FEATURES
Low On Resistance (4 V)
On Resistance Flatness 0.2 V
44 V Supply Maximum Ratings
615 V Analog Signal Range
Fully Specified @ 65 V, +12 V, 615 V
Ultralow Power Dissipation (18 mW)
ESD 2 kV
Continuous Current 100 mA
Fast Switching Times
70 ns
t
O
N
60 ns
t
OFF
TTL/CMOS Compatible
Pin Compatible Upgrade for ADG411/ADG412/ADG413
and ADG431/ADG432/ADG433
APPLICATIONS
Relay Replacement
Audio and Video Switching
Automatic Test Equipment
Precision Data Acquisition
Battery Powered Systems
Sample Hold Systems
Communication Systems
PBX, PABX Systems
Avionics
5 V RON SPST Switches
ADG451/ADG452/ADG453
FUNCTIONAL BLOCK DIAGRAMS
IN1
IN2
ADG451
IN3
IN4
SWITCHES SHOWN FOR A LOGIC "1" INPUT
S1
D1
S2
D2
S3
D3
S4
D4
IN1
IN2
ADG453
IN3
IN4
IN1
IN2
ADG452
IN3
IN4
S1
D1
S2
D2
S3
D3
S4
D4
S1
D1
S2
D2
S3
D3
S4
D4
GENERAL DESCRIPTION
The ADG451, ADG452 and ADG453 are monolithic CMOS
devices comprising four independently selectable switches. They
are designed on an enhanced LC
2
MOS process that provides
low power dissipation yet gives high switching speed and low on
resistance.
The on resistance profile is very flat over the full analog input
range ensuring excellent linearity and low distortion when
switching audio signals. Fast switching speed coupled with high
signal bandwidth also make the parts suitable for video signal
switching. CMOS construction ensures ultralow power dissipation making the parts ideally suited for portable and battery
powered instruments.
The ADG451, ADG452 and ADG453 contain four independent single-pole/single-throw (SPST) switches. The ADG451
and ADG452 differ only in that the digital control logic is inverted. The ADG451 switches are turned on with a logic low on
the appropriate control input, while a logic high is required for
the ADG452. The ADG453 has two switches with digital control logic similar to that of the ADG451 while the logic is inverted on the other two switches.
Each switch conducts equally well in both directions when ON
and has an input signal range which extends to the supplies. In
the OFF condition, signal levels up to the supplies are blocked.
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
The ADG453 exhibits break-before-make switching action for
use in multiplexer applications. Inherent in the design is low charge
injection for minimum transients when switching the digital inputs.
PRODUCT HIGHLIGHTS
1. Low RON (5 Ω max)
2. Ultralow Power Dissipation
3. Extended Signal Range
The ADG451, ADG452 and ADG453 are fabricated on an
enhanced LC
2
MOS process giving an increased signal
range that fully extends to the supply rails.
4. Break-Before-Make Switching
This prevents channel shorting when the switches are
configured as a multiplexer. (ADG453 only.)
5. Single Supply Operation
For applications where the analog signal is unipolar, the
ADG451, ADG452 and ADG453 can be operated from a
single rail power supply. The parts are fully specified with a
single +12 V power supply and will remain functional with
single supplies as low as +5.0 V.
6. Dual Supply Operation
For applications where the analog signal is bipolar, the
ADG451, ADG452 and ADG453 can be operated from a
dual power supply ranging from ±4.5 V to ±20 V.
ADG451BN–40°C to +85°CN-16
ADG451BR–40°C to +85°CR-16A
ADG452BN–40°C to +85°CN-16
ADG452BR–40°C to +85°CR-16A
ADG453BN–40°C to +85°CN-16
ADG453BR–40°C to +85°CR-16A
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2
Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG451/ADG452/ADG453 feature proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
REV. A
–5–
Page 6
ADG451/ADG452/ADG453
TERMINOLOGY
V
DD
V
SS
Most positive power supply potential.
Most negative power supply potential in dual
supplies. In single supply applications, it may be
connected to GND.
V
L
Logic power supply (+5 V).
GNDGround (0 V) reference.
SSource terminal. May be an input or output.
DDrain terminal. May be an input or output.
INLogic control input.
R
ON
∆R
ON
R
FLAT(ON)
Ohmic resistance between D and S.
On resistance match between any two channels
i.e., R
max – RONmin.
ON
Flatness is defined as the difference between the
maximum and minimum value of on-resistance as
measured over the specified analog signal range.
I
(OFF)Source leakage current with the switch “OFF.”
S
(OFF)Drain leakage current with the switch “OFF.”
I
D
ID, IS (ON)Channel leakage current with the switch “ON.”
VD (VS)Analog voltage on terminals D, S.
(OFF)“OFF” switch source capacitance.
C
S
(OFF)“OFF” switch drain capacitance.
C
D
, CS (ON) “ON” switch capacitance.
