Datasheet AD9575 Datasheet (ANALOG DEVICES)

Page 1
V
Network Clock Generator, Two Outputs

FEATURES

Fully integrated VCO/PLL core
0.39 ps rms jitter from 12 kHz to 20 MHz at 156.25 MHz
0.15 ps rms jitter from 1.875 MHz to 20 MHz at 156.25 MHz
0.40 ps rms jitter from 12 kHz to 20 MHz at 106.25 MHz
0.15 ps rms jitter from 637 kHz to 10 MHz at 106.25 MHz Input crystal frequency of 19.44 MHz, 25 MHz, or
25.78125 MHz
Pin selectable divide ratios for 33.33 MHz, 62.5 MHz,
100 MHz, 106.25 MHz, 125 MHz, 155.52 MHz, 156.25 MHz,
159.375 MHz, 161.13 MHz, and 312.5 MHz outputs LVDS/LVPECL/LVCMOS output format Integrated loop filter Space saving 4.4 mm × 5.0 mm TSSOP 100 mA power supply current (LVDS output) 120 mA power supply current (LVPECL output)
3.3 V operation

APPLICATIONS

GbE/FC/SONET line cards, switches, and routers CPU/PCI-E applications Low jitter, low phase noise clock generation
AD9575

GENERAL DESCRIPTION

The AD9575 provides a highly integrated, dual output clock generator function including an on-chip PLL core that is optimized for network clocking. The integer-N PLL design is based on the Analog Devices, Inc., proven portfolio of high performance, low jitter frequency synthesizers to maximize line card performance. Other applications with demanding phase noise and jitter requirements also benefit from this part.
The PLL section consists of a low noise phase frequency detector (PFD), a precision charge pump (CP), a low phase noise voltage controlled oscillator (VCO), and pin selectable feedback and output dividers.
By connecting an external crystal, popular network output fre­quencies can be locked to the input reference. The output divider and feedback divider ratios are pin programmable for the required output rates. No external loop filter components are required, thus conserving valuable design time and board space.
The AD9575 is available in a 16-lead, 4.4 mm × 5.0 mm TSSOP and can be operated from a single 3.3 V supply. The temperature range is −40°C to +85°C.

FUNCTIONAL BLOCK DIAGRAM

DD × 5
XTAL
OSC
AD9575
GND × 5
Rev. A
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
Trademarks and registered trademarks are the property of their respective owners.
LPF
PFD/CP
THIRD-ORDER
LDO
VCO
Figure 1.
LVDS OR LVPECL
LVCMOS
DIVIDERS
SEL
SEL0
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com
Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2010 Analog Devices, Inc. All rights reserved.
Fax: 781.461.3113 ©2010 Analog Devices, Inc. All rights reserved.
100MHz TO 312.5M Hz
33.33MHz/
62.5MHz/SEL1
08462-001
Page 2
AD9575

TABLE OF CONTENTS

Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
PLL Characteristics ...................................................................... 3
LVDS Clock Output Jitter (Typ/Max) ........................................ 4
LVPECL Clock Output Jitter (Typ/Max) ................................... 4
Output Frequency Select ............................................................. 5
Clock Outputs ............................................................................... 5
Timing Characteristics ................................................................ 5
Power .............................................................................................. 6
Crystal Oscillator .......................................................................... 6
Timing Diagrams .......................................................................... 6
Absolute Maximum Ratings ............................................................7
Thermal Resistance .......................................................................7
ESD Caution...................................................................................7
Pin Configuration and Function Descriptions ..............................8
Typical Performance Characteristics ..............................................9
Terminolog y .................................................................................... 11
Theory of Operation ...................................................................... 12
Phase Frequency Detector (PFD) and Charge Pump ............ 12
Power Supply ............................................................................... 12
LVPECL Clock Distribution ..................................................... 12
LVDS Clock Distribution .......................................................... 13
LVCMOS Clock Distribution ................................................... 13
Typical Application Circuit ....................................................... 13
Outline Dimensions ....................................................................... 14
Ordering Guide .......................................................................... 14

