19.44 MHz or 9.72 MHz Input
Reference Signal Select Mux
Single Supply Operation: +5 V or –5.2 V
Output Jitter: 2.0 Degrees RMS
Low Power: 90 mW
10 KH ECL/PECL Compatible Output
10 KH ECL/PECL/TTL/CMOS Compatible Input
Package: 16-Pin Narrow 150 Mil SOIC
PRODUCT DESCRIPTION
The AD809 provides a 155.52 MHz ECL/PECL output clock from
either a 19.44 MHz or a 9.72 MHz TTL/CMOS/ECL/PECL reference frequency. The AD809 functionality supports a distributed
timing architecture, allowing a backplane or PCB 19.44 MHz or
9.72 MHz timing reference signal to be distributed to multiple
FUNCTIONAL BLOCK DIAGRAM
CLKIN
CLKINN
PECLIN
PECLINN
MUX
13
12
10
2
1
15
AUTO
SELECT
AD809
PFD
(19.44MHz
OR
9.72MHz)
TTL/CMOSIN
(155MHz)
155.52 Mbps ports. The AD809 can be applied to create the transmit bit clock for one or more ports.
An input signal multiplexer supports loop-timed applications
where a 155.52 MHz transmit bit clock is recovered from the
155.52 Mbps received data.
The low jitter VCO, low power and wide operating temperature
range make the device suitable for generating a 155.52 MHz bit
clock for SONET/SDH/Fiber in the Loop systems.
The device has a low cost, on-chip VCO that locks to either
8× or 16× the frequency at the 19.44 MHz or 9.72 MHz input.
No external components are needed for frequency synthesis; however, the user can adjust loop dynamics through selection of a
damping factor capacitor whose value determines loop damping.
The AD809 design guarantees that the clock output frequency
will drift low (by roughly 20%) in the absence of a signal at the
input.
The AD809 consumes 90 mW and operates from a single power
supply at either +5 V or –5.2 V.
CF1 CF2
8
7
LOOP
FILTER
BW
ADJUST
AUTO SELECT
DIVIDE BY 8/16
MUX
VCO
5
CLKOUT
4
CLKOUTN
(155MHz
PECL
OUTPUT)
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
Device design is guaranteed for operation over Capture Ranges and Tracking Ranges, however the device has wider capture and tracking ranges
(for both ×8 and ×16 synthesis).
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only; functional operation
of the device at these or any other conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Thermal Characteristics:
16-Pin Narrow Body SOIC Package: θJA = 110°C/W.
Digital VCC for PECL Outputs
4CLKOUTNDifferential 155 MHz Output
5CLKOUTDifferential 155 MHz Output
6V
CC1
Digital VCC for Internal Logic
7CF1Loop Damping Capacitor
8CF2Loop Damping Capacitor
9AV
EE
Analog V
EE
10TTL/CMOSIN TTL/CMOS Reference Clock Input
11AV
CC1
Analog VCC for PLL
12CLKINNPECL Differential Reference Clock Input
13CLKINPECL Differential Reference Clock Input
14AV
CC2
Analog VCC for Input Stage
15MUXInput Signal Mux Control Input
16V
EE
Digital V
EE
PIN CONFIGURATION
PECLINN
PECLIN
V
CC2
CLKOUTN
CLKOUT
V
CC1
CF1
CF2
1
2
3
AD809
4
TOP VIEW
5
(Not to Scale)
6
7
8
V
16
EE
MUX
15
AV
14
CLKIN
13
12
CLKINN
AV
11
TTL/CMOSIN
10
AV
9
CC2
CC1
EE
Table I.
MUX InputInput Selected
TTL “0”CLKIN/CLKINN
TTL “1”PECLIN/PECLINN
Table II. Applying a PECL/ECL or CMOS/TTL Reference
Input to the AD809
Input ReferenceAD809 Configuration
PECL/ECL DifferentialApply the valid PECL–level reference
frequency to Pins 13 and 12.
AD809 frequency synthesizer ignores
the input at Pin 10.
TTL/CMOSApply the reference frequency to
Single-EndedPin 10.
Connect Pins 13 and 12 to AV
EE
(Pins 9 and 16). The AD809 senses
the common-mode signal at these pins
as less than valid PECL and selects the
TTL/CMOS input as active.
