Low on resistance (<70 Ω)
Low ∆RON (9 Ω max)
Low R
Low power dissipation
Fast switching times
Low leakage currents (3 nA max)
Low charge injection (6 pC max)
Break-before-make switching action
Latch-up proof A grade
Plug-in upgrade for DG201A/ADG201A, DG202A/ADG202A,
Plug-in replacement for DG441/DG442/DG444
APPLICATIONS
Audio and video switching
Automatic test equipment
Precision data acquisition
Battery-powered systems
Sample-and-hold systems
Communication systems
GENERAL DESCRIPTION
The ADG441, ADG442, and ADG444 are monolithic CMOS
devices that comprise of four independently selectable switches.
They are designed on an enhanced LC
provides low power dissipation yet gives high switching speed
and low on resistance.
The on resistance profile is very flat over the full analog input
range, which ensures good linearity and low distortion when
switching audio signals. High switching speed also makes the
parts suitable for video signal switching. CMOS construction
ensures ultralow power dissipation, making the parts ideally
suited for portable and battery-powered instruments. The
ADG441, ADG442, and ADG444 contain four independent
SPST switches. Each switch of the ADG441 and ADG444 turns
on when a logic low is applied to the appropriate control input.
The ADG442 switches are turned on with logic high on the
appropriate control input. The ADG441 and ADG444 switches
match (3 Ω max)
ON
< 110 ns
t
ON
t
< 60 ns
OFF
DG211/ADG211A
2
MOS process that
ADG441/ADG442/ADG444
FUNCTIONAL BLOCK DIAGRAM
S1
IN1
IN2
ADG441
ADG444
IN3
IN4
SWITCHES SHOWN FOR A LOGIC 1 INPUT
IN1
D1
S2
IN2
D2
S3
IN3
D3
S4
IN4
D4
Figure 1.
ADG442
differ in that the ADG444 requires a 5 V logic power supply
that is applied to the V
have a V
pin, the logic power supply is generated internally by
L
pin. The ADG441 and ADG442 do not
L
an on-chip voltage generator.
Each switch conducts equally well in both directions when ON
and has an input signal range that extends to the power
supplies. In the OFF condition, signal levels up to the supplies
are blocked. All switches exhibit break-before-make switching
action for use in multiplexer applications. Inherent in the
design is the low charge injection for minimum transients when
switching the digital inputs.
PRODUCT HIGHLIGHTS
1. Extended signal range. The ADG441A/ADG442A/
ADG444A are fabricated on an enhanced LC
isolated process, giving an increased signal range that
extends to the supply rails.
2. Low power dissipation.
3. Low R
4. Trench isolation guards against latch-up for A grade parts. A
dielectric trench separates the P and N channel transistors
thereby preventing latch-up even under severe overvoltage
conditions.
5. Break-before-make switching. This prevents channel
shorting when the switches are configured as a multiplexer.
6. Single-supply operation. For applications where the analog
signal is unipolar, the ADG441/ADG442/ADG444 can be
operated from a single-rail power supply. The parts are fully
specified with a single 12 V power supply.
ON
.
S1
D1
S2
D2
S3
D3
S4
D4
2
MOS, trench-
05233-001
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
VDD = +15 V ± 10%, VSS = −15 V ± 10%, VL = +5 V ± 10% (ADG444), GND = 0 V, unless otherwise noted.
Table 1.
