Datasheet ADG3231 Datasheet (ANALOG DEVICES)

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Low Voltage, Single-Channel

Level Translator

FEATURES
Operates from 1.65 V to 3.6 V Supply Rails
Unidirectional Signal Path, Bidirectional Level Translation
Tiny 6-Lead SOT-23 Package
Short Circuit Protection
LV T TL/CMOS Compatible Inputs

APPLICATIONS
Level Translation
Low Voltage ASIC Translation
Serial Interface Translation

GENERAL DESCRIPTION

The ADG3231 is a level translator designed on a submicron
process that operates from supplies as low as 1.65 V. The device
is guaranteed for operation over the supply range 1.65 V to 3.6 V.
It operates from two supply voltages, allowing bidirectional level
translation, i.e., it translates low voltages to higher voltages and
vice versa. The signal path is unidirectional, meaning data may
fl ow only from A1 to Y1.

This type of device may be used in applications requiring commu­nication between devices operating from different supply levels.

The level translator is packaged in one of the smallest footprints
available for its pin count. The 6-lead SOT-23 package requires
only a maximum of 5.28 mm ⫻ 5.28 mm board space.

ADG3231

FUNCTIONAL BLOCK DIAGRAM

V

CC1

A1

PRODUCT HIGHLIGHTS

1. Bidirectional level translation matches any voltage level from

1.65 V to 3.6 V.

2. The device offers high performance and is fully guaranteed
across the supply range.

3. Short circuit protection.

4. Tiny SOT-23 package.

GND

V

CC2

Y1

*

*Patent Pending

REV. 0

Information furnished by Analog Devices is be lieved to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
that may result from its use. No license is granted by implication or oth­erwise under any patent or patent rights of Analog Devices. Trademarks
and registered trademarks are the property of their respective companies.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: [phone] www.analog.com
Fax: [phone] © 2003 Analog Devices, Inc. All rights reserved.

(V

= V

ADG3231–SPECIFICATIONS

CC1

1

oth er wise noted.)

= 1.65 V to 3.6 V, GND = 0 V. All specifi cations T

CC2

MIN

to T

, un less

MAX

Parameter Symbol Conditions Min Typ2 Max Unit

LOGIC INPUTS/OUTPUTS
Input High Voltage4 VIH V
V
V
Input Low Voltage

4

VIL V
V
V
Output High Voltage V
V
V
I
V
I
Output Low Voltage V
V
V
I
V
I

SWITCHING CHARACTERISTICS
Propagation Delay, tPD A1 to Y1 t
Propagation Delay, t
Propagation Delay, t

PD

PD

Input Leakage Current I
Output Leakage Current I

3

4, 5

A1 to Y1 t
A1 to Y1 t

= 3.0 V to 3.6 V 1.35 V

V

IH

V

IH

V

IL

V

IL

IOH = –100 µA, V

OH

IOH = +100 µA, V

OL

, t

PHL

, t

PHL

, t

PHL

0 ⱕ VIN ⱕ 3.6 V ±1 µA

I

O

CC1

= 2.3 V to 2.7 V 1.35 V

CC1

= 1.65 V to 1.95 V 0.65 VCC V

CC1

= 3.0 V to 3.6 V 0.8 V

CC1

= 2.3 V to 2.7 V 0.7 V

CC1

= 1.65 V to 1.95 V 0.35 VCC V

CC1

= –4 mA, V

OH

= –8 mA, V

OH

= +4 mA, V

OH

= +8 mA, V

OH

3.3 V ± 0.3 V, CL = 30 pF, VT = VCC/2 4 6.5 ns

PLH

2.5 V ± 0.2 V, CL = 30 pF, VT = VCC/2 4.5 6.5 ns

PLH

1.8 V ± 0.15 V, CL = 30 pF, VT = VCC/2 6.5 10.25 ns

PLH

= 3.0 V to 3.6 V 2.4 V

CC2

= 2.3 V to 2.7 V 2.0 V

CC2

= 1.65 V to 1.95 V VCC – 0.45 V

CC2

= 2.3 V to 2.7 V 2.0 V

CC2

= 1.65 V to 1.95 V VCC – 0.45 V

CC2

= 3.0 V to 3.6 V 2.4 V

CC2

= 3.0 V to 3.6 V 0.4 V

CC2

= 2.3 V to 2.7 V 0.4 V

CC2

= 1.65 V to 1.95 V 0.45 V

CC2

= 2.3 V to 2.7 V 0.4 V

CC2

= 1.65 V to 1.95 V 0.45 V

CC2

= 3.0 V to 3.6 V 0.4 V

CC2

0 ⱕ VIN ⱕ 3.6 V ±1 µA

POWER REQUIREMENTS
Power Supply Voltages V
V
Quiescent Power Supply Current I
I

NOTES

1

Temperature range is as follows: B Version: –40°C to +85°C.

2

All typical values are at V

3

VIL and VIH levels are specifi ed with respect to V

4

Guaranteed by design, not subject to production test.

5

See Test Circuit and Waveforms.

Specifi cations subject to change without notice.

CC1

= V

, TA = 25°C, unless otherwise stated.

CC2

CC1

1.65 3.6 V

CC1

1.65 3.6 V

CC2

Digital Inputs = 0 V or VCC 2 µA

CC1

Digital Inputs = 0 V or VCC 2 µA

CC2

; VOH and VOL levels are with respect to V

CC2

.

–2–

REV. 0

ADG3231

ABSOLUTE MAXIMUM RATINGS*

(TA = 25°C, unless otherwise noted.)

VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +4.6 V

A1 Input Voltage . . . . . . . . . . . . . . . . . . . –0.3 V to V

CC1

+0.3 V

DC Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . . . –40°C to +85°C

Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . .150°C

6-Lead SOT-23,

Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 229°C/W

q

JA

Lead Temperature, Soldering (10 seconds) . . . . . . . . . . . 300°C

IR Refl ow, Peak Temperature (<20 seconds) . . . . . . . . . . 235°C

*Stresses above those listed under Absolute Maximum Ratings may cause permanent

damage to the device. This is a stress rating only; functional operation of the device
at these or any other conditions above those listed in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Only one absolute maximum rating
may be applied at any one time.

ORDERING GUIDE

Model Temperature Range Package Description Branding Package Option

ADG3231BRJ-REEL –40°C to +85°C SOT-23 W2B RJ-6
ADG3231BRJ-REEL7 –40°C to +85°C SOT-23 W2B RJ-6

PIN CONFIGURATION

V

V

CC1

NC

A1

1

ADG3231

2

(No t to Scale)

3

6

CC2

Y1

5

GND

4

PIN FUNCTION DESCRIPTIONS

Pin Mnemonic Description

1 V

CC1

Supply Voltage 1, can be any supply voltage from 1.65 V to 3.6 V.
2 NC Not Internally Connected.
3 A1

Digital Input Referred to V

CC1

.
4 GND Device Ground Pin.
5 Y1
6 V

CC2

Digital Output Referred to V
Supply Voltage 2, can be any supply voltage from 1.65 V to 3.6 V.

CC2

.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily ac cu mu late
on the human body and test equipment and can discharge without detection. Although the ADG3231
features proprietary ESD pro tec tion circuitry, permanent damage may occur on devices subjected to high
energy electrostatic discharges. Therefore, proper ESD pre cau tions are rec om mend ed to avoid per for mance
deg ra da tion or loss of functionality.

REV. 0

–3–

ADG3231–Typical Performance Characteristics

5.0
TA = 25ⴗC

4.5

4.0

3.5

3.0

2.5

– nA

CC1

2.0

I

1.5

V

1.0

0.5

0

1.5 2.0 3.02.5 3.5 4.0

V

= 2.5V

CC2

TPC 1. I

30

V

= 3.3V

CC1

= 25ⴗC

T

A

25

20

– nA

15

CC2

I

10

–5

5

0

08070605040302010

V

V

= 3.3V

CC2

= 1.8V

CC2

V

– V

CC1

vs. V

CC1

V

= 1.8V

CC2

TEMPERATURE – ⬚C

CC2

V

CC2

= 2.5V

CC1

= 3.3V

5.0
TA = 25ⴗC

4.5

4.0

3.5

3.0

– nA

2.5

CC2

I

2.0

1.5

V

= 3.3V

CC1

1.0

0.5

0

1.5 2.0 3.02.5 3.5 4.0

TPC 2. I

80

T

= 25ⴗC

A

70

60

50

40

– ␮A

CC1

I

30

20

10

V

CC1

0

10k 100k 1M

V

= 2.5V

CC1

V

– V

CC2

vs. V

CC2

V

= V

CC1

= V

= 1.8V

CC2

FREQUENCY – Hz

V

CC1

CC2

= 3.3V

CC2

10M 100M

= 1.8V

30

25

20

– nA

15

CC1

I

10

5

0

08070605040302010

TPC 3. I

2000

1800

1600

1400

1200

1000

– ␮A

CC2

I

800

600

400

200

0

10k 100k

T

V

CC2

T

A

= 25ⴗC

A

= 3.3V

= 25ⴗC

TEMPERATURE – ⬚C

vs. Temperature

CC1

V

CC1

V

V

=

CC1

FREQUENCY – Hz

= V

CC2

V

V

V

CC2

1M

CC1

CC1

CC1

= 3.3V

= 1.8V

= 3.3V

= 2.5V

= 1.8V

10M 100M

TPC 4. I

10

8

6

TIME – ns

4

2

TA = 25ⴗC
V

CC1

0

1.5 2.0 3.02.5 3.5 4.0

vs. Temperature

CC2

= V

CC2

SUPPLY – V

t

EN

t

DIS

TPC 7. Enable, Disable Time vs. Supply

TPC 5. I

6

5

4

3

TIME – ns

2

1

V

CC1

0

–40 –20 200408060

vs. Frequency

CC1

t

EN

t

DIS

= V

3.3V

CC2 =

TEMPERATURE – ⴗC

TPC 8. Enable, Disable
vs. Temperature

Time

TPC 6. I

16

V

= 3.3V

CC1

= 1.8V

V

CC2

14

= 25ⴗC

T

A

DATA RATE 10Mbps

12

10

8

6

RISE/FALL TIME – ns

4

2

0

22 10292827262524232

vs. Frequency

CC2

t

, LOW-TO-HIGH TRANSITION

PLH

t

, HIGH-TO-LOW TRANSITION

PHL

CAPACITIVE LOAD – pF

TPC 9. Rise/Fall Time vs.
Capacitive Load, A1–Y1

–4–

REV. 0

ADG3231

10

V

= 1.8V

CC1

9

= 3.3V

V

CC2

= 25ⴗC

T

A

8

DATA RATE 10Mbps

t

, LOW-TO-HIGH TRANSITION

LH

7

6

5

4

3

RISE/FALL TIME – ns

2

t

, HIGH-TO-LOW TRANSITION

HL

1

0

22 10292827262524232

CAPACITIVE LOAD – pF

TPC 10. Rise/Fall Time vs.
Capacitive Load, A1–Y1

4.0

t

, A1–Y2

PHL

3.0

2.0

1.0

PROPAGATION DELAY – ns

TA = 25ⴗC
V

CC1

0

t

PLH

= V

= 3.3V

CC2

TEMPERATURE – ⴗC

, A1–Y2

8

V

= 3.3V

CC1

= 3.3V

V

CC2

7

= 25ⴗC

T

A

DATA RATE 10Mbps

6

t

, LOW-TO-HIGH TRANSITION

PLH

5

4

t

, HIGH-TO-LOW TRANSITION

3

2

PROPAGATION DELAY – ns

1

0

22 10292827262524232

PHL

CAPACITIVE LOAD – pF

TPC 11. Propagation Delay
vs. Capacitive Load, A1–Y1

TA = 25ⴗC
DATA RATE = 10MHz

A1

3

2

806040200–20–40

3.3V

1.8V

Y1

8.0

6.0

t

, A1–Y2

= V

PHL

CC2

t

, A1–Y2

PLH

SUPPLY – V

4.0

2.0

PROPAGATION DELAY – ns

TA = 25ⴗC
V

CC1

0

1.5 2.0 3.02.5 3.5 4.0

TPC 12. Propagation Delay
vs. Supply, Bypass Mode

A1

3

2

1

1.8V
Y2

TA = 25ⴗC
DATA RATE = 10MHz

3.3V

TPC 13 Propagation Delay
vs. Temperature

3.5

3

2.5

VCC = 2.5V

2

1.5
VCC = 1.8V

VOLTAGE – V

1

VCC = 1.8V

0.5

SINK

0

02015105

VCC = 3.3V

TA = 25ⴗC
V

CC = VCC1

VCC = 2.5V

CURRENT – mA

SOURCE

VCC = 3.3V

= V

CC2

TPC 16. Y1 Sink and Source Current

TPC 14. Input/Output
V

= 3.3 V, V

CC1

CC2

= 1.8 V

TPC 15. Input/Output
V

= 1.8 V, V

CC1

= 3.3 V

CC2

REV. 0

–5–

ADG3231

TEST CIRCUIT

V

INPUT

OUTPUT

t

t

PLH

PHL

CC1

V

T

0V

V

OH

V

L

V

OL

Figure 1. Propagation Delay

DESCRIPTION

The ADG3231 is a level translating device designed on a submicron
process that operates from supplies as low as 1.65 V. The device is
guaranteed for operation over the supply range 1.65 V to 3.6 V.
It operates from two supply voltages, allowing bidirectional level
translation, i.e., it translates low voltages to high voltages and vice
versa. The signal path is unidirectional, meaning data may only
fl ow from A to Z.

SIGNAL INPUT

V

CC1

DEVICE 1

V

CC1

A1

ADG3231

GND

A1 Input

The A1 input is capable of accepting inputs outside the V
range. For example, the V

supply applied to the device could

CC1

CC1

supply

be 1.8 V while the preceding device could be supplied from a 2.5 V or

3.3 V supply rail. There are no internal diodes to the supply rails,
so the ADG3231 can handle inputs above the supply but inside
the absolute maximum ratings stated.

Normal Operation

The signal path is from A1 to Y1. The device will level translate
the signal applied to A1 to a V

logic level (this level translation

CC1

can be to either a higher or a lower supply) and route the signal
to the Y1 output, which will have standard V

supplies.

V

CC2

The supplies in Figure 2 may be any combination of
e.g., V

CC1

and V

may be anywhere in the range of 1.65 V to

CC2

OL/VOH

levels for

supplies,

3.6 V.

V

CC2

Y1

VCC2

DEVICE 2

SIGNAL OUTPUT

Figure 2. Typical Operation of the ADG3231 Level Translating Switch

–6–

REV. 0

OUTLINE DIMENSIONS

6-Lead Small Outline Transistor Package [SOT-23]

(RJ-6)

Dimensions shown in millimeters

2.90 BSC

ADG3231

1.60 BSC

1.30

1.15

0.90

0.15 MAX

2

1.90

BSC

0.50

0.30

4 5

0.95 BSC

2.80 BSC

1.45 MAX

SEATING
PLANE

6

1 3

PIN 1

COMPLIANT TO JEDEC STANDARDS MO-178AB

0.22

0.08
10ⴗ

0.60

4ⴗ

0.45

0ⴗ

0.30

REV. 0

–7–

C03298–0–5/03(0)

–8–