Datasheet ADC12048CIVF, ADC12048CIV Datasheet (NSC)

Page 1
ADC12048 12-Bit Plus Sign 216 kHz 8-Channel Sampling Analog-to-Digital Converter
ADC12048 12-Bit Plus Sign 216 kHz 8-Channel Sampling Analog-to-Digital Converter
April 2000
General Description
Operating from a single 5V power supply,theADC12048 is a 12 bit + sign, parallel I/O, self-calibrating, sampling analog-to-digital converter (ADC) with an eight input fully dif­ferential analog multiplexer. The maximum sampling rate is 216 kHz. On request, the ADC goes through a self-calibration process that adjusts linearity, zero and full-scale errors.
TheADC12048’s8-channelmultiplexer is software program­mable to operate in a variety of combinations of single-ended, differential, or pseudo-differential modes. The fully differentialMUXandthe 12-bit + sign ADC allowsforthe difference between two signals to be digitized.
TheADC12048 can be configured to work with many popular microprocessors/microcontrollers and DSPs including Na­tional’s HPC family, Intel386 and 8051, TMS320C25, Mo­torola MC68HC11/16, Hitachi 64180 and Analog Devices ADSP21xx.
For complementary voltage references see the LM4040, LM4041 or LM9140.
Features
n 8-channel programmable Differential or Single-Ended
multiplexer
n Programmable Acquisition Times and user-controllable
Throughput Rates
n Programmable data bus width (8/13 bits) n Built-in Sample-and-Hold n Programmable Auto-Calibration and Auto-Zero cycles n Low power standby mode n No missing codes
Key Specifications
(f
= 12 MHz)
CLK
n Resolution 12-bits + sign n 13-bit conversion time 3.6 µs, max n 13-bit throughput rate 216 ksamples/s, min n Integral Linearity Error (ILE) n Single Supply +5V n V
Range GND to VA+
IN
n Power consumption
— Normal operation 34 mW, max — Stand-by mode 75 µw, max
±
1 LSB, max
±
10%
Applications
n Medical instrumentation n Process control systems n Test equipment n Data logging n Inertial guidance
Block Diagram
DS012387-1
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
© 2000 National Semiconductor Corporation DS012387 www.national.com
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Connection Diagrams
ADC12048
PLCC Package
Order Number ADC12048CIV
See NS Package Number V44A
DS012387-2
PQFP Package
DS012387-3
Order Number ADC12048CIVF
See NS Package Number VGZ44A
Ordering Information
Industrial Temperature Range Package
−40˚C T
+85˚C
A
ADC12048CIV PLCC ADC12048CIVF PQFP ADC12048EVAL Evaluation board
Pin Description
PLCC Pkg. PQFP Pkg. Pin Name Description Pin Number Pin Number
6 44 CH0 The eight analog inputs to the Multiplexer. Active channels are selected 7 1 CH1 8 2 CH2 9 3 CH3 15 9 CH4 16 10 CH5 17 11 CH6 18 12 CH7 14 8 COM This pin is another analog input pin used as a pseudo ground when the
13 7 V
+ Positive reference input. The operating voltage range for this input is
REF
based on the contents of bits b3–b0 of the Configuration register. Refer to section titled MUX for more details.
multiplexer is configured in single-ended mode.
1V V
+ VA+ (see
REF
Figure 3
and4). This pin should be bypassed to AGND at least with a parallel combination of a 10 µF and a 0.1 µF (ceramic) capacitors. The capacitors should be placed as close to the part as possible.
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Pin Description (Continued)
PLCC Pkg. PQFP Pkg. Pin Name Description Pin Number Pin Number
12 6 V
19 13 MUX OUT− The inverting (negative) and non-inverting (positive) outputs of the 21 15 MUX OUT+ 20 14 ADCIN− ADC inputs. The inverting (negative) and non-inverting (positive) inputs
22 16 ADCIN+ 24 18 WMODE The logic state of this pin at power-up determines which edge of the
25 19 SYNC The SYNC pin can be programmed as an input or an output. The
26–31 20–25 D0–D5 13-bit Data bus of the ADC12048. D12 is the most significant bit and
34–40 29–34 D6–D12
43 37 CLK The clock input pin used to drive the ADC12048. The operating range
44 38 WR
139RD
240CSCS is the active low Chip Select input pin. Used in conjunction with the
3 41 RDY
4 42 STDBY
10 4 V
Negative reference input. The operating voltage range for this input is
REF
0V V
REF
V
+ −1 (see
REF
Figure 3
and4). This pin should be bypassed to AGND at least with a parallel combination of a 10 µF and a 0.1 µF (ceramic) capacitor. The capacitors should be placed as close to the part as possible.
multiplexer. The analog inputs to the MUX selected by bits b3–b0 of the Configuration register appear at these pins.
into the ADC.
write signal (WR) will latch in data from the data bus. If tied low, the ADC12048 will latch in data on the rising edge of the WR signal. If tied to a logic high, data will he latched in on the falling edge of the WR signal. The state of this pin should not be changed after power-up.
Configuration register’s bit b8 controls the function of this pin. When programmed as an input pin (b8 = 1), a rising edge on this pin causes the ADC’s sample-and-hold to hold the analog input signal and begin conversion. When programmed as an output pin (b8 = 0), the SYNC pin goes high when a conversion begins and returns low when completed.
D0 is the least significant. The BW (bus width) bit of the Configuration register (b12) selects between an 8-bit or 13-bit data bus width. When the BW bit is cleared (BW = 0), D7–D0 are active and D12–D8 are always in TRI-STATE. When the BW bit is set (BW = 1), D12–D0 are active.
is 0.05 MHz to 12 MHz. WR is the active low WRITE control input pin. A logic low on this pin
and the CS will enable the input buffers of the data pins D12–D0. The signal at this pin is used by the ADC12048 to latch in data on D12–D0. The sense of the WMODE pin at power-up will determine which edge of the WR signal the ADC12048 will latch in data. See WMODE pin description.
RD is the active low read control input pin. A logic low on this pin and CS will enable the active output buffers to drive the data bus.
WR and RD signals to control the active data bus input/output buffers of the data bus.
RDY is an active low output pin. The signal at this pin indicates when a requested function has begun or ended. Refer to section Functional Description and the digital timing diagrams for more detail.
This is the standby active low output pin. This pin is low when the ADC12048 is in the standby mode and high when the ADC12048 is out of the standby mode or has been requested to leave the standby mode.
+ Analog supply input pin. The device operating supply voltage range is
A
±
10%. Accuracy is guaranteed only if the VA+ and VD+ are
+5V connected to the same potential. This pin should be bypassed to AGND with a parallel combination of a 10 µF and a 0.1 µF (ceramic) capacitor. The capacitors should be placed as close to the supply pins of the part as possible.
ADC12048
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Pin Description (Continued)
PLCC Pkg. PQFP Pkg. Pin Name Description
ADC12048
Pin Number Pin Number
11 5 AGND Analog ground pin. This is the device’s analog supply ground
connection. It should be connected through a low resistance and low inductance ground return to the system power supply.
32 and 41 26 and 35 V
33 and 42 27 and 36 DGND Digital ground pin. This is the device’s digital supply ground connection.
