Datasheet ADG441 Datasheet (ANALOG DEVICES)

Page 1
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LC2MOS Quad SPST Switches

FEATURES

44 V supply maximum ratings
to VDD analog signal range
V
SS
Low on resistance (<70 Ω) Low ∆RON (9 Ω max) Low R Low power dissipation Fast switching times
Low leakage currents (3 nA max) Low charge injection (6 pC max) Break-before-make switching action Latch-up proof A grade Plug-in upgrade for DG201A/ADG201A, DG202A/ADG202A,
Plug-in replacement for DG441/DG442/DG444

APPLICATIONS

Audio and video switching Automatic test equipment Precision data acquisition Battery-powered systems Sample-and-hold systems Communication systems

GENERAL DESCRIPTION

The ADG441, ADG442, and ADG444 are monolithic CMOS devices that comprise of four independently selectable switches. They are designed on an enhanced LC provides low power dissipation yet gives high switching speed and low on resistance.
The on resistance profile is very flat over the full analog input range, which ensures good linearity and low distortion when switching audio signals. High switching speed also makes the parts suitable for video signal switching. CMOS construction ensures ultralow power dissipation, making the parts ideally suited for portable and battery-powered instruments. The ADG441, ADG442, and ADG444 contain four independent SPST switches. Each switch of the ADG441 and ADG444 turns on when a logic low is applied to the appropriate control input. The ADG442 switches are turned on with logic high on the appropriate control input. The ADG441 and ADG444 switches
match (3 Ω max)
ON
< 110 ns
t
ON
t
< 60 ns
OFF
DG211/ADG211A
2
MOS process that
ADG441/ADG442/ADG444

FUNCTIONAL BLOCK DIAGRAM

S1
IN1
IN2
ADG441 ADG444
IN3
IN4
SWITCHES SHOWN FOR A LOGIC 1 INPUT
IN1
D1 S2
IN2
D2 S3
IN3
D3 S4
IN4
D4
Figure 1.
ADG442
differ in that the ADG444 requires a 5 V logic power supply that is applied to the V have a V
pin, the logic power supply is generated internally by
L
pin. The ADG441 and ADG442 do not
L
an on-chip voltage generator.
Each switch conducts equally well in both directions when ON and has an input signal range that extends to the power supplies. In the OFF condition, signal levels up to the supplies are blocked. All switches exhibit break-before-make switching action for use in multiplexer applications. Inherent in the design is the low charge injection for minimum transients when switching the digital inputs.

PRODUCT HIGHLIGHTS

1. Extended signal range. The ADG441A/ADG442A/
ADG444A are fabricated on an enhanced LC isolated process, giving an increased signal range that extends to the supply rails.
2. Low power dissipation.
3. Low R
4. Trench isolation guards against latch-up for A grade parts. A
dielectric trench separates the P and N channel transistors thereby preventing latch-up even under severe overvoltage conditions.
5. Break-before-make switching. This prevents channel
shorting when the switches are configured as a multiplexer.
6. Single-supply operation. For applications where the analog
signal is unipolar, the ADG441/ADG442/ADG444 can be operated from a single-rail power supply. The parts are fully specified with a single 12 V power supply.
ON
.
S1
D1 S2
D2 S3
D3 S4
D4
2
MOS, trench-
05233-001
Rev. A
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2005 Analog Devices, Inc. All rights reserved.
Page 2
ADG441/ADG442/ADG444
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TABLE OF CONTENTS

Specifications..................................................................................... 3
Dual Supply ................................................................................... 3
Single Supply ................................................................................. 4
Absolute Maximum Ratings............................................................ 5
ESD Caution.................................................................................. 5
Pin Configurations and Function Descriptions ........................... 6
Typical Performance Characteristics ............................................. 7

