Latch-up proof
3 pF off source capacitance
26 pF off drain capacitance
−0.6 pC charge injection
Low leakage: 0.4 nA maximum at 85°C
±9 V to ±22 V dual-supply operation
9 V to 40 V single-supply operation
48 V supply maximum ratings
Fully specified at ±15 V, ±20 V, +12 V, and +36 V
V
to VDD analog signal range
SS
APPLICATIONS
Automatic test equipment
Data acquisition
Instrumentation
Avio nics
Audio and video switching
Communication systems
4-Channel Multiplexer
ADG5204
FUNCTIONAL BLOCK DIAGRAM
ADG5204
1
2
4
A0 A1 EN
1 OF 4
DECODERS
Figure 1.
D
09768-001
GENERAL DESCRIPTION
The ADG5204 is a complementary metal oxide semiconductor
(CMOS) analog multiplexer, comprising four single channels.
The ultralow capacitance and charge injection of these switches
make them ideal solutions for data acquisition and sample-andhold applications, where low glitch and fast settling are required.
Fast switching speed together with high signal bandwidth make
the ADG5204 suitable for video signal switching.
The ADG5204 is designed on a trench process, which guards
against latch-up. A dielectric trench separates the P and N
channel transistors, thereby preventing latch-up even under
severe overvoltage conditions.
The ADG5204 switches one of four inputs to a common output,
D, as determined by the 3-bit binary address lines, A0, A1, and
EN. Logic 0 on the EN pin disables the device. Each switch conducts equally well in both directions when on, and each switch
has an input signal range that extends to the supplies. In the off
condition, signal levels up to the supplies are blocked. All switches
exhibit break-before-make switching action.
PRODUCT HIGHLIGHTS
1. Trench Isolation Guards Against Latch-Up.
A dielectric trench separates the P and N channel transistors,
thereby preventing latch-up even under severe overvoltage
conditions.
2. Ultralow Capacitance and <1 pC Charge Injection.
3. Dual-Supply Operation.
For applications where the analog signal is bipolar, the
ADG5204 can be operated from dual supplies up to ±22 V.
4. Single-Supply Operation.
For applications where the analog signal is unipolar, the
ADG5204 can be operated from a single rail power supply
up to 40 V.
5. 3 V Logic-Compatible Digital Inputs.
V
INH
6. No V
= 2.0 V, V
Logic Power Supply Required.
L
= 0.8 V.
INL
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
VDD = 15 V ± 10%, VSS = −15 V ± 10%, GND = 0 V, unless otherwise noted.
Table 1.
Parameter 25°C −40°C to +85°C −40°C to +125°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range VDD to VSS V max
On Resistance, RON 160 Ω typ VS = ±10 V, IS = −1 mA, see Figure 24
200 250 280 Ω max VDD = +13.5 V, VSS = −13.5 V
On-Resistance Match
Between Channels, ∆R
ON
8 9 10 Ω max
On-Resistance Flatness, R
FLAT(ON)
50 65 70 Ω max
LEAKAGE CURRENTS VDD = +16.5 V, VSS = −16.5 V
Source Off Leakage, IS (Off) 0.01 nA typ
0.1 0.2 0.4 nA max
Drain Off Leakage, ID (Off) 0.01 nA typ
0.1 0.4 1.2 nA max
Channel On Leakage, ID, IS (On) 0.02 nA typ VS = VD = ±10 V, see Figure 26
0.2 0.5 1.2 nA max
DIGITAL INPUTS
Input High Voltage, V
Input Low Voltage, V
Input Current, I
2.0 V min
INH
0.8 V max
INL
or I
0.002 μA typ VIN = V
INL
INH
±0.1 μA max
Digital Input Capacitance, CIN 3 pF typ
DYNAMIC CHARACTERISTICS1
Transition Time, t
175 ns typ RL = 300 Ω, CL = 35 pF
TRANSITION
230 285 320 ns max VS = 10 V, see Figure 29
tON (EN) 155 ns typ RL = 300 Ω, CL = 35 pF
205 255 285 ns max VS = 10 V, see Figure 31
t
(EN) 150 ns typ RL = 300 Ω, CL = 35 pF
OFF
175 200 215 ns max VS = 10 V, see Figure 31
Break-Before-Make Time Delay, tD 80 ns typ RL = 300 Ω, CL = 35 pF
30 ns min VS1 = VS2 = 10 V, see Figure 30
Charge Injection, Q
−0.6 pC typ VS = 0 V, RS = 0 Ω, CL = 1 nF, see Figure 32
INJ
Off Isolation −80 dB typ RL = 50 Ω, CL = 5 pF, f = 100 kHz, see Figure 25
Channel-to-Channel Crosstalk −80 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 28
−3 dB Bandwidth 136 MHz typ RL = 50 Ω, CL = 5 pF, see Figure 27
Insertion Loss −6.8 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 27
CS (Off) 3 pF typ VS = 0 V, f = 1 MHz
CD (Off) 26 pF typ VS = 0 V, f = 1 MHz
CD, CS (On) 30 pF typ VS = 0 V, f = 1 MHz
POWER REQUIREMENTS VDD = +16.5 V, VSS = −16.5 V
IDD 45 μA typ Digital inputs = 0 V or VDD
55 70 μA max
ISS 0.001 μA typ Digital inputs = 0 V or VDD
1 μA max
VDD/VSS ±9/±22 V min/max GND = 0 V
1
Guaranteed by design; not subject to production test.
