16-bit resolution with no missing codes
Throughput: 100 kSPS/500 kSPS options
INL: ±0.6 LSB typical, ±1.25 LSB maximum
SINAD: 91.5 dB @ 10 kHz
THD: −114 dB @ 10 kHz
Pseudo differential analog input range
0 V to V
Any input range and easy to drive with the ADA4841-1
No pipeline delay
Single-supply 2.5 V operation with 1.8 V/2.5 V/3 V/5 V
logic interface
SPI-/QSPI-/MICROWIRE™-/DSP-compatible serial interface
Daisy-chain multiple ADCs
10-lead MSOP and 10-lead, 3 mm × 3 mm LFCSP (QFN),
same space as SOT-23
Wide operating temperature range: −40°C to +125°C
APPLICATIONS
Battery-powered equipment
Low power data acquisition systems
Portable medical instruments
ATE equipment
Data acquisitions
Communications
with V
REF
from 2.5 V to 5.5 V
REF
16-Bit Lower Power
GENERAL DESCRIPTION
The AD7988-1/AD7988-5 are 16-bit, successive approximation,
analog-to-digital converters (ADC) that operate from a single
power supply, VDD. The AD7988-1 offers a 100 kSPS throughput,
and the AD7988-5offers a 500 kSPS throughput. They are low
power, 16-bit sampling ADCs with a versatile serial interface
port. On the CNV rising edge, they sample an analog input,
IN+, between 0 V to V
The reference voltage, REF, is applied externally and can be set
independent of the supply voltage, VDD.
The SPI-compatible serial interface also features the ability to
daisy-chain several ADCs on a single 3-wire bus using the SDI
input. It is compatible with 1.8 V, 2.5 V, 3 V, or 5 V logic using
the separate supply, VIO.
The AD7988-1/AD7988-5 generics are housed in a 10-lead
MSOP or a 10-lead LFCSP (QFN) with operation specified
from −40°C to +125°C.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Figure 1.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 www.analog.com
Page 2
AD7988-1/AD7988-5 Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Changes to Ordering Guide .......................................................... 23
2/12—Revision 0: Initial Ve rs i on
Rev. B | Page 2 of 24
Page 3
Data Sheet AD7988-1/AD7988-5
Absolute Input Voltage
IN+
−0.1 V
+ 0.1
V
Integral Linearity Error
V
= 5 V
−1.25
±0.6
+1.25
LSB1
Gain Error Temperature Drift
±0.35
ppm/°C
Transient Response
Full-scale step
500
ns
fIN = 10 kHz, V
= 2.5 V
87.0 dB3
SPECIFICATIONS
VDD = 2.5 V, VIO = 2.3 V to 5.5 V, V
Table 2.
Parameter Test Conditions/Comments Min Typ Max Unit
RESOLUTION 16 Bits
ANALOG INPUT
Voltage Range IN+ − IN− 0 V
IN− −0.1 +0.1 V
Analog Input CMRR fIN = 1 kHz 60 dB
Leakage Current at 25°C Acquisition phase 1 nA
Input Impedance See the Analog Inputs section
ACCURACY
No Missing Codes 16 Bits
Differential Linearity Error V
V
V
Transition Noise V
V
Gain Error, T
MIN
2
to T
±2 LSB1
MAX
= 5 V, TA = –40°C to +125°C, unless otherwise noted.
REF
REF
REF
= 5 V −0.9 ±0.4 +0.9 LSB1
REF
= 2.5 V ±0.55 LSB1
REF
REF
= 2.5 V ±0.65 LSB1
REF
= 5 V 0.6 LSB1
REF
= 2.5 V 1.0 LSB1
REF
V
Zero Error, T
MIN
2
to T
−0.5 ±0.08 +0.5 mV
MAX
Zero Temperature Drift 0.54 ppm/°C
Power Supply Sensitivity
VDD = 2.5 V ± 5%
±0.1 LSB1
THROUGHPUT
AD7988-1
Conversion Rate
VIO ≥ 2.3 V up to 85°C, VIO ≥ 3.3 V above 85°C up to
0 100 kSPS
125°C
AD7988-5
Conversion Rate
VIO ≥ 2.3 V up to 85°C, VIO ≥ 3.3 V above 85°C up to
0 500 kSPS
125°C
Transient Response Full-scale step 400 ns
AC ACCURACY
Dynamic Range V
V
= 5 V 92 dB3
REF
= 2.5 V 87 dB3
REF
Oversampled Dynamic Range fO = 10 kSPS 111 dB3
Signal-to-Noise Ratio, SNR fIN = 10 kHz, V
fIN = 10 kHz, V
= 5 V 90 91 dB3
REF
= 2.5 V 86.5 dB3
REF
Spurious-Free Dynamic Range, SFDR fIN = 10 kHz −110 dB3
Total Harmonic Distortion, THD fIN = 10 kHz −114 dB3
Signal-to-(Noise + Distortion), SINAD fIN = 10 kHz, V
1
LSB means least significant bit. With the 5 V input range, 1 LSB is 76.3 µV.
2
See the Terminology section. These specifications include full temperature range variation, but not the error contribution from the external reference.
3
All specifications in dB are referred to a full-scale input FSR. Tested with an input signal at 0.5 dB below full scale, unless otherwise specified.
= 5 V 91.5 dB3
REF
REF
Rev. B | Page 3 of 24
Page 4
AD7988-1/AD7988-5 Data Sheet
POWER SUPPLIES
AD7988-1 Power Dissipation
10 kSPS throughput
70 µW
VDD = 2.5 V, VIO = 2.3 V to 5.5 V, V
Table 3.
