Datasheet AD8300AN, AD8300AR Datasheet (Analog Devices)

Page 1
+3 Volt, Serial Input
a
FEATURES Complete 12-Bit DAC No External Components Single +3 Volt Operation
0.5 mV/Bit with 2.0475 V Full Scale 6 s Output Voltage Settling Time Low Power: 3.6 mW Compact SO-8 1.5 mm Height Package
APPLICATIONS Portable Communications Digitally Controlled Calibration Servo Controls PC Peripherals
GENERAL DESCRIPTION
The AD8300 is a complete 12-bit, voltage-output digital-to­analog converter designed to operate from a single +3 volt sup­ply. Built using a CBCMOS process, this monolithic DAC offers the user low cost, and ease-of-use in single-supply +3 volt systems. Operation is guaranteed over the supply voltage range of +2.7 V to +5.5 V making this device ideal for battery oper­ated applications.
The 2.0475 V full-scale voltage output is laser trimmed to maintain accuracy over the operating temperature range of the device. The binary input data format provides an easy-to-use one-half-millivolt-per-bit software programmability. The voltage outputs are capable of sourcing 5 mA.
Complete 12-Bit DAC
AD8300

FUNCTIONAL BLOCK DIAGRAM

12-BIT
CLR
LD
CS
CLK
SDI
REF
EN
DAC
12
DAC
REGISTER
12
SERIAL
REGISTER
AD8300
A double buffered serial data interface offers high speed, three­wire, DSP and microcontroller compatible inputs using data in (SDI), clock (CLK) and load strobe (LD) pins. A chip select (CS) pin simplifies connection of multiple DAC packages by enabling the clock input when active low. Additionally, a CLR input sets the output to zero scale at power on or upon user demand.
The AD8300 is specified over the extended industrial (–40°C to +85°C) temperature range. AD8300s are available in plastic
DIP, and low profile 1.5 mm height SO-8 surface mount packages.
V
OUT
V
DD
GND
3.0
DVFS 1 LSB
2.8
DATA = FFF TA = +258C
2.6
PROPER OPERATION
2.4
WHEN VDD SUPPLY
VOLTAGE ABOVE
2.2
MINIMUM SUPPLY VOLTAGE – Volts
2.0
0.01 100.1 1.0 OUTPUT LOAD CURRENT – mA
H
CURVE
Figure 1. Minimum Supply Voltage vs. Load
REV. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
1.00 V
= +2.7V
0.75
0.50
0.25
0.00
–0.25
–0.50
INL LINEARITY ERROR – LSB
–0.75
–1.00
0 40961024 2048
DD
T
= –408C, +258C, +1258C
A
= –408C = +258C = +1258C
DIGITAL INPUT CODE – Decimal
3072
Figure 2. Linearity Error vs. Digital Code and Temperature
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 1999
Page 2
AD8300–SPECIFICATIONS
+3 V OPERATION
(@ V
= +5 V 10%, –40ⴗC ≤ TA +85C, unless otherwise noted)
DD
Parameter Symbol Condition Min Typ Max Units
STATIC PERFORMANCE
Resolution N [Note 1] 12 Bits
Relative Accuracy INL –2 ±1/2 +2 LSB
Differential Nonlinearity Zero-Scale Error V Full-Scale Voltage Full-Scale Tempco TCV
2
3
DNL Monotonic –1 ±1/2 +1 LSB
ZSE
V
FS
FS
Data = 000 Data = FFF
H
H
[Notes 3, 4] 16 ppm/°C
+1/2 +3 mV
2.039 2.0475 2.056 Volts
ANALOG OUTPUT
Output Current (Source) I Output Current (Sink) I Load Regulation L Output Resistance to GND R Capacitive Load C
OUT
OUT
REG
OUT
L
Data = 800 Data = 800 R
= 200 to , Data = 800
L
Data = 000 No Oscillation
H
H
H
, ∆V , ∆V
4
= 5 LSB 5 mA
OUT
= 5 LSB 2 mA
OUT
H
1.5 5 LSB
30
500 pF
LOGIC INPUTS
Logic Input Low Voltage V Logic Input High Voltage V Input Leakage Current I Input Capacitance C
INTERFACE TIMING

SPECIFICATIONS

4, 5
Clock Width High t Clock Width Low t Load Pulsewidth t Data Setup t Data Hold t Clear Pulsewidth t Load Setup t Load Hold t Select t Deselect t
AC CHARACTERISTICS
4
Voltage Output Settling Time t
IL
IH
IL
IL
CH
CL
LDW
DS
DH
CLRW
LD1
LD2
CSS
CSH
S
To ±0.2% of Full Scale 7 µs To ±1 LSB of Final Value
Output Slew Rate SR Data = 000
to FFFH to 000
H
2.1 V
40 ns 40 ns 50 ns 15 ns 15 ns 40 ns 15 ns 40 ns 40 ns 40 ns
6
H
14 µs
2.0 V/µs
0.6 V
10 µA
10 pF
DAC Glitch 15 nV/s Digital Feedthrough 15 nV/s
SUPPLY CHARACTERISTICS
Power Supply Range VDD Positive Supply Current I
Power Dissipation P
DD
DISS
RANGE
DNL < ±1 LSB 2.7 5.5 V
VDD = 3 V, VIL = 0 V, Data = 000 V
= 3.6 V, VIH = 2.3 V, Data = FFF
DD
VDD = 3 V, VIL = 0 V, Data = 000
H
H
H
1.2 1.7 mA
1.9 3.0 mA
3.6 5.1 mW
Power Supply Sensitivity PSS ∆VDD = ±5% 0.001 0.005 %/%
NOTES
1
LSB = 0.5 mV for 0 V to +2.0475 V output range.
2
The first two codes (000H, 001H) are excluded from the linearity error measurement.
3
Includes internal voltage reference error.
4
These parameters are guaranteed by design and not subject to production testing.
5
All input control signals are specified with tR = tF = 2 ns (10% to 90% of +3 V) and timed from a voltage level of 1.6 V.
6
The settling time specification does not apply for negative going transitions within the last 6 LSBs of ground. Some devices exhibit double the typical settling time in
this 6 LSB region.
Specifications subject to change without notice.
–2–
REV. A
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AD8300
+5 V OPERATION
(@ V
= +5 V 10%, –40ⴗC ≤ TA +85C, unless otherwise noted)
DD
Parameter Symbol Condition Min Typ Max Units
STATIC PERFORMANCE
Resolution N [Note 1] 12 Bits
Relative Accuracy INL –2 ±1/2 +2 LSB
Differential Nonlinearity Zero-Scale Error V Full-Scale Voltage Full-Scale Tempco TCV
2
3
DNL Monotonic –1 ±1/2 +1 LSB
ZSE
V
FS
FS
Data = 000 Data = FFF
H
H
[Notes 3, 4] 16 ppm/°C
+1/2 +3 mV
2.039 2.0475 2.056 Volts
ANALOG OUTPUT
Output Current (Source) I Output Current (Sink) I Load Regulation L Output Resistance to GND R Capacitive Load C
OUT
OUT
REG
OUT
L
Data = 800 Data = 800 R
= 200 to , Data = 800
L
Data = 000 No Oscillation
H
H
H
, ∆V , ∆V
4
= 5 LSB 5 mA
OUT
= 5 LSB 2 mA
OUT
H
1.5 5 LSB
30
500 pF
LOGIC INPUTS
Logic Input Low Voltage V Logic Input High Voltage V Input Leakage Current I Input Capacitance C
INTERFACE TIMING
SPECIFICATIONS
4, 5
Clock Width High t Clock Width Low t Load Pulsewidth t Data Setup t Data Hold t Clear Pulsewidth t Load Setup t Load Hold t Select t Deselect t
AC CHARACTERISTICS
4
Voltage Output Settling Time t
IL
IH
IL
IL
CH
CL
LDW
DS
DH
CLWR
LD1
LD2
CSS
CSH
S
To ±0.2% of Full Scale 6 µs To ±1 LSB of Final Value
Output Slew Rate SR Data = 000
to FFFH to 000
H
2.4 V
30 ns 30 ns 30 ns 15 ns 15 ns 30 ns 15 ns 30 ns 30 ns 30 ns
6
H
13 µs
2.2 V/µs
0.8 V
10 µA
10 pF
DAC Glitch 15 nV/s Digital Feedthrough 15 nV/s
SUPPLY CHARACTERISTICS
Power Supply Range VDD Positive Supply Current I
Power Dissipation P
DD
DISS
RANGE
DNL < ±1 LSB 2.7 5.5 V
VDD = 5 V, VIL = 0 V, Data = 000 V
= 5.5 V, VIH = 2.3 V, Data = FFF
DD
VDD = 5 V, VIL = 0 V, Data = 000
H
H
H
1.2 1.7 mA
2.8 4.0 mA 6 5.1 mW
Power Supply Sensitivity PSS ∆VDD = ±10% 0.001 0.006 %/%
NOTES
1
1 LSB = 0.5 mV for 0 V to +2.0475 V output range.
2
The first two codes (000H, 001H) are excluded from the linearity error measurement.
3
Includes internal voltage reference error.
4
These parameters are guaranteed by design and not subject to production testing.
5
All input control signals are specified with tR = tF = 2 ns (10% to 90% of +5 V) and timed from a voltage level of 1.6 V.
6
The settling time specification does not apply for negative going transitions within the last 6 LSBs of ground. Some devices exhibit double the typical settling time in this 6 LSB region.
Specifications subject to change without notice.
REV. A –3–
Page 4
AD8300
WARNING!
ESD SENSITIVE DEVICE

ABSOLUTE MAXIMUM RATINGS

*
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +7 V
Logic Inputs to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V, +7 V
V
to GND . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
OUT
Short Circuit to GND . . . . . . . . . . . . . . . . . . . . . . 50 mA
I
OUT
Package Power Dissipation . . . . . . . . . . . . . (T
Thermal Resistance θ
JA
Max – T
J
)/θ
A
JA
8-Lead Plastic DIP Package (N-8) . . . . . . . . . . . . . 103°C/W
8-Lead SOIC Package (SO-8) . . . . . . . . . . . . . . . . 158°C/W
Maximum Junction Temperature (T
Max) . . . . . . . . . . 150°C
J
Operating Temperature Range . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 10 secs) . . . . . . . . . . . . +300°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ORDERING GUIDE

Package Package
Model INL Temp Description Options
AD8300AN ±2 XIND 8-Lead P-DIP N-8 AD8300AR ±2 XIND 8-Lead SOIC SO-8
NOTES XIND = –40°C to +85°C. The AD8300 contains 630 transistors. The die size measures 72 mil × 65 mil.
PIN CONFIGURATIONS
SO-8 Plastic DIP
1
4
8
5
V
CS
CLK
SDI
DD
1 2
AD8300
TOP VIEW
3
(Not to Scale)
4
8
V
OUT
7
GND
6
CLR
5
LD
PIN DESCRIPTIONS
Pin # Name Function
1V
DD
Positive power supply input. Specified range
of operation +2.7 V to +5.5 V.
2 CS Chip Select, active low input. Disables shift
register loading when high. Does not affect LD operation.
3 CLK Clock input, positive edge clocks data into
shift register.
4 SDI Serial Data Input, input data loads directly
into the shift register, MSB first.
5 LD Load DAC register strobes, active low.
Transfers shift register data to DAC register. See Truth Table I for operation. Asynchro­nous active low input.
6 CLR Resets DAC register to zero condition.
Asynchronous active low input. 7 GND Analog and Digital Ground. 8V
OUT
DAC voltage output, 2.0475 V full scale with 0.5 mV per bit. An internal tempera­ture stabilized reference maintains a fixed full-scale voltage independent of time, tem­perature and power supply variations.
SDI
D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
CLK
t
CSS
t
CS
t
LD1
LD
SDI
t
DStDH
t
CLK
LD
CLR
FS
V
OUT
ZS
CL
t
CH
t
LDW
t
S
61LSB
ERROR BAND
Figure 3. Timing Diagram
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD8300 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
CSH
t
t
LD2
CLRW
t
S
–4–
REV. A
Page 5
Typical Performance Characteristics–
AD8300
80
60
40
20
0
–20
–40
OUTPUT CURRENT – mA
–60
–80
BROADBAND NOISE – 200mV/DIV
POSITIVE
CURRENT
VDD = +3V
VDD = +5V
02
OUTPUT VOLTAGE – Volts
Figure 4. I
TIME = 100ms/DIV
LIMIT
DATA = 800 RL TIED TO +1.024V
NEGATIVE CURRENT LIMIT
1
vs. V
OUT
VDD = +5V
VDD = +3V
H
OUT
Figure 7. Broadband Noise
2.5 TA = –40 TO +858C
2.0
1.5
1.0
0.5
LOGIC THRESHOLD VOLTAGE
0
01 645
V
SUPPLY VOLTAGE – Volts
DD
Figure 5. Logic Input Threshold Voltage vs. V
50 45 40 35 30
VDD = +3V 610%
25 20 15
TA = +258C
10
DATA = FFF
POWER SUPPLY REJECTION – dB
5 0
10 100 1M10k 100k
Figure 8. Power Supply Rejection vs. Frequency
23
DD
V
= +5V 610%
DD
H
1k
FREQUENCY – Hz
HORIZONTAL = 1ms/DIV
Figure 6. Detail Settling Time
HORIZONTAL = 20ms/DIV
Figure 9. Large Signal Settling Time
3.5
3.0
2.5 VDD = +3V
2.0
1.5
1.0
SUPPLY CURRENT – mA
0.5
0
01 534
VDD = +5V
TA = +258C DATA = FFF
2
LOGIC VOLTAGE – Volts
H
Figure 10. Supply Current vs. Logic Input Voltage
CODE 800H TO 7FF
H
Figure 11. Midscale Transition Performance
0.5ms/DIV
Figure 12. Digital Feedthrough vs. Time
REV. A
–5–
Page 6
AD8300
60
50
40
30
FREQUENCY
20
10
0
–1 0 623145
TOTAL UNADJUSTED ERROR – mV
TUE = SINL+ZS+FS
ss = 300 UNITS
= +3V
V
DD
= +258C
T
A
Figure 13. Total Unadjusted Error Histogram
1.5
NO LOAD
1.0
ss = 300 UNITS NORMALIZED TO +258C
0.5 VDD = +5.5V
0
DRIFT – mV
OUT
–0.5
V
–1.0
–1.5
–55 –35 1255 25 45 65 85 105–15
VDD = +2.7V
TEMPERATURE – 8C
Figure 16. Full-Scale Voltage Drift vs. Temperature
1.5 NO LOAD
1.0
0.5
0
DRIFT – mV
OUT
–0.5
V
–1.0
–1.5
–55 –35 1255 25 45 65 85 105–15
ss = 300 UNITS NORMALIZED TO +258C
VDD = +2.7V
TEMPERATURE – 8C
VDD = +5V
Figure 14. Zero-Scale Voltage Drift vs. Temperature
10
V
= +3V
DD
DATA = FFF
1
0.1
NOISE DENSITY – mV/Hz
0.01 1 100k10 100 1k 10k
FREQUENCY – Hz
H
Figure 17. Output Voltage Noise Density vs. Frequency
3.0 V
= +5.5V
DD
2.6 V
= +5.0V
DD
2.2
V
= +4.5V
DD
1.8 V
= +2.7, 3.0, 3.3V
SUPPLY CURRENT – mA
1.4
DD
I
1.0
DD
DATA = FFF
VIH = +2.4V
= 0V
V
IL
–60 –20 14020 60 100
TEMPERATURE – 8C
Figure 15. Supply Current vs. Temperature
70
60
V
= +3V
DD
DATA FFF
H
TA = –40 TO +858C
50
40
30
FREQUENCY
20
10
0
–50 –40 40–20 –10
–30
TEMPERATURE COEFFICIENT – ppm/8C
0203010
Figure 18. Full-Scale Output Tempco Histogram
H
2.4
2.0
1.6
1.2
0.8
0.4
NOMINAL VOLTAGE CHANGE – mV
0
0 100
HOURS OF OPERATION AT +1508C
VDD = +2.7V ss = 135 UNITS
FULL SCALE (DATA = FFFH)
ZERO SCALE (DATA = 000H)
200 300 500
400
Figure 19. Long Term Drift Accelerated by Burn-In
–6–
600
REV. A
Page 7
AD8300
Table I. Control Logic Truth Table
CS CLK CLR LD Serial Shift Register Function DAC Register Function
H X H H No Effect Latched L L H H No Effect Latched L H H H No Effect Latched
L H H Shift-Register-Data Advanced One Bit Latched L H H No Effect Latched HX H No Effect Updated with Current Shift Register Contents
H X H L No Effect Transparent H X L X No Effect Loaded with All Zeros
HX H No Effect Latched All Zeros
NOTES
1. = Positive Logic Transition; = Negative Logic Transition; X = Don’t Care.
2. Do not clock in serial data while LD is LOW.
3. Data loads MSB first.
OPERATION
The AD8300 is a complete ready to use 12-bit digital-to-analog converter. Only one +3 V power supply is necessary for opera­tion. It contains a 12-bit laser-trimmed digital-to-analog converter, a curvature-corrected bandgap reference, rail-to-rail output op amp, serial-input register, and DAC register. The serial data interface consists of a serial-data-input (SDI) clock (CLK), and load strobe pins (LD) with an active low CS strobe. In addition an asynchronous CLR pin will set all DAC register bits to zero causing the V
to become zero volts. This func-
OUT
tion is useful for power on reset or system failure recovery to a known state.

D/A CONVERTER SECTION

The internal DAC is a 12-bit device with an output that swings from GND potential to 0.4 volt generated from the internal band­gap voltage, see Figure 20. It uses a laser-trimmed segmented R-2R ladder which is switched by N-channel MOSFETs. The output voltage of the DAC has a constant resistance indepen­dent of digital input code. The DAC output is internally con­nected to the rail-to-rail output op amp.

AMPLIFIER SECTION

The internal DAC’s output is buffered by a low power con­sumption precision amplifier. This low power amplifier contains a differential PNP pair input stage that provides low offset volt­age and low noise, as well as the ability to amplify the zero-scale DAC output voltages. The rail-to-rail amplifier is configured with a gain of approximately five in order to set the 2.0475 volt full-scale output (0.5 mV/LSB). See Figure 20 for an equivalent circuit schematic of the analog section.
REF
0.4V
1.2V 12-BIT DAC
0.4V FS
V
OUT
2.047V FS
R2
R1
BANDGAP
Figure 20. Equivalent AD8300 Schematic of Analog Portion
The op amp has a 2 µs typical settling time to 0.4% of full scale.
There are slight differences in settling time for negative slewing signals versus positive. Also negative transition settling time to within the last 6 LSB of zero volts has an extended settling time. See the oscilloscope photos in the typical performances section of this data sheet.
OUTPUT SECTION
The rail-to-rail output stage of this amplifier has been designed to provide precision performance while operating near either power supply. Figure 21 shows an equivalent output schematic of the rail-to-rail amplifier with its N-channel pull-down FETs that will pull an output load directly to GND. The output sourcing current is provided by a P-channel pull-up device that can source current to GND terminated loads.
V
P-CH
N-CH
DD
V
OUT
AGND
Figure 21. Equivalent Analog Output Circuit
The rail-to-rail output stage achieves the minimum operating supply voltage capability shown in Figure 2. The N-channel
output pull-down MOSFET shown in Figure 21 has a 35 on
resistance which sets the sink current capability near ground. In addition to resistive load driving capability, the amplifier has also been carefully designed and characterized for up to 500 pF capacitive load driving capability.

REFERENCE SECTION

The internal curvature-corrected bandgap voltage reference is laser trimmed for both initial accuracy and low temperature coefficient. Figure 18 provides a histogram of total output per­formance of full-scale vs. temperature which is dominated by the reference performance.

POWER SUPPLY

The very low power consumption of the AD8300 is a direct result of a circuit design optimizing use of a CBCMOS process. By using the low power characteristics of the CMOS for the logic, and the low noise, tight matching of the complementary bipolar transistors, good analog accuracy is achieved.
For power-consumption sensitive applications it is important to note that the internal power consumption of the AD8300 is strongly dependent on the actual logic input voltage levels present on the SDI, CLK, CS, LD, and CLR pins. Since these inputs are standard CMOS logic structures, they contribute static power dissipation dependent on the actual driving logic
REV. A
–7–
Page 8
AD8300
VOH and VOL voltage levels. Consequently, for optimum dissipa­tion use of CMOS logic versus TTL provides minimal dissipa­tion in the static state. A V
= 0 V on the logic input pins
INL
provides the lowest standby dissipation of 1.2 mA with a +3.3 V power supply.
As with any analog system, it is recommended that the AD8300 power supply be bypassed on the same PC card that contains the chip. Figure 8 shows the power supply rejection versus fre­quency performance. This should be taken into account when using higher frequency switched-mode power supplies with ripple frequencies of 100 kHz and higher.
One advantage of the rail-to-rail output amplifiers used in the AD8300 is the wide range of usable supply voltage. The part is fully specified and tested over temperature for operation from +2.7 V to +5.5 V. If reduced linearity and source current capa­bility near full scale can be tolerated, operation of the AD8300 is possible down to +2.1 volts. The minimum operating supply voltage versus load current plot in Figure 2 provides information for operation below V
= +2.7 V.
DD

TIMING AND CONTROL

The AD8300 has a separate serial-input register from the 12-bit DAC register that allows preloading of a new data value MSB first into the serial register without disturbing the present DAC output voltage value. Data can only be loaded when the CS pin is active low. After the new value is fully loaded in the serial­input register, it can be asynchronously transferred to the DAC register by strobing the LD pin. The DAC register uses a level sensitive LD strobe that should be returned high before any new data is loaded into the serial-input register. At any time the contents of the DAC resister can be reset to zero by strobing the CLR pin which causes the DAC output voltage to go to zero volts. All of the timing requirements are detailed in Figure 3 along with Table I. Control Logic Truth Table.
All digital inputs are protected with a Zener type ESD protection structure (Figure 22) that allows logic input voltages to exceed the V
supply voltage. This feature can be useful if the user is
DD
loading one or more of the digital inputs with a 5 V CMOS logic input voltage level while operating the AD8300 on a +3.3 V power supply. If this mode of interface is used, make sure that
of the +5 V CMOS meets the VIL input requirement of
the V
OL
the AD8300 operating at 3 V. See Figure 5 for the effect on digital logic input threshold versus operating V
V
DD
LOGIC
IN
GND
supply voltage.
DD
Table II. Unipolar Code Table
Hexadecimal Decimal Number in Number in Analog Output DAC Register DAC Register Voltage (V)
FFF 4095 +2.0475 801 2049 +1.0245 800 2048 +1.0240 7FF 2047 +1.0235 000 0 +0.0000
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
8-Lead SOIC (SO-8)
0.1 968 (5.00)
0.1 890 (4.80)
0.1574 (4.00)
0.1497 (3.80)
PIN 1
0.0098 (0.25)
0.0040 (0.10) SEATING
85
0.0500 (1.27)
PLANE
0.2440 (6.20)
0.2284 (5.80)
41
BSC
0.0192 (0.49)
0.0138 (0.35)
0.0688 (1.75)
0.0532 (1.35)
0.0098 (0.25)
0.0075 (0.19)
0.0196 (0.50)
0.0099 (0.25)
88
0.0500 (1.27)
08
0.0160 (0.41)
3 458
8-Lead Plastic DIP (N-8)
0.430 (10.92)
0.348 (8.84)
PIN 1
0.210 (5.33)
MAX
0.160 (4.06)
0.115 (2.93)
0.022 (0.558)
0.014 (0.356)
8
0.100 (2.54)
5
0.280 (7.11)
14
BSC
0.240 (6.10)
(0.381)
0.070 (1.77)
0.045 (1.15)
0.015 TYP
0.130 (3.30) MIN
SEATING PLANE
0.325 (8.25)
0.300 (7.62)
158
08
0.195 ( 4.95)
0.115 (2.93)
0.015 (0.381)
0.008 (0.204)
C1968a–0–5/99
Figure 22. Equivalent Digital Input ESD Protection
Unipolar Output Operation
This is the basic mode of operation for the AD8300. The
AD8300 has been designed to drive loads as low as 400 in
parallel with 500 pF. The code table for this operation is shown in Table II.

APPLICATIONS INFORMATION

See DAC8512 data sheet for additional application circuit ideas.
–8–
PRINTED IN U.S.A.
REV. A
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