Datasheet AD7988-5 Datasheet (ANALOG DEVICES)

Page 1
PulSAR ADCs in MSOP/LFCSP (QFN)
AD7988-1/AD7988-5
Rev. B
Trademarks and registered trademarks are the prop erty of their respective owner s.
Fax: 781.461.3113 ©2012 Analog Devices, Inc. All rights reserved.
REF
GND
VDD
IN+ IN–
VIO
SDI SCK SDO CNV
1.8V TO 5.5V
3- OR 4-WI RE INTERFACE (SPI, DAISY CHAIN, CS)
2.5V TO 5V 2.5V
0V TO V
REF
10231-001
AD7988-1/ AD7988-5
Data Sheet

FEATURES

Low power dissipation
AD7988-5: 3.5 mW @ 500 kSPS
AD7988-1: 700 µW @ 100 kSPS
16-bit resolution with no missing codes Throughput: 100 kSPS/500 kSPS options INL: ±0.6 LSB typical, ±1.25 LSB maximum SINAD: 91.5 dB @ 10 kHz THD: −114 dB @ 10 kHz Pseudo differential analog input range
0 V to V
Any input range and easy to drive with the ADA4841-1 No pipeline delay Single-supply 2.5 V operation with 1.8 V/2.5 V/3 V/5 V
logic interface SPI-/QSPI-/MICROWIRE™-/DSP-compatible serial interface Daisy-chain multiple ADCs 10-lead MSOP and 10-lead, 3 mm × 3 mm LFCSP (QFN),
same space as SOT-23 Wide operating temperature range: −40°C to +125°C

APPLICATIONS

Battery-powered equipment Low power data acquisition systems Portable medical instruments ATE equipment Data acquisitions Communications
with V
REF
from 2.5 V to 5.5 V
REF
16-Bit Lower Power

GENERAL DESCRIPTION

The AD7988-1/AD7988-5 are 16-bit, successive approximation, analog-to-digital converters (ADC) that operate from a single power supply, VDD. The AD7988-1 offers a 100 kSPS throughput, and the AD7988-5 offers a 500 kSPS throughput. They are low power, 16-bit sampling ADCs with a versatile serial interface port. On the CNV rising edge, they sample an analog input, IN+, between 0 V to V The reference voltage, REF, is applied externally and can be set independent of the supply voltage, VDD.
The SPI-compatible serial interface also features the ability to daisy-chain several ADCs on a single 3-wire bus using the SDI input. It is compatible with 1.8 V, 2.5 V, 3 V, or 5 V logic using the separate supply, VIO.
The AD7988-1/AD7988-5 generics are housed in a 10-lead MSOP or a 10-lead LFCSP (QFN) with operation specified from −40°C to +125°C.
Table 1. MSOP, LFCSP (QFN) 14-/16-/18-Bit PulSAR® ADCs
Bits 100 kSPS 250 kSPS
181 AD76912 AD76902 AD79822
161 AD7684 AD76872 AD76882
163 AD7680
AD7683 AD7988-1
143 AD7940 AD79422 AD79462 ADA4841-1
1
True differential.
2
Pin-for-pin compatible.
3
Pseudo differential.
2
with respect to a ground sense, IN−.
REF
AD7685 AD7694
2
400 kSPS to 500 kSPS
AD7693 AD76862 AD7988-5
≥1000 kSPS
AD7984
ADA4941-1
2
AD7980
2
ADC Driver
ADA4941-1
2
ADA4841-1
ADA4841-1
2
ADA4841-1
ADA4841-1 ADA4841-1

TYPICAL APPLICATION DIAGRAM

Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Figure 1.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com
Page 2
AD7988-1/AD7988-5 Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Typical Application Diagram .......................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Timing Specifications .................................................................. 5
Absolute Maximum Ratings ............................................................ 7
ESD Caution .................................................................................. 7
Pin Configurations and Function Descriptions ........................... 8
Terminology ...................................................................................... 9
Typical Performance Characteristics ........................................... 10
Theory of Operation ...................................................................... 14
Circuit Information .................................................................... 14
Converter Operation .................................................................. 14
Typical Connection Diagram ................................................... 15
Analog Inputs ............................................................................. 16
Driver Amplifier Choice ........................................................... 16
Voltage Reference Input ............................................................ 17
Power Supply ............................................................................... 17
Digital Interface .......................................................................... 17
CS
Mode, 3-Wire ........................................................................ 18
CS
Mode 4-Wire ......................................................................... 19
Chain Mode ................................................................................ 20
Applications Information .............................................................. 21
Interfacing to Blackfin® DSP ..................................................... 21
Layout .......................................................................................... 21
Evaluating the Performance of the AD7988-x ........................ 21
Outline Dimensions ....................................................................... 22
Ordering Guide .......................................................................... 23

REVISION HISTORY

5/12—Rev. A to Rev. B
Changes to Table 3 ............................................................................. 4
Updated Outline Dimensions ........................................................ 22
2/12—Rev. 0 to R e v. A
Added LFCSP Thermal Impedance Values ................................... 7
Updated Outline Dimensions ....................................................... 23
Changes to Ordering Guide .......................................................... 23
2/12—Revision 0: Initial Ve rs i on
Rev. B | Page 2 of 24
Page 3
Data Sheet AD7988-1/AD7988-5
Absolute Input Voltage
IN+
−0.1 V
+ 0.1
V
Integral Linearity Error
V
= 5 V
−1.25
±0.6
+1.25
LSB1
Gain Error Temperature Drift
±0.35
ppm/°C
Transient Response
Full-scale step
500
ns
fIN = 10 kHz, V
= 2.5 V
87.0 dB3