+ Digital supply input pins. The device operating supply voltage range is
D
±
10%. Accuracy is guaranteed only if the VA+ and VD+ are
+5V connected to the same potential. This pin should be bypassed to DGND with a parallel combination of a 10 µF and a 0.1 µF (ceramic) capacitor. The capacitors should be placed as close to the supply pins of the part as possible.
It should be connected through a low resistance and low inductance ground return to the system power supply.
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ADC12048
Absolute Maximum Ratings (Notes 1, 2)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
Supply Voltage (V Voltage at all Inputs −0.3V to V
+−VD+| 300 mV
|V
A
|AGND − DGND| 300 mV Input Current at Any Pin (Note 3) Package Input Current (Note 3) Power Dissipation (Note 4)
= 25˚C 875 mW
at T
A
Storage Temperature −65˚C to +150˚C
+ and VD+) 6.0V
A
+
+ 0.3V
±
30 mA
±
120 mA
Lead Temperature
VF Package
Vapor Phase (60 sec.) 210˚C Infared (15 sec.) 220˚C
V Package, Infared (15 sec.) 300˚C
ESD Susceptibility (Note 5) 3.0 kV
Operating Ratings (Notes 1, 2, 6, 7, 8, 9)
Temperature Range
(T
TA≤ T
min
Supply Voltage
+, VD+ 4.5V to 5.5V
V
A
+−VD+| 100 mV
|V
A
) −40˚C TA≤ 85˚C
max
|AGND − DGND| 100 mV
Voltage Range
V
IN
at all Inputs GND V
+ Input Voltage 1V V
V
REF
− Input Voltage 0 V
V
REF
+−V
V
REF
Common Mode
V
REF
(Note 16) 0.1 V
−1VV
REF
+ V
A
REF
V
REFCM
VA+
IN
+ VA+
REF
+−1V
REF
VA+
REF
0.6 VA+
Converter DC Characteristics
The following specifications apply to the ADC12048 for VA+=VD+ = 5V, V sion mode, f common-mode voltage (V
=T
to T
MIN
= 12.0 MHz, RS=25Ω, source impedance for V
CLK
; all other limits TA=TJ= 25˚C
MAX
), and minimum acquisition time, unless otherwise specified. Boldface limits apply for TA=T
INCM
REF
+ and V
Symbol Parameter Conditions Typical Limits Unit
Resolution with No Missing
After Auto-Cal 13 Bits (max)
Codes
ILE Integral Linearity Error After Auto-Cal
(Notes 12, 17)
+ = 4.096V, V
REF
1, fully differential input with fixed 2.048V
REF
− = 0.0V, 12-bit + sign conver-
REF
(Note 10) (Note 11) (Limit)
±
0.6
±
1 LSB (max)
J
DNL Differential Non-Linearity After Auto-Cal
±
1 LSB (max)
Zero Error After Auto-Cal (Notes 13, 17)
V
= 5.0V
INCM
V
= 2.048V
INCM
V
=0V
INCM
Positive Full-Scale Error After Auto-Cal (Notes 12, 17) Negative Full-Scale Error After Auto-Cal (Notes 12, 17) DC Common Mode Error After Auto-Cal (Note 14)
TUE Total Unadjusted Error After Auto-Cal (Note 18)
±
1.0
±
1.0
±
2
±
1 LSB
±
5.5 LSB (max)
±
2.5 LSB (max)
±
5.5 LSB (max)
±
2.5 LSB (max)
±
2.5 LSB (max)
±
5.5 LSB (max)
Power Supply Characteristics
The following specifications apply to the ADC12048 for VA+=VD+ = 5V, V sion mode, f common-mode voltage, and minimum acquisition time, unless otherwise specified. Boldface limits apply for T
to T
; all other limits TA=TJ= 25˚C
MAX
= 12.0 MHz, RS=25Ω, source impedance for V
CLK
REF
+ and V
Symbol Parameter Conditions Typical Limits Unit
PSS Power Supply Sensitivity V
Zero Error V Full-Scale Error V
+=VA+ = 5.0V±10% (Note 15)
D
+ = 4.096V
REF
−=0V
REF
Linearity Error
+ = 4.096V, V
REF
1, fully differential input with fixed 2.048V
REF
− = 0.0V, 12-bit + sign conver-
REF
A=TJ=TMIN
(Note 10) (Note 11) (Limit)
±
0.1 LSB
±
0.5 LSB
±
0.1 LSB
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Power Supply Characteristics (Continued)
The following specifications apply to the ADC12048 for VA+=VD+ = 5V, V sion mode, f
ADC12048
common-mode voltage, and minimum acquisition time, unless otherwise specified. Boldface limits apply for T to T
; all other limits TA=TJ= 25˚C
MAX
= 12.0 MHz, RS=25Ω, source impedance for V
CLK
REF
+ and V
Symbol Parameter Conditions Typical Limits Unit
I
+V
D
+ Digital Supply Current Start Command (Performing a
D
conversion) with SYNC configured as an input and driven with a 214 kHz signal. Bus width set to 13.
= 12.0 MHz, Reset Mode 850 µA
f
CLK
f
= 12.0 MHz, Conversion 2.45 2.8 mA (max)
CLK
I
+V
A
+ Analog Supply Current Start Command (Performing a
A
conversion) with SYNC configured as an input and driven with a 214 kHz signal. Bus width set to 13.