REVISION HISTORY

3/10—Rev. 0 to Rev. A
Changes to Features Section............................................................ 1
Changes to Table 1, Table 2, and Table 3 ....................................... 4
Changes to Table 4 and Table 6 ....................................................... 5
Changes to Table 7 and Table 8 ....................................................... 6
Changes to Table 12 .......................................................................... 8
Added Figure 11; Renumbered Figures Sequentially ................ 10
Changes to Figure 13 ...................................................................... 10
Changes to Theory of Operation Section and Figure 19 ........... 12
Changes to Figure 24 ...................................................................... 13
1/10—Revision 0: Initial Version
Rev. A | Page 2 of 16
Page 3
AD9575

SPECIFICATIONS

Typical (typ) values are given for VS = 3.3 V ± 10%, TA = 25°C, unless otherwise noted. Minimum (min) and maximum (max) values are given over the full V

PLL CHARACTERISTICS

Table 1.
LVD S LVC MOS LVP ECL Parameter Min Typ Max Min Typ Max Min Typ Max Unit
PHASE NOISE CHARACTERISTICS
PLL Noise (100 MHz Output)
At 1 kHz −123 −122 dBc/Hz At 10 kHz −128 −129 dBc/Hz At 100 kHz −131 −131 dBc/Hz At 1 MHz −150 −151 dBc/Hz At 10 MHz −156 −158 dBc/Hz At 30 MHz −156 −158 dBc/Hz
PLL Noise (106.25 MHz Output)
At 1 kHz −121 −121 dBc/Hz At 10 kHz −127 −128 dBc/Hz At 100 kHz −130 −130 dBc/Hz At 1 MHz −149 −150 dBc/Hz At 10 MHz −156 −158 dBc/Hz At 30 MHz −156 −159 dBc/Hz
PLL Noise (125 MHz Output)
At 1 kHz −120 −120 dBc/Hz At 10 kHz −126 −127 dBc/Hz At 100 kHz −128 −129 dBc/Hz At 1 MHz −148 −150 dBc/Hz At 10 MHz −155 −157 dBc/Hz At 30 MHz −156 −158 dBc/Hz
PLL Noise (155.52 MHz Output)
At 1 kHz −118 −118 dBc/Hz At 10 kHz −123 −123 dBc/Hz At 100 kHz −125 −125 dBc/Hz At 1 MHz −147 −149 dBc/Hz At 10 MHz −155 −157 dBc/Hz At 30 MHz −156 −157 dBc/Hz
PLL Noise (156.25 MHz Output)
At 1 kHz −118 −118 dBc/Hz At 10 kHz −124 −125 dBc/Hz At 100 kHz −126 −127 dBc/Hz At 1 MHz −146 −148 dBc/Hz At 10 MHz −155 −157 dBc/Hz At 30 MHz −155 −157 dBc/Hz
PLL Noise (159.375 MHz Output)
At 1 kHz −118 −118 dBc/Hz At 10 kHz −124 −125 dBc/Hz At 100 kHz −126 −126 dBc/Hz At 1 MHz −146 −147 dBc/Hz At 10 MHz −155 −156 dBc/Hz At 30 MHz −155 −157 dBc/Hz
and TA (−40°C to +85°C) variation.
S
Rev. A | Page 3 of 16
Page 4
AD9575
LVD S LVC MOS LVP ECL Parameter Min Typ Max Min Typ Max Min Typ Max Unit
PLL Noise (161.132812 MHz Output)
At 1 kHz −118 −119 dBc/Hz At 10 kHz −122 −123 dBc/Hz At 100 kHz −126 −126 dBc/Hz At 1 MHz −144 −146 dBc/Hz At 10 MHz −154 −156 dBc/Hz At 30 MHz −155 −156 dBc/Hz
PLL Noise (312.5 MHz Output)
At 1 kHz −112 −112 dBc/Hz At 10 kHz −119 −119 dBc/Hz At 100 kHz −120 −120 dBc/Hz At 1 MHz −140 −142 dBc/Hz At 10 MHz −152 −154 dBc/Hz At 30 MHz −153 −155 dBc/Hz
PLL Noise (33.33 MHz Output)
At 1 kHz −131 dBc/Hz At 10 kHz −138 dBc/Hz At 100 kHz −140 dBc/Hz At 1 MHz −155 dBc/Hz At 5 MHz −155 dBc/Hz
PLL Noise (62.5 MHz Output)
At 1 kHz −126 dBc/Hz At 10 kHz −133 dBc/Hz At 100 kHz −134 dBc/Hz At 1 MHz −150 dBc/Hz
At 5 MHz −152 dBc/Hz Spurious Content −70 −70 dBc PLL Figure of Merit −217 −217 dBc/Hz

