Datasheet AD8072, AD8073 Datasheet (Analog Devices)

Page 1
Low Cost, Dual/Triple
a
FEATURES Very Low Cost Good Video Specifications (RL = 150 ⍀) Gain Flatness of 0.1 dB to 10 MHz
0.05% Differential Gain Error
0.1 Differential Phase Error
Low Power
3.5 mA/Amplifier Supply Current Operates on Single +5 V to +12 V Supply
High Speed
100 MHz, –3 dB Bandwidth (G = +2) 500 V/s Slew Rate Fast Settling Time of 25 ns (0.1%)
Easy to Use
30 mA Output Current Output Swing to 1.3 V of Rails on Single +5 V Supply
APPLICATIONS Video Line Driver Computer Video Plug-In Boards RGB or S-Video Amplifier in Component Systems
PRODUCT DESCRIPTION
The AD8072 (dual) and AD8073 (triple) are low cost, current feedback amplifiers intended for high volume, cost sensitive applications. In addition to being low cost, these amplifiers deliver solid video performance into a 150 load while consuming only 3.5 mA per amplifier of supply current. Furthermore, the AD8073 is three amplifiers in a single 14-lead narrow-body SOIC package. This makes it ideal for applications where small size is essential. Each amplifier’s inputs and output are acces­sible providing added gain setting flexibility.
These devices provide 30 mA of output current per amplifier, and are optimized for driving one back terminated video load (150 ) each. These current feedback amplifiers feature gain flatness of 0.1 dB to 10 MHz while offering differential gain and phase error of 0.05% and 0.1°. This makes the AD8072 and AD8073 ideal for business and consumer video electronics.
Both will operate from a single +5 V to +12 V power supply. The outputs of each amplifier swing to within 1.3 volts of either supply rail to accommodate video signals on a single +5 V supply.
The high bandwidth of 100 MHz, 500 V/µs of slew rate, along with settling to 0.1% in 25 ns, make the AD8072 and AD8073 useful in many general purpose, high speed applications where a single +5 V or dual power supplies up to ±6 V are needed. The AD8072 is available in 8-lead plastic DIP, SOIC, and µSOIC packages while the AD8073 is available in 14-lead plastic DIP and SOIC packages. Both operate over the commercial temperature range of 0°C to +70°C. Additionally, the AD8072ARM oper­ates over the industrial temperature range of –40°C to +85°C.
Video Amplifiers
AD8072/AD8073
FUNCTIONAL BLOCK DIAGRAMS
8-Lead Plastic (N), SOIC (R), and SOIC (RM) Packages
OUT1
1
–IN1
2
IN1
3
–V
4
S
AD8072
14-Lead Plastic (N), and SOIC (R) Packages
NC
1
NC
2
NC
3
V
S
IN1
–IN1
OUT1
6.1
6.0
5.9
5.8
5.7 VS = ⴞ5V
= 2V p-p
V
O
5.6
RF = RG = 1k RL = 150
GAIN FLATNESS – dB
5.5
5.4
5.3
= ⴙ2
A
V
0.1 5001 10 100
AD8073
4
AD8072
5
6
7
NC = NO CONNECT
0.1 dB
DIV
FREQUENCY – MHz
Figure 1. Large Signal Frequency Response
V
8
S
OUT2
7
–IN2
6
IN2
5
OUT2
14
–IN2
13
IN2
12
–V
11
S
IN3
10
–IN3
9
OUT3
8
7
6
5
4
3
1 dB
DIV
2
1
CLOSED-LOOP GAIN – dB
0
–1
REV. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 2000
Page 2
AD8072/AD8073–SPECIFICATIONS
ELECTRICAL CHARACTERISTICS
(@ TA = +25C, VS = 5 V, RL = 150 , unless otherwise noted)
AD8072/AD8073
Parameter Conditions Min Typ Max Units
DYNAMIC PERFORMANCE R
= 1 k
F
