600 fA/√Hz @ 100 kHz
Low Input Bias Current: 750 nA Max
Low Distortion
–90 dB SFDR @ 1 MHz
–65 dB SFDR @ 5 MHz
Wide Supply Range: 3 V to 12 V
Small Packaging: SOT23-8, SC70-5, and SOIC-8
APPLICATIONS
Battery-Powered Instrumentation
Filters
A/D Driver
Level Shifting
Buffering
High Density PC Boards
Photo Multiplier
Voltage Feedback Amplifiers
AD8038/AD8039
CONNECTION DIAGRAMS
SOIC-8 (R)
SOIC-8 (R) and SOT23-8 (RT)*
V
OUT1
–IN1
+IN1
–V
AD8039
1
2
3
4
S
SC70-5 (KS)
AD8038
V
1
OUT
–V
2
S
3
8
+V
S
7
V
OUT2
6
–IN2
5
+IN2
+–
5
+V
S
4
–IN+IN
PRODUCT DESCRIPTION
The AD8038 (single) and AD8039 (dual) amplifiers are high
speed (350 MHz) voltage feedback amplifiers with an exceptionally
low quiescent current of 1.0 mA/amplifier typical (1.5 mA max).
The AD8038 single amplifier in the SOIC-8 package has a
The AD8039 amplifier is the only dual low power, high
amplifier available in a tiny SOT23-8 package, and the single
AD8038 is available in both a SOIC-8 and a SC70-5 package.
These amps are rated to work over the industrial temperature
range of –40°C to +85°C.
disable feature. Despite being low power and low cost, the
amplifier provides excellent overall performance. Additionally,
it offers a high slew rate of 425 V/µs and low input offset volt-
age of 3 mV max.
ADI’s proprietary XFCB process allows low noise operation
√
Hz and 600 fA/√Hz) at extremely low quiescent currents.
(8 nV/
Given a wide supply voltage range (3 V to 12 V), wide bandwidth,
and small packaging, the AD8038 and AD8039 amplifiers are
designed to work in a variety of applications where power and space
are at a premium.
The AD8038 and AD8039 amplifiers have a wide input commonmode range of 1 V from either rail and will swing within 1 V of
each rail on the output. These amplifiers are optimized for
driving capacitive loads up to 15 pF. If driving larger capacitive loads, a small series resistor is needed to avoid excessive
peaking or overshoot.
*Not yet released
REV. B
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices.
Operating Temperature Range . . . . . . . . . . . –40°C to +85°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the AD8038/AD8039
package is limited by the associated rise in junction temperature (TJ)
on the die. The plastic encapsulating the die will locally reach the
junction temperature. At approximately 150°C, which is the glass
transition temperature, the plastic will change its properties. Even
temporarily exceeding this temperature limit may change the stresses
that the package exerts on the die, permanently shifting the parametric
performance of the AD8038/AD8039. Exceeding a junction tempera-
of 175°C for an extended period of time can result in changes
ture
in the silicon devices, potentially causing failure.
RMS output voltages should be considered. If RL is referenced to
V
V
If the RMS signal levels are indeterminate, then
worst case, when V
The still-air thermal properties of the package and PCB (JA), ambient
temperature (TA), and total power dissipated in the package (PD)
determine the junction temperature of the die. The junction
temperature can be calculated as follows:
TT P
=+ ×
ADAJ
θ
()
J
The power dissipated in the package (PD) is the sum of the quiescent
power dissipation and the power dissipated in the package due to the
load drive for all outputs. The quiescent power is the voltage between
the supply pins (VS) multiplied by the quiescent current (IS). Assuming
the load (RL) is referenced to midsupply, then the total drive power is
VS / 2 × I
in the load (V
some of which is dissipated in the package and some
OUT,
OUT
× I
). The difference between the total drive
OUT
In single-supply operation with RL referenced to VS–, worst case is
V
Airflow will increase heat dissipation effectively reducing
more metal directly in contact with the package leads from metal traces,
through holes, ground, and power planes, will reduce the JA. Care
must be taken to minimize parasitic capacitances at the input leads
of high speed op amps as discussed in the board layout section.
Figure 2 shows the maximum safe power dissipation in the package
versus the ambient temperature for the SOIC-8 (125°C/W), SC70-5
(210°C/W), and SOT23-8 (160°C/W) package on a JEDEC standard
four-layer board.
power and the load power is the drive power dissipated in the package.
