Datasheet AD809BR-REEL7, AD809BR Datasheet (Analog Devices)

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155.52 MHz Frequency Synthesizer AD809
FEATURES Frequency Synthesis to 155.52 MHz
19.44 MHz or 9.72 MHz Input Reference Signal Select Mux Single Supply Operation: +5 V or –5.2 V Output Jitter: 2.0 Degrees RMS Low Power: 90 mW 10 KH ECL/PECL Compatible Output 10 KH ECL/PECL/TTL/CMOS Compatible Input Package: 16-Pin Narrow 150 Mil SOIC

PRODUCT DESCRIPTION

The AD809 provides a 155.52 MHz ECL/PECL output clock from either a 19.44 MHz or a 9.72 MHz TTL/CMOS/ECL/PECL refer­ence frequency. The AD809 functionality supports a distributed timing architecture, allowing a backplane or PCB 19.44 MHz or
9.72 MHz timing reference signal to be distributed to multiple

FUNCTIONAL BLOCK DIAGRAM

CLKIN
CLKINN
PECLIN
PECLINN
MUX
13
12
10
2
1
15
AUTO
SELECT
AD809
PFD
(19.44MHz
OR
9.72MHz)
TTL/CMOSIN
(155MHz)
155.52 Mbps ports. The AD809 can be applied to create the trans­mit bit clock for one or more ports.
An input signal multiplexer supports loop-timed applications where a 155.52 MHz transmit bit clock is recovered from the
155.52 Mbps received data. The low jitter VCO, low power and wide operating temperature
range make the device suitable for generating a 155.52 MHz bit clock for SONET/SDH/Fiber in the Loop systems.
The device has a low cost, on-chip VCO that locks to either 8× or 16× the frequency at the 19.44 MHz or 9.72 MHz input. No external components are needed for frequency synthesis; how­ever, the user can adjust loop dynamics through selection of a damping factor capacitor whose value determines loop damping.
The AD809 design guarantees that the clock output frequency will drift low (by roughly 20%) in the absence of a signal at the input.
The AD809 consumes 90 mW and operates from a single power supply at either +5 V or –5.2 V.
CF1 CF2
8
7
LOOP
FILTER
BW ADJUST
AUTO SELECT DIVIDE BY 8/16
MUX
VCO
5
CLKOUT
4
CLKOUTN (155MHz PECL OUTPUT)
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Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 617/329-4700 World Wide Web Site: http://www.analog.com Fax: 617/326-8703 © Analog Devices, Inc., 1997
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AD809–SPECIFICATIONS
(TA = T
MIN
to T
MAX
, VS = V
MIN
to V
, CD = 22 nF, unless otherwise noted)
MAX
Parameter Condition Min Typ Max Units
TRACKING AND CAPTURE RANGE
1
×8 Synthesis 19.42 19.46 MHz ×16 Synthesis 9.71 9.73 MHz
OUTPUT JITTER ×8 Synthesis 1.6 2.9 Degrees RMS
×16 Synthesis 1.6 2.9 Degrees RMS
JITTER TRANSFER
Bandwidth 200 kHz Peaking C
= 5.6 nF (ζ = 5) 0.08 dB
D
C
= 22 nF (ζ = 10) 0.02 dB
D
DUTY CYCLE TOLERANCE ×8 or ×16 Synthesis
Output Jitter 2.9 Degrees RMS 15 85 %
INPUT VOLTAGE LEVELS
PECL
Input Logic High, V Input Logic Low, V
IL
IH
@ CLKIN/N and 3.8 V
CC
Volts
PECLIN/N Inputs 3.1 3.6 Volts
TTL
Input Logic High, V Input Logic Low, V
IH
IL
OUTPUT VOLTAGE LEVELS Referenced to V
@ TTL/CMOSIN 2.0 Volts and MUX Inputs 0.8 Volts
CC
PECL
Output Logic High, V Output Logic Low, V
OL
OH
–1.2 –1.0 –0.7 Volts –2.0 –1.8 –1.7 Volts
SYMMETRY (Duty Cycle) ×8 Synthesis or 46 52 62 %
×16 Synthesis %
OUTPUT RISE/FALL TIMES 1.5
Rise Time (t
) 20%–80% 1.1 1.5 ns
R
Fall Time (tF) 80%–20% 1.1 1.5 ns
POWER SUPPLY VOLTAGE V
MIN
to V
MAX
4.5 5.5 Volts
POWER SUPPLY CURRENT 17 26 mA
OPERATING TEMPERATURE RANGE T
NOTES
1
Device design is guaranteed for operation over Capture Ranges and Tracking Ranges, however the device has wider capture and tracking ranges (for both ×8 and ×16 synthesis).
Specifications subject to change without notice.
MIN
to T
MAX
–40 +85 °C
ABSOLUTE MAXIMUM RATINGS*
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +12 V
Input Voltage (Pin 12 or Pin 13) . . . . . . . . . . . . . . V
+ 0.6 V
CC
“ON” TIME
t
ON
Maximum Junction Temperature. . . . . . . . . . . . . . . . . +165°C
Storage Temperature Range . . . . . . . . . . . . .–65°C to +150°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300°C
ESD Rating (Human Body Model) . . . . . . . . . . . . . . . .1500 V
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Thermal Characteristics: 16-Pin Narrow Body SOIC Package: θJA = 110°C/W.
OUTPUT 50%
(PINS 4 & 5)
PERIOD
SYMMETRY = (100 ×
τ
t
/τ)
ON
Figure 1. Symmetry

ORDERING GUIDE

Model Temperature Range Package Description Package Option
AD809BR –40°C to +85°C 16-Pin Narrow Body SOIC R-16A AD809BR-REEL7 –40°C to +85°C 750 Pieces, 7" Reel R-16A
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AD809
WARNING!
ESD SENSITIVE DEVICE
PIN DESCRIPTIONS
Pin No. Mnemonic Description
1 PECLINN Differential 155 MHz Input 2 PECLIN Differential 155 MHz Input 3V
CC2
Digital VCC for PECL Outputs 4 CLKOUTN Differential 155 MHz Output 5 CLKOUT Differential 155 MHz Output 6V
CC1
Digital VCC for Internal Logic 7 CF1 Loop Damping Capacitor 8 CF2 Loop Damping Capacitor 9AV
EE
Analog V
EE
10 TTL/CMOSIN TTL/CMOS Reference Clock Input 11 AV
CC1
Analog VCC for PLL 12 CLKINN PECL Differential Reference Clock Input 13 CLKIN PECL Differential Reference Clock Input 14 AV
CC2
Analog VCC for Input Stage 15 MUX Input Signal Mux Control Input 16 V
EE
Digital V
EE
PIN CONFIGURATION
PECLINN
PECLIN
V
CC2
CLKOUTN
CLKOUT
V
CC1
CF1 CF2
1 2 3
AD809
4
TOP VIEW
5
(Not to Scale)
6 7 8
V
16
EE
MUX
15
AV
14
CLKIN
13 12
CLKINN AV
11
TTL/CMOSIN
10
AV
9
CC2
CC1
EE
Table I.
MUX Input Input Selected
TTL “0” CLKIN/CLKINN TTL “1” PECLIN/PECLINN
Table II. Applying a PECL/ECL or CMOS/TTL Reference Input to the AD809
Input Reference AD809 Configuration
PECL/ECL Differential Apply the valid PECL–level reference
frequency to Pins 13 and 12. AD809 frequency synthesizer ignores
the input at Pin 10.
TTL/CMOS Apply the reference frequency to Single-Ended Pin 10.
Connect Pins 13 and 12 to AV
EE
(Pins 9 and 16). The AD809 senses the common-mode signal at these pins as less than valid PECL and selects the TTL/CMOS input as active.
AD809 Phase Skew
The AD809 output is in phase with the input. The falling edge at Pin 4, CLKOUTN, occurs 700 ps before the rising edge at Pin 10, TTL/CMOSIN at 27°C. The phase skew remains rela­tively constant over temperature. Refer to Table III for phase skew data.
Table III. Phase Skew vs. Temperature
Skew (CLKOUTN, Pin 4, Relative to Temperature TTL/CMOSIN, Pin 10 Measured in (8C) ps at Package Pins)
–35 –1000 –20 –950 0 –850 10 –750 30 –700 50 –600 70 –450 80 –450 90 –350 100 –250
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD809 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
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AD809
POPULATION – Devices
RMS JITTER – Degrees
1200
1000
0
More1.8
800
600
400
200
0.2 0.4 0.60.81.01.2 1.4 1.6 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4
100 90
80
70
60 50
40
30
20
10
0
CUMULATIVE – %
AD809 FREQUENCY SYNTHESIZER
JITTER DISTRIBUTION MATRIX
75 DEVICES (3 LOTS)
[ECL, TTL] × [×8, ×16] × [RISE, FALL] × [+4.5V, +5.0V, +5.5V] × [–40°C, +25°C, +85°C]
THIS CHART DESCRIBES THE AD809 OUTPUT JITTER SPECIFICATION OVER MANY CONDITIONS. THE DATA REPRESENTED ARE TAKEN WITH RESPECT TO THE RISING AND FALLING EDGES, FOR EACH FREQUENCY RANGE, LOCKED TO EITHER TTL OR ECL INPUT, OVER ALL TEMPERATURE AND SUPPLY CONDITIONS.
0.0
FREQUENCY
CUMULATIVE %
INPUT DUTY CYCLE – %
RMS JITTER – Degrees
1.9
1.3
1.0 0 10010 20 30 40 50 60 70 80 90
1.8
1.2
1.1
1.6
1.4
1.7
1.5
TA = +25°C V
CC
= +5V
19.44MHz 9 72MHz