SPECIFICATIONS

VDD = 2.5 V, VIO = 2.3 V to 5.5 V, V
Table 2.
Parameter Test Conditions/Comments Min Typ Max Unit
RESOLUTION 16 Bits ANALOG INPUT
Voltage Range IN+ − IN− 0 V
IN− −0.1 +0.1 V Analog Input CMRR fIN = 1 kHz 60 dB Leakage Current at 25°C Acquisition phase 1 nA Input Impedance See the Analog Inputs section
ACCURACY
No Missing Codes 16 Bits Differential Linearity Error V V
V Transition Noise V V Gain Error, T
MIN
2
to T
±2 LSB1
MAX
= 5 V, TA = –40°C to +125°C, unless otherwise noted.
REF
REF
REF
= 5 V −0.9 ±0.4 +0.9 LSB1
REF
= 2.5 V ±0.55 LSB1
REF
REF
= 2.5 V ±0.65 LSB1
REF
= 5 V 0.6 LSB1
REF
= 2.5 V 1.0 LSB1
REF
V
Zero Error, T
MIN
2
to T
−0.5 ±0.08 +0.5 mV
MAX
Zero Temperature Drift 0.54 ppm/°C Power Supply Sensitivity
VDD = 2.5 V ± 5%
±0.1 LSB1
THROUGHPUT
AD7988-1
Conversion Rate
VIO ≥ 2.3 V up to 85°C, VIO ≥ 3.3 V above 85°C up to
0 100 kSPS
125°C
AD7988-5
Conversion Rate
VIO ≥ 2.3 V up to 85°C, VIO ≥ 3.3 V above 85°C up to
0 500 kSPS
125°C
Transient Response Full-scale step 400 ns
AC ACCURACY
Dynamic Range V V
= 5 V 92 dB3
REF
= 2.5 V 87 dB3
REF
Oversampled Dynamic Range fO = 10 kSPS 111 dB3 Signal-to-Noise Ratio, SNR fIN = 10 kHz, V fIN = 10 kHz, V
= 5 V 90 91 dB3
REF
= 2.5 V 86.5 dB3
REF
Spurious-Free Dynamic Range, SFDR fIN = 10 kHz −110 dB3 Total Harmonic Distortion, THD fIN = 10 kHz −114 dB3 Signal-to-(Noise + Distortion), SINAD fIN = 10 kHz, V
1
LSB means least significant bit. With the 5 V input range, 1 LSB is 76.3 µV.
2
See the Terminology section. These specifications include full temperature range variation, but not the error contribution from the external reference.
3
All specifications in dB are referred to a full-scale input FSR. Tested with an input signal at 0.5 dB below full scale, unless otherwise specified.
= 5 V 91.5 dB3
REF
REF
Rev. B | Page 3 of 24
Page 4
AD7988-1/AD7988-5 Data Sheet
POWER SUPPLIES
AD7988-1 Power Dissipation
10 kSPS throughput
70 µW
VDD = 2.5 V, VIO = 2.3 V to 5.5 V, V
Table 3.
Parameter Test Conditions/Comments Min Typ Max Unit
REFERENCE
Voltage Range 2.4 5.1 V
Load Current V SAMPLING DYNAMICS
−3 dB Input Bandwidth 10 MHz
Aperture Delay VDD = 2.5 V 2.0 ns DIGITAL INPUTS
Logic Levels
VIL VIO > 3 V –0.3 0.3 × VIO V VIH VIO > 3 V 0.7 × VIO VIO + 0.3 V VIL VIO ≤ 3 V –0.3 0.1 × VIO V VIH VIO ≤ 3 V 0.9 × VIO VIO + 0.3 V IIL −1 +1 µA IIH −1 +1 µA
DIGITAL OUTPUTS
Data Format Serial 16 bits straight binary
Pipeline Delay
VOL I VOH I
= 5 V, TA = –40°C to +125°C, unless otherwise noted.
REF
= 5 V 250 µA
REF
Conversion results available immediately
after completed conversion
= 500 µA 0.4 V
SINK
= −500 µA VIO − 0.3 V
SOURCE
VDD 2.375 2.5 2.625 V
VIO Specified performance 2.3 5.5 V
VIO Range 1.8 5.5 V
Standby Current
1, 2
VDD and VIO = 2.5 V, 25°C 0.35 nA
100 kSPS throughput 700 µW
1 mW
AD7988-5 Power Dissipation 500 kSPS throughput 3.5 5 mW
Energy per Conversion 7.0 nJ/sample TEMPERATURE RANGE
Specified Performance T
1
With all digital inputs forced to VIO or GND as required.
2
During the acquisition phase.
MIN
to T
−40 +125 °C
MAX
Rev. B | Page 4 of 24
Page 5
Data Sheet AD7988-1/AD7988-5
AD7988-5
SCK Period (Chain Mode)
t
SCK High Time
t
4.5
ns
SDI Valid Setup Time from CNV Rising Edge
t
5
ns

TIMING SPECIFICATIONS

VDD = 2.37 V to 2.63 V, VIO = 3.3 V to 5.5 V, −40°C to +125°C unless otherwise stated. See Figure 2 and Figure 3 for load conditions.
Table 4.
Parameter Symbol Min Typ Max Unit
AD7988-1
Throughput Rate 100 kHz Conversion Time: CNV Rising Edge to Data Available t Acquisition Time t Time Between Conversions t
Throughput Rate 500 kHz Conversion Time: CNV Rising Edge to Data Available t Acquisition Time t
Time Between Conversions t CNV Pulse Width (CS Mode) SCK Period (CS Mode)
VIO Above 4.5 V 10.5 ns VIO Above 3 V 12 ns VIO Above 2.7 V 13 ns VIO Above 2.3 V 15 ns
VIO Above 4.5 V 11.5 ns VIO Above 3 V 13 ns VIO Above 2.7 V 14 ns VIO Above 2.3 V 16 ns
SCK Low Time t
SCK Falling Edge to Data Remains Valid t SCK Falling Edge to Data Valid Delay t
VIO Above 4.5 V 9.5 ns VIO Above 3 V 11 ns VIO Above 2.7 V 12 ns VIO Above 2.3 V 14 ns
CNV or SDI Low to SDO D15 MSB Valid (CS Mode)
VIO Above 3 V 10 ns VIO Above 2.3V 15 ns
CNV or SDI High or Last SCK Falling Edge to SDO High Impedance (CS Mode)
SDI Valid Hold Time from CNV Rising Edge (CS Mode) SDI Valid Hold Time from CNV Rising Edge (Chain Mode) t SCK Valid Setup Time from CNV Rising Edge (Chain Mode) t SCK Valid Hold Time from CNV Rising Edge (Chain Mode) t SDI Valid Setup Time from SCK Falling Edge (Chain Mode) t SDI Valid Hold Time from SCK Falling Edge (Chain Mode) t
9.5 μs
CONV
500 ns
ACQ
10 μs
CYC
1.6 μs
CONV
400 ns
ACQ
2 μs
CYC
t
500 ns
CNVH
t
SCK
SCK
4.5 ns
SCKL
SCKH
3 ns
HSDO
DSDO
t
EN
t
20 ns
DIS
SSDICNV
t
2 ns
HSDICNV
0 ns
HSDICNV
5 ns
SSCKCNV
5 ns
HSCKCNV
2 ns
SSDISCK
3 ns
HSDISCK
Rev. B | Page 5 of 24
Page 6
AD7988-1/AD7988-5 Data Sheet
500µA I
OL
500µA I
OH
1.4V
TO SDO
C
L
20pF
10231-002
X% VIO
1
Y% VIO
1
V
IH
2
V
IL
2
V
IL
2
V
IH
2
t
DELAY
t
DELAY
1
FOR VIO ≤ 3.0V, X = 90 AND Y = 10; FOR VIO > 3.0V X = 70, AND Y = 30.
2
MINIMUM V
IH
AND MAXIMUM VIL USED. SEE DIGITAL INPUTS
SPECIFICATIONS IN TABLE 3.
10231-003
Figure 2. Load Circuit for Digital Interface Timing
Figure 3. Voltage Levels for Timing
Rev. B | Page 6 of 24
Page 7
Data Sheet AD7988-1/AD7988-5
IN+,1 IN−1 to GND
−0.3 V to V
+ 0.3 V or ±130 mA
Digital Outputs to GND
−0.3 V to VIO + 0.3 V
θJC Thermal Impedance