AD809 Phase Skew
The AD809 output is in phase with the input. The falling edge
at Pin 4, CLKOUTN, occurs 700 ps before the rising edge at
Pin 10, TTL/CMOSIN at 27°C. The phase skew remains relatively constant over temperature. Refer to Table III for phase
skew data.
Table III. Phase Skew vs. Temperature
Skew (CLKOUTN, Pin 4, Relative to
TemperatureTTL/CMOSIN, Pin 10 Measured in
(8C)ps at Package Pins)
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD809 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
THIS CHART DESCRIBES THE
AD809 OUTPUT JITTER
SPECIFICATION OVER MANY
CONDITIONS. THE DATA
REPRESENTED ARE TAKEN
WITH RESPECT TO THE RISING
AND FALLING EDGES, FOR
EACH FREQUENCY RANGE,
LOCKED TO EITHER TTL OR
ECL INPUT, OVER ALL
TEMPERATURE AND SUPPLY
CONDITIONS.
0.0
FREQUENCY
CUMULATIVE %
INPUT DUTY CYCLE – %
RMS JITTER – Degrees
1.9
1.3
1.0
0100102030405060708090
1.8
1.2
1.1
1.6
1.4
1.7
1.5
TA = +25°C
V
CC
= +5V
19.44MHz
9 72MHz
DEFINITION OF TERMS
Maximum, Minimum and Typical Specifications
Specifications for every parameter are derived from statistical
analyses of data taken on multiple devices from multiple wafer
lots. Typical specifications are the mean of the distribution of
the data for that parameter. If a parameter has a maximum (or a
minimum), that value is calculated by adding to (or subtracting
from) the mean six times the standard deviation of the distribution. This procedure is intended to tolerate production variations: if the mean shifts by 1.5 standard deviations, the remaining
4.5 standard deviations still provide a failure rate of only 3.4
parts per million. For all tested parameters, the test limits are
guardbanded to account for tester variation to thus guarantee
that no device is shipped outside of data sheet
specifications.
Capture and Tracking Range
This is the range of input data rates over which the AD809 will
remain in lock.
Jitter
This is the dynamic displacement of digital signal edges from
their long term average positions, measured in degrees rms.
Jitter on the input clock causes jitter on the synthesized clock.
Output Jitter
This is the jitter on the synthesized clock (OUTPUT, OUTPUT),
in degrees rms.
Jitter Transfer
The AD809 exhibits a low-pass filter response to jitter applied
to its input data.
Bandwidth
This describes the frequency at which the AD809 attenuates
sinusoidal input jitter by 3 dB.
Peaking
This describes the maximum jitter gain of the AD809 in dB.
Damping Factor, z
Damping factor, ζ describes the compensation of the second order PLL. A larger value of ζ corresponds to more damping and
less peaking in the jitter transfer function.
Duty Cycle Tolerance
The AD809 exhibits a duty cycle tolerance that is measured
by applying an input signal (nominal input frequency) with a
known duty cycle imbalance and measuring the ×8 or ×16
output frequency.
Symmetry-Recovered Clock Duty Cycle
Symmetry is calculated as (100× on time)/period, where on time
equals the time that the clock signal is greater than the midpoint
between its “0” level and its “1” level.
Typical Characteristic Curves
Figure 2. Jitter Histogram
Figure 3. Jitter vs. Input Duty Cycle
–4–
REV. A
Page 5
USING THE AD809
2*I
TTL
80µA
OR
0µA
2*I
TTL
80µA
OR
0µA
500Ω
V
CC1
V
EE
V
CC2
DIFFERENTIAL
OUTPUT
V
EE
2.6mA
460Ω460Ω
500Ω
7.5kΩ7.5kΩ
I
TTL
V
CC1
V
EE
500Ω
40µA
40µA
Ground Planes
Use of one ground plane for connections to both analog and
digital grounds is recommended.
Power Supply Connections
Use of a 10 µF capacitor between V
and ground is recom-
CC
mended. Care should be taken to isolate the +5 V power trace
to V
(Pin 3). The V
CC2
pin is used inside the device to pro-
CC2
vide the CLKOUT/CLKOUTN signals.
Use of a trace connecting Pin 14 and Pin 6 (AV
CC2
and V
CC1
respectively) is recommended. Use of 0.1 µF capacitors between
IC power supply and ground is recommended. Power supply
decoupling should take place as close to the IC as possible.
Refer to the schematic, Figure 5, for advised connections.
Transmission Lines
Use of 50 Ω transmission lines are recommended for PECL
inputs.
Terminations
Termination resistors should be used for PECL input signals.
Metal, thick film, 1% tolerance resistors are recommended.
Termination resistors for the PECL input signals should be
placed as close as possible to the PECL input pins.
Connections from the power supply to load resistors for input
and output signals should be individual, not daisy chained. This
will avoid crosstalk on these signals.
Loop Damping Capacitor, C
D
A ceramic capacitor may be used for the loop damping capacitor. A 22 nF capacitor provides a damping factor of 10.
AD809
Synthesizer Input
TTL/CMOSIN
Synthesizer Input
CLKIN/CLKINN
PECL INPUT
PLL Differential
Output Stage–
CLKOUT/CLKOUTN
C2 0.1µF
J1
ECL INN
J2
ECL IN
CLKOUTN
CLKOUT
C3 0.1µF
C4 0.1µF
J3
C5 0.1µF
J4
R3
R4
100Ω
100Ω
C6
0.1µF
VECTOR PINS SPACED FOR THROUGH-HOLE
CAPACITOR ON VECTOR CUPS.
COMPONENT SHOWN FOR REFERENCE ONLY.
C1
0.1µF
R6
3.65kΩ
JUMPER
R7 100Ω
R8 100Ω
R11
154Ω
W2
R5
301Ω
49.9Ω
R1
R12
154Ω
R2
49.9Ω
TP1
CD
TP2
C11
10µF
+5V GND
50Ω STRIP LINE
EQUAL LENGTH
16-PIN SOIC
SOLDERED TO BOARD
1
PECLINN
2
PECLIN
3
V
CC2
C7
4
CLKOUTN
CLKOUT
5
V
6
CC1
C8
7
CF1
8
CF2
GUARD RING
TP4TP3
AD809
TTL/CMOSIN
V
MUX
AV
CC2
CLKIN
CLKINN
AV
CC1
AV
16
EE
15
14
13
12
11
10
9
EE
Figure 5. Evaluation Board Schematic
Figure 4. Simplified Schematics
J5
+5V
MUX
R16
301Ω
JUMPER
W3
R14
49.9Ω
R15
49.9Ω
R13
49.9Ω
C12
0.1µF
R17
3.65kΩ
C13 0.1µF
C14 0.1µF
C15 0.1µF
JUMPER
NOTE:C7–C10 ARE 0.1µF BYPASS CAPACITORS
EXT
W1
GND
C9
C10
RIGHT ANGLE SMA CONNECTOR
OUTER SHELL TO GND PLANE
ALL RESISTORS ARE 1% 1/8 WATT SURFACE MOUNT
TPx
TEST POINTS ARE VECTOR PINS
J6
CLKIN
J7
CLKINN
J8
CMOS/TTL IN
REV. A
–5–
Page 6
AD809
Figure 6. Evaluation Board: Component Side
Figure 7. Evaluation Board: Solder Side
–6–
REV. A
Page 7
AD809
Figure 8. Evaluation Board: INT2
REV. A
–7–
Page 8
AD809
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
16-Lead Small Outline IC Package
(R-16A)
169
PIN 1
1
0.0098 (0.25)
0.0040 (0.10)
0.0500
(1.27)
0.3937 (10.00)
0.3859 (9.80)
BSC
0.0192 (0.49)
0.0138 (0.35)
0.1574 (4.00)
0.1497 (3.80)
8
0.0688 (1.75)
0.0532 (1.35)
0.2440 (6.20)
0.2284 (5.80)
0.0099 (0.25)
0.0075 (0.19)
8°
0°
0.0196 (0.50)
0.0099 (0.25)
0.0500 (1.27)
0.0160 (0.41)
C2045a–2–1/97
x 45°
–8–
PRINTED IN U.S.A.
REV. A
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