= 12.0 MHz, Reset Mode 2.3 mA
f
CLK
f
= 12.0 MHz, Conversion 2.3 4.0 mA (max)
CLK
I
ST
Standby Supply Current Standby Mode (I
++IA+) f
D
= Stopped 5 15 µA (max)
CLK
f
= 12.0 MHz 100 120 µA (max)
CLK
+ = 4.096V, V
REF
1, fully differential input with fixed 2.048V
REF
− = 0.0V, 12-bit + sign conver-
REF
A=TJ=TMIN
(Note 10) (Note 11) (Limit)
Analog MUX Inputs Characteristics
The following specifications apply to the ADC12048 for VA+=VD+= 5V, V sion mode, f common-mode voltage, and minimum acquisition time, unless otherwise specified. Boldface limits apply for T
to T
; all other limits TA=TJ= 25˚C
MAX
= 12.0 MHz, RS=25Ω, source impedance for V
CLK
REF
+ and V
Symbol Parameter Conditions Typical Limits Unit
I
ON
I
OFF
I
ADCIN
R
ON
C
MUX
MUX ON Channel Leakage Current
MUX OFF Channel Leakage Current
ON Channel = 5V, OFF Channel = 0V 0.05 1.0 µA (min) ON Channel = 0V, OFF Channel = 5V −0.05 1.0 µA (max) ON Channel = 5V, OFF Channel = 0V 0.05 1.0 µA (min)
ON Channel = 0V, OFF Channel = 5V −0.05 −1.0 µA (max) ADCIN Input Leakage Current 0.05 2.0 µA (max) MUX On Resistance VIN= 2.5V 310 500 (max) MUX Channel-to-Channel R
Matching
ON
V
IN
= 2.5V
MUX Channel and COM Input Capacitance
C
ADC
C
MUXOUT
ADCIN Input Capacitance 70 pF MUX Output Capacitance 20 pF
+ = 4.096V, V
REF
+ 1, fully differential input with fixed 2.048V
REF
− = 0.0V, 12-Bit + sign conver-
REF
A=TJ=TMIN
(Note 10) (Note 11) (Limit)
±
20%
10 pF
Reference Inputs
The following specifications apply to the ADC12048 for VA+=VD+ = 5V, V version mode, f
2.048V common-mode voltage, and minimum acquisition time, unless otherwise specified. Boldface limits apply for T
=T
to T
MIN
MAX
= 12.0 MHz, RS=25Ω, source impedance for V
CLK
; all other limits TA=TJ= 25˚C
REF
Symbol Parameter Conditions Typical Limits Unit
I
REF
Reference Input Current V
+ 4.096V, V
REF
REF−
=0V Analog Input Signal: 1 kHz 145 µA (Note 20) 80 kHz 136 µA
C
REF
Reference Input Capacitance
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REF
+ and V
+ = 4.096V, V
1, fully differential input with fixed
REF
− = 0.0V, 12-bit + sign con-
REF
(Note 10) (Note 11) (Limit)
85 pF
A=TJ
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Digital Logic Input/Output Characteristics
The following specifications apply to the ADC12048 for VA+=VD+ = 5V, V version mode, f
2.048V common-mode voltage, and minimum acquisition time, unless otherwise specified. Boldface limits apply for T
=T
to T
MIN
MAX
= 12.0 MHz, RS=25Ω, source impedance for V
CLK
; all other limits TA=TJ= 25˚C
REF
Symbol Parameter Conditions Typical Limits Unit
V V I I V
V
I
C
IH
IL IH IL
OH
OL
OFF
IN
Logic High Input Voltage VA+=VD+ = 5.5V 2.0 V (min) Logic Low Input Voltage VA+=VD+ = 4.5V 0.8 V (max) Logic High Input Current VIN= 5V 0.035 2.0 µA (max) Logic Low Input Current VIN= 0V −0.035 −2.0 µA (max) Logic High Output Voltage VA+=VD+ = 4.5V
= −1.6 mA
I
OUT
Logic Low Output Voltage VA+=VD+ = 4.5V
= 1.6 mA
I
OUT
TRI-STATE®Output Leakage Current
V V
OUT OUT
=0V =5V
D12–D0 Input Capacitance
REF
+ and V
+ = 4.096V, V
1, fully differential input with fixed
REF
− = 0.0V, 12-bit + sign con-
REF
(Note 10) (Note 11) (Limit)
2.4 V (min)
0.4 V (max)
±
2.0 µA (max)
10 pF
A=TJ
Converter AC Characteristics
The following specifications apply to the ADC12048 for VS+=VD+ = 5V, V version mode, f
2.048V common-mode voltage, and minimum acquisition time, unless otherwise specified. Boldface limits apply for T
TJ=T
MIN
to T
= 12.0 MHz, RS=25Ω, source impedance for V
CLK
; all other limits TA=TJ= 25˚C
MAX
REF
Symbol Parameter Conditions Typical Limits Unit
t t
Z
CAL
Auto Zero Time 78 78 clks + 120 ns clks (max) Full Calibration Time 4946 4946 clks + 120 ns clks (max) CLK Duty Cycle 50 %
t
CONV
t
AcqSYNCOUT
Conversion Time Sync-Out Mode 44 44 clks (max) Acquisition Time
(Programmable)
Minimum for 13 Bits 9 9 clks + 120 ns clks (max) Maximum for 13 Bits 79 79 clks + 120 ns clks (max)
REF
+ and V
+ = 4.096V, V
1, fully differential input with fixed
REF
− = 0.0V, 12-bit + sign con-
REF
(Note 10) (Note 11) (Limit)
40 % (min) 60 % (max)
A
ADC12048
=
Digital Timing Characteristics
The following specifications apply to the ADC12048, 13-bit data bus width, VA+=VD+ = 5V, f
= 50 pF on data I/O lines
Symbol Parameter Conditions Typical Limits Units
t
TPR
Throughput Rate Sync-Out Mode (SYNC Bit
= “0”) 9 Clock Cycles of Acquisition Time
t
CSWR
t
WRCS
t
WR
t
WRSETFalling
t
WRHOLDFalling
t
WRSETRising
t
WRHOLDRising
t
CSRD
t
RDCS
t
RDDATA
Falling Edge of CS to Falling Edge of WR 0ns Active Edge of WR to Rising Edge of CS 0ns WR Pulse Width 20 30 ns (min) Write Setup Time WMODE = “1” 20 ns (min) Write Hold Time WMODE = “1” 5 ns (min) Write Setup Time WMODE = “0” 20 ns (min) Write Hold Time WMODE = “0” 5 ns (min) Falling Edge of CS to Falling Edge of RD 0ns Rising Edge of RD to Rising Edge of CS 0ns Falling Edge of RD to Valid Data 8-Bit Mode (BW Bit = “0”) 40 58 ns (max)
= 12 MHz, tf= 3 ns and C
CLK
(Note 10) (Note 11) (Limit)
222 kHz
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Digital Timing Characteristics (Continued)
The following specifications apply to the ADC12048, 13-bit data bus width, VA+=VD+ = 5V, f = 50 pF on data I/O lines
ADC12048
Symbol Parameter Conditions Typical Limits Units
t
RDDATA
t
RDHOLD
t
RDRDY
Falling Edge of RD to Valid Data 13-Bit Mode (BW Bit = “1”) 26 44 ns (max) Read Hold Time 23 32 ns (max) Rising Edge of RD to Rising Edge of
RDY
t
WRRDY
Active Edge of WR to Rising Edge of
WMODE = “1”
RDY
t
STNDBY
Active Edge of WR to Falling Edge of STDBY
WMODE = “0”. Writing the Standby Command into the Configuration Register
t
STDONE
Active Edge of WR to Rising Edge of STDBY
WMODE = “0”. Writing the RESET Command into the Configuration Register
t
STDRDY
Active Edge of WR to Falling Edge of RDY
WMODE = “0”. Writing the RESET Command into the Configuration Register
t
SYNC
Minimum SYNC Pulse Width 5 10 ns (min)
= 12 MHz, tf= 3 ns and C
CLK
(Note 10) (Note 11) (Limit)
24 38 ns (max)
42 65 ns (max)
200 230 ns (max)
30 45 ns (max)
1.4 2.5 ms (max)
Notes on Specifications
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test condi­tions.
Note 2: All voltages are measured with respect to GND, unless otherwise specified. Note 3: When the input voltage (V
30 mA. The 120 mA maximum package input current limits the number of pins that can safely exceed the power supplies with an input current of 30 mA to four. Note 4: The maximum power dissipation must he derated at elevated temperatures and is dictated by T
tion to ambient thermal resistance), and T the number given in theAbsolute Maximum Ratings, whichever is lower. For this device, T in the V package, when board mounted, is 55˚C/W, and in the VF package, when board mounted, is 67.8˚C/W.
Note 5: Human body model, 100 pF discharged through 1.5 kresistor. Note 6: Each input and output is protected by a nominal 6.5V breakdown voltage zener diode to GND; as shown below, input voltage magnitude up to 0.3V above
V
+ or 0.3V below GND will not damage the ADC12048. There are parasitic diodes that exist between the inputs and the power supply rails and errors in the A/D
A
conversion can occur if these diodes are forward biased by more than 50 mV.As an example, if V accurate conversions.
) at any pin exceeds the power supply rails (V
IN
(ambient temperature). The maximum allowable power dissipation at any temperature is P
A
IN
<
GND or V
Jmax
>
(VA+orVD+)), the current at that pin should be limited to
IN
, (maximum junction temperature), θJA(package junc-
Jmax
= 150˚C, and the typical thermal resistance (θJA) of the ADC12048
+ is 4.50 VDC, full-scale input voltage must be 4.55 VDCto ensure
A
Dmax
=(T
Jmax−TA
L
)/θJAor
DS012387-4
Note 7: V comparison accuracy. Refer to the Power Supply Considerations section for a detailed discussion.
Note 8: Accuracy is guaranteed when operating at f Note 9: With the test condition for V Note 10: Typicals are at T Note 11: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level). Note 12: Positive integral linearity error is defined as the deviation of the analog value, expressed in LSBs, from the straight line that passes through positive
full-scale and zero. For negative integral linearity error, the straight line passes through negative full-scale and zero.
+ and VD+ must be connected together to the same power supply voltage and bypassed with separate capacitors at each V+pin to assure conversion/
A
= 12 MHz.
CLK
+−V
REF(VREF
= 25˚C and represent most likely parametric norm.
A
−) given as +4.096V, the 12-bit LSB is 1.000 mV.
REF
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Notes on Specifications (Continued)
Note 13: Zero error is a measure of the deviation from the mid-scale voltage (a code of zero), expressed in LSB. It is the average value of the code transitions be-
tween −1 to 0 and 0 to +1 (see Note 14: The DC common-mode error is measured with both inputs shorted together and driven from0V to 5V. The measured value is referred to the resulting out-
put value when the inputs are driven with a 2.5V input.
Note 15: Power Supply Sensitivity is measured after an Auto-Zero and Auto Calibration cycle has been completed with V Note 16: V
(Reference Voltage Common Mode Range) is defined as
REFCM
Figure 8
).
+ and VD+ at the specified extremes.
A
ADC12048
Note 17: The ADC12048’s self-calibration technique ensures linearity and offset errors as specified, but noise inherent in the self-calibration process will result in
a repeatability uncertainly of
Note 18: Total Unadjusted Error (TUE) includes offset, full scale linearity and MUX errors. Note 19: The ADC12048 parts used to gather the information for these curves were auto-calibrated prior to taking the measurements at each test condition. The
auto-calibration cycle cancels any first order drifts due to test conditions. However, each measurement has a repeatability uncertainty error of 0.2 LSB. See (Note
17). Note 20: The reference input current is a DC average current drawn by the reference input with a full-scale sinewave input. The ADC12048 is continuously con-
verting with a throughput rate of 206 kHz. Note 21: These typical curves were measured during continuous conversions with a positive half-scale DC input. A 240 ns RD pulse was applied 25 ns after the
RDY signal went low. The data bus lines were loaded with 2 HC family CMOS inputs (CL∼ 20 pF). Note 22: Any other values placed in the command field are meaningless. However, if a code of 101 or 110is placed in the command field and the CS, RD and WR
go low at the same time, theADC12048 will enter a test mode. These test modes are only to be used by the manufacturer of this device. A hardware power-off and power-on reset must be done to get out of these test modes.
±
0.20 LSB.
Electrical Characteristics
DS012387-5
FIGURE 1. Output Digital Code vs the Operating Input Voltage Range (General Case)
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Electrical Characteristics (Continued)
ADC12048
FIGURE 2. Output Digital Code vs the Operating Input Voltage Range for V
REF
DS012387-6
= 4.096V
FIGURE 3. V
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Operating Range (General Case)
REF
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Electrical Characteristics (Continued)
ADC12048
FIGURE 4. V
Operating Range for VA=5V
REF
FIGURE 5. Transfer Characteristic
DS012387-8
DS012387-9
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Electrical Characteristics (Continued)
ADC12048
FIGURE 6. Simplified Error vs Output Code without Auto-Calibration or Auto-Zero Cycles
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FIGURE 7. Simplified Error vs Output Code after Auto-Calibration Cycle
FIGURE 8. Offset or Zero Error Voltage (Note 13)
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Timing Diagrams
ADC12048
FIGURE 9. Sync-Out Write (WMODE = 1, BW = 1), Read and Convert Cycles
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FIGURE 10. Sync-In Write (WMODE = 1, BW = 1), Read and Convert Cycles
DS012387-14
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Timing Diagrams (Continued)
ADC12048
FIGURE 11. Sync-Out Write (WMODE = 0, BW = 1), Read and Convert Cycles
DS012387-46
FIGURE 12. Sync-In Write (WMODE = 0, BW = 1), Read and Convert Cycles
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Timing Diagrams (Continued)
ADC12048
FIGURE 13. Sync-Out Read and Convert Cycles. The MUX channel
is the channel selected on the most recent write cycle.
DS012387-48
FIGURE 14. Sync-In Read and Convert Cycles. The MUX channel
is the channel selected on the most recent write cycle.
DS012387-49
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Timing Diagrams (Continued)
ADC12048
FIGURE 15. 8-Bit Bus Read Cycle (Sync-Out)
DS012387-50
FIGURE 16. 8-Bit Bus Read Cycle (Sync-In)
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Timing Diagrams (Continued)
FIGURE 17. Write Signal Negates RDY (Writing the Standby, Auto-Cal or Auto-Zero Command)
ADC12048
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FIGURE 18. Standby and Reset Timing (13-Bit Data Bus Width)
Typical Performance Characteristics (See (Note 19), Electrical Characteristic Section)
Integral Linearity Error (INL) Change vs Clock Frequency
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Full-Scale Error Change vs Clock Frequency
Zero Error Change vs Clock Frequency
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DS012387-16
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Typical Performance Characteristics (See (Note 19), Electrical Characteristic Section) (Continued)
Integral Linearity Error (INL)
ADC12048
Change vs Temperature
Integral Linearity Error (INL) Change vs Reference Voltage
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Full-Scale Error Change vs Temperature
Full-Scale Error Change vs Reference Voltage
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Zero Error Change vs Temperature
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Zero Error Change vs Reference Voltage
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Integral Linearity Error (INL) Change vs Supply Voltage
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Full-Scale Error Change vs Supply Voltage
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Zero Error Change vs Supply Voltage
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Page 19
Typical Performance Characteristics (See (Note 21), Electrical Characteristic Section)
ADC12048
Supply Currents vs Clock Frequency
Analog Supply Current vs Temperature
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Reference Currents vs Clock Frequency
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Digital Supply Current vs Temperature
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Typical Performance Characteristics (See (Note 21), Electrical Characteristic Section) (Continued)
Full Scale Differential 1,099 Hz
ADC12048
Sine Wave Input
Full Scale Differential 38,452 Hz Sine Wave Input
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Full Scale Differential 18,677 Hz Sine Wave Input
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Full Scale Differential 79,468 Hz Sine Wave Input
Half Scale Differential 1 kHz Sine Wave Input, f
= 153.6 kHz
S
Half Scale Differential 40 kHz Sine Wave Input, f
= 153.6 kHz
S
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Half Scale Differential 20 kHz Sine Wave Input, f
= 153.6 kHz
S
Half Scale Differential 75 kHz Sine Wave Input, f
= 153.6 kHz
S
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Page 21
Typical Performance Characteristics (See (Note 21), Electrical Characteristic Section) (Continued) Register Bit Description
CONFIGURATION REGISTER (Write Only)
This is a 13-bit write-only register that is used to program the functionality of the ADC12048.All data written to the ADC12048 will always go to this register only. The contents of this register cannot be read.
MSB LSB
b
12
BW COMMAND FIELD SYNC HB SE ACQ TIME MUX ADDRESS
Power on State: 0100Hex b
: The MUX ADDRESS bits configure the analog input MUX. They select which input channels of the MUX will connect to
3–b0
the MUXOUT+ and MUXOUT− pins. (Refer to the MUX section for more details on the MUX.) Power-up value is 0000.
b
: The ACQ TIME bits select one of four possible acquistion times in SYNC-OUT mode. (Refer to Selectable Acquisition
5–b4
Time section.)
b
11
b
10
b
9
b
8
b
7
b
6
b
b
5
4
b
3
b
2
b
b
1
0
TABLE 1. MUX Channel Assignment
b
3
b
2
b
1
b
0
MUXOUT+ MUXOUT−
0000CH0 CH1 0001CH1 CH0 0010CH2 CH3 0011CH3 CH2 0100CH4 CH5 0101CH5 CH4 0110CH6 CH7 0111CH7 CH6 1000CH0 COM 1001CH1 COM 1010CH2 COM 1011CH3 COM 1100CH4 COM 1101CH5 COM 1110CH6 COM 1111CH7 COM
ADC12048
b
5
b
4
Clocks
00 9 01 15 10 47 11 79
b
:When the Single-Ended bit (SE bit) is set, conversion results will be limited to positive values only and any negative conver-
6
sion results will appear as a code of zero in the Data register. The SE bit is cleared at power-up. b
: The High Byte bit (HB) is meaningful only in 8-bit mode (BW bit b12= “0”) and is a don’t care condition in 13-bit mode (BW
7
bit b
= “1”). This bit is used to access the upper byte of the Configuration Register in 8-bit mode. When this bit is set and bit
12
b
= 0, the next byte written to the ADC12048 will program the upper byte of the Configuration register.The HB bit will automati-
12
cally be cleared when data is written to the upper byte of the Configuration register, allowing the lower byte to be accessed with the next write. The HB bit is cleared at power-up.
b
: The SYNC bit.WhentheSYNCbit is set, the SYNC pin is programmed as an input and the converter is in synchronous mode.
8
In this mode a rising edge on the SYNC pin causes the ADC to hold the input signal and begin a conversion. When b
cleared,
15
the SYNC pin is programmed as an output and the converter is in an asynchronous mode. In this mode the signal at the SYNC pin indicates the status of the converter. The SYNC pin is high when a conversion is taking place. The SYNC bit is set at
power-up. b
: The command field. These bits select the mode of operation of the ADC12048. Power-up value is 000. (See (Note 22))
11–b9
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Page 22
Register Bit Description (Continued)
b
11
ADC12048
0 0 0 Standby command. This puts the ADC in a low power consumption mode
b
10
b
9
Command
0 0 1 Ful-Cal command. This will cause the ADC to perform a self-calibrating cycle that will correct
linearity and zero errors.
0 1 0 Auto-zero command. This will cause the ADC to perform an auto-zero cycle that corrects
offset errors. 0 1 1 Reset command. This puts the ADC in an idle mode. 1 0 0 Start command. This will put the converter in a start mode, preparing it to perform a
conversion. If in asynchronous mode (b
programmed acquisition time has ended. In synchronous mode (b
= “0”), conversions will immediately begin after the
8
= “1”), conversions will
8
begin after a rising edge appears on the SYNC pin.
b
: This is the Bus Width (BW) bit. When this bit is a ’0’ theADC12048is configured to interface with an 8-bit data bus; data pins
12
D
are active and pins D12–D9are in TRI-STATE. When the BW bit is a ’1’, the ADC12048 is configured to interface with a
7–D0
16-bit data bus and data pins D
are all active. The BW bit is a ’0’ at power-up.
13–D0
DATA REGISTER (Read Only)
This is a 13-bit read only register that holds the 12-bit +sign conversion result in two’s compliment form. All reads performed from the ADC12048 will place the contents of this register on the data bus. When reading the data register in 8-bit mode, the sign bit is extended (b
through b8all contain the sign bit).
12
MSB LSB
b
12b11b10
b
b
b
b
9
8
7
6
b5b
b
b
b
4
3
2
b
1
0
sign Conversion Data
Power on State: 0000Hex
: b11is the most significant bit and b0is the least significant bit of the conversion result.
b
11–b0
b
: This bit contains the sign of the conversion result: 0 for positive results and 1 for negative.
12
Functional Description
The ADC12048 is programmed through a digital interface that supports an 8-bit or 16-bit data bus. The digital interface consists of a 13-bit data input/output bus (D control signals and two internal registers: a write only 13-bit Configuration register and a read only 13-bit Data register.
The Configuration register programs the functionality of the ADC12048. The 13 bits of the Configuration register are di­vided into 7 fields. Each field controls a specific function of the ADC12048: the channel selection of the MUX, the acqui­sition time, synchronous or asynchronous conversions, mode of operation and the data bus size.
12–D0
), digital
figuration register. When reading the ADC in 8-bit mode, the first read cycle places the lower byte of the Data register on the data bus followed by the upper byte during the next read cycle.
In 13-bit mode the HB bitisa don’t care condition and all bits of the data register and Configuration register are accessible with a single read or write cycle. Since the bus width of the ADC12048 defaults to 8 bits after power-up, the first action when 13-bit mode is desired must be set to the bus width to 13 bits.
WMODE
The WMODE pin is used to determine the active edge of the write pulse. The state of this pin determines which edge of
Features and Operating Modes
the WR signal willcausethe ADC to latch in data.This is pro­cessor dependent. If the processor has valid data on the bus
SELECTABLE BUS WIDTH
TheADC12048 can be programmed to interface with an 8-bit or 16-bit data bus. The BW bit (b
) in the Configuration reg-
12
ister controls the bus size. The bus width is set to 8 bits (D bit is cleared or 13 bits (D
are active and D12–D8are in TRI-STATE) if the BW
7–D0
are active) if the BW bit is
12–D0
during the falling edge of the WR signal, the WMODE pin must be tied to VD+. This willcausethe ADC to latch the data on the fallingedgeof the WR signal. If data is valid ontheris­ing edge of the WR signal, the WMODE pin must be tied to DGND causing the ADC to latch in the data on the rising edge of the WR signal.
set.At power-up the bus width defaults to 8 bits and any ini­tial programming of the ADC12048 should take this into con­sideration.
In 8-bit mode the Configuration register is byte accessible. The HB bit in the lower byte of the Configuration register is used to access the upper byte. If the HB bit is set with a write to the lower byte, the next byte written to the ADC will be placed in the upper byte of the Configuration register. After data is written to the upper byte of the Configuration register, the HB bit will automatically be cleared, causing the next byte written to the ADC to go to the lower byte of the Con-
INPUT MULTIPLEXER
TheADC12048has an eight channel input multiplexer with a COM input that can be used in a single-ended, pseudo-differential or fully-differentialmode.The MUX select bits (b
) in the Configuration register determine which
3–b0
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Features and Operating Modes
(Continued)
being applied to the ADC inputs. The ADCIN+ and ADCIN− are the fully differential non-inverting (positive) and inverting (negative) inputs to the analog-to-digital converter (ADC) of the ADC12048. If no external signal conditioning is required on the signal output of the multiplexer, MUXOUT+ should be connected to ADCIN+ and MUXOUT− should be connected to ADCIN−.
The analog input multiplexer can be set up to operate in ei­ther one of eight differential or eight single-ended (the COM input as the zero reference) modes. In the differential mode, the analog inputs are paired as follows: CH0 with CH1, CH2 with CH3, CH4 with CH5 andCH6withCH7. The input chan­nel pairs can be connected to the MUXOUT+ and MUXOUT− pins in any order. In the single-ended mode, one of the input channels, CH0 through CH7, can be assigned to MUXOUT+ while the MUXOUT− is always assigned to the COM input.
STANDBY MODE
The ADC12048 has a low power consumption mode (75 µW
@
5V). This mode is entered when a Standby command is written in the command field of the Configuration register. A logic low appearing on the STDBY output pin indicates that the ADC12048 is in the Standby mode. Any command other than the Standby command written to the Configuration reg­ister will get the ADC12048 out of the Standby mode. The STDBY pin will immediately switch to a logic “1” as soon as the ADC12048 is requested to get out of the standby mode. The RDY pin will then be asserted low when the ADC is ac­tually out of the Standby mode and ready for normal opera­tion. The ADC12048 defaults to the Standby mode following a hardware power-up. This can be verified by examining the logic low status of the STDBY pin.
SYNC/ASYNC MODE
The ADC12048 may be programmed to operate in synchro­nous (SYNC-IN) or asynchronous (SYNC-OUT) mode. To enter synchronous mode, the SYNC bit in the Configuration register must be set.The ADC12048 is in synchronous mode after a hardware power-up. In this mode, the SYNC pin is programmed as an input and conversions are synchronized to the rising edges of the signal applied at the SYNC pin. Ac­quisition time can also be controlled by the SYNC signal when in synchronous mode. Refer to the sync-in timing dia­grams. When the SYNC bit is cleared, the ADC is in asyn­chronous mode and the SYNC pin is programmed as an out­put. In asynchronous mode, the signal at the SYNC pin indicates the status of the converter. This pin is high when the converter is performing a conversion. Refer to the sync-out timing diagrams.
SELECTABLE ACQUISITION TIME
The ADC12048’s internal sample/hold circuitry samples an input voltage by connecting the input to an internal sampling capacitor (approximately 70 pF) through an effective resis­tance equal to the multiplexer “On” resistance (300max) plus the “On” resistance of the analog switch at the input to the sample/hold circuit (2500typical) and the effective out­put resistance of the source. For conversion results to be ac­curate, the period during which the sampling capacitor is connected to the source (the “acquisition time”) must be long enough to charge the capacitor to within a small fraction of an LSB of the input voltage. An acquisition time of 750 ns is
In asynchronous (SYNC-OUT) mode, the acquisition time is controlled by an internal counter. The minimum acquisition period is 9 clock cycles, which corresponds to the nominal value of 750 ns when the clock frequency is 12 MHz. Bits b and b5of the Configuration Register are used to select the acquisition time from among four possible values (9, 15, 47, or 79 clock cycles). Since acquisition time in the asynchro­nous mode is based on counting clock cycles, it is also in­versely proportional to clock frequency:
Note that the actual acquisition time will be longer than T
ACQ
because acquisition begins either when the multiplexer channel is changed or when RDY goes low, if the multiplexer channel is not changed.After a read is performed, RDY goes high, which starts the T
In synchronous (SYNC-IN) mode, bits b
counter (see
ACQ
Figure 9
and b5are ignored,
4
).
and the acquisition time depends on the sync signal applied at the SYNC pin. If a new MUX channel is selected at the start of the conversion, the acquisition period begins on the active edge of the WR signal that latches in the new MUX channel. If no new MUX channel is selected, the acquisition period begins onthefalling edge of RDY, which occurs at the end of the previous conversion (or at the end of an autozero or autocalibration procedure). The acquisition period ends when SYNC goes high.
To estimate the acquisition time necessary for accurate con­versions when the source resistance is greater than 1 k, use the following expression:
where RSis the source resistance, RMis the MUX “On” re­sistance, and R
is the sample/hold “On” resistance.
S/H
If the settling time of the source is greater than 500 ns, the acquisition time should be about 300 ns longer than the set­tling time for a “well-behaved”, smoothsettlingcharacteristic.
FULL CALIBRATION CYCLE
A full calibration cycle compensates for the ADC’s linearity and offset errors. The converter’s DC specifications are guaranteed only after a full calibration has been performed. A full calibration cycle is initated by writing a Ful-Cal com­mand to the ADC12048. During a full calibration, the offset error is measured eight times, averaged and a correction co­efficient is created. The offset correction coefficient is stored in an internal offset correction register.
The overall Iinearity correction is achieved by correctng the internal DAC’s capacitor mismatches. Each capacitor is compared eight times against all remaining smaller value ca­pacitors. The errors are averaged and correction coefficients are created.
ADC12048
4
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Features and Operating Modes
(Continued)
Once the converter has been calibrated, an arithmetic logic
ADC12048
unit (ALU) uses the offsetandlinearitycorrection coefficients to reduce the conversion offset and linearity errors to within guaranteed limits.
AUTO-ZERO CYCLE
During an auto-zero cycle, the offset is measured only once and a correction coefficient is created and stored in an inter­nal offsetregister.An auto-zero cycle is initiated by writing an Auto-Zero command to the ADC12048.
DIGITAL INTERFACE
The digital control signals are CS, RD, WR, RDY and STDBY. Specific timing relationships are associated with the interaction of these signals. Refer to the Digital Timing Dia­grams section for detailed timing specifications. The active low RDY signal indicates when a certain event begins and ends. It is recommended that the ADC12048 should only be accessed when the RDY signal is low. It is in this state that the ADC12048 is ready to accept a new command. This will minimize the effect of noise generated by a switching data bus on the ADC. The only exception to this is when the ADC12048 is in the standby mode at which time the RDY is high and the STDBY signal is low. The ADC12048 is in the standby mode atpowerup or when a STANDBYcommand is issued. A Ful-Cal, Auto-Zero, Reset or Start command will get theADC12048 out of the standby mode. This may be ob­served by monitoring the status of the RDY and STDBY sig­nals. The RDY signal will go low and the STDBY signal high when the ADC12048 leaves the standby mode.
The following describes the state of the digitalcontrolsignals for each programmed event in both 8-bit and 13-bit mode. RDY should be low before each command is issued except for the case when the device is in standby mode.
FUL-CAL OR AUTO-ZERO COMMAND
8-bit
mode: The first write to the ADC12048 will place the data in the lower byte of the Configuration register.This byte must set the HB bit (b the Configuration register during the next write cycle. During the second write cycle, the Ful-Cal or Auto-Zero command must be issued. The edge of the second write pulse on the WR pin will force the RDY signal high. At this time the con­verter begins executing a full calibration or auto-zero cycle. The RDY signal will automatically go low when the full cali­bration or auto-zero cycle is done.