4.5 Ω typ V
= ±10 V, IS = −1 mA
S
38 Ω typ VS = ±10 V, IS = −1 mA
V
= VS = ±10 V, VD = ∓10 V, see Figure 23
S
V
= VS = ±10 V, VD = ∓10 V, see Figure 23
S
or VDD
GND
Rev. 0 | Page 3 of 20
Page 4
ADG5204
±20 V DUAL SUPPLY
VDD = +20 V ± 10%, VSS = −20 V ± 10%, GND = 0 V, unless otherwise noted.
Table 2.
Parameter 25°C −40°C to +85°C −40°C to +125°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range VDD to VSS V max
On Resistance, RON 140 Ω typ VS = ±15 V, IS = −1 mA, see Figure 24
160 200 230 Ω max VDD = +18 V, VSS = −18 V
On-Resistance Match
Between Channels, ∆R
ON
8 9 10 Ω max
On-Resistance Flatness, R
FLAT(ON)
45 55 60 Ω max
LEAKAGE CURRENTS VDD = +22 V, VSS = −22 V
Source Off Leakage, IS (Off) 0.01 nA typ
0.1 0.2 0.4 nA max
Drain Off Leakage, ID (Off) 0.01 nA typ
0.1 0.4 1.2 nA max
Channel On Leakage, ID, IS (On) 0.02 nA typ VS = VD = ±15 V, see Figure 26
0.2 0.5 1.2 nA max
DIGITAL INPUTS
Input High Voltage, V
Input Low Voltage, V
Input Current, I
INL
2.0 V min
INH
0.8 V max
INL
or I
0.002 μA typ VIN = V
INH
±0.1 μA max
Digital Input Capacitance, CIN 3 pF typ
DYNAMIC CHARACTERISTICS1
Transition Time, t
160 ns typ RL = 300 Ω, CL = 35 pF
TRANSITION
215 260 290 ns max VS = 10 V, see Figure 29
tON (EN) 150 ns typ RL = 300 Ω, CL = 35 pF
185 225 255 ns max VS = 10 V, see Figure 31
t
(EN) 150 ns typ RL = 300 Ω, CL = 35 pF
OFF
175 195 210 ns max VS = 10 V, see Figure 31
Break-Before-Make Time Delay, tD 75 ns typ RL = 300 Ω, CL = 35 pF
30 ns min VS1 = VS2 = 10 V, see Figure 30
Charge Injection, Q
−0.6 pC typ VS = 0 V, RS = 0 Ω, CL = 1 nF, see Figure 32
INJ
Off Isolation −80 dB typ RL = 50 Ω, CL = 5 pF, f = 100 kHz,
Channel-to-Channel Crosstalk −80 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 28
−3 dB Bandwidth 150 MHz typ RL = 50 Ω, CL = 5 pF, see Figure 27
Insertion Loss −6 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 27
CS (Off) 3 pF typ VS = 0 V, f = 1 MHz
CD (Off) 26 pF typ VS = 0 V, f = 1 MHz
CD, CS (On) 30 pF typ VS = 0 V, f = 1 MHz
POWER REQUIREMENTS VDD = +22 V, VSS = −22 V
IDD 50 μA typ Digital inputs = 0 V or VDD
70 110 μA max
ISS 0.001 μA typ Digital inputs = 0 V or VDD
1 μA max
VDD/VSS ±9/±22 V min/max GND = 0 V
1
Guaranteed by design; not subject to production test.
