8 ADCs integrated into 1 package
114 mW ADC power per channel at 65 MSPS
SNR = 70 dB (to Nyquist)
ENOB = 11.3 bits
SFDR = 80 dBc
Excellent linearity: DNL = ±0.3 LSB (typical),
INL = ±0.4 LSB (typical)
Serial LVDS (ANSI-644, default)
Low power, reduced signal option (similar IEEE 1596.3)
Data and frame clock outputs
325 MHz full-power analog bandwidth
2 V p-p input voltage range
1.8 V supply operation
Serial port control
Full-chip and individual-channel power-down modes
Flexible bit orientation
Built-in and custom digital test pattern generation
Programmable clock and data alignment
Programmable output resolution
Standby mode
Octal, 12-Bit, 40/50/65 MSPS
FUNCTIONAL BLOCK DIAGRAM
APPLICATIONS
Medical imaging and nondestructive ultrasound
Portable ultrasound and digital beam-forming systems
Quadrature radio receivers
Diversity radio receivers
Tape drives
Optical networking
Test equipment
GENERAL DESCRIPTION
The AD9222 is an octal, 12-bit, 40/50/65 MSPS analog-todigital converter (ADC) with an on-chip sample-and-hold
circuit designed for low cost, low power, small size, and ease of
use. The product operates at a conversion rate of up to 65 MSPS
and is optimized for outstanding dynamic performance and low
power in applications where a small package size is critical.
The ADC requires a single 1.8 V power supply and LVPECL-/
CMOS-/LVDS-compatible sample rate clock for full performance
operation. No external reference or driver components are
required for many applications.
The ADC automatically multiplies the sample rate clock for
the appropriate LVDS serial data rate. A data clock output (DCO)
for capturing data on the output and a frame clock output (FCO)
for signaling a new output byte are provided. Individual-channel
power-down is supported and typically consumes less than
2 mW when all channels are disabled.
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog D evices.
The ADC contains several features designed to maximize
flexibility and minimize system cost, such as programmable
clock and data alignment and programmable digital test pattern
generation. The available digital test patterns include built-in
deterministic and pseudorandom patterns, along with custom userdefined test patterns entered via the serial port interface (SPI).
The AD9222 is available in an RoHS compliant, 64-l ea d L F CS P. I t i s
specified over the industrial temperature range of −40°C to +85°C.
PRODUCT HIGHLIGHTS
1. Small Footprint. Eight ADCs are contained in a small,
2. Low power of 114 mW/channel at 65 MSPS.
3. Ease of Use. A data clock output (DCO) is provided that
4. User Flexibility. The SPI control offers a wide range of
5. Pin-Compatible Family. This includes the AD9212 (10-bit)
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Figure 1.
space-saving package.
operates at frequencies of up to 390 MHz and supports
double data rate (DDR) operation.
flexible features to meet specific system requirements.
and AD9252 (14-bit).
www.analog.com
Page 2
AD9222 Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Integral Nonlinearity (INL) Full ±0.4 ±1 ±0.4 ±1 ±0.4 ±1 LSB
TEMPERATURE DRIFT
Offset Error Full ±2 ±2 ±2 ppm/°C
Gain Error Full ±17 ±17 ±17 ppm/°C
Reference Voltage (1 V Mode) Full ±21 ±21 ±21 ppm/°C
REFERENCE
Output Voltage Error (VREF = 1 V) Full ±2 ±30 ±2 ±30 ±2 ±30 mV
Load Regulation @ 1.0 mA (VREF = 1 V) Full 3 3 3 mV
Input Resistance Full 6 6 6 kΩ
ANALOG INPUTS
Differential Input Voltage Range
(VREF = 1 V)
Common-Mode Voltage Full AVDD/2 AVDD/2 AVDD/2 V
Full 2 2 2 V p-p
Analog Bandwidth, Full Power Full 325 325 325 MHz
POWER SUPPLY
AVDD Full 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 V
DRVDD Full 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 V
IAVDD Full 338 348.5 357.5 367.5 450 470 mA
IDRVDD Full 51 53.6 53.5 56.2 56.6 60.5 mA
Total Power Dissipation
Power-Down Dissipation Full 2 11 2 11 2 11 mW
Standby Dissipation2 Full 83 89 100 mW
CROSSTALK Full −90 −90 −90 dB
CROSSTALK (Overrange Condition)3 Full −90 −90 −90 dB
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
2
This can be controlled via SPI.
3
Overrange condition is specific with 6 dB of the full-scale input range.
Full 700 722 740 760 910 950.5 mW
Rev. F | Page 3 of 60
Page 4
AD9222 Data Sheet
fIN = 2.4 MHz
Full 70.0
70.0
69.5 dB
fIN = 19.7 MHz
Full
73
85 73
84 70.5
80 dBc
fIN = 35 MHz
Full −92
−92
−90 dBc
AC SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −0.5 dBFS, unless otherwise noted.
Table 2.
AD9222-40 AD9222-50 AD9222-65
Parameter1 Temp Min Typ Max Min Typ Max Min Typ Max Unit
SIGNAL-TO-NOISE RATIO (SNR)
fIN = 2.4 MHz Full 70.3 70.4 70.3 dB
fIN = 19.7 MHz Full 69.5 70.3 69.5 70.3 68.5 70.0 dB
fIN = 35 MHz Full 69.9 70.0 69.8 dB
fIN = 70 MHz Full 68.8 69.0 69.5 dB
SIGNAL-TO-NOISE AND DISTORTION RATIO (SINAD)
fIN = 19.7 MHz Full 68.7 70.0 68.5 70.0 66.8 69.4 dB
fIN = 35 MHz Full 69.5 69.8 69.3 dB
fIN = 70 MHz Full 68.0 68.5 69 dB
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 2.4 MHz Full 11.38 11.4 11.4 Bits
fIN = 19.7 MHz Full 11.25 11.38 11.25 11.38 11.1 11.34 Bits
fIN = 35 MHz Full 11.32 11.33 11.30 Bits
fIN = 70 MHz Full 11.14 11.17 11.25 Bits
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
fIN = 2.4 MHz Full 85 85 83 dBc
fIN = 35 MHz Full 80 83 80 dBc
fIN = 70 MHz Full 76 77 75 dBc
WORST HARMONIC (Second or Third)
fIN = 2.4 MHz Full −85 −85 −83 dBc
fIN = 19.7 MHz Full −85 −74 −84 −73 −80 −70.5 dBc
fIN = 35 MHz Full −80 −83 −80 dBc
fIN = 70 MHz Full −76 −77 −75 dBc
WORST OTHER (Excluding Second or Third)
fIN = 2.4 MHz Full −92 −92 −90 dBc
fIN = 19.7 MHz Full −92 −80 −92 −80 −90 −80 dBc
fIN = 70 MHz Full −90 −90 −85 dBc
TWO-TONE INTERMODULATION DISTORTION (IMD)—
AIN1 AND AIN2 = −7.0 dBFS
f
= 15 MHz, f
IN1
f
= 70 MHz, f
IN1
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
= 16 MHz 25°C 80.0 80.0 80.0 dBc
IN2
= 71 MHz 25°C 77.0 77.0 75.0 dBc
IN2
Rev. F | Page 4 of 60
Page 5
Data Sheet AD9222
Differential Input Voltage2
Full
250
250
250
mV p-p
LOGIC INPUT (SDIO/ODM)
DIGITAL OUTPUTS (D + x, D − x),
Output Offset Voltage (VOS)
Full
1.125
1.375
1.125
1.375
1.125
1.375
V
DIGITAL SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −0.5 dBFS, unless otherwise noted.
Table 3.
AD9222-40 AD9222-50 AD9222-65
Parameter1 Temp Min Typ Max Min Typ Max Min Typ Max Unit
Logic 1 Voltage Full 1.2 DRVDD + 0.3 1.2 DRVDD + 0.3 1.2 DRVDD + 0.3 V
Logic 0 Voltage Full 0 0.3 0 0.3 0 0.3 V
Input Resistance 25°C 30 30 30 kΩ
Input Capacitance 25°C 2 2 2 pF
LOGIC OUTPUT (SDIO/ODM)3
Logic 1 Voltage (IOH = 800 μA) Full 1.79 1.79 1.79 V
Logic 0 Voltage (IOL = 50 μA) Full 0.05 0.05 0.05 V
(ANSI-644)1
Logic Compliance LVDS LVDS LVDS
Differential Output Voltage (VOD) Full 247 454 247 454 247 454 mV
Output Coding (Default)
DIGITAL OUTPUTS (D + x, D − x),
(Low Power, Reduced Signal
1
Option)
Offset binary Offset binary Offset binary
Logic Compliance LVDS LVDS LVDS
Differential Output Voltage (VOD) Full 150 250 150 250 150 250 mV
Output Offset Voltage (VOS) Full 1.10 1.30 1.10 1.30 1.10 1.30 V
Output Coding (Default)
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
2
This is specified for LVDS and LVPECL only.
3
This is specified for 13 SDIO pins sharing the same connection.
Offset binary Offset binary Offset binary
Rev. F | Page 5 of 60
Page 6
AD9222 Data Sheet
CLOCK2
Maximum Clock Rate
Full
40
50
65
MSPS
Minimum Clock Rate
Full
10
10
10
MSPS
Aperture Delay (tA)
25°C 750
750
750 ps
SWITCHING SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −0.5 dBFS, unless otherwise noted.
Table 4.
AD9222-40 AD9222-50 AD9222-65
Parameter1 Temp Min Typ Max Min Typ Max Min Typ Max Unit
Clock Pulse Width High (tEH) Full 12.5 10.0 7.5 ns
Clock Pulse Width Low (tEL) Full 12.5 10.0 7.5 ns
OUTPUT PARAMETERS
Propagation Delay (tPD) Full 1.5 2.3 3.1 1.5 2.3 3.1 1.5 2.3 3.1 ns
Rise Time (tR) (20% to 80%) Full 300 300 300 ps
Fall Time (tF) (20% to 80%) Full 300 300 300 ps
FCO Propagati on Delay (t
DCO Propagation Delay (t
DCO to Data De lay (t
DCO to FCO Delay (t
Data to Data Skew
(t
DATA-MAX
Wake-Up Time (Standby) 25°C 600 600 600 ns
Wake-Up Time (Power-Down) 25°C 375 375 375 μs
Pipeline Latency Full 8 8 8 CLK
APERTURE
2, 3
) Full 1.5 2.3 3.1 1.5 2.3 3.1 1.5 2.3 3.1 ns
FCO
)4 Full t
CPD
)4 Full (t
DATA
)4 Full (t
FRAME
SAMPLE
− 300
SAMPLE
− 300
/24)
/24)
(t
(t
(t
FCO
SAMPLE
SAMPLE
SAMPLE
+
t
/24)
/24) (t
SAMPLE
/24)
+ 300
/24) (t
SAMPLE
/24)
+ 300
(t
SAMPLE
− 300
(t
SAMPLE
− 300
/24)
/24)
(t
(t
(t
FCO
SAMPLE
SAMPLE
SAMPLE
+
t
/24)
/24) (t
SAMPLE
/24)
+ 300
/24) (t
SAMPLE
/24)
+ 300
(t
SAMPLE
− 300
(t
SAMPLE
− 300
/24)
/24)
(t
(t
(t
FCO
SAMPLE
SAMPLE
SAMPLE
+
Full ±50 ±200 ±50 ±200 ±50 ±200 ps
− t
)
DATA-MIN
/24)
/24) (t
/24) (t
ns
/24)
SAMPLE
ps
+ 300
/24)
SAMPLE
ps
+ 300
cycles
Aperture Uncertainty (Jitter) 25°C <1 <1 <1 ps
Out-of-Range Recovery Time 25°C 1 1 1 CLK
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
2
This can be adjusted via the SPI interface.
3
Measurements were made using a part soldered to FR4 material.
4
t
/24 is based on the number of bits divided by 2 because the delays are based on half duty cycles.
DCO−, FCO+, FCO−)
CLK+, CLK− AGND −0.3 V to +3.9 V
VIN + x, VIN − x AGND −0.3 V to +2.0 V
SDIO/ODM AGND −0.3 V to +2.0 V
PDWN, SCLK/DTP, CSB AGND −0.3 V to +3.9 V
REFT, REFB, RBIAS AGND −0.3 V to +2.0 V
VREF, SENSE AGND −0.3 V to +2.0 V
ENVIRONMENTAL
Operating Temperature
−40°C to +85°C
Range (Ambient)
Maximum Junction
150°C
Temperature
Lead Temperature
300°C
(Soldering, 10 sec)
Storage Temperature
−65°C to +150°C
Range (Ambient)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL IMPEDANCE
Table 6.
Air Flow
Velocity (m/s)
1
θ
θ
JA
JB
θJC
0.0 17.7°C/W
1.0 15.5°C/W 8.7°C/W 0.6°C/W
2.5 13.9°C/W
1
θ
for a 4-layer PCB with solid ground plane (simulated). Exposed pad
JA
soldered to PCB.
ESD CAUTION
Rev. F | Page 9 of 60
Page 10
AD9222 Data Sheet
05967-005
PIN 1
INDIC
ATOR
171819202122232425262728293031
32
D – G
D + G
D – F
D + F
D – E
D + E
DCO–
DCO+
FCO–
FCO+
D – D
D + D
D – C
D + C
D – B
D + B
646362616059585756
55545352515049
VIN + F
VIN – F
AVDD
VIN – E
VIN + E
AVDD
REFT
REFB
VREF
SENSE
RBIAS
VIN + D
VIN – D
AVDD
VIN – C
VIN + C
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
AVDD
VIN + G
VIN – G
AVDD
VIN – H
VIN + H
AVDD
AVDD
CLK–
CLK+
AVDD
AVDD
DRGND
DRVDD
D – H
D + H
AVDD
VIN + B
VIN – B
AVDD
VIN – A
VIN + A
AVDD
PDWN
CSB
SDIO/ODM
SCLK/DTP
A
VDD
DRGND
DRVDD
D + A
D – A
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
AD9222
TOP VIEW
(Not to S cale)
EXPOSED PADDLE, PIN 0
(BOTTO M OF PACKAGE )
NOTES
1. THE EXP OSED PAD MUST BE CONNECTED TO ANALOG GROUND
20
D + F
ADC F Digital Output True
25
FCO−
Frame Clock Digital Output Complement
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 5. 64-Lead LFCSP Pin Configuration, Top View
AVDD 1.8 V Analog Supply
12, 37, 42, 45,
48, 51, 59, 62
13, 36 DRGND Digital Output Driver Ground
14, 35 DRVDD 1.8 V Digital Output Driver Supply
2 VIN + G ADC G Analog Input True
3 VIN − G ADC G Analog Input Complement
5 VIN − H ADC H Analog Input Complement
6 VIN + H ADC H Analog Input True
9 CLK− Input Clock Complement
10 CLK+ Input Clock True
15 D − H ADC H Digital Output Complement
16 D + H ADC H Digital Output True
17 D − G ADC G Digital Output Complement
18 D + G ADC G Digital Output True
19 D − F ADC F Digital Output Complement
21 D − E ADC E Digital Output Complement
22 D + E ADC E Digital Output True
23 DCO− Data Clock Digital Output Complement
24 DCO+ Data Clock Digital Output True
26 FCO+ Frame Clock Digital Output True
27 D − D ADC D Digital Output Complement
28 D + D ADC D Digital Output True
29 D − C ADC C Digital Output Complement
30 D + C ADC C Digital Output True
31 D − B ADC B Digital Output Complement
32 D + B ADC B Digital Output True
Rev. F | Page 10 of 60
Page 11
Data Sheet AD9222
40
CSB
Chip Select Bar
63
VIN − F
ADC F Analog Input Complement
Pin No. Mnemonic Description
33 D − A ADC A Digital Output Complement
34 D + A ADC A Digital Output True
38 SCLK/DTP Serial Clock/Digital Test Pattern
39 SDIO/ODM Serial Data Input-Output/Output Driver Mode
41 PDWN Power Down
43 VIN + A ADC A Analog Input True
44 VIN − A ADC A Analog Input Complement
46 VIN − B ADC B Analog Input Complement
47 VIN + B ADC B Analog Input True
49 VIN + C ADC C Analog Input True
50 VIN − C ADC C Analog Input Complement
52 VIN − D ADC D Analog Input Complement
53 VIN + D ADC D Analog Input True
54 RBIAS External Resistor to Set the Internal ADC Core Bias Current
55 SENSE Reference Mode Selection
56 VREF Voltage Reference Input/Output
57 REFB Differential Reference (Negative)
58 REFT Differential Reference (Positive)
60 VIN + E ADC E Analog Input True
61 VIN − E ADC E Analog Input Complement
64 VIN + F ADC F Analog Input True
Rev. F | Page 11 of 60
Page 12
AD9222 Data Sheet
VIN ± x
05967-006
10Ω
10kΩ
10kΩ
CLK–
10Ω
1.25V
CLK+
05967-007
SDIO/ODM
350Ω
30kΩ
05967-008
DRVDD
DRGND
D–D+
V
V
V
V
05967-009
SCLK/DTP AND PDWN
30kΩ
1kΩ
05967-010
100Ω
RBIAS
05967-011
EQUIVALENT CIRCUITS
Figure 6. Equivalent Analog Input Circuit
Figure 7. Equivalent Clock Input Circuit
Figure 9. Equivalent Digital Output Circuit
Figure 10. Equivalent SCLK/DTP and PDWN Input Circuit
Figure 8. Equivalent SDIO/ODM Input Circuit
Figure 11. Equivalent RBIAS Circuit
Rev. F | Page 12 of 60
Page 13
Data Sheet AD9222
CSB
70kΩ
1kΩ
AVDD
05967-012
SENSE
1kΩ
05967-013
VREF
6kΩ
05967-014
Figure 12. Equivalent CSB Input Circuit
Figure 14. Equivalent VREF Circuit
Figure 13. Equivalent SENSE Circuit
Rev. F | Page 13 of 60
Page 14
AD9222 Data Sheet
05967-015
FREQUENCY (MHz)
AMPLITUDE (dBFS)
–120
0
020
–100
–80
–60
–40
–20
2
46810
12141618
AIN = –0.5dBF S
SNR = 70.79dB
ENOB = 11.47 BITS
SFDR = 84.71dBc
05967-016
FREQUENCY (MHz)
AMPLITUDE (dBFS)
–120
0
020
–100
–80
–60
–40
–20
24681012141618
AIN = –0.5dBF S
SNR = 70.32dB
ENOB = 11.39 BITS
SFDR = 84.28dBc
0
–120
–100
–80
–60
–40
–20
0510152025
AMPLITUDE (dBFS)
FREQUENCY (MHz)
AIN = –0.5dBF S
SNR = 70.72dB
ENOB = 11.45 BITS
SFDR = 85.79dBc
05967-017
0
–120
–100
–80
–60
–40
–20
0510152025
AMPLITUDE (dBFS)
FREQUENCY (MHz)
AIN = –0.5dBF S
SNR = 70.35dB
ENOB = 11.40 BITS
SFDR = 83.86dBc
05967-018
0
–120
–100
–80
–60
–40
–20
0510152025
AMPLITUDE (dBFS)
FREQUENCY (MHz)
AIN = –0.5dBF S
SNR = 70.02dB
ENOB = 11.45 BITS
SFDR = 86.3dBc
05967-019
0
–120
–100
–80
–60
–40
–20
0510152025
AMPLITUDE (dBFS)
FREQUENCY (MHz)
AIN = –0.5dBF S
SNR = 69.25dB
ENOB = 11.21 BITS
SFDR = 72.85dBc
05967-020
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 15. Single-Tone 32k FFT with f
= 2.3 MHz, AD9222-40
IN
Figure 16. Single-Tone 32k FFT with fIN = 19.7 MHz, AD9222-40
Figure 18. Single-Tone 32k FFT with f
= 35 MHz, AD9222-50
IN
Figure 19. Single-Tone 32k FFT with f
= 70 MHz, AD9222-50
IN
Figure 17. Single-Tone 32k FFT with f
= 2.3 MHz, AD9222-50
IN
Rev. F | Page 14 of 60
Figure 20. Single-Tone 32k FFT with f
= 120 MHz, AD9222-50
IN
Page 15
Data Sheet AD9222
0
–120
–100
–80
–60
–40
–20
051015202530
AMPLITUDE (dBFS)
FREQUENCY (MHz)
AIN = –0.5dBFS
SNR = 70.21dB
ENOB = 11.31
BITS
SFDR = 82.37dBc
05967-085
0
–120
–100
–80
–60
–40
–20
051015202530
AMPLITUDE (dBFS)
FREQUENCY (MHz)
AIN = –0.5dBFS
SNR = 69.8dB
ENO
B = 11.22 BITS
SFDR = 80.61dBc
05967-086
0
–120
–100
–80
–60
–40
–20
051015202530
AMPLITUDE (dBFS)
FREQUENCY (MHz)
AIN = –0.5dBFS
SNR = 69.65dB
E
NOB = 11.07 BITS
SFDR = 74.79dBc
05967-087
0
–120
–100
–80
–60
–40
–20
051015202530
AMPLITUDE (dBFS)
FREQUENCY (MHz)
AIN = –0.5dBFS
SNR =
68.67dB
ENOB = 10.79 BITS
SFDR = 71.49dBc
05967-088
100
90
95
85
80
75
70
65
60
105045403530252015
SNR/SFDR (dB)
ENCODE (MSPS)
2V p-p, SFDR
2V p-p, SNR
05967-021
90
85
80
75
70
65
60
105045403530252015
SNR/SFDR (dB)
ENCODE (MSPS)
2V p-p, SFDR
2V p-p, SNR
05967-022
Figure 21. Single-Tone 32k FFT with f
Figure 22. Single-Tone 32k FFT with f
= 2.3 MHz, AD9222-65
IN
= 35 MHz, AD9222-65
IN
Figure 24. Single-Tone 32k FFT with f
= 120 MHz, AD9222-65
IN
Figure 25. SNR/SFDR vs. f
, fIN = 2.61 MHz, AD9222-50
SAMPLE
Figure 23. Single-Tone 32k FFT with fIN = 70 MHz, AD9222-65
Figure 26. SNR/SFDR vs. f
, fIN = 20.1 MHz, AD9222-50
SAMPLE
Rev. F | Page 15 of 60
Page 16
AD9222 Data Sheet
SNR/SFDR (dB)
ENCODE (MSPS)
60
65
70
75
80
85
90
95
100
10 15 20 25 30 35 40 45 50 55 60 65
2V p-p, SFDR
2V p-p, SNR
05967-089
SNR/SFDR (dB)
ENCODE (MSPS)
60
65
70
75
80
85
90
10 15 20 25 30 35 40 45 50 55 60 65
2V p-p, SFDR
2V p-p, SNR
05967-090
100
90
80
70
60
50
40
30
20
10
0
–60–50–40–30–20–100
SNR/SFDR (dB)
INPUT AMPLITUDE (dBFS)
80dB
REFERENCE
2V p-p, SFDR
2V p-p, SNR
05967-023
2V p-p, SNR
2V p-p, SFDR
SNR/SFDR (dB)
INPUT AMPLITUDE (dBFS)
0
10
20
30
40
50
60
70
80
90
–60–50–40–30–20–100
80dB
REFERENCE
LINE
05967-091
100
90
80
70
60
50
40
30
20
10
0
–60–50–40–30–20–100
SNR/SFDR (dB)
INPUT AMPLITUDE (dBFS)
80dB
REFERENCE
2V p-p, SFDR
2V p-p, SNR
05967-024
2V p-p, SNR
2V p-p, SFDR
SNR/SFDR (dB)
INPUT AMPLITUDE (dBFS)
0
10
20
30
40
50
60
70
80
90
–60–50–40–30–20–100
80dB
REFERENCE
LINE
05967-092
Figure 27. SNR/SFDR vs. f
Figure 28. SNR/SFDR vs. f
, fIN = 2.3 MHz, AD9222-65
SAMPLE
, fIN = 19.7 MHz, AD9222-65
SAMPLE
Figure 30. SNR/SFDR vs. Analog Input Level, f
= 10.3 MHz, AD9222-65
IN
Figure 31. SNR/SFDR vs. Analog Input Level, fIN = 35 MHz, AD9222-50
Figure 29. SNR/SFDR vs. Analog Input Level, fIN = 10.3 MHz, AD9222-50
Figure 32. SNR/SFDR vs. Analog Input Level, fIN = 35 MHz, AD9222-65
Rev. F | Page 16 of 60
Page 17
Data Sheet AD9222
0
–120
–100
–80
–60
–40
–20
02468101214161820
AMPLITUDE (dBFS)
FREQUENCY (MHz)
AIN1 AND AIN2 = –7dBF S
SFDR = 89.87dB
IMD2 = 96.07dBc
IMD3 = 90.16dBc
05967-025
0
–120
–100
–80
–60
–40
–20
02468101214161820
AMPLITUDE (dBFS)
FREQUENCY (MHz)
AIN1 AND AIN2 = –7dBF S
SFDR = 77.24dB
IMD2 = 91.66dBc
IMD3 = 77.72dBc
05967-026
0
–120
–100
–80
–60
–40
–20
0510152025
AMPLITUDE (dBFS)
FREQUENCY (MHz)
AIN1 AND AIN2 = –7dBF S
SFDR = 84.49dB
IMD2 = 85.83dBc
IMD3 = 84.54dBc
05967-027
0
–120
–100
–80
–60
–40
–20
0510152025
AMPLITUDE (dBFS)
FREQUENCY (MHz)
AIN1 AND AIN2 = –7dBF S
SFDR = 80.42dB
IMD2 = 83.92dBc
IMD3 = 80.60dBc
05967-032
0
–120
–100
–80
–60
–40
–20
051015202530
AMPLITUDE (dBFS)
FREQUENCY (MHz)
AIN1 AND AIN2 = –7dBF S
SFDR = 79.5dB
IMD2 = 80.0dBc
IMD3 = 84.1dBc
05967-093
0
–120
–100
–80
–60
–40
–20
051015202530
AMPLITUDE (dBFS)
FREQUENCY (MHz)
AIN1 AND AIN2 = –7dBF S
SFDR = 75.2dB
IMD2 = 79.3dBc
IMD3 = 75.1dBc
05967-094
Figure 33. Two-Tone 32k FFT with f
AD9222-40
Figure 34. Two-Tone 32k FFT with f
AD9222-40
= 15 MHz and f
IN1
= 70 MHz and f
IN1
= 16 MHz,
IN2
= 71 MHz,
IN2
Figure 36. Two-Tone 32k FFT with f
Figure 37. Two-Tone 32k FFT with f
= 70 MHz and f
IN1
= 15 MHz and f
IN1
= 71 MHz, AD9222-50
IN2
= 16 MHz, AD9222-65
IN2
Figure 35. Two-Tone 32k FFT with f
= 15 MHz and f
IN1
= 16 MHz, AD9222-50
IN2
Figure 38. Two-Tone 32k FFT with f
Rev. F | Page 17 of 60
= 70 MHz and f
IN1
= 71 MHz, AD9222-65
IN2
Page 18
AD9222 Data Sheet
90
85
80
75
70
65
60
1100010010
SNR/SFDR (dB)
ANALOG I NP UT FREQUENCY ( M Hz )
SFDR
SNR
05967-029
SNR/SFDR (dB)
FREQUENCY (MHz)
1101001000
50
55
60
65
70
75
80
85
90
2V p-p, SFDR
2V p-p, SNR
05967-095
100
90
95
85
80
75
70
65
60
–40–20020406080
SINAD/SF DR ( dB)
TEMPERATURE (°C)
2V p-p, SFDR
2V p-p, SINAD
05967-030
90
85
80
75
70
65
60
–40–20020408060
SINAD/SF DR ( dB)
TEMPERATURE (°C)
2V p-p, SFDR
2V p-p, SINAD
05967-096
90
85
80
75
70
65
60
–40–20020406080
SINAD/SF DR ( dB)
TEMPERATURE (°C)
2V p-p, SFDR
2V p-p, SINAD
05967-031
90
85
80
75
70
65
60
–40–20020408060
SINAD/SF DR ( dB)
TEMPERATURE (°C)
2V p-p, SFDR
2V p-p, SINAD
05967-097
Figure 39. SNR/SFDR vs. fIN, AD9222-50
Figure 40. SNR/SFDR vs. fIN, AD9222-65
Figure 42. SINAD/SFDR vs. Temperature, fIN = 2.3 MHz, AD9222-65
Figure 43. SINAD/SFDR vs. Temperature, fIN = 20.1 MHz, AD9222-50
Figure 41. SINAD/SFDR vs. Temperature, fIN = 2.61 MHz, AD9222-50
Figure 44. SINAD/SFDR vs. Temperature, fIN = 19.7 MHz, AD9222-65
Figure 53. Full-Power Bandwidth vs. Frequency, AD9222-50
Rev. F | Page 20 of 60
Page 21
Data Sheet AD9222
SS
H
C
PAR
C
SAMPLE
C
SAMPLE
C
PAR
VIN – x
H
SS
H
VIN + x
H
05967-043
THEORY OF OPERATION
The AD9222 architecture consists of a pipelined ADC divided
into three sections: a 4-bit first stage followed by eight 1.5-bit
stages and a final 3-bit flash. Each stage provides sufficient
overlap to correct for flash errors in the preceding stage. The
quantized outputs from each stage are combined into a final
12-bit result in the digital correction logic. The pipelined
architecture permits the first stage to operate with a new input
sample while the remaining stages operate with preceding samples.
Sampling occurs on the rising edge of the clock.
Each stage of the pipeline, excluding the last, consists of a low
resolution flash ADC connected to a switched-capacitor DAC
and an interstage residue amplifier (for example, a multiplying
digital-to-analog converter (MDAC)). The residue amplifier
magnifies the difference between the reconstructed DAC output
and the flash input for the next stage in the pipeline. One bit of
redundancy is used in each stage to facilitate digital correction
of flash errors. The last stage simply consists of a flash ADC.
The output staging block aligns the data, corrects errors, and
passes the data to the output buffers. The data is then serialized
and aligned to the frame and data clocks.
ANALOG INPUT CONSIDERATIONS
The analog input to the AD9222 is a differential switched-capacitor
circuit designed for processing differential input signals. This
circuit can support a wide common-mode range while maintaining
excellent performance. An input common-mode voltage of
midsupply minimizes signal-dependent errors and provides
optimum performance.
The clock signal alternately switches the input circuit between
sample mode and hold mode (see Figure 54). When the input
circuit is switched into sample mode, the signal source must be
capable of charging the sample capacitors and settling within
one-half of a clock cycle. A small resistor in series with each
input can help reduce the peak transient current injected from
the output stage of the driving source. In addition, low-Q inductors
or ferrite beads can be placed on each leg of the input to reduce
high differential capacitance at the analog inputs and therefore
achieve the maximum bandwidth of the ADC. Such use of lowQ inductors or ferrite beads is required when driving the converter
front end at high IF frequencies. Either a shunt capacitor or two
single-ended capacitors can be placed on the inputs to provide a
matching passive network. This ultimately creates a low-pass
filter at the input to limit unwanted broadband noise. See the
AN-742 Application Note, the AN-827Application Note, and the
Analog Dialogue article “Transformer-Coupled Front-End for
Wideband A/D Converters” (Volume 39, April 2005) for more
information. In general, the precise values depend on the
application.
The analog inputs of the AD9222 are not internally dc-biased.
Therefore, in ac-coupled applications, the user must provide
this bias externally. Setting the device so that V
= AVDD /2 is
CM
recommended for optimum performance, but the device can
function over a wider range with reasonable performance, as
shown in Figure 55 and Figure 57.
Figure 54. Switched-Capacitor Input Circuit
Rev. F | Page 21 of 60
Page 22
AD9222 Data Sheet
90
85
80
75
70
65
60
0.21.61.41.21.00.80.60.4
SNR/SFDR (dB)
ANALOG INPUT COMMON-MODE VOLTAGE (V)
SFDR (dBc)
SNR (dB)
05967-044
90
85
80
75
70
65
60
0.201.61.41.21.00.80.60.4
SNR/SFDR (dB)
ANALOG INPUT COMMON-MODE VOLTAGE (V)
SFDR (dBc)
SNR (dB)
05967-101
90
85
80
75
70
65
60
0.21.61.41.21.00.80.60.4
SNR/SFDR (dB)
ANALOG INPUT COMMON-MODE VOLTAGE (V)
SFDR (dBc)
SNR (dB)
05967-042
90
85
80
75
70
65
60
0.201.61.41.21.00.80.60.4
SNR/SFDR (dB)
ANALOG INPUT COMMON-MODE VOLTAGE (V)
SFDR (dBc)
SNR (dB)
05967-102
Figure 55. SNR/SFDR vs. Common-Mode Voltage,
f
= 2.3 MHz, AD9222-50
IN
Figure 56. SNR/SFDR vs. Common-Mode Voltage,
f
= 2.3 MHz, AD9222-65
IN
Figure 57. SNR/SFDR vs. Common-Mode Voltage,
f
= 35 MHz, AD9222-50
IN
Figure 58. SNR/SFDR vs. Common-Mode Voltage,
f
= 35 MHz, AD9222-65
IN
Rev. F | Page 22 of 60
Page 23
Data Sheet AD9222
2Vp-p
R
R
C
DIFF
1
C
1
C
DIFF
IS OPTIONAL.
49.9Ω
0.1μF
1kΩ
1kΩ
AGND
AVDD
ADT1–1WT
1:1 Z RATIO
VIN – x
ADC
AD9222
VIN + x
C
05967-046
ADC
AD9222
2Vp-p
2.2pF
1kΩ
0.1μF
1kΩ
1kΩ
AVDD
ADT1–1WT
1:1 Z RATIO
16nH
16nH
0.1μF
16nH
33Ω
33Ω
499Ω
65Ω
VIN + x
VIN – x
05967-047
2V p-p
R
R
49.9Ω
0.1µF
0.1µF
AVDD
1kΩ
25Ω
1kΩ
1kΩ
1kΩ
AVDD
VIN – x
ADC
AD9222
VIN + x
C
DIFF
1
C
1
C
DIFF
IS OPTIONAL.
C
05967-048
05967-049
AD8334
1.0kΩ
1.0kΩ
374Ω
187Ω
R
R
C
0.1μF
187Ω
0.1μF
0.1μF
0.1μF
0.1μF10μF
0.1μF
1V p-p
0.1μF
LNA
120nH
VGA
VOH
VIP
INH
22pF
LMD
VIN
LOP
LON
VOL
18nF
274Ω
VIN – x
ADC
AD9222
VIN + x
1kΩ
1kΩ
AVDD
For best dynamic performance, the source impedances driving
VIN + x and VIN − x should be matched such that commonmode settling errors are symmetrical. These errors are reduced
by the common-mode rejection of the ADC. An internal
reference buffer creates the positive and negative reference
voltages, REFT and REFB, respectively, that define the span of
the ADC core. The output common-mode of the reference buffer
is set to midsupply, and the REFT and REFB voltages and span
are defined as
It can be seen from these equations that the REFT and REFB
voltages are symmetrical about the midsupply voltage and, by
definition, the input span is twice the value of the VREF voltage.
Maximum SNR performance is achieved by setting the ADC to
the largest span in a differential configuration. In the case of the
AD9222, the largest input span available is 2 V p-p.
Differential Input Configurations
There are several ways to drive the AD9222 either actively or
passively; h owever, optimum performance is achieved by
driving the analog input differentially. For example, using the
AD8334 differential driver to drive the AD9222 provides
excellent performance and a flexible interface to the ADC (see
Figure 62) for baseband applications. This configuration is
commonly used for medical ultrasound systems.
For applications where SNR is a key parameter, differential
transformer coupling is the recommended input configuration
(see Figure 59 and Figure 60) because the noise performance of
most amplifiers is not adequate to achieve the true performance
of the AD9222.
Regardless of the configuration, the value of the shunt capacitor,
C, is dependent on the input frequency and may need to be
reduced or removed.
Figure 60. Differen tial Transformer-Coup led Configuration f or IF Applications
Single-Ended Input Configuration
A single-ended input may provide adequate performance in
cost-sensitive applications. In this configuration, SFDR and
distortion performance degrade due to the large input commonmode swing. If the application requires a single-ended input
configuration, ensure that the source impedances on each input
are well matched in order to achieve the best possible performance.
A full-scale input of 2 V p-p can still be applied to the ADC’s
VIN + x pin while the VIN − x pin is terminated. Figure 61 details
a typical single-ended input configuration.
Rev. F | Page 23 of 60
Figure 62. Differential Input Configuration Using the AD8334
Figure 61. Single-Ended Input Configuration
Page 24
AD9222 Data Sheet
0.1µF
0.1µF
0.1µF0.1µF
SCHOTTKY
DIODES:
HSM2812
CLK+
50Ω
100Ω
CLK–
CLK+
ADC
AD9222
MINI-CIRCUITS
®
ADT1-1WT, 1:1Z
XFMR
05967-050
CLK+
100Ω
0.1µF
0.1µF
0.1µF
0.1µF
240Ω240Ω
CLK–
AD9510/AD9511/
AD9512/AD9513/
AD9514/AD9515
50Ω
1
50Ω
1
CLK
CLK
1
50Ω RESISTORS ARE OPTIONAL.
CLK–
CLK+
ADC
AD9222
05967-051
PECL DRIVER
CLK+
CLK–
100Ω
0.1µF
0.1µF
0.1µF
0.1µF
50Ω
1
LVDS DRIVER
50Ω
1
CLK
CLK
1
50Ω RESISTORS ARE OPTIONAL.
CLK–
CLK+
ADC
AD9222
05967-052
AD9510/AD9511/
AD9512/AD9513/
AD9514/AD9515
CLK+
0.1µF
0.1µF
0.1µF
39kΩ
CMOS DRIVER
50Ω
1
OPTIONAL
100Ω
0.1µF
CLK
CLK
1
50Ω RESISTOR IS OPTIONAL.
CLK–
CLK+
ADC
AD9222
05967-053
AD9510/AD9511/
AD9512/AD9513/
AD9514/AD9515
CLK+
0.1µF
0.1µF
0.1µF
CMOS DRIVER
50Ω
1
OPTIONAL
100Ω
CLK
CLK
1
50Ω RESISTOR IS OPTIONAL.
0.1µF
CLK–
CLK+
ADC
AD9222
05967-054
AD9510/AD9511/
AD9512/AD9513/
AD9514/AD9515
CLOCK INPUT CONSIDERATIONS
For optimum performance, the AD9222 sample clock inputs
(CLK+ and CLK−) should be clocked with a differential signal.
This signal is typically ac-coupled to the CLK+ and CLK− pins
via a transformer or capacitors. These pins are biased internally
and require no additional biasing.
Figure 63 shows a preferred method for clocking the AD9222. The
low jitter clock source is converted from a single-ended signal
to a differential signal using an RF transformer. The back-toback Schottky diodes across the secondary transformer limit
clock excursions into the AD9222 to approximately 0.8 V p-p
differential. This helps prevent the large voltage swings of the
clock from feeding through to other portions of the AD9222,
and it preserves the fast rise and fall times of the signal, which
are critical to low jitter performance.
In some applications, it is acceptable to drive the sample clock
inputs with a single-ended CMOS signal. In such applications,
CLK+ should be directly driven from a CMOS gate, and the
CLK− pin should be bypassed to ground with a 0.1 μF capacitor
in parallel with a 39 kΩ resistor (see Figure 66). Although the
CLK+ input circuit supply is AVDD (1.8 V), this input is
designed to withstand input voltages of up to 3.3 V, making the
selection of the drive logic voltage very flexible.
Figure 63. Transformer-Coupled Differential Clock
Another option is to ac-couple a differential PECL signal to the
sample clock input pins as shown in Figure 64. The AD9510/
AD9511/AD9512/AD9513/AD9514/AD9515 family of clock
drivers offers excellent jitter performance.
Figure 64. Differential PECL Sample Cl ock
Figure 65. Differential LVDS Sample Clock
Figure 66. Single-Ended 1.8 V CMOS Sample Clock
Figure 67. Single-Ended 3.3 V CMOS Sample Clock
Clock Duty Cycle Considerations
Typical high speed ADCs use both clock edges to generate a
variety of internal timing signals. As a result, these ADCs may
be sensitive to clock duty cycle. Commonly, a 5% tolerance is
required on the clock duty cycle to maintain dynamic performance
characteristics. The AD9222 contains a duty cycle stabilizer (DCS)
that retimes the nonsampling edge, providing an internal clock
signal with a nominal 50% duty cycle. This allows a wide range
of clock input duty cycles without affecting the performance of
the AD9222. When the DCS is on, noise and distortion performance are nearly flat for a wide range of duty cycles. However,
some applications may require the DCS function to be off. If so,
keep in mind that the dynamic range performance can be affected
when operated in this mode. See the Memory Map section for
more details on using this feature.
The duty cycle stabilizer uses a delay-locked loop (DLL) to
create the nonsampling edge. As a result, any changes to the
sampling frequency require approximately eight clock cycles
to allow the DLL to acquire and lock to the new rate.
Rev. F | Page 24 of 60
Page 25
Data Sheet AD9222
1101001000
16 BITS
14 BITS
12 BITS
30
40
50
60
70
80
90
100
110
120
130
0.125ps
0.25ps
0.5ps
1.0ps
2.0ps
ANALOG INPUT FREQUENCY (MHz)
10 BITS
8 BITS
RMS CLOCK JI TTER REQUI RE M E NT
SNR (dB)
05967-055
05967-057
ENCODE (MSPS)
CURRENT (A)
1050
0
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
15202530354045
0.500
0.550
0.600
0.650
0.700
0.750
0.800
POWER (W)
TOTAL POWER
AVDD CURRENT
DRVDD CURRENT
ENCODE (MSPS)
CURRENT (mA)
106050203040
700
750
800
850
900
950
POWER (mW)
TOTAL POWER
AVDD CURRENT
DRVDD CURRENT
0
50
100
150
200
250
300
350
400
450
500
05967-103
Clock Jitter Considerations
High speed, high resolution ADCs are sensitive to the quality of the
clock input. The degradation in SNR at a given input frequency
(f
) due only to aperture jitter (tJ) can be calculated by
A
SNR Degradation = 20 × log 10(1/2 × π × f
× tJ)
A
In this equation, the rms aperture jitter represents the root mean
square of all jitter sources, including the clock input, analog input
signal, and ADC aperture jitter specifications. IF undersampling
applications are particularly sensitive to jitter (see Figure 68).
The clock input should be treated as an analog signal in cases
where aperture jitter may affect the dynamic range of the AD9222.
Power supplies for clock drivers should be separated from the
ADC output driver supplies to avoid modulating the clock signal
with digital noise. Low jitter, crystal-controlled oscillators make
the best clock sources. If the clock is generated from another
type of source (by gating, dividing, or other methods), it should
be retimed by the original clock at the last step.
Refer to the AN-501 Application Note and the AN-756
Application Note for more in-depth information about jitter
performance as it relates to ADCs.
Power Dissipation and Power-Down Mode
As shown in Figure 69, the power dissipated by the AD9222 is
proportional to its sample rate. The digital power dissipation
does not vary much because it is determined primarily by the
DRVDD supply and bias current of the LVDS output drivers.
Figure 69. Supply Current vs. f
for fIN = 10.3 MHz, AD9222- 50
SAMPLE
Figure 68. Ideal SNR vs. Input Frequency and Jitter
Figure 70. Supply Current vs. f
for fIN = 10.3 MHz, AD9222- 65
SAMPLE
Rev. F | Page 25 of 60
Page 26
AD9222 Data Sheet
CH1 500mV/DIV = F CO
CH2 500mV/DIV = DCO
CH3 500mV/DIV = DAT A
5.0ns/DIV
05967-058
CH1 500mV/DIV = F CO
CH2 500mV/DIV = DCO
CH3 500mV/DIV = DAT A
5.0ns/DIV
05967-084
By asserting the PDWN pin high, the AD9222 is placed into
power-down mode. In this state, the ADC typically dissipates
11 mW. Du ri ng po we r-down, the LVDS output drivers are placed
in a high impedance state. The AD9222 returns to normal
operating mode when the PDWN pin is pulled low. This pin is
both 1.8 V and 3.3 V tolerant.
In power-down mode, low power dissipation is achieved by
shutting down the reference, reference buffer, PLL, and biasing
networks. The decoupling capacitors on REFT and REFB are
discharged when entering power-down mode and must be
recharged when returning to normal operation. As a result, the
wake-up time is related to the time spent in the power-down
mode; shorter cycles result in proportionally shorter wake-up
times. With the recommended 0.1 µF and 4.7 µF decoupling
capacitors on REFT and REFB, approximately 1 sec is required
to fully discharge the reference buffer decoupling capacitors,
and approximately 375 µs is required to restore full operation.
There are several other power-down options available when
using the SPI. The user can individually power down each
channel or put the entire device into standby mode. The latter
option allows the user to keep the internal PLL powered when
fast wake-up times (~600 ns) are required. See the Memory
Map section for more details on using these features.
Digital Outputs and Timing
The AD9222 differential outputs conform to the ANSI-644 LVDS
standard on default power-up. This can be changed to a low power,
reduced signal option (similar to the IEEE 1596.3 standard) via the
SDIO/ODM pin or SPI. This LVDS standard can further reduce
the overall power dissipation of the device by approximately
36 m W. See the SDIO/ODM Pin section or Tabl e 16 in the
Memory Map section for more information. The LVDS driver
current is derived on chip and sets the output current at each
output equal to a nominal 3.5 mA. A 100 Ω differential termination
resistor placed at the LVDS receiver inputs results in a nominal
350 mV swing at the receiver.
The AD9222 LVDS outputs facilitate interfacing with LVDS
receivers in custom ASICs and FPGAs for superior switching
performance in noisy environments. Single point-to-point net
topologies are recommended with a 100 Ω termination resistor
placed as close to the receiver as possible. If there is no far-end
receiver termination or there is poor differential trace routing,
timing errors may result. To avoid such timing errors, it is
recommended that the trace length be no longer than 24 inches
and that the differential output traces be kept close together and
at equal lengths. An example of the FCO and data stream with
proper trace length and position is shown in Figure 71.
Figure 71. LVDS Output Timing Example in ANSI-644 Mode (Default),
AD9222-50
Figure 72. LVDS Output Timing Example in ANSI-644 Mode (Default),
AD9222-65
Rev. F | Page 26 of 60
Page 27
Data Sheet AD9222
500
400
300
200
100
–500
–400
–300
–200
–100
0
–1.0ns–1.5ns–0.5ns0ns0.5ns1.0ns1.5ns
EYE DIAGRAM VOLTAGE (mV)
EYE: ALL BITSULS: 12071/12071
90
50
10
20
30
40
60
70
80
0
–150ps –100ps–50ps0ps50ps100ps150ps
TIE JITTER HISTOGRAM (Hits)
05967-061
600
400
200
–600
–400
–200
0
–1.0ns–1.5ns–0.5ns0ns0.5ns1.0ns1.5ns
EYE DIAGRAM VOLTAGE (mV)
EYE: ALL BITSULS: 9596/15596
20
40
60
80
100
140
120
0
–150ps –100ps–50ps0ps50ps100ps150ps
TIE JITTER HISTOGRAM (Hits)
05967-106
60
80
90
70
50
40
20
10
100
30
0
–200ps–100ps100ps0ps200ps
TIE JITTER HISTOGRAM (Hits)
500
400
300
200
100
–500
–400
–300
–200
–100
0
–1.0ns–0.5ns0ns0.5ns1.5ns–1.5ns1.0ns
EYE DIAGRAM VOLTAGE (mV)
EYE: ALL BITS
ULS: 12067/12067
05967-059
An example of the LVDS output using the ANSI-644 standard
(default) data eye and a time interval error (TIE) jitter histogram
with trace lengths less than 24 inches on standard FR-4 material is
shown in Figure 73 and Figure 74. Figure 75 and Figure 76 show
examples of trace lengths exceeding 24 inches on standard FR-4
material. Notice that the TIE jitter histogram reflects the decrease
of the data eye opening as the edge deviates from the ideal position.
It is the user’s responsibility to determine if the waveforms meet
the timing budget of the design when the trace lengths exceed
24 inches. Additional SPI options allow the user to further increase
the internal termination (increasing the current) of all eight outputs
in order to drive longer trace lengths (see Figure 77 and Figure 78).
Even though this produces sharper rise and fall times on the data
edges and is less prone to bit errors, the power dissipation of the
DRVDD supply increases when this option is used.
In cases that require increased driver strength to the DCO± and
FCO± outputs because of load mismatch, Register 0x15 allows
the user to increase the drive strength by 2×. To do this, set the
appropriate bit in Register 0x5. Note that this feature cannot be
used with Bit 4 and Bit 5 in Register 0x15. Bit 4 and Bit 5 take
precedence over this feature. See the Memory Map section for
more details.
Figure 73. Data Eye for LVDS Outputs in ANSI-644 Mode with Trace Lengths
Less than 24 Inches on Standard FR-4, AD9222-50
Figure 74. Data Eye for LVDS Outputs in ANSI-644 Mode with Trace Lengths
Less than 24 Inches on Standard FR-4, AD9222-65
Figure 75. Data Eye for LVDS Outputs in ANSI-644 Mode with Trace Lengths
Greater than 24 Inches on Standard FR-4, AD9222-50
Rev. F | Page 27 of 60
Page 28
AD9222 Data Sheet
500
400
300
200
100
–500
–400
–300
–200
–100
0
–1.0ns–1.5ns–0.5ns0ns0.5ns1.0ns1.5ns
EYE DIAGRAM VOLTAGE (mV)
EYE: ALL BITSULS: 7591/15591
20
40
60
80
100
140
120
0
–300ps –200ps –100ps0ps100ps200ps300ps
TIE JITTER HISTOGRAM (Hits)
05967-105
400
300
200
100
–400
–300
–200
–100
0
–0.5ns0ns0.5ns
EYE DIAGRAM VOLTAGE (mV)
EYE: ALL BITS
ULS: 12072/12072
80
50
10
20
30
40
60
70
0
–150ps –100ps–50ps0ps50ps100ps150ps
TIE JITTER HISTOGRAM (Hits)
–1.0ns1.5ns–1.5ns1.0ns
05967-060
500
400
300
200
100
–500
–400
–300
–200
–100
0
–1.0ns–1.5ns–0.5ns0ns0.5ns1.0ns1.5ns
EYE DIAGRAM VOLTAGE (mV)
EYE: ALL BITSULS: 8000/15600
20
40
60
80
100
140
120
0
–200ps –100ps0ps100ps200ps300ps
TIE JITTER HISTOGRAM (Hits)
05967-104
Figure 76. Data Eye for LVDS Outputs in ANSI-644 Mode with Trace Lengths
Greater than 24 Inches on Standard FR-4, AD9222-65
Figure 77. Data Ey e for LVDS Outputs in ANSI-644 Mode with 100 Ω Termination
on and Trace Lengths Greater than 24 Inches on Standard FR-4, AD9222-50
Figure 78. Data Ey e for LVDS Outputs in ANSI-644 Mode with 100 Ω Termination
on and Trace Lengths Greater than 24 Inches on Standard FR-4, AD9222-65
The format of the output data is offset binary by default. An
example of the output coding format can be found in Table 8.
To change the output data format to twos complement, see the
Memory Map section.
Data from each ADC is serialized and provided on a separate
channel. The data rate for each serial stream is equal to 12 bits
times the sample clock rate, with a maximum of 780 Mbps
(12 bits × 65 MSPS = 780 Mbps). The lowest typical conversion
rate is 10 MSPS. However, if lower sample rates are required for
a specific application, the PLL can be set up via the SPI to allow
encode rates as low as 5 MSPS. See the Memor y Map section to
enable this feature.
Rev. F | Page 28 of 60
Page 29
Data Sheet AD9222
Two output clocks are provided to assist in capturing data from
the AD9222. The DCO is used to clock the output data and is
equal to six times the sample clock (CLK) rate. Data is clocked
out of the AD9222 and must be captured on the rising and
Table 9. Flexible Output Test Modes
Output Test Mode
Bit Sequence Pattern Name Digital Output Word 1 Digital Output Word 2
0000 Off (default) N/A N/A N/A
0001 Midscale short 1000 0000 (8-bit)
All test mode options except PN sequence short and PN sequence long can support 8- to 14-bit word lengths in order to verify data capture to the receiver.
falling edges of the DCO that supports double data rate (DDR)
capturing. The FCO is used to signal the start of a new output
byte and is equal to the sample clock rate. See the timing
diagram shown in Figure 2 for more information.
When the SPI is used, the DCO phase can be adjusted in 60°
increments relative to the data edge. This enables the user to
refine system timing margins if required. The default DCO+
and DCO− timing, as shown in Figure 2, is 90° relative to the
output data edge.
An 8-, 10-, and 14-bit serial stream can also be initiated from
the SPI. This allows the user to implement and test compatibility
with lower and higher resolution systems. When changing the
resolution to an 8- or 10-bit serial stream, the data stream is
shortened. See Figure 3 for the 10-bit example. However, when
using the 14-bit option, the data stream stuffs two 0s at the end
of the 14-bit serial data.
When the SPI is used, all of the data outputs can also be
inverted from their nominal state. This is not to be confused
with inverting the serial stream to an LSB-first mode. In default
mode, as shown in Figure 2, the MSB is first in the data output
serial stream. However, this can be inverted so that the LSB is
first in the data output serial stream (see Figure 4).
There are 12 digital output test pattern options available that
can be initiated through the SPI. This is a useful feature when
validating receiver capture and timing. Refer to Tab l e 9 for the
output bit sequencing options available. Some test patterns have
two serial sequential words and can be alternated in various
ways, depending on the test pattern chosen. Note that some
patterns may not adhere to the data format select option. In
addition, user-defined test patterns can be assigned in the 0x19,
0x1A, 0x1B, and 0x1C register addresses. All test mode options
except PN sequence short and PN sequence long can support
8- to 14-bit word lengths in order to verify data capture to the
receiver.
The PN sequence short pattern produces a pseudorandom bit
sequence that repeats itself every 2
9
− 1 or 511 bits. A
description of the PN sequence and how it is generated can be
found in Section 5.1 of the ITU-T 0.150 (05/96) standard. The
only difference is that the starting value must be a specific value
instead of all 1s (see Table 10 for the initial values).
The PN sequence long pattern produces a pseudorandom bit
sequence that repeats itself every 2
23
− 1 or 8,388,607 bits. A
description of the PN sequence and how it is generated can be
found in section 5.6 of the ITU-T 0.150 (05/96) standard. The
only differences are that the starting value must be a specific
value instead of all 1s (see Ta b l e 10 for the initial values) and the
AD9222 inverts the bit stream with relation to the ITU standard.
Table 10. PN Sequence
Sequence
Initial
Value
First Three Output Samples
(MSB First)
SDIO/ODM Pin
The SDIO/ODM pin is for use in applications that do not require
SPI mode operation. This pin can enable a low power, reduced
signal option (similar to the IEEE 1596.3 reduced range link
output standard) if it and the CSB pin are tied to AVDD during
device power-up. This option should only be used when the
digital output trace lengths are less than 2 inches from th e LVDS
receiver. When this option is used, the FCO, DCO, and outputs
function normally, but the LVDS signal swing of all channels is
reduced from 350 mV p-p to 200 mV p-p, allowing the user to
further reduce the power on the DRVDD supply.
For applications where this pin is not used, it should be tied low.
In this case, the device pin can be left open, and the 30 kΩ
internal pull-down resistor pulls this pin low. This pin is only
1.8 V tolerant. If applications require this pin to be driven from a
3.3 V logic level, insert a 1 kΩ resistor in series with this pin to
limit the current.
Table 11. Output Driver Mode Pin Settings
Selected ODM ODM Voltage
Normal
Operation
ODM AVDD
10 kΩ to AGND
Output Standard
ANSI-644
(default)
Low power,
reduced
signal option
FCO and DCO
ANSI-644
(default)
Low power,
reduced signal
option
SCLK/DTP Pin
The SCLK/DTP pin is for use in applications that do not require
SPI mode operation. This pin can enable a single digital test
pattern if it and the CSB pin are held high during device powerup. When the SCLK/DTP is tied to AVDD, the ADC channel
outputs shift out the following pattern: 1000 0000 0000. The
FCO and DCO function normally while all channels shift out the
repeatable test pattern. This pattern allows the user to perform
timing alignment adjustments among the FCO, DCO, and output
data. For normal operation, this pin should be tied to AGND
through a 10 kΩ resistor. This pin is both 1.8 V and 3.3 V tolerant.
Table 12. Digital Test Pattern Pin Settings
Selected DTP DTP Voltage
Operation
DTP AVDD 1000 0000 0000 Normal operation
D + x and D − x
operation
FCO and DCO
Additional and custom test patterns can also be observed when
commanded from the SPI port. Consult the Memory Map
section for information about the options available.
PN Sequence Long 0x29b80a 0x591, 0xfd7, 0x0a3
Consult the Memory Map section for information on how
to change these additional digital output timing features
through the SPI.
Rev. F | Page 30 of 60
Page 31
Data Sheet AD9222
1µF0.1µF
VREF
SENSE
0.5V
REFT
0.1µF
0.1µF4.7µF
0.1µF
REFB
SELECT
LOGIC
ADC
CORE
+
VIN – x
VIN + x
05967-064
1µF
1
0.1µF
1
VREF
SENSE
AVDD
0.5V
REFT
0.1µF
0.1µF4.7µF
0.1µF
REFB
SELECT
LOGIC
ADC
CORE
+
VIN – x
VIN + x
EXTERNAL
REFERENCE
1
OPTIONAL.
05967-065
CSB Pin
The CSB pin should be tied to AVDD for applications that do
not require SPI mode operation. By tying CSB high, all SCLK
and SDIO information is ignored. This pin is both 1.8 V and
3.3 V tolerant.
RBIAS Pin
To set the internal core bias current of the ADC, place a resistor
(nominally equal to 10.0 kΩ) to ground at the RBIAS pin. The
resistor current is derived on-chip and sets the AVDD current of
the ADC to a nominal 450 mA at 65 MSPS. Therefore, it is
imperative that at least a 1% tolerance on this resistor be used to
achieve consistent performance
Voltage Reference
A stable, accurate 0.5 V voltage reference is built into the
AD9222. This is gained up internally by a factor of 2, setting
V
to 1.0 V, which results in a full-scale differential input span
REF
of 2 V p-p. The V
is set internally by default; however, the
REF
VREF pin can be driven externally with a 1.0 V reference to
improve accuracy.
When applying the decoupling capacitors to the VREF, REFT,
and REFB pins, use ceramic low-ESR capacitors. These capacitors
should be close to the ADC pins and on the same layer of the
PCB as the AD9222. The recommended capacitor values and
configurations for the AD9222 reference pin are shown in
Figure 79.
The REFT and REFB pins establish their input span of the ADC
core from the reference configuration. The analog input fullscale range of the ADC equals twice the voltage at the reference
pin for either an internal or an external reference configuration.
If the reference of the AD9222 is used to drive multiple
converters to improve gain matching, the loading of the reference by the other converters must be considered. Figure 81
depicts how the internal reference voltage is affected by loading.
Figure 79. Internal Reference Configuration
Table 13. Reference Settings
Resulting
Differential
Selected Mode SENSE Voltage Resulting VREF (V)
External
AVDD N/A
Span (V p-p)
2 × external
Reference
Internal,
AGND to 0.2 V 1.0 2.0
2 V p-p FSR
Internal Reference Operation
A comparator within the AD9222 detects the potential at the
SENSE pin and configures the reference. If SENSE is grounded,
the reference amplifier switch is connected to the internal
resistor divider (see Figure 79), setting VREF to 1 V.
reference
Figure 80. External Reference Operation
Rev. F | Page 31 of 60
Page 32
AD9222 Data Sheet
01.00.52.01.53.02.53.5
V
REF
ERROR (%)
CURRENT LOAD ( mA)
05727-083
–30
–5
–10
–15
–20
–25
5
0
0.02
–0.18
–0.14
–0.10
–0.06
–0.02
–0.16
–0.12
–0.08
–0.04
0
–40
V
REF
ERROR (%)
TEMPERATURE (°C)
05967-028
–20020406080
External Reference Operation
The use of an external reference may be necessary to enhance
the gain accuracy of the ADC or improve thermal drift characteristics. Figure 82 shows the typical drift characteristics of the
internal reference in 1 V mode.
When the SENSE pin is tied to AVDD, the internal reference is
disabled, allowing the use of an external reference. The external
reference is loaded with an equivalent 6 kΩ load. An internal
reference buffer generates the positive and negative full-scale
references, REFT and REFB, for the ADC core. Therefore, the
external reference must be limited to a nominal of 1.0 V.
Figure 82. Typical V
Drift, AD9222-50
REF
Figure 81. V
Accuracy vs. Load, AD9222-50
REF
Rev. F | Page 32 of 60
Page 33
Data Sheet AD9222
SERIAL PORT INTERFACE (SPI)
The AD9222 serial port interface allows the user to configure
the converter for specific functions or operations through a
structured register space provided inside the ADC. This gives
the user added flexibility and customization, depending on the
application. Addresses are accessed via the serial port and can
be written to or read from via the port. Memory is organized
into bytes that can be further divided down into fields, as documented in the Memory Map section. Detailed operational
information can be found in the AN-877 Application Note, Interfacing to High Speed ADCs via SPI.
There are three pins that define the SPI: SCLK, SDIO, and CSB
(see Table 14). The SCLK pin is used to synchronize the read
and write data presented to the ADC. The SDIO pin is a dualpurpose pin that allows data to be sent to and read from the
internal ADC memory map registers. The CSB pin is an active
low control that enables or disables the read and write cycles.
Table 14. Serial Port Pins
Pin Function
SCLK Serial Clock. The serial shift clock input. SCLK is used to
synchronize serial interface reads and writes.
SDIO Serial Data Input/Output. A dual-purpose pin. The
typical role for this pin is an input or output, depending
on the instruction sent and the relative position in the
timing frame.
CSB Chip Select Bar (Active Low). This control gates the read
and write cycles.
The falling edge of the CSB in conjunction with the rising edge
of the SCLK determines the start of the framing sequence. During
an instruction phase, a 16-bit instruction is transmitted followed by
one or more data bytes, which is determined by Bit Field W0 and
Bit Field W1. An example of the serial timing and its definitions
can be found in Figure 84 and Table 15. During normal operation,
CSB is used to signal to the device that SPI commands are to be
received and processed. When CSB is brought low, the device
processes SCLK and SDIO to process instructions. Normally,
CSB remains low until the communication cycle is complete.
However, if connected to a slow device, CSB can be brought
high between bytes, allowing older microcontrollers enough
time to transfer data into shift registers. CSB can be stalled
when transferring one, two, or three bytes of data. When W0 and
W1 are set to 11, the device enters streaming mode and continues
to process data, either reading or writing, until CSB is taken
high to end the communication cycle. This allows complete
memory transfers without requiring additional instructions.
Regardless of the mode, if CSB is taken high in the middle of a
byte transfer, the SPI state machine is reset and the device waits
for a new instruction.
In addition to the operation modes, the SPI port configuration
influences how the AD9222 operates. For applications that do
not require a control port, the CSB line can be tied and held high.
This places the remainder of the SPI pins into their secondary
modes, as defined in the SDIO/ODM Pin and SCLK/DTP Pin
sections. CSB can also be tied low to enable 2-wire mode. When
CSB is tied low, SCLK and SDIO are the only pins required for
communication. Although the device is synchronized during
power-up, the user should ensure that the serial port remains
synchronized with the CSB line when using this mode. When
operating in 2-wire mode, it is recommended to use a 1-, 2-, or
3-byte transfer exclusively. Without an active CSB line, streaming
mode can be entered but not exited.
In addition to word length, the instruction phase determines if
the serial frame is a read or write operation, allowing the serial
port to be used to both program the chip and read the contents
of the on-chip memory. If the instruction is a readback operation,
performing a readback causes the SDIO pin to change from an
input to an output at the appropriate point in the serial frame.
Data can be sent in MSB- or LSB-first mode. MSB-first mode
is the default at power-up and can be changed by adjusting the
configuration register. For more information about this and
other features, see the AN-877 Application Note, Interfacing to High Speed ADCs via SPI.
Rev. F | Page 33 of 60
Page 34
AD9222 Data Sheet
05967-037
NUMBER OF SDIO PINS CO NNE CTED TOG E THER
V
OH
(V)
1.715
1.720
1.725
1.730
1.735
1.740
1.745
1.750
1.755
1.760
1.765
1.770
1.775
1.780
1.785
1.790
1.795
1.800
0302010405060708090 100
HARDWARE INTERFACE
The pins described in Ta bl e 14 compose the physical interface
between the user’s programming device and the serial port of
the AD9222. The SCLK and CSB pins function as inputs when
using the SPI. The SDIO pin is bidirectional, functioning as an
input during write phases and as an output during readback.
If multiple SDIO pins share a common connection, care should
be taken to ensure that proper V
same load for each AD9222, Figure 83 shows the number of SDIO
pins that can be connected together and the resulting V
levels are met. Assuming the
OH
level.
OH
This interface is flexible enough to be controlled by either serial
PROMS or PIC mirocontrollers, providing the user with an
alternative method, other than a full SPI controller, to program
the ADC (see the AN-812 Application Note).
If the user chooses not to use the SPI, these dual-function pins
serve their secondary functions when the CSB is strapped to
AVDD during device power-up. See the Theory of Operation
section for details on which pin-strappable functions are
supported on the SPI pins.
Figure 83. SDIO Pin Loading
Rev. F | Page 34 of 60
Page 35
Data Sheet AD9222
DON’T CARE
DON’T CAREDON’T CARE
DON’T CARE
SDIO
SCLK
CSB
t
S
t
DH
t
HI
t
CLK
t
LO
t
DS
t
H
R/WW1W0A12A11A10A9A8A7
D5D4D3D2D1D0
05967-068
Parameter
Timing (Minimum, ns)
Description
t
10
Minimum time for the SDIO pin to switch from an input to an output relative to the SCLK
Minimum time for the SDIO pin to switch from an output to an input relative to the SCLK rising
Figure 84. Serial Timing Details
Table 15. Serial Timing Definitions
tDS 5 Setup time between the data and the rising edge of SCLK
tDH 2 Hold time between the data and the rising edge of SCLK
t
40 Period of the clock
CLK
tS 5 Setup time between CSB and SCLK
tH 2 Hold time between CSB and SCLK
tHI 16 Minimum period that SCLK should be in a logic high state
tLO 16 Minimum period that SCLK should be in a logic low state
EN_SDIO
falling edge (not shown in Figure 84)
t
10
DIS_SD IO
edge (not shown in Figure 84)
Rev. F | Page 35 of 60
Page 36
AD9222 Data Sheet
MEMORY MAP
READING THE MEMORY MAP TABLE
Each row in the memory map register table (Table 16) has eight
address locations. The memory map is divided into three sections:
the chip configuration register map (Address 0x00 to Address 0x02),
the device index and transfer register map (Address 0x05 and
Address 0xFF), and the ADC functions register map (Address 0x08
to Address 0x22).
The leftmost column of the memory map indicates the register
address number, and the default value is shown in the second rightmost column. The (MSB) Bit 7 column is the start of the default
hexadecimal value given. For example, Address 0x09, the clock
register, has a default value of 0x01, meaning Bit 7 = 0, Bit 6 = 0,
Bit 5 = 0, Bit 4 = 0, Bit 3 = 0, Bit 2 = 0, Bit 1 = 0, and Bit 0 = 1, or
0000 0001 in binary. This setting is the default for the duty cycle
stabilizer in the on condition. By writing a 0 to Bit 6 of this address,
the duty cycle stabilizer turns off. For more information on this
and other functions, consult the AN-877 Application Note, Interfacing to High Speed ADCs via SPI.
RESERVED LOCATIONS
Undefined memory locations should not be written to except
when writing the default values suggested in this data sheet.
Addresses that have values marked as 0 should be considered
reserved and have a 0 written into their registers during power-up.
DEFAULT VALUES
When the AD9222 comes out of a reset, critical registers are
preloaded with default values. These values are indicated in
Table 16, where an X refers to an undefined feature.
LOGIC LEVELS
An explanation of various registers follows: “Bit is set” is
synonymous with “bit is set to Logic 1” or “writing Logic 1 for
the bit.” Similarly, “clear a bit” is synonymous with “bit is set to
Logic 0” or “writing Logic 0 for the bit.”
Rev. F | Page 36 of 60
Page 37
Data Sheet AD9222
8-bit Chip ID Bits 7:0
Read
Default is unique
Clock
Clock
Data
Data
Data
Data
Bits are set to
Table 16. Memory Map Register
Addr.
(Hex) Parameter Name
Chip Configuration Registers
00 chip_port_config 0
01 chip_id
02 chip_grade X
Device Index and Transfer Registers
04 device_index_2 X X X X
05 device_index_1 X X
FF device_update X X X X X X X
ADC Functions
08 modes X X X X X
09 clock X X X X X X X
0D test_io
(MSB)
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1
Soft
reset
1 = on
0 = off
(default)
Data
Channel
G
1 = on
(default)
0 = off
Channel
C
1 = on
(default)
0 = off
Internal power-down mode
000 = chip run (default)
001 = full power-down
010 = standby
011 = reset
User test mode
00 = off (default)
01 = on, single alternate
10 = on, single once
11 = on, alternate once
LSB first
1 = on
0 = off
(default)
Child ID [6:4]
(identify device variants of Chip ID)
000 = 65 MSPS
011 = 50 MSPS
001 = 40 MSPS
Soft
reset
1 = on
0 = off
(default)
Channel
DCO
1 = on
0 = off
(default)
Reset PN
long gen
1 = on
0 = off
(default)
1 1
(AD9222 = 0x07), (default)
Channel
FCO
1 = on
0 = off
(default)
Reset
PN short
gen
1 = on
0 = off
(default)
Rev. F | Page 37 of 60
X X X X
Data
Channel
H
1 = on
(default)
0 = off
Channel
D
1 = on
(default)
0 = off
Output test mode—see
Digital Outputs and Timing section
0000 = off (default)
0001 = midscale short
0010 = +FS short
0011 = −FS short
0100 = checkerboard output
0101 = PN 23 sequence
0110 = PN 9 sequence
0111 = one-/zero-word toggle
1000 = user input
1001 = 1-/0-bit toggle
1010 = 1× sync
1011 = one bit high
1100 = mixed bit frequency
(format determined by output_mode)
(LSB)
Bit 0
LSB first
1 = on
0 = off
(default)
Data
Channel
F
1 = on
(default)
0 = off
Channel
B
1 = on
(default)
0 = off
0 0x18
Data
Channel
E
1 = on
(default)
0 = off
Channel
A
1 = on
(default)
0 = off
SW
transfer
1 = on
0 = off
(default)
Duty cycle
stabilizer
1 = on
(default)
0 = off
Tab le 9 in the
Default
Value
(Hex)
only
Read
only
0x0F
0x0F
0x00
0x00
0x01
0x00
Default Notes/
Comments
The nibbles
should be
mirrored so that
LSB- or MSB-first
mode is set correctly regardless
of shift mode.
chip ID, different
for each device.
This is a readonly register.
Child ID used to
differentiate
graded devices.
Bits are set to
determine which
on-chip device
receives the next
write command.
determine which
on-chip device
receives the next
write command.
Synchronously
transfers data
from the master
shift register to
the slave.
Determines
various generic
modes of chip
operation.
Turns the
internal duty
cycle stabilizer
on and off.
When this register is set, the
test data is placed
on the output
pins in place of
normal data.
0011 = output clock phase adjust
(0000 through 1010)
0000 = 0° relative to data edge
0001 = 60° relative to data edge
0010 = 120° relative to data edge
0011 = 180° relative to data edge (default)
0101 = 300° relative to data edge
0110 = 360° relative to data edge
1000 = 480° relative to data edge
1001 = 540° relative to data edge
1010 = 600° relative to data edge
1011 to 1111 = 660° relative to data edge
<10
MSPS,
low
encode
rate
mode
1 = on
0 = off
(default)
DCO and
FCO
2× Drive
Strength
1 = on
0 = off
(default)
Channel
powerdown
1 = on
0 = off
(default)
Value
(Hex)
0x00
0x00
0x03
0x00
0x00
Default Notes/
Comments
Configures the
outputs and the
format of the data.
Determines
LVDS or other
output properties.
Primarily functions to set the
LVDS span and
common-mode
levels in place of
an external
resistor.
On devices that
utilize global
clock divide,
determines
which phase of
the divider
output is used to
supply the
output clock.
Internal latching
is unaffected.
User-defined
pattern, 1 LSB.
User-defined
pattern, 1 MSB.
User-defined
pattern, 2 LSB.
pattern, 2 MSB.
Serial stream
control. Default
causes MSB first
and the native
bit stream
(global).
Used to power
down individual
sections of a
converter (local).
Rev. F | Page 38 of 60
Page 39
Data Sheet AD9222
SILKSCREEN PARTITION
PIN 1 INDICATOR
05967-069
Power and Ground Recommendations
When connecting power to the AD9222, it is recommended
that two separate 1.8 V supplies be used: one for analog (AVDD)
and one for digital (DRVDD). If only one supply is available, it
should be routed to the AVDD first and then tapped off and
isolated with a ferrite bead or a filter choke preceded by
decoupling capacitors for the DRVDD. The user can employ
several different decoupling capacitors to cover both high and
low frequencies. These should be located close to the point of
entry at the PC board level and close to the parts, with minimal
trace lengths.
A single PC board ground plane should be sufficient when
using the AD9222. With proper decoupling and smart partitioning of the PC board’s analog, digital, and clock sections,
optimum performance can be easily achieved.
Exposed Paddle Thermal Heat Slug Recommendations
It is required that the exposed paddle on the underside of the
ADC be connected to analog ground (AGND) to achieve the
best electrical and thermal performance of the AD9222. An
exposed continuous copper plane on the PCB should mate to
the AD9222 exposed paddle, Pin 0. The copper plane should
have several vias to achieve the lowest possible resistive thermal
path for heat dissipation to flow through the bottom of the PCB.
These vias should be solder-filled or plugged.
To maximize the coverage and adhesion between the ADC and
PCB, partition the continuous copper plane by overlaying a
silkscreen on the PCB into several uniform sections. This provides
several tie points between the ADC and PCB during the reflow
process, whereas using one continuous plane with no partitions
only guarantees one tie point. See Figure 85 for a PCB layout
example. For detailed information on packaging and the PCB
layout of chip scale packages, see the AN-772 Application Note,
A Design and Manufacturing Guide for the Lead Frame Chip
Scale Package (LFCSP).
Figure 85. Typical PCB Layout
Rev. F | Page 39 of 60
Page 40
AD9222 Data Sheet
ROHDE & SCHWARZ,
SMA,
2V p-p SIGNAL
SYNTHESIZER
ROHDE & SCHWARZ,
SMA,
2V p-p SIGNAL
SYNTHESIZER
BAND-PASS
FILTER
XFMR
INPUT
CLK
CH A TO CH H
12-BIT
SERIAL
LVDS
USB
CONNECTION
AD9222
EVALUATION BOARD
INTERPOSER
BOARD
HSC-ADC-EVALCZ
FIFO DATA
CAPTURE
BOARD
PC
RUNNING
ADC
ANALYZER
AND SPI
USER
SOFTWARE
1.8V
–+–+
AVDD_DUT
AVDD_3.3V
DRVDD_DUT
GND
GND
–+
5.0V
GND
AVDD_5V
1.8V
6V DC
2A MAX
WALL OUTLET
100V TO 240V AC
47Hz TO 63Hz
SWITCHING
POWER
SUPPLY
–+
GND
3.3V
–+
VCC
GND
3.3V
SPISPISPISPI
05967-070
EVALUATION BOARD
The AD9222 evaluation board provides all of the support circuitry required to operate the ADC in its various modes and
configurations. The converter can be driven differentially using a
transformer (default) or an AD8334 driver. The ADC can also be
driven in a single-ended fashion. Separate power pins are provided
to isolate the DUT from the drive circuitry of the AD8334. Each
input configuration can be selected by changing the connection
of various jumpers (see Figure 90 to Figure 94). Figure 86 shows
the typical bench characterization setup used to evaluate the ac
performance of the AD9222. It is critical that the signal sources
used for the analog input and clock have very low phase noise
(<1 ps rms jitter) to realize the optimum performance of the
converter. Proper filtering of the analog input signal to remove
harmonics and lower the integrated or broadband noise at the
input is also necessary to achieve the specified noise performance.
See Figure 90 to Figure 100 for the complete schematics and
layout diagrams demonstrating the routing and grounding
techniques that should be applied at the system level.
POWER SUPPLIES
This evaluation board has a wall-mountable switching power
supply that provides a 6 V, 2 A maximum output. Connect the
supply to the rated 100 V ac to 240 V ac wall outlet at 47 Hz to
63 Hz. The other end of the supply is a 2.1 mm inner diameter
jack that connects to the PCB at P701. Once on the PC board,
the 6 V supply is fused and conditioned before connecting to
three low dropout linear regulators that supply the proper bias
to each of the various sections on the board.
When operating the evaluation board in a nondefault condition,
L701 to L704 can be removed to disconnect the switching power
supply. This enables the user to bias each section of the board
individually. Use P702 to connect a different supply for each
section. At least one 1.8 V supply is needed f o r AVDD _ DUT a nd
DRVDD_DUT; however, it is recommended that separate supplies
be used for both analog and digital signals and that each supply
have a current capability of 1 A. To operate the evaluation board
using the VGA option, a separate 5.0 V analog supply (AVDD_5 V)
is needed. To operate the evaluation board using the SPI and alternate clock options, a separate 3.3 V analog supply (AVDD_3.3 V) is
needed in addition to the other supplies.
INPUT SIGNALS
When connecting the clock and analog sources to the evaluation board, use clean signal generators with low phase noise,
such as Rohde & Schwarz SMA or HP8644 signal generators or the
equivalent, as well as a 1 m, shielded, RG-58, 50 Ω coaxial cable.
Enter the desired frequency and amplitude from the ADC specifications tables. Typically, most Analog Devices, Inc., evaluation
boards can accept approximately 2.8 V p-p or 13 dBm sine wave
input for the clock. When connecting the analog input source, it
is recommended to use a multipole, narrow-band, band-pass
filter with 50 Ω terminations. Good choices of such band-pass
filters are available from TTE, Allen Avionics, and K&L
Microwave, Inc. The filter should be connected directly to the
evaluation board if possible.
OUTPUT SIGNALS
The default setup uses the Analog Devices HSC-ADC-FIFO5INTZ to interface with the Analog Devices standard dual-channel
FIFO data capture board (HCS-ADC-EVALCZ). Two of the eight
channels can be evaluated at the same time. For more
information on the channel settings and optional settings of these
boards, www.analog.com/FIFO.
Figure 86. Evaluation Board Connection
Rev. F | Page 40 of 60
Page 41
Data Sheet AD9222
0
AMPLITUDE (dBFS)
FREQUENCY (MHz)
0
–18
–16
–14
–12
–10
–8
–6
–4
–2
50 100 150 200 250 300 350 400 450 500
–3dB CUTOFF = 150MHz
05967-071
DEFAULT OPERATION AND JUMPER SELECTION
SETTINGS
The following is a list of the default and optional settings or
modes allowed on the AD9222 Rev. A evaluation board.
•POWER: Connect the switching power supply that is
provided with the evaluation kit between a rated 100 V ac
to 240 V ac wall outlet at 47 Hz to 63 Hz and P701.
•AIN: The evaluation board is set up for a transformer-
coupled analog input with an optimum 50 Ω impedance
match of 150 MHz of bandwidth (see Figure 87). For more
bandwidth response, the differential capacitor across the
analog inputs can be changed or removed. The common
mode of the analog inputs is developed from the center
tap of the transformer or AVDD_DUT/2.
•VREF: VREF is set to 1.0 V by tying the SENSE pin to ground,
R317. This causes the ADC to operate in 2.0 V p-p full-scale
range. A separate external reference option using the ADR510
or ADR520 is also included on the evaluation board. Populate
R312 and R313 and remove C307. Proper use of the VREF
options is noted in the Voltage Reference section.
•RBIAS: RBIAS has a default setting of 10 kΩ (R301) to
ground and is used to set the ADC core bias current.
•CLOCK: The default clock input circuitry is derived from a
simple transformer-coupled circuit using a high bandwidth
1:1 impedance ratio transformer (T401) that adds a very
low amount of jitter to the clock path. The clock input is
50 Ω terminated and ac-coupled to handle single-ended
sine wave types of inputs. The transformer converts the
single-ended input to a differential signal that is clipped
before entering the ADC clock inputs.
Rev. F | Page 41 of 60
A differential LVPECL clock can also be used to clock the
ADC input using the AD9515 (U401). Populate R406 and
R407 with 0 Ω resistors and remove R215 and R216 to
disconnect the default clock path inputs. In addition, populate
C205 and C206 with a 0.1 μF capacitor and remove C409 and
C410 to disconnect the default clock path outputs. The
AD9515 has many pin-strappable options that are set to a
default mode of operation. Consult the AD9515 data sheet
for more information about these and other options.
In addition, an on-board oscillator is available on the OSC401
and can act as the primary clock source. The setup is quick
and involves installing R403 with a 0 Ω resistor and setting
the enable jumper (J401) to the on position. If the user wishes
to employ a different oscillator, two oscillator footprint options
are available (OSC401) to check the ADC performance.
•PDWN: To enable the power-down feature, short J301 to
the on position (AVDD) on the PDWN pin.
•SCLK/DTP: To enable the digital test pattern on the digital
outputs of the ADC, use J304. If J304 is tied to AVDD during
device power-up, Test Pattern 1000 0000 0000 is enabled. See
the SCLK/DTP Pin section for details.
•SDIO/ODM: To enable the low power, reduced signal option
(similar to the IEEE 1595.3 reduced range link LVDS output
standard), use J303. If J303 is tied to AVDD during device
power-up, it enables the LVDS outputs in a low power,
reduced signal option from the default ANSI-644 standard.
This option changes the signal swing from 350 mV p-p to
200 mV p-p, reducing the power of the DRVDD supply. See
the SDIO/ODM Pin section for more details.
•CSB: To enable processing of the SPI information on the
SDIO and SCLK pins, tie J302 low in the always enable mode.
To ignore the SDIO and SCLK information, tie J302 to AVDD.
•Non-SPI Mode: For users who wish to operate the DUT
without using SPI, remove Jumpers J302, J303, and J304.
This disconnects the CSB, SCLK/DTP, and SDIO/ODM pins
from the control bus, allowing the DUT to operate in its
simplest mode. Each of these pins has internal termination
and will float to its respective level.
•D + x, D − x: If an alternative data capture method to the setup
shown in Figure 90 is used, optional receiver terminations,
R318 and R320 to R328, can be installed next to the high
speed backplane connector.
Page 42
AD9222 Data Sheet
68pF
680nH
680nH
05967-107
0
–120
–100
–80
–60
–40
–20
05.0 7.52.510.015.0 17.512.520.0 22.5 25.0
AMPLITUDE (dBFS)
FREQUENCY (MHz)
05967-108
f
SAMPLE
= 50MSPS
AIN = 3.5MHz
AD8334 = MAX GAIN SE TTING
ALTERNATIVE ANALOG INPUT DRIVE
CONFIGURATION
The following is a brief description of the alternative analog
input drive configuration using the AD8334 dual VGA. If this
drive option is in use, some components may need to be
populated, in which case all the necessary components are listed
in Table 17. For more details on the AD8334 dual VGA,
including how it works and its optional pin settings, consult the
AD8334 data sheet.
To configure the analog input to drive the VGA instead of the
default transformer option, the following components need to
be removed and/or changed.
R215, R216, R229, R230, R247, R248, R263, R264, C103,
C105, C110, C112, C117, C119, C124, C126, C203, C205,
C210, C212, C217, C219, C224, and C226 with 10 kΩ
resistors to provide an input common-mode level to the
ADC analog inputs.
R205, R213, R221, R222, R237, R238, R255, and R256 with
0 Ω resistors in the ADC analog input path to connect the
VGA outputs.
•Remove R515, R520, R527, R532, R615, R620, R627, and
R632 on the AD8334 analog outputs.
•Remove R512, R524, R612, and R624 to set the AD8334
mode and AD8334 HILO pin low. Some applications may
require this to be different. Consult the AD8334 data sheet
for more information on these functions.
In this configuration, L505 to L520 and L605 to L620 are
populated with 0 Ω resistors to allow signal connection and use
of a filter if additional requirements are necessary.
In this example, a 16 MHz, two-pole low-pass filter was applied
to the AD8334 outputs. The following components need to be
removed and/or changed:
58 1 U706 IC SOT-223 ADP3339AKC-5-RL7 Analog Devices ADP3339AKCZ-5-RL
59 1 U705 IC SOT-223 ADP3339AKC-3.3-RL Analog Devices ADP3339AKCZ-3.3-RL
60 1 U301 IC CP-64-3 AD9222BCPZ-65, octal,
61 1 U302 IC SOT-23 ADR510ARTZ, 1.0 V,
62 1 U401 IC LFCSP
63 1 U702 IC SC70,
64 1 U703 IC SC70,
65 1 U701 IC 8-SOIC Flash prog
1
This BOM is RoHS compliant.
Reference
Designator Device Pkg. Value Mfg. Mfg. Part Number
T104, T201, T202,
T203, T204, T401
Transformer CD542 ADT1-1WT+,
1:1 impedance ratio
transformer
Mini-Circuits ADT1-1WT+
Analog Devices ADP3339AKCZ-1.8-RL
1.5 A, 1.8 V LDO
regulator
Analog Devices AD8334ACPZ-REEL
ultralow noise
precision dual VGA
Analog Devices AD9222BCPZ-65
12-bit, 50 MSPS serial
LVDS 1.8 V ADC
Analog Devices ADR510ARTZ
precision low noise
shunt voltage
reference
CP-32-2
MAA06A
MAA06A
AD9515BCPZ, 1.6 GHz
clock distribution IC
NC7WZ07P6X_NL,
UHS dual buffer
NC7WZ16P6X_NL,
UHS dual buffer
Analog Devices AD9515BCPZ
Fairchild NC7WZ07P6X_NL
Fairchild NC7WZ16P6X_NL
Microchip PIC12F629-I/SNG
mem 1kx14,
RAM size 64 × 8,
20 MHz speed, PIC12F
controller series
Rev. F | Page 58 of 60
Page 59
Data Sheet AD9222
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
0.22 MIN
TOPVIEW
8.75
BSC SQ
9.00
BSC SQ
1
64
16
17
49
48
32
33
0.50
0.40
0.30
0.50
BSC
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
7.50
REF
0.05 MAX
0.02 NOM
0.60 MAX
0.60
MAX
SEATING
PLANE
PIN 1
INDICATOR
7.55
7.50 SQ
7.45
PIN 1
INDICATOR
0.30
0.23
0.18
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
02-23-2010-B
EXPOSEDPAD
(BOTTOM VIEW)
AD9222-65EBZ
Evaluation Board
OUTLINE DIMENSIONS
Figure 101. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm × 9 mm Body, Very Thin Quad
(CP-64-6)
Dimensions shown in millimeters
ORDERING GUIDE
1, 2
Model
AD9222ABCPZ-40 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-64-6
AD9222ABCPZRL7-40 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 7" Tape and Reel CP-64-6
AD9222ABCPZ-50 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-64-6
AD9222ABCPZRL7-50 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 7" Tape and Reel CP-64-6
AD9222ABCPZ-65 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-64-6
AD9222ABCPZRL7-65 −40°C to +85°C 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 7" Tape and Reel CP-64-6
1
Z = RoHS Compliant Part.
2
The interposer board (HSC-ADC-FIFO5-INTZ) is required to connect to the HSC-ADC-EVALCZ data capture board.
Temperature Range Package Description Package Option