Datasheet ADG5204 Datasheet (ANALOG DEVICES)

Page 1
High Voltage, Latch-Up Proof,
S
S
S3S

FEATURES

Latch-up proof 3 pF off source capacitance 26 pF off drain capacitance
−0.6 pC charge injection Low leakage: 0.4 nA maximum at 85°C ±9 V to ±22 V dual-supply operation 9 V to 40 V single-supply operation 48 V supply maximum ratings Fully specified at ±15 V, ±20 V, +12 V, and +36 V V
to VDD analog signal range
SS

APPLICATIONS

Automatic test equipment Data acquisition Instrumentation Avio nics Audio and video switching Communication systems
4-Channel Multiplexer
ADG5204

FUNCTIONAL BLOCK DIAGRAM

ADG5204
1
2
4
A0 A1 EN
1 OF 4
DECODERS
Figure 1.
D
09768-001

GENERAL DESCRIPTION

The ADG5204 is a complementary metal oxide semiconductor (CMOS) analog multiplexer, comprising four single channels.
The ultralow capacitance and charge injection of these switches make them ideal solutions for data acquisition and sample-and­hold applications, where low glitch and fast settling are required. Fast switching speed together with high signal bandwidth make the ADG5204 suitable for video signal switching.
The ADG5204 is designed on a trench process, which guards against latch-up. A dielectric trench separates the P and N channel transistors, thereby preventing latch-up even under severe overvoltage conditions.
The ADG5204 switches one of four inputs to a common output, D, as determined by the 3-bit binary address lines, A0, A1, and EN. Logic 0 on the EN pin disables the device. Each switch con­ducts equally well in both directions when on, and each switch has an input signal range that extends to the supplies. In the off condition, signal levels up to the supplies are blocked. All switches exhibit break-before-make switching action.

PRODUCT HIGHLIGHTS

1. Trench Isolation Guards Against Latch-Up.
A dielectric trench separates the P and N channel transistors, thereby preventing latch-up even under severe overvoltage conditions.
2. Ultralow Capacitance and <1 pC Charge Injection.
3. Dual-Supply Operation.
For applications where the analog signal is bipolar, the ADG5204 can be operated from dual supplies up to ±22 V.
4. Single-Supply Operation.
For applications where the analog signal is unipolar, the ADG5204 can be operated from a single rail power supply up to 40 V.
5. 3 V Logic-Compatible Digital Inputs.
V
INH
6. No V
= 2.0 V, V
Logic Power Supply Required.
L
= 0.8 V.
INL
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2011 Analog Devices, Inc. All rights reserved.
Page 2
ADG5204

TABLE OF CONTENTS

Features.............................................................................................. 1
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
±15 V Dual Supply ....................................................................... 3
±20 V Dual Supply ....................................................................... 4
12 V Single Supply........................................................................ 5
36 V Single Supply........................................................................ 6
Continuous Current per Channel, Sx or D............................... 7

REVISION HISTORY

5/11—Revision 0: Initial Version
Absolute Maximum Ratings ............................................................8
ESD Caution...................................................................................8
Pin Configurations and Function Descriptions............................9
Truth Table .....................................................................................9
Typical Performance Characteristics........................................... 10
Test Circuits..................................................................................... 14
Terminology.................................................................................... 16
Trench Isolation.............................................................................. 17
Applications Information.............................................................. 18
Outline Dimensions....................................................................... 19
Ordering Guide .......................................................................... 19
Rev. 0 | Page 2 of 20
Page 3
ADG5204