ABSOLUTE MAXIMUM RATINGS

Table 5.
Parameter Rating
Analog Inputs
REF
Supply Voltage
REF, VIO to GND −0.3 V to +6 V VDD to GND −0.3 V to +3 V VDD to VIO +3 V to −6 V
Digital Inputs to GND −0.3 V to VIO + 0.3 V
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Storage Temperature Range −65°C to +125°C Junction Temperature 150°C θJA Thermal Impedance
10-Lead MSOP 200°C/W 10-Lead LFCSP 80°C/W
10-Lead MSOP 44°C/W 10-Lead LFCSP 15°C/W
Reflow Soldering JEDEC Standard (J-STD-020)
1
See the Analog Inputs section.

ESD CAUTION

Rev. B | Page 7 of 24
Page 8
AD7988-1/AD7988-5 Data Sheet
REF
1
VDD
2
IN+
3
IN–
4
GND
5
VIO
10
SDI
9
SCK
8
SDO
7
CNV
6
10231-004
AD7988-1/ AD7988-5
TOP VIEW
(Not to Scale)
NOTES
1. THE EXPOSED P
AD CAN BE CONNECTED TO GND.
1REF 2VDD 3IN+ 4IN– 5GND
10 VIO 9 SDI 8 SCK 7 SDO 6 CNV
10231-005
AD7988-1/ AD7988-5
TO
P VI
EW
(Not to Scale)
6
CNV
DI
9
SDI
DI
Serial Data Input. This input provides multiple features. It selects the interface mode of the ADC as

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

Figure 4. 10-Lead MSOP Pin Configuration
Figure 5. 10-Lead LFCSP (QFN) Pin Configuration
Table 6. Pin Function Descriptions
Pin No. Mnemonic Type1 Description
1 REF AI
Reference Input Voltage. The V
range is from 2.4 V to 5.1 V. It is referred to the GND pin. The GND pin
REF
should be decoupled closely to the REF pin with a 10 µF capacitor. 2 VDD P Power Supply. 3 IN+ AI
Analog Input. It is referred to IN−. The voltage range, for example, the difference between IN+ and IN−, is
REF
.
0 V to V 4 IN− AI Analog Input Ground Sense. Connect to the analog ground plane or to a remote sense ground. 5 GND P Power Supply Ground.
Convert Input. This input has multiple functions. On its leading edge, it initiates the conversions and
selects the interface mode of the part: chain mode or
CS mode. In CS mode, the SDO pin is enabled when
CNV is low. In chain mode, the data should be read when CNV is high. 7 SDO DO Serial Data Output. The conversion result is output on this pin. It is synchronized to SCK. 8 SCK DI Serial Data Clock Input. When the part is selected, the conversion result is shifted out by this clock.
follows:
Chain mode is selected if this pin is low during the CNV rising edge. In this mode, SDI is used as a data
input to daisy-chain the conversion results of two or more ADCs onto a single SDO line. The digital data
level on SDI is output on SDO with a delay of 16 SCK cycles.
CS mode is selected if SDI is high during the CNV rising edge. In this mode, either SDI or CNV can enable
the serial output signals when low. 10 VIO P
Input/Output Interface Digital Power. Nominally at the same supply as the host interface (1.8 V, 2.5 V, 3 V,
or 5 V). EP Exposed Pad. The exposed pad can be connected to GND.
1
AI = analog input, DI = digital input, DO = digital output, and P = power.
Rev. B | Page 8 of 24
Page 9
Data Sheet AD7988-1/AD7988-5

TERMINOLOGY

Integral Nonlinearity Error (INL)
INL refers to the deviation of each individual code from a line drawn from negative full scale through positive full scale. The point used as negative full scale occurs ½ LSB before the first code transition. Positive full scale is defined as a level 1½ LSB beyond the last code transition. The deviation is measured from the middle of each code to the true straight line (see Figure 30).
Differential Nonlinearity Error (DNL)
In an ideal ADC, code transitions are 1 LSB apart. DNL is the maximum deviation from this ideal value. It is often specified in terms of resolution for which no missing codes are guaranteed.
Offset Error
The first transition should occur at a level ½ LSB above analog ground (38.1 µV for the 0 V to 5 V range). The offset error is the deviation of the actual transition from that point.
Gain Error
The last transition (from 111 … 10 to 111 … 11) should occur for an analog voltage 1½ LSB below the nominal full scale (4.999886 V for the 0 V to 5 V range). The gain error is the deviation of the actual level of the last transition from the ideal level after the offset is adjusted out.
Spurious-Free Dynamic Range (SFDR)
SFDR is the difference, in decibels (dB), between the rms amplitude of the input signal and the peak spurious signal.
Effective Number of Bits (ENOB)
ENOB is a measurement of the resolution with a sine wave input. It is related to SINAD by the following formula:
ENOB = (SINAD
− 1.76)/6.02
dB
and is expressed in bits.
Noise-Free Code Resolution
Noise-free code resolution is the number of bits beyond which it is impossible to distinctly resolve individual codes. It is calculated as
Noise-Free Code Resolution = log
(2N/Peak-to-Peak Noise)
2
and is expressed in bits.
Effective Resolution
Effective resolution is calculated as
Effective Resolution = log
(2N/RMS Input Noise)
2
and is expressed in bits.
Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of the first five harmonic components to the rms value of a full-scale input signal and is expressed in dB.
Dynamic Range
Dynamic range is the ratio of the rms value of the full scale to the total rms noise measured with the inputs shorted together. The value for dynamic range is expressed in dB. It is measured with a signal at −60 dBFS to include all noise sources and DNL artifacts.
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the rms value of the actual input signal to the rms sum of all other spectral components below the Nyquist frequency, excluding harmonics and dc. The value for SNR is expressed in dB.
Signal-to-(Noise + Distortion) Ratio (SINAD)
SINAD is the ratio of the rms value of the actual input signal to the rms sum of all other spectral components below the Nyquist frequency, including harmonics but excluding dc. The value for SINAD is expressed in dB.
Aperture Delay
Aperture delay is the measure of the acquisition performance. It is the time between the rising edge of the CNV input and when the input signal is held for a conversion.
Transient Response
Transient response is the time required for the ADC to accurately acquire its input after a full-scale step function is applied.
Rev. B | Page 9 of 24
Page 10
AD7988-1/AD7988-5 Data Sheet
0
–180
FREQUENCY (kHz)
–20
–40
–60
–80
–100
–120
–140
–160
f
S
= 500kSPS
f
IN
= 10kHz SNR = 91.17dB THD = –113.63dB SFDR = 110.30dB SINAD = 91.15dB
AMPLITUDE (dB of FULL SCALE)
0 50 100 150 200 250
10231-046
0
–180
FREQUENCY (kHz)
–20
–40
–60
–80
–100
–120
–140
–160
f
S
= 500kSPS
f
IN
= 10kHz SNR = 86.8dB THD = –111.4dB SFDR = 105.9dB SINAD = 86.8dB
AMPLITUDE (dB of FULL SCALE)
0 50 100 150 200 250
10231-047
0
–180
FREQUENCY (kHz)
–20
–40
–60
–80
–100
–120
–140
–160
f
S
= 100kSPS
f
IN
= 10kHz SNR = 91.09dB THD = –113.12dB SFDR = 110.30dB SINAD = 91.05dB
AMPLITUDE (dB of FULL SCALE)
0 10 20 30 40 50
10231-048
0
–180
FREQUENCY (kHz)
–20
–40
–60
–80
–100
–120
–140
–160
f
S
= 100kSPS
f
IN
= 10kHz SNR = 86.7dB THD = –110.4dB SFDR = 103.9dB SINAD = 86.6dB
AMPLITUDE (dB of FULL SCALE)
0 10 20 30 40 50
10231-049
1.25
–1.25
CODE
INL (LSB)
1.00
0.75
0.50
0.25
0.25
–0.75
0
–0.50
–1.00
POSITIVE INL: +0.40 LSB NE
GATIVE INL: –0.35 LSB
0 16384 32768 49152 65536
10231-010
1.25
1.00
–1.25
–1.00
INL (LSB)
0.7
5
0.50
0.25
–0.25
–0.75
0
0.50
POSITIVE INL: +0.45 LS
B
NEGATIVE INL: –0.29 LSB
CODE
0 16384 32768 49152 65536
10231-011

TYPICAL PERFORMANCE CHARACTERISTICS

VDD = 2.5 V, V
= 5.0 V, VIO = 3.3 V, unless otherwise noted.
REF
Figure 6. AD7988-5 FFT Plot, V
Figure 7. AD7988-5 FFT Plot, V
= 5 V
REF
= 2.5 V
REF
Figure 9. AD7988-1 FFT Plot, V
= 2.5 V
REF
Figure 10. Integral Nonlinearity vs. Code, V
REF
= 5 V
Figure 8. AD7988-1 FFT Plot, V
REF
= 5 V
Figure 11. Integral Nonlinearity vs. Code, V
= 2.5 V
REF
Rev. B | Page 10 of 24
Page 11
Data Sheet AD7988-1/AD7988-5
CODE
0 16384 32768 49152 65536
1.00
–1.00
DNL (LSB)
0.75
0.50
0.25
–0.25
–0.75
0
–0.
50
PO
SITIVE INL: +0.18 LSB
NEGATIVE INL: –0.21 LSB
10231-012
CODE
0 16384 32768 49152 65536
1.00
–1.00
DNL (LSB)
0.75
0.50
0.25
–0.25
–0.75
0
–0.50
POSITIVE INL: +0.25 LSB NEGATIVE INL: –0.22 LSB
10231-013
180k
0
000 0022
CODE IN HEX
COUNTS
8003 8004 8005 8006 8007 8008 8009 800A 800B 800C 800D 800E 800F
1291
852
29
2
10231-050
160k
140k
120k
100k
80k
60k
40k
20k
52720
162595
42731
60k
0
000 0
94 30
1
CODE IN HEX
COUNTS
50k
30k
10k
40k
20k
7FFA 7FFB 7FFC 7FFD 7FFE 7FFF 8000 8001 8002 8003 8004 8005 8006
2290
18848
50970
45198
12424
1217
10231-015
100
80
85
90
95
REFERENCE VOLTAGE (V)
SNR, SINAD (dB)
16
12
13
14
15
ENOB (Bits)
SNR SINAD ENOB
2.25 2.75 3.25 3.75 4.25 4.75 5.25
10231-016
60k
0
000 0
590
11
19
CODE IN HEX
COUNTS
50k
30k
10k
40k
20k
7FFA 7FFB 7FFC 7FFD 7FFE 7FFF 8000 8001 8002 8003 8004 8005 8006
7285
37417
53412
31540
5807
512
10231-051
Figure 12. Differential Nonlinearity vs. Code, V
Figure 13. Differential Nonlinearity vs. Code, V
REF
= 2.5 V
REF
= 5 V
Figure 15. Histogram of a DC Input at the Code Transition, V
Figure 16. SNR, SINAD, and ENOB vs. Reference Voltage
= 2.5 V
REF
Figure 14. Histogram of a DC Input at the Code Center, V
= 5 V
REF
Figure 17. Histogram of a DC Input at the Code Center, V
= 2.5 V
REF
Rev. B | Page 11 of 24
Page 12
AD7988-1/AD7988-5 Data Sheet
95
85
87
89
92
91
93
94
86
88
90
INPUT LEVEL (dB OF FULL SCALE)
SNR (dB)
–10 –9 –8 –7 –6 –5 –4 –3 –2 –1 0
10231-018
–95
–125
–110
–115
–105
–100
–120
115
85
100
95
105
110
90
REFERENCE VOLTAGE (V)
THD (dB)
SFDR (dB)
THD
SFDR
2.25 2.75 3.25 3.75 4.25 4.75 5.25
10231-019
100
80
10 1k
FREQUENCY ( kHz )
SINAD (dB)
95
90
85
100
10231-052
10231-053
95
85
89
87
91
93
–55 125
TEMPERATURE (°C)
SNR (dB)
–35 –15 5 25 65 8545 105
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
VDD VOLTAGE (V)
I
VDD
I
REF
I
VIO
CURRENT (mA)
2.375 2.425 2.475 2.525 2.575 2.625
10231-023
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0
VDD VOLTAGE (V)
I
VDD
I
REF
I
VIO
CURRENT (mA)
2.375 2.425 2.475 2.525 2.575 2.625
10231-024
Figure 18. SNR vs. Input Level
Figure 19. THD, SFDR vs. Reference Voltage
Figure 21. SNR vs. Temperature
Figure 22. Operating Currents vs. Supply (AD7988-5)
Figure 20. SINAD vs. Frequency
Figure 23. Operating Currents vs. Supply (AD7988-1)
Rev. B | Page 12 of 24
Page 13
Data Sheet AD7988-1/AD7988-5
10231-054
–85
–125
10 1k
FREQUENCY ( kHz )
THD (dB)
100
–90
–95
–100
–105
–110
–115
–120
–110
–120
THD (dB)
TEMPERATURE (°C)
–112
–114
–116
–118
–55 –35 –15 5 25 45 65 85 105 125
10231-026
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
CURRENT (mA)
I
VDD
I
REF
I
VIO
TEMPERATURE (°C)
–55 –35 –15 5 25 45 65 85 105 125
10231-027
0.14
0.12
0.10
008
0.06
0.04
0.02
0
CURRENT (mA)
I
VDD
I
REF
I
VIO
TEMPERATURE (°C)
–55 –35 –15 5 25 45 65 85 105 125
10231-028
8
7
6
5
4
3
2
1
0
CURRENT (µA)
TEMPERATURE (°C)
I
VDD
+ I
VIO
–55 –35 –15 5 25 45 65 85 105 125
10231-029
Figure 24. THD vs. Frequency
Figure 25. THD vs. Temperature
Figure 27. Operating Currents vs. Temperature (AD7988-1)
Figure 28. Power-Down Currents vs. Temperature
Figure 26. Operating Currents vs. Temperature (AD7988-5)
Rev. B | Page 13 of 24
Page 14
AD7988-1/AD7988-5 Data Sheet
COMP
SWITCHE S CONTROL
BUSY
OUTPUT CODE
CNV
CONTROL
LOGIC
SW+LSB
SW–LSB
IN+
REF
GND
IN–
MSB
MSB
CC4C 2C16,384C
32,768C
CC4C 2C16,384C32,768C
10231-030

