>4.0 Gbps (2 V swings)
120 ps rise time/fall time (2 V swings)
<1.0 W for dual driver (<500 mW/channel)
−1 V to +3.5 V range
Fast termination mode (VTx)
Cable loss compensation
APPLICATIONS
Automatic test equipment
Semiconductor test systems
Board test systems
Instrumentation and characterization equipment
High speed memory testing (DDR2/DDR3/DDR4)
HDMI testing
GENERAL DESCRIPTION
The ADATE209 is a dual pin driver designed for testing DDR2,
DDR3, and DDR4. It can also be used for high speed SoC applications, such as testing PCI Express 1.0 and HDMI™. The device is a
three-level driver capable of high fidelity swings from 200 mV
to 4 V over a −1 V to +3.5 V range. It has rise/fall times (20% to
80%) under 120 ps for a 2 V programmed swing and 150 ps for
ADATE209
FUNCTIONAL BLOCK DIAGRAM
H1
VL1
VT1
DA1
DB1
TERM1
DA2
DB2
TERM2
Figure 1.
a 3 V programmed swing, and is capable of supporting data
rates of 4.4 Gbps and 3.2 Gbps, respectively.
The device is capable of high speed transitions into and out of
termination mode. It also contains peaking/pre-emphasis circuitry.
The ADATE209 is available in an 8 mm × 8 mm, 49-ball
CSP_BGA.
CLC1EN
VH2
VL2
CLC2EN
VT2
DROUT1
DROUT2
07277-001
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
VCC = 7.0 V, VEE = −4.5 V, GND = 0.0 V; all test conditions are as defined in Table 7, unless otherwise specified. All specified values are at
= 70°C, where TJ corresponds to the internal temperature sensor, unless otherwise noted. Temperature coefficients are measured at TJ =
T
J
70°C ± 20°C, unless otherwise noted. Typical values are based on design, simulation analyses, and/or limited bench evaluations. Typical
values are not tested or guaranteed.
Table 1.
Te st
Parameter Min Typ Max Unit
TOTAL FUNCTION
DROUTx Pin Range −1.0 +3.5 V I
POWER SUPPLIES
Positive Supply, VCC 6.65 7.0 7.35 V I Defines PSRR conditions
Negative Supply, VEE −4.73 −4.5 −4.28 V I Defines PSRR conditions
Data and Termination, V
Data and Termination, I
Positive Supply Current, ICC 50 76 100 mA II
Negative Supply Current, IEE 60 80 110 mA II
Total Power Dissipation 0.5 0.87 1.3 W II
0.97 W III
TEMPERATURE MONITORS
Temperature Sensor Gain −4.7
Temperature Sensor Offset 3.1 V III Voltage reading at 30°C
Input Voltage Differential 0.25 0.8 V IV
Common-Mode Voltage −1.0 +3.3 V IV
Input Bias Current −10 +1.2 +10 μA II
Pin Output Characteristics
Output High Range, VHx −0.9 +3.5 V I
Output Low Range, VLx −1.0 +3.4 V I
Output Termination Range, VTx −1.0 +3.5 V I
Output High Range, VHx −0.9 +4.0 V I VCC = 7.5 V, this range is not production tested
Output Low Range, VLx −1.0 +3.9 V I VCC = 7.5 V, this range is not production tested
Output Termination Range, VTx −1.0 +4.0 V I VCC = 7.5 V, this range is not production tested
Functional Amplitude (VHx − VLx) 0.2 4.5 V I
DC Output Current-Limit Source 50 60 70 mA II
DAx
DAx
, V
, V
DBx
, I
DBx
−1 +1.3 +3.3 V I
TERMx
, I
40 mA I
TERMx
mV/°C
Rev. 0 | Page 3 of 16
Level1 Test Conditions/Comments
Exceeding 40 mA through any input
termination resistor may cause damage to the
device or cause long-term reliability concerns
Quiescent; excludes current draw through data
input termination resistors
VLx = 0.0 V, VHx = 2.0 V; driver toggling into
open circuit; excludes current draw through
data input termination resistors
III
9 mA pushed into DAxB/DBxB/TERMxB signal,
0.6 V forced on DAx/DBx/TERMx signal; DAxT,
DBxT, TERMxT open; measure voltage from
DAx/DBx/ TERMx signal to DAxB/DBxB/TERMxB
signal, calculate resistance (ΔV/ΔI)
Each pin tested at −1.0 V and +3.3 V, while other
high speed pins (DAxB, DBx, DBxB, TERMx,
TERMxB) are left open, termination pins (DAxT,
DBxT, TERMxT ) open
