Single-/Dual-Supply Specifications
Wide Supply Ranges (10.8 V to 16.5 V)
Microprocessor Compatible (100 ns WR Pulse)
Extended Plastic Temperature Range
(–40°C to +85°C)
Low Leakage (20 pA typ)
Low Power Dissipation (28 mW max)
Available in 18-Lead DIP/SOIC and 20-Lead PLCC Packages
Superior Alternative to:
DG528
DG529
GENERAL DESCRIPTION
The ADG528A and ADG529A are CMOS monolithic analog
multiplexers with eight channels and four dual channels, respectively. On-chip latches facilitate microprocessor interfacing. The
ADG528A switches one of eight inputs to a common output,
depending on the state of three binary addresses and an enable
input. The ADG529A switches one of four differential inputs to
a common differential output, depending on the state of two
binary addresses and an enable input. Both devices have TTL
and 5 V CMOS logic-compatible digital inputs.
The ADG528A and ADG529A are designed on an enhanced
LC2MOS process, which gives an increased signal capability of
to VDD and enables operation over a wide range of supply
V
SS
voltages. The devices can comfortably operate anywhere in the
10.8 V to 16.5 V single- or dual-supply range. These multiplexers also feature high switching and low R
ON
.
FUNCTIONAL BLOCK DIAGRAMS
PRODUCT HIGHLIGHTS
1. Single-/dual-supply specifications with a wide tolerance.
The devices are specified in the 10.8 V to 16.5 V range for
both single- and dual-supplies.
2. Easily Interfaced
The ADG528A and ADG529A can be easily interfaced with
microprocessors. The WR signal latches the state of the
address control lines and the enable line. The RS signal
clears both the address and enable data in the latches resulting in no output (all switches off). RS can be tied to the
microprocessor reset pin.
3. Extended Signal Range
The enhanced LC
and an increased analog signal range of V
4. Break-Before-Make Switching
Switches are guaranteed break-before-make so that input
signals are protected against momentary shorting.
5. Low Leakage
Leakage currents in the range of 20 pA make these multiplexers
suitable for high precision circuits.
2
MOS processing results in a high breakdown
to VDD.
SS
REV. B
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
Storage Temperature Range . . . . . . . . . . . . .–65°C to +150°C
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . +300°C
NOTES
1
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only and functional operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
2
Overvoltage at A, EN, WR, RS, S or D will be clamped by diodes. Current should
be limited to the maximum rating above.
ORDERING GUIDE
TemperaturePackagePackage
ModelRangeDescriptionOption
ADG528AKN–40°C to +85°CPDIPN-18
ADG528AKP–40°C to +85°CPLCCP-20A
ADG528AKP-REEL–40°C to +85°CPLCCP-20A
ADG528ABQ–40°C to +85°CCERDIPQ-18
ADG528ATQ–55°C to +125°CCERDIPQ-18
ADG528ABCHIPSDIE
ADG528ATCHIPSDIE
ADG529AKN–40°C to +85°CPDIPN-18
ADG529AKP–40°C to +85°CPLCCP-20A
ADG529AKRW–40°C to +85°CSOICRW-18
ADG529AKRW-REEL–40°C to +85°CSOICRW-18
ADG529AKRW-REEL7–40°C to +85°CSOICRW-18
ADG529ABQ–40°C to +85°CCERDIPQ-18
ADG529ATQ–55°C to +125°CCERDIPQ-18
ADG529ABCHIPSDIE
ADG529ATCHIPSDIE
NOTES
1
N = Plastic DIP; P = Plastic Leaded Chip Carrier (PLCC); Q = Cerdip; RW = SOIC.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
WARNING!
ADG528A/ADG529A features proprietary ESD protection circuitry, permanent damage may occur
on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
Figure 1 shows the timing sequence for latching the switch
address and enable inputs. The latches are level sensitive; therefore, while WR is held low, the latches are transparent and the
switches respond to the address and enable inputs. This input
data is latched on the rising edge of WR.
Figure 2 shows the Reset Pulse Width, t
Time, t
OFF
(RS).
, and Reset Turn-off
RS
Note: All digital input signals rise and fall times measured from
10% to 90% of 3 V. t
The multiplexers are guaranteed functional with reduced single or dual supplies down to 4.5 V.