THEORY OF OPERATION

Figure 29. ADC Simplified Schematic

CIRCUIT INFORMATION

The AD7988-1/AD7988-5 devices are fast, low power, single- supply, precise 16-bit ADCs that use a successive approximation architecture.
The AD7988-1 is capable of converting 100,000 samples per second (100 kSPS), whereas the AD7988-5 is capable of a throughput of 500 kSPS, and they power down between conversions. When operating at 10 kSPS, for example, the ADC consumes 70 µW typically, ideal for battery-powered applications.
The AD7988-x provides the user with on-chip track-and-hold and does not exhibit any pipeline delay or latency, making it ideal for multiple multiplexed channel applications.
The AD7988-x can be interfaced to any 1.8 V to 5 V digital logic family. It is housed in a 10-lead MSOP or a tiny 10-lead LFCSP (QFN) that combines space savings and allows flexible configurations.

CONVERTER OPERATION

The AD7988-x is a successive approximation ADC based on a charge redistribution DAC. Figure 29 shows the simplified schematic of the ADC. The capacitive DAC consists of two identical arrays of 16 binary weighted capacitors, which are connected to the two comparator inputs.
During the acquisition phase, terminals of the array tied to the comparator’s input are connected to GND via SW+ and SW−. All independent switches are connected to the analog inputs. Therefore, the capacitor arrays are used as sampling capacitors and acquire the analog signal on the IN+ and IN− inputs. When the acquisition phase is completed and the CNV input goes high, a conversion phase is initiated. When the conversion phase begins, SW+ and SW− are opened first. The two capacitor arrays are then disconnected from the inputs and connected to the GND input. Therefore, the differential voltage between the IN+ and IN− inputs captured at the end of the acquisition phase are applied to the comparator inputs, causing the comparator to become unbalanced. By switching each element of the capacitor array between GND and REF, the comparator input varies by binary weighted voltage steps (V
REF
/2, V
/4 … V
REF
/65,536). The
REF
control logic toggles these switches, starting with the MSB, to bring the comparator back into a balanced condition. After the completion of this process, the part returns to the acquisition phase and the control logic generates the ADC output code.
Because the AD7988-x has an on-board conversion clock, the serial clock, SCK, is not required for the conversion process.
Rev. B | Page 14 of 24
Page 15
Data Sheet AD7988-1/AD7988-5
000 ... 000
000 ... 001
000 ... 010
111 ... 101
111 ... 110
111 ... 111
–FSR –FS R + 1LSB
–FSR + 0.5LS B
+FSR – 1 LSB
+FSR – 1.5 LS B
ANALOG INP UT
ADC CODE (STRAI GHT BINARY)
10231-031
AD7988-1/ AD7988-5
2.5VV+
20Ω
V+
V–
0V TO V
REF
1.8V TO 5.5V
100nF
10µF
2
2.7nF
4
3
100nF
REF
IN+
IN–
VDD VIO
GND
3- OR 4-WI RE INTERFACE
5
REF
1
1
SEE THE VOLTAGE REFERENCE INPUT SECTION FOR REFERENCE SELECTION.
2
C
REF
IS USUALL Y A 10µ F CERAMIC CAPACI TOR (X5R).
3
SEE THE DRIVER AMPLIFIER CHOICE SECTION.
4
OPTIONAL FILTER. SEE THE ANALOG INPUTS SECTION.
5
SEE THE DIGITAL INTERFACE SECTION FOR THE MOST CONVENIENT INTERFACE MODE.
10231-032
CNV
SCK SDO
SDI

Transfer Functions

The ideal transfer characteristic for the AD7988-x is shown in Figure 30 and Table 7.
Figure 30. ADC Ideal Transfer Function
Table 7. Output Codes and Ideal Input Voltages
Analog Input Description V
= 5 V Digital Output Code (Hex)
REF
FSR – 1 LSB 4.999924 V FFFF1 Midscale + 1 LSB 2.500076 V 8001 Midscale 2.5 V 8000 Midscale – 1 LSB 2.499924 V 7FFF –FSR + 1 LSB 76.3 µV 0001 –FSR 0 V 00002
1
This is also the code for an overranged analog input (V
2
This is also the code for an underranged analog input (V
− V
above V
IN+
IN−
− V
IN+
below V
IN−
− V
REF
GND
GND

TYPICAL CONNECTION DIAGRAM

Figure 31 shows an example of the recommended connection diagram for the AD7988-x when multiple supplies are available.
).
).
Figure 31. Typical Application Diagram with Multiple Supplies
Rev. B | Page 15 of 24
Page 16
AD7988-1/AD7988-5 Data Sheet
REF
R
IN
C
IN
IN+
OR IN–
GND
D2C
PIN
D1
10231-033
AD8605, AD8615
5 V single-supply, low power

ANALOG INPUTS

Figure 32 shows an equivalent circuit of the input structure of the AD7988-x.
The two diodes, D1 and D2, provide ESD protection for the analog inputs, IN+ and IN−. Care must be taken to ensure that the analog input signal never exceeds the supply rails by more than 0.3 V, because this causes these diodes to become forward­biased and start conducting current. These diodes can handle a forward-biased current of 130 mA maximum. For instance, these conditions may eventually occur when the input buffer’s supplies are different from VDD. In such a case (for example, an input buffer with a short circuit), the current limitation can be used to protect the part.
Figure 32. Equivalent Analog Input Circuit
The analog input structure allows the sampling of the true differential signal between IN+ and IN−. By using these differential inputs, signals common to both inputs are rejected.
During the acquisition phase, the impedance of the analog inputs (IN+ and IN−) can be modeled as a parallel combination of Capacitor C R
and CIN. C
IN
and the network formed by the series connection of
PIN
is primarily the pin capacitance. RIN is typically
PIN
400 Ω and is a lumped component made up of serial resistors and the on resistance of the switches. C
is typically 30 pF and
IN
is mainly the ADC sampling capacitor. During the conversion phase, when the switches are opened, the input impedance is limited to C
. RIN and CIN make a one-pole, low-pass filter that
PIN
reduces undesirable aliasing effects and limits the noise. When the source impedance of the driving circuit is low, the
AD7988-x can be driven directly. Large source impedances
significantly affect the ac performance, especially THD. The dc performances are less sensitive to the input impedance. The maximum source impedance depends on the amount of THD that can be tolerated. The THD degrades as a function of the source impedance and the maximum input frequency.

DRIVER AMPLIFIER CHOICE

Although the AD7988-x is easy to drive, the driver amplifier needs to meet the following requirements:
The noise generated by the driver amplifier must be kept as
low as possible to preserve the SNR and transition noise performance of the AD7988-x. The noise coming from the driver is filtered by the AD7988-x analog input circuit’s one-pole, low-pass filter made by R external filter, if one is used. Because the typical noise of the AD7988-x is 47.3 µV rms, the SNR degradation due to the amplifier is
 
SNR
LOSS
log20
=
47.3
 
where:
f
is the input bandwidth in MHz of the AD7988-x
–3dB
(10 MHz) or the cutoff frequency of the input filter, if one is used. N is the noise gain of the amplifier (for example, 1 in buffer configuration).
e
is the equivalent input noise voltage of the op amp,
N
in nV/√Hz.
For ac applications, the driver should have a THD
performance commensurate with the AD7988-x.
For multichannel multiplexed applications, the driver ampli-
fier and the AD7988-x analog input circuit must settle for a full-scale step onto the capacitor array at a 16-bit level (0.0015%, 15 ppm). In the amplifier data sheet, settling at
0.1% to 0.01% is more commonly specified. This may differ significantly from the settling time at a 16-bit level and should be verified prior to driver selection.
Table 8. Recommended Driver Amplifiers
Amplifier Typical Application
ADA4841-1 Very low noise, small size, and low power AD8021 Very low noise and high frequency AD8022 Low noise and high frequency OP184 Low power, low noise, and low frequency AD8655 5 V single-supply, low noise
and CIN or by the
IN
47.3
π
2
+
Nef
−23dB
2
 
 
)(
N
Rev. B | Page 16 of 24
Page 17
Data Sheet AD7988-1/AD7988-5
80
55
1 1k
FREQUENCY ( kHz )
PSRR (dB)
10 100
75
70
65
60
10231-034

VOLTAGE REFERENCE INPUT

The AD7988-x voltage reference input, REF, has a dynamic input impedance and should therefore be driven by a low impedance source with efficient decoupling between the REF and GND pins, as explained in the Layout section.
When REF is driven by a very low impedance source, for example, a reference buffer using the AD8031 or the AD8605, a ceramic chip capacitor is appropriate for optimum performance.
If an unbuffered reference voltage is used, the decoupling value depends on the reference used. For example, a 22 µF (X5R, 1206 size) ceramic chip capacitor is appropriate for optimum performance using a low temperature drift ADR43x reference.
If desired, a reference-decoupling capacitor value as small as
2.2 µF can be used with a minimal impact on performance, especially DNL.
Regardless, there is no need for an additional lower value ceramic decoupling capacitor (for example, 100 nF) between the REF and GND pins.

POWER SUPPLY

The AD7988-x uses two power supply pins: a core supply, VDD, and a digital input/output interface supply, VIO. VIO allows direct interface with any logic between 1.8 V and 5.0 V. To reduce the number of supplies needed, VIO and VDD can be tied together. The AD7988-x is independent of power supply sequencing between VIO and VDD. Additionally, it is very insensitive to power supply variations over a wide frequency range, as shown in Figure 33.
To ensure optimum performance, VDD should be roughly half of REF, the voltage reference input. For example, if REF is 5.0 V, VDD should be set to 2.5 V (±5%). If REF = 2.5V, and VDD =
2.5 V, performance is degraded as can be seen in Tab le 2. The AD7988-x powers down automatically at the end of each
conversion phase.

DIGITAL INTERFACE

Although the AD7988-x has a reduced number of pins, it offers flexibility in its serial interface modes.
CS
The AD7988-x, when in and digital hosts. This interface can use either a 3-wire or 4-wire interface. A 3-wire interface using the CNV, SCK, and SDO signals minimizes wiring connections and is useful, for instance, in isolated applications. A 4-wire interface using the SDI, CNV, SCK, and SDO signals allows CNV, which initiates the conversions, to be independent of the readback timing (SDI). This is useful in low jitter sampling or simultaneous sampling applications.
The AD7988-x, when in chain mode, provides a daisy-chain feature using the SDI input for cascading multiple ADCs on a single data line, similar to a shift register.
The mode in which the part operates depends on the SDI level when the CNV rising edge occurs. high, and chain mode is selected if SDI is low. The SDI hold time is such that when SDI and CNV are connected together, the chain mode is selected.
The user must time out the maximum conversion time prior to readback.
mode, is compatible with SPI, QSPI™,
CS
mode is selected if SDI is
Figure 33. PSRR vs. Frequency
Rev. B | Page 17 of 24
Page 18
AD7988-1/AD7988-5 Data Sheet
AD7988-1/ AD7988-5
SDO
DATA IN
DIGITAL HOST
CONVERT
CLK
VIO
CNV
SCK
SDI
10231-035
t
CONV
t
CYC
CNV
ACQUISITION ACQUISITION
t
ACQ
t
SCK
t
SCKL
CONVERSION
SCK
SDO D15 D14 D13 D1 D0
t
EN
t
HSDO
1 2 3 14 15 16
t
DSDO
t
DIS
t
SCKH
t
CNVH
SDI = 1
10231-036
CS MODE, 3-WIRE
This mode is typically used when a single AD7988-x is connected to an SPI-compatible digital host. The connection diagram is shown in Figure 34, and the corresponding timing is given in Figure 35.
With SDI tied to VIO, a rising edge on CNV initiates a conver­sion, selects the When the conversion is complete, the AD7988-x enters the acquisition phase and powers down.
CS
mode, and forces SDO to high impedance.
Figure 34. 3-Wire
CS
Mode Connection Diagram
When CNV goes low, the MSB is output onto SDO. The remaining data bits are then clocked by subsequent SCK falling edges. The data is valid on both SCK edges. Although the rising edge can be used to capture the data, a digital host using the SCK falling edge allows a faster reading rate, provided that it has an acceptable hold time. After the 16th SCK falling edge or when CNV goes high, whichever is earlier, SDO returns to high impedance.
Figure 35. 3-Wire
CS
Mode Serial Interface Timing (SDI High)
Rev. B | Page 18 of 24
Page 19
Data Sheet AD7988-1/AD7988-5
DIGITAL HOST
CONVERT
CLK
DATA IN
AD7988-1/ AD7988-5
SDO
CNV
SCK
AD7988-1/ AD7988-5
SDO
CNV
SCK
CS1
CS2
SDI SDI
10231-037
t
CONV
t
CYC
ACQUISITION
ACQUISITION
t
ACQ
t
SCK
t
SCKH
t
SCKL
CONVERSION
SCK
CNV
t
SSDICNV
t
HSDICNV
SDO
D15 D13D14 D1 D0 D15 D14 D1
D0
t
HSDO
t
EN
1 2 3 14 15 16 17 18 30 31 32
t
DSDO
t
DIS
SDI (CS1)
SDI (CS2)
10231-038
CS MODE 4-WIRE
This mode is typically used when multiple AD7988-x devices are connected to an SPI-compatible digital host.
A connection diagram example using two AD7988-x devices is shown in Figure 36, and the corresponding timing is given in Figure 37.
With SDI high, a rising edge on CNV initiates a conversion, selects the mode, CNV must be held high during the conversion phase and the subsequent data readback (if SDI and CNV are low, SDO is driven low). Prior to the minimum conversion time, SDI can be used to select other SPI devices, such as analog multiplexers, but SDI must be returned high before the minimum conversion time elapses and then held high for the maximum conversion time.
CS
mode, and forces SDO to high impedance. In this
When the conversion is complete, the AD7988-x enters the acquisition phase and powers down. Each ADC result can be read by bringing its SDI input low, which consequently outputs the MSB onto SDO. The remaining data bits are then clocked by subsequent SCK falling edges. The data is valid on both SCK edges. Although the rising edge can be used to capture the data, a digital host using the SCK falling edge allows a faster reading rate, provided that it has an acceptable hold time. After the 16th SCK falling edge or when SDI goes high, whichever is earlier, SDO returns to high impedance and another AD7988-x can be read.
CS
Figure 36. 4-Wire
Figure 37. 4-Wire
Mode Connection Diagram
CS
Mode Serial Interface Timing
Rev. B | Page 19 of 24
Page 20
AD7988-1/AD7988-5 Data Sheet
DIGITAL HOST
CONVERT
CLK
DATA IN
AD7988-1/ AD7988-5
SDO
CNV
A
SCK
AD7988-1/ AD7988-5
SDO
CNV
B
SCK
10231-039
SDISDI
t
CONV
t
CYC
t
SSDISCK
t
SCKL
t
SCK
t
HSDISCK
t
ACQ
ACQUISITION
t
SSCKCNV
ACQUISITION
t
SCKH
CONVERSION
t
HSCKCNV
SCK
CNV
SDO
B
t
EN
DA15 D
A
14 DA13
D
B
15 DB14 DB13 DB1 DB0 DA15 DA14 DA0DA1
D
A
1 DA0
t
HSDO
1 2 3 15 16 1714 18 30 31 32
t
DSDO
10231-040
SDIA = 0
SDO
A
= SDI
B

CHAIN MODE

This mode can be used to daisy-chain multiple AD7988-x devices on a 3-wire serial interface. This feature is useful for reducing component count and wiring connections, for example, in isolated multiconverter applications or for systems with a limited interfacing capacity. Data readback is analogous to clocking a shift register.
A connection diagram example using two AD7988-x devices is shown in Figure 38, and the corresponding timing is given in Figure 39.
When SDI and CNV are low, SDO is driven low. With SCK low, a rising edge on CNV initiates a conversion and selects the chain mode. In this mode, CNV is held high during the conversion
phase and the subsequent data readback. When the conversion is complete, the MSB is output onto SDO and the AD7988-x enters the acquisition phase and powers down. The remaining data bits stored in the internal shift register are clocked by subsequent SCK falling edges. For each ADC, SDI feeds the input of the internal shift register and is clocked by the SCK falling edge. Each ADC in the chain outputs its data MSB first, and 16 × N clocks are required to read back the N ADCs. The data is valid on both SCK edges. Although the rising edge can be used to capture the data, a digital host using the SCK falling edge allows a faster reading rate and, consequently, more
AD7988-x devices in the chain, provided that the digital host
has an acceptable hold time. The maximum conversion rate may be reduced due to the total readback time.
Figure 38. Chain Mode Connection Diagram
Figure 39. Chain Mode Serial Interface Timing
Rev. B | Page 20 of 24
Page 21
Data Sheet AD7988-1/AD7988-5
AD7988-1/ AD7988-5
SCK SDO CNV
SPI_CLK SPI_MISO SPI_MOSI
10231-041
BLACKFIN
DSP
SCK
SDO
CNV
TSCLK
DR
TFS
RFS
RSCLK
VDRIVE
AD7988-1/ AD7988-5
10231-045
BLACKFIN
DSP
AD7988-1/ AD7988-5
10231-043
10231-044

APPLICATIONS INFORMATION

INTERFACING TO BLACKFIN® DSP

The AD7988-x can easily connect to a DSP SPI or SPORT. The SPI configuration is straightforward, using the standard SPI interface as shown in Figure 40.
Figure 40. Typical Connection to Blackfin SPI Interface
Similarly, the SPORT interface can be used to interface to this ADC. The SPORT interface has some benefits in that it can use direct memory access (DMA) and provides a lower jitter CNV signal generated from a hardware counter.
Some glue logic may be required between SPORT and the
AD7988-x interface. The evaluation board for the AD7988-x
interfaces directly to the SPORT of the Blackfin-based (ADSP­BF-527) SDP board. The configuration used for the SPORT interface requires the addition of some glue logic as shown in Figure 41. The SCK input to the ADC was gated off when CNV was high to keep the SCK line static while converting the data, thereby ensuring the best integrity of the result. This approach uses an AND gate and a NOT gate for the SCK path. The other logic gates used on the RSCLK and RFS paths are for delay matching purposes and may not be necessary where path lengths are short.
This is one approach to using the SPORT interface for this ADC; there may be other solutions equal to this approach.
Using at least one ground plane is recommended. It can be common or split between the digital and analog section. In the latter case, join the planes underneath the AD7988-x devices.
The AD7988-x voltage reference input, REF, has a dynamic input impedance. Decouple REF with minimal parasitic inductances by placing the reference decoupling ceramic capacitor close to, but ideally right up against, the REF and GND pins and connect­ing them with wide, low impedance traces.
Finally, decouple the power supplies of the AD7988-x, VDD and VIO, with ceramic capacitors, typically 100 nF, placed close to the AD7988-x and connected using short and wide traces to provide low impedance paths and to reduce the effect of glitches on the power supply lines.
An example of a layout following these rules is shown in Figure 42 and Figure 43.
EVALUATING THE PERFORMANCE OF THE
AD7988-x
The evaluation board package for the AD7988-x (EVA L-AD7988-
5SDZ) includes a fully assembled and tested evaluation board,
documentation, and software for controlling the board from a PC via the EVA L-SDP-CB1Z.
Figure 41. Evaluation Board Connection to Blackfin Sport Interface

LAYOUT

Design the printed circuit board (PCB) that houses the AD7988-x so that the analog and digital sections are separated and confined to certain areas of the board. The pinout of the AD7988-x, with all the analog signals on the left side and all the digital signals on the right side, eases this task.
Avoid running digital lines under the device because these couple noise onto the die, unless a ground plane under the AD7988-x is used as a shield. Fast switching signals, such as CNV or clocks, should never run near analog signal paths. Avoid crossover of digital and analog signals.
Figure 42. Example Layout of the AD7988-x (Top Layer)
Figure 43. Example Layout of the AD7988-x (Bottom Layer)
Rev. B | Page 21 of 24
Page 22
AD7988-1/AD7988-5 Data Sheet
COMPLIANT TO JEDEC STANDARDS MO-187-BA
091709-A
6° 0°
0.70
0.55
0.40
5
10
1
6
0.50 BSC
0.30
0.15
1.10 MAX
3.10
3.00
2.90
COPLANARITY
0.10
0.23
0.13
3.10
3.00
2.90
5.15
4.90
4.65
PIN 1
IDENTIFIER
15° MAX
0.95
0.85
0.75
0.15
0.05
2.48
2.38
2.23
0.50
0.40
0.30
TOP VIEW
10
1
6
5
0.30
0.25
0.20
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.80
0.75
0.70
1.74
1.64
1.49
0.20 REF
0.05 MAX
0.02 NOM
0.50 BSC
EXPOSED
PAD
3.10
3.00 SQ
2.90
PIN 1
INDICATOR (R 0.15)
FOR PROP E R CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CO NFIGURATI ON AND FUNCTIO N DE S CRIPTIONS SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
02-27-2012-B

OUTLINE DIMENSIONS

Figure 44.10-Lead Mini Small Outline Package [MSOP]
(RM-10)
Dimensions shown in millimeters
Figure 45. 10-Lead Lead Frame Chip Scale Package [QFN (LFCSP_WD)]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-10-9)
Dimensions shown in millimeters
Rev. B | Page 22 of 24
Page 23
Data Sheet AD7988-1/AD7988-5
2

ORDERING GUIDE

Model1 Notes
Nonlinearity
AD7988-1BRMZ ±1.25 LSB max −40°C to +125°C Tube, 50 10-Lead MSOP RM-10 C7E AD7988-1BRMZ-RL7 ±1.25 LSB max −40°C to +125°C Reel, 1,000 10-Lead MSOP RM-10 C7E AD7988-1BCPZ-RL ±1.25 LSB max −40°C to +125°C Reel, 5,000 10-Lead QFN (LFCSP_WD) CP-10-9 C7X AD7988-1BCPZ-RL7 ±1.25 LSB max −40°C to +125°C Reel, 1,500 10-Lead QFN (LFCSP_WD) CP-10-9 C7X AD7988-5BRMZ ±1.25 LSB max −40°C to +125°C Tube, 50 10-Lead MSOP RM-10 C7Q AD7988-5BRMZ-RL7 ±1.25 LSB max −40°C to +125°C Reel, 1,000 10-Lead MSOP RM-10 C7Q AD7988-5BCPZ-RL ±1.25 LSB max −40°C to +125°C Reel, 5,000 10-Lead QFN (LFCSP_WD) CP-10-9 C7Y AD7988-5BCPZ-RL7 ±1.25 LSB max −40°C to +125°C Reel, 1,500 10-Lead QFN (LFCSP_WD) CP-10-9 C7Y
Integral
EVAL-AD7988-5SDZ
EVAL-SDP-CB1Z
1
Z = RoHS Compliant Part.
2
This board can be used as a standalone evaluation board or in conjunction with the EVAL-SDZ-CB1Z for evaluation/demonstration purposes.
3
This board allows a PC to control and communicate with all Analog Devices evaluation boards ending in the SD designator.
3
Evaluation Board with AD7988-5
System Demonstration Board, Used as a
Temperature Range
Ordering Quantity Package Description
Populated; Use for Evaluation of Both AD7988-1 and AD7988-5.
Controller Board for Data Transfer via USB Interface to PC.
Package Option Branding
Rev. B | Page 23 of 24
Page 24
AD7988-1/AD7988-5 Data Sheet
©2012 Analog Devices, Inc. All rights reserved. Trademarks and
NOTES
registered trademarks are the property of their respective owners. D10231-0-5/12(B)
Rev. B | Page 24 of 24
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