REVISION HISTORY

5/05—Data Sheet Changed from Rev. 0 to Rev. A
Changes to Format ............................................................. Universal
Deleted CERDIP Package and T Grade ..........................Universal
Changes to Features and Product Highlights ............................... 1
Changes to Test Conditions in Table 2 .......................................... 4
Changes to Figure 11........................................................................ 8
Changes to Trench Isolation Section ........................................... 12
Updated Outline Dimensions....................................................... 13
Changes to Ordering Guide.......................................................... 14
Test Ci r c ui t s ........................................................................................9
Te r mi n ol o g y .................................................................................... 11
Trench Is o latio n .............................................................................. 12
Outline Dimensions ....................................................................... 13
Ordering Guide .......................................................................... 14
4/94–Revision 0: Initial Version
Rev. A | Page 2 of 16
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SPECIFICATIONS

DUAL SUPPLY

VDD = +15 V ± 10%, VSS = −15 V ± 10%, VL = +5 V ± 10% (ADG444), GND = 0 V, unless otherwise noted.
Table 1.
B Version Parameter +25°C −40°C to +85°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range VSS to VDD V RON 40 Ω typ VD = ±8.5 V, IS = −10 mA 70 85 Ω max VDD = +13.5 V, VSS = −13.5 V ∆RON 4 Ω typ −8.5 V ≤ VD ≤ +8.5 V 9 Ω max
RON Match 1 Ω typ VD = 0 V, IS = −10 mA 3 Ω max LEAKAGE CURRENTS VDD = +16.5 V, VSS = −16.5 V
Source OFF Leakage IS (OFF) ±0.01 nA typ
±0.5 ±3 nA max See Figure 15
Drain OFF Leakage ID (OFF) ±0.01 nA typ
±0.5 ±3 nA max See Figure 15
Channel ON Leakage ID, IS (ON) ±0.08 nA typ VS = VD = ±15.5 V ±0.5 ±3 nA max See Figure 16 DIGITAL INPUTS
Input High Voltage, V
Input Low Voltage, V
Input Current
I
or I
INL
±0.5 µA max DYNAMIC CHARACTERISTICS
tON 85 ns typ RL = 1 kΩ, CL = 35 pF;
110 170 ns max VS = ±10 V; see Figure 17
t
45 ns typ RL = 1 kΩ, CL = 35 pF;
OFF
60 80 ns max VS = ±10 V; see Figure 17
t
30 ns typ RL = 1 kΩ, CL = 35 pF;
OPEN
Charge Injection 1 pC typ VS = 0 V, RS = 0 Ω, CL = 1 nF;
6 pC max VDD = +15 V, VSS = –15 V; see Figure 18
OFF Isolation 60 dB typ RL = 50 Ω, CL = 5 pF; f = 1 MHz; see Figure 19
Channel-to-Channel Crosstalk 100 dB typ RL = 50 Ω, CL = 5 pF; f= 1 MHz; see Figure 20
CS (OFF) 4 pF typ f = 1 MHz
CD (OFF) 4 pF typ f = 1 MHz
CD, CS (ON) 16 pF typ f = 1 MHz POWER REQUIREMENTS VDD = +16.5 V, VSS = −16.5 V
I
DD
ADG441/ADG442 80 µA max ADG444 0.001 µA typ
1 2.5 µA max
ISS 0.0001 µA typ 1 2.5 µA max
IL (ADG444 Only) 0.001 µA typ VL = 5.5 V 1 2.5 µA max
1
Temperature range is: B Version: −40°C to +85°C.
2
Guaranteed by design, not subject to production test.
1
2.4 V min
INH
0.8 V max
INL
±0.00001 µA typ VIN = V
INH
2
Digital Inputs = 0 V or 5 V
= ±15.5 V, VS = 15.5 V
V
D
= ±15.5 V, VS = 15.5 V
V
D
or V
INH
INL
Rev. A | Page 3 of 16
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SINGLE SUPPLY

1
VDD = +12 V ± 10%, VSS = 0 V, VL = +5 V ± 10% (ADG444), GND = 0 V, unless otherwise noted.
Table 2.
B Version
Parameter +25°C −40°C to +85°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 to VDD V RON 70 Ω typ VD = +3 V, +8 V, IS = −5 mA 110 130 Ω max VDD = 10.8 V ∆RON 4 Ω typ 3 V ≤ VD ≤ 8 V 9 Ω max RON Match 1 Ω typ VD = +6 V, IS = −5 mA 3 Ω max
LEAKAGE CURRENT VDD = 13.2 V
Source OFF Leakage IS (OFF) ±0.01 nA typ VD = 12.2 V/1 V, VS = 1 V/12.2 V ±0.5 ±3 nA max See Figure 15 Drain OFF Leakage ID (OFF) ±0.01 nA typ VD = 12.2 V/1 V, VS = 1 V/12.2 V ±0.5 ±3 nA max See Figure 15 Channel ON Leakage ID, IS (ON) ±0.08 nA typ VS = VD = 12.2 V/1 V ±0.5 ±3 nA max Figure 16
DIGITAL INPUTS
Input High Voltage, V Input Low Voltage, V
2.4 V min
INH
0.8 V max
INL
Input Current
I
or I
±0.00001 µA typ VIN = V
INL
INH
INL
or V
INH
±0.5 µA max DYNAMIC CHARACTERISTICS
2
tON 105 ns typ RL = 1 kΩ, CL = 35 pF 150 220 ns max VS = 8 V; Figure 17 t
40 ns typ RL = 1 kΩ, CL = 35 pF
OFF
60 100 ns max VS = 8 V; Figure 17 t
50 ns typ RL = 1 kΩ, CL = 35 pF
OPEN
Charge Injection 2 pC typ VS = 6 V, RS = 0 Ω, CL = 1 nF 6 pC max VDD = 12 V, VSS = 0 V; see Figure 18 OFF Isolation 60 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 19 Channel-to-Channel Crosstalk 100 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 20 CS (OFF) 7 pF typ f = 1 MHz CD (OFF) 10 pF typ f = 1 MHz CD, CS (ON) 16 pF typ f = 1 MHz
POWER REQUIREMENTS VDD = 13.2 V
IDD Digital Inputs = 0 V or 5 V
ADG441/ADG442 80 µA max ADG444 0.001 µA typ
1 2.5 µA max IL (ADG444 Only) 0.001 µA typ VL = 5.5 V
1 2.5 µA max
1
Temperature range is: B Version: −40°C to +85°C.
2
Guaranteed by design, not subject to production test.
Rev. A | Page 4 of 16
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ABSOLUTE MAXIMUM RATINGS

TA = 25°C unless otherwise noted.
Table 3.
Parameter Rating
VDD to V
SS
VDD to GND −0.3 V to +25 V VSS to GND +0.3 V to −25 V VL to GND −0.3 V to VDD + 0.3 V Analog, Digital Inputs VSS − 2 V to VDD + 2 V or 30 mA, Whichever Occurs First Continuous Current, S or D 30 mA Peak Current, S or D (Pulsed at 1 ms, 10% Duty Cycle Max) 100 mA Operating Temperature Range
Industrial (B Version) −40°C to +85°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C Lead Temperature, Soldering (10 sec) 300°C Plastic Package, Power Dissipation 470 mW θJA, Thermal Impedance 177°C/W Lead Temperature, Soldering (10 sec) 260°C SOIC Package, Power Dissipation 600 mW θJA, Thermal Impedance 77°C/W Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time.
44 V
Table 4. Truth Table
ADG441/ADG444 IN ADG442 IN Switch Condition
0 1 ON 1 0 OFF

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. A | Page 5 of 16
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ADG441/ADG442/ADG444
G
G
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PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

IN1
1
D1
2
S1
3
ADG441
4
V
SS
ADG442
ND
5
TOP VIEW
(Not to Scale)
S4
6
D4
7
IN4
8
NC = NO CONNECT
Figure 2. ADG441/ADG442 (DIP/SOIC)
IN2
16
D2
15
S2
14 13
V
DD
NC
12
S3
11
D3
10
IN3
9
05233-002
V
IN1
D1 S1
SS
ND
S4 D4
IN4
1 2 3
ADG444
4
TOP VIEW
(Not to Scale)
5 6 7 8
16
IN2 D2
15
S2
14 13
V V
12
S3
11 10
D3 IN3
9
Figure 3. ADG444 (DIP/SO IC)
DD L
05233-003
Table 5. ADG441/ADG442 Pin Function Descriptions
Pin No. Mnemonic Description
1, 8, 9, 16 IN1 to IN4 Logic Control Input. 2, 7, 10, 15 D1 to D4
Drain Terminal. May be an input or output.
3, 6, 11, 14 S1 to S4
Source Terminal. May be an input or output.
4 V
SS
Most Negative Power Supply Potential in Dual Supplies. In single-supply applications,
it may be connected to ground. 5 GND Ground (0 V) Reference. 12 NC No Connect. 13 V
DD
Most Positive Power Supply Potential.
Table 6. ADG444 Pin Function Descriptions
Pin No. Mnemonic Description
1, 8, 9, 16 IN1 to IN4 Logic Control Input. 2, 7, 10, 15 D1 to D4
Drain Terminal. May be an input or output.
3, 6, 11, 14 S1 to S4
Source Terminal. May be an input or output.
4 V
SS
Most Negative Power Supply Potential in Dual Supplies. In single-supply applications,
it may be connected to ground. 5 GND Ground (0 V) Reference. 12 V 13 V
L
DD
Logic Power Supply (5 V).
Most Positive Power Supply Potential.
Rev. A | Page 6 of 16
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TYPICAL PERFORMANCE CHARACTERISTICS

(Ω) R
ON
100
80
60
TA = 25°C
VDD = +12V
= –12V
V
SS
VDD = +10V
= –10V
V
SS
VDD = +5V V
= –5V
SS
0.02
0.01
= +15V
V
DD
V
= –15V
SS
T
= 25°C
A
0
ID (ON)
I
D
I
S
(OFF)
(OFF)
40
VDD = +15V V
= –15V
SS
20
VD (VS) (V)
Figure 4. R
170
150
130
110
90
(Ω)
ON
R
70
50
30
10
Figure 5. R
as a Function of VD (VS): Dual Supply
ON
VDD = 5V V
= 0V
SS
VDD = 10V
V
= 0V
SS
VDD = 15V V
= 0V
SS
VD (VS) (V)
as a Function of VD (VS): Single Supply
ON
TA = 25°C
VDD = 12V V
15–15 –10 –5 0 5 10
05233-005
= 0V
SS
15036912
05233-006
–0.01
LEAKAGE CURRENT (nA)
–0.02
dB
VS (VD) (V)
Figure 7. Leakage Currents as a Function of V
120
110
100
90
80
OFF ISOLATION
70
60
50
FREQUENCY (Hz)
Figure 8. Crosstalk and Off Isolation vs. Frequency
CROSSTALK
(VD)
S
VDD = +15V
V
= –15V
SS
15–15 –10 –5 0 5 10
05233-008
10M1k 10k 100k 1M
05233-009
(Ω)
ON
R
100
80
60
40
20
Figure 6. R
25°C
VD (VS) (V)
as a Function of VD (VS) for Different Temperatures
ON
85°C
V V
DD SS
= +15V = –15V
125°C
15–15 –10 –5 0 5 10
05233-007
Rev. A | Page 7 of 16
120
VDD = 12V V
= 0V
SS
100
80
)
(
ON
R
60
40
20
25°C
Figure 9. R
as a Function of VD (VS) for Different Temperatures
ON
85°C
VD (VS) (V)
125°C
120246810
05233-010
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ADG441/ADG442/ADG444
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0.010 VDD = 12V
V
= 0V
SS
T
= 25°C
A
0.005
I
D
(ON)
IS (OFF)
120
100
V
= 8V
IN
t
ON
–0.005
LEAKAGE CURRENT (nA)
–0.010
–10
–20
CHARGE INJECTION (pC)
–30
–40
0
ID (OFF)
VS, VD (V)
Figure 10. Leakage Currents as a Function of V
40
TA = 25°C
30
20
10
0
V V
= +15V
DD
= –15V
SS
VS (V)
Figure 11. Charge Injection vs. Source Voltage
80
t (ns)
60
t
OFF
120246810
05233-011
(VD)
S
= 12V
V
DD
V
= 0V
SS
1515–12–9–6–3036912
05233-012
40
SUPPLY VOLTAGE (V)
±20±10 ±12 ±14 ±16 ±18
05233-013
Figure 12. Switching Time vs. Bipolar Supply
160
140
120
100
t (ns)
80
60
40
20
t
ON
t
OFF
SUPPLY VOLTAGE (V)
= 8V
V
IN
20810 1412 16 18
05233-014
Figure 13. Switching Time vs. Single Supply
Rev. A | Page 8 of 16
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ADG441/ADG442/ADG444
V
V
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TEST CIRCUITS

I
DS
V1
SD
S
R
= V1/I
ON
DS
Figure 14. On Resistance
V
S
05233-015
+15V +5V
0.1µF
V
DD
SD
IN
GND
IS (OFF) ID (OFF)
A
S
Figure 15. Off Leakage
0.1µF
V
L
V
C
L
35pF
OUT
V
OUT
R
L
1k
V
SS
SD
3V
V
IN
ADG441/ADG444
V
IN
ADG442
A
V
D
05233-016
50%
3V
50% 50%
V
S
50%
SD
Figure 16. On Leakage
90%90%
ID (ON)
A
V
D
05233-017
0.1µF
–15V
t
ON
t
OFF
05233-018
Figure 17. Switching Times
+15V +5V
V
V
L
R
S
V
S
DD
SD
IN
GND
–15V
V
OUT
C
L
1nF
V
SS
3V
V
IN
V
OUT
Q
= CL× V
INJ
OUT
V
OUT
05233-019
Figure 18. Charge Injection
Rev. A | Page 9 of 16
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ADG441/ADG442/ADG444
V
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+15V +5V
0.1µF
V
DD
SD
V
S
IN
V
GND
IN
0.1µF
V
SS
V
SS
R 50
+15V +5V
0.1µF
V
DD
V
OUT
L
V
OUT
50
V
S
R
L
SD
IN1
GND
0.1µF
V
SS
V
SS
50
V
IN2
NC
0.1µF
–15V
Figure 19. Off Isolation
05233-021
CHANNEL-TO-CHANNEL CROSSTALK = 20× LOG |VS/V
Figure 20. Channel-to-Channel Crosstalk
0.1µF
–15V
OUT
|
05233-022
Rev. A | Page 10 of 16
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TERMINOLOGY

R
ON
Ohmic resistance between D and S.
Match
R
ON
Difference between the R
(OFF)
I
S
of any two channels.
ON
Source leakage current with the switch OFF.
I
(OFF)
D
Drain leakage current with the switch OFF.
I
, IS (ON)
D
Channel leakage current with the switch ON.
V
(VS)
D
Analog voltage on Terminals D, S.
C
(OFF)
S
OFF switch source capacitance.
C
(OFF)
D
OFF switch drain capacitance.
t
ON
Delay between applying the digital control input and the output switching on.
t
OFF
Delay between applying the digital control input and the output switching off.
t
OPEN
Break-before-make delay when switches are configured as a multiplexer.
Crosstalk A me
asure of unwanted signal which is coupled through from
one channel to another as a result of parasitic capacitance.
Off Isolation A meas
ure of unwanted signal coupling through an OFF switch.
Charge Injection
A me
asure of the glitch impulse transferred from the digital
input to the analog output during switching.
C
, CS (ON)
D
ON switch capacitance.
Rev. A | Page 11 of 16
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TRENCH ISOLATION

In the ADG441A, ADG442A, and ADG444A, an insulating oxide layer (trench) is placed between the NMOS and the PMOS transistors of each CMOS switch. Parasitic junctions, which occur between the transistors in junction isolated switches, are eliminated, and the result is a completely latch-up proof switch.
NMOS PMOS
LOCO
In junction isolation, the N and P wells of the PMOS and NMOS transistors form a diode that is reverse-biased under normal operation. However, during overvoltage conditions, this diode becomes forward-biased. A silicon-controlled rectifier (SCR) type circuit is formed by the two transistors causing a significant amplification of the current which, in turn, leads to latch-up. With trench isolation, this diode is removed, and the result is a latch-up proof switch.
P-WELL N-WELL
TRENCH
BURIED OXIDE LAYER
SUBSTRATE (BACK GATE)
Figure 21. Trench Isolation
05233-004
Rev. A | Page 12 of 16
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OUTLINE DIMENSIONS

0.785 (19.94)
0.765 (19.43)
0.745 (18.92)
16 1
0.100 (2.54) BSC
0.015 (0.38)
0.180 (4.57) MAX
0.150 (3.81)
0.130 (3.30)
0.110 (2.79)
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MO-095AC
0.060 (1.52)
0.050 (1.27)
0.045 (1.14)
Figure 22. 16-Lead Plastic Dual In-Line Package [PDIP]
Dimensions shown in inches and (millimeters)
10.00 (0.3937)
9.80 (0.3858)
9 8
MIN
(N-16)
0.295 (7.49)
0.285 (7.24)
0.275 (6.99)
SEATING PLANE
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
0.015 (0.38)
0.010 (0.25)
0.008 (0.20)
0.150 (3.81)
0.135 (3.43)
0.120 (3.05)
4.00 (0.1575)
3.80 (0.1496)
0.25 (0.0098)
0.10 (0.0039)
COPLANARITY
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
16
1
1.27 (0.0500) BSC
0.51 (0.0201)
0.10
0.31 (0.0122)
COMPLIANT TO JEDEC STANDARDS MS-012AC
9
6.20 (0.2441)
5.80 (0.2283)
8
1.75 (0.0689)
1.35 (0.0531)
SEATING PLANE
0.25 (0.0098)
0.17 (0.0067)
0.50 (0.0197)
0.25 (0.0098)
8° 0°
1.27 (0.0500)
0.40 (0.0157)
× 45°
Figure 23. 16-Lead Standard Small Outline Package [SOIC]
(R-16)
Dimensions shown in millimeters and (inches)
Rev. A | Page 13 of 16
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ORDERING GUIDE

Model Temperature Range Package Description Package Option
ADG441BN −40°C to +85°C 16-Lead Plastic Dual In-Line Package (PDIP) N-16 ADG441BR −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16 ADG441BR-REEL −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16 ADG441BRZ ADG441BRZ-REEL1 −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16 ADG441BCHIPS DIE ADG441ABCHIPS ADG441ABN2 −40°C to +85°C 16-Lead Plastic Dual In-Line Package (PDIP) N-16 ADG441ABR2 −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16 ADG441ABR-REEL2 −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16 ADG441ABRZ-REEL ADG442BN −40°C to +85°C 16-Lead Plastic Dual In-Line Package (PDIP) N-16 ADG442BR −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16 ADG442BR-REEL −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16 ADG442BRZ1 −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16 ADG442BRZ-REEL1 −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16 ADG442ABN2 −40°C to +85°C 16-Lead Plastic Dual In-Line Package (PDIP) N-16 ADG442ABR2 −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16 ADG442ABR-REEL2 −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16 ADG442ABRZ ADG442ABRZ-REEL ADG444BN −40°C to +85°C 16-Lead Plastic Dual In-Line Package (PDIP) N-16 ADG444BR −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16 ADG444BR-REEL −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16 ADG444BRZ1 −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16 ADG444BRZ-REEL1 −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16 ADG444ABN2 −40°C to +85°C 16-Lead Plastic Dual In-Line Package (PDIP) N-16 ADG444ABR2 −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16 ADG444ABR-REEL2 −40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16 ADG444ABRZ ADG444ABRZ-REEL
1
Z = Pb-free part.
2
A = Trench isolated.
1
2
1, 2
1, 2
1, 2
1, 2
1, 2
−40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
DIE
−40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
−40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
−40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
−40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
−40°C to +85°C 16-Lead Standard Small Outline Package (SOIC) R-16
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ADG441/ADG442/ADG444
www.BDTIC.com/ADI
NOTES
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ADG441/ADG442/ADG444
www.BDTIC.com/ADI
NOTES
©2005 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners.
C00396–0–5/05(A)
Rev. A | Page 16 of 16
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