LVDS CLOCK OUTPUT JITTER (TYP/MAX)

Typical (typ) values are given for VS = 3.3 V ± 10%, TA = 25°C, unless otherwise noted. Maximum (max) values are given over the full VS and T
(−40°C to +85°C) variation.
A
Table 2.
Jitter Integration Bandwidth
12 kHz to 20 MHz 0.38/0.50 0.40/0.54 0.37/0.47 0.41/0.54 0.39/0.51 0.38/0.51 0.44/0.61 0.36/0.48 ps rms
1.875 MHz to 20 MHz 0.15/0.27 ps rms 637 kHz to 10 MHz 0.15/0.21 ps rms
100 MHz
106.25 MHz
125 MHz
155.52 MHz
156.25 MHz
159.375 MHz
161.13 MHz
312.5 MHz Unit

LVPECL CLOCK OUTPUT JITTER (TYP/MAX)

Typical (typ) values are given for VS = 3.3 V ± 10%, TA = 25°C, unless otherwise noted. Maximum (max) values are given over the full VS and T
(−40°C to +85°C) variation.
A
Table 3.
Jitter Integration Bandwidth
12 kHz to 20 MHz 0.36/0.46 0.44/0.68 0.36/0.45 0.40/0.52 0.39/0.64 0.41/0.62 0.43/0.69 0.38/0.49 ps rms
1.875 MHz to 20 MHz 0.19/0.54 ps rms 637 kHz to 10 MHz 0.22/0.35 ps rms
100 MHz
106.25 MHz
125 MHz
155.52 MHz
Rev. A | Page 4 of 16
156.25 MHz
159.375 MHz
161.13 MHz
312.5 MHz
Unit
Page 5
AD9575

OUTPUT FREQUENCY SELECT

Minimum (min) and maximum (max) values are given over the full VS and TA (−40°C to +85°C) variation.
Table 4.
Parameter Min Typ Max Unit Test Conditions/Comments
Select Pins (SEL0/SEL1)
Logic 1 Voltage 0.83 × VS + 0.2 V Logic 0 Voltage 0.33 × VS − 0.2 V Logic 1 Current 190 μA Pull-up to VS Logic 0 Current 150 μA Pull-down to GND

CLOCK OUTPUTS

Typical (typ) values are given for VS = 3.3 V ± 10%, TA = 25°C, unless otherwise noted. Minimum (min) and maximum (max) values are
given over the full V
Table 5.
Parameter Min Typ Max Unit Test Conditions/Comments
LVDS CLOCK OUTPUT Termination = 100 Ω differential; default
Output Frequency 312.5 MHz Differential Output Voltage (VOD) 250 340 450 mV See Figure 2 for definition Delta VOD 25 mV Output Offset Voltage (VOS) 1.125 1.25 1.375 V Delta VOS 25 mV Short-Circuit Current (ISA, ISB) 14 24 mA Output shorted to GND Duty Cycle 45 50 55 %
LVPECL CLOCK OUTPUT
Output Frequency 312.5 MHz Output High Voltage (VOH) VS − 1.5 VS − 1.05 VS − 0.8 V Output Low Voltage (VOL) VS − 2.5 VS − 1.75 VS − 1.7 V Differential Output Voltage (VOD) 430 640 800 mV See Figure 2 for definition Duty Cycle 45 50 55 %
LVCMOS CLOCK OUTPUT
Output Frequency 62.5 MHz Output High Voltage (VOH) VS − 0.1 V Output Low Voltage (VOL) 0.1 V Duty Cycle 45 50 55 %
and TA (−40°C to +85°C) variation.
S

TIMING CHARACTERISTICS

Table 6.
Parameter Min Typ Max Unit Test Conditions/Comments
LVDS
Termination = 100 Ω differential; C
= 0.1 μF
C
AC
Output Rise Time, tRL 150 200 300 ps 20% to 80%, measured differentially Output Fall Time, tFL 150 200 300 ps 80% to 20%, measured differentially
LVPECL
Termination = 200 Ω to GND; C
= 0.1 μF
C
AC
Output Rise Time, tRL 180 250 300 ps 20% to 80%, measured differentially Output Fall Time, tFL 180 250 300 ps 80% to 20%, measured differentially
LVCMOS
Termination = 50 Ω to 0 V; C
= 0.1 μF
C
AC
LOAD
Output Rise Time, tRC 0.50 0.70 1.10 ns 20% to 80% Output Fall Time, tFC 0.50 0.70 1.10 ns 80% to 20%
Rev. A | Page 5 of 16
LOAD
= 0 pF;
LOAD
= 5 pF;
= 0 pF;
Page 6
AD9575

POWER

Table 7.
Parameter Min Typ Max Unit
POWER SUPPLY 3.0 3.3 3.6 V POWER SUPPLY CURRENT
LVDS 100 130 mA LVPECL 120 160 mA

CRYSTAL OSCILLATOR

Table 8.
Parameter Min Typ Max Unit Test Conditions/Comments
CRYSTAL SPECIFICATION Parallel resonant/fundamental mode
Frequency 19.44 25 25.78125 MHz ESR 40 Ω Load Capacitance 14 pF Cx/2 (see Figure 24) + parasitic capacitance Phase Noise −138 dBc/Hz At 1 kHz offset Stability −30 +30 ppm

TIMING DIAGRAMS

DIFFERENTIAL SIGNAL
80%
20%
50%
t
RL
V
OD
t
FL
08462-003
Figure 2. LVDS or LVPECL Timing and Differential Amplitude Figure 3. LVCMOS Timing
SINGLE-ENDED
80%
20%
t
RC
LVCMOS
5pF LO AD
t
FC
8462-004
Rev. A | Page 6 of 16
Page 7
AD9575

ABSOLUTE MAXIMUM RATINGS

Table 9.
Parameter Rating
VDD, VDDA, VDDX, VDD_CMOS to GND −0.3 V to +3.6 V
XO1, XO2 to GND −0.3 V to VS + 0.3 V
LVDS/LVPECL OUT, LVDS/LVPECL OUT,
CMOS OUT/SEL1, SEL0 to GND Junction Temperature1 150°C Storage Temperature Range −65°C to +150°C Lead Temperature (10 sec) 300°C
1
See Table 10 for θJA.
−0.3 V to V
+ 0.3 V
S
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages.
Table 10. Thermal Resistance
Package Type θJA Unit
16-Lead TSSOP (RU-16) 90.3 °C/W
1
Thermal impedance measurements were taken on a 4-layer board in still air
in accordance with EIA/JESD51-7.
1

ESD CAUTION

Rev. A | Page 7 of 16
Page 8
AD9575

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

GNDA
VDDA VDDX
XO1 XO2
GNDX
GNDA
VDDA
1
2
3
AD9575
4
TOP VIEW
5
(Not to S cale)
6
7 8
16
SEL0
15
GND
14
LVDS/LVPECL OUT
13
LVDS/LVPECL OUT
12
VDD
11
VDD_CMOS
10
CMOS OUT/SEL1
9
GND_CMOS
08462-005
Figure 4. Pin Configuration
Table 11. Pin Function Descriptions
Pin No. Mnemonic Description
1, 7 GNDA Analog Ground. 2, 8 VDDA Analog Power Supply (3.3 V). 3 VDDX 4, 5 XO1, XO2 6 GNDX 9 GND_CMOS 10 CMOS OUT/SEL1 11 VDD_CMOS 12 VDD 13
LVDS/LVPECL OUT 14 LVDS/LVPECL OUT 15 GND
Crystal Oscillator Power Supply. External Crystal. Crystal Oscillator Ground. Ground for LVCMOS Output. LVCMOS Output/Output Frequency Select. Power Supply for LVCMOS Output. Power Supply for LVDS or LVPECL Output. Complementary LVDS or LVPECL Output.
LVDS or LVPECL Output. Ground for LVDS or LVPECL Output.
16 SEL0 Output Frequency Select.
1
Table 12. Output Frequency Selection
Mode XTAL SEL0 SEL1 LVDS/LVPECL Output LVCMOS Output
1 25 MHz GND X
2
100 MHz 33.33 MHz 2 25 MHz VS GND 156.25 MHz High-Z 3 25.78125 MHz V 4 25 MHz No connect X 5 25 MHz 15 kΩ pull-up V 6 25 MHz 15 kΩ pull-up GND 312.5 MHz 7 25 MHz V 8 19.44 MHz V
1
The AD9575 must be power-cycled if the select pin voltages are altered.
2
X = in Mode 1, Pin 10 is configured as an LVCMOS output (33.33 MHz) by forcing Pin 16 to GND. In Mode 4, Pin 10 is configured as an LVCMOS output (62.5 MHz) by
leaving Pin 16 unconnected.
GND 161.13 MHz High-Z
S
2
X
159.375 MHz High-Z
S
125 MHz 62.5 MHz
High-Z
V
S
No connect 155.52 MHz High-Z
S
106.25 MHz High-Z
S
Rev. A | Page 8 of 16
Page 9
AD9575

TYPICAL PERFORMANCE CHARACTERISTICS

110
–115
–120
–125
–130
–135
–140
–145
PHASE NOISE ( dBc/Hz)
–150
–155
–160
1k 10k 100k 1M 10M 100M
FREQUENCY (Hz)
Figure 5. Phase Noise at LVPECL, 100 MHz Clock Output
08462-006
110
–115
–120
–125
–130
–135
–140
–145
PHASE NOISE (dBc/Hz)
–150
–155
–160
1k 10k 100k 1M 10M 100M
FREQUENCY ( Hz )
Figure 8. Phase Noise at LVPECL, 155.52 MHz Clock Output
08462-009
110
–115
–120
–125
–130
–135
–140
–145
PHASE NOISE (dBc/Hz)
–150
–155
–160
1k 10k 100k 1M 10M 100M
FREQUENCY ( Hz )
Figure 6. Phase Noise at LVPECL, 106.25 MHz Clock Output
110
–115
–120
–125
–130
–135
–140
–145
PHASE NOISE ( dBc/Hz)
–150
–155
–160
1k 10k 100k 1M 10M 100M
FREQUENCY (Hz)
Figure 7. Phase Noise at LVPECL, 125 MHz Clock Output
110
–115
–120
–125
–130
–135
–140
–145
PHASE NOISE (d Bc/Hz)
–150
–155
–160
1k 10k 100k 1M 10M 100M
08462-007
FREQUENCY (Hz)
08462-010
Figure 9. Phase Noise at LVPECL, 156.25 MHz Clock Output
110
–115
–120
–125
–130
–135
–140
–145
PHASE NOISE (dBc/Hz)
–150
–155
–160
1k 10k 100k 1M 10M 100M
08462-008
FREQUENCY (Hz)
08462-011
Figure 10. Phase Noise at LVPECL, 159.375 MHz Clock Output
Rev. A | Page 9 of 16
Page 10
AD9575
110
–115
–120
–125
–130
–135
–140
–145
PHASE NOISE (dBc/Hz)
–150
–155
–160
1k 10k 100k 1M 10M 100M
FREQUENCY ( Hz )
Figure 11. Phase Noise at LVPECL, 161.13 MHz Clock Output
110
–115
–120
–125
–130
–135
–140
–145
PHASE NOISE ( dBc/Hz)
–150
–155
–160
1k 10k 100k 1M 10M 100M
FREQUENCY ( Hz )
Figure 12. Phase Noise at LVPECL, 312.5 MHz Clock Output
08462-027
08462-012
M2
M2 50mV 2ns M3 50mV 2ns
M2
M2 100mV 1ns M3 100mV 1ns
Figure 14. 156.25 MHz LVDS Output
Figure 15. 312.5 MHz LVPECL Output
08462-022
8462-023
140
130
LVPECL
120
110
100
SUPPLY CURRENT ( mA)
90
80
1234
5678
MODE
LVDS
Figure 13. Typical Supply Current vs. Mode (see Table 12)
08462-021
M2
M2 100mV 10ns M3 100mV 10ns
Figure 16. 62.5 MHz LVCMOS Output
08462-024
Rev. A | Page 10 of 16
Page 11
AD9575