DEFINITION OF TERMS

Maximum, Minimum and Typical Specifications
Specifications for every parameter are derived from statistical analyses of data taken on multiple devices from multiple wafer lots. Typical specifications are the mean of the distribution of the data for that parameter. If a parameter has a maximum (or a minimum), that value is calculated by adding to (or subtracting from) the mean six times the standard deviation of the distribu­tion. This procedure is intended to tolerate production varia­tions: if the mean shifts by 1.5 standard deviations, the remaining
4.5 standard deviations still provide a failure rate of only 3.4 parts per million. For all tested parameters, the test limits are guardbanded to account for tester variation to thus guarantee that no device is shipped outside of data sheet specifications.
Capture and Tracking Range
This is the range of input data rates over which the AD809 will remain in lock.
Jitter
This is the dynamic displacement of digital signal edges from their long term average positions, measured in degrees rms. Jitter on the input clock causes jitter on the synthesized clock.
Output Jitter
This is the jitter on the synthesized clock (OUTPUT, OUTPUT), in degrees rms.
Jitter Transfer
The AD809 exhibits a low-pass filter response to jitter applied to its input data.
Bandwidth
This describes the frequency at which the AD809 attenuates sinusoidal input jitter by 3 dB.
Peaking
This describes the maximum jitter gain of the AD809 in dB.
Damping Factor, z
Damping factor, ζ describes the compensation of the second or­der PLL. A larger value of ζ corresponds to more damping and less peaking in the jitter transfer function.
Duty Cycle Tolerance
The AD809 exhibits a duty cycle tolerance that is measured by applying an input signal (nominal input frequency) with a known duty cycle imbalance and measuring the ×8 or ×16 output frequency.
Symmetry-Recovered Clock Duty Cycle
Symmetry is calculated as (100× on time)/period, where on time equals the time that the clock signal is greater than the midpoint between its “0” level and its “1” level.
Typical Characteristic Curves
Figure 2. Jitter Histogram
Figure 3. Jitter vs. Input Duty Cycle
–4–
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USING THE AD809

2*I
TTL
80µA
OR
0µA
2*I
TTL
80µA
OR
0µA
500
V
CC1
V
EE
V
CC2
DIFFERENTIAL OUTPUT
V
EE
2.6mA
460460
500
7.5k7.5k
I
TTL
V
CC1
V
EE
500
40µA
40µA
Ground Planes
Use of one ground plane for connections to both analog and digital grounds is recommended.
Power Supply Connections
Use of a 10 µF capacitor between V
and ground is recom-
CC
mended. Care should be taken to isolate the +5 V power trace to V
(Pin 3). The V
CC2
pin is used inside the device to pro-
CC2
vide the CLKOUT/CLKOUTN signals. Use of a trace connecting Pin 14 and Pin 6 (AV
CC2
and V
CC1
respectively) is recommended. Use of 0.1 µF capacitors between IC power supply and ground is recommended. Power supply decoupling should take place as close to the IC as possible. Refer to the schematic, Figure 5, for advised connections.
Transmission Lines
Use of 50 transmission lines are recommended for PECL inputs.
Terminations
Termination resistors should be used for PECL input signals. Metal, thick film, 1% tolerance resistors are recommended. Termination resistors for the PECL input signals should be placed as close as possible to the PECL input pins.
Connections from the power supply to load resistors for input and output signals should be individual, not daisy chained. This will avoid crosstalk on these signals.
Loop Damping Capacitor, C
D
A ceramic capacitor may be used for the loop damping capaci­tor. A 22 nF capacitor provides a damping factor of 10.
AD809
Synthesizer Input TTL/CMOSIN
Synthesizer Input CLKIN/CLKINN PECL INPUT
PLL Differential Output Stage– CLKOUT/CLKOUTN
C2 0.1µF
J1
ECL INN
J2
ECL IN
CLKOUTN
CLKOUT
C3 0.1µF
C4 0.1µF
J3
C5 0.1µF
J4
R3
R4 100
100
C6
0.1µF
VECTOR PINS SPACED FOR THROUGH-HOLE CAPACITOR ON VECTOR CUPS. COMPONENT SHOWN FOR REFERENCE ONLY.
C1
0.1µF
R6
3.65k
JUMPER
R7 100 R8 100
R11
154
W2
R5 301
49.9
R1
R12 154
R2
49.9
TP1
CD
TP2
C11
10µF
+5V GND
50 STRIP LINE
EQUAL LENGTH
16-PIN SOIC
SOLDERED TO BOARD
1
PECLINN
2
PECLIN
3
V
CC2
C7
4
CLKOUTN CLKOUT
5
V
6
CC1
C8
7
CF1
8
CF2
GUARD RING
TP4TP3
AD809
TTL/CMOSIN
V
MUX
AV
CC2
CLKIN
CLKINN
AV
CC1
AV
16
EE
15 14 13 12 11 10
9
EE
Figure 5. Evaluation Board Schematic
Figure 4. Simplified Schematics
J5
+5V
MUX
R16 301
JUMPER W3
R14
49.9
R15
49.9
R13
49.9
C12
0.1µF
R17
3.65k
C13 0.1µF
C14 0.1µF
C15 0.1µF
JUMPER
NOTE: C7–C10 ARE 0.1µF BYPASS CAPACITORS
EXT
W1
GND
C9
C10
RIGHT ANGLE SMA CONNECTOR OUTER SHELL TO GND PLANE
ALL RESISTORS ARE 1% 1/8 WATT SURFACE MOUNT TPx
TEST POINTS ARE VECTOR PINS
J6
CLKIN
J7
CLKINN
J8
CMOS/TTL IN
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AD809
Figure 6. Evaluation Board: Component Side
Figure 7. Evaluation Board: Solder Side
–6–
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AD809
Figure 8. Evaluation Board: INT2
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AD809
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
16-Lead Small Outline IC Package
(R-16A)
16 9
PIN 1
1
0.0098 (0.25)
0.0040 (0.10)
0.0500 (1.27)
0.3937 (10.00)
0.3859 (9.80)
BSC
0.0192 (0.49)
0.0138 (0.35)
0.1574 (4.00)
0.1497 (3.80)
8
0.0688 (1.75)
0.0532 (1.35)
0.2440 (6.20)
0.2284 (5.80)
0.0099 (0.25)
0.0075 (0.19)
8° 0°
0.0196 (0.50)
0.0099 (0.25)
0.0500 (1.27)
0.0160 (0.41)
C2045a–2–1/97
x 45°
–8–
PRINTED IN U.S.A.
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