–3 dB Bandwidth, Small Signal No Peaking, G = +2 80 100 MHz
0.1 dB Bandwidth, Small Signal No Peaking, G = +2 8 10 MHz Slew Rate V
= 4 V Step 500 V/µs
O
Settling Time to 0.1% VO = 2 V Step 25 ns
DISTORTION/NOISE PERFORMANCE R
= 1 k
F
Differential Gain f = 3.58 MHz, G = +2 0.05 0.15 % Differential Phase f = 3.58 MHz, G = +2 0.1 0.3 Degrees Crosstalk f = 5 MHz 60 dB Input Voltage Noise f = 10 kHz 3 nV/Hz Input Current Noise f = 10 kHz (±IIN) 6 pA/Hz
DC PERFORMANCE
Transimpedance 0.3 M Input Offset Voltage 2 6 mV
T
MIN
to T
MAX
8mV
Offset Drift 11 µV/°C Input Bias Current (±)412µA Input Bias Current Drift (±)12nA/°C
INPUT CHARACTERISTICS
–Input Resistance 120 +Input Resistance 1 M Input Capacitance 1.6 pF Common-Mode Rejection Ratio V
= –3.8 V to +3.8 V 56 dB
CM
Input Common-Mode Voltage Range ±3.8 V
OUTPUT CHARACTERISTICS
+Output Voltage Swing 3 3.3 V –Output Voltage Swing 2.25 3 V Output Current R
= 10 30 mA
L
Short Circuit Current 80 mA
POWER SUPPLY
Operating Range ±2.5 to ± 6V Power Supply Rejection Ratio V
= ±4 V to ±6 V 70 dB
S
Quiescent Current per Amplifier 3.5 5 mA
OPERATING TEMPERATURE RANGE 0 +70 °C
Specifications subject to change without notice.
–2–
REV. A
Page 3
AD8072/AD8073
ELECTRICAL CHARACTERISTICS
(@ TA = +25C, VS = +5 V, RL = 150 to 2.5 V, unless otherwise noted)
AD8072/AD8073
Parameter Conditions Min Typ Max Units
DYNAMIC PERFORMANCE R
= 1 k
F
–3 dB Bandwidth, Small Signal No Peaking, G = +2 78 100 MHz
0.1 dB Bandwidth, Small Signal No Peaking, G = +2 7.8 10 MHz Slew Rate V
= 2 V Step 350 V/µs
O
Settling Time to 0.1% VO = 2 V Step 25 ns
DISTORTION/NOISE PERFORMANCE R
Differential Gain f = 3.58 MHz, G = +2, R Differential Phase f = 3.58 MHz, G = +2, R
= 1 k
F
to 1.5 V 0.1 %
L
to 1.5 V 0.1 Degrees
L
Crosstalk f = 5 MHz 60 dB Input Voltage Noise f = 10 kHz 3 nV/Hz Input Current Noise f = 10 kHz (±IIN) 6 pA/Hz
DC PERFORMANCE
Transimpedance 0.25 M Input Offset Voltage 1.5 4 mV
T
MIN
to T
MAX
6mV
Offset Drift 9 µV/°C Input Bias Current (±) 310µA Input Bias Current Drift (±)10nA/°C
INPUT CHARACTERISTICS
–Input Resistance 120 +Input Resistance 1M Input Capacitance 1.6 pF Common-Mode Rejection Ratio V
= +1.2 V to +3.8 V 54 dB
CM
Input Common-Mode Voltage Range +1.2 to +3.8 V
OUTPUT CHARACTERISTICS
Output Voltage Swing +1.5 to +3.5 +1.3 to +3.7 V Output Current R
= 10 20 mA
L
Short Circuit Current 60 mA
POWER SUPPLY
Operating Range ±2.5 to ± 6V Power Supply Rejection Ratio V
= +4 V to +6 V 64 dB
S
Quiescent Current per Amplifier 3 4.5 mA
OPERATING TEMPERATURE RANGE 0 +70 °C
REV. A
–3–
Page 4
AD8072/AD8073
ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13.2 V
Internal Power Dissipation
2
1
AD8072 8-Lead Plastic (N) . . . . . . . . . . . . . . . . . 1.3 Watts
AD8072 8-Lead Small Outline (SO-8) . . . . . . . . . 0.9 Watts
AD8072 8-Lead µSOIC (RM) . . . . . . . . . . . . . . . 0.6 Watts
AD8073 14-Lead Plastic (N) . . . . . . . . . . . . . . . . 1.6 Watts
AD8073 14-Lead Small Outline (R) . . . . . . . . . . . 1.0 Watts
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . .±V
S
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . ± 1.25 V
Output Short Circuit Duration . . . . . . . . . . . . . . . . . . . . . . . .