TERMINOLOGY

Phase Jitter
An ideal sine wave can be thought of as having a continuous and even progression of phase with time from 0° to 360° for each cycle. Actual signals, however, display a certain amount of variation from ideal phase progression over time. This phenom­enon is called phase jitter. Although many causes can contribute to phase jitter, one major cause is random noise, which is charac­terized statistically as Gaussian (normal) in distribution.
This phase jitter leads to a spreading out of the energy of the sine wave in the frequency domain, producing a continuous power spectrum. This power spectrum is usually reported as a series of values whose units are dBc/Hz at a given offset in frequency from the sine wave (carrier). The value is a ratio (expressed in decibels) of the power contained within a 1 Hz bandwidth with respect to the power at the carrier frequency. For each measurement, the offset from the carrier frequency is also given.
Phase Noise
It is meaningful to integrate the total power contained within some interval of offset frequencies (for example, 10 kHz to 10 MHz). This is called the integrated phase noise over that frequency offset interval and can be readily related to the time jitter due to the phase noise within that offset frequency interval.
Phase noise has a detrimental effect on error rate performance by increasing eye closure at the transmitter output and reducing the jitter tolerance/sensitivity of the receiver.
Time Jitter
Phase noise is a frequency domain phenomenon. In the time domain, the same effect is exhibited as time jitter. When observing a sine wave, the time of successive zero crossings is seen to vary. In a square wave, the time jitter is seen as a displacement of the edges from their ideal (regular) times of occurrence. In both cases, the variations in timing from the ideal are the time jitter. Because these variations are random in nature, the time jitter is specified in units of seconds root mean square (rms) or 1 sigma of the Gaussian distribution.
Additive Phase Noise
Additive phase noise is the amount of phase noise that is attrib­utable to the device or subsystem being measured. The phase noise of any external oscillators or clock sources is subtracted. This makes it possible to predict the degree to which the device affects the total system phase noise when used in conjunction with the various oscillators and clock sources, each of which contributes its own phase noise to the total. In many cases, the phase noise of one element dominates the system phase noise.
Additive Time Jitter
Additive time jitter is the amount of time jitter that is attribut­able to the device or subsystem being measured. The time jitter of any external oscillators or clock sources is subtracted. This makes it possible to predict the degree to which the device affects the total system time jitter when used in conjunction with the various oscillators and clock sources, each of which contributes its own time jitter to the total. In many cases, the time jitter of the external oscillators and clock sources dominates the system time jitter.
Rev. A | Page 11 of 16
Page 12
AD9575
V
VDDA
V
V
V

