full operating conditions
SFDR = 78 dBc to f
Single carrier WCDMA ACLR = 79 dBc @ 80 MHz IF
Analog output: adjustable 8.7 mA to 31.7 mA,
= 25 Ω to 50 Ω
R
L
Novel 2×, 4×, and 8× interpolator/coarse complex modulator
allows carrier placement anywhere in DAC bandwidth
Auxiliary DACs allow control of external VGA and offset control
Multiple chip synchronization interface
High performance, low noise PLL clock multiplier
Digital inverse sinc filter
100-lead, exposed paddle TQFP package
APPLICATIONS
Wireless infrastructure
WCDMA, CDMA2000, TD-SCDMA, WiMax, GSM
Digital high or low IF synthesis
Internal digital upconversion capability
Transmit diversity
Wideband communications: LMDS/MMDS, point-to-point
= 100 MHz
OUT
AD9776/AD9778/AD9779
GENERAL DESCRIPTION
The AD9776/AD9778/AD9779 are dual, 12-/14-/16-bit, high
dynamic range, digital-to-analog converters (DACs) that provide a sample rate of 1 GSPS, permitting multicarrier generation
up to the Nyquist frequency. They include features optimized
for direct conversion transmit applications, including complex
digital modulation, and gain and offset compensation. The DAC
outputs are optimized to interface seamlessly with analog quadrature modulators such as the AD8349. A serial peripheral interface
(SPI®) provides for programming/readback of many internal
parameters. Full-scale output current can be programmed over a
range of 10 mA to 30 mA. The devices are manufactured on an
advanced 0.18 m CMOS process and operate on 1.8 V and
3.3 V supplies for a total power consumption of 1.0 W. They are
enclosed in 100-lead TQFP packages.
PRODUCT HIGHLIGHTS
1. Ultralow noise and intermodulation distortion (IMD)
enable high quality synthesis of wideband signals from
baseband to high intermediate frequencies.
2. A proprietary DAC output switching technique enhances
dynamic performance.
3. The current outputs are easily configured for various
single-ended or differential circuit topologies.
4. CMOS data input interface with adjustable set up and hold.
5. Novel 2×, 4×, and 8× interpolator/coarse complex
modulator allows carrier placement anywhere in DAC
bandwidth.
TYPICAL SIGNAL CHAIN
COMPLEX I AND Q
DC
DC
FPGA/ASIC/DSP
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Output Voltage High, VOA or V
Output Voltage Low, VOA or V
OB
OB
825 1575 mV
1025 mV
Output Differential Voltage, |VOD| 150 200 250 mV
Output Offset Voltage, V
Output Impedance, R
O
OS
1150 1250 mV
Single-ended 80 100 120 Ω
Maximum Clock Rate 1 GHz
DAC CLOCK INPUT (CLK+, CLK−)
Differential Peak-to-Peak Voltage (CLK+, CLK−)
3
400 800 2000 mV
Common-Mode Voltage 300 400 500 mV
Maximum Clock Rate
4
1 GSPS
SERIAL PERIPHERAL INTERFACE
Maximum Clock Rate (SCLK) 40 MHz
Minimum Pulse Width High 12.5 ns
Minimum Pulse Width Low 12.5 ns
1
Specification is at a DATACLK frequency of 100 MHz into a 1 kΩ load; maximum drive capability of 8 mA. At higher speeds or greater loads, best practice suggests
using an external buffer for this signal.
2
Guaranteed at 25°C. Can drift above 120 Ω at temperatures above 25°C.
3
When using the PLL, a differential swing of 2 V p-p is recommended.
4
Typical maximum clock rate when DVDD18 = CVDD18 = 1.9 V.
I
OUTF
S
IB
Rev. A | Page 6 of 56
Page 7
AD9776/AD9778/AD9779
DIGITAL INPUT DATA TIMING SPECIFICATIONS
Table 3. AD9776, AD9778, and AD9779 Digital Input Data Timing Specifications
Parameter Min Typ Max Unit
INPUT DATA (ALL MODES, −40°C to +85°C)1
Set-Up Time, Input Data to DATACLK +2.5 ns
Hold Time, Input Data to DATACLK −0.4 ns
Set-Up Time, Input Data to REFCLK −0.8 ns
Hold Time, Input Data to REFCLK +2.9 ns
1
Timing vs. temperature and data valid keep out windows are delineated in Table 19.
AC SPECIFICATIONS
T
to T
MIN
otherwise noted.
Table 4. AD9776, AD9778, and AD9779 AC Specifications
Parameter Min Typ Max Min Typ Max Min Typ Max Unit
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
100-lead, thermally enhanced TQFP_EP package, θJA = 19.1°C/W
with the bottom EPAD soldered to the PCB. With the bottom
EPAD not soldered to the PCB, θ
= 27.4°C/W. These
JA
specifications are valid with no airflow movement.
Differential Clock Input.
7 CGND Clock Common.
8 CGND Clock Common.
9 CVDD18 1.8 V Clock Supply.
10 CVDD18 1.8 V Clock Supply.
11 CGND Clock Common.
12 AGND Analog Common.
13 SYNC_I+ Differential Synchronization Input.
14 SYNC_I− Differential Synchronization Input.
15 DGND Digital Common.
16 DVDD18 1.8 V Digital Supply.
17 P1D<11> Port 1, Data Input D11 (MSB).
18 P1D<10> Port 1, Data Input D10.
19 P1D<9> Port 1, Data Input D9.
ANALOG DOMAIN
DIGITAL DOMAIN
AD9776
TOP VIEW
(Not to Scale)
33
DGND
DVDD18
34NC35NC36NC37
38
39
DVDD33
DATACLK
TXENABLE
40
P2D<11>41P2D<10>
42
P2D<9>
Figure 3. AD9776 Pin Configuration
Pin
No.
Mnemonic Description
20 P1D<8> Port 1, Data Input D8.
21 P1D<7> Port 1, Data Input D7.
22 DGND Digital Common.
23 DVDD18 1.8 V Digital Supply.
24 P1D<6> Port 1, Data Input D6.
25 P1D<5> Port 1, Data Input D5.
26 P1D<4> Port 1, Data Input D4.
27 P1D<3> Port 1, Data Input D3.
28 P1D<2> Port 1, Data Input D2.
29 P1D<1> Port 1, Data Input D1.
30 P1D<0> Port 1, Data Input D0 (LSB).
31 NC No Connect.
32 DGND Digital Common.
33 DVDD18 1.8 V Digital Supply.
34 NC No Connect.
35 NC No Connect.
36 NC No Connect.
DATACLK
37
38 DVDD33 3.3 V Digital Supply.
43
44
45
DGND
DVDD18
P2D<8>46P2D<7>47P2D<6>48P2D<5>49P2D<4>50P2D<3>
Data Clock Output.
75
I120
74
VREF
73
IPTAT
72
AGND
71
IRQ
70
RESET
69
CSB
68
SCLK
67
SDIO
66
SDO
65
PLL_LOCK
64
DGND
63
SYNC_O+
62
SYNC_O–
61
DVDD33
60
DVDD18
59
NC
58
NC
57
NC
56
NC
55
P2D<0>
54
DGND
53
DVDD18
52
P2D<1>
51
P2D<2>
05361-002
Rev. A | Page 9 of 56
Page 10
AD9776/AD9778/AD9779
Pin
No. Mnemonic
39 TXENABLE Transmit Enable.
40 P2D<11> Port 2, Data Input D11 (MSB).
41 P2D<10> Port 2, Data Input D10.
42 P2D<9> Port 2, Data Input D9.
43 DVDD18 1.8 V Digital Supply.
44 DGND Digital Common.
45 P2D<8> Port 2, Data Input D8.
46 P2D<7> Port 2, Data Input D7.
47 P2D<6> Port 2, Data Input D6.
48 P2D<5> Port 2, Data Input D5.
49 P2D<4> Port 2, Data Input D4.
50 P2D<3> Port 2, Data Input D3.
51 P2D<2> Port 2, Data Input D2.
52 P2D<1> Port 2, Data Input D1.
53 DVDD18 1.8 V Digital Supply.
54 DGND Digital Common.
55 P2D<0> Port 2, Data Input D0 (LSB).
56 NC No Connect.
57 NC No Connect.
58 NC No Connect.
59 NC No Connect.
60 DVDD18 1.8 V Digital Supply.
61 DVDD33 3.3 V Digital Supply.
62 SYNC_O− Differential Synchronization Output.
63 SYNC_O+ Differential Synchronization Output
64 DGND Digital Common
65 PLL_LOCK PLL Lock Indicator
66 SDO SPI Port Data Output
67 SDIO SPI Port Data Input/Output
68 SCLK SPI Port Clock
69 CSB SPI Port Chip Select Bar.
70 RESET Reset, Active High.
71 IRQ Interrupt Request.
72 AGND Analog Common.
Description
Pin
No. Mnemonic
73 IPTAT
Description
Factory Test Pin. Output current is
proportional to absolute temperature,
approximately 10 μA at 25°C with
approximately 20 nA/°C slope. This pin
should remain floating.
74 VREF Voltage Reference Output.
75 I120 120 μA Reference Current.
76 AVDD33 3.3 V Analog Supply.
77 AGND Analog Common.
78 AVDD33 3.3 V Analog Supply.
79 AGND Analog Common.
80 AVDD33 3.3 V Analog Supply.
81 AGND Analog Common.
82 AGND Analog Common.
83 OUT2_P Differential DAC Current Output, Channel 2.
84 OUT2_N Differential DAC Current Output, Channel 2.
85 AGND Analog Common.
86 AUX2_P Auxiliary DAC Current Output, Channel 2.
87 AUX2_N Auxiliary DAC Current Output, Channel 2.
88 AGND Analog Common.
89 AUX1_N Auxiliary DAC Current Output, Channel 1.
90 AUX1_P Auxiliary DAC Current Output, Channel 1.
91 AGND Analog Common.
92 OUT1_N Differential DAC Current Output, Channel 1.
93 OUT1_P Differential DAC Current Output, Channel 1.
94 AGND Analog Common.
95 AGND Analog Common.
96 AVDD33 3.3 V Analog Supply.
97 AGND Analog Common.
98 AVDD33 3.3 V Analog Supply.
99 AGND Analog Common.
100 AVDD33 3.3 V Analog Supply.
1
The combined differential clock input at the CLK+ and CLK– pins are referred
Differential Clock Input.
7 CGND Clock Common.
8 CGND Clock Common.
9 CVDD18 1.8 V Clock Supply.
10 CVDD18 1.8 V Clock Supply.
11 CGND Clock Common.
12 AGND Analog Common.
13 SYNC_I+ Differential Synchronization Input.
14 SYNC_I− Differential Synchronization Input.
15 DGND Digital Common.
16 DVDD18 1.8 V Digital Supply.
17 P1D<13> Port 1, Data Input D13 (MSB).
18 P1D<12> Port 1, Data Input D12.
19 P1D<11> Port 1, Data Input D11.
20 P1D<10> Port 1, Data Input D10.
Pin
No.
21 P1D<9> Port 1, Data Input D9.
22 DGND Digital Common.
23 DVDD18 1.8 V Digital Supply.
24 P1D<8> Port 1, Data Input D8.
25 P1D<7> Port 1, Data Input D7.
26 P1D<6> Port 1, Data Input D6.
27 P1D<5> Port 1, Data Input D5.
28 P1D<4> Port 1, Data Input D4.
29 P1D<3> Port 1, Data Input D3.
30 P1D<2> Port 1, Data Input D2.
31 P1D<1> Port 1, Data Input D1.
32 DGND Digital Common.
33 DVDD18 1.8 V Digital Supply.
34 P1D<0> Port 1, Data Input D0 (LSB).
35 NC No Connect.
36 NC No Connect.
37
38 DVDD33 3.3 V Digital Supply.
39 TXENABLE Transmit Enable.
40 P2D<13> Port 2, Data Input D13 (MSB).
Rev. A | Page 11 of 56
Mnemonic Description
DATACLK
Data Clock Output.
Page 12
AD9776/AD9778/AD9779
Pin
No.
41 P2D<12> Port 2, Data Input D12.
42 P2D<11> Port 2, Data Input D11.
43 DVDD18 1.8 V Digital Supply.
44 DGND Digital Common.
45 P2D<10> Port 2, Data Input D10.
46 P2D<9> Port 2, Data Input D9.
47 P2D<8> Port 2, Data Input D8.
48 P2D<7> Port 2, Data Input D7.
49 P2D<6> Port 2, Data Input D6.
50 P2D<5> Port 2, Data Input D5.
51 P2D<4> Port 2, Data Input D4.
52 P2D<3> Port 2, Data Input D3.
53 DVDD18 1.8 V Digital Supply.
54 DGND Digital Common.
55 P2D<2> Port 2, Data Input D2.
56 P2D<1> Port 2, Data Input D1.
57 P2D<0> Port 2, Data Input D0 (LSB).
58 NC No Connect.
59 NC No Connect.
60 DVDD18 1.8 V Digital Supply.
61 DVDD33 3.3 V Digital Supply.
62 SYNC_O− Differential Synchronization Output.
63 SYNC_O+ Differential Synchronization Output.
64 DGND Digital Common.
65 PLL_LOCK PLL Lock Indicator.
66 SDO SPI Port Data Output.
67 SDIO SPI Port Data Input/Output.
68 SCLK SPI Port Clock.
69 CSB SPI Port Chip Select Bar.
70 RESET Reset, Active High.
71 IRQ Interrupt Request.
72 AGND Analog Common.
73 IPTAT
Mnemonic Description
Factory Test Pin. Output current is
proportional to absolute temperature,
approximately 10 μA at 25°C with
approximately 20 nA/°C slope. This
pin should remain floating.
Pin
No.
Mnemonic Description
74 VREF Voltage Reference Output.
75 I120 120 μA Reference Current.
76 AVDD33 3.3 V Analog Supply.
77 AGND Analog Common.
78 AVDD33 3.3 V Analog Supply.
79 AGND Analog Common.
80 AVDD33 3.3 V Analog Supply.
81 AGND Analog Common.
82 AGND Analog Common.
83 OUT2_P
Differential DAC Current Output,
Channel 2.
84 OUT2_N
Differential DAC Current Output,
Channel 2.
85 AGND Analog Common.
86 AUX2_P
Auxiliary DAC Current Output,
Channel 2.
87 AUX2_N
Auxiliary DAC Current Output,
Channel 2.
88 AGND Analog Common.
89 AUX1_N
Auxiliary DAC Current Output,
Channel 1.
90 AUX1_P
Auxiliary DAC Current Output,
Channel 1.
91 AGND Analog Common.
92 OUT1_N
Differential DAC Current Output,
Channel 1.
93 OUT1_P
Differential DAC Current Output,
Channel 1.
94 AGND Analog Common.
95 AGND Analog Common.
96 AVDD33 3.3 V Analog Supply.
97 AGND Analog Common.
98 AVDD33 3.3 V Analog Supply.
99 AGND Analog Common.
100 AVDD33 3.3 V Analog Supply.
1
The combined differential clock input at the CLK+ and CLK– pins are referred
Differential Clock Input.
7 CGND Clock Common.
8 CGND Clock Common.
9 CVDD18 1.8 V Clock Supply.
10 CVDD18 1.8 V Clock Supply.
11 CGND Clock Common.
12 AGND Analog Common.
13 SYNC_I+ Differential Synchronization Input.
14 SYNC_I− Differential Synchronization Input.
15 DGND Digital Common.
16 DVDD18 1.8 V Digital Supply.
17 P1D<15> Port 1, Data Input D15 (MSB).
18 P1D<14> Port 1, Data Input D14.
19 P1D<13> Port 1, Data Input D13.
20 P1D<12> Port 1, Data Input D12.
21 P1D<11> Port 1, Data Input D11.
34
P1D<2>35P1D<1>36P1D<0>
ANALOG DOMAIN
DIGITAL DOMAIN
AD9779
TOP VIEW
(Not to Scale)
37
38
39
DVDD33
DATACLK
TXENABLE
75
I120
74
VREF
73
IPTAT
72
AGND
71
IRQ
70
RESET
69
CSB
68
SCLK
67
SDIO
66
SDO
65
PLL_LOCK
64
DGND
63
SYNC_O+
62
SYNC_O–
61
DVDD33
60
DVDD18
59
P2D<0>
58
P2D<1>
57
P2D<2>
56
P2D<3>
55
P2D<4>
54
DGND
53
DVDD18
52
P2D<5>
51
P2D<6>
40
43
44
45
48
P2D<15>41P2D<14>42P2D<13>
DVDD18
DGND
P2D<12>46P2D<11>47P2D<10>
P2D<9>49P2D<8>50P2D<7>
05361-004
Pin
No.
Mnemonic Description
22 DGND Digital Common.
23 DVDD18 1.8 V Digital Supply.
24 P1D<10> Port 1, Data Input D10.
25 P1D<9> Port 1, Data Input D9.
26 P1D<8> Port 1, Data Input D8.
27 P1D<7> Port 1, Data Input D7.
28 P1D<6> Port 1, Data Input D6.
29 P1D<5> Port 1, Data Input D5.
30 P1D<4> Port 1, Data Input D4.
31 P1D<3> Port 1, Data Input D3.
32 DGND Digital Common.
33 DVDD18 1.8 V Digital Supply.
34 P1D<2> Port 1, Data Input D2.
35 P1D<1> Port 1, Data Input D1.
36 P1D<0> Port 1, Data Input D0 (LSB).
DATACLK
37
Data Clock Output.
38 DVDD33 3.3 V Digital Supply.
39 TXENABLE Transmit Enable.
40 P2D<15> Port 2, Data Input D15 (MSB).
41 P2D<14> Port 2, Data Input D14.
42 P2D<13> Port 2, Data Input D13.
Rev. A | Page 13 of 56
Page 14
AD9776/AD9778/AD9779
Pin
Mnemonic Description
No.
43 DVDD18 1.8 V Digital Supply.
44 DGND Digital Common.
45 P2D<12> Port 2, Data Input D12.
46 P2D<11> Port 2, Data Input D11.
47 P2D<10> Port 2, Data Input D10.
48 P2D<9> Port 2, Data Input D9.
49 P2D<8> Port 2, Data Input D8.
50 P2D<7> Port 2, Data Input D7.
51 P2D<6> Port 2, Data Input D6.
52 P2D<5> Port 2, Data Input D5.
53 DVDD18 1.8 V Digital Supply.
54 DGND Digital Common.
55 P2D<4> Port 2, Data Input D4.
56 P2D<3> Port 2, Data Input D3.
57 P2D<2> Port 2, Data Input D2.
58 P2D<1> Port 2, Data Input D1.
59 P2D<0> Port 2, Data Input D0 (LSB).
60 DVDD18 1.8 V Digital Supply.
61 DVDD33 3.3 V Digital Supply.
62 SYNC_O− Differential Synchronization Output.
63 SYNC_O+ Differential Synchronization Output.
64 DGND Digital Common.
65 PLL_LOCK PLL Lock Indicator.
66 SPI_SDO SPI Port Data Output.
67 SPI_SDIO SPI Port Data Input/Output.
68 SCLK SPI Port Clock.
69 SPI_CSB SPI Port Chip Select Bar.
70 RESET Reset, Active High.
71 IRQ Interrupt Request.
72 AGND Analog Common.
73 IPTAT
Factory Test Pin. Output current is
proportional to absolute temperature,
approximately 10 μA at 25°C with
approximately 20 nA/°C slope. This pin
should remain floating.
Pin
Mnemonic Description
No.
74 VREF Voltage Reference Output.
75 I120 120 μA Reference Current.
76 AVDD33 3.3 V Analog Supply.
77 AGND Analog Common.
78 AVDD33 3.3 V Analog Supply.
79 AGND Analog Common.
80 AVDD33 3.3 V Analog Supply.
81 AGND Analog Common.
82 AGND Analog Common.
83 OUT2_P
Differential DAC Current Output,
Channel 2.
84 OUT2_N
Differential DAC Current Output,
Channel 2.
85 AGND Analog Common.
86 AUX2_P Auxiliary DAC Current Output, Channel 2.
87 AUX2_N Auxiliary DAC Current Output, Channel 2.
88 AGND Analog Common.
89 AUX1_N Auxiliary DAC Current Output, Channel 1.
90 AUX1_P Auxiliary DAC Current Output, Channel 1.
91 AGND Analog Common.
92 OUT1_N
Differential DAC Current Output,
Channel 1.
93 OUT1_P
Differential DAC Current Output,
Channel 1.
94 AGND Analog Common.
95 AGND Analog Common.
96 AVDD33 3.3 V Analog Supply.
97 AGND Analog Common.
98 AVDD33 3.3 V Analog Supply.
99 AGND Analog Common.
100 AVDD33 3.3 V Analog Supply.
1
The combined differential clock input at the CLK+ and CLK– pins are referred
to as REFCLK.
Rev. A | Page 14 of 56
Page 15
AD9776/AD9778/AD9779
TYPICAL PERFORMANCE CHARACTERISTICS
4
3
2
1
0
–1
–2
INL (16-BIT LSB)
–3
–4
–5
–6
0
10k20k30k60k50k40k
CODE
Figure 6. AD9779 Typical INL
05361-005
100
f
= 160MSPS
90
80
70
SFDR (dBc)
60
50
0100
Figure 9. AD9779 In-Band SFDR vs. f
DATA
f
= 200MSPS
DATA
f
= 250MSPS
DATA
20406080
f
OUT
(MHz)
, 2× Interpolation
OUT
05361-008
1.5
1.0
0.5
0
–0.5
DNL (16-BIT LSB)
–1.0
–1.5
–2.0
0
100
90
80
70
SFDR (dBc)
CODE
Figure 7. AD9779 Typical DNL
f
= 160MSPS
DATA
f
f
= 200MSPS
DATA
DATA
60k50k40k30k20k10k
= 250MSPS
05361-006
100
f
f
= 100MSPS
DATA
90
80
f
= 150MSPS
DATA
70
SFDR (dBc)
60
50
0100
20406080
f
OUT
(MHz)
Figure 10. AD9779 In-Band SFDR vs. f
100
f
= 50MSPS
DATA
90
80
70
SFDR (dBc)
f
DATA
= 200MSPS
DATA
, 4× Interpolation
OUT
= 100MSPS
f
DATA
= 125MSPS
05361-009
60
50
0100
Figure 8. AD9779 In-Band SFDR vs. f
20406080
f
(MHz)
OUT
, 1x Interpolation
OUT
05361-007
Rev. A | Page 15 of 56
60
50
0
10203040
f
OUT
(MHz)
Figure 11. AD9779 In-Band SFDR vs. f
, 8× Interpolation
OUT
50
05361-010
Page 16
AD9776/AD9778/AD9779
100
100
90
f
= 160MSPS
DATA
80
70
SFDR (dBc)
60
50
0
20406080
f
OUT
f
DATA
(MHz)
Figure 12. AD9779 Out-of-Band SFDR vs. f
100
90
80
f
= 150MSPS
DATA
70
SFDR (dBc)
f
= 100MSPS
DATA
60
= 200MSPS
f
DATA
OUT
f
= 200MSPS
DATA
= 250MSPS
, 2× Interpolation
100
05361-011
90
80
70
SFDR (dBc)
60
50
04
102030
f
OUT
PLL OFF
(MHz)
PLL ON
0
05361-014
Figure 15. AD9779 In-Band SFDR, 4× Interpolation,
= 100 MSPS, PLL On/Off
f
DATA
100
90
80
70
SFDR (dBc)
60
0dBFS
–3dBFS
–6dBFS
50
0
20406080
f
OUT
(MHz)
Figure 13. AD9779 Out-of-Band SFDR vs. f
100
90
f
80
70
SFDR (dBc)
60
50
0
10203040
DATA
= 50MSPS
f
DATA
f
OUT
= 125MSPS
(MHz)
Figure 14. AD9779 Out-of-Band SFDR vs. f
, 4× Interpolation
OUT
f
= 100MSPS
DATA
, 8× Interpolation
OUT
100
50
05361-012
08
204060
f
OUT
(MHz)
0
05361-015
Figure 16. AD9779 In-Band SFDR vs. Digital Full-Scale Input
100
90
80
70
SFDR (dBc)
60
50
05361-013
50
08
10mA
20mA
30mA
204060
f
OUT
(MHz)
0
05361-016
Figure 17. AD9779 In-Band SFDR vs. Output Full-Scale Current
Rev. A | Page 16 of 56
Page 17
AD9776/AD9778/AD9779
100
f
= 160MSPS
DATA
f
= 200MSPS
(MHz)
DATA
, 1× Interpolation
OUT
90
f
80
IMD (dBc)
70
60
50
0120
= 250MSPS
DATA
20406080100
f
OUT
Figure 18. AD9779 Third-Order IMD vs. f
05361-017
100
90
80
f
IMD (dBc)
70
f
50
DATA
75
= 50MSPS
150
125
100
175
f
DATA
f
OUT
200
60
50
0
25
Figure 21. AD9779 Third-Order IMD vs. f
= 75MSPS
DATA
= 125MSPS
250
225
(MHz)
f
= 100MSPS
DATA
350
325
300
275
, 8× Interpolation
OUT
375
400
425
450
05361-020
100
f
= 160MSPS
DATA
90
80
IMD (dBc)
70
60
50
0 20 40 60 80 100 120 140 160 180 200 220
Figure 19. AD9779 Third-Order IMD vs. f
100
90
80
IMD (dBc)
70
60
50
0400
Figure 20. AD9779 Third-Order IMD vs. f
f
= 200MSPS
DATA
f
= 250MSPS
DATA
f
(MHz)
OUT
, 2× Interpolation
OUT
f
= 150MSPS
DATA
f
= 100MSPS
DATA
f
= 200MSPS
DATA
4080 120 160 200 240 280 320 360
f
(MHz)
OUT
, 4× Interpolation
OUT
05361-018
05361-019
100
90
80
PLL OFF
IMD (dBc)
70
60
50
0200
20406080120 140 160 180
PLL ON
f
OUT
Figure 22. AD9779 Third-Order IMD vs. f
= 100 MSPS, PLL On vs. PLL Off
f
DATA
100
95
90
85
80
75
IMD (dBc)
70
65
60
55
50
4080 120 160 200 240 280 320
0400360
f
OUT
Figure 23. AD9779 Third-Order IMD vs. f
= 200 MSPS
f
DATA
100
(MHz)
, 4× Interpolation,
OUT
(MHz)
, over 50 Parts,4× Interpolation,
OUT
05361-021
05361-022
Rev. A | Page 17 of 56
Page 18
AD9776/AD9778/AD9779
100
95
90
85
80
75
IMD (dBc)
70
65
60
55
50
0
Figure 24. IMD Performance vs. Digital Full-Scale Input, 4× Interpolation,
100
95
90
85
80
75
30mA
IMD (dBc)
70
65
60
55
50
0
Figure 25. IMD Performance vs. Full-Scale Output Current, 4× Interpolation,
Figure 49. AD9776, Single Carrier WCDMA, 4× Interpolation,
= 122.88 MSPS, Amplitude = −3 dBFS
f
DATA
SPAN 50MHz
UPPER
dBm
–87.97
–90.66
–90.17
250
05361-044
05361-045
05361-046
Rev. A | Page 22 of 56
Page 23
AD9776/AD9778/AD9779
–150
f
= 200MSPS
DAC
–154
–158
f
= 800MSPS
DAC
–162
NSD (dBm/Hz)
–166
–170
0100
20406080
1030507090
f
OUT
Figure 50. AD9776 Noise Spectral Density vs. f
with 500 kHz Spacing, f
f
(MHz)
DATA
= 400MSPS
DAC
DAC
= 200 MSPS
, Eight-Tone Input
05361-047
–150
f
= 200MSPS
DAC
f
(MHz)
= 400MSPS
DAC
–154
–158
f
= 800MSPS
DAC
–162
NSD (dBm/Hz)
–166
–170
0100
20406080
1030507090
f
OUT
Figure 51. AD9776 Noise Spectral Density vs. f
Single-Tone Input at −6 dBFS, f
= 200 MSPS
DATA
DAC
05361-048
,
Rev. A | Page 23 of 56
Page 24
AD9776/AD9778/AD9779
TERMINOLOGY
Integral Nonlinearity (INL)
INL is defined as the maximum deviation of the actual analog
output from the ideal output, determined by a straight line
drawn from zero scale to full scale.
Differential Nonlinearity (DNL)
DNL is the measure of the variation in analog value, normalized
to full scale, associated with a 1 LSB change in digital input code.
Monotonicity
A DAC is monotonic if the output either increases or remains
constant as the digital input increases.
Offset Error
The deviation of the output current from the ideal of zero is
called offset error. For I
inputs are all 0s. For I
inputs are set to 1.
Gain Error
The difference between the actual and ideal output span. The
actual span is determined by the difference between the output
when all inputs are set to 1 and the output when all inputs are
set to 0.
Output Compliance Range
The range of allowable voltage at the output of a current-output
DAC. Operation beyond the maximum compliance limits can
cause either output stage saturation or breakdown, resulting in
nonlinear performance.
Tem p er at u re Dr if t
Temperature drift is specified as the maximum change from the
ambient (25°C) value to the value at either T
offset and gain drift, the drift is reported in ppm of full-scale
range (FSR) per degree Celsius. For reference drift, the drift is
reported in ppm per degree Celsius.
Power Supply Rejection (PSR)
The maximum change in the full-scale output as the supplies
are varied from minimum to maximum specified voltages.
Settling Time
The time required for the output to reach and remain within a
specified error band around its final value, measured from the
start of the output transition.
, 0 mA output is expected when the
OUTA
, 0 mA output is expected when all
B
OUTB
or T
MIN
MAX
. For
In-Band Spurious Free Dynamic Range (SFDR)
The difference, in decibels, between the peak amplitude of the
output signal and the peak spurious signal between dc and the
frequency equal to half the input data rate.
Out-of-Band Spurious Free Dynamic Range (SFDR)
The difference, in decibels, between the peak amplitude of the
output signal and the peak spurious signal within the band that
starts at the frequency of the input data rate and ends at the
Nyquist frequency of the DAC output sample rate. Normally,
energy in this band is rejected by the interpolation filters. This
specification, therefore, defines how well the interpolation
filters work and the effect of other parasitic coupling paths to
the DAC output.
Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of the first six harmonic components to the rms value of the measured fundamental. It is
expressed as a percentage or in decibels.
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the rms value of the measured output signal
to the rms sum of all other spectral components below the
Nyquist frequency, excluding the first six harmonics and dc.
The value for SNR is expressed in decibels.
Interpolation Filter
If the digital inputs to the DAC are sampled at a multiple rate of
f
(interpolation rate), a digital filter can be constructed that
DATA
has a sharp transition band near f
appear around f
(output data rate) can be greatly suppressed.
DAC
/2. Images that typically
DATA
Adjacent Channel Leakage Ratio (ACLR)
The ratio in dBc between the measured power within a channel
relative to its adjacent channel.
Complex Image Rejection
In a traditional two-part upconversion, two images are created
around the second IF frequency. These images have the effect of
wasting transmitter power and system bandwidth. By placing
the real part of a second complex modulator in series with the
first complex modulator, either the upper or lower frequency
image near the second IF can be rejected.
Rev. A | Page 24 of 56
Page 25
AD9776/AD9778/AD9779
THEORY OF OPERATION
The AD9776/AD9778/AD9779 combine many features that
make them very attractive DACs for wired and wireless
communications systems. The dual digital signal path and
dual DAC structure allow an easy interface with common
quadrature modulators when designing single sideband
transmitters. The speed and performance of the parts allow
wider bandwidths and more carriers to be synthesized than
in previously available DACs. The digital engine uses a breakthrough filter architecture that combines the interpolation with
a digital quadrature modulator. This allows the parts to conduct
digital quadrature frequency upconversion. They also have
features that allow simplified synchronization with incoming
data and between multiple parts.
The serial port configuration is controlled by Register 0x00,
Bits<6:7>. It is important to note that the configuration changes
immediately upon writing to the last bit of the byte. For multibyte transfers, writing to this register can occur during the
middle of a communication cycle. Care must be taken to
compensate for this new configuration for the remaining bytes
of the current communication cycle.
The same considerations apply to setting the software reset,
RESET (Register 0x00, Bit 5) or pulling the RESET pin (Pin 70)
high. All registers are set to their default values, except
Register 0x00 and Register 0x04, which remain unchanged.
Use of only single-byte transfers when changing serial port
configurations or initiating a software reset is recommended to
prevent unexpected device behavior.
As described in this section, all serial port data is transferred
to/from the device in synchronization to the SCLK pin. If
synchronization is lost, the device has the ability to asynchronously terminate an I/O operation, putting the serial port
controller into a known state and, thereby, regaining
synchronization.
SERIAL PERIPHERAL INTERFACE
66
SPI_SDO
SPI
67
SPI_SDI
SPI_SCLK
SPI_CSB
Figure 52. SPI Port
The serial port is a flexible, synchronous serial communications
port allowing easy interface to many industry-standard microcontrollers and microprocessors. The serial I/O is compatible
with most synchronous transfer formats, including both the
Motorola SPI
® and Intel® SSR protocols. The interface allows
read/write access to all registers that configure the AD9776/
AD9778/AD9779. Single or multiple byte transfers are sup-
PORT
68
69
05361-049
ported, as well as MSB-first or LSB-first transfer formats. The
serial interface ports can be configured as a single pin I/O (SDIO)
or two unidirectional pins for input/output (SDIO/SDO).
General Operation of the Serial Interface
There are two phases to a communication cycle with the
AD977x. Phase 1 is the instruction cycle (the writing of an
instruction byte into the device), coincident with the first eight
SCLK rising edges. The instruction byte provides the serial port
controller with information regarding the data transfer cycle,
Phase 2 of the communication cycle. The Phase 1 instruction
byte defines whether the upcoming data transfer is a read or
write, the number of bytes in the data transfer, and the starting
register address for the first byte of the data transfer. The first
eight SCLK rising edges of each communication cycle are used
to write the instruction byte into the device.
A logic high on the CSB pin followed by a logic low resets the
SPI port timing to the initial state of the instruction cycle.
From this state, the next eight rising SCLK edges represent the
instruction bits of the current I/O operation, regardless of the
state of the internal registers or the other signal levels at the
inputs to the SPI port. If the SPI port is in an instruction cycle
or a data transfer cycle, none of the present data is written.
The remaining SCLK edges are for Phase 2 of the communication cycle. Phase 2 is the actual data transfer between the device
and the system controller. Phase 2 of the communication cycle
is a transfer of one, two, three, or four data bytes as determined
by the instruction byte. Using one multibyte transfer is preferred.
Single-byte data transfers are useful in reducing CPU overhead
when register access requires only one byte. Registers change
immediately upon writing to the last bit of each transfer byte.
Instruction Byte
The instruction byte contains the information shown in
Tabl e 9 .
Table 9. SPI Instruction Byte
MSB LSB
I7 I6 I5 I4 I3 I2 I1 I0
R/W
N1 N0 A4 A3 A2 A1 A0
R/W, Bit 7 of the instruction byte, determines whether a read or
a write data transfer occurs after the instruction byte write.
Logic high indicates a read operation. Logic 0 indicates a write
operation.
N1 and N0, Bit 6 and Bit 5 of the instruction byte, determine
the number of bytes to be transferred during the data transfer
cycle. The bit decodes are listed in
Tabl e 10 .
A4, A3, A2, A1, and A0—Bit 4, Bit 3, Bit 2, Bit 1, and Bit 0, respectively, of the instruction byte determine the register that is accessed
during the data transfer portion of the communication cycle.
Rev. A | Page 25 of 56
Page 26
AD9776/AD9778/AD9779
For multibyte transfers, this address is the starting byte address.
The remaining register addresses are generated by the device
based on the LSB-first bit (Register 0x00, Bit 6).
Table 10. Byte Transfer Count
N1 N0 Description
0 0 Transfer one byte
0 1 Transfer three bytes
1 0 Transfer two bytes
1 1 Transfer four bytes
Serial Interface Port Pin Descriptions
Serial Clock (SCLK)
The serial clock pin synchronizes data to and from the device
and to run the internal state machines. The maximum frequency
of SCLK is 40 MHz. All data input is registered on the rising
edge of SCLK. All data is driven out on the falling edge of SCLK.
Chip Select (CSB)
Active low input starts and gates a communication cycle. It
allows more than one device to be used on the same serial
communications lines. The SDO and SDIO pins go to a high
impedance state when this input is high. Chip select should
stay low during the entire communication cycle.
Serial Data I/O (SDIO)
Data is always written into the device on this pin. However, this
pin can be used as a bidirectional data line. The configuration
of this pin is controlled by Register 0x00, Bit 7. The default is
Logic 0, configuring the SDIO pin as unidirectional.
Serial Data Out (SDO)
Data is read from this pin for protocols that use separate lines
for transmitting and receiving data. In the case where the device
operates in a single bidirectional I/O mode, this pin does not
output data and is set to a high impedance state.
MSB/LSB TRANSFERS
The serial port can support both MSB-first and LSB-first data
formats. This functionality is controlled by Register Bit LSB_FIRST
(Register 0x00, Bit 6). The default is MSB-first (LSB-first = 0).
When LSB-first = 0 (MSB-first) the instruction and data bit
must be written from MSB to LSB. Multibyte data transfers in
MSB-first format start with an instruction byte that includes the
register address of the most significant data byte. Subsequent data
bytes should follow from high address to low address. In MSB-first
mode, the serial port internal byte address generator decrements
for each data byte of the multibyte communication cycle.
When LSB-first = 1 (LSB-first) the instruction and data bit
must be written from LSB to MSB. Multibyte data transfers in
LSB-first format start with an instruction byte that includes the
register address of the least significant data byte followed by multiple data bytes. The serial port internal byte address generator
increments for each byte of the multibyte communication cycle.
The serial port controller data address decrements from the
data address written toward 0x00 for multibyte I/O operations if
the MSB-first mode is active. The serial port controller address
increments from the data address written toward 0x1F for
multibyte I/O operations if the LSB-first mode is active.
INSTRUCTIO N CYCLEDATA TRANSFER CYCLE
CSB
SCLK
SDIO
SDO
CSB
SCLK
SDIO
SDO
CSB
SCLK
SDIO
CSB
SCLK
SDIO
SDO
R/W N1 N0 A4 A3 A2 A1 A0 D7 D6ND5
D7 D6ND5
N
N
Figure 53. Serial Register Interface Timing MSB-First
INSTRUCTIO N CYCLEDATA TRANSFER CYCLE
A0 A1 A2 A3 A4 N0 N1 R/W D00D10D2
D00D10D2
0
0
Figure 54. Serial Register Interface Timing LSB-First
t
DS
t
DS
t
PWH
t
t
SCLK
t
PWL
DH
INSTRUCTIO N BIT 6INSTRUCTION BIT 7
Figure 55. Timing Diagram for SPI Register Write
t
DV
DATA BIT n–1DATA BIT n
Figure 56. Timing Diagram for SPI Register Read
D00D10D20D3
0
D00D10D20D3
0
N
N
05361-050
D7ND6ND5ND4
D7ND6ND5ND4
05361-051
05361-052
05361-053
Rev. A | Page 26 of 56
Page 27
AD9776/AD9778/AD9779
SPI REGISTER MAP
Table 11.
Register
Name Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Def.
Comm 0x00 00 SDIO
Digital
Control
Sync
Control
0x04 04 Data Clock Delay<3:0> Output Sync Pulse Divide<2:0> Sync Out
0x05 05 Sync Out Delay<3:0> Input Sync Pulse Frequency Ratio<2:0> Sync Input
Address
Register Name Reg. No. Bits Description Function Default
Comm Register 00 7 SDIO bidirectional 0: use SDIO pin as input data only 0
1: use SDIO as both input and output data 00 6 LSB/MSB first 0: first bit of serial data is MSB of data byte 0
1: first bit of serial data is LSB of data byte
00 5 Software reset
00 4 Power-down mode 0: all circuitry is active
00 3 Auto power-down enable
00 1 PLL lock (read only) 0: PLL is not locked 1: PLL is locked 0
Digital Control Register 01 7:6 Filter interpolation factor 00: 1× interpolation 00
01: 2× interpolation 10: 4× interpolation 11: 8× interpolation 01 5:2 Filter modulation mode See Table 21 for filter modes 0000
01 0 Zero stuffing 0: zero stuffing off 0
1: zero stuffing on 02 7 Data format 0: signed binary 0
1: unsigned binary 02 6 Dual/interleaved data bus mode 0: both input data ports receive data 0
1: Data Port 1 only receives data 02 5 Real mode 0: enable Q path for signal processing 0
000 to 111, proportional to voltage at PLL
loop filter output, readback only
0A 4:0 PLL loop bandwidth adjustment
PLL Loop Filter Bandwidth section for
See
details
I DAC Control Register 0B 7:0 I DAC gain adjustment
(7:0) LSB slice of 10-bit gain setting word
for I DAC
0C 7 I DAC sleep 0: I DAC on 0
1: I DAC off 0C 6 I DAC power-down 0: I DAC on 0
1: I DAC off 0C 1:0 I DAC gain adjustment
(9:8) MSB slice of 10-bit gain setting word
for I DAC
Aux DAC1 Control
Register
0D 7:0 Aux DAC1 gain adjustment
(7:0) LSB slice of 10-bit gain setting word for
Aux DAC1
0E 7 Aux DAC1 sign 0: positive 1: negative
0E 6 Aux DAC1 current direction 0: source 0
1: sink
0E 5 Aux DAC1 power-down 0: Aux DAC1 on 0
1: Aux DAC1 off
0E 1:0 Aux DAC1 gain adjustment
(9:8) MSB slice of 10-bit gain setting word
for Aux DAC1
0
111001
11
0
Misc Control
11111001
01
00000000
00
Rev. A | Page 29 of 56
Page 30
AD9776/AD9778/AD9779
Address
Register Name Reg. No. Bits Description Function Default
Q DAC Control Register 0F 7:0 Q DAC gain adjustment
10 7 Q DAC sleep 0: Q DAC on 0
1: Q DAC off 10 6 Q DAC power-down 0: Q DAC on 0
1: Q DAC off 10 1:0 Q DAC gain adjustment
12 7 Aux DAC2 sign 0: positive 1: negative
12 6 Aux DAC2 current direction 0: source 0
1: sink
12 5 Aux DAC2 power-down 0: Aux DAC2 on 0
1: Aux DAC2 off
12 1:0 Aux DAC2 gain adjustment
(7:0) LSB slice of 10-bit gain setting word for
Q DAC
(9:8) MSB slice of 10-bit gain setting word
for Q DAC
(7:0) LSB slice of 10-bit gain setting word for
Aux DAC2
(9:8) MSB slice of 10-bit gain setting word
for Aux DAC2
11111001
00000000
00
Rev. A | Page 30 of 56
Page 31
AD9776/AD9778/AD9779
INTERPOLATION FILTER ARCHITECTURE
The AD9776/AD9778/AD9779 can provide up to 8× interpolation, or the interpolation filters can be entirely disabled. It is
important to note that the input signal should be backed off by
approximately 0.01 dB from full scale to avoid overflowing the
interpolation filters. The coefficients of the low-pass filters and
the inverse sinc filter are given in
Tabl e 16 . Spectral plots for the filter responses are shown in
Figure 57. 2× Interpolation, Low-Pass Response to ±4× Input Data Rate
10
0
–10
–20
–30
–40
–50
–60
ATTENUATION (dB)
–70
–80
–90
–100
Figure 58. 4× Interpolation, Low-Pass Response to ±4× Input Data Rate
(Dotted Lines Indicate 1 dB Roll-Off)
–4
–3–2–10123
f
(× Input Data Rate)
OUT
(Dotted Lines Indicate 1 dB Roll-Off)
4
4
05361-054
05361-055
Page 32
AD9776/AD9778/AD9779
10
0
–10
–20
–30
–40
–50
–60
ATTENUATION (dB)
–70
–80
–90
–100
–4
–3–2–10123
f
(× Input Data Rate)
OUT
4
05361-056
Figure 59. 8× Interpolation, Low-Pass Response to ±4× Input Data Rate
(Dotted Lines Indicate 1 dB Roll-Off)
With the interpolation filter and modulator combined, the
incoming signal can be placed anywhere within the Nyquist
region of the DAC output sample rate. When the input signal is
complex, this architecture allows modulation of the input signal
to positive or negative Nyquist regions (see
Tabl e 17).
The Nyquist regions of up to 4× the input data rate can be seen
in
Figure 60.
7–7–5–3–12468
–4×–8–3×–6–2×–4–1×–2DC11×32×53×
4×
05361-057
Figure 60. Nyquist Zones
Figure 57, Figure 58, and Figure 59 show the low-pass response
of the digital filters with no modulation. By turning on the
modulation feature, the response of the digital filters can be
tuned to anywhere within the DAC bandwidth. As an example,
Figure 61 to Figure 67 show the nonshifted mode filter responses
(refer to
Tabl e 1 7 for shifted/nonshifted mode filter responses).
10
0
–10
–20
–30
–40
–50
–60
ATTENUATION (dB)
–70
–80
–90
–100
–4
–3–2–10123
f
(× Input Data Rate)
OUT
Figure 61. Interpolation/Modulation Combination of 4 f
DAC
4
/8 Filter
05361-058
10
0
–10
–20
–30
–40
–50
–60
ATTENUATION (dB)
–70
–80
–90
–100
–4
–3–2–10123
f
(× Input Data Rate)
OUT
Figure 62. Interpolation/Modulation Combination of −3 f
10
0
–10
–20
–30
–40
–50
–60
ATTENUATION (dB)
–70
–80
–90
–100
–4
–3–2–10123
f
(× Input Data Rate)
OUT
Figure 63. Interpolation/Modulation Combination of −2 f
10
0
–10
–20
–30
–40
–50
–60
ATTENUATION (dB)
–70
–80
–90
–100
–4
–3–2–10123
f
(× Input Data Rate)
OUT
Figure 64. Interpolation/Modulation Combination of −1 f
/8 Filter
DAC
/8 Filter
DAC
/8 Filter
DAC
4
4
4
05361-059
05361-060
05361-061
Rev. A | Page 32 of 56
Page 33
AD9776/AD9778/AD9779
10
0
–10
–20
–30
–40
–50
–60
ATTENUATION (dB)
–70
–80
–90
–100
–4
–3–2–10123
f
(× Input Data Rate)
OUT
Figure 65. Interpolation/Modulation Combination of f
10
0
–10
–20
–30
–40
–50
–60
ATTENUATION (dB)
–70
–80
–90
–100
–4
–3–2–10123
f
(×Input Data Rate)
OUT
Figure 66. Interpolation/Modulation Combination of
/8 Filter in Shifted Mode
2 f
DAC
10
0
–10
–20
–30
–40
–50
–60
ATTENUATION (dB)
–70
–80
–90
–100
–4
–3–2–10123
f
(×Input Data Rate)
OUT
Figure 67. Interpolation/Modulation Combination of
/8 Filter in Shifted Mode
3 f
DAC
DAC
/8 Filter
4
4
4
05361-062
05361-063
05361-064
Shifted mode filter responses allow the pass band to be centered
around ±0.5 f
DATA
, ±1.5 f
DATA
, ±2.5 f
, and ±3.5 f
DATA
. Switching
DATA
to the shifted mode response does not modulate the signal.
Instead, the pass band is simply shifted. For example, picture
the response shown in
is a complex signal over the bandwidth 3.2 f
Figure 67 and assume the signal in-band
DATA
to 3.3 f
DATA
. If
the even mode filter response is then selected, the pass band
becomes centered at 3.5 f
. However, the signal remains at
DATA
the same place in the spectrum. The shifted mode capability
allows the filter pass band to be placed anywhere in the DAC
Nyquist bandwidth.