B Version
Parameter +25°C −40°C to +85°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range VSS to VDD V
RON 40 Ω typ VD = ±8.5 V, IS = −10 mA
70 85 Ω max VDD = +13.5 V, VSS = −13.5 V
∆RON 4 Ω typ −8.5 V ≤ VD ≤ +8.5 V
9 Ω max
RON Match 1 Ω typ VD = 0 V, IS = −10 mA
3 Ω max
LEAKAGE CURRENTS VDD = +16.5 V, VSS = −16.5 V
Source OFF Leakage IS (OFF) ±0.01 nA typ
±0.5 ±3 nA max See Figure 15
Drain OFF Leakage ID (OFF) ±0.01 nA typ
±0.5 ±3 nA max See Figure 15
Channel ON Leakage ID, IS (ON) ±0.08 nA typ VS = VD = ±15.5 V
±0.5 ±3 nA max See Figure 16
DIGITAL INPUTS
Input High Voltage, V
Input Low Voltage, V
Input Current
I
or I
INL
±0.5 µA max
DYNAMIC CHARACTERISTICS
tON 85 ns typ RL = 1 kΩ, CL = 35 pF;
110 170 ns max VS = ±10 V; see Figure 17
t
45 ns typ RL = 1 kΩ, CL = 35 pF;
OFF
60 80 ns max VS = ±10 V; see Figure 17
t
30 ns typ RL = 1 kΩ, CL = 35 pF;
OPEN
Charge Injection 1 pC typ VS = 0 V, RS = 0 Ω, CL = 1 nF;
6 pC max VDD = +15 V, VSS = –15 V; see Figure 18
OFF Isolation 60 dB typ RL = 50 Ω, CL = 5 pF; f = 1 MHz; see Figure 19
Channel-to-Channel Crosstalk 100 dB typ RL = 50 Ω, CL = 5 pF; f= 1 MHz; see Figure 20
CS (OFF) 4 pF typ f = 1 MHz
CD (OFF) 4 pF typ f = 1 MHz
CD, CS (ON) 16 pF typ f = 1 MHz
POWER REQUIREMENTS VDD = +16.5 V, VSS = −16.5 V
I
DD
ADG441/ADG442 80 µA max
ADG444 0.001 µA typ
1 2.5 µA max
ISS 0.0001 µA typ 1 2.5 µA max
IL (ADG444 Only) 0.001 µA typ VL = 5.5 V
1 2.5 µA max
1
Temperature range is: B Version: −40°C to +85°C.
2
Guaranteed by design, not subject to production test.
Parameter +25°C −40°C to +85°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 to VDD V
RON 70 Ω typ VD = +3 V, +8 V, IS = −5 mA
110 130 Ω max VDD = 10.8 V
∆RON 4 Ω typ 3 V ≤ VD ≤ 8 V
9 Ω max
RON Match 1 Ω typ VD = +6 V, IS = −5 mA
3 Ω max
LEAKAGE CURRENT VDD = 13.2 V
Source OFF Leakage IS (OFF) ±0.01 nA typ VD = 12.2 V/1 V, VS = 1 V/12.2 V
±0.5 ±3 nA max See Figure 15
Drain OFF Leakage ID (OFF) ±0.01 nA typ VD = 12.2 V/1 V, VS = 1 V/12.2 V
±0.5 ±3 nA max See Figure 15
Channel ON Leakage ID, IS (ON) ±0.08 nA typ VS = VD = 12.2 V/1 V
±0.5 ±3 nA max Figure 16
DIGITAL INPUTS
Input High Voltage, V
Input Low Voltage, V
2.4 V min
INH
0.8 V max
INL
Input Current
I
or I
±0.00001 µA typ VIN = V
INL
INH
INL
or V
INH
±0.5 µA max
DYNAMIC CHARACTERISTICS
2
tON 105 ns typ RL = 1 kΩ, CL = 35 pF
150 220 ns max VS = 8 V; Figure 17
t
40 ns typ RL = 1 kΩ, CL = 35 pF
OFF
60 100 ns max VS = 8 V; Figure 17
t
50 ns typ RL = 1 kΩ, CL = 35 pF
OPEN
Charge Injection 2 pC typ VS = 6 V, RS = 0 Ω, CL = 1 nF
6 pC max VDD = 12 V, VSS = 0 V; see Figure 18
OFF Isolation 60 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 19
Channel-to-Channel Crosstalk 100 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 20
CS (OFF) 7 pF typ f = 1 MHz
CD (OFF) 10 pF typ f = 1 MHz
CD, CS (ON) 16 pF typ f = 1 MHz
POWER REQUIREMENTS VDD = 13.2 V
IDD Digital Inputs = 0 V or 5 V
ADG441/ADG442 80 µA max
ADG444 0.001 µA typ
1 2.5 µA max
IL (ADG444 Only) 0.001 µA typ VL = 5.5 V
1 2.5 µA max
1
Temperature range is: B Version: −40°C to +85°C.
2
Guaranteed by design, not subject to production test.
Rev. A | Page 4 of 16
Page 5
ADG441/ADG442/ADG444
www.BDTIC.com/ADI
ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise noted.
Table 3.
Parameter Rating
VDD to V
SS
VDD to GND −0.3 V to +25 V
VSS to GND +0.3 V to −25 V
VL to GND −0.3 V to VDD + 0.3 V
Analog, Digital Inputs VSS − 2 V to VDD + 2 V or 30 mA, Whichever Occurs First
Continuous Current, S or D 30 mA
Peak Current, S or D (Pulsed at 1 ms, 10% Duty Cycle Max) 100 mA
Operating Temperature Range
Industrial (B Version) −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
Lead Temperature, Soldering (10 sec) 300°C
Plastic Package, Power Dissipation 470 mW
θJA, Thermal Impedance 177°C/W
Lead Temperature, Soldering (10 sec) 260°C
SOIC Package, Power Dissipation 600 mW
θJA, Thermal Impedance 77°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only;
functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum
rating may be applied at any one time.
44 V
Table 4. Truth Table
ADG441/ADG444 IN ADG442 IN Switch Condition
0 1 ON
1 0 OFF
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. A | Page 5 of 16
Page 6
ADG441/ADG442/ADG444
G
G
www.BDTIC.com/ADI
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
IN1
1
D1
2
S1
3
ADG441
4
V
SS
ADG442
ND
5
TOP VIEW
(Not to Scale)
S4
6
D4
7
IN4
8
NC = NO CONNECT
Figure 2. ADG441/ADG442 (DIP/SOIC)
IN2
16
D2
15
S2
14
13
V
DD
NC
12
S3
11
D3
10
IN3
9
05233-002
V
IN1
D1
S1
SS
ND
S4
D4
IN4
1
2
3
ADG444
4
TOP VIEW
(Not to Scale)
5
6
7
8
16
IN2
D2
15
S2
14
13
V
V
12
S3
11
10
D3
IN3
9
Figure 3. ADG444 (DIP/SO IC)
DD
L
05233-003
Table 5. ADG441/ADG442 Pin Function Descriptions
Pin No. Mnemonic Description
1, 8, 9, 16 IN1 to IN4 Logic Control Input.
2, 7, 10, 15 D1 to D4
Drain Terminal. May be
an input or output.
3, 6, 11, 14 S1 to S4
Source Terminal. May be
an input or output.
4 V
SS
Most Negative Power Supply
Potential in Dual Supplies. In
single-supply applications,
it may be connected to ground.
5 GND Ground (0 V) Reference.
12 NC No Connect.
13 V
DD
Most Positive Power Supply Potential.
Table 6. ADG444 Pin Function Descriptions
Pin No. Mnemonic Description
1, 8, 9, 16 IN1 to IN4 Logic Control Input.
2, 7, 10, 15 D1 to D4
Drain Terminal. May be
an input or output.
3, 6, 11, 14 S1 to S4
Source Terminal. May be
an input or output.
4 V
SS
Most Negative Power Supply
Potential in Dual Supplies. In
single-supply applications,
it may be connected to ground.
5 GND Ground (0 V) Reference.
12 V
13 V
L
DD
Logic Power Supply (5 V).
Most Positive Power Supply Potential.
Rev. A | Page 6 of 16
Page 7
ADG441/ADG442/ADG444
www.BDTIC.com/ADI
TYPICAL PERFORMANCE CHARACTERISTICS
(Ω)
R
ON
100
80
60
TA = 25°C
VDD = +12V
= –12V
V
SS
VDD = +10V
= –10V
V
SS
VDD = +5V
V
= –5V
SS
0.02
0.01
= +15V
V
DD
V
= –15V
SS
T
= 25°C
A
0
ID (ON)
I
D
I
S
(OFF)
(OFF)
40
VDD = +15V
V
= –15V
SS
20
VD (VS) (V)
Figure 4. R
170
150
130
110
90
(Ω)
ON
R
70
50
30
10
Figure 5. R
as a Function of VD (VS): Dual Supply
ON
VDD = 5V
V
= 0V
SS
VDD = 10V
V
= 0V
SS
VDD = 15V
V
= 0V
SS
VD (VS) (V)
as a Function of VD (VS): Single Supply
ON
TA = 25°C
VDD = 12V
V
15–15–10–50510
05233-005
= 0V
SS
15036912
05233-006
–0.01
LEAKAGE CURRENT (nA)
–0.02
dB
VS (VD) (V)
Figure 7. Leakage Currents as a Function of V
120
110
100
90
80
OFF ISOLATION
70
60
50
FREQUENCY (Hz)
Figure 8. Crosstalk and Off Isolation vs. Frequency
CROSSTALK
(VD)
S
VDD = +15V
V
= –15V
SS
15–15–10–50510
05233-008
10M1k10k100k1M
05233-009
(Ω)
ON
R
100
80
60
40
20
Figure 6. R
25°C
VD (VS) (V)
as a Function of VD (VS) for Different Temperatures
ON
85°C
V
V
DD
SS
= +15V
= –15V
125°C
15–15–10–50510
05233-007
Rev. A | Page 7 of 16
120
VDD = 12V
V
= 0V
SS
100
80
)
Ω
(
ON
R
60
40
20
25°C
Figure 9. R
as a Function of VD (VS) for Different Temperatures
ON
85°C
VD (VS) (V)
125°C
120246810
05233-010
Page 8
ADG441/ADG442/ADG444
www.BDTIC.com/ADI
0.010
VDD = 12V
V
= 0V
SS
T
= 25°C
A
0.005
I
D
(ON)
IS (OFF)
120
100
V
= 8V
IN
t
ON
–0.005
LEAKAGE CURRENT (nA)
–0.010
–10
–20
CHARGE INJECTION (pC)
–30
–40
0
ID (OFF)
VS, VD (V)
Figure 10. Leakage Currents as a Function of V
40
TA = 25°C
30
20
10
0
V
V
= +15V
DD
= –15V
SS
VS (V)
Figure 11. Charge Injection vs. Source Voltage
80
t (ns)
60
t
OFF
120246810
05233-011
(VD)
S
= 12V
V
DD
V
= 0V
SS
15–15–12–9–6–3036912
05233-012
40
SUPPLY VOLTAGE (V)
±20±10±12±14±16±18
05233-013
Figure 12. Switching Time vs. Bipolar Supply
160
140
120
100
t (ns)
80
60
40
20
t
ON
t
OFF
SUPPLY VOLTAGE (V)
= 8V
V
IN
2081014121618
05233-014
Figure 13. Switching Time vs. Single Supply
Rev. A | Page 8 of 16
Page 9
ADG441/ADG442/ADG444
V
V
www.BDTIC.com/ADI
TEST CIRCUITS
I
DS
V1
SD
S
R
= V1/I
ON
DS
Figure 14. On Resistance
V
S
05233-015
+15V +5V
0.1µF
V
DD
SD
IN
GND
IS (OFF)ID (OFF)
A
S
Figure 15. Off Leakage
0.1µF
V
L
V
C
L
35pF
OUT
V
OUT
R
L
1kΩ
V
SS
SD
3V
V
IN
ADG441/ADG444
V
IN
ADG442
A
V
D
05233-016
50%
3V
50%50%
V
S
50%
SD
Figure 16. On Leakage
90%90%
ID (ON)
A
V
D
05233-017
0.1µF
–15V
t
ON
t
OFF
05233-018
Figure 17. Switching Times
+15V +5V
V
V
L
R
S
V
S
DD
SD
IN
GND
–15V
V
OUT
C
L
1nF
V
SS
3V
V
IN
V
OUT
Q
= CL× ∆V
INJ
OUT
∆V
OUT
05233-019
Figure 18. Charge Injection
Rev. A | Page 9 of 16
Page 10
ADG441/ADG442/ADG444
V
www.BDTIC.com/ADI
+15V +5V
0.1µF
V
DD
SD
V
S
IN
V
GND
IN
0.1µF
V
SS
V
SS
R
50Ω
+15V +5V
0.1µF
V
DD
V
OUT
L
V
OUT
50Ω
V
S
R
L
SD
IN1
GND
0.1µF
V
SS
V
SS
50Ω
V
IN2
NC
0.1µF
–15V
Figure 19. Off Isolation
05233-021
CHANNEL-TO-CHANNEL CROSSTALK = 20× LOG |VS/V
Figure 20. Channel-to-Channel Crosstalk
0.1µF
–15V
OUT
|
05233-022
Rev. A | Page 10 of 16
Page 11
ADG441/ADG442/ADG444
www.BDTIC.com/ADI
TERMINOLOGY
R
ON
Ohmic resistance between D and S.
Match
R
ON
Difference between the R
(OFF)
I
S
of any two channels.
ON
Source leakage current with the switch OFF.
I
(OFF)
D
Drain leakage current with the switch OFF.
I
, IS (ON)
D
Channel leakage current with the switch ON.
V
(VS)
D
Analog voltage on Terminals D, S.
C
(OFF)
S
OFF switch source capacitance.
C
(OFF)
D
OFF switch drain capacitance.
t
ON
Delay between applying the digital control input and the output
switching on.
t
OFF
Delay between applying the digital control input and the output
switching off.
t
OPEN
Break-before-make delay when switches are configured as a
multiplexer.
Crosstalk
A me
asure of unwanted signal which is coupled through from
one channel to another as a result of parasitic capacitance.
Off Isolation
A meas
ure of unwanted signal coupling through an OFF switch.
Charge Injection
A me
asure of the glitch impulse transferred from the digital
input to the analog output during switching.
C
, CS (ON)
D
ON switch capacitance.
Rev. A | Page 11 of 16
Page 12
ADG441/ADG442/ADG444
www.BDTIC.com/ADI
TRENCH ISOLATION
In the ADG441A, ADG442A, and ADG444A, an insulating
oxide layer (trench) is placed between the NMOS and the
PMOS transistors of each CMOS switch. Parasitic junctions,
which occur between the transistors in junction isolated
switches, are eliminated, and the result is a completely latch-up
proof switch.
NMOSPMOS
LOCO
In junction isolation, the N and P wells of the PMOS and
NMOS transistors form a diode that is reverse-biased under
normal operation. However, during overvoltage conditions, this
diode becomes forward-biased. A silicon-controlled rectifier
(SCR) type circuit is formed by the two transistors causing a
significant amplification of the current which, in turn, leads to
latch-up. With trench isolation, this diode is removed, and the
result is a latch-up proof switch.
P-WELLN-WELL
TRENCH
BURIED OXIDE LAYER
SUBSTRATE (BACK GATE)
Figure 21. Trench Isolation
05233-004
Rev. A | Page 12 of 16
Page 13
ADG441/ADG442/ADG444
www.BDTIC.com/ADI
OUTLINE DIMENSIONS
0.785 (19.94)
0.765 (19.43)
0.745 (18.92)
16
1
0.100 (2.54)
BSC
0.015 (0.38)
0.180 (4.57)
MAX
0.150 (3.81)
0.130 (3.30)
0.110 (2.79)
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
16
1
1.27 (0.0500)
BSC
0.51 (0.0201)
0.10
0.31 (0.0122)
COMPLIANT TO JEDEC STANDARDS MS-012AC
9
6.20 (0.2441)
5.80 (0.2283)
8
1.75 (0.0689)
1.35 (0.0531)
SEATING
PLANE
0.25 (0.0098)
0.17 (0.0067)
0.50 (0.0197)
0.25 (0.0098)
8°
0°
1.27 (0.0500)
0.40 (0.0157)
× 45°
Figure 23. 16-Lead Standard Small Outline Package [SOIC]
(R-16)
Dimensions shown in millimeters and (inches)
Rev. A | Page 13 of 16
Page 14
ADG441/ADG442/ADG444
www.BDTIC.com/ADI
ORDERING GUIDE
Model Temperature Range Package Description Package Option
ADG441BN −40°C to +85°C 16-Lead Plastic Dual In-Line Package (PDIP) N-16
ADG441BR −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
ADG441BR-REEL −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
ADG441BRZ
ADG441BRZ-REEL1 −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
ADG441BCHIPS DIE
ADG441ABCHIPS
ADG441ABN2 −40°C to +85°C 16-Lead Plastic Dual In-Line Package (PDIP) N-16
ADG441ABR2 −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
ADG441ABR-REEL2 −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
ADG441ABRZ-REEL
ADG442BN −40°C to +85°C 16-Lead Plastic Dual In-Line Package (PDIP) N-16
ADG442BR −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
ADG442BR-REEL −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
ADG442BRZ1 −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
ADG442BRZ-REEL1 −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
ADG442ABN2 −40°C to +85°C 16-Lead Plastic Dual In-Line Package (PDIP) N-16
ADG442ABR2 −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
ADG442ABR-REEL2 −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
ADG442ABRZ
ADG442ABRZ-REEL
ADG444BN −40°C to +85°C 16-Lead Plastic Dual In-Line Package (PDIP) N-16
ADG444BR −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
ADG444BR-REEL −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
ADG444BRZ1 −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
ADG444BRZ-REEL1 −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
ADG444ABN2 −40°C to +85°C 16-Lead Plastic Dual In-Line Package (PDIP) N-16
ADG444ABR2 −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
ADG444ABR-REEL2 −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
ADG444ABRZ
ADG444ABRZ-REEL
1
Z = Pb-free part.
2
A = Trench isolated.
1
2
1, 2
1, 2
1, 2
1, 2
1, 2
−40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
DIE
−40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
−40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
−40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
−40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
−40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16