TPC 1. RON as a Function of VD(VS): Dual Supply
Voltage, T
TPC 2. Leakage Current as a Function of Temperature
(Note: Leakage Currents Reduce as the Supply
Voltages Reduce)
= +25°C
A
TPC 4. Trigger Levels vs. Power Supply Voltage,
Dual or Single Supply, TA = +25°C
TPC 5. t
Single Supplies, TA = +25°C
(Note: For VDD and |VSS| < 10 V; V1 = VDD/VSS, V2 =
V
TRANSITION
. See Test Circuit 6)
SS/VDD
vs. Supply Voltage: Dual and
TPC 3. RON as a Function of VD(VS): Single Supply
Voltage, TA = +25°C
REV. B
TPC 6. IDD vs. Supply Voltage: Dual or Single
Supply, TA = +25°C
–7–
Page 8
ADG528A/ADG529A
Test Circuits
Test Circuit 1. R
Test Circuit 2. IS (OFF)
Test Circuit 3. ID (OFF)
ON
Test Circuit 4. ID (ON)
Test Circuit 5. I
Test Circuit 6. Switching Time of Multiplexer, t
DIFF
TRANSITION
Test Circuit 7. Break-Before-Make Delay, t
OPEN
REV. B–8–
Page 9
ADG528A/ADG529A
Test Circuit 8. Enable Delay, tON (EN), t
Test Circuit 9. Write Turn-On Time, tON (WR)
OFF
(EN)
REV. B
Test Circuit 10. Reset Turn-Off Time, t
Test Circuit 11. Charge Injection
–9–
OFF
(RS)
Page 10
ADG528A/ADG529A
TERMINOLOGY
R
ON
RON MatchDifference between the RON of any two channels
RON DriftChange in RON versus temperature
(OFF)Source terminal leakage current when the switch
I
S
I
(OFF)Drain terminal leakage current when the switch is
D
ID (ON)Leakage current that flows from the closed switch
VS (VD)Analog voltage on terminal S or D
CS (OFF)Channel input capacitance for “OFF” condition
CD (OFF)Channel output capacitance for “OFF” condition
C
IN
tON (EN)Delay time between the 50% and 90% points of
Ohmic resistance between terminals D and S
is off.
off.
into the body.
Digital input capacitance
the digital input and switch “ON” condition.
OUTLINE DIMENSIONS
18-Lead Plastic Dual In-Line Package [PDIP]
(N-18)
Dimensions shown in inches and (millimeters)
t
(EN)Delay time between the 50% and 10% points of
OFF
the digital input and switch “OFF” condition
t
TRANSITION
Delay time between the 50% and 90% points of
the digital inputs and switch “ON” condition
when switching from one address state to another.
t
OPEN
“OFF” time measured between 50% points of
both switches when switching from one address
state to another
V
V
I
V
V
I
I
INL
INH
INL
DD
SS
DD
SS
(I
Maximum input voltage for Logic “0”
Minimum input voltage for Logic “1”
)Input current of the digital input
INH
Most positive voltage supply
Most negative voltage supply
Positive supply current
Negative supply current
0.048 (1.21)
0.042 (1.07)
0.885 (22.48)
0.845 (21.46)
18
1
0.180 (4.57)
MAX
0.150 (3.81)
0.110 (2.79)
0.022 (0.558)
0.014 (0.356)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
0.015 (0.38) MIN
0.100
0.060 (1.52)
(2.54)
0.045 (1.14)
BSC
COMPLIANT TO JEDEC STANDARDS MO-095AD
0.295 (7.49)
0.275 (6.99)
10
9
SEATING
PLANE
0.325 (8.26)
0.300 (7.62)
20-Lead Plastic Leaded Chip Carrier [PLCC]
(P-20A)
Dimensions shown in inches and (millimeters)
0.048 (1.21)
0.042 (1.07)
3
4
TOP VIEW
(PINS DOWN)
8
0.020
(0.50)
9
0.356 (9.04)
R
0.350 (8.89)
0.395 (10.02)
0.385 (9.78)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
0.056 (1.42)
0.042 (1.07)
19
18
0.050
(1.27)
BSC
14
13
SQ
SQ
COMPLIANT TO JEDEC STANDARDS MO-047AA
0.180 (4.57)
0.165 (4.19)
0.120 (3.04)
0.090 (2.29)
0.20 (0.51)
MIN
0.021 (0.53)
0.013 (0.33)
0.032 (0.81)
0.026 (0.66)
0.040 (1.01)
0.025 (0.64)
0.015 (0.381)
0.008 (0.203)
0.330 (8.38)
0.290 (7.37)
R
0.180 (4.57)
MAX
0.020 (0.50)
R
BOTTOM
VIEW
(PINS UP)
REV. B–10–
Page 11
OUTLINE DIMENSIONS
18-Lead Ceramic Dual In-Line Package [CERDIP]
(Q-18)
Dimensions shown in inches and (millimeters)
ADG528A/ADG529A
0.005
(0.13)
MIN
PIN 1
0.200
(5.08)
MAX
0.200 (5.08)
0.125 (3.18)
0.023 (0.58)
0.014 (0.36)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
0.098 (2.49)
MAX
18
19
0.960 (24.38) MAX
0.100
0.070 (1.78)
(2.54)
0.030 (0.76)
BSC
10
0.310 (7.87)
0.220 (5.59)
0.060 (1.52)
0.015 (0.38)
0.150 (3.81)
MIN
SEATING
PLANE
18-Lead Standard Small Outline Package [SOIC]
Wide Body
(RW-18)
Dimensions shown in millimeters and (inches)
11.75 (0.4626)
11.35 (0.4469)
1810
1
7.60 (0.2992)
7.40 (0.2913)
9
10.65 (0.4193)
10.00 (0.3937)
15
0
0.320 (8.13)
0.290 (7.37)
0.015 (0.38)
0.008 (0.20)
2.65 (0.1043)
0.30 (0.0118)
0.10 (0.0039)
COPLANARITY
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN