
50
0
024681012
Figure 5. On Resistance vs. V
100
90
80
70
60
50
40
ON RESISTANCE (Ω)
30
20
10
VDD = +5V
= –5V
V
SS
0
–5 –2 0
4 1 123 5
Figure 6. On Resistance vs. V
VDD = 3V
VDD = 3.3V
VDD = 4.5V
VDD = 5.5V
VDD = 12V
+125°C
+85°C
D
VDD = 5V
VDD = 10V
VD, VS(V)
(VS) for Single Supply
D
+25°C
–40°C
V
, VS(V)
D
(VS) for Different Temperatures (Dual Supply)
200
150
100
ON RESISTANCE (Ω)
50
VDD = 3V
= 0V
V
SS
0
03273-0-007
0 0.5 1.0 1.5 2.0 2.5 3.0
Figure 8. On Resistance vs. V
1.5 VDD = 5V
= –5V
V
SS
1.0
= ±4V
V
D
= ±4V
V
S
0.5
0
–0.5
–1.0
CURRENT (nA)
–1.5
–2.0
4–3
03273-0-008
–2.5
0 20 40 60 80 100 120
+25°C
–40°C
V
, VS (V)
D
(VS) for Different Temperatures (Single Supply)
D
IS (OFF)
ID (OFF)
IS,ID (ON)
TEMPERATURE (°C)
03273-0-011
03273-0-010
Figure 9. Leakage Current vs. Temperature (Dual Supply)
Rev. A | Page 13 of 20
Page 14
ADG658/ADG659
1.5 VDD = +5V
= 0V
V
SS
1.0
V
= ±4V
D
±
=1V
V
S
0.5
0
–0.5
–1.0
CURRENT (nA)
–1.5
VDD = +3V V
= 0V
SS
–2.0
= ±2.4V
V
D
±
=1V
V
S
–2.5
0 20 40 60 80 100 120
TEMPERATURE (°C)
IS,ID (ON)
Figure 10. Leakage Current vs. Temperature (Single Supply)
14
TA = 25°C
12
10
8
C)
P
(
6
INJ
Q
4
VDD = +5V
2
V
= –5V
SS
0
–2
–4
–5 –3 –1 1 3 5
–4 –2 0 2 4
(V)
V
S
Figure 11. Charge Injection vs. Source Voltage
140
VDD = +5V V
= –5V
SS
120
100
80
TIME (ns)
60
40
20
0
–40 –20 0 20 40 60 80 100 120
Figure 12. t
t
ON
TEMPERATURE (°C)
Times vs. Temperature (Dual Supply)
ON/tOFF
ID (OFF)
t
OFF
IS (OFF)
VDD = +5V V
SS
= 0V
03273-0-012
03273-0-013
03273-0-014
350
VSS = 0V
300
250
200
150
t
TIME (ns)
ON
100
50
0
–40 –20 0 100 120
0 –1 –2 –3 –4 –5 –6 –7
dB
–8 –9
–10 –11 –12 –13 –14 –15
Figure 13. t
ON/tOFF
VDD = +5V V
= –5V
SS
T
= 25°C
A
100k 1M 10M 100M
VDD = 3V
VDD = 5V
VDD = 3V
t
OFF
20 40 60 80
TEMPERATURE (°C)
VDD = 5V
Times vs. Temperature (Single Supply)
FREQUENCY (Hz)
Figure 14. ON Response vs. Frequency (ADG658)
0 –2 –4 –6 –8
–10 –12
dB
–14 –16 –18 –20
VDD = +5V
= –5V
V
SS
–22
= 25°C
T
A
–24
100k 1M 10M 100M
FREQUENCY (Hz)
Figure 15. ON Response vs. Frequency (ADG659)
03273-0-015
03273-0-016
03273-0-017
Rev. A | Page 14 of 20
Page 15
ADG658/ADG659
–20
–40
0
VDD = +5V
= –5V
V
SS
= 25°C
T
A
10000
1000
100
VSS = 0V
VDD = 12V
(µA)
–60
dB
–80
–100
–120
100k 1M 10M 100M
FREQUENCY (Hz)
03273-0-018
Figure 16. OFF Isolation vs. Frequency
0
VDD = –5V
–10
= +5V
V
SS
= 25°C
T
A
–20
–30
–40 –50 –60
dB
–70
–80 –90
–100 –110 –120 –130
100k 1M 10M 100M
FREQUENCY (Hz)
Figure 17. Cross talk vs. Frequency
03273-0-019
10
DD
I
1
0.1
0.01 01012
2468
Figure 19. V
3.0
2.5
2.0
1.5
1.0
0.5
LOGIC THRESHOLD VOLTAGE (V)
0
0
Figure 20. Logic Threshold Voltage vs. Supply Voltage
VDD = 5V
VDD = 3V
V(EN) (V)
Current vs. Logic Level
DD
V
(V)
DD
12246810
03273-0-021
03273-0-022
100
600 IN AND OUT
10
VDD = +5V V
= –5V
SS
= 25°C
T
A
1
THD + N (%)
0.1
0.01 20 50 100
200 500 1k 5k 10k 20k
FREQUENCY (Hz)
2k
Figure 18. THD + Noise
03273-0-020
Rev. A | Page 15 of 20
Page 16
ADG658/ADG659
V
V

TEST CIRCUITS

S
V
S
Figure 21. Test Circuit 1. ON Resistance
I
(OFF)
S
S
S1
A
S2
S8
V
D
Figure 22. Test Circuit 2. I
I
DS
V1
RON =V1/I
V
DD
V
DDVSS
GND
V
V
DD
SS
V
V
DD
GND
SS
(OFF)
I
D
D
EN
LOGIC 1
D
A
(OFF)
V
O
03273-0-025
S1 S2
D
DS
03273-0-023
S8
V
S
Figure 23. Test Circuit 3. I
V
V
DD
SS
V
V
DD
GND
SS
I
(ON)
D
D
EN
A
(ON)
D
V
D
03273-0-026
V
SS
S1 S8
V
S
Figure 24. Test Circuit 4. I
EN
D
(OFF)
S
LOGIC 1
03273-0-024
V
DDVSS
V
DDVSS
A2
IN
50
A1 A0
S2–S7
ADG658*
EN
GND
*SIMILAR CONNECTION FOR ADG659
V
S1
S1
V
S8
S8
D
R 300
C
L
L
35pF
ADDRESS DRIVE (V
V
OUT
Figure 25. Test Circuit 5. Switching Time of Multiplexer, t
3V
)
IN
0V
V
S1
V
OUT
V
S8
50% 50%
90%
t
TRANSITION
TRANSITION
t
TRANSITION
90%
03273-0-027
Rev. A | Page 16 of 20
Page 17
ADG658/ADG659
V
*
V
DDVSS
V
DDVSS
A2
IN
50
A1 A0
ADG658*
EN
*SIMILAR CONNECTION FOR ADG659
S1
S2–S7
S8
D
GND
R
L
300
V
S
C
L
35pF
ADDRESS DRIVE (V
V
OUT
Figure 26. Test Circuit 6. Break-Before-Make Delay, t
3V
)
IN
0V
BBM
80%
03273-0-028
V
OUT
80%
t
BBM
V
V
V
A2 A1 A0
V
IN
EN
50
*SIMILAR CONNECTION FOR ADG659
DD
DDVSS
S2–S8
ADG658*
GND
SS
ENABLE
V
S1
S
D
R 300
C
L
L
35pF
DRIVE (V
V
OUT
Figure 27. Test Circuit 7. Enable Delay, t
OUTPUT
3V
)
IN
0V
V
O
0V
(EN), t
ON
50% 50%
0.9V
O
t
(EN)
ON
(EN)
OFF
0.9V
t
(EN)
OFF
O
03273-0-029
V
DDVSS
V
A2
DDVSS
A1
ADG658*
R
S
V
S
V
IN
SIMILAR CONNECTION FOR ADG659
A0 SD
EN
GND
C 1nF
LOGIC INPUT
V
OUT
L
3V
(V
)
IN
0V
V
OUT
Q
INJ
= CL×∆V
OUT
V
OUT
03273-0-030
Figure 28. Test Circuit 8. Charge Injection
Rev. A | Page 17 of 20
Page 18
ADG658/ADG659
V
V
DD
SS
0.1µ F
V
DDVSS
A2 A1
S
A0
D
LOGIC 1
EN
GND
Figure 29. Test Circuit 9. Off Isolation
0.1µ F
50
OFF ISOLATION = 20 LOG
NETWORK
ANALYZER
V
V
DDVSS
0.1µF0.1µF
NETWORK
ANALYZER
50
V
OUT
R
L
50
V
S
V
OUT
V
03273-0-031
S
V
DDVSS
A2 A1
S
A0
D
EN
GND
INSERTION LOSS = 20 LOG
50
V
OUT
R
L
50
V
WITH SWITCH
OUT
V
WITHOUT SWITCH
OUT
V
S
03273-0-032
Figure 30. Test Circuit 10. Bandwidth
VDDV
SS
0.1µ F
VDDV
A1 A0
50
50
S
ADG659
S1A S1B
DB DA
GND
SS
0.1µ F
EN
DA
DB
NETWORK
ANALYZER
V
OUT
R
L
50
V
CHANNEL-TO-CHANNEL CROSSTALK = 20 LOG
OUT
V
S
03273-0-033
Figure 31. Test Circuit 11. Channel-to-Channel Crosstalk
Rev. A | Page 18 of 20
Page 19
ADG658/ADG659
R
R

OUTLINE DIMENSIONS

5.10
5.00
4.90
0.15
0.05
4.50
4.40
4.30
PIN 1
16
0.65
BSC
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153AB
0.10
0.30
0.19
9
81
1.20 MAX
SEATING PLANE
6.40 BSC
0.20
0.09 8°
0.75
0.60
0.45
Figure 32. 16-Lead Thin Shrink Small Outline Package [TSSOP]
( RU-16)
Dimensions shown in millimeters
PIN 1
INDICATO
1.00
0.85
0.80
4.0
12° MAX
SEATING PLANE
BSC SQ
TOP
VIEW
0.80 MAX
0.65 TYP
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
0.35
0.28
0.25
3.75
BSC SQ
0.20 REF
0.60 MAX
0.65 BSC
0.05 MAX
0.02 NOM
0.75
0.60
0.50
COPLANARITY
0.08
Figure 33. 16-Lead Lead Frame Chip Scale Package [LFCSP]
(CP-16-4)
Dimensions shown in millimeters
0.60 MAX
13
12
EXPOSED
(BOTTOM VIEW)
9
8
PAD
16
1
4
5
1.95 BSC
PIN 1 INDICATO
2.25
2.10 SQ
1.95
0.25 MIN
Rev. A | Page 19 of 20
Page 20
ADG658/ADG659
0.065
0.049
0.010
0.004
COPLANARITY
0.004
0.193 BSC
0.012
0.008
9
8
0.154 BSC
0.069
0.053
SEATING PLANE
0.236 BSC
0.010
0.006
16
1
PIN 1
0.025 BSC
COMPLIANT TO JEDEC STANDARDS MO-137AB
8° 0°
0.050
0.016
Figure 34. 16-Lead Shrink Small Outline Package [QSOP]
(RQ-16)
Dimensions shown in millimeters

ORDERING GUIDE

Model Temperature Range Package Description Package Option
ADG658YRU −40°C to +125°C Thin Shrink Small Outline Package (TSSOP) RU-16 ADG658YRU-REEL7 −40°C to +125°C Thin Shrink Small Outline Package (TSSOP) RU-16 ADG658YCP −40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP-16 ADG658YCP-REEL7 −40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP-16 ADG658YRQ −40°C to +125°C Shrink Small Outline Package (QSOP) RQ-16 ADG658YRQ-REEL −40°C to +125°C Shrink Small Outline Package (QSOP) RQ-16 ADG658YRQ-REEL7 −40°C to +125°C Shrink Small Outline Package (QSOP) RQ-16 ADG659YRU −40°C to +125°C Thin Shrink Small Outline Package (TSSOP) RU-16 ADG659YRU-REEL7 −40°C to +125°C Thin Shrink Small Outline Package (TSSOP) RU-16 ADG659YCP −40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP-16 ADG659YCP-REEL7 −40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP-16 ADG659YCPZ ADG659YCPZ-REEL7 ADG659YRQ −40°C to +125°C Shrink Small Outline Package (QSOP) RQ-16 ADG659YRQ-REEL −40°C to +125°C Shrink Small Outline Package (QSOP) RQ-16 ADG659YRQ-REEL7 −40°C to +125°C Shrink Small Outline Package (QSOP) RQ-16
1
Z = Pb-free part.
1
1
−40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP-16
−40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP-16
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners.
C03273-0-7/04(A)
Rev. A | Page 20 of 20
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