THEORY OF OPERATION

DDX GNDX
GNDA
DD_CMOS GND_CMOS
XTAL
OSC
AD9575
PHASE
FREQUENCY
DETECTOR
CHARGE
PUMP
V
LDO
2.488GHz TO
2.55GHz VCO
Figure 17. Detailed Block Diagram
Figure 17 shows a block diagram of the AD9575. The chip features a PLL core, which is configured to generate the specific clock frequencies via pin programming. By appropriate connection of the select pins, SEL0 and SEL1, the divide ratios of the feedback divider (n), LVDS output divider (m), and LVCMOS output divider (k) can be programmed (see Tab le 1 2 ). In Mode 1 and Mode 4, Pin 10 is configured as an LVCMOS output by forcing Pin 16 to GND (33.33 MHz output) or by leaving Pin 16 uncon­nected (62.5 MHz output). In conjunction with a band-select VCO that operates over the range of 2.488 GHz to 2.55 GHz, a wide range of popular network reference frequencies can be generated. This PLL is based on proven Analog Devices synthesizer technology, noted for its exceptional phase noise performance. The AD9575 is highly integrated and includes the loop filter, a regulator for supply noise immunity, all the necessary dividers, output buffers, and a crystal oscillator. A user need only supply an external crystal to implement a clocking solution that requires no processor intervention.

PHASE FREQUENCY DETECTOR (PFD) AND CHARGE PUMP

The PFD takes inputs from the reference clock and feedback divider to produce an output proportional to the phase and frequency difference between them. Figure 18 shows a simplified schematic.
P
CHARGE
HIGH
REFCLK
HIGH
FEEDBACK
DIVIDER
D1 Q1
CLR1
CLR2
D2 Q2
UP
DOWN
PUMP
CP
LDO
LVCMOS
1/n 1/k
1/m
SEL
LVDS
100MHz
CMOS OUT/SEL1
SEL0 LVDS/LVPECL OUT
LVDS/LVPECL OUT
08462-015

POWER SUPPLY

The AD9575 requires a 3.3 V ± 10% power supply for VS. The Specifications section gives the performance expected from the AD9575 with the power supply voltage within this range. The absolute maximum range of −0.3 V to +3.6 V, with respect to GND, must never be exceeded on the VDD, VDDA, VDDX, and VDD_CMOS pins.
Good engineering practice should be followed in the layout of power supply traces and the ground plane of the PCB. The power supply should be bypassed on the PCB with adequate capacitance (>10 μF). The AD9575 should be bypassed with adequate capacitors (0.1 μF) at all power pins as close as possible to the part. The layout of the AD9575 evaluation board is a good example.

LVPECL CLOCK DISTRIBUTION

Because they are open emitter, the LVPECL outputs require a dc termination to bias the output transistors. The simplified equivalent circuit in Figure 19 shows the LVPECL output stage.
TERM
50 50
0.1µF
LVPECL
200 200
0.1µF
Figure 19. LVPECL AC-Coupled Termination
In most applications, a standard LVPECL far-end termination is recommended, as shown in Figure 20. The resistor network is designed to match the transmission line impedance (50 Ω) and the desired switching threshold (1.3 V).
50
LVPECL
50
08462-026
GND
Figure 18. PFD Simplified Schematic
08462-016
Rev. A | Page 12 of 16
Page 13
AD9575
V
V
V
3.3V
LVPECL
50
SINGLE-ENDED (NOT COUPLED)
50
VT = VDD – 1.3V
3.3V
3.3V
127127
LVPECL
8383
08462-025
Figure 20. LVPECL Far-End Termination

LVDS CLOCK DISTRIBUTION

The AD9575 is also available with low voltage differential signaling (LVDS) o u t p ut s . LV DS us es a cu r re n t m o de output stage with a factory programmed current level. The normal value (default) for this current is 3.5 mA, which yields a 350 mV output swing across a 100 Ω resistor. The LVDS outputs meet or exceed all ANSI/TIA/EIA-644 specifications.
A recommended termination circuit for the LVDS outputs is shown in Figure 21.
50
50
100
8462-017
LVDS LVDS
Figure 21. LVDS Output Termination
See the AN-586 Application Note on the Analog Devices website at www.analog.com for more information about LVDS.

