Datasheet AD9002 Datasheet (Analog Devices)

Page 1
High Speed 8-Bit
256
255
128
127
2
1
D E C O D
I N G
L O G
I C
L A T C H
R
R
R
R/2
R/2
R
R
OVERFLOW
INHIBIT
ANALOG IN
+V
REF
REF
MID
–V
REF
ENCODE
ENCODE
GND HYSTERESIS
–V
S
BIT 2
BIT 3
BIT 4
BIT 5
BIT 6
BIT 7
BIT 8 (MSB)
OVERFLOW
AD9002
BIT 1 (LSB)
a
FEATURES 150 MSPS Encode Rate Low Input Capacitance: 17 pF Low Power: 750 mW –5.2 V Single Supply MIL-STD-883 Compliant Versions Available
APPLICATIONS Radar Systems Digital Oscilloscopes/ATE Equipment Laser/Radar Warning Receivers Digital Radio Electronic Warfare (ECM, ECCM, ESM) Communication/Signal Intelligence
GENERAL DESCRIPTION
The AD9002 is an 8-bit, high speed, analog-to-digital converter. The AD9002 is fabricated in an advanced bipolar process that allows operation at sampling rates in excess of 150 megasamples/ second. Functionally, the AD9002 is comprised of 256 parallel comparator stages whose outputs are decoded to drive the ECL compatible output latches.
An exceptionally wide large signal analog input bandwidth of 160 MHz is due to an innovative comparator design and very close attention to device layout considerations. The wide input bandwidth of the AD9002 allows very accurate acquisition of high speed pulse inputs, without an external track-and-hold. The comparator output decoding scheme minimizes false codes, which is critical to high speed linearity.
The AD9002 provides an external hysteresis control pin that can be used to optimize comparator sensitivity to further im­prove performance. Additionally, the AD9002’s low power dissipation of 750 mW makes it usable over the full extended temperature range. The AD9002 also incorporates an overflow
REV. D
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Monolithic A/D Converter
FUNCTIONAL BLOCK DIAGRAM
bit to indicate overrange inputs. This overflow output can be disabled with the overflow inhibit pin.
The AD9002 is available in two grades, one with 0.5 LSB lin­earity and one with 0.75 LSB linearity. Both versions are offered
in an industrial grade, –25°C to +85°C, packaged in a 28-lead
DIP and a 28-leaded JLCC. The military temperature range
devices, –55°C to +125°C, are available in ceramic DIP and
LCC packages and comply with MIL-STD-883 Class B.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 1999
Page 2
AD9002–SPECIFICATIONS
ELECTRICAL CHARACTERISTICS
(–VS = –5.2 V; Differential Reference Voltage = 2.0 V; unless otherwise noted)
AD9002AD/AJ AD9002BD/BJ AD9002SD/SE AD9002TD/TE
Parameter Temp Min Typ Max Min Typ Max Min Typ Max Min Typ Max Units
RESOLUTION 8 8 8 8 Bits
DC ACCURACY
Differential Linearity +25°C 0.6 0.75 0.4 0.5 0.6 0.75 0.4 0.5 LSB
Full 1.0 0.75 1.0 0.75 LSB
Integral Linearity +25°C 0.6 1.0 0.4 0.5 0.6 1.0 0.4 0.5 LSB
Full 1.2 1.2 1.2 1.2 LSB
No Missing Codes Full GUARANTEED GUARANTEED GUARANTEED GUARANTEED
INITIAL OFFSET ERROR
Top of Reference Ladder +25°C 8 14 8 14 8 14 8 14 mV
Full 17 17 17 17 mV
Bottom of Reference Ladder +25°C 4 10 4 10 4 10 4 10 mV
Full 12 12 12 12 mV
Offset Drift Coefficient Full 20 20 20 20 µV/°C
ANALOG INPUT
Input Bias Current
1
+25°C 60 200 60 200 60 200 60 200 µA
Full 200 200 200 200 µA Input Resistance +25°C 25 200 25 200 25 200 25 200 kΩ Input Capacitance +25°C 1722 1722 1722 1722 pF
Large Signal Bandwidth Input Slew Rate
2
3
+25°C 160 160 160 160 MHz
+25°C 440 440 440 440 V/µs
REFERENCE INPUT
Reference Ladder Resistance +25°C 40 80 110 40 80 110 40 80 110 40 80 110 Ladder Temperature Coefficient 0.25 0.25 0.25 0.25 Ω/°C Reference Input Bandwidth +25°C10101010MHz
DYNAMIC PERFORMANCE
Conversion Rate +25°C 125 150 125 150 125 150 125 150 MSPS Aperture Delay +25°C 1.3 1.3 1.3 1.3 ns Aperture Uncertainty (Jitter) +25°C15151515ps
Output Delay (tPD) Transient Response Overvoltage Recovery Time Output Rise Time Output Fall Time Output Time Skew
ENCODE INPUT
Logic “1” Voltage Logic “0” Voltage
4, 5
6
4
4
4, 8
4
4
+25°C 2.5 3.7 5.5 2.5 3.7 5.5 2.5 3.7 5.5 2.5 3.7 5.5 ns
+25°C6666ns
7
+25°C6666ns
+25°C 3.0 3.0 3.0 3.0 ns
+25°C 2.5 2.5 2.5 2.5 ns
+25°C 0.6 0.6 0.6 0.6 ns
Full –1.1 –1.1 –1.1 –1.1 V
Full –1.5 –1.5 –1.5 –1.5 V
Logic “1” Current Full 150 150 150 150 µA Logic “0” Current Full 120 120 120 120 µA Input Capacitance +25°C3333pF
Encode Pulsewidth (Low) Encode Pulsewidth (High)
9
+25°C 1.5 1.5 1.5 1.5 ns
9
+25°C 1.5 1.5 1.5 1.5 ns
OVERFLOW INHIBIT INPUT
0 V Input Current Full 144 300 144 300 144 300 144 300 µA
AC LINEARITY
Effective Bits
10
11
+25°C 7.6 7.6 7.6 7.6 Bits
In-Band Harmonics
dc to 1.23 MHz +25°C4855 4855 4855 4855 dB dc to 9.3 MHz +25°C50505050dB dc to 19.3 MHz +25°C44444444dB
Signal-to-Noise Ratio Two Tone Intermod Rejection
DIGITAL OUTPUTS
12
4
+25°C 46 47.6 46 47.6 46 47.6 46 47.6 dB
13
+25°C60606060dB
Logic “1” Voltage Full –1.1 –1.1 –1.1 –1.1 V Logic “0” Voltage Full –1.5 –1.5 –1.5 –1.5 V
POWER SUPPLY
14
Supply Current (–5.2 V) +25°C 145 175 145 175 145 175 145 175 mA
Full 200 200 200 200 mA
Nominal Power Dissipation +25°C 750 750 750 750 mW Reference Ladder Dissipation +25°C50505050mW
Power Supply Rejection Ratio
NOTES
1
Measured with AIN = 0 V.
2
Measured by FFT analysis where fundamental is –3 dBc.
3
Input slew rate derived from rise time (10 to 90%) of full scale input.
4
0utputs terminated through 100 to –2 V.
5
Measured from ENCODE in to data out for LSB only.
6
For full-scale step input, 8-bit accuracy is attained in specified time.
7
Recovers to 8-bit accuracy in specified time after 150% full-scale input overvoltage.
8
Output time skew includes high-to-low and low-to-high transitions as well as
15
+25°C 0.8 1.5 0.8 1.5 0.8 1.5 0.8 1.5 mV/V
bit-to-bit time skew differences.
9
ENCODE signal rise/fall times should be less than 10 ns for normal operation.
10
Measured at 125 MSPS encode rate.
11
Analog input frequency = 1.23 MHz.
12
RMS signal to rms noise, with 1.23 MHz analog input signal.
13
Input signals 1 V p-p @ 1.23 MHz and 1 V p-p @ 2.30 MHz.
14
Supplies should remain stable within ±5% for normal operation.
15
Measured at –5.2 V ±5%.
Specifications subject to change without notice.
REV. D–2–
Page 3
AD9002
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage (–VS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . –6 V
Analog-to-Digital Supply Voltage Differential . . . . . . . . .0.5 V
Analog Input Voltage . . . . . . . . . . . . . . . . . . . . . –V
Digital Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . –V
– V
Reference Input Voltage (+V
REF
)2 . . . . –3.5 V to 0.1 V
REF
to +0.5 V
S
to 0 V
S
Differential Reference Voltage . . . . . . . . . . . . . . . . . . . . .2.1 V
Reference Midpoint Current . . . . . . . . . . . . . . . . . . . . ±4 mA
ENCODE to ENCODE Differential Voltage . . . . . . . . . . . 4 V
Digital Output Current . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
Operating Temperature Range
AD9002AD/BD/AJ/BJ . . . . . . . . . . . . . . . . –25°C to +85°C
AD9002SE/SD/TD/TE . . . . . . . . . . . . . . –55°C to +125°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature
3
. . . . . . . . . . . . . . . . . . . . . . . .+175°C
Lead Soldering Temperature (10 sec) . . . . . . . . . . . . .+300°C
NOTES
1
Absolute maximum ratings are limiting values, to be applied individually, and beyond which the serviceability of the circuit may be impaired. Functional operability under any of these conditions is not necessarily implied. Exposure to absolute maximum rating conditions for extended periods of time may affect device reliability.
2
+V
–V
REF
3
Maximum junction temperature (t
packages, and +150°C for plastic packages:
t
PD (θ
where
PD = power dissipation
θ θ
t t
Typical thermal impedances are:
Ceramic DIP θ Ceramic LCC θ PLCC θ
under all circumstances.
REF
= PD (θ
J
JA
JC
= ambient temperature (°C)
A
= case temperature (°C)
C
) + t
JA
A
) + t
JC
C
= thermal impedance from junction to ambient (°C/W) = thermal impedance from junction to case (°C/W)
= 56°C/W; θJC = 20°C/W
JA
= 69°C/W; θ
JA
= 60°C/W; θJC = 19°C/W.
JA
max) should not exceed +175°C for ceramic
J
= 23°C/W
JC
Recommended Operating Conditions
Input Voltage
Parameter Min Nominal Max
–V
S
+V
REF
–V
REF
Analog Input –V
–5.46 –5.20 –4.94 –V
REF
–2.1 –2.0 +V
REF
0.0 V +0.1
+V
REF
REF
EXPLANATION OF TEST LEVELS
Test Level I – 100% production tested.
Test Level II – 100% production tested at +25°C, and
sample tested at specified temperatures. Test Level III – Sample tested only. Test Level IV – Parameter is guaranteed by design and
characterization testing. Test Level V – Parameter is a typical value only. Test Level VI – All devices are 100% production tested at
+25°C. 100% production tested at tempera-
ture extremes for extended temperature
devices; sample tested at temperature ex-
tremes for commercial/industrial devices.
ORDERING GUIDE
Package
Model Linearity Temperature Range Option*
AD9002AD 0.75 LSB –25°C to +85°C D-28 AD9002BD 0.50 LSB –25°C to +85°C D-28 AD9002AJ 0.75 LSB –25°C to +85°C J-28 AD9002BJ 0.50 LSB –25°C to +85°C J-28 AD9002SD/883B 0.75 LSB –55°C to +125°C D-28 AD9002SE/883B 0.75 LSB –55°C to +125°C E-28A AD9002TD/883B 0.50 LSB –55°C to +125°C D-28 AD9002TE/883B 0.50 LSB –55°C to +125°C E-28A
*D = Ceramic DIP; E = Leadless Ceramic Chip Carrier; J = Ceramic Chip
Carrier, J-Formed Leads.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD9002 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
REV. D
–3–
WARNING!
ESD SENSITIVE DEVICE
Page 4
AD9002
FUNCTIONAL DESCRIPTION
Pin # Name Description
1 DIGITAL GROUND One of four digital ground pins. All digital ground pins should be connected together. 2 OVERFLOW INH OVERFLOW INHIBIT controls the data output polarity for overvoltage inputs.
delbanEwolfrevO
)V2.5–rognitaolF(
tupnIgolanA
V
V+>
NI
V
NI
V+
FER
FER
Dfo8D–1
000000001111111110
XXXXXXXX0XXXXXXXX0
3 HYSTERESIS The Hysteresis control voltage varies the comparator hysteresis from 0 mV to 10 mV, for a change
from –5.2 V to –2.2 V at the Hysteresis control pin. Normally converted to –5.2 V.
4+V
REF
The most positive reference voltage for the internal resistor ladder. 5 ANALOG INPUT One of two analog input pins. Both analog input pins should be connected together. 6 ANALOG GROUND One of two analog ground pins. Both analog ground pins should be connected together. 7 ENCODE Noninverted input of the differential encode input. This pin is driven in conjunction with
ENCODE. Data is latched on the rising edge of the ENCODE signal. 8 ENCODE Inverted input of the differential encode input. This pin is driven in conjunction with ENCODE. 9 ANALOG GROUND One of two analog ground pins. Both analog ground pins should be connected together. 10 ANALOG INPUT One of two analog input pins. Both analog inputs should be connected together. 11 –V
REF
12 REF
MID
The most negative reference voltage for the internal resistor ladder.
The midpoint tap on the internal resistor ladder. 13 DIGITAL GROUND One of four digital ground pins. All digital ground pins should be connected together. 14 DIGITAL –V
S
One of two negative digital supply pins (nominally –5.2 V). Both digital supply pins should be con-
nected together. 15 D1 (LSB) Digital data output. 16–19 D2–D5 Digital data output. 20 DIGITAL GROUND One of four digital ground pins. All digital ground pins should be connected together. 21, 22 ANALOG –V
S
One of two negative analog supply pins (nominally –5.2 V). Both analog supply pins should be con-
nected together. 23 DIGITAL GROUND One of four digital ground pins. All digital ground pins should be connected together. 24, 25 D6, D7 Digital data output. 26 D8 (MSB) Digital data output. 27 OVERFLOW Overflow data output. Logic high indicates an input overvoltage (V
INHIBIT is enabled (overflow enabled, –5.2 V). See OVERFLOW INHIBIT.
28 DIGITAL –V
S
One of two negative digital supply pins (nominally –5.2 V). Both digital supply pins should be
connected together.
Dfo8D–1
wolfrevO)DNG(detibihnI
> +V
IN
) if OVERFLOW
REF
DIGITAL
GROUND
OVERFLOW INH
HYSTERESIS
+V
REF
ANALOG INPUT
ANALOG
GROUND
ENCODE
ENCODE
ANALOG GROUND
ANALOG INPUT
–V
REF
REF
MID
DIGITAL
GROUND
DIGITAL –V
1
2
3
4
5
6
7
(Not to Scale)
8
9
10
11
12
13
14
S
DIP
AD9002
TOP VIEW
28
DIGITAL –V
27
OVERFLOW
26
D8(MSB)
25
D7
24
D6 DIGITAL
23
GROUND
22
ANALOG –V
21
ANALOG –V DIGITAL
20
GROUND
19
D5
18
D4
17
D3
16
D2
15
D1(LSB)
S
S
S
ANALOG INPUT
ANALOG GROUND ENCODE
ENCODE
ANALOG
GROUND
ANALOG INPUT
–V
REF
PIN DESIGNATIONS
LCC
S
REF
+V
OVERFLOW INH
DIGITAL –V
HYSTERESIS
DIGITAL GROUND
OVERFLOW
28 271
3426
2
5 6
7 8 9
10 11
AD9002
TOP VIEW
(Not to Scale)
12
13 14 15 16 17 18
S
MID
D1(LSB)
REF
DIGITAL –V
DIGITAL GROUND
–4–
D3
D2
D8(MSB)
25 24
23 22
21 20 19
D4
D7 D6
DIGITAL GROUND ANALOG –V
ANALOG –V DIGITAL
GROUND D5
OVERFLOW
DIGITAL –V
S
OVERFLOW INH
S
HYSTERESIS
D8(MSB)
DIGITAL
GROUND
+V
REF
JLCC
D7
D6
25 24 23 22 21 20 19
26 27 28
S
1
TOP VIEW
(Not to Scale)
2 3 4
5 6 7 8 9 10 11
ANALOG INPUT
ANALOG GROUND
S
S
DIGITAL GROUND
ANALOG –V
ANALOG –V
DIGITAL GROUND
AD9002
TOP VIEW
(Not to Scale)
ENCODE
ENCODE
ANALOG INPUT
ANALOG GROUND
D5
D4
18 17
D3
16
D2
15
D1(LSB)
14
DIGITAL –V DIGITAL
13
GROUND
12
REF
REF
–V
REV. D
S
MID
Page 5
AD9002
OVERFLOW
ANALOG
INPUT
ANALOG
GROUND
ENCODE
ENCODE
ANALOG GROUND
ANALOG
INPUT
–V
REF
REF
MID
DIGITAL
GROUND
DIGITAL
–V
S
D1 (LSB)
D2
D3
D4
D5
DIGITAL GROUND
ANALOG –V
S
DIGITAL GROUND
D6
D7
D8
(MSB)
DIGITAL –V
S
DIGITAL
GROUND
OVERFLOW
INHIBIT
HYSTERESIS
+V
REF
ENCODE
ENCODE
AD9002
–5.2V
ANALOG
INPUT
ENCODE
OUTPUT
DATA
ANALOG
INPUT
N + 1
N
APERTURE
DELAY
t
PD
N – 1
N
N + 2
N + 1
Figure 1. Timing Diagram
+V
AD9002
REF
R
AD9002
R/2
REF
–5.2V
–5.2V
COMPARATOR CELLS
–5.2V
–5.2V
R/2
R
–V
REF
MID
DIGITAL
OUTPUT
Figure 2. Input/Output Circuits
REV. D
0.1mF
–V
HYSTERESIS
100V
AD1
1kV
AD2
1kV
AD3
–2V
0.1mF
STATIC BURN IN
AD1 = 0V AD2 = ECL HIGH AD3 = ECL LOW
DYNAMIC BURN IN
AD1
AD2
AD3
ALL RESISTORS 6 5%, V ALL CAPACITORS 6 20%, mF ALL SUPPLIES 6 5%
OVERFLOW INH
ANALOG IN ENCODE
ENCODE
–V
REF
+V
REF
GROUND
S
AD9002
Figure 3. Burn-in Diagram
OVERFLOW
1kV 1kV
D8
1kV
D7
1kV
D6
1kV
D5
1kV
D4
1kV
D3
1kV
D2
1kV
D1
ECL HIGH ECL LOW
ECL HIGH ECL LOW
0V
–2V
–5.2V
Figure 4. Die Layout and Mechanical Information
Die Dimensions . . . . . . . . . . . . . . . . . 106 × 114 × 15 (±2) mils
Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 × 4 mils
Metalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gold
Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None
Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –V
S
Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Nitride
Die Attach . . . . . . . . . . . . . . . . . . . . . Gold Eutectic (Ceramic)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Epoxy (Plastic)
Bond Wire . . . . . . . . . . . . . 1-1.3 mil Gold; Gold Ball Bonding
–5–
Page 6
AD9002
100V
2N3906
OVERFLOW D8 (MSB) D7 D6 D5 D4 D3 D2 D1 (LSB)
–5.2D
–5.2A
0.01mF0.1mF
0.1mF0.01mF
ENCODE
ENCODE
A
IN
A
IN
–V
REF+VREF
0.1mF
10V
0.1mF
AD741
AD9611
AD96685
40V
AD9002
EQUAL
DISTANCE
50V
ENCODE
INPUT
(GROUND
THRESHOLD)
ANALOG
INPUT
(0V TO +2V)
1kV
4kV
–15V
1.5kV
50V
NYQUEST
FILTER
APPLICATION INFORMATION
The AD9002 is compatible with all standard ECL logic families, including 10K and 10KH. 100K ECL’s logic levels are tempera­ture compensated, and are therefore compatible with the AD9002 (and most other ECL device families) only over a limited temperature range. To operate at the highest encode rates, the supporting logic around the AD9002 will need to be equally fast. Whichever of the ECL logic families is used, special care must be exercised to keep digital switching noise away from the analog circuits around the AD9002. The two most critical items are digital supply lines and digital ground return.
The input capacitance of the AD9002 is an exceptionally low 17 pF. This allows the use of a wide range of input amplifiers, both hybrid and monolithic. To take full advantage of the wide input bandwidth of the AD9002, a hybrid amplifier such as the AD9610 will be required. For those applications that do not require the full input bandwidth of the AD9002, more tradi­tional monolithic amplifiers, such as the AD846, will work very well. Overall performance with any amplifier can be improved
by inserting a 10 resistor in series with the amplifier output.
The output data is buffered through the ECL compatible output latches. All data is delayed by one clock cycle, in addition to the latch propagation delay (t
), before becoming available at the
PD
outputs. Both the analog-to-digital conversion cycle and the data transfer to the output latches are triggered on the rising edge of the differential, ECL compactible ENCODE signal (see timing diagram). In applications where only a single-ended signal is available, the AD96685, a high speed, ECL voltage comparator, can be employed to generate the differential sig­nals. All ECL signals (including the overflow bit) should be terminated properly to avoid ringing and reflection.
The AD9002 also incorporates a HYSTERESIS control pin which provides from 0 mV to 10 mV of additional hysteresis in the comparator input stages. Adjustments in the HYSTERESIS control voltage may help improve noise immunity and overall performance in harsh environments.
The OVERFLOW INHIBIT pin of the AD9002 determines
how the converter handles overrange inputs (AIN ≥ +V
REF
). In the “enabled” state (floating at –5.2 V), the OVERFLOW out­put will be at logic HIGH and all other outputs will be at logic LOW for overrange inputs (return-to-zero operation). In the “inhibited” state (tied to ground), the OVERFLOW output will be at logic LOW, and all other outputs will be at logic HIGH for overrange inputs (nonreturn-to-zero operation).
The AD9002 provides outstanding error rate performance. This is due to tight control of comparator offset matching and a fault tolerant decoding stage. Additional improvements in error rate are possible through the addition of hysteresis (see HYSTER­ESIS control pin). This level of performance is extremely im­portant in fault-sensitive applications such as digital radio (QAM).
Dramatic improvements in comparator design and construction give the AD9002 excellent dynamic characteristics, especially SNR (signal-to-noise ratio). The 160 MHz input bandwidth and low error rate performance give the AD9002 an SNR of 48 dB with a 1.23 MHz input. High SNR performance is par­ticularly important in wide bandwidth applications, such as pulse signature analysis, commonly performed in advanced radar receivers.
–6–
LAYOUT SUGGESTIONS
Designs using the AD9002, like all high speed devices, must follow a few basic layout rules to insure optimum performance. Essentially, these guidelines are meant to avoid many of the problems associated with high speed designs. The first require­ment is for a substantial ground plane around and under the AD9002. Separate ground plane areas for the digital and analog components may be useful, but these separate grounds should be connected together at the AD9002 to avoid the effects of “ground loop” currents.
The second area that requires an extra degree of attention in­volves the three reference inputs, +V The +V
input and the –V
REF
input should both be driven
REF
from a low impedance source (note that the +V
REF
, REF
MID
REF
, and –V
input is
REF
.
typically tied to analog ground). A low drift amplifier should provide satisfactory results, even over an extended temperature range. Adjustments at the REF
input may be useful in im-
MID
proving the integral linearity by correcting any reference ladder skews. The application circuit shown below demonstrates a simple and effective means of driving the reference circuit.
The reference inputs should be adequately decoupled to ground
through 0.1 µF chip capacitors to limit the effects of system
noise on conversion accuracy. The power supply pins must also
be decoupled to ground to improve noise immunity; 0.1 µF and
0.01 µF chip capacitors are recommended.
The analog input signal is brought into the AD9002 through two separate input pins. It is very important that the two input pins be driven symmetrically with equal length electrical con­nections. Otherwise, aperture delay errors may degrade con­verter performance at high frequencies.
Figure 5. Typical Application
REV. D
Page 7
AD9002
ANALOG INPUT
50V
3.9kV
0.1mF
–15V
ENCODE INPUT (GROUND THRESHOLD)
50V
*CONTACT FACTORY ABOUT EVALUATION BOARD AVAILABILITY
1kV
10mF
50V
2kV
–5.2V
HOS200
AD96687
1kV
AD96687
75V
625V
–5.2V
1kV
4.3kV
AD741
A
EQUAL
DISTANCE
A
ENCODE
ENCODE
OVERFLOW
INH
HYSTERESIS
0.1mF
0.01mF
510V
13kV
LINEARITY OUTPUT (ERROR WAVEFORM)
HOS100
90V20V90V
+V
0.1mF
1kV
REF
OVERFLOW D8(MSB) D7
D6 D5
D4 D3 D2
D1(LSB)
–15V
150V
0.1mF
2N3906
0.1mF0.01mF
–V
REF
REF
IN
IN
MID
AD9002*
–5.2A
–5.2D
0.1mF
0.01mF
HOS100
REGISTER
100151
50V
AD96687
AD96687
1kV
–15V
DELAY
880V
0.1mF –5.2V
510V
1kV
13kV
–15V
Figure 6. AD9002 Evaluation Circuit
RECONSTRUCTED
OUTPUT
3.75V
AD9768
DAC
DELAY
880V
LINE
DRIVER
100114
NOTE: 100114 LINE DRIVER OUTPUTS REQUIRE 510V PULL-DOWN RESISTORS TO –5.2V. ALL OTHER ECL OUTPUTS SHOULD BE TERMINATED TO –2V WITH 100V RESISTERS, UNLESS OTHERWISE SPECIFIED. RESISTORS ARE IN V. CAPACITORS ARE IN mF.
37 PIN
D
CONNECTOR
REV. D
65
60
55
50
45
40
AND HARMONIC LEVELS (–dBc)
RMS SIGNAL-TO-NOISE RATIO (dB)
35
30
1MHz
ANALOG INPUT FREQUENCY (0.1dB BELOW FULL SCALE)
3RD HARMONIC
SNR
125 MSPS ENCODE RATE
2ND HARMONIC
10MHz
Figure 7. Dynamic Performance
–7–
100MHz
Page 8
AD9002
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
28-Lead Ceramic Side-Brazed DIP
(D-28)
0.005 (0.13) MIN
0.200 (5.08) MAX
0.200 (5.08)
0.125 (3.18)
0.458 (11.63)
0.442 (11.23) SQ
TOP
VIEW
0.098 (2.49) MAX
28
114
PIN 1
1.490 (37.85) MAX
0.023 (0.58)
0.014 (0.36)
0.110 (2.79)
0.090 (2.29)
15
0.070 (1.78)
0.030 (0.76)
0.310 (7.87)
0.220 (5.59)
0.060 (1.52)
0.015 (0.38)
0.150 (3.81) MIN
SEATING PLANE
0.606 (15.4)
0.58 (14.74)
0.015 (0.38)
0.008 (0.20)
28-Lead Ceramic Leadless Chip Carrier
(E-28A)
0.300 (7.62)
0.100 (2.54)
0.064 (1.63)
0.458
(11.63)
MAX
SQ
0.088 (2.24)
0.054 (1.37)
0.095 (2.41)
0.075 (1.90)
0.011 (0.28)
0.007 (0.18) R TYP
0.075
(1.91)
REF
0.055 (1.40)
0.045 (1.14)
0.075 (1.91)
REF
BSC
0.150 (3.51)
BSC
26
28
25
BOTTOM
VIEW
19
18
4
5
1
12
11
0.200 (5.08) BSC
0.015 (0.38) MIN
0.028 (0.71)
0.022 (0.56)
0.050 (1.27) BSC
458 TYP
C1043d–0–11/99
BOTTOM VIEW
0.022 60.003
(0.559 60.076)
0.050
(1.27)
BSC
28-Leaded JLCC
(J-28)
0.450 60.006
(11.43 60.152)
25 19
26
PIN 1
TOP VIEW
(PINS DOWN)
4
5
0.488 60.010
(11.43 60.254)
–8–
SQ
SQ
11
18
12
0.300 (7.62)
TYP
0.171 (4.34) MAX
0.102 60.010
(1.448 60.254)
0.039 60.005
(0.991 60.127)
0.028 60.002
(0.711 60.051)
0.420 60.010
(10.668 60.254)
0.019 60.002
(0.483 60.051)
0.006 60.0006 (0.152 60.015)
PRINTED IN U.S.A.
REV. D
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