Parameter 25°C −40°C to +85°C −40°C to +125°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 V to VDD V max
On Resistance, RON 340 Ω typ VS = 0 V to 10 V, IS = −1 mA, see Figure 24
500 610 700 Ω max VDD = 10.8 V, VSS = 0 V
On-Resistance Match
Between Channels, ∆R
ON
20 21 22 Ω max
On-Resistance Flatness, R
FLAT(ON)
280 335 370 Ω max
LEAKAGE CURRENTS VDD = 13.2 V, VSS = 0 V
Source Off Leakage, IS (Off) 0.01 nA typ VS = 1 V/10 V, VD = 10 V/1 V, see Figure 23
0.1 0.2 0.4 nA max
Drain Off Leakage, ID (Off) 0.01 nA typ VS = 1 V/10 V, VD = 10 V/1 V, see Figure 23
0.1 0.4 1.2 nA max
Channel On Leakage, ID, IS (On) 0.02 nA typ VS = VD = 1 V/10 V, see Figure 26
0.2 0.5 1.2 nA max
DIGITAL INPUTS
Input High Voltage, V
Input Low Voltage, V
Input Current, I
2.0 V min
INH
0.8 V max
INL
or I
0.002 μA typ VIN = V
INL
INH
±0.1 μA max
Digital Input Capacitance, CIN 3 pF typ
DYNAMIC CHARACTERISTICS1
Transition Time, t
240 ns typ RL = 300 Ω, CL = 35 pF
TRANSITION
350 445 515 ns max VS = 8 V, see Figure 29
tON (EN) 250 ns typ RL = 300 Ω, CL = 35 pF
335 420 485 ns max VS = 8 V, see Figure 31
t
(EN) 160 ns typ RL = 300 Ω, CL = 35 pF
OFF
195 220 240 ns max VS = 8 V, see Figure 31
Break-Before-Make Time Delay, tD 140 ns typ RL = 300 Ω, CL = 35 pF
60 ns min VS1 = VS2 = 8 V, see Figure 30
Charge Injection, Q
−1.2 pC typ VS = 6 V, RS = 0 Ω, CL = 1 nF, see Figure 32
INJ
Off Isolation −80 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 25
Channel-to-Channel Crosstalk −80 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 28
−3 dB Bandwidth 106 MHz typ RL = 50 Ω, CL = 5 pF, see Figure 27
Insertion Loss −11 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 27
CS (Off) 3.5 pF typ VS = 6 V, f = 1 MHz
CD (Off) 29 pF typ VS = 6 V, f = 1 MHz
CD, CS (On) 33 pF typ VS = 6 V, f = 1 MHz
POWER REQUIREMENTS VDD = 13.2 V
IDD 40 μA typ Digital inputs = 0 V or VDD
65 μA max
VDD 9/40 V min/max GND = 0 V, VSS = 0 V
1
Guaranteed by design; not subject to production test.
Parameter 25°C −40°C to +85°C −40°C to +125°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 V to VDD V max
On Resistance, RON 150 Ω typ VS = 0 V to 30 V, IS = −1 mA, see Figure 24
170 215 245 Ω max VDD = 32.4 V, VSS = 0 V
On-Resistance Match
Between Channels, ∆R
ON
8 9 10 Ω max
On-Resistance Flatness, R
FLAT(ON)
50 60 65 Ω max
LEAKAGE CURRENTS VDD = 39.6 V, VSS = 0 V
Source Off Leakage, IS (Off) 0.01 nA typ VS = 1 V/30 V, VD = 30 V/1 V, see Figure 23
0.1 0.2 0.4 nA max
Drain Off Leakage, ID (Off) 0.01 nA typ VS = 1 V/30 V, VD = 30 V/1 V, see Figure 23
0.1 0.4 1.2 nA max
Channel On Leakage, ID, IS (On) 0.02 nA typ VS = VD = 1 V/30 V, see Figure 26
0.2 0.5 1.2 nA max
DIGITAL INPUTS
Input High Voltage, V
Input Low Voltage, V
Input Current, I
2.0 V min
INH
0.8 V max
INL
or I
0.002 μA typ VIN = V
INL
INH
±0.1 μA max
Digital Input Capacitance, CIN 3 pF typ
DYNAMIC CHARACTERISTICS1
Transition Time, t
180 ns typ RL = 300 Ω, CL = 35 pF
TRANSITION
250 275 305 ns max VS = 18 V, see Figure 29
tON (EN) 170 ns typ RL = 300 Ω, CL = 35 pF
220 251 285 ns max VS = 18 V, see Figure 31
t
(EN) 170 ns typ RL = 300 Ω, CL = 35 pF
OFF
210 215 220 ns max VS = 18 V, see Figure 31
Break-Before-Make Time Delay, tD 80 ns typ RL = 300 Ω, CL = 35 pF
30 ns min VS1 = VS2 = 18 V, see Figure 30
Charge Injection, Q
−0.6 pC typ VS = 18 V, RS = 0 Ω, CL = 1 nF, see Figure 32
INJ
Off Isolation −80 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 25
Channel-to-Channel Crosstalk −80 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 28
−3 dB Bandwidth 136 MHz typ RL = 50 Ω, CL = 5 pF, see Figure 27
Insertion Loss −6.7 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 27
CS (Off) 3 pF typ VS = 18 V, f = 1 MHz
CD (Off) 26 pF typ VS = 18 V, f = 1 MHz
CD, CS (On) 30 pF typ VS = 18 V, f = 1 MHz
POWER REQUIREMENTS VDD = 39.6 V
IDD 85 μA typ Digital inputs = 0 V or VDD
100 130 μA max
VDD 9/40 V min/max GND = 0 V, VSS = 0 V
1
Guaranteed by design; not subject to production test.