PD = quiescent power + (total drive power – load power)
PVI VV R V R
=×
[]
DSS SOUTLOUTL
+
()
[]
×
//–/2
()
2
[]
ORDERING GUIDE
OUTPUT SHORT CIRCUIT
Shorting the output to ground or drawing excessive current from
the AD8038/AD8039 will likely cause a catastrophic failure.
2.0
1.5
SOIC-8
1.0
0.5
MAXIMUM POWER DISSIPATION – W
0
–55
SOT23-8
SC70-5
–255356595125
AMBIENT TEMPERATURE – ⴗC
Figure 2. Maximum Power Dissipation vs.
Temperature for a Four-Layer Board
, as in single-supply operation, then the total drive power is
S–
I
OUT
.
S
consider the
= VS / 4 for RL to midsupply:
OUT
2
//4
()
. Also,
JA
OUT
= VS / 2.
PVI VR
=×
()
DSS SL
values are approximations.
JA
+
ModelTemperature RangePackage DescriptionPackage OutlineBranding Information
AD8038AR–40°C to +85°C8-Lead SOICSO-8
AD8038AR-REEL–40°C to +85°C8-Lead SOICSO-8
AD8038AR-REEL7–40°C to +85°C8-Lead SOICSO-8
AD8038AKS-REEL–40°C to +85°C5-Lead SC70KS-5HUA
AD8038AKS-REEL7–40°C to +85°C5-Lead SC70KS-5HUA
AD8039AR–40°C to +85°C8-Lead SOICSO-8
AD8039AR-REEL–40°C to +85°C8-Lead SOICSO-8
AD8039AR-REEL7–40°C to +85°C8-Lead SOICSO-8
AD8039ART-REEL*–40°C to +85°C8-Lead SOT23RT-8HYA
AD8039ART-REEL7*–40°C to +85°C8-Lead SOT23RT-8HYA
*Under development.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8038/AD8039 features proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. B–4–
Page 5
Typical Performance Characteristics–AD8038/AD8039
(Default Conditions: ⴞ5 V, CL = 5 pF, G = +2, RG = RF = 1 kΩ, RL = 2 kΩ, VO = 2 V p-p, Frequency = 1 MHz, TA = 25ⴗC.)
24
G = +10
21
18
G = +5
15
12
9
G = +2
6
GAIN – dB
3
G = +1
0
–3
–6
0.11000
110100
FREQUENCY – MHz
TPC 1. Small Signal Frequency
Response for Various Gains,
V
= 500 mV p-p
OUT
7
6
5
4
3
GAIN – dB
2
1
0
0.11000110100
RL = 500⍀
RL = 1k⍀
FREQUENCY – MHz
RL = 2k⍀
TPC 4. Small Signal Frequency
Response for Various R
VS = 5 V, V
= 500 mV p-p
OUT
LOAD
,
7
6
5
4
3
GAIN – dB
2
1
0
0.11000110100
VS = ⴞ5V
FREQUENCY – MHz
VS = ⴞ1.5V
VS = ⴞ2.5V
TPC 2. Small Signal Frequency
Response for Various Supplies,
V
= 500 mV p-p
OUT
8
7
6
5
4
GAIN – dB
3
2
1
0
0.1
110100
FREQUENCY – MHz
RL = 2k⍀
RL = 500⍀
RL = 1k⍀
TPC 5. Large Signal Frequency
Response for Various R
V
= 3 V p-p, VS = 5 V
OUT
LOAD
,
7
6
5
4
3
GAIN – dB
2
1
0
0.11000110100
RL = 500⍀
RL = 1k⍀
FREQUENCY – MHz
RL = 2k⍀
TPC 3. Small Signal Frequency
Response for Various R
VS = ±5 V, V
8
7
6
5
4
GAIN – dB
3
2
1
0
0.1
= 500 mV p-p
OUT
RL = 2k⍀
RL = 500⍀
RL = 1k⍀
110100
FREQUENCY – MHz
LOAD
,
TPC 6. Large Signal Frequency
Response for Various R
V
= 4 V p-p, VS = ±5 V
OUT
LOAD
,
5
4
3
2
1
0
–1
GAIN – dB
–2
–3
–4
–5
110100
CL = 15pF
CL = 10pF
CL = 5pF
FREQUENCY – MHz
TPC 7. Small Signal Frequency
Response for Various C
V
= 500 mV p-p, VS = ±5 V,
OUT
LOAD
G = +1
REV. B
2
1
0
–1
–2
GAIN – dB
–3
–4
–5
–6
0.11000110100
V
= 200mV
OUT
V
= 1V
OUT
V
= 500mV
OUT
V
= 2V
OUT
FREQUENCY – MHz
TPC 9. Frequency Response for
Various Output Voltage Levels
1000
7
5
3
1
GAIN – dB
–1
–3
–5
110100
CL = 15pF
CL = 10pF
CL = 5pF
1000
FREQUENCY – MHz
TPC 8. Small Signal Frequency
,
Response for Various C
V
= 500 mV p-p, VS = 5 V, G
OUT
=
+1
LOAD
,
–5–
Page 6
AD8038/AD8039
g
(Default Conditions: ⴞ5 V, CL = 5 pF, G = +2, RG = RF = 1 kΩ, RL = 2 kΩ, VO = 2 V p-p, Frequency = 1 MHz, TA = 25ⴗC.)