SPECIFICATIONS

±15 V DUAL SUPPLY

VDD = 15 V ± 10%, VSS = −15 V ± 10%, GND = 0 V, unless otherwise noted.
Table 1.
Parameter 25°C −40°C to +85°C −40°C to +125°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range VDD to VSS V max On Resistance, RON 160 Ω typ VS = ±10 V, IS = −1 mA, see Figure 24 200 250 280 Ω max VDD = +13.5 V, VSS = −13.5 V On-Resistance Match
Between Channels, ∆R
ON
8 9 10 Ω max On-Resistance Flatness, R
FLAT(ON)
50 65 70 Ω max LEAKAGE CURRENTS VDD = +16.5 V, VSS = −16.5 V
Source Off Leakage, IS (Off) 0.01 nA typ
0.1 0.2 0.4 nA max Drain Off Leakage, ID (Off) 0.01 nA typ
0.1 0.4 1.2 nA max Channel On Leakage, ID, IS (On) 0.02 nA typ VS = VD = ±10 V, see Figure 26
0.2 0.5 1.2 nA max DIGITAL INPUTS
Input High Voltage, V Input Low Voltage, V Input Current, I
2.0 V min
INH
0.8 V max
INL
or I
0.002 μA typ VIN = V
INL
INH
±0.1 μA max Digital Input Capacitance, CIN 3 pF typ
DYNAMIC CHARACTERISTICS1
Transition Time, t
175 ns typ RL = 300 Ω, CL = 35 pF
TRANSITION
230 285 320 ns max VS = 10 V, see Figure 29 tON (EN) 155 ns typ RL = 300 Ω, CL = 35 pF 205 255 285 ns max VS = 10 V, see Figure 31 t
(EN) 150 ns typ RL = 300 Ω, CL = 35 pF
OFF
175 200 215 ns max VS = 10 V, see Figure 31 Break-Before-Make Time Delay, tD 80 ns typ RL = 300 Ω, CL = 35 pF
30 ns min VS1 = VS2 = 10 V, see Figure 30
Charge Injection, Q
−0.6 pC typ VS = 0 V, RS = 0 Ω, CL = 1 nF, see Figure 32
INJ
Off Isolation −80 dB typ RL = 50 Ω, CL = 5 pF, f = 100 kHz, see Figure 25 Channel-to-Channel Crosstalk −80 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 28
−3 dB Bandwidth 136 MHz typ RL = 50 Ω, CL = 5 pF, see Figure 27 Insertion Loss −6.8 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 27 CS (Off) 3 pF typ VS = 0 V, f = 1 MHz CD (Off) 26 pF typ VS = 0 V, f = 1 MHz CD, CS (On) 30 pF typ VS = 0 V, f = 1 MHz
POWER REQUIREMENTS VDD = +16.5 V, VSS = −16.5 V
IDD 45 μA typ Digital inputs = 0 V or VDD 55 70 μA max ISS 0.001 μA typ Digital inputs = 0 V or VDD 1 μA max VDD/VSS ±9/±22 V min/max GND = 0 V
1
Guaranteed by design; not subject to production test.
4.5 Ω typ V
= ±10 V, IS = −1 mA
S
38 Ω typ VS = ±10 V, IS = −1 mA
V
= VS = ±10 V, VD = ∓10 V, see Figure 23
S
V
= VS = ±10 V, VD = ∓10 V, see Figure 23
S
or VDD
GND
Rev. 0 | Page 3 of 20
Page 4
ADG5204

±20 V DUAL SUPPLY

VDD = +20 V ± 10%, VSS = −20 V ± 10%, GND = 0 V, unless otherwise noted.
Table 2.
Parameter 25°C −40°C to +85°C −40°C to +125°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range VDD to VSS V max On Resistance, RON 140 Ω typ VS = ±15 V, IS = −1 mA, see Figure 24 160 200 230 Ω max VDD = +18 V, VSS = −18 V On-Resistance Match
Between Channels, ∆R
ON
8 9 10 Ω max On-Resistance Flatness, R
FLAT(ON)
45 55 60 Ω max LEAKAGE CURRENTS VDD = +22 V, VSS = −22 V
Source Off Leakage, IS (Off) 0.01 nA typ
0.1 0.2 0.4 nA max Drain Off Leakage, ID (Off) 0.01 nA typ
0.1 0.4 1.2 nA max Channel On Leakage, ID, IS (On) 0.02 nA typ VS = VD = ±15 V, see Figure 26
0.2 0.5 1.2 nA max
DIGITAL INPUTS
Input High Voltage, V Input Low Voltage, V Input Current, I
INL
2.0 V min
INH
0.8 V max
INL
or I
0.002 μA typ VIN = V
INH
±0.1 μA max Digital Input Capacitance, CIN 3 pF typ
DYNAMIC CHARACTERISTICS1
Transition Time, t
160 ns typ RL = 300 Ω, CL = 35 pF
TRANSITION
215 260 290 ns max VS = 10 V, see Figure 29 tON (EN) 150 ns typ RL = 300 Ω, CL = 35 pF 185 225 255 ns max VS = 10 V, see Figure 31 t
(EN) 150 ns typ RL = 300 Ω, CL = 35 pF
OFF
175 195 210 ns max VS = 10 V, see Figure 31 Break-Before-Make Time Delay, tD 75 ns typ RL = 300 Ω, CL = 35 pF
30 ns min VS1 = VS2 = 10 V, see Figure 30
Charge Injection, Q
−0.6 pC typ VS = 0 V, RS = 0 Ω, CL = 1 nF, see Figure 32
INJ
Off Isolation −80 dB typ RL = 50 Ω, CL = 5 pF, f = 100 kHz,
Channel-to-Channel Crosstalk −80 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 28
−3 dB Bandwidth 150 MHz typ RL = 50 Ω, CL = 5 pF, see Figure 27 Insertion Loss −6 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 27 CS (Off) 3 pF typ VS = 0 V, f = 1 MHz CD (Off) 26 pF typ VS = 0 V, f = 1 MHz CD, CS (On) 30 pF typ VS = 0 V, f = 1 MHz
POWER REQUIREMENTS VDD = +22 V, VSS = −22 V
IDD 50 μA typ Digital inputs = 0 V or VDD 70 110 μA max ISS 0.001 μA typ Digital inputs = 0 V or VDD 1 μA max VDD/VSS ±9/±22 V min/max GND = 0 V
1
Guaranteed by design; not subject to production test.
4.5 Ω typ V
= ±15 V, IS = −1 mA
S
33 Ω typ VS = ±15 V, IS = −1 mA
V
= ±15 V, VD = ∓15 V, see Figure 23
S
V
= ±15 V, VD = ∓15 V, see Figure 23
S
or VDD
GND
see Figure 25
Rev. 0 | Page 4 of 20
Page 5
ADG5204

12 V SINGLE SUPPLY

VDD = 12 V ± 10%, VSS = 0 V, GND = 0 V, unless otherwise noted.
Table 3.
Parameter 25°C −40°C to +85°C −40°C to +125°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 V to VDD V max On Resistance, RON 340 Ω typ VS = 0 V to 10 V, IS = −1 mA, see Figure 24 500 610 700 Ω max VDD = 10.8 V, VSS = 0 V On-Resistance Match
Between Channels, ∆R
ON
20 21 22 Ω max On-Resistance Flatness, R
FLAT(ON)
280 335 370 Ω max LEAKAGE CURRENTS VDD = 13.2 V, VSS = 0 V
Source Off Leakage, IS (Off) 0.01 nA typ VS = 1 V/10 V, VD = 10 V/1 V, see Figure 23
0.1 0.2 0.4 nA max Drain Off Leakage, ID (Off) 0.01 nA typ VS = 1 V/10 V, VD = 10 V/1 V, see Figure 23
0.1 0.4 1.2 nA max Channel On Leakage, ID, IS (On) 0.02 nA typ VS = VD = 1 V/10 V, see Figure 26
0.2 0.5 1.2 nA max DIGITAL INPUTS
Input High Voltage, V Input Low Voltage, V Input Current, I
2.0 V min
INH
0.8 V max
INL
or I
0.002 μA typ VIN = V
INL
INH
±0.1 μA max Digital Input Capacitance, CIN 3 pF typ
DYNAMIC CHARACTERISTICS1
Transition Time, t
240 ns typ RL = 300 Ω, CL = 35 pF
TRANSITION
350 445 515 ns max VS = 8 V, see Figure 29 tON (EN) 250 ns typ RL = 300 Ω, CL = 35 pF 335 420 485 ns max VS = 8 V, see Figure 31 t
(EN) 160 ns typ RL = 300 Ω, CL = 35 pF
OFF
195 220 240 ns max VS = 8 V, see Figure 31 Break-Before-Make Time Delay, tD 140 ns typ RL = 300 Ω, CL = 35 pF
60 ns min VS1 = VS2 = 8 V, see Figure 30
Charge Injection, Q
−1.2 pC typ VS = 6 V, RS = 0 Ω, CL = 1 nF, see Figure 32
INJ
Off Isolation −80 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 25 Channel-to-Channel Crosstalk −80 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 28
−3 dB Bandwidth 106 MHz typ RL = 50 Ω, CL = 5 pF, see Figure 27 Insertion Loss −11 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 27 CS (Off) 3.5 pF typ VS = 6 V, f = 1 MHz CD (Off) 29 pF typ VS = 6 V, f = 1 MHz CD, CS (On) 33 pF typ VS = 6 V, f = 1 MHz
POWER REQUIREMENTS VDD = 13.2 V
IDD 40 μA typ Digital inputs = 0 V or VDD 65 μA max VDD 9/40 V min/max GND = 0 V, VSS = 0 V
1
Guaranteed by design; not subject to production test.
5 Ω typ V
= 0 V to 10 V, IS = −1 mA
S
145 Ω typ VS = 0 V to 10 V, IS = −1 mA
or VDD
GND
Rev. 0 | Page 5 of 20
Page 6
ADG5204

36 V SINGLE SUPPLY

VDD = 36 V ± 10%, VSS = 0 V, GND = 0 V, unless otherwise noted.
Table 4.
Parameter 25°C −40°C to +85°C −40°C to +125°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 V to VDD V max On Resistance, RON 150 Ω typ VS = 0 V to 30 V, IS = −1 mA, see Figure 24 170 215 245 Ω max VDD = 32.4 V, VSS = 0 V On-Resistance Match
Between Channels, ∆R
ON
8 9 10 Ω max On-Resistance Flatness, R
FLAT(ON)
50 60 65 Ω max LEAKAGE CURRENTS VDD = 39.6 V, VSS = 0 V
Source Off Leakage, IS (Off) 0.01 nA typ VS = 1 V/30 V, VD = 30 V/1 V, see Figure 23
0.1 0.2 0.4 nA max Drain Off Leakage, ID (Off) 0.01 nA typ VS = 1 V/30 V, VD = 30 V/1 V, see Figure 23
0.1 0.4 1.2 nA max Channel On Leakage, ID, IS (On) 0.02 nA typ VS = VD = 1 V/30 V, see Figure 26
0.2 0.5 1.2 nA max DIGITAL INPUTS
Input High Voltage, V Input Low Voltage, V Input Current, I
2.0 V min
INH
0.8 V max
INL
or I
0.002 μA typ VIN = V
INL
INH
±0.1 μA max Digital Input Capacitance, CIN 3 pF typ
DYNAMIC CHARACTERISTICS1
Transition Time, t
180 ns typ RL = 300 Ω, CL = 35 pF
TRANSITION
250 275 305 ns max VS = 18 V, see Figure 29 tON (EN) 170 ns typ RL = 300 Ω, CL = 35 pF 220 251 285 ns max VS = 18 V, see Figure 31 t
(EN) 170 ns typ RL = 300 Ω, CL = 35 pF
OFF
210 215 220 ns max VS = 18 V, see Figure 31 Break-Before-Make Time Delay, tD 80 ns typ RL = 300 Ω, CL = 35 pF
30 ns min VS1 = VS2 = 18 V, see Figure 30
Charge Injection, Q
−0.6 pC typ VS = 18 V, RS = 0 Ω, CL = 1 nF, see Figure 32
INJ
Off Isolation −80 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 25 Channel-to-Channel Crosstalk −80 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 28
−3 dB Bandwidth 136 MHz typ RL = 50 Ω, CL = 5 pF, see Figure 27 Insertion Loss −6.7 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 27 CS (Off) 3 pF typ VS = 18 V, f = 1 MHz CD (Off) 26 pF typ VS = 18 V, f = 1 MHz CD, CS (On) 30 pF typ VS = 18 V, f = 1 MHz
POWER REQUIREMENTS VDD = 39.6 V
IDD 85 μA typ Digital inputs = 0 V or VDD 100 130 μA max VDD 9/40 V min/max GND = 0 V, VSS = 0 V
1
Guaranteed by design; not subject to production test.
4.5 Ω typ V
= 0 V to 30 V, IS = −1 mA
S
35 Ω typ VS = 0 V to 30 V, IS = −1 mA
or VDD
GND
Rev. 0 | Page 6 of 20
Page 7
ADG5204

CONTINUOUS CURRENT PER CHANNEL, Sx OR D

Table 5.
Parameter 25°C 85°C 125°C Unit
CONTINUOUS CURRENT, Sx OR D PINS
VDD = +15 V, VSS = −15 V
TSSOP (θJA = 112.6°C/W) 24.5 7.5 2.8 mA max LFCSP (θJA = 30.4°C/W) 35.7 7.7 2.8 mA max
VDD = +20 V, VSS = −20 V
TSSOP (θJA = 112.6°C/W) 26 7.5 2.8 mA max LFCSP (θJA = 30.4°C/W) 37 7.7 2.8 mA max
VDD = 12 V, VSS = 0 V
TSSOP (θJA = 112.6°C/W) 18 7 2.8 mA max LFCSP (θJA = 30.4°C/W) 28 7.7 2.8 mA max
VDD = 36 V, VSS = 0 V
TSSOP (θJA = 112.6°C/W) 30 7.7 2.8 mA max LFCSP (θJA = 30.4°C/W) 41 7.7 2.8 mA max
Rev. 0 | Page 7 of 20
Page 8
ADG5204

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.
Table 6.
Parameter Rating
VDD to VSS 48 V VDD to GND −0.3 V to +48 V VSS to GND +0.3 V to −48 V Analog Inputs1
Digital Inputs1
Peak Current, Sx or D Pins
Continuous Current, Sx or D2 Data + 15% Operating Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C Thermal Impedance, θJA
16-Lead TSSOP, θJA Thermal
Impedance (4-Layer Board)
16-Lead LFCSP, θJA Thermal
Impedance (4-Layer Board)
Reflow Soldering Peak
Temperature, Pb Free
1
Overvoltages at the Sx and D pins are clamped by internal diodes. Limit
current to the maximum ratings given.
2
See . Table 5
− 0.3 V to VDD + 0.3 V or
V
SS
30 mA, whichever occurs first
− 0.3 V to VDD + 0.3 V or
V
SS
30 mA, whichever occurs first 81 mA (pulsed at 1 ms,
10% duty cycle maximum)
112.6°C/W
30.4°C/W
260(+0/−5)°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Only one absolute maximum rating can be applied at any one time.

ESD CAUTION

Rev. 0 | Page 8 of 20
Page 9
ADG5204
2
V

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

EN
A0
NC
1
A0
2
EN
3
V
SS
4
S1
(Not to Scale)
5
S2
6
D
7
NC
NC = NO CONNECT
ADG5204
TOP VIEW
14
A1
13
GND
12
V
DD
11
S3
10
S4
9
NC
8
NC
09768-002
NOTES
1. NC = NO CONNECT . . EXPOSED PAD TIED TO SUBSTRATE,
Figure 2. TSSOP Pin Configuration
Table 7. Pin Function Descriptions
Pin No.
TSSOP LFCSP Mnemonic Description
1 15 A0 Logic Control Input. 2 16 EN
Active High Digital Input. When this pin is low, the device is disabled and all switches are off.
When this pin is high, the Ax logic inputs determine the on switches. 3 1 VSS Most Negative Power Supply Potential. 4 3 S1 Source Terminal. Can be an input or an output. 5 4 S2 Source Terminal. Can be an input or an output. 6 6 D Drain Terminal. Can be an input or an output. 7 to 9 2, 5, 7, 8, 13 NC No Connect. These pins are open. 10 9 S4 Source Terminal. Can be an input or an output. 11 10 S3 Source Terminal. Can be an input or an output. 12 11 VDD Most Positive Power Supply Potential. 13 12 GND Ground (0 V) Reference. 14 14 A1 Logic Control Input. N/A1 EP Exposed Pad
Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder
joints and maximum thermal capability, it is recommended that the pad be soldered to the
.
SS
1
N/A means not applicable.
substrate, V
1V
SS
2NC
3S1
4S2
Figure 3. LFCSP Pin Configuration
A1
14
16
15
ADG5204
TOP VIEW
(Not to Scale)
7
5
6
D
NC
NC
13
8
NC
12 GND
11 V
DD
10 S3
9S4
.
SS
09768-003

TRUTH TABLE

Table 8.
EN A1 A0 S1 S2 S3 S4
0 X1 X1 Off Off Off Off 1 0 0 On Off Off Off 1 0 1 Off On Off Off 1 1 0 Off Off On Off 1 1 1 Off Off Off On
1
X is don’t care.
Rev. 0 | Page 9 of 20
Page 10
ADG5204

TYPICAL PERFORMANCE CHARACTERISTICS

160
TA = 25°C
140
120
VDD = +18V V
= –18V
SS
160
140
120
TA = 25°C
VDD = 32.4V V
= 0V
SS
100
V
80
60
ON RESISTANCE (Ω)
40
20
0
–25 –20 –15 –10 –5 0 5 10 15 20 25
Figure 4. R
250
TA = 25°C
200
150
100
ON RESISTANCE ( Ω)
50
0
–20 –15 –10 –5 0 5 10 15 20
Figure 5. R
500
TA = 25°C
450
400
350
300
250
200
ON RESISTANCE ( Ω)
150
100
50
0
01412108642
Figure 6. R
= +20V
DD
V
= –20V
SS
VS, VD (V)
as a Function of VD or VS, Dual Supply
ON
VDD = +16.5V V
= –16.5V
SS
VDD = +15V V
= –15V
SS
VS, VD (V)
as a Function of VD or VS, Dual Supply
ON
VDD = 9V V
= 0V
SS
VDD = 10.8V V
SS
VS, VD (V)
as a Function of VD or VS, Single Supply
ON
= +22V
V
DD
V
= –22V
SS
VDD = +9V V
= –9V
SS
VDD = +13.2V V
= –13.2V
SS
= 0V
VDD = 12V V
= 0V
SS
VDD = 13.2V V
= 0V
SS
100
80
60
ON RESISTANCE (Ω)
40
20
0
043530252015105
09768-104
09768-105
Figure 7. R
250
VDD = +15V V
SS
200
150
100
ON RESISTANCE ( Ω)
50
0
–15 –10 –5 0 5 10 15
Figure 8. R
as a Function of VD or VS, Single Supply
ON
= –15V
as a Function of VD or VS, for Different Temperatures,
ON
VDD = 36V V
= 0V
SS
VS, VD (V)
TA = +125°C
T
= +85°C
A
= +25°C
T
A
T
= –40°C
A
VS,VD (V)
VDD = 39.6V V
= 0V
SS
0
09768-107
09768-108
±15 V Dual Supply
200
180
160
140
120
100
80
ON RESISTANCE ( Ω)
60
40
20
VDD = +20V V
= –20V
SS
0
–20 –15 –10 –5 0 5 10 2015
09768-106
Figure 9. R
as a Function of VD or VS, for Different Temperatures,
ON
T
= +125°C
A
T
= +85°C
A
= +25°C
T
A
= –40°C
T
A
VS,VD (V)
09768-109
±20 V Dual Supply
Rev. 0 | Page 10 of 20
Page 11
ADG5204
500
450
= +125°C
400
340
T
A
T
A
= +85°C
300
= +25°C
T
250
200
ON RESISTANCE ( Ω)
150
A
= –40°C
T
A
100
50
VDD = 12V V
= 0V
SS
0
024681012
VS,VD (V)
Figure 10. R
as a Function of VD or VS for Different Temperatures,
ON
12 V Single Supply
250
VDD = 36V
= 0V
V
SS
200
T
= +125°C
150
100
ON RESISTANCE (Ω)
A
T
= +85°C
A
= +25°C
T
A
T
= –40°C
A
50
0
03530252015105
VS,VD (V)
Figure 11. R
as a Function of VD or VS for Different Temperatures,
ON
36 V Single Supply
10
ID (OFF) – +
I
D,IS
(ON) + +
0
–10
(OFF) + –
I
–20
–30
D
(ON) – –
I
D,IS
–40
LEAKAGE CURRENT (p A)
–50
VDD = +15V
–60
V
= –15V
SS
V
= +10V/–10V
BIAS
–70
0 20 40 60 80 100 120
TEMPERATURE (°C)
I
(OFF) + –
S
(OFF) – +
I
S
Figure 12. Leakage Current vs. Temperature, ±15 V Dual Supply
09768-110
09768-111
09768-112
100
I
(OFF) + –
S
I
D,IS
(ON) + +
I
(OFF) – +
D
50
0
(OFF) – +
I
S
–50
I
(OFF) + –
–100
LEAKAGE CURRENT (p A)
–150
VDD = +20V V
= –20V
SS
V
= +15V/–15V
BIAS
–200
0 20 40 60 80 100 120
D
I
(ON) – –
D,IS
TEMPERATURE (°C)
Figure 13. Leakage Current vs. Temperature, ±20 V Dual Supply
40
20
0
–20
–40
–60
LEAKAGE CURRENT (p A)
–80
VDD = 12V
–100
V
= 0V
SS
V
= 1V/10V
BIAS
–120
0 20406080100120
(OFF) + –
I
S
I
(OFF) – +
S
I
D,IS
TEMPERATURE ( °C)
(ON) + +
I
(OFF) + –
D
I
D,IS
I
(OFF) – +
D
(ON) – –
Figure 14. Leakage Current vs. Temperature, 12 V Single Supply
50
I
(OFF) – +
D
ID,IS (ON) + +
0
–50
–100
I
(OFF) + –
–150
D
LEAKAGE CURRENT (p A)
–200
VDD = 36V V
= 0V
SS
V
= 1V/30V
BIAS
–250
0 20406080100120
TEMPERATURE ( °C)
I
D,IS
I
(OFF) + –
S
(OFF) – +
I
S
(ON) – –
Figure 15. Leakage Current vs. Temperature, 36 V Single Supply
09768-113
09768-114
09768-115
Rev. 0 | Page 11 of 20
Page 12
ADG5204
0
TA = 25°C V
DD
V
SS
–20
= +15V = –15V
350
300
–40
–60
–80
OFF ISOLATION (dB)
–100
–120
10k 100k 1M 10M 100M 1G
FREQUENCY (Hz)
Figure 16. Off Isolation vs. Frequency, ±15 V Dual Supply
0
TA = 25°C V
= +15V
DD
V
= –15V
SS
–20
–40
BETWEEN S1 AND S2
–60
CROSSTALK (dB)
–80
BETWEEN S1 AND S4
–100
–120
10k 100k 1M 10M 100M 1G
FREQUENCY (Hz)
Figure 17. Crosstalk vs. Frequency, ±15 V Dual Supply
2.5 TA = 25°C
2.0
1.5
1.0
0.5
0
–0.5
–1.0
CHARGE INJECTI ON (pC)
–1.5
–2.0
–2.5
–20 –10 0 10 20 30 40
V V
DD
SS
= +15V = –15V
V
V
V V
DD
V
S
= +20V
DD
= –20V
SS
= +12V
= 0V
SS
(V)
V
DD
V
SS
Figure 18. Charge Injection vs. Source Voltage
= +36V
= 0V
250
VDD = +12V V
= 0V
SS
200
150
TIME (ns)
V V
DD SS
= +20V
= –20V
100
50
0
–40 –20 0 20 40 60 80 100 120
09768-116
V V
TEMPERATURE (°C)
DD SS
V V
= +15V = –15V
DD SS
= +36V = 0V
09768-120
Figure 19. Transition Time vs. Temperature
0
TA = 25°C V
= +15V
DD
V
= –15V
SS
–20
–40
–60
ACPSRR (dB)
–80
–100
–120
1k 10k 100k 1M 10M
09768-117
NO DECOUPLING CAPACITORS
DECOUPLING CAPACITORS
FREQUENCY (Hz)
09768-121
Figure 20. ACPSRR vs. Frequency, ±15 V Dual Supply
40
TA = 25°C V
= +15V
DD
35
V
= –15V
SS
30
25
20
15
CAPACITANCE (pF )
10
5
0
–15 –10 –5 0 5 10 15
09768-119
SOURCE/DRAIN ON
DRAIN OFF
SOURCE OFF
V
(V)
S
09768-123
Figure 21. Capacitance vs. Source Voltage, Dual Supply
Rev. 0 | Page 12 of 20
Page 13
ADG5204
0
TA = 25°C V
= +15V
DD
–2
V
= –15V
SS
–4
–6
–8
–10
–12
ATTENUATION (dB)
–14
–16
–18
–20
100k 1M 10M 100M 1G
FREQUENCY (Hz)
Figure 22. Bandwidth
09768-125
Rev. 0 | Page 13 of 20
Page 14
ADG5204
V
V
V
V
V
V
V
V

