Datasheet AD8331, AD8332, AD8334 Datasheet (ANALOG DEVICES)

Ultralow Noise VGAs with
VINV
O
V
Preamplifier and Programmable R

FEATURES

Ultralow noise preamplifier (preamp)
Voltage noise = 0.74 nV/√Hz Current noise = 2.5 pA/√Hz
3 dB bandwidth
AD8331: 120 MHz AD8332, AD8334: 100 MHz
Low power
AD8331: 125 mW/channel AD8332, AD8334: 145 mW/channel
Wide gain range with programmable postamp
−4.5 dB to +43.5 dB in LO gain mode
7.5 dB to 55.5 dB in HI gain mode Low output-referred noise: 48 nV/√Hz typical Active input impedance matching Optimized for 10-bit/12-bit ADCs Selectable output clamping level Single 5 V supply operation AD8332 and AD8334 available in lead frame chip scale package

APPLICATIONS

Ultrasound and sonar time-gain controls High performance automatic gain control (AGC) systems I/Q signal processing High speed, dual ADC drivers

GENERAL DESCRIPTION

The AD8331/AD8332/AD8334 are single-, dual-, and quad­channel, ultralow noise linear-in-dB, variable gain amplifiers (VGAs). Optimized for ultrasound systems, they are usable as a low noise variable gain element at frequencies up to 120 MHz.
Included in each channel are an ultralow noise preamp (LNA), an X-AMP® VGA with 48 dB of gain range, and a selectable gain postamp with adjustable output limiting. The LNA gain is 19 dB with a single-ended input and differential outputs. Using a single resistor, the LNA input impedance can be adjusted to match a signal source without compromising noise performance.
The 48 dB gain range of the VGA makes these devices suitable for a variety of applications. Excellent bandwidth uniformity is maintained across the entire range. The gain control interface provides precise linear-in-dB scaling of 50 dB/V for control voltages between 40 mV and 1 V. Factory trim ensures excellent part-to-part and channel-to-channel gain matching.
IN
AD8331/AD8332/AD8334

FUNCTIONAL BLOCK DIAGRAM

INH
LMD
LNA
19dB
VCM BIAS
IPLOPLON
48dB
ATTENUATO R
+
VGA BIAS AND
INTERPOLATOR
CM
V
MID
21dB
CONTROL
INTERFACE
3.5dB O R 15.5dB
GAIN
AD8331/AD8332/AD8334
GAIN
ENB
Figure 1. Signal Path Block Diagram
60
50
40
30
20
GAIN (dB)
10
0
–10
100k 1M 10M 100M 1G
V
= 1V
GAIN
V
= 0.8V
GAIN
V
= 0.6V
GAIN
V
= 0.4V
GAIN
V
= 0.2V
GAIN
V
= 0V
GAIN
FREQUENCY (Hz)
Figure 2. Frequency Response vs. Gain
Differential signal paths result in superb second- and third­order distortion performance and low crosstalk.
The low output-referred noise of the VGA is advantageous in driving high speed differential ADCs. The gain of the postamp can be pin selected to 3.5 dB or 15.5 dB to optimize gain range and output noise for 12-bit or 10-bit converter applications. The output can be limited to a user-selected clamping level, preventing input overload to a subsequent ADC. An external resistor adjusts the clamping level.
The operating temperature range is −40°C to +85°C. The AD8331 is available in a 20-lead QSOP package, the AD8332 is available in 28-lead TSSOP and 32-lead LFCSP packages, and the AD8334 is available in a 64-lead LFCSP package.
PA
CLAMP
HI GAIN
MODE
HIL
VOH
VOL
RCLMP
03199-002
03199-001
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AD8331/AD8332/AD8334

TABLE OF CONTENTS

Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 4
Absolute Maximum Ratings ............................................................ 7
ESD Caution .................................................................................. 7
Pin Configurations and Function Descriptions ........................... 8
Typical Performance Characteristics ........................................... 12
Test Circuits ..................................................................................... 20
Measurement Considerations ................................................... 20
Theory of Operation ...................................................................... 24
Overview ...................................................................................... 24
Low Noise Amplifier (LNA) ..................................................... 25
Variable Gain Amplifier ............................................................ 27
Postamplifier ............................................................................... 28
Applications Information .............................................................. 30
LNA—External Components .................................................... 30
Driving ADCs ............................................................................. 32
Overload ...................................................................................... 32
Optional Input Overload Protection ....................................... 32
Layout, Grounding, and Bypassing .......................................... 33
Multiple Input Matching ........................................................... 33
Disabling the LNA ...................................................................... 33
Ultrasound TGC Application ................................................... 34
High Density Quad Layout ....................................................... 34
AD8331 Evaluation Board ............................................................ 39
General Description ................................................................... 39
User-Supplied Optional Components ..................................... 39
Measurement Setup.................................................................... 39
Board Layout ............................................................................... 39
AD8331 Evaluation Board Schematics .................................... 40
AD8331 Evaluation Board PCB Layers ................................... 42
AD8332 Evaluation Board ............................................................ 43
General Description ................................................................... 43
User-Supplied Optional Components ..................................... 43
Measurement Setup.................................................................... 43
Board Layout ............................................................................... 43
Evaluation Board Schematics ................................................... 44
AD8332 Evaluation Board PCB Layers ................................... 46
AD8334 Evaluation Board ............................................................ 47
General Description ................................................................... 47
Configuring the Input Impedance ........................................... 48
Measurement Setup.................................................................... 48
Board Layout ............................................................................... 48
Evaluation Board Schematics ................................................... 49
AD8334 Evaluation Board PCB Layers ................................... 51
Outline Dimensions ....................................................................... 53
Ordering Guide .......................................................................... 55

REVISION HISTORY

10/10—Rev. F to Rev. G
Changes to Quiescent Current per Channel Parameter,
Table 1 ................................................................................................ 6
Changes to Pin 1, Table 3 ................................................................. 8
Changes to Pin 1 and Pin 28, Table 4 and Pin 4 and Pin 5,
Table 5 ................................................................................................ 9
Changes to Figure 6 and Table 6 ................................................... 10
Changes to Figure 33 ...................................................................... 16
Changes to Figure 64 ...................................................................... 22
Changes to Figure 70 ...................................................................... 24
Changes to Low Noise Amplifier (LNA) Section and
Figure 74 .......................................................................................... 25
Changes to Figure 94 ...................................................................... 38
Changes to General Descriptions Section, Figure 95 Caption,
Table 10, and Board Layout Section ............................................. 39
Changes to Figure 96 ...................................................................... 40
Changes to Figure 97 ...................................................................... 41
Changes to Figure 98 and Figure 103 ........................................... 42
Rev. G | Page 2 of 56
Deleted AD8331 Bill of Materials Section and Table 11;
Renumbered Sequentially ............................................................. 43
Changes to Figure 104 ................................................................... 43
Changes to Figure 106 ................................................................... 45
Changes to Figure 107 ................................................................... 46
Changes to Figure 113 ................................................................... 47
Changes to Figure 114 and Board Layout Section ..................... 48
Deleted AD8332 Bill of Materials Section and Table 13;
Renumbered Sequentially ............................................................. 48
Changes to Figure 115 ................................................................... 49
Changes to Figure 116 ................................................................... 50
Changes to Figure 117 to Figure 120 ........................................... 51
Changes to Figure 121 ................................................................... 52
Deleted AD8334 Bill of Materials Section and Table 15;
Renumbered Sequentially ............................................................. 54
AD8331/AD8332/AD8334
4/08—Rev. E to Rev. F
to R
Changed R
FB
Throughout ..................................................... 4
IZ
Changes to Figure 1 ........................................................................... 1
Changes to Table 1, LNA and VGA Characteristics, Output
Offset Voltage, Conditions ............................................................... 4
Changes to Quiescent Current per Channel and Power Down
Current Parameters ........................................................................... 6
Changes to Table 2 ............................................................................ 7
Changes to Table 3, Pin 1 Description ........................................... 8
Changes to Table 4, Pin 1 and Pin 28 Descriptions ...................... 9
Changes to Table 5, Pin 4 and Pin 5 Descriptions ........................ 9
Changes to Table 6, Pin 2, Pin 15, and Pin 20 Descriptions ...... 10
Changes to Table 6, Pin 61 Description ....................................... 11
Changes to Typical Performance Characteristics Section,
Default Conditions .......................................................................... 12
Changes to Figure 25 ...................................................................... 15
Changes to Figure 39 ...................................................................... 17
Changes to Figure 55 Through Figure 68 ................................... 20
Changes to Theory of Operation, Overview Section ................. 24
Changes to Low Noise Amplifier Section and Figure 74 ........... 25
Changes to Active Impedance Matching Section, Figure 75,
and Figure 77 ................................................................................... 26
Changes to Figure 78 ...................................................................... 27
Changes to Equation 6, Table 7, Figure 81, and Figure 82 ......... 30
Changes to Figure 83 ...................................................................... 31
Changes to Figure 88 ...................................................................... 32
Switched Figure 89 and Figure 90 ................................................. 33
Changes to Figure 89 ...................................................................... 33
Changes to Ultrasound TGC Application Section...................... 34
Incorporated AD8331-EVAL Data Sheet, Rev. A ....................... 39
Changes to User-Supplied Optional Components Section
and Measurement Setup Section ................................................... 39
Changes to Figure 95 ...................................................................... 39
Changes to Figure 97 ...................................................................... 41
Added Figure 98 .............................................................................. 42
Incorporated AD8332-EVALZ Data Sheet, Rev. D ..................... 44
Incorporated AD8334-EVAL Data Sheet, Rev. 0 ........................ 49
Updated Outline Dimensions ........................................................ 55
Changes to Ordering Guide ........................................................... 57
4/06—Rev. D to Rev. E
Added AD8334 ................................................................... Universal
Changes to Figure 1 and Figure 2 .................................................... 1
Changes to Table 1 ............................................................................ 4
Changes to Table 2 ............................................................................ 7
Changes to Figure 7 through Figure 9 and Figure 12 ................. 12
Changes to Figure 13, Figure 14, Figure 16, and Figure 18 ....... 13
Changes to Figure 23 and Figure 24 ............................................. 14
Changes to Figure 25 through Figure 27 ...................................... 15
Changes to Figure 31 and Figure 33 through Figure 36 ............ 16
Changes to Figure 37 through Figure 42 ...................................... 17
Changes to Figure 43, Figure 44, and Figure 48 .......................... 18
Changes to Figure 49, Figure 50, and Figure 54 .......................... 19
Inserted Figure 56 and Figure 57 .................................................. 20
Inserted Figure 58, Figure 59, and Figure 61 ............................... 21
Changes to Figure 60 ...................................................................... 21
Inserted Figure 63 and Figure 65 .................................................. 22
Changes to Figure 64 ...................................................................... 22
Moved Measurement Considerations Section ............................ 23
Inserted Figure 67 and Figure 68 .................................................. 23
Inserted Figure 70 and Figure 71 .................................................. 24
Change to Figure 72 ........................................................................ 24
Changes to Figure 73 and Low Noise Amplifier Section ........... 25
Changes to Postamplifier Section ................................................. 28
Changes to Figure 80 ...................................................................... 29
Changes to LNA—External Components Section ...................... 30
Changes to Logic Inputs—ENB, MODE, and HILO Section ... 31
Changes to Output Decoupling and Overload Sections ............ 32
Changes to Layout, Grounding, and Bypassing Section ............ 33
Changes to Ultrasound TGC Application Section ..................... 34
Added High Density Quad Layout Section ................................. 34
Inserted Figure 94 ........................................................................... 38
Updated Outline Dimensions ........................................................ 39
Changes to Ordering Guide ........................................................... 40
3/06—Rev. C to Rev. D
Updated Format ................................................................. Universal
Changes to Features and General Description .............................. 1
Changes to Table 1 ............................................................................ 3
Changes to Table 2 ............................................................................ 6
Changes to Ordering Guide ........................................................... 34
11/03—Rev. B to Rev. C
Addition of New Part ......................................................... Universal
Changes to Figures ............................................................. Universal
Updated Outline Dimensions ........................................................ 32
5/03—Rev. A to Rev. B
Edits to Ordering Guide ................................................................. 32
Edits to Ultrasound TGC Application Section ........................... 25
Added Figure 71, Figure 72, and Figure 73.................................. 26
Updated Outline Dimensions ........................................................ 31
2/03—Rev. 0 to Rev. A
Edits to Ordering Guide ................................................................. 32
Rev. G | Page 3 of 56
AD8331/AD8332/AD8334

SPECIFICATIONS

TA = 25°C, VS = 5 V, RL = 500 Ω, RS = RIN = 50 Ω, RIZ = 280 Ω, CSH = 22 pF, f = 10 MHz, R
−4.5 dB to +43.5 dB gain (HILO = LO), and differential output voltage, unless otherwise specified.
Table 1.
Parameter Test Conditions/Comments Min Typ Max Unit1
LNA CHARACTERISTICS
Gain Single-ended input to differential output 19 dB Input to output (single-ended) 13 dB
Input Voltage Range AC-coupled ±275 mV
Input Resistance RIZ = 280 Ω 50 Ω R R R R
= 412 Ω 75 Ω
IZ
= 562 Ω 100 Ω
IZ
= 1.13 kΩ 200 Ω
IZ
= ∞ 6
IZ
Input Capacitance 13 pF
Output Impedance Single-ended, either output 5 Ω
−3 dB Small Signal Bandwidth V
= 0.2 V p-p 130 MHz
OUT
Slew Rate 650 V/μs
Input Voltage Noise RS = 0 Ω, HI or LO gain, RIZ = ∞, f = 5 MHz 0.74 nV/√Hz
Input Current Noise RIZ = ∞, HI or LO gain, f = 5 MHz 2.5 pA/√Hz
Noise Figure f = 10 MHz, LOP output
Active Termination Match RS = RIN = 50 Ω 3.7 dB Unterminated RS = 50 Ω, RIZ = ∞ 2.5 dB
Harmonic Distortion at LOP1 or LOP2 V
= 0.5 V p-p, single-ended, f = 10 MHz
OUT
HD2 −56 dBc HD3 −70 dBc
Output Short-Circuit Current Pin LON, Pin LOP 165 mA LNA AND VGA CHARACTERISTICS
−3 dB Small Signal Bandwidth V
= 0.2 V p-p
OUT
AD8331 120 MHz AD8332, AD8334 100 MHz
−3 dB Large Signal Bandwidth V
= 2 V p-p
OUT
AD8331 110 MHz AD8332, AD8334 90 MHz
Slew Rate
AD8331 LO gain 300 V/μs HI gain 1200 V/μs AD8332, AD8334 LO gain 275 V/μs
HI gain 1100 V/μs Input Voltage Noise RS = 0 Ω, HI or LO gain, RIZ = ∞, f = 5 MHz 0.82 nV/√Hz Noise Figure V
= 1.0 V
GAIN
Active Termination Match RS = RIN = 50 Ω, f = 10 MHz, measured 4.15 dB R
= RIN = 200 Ω, f = 5 MHz, simulated 2.0 dB
S
Unterminated RS = 50 Ω, RIZ = ∞, f = 10 MHz, measured 2.5 dB
R
= 200 Ω, RIZ = ∞, f = 5 MHz, simulated 1.0 dB
S
Output-Referred Noise
AD8331 V V AD8332, AD8334 V
V
= 0.5 V, LO gain 48 nV/√Hz
GAIN
= 0.5 V, HI gain 178 nV/√Hz
GAIN
= 0.5 V, LO gain 40 nV/√Hz
GAIN
= 0.5 V, HI gain 150 nV/√Hz
GAIN
Output Impedance, Postamplifier DC to 1 MHz 1 Ω
= ∞, CL = 1 pF, VCM pin floating,
CLMP
Rev. G | Page 4 of 56
AD8331/AD8332/AD8334
Parameter Test Conditions/Comments Min Typ Max Unit1
Output Signal Range, Postamplifier RL ≥ 500 Ω, unclamped, either pin VCM ± 1.125 V
Differential 4.5 V p-p
Output Offset Voltage
AD8331 Differential, V Common mode −125 −25 +100 mV AD8332, AD8334 Differential, 0.05 V ≤ V
Common mode −125 –25 +100 mV Output Short-Circuit Current 45 mA Harmonic Distortion V
= 0.5 V, V
GAIN
AD8331
HD2 f = 1 MHz −88 dBc HD3 −85 dBc HD2 f = 10 MHz −68 dBc HD3 −65 dBc
AD8332, AD8334
HD2 f = 1 MHz −82 dBc HD3 −85 dBc HD2 f = 10 MHz −62 dBc HD3 −66 dBc
Input 1 dB Compression Point V
= 0.25 V, V
GAIN
Two-Tone Intermodulation Distortion (IMD3)
AD8331 V
V
AD8332, AD8334 V
V
= 0.72 V, V
GAIN
= 0.5 V, V
GAIN
= 0.72 V, V
GAIN
= 0.5 V, V
GAIN
Output Third-Order Intercept
AD8331 V
V
AD8332, AD8334 V
V
Channel-to-Channel Crosstalk (AD8332, AD8334) V Overload Recovery V
= 0.5 V, V
GAIN
= 0.5 V, V
GAIN
= 0.5 V, V
GAIN
= 0.5 V, V
GAIN
= 0.5 V, V
GAIN
= 1.0 V, VIN = 50 mV p-p/1 V p-p, f = 10 MHz 5 ns
GAIN
Group Delay Variation 5 MHz < f < 50 MHz, full gain range ±2 ns
ACCURACY
Absolute Gain Error2 0.05 V < V
0.10 V < V
0.95 V < V Gain Law Conformance3 0.1 V < V Channel-to-Channel Gain Matching 0.1 V < V
GAIN
GAIN
GAIN CONTROL INTERFACE (Pin GAIN)
Gain Scaling Factor 0.10 V < V Gain Range LO gain −4.5 to +43.5 dB
HI gain 7.5 to 55.5 dB
Input Voltage (V
) Range 0 to 1.0 V
GAIN
Input Impedance 10 MΩ Response Time 48 dB gain change to 90% full scale 500 ns
COMMON-MODE INTERFACE (PIN VCMx)
Input Resistance4 Current limited to ±1 mA 30 Ω Output CM Offset Voltage VCM = 2.5 V −125 −25 +100 mV Voltage Range V
= 2.0 V p-p 1.5 to 3.5 V
OUT
= 0.5 V −50 ±5 +50 mV
GAIN
≤ 1.0 V −20 ±5 +20 mV
GAIN
= 1 V p-p, HI gain
OUT
= 1 V p-p, f = 1 MHz to 10 MHz 1 dBm
OUT
= 1 V p-p, f = 1 MHz −80 dBc
OUT
= 1 V p-p, f = 10 MHz −72 dBc
OUT
= 1 V p-p, f = 1 MHz −78 dBc
OUT
= 1 V p-p, f = 10 MHz −74 dBc
OUT
= 1 V p-p, f = 1 MHz 38 dBm
OUT
= 1 V p-p, f = 10 MHz 33 dBm
OUT
= 1 V p-p, f = 1 MHz 35 dBm
OUT
= 1 V p-p, f = 10 MHz 32 dBm
OUT
= 1 V p-p, f = 1 MHz −98 dB
OUT
< 0.10 V −1 +0.5 +2 dB
GAIN
< 0.95 V −1 ±0.3 +1 dB
GAIN
< 1.0 V −2 −1 +1 dB
GAIN
< 0.95 V ±0.2 dB < 0.95 V ±0.1 dB
< 0.95 V 48.5 50 51.5 dB/V
GAIN
Rev. G | Page 5 of 56
AD8331/AD8332/AD8334
Parameter Test Conditions/Comments Min Typ Max Unit1
ENABLE INTERFACE
(PIN ENB, PIN ENBL, PIN ENBV) Logic Level to Enable Power 2.25 5 V Logic Level to Disable Power 0 1.0 V
Input Resistance Pin ENB 25 kΩ Pin ENBL 40 kΩ Pin ENBV 70
Power-Up Response Time V V HILO GAIN RANGE INTERFACE (PIN HILO)
Logic Level to Select HI Gain Range 2.25 5 V
Logic Level to Select LO Gain Range 0 1.0 V
Input Resistance 50 kΩ OUTPUT CLAMP INTERFACE (PIN RCLMP; HI OR
LO GAIN)
Accuracy
HILO = LO R HILO = HI R
MODE INTERFACE (PIN MODE)
Logic Level for Positive Gain Slope 0 1.0 V
Logic Level for Negative Gain Slope 2.25 5 V
Input Resistance 200 kΩ POWER SUPPLY (PIN VPS1, PIN VPS2,
PIN VPSV, PIN VPSL, PIN VPOS)
Supply Voltage 4.5 5.0 5.5 V
Quiescent Current per Channel
AD8331 20 25 mA AD8332 22 27.5 32 mA AD8334 24 29.5 34
Power Dissipation per Channel No signal
AD8331 125 mW AD8332, AD8334 138 mW
Power-Down Current VGA and LNA disabled
AD8331 50 240 400 μA AD8332 50 300 600 μA AD8334 50 600 1200 μA
LNA Current
AD8331 (ENBL) Each channel 7.5 11 15 mA AD8332, AD8334 (ENBL) Each channel 7.5 12 15 mA
VGA Current
AD8331 (ENBV) 7.5 14 20 mA AD8332, AD8334 (ENBV) 7.5 17 20 mA
PSRR V
1
All dBm values are referred to 50 Ω.
2
The absolute gain refers to the theoretical gain expression in Equation 1.
3
Best-fit to linear-in-dB curve.
4
The current is limited to ±1 mA typical.
= 30 mV p-p 300 μs
INH
= 150 mV p-p 4 ms
INH
= 2.74 kΩ, V
CLMP
= 2.21 kΩ, V
CLMP
= 1 V p-p (clamped) ±50 mV
OUT
= 1 V p-p (clamped) ±75 mV
OUT
= 0 V, f = 100 kHz −68 dB
GAIN
Rev. G | Page 6 of 56
AD8331/AD8332/AD8334

ABSOLUTE MAXIMUM RATINGS

Table 2.
Parameter Rating
Voltage
Supply Voltage (VPSn, VPSV, VPSL, VPOS) 5.5 V Input Voltage (INHx) VS + 200 mV ENB, ENBL, ENBV, HILO Voltage VS + 200 mV GAIN Voltage 2.5 V
Power Dissipation
RU Package1 (AD8332) 0.96 W CP-32 Package (AD8332) 1.97 W RQ Package1 (AD8331) 0.78 W CP-64 Package (AD8334) 0.91 W
Temperature
Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering 60 sec) 300°C
θJA
RU Package1 (AD8332) 68°C/W CP-32 Package22 (AD8332) 33°C/W RQ Package1 (AD8331) 83°C/W CP-64 Package3 (AD8334) 24.2°C/W
1
4-layer JEDEC board (2S2P).
2
Exposed pad soldered to board, nine thermal vias in pad—JEDEC, 4-layer
board J-STD-51-9.
3
Exposed pad soldered to board, 25 thermal vias in pad—JEDEC, 4-layer
board J-STD-51-9.
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

Rev. G | Page 7 of 56
AD8331/AD8332/AD8334

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

LMD
INH
VPSL
LON
LOP
COML
VIP
VIN
MODE
GAIN
1
2
3
4
5
6
(Not to Scale)
7
8
9
10
PIN 1 INDICATO R
AD8331
TOP VIEW
20
19
18
17
16
15
14
13
12
11
COMM
ENBL
ENBV
COMM
VOL
VOH
VPOS
HILO
RCLMP
VCM
03199-003
Figure 3. 20-Lead QSOP Pin Configuration (AD8331)
Table 3. 20-Lead QSOP Pin Function Description (AD8331)
Pin No. Mnemonic Description
1 LMD LNA Midsupply Bypass Pin; Connect a Capacitor for Midsupply HF Bypass 2 INH LNA Input 3 VPSL LNA 5 V Supply 4 LON LNA Inverting Output 5 LOP LNA Noninverting Output 6 COML LNA Ground 7 VIP VGA Noninverting Input 8 VIN VGA Inverting Input 9 MODE Gain Slope Logic Input 10 GAIN Gain Control Voltage 11 VCM Common-Mode Voltage 12 RCLMP Output Clamping Level 13 HILO Gain Range Select (HI or LO) 14 VPOS VGA 5 V Supply 15 VOH Noninverting VGA Output 16 VOL Inverting VGA Output 17 COMM VGA Ground 18 ENBV VGA Enable 19 ENBL LNA Enable 20 COMM VGA Ground
Rev. G | Page 8 of 56
AD8331/AD8332/AD8334
1
LMD2
INH2
VPS2
LON2
LOP2
COM2
VIP2
VIN2
VCM2
GAIN
RCLMP
VOH2
VOL2
COMM
2
3
4
5
6
7
(Not to Scale)
8
9
10
11
12
13
14
PIN 1 INDICATO R
AD8332
TOP VIEW
Figure 4. 28-Lead TSSOP Pin Configuration (AD8332)
28
LMD1
27
INH1
26
VPS1
25
LON1
24
LOP1
23
COM1
22
VIP1
21
VIN1
20
VCM1
19
HILO
18
ENB
17
VOH1
16
VOL1
15
VPSV
03199-004
LON1
VPS1
INH1
LMD1
LMD2
INH2
VPS2
LON2
NC = NO CONNECT
1
2
3
4
5
6
7
8
LOP1
COM1
PIN 1 INDICATO R
LOP2
COM2
VIP1
VIN1
VCM1
29303132 28 252627
AD8332
TOP VIEW
(Not to Scale)
VIP2
VIN2
VCM2
HILO
ENBL
ENBV
COMM
24
VOH1
23
VOL1
22
VPSV
21
20
NC
19
VOL2
18
VOH2
17
14139121110
15 16
GAIN
MODE
COMM
RCLMP
03199-005
Figure 5. 32-Lead LFCSP Pin Configuration (AD8332)
Table 4. 28-Lead TSSOP Pin Function Description (AD8332)
Pin No.
1 LMD2
Mnemonic Description
CH 2 LNA Midsupply Pin; Connect a
Capacitor for Midsupply HF Bypass 2 INH2 CH2 LNA Input 3 VPS2 CH2 Supply LNA 5 V 4 LON2 CH2 LNA Inverting Output 5 LOP2 CH2 LNA Noninverting Output 6 COM2 CH2 LNA Ground 7 VIP2 CH2 VGA Noninverting Input 8 VIN2 CH2 VGA Inverting Input 9 VCM2 CH2 Common-Mode Voltage 10 GAIN Gain Control Voltage 11 RCLMP Output Clamping Resistor 12 VOH2 CH2 Noninverting VGA Output 13 VOL2 CH2 Inverting VGA Output 14 COMM VGA Ground (Both Channels) 15 VPSV VGA Supply 5 V (Both Channels) 16 VOL1 CH1 Inverting VGA Output 17 VOH1 CH1 Noninverting VGA Output 18 ENB Enable—VGA/LNA 19 HILO VGA Gain Range Select (HI or LO) 20 VCM1 CH1 Common-Mode Voltage 21 VIN1 CH1 VGA Inverting Input 22 VIP1 CH1 VGA Noninverting Input 23 COM1 CH1 LNA Ground 24 LOP1 CH1 LNA Noninverting Output 25 LON1 CH1 LNA Inverting Output 26 VPS1 CH1 LNA Supply 5 V 27 INH1 CH1 LNA Input 28 LMD1
CH 1 LNA Midsupply Pin; Connect a
Capacitor for Midsupply HF Bypass
Table 5. 32-Lead LFCSP Pin Function Description (AD8332)
Pin No.
Mnemonic Description
1 LON1 CH1 LNA Inverting Output 2 VPS1 CH1 LNA Supply 5 V 3 INH1 CH1 LNA Input 4 LMD1
CH 1 LNA Midsupply Pin; Connect a Capacitor for Midsupply HF Bypass
5 LMD2
CH 2 LNA Midsupply Pin; Connect a
Capacitor for Midsupply HF Bypass 6 INH2 CH2 LNA Input 7 VPS2 CH2 LNA Supply 5 V 8 LON2 CH2 LNA Inverting Output 9 LOP2 CH2 LNA Noninverting Output 10 COM2 CH2 LNA Ground 11 VIP2 CH2 VGA Noninverting Input 12 VIN2 CH2 VGA Inverting Input 13 VCM2 CH2 Common-Mode Voltage 14 MODE Gain Slope Logic Input 15 GAIN Gain Control Voltage 16 RCLMP Output Clamping Level Input 17 COMM VGA Ground 18 VOH2 CH2 Noninverting VGA Output 19 VOL2 CH2 Inverting VGA Output 20 NC No Connect 21 VPSV VGA Supply 5 V 22 VOL1 CH1 Inverting VGA Output 23 VOH1 CH1 Noninverting VGA Output 24 COMM VGA Ground 25 ENBV VGA Enable 26 ENBL LNA Enable 27 HILO VGA Gain Range Select (HI or LO) 28 VCM1 CH1 Common-Mode Voltage 29 VIN1 CH1 VGA Inverting Input 30 VIP1 CH1 VGA Noninverting Input 31 COM1 CH1 LNA Ground 32 LOP1 CH1 LNA Noninverting Output
Rev. G | Page 9 of 56
AD8331/AD8332/AD8334
COM2
COM1
INH1
LMD1NCLON1
LOP1
VIP1
VIN1
VPS1
GAIN12
CLMP12
EN12
646362616059585756555453525150
EN34
VCM1
VCM2
49
INH2
LMD2
NC LON2 LOP2
VIP2
VIN2 VPS2 VPS3
VIN3
10
VIP3
11
LOP3
12
LON3
13
NC
14
LMD3
15
INH3
16
NOTES
1. THE EXPO SED PADDLE MUST BE SOLDERED TO THE PCB GROUND TO ENSURE PROPER HEAT DISSIPATION, NOISE, AND MECHANICAL STRENG TH BENEFITS.
2. NC = NO CONNECT .
PIN 1
1
INDICATOR
2 3 4 5 6 7 8 9
171819202122232425262728293031
COM3
COM4
INH4
LMD4
AD8334
TOP VIEW
(Not to Scale)
NC
LON4
VIP4
VIN4
HILO
VPS4
LOP4
VCM4
GAIN34
CLMP34
48
COM12
47
VOH1
46
VOL1
45
VPS12
44
VOL2
43
VOH2
42
COM12
41
MODE
40
NC
39
COM34
38
VOH3
37
VOL3
36
VPS34
35
VOL4
34
VOH4
33
COM34
32
NC
VCM3
03199-006
Figure 6. 64-Lead LFCSP Pin Configuration (AD8334)
Table 6. 64-Lead LFCSP Pin Function Description (AD8334)
Pin No. Mnemonic Description
1 INH2 CH2 LNA Input. 2 LMD2 CH 2 LNA Midsupply Pin; Connect a Capacitor for Midsupply HF Bypass. 3 NC Not Connected. 4 LON2 CH2 LNA Feedback Output (for RIZ). 5 LOP2 CH2 LNA Output. 6 VIP2 CH2 VGA Positive Input. 7 VIN2 CH2 VGA Negative Input. 8 VPS2 CH2 LNA Supply 5 V. 9 VPS3 CH3 LNA Supply 5 V. 10 VIN3 CH3 VGA Negative Input. 11 VIP3 CH3 VGA Positive Input. 12 LOP3 CH3 LNA Positive Output. 13 LON3 CH3 LNA Feedback Output (for RIZ). 14 NC Not Connected. 15 LMD3 CH 3 LNA Midsupply Pin; Connect a Capacitor for Midsupply HF Bypass. 16 INH3 CH3 LNA Input. 17 COM3 CH3 LNA Ground. 18 COM4 CH4 LNA Ground. 19 INH4 CH4 LNA Input. 20 LMD4 CH 4 LNA Midsupply Pin; Connect a Capacitor for Midsupply HF Bypass. 21 NC Not Connected. 22 LON4 CH4 LNA Feedback Output (for RIZ). 23 LOP4 CH4 LNA Positive Output. 24 VIP4 CH4 VGA Positive Input. 25 VIN4 CH4 VGA Negative Input. 26 VPS4 CH4 LNA Supply 5 V.
Rev. G | Page 10 of 56
AD8331/AD8332/AD8334
Pin No. Mnemonic Description
27 GAIN34 Gain Control Voltage for CH3 and CH4. 28 CLMP34 Output Clamping Level Input for CH3 and CH4. 29 HILO Gain Select for Postamp 0 dB or 12 dB. 30 VCM4 CH4 Common-Mode Voltage—AC Bypass. 31 VCM3 CH3 Common-Mode Voltage—AC Bypass. 32 NC No Connect. 33 COM34 VGA Ground CH3 and CH4. 34 VOH4 CH4 Positive VGA Output. 35 VOL4 CH4 Negative VGA Output. 36 VPS34 VGA Supply 5 V CH3 and CH4. 37 VOL3 CH3 Negative VGA Output. 38 VOH3 CH3 Positive VGA Output. 39 COM34 VGA Ground CH3 and CH4. 40 NC No Connect. 41 MODE Gain Control Slope, Logic Input, 0 = Positive. 42 COM12 VGA Ground CH1 and CH2. 43 VOH2 CH2 Positive VGA Output. 44 VOL2 CH2 Negative VGA Output. 45 VPS12 CH2 VGA Supply 5 V CH1 and CH2. 46 VOL1 CH1 Negative VGA Output. 47 VOH1 CH1 Positive VGA Output. 48 COM12 VGA Ground CH1 and CH2. 49 VCM2 CH2 Common-Mode Voltage—AC Bypass. 50 VCM1 CH1 Common-Mode Voltage—AC Bypass. 51 EN34 Shared LNA/VGA Enable CH3 and CH4. 52 EN12 Shared LNA/VGA Enable CH1 and CH2. 53 CLMP12 Output Clamping Level Input CH1 and CH2. 54 GAIN12 Gain Control Voltage CH1 and CH2. 55 VPS1 CH1 LNA Supply 5 V. 56 VIN1 CH1 VGA Negative Input. 57 VIP1 CH1 VGA Positive Input. 58 LOP1 CH1 LNA Positive Output. 59 LON1 CH1 LNA Feedback Output (for RIZ). 60 NC Not Connected. 61 LMD1 CH 1 LNA Midsupply Pin; Connect a Capacitor for Midsupply HF Bypass. 62 INH1 CH1 LNA Input. 63 COM1 CH1 LNA Ground. 64 COM2 CH2 LNA Ground. EPAD
The exposed paddle must be soldered to the PCB ground to ensure proper heat dissipation, noise, and mechanical strength benefits.
Rev. G | Page 11 of 56
AD8331/AD8332/AD8334

TYPICAL PERFORMANCE CHARACTERISTICS

TA = 25°C, VS = 5 V, RL = 500 Ω, RS = RIN = 50 Ω, RIZ = 280 Ω, CSH = 22 pF, f = 10 MHz, R
−4.5 dB to +43.5 dB gain (HILO = LO), and differential output voltage, unless otherwise specified.
60
50
40
30
20
GAIN (dB)
10
0
–10
0 0.2 0.4 0.6 0.8 1.0 1.1
Figure 7. Gain vs. V
ASCENDING GAIN MODE DESCENDI NG GAI N MODE
(WHERE AVAILABLE)
GAIN
HILO = HI
HILO = LO
V
(V)
GAIN
and MODE (MODE Available on RU Package)
2.0
1.5
1.0
0.5
0
–0.5
GAIN ERROR (dB)
–1.0
–1.5
–2.0
0 0.2 0.4 0.6 0.8 1.0 1.1
Figure 8. Absolute Gain Error vs. V
2.0
1.5
1.0
0.5
0
–0.5
GAIN ERROR (dB)
–1.0
–1.5
–2.0
0 0.2 0.4 0.6 0.8 1.0 1.1
Figure 9. Absolute Gain Error vs. V
1MHz
–40°C
10MHz
V
GAIN
30MHz
50MHz
70MHz
V
GAIN
(V)
at Three Temperatures
GAIN
(V)
at Various Frequencies
GAIN
03199-007
+25°C
+85°C
03199-008
03199-009
50
40
30
20
PERCENT OF UNI TS (%)
10
0 –0.5 –0.4 –0.3 –0.2 –0.1 0 0. 1 0.2 0.3 0.4 0.5
25
20
15
10
5
0
25
20
15
PERCENT OF UNI TS (%)
10
5
0
Figure 11. Gain Match Histogram for V
50
40
30
20
10
GAIN (dB)
0
–10
–20
100k 1M 10M 100M 500M
Figure 12. Frequency Response for Various Values of V
= ∞, CL = 1 pF, VCM pin floating,
CLMP
SAMPLE SIZE = 80 UNITS V
= 0.5V
GAIN
Figure 10. Gain Error Histogram
SAMPLE SIZE = 50 UNITS V
= 0.2V
GAIN
V
= 0.7V
GAIN
–0.17
–0.15
–0.13
–0.11
–0.09
CHANNEL TO CHANNEL G AIN MATCH (d B)
GAIN ERROR (dB)
–0.07
–0.05
–0.03
–0.01
V
= 1V
GAIN
V
= 0.8V
GAIN
V
= 0.6V
GAIN
V
= 0.4V
GAIN
V
= 0.2V
GAIN
V
= 0V
GAIN
FREQUENCY (Hz)
03199-010
03199-011
0.01
0.03
0.05
0.07
0.09
0.11
0.13
0.15
0.17
0.19
0.21
= 0.2 V and 0.7 V
GAIN
03199-012
GAIN
Rev. G | Page 12 of 56
AD8331/AD8332/AD8334
60
50
40
30
20
GAIN (dB)
10
0
V
V
V
V
V
V
GAIN
GAIN
GAIN
GAIN
GAIN
GAIN
= 1V
= 0.8V
= 0.6V
= 0.4V
= 0.2V
= 0V
0
V
= 1V p-p
OUT
–20
V
= 1.0V
GAIN
V
V
GAIN
GAIN
= 0.7V
= 0.4V
–40
–60
CROSSTALK (d B)
–80
–100
AD8332
AD8334
–10
100k 1M 10M 100M 500M
FREQUENCY (Hz)
Figure 13. Frequency Response for Various Values of V
, HILO = HI
GAIN
03199-013
30
V
= 0.5V
GAIN
20
10
0
GAIN (dB)
–10
–20
–30
100k 1M 10M 100M 500M
= RS = 75
R
IN
RIN = RS = 100
= RS = 200
R
IN
R
= RS = 500
IN
R
FREQUENCY (Hz)
= RS = 1k
IN
RIN = RS = 50
03199-014
Figure 14. Frequency Response for Various Matched Source Impedances
30
V
= 0.5V
GAIN
R
=
IZ
20
10
0
GAIN (dB)
–10
–20
–30
100k 1M 10M 100M 500M
Figure 15. Frequency Response, Unterminated LNA, R
FREQUENCY (Hz)
= 50 Ω
S
03199-015
–120
100k 1M 10M 100M
FREQUENCY (Hz)
03199-016
Figure 16. Channel-to-Channel Crosstalk vs.
Frequency for Various Values of V
50
45
40
35
30
1µF
25
COUPLING
20
GROUP DELAY (ns)
15
10
5
0 100k 1M 10M 100M
0.1µF COUPLING
FREQUENCY (Hz)
GAIN
03199-017
Figure 17. Group Delay vs. Frequency for Two Values of AC Coupling
20
HI GAIN
10
0
–10
–20
20
LO GAIN
10
OFFSET VOLTAGE (mV)
0
–10
–20
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
V
GAIN
(V)
T = +85°C T = +25°C T = –40°C
T = +85°C T = +25°C T = –40°C
03199-018
Figure 18. Representative Differential Output Offset Voltage vs.
at Three Temperatures
V
GAIN
Rev. G | Page 13 of 56
AD8331/AD8332/AD8334
R
IN
R
IZ
= 100,
= 549
50j
–50j
RIN = 50, R
IZ
R
= 200,
IN
R
= 1.1k
IZ
R
= 200
IN
R
IN
= 270
= 500
= 1k
R
IN
f
= 100kHz
RIN = 50
100j
–100j
IZ
R
= 100
IN
03199-022
35
30
25
20
15
% TOTAL
10
5
0
SAMPLE SIZE = 100
0.2V < V
49.6 50.550.450.350.250. 150. 049.949.849.7
< 0.7V
GAIN
GAIN SCALING FACTOR
Figure 19. Gain Scaling Factor Histogram
100
SINGLE ENDE D, PIN VOH O R PIN VOL R
=
L
10
1
OUTPUT IMPEDANCE ()
03199-019
25j
R
= 6k,
IN
R
=
IZ
0 17
RIN = 75, R
= 412
IZ
–25j
Figure 22. Smith Chart, S11 vs. Frequency,
0.1 MHz to 200 MHz for Various Values of R
20
VIN = 10mV p-p
15
10
5
0
GAIN (dB)
–5
0.1 100k 100M10M1M
Figure 20. Output Impedance vs. Frequency
10k
1k
100
INPUT IMPE DANCE ()
RIZ = 6.65k, CSH = 0pF R
10
R
100k 100M10M1M
Frequency for Various Values of R
FREQUENCY (Hz)
= , CSH = 0pF
R
IZ
= 3.01k, CSH = 0pF
IZ
= 1.1k, CSH = 1.2pF
IZ
FREQUENCY (Hz)
= 549, CSH = 8.2pF
R
IZ
= 412, CSH = 12pF
R
IZ
= 270, CSH = 22pF
R
IZ
Figure 21. LNA Input Impedance vs.
and CSH
IZ
–10
R
= 75
03199-020
–15
100k 1M 10M 100M 500M
FREQUENCY (Hz)
IN
03199-023
Figure 23. LNA Frequency Response, Single-Ended, for Various Values of RIN
20
15
RIZ =
10
5
0
GAIN (dB)
–5
–10
03199-021
–15
100k 1M 10M 100M 500M
FREQUENCY (Hz)
03199-024
Figure 24. Frequency Response for Unterminated LNA, Single-Ended
Rev. G | Page 14 of 56
AD8331/AD8332/AD8334
500
f
= 10MHz
400
300
200
100
OUTPUT-REF ERRED NOISE ( nV/ Hz)
0
HI GAIN
LO GAIN
0 0.2 0.4 0.6 0.8 1.0
AD8332 AD8334
AD8331
V
GAIN
(V)
Figure 25. Output-Referred Noise vs. V
2.5 RS = 0, RIZ = , V HILO = L O OR HI
2.0
GAIN
= 1V,
03199-025
GAIN
1.00 RS = 0, RIZ =,
V
= 1V, f = 10M Hz
GAIN
0.95
0.90
0.85
0.80
0.75
0.70
0.65
0.60
INPUT-REFERRE D NOISE (n V/ Hz)
0.55
0.50
–50 –30 –10 10 30 50 70 90
TEMPERATURE ( °C)
Figure 28. Short-Circuit, Input-Referred Noise vs. Temperature
10
f = 5MHz, RIZ =,
= 1V
V
GAIN
03199-028
1.5
1.0
INPUT-REFERRED NOISE (nV/ Hz)
0.5 100k 1M 10M 100M
FREQUENCY (Hz)
Figure 26. Short-Circuit, Input-Referred Noise vs. Frequency
100
10
1
INPUT-REFERRED NOISE (nV/ Hz)
0.1
0 0.2 0.4 0.6 0.8 1.0
RS = 0, RIZ =, HILO = LO OR HI, f = 10MHz
V
(V)
GAIN
Figure 27. Short-Circuit, Input-Referred Noise vs. V
GAIN
1
R
THERMAL NOISE
S
INPUT-REFERRE D NOISE (n V/ Hz)
03199-026
0.1 1 10 100 1k
SOURCE RESIST ANCE ()
Figure 29. Input-Referred Noise vs. R
ALONE
03199-029
S
7
INCLUDES NOISE OF VGA
6
5
4
3
NOISE FI GURE (dB)
2
1
03199-027
SIMULATED RESULTS
0
50 100 1k
Figure 30. Noise Figure vs. RS for Various Values of R
R
= 50
IN
R
= 75
IN
= 100
R
IN
= 200
R
IN
R
=
IZ
SOURCE RESIST ANCE ()
03199-030
IN
Rev. G | Page 15 of 56
AD8331/AD8332/AD8334
35
30
25
20
15
NOISE FI GURE (dB)
10
HILO = LO, RIN = 50
HILO = LO, R
5
HILO = HI, RIN = 50 HILO = HI, R
0
0 0.10.20.30.40.50.60.70.80.91.01.1
30
25
20
15
10
NOISE FI GURE (dB)
5
f = 10MHz, RS = 50
0
10 15 20 25 30 35 40 45 50 55 60
0
G = 30dB V
= 1Vp-p
OUT
–10
–20
–30
–40
–50
–60
–70
HARMONIC DISTORTION (dBc)
–80
–90
1M 10M 100M
Figure 33. Harmonic Distortion vs. Frequency
=
IZ
=
Iz
V
(V)
GAIN
Figure 31. Noise Figure vs. V
GAIN (dB)
Figure 32. Noise Figure vs. Gain
FREQUENCY (Hz)
f = 10MHz, RS = 50PREAMP LIMITED
GAIN
HILO = LO, R HILO = LO, R
HILO = HI, RIN = 50 HILO = HI, R
HILO = HI, HD2
HILO = HI, HD3
HILO = LO, HD2
HILO = LO, HD3
FB
IN
FB
=
= 50
=
30
f = 10MHz, V
= 1V p-p
OUT
–40
–50
–60
–70
HARMONIC DIST ORTION (dBc)
–80
03199-031
–90
0 200018001600140012001000800600400200
HILO = HI , HD2
HILO = HI , HD3
R
LOAD
Figure 34. Harmonic Distortion vs. R
40
f = 10MHz, V
= 1V p-p
HARMONIC DISTORTION (dBc)
03199-032
OUT
–50
–60
–70
–80
–90
0 10203040
HILO = LO, HD3
HILO = HI, HD2
C
LOAD
Figure 35. Harmonic Distortion vs. C
20
f = 10MHz, GAIN = 30d B
–40
HILO = L O, HD2
–60
HILO = HI, HD2
–80
HARMONIC DISTORTION (dBc)
–100
01234
03199-113
V
(V p-p)
OUT
HILO = L O, HD2
HILO = L O, HD3
03199-034
()
LOAD
HILO = L O, HD2
HILO = HI, HD3
03199-035
50
(pF)
LOAD
HILO = LO, HD3
HILO = HI , HD3
03199-036
Figure 36. Harmonic Distortion vs. Differential Output Voltage
Rev. G | Page 16 of 56
AD8331/AD8332/AD8334
0
V
= 1V p-p
OUT
–20
INPUT RANGE LIMITED WHEN
–40
HILO = LO
–60
–80
DISTORTION (dBc)
–100
–120
0 0. 1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1. 0
HILO = HI, HD3
HILO = L O, HD2
V
(V)
GAIN
Figure 37. Harmonic Distortion vs. V
HILO = L O, HD3
HILO = HI, HD2
, f = 1 MHz
GAIN
0
V
= 1V p-p
OUT
–20
INPUT RANGE LIMITED WHEN
–40
HILO = LO
–60
HILO = LO, HD2
HILO = L O, HD3
03199-037
0
V
= 1V p-p COMPOSITE (
OUT
G = 30dB
–10
–20
–30
–40
–50
IMD3 (dBc)
–60
–70
–80
–90
1M 10M 100M
f
+
f
)
1
2
FREQUENCY (Hz)
HILO = LO
HILO = HI
Figure 40. IMD3 vs. Frequency
40
10MHz HILO = HI
35
30
25
20
1MHz HILO = HI
1MHz HILO = LO
10MHz HILO = LO
03199-040
–80
DISTORTION (dBc)
HILO = HI , HD3
–100
–120
0 0. 1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1. 0
V
GAIN
(V)
Figure 38. Harmonic Distortion vs. V
HILO = HI, HD2
, f = 10 MHz
GAIN
10
0
f = 10MHz
–10
–20
IP1dB COMPRESSION (d Bm)
–30
–40
0 0. 1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1. 0
HILO = HI
V
GAIN
Figure 39. IP1dB Compression vs. V
HILO = LO
(V)
GAIN
15
OUTPUT I P3 (dBm)
10
5
V
= 1V p-p COMPOSITE (
03199-038
0
010.90.80.70.60.50.40.30.20.1
OUT
Figure 41. Output Third-Order Intercept (IP3) vs. V
V
GAIN
f
+
f
)
1
2
(V)
GAIN
03199-041
.0
2mV
100
90
10
0
50mV 10n s
03199-039
3199-042
Figure 42. Small Signal Pulse Response, G = 30 dB,
Top: Input, Bottom: Output Voltage, HILO = HI or LO
Rev. G | Page 17 of 56
AD8331/AD8332/AD8334
20mV
100
90
10
0
500mV 10ns
Figure 43. Large Signal Pulse Response, G = 30 dB,
HILO = HI or LO, Top: Input, Bottom: Output Voltage
2
G = 30dB
1
INPUT
(V)
0
OUT
V
CL = 0pF CL = 10pF CL = 22pF CL = 47pF
5.0
4.5
4.0
3.5
3.0
2.5
(V p-p)
OUT
2.0
V
1.5
1.0
3199-043
0.5
0
0545403530252015105
4
G = 40dB
3
2
1
INPUT
(V)
0
OUT
V
–1
HILO = HI
HILO = LO
R
(k)
CLMP
Figure 46. Clamp Level vs. R
R
= 48.1k
CLMP
R
= 16.5k
CLMP
R
= 7.15k
CLMP
R
= 2.67k
CLMP
03199-046
0
CLMP
–1
INPUT IS NOT TO SCALE
–2
–50 50403020100–10–20–30–40
TIME (ns)
Figure 44. Large Signal Pulse Response for Various Capacitive Loads,
= 0 pF, 10 pF, 20 pF, 50 pF
C
L
500mV
200mV 400ns
3199-045
Figure 45. Pin GAIN Transient Response,
Top: V
, Bottom: Output Voltage
GAIN
–2
–3
03199-044
–4
–30–20–100 1020304050607080
TIME (ns)
Figure 47. Clamp Level Pulse Response for Four Values of R
03199-047
CLMP
200mV
100
90
10
0
Figure 48. LNA Overdrive Recovery, V
= 0.27 V VGA Output Shown
V
GAIN
100ns
0.05 V p-p to 1 V p-p Burst,
INH
3199-048
Rev. G | Page 18 of 56
AD8331/AD8332/AD8334
1V
100
90
10
0
Figure 49. VGA Overdrive Recovery, V
= 1 V VGA Output Shown Attenuated by 24 dB
V
GAIN
1V
100
90
10
0
Figure 50. VGA Overdrive Recovery, V
= 1 V VGA Output Shown Attenuated by 24 dB
V
GAIN
2V
200mV 1ms
Figure 51. Enable Response, Top: V
100ns
4 mV p-p to 70 mV p-p Burst,
INH
100ns
4 mV p-p to 275 mV p-p Burst,
INH
, Bottom: V
ENB
OUT
, V
= 30 mV p-p
INH
2V
3199-049
1V 1ms
3199-052
Figure 52. Enable Response, Large Signal,
, Bottom: V
Top: V
ENB
0
–10
–20
–30
–40
PSRR (dB)
–50
–60
–70
3199-050
–80
100k 1M 10M 100M
VPSV, V
GAIN
, V
= 150 mV p-p
OUT
INH
VPS1, V
= 0.5V
FREQUENCY (Hz)
GAIN
VPS1, V
= 0.5V
GAIN
= 0V
03199-053
Figure 53. PSRR vs. Frequency (No Bypass Capacitor)
140
V
= 0.5V
GAIN
130
120
110
100
90
80
70
60
50
40
QUIESCENT SUPPLY CURRENT (mA)
3199-051
30
20
–40 100806040200–20
AD8334
AD8332
AD8331
03199-054
TEMPERATURE ( °C)
Figure 54. Quiescent Supply Current vs. Temperature
Rev. G | Page 19 of 56
AD8331/AD8332/AD8334
*
R

TEST CIRCUITS

MEASUREMENT CONSIDERATIONS

Figure 55 through Figure 68 show typical measurement configurations and proper interface values for measurements with 50 Ω conditions.
Short-circuit input noise measurements are made as shown in Figure 62. The input-referred noise level is determined by
FB*
120nH
22pF
FERRITE BEAD
Figure 55. Test Circuit—Gain and Bandwidth Measurements
NETWORK ANALYZE
0.1µF
5050
18nF
270
0.1µF
INH
DUT
0.1µF
0.1µF
LMD
NETWORK ANALYZER
dividing the output noise by the numerical gain between Point A and Point B and accounting for the noise floor of the spectrum analyzer. The gain should be measured at each frequency of interest and with low signal levels because a 50 Ω load is driven directly. The generator is removed when noise measurements are made.
INOUT
237
28
237
28
1:1
3199-055
5050
INOUT
10k
18nF
0.1µF
237
FB*
120nH
22pF
0.1µF
0.1µF
INH
LMD
DUT
VGN
0.1µF
237
28
28
1:1
03199-056
10k
*FERRITE BEAD
Figure 56. Test Circuit—Frequency Response for Various Matched Source Impedances
FB*
120nH
22pF
*FERRITE BEAD
Figure 57. Test Circuit—Frequency Response for Unterminated LNA, R
NETWORK ANALYZ ER
0.1µF INH
LMD
0.1µF
DUT
0.1µF
VGN
5050
0.1µF
INOUT
237
237
28
28
1:1
03199-057
= 50 Ω
S
Rev. G | Page 20 of 56
AD8331/AD8332/AD8334
K
*
FB*
120nH
22pF
*FERRITE BEAD
NETWORK ANALYZ ER
18nF
0.1µF OR
1µF
10k
INH
0.1µF
LNA
LMD
5050
0.1µF OR
1µF
0.1µF OR
1µF
INOUT
0.1µF
237
0.1µF
237
28
28
1:1
03199-058
VGA
Figure 58. Test Circuit—Group Delay vs. Frequency for Two Values of AC Coupling
18nF
INH
270
DUT
LMD
0.1µF
0.1µF
0.1µF
237
237
28
28
1:1
50
03199-059
NETWORK ANALYZER
50
FB*
120nH
OUT
22pF
*FERRITE BEAD
0.1µF
Figure 59. Test Circuit—LNA Input Impedance vs. Frequency in Standard and Smith Chart (S11) Formats
NETWORK ANALYZER
5050
INOUT
0.1µF
0.1µF
0.1µF
237
237
28
28
1:1
03199-060
FB*
120nH
22pF
*FERRITE BEAD
0.1µF INH
0.1µF
LMD
0.1µF
VGALNA
0.1µF
Figure 60. Test Circuit—Frequency Response for Unterminated LNA, Single-Ended
NETWOR
ANALYZER
18nF
FB*
120nH
22pF
FERRITE BEAD
0.1µF
270
INH
LMD
DUT
0.1µF
0.1µF
0.1µF
237
237
28
28
1:1
50
IN
03199-061
Figure 61. Test Circuit—Short-Circuit, Input-Referred Noise
Rev. G | Page 21 of 56
AD8331/AD8332/AD8334
A
49.9
50
SIGNAL G ENERATOR
TO MEASURE G AIN
DISCONNECT F OR
NOISE MEASUREMENT
0.1µF
1
FERRITE
BEAD
120nH
22pF
GAIN
INH
LMD
DUT
0.1µF
0.1µF
0.1µF
B
IN
1:1
SPECTRUM
ANALYZER
50
03199-062
Figure 62. Test Circuit—Noise Figure
SPECTRUM
ANALYZER
50
IN
03199-063
50
LPF
SIGNAL GENERATOR
–6dB
0.1µF
22pF
18nF
AD8332
INH
270
LMD
0.1µF
DUT
0.1µF
0.1µF
1k
1k
28
28
1:1
–6dB
Figure 63. Test Circuit—Harmonic Distortion vs. Load Resistance
SPECTRUM
18nF
270
ANALYZER
50
LPF
SIGNAL GENERATOR
–6dB
0.1µF
22pF
AD8332
INH
LMD
0.1µF
DUT
0.1µF
0.1µF
237
237
28
28
1:1
–6dB
50
IN
03199-114
Figure 64. Test Circuit—Harmonic Distortion vs. Load Capacitance
SPECTRUM
50
50
–6dB
+22dB
–6dB
+22dB
SIGNAL
GENERATORS
COMBINER
–6dB
FB*
120nH
*FERRITE BEAD
22pF
0.1µF
18nF
INH
LMD
274
DUT
0.1µF
0.1µF
0.1µF
237
28
1:1
237
28
–6dB
ANALYZER
INPUT
50
03199-065
Figure 65.Test Circuit—IMD3 vs. Frequency
Rev. G | Page 22 of 56
AD8331/AD8332/AD8334
E
18nF
FB*
120nH
22pF
50
*FERRITE BEAD
0.1µF
270
INH
DUT
LMD
0.1µF
0.1µF
0.1µF
237
28
237
28
OSCILLO SCOPE
50
IN
1:1
3199-066
Figure 66. Test Circuit—Pulse Response Measurements
DIFF
PULSE
GENERATOR
OSCILLOSCOP
CH1 CH2
9.5dB
50
03199-067
18nF
270
0.1µF
FB*
120nH
22pF
50
RF SIGNAL GENERATOR
*FERRITE BEAD
0.1µF INH
0.1µF
LMD
DUT
TO PIN GAIN OR PIN ENxx
0.1µF
255
255
Figure 67. Test Circuit—Gain and Enable Transient Response
NETWO RK ANALYZER
PROBE
FB*
120nH
22pF
50
RF SIGNAL GENERATOR
*FERRITE BEAD
0.1µF
TO POWER
18nF
270
INH
0.1µF
PINS
LMD
50
0.1µF
DUT
0.1µF
255
255
50
INOUT
DIFF
PROBE
PROBE POWER
03199-068
Figure 68. Test Circuit—PSRR vs. Frequency
Rev. G | Page 23 of 56
AD8331/AD8332/AD8334
V
VINV
V

THEORY OF OPERATION

OVERVIEW

The AD8331/AD8332/AD8334 operate in the same way. Figure 69, Figure 70, and Figure 71 are functional block diagrams of the three devices
INH
LMD
INH1
LMD1
LMD2
INH2
+
LNA
VCM
BIAS
IPLOPLON
ATTENUAT OR
+
VGA BIAS AND
INTERPOLATOR
–48dB
CM
V
MID
AD8331
ENBL
ENBV GAIN
Figure 69. AD8331 Functional Block Diagram
LON1 LOP1
+19dB
LNA 1
LNA 2
LNA V
MID
VIP1
VIN1
ATTENUATOR
–48dB
+
VGA BIAS AND
INTERPOLAT OR
+
ATTENUATOR
–48dB
AD8332
LON2 LOP2
VIP2
VIN2
ENB
Figure 70. AD8332 Functional Block Diagram
GAIN INT
VCM1
V
MID
21dB
GAIN
INT
21dB
V
MID
VCM2
3.5dB/
15.5dB
PA21dB
CLAMP
3.5dB/
15.5dB
PA1
CLAMP
HILO
HILO
PA2
VOH
VOL
RCLMP
MODE
VOH1
VOL1
GAIN
VOH2
VOL2
RCLMP
LON1 LOP1VIP1VIN1 EN12
INH1
LMD1
LMD2
INH2
LON2
LOP2
VIP2
VIN2
MODE
VIN3
VIP3
03199-069
LOP3
LON3
INH3
LMD3
LMD4
INH4
LNA 1
LNA 2
LNA 3
LNA 4
VCM BIAS
VCM
BIAS
ATTENUATO R
–48dB
+
VGA BIAS AND
INTERPO LATOR
+
ATTENUATO R
–48dB
GAIN UP/
DOWN
ATTENUATO R
–48dB
+
VGA BIAS AND
INTERPO LATOR
+
ATTENUATO R
–48dB
AD8334
CM1
V
MID1
V
MID2
V
MID3
V
MID4
VCM4EN34VIN4VIP4LON4 LOP4
21dB
GAIN
INT
21dB
21dB
GAIN
INT
21dB
CLAMP
PA1
PA2
PA3
PA4
CLAMP
CLMP12
VOH1
VOL1
GAIN12
HILO VOL2
VOH2
VCM2
VCM3
VOH3
VOL3
GAIN34
VOL4
VOH4
CLMP34
03199-071
Figure 71. AD8334 Functional Block Diagram
Each channel contains an LNA that provides user-adjustable input impedance termination, a differential X-AMP VGA, and a pro­grammable gain postamp with adjustable output voltage limiting. Figure 72 shows a simplified block diagram with external
03199-070
components.
PREAMPLIFIER
INH
LNA
LMD LOP
19dB
VCM BIAS
LON
VIN
SIGNAL PATH
48dB
ATTENUATOR
VIP
AND
BIAS
INTERPOLATOR
V
VCM
MID
POSTAMP
3.5dB/15.5dB
21dB
GAIN
INTERFACE
HILO
VOH
VOL
CLAMP
RCLMP
GAIN
03199-072
Figure 72. Simplified Block Diagram
Rev. G | Page 24 of 56
AD8331/AD8332/AD8334
The linear-in-dB, gain control interface is trimmed for slope and absolute accuracy. The gain range is +48 dB, extending from
−4.5 dB to +43.5 dB in LO gain and +7.5 dB to +55.5 dB in HI gain mode. The slope of the gain control interface is 50 dB/V, and the gain control range is 40 mV to 1 V. Equation 1 and Equation 2 are the expressions for gain.
GAIN (dB) = 50 (dB/V) × V
− 6.5 dB, (HILO = LO) (1)
GAIN
or GAIN (dB) = 50 (dB/V) × V
+ 5.5 dB, (HILO = HI) (2)
GAIN
The ideal gain characteristics are shown in Figure 73.
60
50
40
30
20
GAIN (dB)
10
0
–10
0 0.2 0.4 0.6 0.8 1.0 1.1
ASCENDING GAIN MODE DESCENDING GAIN MODE
(WHERE AVAILABLE)
HILO = HI
HILO = LO
V
(V)
GAIN
03199-073
Figure 73. Ideal Gain Control Characteristics
The gain slope is negative with MODE pulled high (where available), as follows:
GAIN (dB) = −50 (dB/V) × V
+ 45.5 dB, (HILO = LO) (3)
GAIN
or GAIN (dB) = −50 (dB/V) × V
+ 57.5 dB, (HILO = HI) (4)
GAIN
The LNA converts a single-ended input to a differential output with a voltage gain of 19 dB. If only one output is used, the gain is 13 dB. The inverting output is used for active input impedance termination. Each of the LNA outputs is capacitively coupled to a VGA input. The VGA consists of an attenuator with a range of 48 dB followed by an amplifier with 21 dB of gain for a net gain range of −27 dB to +21 dB. The X-AMP, gain interpolation technique results in low gain error and uniform bandwidth, and differential signal paths minimize distortion.
The final stage is a logic programmable amplifier with gains of
3.5 dB or 15.5 dB. The LO and HI gain modes are optimized for 12-bit and 10-bit ADC applications, in terms of output-referred noise and absolute gain range. Output voltage limiting can be programmed by the user.

LOW NOISE AMPLIFIER (LNA)

Good noise performance in the AD8331/AD8332/AD8334 relies on a proprietary ultralow noise preamplifier at the beginning of the signal chain, which minimizes the noise contribution in the following VGA. Active impedance control optimizes noise per­formance for applications that benefit from input matching.
A simplified schematic of the LNA is shown in Figure 74. INH is capacitively coupled to the source. A bias generator establishes dc input bias voltages of 3.25 V and centers the output common­mode levels at 2.5 V. A capacitor C the input coupling capacitor C pin to ground to decouple the LMD bus. The LMD pin is not useable for configuring the LNA as a differential input amplifier.
LOP
2.5V 2.5V
C
INH
INH
C
R
S
SH
–a
3.25V 3.25V
60 40 80
Figure 74. Simplified LNA Schematic
The LNA supports differential output voltages as high as 5 V p-p, with positive and negative excursions of ±1.25 V, about a common-mode voltage of 2.5 V. Because the differential gain magnitude is 9, the maximum input signal before saturation is ±275 mV or +550 mV p-p. Overload protection ensures quick recovery time from large input voltages. Because the inputs are capacitively coupled to a bias voltage near midsupply, very large inputs can be handled without interacting with the ESD protection.
Low value feedback resistors and the current-driving capability of the output stage allow the LNA to achieve a low input-referred voltage noise of 0.74 nV/√Hz. This is achieved with a current consumption of only 11 mA per channel (55 mW). On-chip resistor matching results in precise single-ended gains of 4.5× (9× differential), critical for accurate impedance control. The use of a fully differential topology and negative feedback minimizes distortion. Low HD2 is particularly important in second harmonic ultrasound imaging applications. Differential signaling enables smaller swings at each output, further reducing third-order distortion.
(can be the same value as
LMD
) is connected from the LMD
INH
C
IZ
Q1 Q2
I
0
VPOS
I
0
VCM
BIAS
R
IZ
TO
VGA
LON
I
0
–a
LMD
I
0
C
LMD
03199-074
Rev. G | Page 25 of 56
AD8331/AD8332/AD8334

Active Impedance Matching

The LNA supports active impedance matching through an external shunt feedback resistor from Pin LON to Pin INH. The input resistance, R
, is given in Equation 5, where A is the single-
IN
ended gain of 4.5, and 6 kΩ is the unterminated input impedance.
R
×
R
R
C
is needed in series with RIZ because the dc levels at Pin LON
IZ
IZ
=
IN
1
k6
A
+
and Pin INH are unequal. Expressions for choosing R of R
and for choosing CIZ are found in the Applications
IN
Information section. C
k6
IZ
=
k33
and the ferrite bead enhance stability
SH
(5)
R
+
IZ
in terms
IZ
at higher frequencies, where the loop gain is diminished, and prevent peaking. Frequency response plots of the LNA are shown in Figure 23 and Figure 24. The bandwidth is approximately 130 MHz for matched input impedances of 50 Ω to 200 Ω and declines at higher source impedances. The unterminated bandwidth (when R
= ∞) is approximately 80 MHz.
IZ
Each output can drive external loads as low as 100 Ω in addition to the 100 Ω input impedance of the VGA (200 Ω differential). Capacitive loading up to 10 pF is permissible. All loads should be ac-coupled. Typically, Pin LOP output is used as a single-ended driver for auxiliary circuits, such as those used for Doppler ultrasound imaging. Pin LON drives R
. Alternatively, a
IZ
differential external circuit can be driven from the two outputs in addition to the active feedback termination. In both cases, important stability considerations discussed in the Applications Information section should be carefully observed.
The impedance at each LNA output is 5 Ω. A 0.4 dB reduction in open circuit gain results when driving the VGA, and a 0.8 dB reduction results with an additional 100 Ω load at the output. The differential gain of the LNA is 6 dB higher. If the load is less than 200 Ω on either side, a compensating load is recommended on the opposite output.

LNA Noise

The input-referred voltage noise sets an important limit on system performance. The short-circuit input voltage noise of the LNA is 0.74 nV/√Hz or 0.82 nV/√Hz (at maximum gain), including the VGA noise. The open circuit, current noise is
2.5 pA/√Hz. These measurements, taken without a feedback resistor, provide the basis for calculating the input noise and noise figure performance of the configurations in Figure 75. Figure 76 and Figure 77 show simulations extracted from these results and the 4.1 dB noise figure (NF) measurement with the input actively matched to a 50 Ω source. Unterminated (R
= ∞)
IZ
operation exhibits the lowest equivalent input noise and noise figure. Figure 76 shows the noise figure vs. source resistance, rising at low R to the source noise, and again at high R
, where the LNA voltage noise is large compared
S
due to current noise.
S
The VGA input-referred voltage noise of 2.7 nV/√Hz is included in all of the curves.
+
V
IN
+
V
IN
ACTIVE IMP EDANCE MATCH - RS = R
+
V
IN
Figure 75. Input Configurations
7
6
5
4
3
NOISE FI GURE (dB)
2
1
SIMULATION
0
50 100 1k
Figure 76. Noise Figure vs. R
Active Match, and Unterminated Inputs
7
INCLUDES NOISE OF VGA
6
5
4
3
NOISE FI GURE (dB)
2
1
(SIMULATED RESULTS)
0
50 100 1k
Figure 77. Noise Figure vs. R
UNTERMINATED
R
IN
R
S
RESISTIVE TERMINAT ION
R
IN
R
S
R
S
R
R
IN
R
S
R
IZ
RIN=
1 + 4.5
INCLUDES NOISE OF VGA
RESISTIVE TERMINAT ION
R
= 50
IN
= 75
R
IN
= 100
R
IN
R
= 200
IN
=
R
IZ
for Various Fixed Values of RIN, Actively Matched
S
= RIN)
(R
S
ACTIVE IM PEDANCE MATCH
UNTERMINATED
RS ()
RS ()
V
V
IZ
V
for Resistive,
S
OUT
OUT
IN
OUT
03199-075
03199-076
03199-077
Rev. G | Page 26 of 56
AD8331/AD8332/AD8334
200
The primary purpose of input impedance matching is to improve the system transient response. With resistive termination, the input noise increases due to the thermal noise of the matching resistor and the increased contribution of the LNA input voltage noise generator. With active impedance matching, however, the contributions of both are smaller than they would be for resistive termination by a factor of 1/(1 + LNA Gain). Figure 76 shows their relative NF performance. In this graph, the input impedance is swept with R
to preserve the match at each point. The noise
S
figures for a source impedance of 50  are 7.1 dB, 4.1 dB, and
2.5 dB, respectively, for the resistive, active, and unterminated configurations. The noise figures for 200  are 4.6 dB, 2.0 dB, and 1.0 dB, respectively.
Figure 77 is a plot of NF vs. R
for various values of RIN, which is
S
helpful for design purposes. The plateau in the NF for actively matched inputs mitigates source impedance variations. For comparison purposes, a preamp with a gain of 19 dB and noise spectral density of 1.0 nV/√Hz, combined with a VGA with
3.75 nV/√Hz, yields a noise figure degradation of approximately
1.5 dB (for most input impedances), significantly worse than the AD8331/AD8332/AD8334 performance.
The equivalent input noise of the LNA is the same for single­ended and differential output applications. The LNA noise figure improves to 3.5 dB at 50 Ω without VGA noise, but this is exclusive of noise contributions from other external circuits connected to LOP. A series output resistor is usually recom­mended for stability purposes when driving external circuits on a separate board (see the Applications Information section). In low noise applications, a ferrite bead is even more desirable.

VARIABLE GAIN AMPLIFIER

The differential X-AMP VGA provides precise input attenuation and interpolation. It has a low input-referred noise of 2.7 nV/√Hz and excellent gain linearity. A simplified block diagram is shown in Figure 78.
GAIN
VIP
VIN
g
m
6dB
R
GAIN INTERPOLATOR
(BOTH CHANNELS)
2R
Figure 78. Simplified VGA Schematic
48dB
POSTAMP
+
POSTAMP
03199-078

X-AMP VGA

The input of the VGA is a differential R-2R ladder attenuator network with 6 dB steps per stage and a net input impedance of 200 Ω differential. The ladder is driven by a fully differential input signal from the LNA and is not intended for single-ended operation. LNA outputs are ac-coupled to reduce offset and isolate their common-mode voltage. The VGA inputs are biased through the center tap connection of the ladder to VCM, which is typically set to 2.5 V and is bypassed externally to provide a clean ac ground.
The signal level at successive stages in the input attenuator falls from 0 dB to −48 dB in +6 dB steps. The input stages of the X-AMP are distributed along the ladder, and a biasing interpolator, controlled by the gain interface, determines the input tap point. With overlapping bias currents, signals from successive taps merge to provide a smooth attenuation range from 0 dB to
−48 dB. This circuit technique results in excellent linear-in-dB gain law conformance and low distortion levels and deviates ±0.2 dB or less from the ideal. The gain slope is monotonic with respect to the control voltage and is stable with variations in process, temperature, and supply.
The X-AMP inputs are part of a gain-of-12 feedback amplifier that completes the VGA. Its bandwidth is 150 MHz. The input stage is designed to reduce feedthrough to the output and to ensure excellent frequency response uniformity across gain setting (see Figure 12 and Figure 13).

Gain Control

Position along the VGA attenuator is controlled by a single-ended analog control voltage, V
, with an input range of 40 mV to
GAIN
1.0 V. The gain control scaling is trimmed to a slope of 50 dB/V (20 mV/dB). Values of V
beyond the control range saturate
GAIN
to minimum or maximum gain values. Both channels of the AD8332 are controlled from a single gain interface to preserve matching. Gain can be calculated using Equation 1 and Equation 2.
Gain accuracy is very good because both the scaling factor and absolute gain are factory trimmed. The overall accuracy relative to the theoretical gain expression is ±1 dB for variations in temperature, process, supply voltage, interpolator gain ripple, trim errors, and tester limits. The gain error relative to a best-fit line for a given set of conditions is typically ±0.2 dB. Gain matching between channels is better than 0.1 dB (Figure 11 shows gain errors in the center of the control range). When V
< 0.1 or > 0.95,
GAIN
gain errors are slightly greater. The gain slope can be inverted, as shown in Figure 73 (except for
the AD8332 AR models). The gain drops with a slope of −50 dB/V across the gain control range from maximum to minimum gain. This slope is useful in applications such as automatic gain control, where the control voltage is proportional to the measured output signal amplitude. The inverse gain mode is selected by setting the MODE pin to HI gain mode.
Gain control response time is less than 750 ns to settle within 10% of the final value for a change from minimum to maximum gain.
Rev. G | Page 27 of 56
AD8331/AD8332/AD8334

VGA Noise

In a typical application, a VGA compresses a wide dynamic range input signal to within the input span of an ADC. While the input-referred noise of the LNA limits the minimum resolvable input signal, the output-referred noise, which depends primarily on the VGA, limits the maximum instantaneous dynamic range that can be processed at any one particular gain control voltage. This limit is set in accordance with the quantization noise floor of the ADC.
Output- and input-referred noise as a function of V in Figure 25 and Figure 27 for the short circuited input conditions. The input noise voltage is simply equal to the output noise divided by the measured gain at each point in the control range.
The output-referred noise is flat over most of the gain range because it is dominated by the fixed output-referred noise of the VGA. Values are 48 nV/√Hz in LO gain mode and 178 nV/√Hz in HI gain mode. At the high end of the gain control range, the noise of the LNA and the noise of the source prevail. The input­referred noise reaches its minimum value near the maximum gain control voltage, where the input-referred contribution of the VGA becomes very small.
At lower gains, the input-referred noise, and thus noise figure, increases as the gain decreases. The instantaneous dynamic range of the system is not lost, however, because the input capacity increases with it. The contribution of the ADC noise floor has the same dependence as well. The important relationship is the magnitude of the VGA output noise floor relative to that of the ADC.
With its low output-referred noise levels, these devices ideally drive low voltage ADCs. The converter noise floor drops 12 dB for every two bits of resolution and drops at lower input full­scale voltages and higher sampling rates. ADC quantization noise is discussed in the Applications Information section.
The preceding noise performance discussion applies to a differential VGA output signal. Although the LNA noise performance is the same in single-ended and differential applications, the VGA performance is not. The noise of the VGA is significantly higher in single-ended usage because the contribution of its bias noise is designed to cancel in the differential signal. A transformer can be used with single-ended applications when low noise is desired.
Gain control noise is a concern in very low noise applications. Thermal noise in the gain control interface can modulate the channel gain. The resultant noise is proportional to the output signal level and usually only evident when a large signal is present. Its effect is observable only in LO gain mode where the noise floor is substantially lower. The gain interface includes an on-chip noise filter, which reduces this effect significantly at frequencies above 5 MHz. Care should be taken to minimize noise impinging at the GAIN input. An external RC filter can be used to remove V
source noise. The filter bandwidth should be
GAIN
sufficient to accommodate the desired control bandwidth.
are plotted
GAIN

Common-Mode Biasing

An internal bias network connected to a midsupply voltage establishes common-mode voltages in the VGA and postamp. An externally bypassed buffer maintains the voltage. The bypass capacitors form an important ac ground connection because the VCM network makes a number of important connections internally, including the center tap of the VGA differential input attenuator, the feedback network of the VGA fixed gain amplifier, and the feedback network of the postamp in both gain settings. For best results, use a 1 nF capacitor and a 0.1 µF capacitor in parallel, with the 1 nF capacitor nearest to the VCM pin. Separate VCM pins are provided for each channel. For dc coupling to a 3 V ADC, the output common-mode voltage is adjusted to 1.5 V by biasing the VCM pin.

POSTAMPLIFIER

The final stage has a selectable gain of 3.5 dB (×1.5) or 15.5 dB (×6), set by the HILO logic pin. Figure 79 is a simplified block diagram.
Gm2
+
VOH
Gm1
F2
VCM
Separate feedback attenuators implement the two gain settings. These are selected in conjunction with an appropriately scaled input stage to maintain a constant 3 dB bandwidth between the two gain modes (~150 MHz). The slew rate is 1200 V/µs in HI gain mode and 300 V/µs in LO gain mode. The feedback networks for HI and LO gain modes are factory trimmed to adjust the absolute gains of each channel.

Noise

The topology of the postamp provides constant input-referred noise with the two gain settings and variable output-referred noise. The output-referred noise in HI gain mode increases (with gain) by four. This setting is recommended when driving converters with higher noise floors. The extra gain boosts the output signal levels and noise floor appropriately. When driving circuits with lower input noise floors, the LO gain mode optimizes the output dynamic range.
Although the quantization noise floor of an ADC depends on a number of factors, the 48 nV/√Hz and 178 nV/√Hz levels are well suited to the average requirements of most 12-bit and 10-bit converters, respectively. An additional technique, described in the Applications Information section, can extend the noise floor even lower for possible use with 14-bit ADCs.
F1
Gm2
Gm1
Figure 79. Postamplifier Block Diagram
VOL
3199-079
Rev. G | Page 28 of 56
AD8331/AD8332/AD8334
V

Output Clamping

Outputs are internally limited to a level of 4.5 V p-p differential when operating at a 2.5 V common-mode voltage. The postamp implements an optional output clamp engaged through a resistor from R
to ground. Tab le 8 shows a list of recommended
CLMP
resistor values. Output clamping can be used for ADC input overload protection, if
needed, or postamp overload protection when operating from a lower common-mode level, such as 1.5 V. The user should be aware that distortion products increase as output levels approach the clamping levels, and the user should adjust the clamp resistor accordingly. For additional information, see the Applications Information section.
The accuracy of the clamping levels is approximately ±5% in LO or HI mode. Figure 80 illustrates the output characteristics for a few values of R
CLMP
.
5.0
4.5
4.0
3.5
3.0
(V)
OL
2.5
,
OH
2.0
V
1.5
1.0
0.5
0
R
=
CLMP
8.8k
3.5k
R
= 1.86k
CLMP
3.5k
8.8k
R
=
CLMP
–3 –2 –1 0 1 2 3
V
(V)
INH
Figure 80. Output Clamping Characteristics
03199-080
Rev. G | Page 29 of 56
AD8331/AD8332/AD8334
V
A

APPLICATIONS INFORMATION

LNA—EXTERNAL COMPONENTS

The LMD pin (connected to the bias circuitry) must be bypassed to ground and signal sourced to the INH pin, which is capacitively coupled using 2.2 nF to 0.1 µF capacitors (see Figure 81).
The unterminated input impedance of the LNA is 6 k. The user can synthesize any LNA input resistance between 50  and 6 k. R Table 7.
Table 7. LNA External Component Values for Common Source Impedances
RIN (Ω) RIZ (Nearest STD 1% Value, Ω) CSH (pF)
50 280 22 75 412 12 100 562 8 200 1.13 k 1.2 500 3.01 k None 6 k
When active input termination is used, a decoupling capacitor (CIS) is required to isolate the input and output bias voltages of the LNA.
The shunt input capacitor, C frequencies where the active termination match is lost due to the gain roll-off of the LNA at high frequencies. The value of C diminishes as R required. Suggested values for C shown in Tabl e 7.
When a long trace to Pin INH is unavoidable, or if both LNA outputs drive external circuits, a small ferrite bead (FB) in series with Pin INH preserves circuit stability with negligible effect on noise. The bead shown is 75 Ω at 100 MHz (Murata BLM21 or equivalent). Other values can prove useful.
Figure 82 shows the interconnection details of the LNA output. Capacitive coupling between the LNA outputs and the VGA inputs is required because of the differences in their dc levels and the need to eliminate the offset of the LNA. Capacitor values of 0.1 µF are recommended. There is a 0.4 dB loss in gain between the LNA output and the VGA input due to the 5 Ω output resistance. Additional loading at the LOP and LON outputs affects LNA gain.
is calculated according to Equation 6 or selected from
IZ
()
R
k33 ×
IN
R
=
IZ
k6
increases to 500 Ω, at which point no capacitor is
IN
(6)
()
R
IN
, reduces gain peaking at higher
SH
for 50 Ω ≤ RIN ≤ 200 Ω are
SH
None
SH
C
GAIN
1nF
LMD
0.1µF
1
LMD2
2
INH2
+5V
3
VPS2
4
LON2
5
LOP2
6
COM2
7
10
11
12
13
14
8
9
VIP2
VIN2
VCM2
GAIN
RCLMP
VOH2
VOL2
COMM
*SEE TEXT
1nF0.1µF
1nF0.1µF
LMD1
INH1
VPS1
LON1
LOP1
COM1
VIP1
VIN1
VCM1
HILO
ENB
VOH1
VOL1
VPSV
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1nF
FB
C
*
SH
*
C
IZ
*
R
IZ
1nF
LNA OUT
0.1µF
5V
1nF
5V
*
*
0.1µF
VGA OUT
VGA OUT
5V
0.1µF
0.1µF
5V
0.1µF
LNA
SOURCE
Figure 81. Basic Connections for a Typical Channel (AD8332 Shown)
LN
DECOUPLING
R
RESISTO R
IZ
VCM
LNA
DECOUPLING
RESISTO R
VIP
VIN
5
3.25V
C
SH
3.25V
LNA
2.5V
2.5V
LON
LOP
5
50
50
TO EXT
CIRCUIT
100
100
TO EXT
CIRCUIT
Figure 82. Interconnections of the LNA and VGA
Both LNA outputs are available for driving external circuits. Pin LOP should be used in those instances when a single-ended LNA output is required. The user should be aware of stray capacitance loading of the LNA outputs, in particular LON. The LNA can drive 100 Ω in parallel with 10 pF. If an LNA output is routed to a remote PC board, it tolerates a load capacitance up to 100 pF with the addition of a 49.9 Ω series resistor or ferrite 75 Ω/100 MHz bead.
03199-081
03199-082
Rev. G | Page 30 of 56
AD8331/AD8332/AD8334

Gain Input

The GAIN pin is common to both channels of the AD8332. The input impedance is nominally 10 MΩ, and a bypass capacitor from 100 pF to 1 nF is recommended.
Parallel connected devices can be driven by a common voltage source or DAC. Decoupling should take into account any band­width considerations of the drive waveform, using the total distributed capacitance.
If gain control noise in LO gain mode becomes a factor, main­taining ≤15 nV/√Hz noise at the GAIN pin ensures satisfactory noise performance. Internal noise prevails below 15 nV/√Hz at the GAIN pin. Gain control noise is negligible in HI gain mode.

VCM Input

The common-mode voltage of Pin VCM, Pin VOL, and Pin VOH defaults to 2.5 V dc. With output ac-coupled applications, the VCM pin is unterminated; however, it must still be bypassed in close proximity for ac grounding of internal circuitry. The VGA outputs can be dc connected to a differential load, such as an ADC. Common-mode output voltage levels between 1.5 V and
3.5 V can be realized at Pin VOH and Pin VOL by applying the desired voltage at Pin VCM. DC-coupled operation is not recommended when driving loads on a separate PC board.
The voltage on the VCM pin is sourced by an internal buffer with an output impedance of 30 Ω and a ±2 mA default output current (see Figure 83). If the VCM pin is driven from an external source, its output impedance should be <<30 Ω, and its current drive capability should be >>2 mA. If the VCM pins of several devices are connected in parallel, the external buffer should be capable of overcoming their collective output currents. When a common-mode voltage other than 2.5 V is used, a voltage­limiting resistor, R
2mA MAX
AC GROUNDING FO R INTERNAL CIRCUI TRY
, is needed to protect against overload.
CLMP
INTERNAL
CIRCUITRY
30
Figure 83. VCM Interface
VCM
100pF
RO << 30
0.1µF
NEW V
CM
03199-083

Logic Inputs—ENB, MODE, and HILO

The input impedance of all enable pins is nominally 25 kΩ and can be pulled up to 5 V (a pull-up resistor is recommended) or driven by any 3 V or 5 V logic families. The enable pin, ENB, powers down the VGA; when pulled low, the VGA output voltages are near ground. Multiple devices can be driven from a common source. Consult Ta ble 3 , Table 4, Tabl e 5, and Tabl e 6 for infor­mation about circuit functions controlled by the enable pins.
Pin HILO is compatible with 3 V or 5 V CMOS logic families. It is either connected to ground or pulled up to 5 V, depending on the desired gain range and output noise.

Optional Output Voltage Limiting

The RCLMP pin provides the user with a means to limit the output voltage swing when used with loads that have no provisions for prevention of input overdrive. The peak-to-peak limited voltage is adjusted by a resistor to ground (see Ta ble 8 for a list of several voltage levels and corresponding resistor values). Unconnected, the default limiting level is 4.5 V p-p.
Note that third harmonic distortion increases as waveform amplitudes approach clipping. For lowest distortion, the clamp level should be set higher than the converter input span. A clamp level of 1.5 V p-p is recommended for a 1 V p-p linear output range,
2.7 V p-p for a 2 V p-p range, or 1 V p-p for a 0.5 V p-p operation. The best solution is determined experimentally. Figure 84 shows third harmonic distortion as a function of the limiting level for a 2 V p-p output signal. A wider limiting level is desirable in HI gain mode.
20
V
= 0.75V
GAIN
–30
–40
–50
HD3 (dBc)
–60
–70
–80
1.52.02.53.0 4.03.5 4.5 5.0
Figure 84. HD3 vs. Clamping Level for 2 V p-p Differential Input
CLAMP LIMIT LEVEL (V p-p)
HILO = LO
HILO = HI
03199-084
Table 8. Clamp Resistor Values
Clamp Resistor Value (kΩ)
Clamp Level (V p-p)
HILO = LO HILO = HI
0.5 1.21
1.0 2.74 2.21
1.5 4.75 4.02
2.0 7.5 6.49
2.5 11 9.53
3.0 16.9 14.7
3.5 26.7 23.2
4.0 49.9 39.2
4.4 100 73.2

Output Decoupling

When driving capacitive loads greater than about 10 pF, or long circuit connections on other boards, an output network of resistors and/or ferrite beads can be useful to ensure stability. These components can be incorporated into a Nyquist filter such as the one shown in Figure 81. In Figure 81, the resistor value is
84.5 Ω. For example, all the evaluation boards for this series incorporate 100  in parallel with a 120 nH bead. Lower value resistors are permissible for applications with nearby loads or
Rev. G | Page 31 of 56
AD8331/AD8332/AD8334
X
X
with gains less than 40 dB. The exact values of these components can be selected empirically.
An antialiasing noise filter is typically used with an ADC. Filter requirements are application dependent.
When the ADC resides on a separate board, the majority of filter components should be placed nearby to suppress noise picked up between boards and to mitigate charge kickback from the ADC inputs. Any series resistance beyond that required for output stability should be placed on the ADC board. Figure 85 shows a second-order, low-pass filter with a bandwidth of 20 MHz. The capacitor is chosen in conjunction with the 10 pF input capacitance of the ADC.
OPTIONAL
BACKPLANE
0.1µF
84.5
0.1µF
84.5
Figure 85. 20 MHz Second-Order, Low-Pass Filter

DRIVING ADCs

The output drive accommodates a wide range of ADCs. The noise floor requirements of the VGA depend on a number of application factors, including bit resolution, sampling rate, full­scale voltage, and the bandwidth of the noise/antialias filter. The output noise floor and gain range can be adjusted by selecting HI or LO gain mode.
The relative noise and distortion performance of the two gain modes can be compared in Figure 25 and Figure 31 through Figure 41. The 48 nV/√Hz noise floor of the LO gain mode is suited to converters with higher sampling rates or resolutions (such as 12 bits). Both gain modes can accommodate ADC full­scale voltages as high as 4 V p-p. Because distortion performance remains favorable for output voltages as high as 4 V p-p (see Figure 36), it is possible to lower the output-referred noise even further by using a resistive attenuator (or transformer) at the output. The circuit in Figure 86 has an output full-scale range of 2 V p-p, a gain range of −10.5 dB to +37.5 dB, and an output noise floor of 24 nV/√Hz, making it suitable for some 14-bit ADC applications.
4V p-p DIFF,
48nV/ Hz
VOH
VOL
Figure 86. Adjusting the Noise Floor for 14-Bit ADCs

OVERLOAD

These devices respond gracefully to large signals that overload its input stage and to normal signals that overload the VGA when the gain is set unexpectedly high. Each stage is designed for clean-limited overload waveforms and fast recovery when gain setting or input amplitude is reduced.
187
2:1
187
1.5µH
158
158
1.5µH
2V p-p DIFF,
24nV/ Hz
374
LPF
18pF
ADC
AD6644
ADC
03199-086
03199-085
Signals larger than ±275 mV at the LNA input are clipped to 5 V p-p differential prior to the input of the VGA. Figure 48 shows the response to a 1 V p-p input burst. The symmetric overload waveform is important for applications, such as CW Doppler ultrasound, where the spectrum of the LNA outputs during overload is critical. The input stage is also designed to accommodate signals as high as ±2.5 V without triggering the slow-settling ESD input protection diodes.
Both stages of the VGA are susceptible to overload. Post­amplifier limiting is more common and results in the clean­limited output characteristics found in Figure 49. Recovery is fast in all cases. The graph in Figure 87 summarizes the combinations of input signal and gain that lead to the different types of overload.
43.5
GAIN (dB)
–4.5
POSTAMP
OVERLOAD
1m
INPUT AMP LITUDE (V)
15mV
LO GAIN
MODE
-AMP
OVERLOAD
25mV
29dB
24.5dB
LNA OVERLOAD
1
0.2750.110m
POSTAMP
OVERLOAD
4mV
56.5
HI GAIN
GAIN (dB)
7.5
MODE
1m 0.2750.110m 1
INPUT AMPLITUDE (V)
Figure 87. Overload Gain and Signal Conditions
-AMP
OVERLOAD
25mV
41dB
24.5dB
LNA OVERLOAD
The clamp interface mentioned in the Output Clamping section controls the maximum output swing of the postamp and its overload response. When the clamp feature is not used, the output level defaults to approximately 4.5 V p-p differential centered at 2.5 V common mode. When other common-mode levels are set through the VCM pin, the value of R
should be
CLMP
selected for graceful overload. A value of 8.3 kΩ or less is recommended for 1.5 V or 3.5 V common-mode levels (7.2 kΩ for HI gain mode). This limits the output swing to just above 2 V p-p differential.

OPTIONAL INPUT OVERLOAD PROTECTION

Applications in which high transients are applied to the LNA input can benefit from the use of clamp diodes. A pair of back­to-back Schottky diodes can reduce these transients to manageable levels. Figure 88 illustrates how such a diode protection scheme can be connected.
OPTIONAL SCHOTT KY OVERLOAD
CLAMP
231
BAS40-04
0.1µF
FB
C
R
SH
C
SH
2
3
4
INH
VPSL
LON
IZ
R
IZ
Figure 88. Input Overload Clamping
COMM
ENBL
20
19
03199-088
03199-087
Rev. G | Page 32 of 56
AD8331/AD8332/AD8334
When selecting overload protection, the important parameters are forward and reverse voltages and t BAS40-04 series shown in Figure 88 has a
(or τrr). The Infineon
rr
τ
of 100 ps and a VF
rr
of 310 mV at 1 mA. Many variations of these specifications can be found in vendor catalogs.

LAYOUT, GROUNDING, AND BYPASSING

Due to their excellent high frequency characteristics, these devices are sensitive to their PCB environments. Realizing expected performance requires attention to detail critical to good, high speed, board design.
A multilayer board with power and ground planes is recom­mended with blank areas in the signal layers filled with ground plane. Be certain that the power and ground pins provided for robust power distribution to the device are connected. Decouple the power supply pins with surface-mount capacitors as close as possible to each pin to minimize impedance paths to ground. Decouple the LNA power pins from the VGA supply using ferrite beads. Together with the capacitors, ferrite beads eliminate undesired high frequencies without reducing the headroom. Use a larger value capacitor for every 10 chips to 20 chips to decouple residual low frequency noise. To minimize voltage drops, use a 5 V regulator for the VGA array.
Several critical LNA areas require special care. The LON and LOP output traces must be as short as possible before connecting to the coupling capacitors connected to Pin VIN and Pin VIP.
must be placed near the LON pin as well. Resistors must be
R
IZ
placed as close as possible to the VGA output pins, VOL and VOH, to mitigate loading effects of connecting traces. Values are discussed in the Output Decoupling section.
Signal traces must be short and direct to avoid parasitic effects. Wherever there are complementary signals, symmetrical layout should be employed to maintain waveform balance. PCB traces should be kept adjacent when running differential signals over a long distance.

MULTIPLE INPUT MATCHING

Matching of multiple sources with dissimilar impedances can be accomplished as shown in Figure 89. A relay and low supply voltage analog switch can be used to select between multiple sources and their associated feedback resistors. An ADG736 dual SPDT switch is shown in this example; however, multiple switches are also available and users are referred to the Analog Devices
Selection Guide for switches and multiplexers.
ADG736
1.13k
SELECT R
IZ
280
LON
5
LOP
5
03199-090
200
50
0.1µF
18nF
INH
LMD
AD8332
LNA
Figure 89. Accommodating Multiple Sources

DISABLING THE LNA

Where accessible, connection of the LNA enable pin to ground powers down the LNA, resulting in a current reduction of about half. In this mode, the LNA input and output pins can be left unconnected; however, the power must be connected to all the supply pins for the disabling circuit to function. Figure 90 illustrates the connections using AD8331 as an example.
20
COMM
19
ENBL
18
17
16
15
14
13
12
+5V
VOUT
HILO
ENBV
COMM
VOL
VOH
VPOS +5V
HILO
RCLMP
R
CLMP
+5V
0.1µF
VIN
0.1µF
MODE
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
LMD
AD8331
INH
VPSL
LON
LOP
COML
VIP
VIN
MODE
Rev. G | Page 33 of 56
GAIN
10
GAIN
VCM
11
Figure 90. Disabling the LNA
VCM
03199-089
AD8331/AD8332/AD8334

ULTRASOUND TGC APPLICATION

The AD8332 ideally meets the requirements of medical and industrial ultrasound applications. The TGC amplifier is a key subsystem in such applications because it provides the means for echo location of reflected ultrasound energy.
Figure 91 through Figure 93 are schematics of a dual, fully differential system using the AD8332 and the AD9238 12-bit high speed ADC with conversion speeds as high as 65 MSPS.

HIGH DENSITY QUAD LAYOUT

The AD8334 is the ideal solution for applications with limited board space. Figure 94 represents four channels routed to and away from this very compact quad VGA. Note that none of the signal paths crosses and that all four channels are spaced apart to eliminate crosstalk.
In this example, all of the components shown are 0402 size; however, the same layout is executable at the expense of slightly more board area. The sketch also assumes that both sides of the printed circuit board are available for components and that the bypass and power supply decoupling circuitry is located on the wiring side of the board.
Rev. G | Page 34 of 56
AD8331/AD8332/AD8334
TP3
(RED)
TP4
L19 SAT
L20 SAT
+5V
120nH FB
120nH FB
FILTER
C67 SAT
+
C46 1µF
L7
+5VGA
L6
+5VLNA
JP13
L17 SAT
JP12
L18
SAT
TB1 +5V
(BLACK)
TB2
GND
OPTIONAL 4-POLE LOW-PASS
VIN+B
C66 SAT
–B
V
IN
CFB2
18nF
RFB2
274
C51
0.1µF
VCM1
TP2 GAIN
TP7 GND
R3
(R
CLMP
JP8
DC2H
C54
0.1µF
C55
0.1µF
JP7
DC2L
S3
E
)
IN2
C50
0.1µF
L12 120nH FB
C80
22pF
+5VLNA
C41
0.1µF
C83 1nF
C69
0.1µF
100
120nH FB
120nH FB
100
TP5
0.1µF
C48
0.1µF
R27
L11
L10
R26
C53
0.1µF
C68 1nF
C49
JP5
IN2
C74 1nF
C78
1nF
AD8332ARU
1
LMD2
2
INH2
3
VPS2
4
LON2
5
LOP2
6
COM2
7
VIP2
8
VIN2
9
VCM2
10
GAIN
11
RCLMP
12
VOH2
13
VOL2
14
COMM
+5VGA
C45
0.1µF
LMD1
INH1
VPS1
LON1
LOP1
COM1
VIP1
VIN1
VCM1
HILO
ENB
VOH1
VOL1
VPSV
C85 1nF
28
27
26
+5VLNA
25
24
23
22
21
20
C77
1nF
19
+5VGA
18
17
16
15
C70
0.1µF
JP6
IN1
ENABLE JP16 DISABLE
120nH FB
120nF FB
22pF
C42
0.1µF
C43
0.1µF
R24
100
L9
L8
R25
100
C79
VCM1
120nH FB
CFB1 18nF
RFB1 274
C59
0.1µF
C58
0.1µF
0.1µF
JP10
L13
+5VGA
HI GAIN JP10 LO GAIN
JP9
C56
TP6
C60
0.1µF
OPTIONAL 4-POLE LOW-PASS
JP17
L1
SAT
L14
SAT
FILTER
C64
SAT
S1
E
L15 SAT
L16
SAT
IN1
VIN+A
C65 SAT
VIN–A
03199-091
Figure 91. Schematic, TGC, VGA Section Using an AD8332 and AD9238
Rev. G | Page 35 of 56
AD8331/AD8332/AD8334
V
ADP3339AKC-3.3
+5V
312
OUT
IN
OUT
TAB
S2
EXT CLOCK
R17
49.9
+3.3VCLK
C86
0.1µF
V
DD
20MHz
GND
SG-636PCE
2
OUT
R1
L5
120nH FB
L4
120nH FB
L3
120nH FB
L2
120nH FB
C31
0.1µF
C30
0.1µF
C29
0.1µF
C1
0.1µF
VIN+_A
V
–_A
IN
C35
0.1µF
C36
0.1µF
R12
1.5k
R4
1.5k
C33
10µF
6.3V
+
R5
33
R6
33
C17
0.1µF
GND
C44 1µF
+
VREF
R20
4.7k
U5
74VHC04
U5
10µF
6.3V
1.5k1. 5k
ADCLK
8965
C34
C20
0.1µF
JP11JP3
4.7k
TP 12
TP 13
JP1
33
33
R41
1
R8
R7
DATA
CLK
C39
10µF
C16
0.1µF
2
C38
0.1µF
C37
0.1µF
VIN–_B
V
+_B
+3.3VCLK
JP4
3
2
EXT
1
INT
R18 499
R16 5k
R19 499
C63
0.1µF
C47
+
10µF
6.3V
14
OE
3
IN
ADCLK
U5
74VHC04
4312
U5
74VHC04
74VHC04
U6
U5
74VHC04
1213
SPARES
U5
74VHC04
1011
C2
10µF
6.3V
C40
0.1µF
TP9
C32
0.1µF
C62
18pF
C19 1nF
R9 0
3
+3.3VADDIG
C61
18pF
C18 1nF
+
C15 1nF
+3.3VAVDD
+
C52
10nF
C12 10µF
6.3V
C57
10nF
DNC
DNC
D0_B
D1_B
D2_B
D3_B
D4_B
D5_B
C26
0.1µF
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
C22
0.1µF
AGND
VIN+_A
VIN–_A
AGND
AVDD
REFT_A
REFB_A
VREF
SENSE
REFB_B
REFT_B
AVDD
AGND
VIN–_B
VIN+_B
AGND
AVDD
CLK_B
DCS
DFS
PDWN_B
OEB_B
DNC
DNC
D0_B
D1_B
D2_B
DRGND
DRVDD
D3_B
D4_B
D5_B
C24 1nF
C21 1nF
AVDD
CLK_A
SHARED_REF
MUX_SELECT
PDWN_A
OEB_A
OTR_A
D11_A (MSB)
D10_A
D9_A
D8_A
DRGND
DRVDD
D7_A
D6_A
D5_A
D4_A
U1 A/D CONVERTER AD9238
D3_A
D2_A
D1_A
D0_A
DNC
DNC
DRVDD
DRGND
OTR_B
D11_B (MSB)
D10_B
D9_B
D8_B
D7_B
D6_B
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
ADCLK
R10 0
4.7k
R15 0
R11 100
JP2
SHARED
REF
Y
R14
+3.3VADDIG
OTR_A
D11_A
D10_A
D9_A
D8_A
C23
0.1µF
D7_A
D6_A
D5_A
D4_A
D3_A
D2_A
D1_A
D0_A
DNC
DNC
C13 1nF
OTR_B
D11_B
D10_B
D9_B
D8_B
D7_B
D6_B
N
+3.3VADDIG
C25 1nF
C14
0.1µF
C11
+
10µF
6.3V
03199-092
Figure 92. Converter Schematic, TGC Using an AD8332 and AD9238
Rev. G | Page 36 of 56
AD8331/AD8332/AD8334
U10
U7
VCC
GND
VCC
GND
20
+
10
18
Y1
17
Y2
16
Y3
15
Y4
14
Y5
13
Y6
12
Y7
11
Y8
C3
0.1µF
C28 10µF
6.3V
+3.3VDVDD
+3.3VDVDD
20
10
18
Y1
17
Y2
16
Y3
15
Y4
14
Y5
13
Y6
12
Y7
11
Y8
C8
0.1µF
C10
0.1µF
+
C76 10µF
6.3V
OTR_A
D11_A
D10_A
D9_A
D8_A
D7_A
D6_A
D5_A
D4_A
D3_A
D2_A
D1_A
D0_A
DNC
DNC
DATACLKA
22 × 4
1
RP 9
2
3
4
1
22 × 4
RP 10
2
3
4
1
22 × 4
RP 11
2
3
4
1
22 × 4
RP 12
2
3
4
1
G1
74VHC541
19
G2
2
8
A1
7
3
A2
4
6
A3
5
5
A4
8
6
A5
7
7
A6
6
8
A7
5
9
A8
1
G1
74VHC541
19
G2
8
2
A1
3
7
A2
6
4
A3
5
5
A4
8
6
A5
7
7
A6
8
6
A7
5
9
A8
R40 22
22 × 4
18
RP 1
7
2
6
3
54
18
22 × 4
RP2
7
2
6
3
54
18
22 × 4
RP 3
7
2
6
3
54
18
22 × 4
RP 4
7
2
6
3
54
2
4
6
8
10
12
14
HEADER UP MALE NO SHROUD
16
18
20
22
24
26 25
28 27
30
34
36
38
40
SAM080UPM
1
3
5
7
9
11
13
15
17
19
21
23
29
3132
33
35
37
39
+3.3VDVDD
OTR_B
D11_B
D10_B
D9_B
D8_B
D7_B
D6_B
D5_B
D4_B
D3_B
D2_B
D1_B
D0_B
DNC
DNC
19
8
1
22 × 4
RP 13
7
2
6
3
5
4
22 × 4
8
1
RP 14
7
2
6
3
5
4
18
22 × 4
RP 15
19
7
2
6
3
5
4
22 × 4
8
1
RP 16
7
2
6
3
5
4
DATACLK
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
G1
74VHC541
G2
A1
A2
A3
A4
A5
A6
A7
A8
G1
74VHC541
G2
A1
A2
A3
A4
A5
A6
A7
A8
20
U2
VCC
10
GND
18
Y1
17
Y2
16
Y3
15
Y4
14
Y5
13
Y6
12
Y7
11
Y8
+3.3VDVDD
20
VCC
U3
10
GND
18
Y1
17
Y2
16
Y3
15
Y4
14
Y5
13
Y6
12
Y7
11
Y8
++
C7
0.1µFC90.1µF
C4
0.1µFC50.1µFC60.1µF
C27 10µF
6.3V
+
C75 10µF
6.3V
22 × 4
18
RP 5
2
3
22 × 4
1
RP 6
2
3
18
22 × 4
RP 7
2
3
18
22 × 4
RP 8
2
3
R39 22
7
6
54
8
7
6
54
7
6
54
7
6
54
42
44
46
48 47
52
HEADER UP MALE NO SHROUD
54 53
56 55
58
60
62
64
66
68
70
72
74
76
78
80
SAM080UPM
41
43
45
4950
51
57
59
61
63
65
67
69
71
73
75
77
79
03199-093
Figure 93. Interface Schematic, TGC Using an AD8332 and AD9238
Rev. G | Page 37 of 56
AD8331/AD8332/AD8334
CH3 LNA INPUT
CH4 LNA INPUT
16
INH3
COM3
COM4
INH4
20
LMD4
21
NC
22 23 24
LON4
LOP4
VIP4
VIN4
VPS4
GAIN34
2825 26 2717 18 19
CLMP34
29
HILO
30 31 32
VCM4
VCM3
COM34
NC
CH2 LNA INPUT
CH1 LNA INPUT
15
14
13912
LON3
NC
LMD3
VOH4
VPS34
VOL4
11
10
VIN3
VIP3
LOP3
COM34
VOH3
VOL3
VPS3
NC
LOCATED ON WIRING SIDE
8
7
6
514
LOP2
VIP2
VIN2
VPS2
POWER SUPPLY DECOUPLI NG
AD8334
COM12
MODE
VOH2
VOL2
3
2
INH2
LMD2
NC
LON2
GAIN12
CLMP12
VPS12
VOL1
COM12
VOH1
COM2
COM1
INH1
LMD1
NC
LON1
LOP1
VIP1
VIN1
VPS1
EN12
EN34
VCM1
VCM2
64
58 575962 61 6063
50 4956 55 5154 53 52
03199-094
48
35
36
37
34
33
NC = NO CONNECT
CH4 DIFFERENT IAL
OUTPUT
384239
CH3 DIFFERENT IAL
OUTPUT
40
41
43
CH2 DIFFERENT IAL
OUTPUT
45
44
47
46
CH1 DIFFERENT IAL
OUTPUT
Figure 94. Compact Signal Path and Board Layout for the AD8334
Rev. G | Page 38 of 56
AD8331/AD8332/AD8334

AD8331 EVALUATION BOARD

GENERAL DESCRIPTION

The AD8331 evaluation board is a platform for testing and evaluating the AD8331 variable gain amplifier (VGA). The board is provided completely assembled and tested; the user simply connects an input signal, VGAIN sources, and a 5 V power supply. The AD8331-EVALZ is lead free and RoHS compliant. Figure 95 is a photograph of the board.

USER-SUPPLIED OPTIONAL COMPONENTS

As shown in the schematic in Figure 96, the board provides for optional components. The components shown in black are for typical operation, and the components shown in gray are installed at the user’s discretion.
As shipped, the LNA input impedance of the AD8331-EVALZ is configured for 50  to accommodate most signal generators and network analyzers. Input impedances up to 6 kΩ are realized by changing the values of RFB and CSH. Refer to the Theory of Operation section for details on this circuit feature. See Table 9 for typical values of input impedance and corresponding components.
Table 9. LNA External Component Values for Common Source Impedances
RIN (Ω) RFB (Ω, Nearest 1% Value) CSH (pF)
50 274 22 75 412 12 100 562 8 200 1.13 k 1.2 500 3.01 k None 6 k None
The board is designed for 0603 size, surface-mount components. Back-to-back diodes can be installed at Location D3 if desired.
To evaluate the LNA as a standalone amplifier, install optional SMA connectors LON and LOP and capacitors C1 and C2; typical values are 0.1 µF or smaller. At R4 and R8, 0  resistors are installed unless capacitive loads larger than 10 pF are connected to the SMA connectors LON and LOP (such as coaxial cables). In that event, small value resistors (68  to 100 ) must be installed at R4 and R8 to preserve the stability of the amplifier.
A resistor can be inserted at RCLMP if output clamping is desired. Refer to Tab le 8 for appropriate values.

MEASUREMENT SETUP

The basic board connection for measuring bandwidth is shown in Figure 97. A 5 V, 100 mA minimum power supply and a low noise, voltage reference supply for GAIN are required. Table 1 0 lists jumpers, and Figure 97 shows their functions and positions.
The preferred signal detection method is a differential probe connected to VO, as shown in Figure 97. Single-ended loads can be connected using the board edge SMA connector, VOH. Be sure to take into account the 25.8 dB attenuation incurred when using the board in this manner. For connection to an ADC, the 270  series resistors can be replaced with 0  or other appropriate values.
Table 10. Jumper Functions
Switch Function
LNA_EN Enables the LNA when in the top position VGA_EN Enables the VGA when in the top position W5, W6 Connects the AD8331 outputs to the SMA connectors GN_SLOPE Left = gain increases with V Right = gain decreases with V GN_HI_LO Left = high gain Right = LO gain

BOARD LAYOUT

The evaluation board circuitry uses four conductor layers. The two inner layers are grounded, and all interconnecting circuitry is located on the outer layers. Figure 99 to Figure 102 illustrate the copper patterns.
Figure 95. Photograph of AD8331-EVALZ
GAIN
GAIN
03199-115
Rev. G | Page 39 of 56
AD8331/AD8332/AD8334
V

AD8331 EVALUATION BOARD SCHEMATICS

+5
GNDGND2GND1
GND4GND3
INPUT CLAMP DIODES
LNA2
120nH FB
PROBE
3D1
L1
BAT64-04
LON
LOP
C
0.1µF
120nH FB
+5V
R4
R8
GN_SLOPE
INH
LO
L2
CSH
22pF
+
C1
C2
0.1µF
C16
C3 10µF 10V
+5V
CLMD
0.1µF
CFB
0.018µF RFB
274µF
C6
0.1µF
C14
0.1µF
DOWN
UP
1
LMD2
2
INH
3
VPS
AD8331ARQ
4
LON
5
LOP
6
COML
7
VIP
8
VIN
9
MODE
DUT
COMM
ENB
ENBV
COMM
VOL
VOH
VPOS
HILO
CLMP
20
19
18
17
16
15
14
13
12
LNA_EN
VGA_EN
L3
120nH FB
R44
100
R43
100
L4
120nH FB
C32
0.1µF
GN_HI_LO
RCLMP
C17
0.1µF
ENABLE
DISABLE
VO
L5
120nH FB
HI
LO
RCLMP
+5V
ENABLE
DISABLE
W5
W6
C24
0.1µF
C26
0.1µF
+5V
R16
237
R20
237
1:1
T1
VOH
COMPONENTS IN GRAY ARE OPTIONAL AND USER SUPPLI ED.
GAIN
C34 1nF
10
GAIN
VCM
11
C18
0.1µF
VCM
03199-116
Figure 96. Schematic of the AD8331 Evaluation Board
Rev. G | Page 40 of 56
AD8331/AD8332/AD8334
DP8200 PRECISIO N VOLTAG E REFERENCE
(FOR VGAIN)
4395A ANALYZER
GND
1103 TEKPROBE POWER SUPPLY
POWER SUPPLY
+5V
GND
DIFFERENTIAL PROBE TO VO PINS
INSERT JUMPERS W5 AND W6 TO USE OUTPUT TRANSFORMER AND VO H SMA
E3631A
03199-117
Figure 97. AD8331 Typical Board Test Connections
Rev. G | Page 41 of 56
AD8331/AD8332/AD8334

AD8331 EVALUATION BOARD PCB LAYERS

Figure 98. AD8331-EVALZ Assembly
3199-118
03199-201
Figure 101. Internal Layer Ground
Figure 99. Primary Side Copper
Figure 100. Secondary Side Copper
03199-199
Figure 102. Power Plane
03199-200
Figure 103. Top Silkscreen
03199-202
03199-119
Rev. G | Page 42 of 56
AD8331/AD8332/AD8334

AD8332 EVALUATION BOARD

GENERAL DESCRIPTION

The AD8332-EVALZ is a platform for the testing and evaluation of the AD8332 variable gain amplifier (VGA). The board is shipped assembled and tested, and users need only connect the signal and VGAIN sources to a single 5 V power supply. Figure 104 is a photograph of the component side of the board, and Figure 105 shows the schematic. The AD8332-EVALZ is lead free and RoHS compliant.
Table 11. LNA External Component Values for Common Source Impedances
RIN (Ω) RFB1, RFB2 (Ω Std 1% Value) CSH1, CSH2 (pF)
50 274 22 75 412 12 100 562 8 200 1.13 k 1.2 500 3.01 k None 6 k
SMA connectors, S2, S3, S6, and S7, are provided for access to the LNA outputs or the VGA inputs. If the LNA is used alone,
0.1 µF coupling capacitors can be installed at the C5, C9, C23, and C24 locations. Resistors of 68 Ω to 100 Ω may be required if the load capacitances, as seen by the LNA outputs, are larger than approximately 10 pF.
A resistor can be inserted at RCLMP if output clamping is desired. The peak-to-peak clamping level is adjusted by installing one of the standard 1% resistor values listed in Table 8 .
A high frequency differential probe connected to the 2-pin headers, VOx, is the preferred method to observe a waveform at the VGA output. A typical setup is shown in Figure 106. Single-ended loads can be connected directly via the board edge SMA connectors. Note that the AD8332 output amplifier is buffered with 237 Ω resistors; therefore, be sure to compensate for attenuation if low impedances are connected to the output SMAs.
None
Figure 104.Photograph of the AD8332-EVALZ
03199-131

USER-SUPPLIED OPTIONAL COMPONENTS

The board is built and tested using the components shown in black in Figure 105. Provisions are made for optional components (shown in gray) that can be installed for testing at user discretion. The default LNA input impedance is 50 Ω to match various signal generators and network analyzers. Input impedances up to 6 kΩ are realized by changing the values of RFBx and CSHx. For reference, Ta ble 11 lists the common input impedance values and corresponding adjustments. The board is designed for 0603 size, surface-mount components.

MEASUREMENT SETUP

The basic board connections for measuring bandwidth are shown in Figure 106. A 5 V, 100 mA (minimum) power supply is required, and a low noise voltage reference supply is required for VGAIN.

BOARD LAYOUT

The evaluation board circuitry uses four conductor layers. The two inner layers are power and ground planes, and all interconnecting circuitry is located on the outer layers. Figure 108 to Figure 111 illustrate the copper patterns.
Rev. G | Page 43 of 56
AD8331/AD8332/AD8334
V

EVALUATION BOARD SCHEMATICS

+5
GND GND4GND3GND2GND1
VOH2
+
C25
10µF
LNA2
T2 1:1
L1
120nH FB
L8
120nH FB
+5V
C9
C5
R13
237
R14
237
R10
R12
0.1µF
0.1µF
+5VLNA
C11
C12
S6
LON2
S7
LOP2
COMPONENTS IN GRAY ARE OPTIONAL AND USER SUPPLI ED.
C4
0.1µF
CAL2
W8
TP3
CLAMP
RCLMP
W12
VO2
W13
0.1µF
C16
0.1µF
W6
CSH2
C6
VCM2
GAIN
22pF
0.1µF
1nF
120nH FB
R7
100
R8
100
L4
120nH FB
1
LMD2
C2
0.1µF
2
INH2
CFB2
18nF
3
VPS2
RFB2
274
C14
0.1µF
C8
C20
0.1µF
L3
C10
AD8332ARUZ
4
LON2
5
LOP2
6
COM2
7
VIP2
8
VIN2
9
VCM2
10
GAIN
11
RCLMP
12
VOH2
13
VOL2
14 15
COMM
LMD1
INH1
VPS1
LON1
LOP1
COM1
VIP1
VIN1
VCM1
HILO
ENB
VOH1
VOL1
VPSV
C22
0.1µF
28
27
26
25
24
23
22
21
20
19
18
17
16
C1
0.1µF
CFB1 18nF
RFB1 274
C13
0.1µF
C17
0.1µF
W5
L6
120nH FB
R5
100
R6
100
L5
120nH FB
120nH FB
L7
CSH1
22pF
+5V
HI
LO
W4
C7
0.1µF
C15
0.1µF
VCM1
W9
+5V
ENABLE
DISABLE
W7 VO1
+5V
0.1µF
CAL1
R11
W10
W11
C3
120nH FB
+5VLNA
R9
C19
0.1µF
C18
0.1µF
C23
C24
L2
LNA1
S2
LON1
S3
LOP1
R15
237
R16
237
1:1
T1
VOH1
3199-096
Figure 105. Schematic of the AD8332 Evaluation Board
Rev. G | Page 44 of 56
AD8331/AD8332/AD8334
NETWORK ANALYZER
1103 TEKPROBE POWER SUPPLY
VGAIN SUPPLY
DIFFERENTIAL PROBE
03199-120
Figure 106. AD8332 Typical Board Test Connections
Rev. G | Page 45 of 56
AD8331/AD8332/AD8334

AD8332 EVALUATION BOARD PCB LAYERS

Figure 107. AD8332-EVALZ Assembly
03199-101
03199-121
Figure 110. Ground Plane
3199-102
03199-103
Figure 108. Primary Side Copper
Figure 109. Secondary Side Copper
03199-099
Figure 111. Power Plane
03199-100
Figure 112. Component Side Silkscreen
Rev. G | Page 46 of 56
AD8331/AD8332/AD8334

AD8334 EVALUATION BOARD

GENERAL DESCRIPTION

The AD8334-EVALZ is a platform for the testing and evaluation of the AD8334 variable gain amplifier (VGA). The board is shipped assembled and tested, and users need only connect the signal and VGAIN sources and a single 5 V power supply. Figure 113 is a photograph of the board. The AD8334-EVALZ is lead free and RoHS compliant.
03199-122
Figure 113. AD8334-EVALZ Top View
Rev. G | Page 47 of 56
AD8331/AD8332/AD8334

CONFIGURING THE INPUT IMPEDANCE

The board is built and tested using the components shown in black in Figure 115. Provisions are made for optional components (shown in gray) that can be installed at user discretion. As shipped, the input impedances of the low noise amplifiers (LNAs) are configured for 50 Ω to match the output impedances of most signal generators and network analyzers. Input impedances up to 6 kΩ can be realized by changing the values of the feedback resistors, R
FB1
, R and C12. For reference, Table 12 lists standard values of 1% resistors for some typical values of input impedance. Of course, if the user has determined that the source impedance falls between these values, the feedback resistor value can be calculated accordingly. Note that the board is designed to accept standard surface-mount, size 0603 components.
Table 12. LNA External Component Values for Common Source Impedances
RIN (Ω) RFB1, RFB2, RFB3, RFB4 (Ω, ±1%) C6, C8, C10, C12 (pF)
50 274 22 75 412 12 100 562 8 200 1.13 k 1.2 500 3.01 k No capacitor 6 k No resistor No capacitor
FB2, RFB3
, R
, and shunt capacitors, C6, C8, C10,
FB4

Viewing Signals

The preferred signal detector is a high impedance differential probe, such as the Tektronix P6247, 1 GHz differential probe, connected to the 2-pin headers (VO1, VO2, VO3, or VO4), as shown in Figure 116. The low capacitance of this probe has the least effect on the performance of the device of any detection method tried. The probe can also be used for monitoring input signals at IN1, IN2, IN3, or IN4. It can be used for probing other circuit nodes; however, be aware that the 200 kΩ input impedance can affect certain circuits.
Differential-to-single-ended transformers are provided for single-ended output connections. Note that series resistors are provided to protect against accidental output overload should a 50 Ω load be connected to the connector. Of course, the effect of these resistors is to limit the bandwidth. If the load connected to the SMA is >500 Ω, the 237 Ω series resistors, RX1, RX2, RX3, RX4, RX5, RX6, RX7, and RX8, can be replaced with 0 Ω values.

Driving the VGA from an External Source or Using the LNA to Drive an External Load

Appropriate components can be installed if the user wants to drive the VGA directly from an external source or to evaluate the LNA output. If the LNA is used to drive off-board loads or cables, small value series resistors (47 Ω to 100 Ω) are recommended for LNA decoupling. These can be installed in the R10, R11, R14, R15, R18, R19, R22, and R23 spaces.
Provisions are made for surface-mount SMA connectors that can be used for driving from either direction. If the LNA is not used, it is recommended that the capacitors, C16, C17, C21, C22, C26, C27, C31, and C32, be carefully removed to avoid driving the outputs of the LNAs.

Using the Clamp Circuit

The board is shipped with no resistors installed in the spaces provided for clamp-circuit operation. Note that each pair of channels shares a clamp resistor. If the output clamping is desired, the resistors are installed in R49 and R50. The peak-to­peak clamping level is application dependent.
Figure 114. AD8334-EVALZ Assembly

MEASUREMENT SETUP

The basic board connections for measuring bandwidth are shown in Figure 116. A 5 V, 200 mA (minimum) power supply is required, and a low noise voltage reference supply is required for VGAIN.

BOARD LAYOUT

The evaluation board circuitry uses four conductor layers. The two inner layers are ground, and all interconnecting circuitry is located on the outer layers. Figure 117 to Figure 120 illustrate the copper patterns.
03199-123
Rev. G | Page 48 of 56
AD8331/AD8332/AD8334
V
V

EVALUATION BOARD SCHEMATICS

+5V
GND1 GND2 GND3 GND6GND5GND4
+
C14
10 µF
ICR1
12
CR1
C7
CF B2
L7
12 0 nH
12 0 nH
1
L6
L2
L3
LO2
R18
R19
0.1µF
IN2
R14
0
1
R15
0
0.1 µF
1
1
C9
0.1 µF
IN3
RFB2
27 4
1
1
C71
0.1 µF
0.1 µF
0.1 µF
INH2
CR2
INH3
120 nH
ICR2
2
1
3
+5 V
+5 V
LO3
12 0 n H
ICR3
12
3
CR3
NOTES
1
COMPONENTS IN GRAY ARE OPTIONAL USER SUPPLIED.
2
NC = NO CONNECT.
18 n F
C22
C69
C27
C10
22 pF
0.1 µF
0.1 µF
RFB3 274
CFB3 18 nF
C8
22 p F
C2
C21
0.1 µF
C26
C3
0.1µF
22 pF
3
64
1
INH2
2
LM D 2
3
NC
4
LO N2
5
LO P2
6
VIP2
7
VIN2
8
VPS2
9
VPS3
10
VIN3
11
VIP3
12
LO P3
13
LO N3
14
NC
15
LM D 3
16
INH3
22 pF
ICR4
12
3
INH1
1
L5 12 0 nH
IN1
0.1 µF C6
63
COM2
C5
CFB1 18 nF
0.1µF
IN H1
COM1
LO1
1
NC
R11
0.1 µF
57
58
5962 61 60
LOP1
LON1
R1 0
RFB1
274
C1
LMD1
AD8334
COM4
COM3
C12
0.1 µF
C11
IN H4
20
CFB4 18 nF
L8 12 0 nH
LMD4
C4
0.1µF
IN4
RFB4
274
R22
NC
1
LON4
LO4
LOP4
23
24
0.1 µF
C32
0.1 µF
R23
1
CR4
Figure 115. AD8334-EVALZ Schematic
1
C17
0.1 µF
C16
C31
12 0 nH
VIP1
VIP4
25 26 2717 18 19 21 22
12 0 nH
1
VIN1
VIN4
+5V
+5
R49
4. 02k
L1
CLMP12
C67
µF
C8 2
1nF
C53
0.1
0.1µF
VPS1
GAIN12
VPS4
28
µF
C80
1nF
C13
0.1
L4
GAIN34 GAIN34
EN12
CLMP12
CLMP34
29
µF
C55
0.1
CLMP34
R50
4.02k
EN12
HILO
+5
EN34
EDE
C57
D
0.1µF
50 4 956 55 5154 53 52
EN34
VCM1
COMM34
VCM4
VCM3
30 31 32
C62
0.1µF
C64
0.1 µF
HI
VCM2
COM12
VP SV2
COM12
MODE
VPS34
COM34
3
NC
+5V
HILO
LO
VOH1
VOL1
VOL2
VOH2
NC
VOH3
VOL3
VOL4
VOH4
C59
0.1µF
3
L9
12 0 nH
RX1
100
RX2
100
L10
12 0 nH
48
47
46
45
44
43
+5V
42
D
41
SLOPE
U
40
39
38
37
36
35
34
33
C75
0.1µF
L1 1
120 nH
RX3
100
RX4
100
L1 3
120 nH
L14
12 0 nH
RX5
100
VO 3
RX6
100
L15
12 0 nH
VO 1
L12
120 nH F B
VO2
L34
120 n H
+5V
+5 V
C77
0.1µF
L16
12 0 nH
RX7
100
VO 4
RX8
10 0
L17
12 0 nH
03199-124
Rev. G | Page 49 of 56
AD8331/AD8332/AD8334
PRECISION VOLTAGE
REFERENCE (FO R VGAIN)
GAIN
CONTROL
VOLTAGE
GND
NETWORK ANALYZ ER
SIGNAL INPUT
PROBE
POWER
SUPPLY
+5V
DIFFERENTIAL PROBE
POWER SUPPLY
GND
03199-125
Figure 116. AD8334 Typical Board Test Connections (One Channel Shown)
Rev. G | Page 50 of 56
AD8331/AD8332/AD8334

AD8334 EVALUATION BOARD PCB LAYERS

3199-128
03199-126
Figure 117. AD8334-EVALZ Primary Side Copper
Figure 119. AD8334-EVALZ Inner Layer 1Copper
Figure 118. AD8334-EVALZ Secondary Side Copper
3199-127
Rev. G | Page 51 of 56
03199-129
Figure 120. AD8334-EVALZ Inner Layer 2 Copper
AD8331/AD8332/AD8334
Figure 121. AD8334-EVALZ Component Side Silkscreen
03199-130
Rev. G | Page 52 of 56
AD8331/AD8332/AD8334
C
Y

OUTLINE DIMENSIONS

9.80
9.70
9.60
PIN 1
0.15
0.05
OPLANARIT
0.10
28
0.65
BSC
0.30
0.19
COMPLIANT TO JEDEC STANDARDS MO-153-AE
1.20 MAX
SEATING
PLANE
15
4.50
4.40
4.30
0.20
0.09
6.40 BSC
8° 0°
0.75
0.60
0.45
141
Figure 122. 28-Lead Thin Shrink Small Outline Package (TSSOP)
(RU-28)
Dimensions shown in millimeters
0.345 (8.76)
0.341 (8.66)
0.337 (8.55)
20
11
0.158 (4.01)
0.154 (3.91)
0.150 (3.81)
101
0.244 (6.20)
0.236 (5.99)
0.228 (5.79)
0.065 (1.65)
0.049 (1.25)
0.010 (0.25)
0.004 (0.10)
COPLANARITY
0.004 (0.10)
8° 0°
0.010 (0.25)
0.006 (0.15)
0.050 (1.27)
0.016 (0.41)
0.069 (1.75)
0.053 (1.35)
SEATING
0.025 (0.64) BSC
CONTROLL ING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIO NS (IN PARENTHESES) ARE ROUNDED-O FF INCH EQ UIVALENTS FOR REFERENCE ON LY AND ARE NOT APPROPRI ATE FOR USE IN DESIGN.
0.012 (0.30)
0.008 (0.20)
COMPLIANT TO JEDEC STANDARDS MO-137-AD
PLANE
0.020 (0.51)
0.010 (0.25)
0.041 (1.04) REF
081908-A
Figure 123. 20-Lead Shrink Small Outline Package (QSOP)
(RQ-20)
Dimensions shown in Inches and (millimeters
Rev. G | Page 53 of 56
AD8331/AD8332/AD8334
C
PIN 1
ATO R
INDI
12° MAX
1.00
0.85
0.80 SEATING
PLANE
PIN 1 INDICATOR
0.08
0.60 MAX
25
24
EXPOSED
PAD
(BOTTOM VIEW)
17
16
3.50 REF
FOR PROPER CONNECTION O F THE EXPOSED PAD, REFER TO THE PIN CONF IGURATIO N AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET.
5.00
BSC SQ
TOP
VIEW
0.80 MAX
0.65 TYP
0.30
0.23
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
4.75
BSC SQ
0.20 REF
0.05 MAX
0.02 NOM
0.60 MAX
0.50
BSC
0.50
0.40
0.30
COPLANARIT Y
Figure 124. 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
5 mm × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters
9.00
BSC SQ
TOP
VIEW
8.75
BSC SQ
0.60 MAX
0.60 MAX
49
48
EXPOSED PAD
(BOTTOM VIEW)
PIN 1
32
9
INDICATOR
1
3.25
3.10 SQ
2.95
8
0.25 MIN
011708-A
0.30
0.25
0.18
64
1
PIN 1 INDICATOR
*
4.85
4.70 SQ
4.55
1.00
0.85
0.80
SEATING
PLANE
12° MAX
0.50
0.40
0.30
0.80 MAX
0.65 TYP
0.50 BSC
*
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
EXCEPT FO R EXPOSED PAD DI MENSION
0.20 REF
0.05 MAX
0.02 NOM
33
32
7.50 REF
16
17
FOR PROPER CONNECTION O F THE EXPOSE D PAD, REFER T O THE PIN CONF IGURATIO N AND FUNCTION DESCRIPTIO NS SECTION OF THIS DATA SHEET.
082908-B
Figure 125. 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
9 mm × 9 mm Body, Very Thin Quad
(CP-64-1)
Dimensions shown in millimeters
Rev. G | Page 54 of 56
AD8331/AD8332/AD8334

ORDERING GUIDE

Model1 Temperature Range Package Description Package Option
AD8331ARQ –40°C to +85°C 20-Lead Shrink Small Outline Package (QSOP) RQ-20 AD8331ARQ-REEL –40°C to +85°C 20-Lead Shrink Small Outline Package (QSOP) RQ-20 AD8331ARQ-REEL7 –40°C to +85°C 20-Lead Shrink Small Outline Package (QSOP) RQ-20 AD8331ARQZ –40°C to +85°C 20-Lead Shrink Small Outline Package (QSOP) RQ-20 AD8331ARQZ-RL –40°C to +85°C 20-Lead Shrink Small Outline Package (QSOP) RQ-20 AD8331ARQZ-R7 –40°C to +85°C 20-Lead Shrink Small Outline Package (QSOP) RQ-20 AD8331-EVALZ Evaluation Board with AD8331ARQ AD8332ACP-R2 –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2 AD8332ACP-REEL –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2 AD8332ACP-REEL7 –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2 AD8332ACPZ-R2 –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2 AD8332ACPZ-R7 –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2 AD8332ACPZ-RL –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2 AD8332ARU –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28 AD8332ARU-REEL –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28 AD8332ARU-REEL7 –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28 AD8332ARUZ –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28 AD8332ARUZ-R7 –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28 AD8332ARUZ-RL –40°C to +85°C 28-Lead Thin Shrink Small Outline Package (TSSOP) RU-28 AD8332-EVALZ Evaluation Board with AD8332ARU AD8334ACPZ –40°C to +85°C 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-64-1 AD8334ACPZ-REEL –40°C to +85°C 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-64-1 AD8334ACPZ-REEL7 –40°C to +85°C 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-64-1 AD8334-EVALZ Evaluation Board with AD8334ACP
1
Z = RoHS Compliant Part.
Rev. G | Page 55 of 56
AD8331/AD8332/AD8334
NOTES
©2003–2010 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D03199-0-10/10(G)
Rev. G | Page 56 of 56
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