80
70
60
50
40
30
20
OPEN-LOOP GAIN – dB
0
–10
–20
0.01100.11101001000
PHASE
GAIN
FREQUENCY – MHz
180
135
90
45
0
–45
rees
PHASE – De
TPC 10. Open-Loop Gain and
Phase, VS = ±5 V
–45
–50
–55
–60
–65
–70
–75
–80
HARMONIC DISTORTION – dBc
–85
–90
18
RL = 500⍀ HD2
RL = 500⍀ HD3
RL = 2k⍀ HD3
RL = 2k⍀ HD2
234567
FREQUENCY – MHz
910
TPC 13. Harmonic Distortion vs.
Frequency for Various Loads,
V
S
= 5 V, V
= 2 V p-p, G = +2
OUT
9
6
3
GAIN – dB
0
–3
0.11000110100
FREQUENCY – MHz
–40ⴗC
+25ⴗC
+85ⴗC
TPC 11. Frequency Response
vs. Temperature, Gain = +2, V
= ±5 V, V
–50
G = +2 HD2
–60
–70
–80
–90
HARMONIC DISTORTION – dBc
–100
18
234567
= 2V p-p
OUT
G = +1 HD2
G = +1 HD3
FREQUENCY – MHz
G = +2 HD3
S
910
TPC 14. Harmonic Distortion vs.
Frequency for Various Gains,
= ±5 V, V
V
S
= 2 V p-p
OUT
–50
–55
–60
–65
–70
–75
–80
HARMONIC DISTORTION – dBc
–85
–90
RL = 500⍀ HD2
RL = 500⍀ HD3
RL = 2k⍀ HD2
18
234567
FREQUENCY – MHz
RL = 2k⍀ HD3
910
TPC 12. Harmonic Distortion vs.
Frequency for Various Loads,
V
= ±5 V, V
S
–50
G = +2 HD2
–60
–70
–80
–90
HARMONIC DISTORTION – dBc
–100
18
234567
= 2 V p-p, G = +2
OUT
G = +1 HD2
G = +1 HD3
FREQUENCY – MHz
G = +2 HD3
910
TPC 15. Harmonic Distortion vs.
Frequency for Various Gains,
V
S
= 5 V, V
= 2 V p-p
OUT
–40
10MHz HD2
–50
10MHz HD3
–60
–70
–80
–90
HARMONIC DISTORTION – dBc
–100
1
1MHz HD3
1MHz HD2
234
AMPLITUDE – V p-p
5MHz HD2
5MHz HD3
TPC 16. Harmonic Distortion vs.
V
Amplitude for Various
OUT
Frequencies,
VS = ±5 V, G = +2
–45
10MHz HD2
–55
10MHz HD3
–65
–75
–85
HARMONIC DISTORTION – dBc
–95
1.0
1.52.02.53.0
5MHz HD2
5MHz HD3
1MHz HD3
1MHz HD2
AMPLITUDE – V p-p
TPC 17. Harmonic Distortion vs.
Amplitude for Various Frequencies,
VS = 5 V, G = +2
1000
100
10
VOLTA G E NOISE – nV/ Hz
1
10
FREQUENCY – Hz
TPC 18. Input Voltage Noise vs.