LVCMOS CLOCK DISTRIBUTION

The AD9575 provides a 33.33 MHz or 62.5 MHz clock output, which is a dedicated LVCMOS level. Whenever single-ended LVCMOS clocking is used, some of the following general guide­lines should be followed.
Point-to-point nets should be designed such that a driver has only one receiver on the net, if possible. This allows for simple
termination schemes and minimizes ringing due to possible mismatched impedances on the net. Series termination at the source is generally required to provide transmission line matching and/or to reduce current transients at the driver (see Figure 22). The value of the resistor is dependent on the board design and timing requirements (typically 10 Ω to 100 Ω is used). LVCMOS outputs are limited in terms of the capacitive load or trace length that they can drive. Typically, trace lengths less than 6 inches are recommended to preserve signal rise/fall times and preserve signal integrity.
60.4
1.0 INCH
CMOS
10
MICROSTRIP
5pF
GND
08462-018
Figure 22. Series Termination of LVCMOS Output
Termination at the far end of the PCB trace is a second option. The LVCMOS output of the AD9575 does not supply enough current to provide a full voltage swing with a low impedance resistive, far-end termination, as shown in Figure 23. The far-end termination network should match the PCB trace impedance and provide the desired switching point.
The reduced signal swing may still meet receiver input requirements in some applications. This can be useful when driving long trace lengths on less critical nets.
= 3.3
PULLUP
LVCMOS
10
50
Figure 23. LVCMOS Output with Far-End Termination
100
100
3pF
8462-019

TYPICAL APPLICATION CIRCUIT

AD9575
GNDA
VDDA
LVDS/LVPECL OUT
VDDX
LVDS/LVPECL OUT
XO1
XO2
GNDX
GNDA
VDDA
VDD_CMOS
CMOS OUT/SEL1
GND_CMOS
S
V
S
Cx1 = 22pF
Cx2 = 22pF
V
S
1nF0.1µF
0.1µF
0.1µF
1
2
3
4
5
6
7
8
Figure 24. Typical Application Circuit (in LVDS Configuration)
Rev. A | Page 13 of 16
SEL0
GND
VDD
16
15
0.1µF
V
V
0.1µF
50
50
S
S
R
T
100
=
08462-028
14
13
12
11
10
9
Page 14
AD9575

OUTLINE DIMENSIONS

5.10
5.00
4.90
0.15
0.05
4.50
4.40
4.30
PIN 1
16
0.65
BSC
COPLANARITY
COMPLIANT TO JEDEC S T ANDARDS MO-153-AB
0.10
0.30
0.19
9
81
1.20 MAX
SEATING PLANE
6.40 BSC
0.20
0.09 8°
0.75
0.60
0.45
Figure 25. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters

ORDERING GUIDE

1
Model
AD9575ARUZLVD −40°C to +85°C
AD9575ARUZPEC −40°C to +85°C
AD9575-EVALZ-LVD LVDS Outputs, Evaluation Board AD9575-EVALZ-PEC LVPECL Outputs, Evaluation Board
1
Z = RoHS Compliant Part.
Temperature Range Package Description Package Option
16-Lead Thin Shrink Small Outline Package (TSSOP), 96 pcs per Tube, LVDS Output Format
16-Lead Thin Shrink Small Outline Package (TSSOP), 96 pcs per Tube, LVPECL Output Format
RU-16
RU-16
Rev. A | Page 14 of 16
Page 15
AD9575
NOTES
Rev. A | Page 15 of 16
Page 16
AD9575
NOTES
©2010 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D08462-0-3/10(A)
Rev. A | Page 16 of 16
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