TEST CIRCUITS

IS (OFF) ID (OFF)
A A
Sx D
NC
Sx D
ID (ON)
A
0.1µF
S
S
DD
V
DDVSS
Sx
GND
Figure 23. Off Leakage
V
Sx D
Figure 24. On Resistance
SS
0.1µF
50
D
V
D
09768-006
DD
0.1µF
V
DDVSS
Sx
I
DS
09768-005
NC = NO CONNECT
Figure 26. On Leakage
SS
0.1µF
D
GND
INSERTION LOSS = 20 log
V
D
NETWORK
ANALYZER
50
R
L
50
V
WITH SWITCH
OUT
V
WITHOUT SWITCH
OUT
09768-007
V
S
V
OUT
09768-009
Figure 27. Bandwidth
DD
GND
SS
0.1µF
V
SS
D
R
L
50
NETWORK
ANALYZER
50
V
OUT
R
L
50
0.1µF
NETWORK
ANALYZER
V
OUT
R
L
50
V
S
V
S
V
DD
S1
S2
OFF ISOLATION = 20 log
Figure 25. Off Isolation
V
OUT
V
S
09768-008
CHANNEL-TO-CHANNEL CROSSTALK = 20 log
Figure 28. Channel-to-Channel Crosstalk
V
OUT
V
S
09768-010
Rev. 0 | Page 14 of 20
Page 15
ADG5204
V
VDDV
V
VDDV
0.1µF
V
IN
2.4V
A1
A0
EN
V
DD
SS
0.1µF
V
V
DD
SS
S1
S2
V
S1
ADDRESS
DRIVE (VIN)
S3
GND
S4
D
R
L
300
V
S4
V
OUT
C
L
35pF
3V
0V
V
OUT
50% 50%
90%
t
TRANSITION
t
TRANSITI ON
90%
09768-012
Figure 29. Address to Output Switching Times
SS
VDDV
0.1µF
SS
S1
S2
V
S1
ADDRESS
DRIVE (V
3V
)
IN
0V
S3
0.1µF
A1
V
IN
300
A0
S4
50% 50%
t
ON
80%
0.9V
(EN)
2.4V
EN
GND
D
R
L
300
Figure 30. Break-Before-Make Time Delay, t
V
DD
SS
VDDV
GND
0.1µF
SS
S1
S2
S3
S4
D
R
L
300
0.1µF
A1
A0
EN
V
IN
300
V
OUT
C
L
35pF
ENABLE
V
S
C
L
35pF
DRIVE (V
OUTPUT
V
OUT
V
OUT
D
3V
)
IN
0V
V
OUT
0V
OUT
80%
t
D
0.1V
OUT
t
(EN)
OFF
09768-013
09768-014
Figure 31. Enable-to-Output Switching Delay
SS
V
V
R
S
V
S
DD
Sx D
DECODER
SS
V
OUT
C
L
1nF
V
OUT
V
Q
= CL × ∆V
INJ
IN
SW OFF
OUT
V
OUT
SW OFF
SW ON
GND
SW OFF
V
A2A1
IN
EN
SW OFF
09768-015
Figure 32. Charge Injection
Rev. 0 | Page 15 of 20
Page 16
ADG5204

TERMINOLOGY

IDD
The positive supply current.
I
SS
The negative supply current.
V
, VS
D
The analog voltage on Terminal D and Terminal S.
R
ON
The ohmic resistance between Terminal D and Terminal S.
R
Flatness that is defined as the difference between the maximum and minimum value of on resistance measured over the specified analog signal range.
I
The source leakage current with the switch off.
I
The drain leakage current with the switch off.
I
The channel leakage current with the switch on.
V
The maximum input voltage for Logic 0.
V
The minimum input voltage for Logic 1.
I
The input current of the digital input.
C
The off switch source capacitance, which is measured with reference to ground.
C
The off switch drain capacitance, which is measured with reference to ground.
C
The on switch capacitance, which is measured with reference to ground.
FLAT(ON)
(Off)
S
(Off)
D
, IS (On)
D
INL
INH
, I
INL
INH
(Off)
S
(Off)
D
(On), CS (On)
D
C
IN
The digital input capacitance.
t
TRANSITION
The delay time between the 50% and 90% points of the digital input and switch-on condition when switching from one address state to another.
t
(EN)
ON
The delay between applying the digital control input and the output switching on. See Figure 31.
t
(EN)
OFF
The delay between applying the digital control input and the output switching off. See Figure 31.
Charge Injection
A measure of the glitch impulse transferred from the digital input to the analog output during switching.
Off Isolation
A measure of unwanted signal coupling through an off switch.
Crosstalk
A measure of unwanted signal that is coupled through from one channel to another as a result of parasitic capacitance.
Bandwidth
The frequency at which the output is attenuated by 3 dB.
On Response
The frequency response of the on switch.
Insertion Loss
The loss due to the on resistance of the switch.
ACPSRR (AC Power Supply Rejection Ratio)
The ratio of the amplitude of signal on the output to the amplitude of the modulation. This is a measure of the ability of the device to avoid coupling noise and spurious signals that appear on the supply voltage pins to the output of the switch. The dc voltage on the device is modulated by a sine wave of 0.62 V p-p.
Rev. 0 | Page 16 of 20
Page 17
ADG5204

TRENCH ISOLATION

In the ADG5204, an insulating oxide layer (trench) is placed between the NMOS and the PMOS transistors of each CMOS switch. Parasitic junctions, which occur between the transistors in junction isolated switches, are eliminated, and the result is a completely latch-up proof switch.
In junction isolation, the N and P wells of the PMOS and NMOS transistors form a diode that is reverse-biased under normal operation. However, during overvoltage conditions, this diode can become forward-biased. A silicon controlled rectifier (SCR) type circuit is formed by the two transistors causing a significant amplification of the current that, in turn, leads to latch-up. By using trench isolation, this diode is removed, and the result is a latch-up proof switch.
NMOS PMOS
P WELL N WELL
TRENCH
BURIED OXIDE L AYER
HANDLE WAFER
Figure 33. Trench Isolation
09768-004
Rev. 0 | Page 17 of 20
Page 18
ADG5204

APPLICATIONS INFORMATION

The ADG52xx family of switches and multiplexers provide a robust solution for instrumentation, industrial, automotive, aerospace, and other harsh environments that are prone to latch-up, which is an undesirable high current state that can lead to device failure and persists until the power supply is turned off. The ADG5204 high voltage multiplexer allows single-supply operation from 9 V to 40 V and dual-supply operation from ±9 V to ±22 V.
Rev. 0 | Page 18 of 20
Page 19
ADG5204
S

OUTLINE DIMENSIONS

5.10
5.00
4.90
4.50
4.40
4.30
PIN 1
1.05
1.00
0.80
0.15
0.05
COPLANARITY
0.10
14
1
0.65 BSC
0.30
0.19
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
8
6.40 BSC
7
1.20
0.20
MAX
SEATING PLANE
0.09
8° 0°
0.75
0.60
0.45
061908-A
Figure 34. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
PIN 1
INDICATOR
0.80
0.75
0.70
EATING
PLANE
4.10
4.00 SQ
3.90
0.65 BSC
0.45
0.40
0.35
0.05 MAX
0.02 NOM
0.20 REF
0.35
0.30
0.25
13
12
9
8
BOTTOM VIEWTOP VIEW
COPLANARITY
0.08
N
1
P
I
D
C
I
N
I
16
EXPOSED
1
PAD
4
5
FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET.
2.70
2.60 SQ
2.50
0.20 MIN
R
O
A
T
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGC.
08-16-2010-C
Figure 35. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-16-17)
Dimensions shown in millimeters

ORDERING GUIDE

Model1 Temperature Range Package Description Package Option
ADG5204BRUZ −40°C to +125°C 14-Lead Thin Shrink Small Outline Package [TSSOP] RU-14 ADG5204BRUZ-RL7 −40°C to +125°C 14-Lead Thin Shrink Small Outline Package [TSSOP] RU-14 ADG5204BCPZ-RL7 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-16-17
1
Z = RoHS Compliant Part.
Rev. 0 | Page 19 of 20
Page 20
ADG5204
NOTES
©2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D09768-0-5/11(0)
Rev. 0 | Page 20 of 20
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