The AD9776/AD9778/AD9779 are dual DACs with internal
complex modulators built into the interpolating filter response.
In dual channel mode, the devices expect the real and the
imaginary components of a complex signal at Digital Input
Port 1 and Digital Input Port 2 (I and Q, respectively). The DAC
outputs then represent the real and imaginary components of
the input signal, modulated by the complex carrier f
f
DAC
/4, or f
DAC
/8.
DAC
/2,
With Register 2, Bit 6 set, the device accepts interleaved data on
Port 1 in the I, Q, I, Q . . . sequence. Note that in interleaved
mode, the channel data rate at the beginning of the I and the Q
data paths are now half the input data rate because of the interleaving. The maximum input data rate is still subject to the
maximum specification of the device. This limits the synthesis
bandwidth available at the input in interleaved mode.
With Register 0x02, Bit 5 (real mode) set, the Q channel and the
internal I and Q digital modulation are turned off. The output
spectrum at the I DAC then represents the signal at Digital
Input Port 1, interpolated by 1×, 2×, 4×, or 8×.
The general recommendation is that if the desired signal is
within ±0.4 × f
, the odd filter mode should be used. Outside
DATA
of this, the even filter mode should be used. In any situation, the
total bandwidth of the signal should be less than 0.8 × f
In 4× interpolation;
BW (min) = 0.075 × f
BW (max) = 0.2 × f
In 2× interpolation;
BW (min) = 0.15 × f
BW (max) = 0.4 × f
DAC
DAC
DAC
DAC
DAC
DAC
Rev. A | Page 34 of 56
Page 35
AD9776/AD9778/AD9779
INTERPOLATION FILTER MINIMUM AND
MAXIMUM BANDWIDTH SPECIFICATIONS
The AD977x uses a novel interpolation filter architecture that
allows DAC IF frequencies to be generated anywhere in the
spectrum.
output bandwidth placement. Note that there are no possible
filter modes in which the carrier can be placed near 0.5 × f
1.5 × f
The filter architecture not only allows the interpolation filter
pass bands to be centered in the middle of the input Nyquist
zones (as explained in this section), but also allows the possibility of a 3 × f
combinations, a carrier of given bandwidth can be placed
anywhere in the spectrum and fall into a possible pass band of
the interpolation filters. The possible bandwidths accessible
with the filter architecture are shown in
Figure 70. Note that the shifted and nonshifted filter modes
are all accessible by programming the filter mode for the
particular interpolation rate.
Figure 69. Nonshifted Bandwidths Accessible with the Filter Architecture
Figure 68 shows the traditional choice of DAC IF
, 2.5 × f
DATA
10
0
–10
/2
DAC
f
–20
–
–30
–40
–50
ATTENUATION (dB)
–60
–70
–80
–44
Figure 68. Traditional Bandwidth Options for TxDAC Output IF
, and so on.
DATA
/4
BASEBAND
/8
DAC
f
+
DAC
f
+
/8
/4
DAC
DAC
f
f
–
–
–3–2–10123
f
(× Input Data Rate),
OUT
ASSUMING 8× INTERPOLATION
/8 modulation mode. With all of these filter
DAC
Figure 69 and
10
0
–10
–20
–30
–40
–50
ATTENUATIO N (dB)
–60
–70
–80
/8
/2
DAC
f
–
–44
/4
DAC
f
–3 ×
–3–2–10123
/8
DAC
DAC
f
f
–
–
f
(×Input Data Rate),
OUT
ASSUMING 8× INTERPOLATION
/8
DAC
f
BASEBAND
+
/4
f
+
DAC
/8
f
+3 ×
DAC
/2
f
+
/2
f
+
DAC
DAC
DATA
05361-066
05361-065
10
0
/8
/4
–10
DAC
f
×
–20
–30
SHIFTED –3
,
–40
–50
ATTENUATION (dB)
–60
–70
–80
–44
–3–2–10123
/8
DAC
f
f
SHIFTED –
SHIFTED –
f
OUT
ASSUMING 8
DAC
SHIFTED –DC
(×Input Data Rate),
×
INTERPOLATION
SHIFTED –DC
/8
DAC
f
SHIFTED –
/4
f
SHIFTED –
DAC
/8
DAC
f
×
SHIFTED –3
05361-067
Figure 70. Shifted Bandwidths Accessible with the Filter Architecture
With this filter architecture, a signal placed anywhere in the
spectrum is possible. However, the signal bandwidth is limited
by the input sample rate of the DAC and the specific placement
of the carrier in the spectrum. The bandwidth restriction
resulting from the combination of filter response and input
sample rate is often referred to as the synthesis bandwidth, since
this is the largest bandwidth that the DAC can synthesize.
The maximum bandwidth condition exists if the carrier is
placed directly in the center of one of the filter pass bands. In
this case, the total 0.1 dB bandwidth of the interpolation filters
is equal to 0.8 × f
. As Tab le 1 7 shows, the synthesis band-
DATA
width as a fraction of DAC output sample rate drops by a factor
of 2 for every doubling of interpolation rate. The minimum
bandwidth condition exists, for example, if a carrier is placed at
0.25 × f
enabled, the high end of the filter response cuts off at 0.4 × f
. In this situation, if the nonshifted filter response is
DATA
DATA
,
thus limiting the high end of the signal bandwidth. If the shifted
filter response is enabled instead, then the low end of the filter
response cuts off at 0.1 × f
, thus limiting the low end of the
DATA
signal bandwidth. The minimum bandwidth specification that
applies for a carrier at 0.25 × f
is therefore 0.3 × f
DATA
DATA
. The
minimum bandwidth behavior is repeated over the spectrum
for carriers placed at (±n ± 0.25) × f
, where n is any integer.
DATA
DRIVING THE REFCLK INPUT
The REFCLK input requires a low jitter differential drive signal.
It is a PMOS input differential pair powered from
the 1.8 V supply, therefore, it is important to maintain the
specified 400 mV input common-mode voltage. Each input
pin can safely swing from 200 mV p-p to 1 V p-p about the
400 mV common-mode voltage. While these input levels are
not directly LVDS-compatible, REFCLK can be driven by an
offset ac-coupled LVDS signal, as shown in
Figure 71.
Rev. A | Page 35 of 56
Page 36
AD9776/AD9778/AD9779
2
LVDS_P_INCLK+
LVDS_N_INCLK–
0.1μF
0.1μF
50Ω
50Ω
V
CM
= 400mV
05361-068
Figure 71. LVDS REFCLK Drive Circuit
If a clean sine clock is available, it can be transformer-coupled
to REFCLK, as shown in
Figure 71. Use of a CMOS or TTL
clock is also acceptable for lower sample rates. It can be routed
through a CMOS to LVDS translator, then ac-coupled, as
described in this section. Alternatively, it can be transformercoupled and clamped, as shown in
TTL OR CMOS
CLK INPUT
Figure 72. TTL or CMOS REFCLK Drive Circuit
0.1μF
Figure 72.
50Ω
50Ω
CLK+
BAV99ZXCT
HIGH SPEED
DUAL DIODE
= 400mV
V
CM
CLK–
05361-069
A simple bias network for generating VCM is shown in
Figure 73. It is important to use CVDD18 and CGND for the
clock bias circuit. Any noise or other signal that is coupled onto
the clock is multiplied by the DAC digital input signal and can
degrade DAC performance.
= 400mV
V
CM
CVDD18
1kΩ
87Ω
0.1μF1nF
Figure 73. REFCLK VCM Generator Circuit
1nF
CGND
05361-070
PLL Enabled (Register 0x09, Bit 7 = 1)
The PLL enable switch shown in Figure 74 is connected to the
junction of the N1 dividers (PLL VCO divide ratio) and N2
dividers (PLL loop divide ratio). Divider N3 determines the
interpolation rate of the DAC, and the ratio N3/N2 determines
the ratio of reference clock/input data rate. The VCO runs
optimally over the range of 1.0 GHz to 2.0 GHz, so that N1
keeps the speed of the VCO within this range, although the
DAC sample rate can be lower. The loop filter components are
entirely internal and no external compensation is necessary.
PLL Disabled (Register 0x09, Bit 7 = 0)
The PLL enable switch shown in Figure 74 is connected to the
reference clock input. The differential reference clock input is
the same as the DAC output sample rate. N3 determines the
interpolation rate.
0x0A (7:5)
PLL CONT ROL
VOLTAG E RANGE
DAC
INTERPO LATION
RATE
DATACLK OUT (PIN 37)
REFERENCE CL OCK
(PINS 5 AND 6)
0x0A (4:0)
PHASE
DETECTI ON
DIVIDE RAT IO
0x09 (7)
PLL ENABLE
LOOP FILTER
BANDWIDTH
INTERNAL
LOOP
FILTER
÷N2÷N1
0x09 (4:3)
PLL LOOP
INTERNAL DAC SAM PLE
RATE CLOCK
VCO RANGE
0x09 (6:5)
PLL VCO
DIVIDE RATI O
÷N3
0x01 (7:6)
Figure 74. Internal Clock Architecture
ADC
0x08 (7:2)
VCO
05361-071
INTERNAL PLL CLOCK MULTIPLIER/CLOCK
DISTRIBUTION
The internal clock structure on the devices allows the user to
drive the differential clock inputs with a clock at 1× or an
integer multiple of the input data rate or at the DAC output
sample rate. An internal PLL provides input clock multiplication
and provides all the internal clocks required for the interpolation
filters and data synchronization.
The internal clock architecture is shown in
reference clock is the differential clock at Pin 5 and Pin 6. This
clock input can be run differentially or singled-ended by
driving Pin 5 with a clock signal and biasing Pin 6 to the
midswing point of the signal at Pin 5. The clock architecture
can be run in the following configurations:
Figure 74. The
Rev. A | Page 36 of 56
Page 37
AD9776/AD9778/AD9779
Table 18. VCO Frequency Range vs. PLL Band Select Value
Because the PLL band covers greater than a 2× frequency range,
there can be two options for the PLL band select: one at the low
end of the range and one at the high end of the range. Under
these conditions, the VCO phase noise is optimal when the user
selects the band select value corresponding to the high end of the
frequency range.
the optimal VCO frequency varies with the band select value.
VCO Frequency Ranges over Temperature
The specifications given over temperature in Tab le 1 8 are for a
single part in a single lot. Part-to-part, and lot-to-lot, these
specifications can exhibit a mean shift of several register
settings. Systems should be designed to take this potential shift
into account to maintain optimal PLL performance.
PLL Loop Filter Bandwidth
The loop filter bandwidth of the PLL is programmed via SPI
Register 0x0A, Bits<4:0>. Changing these values switches
capacitors on the internal loop filter. No external loop filter
components are required. This loop filter has a pole at 0 (P1),
and then a zero (Z1) pole (P2) combination. Z1 and P2 occur
within a decade of each other. The location of the zero pole is
determined by Bits<4:0>. For a setting of 00000, the zero pole
occurs near 10 MHz. By setting Bits<4:0> to 11111, the Z1/P2
combination can be lowered to approximately 1 MHz. The
relationship between Bits<4:0> and the position of the zero pole
between 1 MHz and 10 MHz is linear. The internal components
are not low tolerance, however, and can drift by as much as ±30%.
For optimal performance, the bandwidth adjustment
(Register 0x0A, Bits<4:0>) should be set to 11111 for all
operating modes with PLL enabled. The PLL bias settings
Rev. A | Page 37 of 56
Typical PLL Lock Ranges
VCO Frequency Range in MHz
Typ at 2 5°C Typ over Temp
f
LOW
f
HIGH
f
LOW
f
HIGH
Figure 75 shows how the VCO bandwidth and
Page 38
AD9776/AD9778/AD9779
(Register 0x09, Bits<2:0>) should be set to 111. The PLL control
voltage (Register 0x0A, Bits<7:5>) is read back and is proportional to the dc voltage at the internal loop filter output. With
the PLL bias settings given in this section, the readback from
the PLL control voltage should typically be 010, or possibly 001
or 011. Anything outside of this range indicates that the PLL is
not operating correctly.
60
56
52
48
44
40
36
32
28
PLL BAND
24
20
16
12
8
4
0
850
950
1050
1150
1250
1350
F
VCO
1450
(MHz)
1550
1650
1750
1850
Figure 75. Typical PLL Band Select vs. Frequency at 25°C
1950
2050
2150
05361-072
external resistor is 10 k, which sets up an I
REFERENCE
in the
resistor of 120 A, which in turn provides a DAC output fullscale current of 20 mA. Because the gain error is a linear
function of this resistor, a high precision resistor improves gain
matching to the internal matching specification of the devices.
Internal current mirrors provide a current-gain scaling, where
I DAC or Q DAC gain is a 10-bit word in the SPI port register
(Register 0x0A, Register 0x0B, Register 0x0E, and Register 0x0F).
The default value for the DAC gain registers gives an I
approximately 20 mA, where I
0.1μF
R
VREF
35
V2.1
I120
10kΩ
27
⎛
⎜
12
⎝
6
⎛
⎜
1024
⎝
AD9779
1.2V BAND GAP
Figure 77. Reference Circuitry
×+×gainDAC
is equal to
FS
⎞
⎟
⎠
I DAC GAIN
CURRENT
SCALING
Q DAC GAIN
⎞
32
×
⎟
⎠
I DAC
Q DAC
of
FS
DAC FULL-SCALE
REFERENCE
CURRENT
05361-073
60
56
52
48
44
40
36
32
28
PLL BAND
24
20
16
12
8
4
0
850
950
1050
1150
1250
1350
F
VCO
1450
(MHz)
1550
1650
1750
1850
1950
2050
2150
05361-113
Figure 76. Typical PLL Band Select vs. Frequency over Temperature
The AD977x has an autosearch feature that determines the
optimal settings for the PLL. To enable the autosearch mode, set
Register 0x08, Bits<7:2> to 11111b, and read back the value
from Register 0x08, Bits<7:2>. Autosearch mode is intended to
find the optimal PLL settings only, after which the same settings
should be applied in manual mode. It is not recommended that
the PLL be set to autosearch mode during regular operation.
FULL-SCALE CURRENT GENERATION
Internal Reference
Full-scale current on the I DAC and Q DAC can be set from
8.66 mA to 31.66 mA. Initially, the 1.2 V band gap reference is
used to set up a current in an external resistor connected to
I120 (Pin 75). A simplified block diagram of the reference
circuitry is shown in
Figure 77. The recommended value for the
Rev. A | Page 38 of 56
30
25
20
(mA)
FS
I
15
10
5
0
0
200400600800
DAC GAIN CODE
Figure 78. I
vs. DAC Gain Code
FS
1000
05361-074
Application of Auxiliary DACs in Single Sideband
Transmitter
Two auxiliary DACs are provided on the AD977x. The full-scale
output current on these DACs is derived from the 1.2 V band
gap reference and external resistor. The gain scale from the reference amplifier current I
to the auxiliary DAC reference
REFERENCE
current is 16.67 with the auxiliary DAC gain set to full scale
(10-bit values, SPI Register 0x0D and SPI Register 0x11), this
gives a full-scale current of approximately 2 mA for auxiliary
DAC1 and auxiliary DAC2. The auxiliar y DAC outputs are not
differential. Only one side of the auxiliary DAC (P or N) is
active at one time. The inactive side goes into a high impedance
state (>100 k). In addition, the P or N outputs can act as
current sources or sinks. The control of the P and N side for
both auxiliary DACs is via Register 0x0E and Register 0x10,
Bits<7:6>. When sourcing current, the output compliance
Page 39
AD9776/AD9778/AD9779
voltage is 0 V to 1.6 V. When sinking current, the output
compliance voltage is 0.8 V to 1.6 V.
The auxiliary DACs can be used for local oscillator (LO) cancellation when the DAC output is followed by a quadrature modulator.
This LO feedthrough is caused by the input referred dc offset
voltage of the quadrature modulator (and the DAC output offset
voltage mismatch) and can degrade system performance. Typical
DAC-to-quadrature modulator interfaces are shown in
and
Figure 80. Often, the input common-mode voltage for the
Figure 79
modulator is much higher than the output compliance range of
the DAC, so that ac coupling or a dc level shift is necessary. If the
required common-mode input voltage on the quadrature
modulator matches that of the DAC, then the dc blocking
capacitors in
Figure 79 can be removed. A low-pass or band-pass
passive filter is recommended when spurious signals from the
DAC (distortion and DAC images) at the quadrature modulator
inputs can affect the system performance. Placing the filter at the
location shown in
Figure 79 and Figure 80 allows easy design of
the filter, as the source and load impedances can easily be
designed close to 50 Ω.
QUADRATURE
MODULATOR V+
AD9779
AUX
DAC1
QUADRATURE
MODULATOR V+
AD9779
I DAC
25Ω TO 50Ω
0.1μF
0.1μF
OPTIONAL
PASSIVE
FILTERING
AD9779
Q DAC
25Ω TO 50Ω
QUAD MOD
I INPUTS
0.1μF
0.1μF
OPTIONAL
PASSIVE
FILTERING
Figure 79. Typical Use of Auxiliary DACs AC Coupling to
Quadrature Modulator
QUADRATURE
MODULATOR V+
AD9779
AUX
DAC1 OR 2
QUAD MOD
I OR Q INPUTS
AD9779
AUX
DAC2
QUAD MOD
Q INPUTS
05361-115
of the 3.3 V supply (mode and speed independent) in single
DAC mode is 102 mW/31 mA. In dual DAC mode, this is
182 mW/5
5 mA. Furthermore, when the PLL is enabled, it adds
90 mW/50 mA to the 1.8 V clock supply regardless of the mode
of the AD9779.
0.7
0.6
8× INTERPOLATION,
0.5
0.4
0.3
POWER (W)
0.2
0.1
ZERO STUFFING
0
255075 100 125 150 175 200 225
0250
Figure 81. Total Power Dissipation, I Data Only, Real Mode
0.4
8× INTERPOLATION
0.3
0.2
POWER (W)
0.1
0
255075 100 125 150 175 200 225
0250
Figure 82. Power Dissipation, Digital 1.8 V Supply, I Data Only, Real Mode,
Does Not Include Zero Stuffing
0.08
0.06
8× INTERPOLATION
8× INTERPOLATION
4× INTERPOLATION,
ZERO STUFFING
f
(MSPS)
DATA
4× INTERPOLATION
f
(MSPS)
DATA
4× INTERPOLATION
4× INTERPOLATION
2× INTERPOLATION,
ZERO STUFFING
2× INTERPOLATION
1× INTERPOLATION,
ZERO STUFFING
1× INTERPOLATION
2× INTERPOLATION
1× INTERPOLATION
05361-076
05361-078
AD9779
I OR Q DAC
25Ω TO 50Ω
OPTIONAL
PASSIVE
FILTERING
25Ω TO 50Ω
05361-116
Figure 80. Typical Use of Auxiliary DACs DC Coupling to Quadrature
Modulator with DC Shift
POWER DISSIPATION
Figure 81 to Figure 89 show the power dissipation of the 1.8 V
and 3.3 V digital and clock supplies in single DAC and dual
DAC modes. In addition to this, the power dissipation/current
Rev. A | Page 39 of 56
0.04
POWER (W)
0.02
0
255075 100 125 150 175 200 225
0250
f
DATA
(MSPS)
2× INTERPOLATION
1× INTERPOLATION
Figure 83. Power Dissipation, Clock 1.8 V Supply, I Data Only, Real Mode,
Includes Modulation Modes, Does Not Include Zero Stuffing
05361-079
Page 40
AD9776/AD9778/AD9779
0.075
ALL INTERPOLATION MODES
0.050
POWER (W)
0.025
0
255075 100 125 150 175 200 225
0250
Figure 84. Digital 3.3 V Supply, I Data Only, Real Mode, Includes Modulation
1.0
8× INTERPOLATI ON,
0.9
ZERO STUFFING
0.8
0.7
0.6
0.5
0.4
POWER (W)
0.3
0.2
4× INTE RPOLATI ON,
ZERO STUFFING
0.1
0
0300250 275
25 50 75 100 125 150 175 200 225
Figure 85. Total Power Dissipation, Dual DAC Mode
f
(MSPS)
DATA
Modes and Zero Stuffing
8× INTERPOLATION, ALL
MODULAT ION M ODES
2× INTE RPOLATI ON,
ALL MODULATION MO DES
2× INTE RPOLATI ON,
ZERO STUFFING
f
DATA
(MSPS)
1× INTE RPOLATI ON,
ZERO STUFFING
4× INT ERPOLATI ON,
ALL MODULATION
MODES
1× INTERPOLATION
05361-077
05361-080
0.125
8× INTERPOLATION, f
0.100
0.075
0.050
POWER (W)
0.025
0
0
NO MODULATION
255075 100 125 150 175 200 225
DAC
f
DAC
f
DAC
f
DATA
/8,
/4,
/2,
(MSPS)
4× INTERPOLATION
2× INTERPOLATION
1× INTERPOLATION,
NO MODULATION
250
05361-082
Figure 87. Power Dissipation, Clock 1.8 V Supply, I and Q Data, Dual DAC
Mode, Does Not Include Zero Stuffing
0.075
ALL INTERPOLATION MODES
0.050
POWER (W)
0.025
0
0250
255075 100 125 150 175 200 225
f
DATA
(MSPS)
Figure 88. Digital 3.3 V Supply, I and Q Data, Dual DAC Mode
05361-083
0.8
8× INTERPOLATION, f
0.7
0.6
0.5
0.4
POWER (W)
0.3
0.2
0.1
0
0
NO MODULATION
255075 100 125 150 175 200 225
f
f
DAC
DAC
DAC
f
DATA
/8,
/4,
/2,
4× INTERPOLATION
2× INTERPOLATION
1× INTERPOLATION,
NO MODULATION
(MSPS)
250
05361-081
Figure 86. Power Dissipation, Digital 1.8 V Supply, I and Q Data, Dual DAC
Mode, Does Not Include Zero Stuffing
Rev. A | Page 40 of 56
0.16
0.14
0.12
0.10
0.08
POWER (W)
0.06
0.04
0.02
0
01200
2004006008001000
f
DAC
(MSPS)
Figure 89. Power Dissipation of Inverse Sinc Filter
05361-084
Page 41
AD9776/AD9778/AD9779
POWER-DOWN AND SLEEP MODES INTERLEAVED DATA MODE
The AD977x has a variety of power-down modes, so that the
digital engine, main TxDACs, or auxiliary DACs can be powered
down individually or together. Via the SPI port, the main TxDACs
can be placed in sleep or power-down mode. In sleep mode, the
TxDAC output is turned off, thus reducing power dissipation.
The reference remains powered on, however, so that recovery
from sleep mode is very fast. With the power-down mode bit
set (Register 0x00, Bit 4), all analog and digital circuitry, including
the reference, is powered down. The SPI port remains active in
this mode. This mode offers more substantial power savings
than sleep mode, but the turn-on time is much longer. The
auxiliary DACs also have the capability to be programmed into
sleep mode via the SPI port. The auto power-down enable bit
(Register 0x00, Bit 3) controls the power-down function for the
digital section of the devices. The auto power-down function
works in conjunction with the TXENABLE pin (Pin 39) according
to the following:
TXENABLE (Pin 39) =
0: autopower-down enable =
0: flush data path with 0s
1: flush data for multiple REFCLK cycles; then
automatically place the digital engine in power-down
state. DACs, reference, and SPI port are not affected.
or TXENABLE (Pin 39) =
1: normal operation
As shown in
Figure 90, the power dissipation saved by using the
power down mode is nearly proportional to the duty cycle of
the signal at the TXENABLE pin.
0.9
0.8
0.7
0.6
0.5
0.4
POWER SAVINGS
0.3
0.2
0.1
0
010080604020
Figure 90. Power Savings Based on Duty Cycle of TxEnable
DUTY CYCLE (%)
2× INT f
2× INT f
4× INT
4× INT f
8× INT f
8× INT f
If the TxEnable invert bit (Register 0x02, Bit 1) is set, the
function of this TXENABLE pin is inverted.
Rev. A | Page 41 of 56
The TxEnable bit is dual function. In dual port mode, it is
simply used to power down the digital section of the devices. In
interleaved mode, the IQ data stream is synchronized to
TXENABLE. Therefore, to achieve IQ synchronization,
TXENABLE should be held low until an I data word is present at
the inputs to Data Port 1. If a DATACLK rising edge occurs
while TXENABLE is at a high logic level, IQ data becomes
synchronized to the DATACLK output. TXENABLE can remain
high and the input IQ data remains synchronized. To be
backwards-compatible with previous DACs from Analog
Devices, Inc. such as the AD9777 and AD9786, the user can
also toggle TXENABLE once during each data input cycle, thus
continually updating the synchronization. If TXENABLE is
brought low and held low for multiple REFCLK cycles, then the
devices flush the data in the interpolation filters, and shut down
the digital engine after the filters are flushed. The amount of
REFCLK cycles it takes to go into this power-down mode is
then a function of the length of the equivalent 2×, 4×, or 8×
interpolation filter. The timing of TXENABLE, I/Q select, filter
flush, and digital power-down are shown in
INTERLEAVED
INPUT DATA
TxENABLE
TxENABLE CAN REMAIN
HIGH OR TOGGLE FOR
I/Q SYNCHRONIZATION
I1Q1I2Q2
FLUSHING
INTERPOLATION
FILTERS
Figure 91. TXENABLE Function
Figure 91.
POWER
DOWN DIGITAL
SECTION
The TXENABLE function can be inverted by changing the
status of Register 0x02, Bit 1. The other bit that controls IQ
ordering is the Q-first bit (Register 0x02, Bit 0). With the Q-first
bit reset to the default of 0, the IQ pairing that is latched is the
I1Q1, I2Q2, and so on. With IQ first set to 1, the first I data is
discarded and the pairing is I2Q1, I3Q2, and so on. Note that
with IQ-first set, the I data is still routed to the internal I
channel, the Q data is routed to the internal Q channel, and
only the pairing changes.
TIMING INFORMATION
Figure 92 to Figure 95 show some of the various timing
possibilities when the PLL is enabled. The combination of the
settings of N2 and N3 from
clock frequency can be a multiple of the actual input data rate.
Figure 92 to Figure 95 show, respectively, what the timing looks
like when N2/N3 = 1 and 2.
In interleaved mode, set-up and hold times of DATACLK out to
data in are the same as those shown in
is recommended that any toggling of TXENABLE occur
concurrently with the digital data input updating. In this way,
timing margins between DATACLK, TXENABLE, and digital
input data are optimized.
Specifications are given in Tabl e 1 9 for the drift of input data set
up and hold time vs. temperature, as well as the data keep out
window (KOW). Note that although these specifications do
drift, the length of the keep out window, where input data is
invalid, changes very little over temperature.
Table 19. AD9779 Timing Specifications vs. Temperature
Timing
Parameter
Temperature
Min
t
S
(ns)
Min
t
H
(ns)
Max
KOW
(ns)
REFCLK to DATA −40°C −0.8 +2.2 +1.3
+25°C −1.1 +2.5 +1.4
+85°C −1.3 +2.9 +1.5
DATACLK to DATA −40°C +1.8 −0.4 +1.3
+25°C +2.1 −0.7 +1.4
+85°C +2.5 −0.9 +1.5
SYNC_I to
−40°C to +85°C −0.2 +1.0 +0.8
REFCLK
SYNCHRONIZATION OF INPUT DATA TO DATACLK
OUTPUT (PIN 37)
Synchronizing the input data bus to the DATACLK out signal is
achieved by meeting the timing relationships between DATACLK
and DATA timing specified in
nizing the input data to the DATACLK out, the sync input
(SYNC_I) signal does not need to be applied and can be ignored
(connect to GND).
Tabl e 1 9 . If the user is synchro-
and must be no greater than DATACLK for proper
synchronization. There is no limit on how slow the SYNC_I
signal can be driven. As long as the set up and hold timing
relationship between SYNC_I and REFCLK given in
Tabl e 19 is
met, the input data is latched on the immediate next rising edge
of REFCLK. Note that a rising edge of DATACLK out occurs
concurrently with the next REFCLK rising edge, after a short
propagation delay. Although this propagation delay is not
specified, input data setup and hold timing information is given
with respect to REFCLK in and DATACLK out in
Figure 92 to
Figure 95. Also, note that in 1× interpolation, because there is
no phase ambiguity, there is no need to use the SYNC_I signal.
Valid Timing Window
In addition to the timing requirements of SYNC_I with respect
to REFCLK, it is important to understand that the valid timing
window for SYNC_I is limited by the internal DAC sample rate.
This is shown in
Figure 96. When the tS and tH requirements are
met, the valid timing window for SYNC_I extends only as far as
one period of the internal DAC sample rate (minus t
and tH).
S
Failure to meet this timing specification can potentially result in
erroneous data being latched into the AD9779 digital inputs.
As an example, if the AD9779 input data rate is 122.88 MSPS
and the REFCLK is the same, with the AD9779 in 4× interpolation, the DAC sample rate is 1/491.52 MHz or about 2 ns. With
a t
of −0.2 ns and tH of 1.0 ns, this gives a valid timing window
S
for SYNC_I of
2 ns − 0.8 ns = 1.2 ns
SYNCHRONIZATION OF INPUT DATA TO THE
REFCLK INPUT (PIN 5 AND PIN 6) WITH PLL
ENABLED OR DISABLED
Synchronizing the input data bus to the REFCLK input requires
the use of the SYNC_I input pins (Pin 13 and Pin 14). If the
SYNC_I input is not used, there is a phase ambiguity between
the DATACLK out and the REFCLK in. This ambiguity matches
the interpolation rate in which the AD9779, for example, is
currently operating. Because input data is latched on the rising
edge of DATACLK, it is impossible for the user to determine
onto which one of the multiple internal DACCLK edges (as an
example, one of four edges in 4× interpolation) the input data
actually latches. For the user to specifically determine the exact
edge of REFCLK on which the data is being latched, a rising
edge must be periodically applied to SYNC_I. The frequency of
the SYNC_I signal must be equal to f
REFCL
SYNC_I
/2N, N being an integer,
DAC
Figure 96. Valid Timing Relationship for SYNC_I to REFCLK
t
DAC_SAMPLE
The timing window of the digital input data to REFCLK can be
moved in increments of one internal REFCLK cycle by using
the REFCLK OFFSET register (Register 0x7, Bits<4:0>).
Because SYNC_I can be run at the same frequency as REFCLK
when the PLL is enabled, best practice suggests that in this condition, REFCLK and SYNC_I originate from the same source.
This limits the variation in time between these two signals and
makes the overall timing budget easier to achieve. A slight delay
may be necessary on the REFCLK path in this configuration to
add more timing margin between REFCLK and SYNC_I (see
Tabl e 1 9 for timing relationship).
t
t
S
H
t
DAC_SAMPLE
5361-124
Rev. A | Page 43 of 56
Page 44
AD9776/AD9778/AD9779
Using Data Delay to Meet Timing Requirements
To meet strict timing requirements at input data rates of up to
250 MSPS, the AD977x has a fine timing feature. Fine timing
adjustments are made by programming values into the data
clock delay register (Register 0x04, Bits<7:4>). This register can
be used to add delay between the REFCLK in and the
DATACLK out.
Figure 97 shows the default delay present when
DATACLK delay is disabled. The disable function bit is found
in Register 0x02, Bit 4.
DATACLK delay is enabled and set to 0000.
Figure 98 shows the delay present when
Figure 99 indicates
the delay when DATACLK delay is enabled and set to 1111.
Note that the setup and hold times specified for data to
DATACLK are defined for DATACLK delay disabled.
TEK RUN: 5.00GS/sSAMPLE
Δ: 4.48nS
@: 40.28nS
2
TEK RUN: 5.00GS/sSAMPLE
Δ
: 7.84nS
@: 32.44nS
2
1
CH1 1.00V
Figure 99. Delay from REFCLK to DATACLK Out with DATACLK Delay = 1111
Ω
CH2 500mV
Ω
M2.00nsCH1 420mV
The difference between the minimum delay shown in Figure 98
and the maximum delay shown in
Figure 99 is the range
programmable using the DATACLK delay register. The delay
(in absolute time) when programming DATACLK delay
between 0000 and 1111 is a linear extrapolation between these
two figures. The typical delays per increment over temperature
are shown in
Tabl e 2 0 .
05361-091
1
CH1 1.00VΩ
Figure 97. Delay from REFCLK to DATACLK with DATACLK Delay Disabled
TEK RUN: 5.00GS/sSAMPLE
2
1
CH1 1.00V
Figure 98. Delay from REFCLK to DATACLK Out with DATACLK Delay = 0000
CH2 500mVΩ M2.00nsCH1 420mV
CH2 500mV
Ω
Ω
M2.00nsCH1 420mV
Δ
: 4.76nS
@: 35.52nS
05361-089
05361-090
Table 20. Data Delay Line Typical Delays Over Temperature
Delays −40°C +25°C +85°C Unit
Delay Between Disabled and
370 416 432 ps
Enabled
Average Delay per Increment 171 183 197 ps
The frequency of DATACLK out depends on several programmable settings: interpolation, zero stuffing, and interleaved/
dual port mode, all of which have an effect on the REFCLK
frequency. The divisor function between REFCLK and
DATACLK is equal to the values shown in
Tabl e 2 1 .
Table 21. REFCLK to DATACLK Divisor Ratio
Interpolation Zero Stuffing Input Mode Divisor
1 Disabled Dual port 1
2 Disabled Dual port 2
4 Disabled Dual port 4
8 Disabled Dual port 8
1 Disabled Interleaved Invalid
2 Disabled Interleaved 1
4 Disabled Interleaved 2
8 Disabled Interleaved 4
1 Enabled Dual port 2
2 Enabled Dual port 4
4 Enabled Dual port 8
8 Enabled Dual port 16
1 Enabled Interleaved 1
2 Enabled Interleaved 2
4 Enabled Interleaved 4
8 Enabled Interleaved 8
Rev. A | Page 44 of 56
Page 45
AD9776/AD9778/AD9779
In addition to this divisor function, DATACLK can be divided
by up to an additional factor of 4, according to the state of the
DATACLK divide register (Register 0x03, Bits<5:4>). For more
details, see
Table 22. Extra DATACLK Divisor Ratio
Register 0x03, Bits<5:4> Divider Ratio
00 1
01 2
10 4
11 1
The maximum divisor resulting from the combination of the
values in
Tabl e 22 ).
Tabl e 21 , and the DATACLK divide register is 32.
Manual Input Timing Correction
Correction of input timing can be achieved manually. The
correction function is controlled by Register 0x03, Bits<7:6>.
The function is programmed as shown in
Necessary corrections can be made by adjusting DATACLK
delay and the DATACLK invert bit (Register 2, Bit 2).
DATACLK delay can then be swept to find the range over which
the timing is valid. The final value for data delay should be the
value that corresponds to the middle of the valid timing range.
If a valid timing range is not found during this sweep, the user
should invert the DATACLK invert bit and repeat the process.
Multiple DAC Synchronization
The AD9779 has programmable features that allow the CMOS
digital data bus inputs and internal filters on multiple devices to
be synchronized. This means that the DATACLK output signal
on one AD9779 can be used to register the output data for a data
bus delivering data to multiple AD9779s. The details of this operation are given in the Analog Devices Application Note AN-822.
Rev. A | Page 45 of 56
Page 46
AD9776/AD9778/AD9779
C
EVALUATION BOARD OPERATION
The AD977x evaluation board is designed to optimize the DAC
performance and the speed of the digital interface, yet remains
user friendly. To operate the board, the user needs a power
source, a clock source, and a digital data source. The user also
needs a spectrum analyzer or an oscilloscope to look at the DAC
output. The diagram in Figure 100 illustrates the test setup. A
sine or square wave clock works well as a clock source. The dc
offset on the clock is not a problem, since the clock is ac-coupled
on the evaluation board before the REFCLK inputs. All
necessary connections to the evaluation board are shown in
more detail in Figure 101.
CLOCK
GENERATOR
ADAPTER
CABLES
CLKINSPI PORT
The evaluation board comes with software that allows the user
to program the SPI port. Via the SPI port, the devices can be
programmed into any of its various operating modes. When
first operating the evaluation board, it is useful to start with a
simple configuration, that is, a configuration in which the SPI
port settings are as close as possible to the default settings. The
default software window is shown in Figure 102. The arrows
indicate which settings need to be changed for an easy first time
evaluation. Note that this implies that the PLL is not being used
and that the clock being used is at the speed of the DAC output
sample rate. For a more detailed description of how to use the
PLL, see the PLL Loop Filter Bandwidth section.
DIGITAL
PATTERN
GENERATOR
LOCK IN
DATACLK OUT
P4 Digital Input Connector
Figure 101. AD977x Evaluation Board Showing All Connections
AUX33
S7 DCLKOUT
AD9779
EVALUATION
BOARD
Figure 100. Typical Test Setup
DVDD18DVDD33 CVDD18AVDD33
J1 CLOCK IN
JP4
AD9779
SPI PORT
JP15
JP14
JP16
JP17
JP8
JP3
JP2
S5 OUTPUT 1
AD8349
S6 OUTPUT 2
SPECTRUM
ANALYZER
1.8V POWER SUPPLY
3.3V POWER SUPPLY
J2
5V Supply
MODULATOR
OUTPUT
+5V
GND
LOCAL OSC
INPUT
ANALOG
DEVICES
AD9779/8/6
REV D
05361-097
05361-098
Rev. A | Page 46 of 56
Page 47
AD9776/AD9778/AD9779
1. SET INTERPOLATION RATE
2. SET INTERPOLATION FILTER MODE
3. SET INPUT DATA FORMAT
4. SET DATACLK POLARITY TO MATCH INPUT TIM ING
Figure 102. SPI Port Software Window
The default settings for the evaluation board allow the user to
view the differential outputs through a transformer that
converts the DAC output signal to a single-ended signal. On the
evaluation board, these transformers are designated T1A, T2A,
T3A, and T4A. There are also four common-mode transformers
on the board that are designated T1B, T2B, T3B, and T4B. The
recommended operating setup places the transformer and
common-mode transformer in series. A pair of transformers
5361-099
and common-mode transformers are installed on each DAC
output, so that the pairs can be set up in either order. As an
example, for the frequency range of dc to 30 MHz, it is
recommended that the transformer be placed right after the
DAC. Above DAC output frequencies of 30 MHz, it is
recommended that the common-mode transformer is placed
right after the DAC outputs, followed by the transformer.
Rev. A | Page 47 of 56
Page 48
AD9776/AD9778/AD9779
MODIFYING THE EVALUATION BOARD TO USE
THE AD8349 ON-BOARD QUADRATURE
MODULATOR
The evaluation board contains an Analog Devices AD8349
quadrature modulator. The AD977x and AD8349provide an
easy-to-interface DAC/modulator combination that can be
easily evaluated on the evaluation board. To route the DAC
output signal to the quadrature modulator, the following
jumper settings must be made:
The DAC output area of the evaluation board is shown in
Figure 103. The jumpers that need to be changed to use the
AD8349 are circled. Also circled are the 5 V and GND
connections for the AD8349.
05361-100
Figure 103. Photo of Evaluation Board, DAC Output Area
Rev. A | Page 48 of 56
Page 49
AD9776/AD9778/AD9779
EVALUATION BOARD SCHEMATICS
EXC-CL4532U1
L12
RED
TP14
VDDM
VDDM_IN
4
74AC14
U6
3
RED
TP13
C66
0.1μF
L16
C67
0.1μF
+
16V
C46
22μF
10
U6
11
DGND2
TP15
DGND2
74AC14
2
EXC-CL4532U1
BLACK
8
6
74AC14
U6
9
74AC14
U6
5
S2
SWSECMA
SCLK
3
2
CSB
1
S1
SWSECMA
R51
9kΩ
13
U5
12
74AC14
1
U5
2
74AC14
3
2
1
S3
R53
9kΩ
11
U5
10
3
U5
4
3
2
SDI
SWSECMA
R54
9kΩ
9
U5
8
74AC14
5
U5
6
74AC14
P1
123
S4
SWSECMA
2
SDO
1
12
U6
74AC14
74AC14
13
2
U6
1
5
4
3
1
74AC14
74AC14
SPI_SDI
SPI_CLK
SPI_CSB
SPI_SDO
FCI-68898
CLASS = IO
TJAK06RAP
6
RED
TP16
R52
10kΩ
R55
10kΩ
TP1
TP3
DVDD18
L2
EXC-CL4532U1
RED
DVDD18_IN
C70
C71
RED
TP18
+
C76
TP4
BLACK
0.1μF
L7
0.1μF
EXC-CL4532U1
16V
22μF
TP5
AVDD33
L3
EXC-CL4532U1
RED
AVDD33_IN
C26
C28
RED
TP19
+
C20
TP8
BLACK
0.1μF
L13
0.1μF
EXC-CL4532U1
16V
22μF
TP6
DVDD33
L4
EXC-CL4532U1
RED
DVDD33_IN
C42
C45
RED
TP20
+
C21
TP9
BLACK
0.1μF
L14
0.1μF
EXC-CL4532U1
16V
22μF
TP7
DPWR33
L5
EXC-CL4532U1
RED
DPWR33_IN
C49
C48
RED
TP21
+
C22
TP10
BLACK
0.1μF
L15
0.1μF
EXC-CL4532U1
16V
22μF
05361-101
CVDD18
L1
EXC-CL4532U1
RED
CVDD18_IN
C69
C68
RED
TP17
+
C77
TP2
BLACK
0.1μF
L6
0.1μF
EXC-CL4532U1
16V
22μF
Figure 104. Evaluation Board, Rev. D, Power Supply Decoupling and SPI Interface
Rev. A | Page 49 of 56
Page 50
AD9776/AD9778/AD9779
T2B
1
3
6
S
P
4
ADTL1-12
T2A
6
2
1
4
S5
1
2
3
TC1-1T
T1B
1
P
3
ADTL1-12
T1A
6
4
TC1-1T
6
S
4
1
2
3
R10
50Ω
JP14
JP15
R9
50Ω
R11
50Ω
R6
0Ω
R5
0Ω
R11
50Ω
JP16
JP17
R7
0Ω
R8
0Ω
T3A
3
2
1
TC1-1T
T3B
4
S
6
ADTL1-12
T4A
4
3
2
6
1
S6
2
4
6
1
TC1-1T
T4B
3
P
1
4
6
3
P
S
1
ADTL1-12
CVDD18
S15
1
2
S2
1
2
VOLT
C62
0.1µF
C61
1nF
C60
0.1µF
C59
1nF
AVDD33
C58
1nF
C57
0.1µF
C56
1nF
C55
0.1µF
C31
1nF
C14
0.1µF
C6
4.7µF
+
JP13
C33
1nF
C37
0.1µF
C24
1nF
C9
0.1µF
C1
4.7µF
+
CLK_N
CLK_P
CR1
VAL
R64
1kΩ
7068696766
71
IRQ
RESET
P1D3
P1D4
31302928272625
32
0.1µF
SPI_CSB
SPI_CSB
VSSD_32
C84
33
SPI_CLK
SPI_CLK
VDDD18_33
34
DGND;5
2
SW1
4
SPI_SDI
SPI_SDO
65
SPI_SDI
SPI_SDO
P1D1
P1D2
36
35
1
3
CR2
VAL
R64
1kΩ
63
64
VSSD_64
SYNC_OP
PLL_LOCK
VDDD33_38
DCLK
P1D0
37
38
DPWR33
R63
10Ω
P2D0
P2D1
P2D2
P2D3
P2D4
P2D5
P2D6P2D7
DVDD33
62
59
58
5756555251
P2D1
VDD18_43
44
P2D2
P2D3
VSSD_44
P2D12
1
2
3
3
1
2
74LCX112
53
54
PAD
PAD
P2D4
P2D5
P2D6
VSSD_54
VDDD18_53
P2D8
P2D9
P2D10
P2D11
474645
J
K
15
4
JP7
PRE
CLR
U1
504948
P2D15
R59
6
22Ω
5
4
R58
22Ω
DPWR33
U10
5
Q
6
Q_
60
61
P2D0
SYNC_ON
VDDD18_60
VDDD33_61
TX
P2D13
P2D14
P2D15
43
424140
39
JP18
C34
1nF
C38
0.1µF
C25
1nF
C10
0.1µF
C2
VOLT
4.7µF
+
DVDD18
9779TQFP
+
C4
4.7µF
VOLT
DVDD33
S16
1
2
74LCX112
C40
0.1µF
C35
1nF
C39
0.1µF
C36
1nF
C27
1nF
C11
0.1µF
C3
4.7µF
VOLT
+
C29
1nF
C12
0.1µF
C30
1nF
C13
0.1µF
C5
4.7µF
+
DVDD18
U10
10
11
J
13
12
K
9
PRE
Q
7
Q_
CLR
14
05361-102
JP3
JP2
JP4
JP8
D1ND1P
IOUT1_P
VOLT
100
96
98
97
99
VSSA_99
VSSA_97
VDDA33_98
VDDA33_100
VSSC_3
VSSC_4
VDDC18_1
VDDC18_2
5
1102
3
4
DATACLK
S7
IOUT1_N
AUX1_P
908986
92
93
91
94
95
AUX1_P
IOUT1_P
IOUT1_N
VSSA_91
VSSA_94
VSSA_95
VDDA33_96
VSSC_11
VSSC_7
VSSC_8
VDDC18_10
VDDC18_9
CLK_N
CLK_P
6
9
7
8
11
12
R32
25Ω
1
2
DPWR33
C78
4.7µF
VOLT
C7
VOLT
4.7µF
C15
1nF
C32
0.1µF
IOUT2_N
AUX1_N
AUX2_P
AUX2_N
87
84
85
88
AUX2_P
AUX2_N
AUX1_N
VSS_12
+
+
VSSA_88
SYNC_1P
13
SYNC_1N
VSSD_15
14
15
4
5
IOUT2_N
VSSA_85
VDDD18
P1D15
16
VCCYNC
SN74LVC1G34
D2PD2N
TP11 RED
C18
1nF
6.3V
IOUT2_P
80
83
81
82
IOUT2_P
VSSA_81
VSSA_82
VDDA33_80
P1D11
P1D12
P1D13
P1D14
2120191817
U11
3
GND
2
A
1
+
C8
10µF
R56
10Ω
76
78
75
73
74
77
79
VSSA_79
VDDA33_78
VSSD_22
VDDD18_23
24
23
22
R26
22Ω
VSSA_77
P1D10
I120
VDDA33_76
P1D8
P1D9
DPWR33
72
IPTAT
VSS_72
VREF_74
P1D5
P1D6TP12 RED
P1D7
R26
22Ω
Figure 105. Evaluation Board, Rev. D, Circuitry Local to Devices
1. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED.
. THE PACKAGE HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION O
THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNA
TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIV
SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE
DEVICE WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.
7°
3.5°
0°
16.00 BSC SQ
1
PIN 1
25
2650
0.50 BSC
COMPLIANT TO JEDEC STANDARDS MS-026-AED-HD
14.00 BSC SQ
TOP VIEW
(PINS DOWN)
0.27
0.22
0.17
76100
0.15
0.05
75
51
76100
75
BOTTOM VIEW
(PINS UP)
CONDUCTIVE
HEAT SINK
51
1.05
1.00
0.95
COPLANARITY
0.08
6.50
NOM
Figure 116. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
(SV-100-1)
Dimensions shown in millimeters
1
25
2650
ORDERING GUIDE
Model Temperature Range Package Description Package Option