13-bit
mode: In a single write cycle the Ful-Cal or Auto-Zero command must be written to theADC12048. The edge of the WR signal will force the RDY high. At this time the converter begins executing a full calibration or auto-zero cycle. The RDY signal will automatically go low when the full calibration or auto-zero cycle is done.
STARTING A CONVERSION: START COMMAND
In order to completely describe the events associated with the Start command, both the SYNC-OUT and SYNC-IN modes must be considered.
SYNC-OUT/Asynchronous 8-bit
mode: Thefirstbyte written to the ADC12048 shouldset the MUX channel, the acquisition time and the HB bit. The second byte should clear the SYNC bit, write the START command and clear the BW bit. In order to initiate a conver-
) to allow access to the upper byte of
7
and b4of the configuration register.The SYNC pin will
5
go high indicating that a conversion sequence hasbegunfol­lowing the end of the acquisition period.The RDY and SYNC signal will fall low when the conversion is done. At this time new information, such as a new MUX channel, acquisition time and operational command can be written into the con­figuration register or it can remain unchanged. Assuming that the START command is in theConfigurationregister, the previous conversion can be read. The first read places the lower byte of the conversion resultcontainedinthe Data reg­ister on the data bus. The second read will place the upper byte of the conversion result stored in the Data register on the data bus. The rising edge on the second read pulse will begin another conversion sequence and raise the RDY and SYNC signals appropriately.
13-bit
mode: The MUX channel and the acquisition time should be set, the SYNC bit cleared and the START com­mand issued with a single write to the ADC12048. In order to initiate a conversion, a single read must be performed from the ADC12048. The rising edge of the read signal will force the RDY signal high and begin the programmed acquisition time selected by bits b5and b4of the configuration register. The SYNC pin will go high indicating that a conversion se­quence has begun following the end of the acquisition pe­riod. The RDY and SYNC signal will fall low when the con­version is done. At this time new information, such as a new MUX channel, acquisition time and operational command can be written into the configuration register or it can remain unchanged. With the START command in the Configuration register, a read from the ADC12048 will place the entire 13-bit conversion result stored in the data register on the data bus. The rising edge of the read pulse will immediately force the RDY output high. The SYNC will then go high fol­lowing the elapse of the programmed acquisition time in the configuration register’s bits b
and b4.
5
SYNC-IN/Synchronous
For the SYNC-IN case, it is assumed that a series of SYNC pulses at the desired sampling rate are applied at the SYNC pin of the ADC12048.
8-bit
mode: Thefirstbyte written to the ADC12048 shouldset the MUX channelandthe HB bit. The second byte should set the SYNC bit, write the START command and clear the BW bit.
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ADC12048
Features and Operating Modes
(Continued)
register on the data bus. With the START command in the configuration register, the rising edge of the second read pulse will raise the RDY signal high and begin a conversion cycle following a rising edge on the SYNC pin.
13-bit
mode: The MUX channel should be selected, the SYNC bit should be set and the START command issued with a single write to the ADC12048. A rising edge on the SYNC pin or on the RD pin will force the RDY signal high. It is recommended that the action of reading from the ADC12048 (not the rising edge of the SYNC signal) be used to raise the RDY signal. This will ensure that the conversion result is read during the acquisition period of the next con­version cycle, eliminating a read from the ADC12048 while it is performing a conversion. Noise generated by accessing the ADC12048 while it is converting may degrade the con­version result. In the SYNC-IN mode, only the rising edge of the SYNC signal will begin a conversion cycle. The RDY sig­nal will go low when the conversion cycle is done.Theacqui­sition time is controlled by the SYNC signal. The acquisition period begins following a write cycle containing MUX chan­nel information. The selected MUX channel is sampled after the rising edge of the WR signal until the rising edge of the SYNC pulse, at which time the signal will be held and con­version begins.Anew MUX channel and/or operational com­mand may be written into the Configuration register at this time, if needed. With the START command in the Configura­tion register, a read from the ADC12048 will place the entire conversion result stored in the Data register on the data bus and the rising edge of the read pulse will force the RDY sig­nal high. The selected MUX channel will be sampled until a rising edge appears on the SYNC pin, at which the time sampled signal will be held and a conversion cycle started.
Analog Application Information
REFERENCE VOLTAGE
TheADC12048 has two reference inputs, V They define the zero to full-scale range of the analog input signals over which 4095 positive and 4096 negative codes exist. The reference inputs can be connected to span the en­tire supply voltage range (V
− = AGND, V
REF
they can be connected to different voltages when other input spans are required. The reference inputs of the ADC12048 have transient capacitive switching currents. The voltage sources driving V
REF
+ and V
− must have very low output
REF
impedence and noise and must be adequately bypassed. The circuit in
Figure 20
is an example of a very stable refer-
ence source. The ADC12048 can be used in either ratiometric or absolute
reference appplications. In ratiometric systems, the analog input voltage is proportional to the voltage used for the ADC’s reference voltage. This technique relaxes the system reference requirements because the analog input voltage moves with the ADC’s reference. The system power supply can be used as the reference voltage by connecting the V
+ pin to VA+ and the V
REF
− pin to AGND. For absolute
REF
accuracy, where the analog input voltage varies between very specific voltage limits, a time and temperature stable voltage source can be connected to the reference inputs. Typically, the reference voltage’s magnitude will require an initial adjustment to null reference voltage induced full-scale errors.
The reference voltage inputs are not fully differential. The ADC12048 will not generate correct conversions if (V
+) – (V
REF
able relationship between V
−) is below 1V.
REF
REF
Figure 19
+ and V
+ and V
REF
+=VA+) or
REF
shows the allow-
−.
REF
REF
−.
STANDBY COMMAND
8-bit
mode: Thefirstbyte written to the ADC12048 shouldset the HB bit in the Configuration register (bit b byte must issue the Standby command (bits b
). The second
7
11,b10,b9
=0,
0, 0).
13-bit
mode: The Standby command must be issued to the
ADC12048 in single write (bits b
11,b10,b9
=0,0,0).
RESET
The RESET command places the ADC12048 into a ready state and forces the RDY signal low. The RESET command can be used to interrupt the ADC12048 while it is performing a conversion, full-calibration or auto-zero cycle. It can also be used to get the ADC12048 out of the standby mode.
FIGURE 19. V
Operating Range
REF
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Analog Application Information (Continued)
ADC12048
*
Tantalum
**
Ceramic
FIGURE 20. Low Drift Extremely Stable Reference Circuit
Part Number Output Voltage Temperature
LM4041CI-Adj LM4040AI-4.1 LM4050 LM4121 LM9140BYZ-4.1 Circuit of
Figure 20
Tolerance Coefficient
Adjustable
±
0.5%
±
0.1%
±
0.2%
±
0.1%
±
0.5%
±
100ppm/˚C
±
100ppm/˚C
±
50ppm/˚C
±
50ppm/˚C
±
25ppm/˚C
±
2ppm/˚C
DS012387-36
OUTPUT DIGITAL CODE VERSUS ANALOG INPUT VOLTAGE
The ADC12048’s fully differential 12-bit + sign ADC gener­ates a two’s complement output that is found by using the equation shown below:
Round off the result to the nearest integer value between
−4096 and 4095.
INPUT CURRENT
At the start of the acquisition window (t ing current (due to capacitive switching) flows through the analog input pins (CH0–CH7,ADCIN+ and ADCIN−, and the COM). The peak value of this input current will depend on the amplitude and frequency of the input voltage applied, the source impedance and the input switch ON resistance. With the MUXOUT+ connected to the ADCIN+ and the MUXOUT− connected to the ADCIN− the on resistance is typically 2800. Bypassing the MUX and using just the AD­CIN+ and ADCIN− inputs the on resistance is typically 2500.
For low impedance voltage sources ( operation), the input charging current will decay to a value that will not introduce any conversion errors before the end of the default sample-and-hold (S/H) acquisition time (9 clock cycles). For higher source impedances ( 12 MHz operation), the S/H acquisition time should be in­creased to allow the charging current to settle within speci­fied limits. In asynchronous mode, the acquisition time may
AcqSYNOUT
<
1000for 12 MHz
) a charg-
>
1000for
be increased to 15, 47 or 79 clock cycles. If different acqui­sition times are needed, the synchronous mode can be used to fully control the acquisition time.
INPUT BYPASS CAPACITANCE
External capacitors (0.01 µF–0.1 µF) can be connected be­tween the analog input pins (CH0–CH7) and the analog ground to filter any noise caused by inconductive pickup as­sociated with long leads.
POWER SUPPLY CONSIDERATIONS
Decoupling and bypassing the power supply on a high reso­lution ADC is an important design task. Noise spikes on the V
+ (analog supply) or VD+ (digital supply) can cause con-
A
version errors. The analog comparator used in the ADC will respond to power supply noise and will makeerroneouscon­version decisions. The ADC is especially sensitive to power supply spikes that occur during the auto-zero orlinearitycali­bration cycles.
The ADC12048 is designed to operate from a single +5V power supply. The separate supply and ground pins for the analog and digital portions of the circuit allowseparateexter­nal bypassing. To minimize power supply noise and ripple, adequate bypass capacitors should be placed directly be­tween power supply pins and their associated grounds. Both supply pins should be connected to the same supply source. In systems with separate analog and digital supplies, the ADC should be powered from the analog supply. At least a 10 µF tantalum electrolytic capacitor in parallel with a 0.1 µF monolithic ceramic capacitor is recommended for bypassing each power supply. The key consideration for these capaci­tors is to have low series resistance and inductance. The ca-
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Page 27
Analog Application Information
(Continued)
pacitors should be placed as close as physically possible to the supply and ground pins with the smaller capacitor closer to the device. The capacitors also should have the shortest possible leads in order to minimize series lead inductance. Surface mount chip capacitors are optimal in this respect and should be used when possible.
When the power supply regulator is not local on the board, adequate bypassing (a high value electrolytic capacitor) should be placed at the power entry point. The value of the capacitor depends on the total supply current of the circuits on the PC board. All supply currents should be supplied by the capacitor instead of being drawn from the external sup­ply lines, while the external supply charges the capacitor at a steady rate.
The ADC has two V that each of these V DGND with a 0.1 µF plus a 10 µF capacitor. The layout dia­gram of
Figure 21
the supply bypass capacitors.
PC BOARD LAYOUT AND GROUNDING CONSIDERATlONS
To get the best possible performance from the ADC12048, the printed circuit boards should have separate analog and digital ground planes. The reason for using two ground planes is to prevent digital and analog ground currents from sharing the same path until they reach a very low impedance power supply point. This will prevent noisy digital switching currents from being injected into the analog ground.
Figure 21
illustrates a favorable layout for ground planes, power supply and reference input bypass capacitors. It shows a layout using a 44-pin PLCC socket and through-hole assembly. A similar approach should be used for the PQFP package.
+ and DGND pins. It is recommended
D
+ pins be separately bypassed to
D
shows the recommended placement for
The analog ground plane should encompass the area under the analog pins and any other analog components such as the reference circuit, input amplifiers, signal conditioning cir­cuits, and analog signal traces.
The digital ground plane should encompass the area under the digital circuits and the digital input/output pins of the ADC12048. Having a continuous digital ground plane under the data and clock traces is very important. This reduces the overshoot/undershoot and high frequency ringing on these lines that can be capacitively coupled to analog circuitry sec­tions through stray capacitances.
The AGND and DGND in the ADC12048 are not internally connected together. They should be connected together on the PC board right at the chip. This will provide the shortest return path for the signals being exchanged between the in­ternal analog and digital sections of the ADC.
It is also a good design practice to have power plane layers in the PC board. This will improve the supply bypassing (an effective distributed capacitance between power and ground plane layers) and voltage drops on the supply lines. How­ever,power planes are not as essential as groundplanesare for satisfactory performance. If power planes are used, they should be separated into two planes and the area and con­nections should follow the same guidelines as mentioned for the ground planes. Each power plane should be laid out over its associated ground planes, avoiding any overlap between power and ground planes of different types. When the power planes are not used, it is recommended to use separate sup­ply traces for the V
+ and VD+ pins from a low impedance
A
supply point (the regulator output or the power entry point to the PC board). This will help ensure that the noisy digital supply does not corrupt the analog supply.
ADC12048
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Page 28
Analog Application Information (Continued)
ADC12048
FIGURE 21. Top View of Printed Circuit Board for a 44-Pin PLCC ADC12048
When measuring AC input signals, any crosstalk between analog input/output lines and the reference lines (CH0–CH7, MUXOUT
±
, ADC IN±,V
±
) should be minimized.
REF
Crosstalk is minimized by reducing any stray capacitance between the lines. This can be done by increasing the clear­ance between traces, keeping the traces as short as pos­sible, shielding traces from each other by placing them on different sides of the AGND plane, or running AGND traces between them.
Figure 21
also shows the reference input bypass capacitors.
Here the reference inputs are considered to be differential.
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DS012387-38
The performance improves by having a 0.1 µF capacitor be­tween the V
REF
+ and V
−, and by bypassing in a manner
REF
similar to that described for the supply pins. When a single ended reference is used, V only two capacitors are used between V
− is connected to AGND and
REF
REF
+ and V
REF
(0.1 µF + 10 µF). It is recommended to directly connect the AGND side of these capacitors to the V necting V
− and the ground sides of the capacitors sepa-
REF
− instead of con-
REF
rately to the ground planes. This provides a significantly lower-impedance connection when using surface mount technology.
Page 29
Physical Dimensions inches (millimeters) unless otherwise noted
ADC12048
44-Lead Molded Plastic Leaded Chip Carrier
Order Number ADC12048CIV
NS Package Number V44A
44-Lead (10mm x 10mm) Molded Plastic Quad Flat Package
Order Number ADC12048CIVF
NS Package Number VGZ44A
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Page 30
Notes
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NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in
ADC12048 12-Bit Plus Sign 216 kHz 8-Channel Sampling Analog-to-Digital Converter
accordance with instructions for use provided in the
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
labeling, can be reasonably expected to result in a significant injury to the user.
National Semiconductor Corporation
Americas Tel: 1-800-272-9959 Fax: 1-800-737-7018 Email: support@nsc.com
www.national.com
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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Fax: +49 (0) 180-530 85 86
Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790
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