Frequency
REV. B–6–
10M100k1k10010k1M100M
Page 7
AD8038/AD8039
(Default Conditions: ⴞ5 V, CL = 5 pF, G = +2, RG = RF = 1 kΩ, RL = 2 kΩ, VO = 2 V p-p, Frequency = 1 MHz, TA = 25ⴗC.)
100000
RL = 2k⍀
RL = 500⍀
RL = 2k⍀
10000
1000
NOISE – fA/ Hz
RL = 500⍀
100
100100010000 1000001M
10
FREQUENCY – Hz
TPC 19. Input Current Noise vs.
Frequency
CL = 25pF WITH
R
= 19.6⍀
SNUB
= 5pF
C
L
CL = 10pF
50mV/DIV5ns/DIV
TPC 22. Small Signal Transient
Response for Various Capacitive
Loads, VS= 5 V
50mV/DIV5ns/DIV
TPC 20. Small Signal Transient
Response for Various R
= 5 V
V
S
CL = 25pF WITH
= 19.6⍀
R
SNUB
CL = 5pF
CL = 10pF
50mV/DIV5ns/DIV
LOAD
,
TPC 23. Small Signal Transient
Response for Various Capacitive
Loads, VS= ±5 V
50mV/DIV5ns/DIV
TPC 21. Small Signal Transient
Response for Various R
= ±5 V
V
S
RL = 500⍀RL = 2k⍀
2.5V
500mV/DIV
LOAD
5ns/DIV
,
TPC 24. Large Signal Transient
Response for Various R
LOAD
,
VS= 5 V
RL = 500⍀
1V/DIV
RL = 2k⍀
5ns/DIV
TPC 25. Large Signal Transient
Response for Various R
LOAD
VS = ±5 V
REV. B
CL = 10pF
CL = 25pF
CL = 5pF
2.5V
500mV/DIV
TPC 26. Large Signal Transient
,
Response for Various Capacitive
Loads, VS = 5 V
5ns/DIV
TPC 27. Large Signal Transient
Response for Various Capacitive
Loads, VS = ±5 V
500mV/DIV
CL = 5pF
5ns/DIV
–7–
Page 8
AD8038/AD8039
FREQUENCY – MHz
IMPEDANCE – ⍀
0.1
0.01
0.11101001000
VS = ⴞ5V
VS = +5V
1
10
100
1000
(Default Conditions: ⴞ5 V, CL = 5 pF, G = +2, RG = RF = 1 kΩ, RL = 2 kΩ, VO = 2 V p-p, Frequency = 1 MHz, TA = 25ⴗC.)
IN
OUT
2V/DIV
TPC 28. Input Overdrive
Recovery, Gain = +1
–10
–20
–30
–40
–50
–60
–70
CROSSTALK – dB
–80
–90
–100
0.11000110
SIDE B
FREQUENCY – MHz
TPC 31. AD8039 Crosstalk,
= 1 V p-p, Gain = +1
V
IN
50ns/DIV
SIDE A
100
IN
INPUT 1V/DIV
OUTPUT 2V/DIV
OUT
50ns/DIV
TPC 29. Output Overdrive
Recovery, Gain = +2
–10
–20
–30
–40
–50
CMRR – dB
–60
–70
–80
VS = +5V
VS = ⴞ5V
1100010100
FREQUENCY – MHz
TPC 32. CMRR vs. Frequency,
VIN = 1 V p-p
2mV/DIV
+0.1%
–0.1%
0
t = 0
V
IN
0.5V/DIV5ns/DIV
ERROR
VOLTAGE
VS = ⴞ5V
G = +2
V
OUT
TPC 30. 0.1% Settling Time
= 2 V p-p
V
OUT
TPC 33. Output Impedance vs.
Frequency
= 2V p-p
10
0
–10
–20
–30
–40
–50
PSRR – dB
–60
–70
–80
–90
0.00110000.01101001
TPC 34. PSRR vs. Frequency
–PSRR
+PSRR
FREQUENCY – MHz
9
8
7
6
5
– p-p
4
OUT
V
3
2
1
0
0100400
VS = ⴞ5V
VS = +5V
200300500
R
– ⍀
LOAD
TPC 35. Output Swing vs. Load
Resistance
1.25
1.00
0.75
0.50
SUPPLY CURRENT – mA
0.25
0
0
246810
SUPPLY VOLTAGE – V
TPC 36. AD8038 Supply Current vs.
