7.5 dB to 55.5 dB in HI gain mode
Low output-referred noise: 48 nV/√Hz typical
Active input impedance matching
Optimized for 10-bit/12-bit ADCs
Selectable output clamping level
Single 5 V supply operation
AD8332 and AD8334 available in lead frame chip scale package
APPLICATIONS
Ultrasound and sonar time-gain controls
High performance automatic gain control (AGC) systems
I/Q signal processing
High speed, dual ADC drivers
GENERAL DESCRIPTION
The AD8331/AD8332/AD8334 are single-, dual-, and quadchannel, ultralow noise linear-in-dB, variable gain amplifiers
(VGAs). Optimized for ultrasound systems, they are usable as a
low noise variable gain element at frequencies up to 120 MHz.
Included in each channel are an ultralow noise preamp (LNA),
an X-AMP® VGA with 48 dB of gain range, and a selectable gain
postamp with adjustable output limiting. The LNA gain is 19 dB
with a single-ended input and differential outputs. Using a single
resistor, the LNA input impedance can be adjusted to match a
signal source without compromising noise performance.
The 48 dB gain range of the VGA makes these devices suitable
for a variety of applications. Excellent bandwidth uniformity is
maintained across the entire range. The gain control interface
provides precise linear-in-dB scaling of 50 dB/V for control
voltages between 40 mV and 1 V. Factory trim ensures excellent
part-to-part and channel-to-channel gain matching.
IN
AD8331/AD8332/AD8334
FUNCTIONAL BLOCK DIAGRAM
INH
LMD
LNA
19dB
VCM
BIAS
IPLOPLON
–
48dB
ATTENUATO R
+
VGA BIAS AND
INTERPOLATOR
CM
V
MID
21dB
CONTROL
INTERFACE
3.5dB O R 15.5dB
GAIN
AD8331/AD8332/AD8334
GAIN
ENB
Figure 1. Signal Path Block Diagram
60
50
40
30
20
GAIN (dB)
10
0
–10
100k1M10M100M1G
V
= 1V
GAIN
V
= 0.8V
GAIN
V
= 0.6V
GAIN
V
= 0.4V
GAIN
V
= 0.2V
GAIN
V
= 0V
GAIN
FREQUENCY (Hz)
Figure 2. Frequency Response vs. Gain
Differential signal paths result in superb second- and thirdorder distortion performance and low crosstalk.
The low output-referred noise of the VGA is advantageous in
driving high speed differential ADCs. The gain of the postamp
can be pin selected to 3.5 dB or 15.5 dB to optimize gain range
and output noise for 12-bit or 10-bit converter applications. The
output can be limited to a user-selected clamping level, preventing
input overload to a subsequent ADC. An external resistor adjusts
the clamping level.
The operating temperature range is −40°C to +85°C. The
AD8331 is available in a 20-lead QSOP package, the AD8332 is
available in 28-lead TSSOP and 32-lead LFCSP packages, and
the AD8334 is available in a 64-lead LFCSP package.
PA
CLAMP
HI GAIN
MODE
HIL
VOH
VOL
RCLMP
03199-002
03199-001
Rev. G
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Exposed pad soldered to board, nine thermal vias in pad—JEDEC, 4-layer
board J-STD-51-9.
3
Exposed pad soldered to board, 25 thermal vias in pad—JEDEC, 4-layer
board J-STD-51-9.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. G | Page 7 of 56
AD8331/AD8332/AD8334
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
LMD
INH
VPSL
LON
LOP
COML
VIP
VIN
MODE
GAIN
1
2
3
4
5
6
(Not to Scale)
7
8
9
10
PIN 1
INDICATO R
AD8331
TOP VIEW
20
19
18
17
16
15
14
13
12
11
COMM
ENBL
ENBV
COMM
VOL
VOH
VPOS
HILO
RCLMP
VCM
03199-003
Figure 3. 20-Lead QSOP Pin Configuration (AD8331)
Table 3. 20-Lead QSOP Pin Function Description (AD8331)
Pin No. Mnemonic Description
1 LMD LNA Midsupply Bypass Pin; Connect a Capacitor for Midsupply HF Bypass
2 INH LNA Input
3 VPSL LNA 5 V Supply
4 LON LNA Inverting Output
5 LOP LNA Noninverting Output
6 COML LNA Ground
7 VIP VGA Noninverting Input
8 VIN VGA Inverting Input
9 MODE Gain Slope Logic Input
10 GAIN Gain Control Voltage
11 VCM Common-Mode Voltage
12 RCLMP Output Clamping Level
13 HILO Gain Range Select (HI or LO)
14 VPOS VGA 5 V Supply
15 VOH Noninverting VGA Output
16 VOL Inverting VGA Output
17 COMM VGA Ground
18 ENBV VGA Enable
19 ENBL LNA Enable
20 COMM VGA Ground
27 GAIN34 Gain Control Voltage for CH3 and CH4.
28 CLMP34 Output Clamping Level Input for CH3 and CH4.
29 HILO Gain Select for Postamp 0 dB or 12 dB.
30 VCM4 CH4 Common-Mode Voltage—AC Bypass.
31 VCM3 CH3 Common-Mode Voltage—AC Bypass.
32 NC No Connect.
33 COM34 VGA Ground CH3 and CH4.
34 VOH4 CH4 Positive VGA Output.
35 VOL4 CH4 Negative VGA Output.
36 VPS34 VGA Supply 5 V CH3 and CH4.
37 VOL3 CH3 Negative VGA Output.
38 VOH3 CH3 Positive VGA Output.
39 COM34 VGA Ground CH3 and CH4.
40 NC No Connect.
41 MODE Gain Control Slope, Logic Input, 0 = Positive.
42 COM12 VGA Ground CH1 and CH2.
43 VOH2 CH2 Positive VGA Output.
44 VOL2 CH2 Negative VGA Output.
45 VPS12 CH2 VGA Supply 5 V CH1 and CH2.
46 VOL1 CH1 Negative VGA Output.
47 VOH1 CH1 Positive VGA Output.
48 COM12 VGA Ground CH1 and CH2.
49 VCM2 CH2 Common-Mode Voltage—AC Bypass.
50 VCM1 CH1 Common-Mode Voltage—AC Bypass.
51 EN34 Shared LNA/VGA Enable CH3 and CH4.
52 EN12 Shared LNA/VGA Enable CH1 and CH2.
53 CLMP12 Output Clamping Level Input CH1 and CH2.
54 GAIN12 Gain Control Voltage CH1 and CH2.
55 VPS1 CH1 LNA Supply 5 V.
56 VIN1 CH1 VGA Negative Input.
57 VIP1 CH1 VGA Positive Input.
58 LOP1 CH1 LNA Positive Output.
59 LON1 CH1 LNA Feedback Output (for RIZ).
60 NC Not Connected.
61 LMD1 CH 1 LNA Midsupply Pin; Connect a Capacitor for Midsupply HF Bypass.
62 INH1 CH1 LNA Input.
63 COM1 CH1 LNA Ground.
64 COM2 CH2 LNA Ground.
EPAD
The exposed paddle must be soldered to the PCB ground to ensure proper heat dissipation,
noise, and mechanical strength benefits.
Rev. G | Page 11 of 56
AD8331/AD8332/AD8334
TYPICAL PERFORMANCE CHARACTERISTICS
TA = 25°C, VS = 5 V, RL = 500 Ω, RS = RIN = 50 Ω, RIZ = 280 Ω, CSH = 22 pF, f = 10 MHz, R
−4.5 dB to +43.5 dB gain (HILO = LO), and differential output voltage, unless otherwise specified.
60
50
40
30
20
GAIN (dB)
10
0
–10
00.20.40.60.81.0 1.1
Figure 7. Gain vs. V
ASCENDING GAIN MODE
DESCENDI NG GAI N MODE
(WHERE AVAILABLE)
GAIN
HILO = HI
HILO = LO
V
(V)
GAIN
and MODE (MODE Available on RU Package)
2.0
1.5
1.0
0.5
0
–0.5
GAIN ERROR (dB)
–1.0
–1.5
–2.0
00.20.40.60.81.0 1.1
Figure 8. Absolute Gain Error vs. V
2.0
1.5
1.0
0.5
0
–0.5
GAIN ERROR (dB)
–1.0
–1.5
–2.0
00.20.40.60.81.0 1.1
Figure 9. Absolute Gain Error vs. V
1MHz
–40°C
10MHz
V
GAIN
30MHz
50MHz
70MHz
V
GAIN
(V)
at Three Temperatures
GAIN
(V)
at Various Frequencies
GAIN
03199-007
+25°C
+85°C
03199-008
03199-009
50
40
30
20
PERCENT OF UNI TS (%)
10
0
–0.5 –0.4 –0.3 –0.2 –0.100. 1 0.20.3 0.40.5
25
20
15
10
5
0
25
20
15
PERCENT OF UNI TS (%)
10
5
0
Figure 11. Gain Match Histogram for V
50
40
30
20
10
GAIN (dB)
0
–10
–20
100k1M10M100M500M
Figure 12. Frequency Response for Various Values of V
= ∞, CL = 1 pF, VCM pin floating,
CLMP
SAMPLE SIZE = 80 UNITS
V
= 0.5V
GAIN
Figure 10. Gain Error Histogram
SAMPLE SIZE = 50 UNITS
V
= 0.2V
GAIN
V
= 0.7V
GAIN
–0.17
–0.15
–0.13
–0.11
–0.09
CHANNEL TO CHANNEL G AIN MATCH (d B)
GAIN ERROR (dB)
–0.07
–0.05
–0.03
–0.01
V
= 1V
GAIN
V
= 0.8V
GAIN
V
= 0.6V
GAIN
V
= 0.4V
GAIN
V
= 0.2V
GAIN
V
= 0V
GAIN
FREQUENCY (Hz)
03199-010
03199-011
0.01
0.03
0.05
0.07
0.09
0.11
0.13
0.15
0.17
0.19
0.21
= 0.2 V and 0.7 V
GAIN
03199-012
GAIN
Rev. G | Page 12 of 56
AD8331/AD8332/AD8334
60
50
40
30
20
GAIN (dB)
10
0
V
V
V
V
V
V
GAIN
GAIN
GAIN
GAIN
GAIN
GAIN
= 1V
= 0.8V
= 0.6V
= 0.4V
= 0.2V
= 0V
0
V
= 1V p-p
OUT
–20
V
= 1.0V
GAIN
V
V
GAIN
GAIN
= 0.7V
= 0.4V
–40
–60
CROSSTALK (d B)
–80
–100
AD8332
AD8334
–10
100k1M10M100M500M
FREQUENCY (Hz)
Figure 13. Frequency Response for Various Values of V
, HILO = HI
GAIN
03199-013
30
V
= 0.5V
GAIN
20
10
0
GAIN (dB)
–10
–20
–30
100k1M10M100M500M
= RS = 75
R
IN
RIN = RS = 100
= RS = 200
R
IN
R
= RS = 500
IN
R
FREQUENCY (Hz)
= RS = 1k
IN
RIN = RS = 50
03199-014
Figure 14. Frequency Response for Various Matched Source Impedances
30
V
= 0.5V
GAIN
R
=
IZ
20
10
0
GAIN (dB)
–10
–20
–30
100k1M10M100M500M
Figure 15. Frequency Response, Unterminated LNA, R
FREQUENCY (Hz)
= 50 Ω
S
03199-015
–120
100k1M10M100M
FREQUENCY (Hz)
03199-016
Figure 16. Channel-to-Channel Crosstalk vs.
Frequency for Various Values of V
50
45
40
35
30
1µF
25
COUPLING
20
GROUP DELAY (ns)
15
10
5
0
100k1M10M100M
0.1µF
COUPLING
FREQUENCY (Hz)
GAIN
03199-017
Figure 17. Group Delay vs. Frequency for Two Values of AC Coupling
20
HI GAIN
10
0
–10
–20
20
LO GAIN
10
OFFSET VOLTAGE (mV)
0
–10
–20
00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
V
GAIN
(V)
T = +85°C
T = +25°C
T = –40°C
T = +85°C
T = +25°C
T = –40°C
03199-018
Figure 18. Representative Differential Output Offset Voltage vs.
at Three Temperatures
V
GAIN
Rev. G | Page 13 of 56
AD8331/AD8332/AD8334
R
IN
R
IZ
= 100,
= 549
50j
–50j
RIN = 50,
R
IZ
R
= 200,
IN
R
= 1.1k
IZ
R
= 200
IN
R
IN
= 270
= 500
= 1k
R
IN
f
= 100kHz
RIN = 50
100j
–100j
IZ
R
= 100
IN
03199-022
35
30
25
20
15
% TOTAL
10
5
0
SAMPLE SIZE = 100
0.2V < V
49.650.550.450.350.250. 150. 049.949.849.7
< 0.7V
GAIN
GAIN SCALING FACTOR
Figure 19. Gain Scaling Factor Histogram
100
SINGLE ENDE D, PIN VOH O R PIN VOL
R
=
L
10
1
OUTPUT IMPEDANCE ()
03199-019
25j
R
= 6k,
IN
R
=
IZ
017
RIN = 75,
R
= 412
IZ
–25j
Figure 22. Smith Chart, S11 vs. Frequency,
0.1 MHz to 200 MHz for Various Values of R
20
VIN = 10mV p-p
15
10
5
0
GAIN (dB)
–5
0.1
100k100M10M1M
Figure 20. Output Impedance vs. Frequency
10k
1k
100
INPUT IMPE DANCE ()
RIZ = 6.65k, CSH = 0pF
R
10
R
100k100M10M1M
Frequency for Various Values of R
FREQUENCY (Hz)
= , CSH = 0pF
R
IZ
= 3.01k, CSH = 0pF
IZ
= 1.1k, CSH = 1.2pF
IZ
FREQUENCY (Hz)
= 549, CSH = 8.2pF
R
IZ
= 412, CSH = 12pF
R
IZ
= 270, CSH = 22pF
R
IZ
Figure 21. LNA Input Impedance vs.
and CSH
IZ
–10
R
= 75
03199-020
–15
100k1M10M100M500M
FREQUENCY (Hz)
IN
03199-023
Figure 23. LNA Frequency Response, Single-Ended, for Various Values of RIN
20
15
RIZ =
10
5
0
GAIN (dB)
–5
–10
03199-021
–15
100k1M10M100M500M
FREQUENCY (Hz)
03199-024
Figure 24. Frequency Response for Unterminated LNA, Single-Ended
Rev. G | Page 14 of 56
AD8331/AD8332/AD8334
500
f
= 10MHz
400
300
200
100
OUTPUT-REF ERRED NOISE ( nV/ Hz)
0
HI GAIN
LO GAIN
00.20.40.60.81.0
AD8332
AD8334
AD8331
V
GAIN
(V)
Figure 25. Output-Referred Noise vs. V
2.5
RS = 0, RIZ = , V
HILO = L O OR HI
2.0
GAIN
= 1V,
03199-025
GAIN
1.00
RS = 0, RIZ =,
V
= 1V, f = 10M Hz
GAIN
0.95
0.90
0.85
0.80
0.75
0.70
0.65
0.60
INPUT-REFERRE D NOISE (n V/ Hz)
0.55
0.50
–50–30–101030507090
TEMPERATURE ( °C)
Figure 28. Short-Circuit, Input-Referred Noise vs. Temperature
10
f = 5MHz, RIZ =,
= 1V
V
GAIN
03199-028
1.5
1.0
INPUT-REFERRED NOISE (nV/ Hz)
0.5
100k1M10M100M
FREQUENCY (Hz)
Figure 26. Short-Circuit, Input-Referred Noise vs. Frequency
100
10
1
INPUT-REFERRED NOISE (nV/ Hz)
0.1
00.20.40.60.81.0
RS = 0, RIZ =,
HILO = LO OR HI, f = 10MHz
V
(V)
GAIN
Figure 27. Short-Circuit, Input-Referred Noise vs. V
GAIN
1
R
THERMAL NOISE
S
INPUT-REFERRE D NOISE (n V/ Hz)
03199-026
0.1
1101001k
SOURCE RESIST ANCE ()
Figure 29. Input-Referred Noise vs. R
ALONE
03199-029
S
7
INCLUDES NOISE OF VGA
6
5
4
3
NOISE FI GURE (dB)
2
1
03199-027
SIMULATED RESULTS
0
501001k
Figure 30. Noise Figure vs. RS for Various Values of R
R
= 50
IN
R
= 75
IN
= 100
R
IN
= 200
R
IN
R
=
IZ
SOURCE RESIST ANCE ()
03199-030
IN
Rev. G | Page 15 of 56
AD8331/AD8332/AD8334
–
–
–
35
30
25
20
15
NOISE FI GURE (dB)
10
HILO = LO, RIN = 50
HILO = LO, R
5
HILO = HI, RIN = 50
HILO = HI, R
0
0 0.10.20.30.40.50.60.70.80.91.01.1
30
25
20
15
10
NOISE FI GURE (dB)
5
f = 10MHz, RS = 50
0
1015202530354045505560
0
G = 30dB
V
= 1Vp-p
OUT
–10
–20
–30
–40
–50
–60
–70
HARMONIC DISTORTION (dBc)
–80
–90
1M10M100M
Figure 33. Harmonic Distortion vs. Frequency
=
IZ
=
Iz
V
(V)
GAIN
Figure 31. Noise Figure vs. V
GAIN (dB)
Figure 32. Noise Figure vs. Gain
FREQUENCY (Hz)
f = 10MHz, RS = 50PREAMP LIMITED
GAIN
HILO = LO, R
HILO = LO, R
HILO = HI, RIN = 50
HILO = HI, R
HILO = HI, HD2
HILO = HI, HD3
HILO = LO, HD2
HILO = LO, HD3
FB
IN
FB
=
= 50
=
30
f = 10MHz,
V
= 1V p-p
OUT
–40
–50
–60
–70
HARMONIC DIST ORTION (dBc)
–80
03199-031
–90
0200018001600140012001000800600400200
HILO = HI , HD2
HILO = HI , HD3
R
LOAD
Figure 34. Harmonic Distortion vs. R
40
f = 10MHz,
V
= 1V p-p
HARMONIC DISTORTION (dBc)
03199-032
OUT
–50
–60
–70
–80
–90
0 10203040
HILO = LO, HD3
HILO = HI, HD2
C
LOAD
Figure 35. Harmonic Distortion vs. C
20
f = 10MHz,
GAIN = 30d B
–40
HILO = L O, HD2
–60
HILO = HI, HD2
–80
HARMONIC DISTORTION (dBc)
–100
01234
03199-113
V
(V p-p)
OUT
HILO = L O, HD2
HILO = L O, HD3
03199-034
()
LOAD
HILO = L O, HD2
HILO = HI, HD3
03199-035
50
(pF)
LOAD
HILO = LO, HD3
HILO = HI , HD3
03199-036
Figure 36. Harmonic Distortion vs. Differential Output Voltage
Rev. G | Page 16 of 56
AD8331/AD8332/AD8334
0
V
= 1V p-p
OUT
–20
INPUT RANGE
LIMITED WHEN
–40
HILO = LO
–60
–80
DISTORTION (dBc)
–100
–120
00. 1 0.20.3 0.40.5 0.6 0.70.8 0.9 1. 0
HILO = HI, HD3
HILO = L O, HD2
V
(V)
GAIN
Figure 37. Harmonic Distortion vs. V
HILO = L O, HD3
HILO = HI, HD2
, f = 1 MHz
GAIN
0
V
= 1V p-p
OUT
–20
INPUT RANGE
LIMITED WHEN
–40
HILO = LO
–60
HILO = LO, HD2
HILO = L O, HD3
03199-037
0
V
= 1V p-p COMPOSITE (
OUT
G = 30dB
–10
–20
–30
–40
–50
IMD3 (dBc)
–60
–70
–80
–90
1M10M100M
f
+
f
)
1
2
FREQUENCY (Hz)
HILO = LO
HILO = HI
Figure 40. IMD3 vs. Frequency
40
10MHz HILO = HI
35
30
25
20
1MHz HILO = HI
1MHz HILO = LO
10MHz HILO = LO
03199-040
–80
DISTORTION (dBc)
HILO = HI , HD3
–100
–120
00. 1 0.20.3 0.40.5 0.6 0.70.8 0.9 1. 0
V
GAIN
(V)
Figure 38. Harmonic Distortion vs. V
HILO = HI, HD2
, f = 10 MHz
GAIN
10
0
f = 10MHz
–10
–20
IP1dB COMPRESSION (d Bm)
–30
–40
00. 1 0.20.3 0.40.5 0.6 0.70.8 0.9 1. 0
HILO = HI
V
GAIN
Figure 39. IP1dB Compression vs. V
HILO = LO
(V)
GAIN
15
OUTPUT I P3 (dBm)
10
5
V
= 1V p-p COMPOSITE (
03199-038
0
010.90.80.70.60.50.40.30.20.1
OUT
Figure 41. Output Third-Order Intercept (IP3) vs. V
V
GAIN
f
+
f
)
1
2
(V)
GAIN
03199-041
.0
2mV
100
90
10
0
50mV10n s
03199-039
3199-042
Figure 42. Small Signal Pulse Response, G = 30 dB,
Top: Input, Bottom: Output Voltage, HILO = HI or LO
Rev. G | Page 17 of 56
AD8331/AD8332/AD8334
20mV
100
90
10
0
500mV10ns
Figure 43. Large Signal Pulse Response, G = 30 dB,
HILO = HI or LO, Top: Input, Bottom: Output Voltage
2
G = 30dB
1
INPUT
(V)
0
OUT
V
CL = 0pF
CL = 10pF
CL = 22pF
CL = 47pF
5.0
4.5
4.0
3.5
3.0
2.5
(V p-p)
OUT
2.0
V
1.5
1.0
3199-043
0.5
0
0545403530252015105
4
G = 40dB
3
2
1
INPUT
(V)
0
OUT
V
–1
HILO = HI
HILO = LO
R
(k)
CLMP
Figure 46. Clamp Level vs. R
R
= 48.1k
CLMP
R
= 16.5k
CLMP
R
= 7.15k
CLMP
R
= 2.67k
CLMP
03199-046
0
CLMP
–1
INPUT IS NOT TO SCALE
–2
–5050403020100–10–20–30–40
TIME (ns)
Figure 44. Large Signal Pulse Response for Various Capacitive Loads,
= 0 pF, 10 pF, 20 pF, 50 pF
C
L
500mV
200mV400ns
3199-045
Figure 45. Pin GAIN Transient Response,
Top: V
, Bottom: Output Voltage
GAIN
–2
–3
03199-044
–4
–30–20–100 1020304050607080
TIME (ns)
Figure 47. Clamp Level Pulse Response for Four Values of R
03199-047
CLMP
200mV
100
90
10
0
Figure 48. LNA Overdrive Recovery, V
= 0.27 V VGA Output Shown
V
GAIN
100ns
0.05 V p-p to 1 V p-p Burst,
INH
3199-048
Rev. G | Page 18 of 56
AD8331/AD8332/AD8334
1V
100
90
10
0
Figure 49. VGA Overdrive Recovery, V
= 1 V VGA Output Shown Attenuated by 24 dB
V
GAIN
1V
100
90
10
0
Figure 50. VGA Overdrive Recovery, V
= 1 V VGA Output Shown Attenuated by 24 dB
V
GAIN
2V
200mV1ms
Figure 51. Enable Response, Top: V
100ns
4 mV p-p to 70 mV p-p Burst,
INH
100ns
4 mV p-p to 275 mV p-p Burst,
INH
, Bottom: V
ENB
OUT
, V
= 30 mV p-p
INH
2V
3199-049
1V1ms
3199-052
Figure 52. Enable Response, Large Signal,
, Bottom: V
Top: V
ENB
0
–10
–20
–30
–40
PSRR (dB)
–50
–60
–70
3199-050
–80
100k1M10M100M
VPSV, V
GAIN
, V
= 150 mV p-p
OUT
INH
VPS1, V
= 0.5V
FREQUENCY (Hz)
GAIN
VPS1, V
= 0.5V
GAIN
= 0V
03199-053
Figure 53. PSRR vs. Frequency (No Bypass Capacitor)
140
V
= 0.5V
GAIN
130
120
110
100
90
80
70
60
50
40
QUIESCENT SUPPLY CURRENT (mA)
3199-051
30
20
–40100806040200–20
AD8334
AD8332
AD8331
03199-054
TEMPERATURE ( °C)
Figure 54. Quiescent Supply Current vs. Temperature
Rev. G | Page 19 of 56
AD8331/AD8332/AD8334
*
R
TEST CIRCUITS
MEASUREMENT CONSIDERATIONS
Figure 55 through Figure 68 show typical measurement
configurations and proper interface values for measurements
with 50 Ω conditions.
Short-circuit input noise measurements are made as shown in
Figure 62. The input-referred noise level is determined by
FB*
120nH
22pF
FERRITE BEAD
Figure 55. Test Circuit—Gain and Bandwidth Measurements
NETWORK ANALYZE
0.1µF
5050
18nF
270
0.1µF
INH
DUT
0.1µF
0.1µF
LMD
NETWORK ANALYZER
dividing the output noise by the numerical gain between Point A
and Point B and accounting for the noise floor of the spectrum
analyzer. The gain should be measured at each frequency of
interest and with low signal levels because a 50 Ω load is driven
directly. The generator is removed when noise measurements
are made.
INOUT
237
28
237
28
1:1
3199-055
5050
INOUT
10k
18nF
0.1µF
237
FB*
120nH
22pF
0.1µF
0.1µF
INH
LMD
DUT
VGN
0.1µF
237
28
28
1:1
03199-056
10k
*FERRITE BEAD
Figure 56. Test Circuit—Frequency Response for Various Matched Source Impedances
FB*
120nH
22pF
*FERRITE BEAD
Figure 57. Test Circuit—Frequency Response for Unterminated LNA, R
NETWORK ANALYZ ER
0.1µF
INH
LMD
0.1µF
DUT
0.1µF
VGN
5050
0.1µF
INOUT
237
237
28
28
1:1
03199-057
= 50 Ω
S
Rev. G | Page 20 of 56
AD8331/AD8332/AD8334
K
*
FB*
120nH
22pF
*FERRITE BEAD
NETWORK ANALYZ ER
18nF
0.1µF
OR
1µF
10k
INH
0.1µF
LNA
LMD
5050
0.1µF
OR
1µF
0.1µF
OR
1µF
INOUT
0.1µF
237
0.1µF
237
28
28
1:1
03199-058
VGA
Figure 58. Test Circuit—Group Delay vs. Frequency for Two Values of AC Coupling
18nF
INH
270
DUT
LMD
0.1µF
0.1µF
0.1µF
237
237
28
28
1:1
50
03199-059
NETWORK
ANALYZER
50
FB*
120nH
OUT
22pF
*FERRITE BEAD
0.1µF
Figure 59. Test Circuit—LNA Input Impedance vs. Frequency in Standard and Smith Chart (S11) Formats
NETWORK ANALYZER
5050
INOUT
0.1µF
0.1µF
0.1µF
237
237
28
28
1:1
03199-060
FB*
120nH
22pF
*FERRITE BEAD
0.1µF
INH
0.1µF
LMD
0.1µF
VGALNA
0.1µF
Figure 60. Test Circuit—Frequency Response for Unterminated LNA, Single-Ended
NETWOR
ANALYZER
18nF
FB*
120nH
22pF
FERRITE BEAD
0.1µF
270
INH
LMD
DUT
0.1µF
0.1µF
0.1µF
237
237
28
28
1:1
50
IN
03199-061
Figure 61. Test Circuit—Short-Circuit, Input-Referred Noise
Rev. G | Page 21 of 56
AD8331/AD8332/AD8334
A
49.9
50
SIGNAL G ENERATOR
TO MEASURE G AIN
DISCONNECT F OR
NOISE MEASUREMENT
0.1µF
1
FERRITE
BEAD
120nH
22pF
GAIN
INH
LMD
DUT
0.1µF
0.1µF
0.1µF
B
IN
1:1
SPECTRUM
ANALYZER
50
03199-062
Figure 62. Test Circuit—Noise Figure
SPECTRUM
ANALYZER
50
IN
03199-063
50
LPF
SIGNAL
GENERATOR
–6dB
0.1µF
22pF
18nF
AD8332
INH
270
LMD
0.1µF
DUT
0.1µF
0.1µF
1k
1k
28
28
1:1
–6dB
Figure 63. Test Circuit—Harmonic Distortion vs. Load Resistance
SPECTRUM
18nF
270
ANALYZER
50
LPF
SIGNAL
GENERATOR
–6dB
0.1µF
22pF
AD8332
INH
LMD
0.1µF
DUT
0.1µF
0.1µF
237
237
28
28
1:1
–6dB
50
IN
03199-114
Figure 64. Test Circuit—Harmonic Distortion vs. Load Capacitance
SPECTRUM
50
50
–6dB
+22dB
–6dB
+22dB
SIGNAL
GENERATORS
COMBINER
–6dB
FB*
120nH
*FERRITE BEAD
22pF
0.1µF
18nF
INH
LMD
274
DUT
0.1µF
0.1µF
0.1µF
237
28
1:1
237
28
–6dB
ANALYZER
INPUT
50
03199-065
Figure 65.Test Circuit—IMD3 vs. Frequency
Rev. G | Page 22 of 56
AD8331/AD8332/AD8334
E
18nF
FB*
120nH
22pF
50
*FERRITE BEAD
0.1µF
270
INH
DUT
LMD
0.1µF
0.1µF
0.1µF
237
28
237
28
OSCILLO SCOPE
50
IN
1:1
3199-066
Figure 66. Test Circuit—Pulse Response Measurements
DIFF
PULSE
GENERATOR
OSCILLOSCOP
CH1 CH2
9.5dB
50
03199-067
18nF
270
0.1µF
FB*
120nH
22pF
50
RF
SIGNAL
GENERATOR
*FERRITE BEAD
0.1µF
INH
0.1µF
LMD
DUT
TO PIN GAIN
OR PIN ENxx
0.1µF
255
255
Figure 67. Test Circuit—Gain and Enable Transient Response
NETWO RK
ANALYZER
PROBE
FB*
120nH
22pF
50
RF
SIGNAL
GENERATOR
*FERRITE BEAD
0.1µF
TO POWER
18nF
270
INH
0.1µF
PINS
LMD
50
0.1µF
DUT
0.1µF
255
255
50
INOUT
DIFF
PROBE
PROBE
POWER
03199-068
Figure 68. Test Circuit—PSRR vs. Frequency
Rev. G | Page 23 of 56
AD8331/AD8332/AD8334
V
VINV
V
THEORY OF OPERATION
OVERVIEW
The AD8331/AD8332/AD8334 operate in the same way.
Figure 69, Figure 70, and Figure 71 are functional block
diagrams of the three devices
INH
LMD
INH1
LMD1
LMD2
INH2
+
–
LNA
VCM
BIAS
IPLOPLON
–
ATTENUAT OR
+
VGA BIAS AND
INTERPOLATOR
–48dB
CM
V
MID
AD8331
ENBL
ENBVGAIN
Figure 69. AD8331 Functional Block Diagram
LON1 LOP1
+19dB
LNA 1
LNA 2
LNA V
MID
VIP1
VIN1
–
ATTENUATOR
–48dB
+
VGA BIAS AND
INTERPOLAT OR
+
ATTENUATOR
–48dB
–
AD8332
LON2 LOP2
VIP2
VIN2
ENB
Figure 70. AD8332 Functional Block Diagram
GAIN INT
VCM1
V
MID
21dB
GAIN
INT
21dB
V
MID
VCM2
3.5dB/
15.5dB
PA21dB
CLAMP
3.5dB/
15.5dB
PA1
CLAMP
HILO
HILO
PA2
VOH
VOL
RCLMP
MODE
VOH1
VOL1
GAIN
VOH2
VOL2
RCLMP
LON1 LOP1VIP1VIN1 EN12
INH1
LMD1
LMD2
INH2
LON2
LOP2
VIP2
VIN2
MODE
VIN3
VIP3
03199-069
LOP3
LON3
INH3
LMD3
LMD4
INH4
LNA 1
LNA 2
LNA 3
LNA 4
VCM
BIAS
VCM
BIAS
–
ATTENUATO R
–48dB
+
VGA BIAS AND
INTERPO LATOR
+
ATTENUATO R
–48dB
–
GAIN UP/
DOWN
–
ATTENUATO R
–48dB
+
VGA BIAS AND
INTERPO LATOR
+
ATTENUATO R
–48dB
–
AD8334
CM1
V
MID1
V
MID2
V
MID3
V
MID4
VCM4EN34VIN4VIP4LON4 LOP4
21dB
GAIN
INT
21dB
21dB
GAIN
INT
21dB
CLAMP
PA1
PA2
PA3
PA4
CLAMP
CLMP12
VOH1
VOL1
GAIN12
HILO
VOL2
VOH2
VCM2
VCM3
VOH3
VOL3
GAIN34
VOL4
VOH4
CLMP34
03199-071
Figure 71. AD8334 Functional Block Diagram
Each channel contains an LNA that provides user-adjustable input
impedance termination, a differential X-AMP VGA, and a programmable gain postamp with adjustable output voltage limiting.
Figure 72 shows a simplified block diagram with external
03199-070
components.
PREAMPLIFIER
INH
LNA
LMDLOP
19dB
VCM
BIAS
LON
VIN
SIGNAL PATH
48dB
ATTENUATOR
VIP
AND
BIAS
INTERPOLATOR
V
VCM
MID
POSTAMP
3.5dB/15.5dB
21dB
GAIN
INTERFACE
HILO
VOH
VOL
CLAMP
RCLMP
GAIN
03199-072
Figure 72. Simplified Block Diagram
Rev. G | Page 24 of 56
AD8331/AD8332/AD8334
The linear-in-dB, gain control interface is trimmed for slope and
absolute accuracy. The gain range is +48 dB, extending from
−4.5 dB to +43.5 dB in LO gain and +7.5 dB to +55.5 dB in HI
gain mode. The slope of the gain control interface is 50 dB/V,
and the gain control range is 40 mV to 1 V. Equation 1 and
Equation 2 are the expressions for gain.
GAIN (dB) = 50 (dB/V) × V
− 6.5 dB, (HILO = LO) (1)
GAIN
or
GAIN (dB) = 50 (dB/V) × V
+ 5.5 dB, (HILO = HI) (2)
GAIN
The ideal gain characteristics are shown in Figure 73.
60
50
40
30
20
GAIN (dB)
10
0
–10
00.20.40.60.81.0 1.1
ASCENDING GAIN MODE
DESCENDING GAIN MODE
(WHERE AVAILABLE)
HILO = HI
HILO = LO
V
(V)
GAIN
03199-073
Figure 73. Ideal Gain Control Characteristics
The gain slope is negative with MODE pulled high (where
available), as follows:
GAIN (dB) = −50 (dB/V) × V
+ 45.5 dB, (HILO = LO) (3)
GAIN
or
GAIN (dB) = −50 (dB/V) × V
+ 57.5 dB, (HILO = HI) (4)
GAIN
The LNA converts a single-ended input to a differential output
with a voltage gain of 19 dB. If only one output is used, the gain
is 13 dB. The inverting output is used for active input impedance
termination. Each of the LNA outputs is capacitively coupled to
a VGA input. The VGA consists of an attenuator with a range of
48 dB followed by an amplifier with 21 dB of gain for a net gain
range of −27 dB to +21 dB. The X-AMP, gain interpolation
technique results in low gain error and uniform bandwidth, and
differential signal paths minimize distortion.
The final stage is a logic programmable amplifier with gains of
3.5 dB or 15.5 dB. The LO and HI gain modes are optimized for
12-bit and 10-bit ADC applications, in terms of output-referred
noise and absolute gain range. Output voltage limiting can be
programmed by the user.
LOW NOISE AMPLIFIER (LNA)
Good noise performance in the AD8331/AD8332/AD8334
relies on a proprietary ultralow noise preamplifier at the beginning
of the signal chain, which minimizes the noise contribution in the
following VGA. Active impedance control optimizes noise performance for applications that benefit from input matching.
A simplified schematic of the LNA is shown in Figure 74. INH
is capacitively coupled to the source. A bias generator establishes dc
input bias voltages of 3.25 V and centers the output commonmode levels at 2.5 V. A capacitor C
the input coupling capacitor C
pin to ground to decouple the LMD bus. The LMD pin is not
useable for configuring the LNA as a differential input amplifier.
LOP
2.5V2.5V
C
INH
INH
C
R
S
SH
–a
3.25V3.25V
604080
Figure 74. Simplified LNA Schematic
The LNA supports differential output voltages as high as 5 V p-p,
with positive and negative excursions of ±1.25 V, about a
common-mode voltage of 2.5 V. Because the differential gain
magnitude is 9, the maximum input signal before saturation is
±275 mV or +550 mV p-p. Overload protection ensures quick
recovery time from large input voltages. Because the inputs are
capacitively coupled to a bias voltage near midsupply, very large
inputs can be handled without interacting with the ESD protection.
Low value feedback resistors and the current-driving capability
of the output stage allow the LNA to achieve a low input-referred
voltage noise of 0.74 nV/√Hz. This is achieved with a current
consumption of only 11 mA per channel (55 mW). On-chip
resistor matching results in precise single-ended gains of 4.5×
(9× differential), critical for accurate impedance control. The use
of a fully differential topology and negative feedback minimizes
distortion. Low HD2 is particularly important in second harmonic
ultrasound imaging applications. Differential signaling enables
smaller swings at each output, further reducing third-order
distortion.
(can be the same value as
LMD
) is connected from the LMD
INH
C
IZ
Q1Q2
I
0
VPOS
I
0
VCM
BIAS
R
IZ
TO
VGA
LON
I
0
–a
LMD
I
0
C
LMD
03199-074
Rev. G | Page 25 of 56
AD8331/AD8332/AD8334
Active Impedance Matching
The LNA supports active impedance matching through an external
shunt feedback resistor from Pin LON to Pin INH. The input
resistance, R
, is given in Equation 5, where A is the single-
IN
ended gain of 4.5, and 6 kΩ is the unterminated input impedance.
R
×
R
R
C
is needed in series with RIZ because the dc levels at Pin LON
IZ
IZ
=
IN
1
k6
A
+
and Pin INH are unequal. Expressions for choosing R
of R
and for choosing CIZ are found in the Applications
IN
Information section. C
k6
IZ
=
k33
and the ferrite bead enhance stability
SH
(5)
R
+
IZ
in terms
IZ
at higher frequencies, where the loop gain is diminished, and
prevent peaking. Frequency response plots of the LNA are shown
in Figure 23 and Figure 24. The bandwidth is approximately
130 MHz for matched input impedances of 50 Ω to 200 Ω and
declines at higher source impedances. The unterminated
bandwidth (when R
= ∞) is approximately 80 MHz.
IZ
Each output can drive external loads as low as 100 Ω in addition
to the 100 Ω input impedance of the VGA (200 Ω differential).
Capacitive loading up to 10 pF is permissible. All loads should
be ac-coupled. Typically, Pin LOP output is used as a single-ended
driver for auxiliary circuits, such as those used for Doppler
ultrasound imaging. Pin LON drives R
. Alternatively, a
IZ
differential external circuit can be driven from the two outputs
in addition to the active feedback termination. In both cases,
important stability considerations discussed in the Applications
Information section should be carefully observed.
The impedance at each LNA output is 5 Ω. A 0.4 dB reduction
in open circuit gain results when driving the VGA, and a 0.8 dB
reduction results with an additional 100 Ω load at the output.
The differential gain of the LNA is 6 dB higher. If the load is less
than 200 Ω on either side, a compensating load is recommended
on the opposite output.
LNA Noise
The input-referred voltage noise sets an important limit on
system performance. The short-circuit input voltage noise of
the LNA is 0.74 nV/√Hz or 0.82 nV/√Hz (at maximum gain),
including the VGA noise. The open circuit, current noise is
2.5 pA/√Hz. These measurements, taken without a feedback
resistor, provide the basis for calculating the input noise and
noise figure performance of the configurations in Figure 75.
Figure 76 and Figure 77 show simulations extracted from these
results and the 4.1 dB noise figure (NF) measurement with the
input actively matched to a 50 Ω source. Unterminated (R
= ∞)
IZ
operation exhibits the lowest equivalent input noise and noise
figure. Figure 76 shows the noise figure vs. source resistance,
rising at low R
to the source noise, and again at high R
, where the LNA voltage noise is large compared
S
due to current noise.
S
The VGA input-referred voltage noise of 2.7 nV/√Hz is
included in all of the curves.
+
V
IN
–
+
V
IN
–
ACTIVE IMP EDANCE MATCH - RS = R
+
V
IN
–
Figure 75. Input Configurations
7
6
5
4
3
NOISE FI GURE (dB)
2
1
SIMULATION
0
501001k
Figure 76. Noise Figure vs. R
Active Match, and Unterminated Inputs
7
INCLUDES NOISE OF VGA
6
5
4
3
NOISE FI GURE (dB)
2
1
(SIMULATED RESULTS)
0
501001k
Figure 77. Noise Figure vs. R
UNTERMINATED
R
IN
R
S
RESISTIVE TERMINAT ION
R
IN
R
S
R
S
R
R
IN
R
S
R
IZ
RIN=
1 + 4.5
INCLUDES NOISE OF VGA
RESISTIVE TERMINAT ION
R
= 50
IN
= 75
R
IN
= 100
R
IN
R
= 200
IN
=
R
IZ
for Various Fixed Values of RIN, Actively Matched
S
= RIN)
(R
S
ACTIVE IM PEDANCE MATCH
UNTERMINATED
RS ()
RS ()
V
V
IZ
V
for Resistive,
S
OUT
OUT
IN
OUT
03199-075
03199-076
03199-077
Rev. G | Page 26 of 56
AD8331/AD8332/AD8334
200
The primary purpose of input impedance matching is to
improve the system transient response. With resistive termination,
the input noise increases due to the thermal noise of the matching
resistor and the increased contribution of the LNA input voltage
noise generator. With active impedance matching, however, the
contributions of both are smaller than they would be for resistive
termination by a factor of 1/(1 + LNA Gain). Figure 76 shows
their relative NF performance. In this graph, the input impedance
is swept with R
to preserve the match at each point. The noise
S
figures for a source impedance of 50 are 7.1 dB, 4.1 dB, and
2.5 dB, respectively, for the resistive, active, and unterminated
configurations. The noise figures for 200 are 4.6 dB, 2.0 dB,
and 1.0 dB, respectively.
Figure 77 is a plot of NF vs. R
for various values of RIN, which is
S
helpful for design purposes. The plateau in the NF for actively
matched inputs mitigates source impedance variations. For
comparison purposes, a preamp with a gain of 19 dB and noise
spectral density of 1.0 nV/√Hz, combined with a VGA with
3.75 nV/√Hz, yields a noise figure degradation of approximately
1.5 dB (for most input impedances), significantly worse than
the AD8331/AD8332/AD8334 performance.
The equivalent input noise of the LNA is the same for singleended and differential output applications. The LNA noise figure
improves to 3.5 dB at 50 Ω without VGA noise, but this is
exclusive of noise contributions from other external circuits
connected to LOP. A series output resistor is usually recommended for stability purposes when driving external circuits on
a separate board (see the Applications Information section). In
low noise applications, a ferrite bead is even more desirable.
VARIABLE GAIN AMPLIFIER
The differential X-AMP VGA provides precise input attenuation
and interpolation. It has a low input-referred noise of 2.7 nV/√Hz
and excellent gain linearity. A simplified block diagram is shown
in Figure 78.
GAIN
VIP
VIN
g
m
6dB
R
GAIN INTERPOLATOR
(BOTH CHANNELS)
2R
Figure 78. Simplified VGA Schematic
48dB
POSTAMP
+
–
POSTAMP
03199-078
X-AMP VGA
The input of the VGA is a differential R-2R ladder attenuator
network with 6 dB steps per stage and a net input impedance of
200 Ω differential. The ladder is driven by a fully differential
input signal from the LNA and is not intended for single-ended
operation. LNA outputs are ac-coupled to reduce offset and isolate
their common-mode voltage. The VGA inputs are biased through
the center tap connection of the ladder to VCM, which is typically
set to 2.5 V and is bypassed externally to provide a clean ac ground.
The signal level at successive stages in the input attenuator
falls from 0 dB to −48 dB in +6 dB steps. The input stages of the
X-AMP are distributed along the ladder, and a biasing interpolator,
controlled by the gain interface, determines the input tap point.
With overlapping bias currents, signals from successive taps
merge to provide a smooth attenuation range from 0 dB to
−48 dB. This circuit technique results in excellent linear-in-dB
gain law conformance and low distortion levels and deviates
±0.2 dB or less from the ideal. The gain slope is monotonic with
respect to the control voltage and is stable with variations in
process, temperature, and supply.
The X-AMP inputs are part of a gain-of-12 feedback amplifier
that completes the VGA. Its bandwidth is 150 MHz. The input
stage is designed to reduce feedthrough to the output and to
ensure excellent frequency response uniformity across gain
setting (see Figure 12 and Figure 13).
Gain Control
Position along the VGA attenuator is controlled by a single-ended
analog control voltage, V
, with an input range of 40 mV to
GAIN
1.0 V. The gain control scaling is trimmed to a slope of 50 dB/V
(20 mV/dB). Values of V
beyond the control range saturate
GAIN
to minimum or maximum gain values. Both channels of the
AD8332 are controlled from a single gain interface to preserve
matching. Gain can be calculated using Equation 1 and Equation 2.
Gain accuracy is very good because both the scaling factor and
absolute gain are factory trimmed. The overall accuracy relative
to the theoretical gain expression is ±1 dB for variations in
temperature, process, supply voltage, interpolator gain ripple,
trim errors, and tester limits. The gain error relative to a best-fit
line for a given set of conditions is typically ±0.2 dB. Gain matching
between channels is better than 0.1 dB (Figure 11 shows gain errors
in the center of the control range). When V
< 0.1 or > 0.95,
GAIN
gain errors are slightly greater.
The gain slope can be inverted, as shown in Figure 73 (except for
the AD8332 AR models). The gain drops with a slope of −50 dB/V
across the gain control range from maximum to minimum gain.
This slope is useful in applications such as automatic gain control,
where the control voltage is proportional to the measured output
signal amplitude. The inverse gain mode is selected by setting the
MODE pin to HI gain mode.
Gain control response time is less than 750 ns to settle within 10%
of the final value for a change from minimum to maximum gain.
Rev. G | Page 27 of 56
AD8331/AD8332/AD8334
VGA Noise
In a typical application, a VGA compresses a wide dynamic
range input signal to within the input span of an ADC. While
the input-referred noise of the LNA limits the minimum resolvable
input signal, the output-referred noise, which depends primarily
on the VGA, limits the maximum instantaneous dynamic range
that can be processed at any one particular gain control voltage.
This limit is set in accordance with the quantization noise floor
of the ADC.
Output- and input-referred noise as a function of V
in Figure 25 and Figure 27 for the short circuited input conditions.
The input noise voltage is simply equal to the output noise divided
by the measured gain at each point in the control range.
The output-referred noise is flat over most of the gain range
because it is dominated by the fixed output-referred noise of the
VGA. Values are 48 nV/√Hz in LO gain mode and 178 nV/√Hz
in HI gain mode. At the high end of the gain control range, the
noise of the LNA and the noise of the source prevail. The inputreferred noise reaches its minimum value near the maximum
gain control voltage, where the input-referred contribution of
the VGA becomes very small.
At lower gains, the input-referred noise, and thus noise figure,
increases as the gain decreases. The instantaneous dynamic
range of the system is not lost, however, because the input
capacity increases with it. The contribution of the ADC noise
floor has the same dependence as well. The important relationship
is the magnitude of the VGA output noise floor relative to that
of the ADC.
With its low output-referred noise levels, these devices ideally
drive low voltage ADCs. The converter noise floor drops 12 dB
for every two bits of resolution and drops at lower input fullscale voltages and higher sampling rates. ADC quantization
noise is discussed in the Applications Information section.
The preceding noise performance discussion applies to a
differential VGA output signal. Although the LNA noise
performance is the same in single-ended and differential
applications, the VGA performance is not. The noise of the
VGA is significantly higher in single-ended usage because the
contribution of its bias noise is designed to cancel in the differential
signal. A transformer can be used with single-ended applications
when low noise is desired.
Gain control noise is a concern in very low noise applications.
Thermal noise in the gain control interface can modulate the
channel gain. The resultant noise is proportional to the output
signal level and usually only evident when a large signal is present.
Its effect is observable only in LO gain mode where the noise
floor is substantially lower. The gain interface includes an
on-chip noise filter, which reduces this effect significantly at
frequencies above 5 MHz. Care should be taken to minimize
noise impinging at the GAIN input. An external RC filter can be
used to remove V
source noise. The filter bandwidth should be
GAIN
sufficient to accommodate the desired control bandwidth.
are plotted
GAIN
Common-Mode Biasing
An internal bias network connected to a midsupply voltage
establishes common-mode voltages in the VGA and postamp.
An externally bypassed buffer maintains the voltage. The bypass
capacitors form an important ac ground connection because
the VCM network makes a number of important connections
internally, including the center tap of the VGA differential input
attenuator, the feedback network of the VGA fixed gain amplifier,
and the feedback network of the postamp in both gain settings.
For best results, use a 1 nF capacitor and a 0.1 µF capacitor in
parallel, with the 1 nF capacitor nearest to the VCM pin. Separate
VCM pins are provided for each channel. For dc coupling to a 3 V
ADC, the output common-mode voltage is adjusted to 1.5 V by
biasing the VCM pin.
POSTAMPLIFIER
The final stage has a selectable gain of 3.5 dB (×1.5) or 15.5 dB
(×6), set by the HILO logic pin. Figure 79 is a simplified block
diagram.
Gm2
+
VOH
Gm1
F2
VCM
–
Separate feedback attenuators implement the two gain settings.
These are selected in conjunction with an appropriately scaled
input stage to maintain a constant 3 dB bandwidth between the
two gain modes (~150 MHz). The slew rate is 1200 V/µs in HI gain
mode and 300 V/µs in LO gain mode. The feedback networks
for HI and LO gain modes are factory trimmed to adjust the
absolute gains of each channel.
Noise
The topology of the postamp provides constant input-referred
noise with the two gain settings and variable output-referred
noise. The output-referred noise in HI gain mode increases
(with gain) by four. This setting is recommended when driving
converters with higher noise floors. The extra gain boosts the
output signal levels and noise floor appropriately. When driving
circuits with lower input noise floors, the LO gain mode optimizes
the output dynamic range.
Although the quantization noise floor of an ADC depends on a
number of factors, the 48 nV/√Hz and 178 nV/√Hz levels are
well suited to the average requirements of most 12-bit and 10-bit
converters, respectively. An additional technique, described in
the Applications Information section, can extend the noise floor
even lower for possible use with 14-bit ADCs.
F1
Gm2
Gm1
Figure 79. Postamplifier Block Diagram
VOL
3199-079
Rev. G | Page 28 of 56
AD8331/AD8332/AD8334
V
Output Clamping
Outputs are internally limited to a level of 4.5 V p-p differential
when operating at a 2.5 V common-mode voltage. The postamp
implements an optional output clamp engaged through a resistor
from R
to ground. Tab le 8 shows a list of recommended
CLMP
resistor values.
Output clamping can be used for ADC input overload protection, if
needed, or postamp overload protection when operating from a
lower common-mode level, such as 1.5 V. The user should be
aware that distortion products increase as output levels approach
the clamping levels, and the user should adjust the clamp resistor
accordingly. For additional information, see the Applications
Information section.
The accuracy of the clamping levels is approximately ±5% in LO
or HI mode. Figure 80 illustrates the output characteristics for a
few values of R
CLMP
.
5.0
4.5
4.0
3.5
3.0
(V)
OL
2.5
,
OH
2.0
V
1.5
1.0
0.5
0
R
=
CLMP
8.8k
3.5k
R
= 1.86k
CLMP
3.5k
8.8k
R
=
CLMP
–3–2–10123
V
(V)
INH
Figure 80. Output Clamping Characteristics
03199-080
Rev. G | Page 29 of 56
AD8331/AD8332/AD8334
V
A
APPLICATIONS INFORMATION
LNA—EXTERNAL COMPONENTS
The LMD pin (connected to the bias circuitry) must be bypassed to
ground and signal sourced to the INH pin, which is capacitively
coupled using 2.2 nF to 0.1 µF capacitors (see Figure 81).
The unterminated input impedance of the LNA is 6 k. The
user can synthesize any LNA input resistance between 50 and
6 k. R
Table 7.
Table 7. LNA External Component Values for Common
Source Impedances
RIN (Ω) RIZ (Nearest STD 1% Value, Ω) CSH (pF)
50 280 22
75 412 12
100 562 8
200 1.13 k 1.2
500 3.01 k None
6 k
When active input termination is used, a decoupling capacitor (CIS)
is required to isolate the input and output bias voltages of the LNA.
The shunt input capacitor, C
frequencies where the active termination match is lost due to
the gain roll-off of the LNA at high frequencies. The value of C
diminishes as R
required. Suggested values for C
shown in Tabl e 7.
When a long trace to Pin INH is unavoidable, or if both LNA
outputs drive external circuits, a small ferrite bead (FB) in series
with Pin INH preserves circuit stability with negligible effect on
noise. The bead shown is 75 Ω at 100 MHz (Murata BLM21 or
equivalent). Other values can prove useful.
Figure 82 shows the interconnection details of the LNA output.
Capacitive coupling between the LNA outputs and the VGA
inputs is required because of the differences in their dc levels
and the need to eliminate the offset of the LNA. Capacitor values
of 0.1 µF are recommended. There is a 0.4 dB loss in gain
between the LNA output and the VGA input due to the 5 Ω
output resistance. Additional loading at the LOP and LON
outputs affects LNA gain.
is calculated according to Equation 6 or selected from
IZ
()
R
k33×
IN
R
=
IZ
–k6
∞
increases to 500 Ω, at which point no capacitor is
IN
(6)
()
R
IN
, reduces gain peaking at higher
SH
for 50 Ω ≤ RIN ≤ 200 Ω are
SH
None
SH
C
GAIN
1nF
LMD
0.1µF
1
LMD2
2
INH2
+5V
3
VPS2
4
LON2
5
LOP2
6
COM2
7
10
11
12
13
14
8
9
VIP2
VIN2
VCM2
GAIN
RCLMP
VOH2
VOL2
COMM
*SEE TEXT
1nF0.1µF
1nF0.1µF
LMD1
INH1
VPS1
LON1
LOP1
COM1
VIP1
VIN1
VCM1
HILO
ENB
VOH1
VOL1
VPSV
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1nF
FB
C
*
SH
*
C
IZ
*
R
IZ
1nF
LNA OUT
0.1µF
5V
1nF
5V
*
*
0.1µF
VGA OUT
VGA OUT
5V
0.1µF
0.1µF
5V
0.1µF
LNA
SOURCE
Figure 81. Basic Connections for a Typical Channel (AD8332 Shown)
LN
DECOUPLING
R
RESISTO R
IZ
VCM
LNA
DECOUPLING
RESISTO R
VIP
VIN
5
3.25V
C
SH
3.25V
LNA
2.5V
2.5V
LON
LOP
5
50
50
TO EXT
CIRCUIT
100
100
TO EXT
CIRCUIT
Figure 82. Interconnections of the LNA and VGA
Both LNA outputs are available for driving external circuits.
Pin LOP should be used in those instances when a single-ended
LNA output is required. The user should be aware of stray
capacitance loading of the LNA outputs, in particular LON. The
LNA can drive 100 Ω in parallel with 10 pF. If an LNA output is
routed to a remote PC board, it tolerates a load capacitance up
to 100 pF with the addition of a 49.9 Ω series resistor or ferrite
75 Ω/100 MHz bead.
03199-081
03199-082
Rev. G | Page 30 of 56
AD8331/AD8332/AD8334
–
Gain Input
The GAIN pin is common to both channels of the AD8332. The
input impedance is nominally 10 MΩ, and a bypass capacitor
from 100 pF to 1 nF is recommended.
Parallel connected devices can be driven by a common voltage
source or DAC. Decoupling should take into account any bandwidth considerations of the drive waveform, using the total
distributed capacitance.
If gain control noise in LO gain mode becomes a factor, maintaining ≤15 nV/√Hz noise at the GAIN pin ensures satisfactory
noise performance. Internal noise prevails below 15 nV/√Hz at
the GAIN pin. Gain control noise is negligible in HI gain mode.
VCM Input
The common-mode voltage of Pin VCM, Pin VOL, and Pin VOH
defaults to 2.5 V dc. With output ac-coupled applications, the
VCM pin is unterminated; however, it must still be bypassed in
close proximity for ac grounding of internal circuitry. The VGA
outputs can be dc connected to a differential load, such as an
ADC. Common-mode output voltage levels between 1.5 V and
3.5 V can be realized at Pin VOH and Pin VOL by applying the
desired voltage at Pin VCM. DC-coupled operation is not
recommended when driving loads on a separate PC board.
The voltage on the VCM pin is sourced by an internal buffer
with an output impedance of 30 Ω and a ±2 mA default output
current (see Figure 83). If the VCM pin is driven from an external
source, its output impedance should be <<30 Ω, and its current
drive capability should be >>2 mA. If the VCM pins of several
devices are connected in parallel, the external buffer should be
capable of overcoming their collective output currents. When a
common-mode voltage other than 2.5 V is used, a voltagelimiting resistor, R
2mA MAX
AC GROUNDING FO R
INTERNAL CIRCUI TRY
, is needed to protect against overload.
CLMP
INTERNAL
CIRCUITRY
30
Figure 83. VCM Interface
VCM
100pF
RO << 30
0.1µF
NEW V
CM
03199-083
Logic Inputs—ENB, MODE, and HILO
The input impedance of all enable pins is nominally 25 kΩ and
can be pulled up to 5 V (a pull-up resistor is recommended) or
driven by any 3 V or 5 V logic families. The enable pin, ENB,
powers down the VGA; when pulled low, the VGA output voltages
are near ground. Multiple devices can be driven from a common
source. Consult Ta ble 3 , Table 4, Tabl e 5, and Tabl e 6 for information about circuit functions controlled by the enable pins.
Pin HILO is compatible with 3 V or 5 V CMOS logic families. It
is either connected to ground or pulled up to 5 V, depending on
the desired gain range and output noise.
Optional Output Voltage Limiting
The RCLMP pin provides the user with a means to limit the
output voltage swing when used with loads that have no
provisions for prevention of input overdrive. The peak-to-peak
limited voltage is adjusted by a resistor to ground (see Ta ble 8
for a list of several voltage levels and corresponding resistor
values). Unconnected, the default limiting level is 4.5 V p-p.
Note that third harmonic distortion increases as waveform
amplitudes approach clipping. For lowest distortion, the clamp level
should be set higher than the converter input span. A clamp level
of 1.5 V p-p is recommended for a 1 V p-p linear output range,
2.7 V p-p for a 2 V p-p range, or 1 V p-p for a 0.5 V p-p operation.
The best solution is determined experimentally. Figure 84 shows
third harmonic distortion as a function of the limiting level for
a 2 V p-p output signal. A wider limiting level is desirable in HI
gain mode.
20
V
= 0.75V
GAIN
–30
–40
–50
HD3 (dBc)
–60
–70
–80
1.52.02.53.04.03.54.55.0
Figure 84. HD3 vs. Clamping Level for 2 V p-p Differential Input
CLAMP LIMIT LEVEL (V p-p)
HILO = LO
HILO = HI
03199-084
Table 8. Clamp Resistor Values
Clamp Resistor Value (kΩ)
Clamp Level (V p-p)
HILO = LO HILO = HI
0.5 1.21
1.0 2.74 2.21
1.5 4.75 4.02
2.0 7.5 6.49
2.5 11 9.53
3.0 16.9 14.7
3.5 26.7 23.2
4.0 49.9 39.2
4.4 100 73.2
Output Decoupling
When driving capacitive loads greater than about 10 pF, or long
circuit connections on other boards, an output network of resistors
and/or ferrite beads can be useful to ensure stability. These
components can be incorporated into a Nyquist filter such as
the one shown in Figure 81. In Figure 81, the resistor value is
84.5 Ω. For example, all the evaluation boards for this series
incorporate 100 in parallel with a 120 nH bead. Lower value
resistors are permissible for applications with nearby loads or
Rev. G | Page 31 of 56
AD8331/AD8332/AD8334
X
X
with gains less than 40 dB. The exact values of these components
can be selected empirically.
An antialiasing noise filter is typically used with an ADC. Filter
requirements are application dependent.
When the ADC resides on a separate board, the majority of
filter components should be placed nearby to suppress noise
picked up between boards and to mitigate charge kickback from
the ADC inputs. Any series resistance beyond that required for
output stability should be placed on the ADC board. Figure 85
shows a second-order, low-pass filter with a bandwidth of 20 MHz.
The capacitor is chosen in conjunction with the 10 pF input
capacitance of the ADC.
OPTIONAL
BACKPLANE
0.1µF
84.5
0.1µF
84.5
Figure 85. 20 MHz Second-Order, Low-Pass Filter
DRIVING ADCs
The output drive accommodates a wide range of ADCs. The
noise floor requirements of the VGA depend on a number of
application factors, including bit resolution, sampling rate, fullscale voltage, and the bandwidth of the noise/antialias filter. The
output noise floor and gain range can be adjusted by selecting
HI or LO gain mode.
The relative noise and distortion performance of the two gain
modes can be compared in Figure 25 and Figure 31 through
Figure 41. The 48 nV/√Hz noise floor of the LO gain mode is
suited to converters with higher sampling rates or resolutions
(such as 12 bits). Both gain modes can accommodate ADC fullscale voltages as high as 4 V p-p. Because distortion performance
remains favorable for output voltages as high as 4 V p-p (see
Figure 36), it is possible to lower the output-referred noise even
further by using a resistive attenuator (or transformer) at the
output. The circuit in Figure 86 has an output full-scale range of
2 V p-p, a gain range of −10.5 dB to +37.5 dB, and an output
noise floor of 24 nV/√Hz, making it suitable for some 14-bit
ADC applications.
4V p-p DIFF,
48nV/ Hz
VOH
VOL
Figure 86. Adjusting the Noise Floor for 14-Bit ADCs
OVERLOAD
These devices respond gracefully to large signals that overload
its input stage and to normal signals that overload the VGA
when the gain is set unexpectedly high. Each stage is designed
for clean-limited overload waveforms and fast recovery when
gain setting or input amplitude is reduced.
187
2:1
187
1.5µH
158
158
1.5µH
2V p-p DIFF,
24nV/ Hz
374
LPF
18pF
ADC
AD6644
ADC
03199-086
03199-085
Signals larger than ±275 mV at the LNA input are clipped to
5 V p-p differential prior to the input of the VGA. Figure 48
shows the response to a 1 V p-p input burst. The symmetric
overload waveform is important for applications, such as CW
Doppler ultrasound, where the spectrum of the LNA outputs
during overload is critical. The input stage is also designed to
accommodate signals as high as ±2.5 V without triggering the
slow-settling ESD input protection diodes.
Both stages of the VGA are susceptible to overload. Postamplifier limiting is more common and results in the cleanlimited output characteristics found in Figure 49. Recovery is fast in
all cases. The graph in Figure 87 summarizes the combinations of
input signal and gain that lead to the different types of overload.
43.5
GAIN (dB)
–4.5
POSTAMP
OVERLOAD
1m
INPUT AMP LITUDE (V)
15mV
LO GAIN
MODE
-AMP
OVERLOAD
25mV
29dB
24.5dB
LNA OVERLOAD
1
0.2750.110m
POSTAMP
OVERLOAD
4mV
56.5
HI GAIN
GAIN (dB)
7.5
MODE
1m0.2750.110m1
INPUT AMPLITUDE (V)
Figure 87. Overload Gain and Signal Conditions
-AMP
OVERLOAD
25mV
41dB
24.5dB
LNA OVERLOAD
The clamp interface mentioned in the Output Clamping section
controls the maximum output swing of the postamp and its
overload response. When the clamp feature is not used, the
output level defaults to approximately 4.5 V p-p differential
centered at 2.5 V common mode. When other common-mode
levels are set through the VCM pin, the value of R
should be
CLMP
selected for graceful overload. A value of 8.3 kΩ or less is
recommended for 1.5 V or 3.5 V common-mode levels (7.2 kΩ
for HI gain mode). This limits the output swing to just above
2 V p-p differential.
OPTIONAL INPUT OVERLOAD PROTECTION
Applications in which high transients are applied to the LNA
input can benefit from the use of clamp diodes. A pair of backto-back Schottky diodes can reduce these transients to manageable
levels. Figure 88 illustrates how such a diode protection scheme
can be connected.
OPTIONAL
SCHOTT KY
OVERLOAD
CLAMP
231
BAS40-04
0.1µF
FB
C
R
SH
C
SH
2
3
4
INH
VPSL
LON
IZ
R
IZ
Figure 88. Input Overload Clamping
COMM
ENBL
20
19
03199-088
03199-087
Rev. G | Page 32 of 56
AD8331/AD8332/AD8334
When selecting overload protection, the important parameters
are forward and reverse voltages and t
BAS40-04 series shown in Figure 88 has a
(or τrr). The Infineon
rr
τ
of 100 ps and a VF
rr
of 310 mV at 1 mA. Many variations of these specifications can
be found in vendor catalogs.
LAYOUT, GROUNDING, AND BYPASSING
Due to their excellent high frequency characteristics, these
devices are sensitive to their PCB environments. Realizing
expected performance requires attention to detail critical to
good, high speed, board design.
A multilayer board with power and ground planes is recommended with blank areas in the signal layers filled with ground
plane. Be certain that the power and ground pins provided for
robust power distribution to the device are connected. Decouple
the power supply pins with surface-mount capacitors as close as
possible to each pin to minimize impedance paths to ground.
Decouple the LNA power pins from the VGA supply using
ferrite beads. Together with the capacitors, ferrite beads
eliminate undesired high frequencies without reducing the
headroom. Use a larger value capacitor for every 10 chips to
20 chips to decouple residual low frequency noise. To minimize
voltage drops, use a 5 V regulator for the VGA array.
Several critical LNA areas require special care. The LON and
LOP output traces must be as short as possible before connecting
to the coupling capacitors connected to Pin VIN and Pin VIP.
must be placed near the LON pin as well. Resistors must be
R
IZ
placed as close as possible to the VGA output pins, VOL and
VOH, to mitigate loading effects of connecting traces. Values
are discussed in the Output Decoupling section.
Signal traces must be short and direct to avoid parasitic effects.
Wherever there are complementary signals, symmetrical layout
should be employed to maintain waveform balance. PCB traces
should be kept adjacent when running differential signals over a
long distance.
MULTIPLE INPUT MATCHING
Matching of multiple sources with dissimilar impedances can be
accomplished as shown in Figure 89. A relay and low supply voltage
analog switch can be used to select between multiple sources
and their associated feedback resistors. An ADG736 dual SPDT
switch is shown in this example; however, multiple switches are
also available and users are referred to the Analog Devices
Selection Guide for switches and multiplexers.
ADG736
1.13k
SELECT R
IZ
280
LON
5
LOP
5
03199-090
200
50
0.1µF
18nF
INH
LMD
AD8332
LNA
Figure 89. Accommodating Multiple Sources
DISABLING THE LNA
Where accessible, connection of the LNA enable pin to ground
powers down the LNA, resulting in a current reduction of about
half. In this mode, the LNA input and output pins can be left
unconnected; however, the power must be connected to all the
supply pins for the disabling circuit to function. Figure 90 illustrates
the connections using AD8331 as an example.
20
COMM
19
ENBL
18
17
16
15
14
13
12
+5V
VOUT
HILO
ENBV
COMM
VOL
VOH
VPOS+5V
HILO
RCLMP
R
CLMP
+5V
0.1µF
VIN
0.1µF
MODE
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
LMD
AD8331
INH
VPSL
LON
LOP
COML
VIP
VIN
MODE
Rev. G | Page 33 of 56
GAIN
10
GAIN
VCM
11
Figure 90. Disabling the LNA
VCM
03199-089
AD8331/AD8332/AD8334
ULTRASOUND TGC APPLICATION
The AD8332 ideally meets the requirements of medical and
industrial ultrasound applications. The TGC amplifier is a key
subsystem in such applications because it provides the means
for echo location of reflected ultrasound energy.
Figure 91 through Figure 93 are schematics of a dual, fully
differential system using the AD8332 and the AD9238 12-bit
high speed ADC with conversion speeds as high as 65 MSPS.
HIGH DENSITY QUAD LAYOUT
The AD8334 is the ideal solution for applications with limited
board space. Figure 94 represents four channels routed to and
away from this very compact quad VGA. Note that none of the
signal paths crosses and that all four channels are spaced apart
to eliminate crosstalk.
In this example, all of the components shown are 0402 size;
however, the same layout is executable at the expense of slightly
more board area. The sketch also assumes that both sides of the
printed circuit board are available for components and that the
bypass and power supply decoupling circuitry is located on the
wiring side of the board.
Rev. G | Page 34 of 56
AD8331/AD8332/AD8334
TP3
(RED)
TP4
L19
SAT
L20
SAT
+5V
120nH FB
120nH FB
FILTER
C67
SAT
+
C46
1µF
L7
+5VGA
L6
+5VLNA
JP13
L17
SAT
JP12
L18
SAT
TB1
+5V
(BLACK)
TB2
GND
OPTIONAL 4-POLE LOW-PASS
VIN+B
C66
SAT
–B
V
IN
CFB2
18nF
RFB2
274
C51
0.1µF
VCM1
TP2 GAIN
TP7 GND
R3
(R
CLMP
JP8
DC2H
C54
0.1µF
C55
0.1µF
JP7
DC2L
S3
E
)
IN2
C50
0.1µF
L12
120nH FB
C80
22pF
+5VLNA
C41
0.1µF
C83
1nF
C69
0.1µF
100
120nH FB
120nH FB
100
TP5
0.1µF
C48
0.1µF
R27
L11
L10
R26
C53
0.1µF
C68
1nF
C49
JP5
IN2
C74
1nF
C78
1nF
AD8332ARU
1
LMD2
2
INH2
3
VPS2
4
LON2
5
LOP2
6
COM2
7
VIP2
8
VIN2
9
VCM2
10
GAIN
11
RCLMP
12
VOH2
13
VOL2
14
COMM
+5VGA
C45
0.1µF
LMD1
INH1
VPS1
LON1
LOP1
COM1
VIP1
VIN1
VCM1
HILO
ENB
VOH1
VOL1
VPSV
C85
1nF
28
27
26
+5VLNA
25
24
23
22
21
20
C77
1nF
19
+5VGA
18
17
16
15
C70
0.1µF
JP6
IN1
ENABLE
JP16
DISABLE
120nH FB
120nF FB
22pF
C42
0.1µF
C43
0.1µF
R24
100
L9
L8
R25
100
C79
VCM1
120nH FB
CFB1
18nF
RFB1
274
C59
0.1µF
C58
0.1µF
0.1µF
JP10
L13
+5VGA
HI GAIN
JP10
LO GAIN
JP9
C56
TP6
C60
0.1µF
OPTIONAL 4-POLE LOW-PASS
JP17
L1
SAT
L14
SAT
FILTER
C64
SAT
S1
E
L15
SAT
L16
SAT
IN1
VIN+A
C65
SAT
VIN–A
03199-091
Figure 91. Schematic, TGC, VGA Section Using an AD8332 and AD9238
Rev. G | Page 35 of 56
AD8331/AD8332/AD8334
V
ADP3339AKC-3.3
+5V
312
OUT
IN
OUT
TAB
S2
EXT CLOCK
R17
49.9
+3.3VCLK
C86
0.1µF
V
DD
20MHz
GND
SG-636PCE
2
OUT
R1
L5
120nH FB
L4
120nH FB
L3
120nH FB
L2
120nH FB
C31
0.1µF
C30
0.1µF
C29
0.1µF
C1
0.1µF
VIN+_A
V
–_A
IN
C35
0.1µF
C36
0.1µF
R12
1.5k
R4
1.5k
C33
10µF
6.3V
+
R5
33
R6
33
C17
0.1µF
GND
C44
1µF
+
VREF
R20
4.7k
U5
74VHC04
U5
10µF
6.3V
1.5k1. 5k
ADCLK
8965
C34
C20
0.1µF
JP11JP3
4.7k
TP 12
TP 13
JP1
33
33
R41
1
R8
R7
DATA
CLK
C39
10µF
C16
0.1µF
2
C38
0.1µF
C37
0.1µF
VIN–_B
V
+_B
+3.3VCLK
JP4
3
2
EXT
1
INT
R18
499
R16
5k
R19
499
C63
0.1µF
C47
+
10µF
6.3V
14
OE
3
IN
ADCLK
U5
74VHC04
4312
U5
74VHC04
74VHC04
U6
U5
74VHC04
1213
SPARES
U5
74VHC04
1011
C2
10µF
6.3V
C40
0.1µF
TP9
C32
0.1µF
C62
18pF
C19
1nF
R9
0
3
+3.3VADDIG
C61
18pF
C18
1nF
+
C15
1nF
+3.3VAVDD
+
C52
10nF
C12
10µF
6.3V
C57
10nF
DNC
DNC
D0_B
D1_B
D2_B
D3_B
D4_B
D5_B
C26
0.1µF
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
C22
0.1µF
AGND
VIN+_A
VIN–_A
AGND
AVDD
REFT_A
REFB_A
VREF
SENSE
REFB_B
REFT_B
AVDD
AGND
VIN–_B
VIN+_B
AGND
AVDD
CLK_B
DCS
DFS
PDWN_B
OEB_B
DNC
DNC
D0_B
D1_B
D2_B
DRGND
DRVDD
D3_B
D4_B
D5_B
C24
1nF
C21
1nF
AVDD
CLK_A
SHARED_REF
MUX_SELECT
PDWN_A
OEB_A
OTR_A
D11_A (MSB)
D10_A
D9_A
D8_A
DRGND
DRVDD
D7_A
D6_A
D5_A
D4_A
U1 A/D CONVERTER AD9238
D3_A
D2_A
D1_A
D0_A
DNC
DNC
DRVDD
DRGND
OTR_B
D11_B (MSB)
D10_B
D9_B
D8_B
D7_B
D6_B
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
ADCLK
R10
0
4.7k
R15
0
R11
100
JP2
SHARED
REF
Y
R14
+3.3VADDIG
OTR_A
D11_A
D10_A
D9_A
D8_A
C23
0.1µF
D7_A
D6_A
D5_A
D4_A
D3_A
D2_A
D1_A
D0_A
DNC
DNC
C13
1nF
OTR_B
D11_B
D10_B
D9_B
D8_B
D7_B
D6_B
N
+3.3VADDIG
C25
1nF
C14
0.1µF
C11
+
10µF
6.3V
03199-092
Figure 92. Converter Schematic, TGC Using an AD8332 and AD9238
Rev. G | Page 36 of 56
AD8331/AD8332/AD8334
U10
U7
VCC
GND
VCC
GND
20
+
10
18
Y1
17
Y2
16
Y3
15
Y4
14
Y5
13
Y6
12
Y7
11
Y8
C3
0.1µF
C28
10µF
6.3V
+3.3VDVDD
+3.3VDVDD
20
10
18
Y1
17
Y2
16
Y3
15
Y4
14
Y5
13
Y6
12
Y7
11
Y8
C8
0.1µF
C10
0.1µF
+
C76
10µF
6.3V
OTR_A
D11_A
D10_A
D9_A
D8_A
D7_A
D6_A
D5_A
D4_A
D3_A
D2_A
D1_A
D0_A
DNC
DNC
DATACLKA
22 × 4
1
RP 9
2
3
4
1
22 × 4
RP 10
2
3
4
1
22 × 4
RP 11
2
3
4
1
22 × 4
RP 12
2
3
4
1
G1
74VHC541
19
G2
2
8
A1
7
3
A2
4
6
A3
5
5
A4
8
6
A5
7
7
A6
6
8
A7
5
9
A8
1
G1
74VHC541
19
G2
8
2
A1
3
7
A2
6
4
A3
5
5
A4
8
6
A5
7
7
A6
8
6
A7
5
9
A8
R40
22
22 × 4
18
RP 1
7
2
6
3
54
18
22 × 4
RP2
7
2
6
3
54
18
22 × 4
RP 3
7
2
6
3
54
18
22 × 4
RP 4
7
2
6
3
54
2
4
6
8
10
12
14
HEADER UP MALE NO SHROUD
16
18
20
22
24
2625
2827
30
34
36
38
40
SAM080UPM
1
3
5
7
9
11
13
15
17
19
21
23
29
3132
33
35
37
39
+3.3VDVDD
OTR_B
D11_B
D10_B
D9_B
D8_B
D7_B
D6_B
D5_B
D4_B
D3_B
D2_B
D1_B
D0_B
DNC
DNC
19
8
1
22 × 4
RP 13
7
2
6
3
5
4
22 × 4
8
1
RP 14
7
2
6
3
5
4
18
22 × 4
RP 15
19
7
2
6
3
5
4
22 × 4
8
1
RP 16
7
2
6
3
5
4
DATACLK
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
G1
74VHC541
G2
A1
A2
A3
A4
A5
A6
A7
A8
G1
74VHC541
G2
A1
A2
A3
A4
A5
A6
A7
A8
20
U2
VCC
10
GND
18
Y1
17
Y2
16
Y3
15
Y4
14
Y5
13
Y6
12
Y7
11
Y8
+3.3VDVDD
20
VCC
U3
10
GND
18
Y1
17
Y2
16
Y3
15
Y4
14
Y5
13
Y6
12
Y7
11
Y8
++
C7
0.1µFC90.1µF
C4
0.1µFC50.1µFC60.1µF
C27
10µF
6.3V
+
C75
10µF
6.3V
22 × 4
18
RP 5
2
3
22 × 4
1
RP 6
2
3
18
22 × 4
RP 7
2
3
18
22 × 4
RP 8
2
3
R39
22
7
6
54
8
7
6
54
7
6
54
7
6
54
42
44
46
4847
52
HEADER UP MALE NO SHROUD
5453
5655
58
60
62
64
66
68
70
72
74
76
78
80
SAM080UPM
41
43
45
4950
51
57
59
61
63
65
67
69
71
73
75
77
79
03199-093
Figure 93. Interface Schematic, TGC Using an AD8332 and AD9238
Rev. G | Page 37 of 56
AD8331/AD8332/AD8334
CH3 LNA INPUT
CH4 LNA INPUT
16
INH3
COM3
COM4
INH4
20
LMD4
21
NC
222324
LON4
LOP4
VIP4
VIN4
VPS4
GAIN34
282526 27171819
CLMP34
29
HILO
303132
VCM4
VCM3
COM34
NC
CH2 LNA INPUT
CH1 LNA INPUT
15
14
13912
LON3
NC
LMD3
VOH4
VPS34
VOL4
11
10
VIN3
VIP3
LOP3
COM34
VOH3
VOL3
VPS3
NC
LOCATED ON WIRING SIDE
8
7
6
514
LOP2
VIP2
VIN2
VPS2
POWER SUPPLY DECOUPLI NG
AD8334
COM12
MODE
VOH2
VOL2
3
2
INH2
LMD2
NC
LON2
GAIN12
CLMP12
VPS12
VOL1
COM12
VOH1
COM2
COM1
INH1
LMD1
NC
LON1
LOP1
VIP1
VIN1
VPS1
EN12
EN34
VCM1
VCM2
64
58 575962 616063
50 4956555154 5352
03199-094
48
35
36
37
34
33
NC = NO CONNECT
CH4 DIFFERENT IAL
OUTPUT
384239
CH3 DIFFERENT IAL
OUTPUT
40
41
43
CH2 DIFFERENT IAL
OUTPUT
45
44
47
46
CH1 DIFFERENT IAL
OUTPUT
Figure 94. Compact Signal Path and Board Layout for the AD8334
Rev. G | Page 38 of 56
AD8331/AD8332/AD8334
AD8331 EVALUATION BOARD
GENERAL DESCRIPTION
The AD8331 evaluation board is a platform for testing and
evaluating the AD8331 variable gain amplifier (VGA). The
board is provided completely assembled and tested; the user
simply connects an input signal, VGAIN sources, and a 5 V
power supply. The AD8331-EVALZ is lead free and RoHS
compliant. Figure 95 is a photograph of the board.
USER-SUPPLIED OPTIONAL COMPONENTS
As shown in the schematic in Figure 96, the board provides for
optional components. The components shown in black are for
typical operation, and the components shown in gray are
installed at the user’s discretion.
As shipped, the LNA input impedance of the AD8331-EVALZ is
configured for 50 to accommodate most signal generators and
network analyzers. Input impedances up to 6 kΩ are realized by
changing the values of RFB and CSH. Refer to the Theory of
Operation section for details on this circuit feature. See Table 9
for typical values of input impedance and corresponding
components.
Table 9. LNA External Component Values for Common
Source Impedances
RIN (Ω) RFB (Ω, Nearest 1% Value) CSH (pF)
50 274 22
75 412 12
100 562 8
200 1.13 k 1.2
500 3.01 k None
6 k ∞ None
The board is designed for 0603 size, surface-mount components.
Back-to-back diodes can be installed at Location D3 if desired.
To evaluate the LNA as a standalone amplifier, install optional
SMA connectors LON and LOP and capacitors C1 and C2;
typical values are 0.1 µF or smaller. At R4 and R8, 0 resistors
are installed unless capacitive loads larger than 10 pF are connected
to the SMA connectors LON and LOP (such as coaxial cables).
In that event, small value resistors (68 to 100 ) must be
installed at R4 and R8 to preserve the stability of the amplifier.
A resistor can be inserted at RCLMP if output clamping is
desired. Refer to Tab le 8 for appropriate values.
MEASUREMENT SETUP
The basic board connection for measuring bandwidth is shown
in Figure 97. A 5 V, 100 mA minimum power supply and a low
noise, voltage reference supply for GAIN are required. Table 1 0
lists jumpers, and Figure 97 shows their functions and positions.
The preferred signal detection method is a differential probe
connected to VO, as shown in Figure 97. Single-ended loads can be
connected using the board edge SMA connector, VOH. Be sure to
take into account the 25.8 dB attenuation incurred when using the
board in this manner. For connection to an ADC, the 270 series
resistors can be replaced with 0 or other appropriate values.
Table 10. Jumper Functions
Switch Function
LNA_EN Enables the LNA when in the top position
VGA_EN Enables the VGA when in the top position
W5, W6 Connects the AD8331 outputs to the SMA connectors
GN_SLOPE Left = gain increases with V
Right = gain decreases with V
GN_HI_LO Left = high gain
Right = LO gain
BOARD LAYOUT
The evaluation board circuitry uses four conductor layers. The
two inner layers are grounded, and all interconnecting circuitry
is located on the outer layers. Figure 99 to Figure 102 illustrate
the copper patterns.
Figure 95. Photograph of AD8331-EVALZ
GAIN
GAIN
03199-115
Rev. G | Page 39 of 56
AD8331/AD8332/AD8334
V
AD8331 EVALUATION BOARD SCHEMATICS
+5
GNDGND2GND1
GND4GND3
INPUT
CLAMP
DIODES
LNA2
120nH FB
PROBE
3D1
L1
BAT64-04
LON
LOP
C
0.1µF
120nH FB
+5V
R4
R8
GN_SLOPE
INH
LO
L2
CSH
22pF
+
C1
C2
0.1µF
C16
C3
10µF
10V
+5V
CLMD
0.1µF
CFB
0.018µF
RFB
274µF
C6
0.1µF
C14
0.1µF
DOWN
UP
1
LMD2
2
INH
3
VPS
AD8331ARQ
4
LON
5
LOP
6
COML
7
VIP
8
VIN
9
MODE
DUT
COMM
ENB
ENBV
COMM
VOL
VOH
VPOS
HILO
CLMP
20
19
18
17
16
15
14
13
12
LNA_EN
VGA_EN
L3
120nH FB
R44
100
R43
100
L4
120nH FB
C32
0.1µF
GN_HI_LO
RCLMP
C17
0.1µF
ENABLE
DISABLE
VO
L5
120nH FB
HI
LO
RCLMP
+5V
ENABLE
DISABLE
W5
W6
C24
0.1µF
C26
0.1µF
+5V
R16
237
R20
237
1:1
T1
VOH
COMPONENTS IN GRAY ARE
OPTIONAL AND USER SUPPLI ED.
GAIN
C34
1nF
10
GAIN
VCM
11
C18
0.1µF
VCM
03199-116
Figure 96. Schematic of the AD8331 Evaluation Board
Rev. G | Page 40 of 56
AD8331/AD8332/AD8334
DP8200 PRECISIO N VOLTAG E REFERENCE
(FOR VGAIN)
4395A ANALYZER
GND
1103 TEKPROBE
POWER SUPPLY
POWER SUPPLY
+5V
GND
DIFFERENTIAL PROBE
TO VO PINS
INSERT JUMPERS W5 AND W6
TO USE OUTPUT
TRANSFORMER AND VO H SMA
E3631A
03199-117
Figure 97. AD8331 Typical Board Test Connections
Rev. G | Page 41 of 56
AD8331/AD8332/AD8334
AD8331 EVALUATION BOARD PCB LAYERS
Figure 98. AD8331-EVALZ Assembly
3199-118
03199-201
Figure 101. Internal Layer Ground
Figure 99. Primary Side Copper
Figure 100. Secondary Side Copper
03199-199
Figure 102. Power Plane
03199-200
Figure 103. Top Silkscreen
03199-202
03199-119
Rev. G | Page 42 of 56
AD8331/AD8332/AD8334
AD8332 EVALUATION BOARD
GENERAL DESCRIPTION
The AD8332-EVALZ is a platform for the testing and evaluation of
the AD8332 variable gain amplifier (VGA). The board is shipped
assembled and tested, and users need only connect the signal
and VGAIN sources to a single 5 V power supply. Figure 104 is a
photograph of the component side of the board, and Figure 105
shows the schematic. The AD8332-EVALZ is lead free and
RoHS compliant.
Table 11. LNA External Component Values for Common
Source Impedances
50 274 22
75 412 12
100 562 8
200 1.13 k 1.2
500 3.01 k None
6 k
SMA connectors, S2, S3, S6, and S7, are provided for access to
the LNA outputs or the VGA inputs. If the LNA is used alone,
0.1 µF coupling capacitors can be installed at the C5, C9, C23,
and C24 locations. Resistors of 68 Ω to 100 Ω may be required
if the load capacitances, as seen by the LNA outputs, are larger
than approximately 10 pF.
A resistor can be inserted at RCLMP if output clamping is desired.
The peak-to-peak clamping level is adjusted by installing one of
the standard 1% resistor values listed in Table 8 .
A high frequency differential probe connected to the 2-pin headers,
VOx, is the preferred method to observe a waveform at the VGA
output. A typical setup is shown in Figure 106. Single-ended loads
can be connected directly via the board edge SMA connectors.
Note that the AD8332 output amplifier is buffered with 237 Ω
resistors; therefore, be sure to compensate for attenuation if low
impedances are connected to the output SMAs.
∞
None
Figure 104.Photograph of the AD8332-EVALZ
03199-131
USER-SUPPLIED OPTIONAL COMPONENTS
The board is built and tested using the components shown in
black in Figure 105. Provisions are made for optional components
(shown in gray) that can be installed for testing at user discretion.
The default LNA input impedance is 50 Ω to match various
signal generators and network analyzers. Input impedances up to
6 kΩ are realized by changing the values of RFBx and CSHx. For
reference, Ta ble 11 lists the common input impedance values
and corresponding adjustments. The board is designed for 0603
size, surface-mount components.
MEASUREMENT SETUP
The basic board connections for measuring bandwidth are
shown in Figure 106. A 5 V, 100 mA (minimum) power supply
is required, and a low noise voltage reference supply is required
for VGAIN.
BOARD LAYOUT
The evaluation board circuitry uses four conductor layers.
The two inner layers are power and ground planes, and all
interconnecting circuitry is located on the outer layers. Figure 108
to Figure 111 illustrate the copper patterns.
Rev. G | Page 43 of 56
AD8331/AD8332/AD8334
V
EVALUATION BOARD SCHEMATICS
+5
GNDGND4GND3GND2GND1
VOH2
+
C25
10µF
LNA2
T2
1:1
L1
120nH FB
L8
120nH FB
+5V
C9
C5
R13
237
R14
237
R10
R12
0.1µF
0.1µF
+5VLNA
C11
C12
S6
LON2
S7
LOP2
COMPONENTS IN GRAY ARE
OPTIONAL AND USER SUPPLI ED.
C4
0.1µF
CAL2
W8
TP3
CLAMP
RCLMP
W12
VO2
W13
0.1µF
C16
0.1µF
W6
CSH2
C6
VCM2
GAIN
22pF
0.1µF
1nF
120nH FB
R7
100
R8
100
L4
120nH FB
1
LMD2
C2
0.1µF
2
INH2
CFB2
18nF
3
VPS2
RFB2
274
C14
0.1µF
C8
C20
0.1µF
L3
C10
AD8332ARUZ
4
LON2
5
LOP2
6
COM2
7
VIP2
8
VIN2
9
VCM2
10
GAIN
11
RCLMP
12
VOH2
13
VOL2
1415
COMM
LMD1
INH1
VPS1
LON1
LOP1
COM1
VIP1
VIN1
VCM1
HILO
ENB
VOH1
VOL1
VPSV
C22
0.1µF
28
27
26
25
24
23
22
21
20
19
18
17
16
C1
0.1µF
CFB1
18nF
RFB1
274
C13
0.1µF
C17
0.1µF
W5
L6
120nH FB
R5
100
R6
100
L5
120nH FB
120nH FB
L7
CSH1
22pF
+5V
HI
LO
W4
C7
0.1µF
C15
0.1µF
VCM1
W9
+5V
ENABLE
DISABLE
W7
VO1
+5V
0.1µF
CAL1
R11
W10
W11
C3
120nH FB
+5VLNA
R9
C19
0.1µF
C18
0.1µF
C23
C24
L2
LNA1
S2
LON1
S3
LOP1
R15
237
R16
237
1:1
T1
VOH1
3199-096
Figure 105. Schematic of the AD8332 Evaluation Board
Rev. G | Page 44 of 56
AD8331/AD8332/AD8334
NETWORK ANALYZER
1103 TEKPROBE
POWER SUPPLY
VGAIN SUPPLY
DIFFERENTIAL PROBE
03199-120
Figure 106. AD8332 Typical Board Test Connections
Rev. G | Page 45 of 56
AD8331/AD8332/AD8334
AD8332 EVALUATION BOARD PCB LAYERS
Figure 107. AD8332-EVALZ Assembly
03199-101
03199-121
Figure 110. Ground Plane
3199-102
03199-103
Figure 108. Primary Side Copper
Figure 109. Secondary Side Copper
03199-099
Figure 111. Power Plane
03199-100
Figure 112. Component Side Silkscreen
Rev. G | Page 46 of 56
AD8331/AD8332/AD8334
AD8334 EVALUATION BOARD
GENERAL DESCRIPTION
The AD8334-EVALZ is a platform for the testing and evaluation of
the AD8334 variable gain amplifier (VGA). The board is shipped
assembled and tested, and users need only connect the signal
and VGAIN sources and a single 5 V power supply. Figure 113
is a photograph of the board. The AD8334-EVALZ is lead free
and RoHS compliant.
03199-122
Figure 113. AD8334-EVALZ Top View
Rev. G | Page 47 of 56
AD8331/AD8332/AD8334
CONFIGURING THE INPUT IMPEDANCE
The board is built and tested using the components shown in
black in Figure 115. Provisions are made for optional components
(shown in gray) that can be installed at user discretion. As
shipped, the input impedances of the low noise amplifiers (LNAs)
are configured for 50 Ω to match the output impedances of most
signal generators and network analyzers. Input impedances up to
6 kΩ can be realized by changing the values of the feedback
resistors, R
FB1
, R
and C12. For reference, Table 12 lists standard values of 1%
resistors for some typical values of input impedance. Of course,
if the user has determined that the source impedance falls
between these values, the feedback resistor value can be
calculated accordingly. Note that the board is designed to accept
standard surface-mount, size 0603 components.
Table 12. LNA External Component Values for Common
Source Impedances
50 274 22
75 412 12
100 562 8
200 1.13 k 1.2
500 3.01 k No capacitor
6 k No resistor No capacitor
FB2, RFB3
, R
, and shunt capacitors, C6, C8, C10,
FB4
Viewing Signals
The preferred signal detector is a high impedance differential
probe, such as the Tektronix P6247, 1 GHz differential probe,
connected to the 2-pin headers (VO1, VO2, VO3, or VO4), as
shown in Figure 116. The low capacitance of this probe has the
least effect on the performance of the device of any detection
method tried. The probe can also be used for monitoring input
signals at IN1, IN2, IN3, or IN4. It can be used for probing
other circuit nodes; however, be aware that the 200 kΩ input
impedance can affect certain circuits.
Differential-to-single-ended transformers are provided for
single-ended output connections. Note that series resistors are
provided to protect against accidental output overload should a
50 Ω load be connected to the connector. Of course, the effect
of these resistors is to limit the bandwidth. If the load connected
to the SMA is >500 Ω, the 237 Ω series resistors, RX1, RX2, RX3,
RX4, RX5, RX6, RX7, and RX8, can be replaced with 0 Ω values.
Driving the VGA from an External Source or Using the
LNA to Drive an External Load
Appropriate components can be installed if the user wants to
drive the VGA directly from an external source or to evaluate
the LNA output. If the LNA is used to drive off-board loads
or cables, small value series resistors (47 Ω to 100 Ω) are
recommended for LNA decoupling. These can be installed
in the R10, R11, R14, R15, R18, R19, R22, and R23 spaces.
Provisions are made for surface-mount SMA connectors that
can be used for driving from either direction. If the LNA is not
used, it is recommended that the capacitors, C16, C17, C21,
C22, C26, C27, C31, and C32, be carefully removed to avoid
driving the outputs of the LNAs.
Using the Clamp Circuit
The board is shipped with no resistors installed in the spaces
provided for clamp-circuit operation. Note that each pair of
channels shares a clamp resistor. If the output clamping is
desired, the resistors are installed in R49 and R50. The peak-topeak clamping level is application dependent.
Figure 114. AD8334-EVALZ Assembly
MEASUREMENT SETUP
The basic board connections for measuring bandwidth are
shown in Figure 116. A 5 V, 200 mA (minimum) power supply
is required, and a low noise voltage reference supply is required
for VGAIN.
BOARD LAYOUT
The evaluation board circuitry uses four conductor layers. The
two inner layers are ground, and all interconnecting circuitry is
located on the outer layers. Figure 117 to Figure 120 illustrate
the copper patterns.
03199-123
Rev. G | Page 48 of 56
AD8331/AD8332/AD8334
V
V
EVALUATION BOARD SCHEMATICS
+5V
GND1 GND2 GND3GND6GND5GND4
+
C14
10 µF
ICR1
12
CR1
C7
CF B2
L7
12 0 nH
12 0 nH
1
L6
L2
L3
LO2
R18
R19
0.1µF
IN2
R14
0
1
R15
0
0.1 µF
1
1
C9
0.1 µF
IN3
RFB2
27 4
1
1
C71
0.1 µF
0.1 µF
0.1 µF
INH2
CR2
INH3
120 nH
ICR2
2
1
3
+5 V
+5 V
LO3
12 0 n H
ICR3
12
3
CR3
NOTES
1
COMPONENTS IN GRAY ARE OPTIONAL USER SUPPLIED.
2
NC = NO CONNECT.
18 n F
C22
C69
C27
C10
22 pF
0.1 µF
0.1 µF
RFB3
274
CFB3
18 nF
C8
22 p F
C2
C21
0.1 µF
C26
C3
0.1µF
22 pF
3
64
1
INH2
2
LM D 2
3
NC
4
LO N2
5
LO P2
6
VIP2
7
VIN2
8
VPS2
9
VPS3
10
VIN3
11
VIP3
12
LO P3
13
LO N3
14
NC
15
LM D 3
16
INH3
22 pF
ICR4
12
3
INH1
1
L5
12 0 nH
IN1
0.1 µF
C6
63
COM2
C5
CFB1
18 nF
0.1µF
IN H1
COM1
LO1
1
NC
R11
0.1 µF
57
58
5962 61 60
LOP1
LON1
R1 0
RFB1
274
C1
LMD1
AD8334
COM4
COM3
C12
0.1 µF
C11
IN H4
20
CFB4
18 nF
L8
12 0 nH
LMD4
C4
0.1µF
IN4
RFB4
274
R22
NC
1
LON4
LO4
LOP4
23
24
0.1 µF
C32
0.1 µF
R23
1
CR4
Figure 115. AD8334-EVALZ Schematic
1
C17
0.1 µF
C16
C31
12 0 nH
VIP1
VIP4
25 26 2717 18 1921 22
12 0 nH
1
VIN1
VIN4
+5V
+5
R49
4. 02k
L1
CLMP12
C67
µF
C8 2
1nF
C53
0.1
0.1µF
VPS1
GAIN12
VPS4
28
µF
C80
1nF
C13
0.1
L4
GAIN34GAIN34
EN12
CLMP12
CLMP34
29
µF
C55
0.1
CLMP34
R50
4.02k
EN12
HILO
+5
EN34
EDE
C57
D
0.1µF
50 4 956 555154 53 52
EN34
VCM1
COMM34
VCM4
VCM3
30 3132
C62
0.1µF
C64
0.1 µF
HI
VCM2
COM12
VP SV2
COM12
MODE
VPS34
COM34
3
NC
+5V
HILO
LO
VOH1
VOL1
VOL2
VOH2
NC
VOH3
VOL3
VOL4
VOH4
C59
0.1µF
3
L9
12 0 nH
RX1
100
RX2
100
L10
12 0 nH
48
47
46
45
44
43
+5V
42
D
41
SLOPE
U
40
39
38
37
36
35
34
33
C75
0.1µF
L1 1
120 nH
RX3
100
RX4
100
L1 3
120 nH
L14
12 0 nH
RX5
100
VO 3
RX6
100
L15
12 0 nH
VO 1
L12
120 nH F B
VO2
L34
120 n H
+5V
+5 V
C77
0.1µF
L16
12 0 nH
RX7
100
VO 4
RX8
10 0
L17
12 0 nH
03199-124
Rev. G | Page 49 of 56
AD8331/AD8332/AD8334
PRECISION VOLTAGE
REFERENCE (FO R VGAIN)
GAIN
CONTROL
VOLTAGE
GND
NETWORK ANALYZ ER
SIGNAL INPUT
PROBE
POWER
SUPPLY
+5V
DIFFERENTIAL PROBE
POWER SUPPLY
GND
03199-125
Figure 116. AD8334 Typical Board Test Connections (One Channel Shown)
Rev. G | Page 50 of 56
AD8331/AD8332/AD8334
AD8334 EVALUATION BOARD PCB LAYERS
3199-128
03199-126
Figure 117. AD8334-EVALZ Primary Side Copper
Figure 119. AD8334-EVALZ Inner Layer 1Copper
Figure 118. AD8334-EVALZ Secondary Side Copper
3199-127
Rev. G | Page 51 of 56
03199-129
Figure 120. AD8334-EVALZ Inner Layer 2 Copper
AD8331/AD8332/AD8334
Figure 121. AD8334-EVALZ Component Side Silkscreen
03199-130
Rev. G | Page 52 of 56
AD8331/AD8332/AD8334
C
Y
OUTLINE DIMENSIONS
9.80
9.70
9.60
PIN 1
0.15
0.05
OPLANARIT
0.10
28
0.65
BSC
0.30
0.19
COMPLIANT TO JEDEC STANDARDS MO-153-AE
1.20 MAX
SEATING
PLANE
15
4.50
4.40
4.30
0.20
0.09
6.40 BSC
8°
0°
0.75
0.60
0.45
141
Figure 122. 28-Lead Thin Shrink Small Outline Package (TSSOP)
(RU-28)
Dimensions shown in millimeters
0.345 (8.76)
0.341 (8.66)
0.337 (8.55)
20
11
0.158 (4.01)
0.154 (3.91)
0.150 (3.81)
101
0.244 (6.20)
0.236 (5.99)
0.228 (5.79)
0.065 (1.65)
0.049 (1.25)
0.010 (0.25)
0.004 (0.10)
COPLANARITY
0.004 (0.10)
8°
0°
0.010 (0.25)
0.006 (0.15)
0.050 (1.27)
0.016 (0.41)
0.069 (1.75)
0.053 (1.35)
SEATING
0.025 (0.64)
BSC
CONTROLL ING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIO NS
(IN PARENTHESES) ARE ROUNDED-O FF INCH EQ UIVALENTS FOR
REFERENCE ON LY AND ARE NOT APPROPRI ATE FOR USE IN DESIGN.
0.012 (0.30)
0.008 (0.20)
COMPLIANT TO JEDEC STANDARDS MO-137-AD
PLANE
0.020 (0.51)
0.010 (0.25)
0.041 (1.04)
REF
081908-A
Figure 123. 20-Lead Shrink Small Outline Package (QSOP)
(RQ-20)
Dimensions shown in Inches and (millimeters
Rev. G | Page 53 of 56
AD8331/AD8332/AD8334
C
PIN 1
ATO R
INDI
12° MAX
1.00
0.85
0.80
SEATING
PLANE
PIN 1
INDICATOR
0.08
0.60 MAX
25
24
EXPOSED
PAD
(BOTTOM VIEW)
17
16
3.50 REF
FOR PROPER CONNECTION O F
THE EXPOSED PAD, REFER TO
THE PIN CONF IGURATIO N AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
5.00
BSC SQ
TOP
VIEW
0.80 MAX
0.65 TYP
0.30
0.23
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
4.75
BSC SQ
0.20 REF
0.05 MAX
0.02 NOM
0.60 MAX
0.50
BSC
0.50
0.40
0.30
COPLANARIT Y
Figure 124. 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
5 mm × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters
9.00
BSC SQ
TOP
VIEW
8.75
BSC SQ
0.60 MAX
0.60 MAX
49
48
EXPOSED PAD
(BOTTOM VIEW)
PIN 1
32
9
INDICATOR
1
3.25
3.10 SQ
2.95
8
0.25 MIN
011708-A
0.30
0.25
0.18
64
1
PIN 1
INDICATOR
*
4.85
4.70 SQ
4.55
1.00
0.85
0.80
SEATING
PLANE
12° MAX
0.50
0.40
0.30
0.80 MAX
0.65 TYP
0.50 BSC
*
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
EXCEPT FO R EXPOSED PAD DI MENSION
0.20 REF
0.05 MAX
0.02 NOM
33
32
7.50
REF
16
17
FOR PROPER CONNECTION O F
THE EXPOSE D PAD, REFER T O
THE PIN CONF IGURATIO N AND
FUNCTION DESCRIPTIO NS
SECTION OF THIS DATA SHEET.
082908-B
Figure 125. 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
9 mm × 9 mm Body, Very Thin Quad
(CP-64-1)
Dimensions shown in millimeters
Rev. G | Page 54 of 56
AD8331/AD8332/AD8334
ORDERING GUIDE
Model1 Temperature Range Package Description Package Option
AD8331ARQ –40°C to +85°C 20-Lead Shrink Small Outline Package (QSOP) RQ-20
AD8331ARQ-REEL –40°C to +85°C 20-Lead Shrink Small Outline Package (QSOP) RQ-20
AD8331ARQ-REEL7 –40°C to +85°C 20-Lead Shrink Small Outline Package (QSOP) RQ-20
AD8331ARQZ –40°C to +85°C 20-Lead Shrink Small Outline Package (QSOP) RQ-20
AD8331ARQZ-RL –40°C to +85°C 20-Lead Shrink Small Outline Package (QSOP) RQ-20
AD8331ARQZ-R7 –40°C to +85°C 20-Lead Shrink Small Outline Package (QSOP) RQ-20
AD8331-EVALZ Evaluation Board with AD8331ARQ
AD8332ACP-R2 –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
AD8332ACP-REEL –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
AD8332ACP-REEL7 –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
AD8332ACPZ-R2 –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
AD8332ACPZ-R7 –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
AD8332ACPZ-RL –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
AD8332ARU –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD8332ARU-REEL –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD8332ARU-REEL7 –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD8332ARUZ –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD8332ARUZ-R7 –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD8332ARUZ-RL –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28
AD8332-EVALZ Evaluation Board with AD8332ARU
AD8334ACPZ –40°C to +85°C 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-64-1
AD8334ACPZ-REEL –40°C to +85°C 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-64-1
AD8334ACPZ-REEL7 –40°C to +85°C 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-64-1
AD8334-EVALZ Evaluation Board with AD8334ACP