Datasheet AD9200SSOP, AD9200LQFP, AD9200KSTRL, AD9200KST, AD9200JSTRL Datasheet (Analog Devices)

...
Page 1
Complete 10-Bit, 20 MSPS, 80 mW
a
FEATURES CMOS 10-Bit, 20 MSPS Sampling A/D Converter Pin-Compatible with AD876 Power Dissipation: 80 mW (3 V Supply) Operation Between 2.7 V and 5.5 V Supply Differential Nonlinearity: 0.5 LSB Power-Down (Sleep) Mode Three-State Outputs Out-of-Range Indicator Built-In Clamp Function (DC Restore) Adjustable On-Chip Voltage Reference IF Undersampling to 135 MHz

PRODUCT DESCRIPTION

The AD9200 is a monolithic, single supply, 10-bit, 20 MSPS analog-to-digital converter with an on-chip sample-and-hold amplifier and voltage reference. The AD9200 uses a multistage differential pipeline architecture at 20 MSPS data rates and guarantees no missing codes over the full operating temperature range.
The input of the AD9200 has been designed to ease the devel­opment of both imaging and communications systems. The user can select a variety of input ranges and offsets and can drive the input either single-ended or differentially.
The sample-and-hold (SHA) amplifier is equally suited for both multiplexed systems that switch full-scale voltage levels in suc­cessive channels and sampling single-channel inputs at frequen­cies up to and beyond the Nyquist rate. AC coupled input signals can be shifted to a predetermined level, with an onboard clamp circuit (AD9200ARS, AD9200KST). The dynamic per­formance is excellent.
The AD9200 has an onboard programmable reference. An external reference can also be chosen to suit the dc accuracy and temperature drift requirements of the application.

FUNCTIONAL BLOCK DIAGRAM

CMOS A/D Converter
AD9200
A single clock input is used to control all internal conversion cycles. The digital output data is presented in straight binary output format. An out-of-range signal (OTR) indicates an over­flow condition which can be used with the most significant bit to determine low or high overflow.
The AD9200 can operate with supply range from 2.7 V to
5.5 V, ideally suiting it for low power operation in high speed portable applications.
The AD9200 is specified over the industrial (–40°C to +85°C) and commercial (0°C to +70°C) temperature ranges.
PRODUCT HIGHLIGHTS Low Power
The AD9200 consumes 80 mW on a 3 V supply (excluding the reference power). In sleep mode, power is reduced to below 5 mW.
Very Small Package
The AD9200 is available in both a 28-lead SSOP and 48-lead LQFP packages.
Pin Compatible with AD876
The AD9200 is pin compatible with the AD876, allowing older designs to migrate to lower supply voltages.
300 MHz On-Board Sample-and-Hold
The versatile SHA input can be configured for either single­ended or differential inputs.
Out-of-Range Indicator
The OTR output bit indicates when the input signal is beyond the AD9200’s input range.
Built-In Clamp Function
Allows dc restoration of video signals with AD9200ARS and AD9200KST.
CLAMP
CLAMP
AIN REFTS REFBS
REFTF
REFBF
VREF
REFSENSE
IN
SHA SHAGAIN SHA GAINGAIN
SHA
AVSS
1V
A/D
D/A
A/D
AD9200
REV. E
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
DRVDDAVDDCLK
STBY
SHA GAIN
A/D
D/A A/D
CORRECTION LOGIC
OUTPUT BUFFERS
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 1999
D/A
DRVSS
A/D
D/A
MODE
THREE-
STATE
OTR D9
(MSB) D0
(LSB)
Page 2
(AVDD = +3 V, DRVDD = +3 V, FS = 20 MHz (50% Duty Cycle), MODE = AVDD, 2 V Input
AD9200–SPECIFICATIONS
Span from 0.5 V to 2.5 V, External Reference, T
Parameter Symbol Min Typ Max Units Condition
RESOLUTION 10 Bits
CONVERSION RATE F
S
20 MHz
DC ACCURACY
Differential Nonlinearity DNL ±0.5 ±1 LSB REFTS = 2.5 V, REFBS = 0.5 V Integral Nonlinearity INL ±0.75 ±2 LSB
Offset Error E Gain Error E
ZS
FS
0.4 1.2 % FSR
1.4 3.5 % FSR
REFERENCE VOLTAGES
Top Reference Voltage REFTS 1 AVDD V Bottom Reference Voltage REFBS GND AVDD – 1 V Differential Reference Voltage 2 V p-p Reference Input Resistance
1
10 k REFTS, REFBS: MODE = AVDD
4.2 k Between REFTF and REFBF: MODE = AVSS
ANALOG INPUT
Input Voltage Range AIN REFBS REFTS V REFBS Min = GND: REFTS Max = AVDD Input Capacitance C Aperture Delay t Aperture Uncertainty (Jitter) t
IN
AP
AJ
1 pF Switched 4ns 2ps
Input Bandwidth (–3 dB) BW
Full Power (0 dB) 300 MHz
DC Leakage Current 23 µA Input = ±FS
INTERNAL REFERENCE
Output Voltage (1 V Mode) VREF 1 V REFSENSE = VREF
Output Voltage Tolerance (1 V Mode) ±10 ±25 mV
Output Voltage (2 V Mode) VREF 2 V REFSENSE = GND Load Regulation (1 V Mode) 0.5 2 mV 1 mA Load Current
POWER SUPPLY
Operating Voltage AVDD 2.7 3 5.5 V
DRVDD 2.7 3 5.5 V Supply Current IAVDD 26.6 33.3 mA AVDD = 3 V, MODE = AVSS Power Consumption P
D
80 100 mW AVDD = DRVDD = 3 V, MODE = AVSS
Power-Down 4 mW STBY = AVDD, MODE and CLOCK =
AVSS
Gain Error Power Supply Rejection PSRR 1 % FS
DYNAMIC PERFORMANCE (AIN = 0.5 dBFS)
Signal-to-Noise and Distortion SINAD
f = 3.58 MHz 54.5 57 dB f = 10 MHz 54 dB
Effective Bits
f = 3.58 MHz 9.1 Bits f = 10 MHz 8.6 Bits
Signal-to-Noise SNR
f = 3.58 MHz 55 57 dB f = 10 MHz 56 dB
Total Harmonic Distortion THD
f = 3.58 MHz –59 –66 dB f = 10 MHz –58 dB
Spurious Free Dynamic Range SFDR
f = 3.58 MHz –61 –69 dB f = 10 MHz –61 dB
Two-Tone Intermodulation
Distortion IMD 68 dB f = 44.49 MHz and 45.52 MHz Differential Phase DP 0.1 Degree NTSC 40 IRE Mod Ramp Differential Gain DG 0.05 %
MIN
to T
unless otherwise noted)
MAX
–2–
REV. E
Page 3
Parameter Symbol Min Typ Max Units Condition
DIGITAL INPUTS
High Input Voltage V Low Input Voltage V
IH
IL
2.4 V
0.3 V
DIGITAL OUTPUTS
High-Z Leakage I Data Valid Delay t Data Enable Delay t Data High-Z Delay t
OZ
OD
DEN
DHZ
–10 +10 µA Output = GND to VDD
25 ns CL = 20 pF 25 ns 13 ns
LOGIC OUTPUT (with DRVDD = 3 V)
High Level Output Voltage (I High Level Output Voltage (I Low Level Output Voltage (I Low Level Output Voltage (I
= 50 µA) V
OH
= 0.5 mA) V
OH
= 1.6 mA) V
OL
= 50 µA) V
OL
OH
OH
OL
OL
+2.95 V +2.80 V
+0.4 V +0.05 V
LOGIC OUTPUT (with DRVDD = 5 V)
High Level Output Voltage (I High Level Output Voltage (I Low Level Output Voltage (I Low Level Output Voltage (I
= 50 µA) V
OH
= 0.5 mA) V
OH
= 1.6 mA) V
OL
= 50 µA) V
OL
OH
OH
OL
OL
+4.5 V +2.4 V
+0.4 V +0.1 V
CLOCKING
Clock Pulsewidth High t Clock Pulsewidth Low t
CH
CL
22.5 ns
22.5 ns
Pipeline Latency 3 Cycles
CLAMP
NOTES
1
2
Specifications subject to change without notice.
2
Clamp Error Voltage E Clamp Pulsewidth t
See Figures 1a and 1b. Available only in AD9200ARS and AD9200KST.
OC
CPW
±20 ±40 mV CLAMPIN = 0.5 V–2.7 V, RIN = 10 2 µsC
= 1 µF (Period = 63.5 µs)
IN
AD9200
REV. E
AV
DD
REFTS
REFBS
MODE
10kV
10kV
AD9200
0.4 3 V
DD
REFTS
REFTF
REFBF
REFBS MODE
Figure 1a. Figure 1b.
–3–
AD9200
4.2kV
Page 4
AD9200
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS*
With Respect
Parameter to Min Max Units
AVDD AVSS –0.3 +6.5 V DRVDD DRVSS –0.3 +6.5 V AVSS DRVSS –0.3 +0.3 V AVDD DRVDD –6.5 +6.5 V MODE AVSS –0.3 AVDD + 0.3 V CLK AVSS –0.3 AVDD + 0.3 V Digital Outputs DRVSS –0.3 DRVDD + 0.3 V AIN AVSS –0.3 AVDD + 0.3 V VREF AVSS –0.3 AVDD + 0.3 V REFSENSE AVSS –0.3 AVDD + 0.3 V REFTF, REFTB AVSS –0.3 AVDD + 0.3 V REFTS, REFBS AVSS –0.3 AVDD + 0.3 V
Junction Temperature +150 °C Storage Temperature –65 +150 °C
Lead Temperature
10 sec +300 °C
AVDD
DRVDD
AVDD
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum ratings for extended periods may effect device reliability.

ORDERING GUIDE

Temperature Package Package
Model Range Description Options*
AD9200JRS 0°C to +70°C 28-Lead SSOP RS-28 AD9200ARS –40°C to +85°C 28-Lead SSOP RS-28 AD9200JST 0°C to +70°C 48-Lead LQFP ST-48 AD9200KST 0°C to +70°C 48-Lead LQFP ST-48 AD9200JRSRL 0°C to +70°C 28-Lead SSOP (Reel) RS-28 AD9200ARSRL –40°C to +85°C 28-Lead SSOP (Reel) RS-28 AD9200JSTRL 0°C to +70°C 48-Lead LQFP (Reel) ST-48 AD9200KSTRL 0°C to +70°C 48-Lead LQFP (Reel) ST-48
AD9200 SSOP-EVAL Evaluation Board AD9200 LQFP-EVAL Evaluation Board
*RS = Shrink Small Outline; ST = Thin Quad Flatpack.
AVDD
AVDD
AVDD
DRVSS
DRVSS
AVSS
a. D0–D9, OTR
AVDD
AVSS
b. Three-State, Standby, Clamp
d. AIN
AVDD
AVSS
f. CLAMPIN g. MODE
AVDD
AVSS
AVSS
REFBS
REFBF
AVDD
AVDD
AVSS
AVSS
AVSS
e. Reference
AVDD
AVSS
h. REFSENSE
Figure 2. Equivalent Circuits
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD9200 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
–4–
REFTF
REFTS
AVSS
AVDD
AVDD
AVSS
c. CLK
AVSS
AVSS
AVDD
AVSS
i. VREF
REV. E
Page 5
PIN CONFIGURATIONS
28-Lead Shrink Small Outline (SSOP)
AD9200
48-Lead Plastic Thin Quad Flatpack (LQFP)
AVSS
DRVDD
OTR
DRVSS
D0 D1 D2 D3 D4 D5 D6 D7 D8 D9
1 2 3 4 5
AD9200
6
TOP VIEW
(Not to Scale)
7 8
9 10 11 12 13 14
AVDD
28
AIN
27
VREF
26
REFBS
25
REFBF
24 23
MODE REFTF
22
REFTS
21
20
CLAMPIN
19
CLAMP
18
REFSENSE
17
STBY
16
THREE-STATE
15
CLK
D0 D1 D2 D3
D4 NC NC
D5
D6
D7
D8
D9
NC = NO CONNECT
NC
NC
DRVDD
NC
48 47 46 45 44 39 38 3743 42 41 40
1
PIN 1
2
IDENTIFIER 3 4 5 6 7 8 9
10 11 12
13 14 15 16 17 18 19 20 21 22 23 24
NC
NC
TOP VIEW
(Not to Scale)
NC
OTR
NC
AVSS
AD9200
NC
DRVSS
AVDD
NC
NC
NC
NC
NC
AIN
CLK
VREF
NC
36 35 34 33 32 31 30 29 28 27 26 25
STBY
THREE-STATE
PIN FUNCTION DESCRIPTIONS
SSOP LQFP Pin No. Pin No. Name Description
1 44 AVSS Analog Ground 2 45 DRVDD Digital Driver Supply 3 1 D0 Bit 0, Least Significant Bit 4 2 D1 Bit 1 5 3 D2 Bit 2 6 4 D3 Bit 3 7 5 D4 Bit 4 8 8 D5 Bit 5
9 9 D6 Bit 6 10 10 D7 Bit 7 11 11 D8 Bit 8 12 12 D9 Bit 9, Most Significant Bit 13 16 OTR Out-of-Range Indicator 14 17 DRVSS Digital Ground 15 22 CLK Clock Input 16 23 THREE-STATE HI: High Impedance State. LO: Normal Operation 17 24 STBY HI: Power-Down Mode. LO: Normal Operation 18 26 REFSENSE Reference Select 19 27 CLAMP HI: Enable Clamp Mode. LO: No Clamp 20 28 CLAMPIN Clamp Reference Input 21 29 REFTS Top Reference 22 30 REFTF Top Reference Decoupling 23 32 MODE Mode Select 24 34 REFBF Bottom Reference Decoupling 25 35 REFBS Bottom Reference 26 38 VREF Internal Reference Output 27 39 AIN Analog Input 28 42 AVDD Analog Supply
NC REFBS REFBF NC MODE NC REFTF REFTS CLAMPIN CLAMP REFSENSE NC
REV. E
–5–
Page 6
AD9200
DEFINITIONS OF SPECIFICATIONS Integral Nonlinearity (INL)
Integral nonlinearity refers to the deviation of each individual code from a line drawn from “zero” through “full scale”. The point used as “zero” occurs 1/2 LSB before the first code transi­tion. “Full scale” is defined as a level 1 1/2 LSB beyond the last code transition. The deviation is measured from the center of each particular code to the true straight line.
Differential Nonlinearity (DNL, No Missing Codes)
An ideal ADC exhibits code transitions that are exactly 1 LSB apart. DNL is the deviation from this ideal value. It is often specified in terms of the resolution for which no missing codes (NMC) are guaranteed.
(AVDD = +3 V, DRVDD = +3 V, FS = 20 MHz (50% Duty Cycle), MODE = AVDD, 2 V Input
Typical Characterization Curves
1.0
0.5
0
DNL
Span from 0.5 V to 2.5 V, External Reference, unless otherwise noted)
Offset Error
The first transition should occur at a level 1 LSB above “zero.” Offset is defined as the deviation of the actual first code transi­tion from that point.
Gain Error
The first code transition should occur for an analog value 1 LSB above nominal negative full scale. The last transition should occur for an analog value 1 LSB below the nominal positive full scale. Gain error is the deviation of the actual difference be­tween first and last code transitions and the ideal difference between the first and last code transitions.
Pipeline Delay (Latency)
The number of clock cycles between conversion initiation and the associated output data being made available. New output data is provided every rising edge.
60
55
50
45
40
SNR– dB
35
–0.5 AMPLITUDE
–6.0 AMPLITUDE
–20.0 AMPLITUDE
–0.5
–1.0
1.0
0.5
INL
–0.5
–1.0
0 1024128
0
0 1024128
256 384 512 640 768 896
CODE OFFSET
Figure 3. Typical DNL
256 384 512 640 768 896
CODE OFFSET
Figure 4. Typical INL
30
25
20
1.00E+05 1.00E+081.00E+06 1.00E+07 INPUT FREQUENCY – Hz
Figure 5. SNR vs. Input Frequency
60
55
50
45
40
SINAD – dB
35
30
25
20
1.00E+05 1.00E+081.00E+06
–0.5 AMPLITUDE
–6.0 AMPLITUDE
–20.0 AMPLITUDE
INPUT FREQUENCY – Hz
1.00E+07
Figure 6. SINAD vs. Input Frequency
–6–
REV. E
Page 7
AD9200
–30
–35
–40
–45 –50
–55
THD – dB
–60
–65
–70
–75 –80
1.00E+05 1.00E+081.00E+06 1.00E+07
–20.0 AMPLITUDE
–6.0 AMPLITUDE
–0.5 AMPLITUDE
INPUT FREQUENCY – Hz
Figure 7. THD vs. Input Frequency
–70
F
–60
–50
–40
–30
THD – dB
–20
–10
0
100E+03 100E+061E+06
CLOCK FREQUENCY – Hz
IN
= 1MHz
10E+06
CLOCK = 20MHz
80.5
80.5
80.0
80.0
79.5
79.5
79.0
79.0
78.5
78.5
78.0
78.0
POWER CONSUMPTION – mW
POWER CONSUMPTION – mW
77.5
77.5
77.0
77.0 0202
0202
4
6 8 10 12 14 16 18
4
6 8 10 12 14 16 18
CLOCK FREQUENCY – MHz
CLOCK FREQUENCY – MHz
Figure 10. Power Consumption vs. Clock Frequency (MODE = AVSS)
1M 900k 800k 700k 600k 500k
HITS
400k 300k 200k 100k
54383
0
N–1 N
499856
CODE
54160
N+1
Figure 8. THD vs. Clock Frequency
1.005
1.004
1.003
1.002
– V
REF
V
1.001
1.000
0.999
0.998 –40 100–20
0
20 40 60 80
TEMPERATURE – °C
Figure 9. Voltage Reference Error vs. Temperature
Figure 11. Grounded Input Histogram
20
0
–20
–40
–60
–80
–100
–120
–140
0E+0 10E+61E+6 2E+6 3E+6 4E+6 5E+6 6E+6 7E+6 8E+6 9E+6
SINGLE TONE FREQUENCY DOMAIN
CLOCK = 20MHz
Figure 12. Single-Tone Frequency Domain
REV. E
–7–
Page 8
AD9200
0
–3
–6
–9
–12
–15
–18
SIGNAL AMPLITUDE – dB
–21
–24
–27
1.0E+6 1.0E+910.0E+6 FREQUENCY – Hz
100.0E+6
Figure 13. Full Power Bandwidth
25 20 15 10
5 0
mA
B
I
–5 –10 –15 –20 –25
0 3.01.0 2.0
INPUT VOLTAGE – V
REFBS = 0.5V REFTS = 2.5V CLOCK = 20MHz
2.50.5 1.5
Figure 14. Input Bias Current vs. Input Voltage

APPLYING THE AD9200

THEORY OF OPERATION
The AD9200 implements a pipelined multistage architecture to achieve high sample rate with low power. The AD9200 distrib­utes the conversion over several smaller A/D subblocks, refining the conversion with progressively higher accuracy as it passes the results from stage to stage. As a consequence of the distrib­uted conversion, the AD9200 requires a small fraction of the 1023 comparators used in a traditional flash type A/D. A sample-and-hold function within each of the stages permits the first stage to operate on a new input sample while the second, third and fourth stages operate on the three preceding samples.

OPERATIONAL MODES

The AD9200 is designed to allow optimal performance in a wide variety of imaging, communications and instrumentation applications, including pin compatibility with the AD876 A/D. To realize this flexibility, internal switches on the AD9200 are used to reconfigure the circuit into different modes. These modes are selected by appropriate pin strapping. There are three parts of the circuit affected by this modality: the voltage reference, the reference buffer, and the analog input. The nature of the appli­cation will determine which mode is appropriate: the descrip­tions in the following sections, as well as the Table I should assist in picking the desired mode.
Table I. Mode Selection
Input Input MODE REFSENSE
Modes Connect Span Pin Pin REF REFTS REFBS Figure
TOP/BOTTOM AIN 1 V AVDD Short REFSENSE, REFTS and VREF Together AGND 18
AIN 2 V AVDD AGND Short REFTS and VREF Together AGND 19
CENTER SPAN AIN 1 V AVDD/2 Short VREF and REFSENSE Together AVDD/2 AVDD/2 20
AIN 2 V AVDD/2 AGND No Connect AVDD/2 AVDD/2
Differential AIN Is Input 1 1 V AVDD/2 Short VREF and REFSENSE Together AVDD/2 AVDD/2 29
REFTS and REFBS Are Shorted Together for Input 2 2 V AVDD/2 AGND No Connect AVDD/2 AVDD/2
External Ref AIN 2 V max AVDD AVDD No Connect Span = REFTS 21, 22
– REFBS (2 V max)
AGND Short to Short to 23
VREFTF VREFBF
AD876 AIN 2 V Float or AVDD No Connect Short to Short to 30
AVSS VREFTF VREFBF
–8–
REV. E
Page 9

SUMMARY OF MODES

VOLTAGE REFERENCE

1 V Mode the internal reference may be set to 1 V by connect­ing REFSENSE and VREF together.
2 V Mode the internal reference my be set to 2 V by connecting REFSENSE to analog ground
External Divider Mode the internal reference may be set to a point between 1 V and 2 V by adding external resistors. See Figure 16f.
External Reference Mode enables the user to apply an exter­nal reference to REFTS, REFBS and VREF pins. This mode is attained by tying REFSENSE to VDD.

REFERENCE BUFFER

Center Span Mode midscale is set by shorting REFTS and REFBS together and applying the midscale voltage to that point The MODE pin is set to AVDD/2. The analog input will swing about that midscale point.
Top/Bottom Mode sets the input range between two points. The two points are between 1 V and 2 V apart. The Top/Bottom Mode is enabled by tying the MODE pin to AVDD.

ANALOG INPUT

Differential Mode is attained by driving the AIN pin as one differential input and shorting REFTS and REFBS together and driving them as the second differential input. The MODE pin is tied to AVDD/2. Preferred mode for optimal distortion performance.
Single-Ended is attained by driving the AIN pin while the REFTS and REFBS pins are held at dc points. The MODE pin is tied to AVDD.
Single-Ended/Clamped (AC Coupled) the input may be clamped to some dc level by ac coupling the input. This is done by tying the CLAMPIN to some dc point and applying a pulse to the CLAMP pin. MODE pin is tied to AVDD.

SPECIAL

AD876 Mode enables users of the AD876 to drop the AD9200 into their socket. This mode is attained by floating or grounding the MODE pin.

INPUT AND REFERENCE OVERVIEW

Figure 16, a simplified model of the AD9200, highlights the relationship between the analog input, AIN, and the reference voltages, REFTS, REFBS and VREF. Like the voltages applied to the resistor ladder in a flash A/D converter, REFTS and REFBS define the maximum and minimum input voltages to the A/D.
The input stage is normally configured for single-ended opera­tion, but allows for differential operation by shorting REFTS and REFBS together to be used as the second input.
AD9200
AIN
REFTS
REFBS
Figure 15. AD9200 Equivalent Functional Input Circuit
SHA
In single-ended operation, the input spans the range,
REFBS AIN REFTS
where REFBS can be connected to GND and REFTS con­nected to VREF. If the user requires a different reference range, REFBS and REFTS can be driven to any voltage within the power supply rails, so long as the difference between the two is between 1 V and 2 V.
In differential operation, REFTS and REFBS are shorted to­gether, and the input span is set by VREF,
(REFTS – VREF/2) AIN (REFTS + VREF/2)
where VREF is determined by the internal reference or brought in externally by the user.
The best noise performance may be obtained by operating the AD9200 with a 2 V input range. The best distortion perfor­mance may be obtained by operating the AD9200 with a 1 V input range.

REFERENCE OPERATION

The AD9200 can be configured in a variety of reference topolo­gies. The simplest configuration is to use the AD9200’s onboard bandgap reference, which provides a pin-strappable option to generate either a 1 V or 2 V output. If the user desires a refer­ence voltage other than those two, an external resistor divider can be connected between VREF, REFSENSE and analog ground to generate a potential anywhere between 1 V and 2 V. Another alternative is to use an external reference for designs requiring enhanced accuracy and/or drift performance. A third alternative is to bring in top and bottom references, bypassing VREF altogether.
Figures 16d, 16e and 16f illustrate the reference and input ar­chitecture of the AD9200. In tailoring a desired arrangement, the user can select an input configuration to match drive circuit. Then, moving to the reference modes at the bottom of the figure, select a reference circuit to accommodate the offset and amplitude of a full-scale signal.
Table I outlines pin configurations to match user requirements.
AD9200
A/D
CORE
REV. E
–9–
Page 10
AD9200
+FS
–FS
+F/S RANGE OBTAINED
FROM VREF PIN OR
EXTERNAL REF
–F/S RANGE OBTAINED
FROM VREF PIN OR
EXTERNAL REF
AIN
REFTS
REFBS
AD9200
SHA
10kV
10kV
A2
A/D
10kV
10kV
CORE
a. Top/Bottom Mode
MAXIMUM MAGNITUDE OF V
IS DETERMINED BY INTERNAL
REFERENCE AND TURNS RATIO
V
4.2kV TOTAL
AVDD/2
REFTS
REFBS
AIN
MODE (AVDD)
REFTF
0.1mF
REFBF
0.1mF
10mF
0.1mF
10kV
10kV
10kV
A2
MIDSCALE
SHA
A/D
CORE
V*
AIN
REFTS
REFBS
MIDSCALE OFFSET VOLTAGE IS DERIVED FROM INTERNAL OR EXTERNAL REF
AD9200
4.2kV TOTAL
MODE
REFTF
0.1mF
AD9200
SHA
10kV
10kV
A2
A/D
10kV
INTERNAL
REF
* MAXIMUM MAGNITUDE OF V IS DETERMINED
CORE
10kV
BY INTERNAL REFERENCE
b. Center Span Mode
AVDD/2
0.1mF
10mF
4.2kV TOTAL
MODE
REFTF
0.1mF
REFBF
AVDD/2
0.1mF
10mF
0.1mF
A1
1V
AD9200
d. 1 V Reference
A1
1V
AD9200
INTERNAL 10K REF RESISTORS ARE SWITCHED OPEN BY THE PRESENSE
OF R
AND RB.
A
f. Variable Reference
(Between 1 V and 2 V)
VREF (1V)
REFSENSE AVSS
VREF (= 1 + R
R
A
REFSENSE R
B
AVSS
A/RB
)
INTERNAL
c. Differential Mode
0.1mF 1.0mF
0.1mF 1.0mF
REF
10kV
0.1mF
REFBF
VREF (2V)
1V
AD9200
A1
10kV
10kV
0.01mF 1.0mF
REFSENSE
AVSS
e. 2 V Reference
1V
AD9200
A1
VREF
g. Internal Reference Disable (Power Reduction)
REFSENSE AVDD
Figure 16.
–10–
REV. E
Page 11
AD9200
The actual reference voltages used by the internal circuitry of the AD9200 appear on REFTF and REFBF. For proper opera­tion, it is necessary to add a capacitor network to decouple these pins. The REFTF and REFBF should be decoupled for all internal and external configurations as shown in Figure 17.
REFTF
0.1mF
0.1mF
10mF
0.1mF
AD9200
REFBF
Figure 17. Reference Decoupling Network
Note: REFTF = reference top, force
REFBF = reference bottom, force REFTS = reference top, sense REFBS = reference bottom, sense

INTERNAL REFERENCE OPERATION

Figures 18, 19 and 20 show example hookups of the AD9200 internal reference in its most common configurations. (Figures 18 and 19 illustrate top/bottom mode while Figure 20 illustrates center span mode). Figure 29 shows how to connect the AD9200 for 1 V p-p differential operation. Shorting the VREF pin directly to the REFSENSE pin places the internal reference amplifier, A1, in unity-gain mode and the resultant reference output is 1 V. In Figure 18 REFBS is grounded to give an input range from 0 V to 1 V. These modes can be chosen when the supply is either +3 V or +5 V. The VREF pin must be bypassed to
AVSS (analog ground) with a 1.0 µF tantalum capacitor in parallel with a low inductance, low ESR, 0.1 µF ceramic capacitor.
Figure 19 shows the single-ended configuration for 2 V p-p operation. REFSENSE is connected to GND, resulting in a 2 V reference output.
2V
0V
1.0mF
REFTS REFBS
0.1mF
SENSE
AIN
VREF
REF
10kV
10kV
A1
10kV
A2
10kV
SHA
1V
A/D
CORE
AD9200
4.2kV TOTAL
MODE
REFTF
0.1mF
REFBF
AVDD
0.1mF
10mF
0.1mF
Figure 19. Internal Reference, 2 V p-p Input Span (Top/Bottom Mode)
Figure 20 shows the single-ended configuration that gives the good high frequency dynamic performance (SINAD, SFDR). To optimize dynamic performance, center the common-mode voltage of the analog input at approximately 1.5 V. Connect the shorted REFTS and REFBS inputs to a low impedance 1.5 V source. In this configuration, the MODE pin is driven to a volt­age at midsupply (AVDD/2).
Maximum reference drive is 1 mA. An external buffer is re­quired for heavier loads.
1V
0V
0.1mF1.0mF
AIN
REFTS
REFBS
VREF
REF
SENSE
10kV
10kV
A1
10kV
A2
10kV
SHA
1V
A/D
CORE
AD9200
4.2kV TOTAL
MODE
REFTF
0.1mF
REFBF
Figure 18. Internal Reference 1 V p-p Input Span (Top/Bottom Mode)
AVDD
0.1mF
10mF
0.1mF
1.0mF
2V
1V
+1.5V
0.1mF
AIN
REFTS
REFBS
VREF
REF
SENSE
10kV
10kV
A1
10kV
A2
10kV
SHA
1V
A/D
CORE
AD9200
4.2kV TOTAL
MODE
REFTF
0.1mF
REFBF
AVDD/2
Figure 20. Internal Reference 1 V p-p Input Span,
(Center Span Mode)
0.1mF
10mF
0.1mF
REV. E
–11–
Page 12
AD9200

EXTERNAL REFERENCE OPERATION

Using an external reference may provide more flexibility and improve drift and accuracy. Figures 21 through 23 show ex­amples of how to use an external reference with the AD9200. To use an external reference, the user must disable the internal reference amplifier by connecting the REFSENSE pin to VDD. The user then has the option of driving the VREF pin, or driv­ing the REFTS and REFBS pins.
The AD9200 contains an internal reference buffer (A2), that simplifies the drive requirements of an external reference. The
external reference must simply be able to drive a 10 k load.
Figure 21 shows an example of the user driving the top and bottom references. REFTS is connected to a low impedance 2 V source and REFBS is connected to a low impedance 1 V source. REFTS and REFBS may be driven to any voltage within the supply as long as the difference between them is between 1 V and 2 V.
2V
1V
2V 1V
AVDD
AIN
REFTS
REFBS
REF
SENSE
MODE
10kV
10kV
10kV
A2
10kV
SHA
A/D
CORE
AD9200
4.2kV TOTAL
REFTF
0.1mF
REFBF
0.1mF
10mF
0.1mF
4V
2V
4V
2V
0.1 F
10 F
AVDD
0.1 F
0.1 F
VIN REFTS REFTF
AD9200
REFBF REFBS
VREF REFSENSE
MODE
Figure 23a. External Reference—2 V p-p Input Span
REFT
REFB
+5V
6
5
2
3
C4
F
0.1
8
7
C3
F
0.1
C2
F
10
C5
0.1 F
6
4
C1
0.1
F
C6
0.1
F
REFTS
REFTF
AD9200
REFBS
REFBF
Figure 23b. Kelvin Connected Reference Using the AD9200
Figure 21. External Reference Mode—1 V p-p Input Span
Figure 22 shows an example of an external reference generating
2.5 V at the shorted REFTS and REFBS inputs. In this in­stance, a REF43 2.5 V reference drives REFTS and REFBS. A resistive divider generates a 1 V VREF signal that is buffered by
A3. A3 must be able to drive a 10 k, capacitive load. Choose
this op amp based on noise and accuracy requirements.
3.0V
2.5V
2.0V
10mF
0.1mF
REF43
1.5kV
1kV
A3
+5V
0.1mF
1.0mF
AVDD/2
0.1mF
0.1mF
AVDD
AD9200
AIN
REFTS
REFBS
VREF
MODE REFSENSE
AVDD
REFTF
REFBF
0.1mF
AVDD
0.1mF
10mF
0.1mF
Figure 22. External Reference Mode—1 V p-p Input Span 2.5 V
CM
Figure 23a shows an example of the external references driving the REFTF and REFBF pins that is compatible with the AD876. REFTS is shorted to REFTF and driven by an external 4 V low impedance source. REFBS is shorted to REFBF and driven by a 2 V source. The MODE pin is connected to GND in this configuration.

STANDBY OPERATION

The ADC may be placed into a powered down (sleep) mode by driving the STBY (standby) pin to logic high potential and holding the clock at logic low. In this mode the typical power drain is approximately 4 mW. If there is no connection to the STBY pin, an internal pull-down circuit will keep the ADC in a “wake-up” mode of operation.
The ADC will “wake up” in 400 ns (typ) after the standby pulse goes low.

CLAMP OPERATION

The AD9200ARS and AD9200KST parts feature an optional clamp circuit for dc restoration of video or ac coupled signals. Figure 24 shows the internal clamp circuitry and the external control signals needed for clamp operation. To enable the clamp, apply a logic high to the CLAMP pin. This will close the switch SW1. The clamp amplifier will then servo the volt­age at the AIN pin to be equal to the clamp voltage applied at the CLAMPIN pin. After the desired clamp level is attained, SW1 is opened by taking CLAMP back to a logic low. Ignoring the droop caused by the input bias current, the input capacitor CIN will hold the dc voltage at AIN constant until the next clamp interval. The input resistor RIN has a minimum recom-
mended value of 10 , to maintain the closed-loop stability of
the clamp amplifier.
The allowable voltage range that can be applied to CLAMPIN depends on the operational limits of the internal clamp ampli­fier. When operating off of 3 volt supplies, the recommended clamp range is between 0.5 volts and 2.0 volts.
–12–
REV. E
Page 13
AD9200
The input capacitor should be sized to allow sufficient acquisi­tion time of the clamp voltage at AIN within the CLAMP inter­val, but also be sized to minimize droop between clamping intervals. Specifically, the acquisition time when the switch is closed will equal:
V
T
= R
ACQ
INCIN
C
ln
V
E
where VC is the voltage change required across CIN, and VE is the error voltage. V
is calculated by taking the difference be-
C
tween the initial input dc level at the start of the clamp interval and the clamp voltage supplied at CLAMPIN. V
is a system-
E
dependent parameter, and equals the maximum tolerable devia­tion from V
. For example, if a 2-volt input level needs to be
C
clamped to 1 volt at the AD9200’s input within 10 millivolts, then V
equals 2 – 1 or 1 volt, and VE equals 10 mV. Note that
C
once the proper clamp level is attained at the input, only a very small voltage change will be required to correct for droop.
The voltage droop is calculated with the following equation:
I
BIAS
dV =
t
()
C
IN
where t = time between clamping intervals.
The bias current of the AD9200 will depend on the sampling rate, F over time, with an input resistance equal to 1/C
. The switched capacitor input AIN appears resistive
S
. Given a
SFS
sampling rate of 20 MSPS and an input capacitance of 1 pF, the
input resistance is 50 k. This input resistance is equivalently
terminated at the midscale voltage of the input range. The worst case bias current will thus result when the input signal is at the extremes of the input range, that is, the furthest distance from the midscale voltage level. For a 1-volt input range, the maxi-
mum bias current will be ±0.5 volts divided by 50 k, which is ±10 µA.
If droop is a critical parameter, then the minimum value of C
IN
should be calculated first based on the droop requirement. Acquisition time—the width of the CLAMP pulse—can be adjusted accordingly once the minimum capacitor value is cho­sen. A tradeoff will often need to be made between droop and acquisition time, or error voltage V
.
E
Clamp Circuit Example
A single supply video amplifier outputs a level-shifted video signal between 2 and 3 volts with the following parameters:
horizontal period = 63.56 µs, horizontal sync interval = 10.9 µs, horizontal sync pulse = 4.7 µs,
sync amplitude = 0.3 volts, video amplitude of 0.7 volts, reference black level = 2.3 volts
The video signal must be dc restored from a 2- to 3-volt range down to a 1- to 2-volt range. Configuring the AD9200 for a one volt input span with an input range from 1 to 2 volts (see Figure 24), the CLAMPIN voltage can be set to 1 volt with an external voltage or by direct connection to REFBS. The CLAMP pulse may be applied during the SYNC pulse, or during the
back porch to truncate the SYNC below the AD9200’s mini­mum input voltage. With a C
= 1 µF, and RIN = 20 , the
IN
acquisition time needed to set the input dc level to one volt
with 1 mV accuracy is about 140 µs, assuming a full 1 volt V
.
C
With a 1 µF input coupling capacitor, the droop across one
horizontal can be calculated:
I
= 10 µA, and t = 63.5 µs, so dV = 0.635 mV, which is less
BIAS
than one LSB.
After the input capacitor is initially charged, the clamp pulse­width only needs to be wide enough to correct small voltage errors such as the droop. The fine scale settling characteristics of the clamp circuitry are shown in Table II.
Depending on the required accuracy, a CLAMP pulsewidth of
1 µs–3 µs should work in most applications. The OFFSET val-
ues ignore the contribution of offset from the clamp amplifier; they simply compare the output code with a “final value” mea­sured with a much longer CLAMP pulse duration.
Table II.

CLAMP OFFSET

10 µs <1 LSB 5 µs 5 LSBs 4 µs 7 LSBs 3 µs 11 LSBs 2 µs 19 LSBs 1 µs 42 LSBs
AD9200
CLAMP IN
CIN
RIN
CLAMP
AIN
SW1
TO SHA
Figure 24a. Clamp Operation
AIN
0.1 F
0.1 F
SHORT TO REFBS OR EXTERNAL DC
10
AVDD
2
F
0.1 F
REFTF REFTS
AD9200
REFBF REFBS
MODE
CLAMP
CLAMPIN
Figure 24b. Video Clamp Circuit
REV. E
–13–
Page 14
AD9200

DRIVING THE ANALOG INPUT

Figure 25 shows the equivalent analog input of the AD9200, a sample-and-hold amplifier (switched capacitor input SHA). Bringing CLK to a logic low level closes Switches 1 and 2 and opens Switch 3. The input source connected to AIN must charge capacitor CH during this time. When CLK transitions from logic “low” to logic “high,” Switches 1 and 2 open, placing the SHA in hold mode. Switch 3 then closes, forcing the output of the op amp to equal the voltage stored on CH. When CLK transitions from logic “high” to logic “low,” Switch 3 opens first. Switches 1 and 2 close, placing the SHA in track mode.
The structure of the input SHA places certain requirements on the input drive source. The combination of the pin capacitance, CP, and the hold capacitance, CH, is typically less than 5 pF. The input source must be able to charge or discharge this ca­pacitance to 10-bit accuracy in one half of a clock cycle. When the SHA goes into track mode, the input source must charge or discharge capacitor CH from the voltage already stored on CH to the new voltage. In the worst case, a full-scale voltage step on the input, the input source must provide the charging current through the R
(50 ) of Switch 1 and quickly (within 1/2 CLK
ON
period) settle. This situation corresponds to driving a low input impedance. On the other hand, when the source voltage equals the value previously stored on CH, the hold capacitor requires no input current and the equivalent input impedance is ex­tremely high.
Adding series resistance between the output of the source and the AIN pin reduces the drive requirements placed on the source. Figure 26 shows this configuration. The bandwidth of the particular application limits the size of this resistor. To maintain the performance outlined in the data sheet specifica-
tions, the resistor should be limited to 20 or less. For applica-
tions with signal bandwidths less than 10 MHz, the user may proportionally increase the size of the series resistor. Alterna­tively, adding a shunt capacitance between the AIN pin and analog ground can lower the ac load impedance. The value of this capacitance will depend on the source resistance and the required signal bandwidth.
The input span of the AD9200 is a function of the reference voltages. For more information regarding the input range, see the Internal and External Reference sections of the data sheet.
CH
AIN
(REFTS
REFBS)
CP
CP
S1
S3
S2
AD9200
SHA
CH
Figure 25. AD9200 Equivalent Input Structure
In many cases, particularly in single-supply operation, ac cou­pling offers a convenient way of biasing the analog input signal at the proper signal range. Figure 25 shows a typical configura­tion for ac-coupling the analog input signal to the AD9200. Maintaining the specifications outlined in the data sheet requires careful selection of the component values. The most important is the f R2 and the parallel combination of C1 and C2. The f
high-pass corner frequency. It is a function of
–3 dB
–3 dB
point
can be approximated by the equation:
f
where C
= 1/(2 × pi × [R2] C
–3 dB
is the parallel combination of C1 and C2. Note that
EQ
EQ
)
C1 is typically a large electrolytic or tantalum capacitor that becomes inductive at high frequencies. Adding a small ceramic
or polystyrene capacitor (on the order of 0.01 µF) that does not
become inductive until negligibly higher frequencies, maintains a low impedance over a wide frequency range.
NOTE: AC coupled input signals may also be shifted to a desired level with the AD9200’s internal clamp. See Clamp Operation.
V
C1
IN
C2
R1
R2
V
BIAS
AIN
I
B
AD9200
Figure 27. AC Coupled Input
There are additional considerations when choosing the resistor values. The ac-coupling capacitors integrate the switching tran­sients present at the input of the AD9200 and cause a net dc bias current, I
, to flow into the input. The magnitude of the
B
bias current increases as the signal magnitude deviates from V midscale and the clock frequency increases; i.e., minimum bias current flow when AIN = V midscale. This bias current
will result in an offset error of (R1 + R2) × I
. If it is necessary
B
to compensate this error, consider making R2 negligibly small or modifying VBIAS to account for the resultant offset.
In systems that must use dc coupling, use an op amp to level­shift a ground-referenced signal to comply with the input re­quirements of the AD9200. Figure 28 shows an AD8041 config­ured in noninverting mode.
+V
CC
0.1 F
MIDSCALE
OFFSET
VOLTAGE
NC
0V
1V p-p
DC
2
AD8041
3
7
1
5
4
NC
20
6
AD9200
AIN
<
20V
AIN
V
S
AD9200
Figure 26. Simple AD9200 Drive Configuration
–14–
Figure 28. Bipolar Level Shift
REV. E
Page 15
AD9200

DIFFERENTIAL INPUT OPERATION

The AD9200 will accept differential input signals. This function may be used by shorting REFTS and REFBS and driving them as one leg of the differential signal (the top leg is driven into AIN). In the configuration below, the AD9200 is accepting a 1 V p-p signal. See Figure 29.
2V
1V
1.0mF
AVDD/2
0.1mF
AVDD/2
AD9200
AIN
REFTS REFBS
VREF
REFSENSE
MODE
REFTF
REFBF
0.1mF
0.1mF
10mF
0.1mF
Figure 29. Differential Input

AD876 MODE OF OPERATION

The AD9200 may be dropped into the AD876 socket. This will allow AD876 users to take advantage of the reduced power consumption realized when running the AD9200 on a 3.0 V analog supply.
Figure 30 shows the pin functions of the AD876 and AD9200. The grounded REFSENSE pin and floating MODE pin effec­tively put the AD9200 in the external reference mode. The external reference input for the AD876 will now be placed on the reference pins of the AD9200.
The clamp controls will be grounded by the AD876 socket. The AD9200 has a 3 clock cycle delay compared to a 3.5 cycle delay of the AD876.
4V
2V
4V
2V
10mF
0.1mF
0.1mF
0.1mF
AVDD
AIN
AD9200
REFTS REFTF
REFBF REFBS MODENC REFSENSE CLAMP
CLAMPIN OTR
VREF
0.1mF
The pipelined architecture of the AD9200 operates on both rising and falling edges of the input clock. To minimize duty cycle variations the recommended logic family to drive the clock input is high speed or advanced CMOS (HC/HCT, AC/ACT) logic. CMOS logic provides both symmetrical voltage threshold levels and sufficient rise and fall times to support 20 MSPS operation. The AD9200 is designed to support a conversion rate of 20 MSPS; running the part at slightly faster clock rates may be possible, although at reduced performance levels. Conversely, some slight performance improvements might be realized by clocking the AD9200 at slower clock rates.
ANALOG
INPUT
INPUT
CLOCK
DATA
OUTPUT
S1
t
CH
S2
t
C
t
CL
S3
S4
25ns
DATA 1
Figure 31. Timing Diagram
The power dissipated by the output buffers is largely propor­tional to the clock frequency; running at reduced clock rates provides a reduction in power consumption.

DIGITAL INPUTS AND OUTPUTS

Each of the AD9200 digital control inputs, THREE-STATE and STBY are reference to analog ground. The clock is also referenced to analog ground.
The format of the digital output is straight binary (see Figure
32). A low power mode feature is provided such that for STBY = HIGH and the clock disabled, the static power of the AD9200 will drop below 5 mW.
OTR
–FS+1LSB
–FS
+FS
+FS–1LSB
Figure 32. Output Data Format
Figure 30. AD876 Mode

CLOCK INPUT

The AD9200 clock input is buffered internally with an inverter powered from the AVDD pin. This feature allows the AD9200 to accommodate either +5 V or +3.3 V CMOS logic input sig­nal swings with the input threshold for the CLK pin nominally at AVDD/2.
REV. E
–15–
THREE-
STATE
DATA
(D0–D9)
t
DHZ
HIGH
IMPEDANCE
t
DEN
Figure 33. Three-State Timing Diagram
Page 16
AD9200

APPLICATIONS

DIRECT IF DOWN CONVERSION USING THE AD9200

Sampling IF signals above an ADC’s baseband region (i.e., dc to F
/2) is becoming increasingly popular in communication
S
applications. This process is often referred to as Direct IF Down Conversion or Undersampling. There are several potential ben­efits in using the ADC to alias (i.e., or mix) down a narrowband or wideband IF signal. First and foremost is the elimination of a complete mixer stage with its associated amplifiers and filters, reducing cost and power dissipation. Second is the ability to apply various DSP techniques to perform such functions as filtering, channel selection, quadrature demodulation, data reduction, detection, etc. A detailed discussion on using this technique in digital receivers can be found in Analog Devices Application Notes AN-301 and AN-302.
In Direct IF Down Conversion applications, one exploits the inherent sampling process of an ADC in which an IF signal lying outside the baseband region can be aliased back into the baseband region in a similar manner that a mixer will down­convert an IF signal. Similar to the mixer topology, an image rejection filter is required to limit other potential interfering signals from also aliasing back into the ADC’s baseband region. A tradeoff exists between the complexity of this image rejection filter and the sample rate as well as dynamic range of the ADC.
The AD9200 is well suited for various narrowband IF sampling applications. The AD9200’s low distortion input SHA has a full-power bandwidth extending to 300 MHz thus encompassing
many popular IF frequencies. A DNL of ±0.5 LSB (typ) com-
bined with low thermal input referred noise allows the AD9200 in the 2 V span to provide 60 dB of SNR for a baseband input sine wave. Also, its low aperture jitter of 2 ps rms ensures minimum SNR degradation at higher IF frequencies. In fact, the AD9200 is capable of still maintaining 56 dB of SNR at an IF of 135 MHz with a 1 V (i.e., 4 dBm) input span. Note, although the AD9200 will typically yield a 3 to 4 dB improvement in SNR when con­figured for the 2 V span, the 1 V span provides the optimum full-scale distortion performance. Furthermore, the 1 V span reduces the performance requirements of the input driver cir­cuitry and thus may be more practical for system implementa­tion purposes.
Figure 34 shows a simplified schematic of the AD9200 config­ured in an IF sampling application. To reduce the complexity of the digital demodulator in many quadrature demodulation ap­plications, the IF frequency and/or sample rate are selected such that the bandlimited IF signal aliases back into the center of the ADC’s baseband region (i.e., F
/4). For example, if an IF sig-
S
nal centered at 45 MHz is sampled at 20 MSPS, an image of this IF signal will be aliased back to 5.0 MHz which corre­sponds to one quarter of the sample rate (i.e., F
/4). This
S
demodulation technique typically reduces the complexity of the post digital demodulator ASIC which follows the ADC.
To maximize its distortion performance, the AD9200 is config­ured in the differential mode with a 1 V span using a transformer. The center tap of the transformer is biased at midsupply via a resistor divider. Preceding the AD9200 is a bandpass filter as well as a 32 dB gain stage. A large gain stage may be required to compensate for the high insertion losses of a SAW filter used for image rejection. The gain stage will also provide adequate isolation for the SAW filter from the charge “kick back” currents associated with AD9200’s input stage.
The gain stage can be realized using one or two cascaded AD8009 op amps amplifiers. The AD8009 is a low cost, 1 GHz, current-feedback op amp having a 3rd order intercept character­ized up to 250 MHz. A passive bandpass filter following the AD8009 attenuates its dominant 2nd order distortion products which would otherwise be aliased back into the AD9200’s baseband region. Also, it reduces any out-of-band noise which would also be aliased back due to the AD9200’s noise band­width of 220+ MHz. Note, the bandpass filters specifications are application dependent and will affect both the total distor­tion and noise performance of this circuit.
The distortion and noise performance of an ADC at the given IF frequency is of particular concern when evaluating an ADC for a narrowband IF sampling application. Both single-tone and dual-tone SFDR vs. amplitude are very useful in an assessing an ADC’s noise performance and noise contribution due to aper­ture jitter. In any application, one is advised to test several units of the same device under the same conditions to evaluate the given applications sensitivity to that particular device.
SAW
FILTER
OUTPUT
50V
G
= 20dB G2 = 12dB L-C
1
200V
22.1V
50V
280V
93.1V
50V
BANDPASS
FILTER
MINI CIRCUITS
T4 - 6T
AVDD
1:4
1kV
1kV
Figure 34. Simplified AD9200 IF Sampling Circuit
–16–
200V
0.1mF
AD9200
AIN
REFTS REFBS
VREF
0.1mF1.0mF
REFSENSE
REV. E
Page 17
AD9200
90
80
0 –60 0–40 –20
70
60
30
20
INPUT POWER LEVEL – dBFS
50
40
10
–10–50 –30
WORST CASE SPURIOUS – dBFS
SNR – dBc
SINGLE TONE SFDR
DUAL TONE SFDR
SNR
CLK = 20MSPS SINGLE TONE – 85.52MHz DUAL TONE– F
1
= 84.49MHz
– F
2
= 85.52MHz
Figures 35–38 combine the dual-tone SFDR as well as single tone SFDR and SNR performance at IF frequencies of 45 MHz, 70 MHz, 85 MHz and 135 MHz. Note, the SFDR vs. ampli­tude data is referenced to dBFS while the single tone SNR data is referenced to dBc. The performance characteristics in these figures are representative of the AD9200 without the AD8009. The AD9200 was operated in the differential mode (via trans­former) with a 1 V span at 20 MSPS. The analog supply (AVDD) and the digital supply (DRVDD) were set to +5 V and
3.3 V, respectively.
90
80
70
60
50
40
SNR – dBc
30
20
WORST CASE SPURIOUS – dBFS
10
0
–60 0–40 –20
DUAL TONE SFDR
SINGLE TONE SFDR
SNR
INPUT POWER LEVEL – dBFS
CLK = 20MSPS SINGLE TONE – 45.52MHz DUAL TONE– F
= 44.49MHz
1
– F
= 45.52MHz
2
–10–50 –30
Although not presented, data was also taken with the insertion of an AD8009 gain stage of 32 dB in the signal path. No degradation in two-tone SFDR vs. amplitude was noted at an IF of 45 MHz, 70 MHz and 85 MHz. However, at 135 MHz, the AD8009 became the limiting factor in the distortion perfor­mance until the two input tones were decreased to –15 dBFS from their full-scale level of –6.5 dBFS. Note: the SNR perfor­mance in each case degraded by approximately 0.5 dB due to the AD8009’s in-band noise contribution.
Figure 35. SNR/SFDR for IF @ 45 MHz
90
80
70
60
50
40
SNR – dBc
30
20
WORST CASE SPURIOUS – dBFS
10
0 –60 0–40 –20
Figure 36. SNR/SFDR for IF @ 70 MHz
REV. E
SINGLE TONE SFDR
DUAL TONE SFDR
SNR
INPUT POWER LEVEL – dBFS
CLK = 21.538MSPS SINGLE TONE – 70.55MHz DUAL TONE– F
= 69.50MHz
1
= 70.55MHz
– F
2
–10–50 –30
–17–
Figure 37. SNR/SFDR for IF @ 85 MHz
90
80
70
60
50
40
SNR – dBc
30
20
WORST CASE SPURIOUS – dBFS
10
0 –60 0–40 –20
DUAL TONE SFDR
SINGLE TONE SFDR
SNR
CLK = 20MSPS SINGLE TONE – 135.52MHz DUAL TONE – F1 = 134.44MHz
INPUT POWER LEVEL – dBFS
– F
= 135.52MHz
2
Figure 38. SNR/SFDR for IF @ 135 MHz
–10–50 –30
Page 18
AD9200
+3–5A
5.49kV
AD1580
J7
AVDD
DUTCLK
THREE-STATE
STBY
REFSENSE
CLAMP
CLAMPIN
REFTS REFTF
MODE REFBF REFBS
VREF
AIN
R7
D1
GND
C16
0.1mF
10/10V
C33
TP14
R53
49.9V
+
C17 10/10V
15 16
17 18 19 20 21 22 23
24 25 26 27
XXXX
ADJ.
R8
10kV
CW
R9
1.5kV
JP5
JP17
JP18
28
AVDD
DRVDD
U1
AD9200
CLK THREE-STATE STBY REFSENSE
CLAMP CLAMPIN REFTS REFTF
MODE REFBF REFBS VREF
AIN
AVSS
DRVSS
1
XXXX
ADJ.
R14
10kV
R37 1kV
R38 1kV
R39 1kV
C18 10/10V
WHITE
13
3 4
5 6 7 8 9 10 11
12
3
C8 10/10V
C19
0.1mF
D0 D1
D2 D3 D4 D5 D6 D7 D8
D9
R11
15kV
2
CW
OTR
TP19
AD822
U2
+3–5A
R12
10kV
TP11
DRVDD
DRVDD
4
C7
8
0.1mF
2
3
C9 10/10V
DRVDD
DRVDD
CLK
1
0.1mF
11kV
AD822
U3
+3–5A
C40
GND
R13
B
B
GND
C41
0.1mF
4
8
1
3
1
3 A
1
C10
0.1mF
S3
A
S4
GND
2
2
D5 D6
D7 D8 D9
D0 D1 D2
D3 D4
GND
5
AD822
U2
6
6
AD822
U3
5
16
B
U4 A
15
B
U4 A
21
B
U4 A
20
B
U4 A
19
B
U4 A
18
B
U4 A
17
B
U4 A
14
B
U4 A
24
VCCB
VCCA
23
NC1
22
OE
13
GD1
U4
74LVXC4245WM
19
B
U5 A
20
B
U5 A
21
B
U5 A
18
B
U5 A
17
B
U5 A
16
B
U5 A
15
B
U5 A
14
B
U5 A
24
VCCB
VCCA
23
NC1
22
OE
13
GD1
U5
74LVXC4245WM
GND
+3–5A
7
7
8 9 3
4 5 6 7 10 1 2
T/R
11
GD2
12
GD3
5 4 3 6 7 8 9 10 1 2
T/R
11
GD2
12
GD3
321
JP20
R15 1kV
C11
0.1mF
0.1mF
R16 1kV
C29
GND
3
GND
CM
C20
0.1mF
C21
0.1mF
R17 316V
R18 316kV
+3–5D
2
JP21
GND
1
+3–5D
C43
0.1mF
Q1 2N3906
R19 178V
R20 178V
Q2 2N3904
B
1 3
GND
+3–5D
C42
0.1mF
0.626V TO 4.8V
S2
2
A
C12
0.1mF
C14
0.1mF
710
RN1 22V
611
RN1 22V
5
12
RN1 22V
413
RN1 22V
2
15
RN1 22V
116
RN1 22V
611
RN2 22V
512
RN2 22V
13
4
RN2 22V
3
RN2 22V
215
RN2 22V
1
RN2 22V
C13 10/10V
C15 10/10V
CLK
16
TP16
TP17
WHITE
CLK_OUT
14
13
J8
11
J8
9
J8
7
J8
5
J8
J8
1
33
J8
J8
23
21
J8
J8
19
17
J8
15
J8
EXTT
EXTB
CLAMP
THREE-STATE
STBY
27 25
3 2
4 6
8
10 12
14 16
18 20
22 24
26
NC
39 28
29 30
31 32 34
35
NC
36 37
NC
38 40
J8 J8 J8 J8 J8 J8 J8 J8 J8 J8 J8 J8 J8 J8 J8 J8 J8 J8 J8 J8 J8 J8 J8 J8 J8 J8 J8 J8
R10
5kV
2
OTR
D0 D1 D2 D3
D4 D5 D6 D7
D8 D9
14
Figure 39a. Evaluation Board Schematic
–18–
REV. E
Page 19
AD9200
VREF
J1
AVDD
2
R1
49.9
R5
R6
GND
12
2
3
JP14
MODE
JP15
JP16
U6
U6
U6
5
6
TP12
B
1
S6
2
3
A
R51
49.9 CLK
TP13
R52
49.9
4
DUTCLK
GND
REFSENSE
EXTB
REFBF
REFTF
EXTT CLAMPIN EXTT
REFTS
REFBS
EXTB
AIN
REFBS
CM
AVDD
JP22
4.99k
ADC_CLK
2k
R34
R36
J5
JP1
TP5
TP6
P
T1
A 3
1 B
C3
0.1
10/10V
C35 10/10V
JP13
3
2
1
S
JP2
TP1
JP3
JP4
B
1
3
A
JP6
JP7
A 3
S8
B
1
JP8
C1
F
0.1
C2
47/10V
TP8
TP7
JP9
S5
2
JP12
T1–1T
4
6
JP26
2
S1
C5
JP11
JP10
C6
0.1
C37
0.1
C4
0.1 F
F
F
TP9
TP10
C38
0.1
GND
TP3
TP4
F
DCIN
F
+
GND
C36
F
0.1
R2
100
R3
100
AVDDCLK
R35
4.99k
CW
C30
F
0.1
AVDD
R4
49.9
10k
10k
B
1
S7
3
A
GND J6
GND J10
TP29
J9
TP20
J2
TP21
J3
TP22
J4
TP23 TP24 TP25 TP26 TP27 TP28
C32
0.1
C22
0.1
C24
0.1
C26
0.1
L4
F
L1
F
L2
F
L3
F
Figure 39b. Evaluation Board Schematic
C31 10/10V
C23 10/10V
C25 33/16V
C27 10/10V
+3–5D
DRVDD
AVDD
+3–5A
74AHC14
U6 DECOUPLING
AVDDCLK
14
PWR
U6
GND
7
C28
0.1 F
U6
9
11U610
13U612
8
REV. E
–19–
Page 20
AD9200
Figure 40a. Evaluation Board, Component Signal (Not to Scale)
Figure 40b. Evaluation Board, Solder Signal (Not to Scale)
–20–
REV. E
Page 21
AD9200
Figure 40c. Evaluation Board Power Plane (Not to Scale)
REV. E
Figure 40d. Evaluation Board Ground Plane (Not to Scale)
–21–
Page 22
AD9200
Figure 40e. Evaluation Board Component Silk (Not to Scale)
Figure 40f. Evaluation Board Solder Silk (Not to Scale)
–22–
REV. E
Page 23
AD9200
GROUNDING AND LAYOUT RULES
As is the case for any high performance device, proper ground­ing and layout techniques are essential in achieving optimal performance. The analog and digital grounds on the AD9200 have been separated to optimize the management of return currents in a system. Grounds should be connected near the ADC. It is recommended that a printed circuit board (PCB) of at least four layers, employing a ground plane and power planes, be used with the AD9200. The use of ground and power planes offers distinct advantages:
1. The minimization of the loop area encompassed by a signal and its return path.
2. The minimization of the impedance associated with ground and power paths.
3. The inherent distributed capacitor formed by the power plane, PCB insulation and ground plane.
These characteristics result in both a reduction of electro­magnetic interference (EMI) and an overall improvement in performance.
It is important to design a layout that prevents noise from cou­pling onto the input signal. Digital signals should not be run in parallel with the input signal traces and should be routed away from the input circuitry. Separate analog and digital grounds should be joined together directly under the AD9200 in a solid ground plane. The power and ground return currents must be carefully managed. A general rule of thumb for mixed signal layouts dictates that the return currents from digital circuitry should not pass through critical analog circuitry.
DIGITAL OUTPUTS
Each of the on-chip buffers for the AD9200 output bits (D0–D9) is powered from the DRVDD supply pins, separate from AVDD. The output drivers are sized to handle a variety of logic families while minimizing the amount of glitch energy generated. In all cases, a fan-out of one is recommended to keep the capacitive load on the output data bits below the specified 20 pF level.
For DRVDD = 5 V, the AD9200 output signal swing is compat­ible with both high speed CMOS and TTL logic families. For TTL, the AD9200 on-chip, output drivers were designed to support several of the high speed TTL families (F, AS, S). For applications where the clock rate is below 20 MSPS, other TTL families may be appropriate. For interfacing with lower voltage CMOS logic, the AD9200 sustains 20 MSPS operation with DRVDD = 3 V. In all cases, check your logic family data sheets for compatibility with the AD9200 Digital Specification table.

THREE-STATE OUTPUTS

The digital outputs of the AD9200 can be placed in a high impedance state by setting the THREE-STATE pin to HIGH. This feature is provided to facilitate in-circuit testing or evaluation.
REV. E
–23–
Page 24
AD9200
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
48-Lead Plastic Thin Quad Flatpack (LQFP)
(ST-48)
0.030 (0.75)
0.018 (0.45)
SEATING
PLANE
0.006 (0.15)
0.002 (0.05)
0° – 7°
0.063 (1.60) MAX
0.030 (0.75)
0.057 (1.45)
0.018 (0.45)
0.053 (1.35)
0° MIN
0.007 (0.18)
0.004 (0.09)
0.354 (9.00) BSC
0.276 (7.0) BSC
48
1
TOP VIEW
(PINS DOWN)
12
13
0.019 (0.5) BSC
37
36
25
24
0.011 (0.27)
0.006 (0.17)
28-Lead Shrink Small Outline Package (SSOP)
(RS-28)
0.407 (10.34)
0.397 (10.08)
28 15
0.311 (7.9)
0.301 (7.64)
141
0.212 (5.38)
0.205 (5.21)
0.276 (7.0) BSC
0.354 (9.00) BSC
C3033e–0–8/99
0.078 (1.98)
0.068 (1.73)
0.008 (0.203)
0.002 (0.050)
PIN 1
0.0256 (0.65)
BSC
0.015 (0.38)
0.010 (0.25)
SEATING
PLANE
0.07 (1.79)
0.066 (1.67)
0.009 (0.229)
0.005 (0.127)
8° 0°
0.03 (0.762)
0.022 (0.558)
PRINTED IN U.S.A.
–24–
REV. E
Loading...