Supply Voltage
REV. B–8–
12
Page 9
AD8038/AD8039
0
–10
–20
–30
–40
–50
ISOLATION – dB
–60
–70
–80
–90
0.110001.010100
FREQUENCY – MHz
TPC 37. AD8038 Input-Output Isolation (G = +2,
R
= 2 kΩ, VS = ±5V
L
LAYOUT, GROUNDING, AND BYPASSING
CONSIDERATIONS
Disable
The AD8038 in the SOIC-8 package provides a disable feature.
This feature disables the input from the output (see TPC 37 for
input-output isolation) and reduces the quiescent current from
typically 1 mA to 0.2 mA. When the DISABLE node is pulled
below 4.5 V from the positive supply rail, the part becomes
disabled. In order to enable the part, the DISABLE node needs
to be pulled up to above 2.5 V below the positive rail.
Power Supply Bypassing
Power supply pins are actually inputs, and care must be taken
so that a noise-free stable dc voltage is applied. The purpose
of bypass capacitors is to create low impedances from the supply to ground at all frequencies, thereby shunting or filtering a
majority of the noise.
Decoupling schemes are designed to minimize the bypassing
impedance at all frequencies with a parallel combination of
capacitors. 0.01 µF or 0.001 µF (X7R or NPO) chip capacitors
are critical and should be as close as possible to the amplifier
package. Larger chip capacitors, such as the 0.1 µF capacitor,
can be shared among a few closely spaced active components in
the same signal path. A 10 µF tantalum capacitor is less critical
for high frequency bypassing and, in most cases, only one per
board is needed at the supply inputs.
Grounding
A ground plane layer is important in densely packed PC boards
to spread the current minimizing parasitic inductances.
However, an understanding of where the current flows in a circuit
is critical to implementing effective high speed circuit design.
The length of the current path is directly proportional to the
magnitude of parasitic inductances, and thus the high frequency
impedance of the path. High speed currents in an inductive
ground return will create an unwanted voltage noise.
The length of the high frequency bypass capacitor leads are most
critical. A parasitic inductance in the bypass grounding will
work against the low impedance created by the bypass capacitor.
Place the ground leads of the bypass capacitors at the same
physical location. Because load currents flow from the supplies
as well, the ground for the load impedance should be at the
same physical location as the bypass capacitor grounds. For the
larger value capacitors, which are intended to be effective at
lower frequencies, the current return path distance is less critical.
Input Capacitance
Along with bypassing and ground, high speed amplifiers can be
sensitive to parasitic capacitance between the inputs and ground. A
few pF of capacitance will reduce the input impedance at high
frequencies, in turn increasing the amplifiers’ gain, causing peaking
of the frequency response, or even oscillations if severe enough.
It is recommended that the external passive components that
are connected to the input pins be placed as close as possible to
the inputs to avoid parasitic capacitance. The ground and power
planes must be kept at a distance of at least 0.05 mm from the
input pins on all layers of the board.
Output Capacitance
To a lesser extent, parasitic capacitances on the output can cause
peaking of the frequency response. There are two methods to
minimize this effect.
1. Put a small value resistor in series with the output to isolate
the load capacitor from the amp’s output stage; see TPCs 7,
8, 22, and 23.
2. Increase the phase margin with higher noise gains or add a pole
with a parallel resistor and capacitor from –IN to the output.
Input-to-Output Coupling
The input and output signal traces should not be parallel to
minimize capacitive coupling between the inputs and outputs,
avoiding any positive feedback.
APPLICATIONS
Low Power ADC Driver
1k⍀
+5V
0.1F10F
1k⍀
V
IN
0V
1k⍀
1k⍀
1k⍀
8
3
2
6
5
–5V
1k⍀
1k⍀
4
1
7
0.1F
AD8039
10F
1k⍀
50⍀
50⍀
2.5V
0.1F10F
3V
REF
VINA
AD9203
VINB
Figure 3. Schematic to Drive AD9203 with the AD8039
Differential A/D Driver
The AD9203 is a low power (125 mW on a 5 V supply) 40 MSPS
10-bit converter. This represents a breakthrough in power/speed
for ADCs. As such, the low power, high performance AD8039
is an appropriate choice of amplifier to drive it.
In low supply voltage applications, differential analog inputs are
needed to increase the dynamic range of the ADC inputs.