4.5 Ω typ V
= 0 V to 30 V, IS = −1 mA
S
35 Ω typ VS = 0 V to 30 V, IS = −1 mA
or VDD
GND
Rev. 0 | Page 6 of 20
Page 7
ADG5204
CONTINUOUS CURRENT PER CHANNEL, Sx OR D
Table 5.
Parameter 25°C 85°C 125°C Unit
CONTINUOUS CURRENT, Sx OR D PINS
VDD = +15 V, VSS = −15 V
TSSOP (θJA = 112.6°C/W) 24.5 7.5 2.8 mA max
LFCSP (θJA = 30.4°C/W) 35.7 7.7 2.8 mA max
VDD = +20 V, VSS = −20 V
TSSOP (θJA = 112.6°C/W) 26 7.5 2.8 mA max
LFCSP (θJA = 30.4°C/W) 37 7.7 2.8 mA max
VDD = 12 V, VSS = 0 V
TSSOP (θJA = 112.6°C/W) 18 7 2.8 mA max
LFCSP (θJA = 30.4°C/W) 28 7.7 2.8 mA max
VDD = 36 V, VSS = 0 V
TSSOP (θJA = 112.6°C/W) 30 7.7 2.8 mA max
LFCSP (θJA = 30.4°C/W) 41 7.7 2.8 mA max
Rev. 0 | Page 7 of 20
Page 8
ADG5204
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 6.
Parameter Rating
VDD to VSS 48 V
VDD to GND −0.3 V to +48 V
VSS to GND +0.3 V to −48 V
Analog Inputs1
Digital Inputs1
Peak Current, Sx or D Pins
Continuous Current, Sx or D2 Data + 15%
Operating Temperature Range −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
Thermal Impedance, θJA
16-Lead TSSOP, θJA Thermal
Impedance (4-Layer Board)
16-Lead LFCSP, θJA Thermal
Impedance (4-Layer Board)
Reflow Soldering Peak
Temperature, Pb Free
1
Overvoltages at the Sx and D pins are clamped by internal diodes. Limit
current to the maximum ratings given.
2
See . Table 5
− 0.3 V to VDD + 0.3 V or
V
SS
30 mA, whichever occurs first
− 0.3 V to VDD + 0.3 V or
V
SS
30 mA, whichever occurs first
81 mA (pulsed at 1 ms,
10% duty cycle maximum)
112.6°C/W
30.4°C/W
260(+0/−5)°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating can be applied at any
one time.
ESD CAUTION
Rev. 0 | Page 8 of 20
Page 9
ADG5204
2
V
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
EN
A0
NC
1
A0
2
EN
3
V
SS
4
S1
(Not to Scale)
5
S2
6
D
7
NC
NC = NO CONNECT
ADG5204
TOP VIEW
14
A1
13
GND
12
V
DD
11
S3
10
S4
9
NC
8
NC
09768-002
NOTES
1. NC = NO CONNECT .
. EXPOSED PAD TIED TO SUBSTRATE,
Figure 2. TSSOP Pin Configuration
Table 7. Pin Function Descriptions
Pin No.
TSSOP LFCSP Mnemonic Description
1 15 A0 Logic Control Input.
2 16 EN
Active High Digital Input. When this pin is low, the device is disabled and all switches are off.
When this pin is high, the Ax logic inputs determine the on switches.
3 1 VSS Most Negative Power Supply Potential.
4 3 S1 Source Terminal. Can be an input or an output.
5 4 S2 Source Terminal. Can be an input or an output.
6 6 D Drain Terminal. Can be an input or an output.
7 to 9 2, 5, 7, 8, 13 NC No Connect. These pins are open.
10 9 S4 Source Terminal. Can be an input or an output.
11 10 S3 Source Terminal. Can be an input or an output.
12 11 VDD Most Positive Power Supply Potential.
13 12 GND Ground (0 V) Reference.
14 14 A1 Logic Control Input.
N/A1 EP Exposed Pad
Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder
joints and maximum thermal capability, it is recommended that the pad be soldered to the
.
SS
1
N/A means not applicable.
substrate, V
1V
SS
2NC
3S1
4S2
Figure 3. LFCSP Pin Configuration
A1
14
16
15
ADG5204
TOP VIEW
(Not to Scale)
7
5
6
D
NC
NC
13
8
NC
12 GND
11 V
DD
10 S3
9S4
.
SS
09768-003
TRUTH TABLE
Table 8.
EN A1 A0 S1 S2 S3 S4
0 X1 X1 Off Off Off Off
1 0 0 On Off Off Off
1 0 1 Off On Off Off
1 1 0 Off Off On Off
1 1 1 Off Off Off On
1
X is don’t care.
Rev. 0 | Page 9 of 20
Page 10
ADG5204
TYPICAL PERFORMANCE CHARACTERISTICS
160
TA = 25°C
140
120
VDD = +18V
V
= –18V
SS
160
140
120
TA = 25°C
VDD = 32.4V
V
= 0V
SS
100
V
80
60
ON RESISTANCE (Ω)
40
20
0
–25 –20 –15 –10 –50510152025
Figure 4. R
250
TA = 25°C
200
150
100
ON RESISTANCE ( Ω)
50
0
–20–15–10–505101520
Figure 5. R
500
TA = 25°C
450
400
350
300
250
200
ON RESISTANCE ( Ω)
150
100
50
0
01412108642
Figure 6. R
= +20V
DD
V
= –20V
SS
VS, VD (V)
as a Function of VD or VS, Dual Supply
ON
VDD = +16.5V
V
= –16.5V
SS
VDD = +15V
V
= –15V
SS
VS, VD (V)
as a Function of VD or VS, Dual Supply
ON
VDD = 9V
V
= 0V
SS
VDD = 10.8V
V
SS
VS, VD (V)
as a Function of VD or VS, Single Supply
ON
= +22V
V
DD
V
= –22V
SS
VDD = +9V
V
= –9V
SS
VDD = +13.2V
V
= –13.2V
SS
= 0V
VDD = 12V
V
= 0V
SS
VDD = 13.2V
V
= 0V
SS
100
80
60
ON RESISTANCE (Ω)
40
20
0
043530252015105
09768-104
09768-105
Figure 7. R
250
VDD = +15V
V
SS
200
150
100
ON RESISTANCE ( Ω)
50
0
–15–10–5051015
Figure 8. R
as a Function of VD or VS, Single Supply
ON
= –15V
as a Function of VD or VS, for Different Temperatures,
ON
VDD = 36V
V
= 0V
SS
VS, VD (V)
TA = +125°C
T
= +85°C
A
= +25°C
T
A
T
= –40°C
A
VS,VD (V)
VDD = 39.6V
V
= 0V
SS
0
09768-107
09768-108
±15 V Dual Supply
200
180
160
140
120
100
80
ON RESISTANCE ( Ω)
60
40
20
VDD = +20V
V
= –20V
SS
0
–20–15–10–505102015
09768-106
Figure 9. R
as a Function of VD or VS, for Different Temperatures,
ON
T
= +125°C
A
T
= +85°C
A
= +25°C
T
A
= –40°C
T
A
VS,VD (V)
09768-109
±20 V Dual Supply
Rev. 0 | Page 10 of 20
Page 11
ADG5204
500
450
= +125°C
400
340
T
A
T
A
= +85°C
300
= +25°C
T
250
200
ON RESISTANCE ( Ω)
150
A
= –40°C
T
A
100
50
VDD = 12V
V
= 0V
SS
0
024681012
VS,VD (V)
Figure 10. R
as a Function of VD or VS for Different Temperatures,
ON
12 V Single Supply
250
VDD = 36V
= 0V
V
SS
200
T
= +125°C
150
100
ON RESISTANCE (Ω)
A
T
= +85°C
A
= +25°C
T
A
T
= –40°C
A
50
0
03530252015105
VS,VD (V)
Figure 11. R
as a Function of VD or VS for Different Temperatures,
ON
36 V Single Supply
10
ID (OFF) – +
I
D,IS
(ON) + +
0
–10
(OFF) + –
I
–20
–30
D
(ON) – –
I
D,IS
–40
LEAKAGE CURRENT (p A)
–50
VDD = +15V
–60
V
= –15V
SS
V
= +10V/–10V
BIAS
–70
020406080100120
TEMPERATURE (°C)
I
(OFF) + –
S
(OFF) – +
I
S
Figure 12. Leakage Current vs. Temperature, ±15 V Dual Supply
09768-110
09768-111
09768-112
100
I
(OFF) + –
S
I
D,IS
(ON) + +
I
(OFF) – +
D
50
0
(OFF) – +
I
S
–50
I
(OFF) + –
–100
LEAKAGE CURRENT (p A)
–150
VDD = +20V
V
= –20V
SS
V
= +15V/–15V
BIAS
–200
020406080100120
D
I
(ON) – –
D,IS
TEMPERATURE (°C)
Figure 13. Leakage Current vs. Temperature, ±20 V Dual Supply
40
20
0
–20
–40
–60
LEAKAGE CURRENT (p A)
–80
VDD = 12V
–100
V
= 0V
SS
V
= 1V/10V
BIAS
–120
0 20406080100120
(OFF) + –
I
S
I
(OFF) – +
S
I
D,IS
TEMPERATURE ( °C)
(ON) + +
I
(OFF) + –
D
I
D,IS
I
(OFF) – +
D
(ON) – –
Figure 14. Leakage Current vs. Temperature, 12 V Single Supply
50
I
(OFF) – +
D
ID,IS (ON) + +
0
–50
–100
I
(OFF) + –
–150
D
LEAKAGE CURRENT (p A)
–200
VDD = 36V
V
= 0V
SS
V
= 1V/30V
BIAS
–250
0 20406080100120
TEMPERATURE ( °C)
I
D,IS
I
(OFF) + –
S
(OFF) – +
I
S
(ON) – –
Figure 15. Leakage Current vs. Temperature, 36 V Single Supply
09768-113
09768-114
09768-115
Rev. 0 | Page 11 of 20
Page 12
ADG5204
0
TA = 25°C
V
DD
V
SS
–20
= +15V
= –15V
350
300
–40
–60
–80
OFF ISOLATION (dB)
–100
–120
10k100k1M10M100M1G
FREQUENCY (Hz)
Figure 16. Off Isolation vs. Frequency, ±15 V Dual Supply
0
TA = 25°C
V
= +15V
DD
V
= –15V
SS
–20
–40
BETWEEN S1 AND S2
–60
CROSSTALK (dB)
–80
BETWEEN S1 AND S4
–100
–120
10k100k1M10M100M1G
FREQUENCY (Hz)
Figure 17. Crosstalk vs. Frequency, ±15 V Dual Supply
2.5
TA = 25°C
2.0
1.5
1.0
0.5
0
–0.5
–1.0
CHARGE INJECTI ON (pC)
–1.5
–2.0
–2.5
–20–10010203040
V
V
DD
SS
= +15V
= –15V
V
V
V
V
DD
V
S
= +20V
DD
= –20V
SS
= +12V
= 0V
SS
(V)
V
DD
V
SS
Figure 18. Charge Injection vs. Source Voltage
= +36V
= 0V
250
VDD = +12V
V
= 0V
SS
200
150
TIME (ns)
V
V
DD
SS
= +20V
= –20V
100
50
0
–40–20020406080100120
09768-116
V
V
TEMPERATURE (°C)
DD
SS
V
V
= +15V
= –15V
DD
SS
= +36V
= 0V
09768-120
Figure 19. Transition Time vs. Temperature
0
TA = 25°C
V
= +15V
DD
V
= –15V
SS
–20
–40
–60
ACPSRR (dB)
–80
–100
–120
1k10k100k1M10M
09768-117
NO DECOUPLING CAPACITORS
DECOUPLING CAPACITORS
FREQUENCY (Hz)
09768-121
Figure 20. ACPSRR vs. Frequency, ±15 V Dual Supply
40
TA = 25°C
V
= +15V
DD
35
V
= –15V
SS
30
25
20
15
CAPACITANCE (pF )
10
5
0
–15–10–5051015
09768-119
SOURCE/DRAIN ON
DRAIN OFF
SOURCE OFF
V
(V)
S
09768-123
Figure 21. Capacitance vs. Source Voltage, Dual Supply
Rev. 0 | Page 12 of 20
Page 13
ADG5204
0
TA = 25°C
V
= +15V
DD
–2
V
= –15V
SS
–4
–6
–8
–10
–12
ATTENUATION (dB)
–14
–16
–18
–20
100k1M10M100M1G
FREQUENCY (Hz)
Figure 22. Bandwidth
09768-125
Rev. 0 | Page 13 of 20
Page 14
ADG5204
V
V
V
V
V
V
V
V
TEST CIRCUITS
IS (OFF)ID (OFF)
AA
SxD
NC
SxD
ID (ON)
A
0.1µF
S
S
DD
V
DDVSS
Sx
GND
Figure 23. Off Leakage
V
SxD
Figure 24. On Resistance
SS
0.1µF
50Ω
D
V
D
09768-006
DD
0.1µF
V
DDVSS
Sx
I
DS
09768-005
NC = NO CONNECT
Figure 26. On Leakage
SS
0.1µF
D
GND
INSERTION LOSS = 20 log
V
D
NETWORK
ANALYZER
50Ω
R
L
50Ω
V
WITH SWITCH
OUT
V
WITHOUT SWITCH
OUT
09768-007
V
S
V
OUT
09768-009
Figure 27. Bandwidth
DD
GND
SS
0.1µF
V
SS
D
R
L
50Ω
NETWORK
ANALYZER
50Ω
V
OUT
R
L
50Ω
0.1µF
NETWORK
ANALYZER
V
OUT
R
L
50Ω
V
S
V
S
V
DD
S1
S2
OFF ISOLATION = 20 log
Figure 25. Off Isolation
V
OUT
V
S
09768-008
CHANNEL-TO-CHANNEL CROSSTALK = 20 log
Figure 28. Channel-to-Channel Crosstalk
V
OUT
V
S
09768-010
Rev. 0 | Page 14 of 20
Page 15
ADG5204
V
VDDV
V
VDDV
0.1µF
V
IN
2.4V
A1
A0
EN
V
DD
SS
0.1µF
V
V
DD
SS
S1
S2
V
S1
ADDRESS
DRIVE (VIN)
S3
GND
S4
D
R
L
300Ω
V
S4
V
OUT
C
L
35pF
3V
0V
V
OUT
50%50%
90%
t
TRANSITION
t
TRANSITI ON
90%
09768-012
Figure 29. Address to Output Switching Times
SS
VDDV
0.1µF
SS
S1
S2
V
S1
ADDRESS
DRIVE (V
3V
)
IN
0V
S3
0.1µF
A1
V
IN
300Ω
A0
S4
50%50%
t
ON
80%
0.9V
(EN)
2.4V
EN
GND
D
R
L
300Ω
Figure 30. Break-Before-Make Time Delay, t
V
DD
SS
VDDV
GND
0.1µF
SS
S1
S2
S3
S4
D
R
L
300Ω
0.1µF
A1
A0
EN
V
IN
300Ω
V
OUT
C
L
35pF
ENABLE
V
S
C
L
35pF
DRIVE (V
OUTPUT
V
OUT
V
OUT
D
3V
)
IN
0V
V
OUT
0V
OUT
80%
t
D
0.1V
OUT
t
(EN)
OFF
09768-013
09768-014
Figure 31. Enable-to-Output Switching Delay
SS
V
V
R
S
V
S
DD
SxD
DECODER
SS
V
OUT
C
L
1nF
V
OUT
V
Q
= CL × ∆V
INJ
IN
SW OFF
OUT
∆V
OUT
SW OFF
SW ON
GND
SW OFF
V
A2A1
IN
EN
SW OFF
09768-015
Figure 32. Charge Injection
Rev. 0 | Page 15 of 20
Page 16
ADG5204
TERMINOLOGY
IDD
The positive supply current.
I
SS
The negative supply current.
V
, VS
D
The analog voltage on Terminal D and Terminal S.
R
ON
The ohmic resistance between Terminal D and Terminal S.
R
Flatness that is defined as the difference between the maximum
and minimum value of on resistance measured over the specified
analog signal range.
I
The source leakage current with the switch off.
I
The drain leakage current with the switch off.
I
The channel leakage current with the switch on.
V
The maximum input voltage for Logic 0.
V
The minimum input voltage for Logic 1.
I
The input current of the digital input.
C
The off switch source capacitance, which is measured with
reference to ground.
C
The off switch drain capacitance, which is measured with
reference to ground.
C
The on switch capacitance, which is measured with reference to
ground.
FLAT(ON)
(Off)
S
(Off)
D
, IS (On)
D
INL
INH
, I
INL
INH
(Off)
S
(Off)
D
(On), CS (On)
D
C
IN
The digital input capacitance.
t
TRANSITION
The delay time between the 50% and 90% points of the digital
input and switch-on condition when switching from one address
state to another.
t
(EN)
ON
The delay between applying the digital control input and the
output switching on. See Figure 31.
t
(EN)
OFF
The delay between applying the digital control input and the
output switching off. See Figure 31.
Charge Injection
A measure of the glitch impulse transferred from the digital
input to the analog output during switching.
Off Isolation
A measure of unwanted signal coupling through an off switch.
Crosstalk
A measure of unwanted signal that is coupled through from one
channel to another as a result of parasitic capacitance.
Bandwidth
The frequency at which the output is attenuated by 3 dB.
On Response
The frequency response of the on switch.
Insertion Loss
The loss due to the on resistance of the switch.
ACPSRR (AC Power Supply Rejection Ratio)
The ratio of the amplitude of signal on the output to the amplitude
of the modulation. This is a measure of the ability of the device
to avoid coupling noise and spurious signals that appear on the
supply voltage pins to the output of the switch. The dc voltage on
the device is modulated by a sine wave of 0.62 V p-p.
Rev. 0 | Page 16 of 20
Page 17
ADG5204
TRENCH ISOLATION
In the ADG5204, an insulating oxide layer (trench) is placed
between the NMOS and the PMOS transistors of each CMOS
switch. Parasitic junctions, which occur between the transistors
in junction isolated switches, are eliminated, and the result is a
completely latch-up proof switch.
In junction isolation, the N and P wells of the PMOS and
NMOS transistors form a diode that is reverse-biased under
normal operation. However, during overvoltage conditions, this
diode can become forward-biased. A silicon controlled rectifier
(SCR) type circuit is formed by the two transistors causing a
significant amplification of the current that, in turn, leads to
latch-up. By using trench isolation, this diode is removed, and
the result is a latch-up proof switch.
NMOSPMOS
P WELLN WELL
TRENCH
BURIED OXIDE L AYER
HANDLE WAFER
Figure 33. Trench Isolation
09768-004
Rev. 0 | Page 17 of 20
Page 18
ADG5204
APPLICATIONS INFORMATION
The ADG52xx family of switches and multiplexers provide a
robust solution for instrumentation, industrial, automotive,
aerospace, and other harsh environments that are prone to
latch-up, which is an undesirable high current state that can
lead to device failure and persists until the power supply is
turned off. The ADG5204 high voltage multiplexer allows
single-supply operation from 9 V to 40 V and dual-supply
operation from ±9 V to ±22 V.
Rev. 0 | Page 18 of 20
Page 19
ADG5204
S
OUTLINE DIMENSIONS
5.10
5.00
4.90
4.50
4.40
4.30
PIN 1
1.05
1.00
0.80
0.15
0.05
COPLANARITY
0.10
14
1
0.65 BSC
0.30
0.19
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
8
6.40
BSC
7
1.20
0.20
MAX
SEATING
PLANE
0.09
8°
0°
0.75
0.60
0.45
061908-A
Figure 34. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
PIN 1
INDICATOR
0.80
0.75
0.70
EATING
PLANE
4.10
4.00 SQ
3.90
0.65
BSC
0.45
0.40
0.35
0.05 MAX
0.02 NOM
0.20 REF
0.35
0.30
0.25
13
12
9
8
BOTTOM VIEWTOP VIEW
COPLANARITY
0.08
N
1
P
I
D
C
I
N
I
16
EXPOSED
1
PAD
4
5
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
2.70
2.60 SQ
2.50
0.20 MIN
R
O
A
T
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGC.
08-16-2010-C
Figure 35. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-16-17)
Dimensions shown in millimeters
ORDERING GUIDE
Model1 Temperature Range Package Description Package Option
ADG5204BRUZ −40°C to +125°C 14-Lead Thin Shrink Small Outline Package [TSSOP] RU-14
ADG5204BRUZ-RL7 −40°C to +125°C 14-Lead Thin Shrink Small Outline Package [TSSOP] RU-14
ADG5204BCPZ-RL7 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-16-17