Observe Power Derating Curves Storage Temperature Range
N, R, RM Packages . . . . . . . . . . . . . . . . . –65°C to +125°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
2
Specification is for device in free air:
8-Lead Plastic Package: θJA = 90°C/W 8-Lead SOIC Package: θJA = 140°C/W 8-Lead µSOIC Package: θJA = 214°C/W 14-Lead Plastic Package: θJA = 75°C/W 14-Lead SOIC Package: θJA = 120°C/W
ORDERING GUIDE
Model Range Description Option
AD8072ARM –40°C to +85°C 8-Lead µSOIC RM-8 AD8072ARM-REEL –40°C to +85°C 13" Reel 8-Lead µSOIC RM-8 AD8072ARM-REEL7 –40°C to +85°C 7" Reel 8-Lead µSOIC RM-8 AD8072JN 0°C to +70°C 8-Lead Plastic DIP N-8 AD8072JR 0°C to +70°C 8-Lead SOIC SO-8 AD8072JR-REEL 0°C to +70°C 13" Reel 8-Lead SOIC SO-8 AD8072JR-REEL7 0°C to +70°C 7" Reel 8-Lead SOIC SO-8 AD8073JN 0°C to +70°C 14-Lead Plastic DIP N-14 AD8073JR 0°C to +70°C 14-Lead Narrow SOIC R-14 AD8073JR-REEL 0°C to +70°C 13" Reel 14-Lead SOIC R-14 AD8073JR-REEL7 0°C to +70°C 7" Reel 14-Lead SOIC R-14
Temperature Package Package
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8072 and AD8073 is limited by the associated rise in junc­tion temperature. The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the plastic, approximately +150°C. Exceeding this limit temporarily may cause a shift in parametric perfor­mance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of +175°C for an extended period can result in device failure.
While the AD8072 and AD8073 are internally short circuit pro­tected, this may not be sufficient to guarantee that the maximum junction temperature (+150°C) is not exceeded under all condi­tions. To ensure proper operation, it is necessary to observe the maximum power derating curves shown in Figures 2 and 3.
2.0
8-LEAD MINI-DIP PACKAGE
1.5
8-LEAD SOIC PACKAGE
1.0
0.5
MAXIMUM POWER DISSIPATION – Watts
0 –50 90–40 –30 –20 –10 0 1020 30 5060 708040
SOIC
AMBIENT TEMPERATURE – C
TJ = ⴙ150C
Figure 2. AD8072 Maximum Power Dissipation vs. Temperature
2.5
TJ = ⴙ150C
2.0
14-LEAD DIP PACKAGE
1.5
14-LEAD SOIC
1.0
MAXIMUM POWER DISSIPATION – Watts
0.5
50 9040
30 20 100 1020 304050 60 80
AMBIENT TEMPERATURE C
Figure 3. AD8073 Maximum Power Dissipation vs. Temperature
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD8072 and AD8073 feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
–4–
70
WARNING!
ESD SENSITIVE DEVICE
REV. A
Page 5
AD8072/AD8073
0.00 0.03 0.07 0.08 0.08 0.08 0.09 0.08 0.08 0.07 0.06
DIFFERENTIAL GAIN – %
MIN = 0.00 MAX = 0.09 p-p/MAX = 0.09
0.12
0.10
0.08
0.06
0.04
0.02
0.00
–0.02
V
S
= 5V, RF = 1k, RL = 150 TO 1.5V, AV = ⴙ2
0.00 0.05 0.09 0.10 0.09 0.08 0.06 0.06 0.05 0.04 0.02
1
ST2ND3RD4TH5TH
6
TH
7TH8TH9TH10TH11
TH
MODULATING RAMP LEVEL – IRE
DIFFERENTIAL PHASE – deg
MIN = 0.00 MAX = 0.10 p-p = 0.10
0.12
0.10
0.08
0.06
0.04
0.02
0.00
–0.02
V
S
= 5V, RF = 1k, RL = 150 TO 1.5V, AV = ⴙ2
7
6
5
4
3
VS = ⴙ5V
2
RF = 1k
= 150 TO 2.5V
R
1
CLOSED-LOOP GAIN – dB
0
0.1
0.1 10001.0 10 100
L
AV = ⴙ2 VIN = 100mV p-p
FREQUENCY – MHz
0ⴗC
70ⴗC
25ⴗC
Figure 4. Frequency Response Over Temperature; VS = +5 V
7
6
5
4
6.1
6.0
5.9
5.8
VS = ⴞ5V
= 1k
R
F
= 150
R
L
= ⴙ2
A
V
V
= 100mV p-p
IN
0.1 5001.0 10 100
GAIN FLATNESS – dB
5.7
5.6
5.5
5.4
5.3
70ⴗC
FREQUENCY – MHz
0ⴗC, 25ⴗC
Figure 7. 0.1 dB Flatness vs. Frequency Over Tempera­ture; V
= ±5 V
S
3
VS = ⴞ5V
2
RF = 1k
= 150
R
1
CLOSED-LOOP GAIN – dB
0
0.1
0.1 10001.0 10 100
L
AV = ⴙ2 VIN = 100mV p-p
FREQUENCY – MHz
Figure 5. Frequency Response Over Temperature; VS = ±5 V
6.1
6.0
5.9
5.8
5.7
VS = ⴙ5V
= 1k
R
F
= 150 TO 2.5V
R
5.6
L
AV = ⴙ2
GAIN FLATNESS – dB
VIN = 100mV p-p
5.5
Figure 6. 0.1 dB Flatness vs. Frequency Over Tempera­ture; V
REV. A
5.4
5.3
0.1 5001.0 10 100
= +5 V
S
FREQUENCY – MHz
70C
70ⴗC
0C, 25C
25ⴗC
0ⴗC
–5–
Figure 8. Differential Gain and Phase, VS = +5 V
0.00 0.00 0.00 –0.00 0.00 –0.01 –0.01 –0.02 –0.03 –0.03 –0.03
0.00 VS = ⴞ5V,
0.01
0.02
0.03
DIFFERENTIAL GAIN %
0.020.040.060.080.100.12
DIFFERENTIAL PHASE – deg
= 1k
R
F
= 150
R
L
= ⴙ2
A
V
0.00 0.00 –0.00 –0.02 –0.03 –0.05 –0.07 –0.08 –0.10 –0.10 –0.10
0.02
0.00
V
= ⴞ5V,
S
= 1k
R
F
= 150
R
L
= ⴙ2
A
V
1
ST2ND3RD4TH5TH
MIN = –0.03 MAX = 0.00 p-p/MAX = 0.03
MIN = –0.10 MAX = 0.00 p-p = 0.10
6
TH
MODULATING RAMP LEVEL – IRE
7TH8TH9TH10TH11
Figure 9. Differential Gain and Phase, VS = ±5 V
TH
Page 6
AD8072/AD8073
0
–10
SOIC PACKAGE DRIVE AMP 2
–20
RECEIVE AMPS 1, 3 AD8073 RECEIVE AMP 1 AD8072
–30
= ⴙ5V, ⴞ5V
V
S
= 1k, RL = 150
R
F
–40
= ⴙ2
A
V
= 1V p-p
V
IN
50
60
CROSSTALK dB
70
80
90
0.1
0.1 5001.0 10 100 FREQUENCY – MHz
AMP 2 OUTPUT
Figure 10. Crosstalk vs. Frequency
–40
VS = ⴞ5V
= 1k
R
F
–50
= 150
R
L
= ⴙ2
A
V
= 2V p-p
V
OUT
60
70
80
DISTORTION dBc
90
100
0.1 1 FREQUENCY – MHz
3RD
HARMONIC
HARMONIC
2ND
10
Figure 11. Distortion vs. Frequency; VS = ±5 V
1G
0
20
40
60
80
100
120
140
160
180
100k
Z
T
1M
10k
100
OHMS (⍀)
DEGREES
1k
10
10k
1k
FREQUENCY – Hz
100M
10M1M100k
Figure 13. Open-Loop Transimpedance vs. Frequency
3
2
1
0
1
2
VS = ⴞ5V
RF = 1k
–3
= 150
R
L
= 200mV p-p
V
OUT
4
5
NORMALIZED CLOSED-LOOP GAIN dB
6
0.1 1k1 10 100 FREQUENCY – MHz
AV = ⴙ10
AV = ⴙ5
AV = ⴙ1
AV = ⴙ2
Figure 14. Normalized Frequency Response; VS = ±5 V
DEGREES
–40
VS = ⴙ5V
= 1k
R
F
DISTORTION – dBc
100
50
60
70
80
90
= 150 TO 2.5V
R
L
A
= ⴙ2
V
= 2V p-p
V
OUT
0.1 1 10 FREQUENCY – MHz
3RD
HARMONIC
2ND
HARMONIC
Figure 12. Distortion vs. Frequency; VS = +5 V
–6–
6.1
6.0
5.9
5.8
5.7 VS = ⴙ5V
= 2V p-p
V
O
GAIN FLATNESS – dB
5.6
5.5
5.4
5.3
= RG = 1k
R
F
= 150 TO 2.5V
R
L
= ⴙ2
A
V
0.1 5001 10 100
0.1 dB
DIV
FREQUENCY – MHz
1 dB
DIV
Figure 15. Large Signal Frequency Response
7
6
5
4
3
2
1
CLOSED-LOOP GAIN – dB
0
–1
REV. A
Page 7
100
VS = ⴞ5V
= 1k
R
F
= ⴙ2
A
V
AD8072/AD8073
100
80
10
1
OUTPUT RESISTANCE –
0.1
0.1 500110100 FREQUENCY – MHz
Figure 16. Output Resistance vs. Frequency; VS = ±5 V
50
40
30
20
10
INPUT VOLTAGE NOISE – nV/ Hz
0
1 100k10
100 1k 10k
FREQUENCY – Hz
Figure 17. Noise vs. Frequency; VS = ±5 V
60
40
20
INPUT CURRENT NOISE – pA/ Hz
0
1 100k10
100 1k 10k
FREQUENCY – Hz
Figure 18. Noise vs. Frequency; VS = ±5 V
10
VS = ⴞ5V
0
= 1k
R
F
= 150
R
L
= ⴙ2
A
V
100mV p-p ON TOP OF V
S
0.1 500110100
0.02
–PSRR
PSRR
FREQUENCY – MHz
PSRR – dB
10
20
30
40
50
60
70
Figure 19. PSRR vs. Frequency
REV. A
CMRR dB
10
15
20
25
30
35
40
45
50
55
5
2V p-p
0.02
1k 1k
V
IN
150
V
OUT
154
60.4
154
0.1 500110100 FREQUENCY – MHz
Figure 20. CMRR vs. Frequency; VS = ±5 V
–7–
Page 8
AD8072/AD8073
1k 1k
V
IN
50
Figure 21. Test Circuit; Gain = +2
250mV
20ns
Figure 22. 2 V Step Response; G = +2, VS = ±5 V
V
0.1␮F
0.1␮F
R
L
150
0.001␮F
0.001␮F
+
+
10␮F
10␮F
V
–V
250mV
OUT
S
S
10ns
Figure 25. 2 V Step Response; G = +2, VS = ±2.5 V
50mV
Figure 23. 200 mV Step Response; G = +2, VS = ±5 V
1V
Figure 24. Sine Response; G = +2, VS = ±5 V
20ns
Figure 26. 200 mV Step Response; G = +2, VS = ±2.5 V
20ns
Figure 27. Sine Response; G = +2, VS = ±2.5 V
Note: VS = ±2.5 V operation is identical to VS = +5 V single supply operation.
–8–
50mV
250mV
20ns
20ns
REV. A
Page 9
AD8072/AD8073
APPLICATIONS Overdrive Recovery
Overdrive of an amplifier occurs when the output and/or input range are exceeded. The amplifier must recover from this overdrive condition and resume normal operation. As shown in Figure 28, the AD8072 and AD8073 recover within 75 ns from positive overdrive and 30 ns from negative overdrive.
V
IN
V
OUT
1V
25ns
Figure 28. Overload Recovery; VS = ±5 V, VIN = 8 V p-p, R
= 1 kΩ, RL = 150 Ω, G = +2
F
Bandwidth vs. Feedback Resistor Value
The closed-loop frequency response of a current feedback am­plifier is a function of the feedback resistor. A smaller feedback resistor will produce a wider bandwidth response. However, if the feedback resistance becomes too small, the gain flatness can be affected. As a practical consideration, the minimum value of feedback resistance for the AD8072/AD8073 was found to be 649 . For resistances below this value, the gain flatness will be affected and more significant lot to lot variations in device per­formance will be noticed. Figure 29 shows a plot of the frequency response of an AD8072/AD8073 at a gain of two with both feed­back and gain resistors equal to 649 Ω.
On the other hand, the bandwidth of a current feedback ampli­fier can be decreased by increasing the feedback resistance. This can sometimes be useful where it is desired to reduce the noise bandwidth of a system. As a practical matter, the maximum value of feedback resistor was found to be 2 k. Figure 29 shows the frequency response of an AD8072/AD8073 at a gain of two with both feedback and gain resistors equal to 2 kΩ.
Capacitive Load Drive
When an op amp output drives a capacitive load, extra phase shift due to the pole formed by the op amp’s output impedance and the capacitor can cause peaking or even oscillation. The top trace of Figure 30, R
= 0 , shows the output of one of the am-
S
plifiers of the AD8072/AD8073 when driving a 50 pF capacitor as shown in the schematic of Figure 31.
The amount of peaking can be significantly reduced by adding a resistor in series with the capacitor. The lower trace of Fig­ure 30 shows the same capacitor being driven with a 25 resis­tor in series with it. In general, the resistor value will have to be experimentally determined, but from 10 to 50 is a practical range of values to experiment with for capacitive loads of up to a few hundred pF.
RS = 0
RS = 25
50mV
20ns
Figure 30. Capacitive Low Drive
1k 1k
R
S
V
= 100mV p-p R
IN
50
C
L
50pF
L
1k
Figure 31. Capacitive Load Drive Circuit
GAIN FLATNESS – dB
REV. A
6.1
6.0
5.9
5.8
5.7 VS = ⴞ5V
= ⴙ2
A
V
5.6
= 150
R
L
= 0.2V p-p
V
O
5.5
5.4
0.1 5001 10 100
0.1 dB
DIV
RF = 2k
FREQUENCY – MHz
Figure 29. Frequency Response vs. R
RF = 649
1 dB DIV
F
7
6
5
4
3
2
CLOSED-LOOP GAIN – dB
1
0
–9–
Page 10
AD8072/AD8073
Crosstalk
Crosstalk between internal amplifiers may vary depending on which amplifier is being driven and how many amplifiers are being driven. This variation typically stems from pin location on the package and the internal layout of the IC itself. Table I illustrates the typical crosstalk results for a combination of conditions.
Table I. AD8073JR Crosstalk Table (dB)
Receive Amplifier
AD8073JR
123
1 X –60 –56
Drive
Amplifier
2 –60 X –60
3 –54 –60 X
All Hostile –53 –55 –54
CONDITIONS
VS = ±5 V
= 1 k, RL = 150
R
F
A
= +2
V
V
= 2 V p-p on Drive Amplifier
OUT
Layout Considerations
The specified high speed performance of the AD8072 and AD8073 require careful attention to board layout and compo­nent selection. Proper RF
design techniques and low parasitic
component selection are mandatory.
The PCB should have a ground plane covering all unused portions of the component side of the board to provide a low impedance ground path. The ground plane should be removed from the area near the input pins to reduce stray capacitance.
Chip capacitors should be used for supply bypassing. One end of the capacitor should be connected to the ground plane and the other within 1/8 inches of each power pin. An additional large (4.7 µF–10 µF) tantalum electrolytic capacitor should be connected in parallel, but not necessarily as close to the supply pins, to provide current for fast large-signal changes at the device’s output.
The feedback resistor should be located close to the inverting input pin in order to keep the stray capacitance at this node to a minimum. Capacitance variations of less than 1 pF at the invert­ing input will affect high speed performance.
Stripline design techniques should be used for long signal traces (greater than about 1 inch). These should be designed with a characteristic impedance of 50 or 75 and be properly termi­nated at each end.
–10–
REV. A
Page 11
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
AD8072/AD8073
0.210 (5.33) MAX
0.160 (4.06)
0.115 (2.93)
0.022 (0.558)
0.014 (0.356)
0.1574 (4.00)
0.1497 (3.80)
8-Lead Plastic DIP
(N-8)
0.430 (10.92)
0.348 (8.84)
8
14
PIN 1
0.100 (2.54)
BSC
5
0.280 (7.11)
0.240 (6.10)
0.060 (1.52)
0.015 (0.38)
0.070 (1.77)
0.045 (1.15)
8-Lead Plastic SOIC
(SO-8)
0.1968 (5.00)
0.1890 (4.80)
8
5
0.2440 (6.20)
41
0.2284 (5.80)
0.130 (3.30) MIN
SEATING PLANE
0.325 (8.25)
0.300 (7.62)
0.015 (0.381)
0.008 (0.204)
0.195 (4.95)
0.115 (2.93)
0.210 (5.33) MAX
0.160 (4.06)
0.115 (2.93)
0.1574 (4.00)
0.1497 (3.80)
14-Lead Plastic DIP
(N-14)
0.795 (20.19)
0.725 (18.42)
14
17
PIN 1
0.022 (0.558)
0.014 (0.356)
0.100 (2.54)
BSC
8
0.070 (1.77)
0.045 (1.15)
14-Lead SOIC
(R-14)
0.3444 (8.75)
0.3367 (8.55)
14 8
71
0.280 (7.11)
0.240 (6.10)
0.060 (1.52)
0.015 (0.38)
0.130 (3.30) MIN
SEATING PLANE
0.2440 (6.20)
0.2284 (5.80)
0.325 (8.25)
0.300 (7.62)
0.015 (0.381)
0.008 (0.204)
0.195 (4.95)
0.115 (2.93)
C2126–0–3/00 (rev. A)
0.0098 (0.25)
0.0040 (0.10)
SEATING
PLANE
0.122 (3.10)
0.114 (2.90)
0.006 (0.15)
0.002 (0.05)
SEATING
PLANE
PIN 1
0.0500 (1.27)
BSC
0.122 (3.10)
0.114 (2.90)
85
PIN 1
0.0256 (0.65) BSC
0.120 (3.05)
0.112 (2.84)
0.018 (0.46)
0.008 (0.20)
0.0688 (1.75)
0.0532 (1.35)
0.0192 (0.49)
0.0138 (0.35)
0.0098 (0.25)
0.0075 (0.19)
8-Lead SOIC
(RM-8)
0.199 (5.05)
0.187 (4.75)
41
0.043 (1.09)
0.037 (0.94)
0.011 (0.28)
0.003 (0.08)
0.0196 (0.50)
0.0099 (0.25)
8° 0°
0.0500 (1.27)
0.0160 (0.41)
0.120 (3.05)
0.112 (2.84)
33 27
x 45°
0.028 (0.71)
0.016 (0.41)
0.0098 (0.25)
0.0040 (0.10)
SEATING
PLANE
PIN 1
0.0500 (1.27)
BSC
0.0688 (1.75)
0.0532 (1.35)
0.0192 (0.49)
0.0138 (0.35)
0.0099 (0.25)
0.0075 (0.19)
0.0196 (0.50)
0.0099 (0.25)
8° 0°
0.0500 (1.27)
0.0160 (0.41)
x 45°
PRINTED IN U.S.A.
REV. A
–11–
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