Differential driving can also reduce second and other even-order
distortion products. The AD8039 can be used to make a
dc-coupled, single-ended-to-differential driver for one of these
ADCs. Figure 3 is a schematic of such a circuit for driving an
AD9203, a 10-bit, 40 MSPS ADC.
REV. B
–9–
Page 10
AD8038/AD8039
The AD9203 works best when the common-mode voltage at the
input is at the midsupply or 2.5 V. The output stage design of
the AD8039 makes it ideal for driving these types of ADCs.
In this circuit, one of the op amps is configured in the inverting
mode, while the other is in the noninverting mode. However, to
provide better bandwidth matching, each op amp is configured
for a noise gain of +2. The inverting op amp is configured for a
gain of –1, while the noninverting op amp is configured for a
gain of +2. Each has a very similar ac response. The input signal
to the noninverting op amp is divided by 2 to normalize its
voltage level and make it equal to the inverting output.
The outputs of the op amps are centered at 2.5 V, which is the
midsupply level of the ADC. This is accomplished by first taking
the 2.5 V reference output of the ADC and dividing it by 2 with a
pair of 1 kΩ resistors. The resulting 1.25 V is applied to each op
amp’s positive input. This voltage is then multiplied by the gain of
the op amps to provide a 2.5 V level at each output.
Low Power Active Video Filter
Some composite video signals derived from a digital source
contain clock feedthrough that can limit picture quality. Active
filters made from op amps can be used in this application, but
they will consume 25 mW to 30 mW for each channel. In
power-sensitive applications, this can be too much, requiring the
use of passive filters that can create impedance matching problems when driving any significant load.
The AD8038 can be used to make an effective low-pass active
filter that consumes one-fifth of the power consumed by an
active filter made from an op amp. Figure 4 shows a circuit that
uses an AD8038 to create a single ±2.5 V supply, three-pole
Sallen-Key filter. This circuit uses a single RC pole in front
of a standard two-pole active section.
R
680pF
+2.5V
R3
R1
200k⍀
V
IN
R4
49.9k⍀
R2
499k⍀
C1
100pF
49.9k⍀
C3
33pF
AD8038
–2.5V
1k⍀
0.1F
0.1F
F
10F
V
OUT
R5
49.9k⍀
10F
Figure 4. Low-Pass Filter for Video
Figure 5 shows the frequency response of this filter. The response
is down 3 dB at 6 MHz, so it passes the video band with little
attenuation. The rejection at 27 MHz is 45 dB, which provides
more than a factor of 100 in suppression of the clock components
at this frequency.
10
0
–10
–20
–30
GAIN – dB
–40
–50
–60
0.1
110100
FREQUENCY – MHz
Figure 5. Video Filter Response
REV. B–10–
Page 11
OUTLINE DIMENSIONS
AD8038/AD8039
0.053 (1.35)
0.045 (1.15)
PIN 1
0.039 (1.00)
0.031 (0.80)
0.004 (0.10)
0.000 (0.00)
Dimensions shown in inches and (mm)
5-Lead SC70
(KS-5)
0.087 (2.20)
0.071 (1.80)
5
1 2
4
3
0.026 (0.65) BSC
0.012 (0.30)
0.006 (0.15)
0.094 (2.40)
0.071 (1.80)
0.043 (1.10)
0.031 (0.80)
SEATING
PLANE
0.007 (0.18)
0.004 (0.10)
Dimensions shown in millimeters and (inches)
0.016 (0.40)
0.004 (0.10)
0.012 (0.30)
0.004 (0.10)
8-Lead Plastic SOIC
(R-8)
0.071 (1.80)
0.059 (1.50)
PIN 1
0.051 (1.30)
0.035 (0.90)
0.006 (0.15)
0.000 (0.00)
*Not yet released.
Dimensions shown in inches and (mm)
8-Lead Plastic Surface Mount
(RT-8)*
0.122 (3.10)
0.110 (2.80)
7
2
0.077
(1.95)
BSC
3
5 6
0.112 (2.80)
4
0.026
(0.65) BSC
0.057 (1.45)
0.035 (0.90)
SEATING
PLANE
0.009 (0.23)
0.003 (0.08)
8
0.015 (0.38)
0.009 (0.22)
10ⴗ
0ⴗ
0.022 (0.55)
0.014 (0.35)
5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
COPLANARITY
0.25 (0.0098)
0.10 (0.0040)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN