±2 V to ±6 V dual supply
2 V to 12 V single supply
Automotive temperature range −40°C to +125°C
<0.1 nA leakage currents
45 Ω on resistance over full signal range
Rail-to-rail switching operation
Single 8-to-1 multiplexer ADG658
Differential 4-to-1 multiplexer ADG659
16-lead LFCSP/TSSOP/QSOP packages
Typical power consumption <0.1 µW
TTL/CMOS compatible inputs
Package upgrades to 74HC4051/74HC4052 and
MAX4051/MAX4052/MAX4581/MAX4582
APPLICATIONS
Automotive applications
Automatic test equipment
Data acquisition systems
Battery-powered systems
Communication systems
Audio and video signal routing
Relay replacement
Sample-and-hold systems
Industrial control systems
GENERAL DESCRIPTION
The ADG658 and ADG659 are low voltage, CMOS analog
multiplexers comprised of eight single channels and four
differential channels, respectively. The ADG658 switches one of
eight inputs (S1–S8) to a common output, D, as determined by
the 3-bit binary address lines A0, A1, and A2. The ADG659
switches one of four differential inputs to a common differential
output, as determined by the 2-bit binary address lines A0 and
EN
A1. An
the device. When disabled, all channels are switched off.
These parts are designed on an enhanced process that provides
lower power dissipation yet gives high switching speeds. These
parts can operate equally well as either multiplexers or
input on both devices is used to enable or disable
Analog Multiplexers
ADG658/ADG659
demultiplexers and have an input range that extends to the
supplies. All channels exhibit break-before-make switching
action, preventing momentary shorting when switching
channels. All digital inputs have 0.8 V to 2.4 V logic thresholds,
ensuring TTL/CMOS logic compatibility when using single
+5 V or dual ±5 V supplies.
The ADG658 and ADG659 are available in 16-lead TSSOP/
QSOP packages and 16-lead 4 mm × 4 mm LFCSP packages.
PRODUCT HIGHLIGHTS
1. Single- and dual-supply operation.
The ADG658 and ADG659 offer high performance and are
fully specified and guaranteed with ±5 V, +5 V, and +3 V
supply rails.
2. Automotive temperature range −40°C to +125°C.
3. Low power consumption, typically <0.1 µW.
4. 16-lead 4 mm × 4 mm LFCSP packages, 16-lead TSSOP
package and 16-lead QSOP package.
FUNCTIONAL BLOCK DIAGRAM
A0A1ENA0 A1 A2
Figure 1.
ADG659
1 OF 4
DECODER
DA
DB
03273-0-001
ADG658
S1
8
1 OF 8
DECODER
EN
SWITCHES SHOWN FOR A LOGIC 1 INPUT
S1A
S4A
D
S1B
S4B
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
Analog Signal Range VSS to V
On Resistance (RON) 45 Ω typ VS = ±4.5 V, IS = 1 mA;
75 90 100 Ω max Test Circuit 1
On Resistance Match between 1.3 Ω typ
Channels (∆RON) 3 3.2 3.5 Ω max VS = 3.5 V, IS = 1 mA
On Resistance Flatness (R
) 10 Ω typ VDD = +5 V, VSS = −5 V;
FLAT(ON)
16 17 18 Ω max VS = ±3 V, IS = 1 mA
LEAKAGE CURRENTS VDD = +5.5 V, VSS = −5.5 V
Source OFF Leakage IS (OFF) ±0.005 nA typ
±0.2 ±5 nA max Test Circuit 2
Drain OFF Leakage ID (OFF) ±0.005 nA typ
ADG658 ±0.2 ±5 nA max Test Circuit 3
ADG659 ±0.1 ±2.5 nA max
Channel ON Leakage ID, IS (ON) ±0.005 nA typ VD = VS = ±4.5 V; Test Circuit 4
ADG658 ±0.2 ±5 nA max
ADG659 ±0.1 ±2.5 nA max
DIGITAL INPUTS
Input High Voltage, V
Input Low Voltage, V
INH
INL
2.4 V min
0.8 V max
Input Current
I
or I
INL
INH
0.005 µA typ VIN = V
±1 µA max
CIN, Digital Input Capacitance 2 pF typ
DYNAMIC CHARACTERISTICS
t
TRANS
2
80 ns typ RL = 300 Ω, CL = 35 pF
115 140 165 ns max VS = 3 V; Test Circuit 5
tON (EN)
80 ns typ R
115 140 165 ns max VS = 3 V; Test Circuit 7
t
(EN)
OFF
30 ns typ R
45 50 55 ns max VS = 3 V; Test Circuit 7
Break-Before-Make Time Delay, t
BBM
50 ns typ RL = 300 Ω, CL = 35 pF
10 ns min VS1 = VS2 = 3 V; Test Circuit 6
Charge Injection 2 pC typ VS = 0 V, RS = 0 Ω,
4 pC max CL = 1 nF; Test Circuit 8
Off Isolation −90 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; Test Circuit 9
Total Harmonic Distortion, THD + N 0.025 % typ RL = 600 Ω, 2 V p-p, f = 20 Hz to 20 kHz
Channel-to-Channel Crosstalk
(ADG659) −90 dB typ R
−3 dB Bandwidth
ADG658 210 MHz typ RL = 50 Ω, CL = 5 pF;
ADG659 400 MHz typ Test Circuit 10
CS (OFF) 4 pF typ f = 1 MHz
CD (OFF)
ADG658 23 pF typ f = 1 MHz
ADG659 12 pF typ f = 1 MHz
1
Y Version
−40°C
to+125°C Unit Test Conditions/Comments
V VDD = +4.5 V, VSS = −4.5 V
DD
= ±4.5 V, VS = 4.5 V;
V
D
= ±4.5 V, VS = 4.5 V;
V
D
or V
INL
= 300 Ω, CL = 35 pF
L
= 300 Ω, CL = 35 pF
L
= 50 Ω, CL = 5 pF, f = 1 MHz; Test Circuit 11
L
m
m
INH
Rev. A | Page 3 of 20
Page 4
ADG658/ADG659
B Version
−40°C
Parameter +25°C
to +85°C
CD, CS (ON)
ADG658 28 pF typ f = 1 MHz
ADG659 16 pF typ f = 1 MHz
POWER REQUIREMENTS VDD = +5.5 V, VSS = −5.5 V
I
DD
0.01 µA typ Digital Inputs = 0 V or 5.5 V
1 µA max
I
SS
0.01 µA typ Digital Inputs = 0 V or 5.5 V
1 µA max
1
Temperature range is as follows: B Version: −40°C to +85°C. Y Version: −40°C to +125°C.
2
Guaranteed by design; not subject to production test.
Analog Signal Range 0 to V
On Resistance (RON) 85 Ω typ VS = 0 V to 4.5 V, IS = 1 mA;
150 160 200 Ω max Test Circuit 1
On Resistance Match between 4.5 Ω typ VS = 3.5 V, IS = 1 mA
Channels (∆RON) 8 9 10 Ω max
On Resistance Flatness (R
) 13 14 16 Ω typ
FLAT(ON)
LEAKAGE CURRENTS VDD = 5.5 V
Source OFF Leakage IS (OFF) ±0.005 nA typ VS = 1 V/4.5 V, VD = 4.5 V/1 V;
±0.2 ±5 nA max Test Circuit 2
Drain OFF Leakage ID (OFF) ±0.005 nA typ VS = 1 V/4.5 V, VD = 4.5 V/1 V;
ADG658 ±0.2 ±5 nA max Test Circuit 3
ADG659 ±0.1 ±2.5 nA max
Channel ON Leakage ID, IS (ON) ±0.005 nA typ VS = VD = 1 V or 4.5 V, Test Circuit 4
ADG658 ±0.2 ±5 nA max
ADG659 ±0.1 ±2.5 nA max
DIGITAL INPUTS
Input High Voltage, V
Input Low Voltage, V
INH
INL
2.4 V min
0.8 V max
Input Current
I
or I
INL
INH
0.005 µA typ VIN = V
±1 µA max
CIN, Digital Input Capacitance 2 pF typ
DYNAMIC CHARACTERISTICS
t
TRANS
2
120 ns typ RL = 300 Ω, CL = 35 pF
200 270 300 ns max VS = 3 V; Test Circuit 5
tON (EN)
120 ns typ R
190 245 280 ns max VS = 3 V; Test Circuit 7
t
(EN)
OFF
35 ns typ R
50 60 70 ns max VS = 3 V; Test Circuit 7
Break-Before-Make Time Delay, t
100 ns typ RL = 300 Ω, CL = 35 pF
BBM
10 ns min VS1 = VS2 = 3 V; Test Circuit 6
Charge Injection 0.5 pC typ VS = 2.5 V, RS = 0 Ω, CL = 1 nF;
1 pC max Test Circuit 8
Off Isolation −90 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; Test Circuit 9
Channel-to-Channel Crosstalk −90 dB typ RL = 50 Ω, CL = 5 pF; f = 1 MHz;
(ADG659) Test Circuit 11
−3 dB Bandwidth
ADG658 180 MHz typ RL = 50 Ω, CL = 5 pF;
ADG659 330 MHz typ Test Circuit 10
CS (OFF) 5 pF typ f = 1 MHz
CD (OFF)
ADG658 29 pF typ f = 1 MHz
ADG659 15 pF typ f = 1 MHz
1
Y Version
−40°C
to +125°C Unit Test Conditions/Comments
DD
V VDD = 4.5 V, VSS = 0 V
= 5 V, VSS = 0 V
V
DD
= 1.5 V to 4 V, IS = 1 mA
V
S
or V
INL
INH
= 300 Ω, CL = 35 pF
L
= 300 Ω, CL = 35 pF
L
Rev. A | Page 5 of 20
Page 6
ADG658/ADG659
C
, CS (ON)
D
ADG658 30 pF typ f = 1 MHz
ADG659 16 pF typ f = 1 MHz
POWER REQUIREMENTS VDD = 5.5 V
I
DD
1 µA max
1
Temperature range is as follows: B Version: −40°C to +85°C. Y Version: −40°C to +125°C.
2
Guaranteed by design; not subject to production test.
Analog Signal Range 0 to V
On Resistance (RON) 185 Ω typ VS = 0 V to 2.7 V, IS = 0.1 mA;
300 350 400 Ω max Test Circuit 1
On Resistance Match between 2 Ω typ VS = 1.5 V, IS = 0.1 mA
Channels (∆RON)
4.5 6 7 Ω max
LEAKAGE CURRENTS VDD = 3.3 V
Source OFF Leakage IS (OFF) ±0.005 nA typ VS = 1 V/3 V, VD = 3 V/1 V;
±0.2 ±5 nA max Test Circuit 2
Drain OFF Leakage ID (OFF) ±0.005 nA typ VS = 1 V/3 V, VD = 3 V/1 V;
ADG658 ±0.2 ±5 nA max Test Circuit 3
ADG659 ±0.1 ±2.5 nA max
Channel ON Leakage ID, IS (ON) ±0.005 nA typ VS = VD = 1 V or 3 V, Test Circuit 4
ADG658 ±0.2 ±5 nA max
ADG659 ±0.1 ±2.5 nA max
DIGITAL INPUTS
Input High Voltage, V
Input Low Voltage, V
INH
INL
2.0 V min
0.5 V max
Input Current
I
or I
INL
INH
0.005 µA typ VIN = V
±1 µA max
CIN, Digital Input Capacitance 2 pF typ
DYNAMIC CHARACTERISTICS
t
TRANS
2
200 ns typ RL = 300 Ω, CL = 35 pF
370 440 490 ns max VS = 1.5 V; Test Circuit 7
tON (EN)
230 ns typ R
370 440 490 ns max VS = 1.5 V; Test Circuit 7
t
(EN)
OFF
50 ns typ R
80 90 110 ns max VS = 1.5 V; Test Circuit 7
Break-Before-Make Time Delay, t
200 ns typ RL = 300 Ω, CL = 35 pF
BBM
10 ns min VS1 = VS2 = 1.5 V; Test Circuit 6
Charge Injection 1 pC typ VS = 1.5 V, RS = 0 Ω, CL = 1 nF;
2 pC max Test Circuit 8
Off Isolation −90 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; Test Circuit 9
Channel-to-Channel Crosstalk −90 dB typ RL = 50 Ω, CL = 5 pF; f = 1 MHz;
(ADG659) Test Circuit 11
−3 dB Bandwidth
ADG658 160 MHz typ RL = 50 Ω, CL = 5 pF;
ADG659 300 MHz typ Test Circuit 10
CS (OFF) 5 pF typ f = 1 MHz
CD (OFF)
ADG658 29 pF typ f = 1 MHz
ADG659 15 pF typ f = 1 MHz
CD, CS (ON)
ADG658 30 pF typ f = 1 MHz
ADG659 16 pF typ f = 1 MHz
1
Y Version
−40°C
to +125°C Unit Test Conditions/Comments
DD
V VDD = 2.7 V, VSS = 0 V
or V
INL
INH
= 300 Ω, CL = 35 pF
L
= 300 Ω, CL = 35 pF
L
Rev. A | Page 7 of 20
Page 8
ADG658/ADG659
B Version
−40°C
Parameter +25°C
to +85°C
POWER REQUIREMENTS VDD = 3.6 V
I
DD
0.01 µA typ Digital Inputs = 0 V or 3.6 V
1 µA max
1
Temperature range is as follows: B Version: −40°C to +85°C. Y Version: −40°C to +125°C.
2
Guaranteed by design; not subject to production test.
Y Version
−40°C
to +125°C Unit Test Conditions/Comments
Rev. A | Page 8 of 20
Page 9
ADG658/ADG659
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameters Ratings
VDD to V
SS
13 V
VDD to GND −0.3 V to +13 V
VSS to GND +0.3 V to −6.5 V
Analog Inputs
Digital Inputs
1
1
V
−0.3 V to VDD +0.3 V
SS
GND −0.3 V to VDD +0.3
V or 10 mA, whichever
occurs first
Peak Current, S or D 40 mA
(Pulsed at 1 ms, 10% duty cycle max)
Continuous Current, S or D 20 mA
Operating Temperature Range
Automotive (Y Version) −40°C to +125°C
Industrial (B Version) −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
θJA Thermal Impedance, 16-Lead
104°C/W
QSOP
θJA Thermal Impedance, 16-Lead
150.4°C/W
TSSOP
θJA Thermal Impedance (4-Layer
Board),
16-Lead LFCSP 70°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
ESD 5.5 kV
1
Over voltages at AX, EN, S, or D are clamped by internal diodes. Current
should be limited to the maximum ratings.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Most Positive Power Supply Potential.
Most Negative Power Supply Potential.
Positive Supply Current.
Negative Supply Current.
GND Ground (0 V) Reference.
S Source Terminal. May be an input or output.
D Drain Terminal. May be an input or output.
A
X
Logic Control Input.
ENActive Low Digital Input. When high, device is disabled and all switches are OFF. When low, AXlogic inputs determine ON
switch.
VD (VS) Analog Voltage on Terminals D, S.
R
ON
∆R
R
FLAT(ON)
ON
Ohmic Resistance between D and S.
On Resistance Match between Any Two Channels, i.e., RONmax − RONmin.
Flatness is defined as the difference between the maximum and minimum value of ON Resistance as measured over the
specified analog signal range.
IS (OFF) Source Leakage Current with the Switch OFF.
ID (OFF) Drain Leakage Current with the Switch OFF.
ID, IS (ON) Channel Leakage Current with the Switch ON.
V
INL
V
INH
I
) Input Current of the Digital Input.
INL (IINH
Maximum Input Voltage for Logic 0.
Minimum Input Voltage for Logic 1.
CS (OFF) OFF Switch Source Capacitance. Measured with reference to ground.
CD (OFF) OFF Switch Drain Capacitance. Measured with reference to ground.
Rev. A | Page 11 of 20
Page 12
ADG658/ADG659
Parameter Description
CD, CS (ON) ON Switch Capacitance. Measured with reference to ground.
C
IN
t
ON
t
OFF
t
BBM
Charge
Injection
Off Isolation Measure of Unwanted Signal Coupling through an OFF Switch.
Crosstalk Measure of Unwanted Signal Coupled through from One Channel to Another as a Result of Parasitic Capacitance.
Bandwidth The Frequency at which the Output is Attenuated by 3 dB.
On Response The Frequency Response of the ON Switch.
Insertion Loss The Loss Due to the ON Resistance of the Switch.
Digital Input Capacitance.
Delay between Applying the Digital Control Input and the Output Switching ON. See Test Circuit 7.
Delay between Applying the Digital Control Input and the Output Switching OFF.
ON Time. Measured between 80% points of both switches when switching from one address state to another.
Measure of the Glitch Impulse Transferred from the Digital Input to the Analog Output during Switching.
Rev. A | Page 12 of 20
Page 13
ADG658/ADG659
TYPICAL PERFORMANCE CHARACTERISTICS
100
TA = 25°C
90
80
70
60
50
40
ON RESISTANCE (Ω)
30
20
10
0
–5.5–3.5–1.50.52.54.5
VDD,VSS = ±5.5V
VDD,VSS = ±3V
VDD,VSS = ±5V
VD, VS (V)
Figure 4. On Resistance vs. V
250
200
VDD = 2.7V
VDD,VSS = ±2.7V
VDD,VSS = ±4.5V
(VS) for Dual Supply
D
TA = 25°C
03273-0-006
140
120
100
80
60
ON RESISTANCE (Ω)
40
20
= 5V
V
DD
= 0V
V
SS
0
01.02.0
0.51.52.5 3.04.54.05.0
Figure 7. On Resistance vs. V
300
250
+125°C
+85°C
+25°C
–40°C
, VS (V)
V
D
(VS) for Different Temperatures (Single Supply)
D
+85°C
3.5
03273-0-009
+125°C
150
100
ON RESISTANCE (Ω)
50
0
024681012
Figure 5. On Resistance vs. V
100
90
80
70
60
50
40
ON RESISTANCE (Ω)
30
20
10
VDD = +5V
= –5V
V
SS
0
–5–20
–4–11235
Figure 6. On Resistance vs. V
VDD = 3V
VDD = 3.3V
VDD = 4.5V
VDD = 5.5V
VDD = 12V
+125°C
+85°C
D
VDD = 5V
VDD = 10V
VD, VS(V)
(VS) for Single Supply
D
+25°C
–40°C
V
, VS(V)
D
(VS) for Different Temperatures (Dual Supply)
200
150
100
ON RESISTANCE (Ω)
50
VDD = 3V
= 0V
V
SS
0
03273-0-007
00.51.01.52.02.53.0
Figure 8. On Resistance vs. V
1.5
VDD = 5V
= –5V
V
SS
1.0
= ±4V
V
D
= ±4V
V
S
0.5
0
–0.5
–1.0
CURRENT (nA)
–1.5
–2.0
4–3
03273-0-008
–2.5
020406080100120
+25°C
–40°C
V
, VS (V)
D
(VS) for Different Temperatures (Single Supply)
D
IS (OFF)
ID (OFF)
IS,ID (ON)
TEMPERATURE (°C)
03273-0-011
03273-0-010
Figure 9. Leakage Current vs. Temperature (Dual Supply)
Rev. A | Page 13 of 20
Page 14
ADG658/ADG659
1.5
VDD = +5V
= 0V
V
SS
1.0
V
= ±4V
D
±
=1V
V
S
0.5
0
–0.5
–1.0
CURRENT (nA)
–1.5
VDD = +3V
V
= 0V
SS
–2.0
= ±2.4V
V
D
±
=1V
V
S
–2.5
020406080100120
TEMPERATURE (°C)
IS,ID (ON)
Figure 10. Leakage Current vs. Temperature (Single Supply)
14
TA = 25°C
12
10
8
C)
P
(
6
INJ
Q
4
VDD = +5V
2
V
= –5V
SS
0
–2
–4
–5–3–1135
–4–2024
(V)
V
S
Figure 11. Charge Injection vs. Source Voltage
140
VDD = +5V
V
= –5V
SS
120
100
80
TIME (ns)
60
40
20
0
–40–20020406080100120
Figure 12. t
t
ON
TEMPERATURE (°C)
Times vs. Temperature (Dual Supply)
ON/tOFF
ID (OFF)
t
OFF
IS (OFF)
VDD = +5V
V
SS
= 0V
03273-0-012
03273-0-013
03273-0-014
350
VSS = 0V
300
250
200
150
t
TIME (ns)
ON
100
50
0
–40–200100120
0
–1
–2
–3
–4
–5
–6
–7
dB
–8
–9
–10
–11
–12
–13
–14
–15
Figure 13. t
ON/tOFF
VDD = +5V
V
= –5V
SS
T
= 25°C
A
100k1M10M100M
VDD = 3V
VDD = 5V
VDD = 3V
t
OFF
20406080
TEMPERATURE (°C)
VDD = 5V
Times vs. Temperature (Single Supply)
FREQUENCY (Hz)
Figure 14. ON Response vs. Frequency (ADG658)
0
–2
–4
–6
–8
–10
–12
dB
–14
–16
–18
–20
VDD = +5V
= –5V
V
SS
–22
= 25°C
T
A
–24
100k1M10M100M
FREQUENCY (Hz)
Figure 15. ON Response vs. Frequency (ADG659)
03273-0-015
03273-0-016
03273-0-017
Rev. A | Page 14 of 20
Page 15
ADG658/ADG659
–20
–40
0
VDD = +5V
= –5V
V
SS
= 25°C
T
A
10000
1000
100
VSS = 0V
VDD = 12V
(µA)
–60
dB
–80
–100
–120
100k1M10M100M
FREQUENCY (Hz)
03273-0-018
Figure 16. OFF Isolation vs. Frequency
0
VDD = –5V
–10
= +5V
V
SS
= 25°C
T
A
–20
–30
–40
–50
–60
dB
–70
–80
–90
–100
–110
–120
–130
100k1M10M100M
FREQUENCY (Hz)
Figure 17. Cross talk vs. Frequency
03273-0-019
10
DD
I
1
0.1
0.01
01012
2468
Figure 19. V
3.0
2.5
2.0
1.5
1.0
0.5
LOGIC THRESHOLD VOLTAGE (V)
0
0
Figure 20. Logic Threshold Voltage vs. Supply Voltage
VDD = 5V
VDD = 3V
V(EN) (V)
Current vs. Logic Level
DD
V
(V)
DD
12246810
03273-0-021
03273-0-022
100
600Ω
IN AND OUT
10
VDD = +5V
V
= –5V
SS
= 25°C
T
A
1
THD + N (%)
0.1
0.01
2050100
200 5001k5k10k 20k
FREQUENCY (Hz)
2k
Figure 18. THD + Noise
03273-0-020
Rev. A | Page 15 of 20
Page 16
ADG658/ADG659
V
V
TEST CIRCUITS
S
V
S
Figure 21. Test Circuit 1. ON Resistance
I
(OFF)
S
S
S1
A
S2
S8
V
D
Figure 22. Test Circuit 2. I
I
DS
V1
RON =V1/I
V
DD
V
DDVSS
GND
V
V
DD
SS
V
V
DD
GND
SS
(OFF)
I
D
D
EN
LOGIC 1
D
A
(OFF)
V
O
03273-0-025
S1
S2
D
DS
03273-0-023
S8
V
S
Figure 23. Test Circuit 3. I
V
V
DD
SS
V
V
DD
GND
SS
I
(ON)
D
D
EN
A
(ON)
D
V
D
03273-0-026
V
SS
S1
S8
V
S
Figure 24. Test Circuit 4. I
EN
D
(OFF)
S
LOGIC 1
03273-0-024
V
DDVSS
V
DDVSS
A2
IN
50Ω
A1
A0
S2–S7
ADG658*
EN
GND
*SIMILAR CONNECTION FOR ADG659
V
S1
S1
V
S8
S8
D
R
300Ω
C
L
L
35pF
ADDRESS
DRIVE (V
V
OUT
Figure 25. Test Circuit 5. Switching Time of Multiplexer, t
3V
)
IN
0V
V
S1
V
OUT
V
S8
50%50%
90%
t
TRANSITION
TRANSITION
t
TRANSITION
90%
03273-0-027
Rev. A | Page 16 of 20
Page 17
ADG658/ADG659
V
*
V
DDVSS
V
DDVSS
A2
IN
50Ω
A1
A0
ADG658*
EN
*SIMILAR CONNECTION FOR ADG659
S1
S2–S7
S8
D
GND
R
L
300Ω
V
S
C
L
35pF
ADDRESS
DRIVE (V
V
OUT
Figure 26. Test Circuit 6. Break-Before-Make Delay, t
3V
)
IN
0V
BBM
80%
03273-0-028
V
OUT
80%
t
BBM
V
V
V
A2
A1
A0
V
IN
EN
50Ω
*SIMILAR CONNECTION FOR ADG659
DD
DDVSS
S2–S8
ADG658*
GND
SS
ENABLE
V
S1
S
D
R
300Ω
C
L
L
35pF
DRIVE (V
V
OUT
Figure 27. Test Circuit 7. Enable Delay, t
OUTPUT
3V
)
IN
0V
V
O
0V
(EN), t
ON
50%50%
0.9V
O
t
(EN)
ON
(EN)
OFF
0.9V
t
(EN)
OFF
O
03273-0-029
V
DDVSS
V
A2
DDVSS
A1
ADG658*
R
S
V
S
V
IN
SIMILAR CONNECTION FOR ADG659
A0
SD
EN
GND
C
1nF
LOGIC INPUT
V
OUT
L
3V
(V
)
IN
0V
V
OUT
Q
INJ
= CL×∆V
OUT
∆V
OUT
03273-0-030
Figure 28. Test Circuit 8. Charge Injection
Rev. A | Page 17 of 20
Page 18
ADG658/ADG659
V
V
DD
SS
0.1µ F
V
DDVSS
A2
A1
S
A0
D
LOGIC 1
EN
GND
Figure 29. Test Circuit 9. Off Isolation
0.1µ F
50Ω
OFF ISOLATION = 20 LOG
NETWORK
ANALYZER
V
V
DDVSS
0.1µF0.1µF
NETWORK
ANALYZER
50Ω
V
OUT
R
L
50Ω
V
S
V
OUT
V
03273-0-031
S
V
DDVSS
A2
A1
S
A0
D
EN
GND
INSERTION LOSS = 20 LOG
50Ω
V
OUT
R
L
50Ω
V
WITH SWITCH
OUT
V
WITHOUT SWITCH
OUT
V
S
03273-0-032
Figure 30. Test Circuit 10. Bandwidth
VDDV
SS
0.1µ F
VDDV
A1
A0
50Ω
50Ω
S
ADG659
S1A
S1B
DB
DA
GND
SS
0.1µ F
EN
DA
DB
NETWORK
ANALYZER
V
OUT
R
L
50Ω
V
CHANNEL-TO-CHANNEL CROSSTALK = 20 LOG
OUT
V
S
03273-0-033
Figure 31. Test Circuit 11. Channel-to-Channel Crosstalk
Rev. A | Page 18 of 20
Page 19
ADG658/ADG659
R
R
OUTLINE DIMENSIONS
5.10
5.00
4.90
0.15
0.05
4.50
4.40
4.30
PIN 1
16
0.65
BSC
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153AB
0.10
0.30
0.19
9
81
1.20
MAX
SEATING
PLANE
6.40
BSC
0.20
0.09
8°
0°
0.75
0.60
0.45
Figure 32. 16-Lead Thin Shrink Small Outline Package [TSSOP]
( RU-16)
Dimensions shown in millimeters
PIN 1
INDICATO
1.00
0.85
0.80
4.0
12° MAX
SEATING
PLANE
BSC SQ
TOP
VIEW
0.80 MAX
0.65 TYP
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
0.35
0.28
0.25
3.75
BSC SQ
0.20 REF
0.60 MAX
0.65 BSC
0.05 MAX
0.02 NOM
0.75
0.60
0.50
COPLANARITY
0.08
Figure 33. 16-Lead Lead Frame Chip Scale Package [LFCSP]
(CP-16-4)
Dimensions shown in millimeters
0.60 MAX
13
12
EXPOSED
(BOTTOM VIEW)
9
8
PAD
16
1
4
5
1.95 BSC
PIN 1
INDICATO
2.25
2.10 SQ
1.95
0.25 MIN
Rev. A | Page 19 of 20
Page 20
ADG658/ADG659
0.065
0.049
0.010
0.004
COPLANARITY
0.004
0.193
BSC
0.012
0.008
9
8
0.154
BSC
0.069
0.053
SEATING
PLANE
0.236
BSC
0.010
0.006
16
1
PIN 1
0.025
BSC
COMPLIANT TO JEDEC STANDARDS MO-137AB
8°
0°
0.050
0.016
Figure 34. 16-Lead Shrink Small Outline Package [QSOP]
(RQ-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
ADG658YRU −40°C to +125°C Thin Shrink Small Outline Package (TSSOP) RU-16
ADG658YRU-REEL7 −40°C to +125°C Thin Shrink Small Outline Package (TSSOP) RU-16
ADG658YCP −40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP-16
ADG658YCP-REEL7 −40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP-16
ADG658YRQ −40°C to +125°C Shrink Small Outline Package (QSOP) RQ-16
ADG658YRQ-REEL −40°C to +125°C Shrink Small Outline Package (QSOP) RQ-16
ADG658YRQ-REEL7 −40°C to +125°C Shrink Small Outline Package (QSOP) RQ-16
ADG659YRU −40°C to +125°C Thin Shrink Small Outline Package (TSSOP) RU-16
ADG659YRU-REEL7 −40°C to +125°C Thin Shrink Small Outline Package (TSSOP) RU-16
ADG659YCP −40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP-16
ADG659YCP-REEL7 −40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP-16
ADG659YCPZ
ADG659YCPZ-REEL7
ADG659YRQ −40°C to +125°C Shrink Small Outline Package (QSOP) RQ-16
ADG659YRQ-REEL −40°C to +125°C Shrink Small Outline Package (QSOP) RQ-16
ADG659YRQ-REEL7 −40°C to +125°C Shrink Small Outline Package (QSOP) RQ-16
1
Z = Pb-free part.
1
1
−40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP-16
−40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP-16