Parameter Test Conditions/Comments Min Typ Max Unit
REFERENCE
Voltage Range 2.4 5.1 V
Load Current V
SAMPLING DYNAMICS
−3 dB Input Bandwidth 10 MHz
Aperture Delay VDD = 2.5 V 2.0 ns
DIGITAL INPUTS
Logic Levels
VIL VIO > 3 V –0.3 0.3 × VIO V
VIH VIO > 3 V 0.7 × VIO VIO + 0.3 V
VIL VIO ≤ 3 V –0.3 0.1 × VIO V
VIH VIO ≤ 3 V 0.9 × VIO VIO + 0.3 V
IIL −1 +1 µA
IIH −1 +1 µA
DIGITAL OUTPUTS
Data Format Serial 16 bits straight binary
Pipeline Delay
VOL I
VOH I
= 5 V, TA = –40°C to +125°C, unless otherwise noted.
REF
= 5 V 250 µA
REF
Conversion results available immediately
after completed conversion
= 500 µA 0.4 V
SINK
= −500 µA VIO − 0.3 V
SOURCE
VDD 2.375 2.5 2.625 V
VIO Specified performance 2.3 5.5 V
VIO Range 1.8 5.5 V
Standby Current
1, 2
VDD and VIO = 2.5 V, 25°C 0.35 nA
100 kSPS throughput 700 µW
1 mW
AD7988-5 Power Dissipation 500 kSPS throughput 3.5 5 mW
Energy per Conversion 7.0 nJ/sample
TEMPERATURE RANGE
Specified Performance T
1
With all digital inputs forced to VIO or GND as required.
2
During the acquisition phase.
MIN
to T
−40 +125 °C
MAX
Rev. B | Page 4 of 24
Page 5
Data Sheet AD7988-1/AD7988-5
AD7988-5
SCK Period (Chain Mode)
t
SCK High Time
t
4.5
ns
SDI Valid Setup Time from CNV Rising Edge
t
5
ns
TIMING SPECIFICATIONS
VDD = 2.37 V to 2.63 V, VIO = 3.3 V to 5.5 V, −40°C to +125°C unless otherwise stated. See Figure 2 and Figure 3 for load conditions.
Table 4.
Parameter Symbol Min Typ Max Unit
AD7988-1
Throughput Rate 100 kHz
Conversion Time: CNV Rising Edge to Data Available t
Acquisition Time t
Time Between Conversions t
Throughput Rate 500 kHz
Conversion Time: CNV Rising Edge to Data Available t
Acquisition Time t
Time Between Conversions t
CNV Pulse Width (CS Mode)
SCK Period (CS Mode)
VIO Above 4.5 V 10.5 ns
VIO Above 3 V 12 ns
VIO Above 2.7 V 13 ns
VIO Above 2.3 V 15 ns
VIO Above 4.5 V 11.5 ns
VIO Above 3 V 13 ns
VIO Above 2.7 V 14 ns
VIO Above 2.3 V 16 ns
SCK Low Time t
SCK Falling Edge to Data Remains Valid t
SCK Falling Edge to Data Valid Delay t
VIO Above 4.5 V 9.5 ns
VIO Above 3 V 11 ns
VIO Above 2.7 V 12 ns
VIO Above 2.3 V 14 ns
CNV or SDI Low to SDO D15 MSB Valid (CS Mode)
VIO Above 3 V 10 ns
VIO Above 2.3V 15 ns
CNV or SDI High or Last SCK Falling Edge to SDO High Impedance (CS Mode)
SDI Valid Hold Time from CNV Rising Edge (CS Mode)
SDI Valid Hold Time from CNV Rising Edge (Chain Mode) t
SCK Valid Setup Time from CNV Rising Edge (Chain Mode) t
SCK Valid Hold Time from CNV Rising Edge (Chain Mode) t
SDI Valid Setup Time from SCK Falling Edge (Chain Mode) t
SDI Valid Hold Time from SCK Falling Edge (Chain Mode) t
9.5 μs
CONV
500 ns
ACQ
10 μs
CYC
1.6 μs
CONV
400 ns
ACQ
2 μs
CYC
t
500 ns
CNVH
t
SCK
SCK
4.5 ns
SCKL
SCKH
3 ns
HSDO
DSDO
t
EN
t
20 ns
DIS
SSDICNV
t
2 ns
HSDICNV
0 ns
HSDICNV
5 ns
SSCKCNV
5 ns
HSCKCNV
2 ns
SSDISCK
3 ns
HSDISCK
Rev. B | Page 5 of 24
Page 6
AD7988-1/AD7988-5 Data Sheet
500µAI
OL
500µAI
OH
1.4V
TO SDO
C
L
20pF
10231-002
X% VIO
1
Y% VIO
1
V
IH
2
V
IL
2
V
IL
2
V
IH
2
t
DELAY
t
DELAY
1
FOR VIO ≤ 3.0V, X = 90 AND Y = 10; FOR VIO > 3.0V X = 70, AND Y = 30.
2
MINIMUM V
IH
AND MAXIMUM VIL USED. SEE DIGITAL INPUTS
SPECIFICATIONS IN TABLE 3.
10231-003
Figure 2. Load Circuit for Digital Interface Timing
Figure 3. Voltage Levels for Timing
Rev. B | Page 6 of 24
Page 7
Data Sheet AD7988-1/AD7988-5
IN+,1 IN−1 to GND
−0.3 V to V
+ 0.3 V or ±130 mA
Digital Outputs to GND
−0.3 V to VIO + 0.3 V
θJC Thermal Impedance
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
Analog Inputs
REF
Supply Voltage
REF, VIO to GND −0.3 V to +6 V
VDD to GND −0.3 V to +3 V
VDD to VIO +3 V to −6 V
Digital Inputs to GND −0.3 V to VIO + 0.3 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Storage Temperature Range −65°C to +125°C
Junction Temperature 150°C
θJA Thermal Impedance
10-Lead MSOP 200°C/W
10-Lead LFCSP 80°C/W
10-Lead MSOP 44°C/W
10-Lead LFCSP 15°C/W
Reflow Soldering JEDEC Standard (J-STD-020)
1
See the Analog Inputs section.
ESD CAUTION
Rev. B | Page 7 of 24
Page 8
AD7988-1/AD7988-5 Data Sheet
REF
1
VDD
2
IN+
3
IN–
4
GND
5
VIO
10
SDI
9
SCK
8
SDO
7
CNV
6
10231-004
AD7988-1/
AD7988-5
TOP VIEW
(Not to Scale)
NOTES
1. THE EXPOSED P
AD CAN BE CONNECTED TO GND.
1REF
2VDD
3IN+
4IN–
5GND
10 VIO
9 SDI
8 SCK
7 SDO
6 CNV
10231-005
AD7988-1/
AD7988-5
TO
P VI
EW
(Not to Scale)
6
CNV
DI
9
SDI
DI
Serial Data Input. This input provides multiple features. It selects the interface mode of the ADC as
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 4. 10-Lead MSOP Pin Configuration
Figure 5. 10-Lead LFCSP (QFN) Pin Configuration
Table 6. Pin Function Descriptions
Pin No. Mnemonic Type1 Description
1 REF AI
Reference Input Voltage. The V
range is from 2.4 V to 5.1 V. It is referred to the GND pin. The GND pin
REF
should be decoupled closely to the REF pin with a 10 µF capacitor.
2 VDD P Power Supply.
3 IN+ AI
Analog Input. It is referred to IN−. The voltage range, for example, the difference between IN+ and IN−, is
REF
.
0 V to V
4 IN− AI Analog Input Ground Sense. Connect to the analog ground plane or to a remote sense ground.
5 GND P Power Supply Ground.
Convert Input. This input has multiple functions. On its leading edge, it initiates the conversions and
selects the interface mode of the part: chain mode or
CS mode. In CS mode, the SDO pin is enabled when
CNV is low. In chain mode, the data should be read when CNV is high.
7 SDO DO Serial Data Output. The conversion result is output on this pin. It is synchronized to SCK.
8 SCK DI Serial Data Clock Input. When the part is selected, the conversion result is shifted out by this clock.
follows:
Chain mode is selected if this pin is low during the CNV rising edge. In this mode, SDI is used as a data
input to daisy-chain the conversion results of two or more ADCs onto a single SDO line. The digital data
level on SDI is output on SDO with a delay of 16 SCK cycles.
CS mode is selected if SDI is high during the CNV rising edge. In this mode, either SDI or CNV can enable
the serial output signals when low.
10 VIO P
Input/Output Interface Digital Power. Nominally at the same supply as the host interface (1.8 V, 2.5 V, 3 V,
or 5 V).
EP Exposed Pad. The exposed pad can be connected to GND.
1
AI = analog input, DI = digital input, DO = digital output, and P = power.
Rev. B | Page 8 of 24
Page 9
Data Sheet AD7988-1/AD7988-5
TERMINOLOGY
Integral Nonlinearity Error (INL)
INL refers to the deviation of each individual code from a line
drawn from negative full scale through positive full scale. The
point used as negative full scale occurs ½ LSB before the first
code transition. Positive full scale is defined as a level 1½ LSB
beyond the last code transition. The deviation is measured from
the middle of each code to the true straight line (see Figure 30).
Differential Nonlinearity Error (DNL)
In an ideal ADC, code transitions are 1 LSB apart. DNL is the
maximum deviation from this ideal value. It is often specified in
terms of resolution for which no missing codes are guaranteed.
Offset Error
The first transition should occur at a level ½ LSB above analog
ground (38.1 µV for the 0 V to 5 V range). The offset error is
the deviation of the actual transition from that point.
Gain Error
The last transition (from 111 … 10 to 111 … 11) should
occur for an analog voltage 1½ LSB below the nominal full
scale (4.999886 V for the 0 V to 5 V range). The gain error is
the deviation of the actual level of the last transition from the
ideal level after the offset is adjusted out.
Spurious-Free Dynamic Range (SFDR)
SFDR is the difference, in decibels (dB), between the rms
amplitude of the input signal and the peak spurious signal.
Effective Number of Bits (ENOB)
ENOB is a measurement of the resolution with a sine wave
input. It is related to SINAD by the following formula:
ENOB = (SINAD
− 1.76)/6.02
dB
and is expressed in bits.
Noise-Free Code Resolution
Noise-free code resolution is the number of bits beyond which
it is impossible to distinctly resolve individual codes. It is
calculated as
Noise-Free Code Resolution = log
(2N/Peak-to-Peak Noise)
2
and is expressed in bits.
Effective Resolution
Effective resolution is calculated as
Effective Resolution = log
(2N/RMS Input Noise)
2
and is expressed in bits.
Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of the first five harmonic
components to the rms value of a full-scale input signal and is
expressed in dB.
Dynamic Range
Dynamic range is the ratio of the rms value of the full scale to
the total rms noise measured with the inputs shorted together.
The value for dynamic range is expressed in dB. It is measured
with a signal at −60 dBFS to include all noise sources and DNL
artifacts.
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the rms value of the actual input signal to the
rms sum of all other spectral components below the Nyquist
frequency, excluding harmonics and dc. The value for SNR is
expressed in dB.