Amplitude can be programmed to VHx = VLx,
accuracy specifications apply when VHx − VLx ≥
200 mV
Driver high, VHx = 3.5 V, short DROUTx pin to
−1.0 V, then measure current
ADATE209
www.BDTIC.com/ADI
Te st
Parameter Min Typ Max Unit
DC Output Current-Limit Sink −70 −60 −50 mA II
Output Resistance, ±30 mA 46.5 48.5 50.5 Ω II
Absolute Accuracy
VHx, VLx, VTx Offset −150 +20 +150 mV II Measured at 0.0 V, target: improve offset
VHx, VLx, VTx Offset Temperature
Coefficient
VHx, VLx, VTx Gain 0.97 1.02 1.03 %FSR II Relative to straight line from 0.0 V to 2.0 V
VHx, VLx, VTx Linearity −15 ±2.4 +15 mV II
VLx, VHx, VTx Interaction 0.3 mV III
VHx, VLx, VTx DC PSRR −36 +24 +36 mV/V II
VHx, VLx, VTx Input Bias Current −10 +1 +10 μA II
DRIVER AC SPECIFICATIONS
Rise/Fall Times Toggle DAx inputs
0.2 V Programmed Swing 115 ps V VHx = 0.2 V, VLx = 0.0 V, terminated, 20% to 80%
0.5 V Programmed Swing 90 ps V VHx = 0.5 V, VLx = 0.0 V, terminated, 20% to 80%
1.0 V Programmed Swing 90 ps V VHx = 1.0 V, VLx = 0.0 V, terminated, 20% to 80%
3.0 V Programmed Swing 150 ps V VHx = 3.0 V, VLx = 0.0 V, terminated, 20% to 80%
4.0 V Programmed Swing 190 ps V VHx = 3.5 V, VLx = −0.5 V, terminated, 20% to 80%
Rise-to-Fall Matching 10 ps V
Minimum Pulse Width Toggle both DAx and DBx inputs
0.2 V Programmed Swing 200 ps V
0.5 V Programmed Swing 180 ps V
1.0 V Programmed Swing 180 ps V
2.0 V Programmed Swing 200 ps V
3.0 V Programmed Swing 300 ps V
Maximum Toggle Rate 2.5 GHz V
2.2 GHz V
1.8 GHz V
270 μV/°C III Measured at calibration points, 0.0 V and 2.0 V
Level1 Test Conditions/Comments
Driver high, VHx = −1.0 V, short DROUTx pin to
3.5 V, then measure current
Source: driver high, VHx = 3.0 V, I
9 mA; sink: driver low, VLx = 0.0 V, I
/ΔI
and −9 mA; ΔV
VHx tests conducted with VLx = −1.0 V and
VTx = −1.0 V; VLx tests conducted with VHx =
3.5 V and VTx = 3.5 V; VTx tests conducted with
VLx = −1.0 V and VHx = 3.5 V
After two-point gain/offset calibration, relative
to straight line from 0.0 V to 2.0 V
VLx = −1.0 V, VHx swept from −0.9 V to +3.5 V,
VTx swept from −1.0 V to 3.5 V,
VHx = 3.5 V, VLx swept from −1.0 V to +3.4 V,
VTx swept from −0.8 V to +3.5 V,
VTx = 1.5 V, VLx swept from −1.0 V to +3.5 V,
VHx swept from −1.0 V to +3.5 V
Change in output voltage as power supplies are
moved by ±5%; measured at calibration points,
0.0 V and 2.0 V
VHx = 1.0 V, VLx = 0.0 V, terminated; rise to fall
within one channel
VHx = 0.2 V, VLx = 0.0 V, terminated, timing error
less than ±25 ps
VHx = 0.5 V, VLx = 0.0 V, terminated, timing error
less than ±25 ps
VHx = 1.0 V, VLx = 0.0 V, terminated, timing error
less than ±25 ps
VHx = 2.0 V, VLx = 0.0 V, terminated, timing error
less than ±25 ps
VHx = 3.0 V, VLx = 0.0 V, terminated, timing error
less than ±25 ps
Positive Supply Voltage (VCC to GND) −0.5 V to +8.0 V
Negative Supply Voltage (VEE to GND) −5.0 V to +0.5 V
Supply Voltage Difference (VCC to VEE) −1.0 V to +13 V
Reference Ground (DUTGND to GND) −0.5 V to +0.5 V
Input Voltages
Input Common-Mode Voltage VEE to VCC
Short-Circuit Voltage (RL = 0 Ω, V
Continuous Short-Circuit Condition)
High Speed Input Voltage
(Data and Termination Inputs, DAx, DBx,
and TERMx)
High Speed Differential Input Voltage
(DAx, DBx, TERMx to Termination Pin
DAxT, DBxT, TERMxT)
VHx, VLx, VTx −2 V to +4.5 V
CLCxEN −1 V to +3.5 V
DROUTx I/O Pin Current
DCL MaximumShort-Circuit Current
RL = 0 Ω, V
(
Current Limit)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
= −1.5 V to +4 V; DCL
DUT
DUT
−1.5 V to +4.0 V
−1.5 V to +3.9 V
2 V
±100 mA
THERMAL RESISTANCE
θJA is specified for the following conditions: JEDEC 4L PCB,
50°C, and 100 LFM forced convection. θ
cold plate and 50°C ambient temperature.
Table 3. Thermal Resistance
Package Type θJA θ
49-Ball CSP_BGA 48.4 3.9 °C/W
is specified for a 50°C
JC
Unit
JC
EXPLANATION OF TEST LEVELS
I. Definition.
II. 100% Production Tested.
III. Characterized on Tester.
IV. Functionally Checked During Production Test.
V. Characterized on Bench.
ESD CAUTION
Rev. 0 | Page 6 of 16
ADATE209
www.BDTIC.com/ADI
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1234567
GNDVEEDROUT2GNDDROUT1VEEG ND
A
TERM2
B
TERM2B
C
DA2DA2T
D
DA2B
E
DB2DB2T
F
DB2BCLC2ENVT2
G
TERM2T
VCC
GND
VEEGNDVEEVCCTERM1
VCCGNDVCCTERM1TTERM1B
GND
VH2
VL2
Figure 2. Pin Configuration
GNDGNDDA1TDA1
GNDVH1GNDDA1B
VCCTHERMVL1DB1TDB1
THERM
VT1CLC1ENDB1B
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
A1 GND Ground.
A2 VEE Negative Power Supply, −4.5 V.
A3 DROUT2 Driver Output, Channel 2.
A4 GND Ground.
A5 DROUT1 Driver Output, Channel 1.
A6 VEE Negative Power Supply, −4.5 V.
A7 GND Ground.
B1 TERM2 Termination Mode Data Input. Noninverting input for Channel 2.
B2 VCC Positive Power Supply, 7.0 V.
B3 VEE Negative Power Supply, −4.5 V.
B4 GND Ground.
B5 VEE Negative Power Supply, − 4.5 V.
B6 VCC Positive Power Supply, 7.0 V.
B7 TERM1 Termination Mode Data Input. Noninverting input for Channel 1.
C1 TERM2B Termination Mode Data Input. Inverting input for Channel 2.
C2 TERM2T Termination Pin for Termination Mode Data Input, Channel 2.
C3 VCC Positive Power Supply, 7.0 V.
C4 GND Ground.
C5 VCC Positive Power Supply, 7.0 V.
C6 TERM1T Termination Pin for Termination Mode Data Input, Channel 1.
C7 TERM1B Termination Mode Data Input. Inverting input for Channel 1.
D1 DA2 Data Input A. Noninverting input for Channel 2.
D2 DA2T Termination for Data Input A, Channel 2.
D3 GND Ground.
Rev. 0 | Page 7 of 16
07277-002
ADATE209
www.BDTIC.com/ADI
Pin No. Mnemonic Description
D4 GND Ground.
D5 GND Ground.
D6 DA1T Termination for Data Input A, Channel 1.
D7 DA1 Data Input A. Noninverting input for Channel 1.
E1 DA2B Data Input A. Inverting input for Channel 2.
E2 GND Ground.
E3 VH2 VH Input, Channel 2.
E4 GND Ground.
E5 VH1 VH Input, Channel 1.
E6 GND Ground.
E7 DA1B Data Input A. Inverting input for Channel 1.
F1 DB2 Data Input B. Noninverting input for Channel 2.
F2 DB2T Termination for Data Input B, Channel 2.
F3 VL2 VL Input, Channel 2.
F4 VCCTHERM Positive Power Supply for Thermal Diode String, 7.0 V.
F5 VL1 VL Input, Channel 1.
F6 DB1T Termination for Data Input B, Channel 1.
F7 DB1 Data Input B. Noninverting input for Channel 1.
G1 DB2B Data Input B. Inverting input for Channel 2.
G2 CLC2EN Cable-Loss Compensation Control Pin, Channel 2.
G3 VT2 VT Input, Channel 2.
G4 THERM Thermal Diode Connection.
G5 VT1 VT Input, Channel 1.
G6 CLC1EN Cable-Loss Compensation Control Pin, Channel 1.
G7 DB1B Data Input B. Inverting input for Channel 1.
Rev. 0 | Page 8 of 16
ADATE209
www.BDTIC.com/ADI
TYPICAL PERFORMANCE CHARACTERISTICS
0.30
0.25
0.5V
1.2
1.0
0.20
0.15
0.10
VOLTAGE (V)
0.05
–0.05
0
0
0.29
0.2V
0.58
0.87
1.16
1.45
1.74
2.03
2.32
2.61
2.90
3.19
3.48
3.77
4.06
4.35
4.64
TIME (ns)
4.93
Figure 3. Small Signal Response, VHx = 500 mV, 200 mV, VLx = 0.0 V
1.8
1.6
1.4
1.2
1.0
0.8
0.6
VOLTAGE (V)
0.4
0.2
0
–0.2
0
0.29
0.58
0.87
1.16
1.45
1.74
2.03
2.32
2.61
2.90
3.19
3.48
3.77
4.06
4.35
4.64
TIME (ns)
4.93
Figure 4. Large Signal Response, VHx = 3.0 V, 2.0 V, 1.0 V, VLx = 0.0 V
The ADATE209 contains three high speed differential inputs
for each channel. Two of the inputs, combined in an on-chip
exclusive-OR gate, control the VHx/VLx transitions. The
exclusive-OR gate can be used as a data mux or for data inversion.
The third input is used to control the transitions to the VTx level.
Table 5. Logic Truth Table
DAx DBx TERMx DROUTx
Low Low Low VL
High Low Low VH
Low High Low VH
High High Low VL
X1 X
1
X = don’t care.
1
High VT
The high speed inputs are designed to be compatible with most
types of differential inputs. Each side of the differential inputs is
terminated through 50 Ω to a common point. For connection to
PECL inputs, connect the DAxT/DBxT/TERMxT input
termination to V
− 2.0 V (VCC of the input signal, not of the
CC
ADATE209) or to an appropriate resistor to ground. For connection to LVDS, do not connect DAxT/DBxT/TERMxT. For
connection to CML signals, either leave DAxT/DBxT/TERMxT
open or connect DAxT/DBxT/TERMxT to the appropriate
V
CC/VDD
level.
DAxT, DBxT,
TERMxT
CABLE LOSS COMPENSATION/PEAKING
CIRCUITRY
The ADATE209 has two different CLC/peaking modes: nominal
and boost. In nominal mode, a small amount of high frequency
energy is injected in the driver output signal to compensate for
high frequency losses in the test interface. In boost mode, a
much larger percentage of high frequency energy is injected in
the driver output signal. The two modes are controlled through
the CLCxEN signal.
Table 6.
CLCxEN CLC/Peaking Mode
Logic low Nominal
Logic high Boost
For applications using very short path lengths, very high fidelity
cables and connectors, and/or lower data rates, nominal mode
should be used. For applications using lower fidelity cables and
connectors (and often lower cost) and/or at higher data rates,
use boost mode.
CCTHERM
40Ω
THERM
GND
Figure 32. Thermal Diode String Schematic
ADATE209
07277-032
50Ω
DAx, DBx,
TERMx
DAxB, DBxB,
TERMxB
Figure 31. Input Termination Schematic Diagram
50Ω
07277-031
THERMAL DIODE STRING
Figure 32 shows a simplified schematic of the thermal diode
string. To use the diode string, connect VCCTHERM to 7.0 V
and measure the voltage at THERM. The nominal gain of the
thermal diode string is −4.7 mV/°C.
DEFAULT TEST CONDITIONS
Table 7 lists the default test conditions.
Table 7.
Name Default Test Condition
DB1/DB1B Logic high
DB2/DB2B Logic high
DA1T/DA2T/DB1T/DB2T 1.3 V
VHx 2.0 V
VLx 0.0 V
VTx 1.0 V
Rev. 0 | Page 14 of 16
ADATE209
www.BDTIC.com/ADI
OUTLINE DIMENSIONS
8.10
8.00 SQ
A1 BALL
CORNER
7.90
TOP VIEW
3.275
REF
3.225
REF
6.00
BSC SQ
1.00
BSC
7654231
BOTTOM VIEW
A
B
C
D
E
F
G
A1 BALL
CORNER
0.68
0.63
0.58
0.305 REF
0.100 REF
COPLANARITY
0.10
030408-A
*
1.60 MAX
1.21 NOM
DETAIL A
0.60
0.56
0.52
0.55
0.50
0.45
SEATING
PLANE
*
COMPLIANT TO JEDEC ST ANDARDS MO-192-ABB-1 W ITH
EXCEPTIO N TO PACKAGE HEI GHT.