C
D
t
ON
Delay between applying the digital control input
and the output switching on. See Test Circuit 4.
t
OFF
Delay between applying the digital control input
and the output switching off.
t
D
“OFF” time or “ON” time measured between
the 90% points of both switches, when switching
from one address state to another. See Test
Circuit 5.
CrosstalkA measure of unwanted signal coupled through
from one channel to another as a result of parasitic capacitance.
Off IsolationA measure of unwanted signal coupling through
an “OFF” switch.
ChargeA measure of the glitch impulse transferred
Injectionfrom the digital input to the analog output dur-
ing switching.
9
8
7
6
5
– V
ON
R
4
3
2
1
0
–16.5
–13.5
–10.5
VD OR VS DRAIN OR SOURCE VOLTAGE – V
–7.5
VDD = +5V
V
SS
–4.5
= –5V
VDD = +13.5V
= –13.5V
V
SS
VDD = +15V
= –15V
V
SS
1.5
–1.5
4.5
Figure 1. On Resistance as a Function of VD (VS)
for Various Dual Supplies
TA = +258C
V
= +5V
L
VDD = +16.5V
V
= –16.5V
SS
7.5
10.5
13.5
16.5
7
6
5
4
– V
ON
3
R
2
1
0
–15
+858C
+258C
–408C
–10–5
V
OR VS DRAIN OR SOURCE VOLTAGE – V
D
0510
VDD = +15V
V
= –15V
SS
V
= +5V
L
Figure 2. On Resistance as a Function of VD (VS)
for Different Temperatures with Dual Supplies
15
–6–
REV. A
Page 7
Typical Performance Characteristics–
LEAKAGE CURRENT – nA
0.5
–15
–12
0.4
0.3
0.2
–0.2
–0.3
–0.4
–0.5
0.1
0
–0.1
ID(ON)
V
D
OR VS DRAIN OR SOURCE VOLTAGE – V
ID(OFF)
IS(OFF)
–9
–6–315
12
9630
VDD = +15V
V
SS
= –15V
T
A
= +258C
V
L
= +5V
ADG451/ADG452/ADG453
16
VDD = +5V
14
V
= 0V
SS
12
10
– V
8
ON
R
6
4
2
0
0
VDD = +13.5V
V
= 0V
SS
3
V
OR VS DRAIN OR SOURCE VOLTAGE – V
D
V
= +15V
DD
V
= 0V
SS
6
9
VDD = +16.5V
V
= 0V
SS
1215
TA = +258C
V
= +5V
L
18
Figure 3. On Resistance as a Function of VD (VS) for
Various Single Supplies
10
VDD = +15V
V
= –15V
SS
V
= +5V
L
V
= +15V
D
V
= –15V
S
1.0
ID(ON)
12
11
10
9
8
7
– V
6
ON
R
5
4
3
2
1
0
VDD = +15V
VSS = 0V
VL = +5V
0
2468
VD OR VS DRAIN OR SOURCE VOLTAGE – V
10
1214
Figure 6. On Resistance as a Function of VD (VS)
for Different Temperatures with Single Supplies
+858C
+258C
–408C
16
Figure 4. Leakage Currents as a Function of Temperature
Figure 5. Supply Current vs. Input Switching Frequency
REV. A
0.1
ID(OFF)
LEAKAGE CURRENT – nA
0.01
25
100k
VDD = +15V
V
10k
SS
V
SS
1k
100
– mA
10
SUPPLY
I
1.0
0.1
0.01
101001k10k100k1M10M
IS(OFF)
354555657585
= –15V
= +5V
TEMPERATURE – 8C
I+, I
+
I
FREQUENCY – Hz
4SW
L
1SW
–7–
Figure 7. Leakage Currents as a Function of VD (VS)
70
60
50
40
30
OFF ISOLATION – dB
20
10
0
1
10
FREQUENCY – MHz
VDD = +15V
V
= –15V
SS
V
= +5V
L
100
Figure 8. Off Isolation vs. Frequency
Page 8
ADG451/ADG452/ADG453
120
100
80
60
40
CROSSTALK – dB
20
0
10010k100k1M10M
1k
FREQUENCY – Hz
VDD = 115V
VSS = –15V
VL = 15V
R
= 50V
LOAD
100M
Figure 9. Crosstalk vs. Frequency
0
–0.5
–1.0
–1.5
–2.0
LOSS – dB
–2.5
–3.0
–3.5
1
10
FREQUENCY – MHz
VDD = 115V
V
= –15V
SS
V
= 15V
L
100
Figure 10. Frequency Response with Switch On
200
APPLICATION
Figure 11 illustrates a precise, fast, sample-and-hold circuit.
An AD845 is used as the input buffer while the output
operational amplifier is an AD711. During the track mode,
SW1 is closed and the output V
V
. In the hold mode, SW1 is opened and the signal is
IN
held by the hold capacitor C
+5V
+15V
SW2
D
AD845
S
S
SW1
ADG451/
452/453
D
–15V
+15V
V
IN
–15V
follows the input signal
OUT
.
H
2200pF
C
C
1000pF
R
C
75V
CH
2200pF
+15V
AD711
–15V
V
OUT
Figure 11. Fast, Accurate Sample-and-Hold Circuit
Due to switch and capacitor leakage, the voltage on the
hold capacitor will decrease with time. The ADG451/
ADG452/ADG453 minimizes this droop due to its low
leakage specifications. The droop rate is further minimized
by the use of a polystyrene hold capacitor. The droop rate
for the circuit shown is typically 30 µV/µs.
A second switch, SW2, that operates in parallel with SW1, is
included in this circuit to reduce pedestal error. Since both
switches will be at the same potential, they will have a differential effect on the op amp AD711, which will minimize
charge injection effects. Pedestal error is also reduced by the
compensation network R
and CC. This compensation net-
C
work reduces the hold time glitch while optimizing the acquisition time. Using the illustrated op amps and component
values, the pedestal error has a maximum value of 5mV over
the ±10 V input range. Both the acquisition and settling
times are 850 ns.
–8–
REV. A
Page 9
Test Circuits
ADG451/ADG452/ADG453
I
DS
V
1
IS(OFF)IS(OFF)
ID(ON)
V
S
RON = V1/I
DS
Test Circuit 1. On Resistance
+15V
0.1mF
V
S
V
S
IN
V
IN
GND
DD
0.1mF
+5V
V
D
V
–15V
V
S
Test Circuit 2. Off Leakage
0.1mF
L
V
R
L
300V
SS
C
L
35pF
Test Circuit 4. Switching Times
OUT
V
D
V
S
V
D
Test Circuit 3. On Leakage
3V
ADG451
V
IN
V
IN
ADG452
V
OUT
50%
3V
50%50%
90%90%
t
ON
t
50%
OFF
+15V
0.1mF0.1mF
V
IN
S1
S2
IN1, IN2
GND
V
S1
V
S2
V
DD
ADG453
0.1mF
+5V
V
V
–15V
3V
L
D1
R
D2
R
L2
300V
SS
C
L2
35pF
V
OUT2
L1
300V
C
L1
35pF
V
OUT1
V
V
V
OUT1
OUT2
IN
0V
0V
0V
50%
90%
90%90%
t
D
50%
90%
t
D
Test Circuit 5. Break-Before-Make Time Delay
REV. A
–9–
Page 10
ADG451/ADG452/ADG453
R
S
V
S
IN
+15V
V
S
GND
+5V
V
L
D
V
–15V
DD
C
L
10nF
V
OUT
Test Circuit 6. Charge Injection
3V
V
IN
V
OUT
VIN = CL 3 DV
OUT
DV
OUT
+15V
SD
V
S
IN
V
GND
IN
+5V
0.1mF0.1mF
V
DD
0.1mF
V
V
SS
–15V
L
V
OUT
R
L
50V
Test Circuit 7. Off Isolation
0.1mF
+5V+15V
V
–15V
V
IN2
D
SS
CHANNEL-TO-CHANNEL
CROSSTALK = 20 3 LOG|V
50V
NC
S/VOUT
|
0.1mF0.1mF
SD
V
V
S
V
OUT
IN1
R
L
50V
S
GND
Test Circuit 8. Channel-to-Channel Crosstalk
–10–
REV. A
Page 11
16
18
9
0.840 (21.34)
0.745 (18.92)
0.280 (7.11)
0.240 (6.10)
PIN 1
SEATING
PLANE
0.022 (0.558)
0.014 (0.356)
0.060 (1.52)
0.015 (0.38)
0.210 (5.33)
MAX
0.130
(3.30)
MIN
0.070 (1.77)
0.045 (1.15)
0.100
(2.54)
BSC
0.160 (4.06)
0.115 (2.93)
0.325 (8.26)
0.300 (7.62)
0.015 (0.381)
0.008 (0.204)
0.195 (4.95)
0.115 (2.93)
0.1574 (4.00)
0.1497 (3.80)
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
16-Lead Plastic DIP
(N-16)
16-Lead SOIC
(R-16A)
0.3937 (10.00)
0.3859 (9.80)
169
0.2440 (6.20)
81
0.2284 (5.80)
ADG451/ADG452/ADG453
REV. A
0.0098 (0.25)
0.0040 (0.10)
SEATING
PLANE
PIN 1
0.0500
(1.27)
BSC
0.0688 (1.75)
0.0532 (1.35)
0.0192 (0.49)
0.0138 (0.35)
–11–
0.0099 (0.25)
0.0075 (0.19)
0.0196 (0.50)
0.0099 (0.25)
88
08
0.0500 (1.27)
0.0160 (0.41)
x 458
Page 12
C3119a–0–2/98
–12–
PRINTED IN U.S.A.
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