Signal-to-(Noise + Distortion) Ratio (SINAD)
SINAD is the ratio of the rms value of the actual input signal to
the rms sum of all other spectral components below the Nyquist
frequency, including harmonics but excluding dc. The value for
SINAD is expressed in dB.
Aperture Delay
Aperture delay is the measure of the acquisition performance. It
is the time between the rising edge of the CNV input and when
the input signal is held for a conversion.
Transient Response
Transient response is the time required for the ADC to
accurately acquire its input after a full-scale step function is
applied.
Figure 15. Histogram of a DC Input at the Code Transition, V
Figure 16. SNR, SINAD, and ENOB vs. Reference Voltage
= 2.5 V
REF
Figure 14. Histogram of a DC Input at the Code Center, V
= 5 V
REF
Figure 17. Histogram of a DC Input at the Code Center, V
= 2.5 V
REF
Rev. B | Page 11 of 24
Page 12
AD7988-1/AD7988-5 Data Sheet
95
85
87
89
92
91
93
94
86
88
90
INPUT LEVEL (dB OF FULL SCALE)
SNR (dB)
–10 –9–8–7–6–5–4–3–2–10
10231-018
–95
–125
–110
–115
–105
–100
–120
115
85
100
95
105
110
90
REFERENCE VOLTAGE (V)
THD (dB)
SFDR (dB)
THD
SFDR
2.252.753.253.754.254.755.25
10231-019
100
80
101k
FREQUENCY ( kHz )
SINAD (dB)
95
90
85
100
10231-052
10231-053
95
85
89
87
91
93
–55125
TEMPERATURE (°C)
SNR (dB)
–35 –15525658545105
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
VDD VOLTAGE (V)
I
VDD
I
REF
I
VIO
CURRENT (mA)
2.3752.4252.4752.5252.5752.625
10231-023
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0
VDD VOLTAGE (V)
I
VDD
I
REF
I
VIO
CURRENT (mA)
2.3752.4252.4752.5252.5752.625
10231-024
Figure 18. SNR vs. Input Level
Figure 19. THD, SFDR vs. Reference Voltage
Figure 21. SNR vs. Temperature
Figure 22. Operating Currents vs. Supply (AD7988-5)
Figure 20. SINAD vs. Frequency
Figure 23. Operating Currents vs. Supply (AD7988-1)
Rev. B | Page 12 of 24
Page 13
Data Sheet AD7988-1/AD7988-5
10231-054
–85
–125
101k
FREQUENCY ( kHz )
THD (dB)
100
–90
–95
–100
–105
–110
–115
–120
–110
–120
THD (dB)
TEMPERATURE (°C)
–112
–114
–116
–118
–55 –35–15525456585105 125
10231-026
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
CURRENT (mA)
I
VDD
I
REF
I
VIO
TEMPERATURE (°C)
–55 –35–15525456585105125
10231-027
0.14
0.12
0.10
008
0.06
0.04
0.02
0
CURRENT (mA)
I
VDD
I
REF
I
VIO
TEMPERATURE (°C)
–55 –35–15525456585105 125
10231-028
8
7
6
5
4
3
2
1
0
CURRENT (µA)
TEMPERATURE (°C)
I
VDD
+ I
VIO
–55 –35–15525456585105 125
10231-029
Figure 24. THD vs. Frequency
Figure 25. THD vs. Temperature
Figure 27. Operating Currents vs. Temperature (AD7988-1)
Figure 28. Power-Down Currents vs. Temperature
Figure 26. Operating Currents vs. Temperature (AD7988-5)
Rev. B | Page 13 of 24
Page 14
AD7988-1/AD7988-5 Data Sheet
COMP
SWITCHE S CONTROL
BUSY
OUTPUT CODE
CNV
CONTROL
LOGIC
SW+LSB
SW–LSB
IN+
REF
GND
IN–
MSB
MSB
CC4C2C16,384C
32,768C
CC4C2C16,384C32,768C
10231-030
THEORY OF OPERATION
Figure 29. ADC Simplified Schematic
CIRCUIT INFORMATION
The AD7988-1/AD7988-5 devices are fast, low power, single-
supply, precise 16-bit ADCs that use a successive approximation
architecture.
The AD7988-1 is capable of converting 100,000 samples per
second (100 kSPS), whereas the AD7988-5 is capable of a
throughput of 500 kSPS, and they power down between
conversions. When operating at 10 kSPS, for example, the
ADC consumes 70 µW typically, ideal for battery-powered
applications.
The AD7988-x provides the user with on-chip track-and-hold
and does not exhibit any pipeline delay or latency, making it
ideal for multiple multiplexed channel applications.
The AD7988-x can be interfaced to any 1.8 V to 5 V digital logic
family. It is housed in a 10-lead MSOP or a tiny 10-lead LFCSP
(QFN) that combines space savings and allows flexible
configurations.
CONVERTER OPERATION
The AD7988-xis a successive approximation ADC based on a
charge redistribution DAC. Figure 29 shows the simplified
schematic of the ADC. The capacitive DAC consists of two
identical arrays of 16 binary weighted capacitors, which are
connected to the two comparator inputs.
During the acquisition phase, terminals of the array tied to the
comparator’s input are connected to GND via SW+ and SW−.
All independent switches are connected to the analog inputs.
Therefore, the capacitor arrays are used as sampling capacitors
and acquire the analog signal on the IN+ and IN− inputs. When
the acquisition phase is completed and the CNV input goes high, a
conversion phase is initiated. When the conversion phase begins,
SW+ and SW− are opened first. The two capacitor arrays are then
disconnected from the inputs and connected to the GND input.
Therefore, the differential voltage between the IN+ and IN−
inputs captured at the end of the acquisition phase are applied
to the comparator inputs, causing the comparator to become
unbalanced. By switching each element of the capacitor array
between GND and REF, the comparator input varies by binary
weighted voltage steps (V
REF
/2, V
/4 … V
REF
/65,536). The
REF
control logic toggles these switches, starting with the MSB, to
bring the comparator back into a balanced condition. After the
completion of this process, the part returns to the acquisition phase
and the control logic generates the ADC output code.
Because the AD7988-x has an on-board conversion clock, the
serial clock, SCK, is not required for the conversion process.
Rev. B | Page 14 of 24
Page 15
Data Sheet AD7988-1/AD7988-5
000 ... 000
000 ... 001
000 ... 010
111 ... 101
111 ... 110
111 ... 111
–FSR –FS R + 1LSB
–FSR + 0.5LS B
+FSR – 1 LSB
+FSR – 1.5 LS B
ANALOG INP UT
ADC CODE (STRAI GHT BINARY)
10231-031
AD7988-1/
AD7988-5
2.5VV+
20Ω
V+
V–
0V TO V
REF
1.8V TO 5.5V
100nF
10µF
2
2.7nF
4
3
100nF
REF
IN+
IN–
VDDVIO
GND
3- OR 4-WI RE INTERFACE
5
REF
1
1
SEE THE VOLTAGE REFERENCE INPUT SECTION FOR REFERENCE SELECTION.
2
C
REF
IS USUALL Y A 10µ F CERAMIC CAPACI TOR (X5R).
3
SEE THE DRIVER AMPLIFIER CHOICE SECTION.
4
OPTIONAL FILTER. SEE THE ANALOG INPUTS SECTION.
5
SEE THE DIGITAL INTERFACE SECTION FOR THE MOST CONVENIENT INTERFACE MODE.
10231-032
CNV
SCK
SDO
SDI
Transfer Functions
The ideal transfer characteristic for the AD7988-x is shown in
Figure 30 and Table 7.
Figure 30. ADC Ideal Transfer Function
Table 7. Output Codes and Ideal Input Voltages
Analog Input
Description V
= 5 V Digital Output Code (Hex)
REF
FSR – 1 LSB 4.999924 V FFFF1
Midscale + 1 LSB 2.500076 V 8001
Midscale 2.5 V 8000
Midscale – 1 LSB 2.499924 V 7FFF
–FSR + 1 LSB 76.3 µV 0001
–FSR 0 V 00002
1
This is also the code for an overranged analog input (V
2
This is also the code for an underranged analog input (V
− V
above V
IN+
IN−
− V
IN+
below V
IN−
− V
REF
GND
GND
TYPICAL CONNECTION DIAGRAM
Figure 31 shows an example of the recommended connection
diagram for the AD7988-x when multiple supplies are available.
).
).
Figure 31. Typical Application Diagram with Multiple Supplies
Rev. B | Page 15 of 24
Page 16
AD7988-1/AD7988-5 Data Sheet
REF
R
IN
C
IN
IN+
OR IN–
GND
D2C
PIN
D1
10231-033
AD8605, AD8615
5 V single-supply, low power
ANALOG INPUTS
Figure 32 shows an equivalent circuit of the input structure of
the AD7988-x.
The two diodes, D1 and D2, provide ESD protection for the
analog inputs, IN+ and IN−. Care must be taken to ensure that
the analog input signal never exceeds the supply rails by more
than 0.3 V, because this causes these diodes to become forwardbiased and start conducting current. These diodes can handle a
forward-biased current of 130 mA maximum. For instance,
these conditions may eventually occur when the input buffer’s
supplies are different from VDD. In such a case (for example, an
input buffer with a short circuit), the current limitation can be
used to protect the part.
Figure 32. Equivalent Analog Input Circuit
The analog input structure allows the sampling of the true
differential signal between IN+ and IN−. By using these
differential inputs, signals common to both inputs are rejected.
During the acquisition phase, the impedance of the analog
inputs (IN+ and IN−) can be modeled as a parallel combination of
Capacitor C
R
and CIN. C
IN
and the network formed by the series connection of
PIN
is primarily the pin capacitance. RIN is typically
PIN
400 Ω and is a lumped component made up of serial resistors
and the on resistance of the switches. C
is typically 30 pF and
IN
is mainly the ADC sampling capacitor. During the conversion
phase, when the switches are opened, the input impedance is
limited to C
. RIN and CIN make a one-pole, low-pass filter that
PIN
reduces undesirable aliasing effects and limits the noise.
When the source impedance of the driving circuit is low, the
AD7988-x can be driven directly. Large source impedances
significantly affect the ac performance, especially THD. The dc
performances are less sensitive to the input impedance. The
maximum source impedance depends on the amount of THD
that can be tolerated. The THD degrades as a function of the
source impedance and the maximum input frequency.
DRIVER AMPLIFIER CHOICE
Although the AD7988-x is easy to drive, the driver amplifier
needs to meet the following requirements:
•The noise generated by the driver amplifier must be kept as
low as possible to preserve the SNR and transition noise
performance of the AD7988-x. The noise coming from the
driver is filtered by the AD7988-x analog input circuit’s
one-pole, low-pass filter made by R
external filter, if one is used. Because the typical noise of
the AD7988-x is 47.3 µV rms, the SNR degradation due to
the amplifier is
SNR
LOSS
log20
=
47.3
where:
f
is the input bandwidth in MHz of the AD7988-x
–3dB
(10 MHz) or the cutoff frequency of the input filter, if
one is used.
N is the noise gain of the amplifier (for example, 1 in buffer
configuration).
e
is the equivalent input noise voltage of the op amp,
N
in nV/√Hz.
•For ac applications, the driver should have a THD
performance commensurate with the AD7988-x.
•For multichannel multiplexed applications, the driver ampli-
fier and the AD7988-x analog input circuit must settle for
a full-scale step onto the capacitor array at a 16-bit level
(0.0015%, 15 ppm). In the amplifier data sheet, settling at
0.1% to 0.01% is more commonly specified. This may
differ significantly from the settling time at a 16-bit level
and should be verified prior to driver selection.
Table 8. Recommended Driver Amplifiers
Amplifier Typical Application
ADA4841-1 Very low noise, small size, and low power
AD8021 Very low noise and high frequency
AD8022 Low noise and high frequency
OP184 Low power, low noise, and low frequency
AD8655 5 V single-supply, low noise
and CIN or by the
IN
47.3
π
2
+
Nef
−23dB
2
)(
N
Rev. B | Page 16 of 24
Page 17
Data Sheet AD7988-1/AD7988-5
80
55
11k
FREQUENCY ( kHz )
PSRR (dB)
10100
75
70
65
60
10231-034
VOLTAGE REFERENCE INPUT
The AD7988-x voltage reference input, REF, has a dynamic
input impedance and should therefore be driven by a low
impedance source with efficient decoupling between the REF
and GND pins, as explained in the Layout section.
When REF is driven by a very low impedance source, for example,
a reference buffer using the AD8031 or the AD8605, a ceramic
chip capacitor is appropriate for optimum performance.
If an unbuffered reference voltage is used, the decoupling value
depends on the reference used. For example, a 22 µF (X5R,
1206 size) ceramic chip capacitor is appropriate for optimum
performance using a low temperature drift ADR43x reference.
If desired, a reference-decoupling capacitor value as small as
2.2 µF can be used with a minimal impact on performance,
especially DNL.
Regardless, there is no need for an additional lower value ceramic
decoupling capacitor (for example, 100 nF) between the REF
and GND pins.
POWER SUPPLY
The AD7988-x uses two power supply pins: a core supply, VDD,
and a digital input/output interface supply, VIO. VIO allows
direct interface with any logic between 1.8 V and 5.0 V. To
reduce the number of supplies needed, VIO and VDD can be
tied together. The AD7988-x is independent of power supply
sequencing between VIO and VDD. Additionally, it is very
insensitive to power supply variations over a wide frequency
range, as shown in Figure 33.
To ensure optimum performance, VDD should be roughly half
of REF, the voltage reference input. For example, if REF is 5.0 V,
VDD should be set to 2.5 V (±5%). If REF = 2.5V, and VDD =
2.5 V, performance is degraded as can be seen in Tab le 2.
The AD7988-x powers down automatically at the end of each
conversion phase.
DIGITAL INTERFACE
Although the AD7988-x has a reduced number of pins, it offers
flexibility in its serial interface modes.
CS
The AD7988-x, when in
and digital hosts. This interface can use either a 3-wire or 4-wire
interface. A 3-wire interface using the CNV, SCK, and SDO
signals minimizes wiring connections and is useful, for
instance, in isolated applications. A 4-wire interface using the
SDI, CNV, SCK, and SDO signals allows CNV, which initiates
the conversions, to be independent of the readback timing
(SDI). This is useful in low jitter sampling or simultaneous
sampling applications.
The AD7988-x, when in chain mode, provides a daisy-chain
feature using the SDI input for cascading multiple ADCs on a
single data line, similar to a shift register.
The mode in which the part operates depends on the SDI level
when the CNV rising edge occurs.
high, and chain mode is selected if SDI is low. The SDI hold
time is such that when SDI and CNV are connected together,
the chain mode is selected.
The user must time out the maximum conversion time prior to
readback.
mode, is compatible with SPI, QSPI™,
CS
mode is selected if SDI is
Figure 33. PSRR vs. Frequency
Rev. B | Page 17 of 24
Page 18
AD7988-1/AD7988-5 Data Sheet
AD7988-1/
AD7988-5
SDO
DATA IN
DIGITAL HOST
CONVERT
CLK
VIO
CNV
SCK
SDI
10231-035
t
CONV
t
CYC
CNV
ACQUISITIONACQUISITION
t
ACQ
t
SCK
t
SCKL
CONVERSION
SCK
SDOD15D14D13D1D0
t
EN
t
HSDO
123141516
t
DSDO
t
DIS
t
SCKH
t
CNVH
SDI = 1
10231-036
CS MODE, 3-WIRE
This mode is typically used when a single AD7988-x is
connected to an SPI-compatible digital host. The connection
diagram is shown in Figure 34, and the corresponding timing is
given in Figure 35.
With SDI tied to VIO, a rising edge on CNV initiates a conversion, selects the
When the conversion is complete, the AD7988-xenters the
acquisition phase and powers down.
CS
mode, and forces SDO to high impedance.
Figure 34. 3-Wire
CS
Mode Connection Diagram
When CNV goes low, the MSB is output onto SDO. The remaining
data bits are then clocked by subsequent SCK falling edges. The
data is valid on both SCK edges. Although the rising edge can
be used to capture the data, a digital host using the SCK falling
edge allows a faster reading rate, provided that it has an acceptable
hold time. After the 16th SCK falling edge or when CNV goes
high, whichever is earlier, SDO returns to high impedance.
Figure 35. 3-Wire
CS
Mode Serial Interface Timing (SDI High)
Rev. B | Page 18 of 24
Page 19
Data Sheet AD7988-1/AD7988-5
DIGITAL HOST
CONVERT
CLK
DATA IN
AD7988-1/
AD7988-5
SDO
CNV
SCK
AD7988-1/
AD7988-5
SDO
CNV
SCK
CS1
CS2
SDISDI
10231-037
t
CONV
t
CYC
ACQUISITION
ACQUISITION
t
ACQ
t
SCK
t
SCKH
t
SCKL
CONVERSION
SCK
CNV
t
SSDICNV
t
HSDICNV
SDO
D15D13D14D1D0D15D14D1
D0
t
HSDO
t
EN
1231415161718303132
t
DSDO
t
DIS
SDI (CS1)
SDI (CS2)
10231-038
CS MODE 4-WIRE
This mode is typically used when multiple AD7988-x devices
are connected to an SPI-compatible digital host.
A connection diagram example using two AD7988-x devices is
shown in Figure 36, and the corresponding timing is given in
Figure 37.
With SDI high, a rising edge on CNV initiates a conversion,
selects the
mode, CNV must be held high during the conversion phase and
the subsequent data readback (if SDI and CNV are low, SDO is
driven low). Prior to the minimum conversion time, SDI can be
used to select other SPI devices, such as analog multiplexers,
but SDI must be returned high before the minimum conversion
time elapses and then held high for the maximum conversion time.
CS
mode, and forces SDO to high impedance. In this
When the conversion is complete, the AD7988-xenters the
acquisition phase and powers down. Each ADC result can
be read by bringing its SDI input low, which consequently
outputs the MSB onto SDO. The remaining data bits are then
clocked by subsequent SCK falling edges. The data is valid on
both SCK edges. Although the rising edge can be used to capture
the data, a digital host using the SCK falling edge allows a faster
reading rate, provided that it has an acceptable hold time. After
the 16th SCK falling edge or when SDI goes high, whichever is
earlier, SDO returns to high impedance and another AD7988-x
can be read.
CS
Figure 36. 4-Wire
Figure 37. 4-Wire
Mode Connection Diagram
CS
Mode Serial Interface Timing
Rev. B | Page 19 of 24
Page 20
AD7988-1/AD7988-5 Data Sheet
DIGITAL HOST
CONVERT
CLK
DATA IN
AD7988-1/
AD7988-5
SDO
CNV
A
SCK
AD7988-1/
AD7988-5
SDO
CNV
B
SCK
10231-039
SDISDI
t
CONV
t
CYC
t
SSDISCK
t
SCKL
t
SCK
t
HSDISCK
t
ACQ
ACQUISITION
t
SSCKCNV
ACQUISITION
t
SCKH
CONVERSION
t
HSCKCNV
SCK
CNV
SDO
B
t
EN
DA15D
A
14DA13
D
B
15DB14DB13DB1DB0DA15DA14DA0DA1
D
A
1DA0
t
HSDO
1231516171418303132
t
DSDO
10231-040
SDIA = 0
SDO
A
= SDI
B
CHAIN MODE
This mode can be used to daisy-chain multiple AD7988-x
devices on a 3-wire serial interface. This feature is useful for
reducing component count and wiring connections, for example,
in isolated multiconverter applications or for systems with a
limited interfacing capacity. Data readback is analogous to
clocking a shift register.
A connection diagram example using two AD7988-x devices is
shown in Figure 38, and the corresponding timing is given in
Figure 39.
When SDI and CNV are low, SDO is driven low. With SCK low,
a rising edge on CNV initiates a conversion and selects the chain
mode. In this mode, CNV is held high during the conversion
phase and the subsequent data readback. When the conversion
is complete, the MSB is output onto SDO and the AD7988-x
enters the acquisition phase and powers down. The remaining
data bits stored in the internal shift register are clocked by
subsequent SCK falling edges. For each ADC, SDI feeds the
input of the internal shift register and is clocked by the SCK
falling edge. Each ADC in the chain outputs its data MSB first,
and 16 × N clocks are required to read back the N ADCs. The
data is valid on both SCK edges. Although the rising edge can
be used to capture the data, a digital host using the SCK falling
edge allows a faster reading rate and, consequently, more
AD7988-x devices in the chain, provided that the digital host
has an acceptable hold time. The maximum conversion rate
may be reduced due to the total readback time.
Figure 38. Chain Mode Connection Diagram
Figure 39. Chain Mode Serial Interface Timing
Rev. B | Page 20 of 24
Page 21
Data Sheet AD7988-1/AD7988-5
AD7988-1/
AD7988-5
SCK
SDO
CNV
SPI_CLK
SPI_MISO
SPI_MOSI
10231-041
BLACKFIN
DSP
SCK
SDO
CNV
TSCLK
DR
TFS
RFS
RSCLK
VDRIVE
AD7988-1/
AD7988-5
10231-045
BLACKFIN
DSP
AD7988-1/
AD7988-5
10231-043
10231-044
APPLICATIONS INFORMATION
INTERFACING TO BLACKFIN® DSP
The AD7988-x can easily connect to a DSP SPI or SPORT. The
SPI configuration is straightforward, using the standard SPI
interface as shown in Figure 40.
Figure 40. Typical Connection to Blackfin SPI Interface
Similarly, the SPORT interface can be used to interface to this
ADC. The SPORT interface has some benefits in that it can use
direct memory access (DMA) and provides a lower jitter CNV
signal generated from a hardware counter.
Some glue logic may be required between SPORT and the
AD7988-x interface. The evaluation board for the AD7988-x
interfaces directly to the SPORT of the Blackfin-based (ADSPBF-527) SDP board. The configuration used for the SPORT
interface requires the addition of some glue logic as shown in
Figure 41. The SCK input to the ADC was gated off when CNV
was high to keep the SCK line static while converting the data,
thereby ensuring the best integrity of the result. This approach
uses an AND gate and a NOT gate for the SCK path. The other
logic gates used on the RSCLK and RFS paths are for delay
matching purposes and may not be necessary where path
lengths are short.
This is one approach to using the SPORT interface for this ADC;
there may be other solutions equal to this approach.
Using at least one ground plane is recommended. It can be
common or split between the digital and analog section. In the
latter case, join the planes underneath the AD7988-x devices.
The AD7988-x voltage reference input, REF, has a dynamic input
impedance. Decouple REF with minimal parasitic inductances
by placing the reference decoupling ceramic capacitor close to,
but ideally right up against, the REF and GND pins and connecting them with wide, low impedance traces.
Finally, decouple the power supplies of the AD7988-x, VDD and
VIO, with ceramic capacitors, typically 100 nF, placed close to
the AD7988-x and connected using short and wide traces to
provide low impedance paths and to reduce the effect of glitches
on the power supply lines.
An example of a layout following these rules is shown in Figure 42
and Figure 43.
EVALUATING THE PERFORMANCE OF THE
AD7988-x
The evaluation board package for the AD7988-x (EVA L-AD7988-
5SDZ) includes a fully assembled and tested evaluation board,
documentation, and software for controlling the board from a
PC via the EVA L-SDP-CB1Z.
Figure 41. Evaluation Board Connection to Blackfin Sport Interface
LAYOUT
Design the printed circuit board (PCB) that houses the AD7988-x
so that the analog and digital sections are separated and confined
to certain areas of the board. The pinout of the AD7988-x, with all
the analog signals on the left side and all the digital signals on
the right side, eases this task.
Avoid running digital lines under the device because these couple
noise onto the die, unless a ground plane under the AD7988-x is
used as a shield. Fast switching signals, such as CNV or clocks,
should never run near analog signal paths. Avoid crossover of
digital and analog signals.
Figure 42. Example Layout of the AD7988-x(Top Layer)
Figure 43. Example Layout of the AD7988-x(Bottom Layer)
Rev. B | Page 21 of 24
Page 22
AD7988-1/AD7988-5 Data Sheet
COMPLIANT TO JEDEC STANDARDS MO-187-BA
091709-A
6°
0°
0.70
0.55
0.40
5
10
1
6
0.50 BSC
0.30
0.15
1.10 MAX
3.10
3.00
2.90
COPLANARITY
0.10
0.23
0.13
3.10
3.00
2.90
5.15
4.90
4.65
PIN 1
IDENTIFIER
15° MAX
0.95
0.85
0.75
0.15
0.05
2.48
2.38
2.23
0.50
0.40
0.30
TOP VIEW
10
1
6
5
0.30
0.25
0.20
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.80
0.75
0.70
1.74
1.64
1.49
0.20 REF
0.05 MAX
0.02 NOM
0.50 BSC
EXPOSED
PAD
3.10
3.00 SQ
2.90
PIN 1
INDICATOR
(R 0.15)
FOR PROP E R CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CO NFIGURATI ON AND
FUNCTIO N DE S CRIPTIONS
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
02-27-2012-B
OUTLINE DIMENSIONS
Figure 44.10-Lead Mini Small Outline Package [MSOP]
(RM-10)
Dimensions shown in millimeters
Figure 45. 10-Lead Lead Frame Chip Scale Package [QFN (LFCSP_WD)]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-10-9)
Dimensions shown in millimeters
Rev. B | Page 22 of 24
Page 23
Data Sheet AD7988-1/AD7988-5
2
ORDERING GUIDE
Model1 Notes
Nonlinearity
AD7988-1BRMZ ±1.25 LSB max −40°C to +125°C Tube, 50 10-Lead MSOP RM-10 C7E
AD7988-1BRMZ-RL7 ±1.25 LSB max −40°C to +125°C Reel, 1,000 10-Lead MSOP RM-10 C7E
AD7988-1BCPZ-RL ±1.25 LSB max −40°C to +125°C Reel, 5,000 10-Lead QFN (LFCSP_WD) CP-10-9 C7X
AD7988-1BCPZ-RL7 ±1.25 LSB max −40°C to +125°C Reel, 1,500 10-Lead QFN (LFCSP_WD) CP-10-9 C7X
AD7988-5BRMZ ±1.25 LSB max −40°C to +125°C Tube, 50 10-Lead MSOP RM-10 C7Q
AD7988-5BRMZ-RL7 ±1.25 LSB max −40°C to +125°C Reel, 1,000 10-Lead MSOP RM-10 C7Q
AD7988-5BCPZ-RL ±1.25 LSB max −40°C to +125°C Reel, 5,000 10-Lead QFN (LFCSP_WD) CP-10-9 C7Y
AD7988-5BCPZ-RL7 ±1.25 LSB max −40°C to +125°C Reel, 1,500 10-Lead QFN (LFCSP_WD) CP-10-9 C7Y
Integral
EVAL-AD7988-5SDZ
EVAL-SDP-CB1Z
1
Z = RoHS Compliant Part.
2
This board can be used as a standalone evaluation board or in conjunction with the EVAL-SDZ-CB1Z for evaluation/demonstration purposes.
3
This board allows a PC to control and communicate with all Analog Devices evaluation boards ending in the SD designator.
3
Evaluation Board with AD7988-5
System Demonstration Board, Used as a
Temperature
Range
Ordering
Quantity Package Description
Populated; Use for Evaluation of Both
AD7988-1 and AD7988-5.
Controller Board for Data Transfer via
USB Interface to PC.